Inorganic board manufacturing method and inorganic board

Abstract

To provide an inorganic board suitable for realizing high water resistance, and a method for producing the same.SOLUTION: A production method comprises first to sixth steps. In the first step, a first layer L1 is formed by the deposition of raw material onto a receiving board B1. In the second step, either end part (a first part Ma) and the other end part (a second part Mb) in the first direction of a raw material mat M including the first layer L1 are pressed toward the receiving board B1 so as to be compressed. In the third step, a second layer L2 is formed on the first layer L1 by the deposition of raw material. In the fourth step, the exposed face of the second layer L2 is flattened. In the fifth step, the raw material mat M is cured in a state of being pressed between the receiving board B1 and a press board B2 to form a cured board M' from the raw material mat M. In the sixth step, the first part Ma is worked to form a first back side joined part P1, and also the second part Mb is worked to form a first surface side joined part P2. An inorganic board X1 comprises: the first back side joined part P1 and the first surface side joined part P2 having high density.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing an inorganic board that can be used as a building board, and an inorganic board. do. [Background technology]

[0002] Ceramic siding boards and ceramic boards are used as building boards to form the exterior and interior walls of buildings. Inorganic boards such as acrylic boards are sometimes used. Inorganic boards are made of hydraulic cement. It is made from a raw material mainly made of inorganic material, for example, through a pressing process. The edges are processed into a shape suitable for joining inorganic boards together. When constructing the wall, multiple inorganic boards are joined together vertically and horizontally. Such technology relating to inorganic boards is described in, for example, Patent Document 1 below. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 5-000411 Summary of the Invention [Problem to be solved by the invention]

[0004] Wall materials such as inorganic boards that make up exterior walls are exposed to ultraviolet rays, carbon dioxide, rain, and other factors in the outdoor environment. The impact of water on inorganic boards and other wall materials has been investigated recently. For example, water can cause the paint film on the surface of wall materials to fade and peel off. Water can also cause cracks and carbonation in the internal structure of the wall material. In addition, depending on the temperature difference in the environment, the action of repeated freezing and thawing of water, i.e., freeze-thaw This action can cause localized destruction of the wall material and the above-mentioned peeling of the coating, thereby deteriorating the wall material.

[0005] The joint shapes at the edges of the inorganic board are formed by cutting. The processed surface exposes the internal structure of the inorganic board. Therefore, conventional inorganic boards are prone to water penetration from the edges. The fact that inorganic boards are susceptible to the effects of water is a factor that affects their durability. This is not desirable from the viewpoint of

[0006] The present invention was conceived under these circumstances, and its object is to provide a highly water-resistant and a method for manufacturing an inorganic board suitable for realizing high water resistance. To provide a mechanical board. [Means for solving the problem]

[0007] According to a first aspect of the present invention, there is provided a method for manufacturing an inorganic board. includes a first deposition step, a pressing step, a second deposition step, a planarization step, and a processing step.

[0008] In the first depositing step, a first raw material containing a hydraulic first inorganic material and a first reinforcing material is deposited on a receiving plate. In the pressing step, the first layer of the raw mat including the first layer is deposited on the first layer. The first portion, which is one end in the direction, and the second portion, which is the other end, are connected to the opposite side of the receiving plate. Then, press it towards the receiving plate to compress it.

[0009] In the second depositing step, a second raw material containing a hydraulic second inorganic material and a second reinforcing material is deposited on the first The second layer is formed by depositing the second layer on the opposite side of the backing plate in the flattening process. The exposed surface is planarized.

[0010] In the curing process, a press plate is placed on the raw mat including the first and second layers, and then the The raw mat is cured while being pressed between a receiving plate and a press plate, and the hardened material is extracted from the raw mat. In the processing step, the first part is processed to form a first backside joint, and the second part is processed to form a first backside joint. The part is processed to form the first front side joint.

[0011] In the inorganic board manufacturing method of the present invention, the first stacking step, the pressing step, and the second stacking step By passing through the planarization process, the amount of deposited raw material per unit thickness is reduced to the first portion and the second portion. In the second portion, a locally thick raw mat can be formed. By undergoing the above-mentioned curing process involving pressure in the first direction, both ends in the first direction (first portion, In the second part, the raw materials (inorganic materials, reinforcing materials) are locally compressed and the both ends are A locally densified hardened plate can be produced, and the first backside bonding can be performed on both ends of the densified plate. By undergoing the above-mentioned processing steps for forming the first surface-side joining portion and the first surface-side joining portion, a high density ( That is, an inorganic board having dense first back-side bonding portions and first front-side bonding portions is obtained.

[0012] According to the method for manufacturing an inorganic board of the present invention, as described above, the first back surface having a locally high density can be formed. An inorganic board having a side joint portion and a first front-side joint portion can be manufactured. While avoiding excessive weight, the material is processed to form the first backside joint and the first frontside joint. The manufacturing method of the present invention is suitable for suppressing water penetration from the edge of the inorganic board. This is suitable for realizing high water resistance in the inorganic boards produced.

[0013] Preferably, in the pressing step, the raw material mat is pressed in one direction in a second direction intersecting the first direction. The third portion, which is the end portion, and the fourth portion, which is the other end portion, are arranged from the side opposite the backing plate toward the backing plate. In this case, the third part is processed to form the second backside joint. The fourth portion is processed to form the second front-side joining portion.

[0014] In such a configuration, the first and second raw mats are used as raw mats to be subjected to the curing step. In addition to the second part, the third and fourth parts also have locally large amounts of deposited material per unit thickness. A raw mat can be formed. Then, in the processing step, a first backing having a locally high density (i.e., dense) can be formed. An inorganic board having a side joint, a first front joint, a second back joint, and a second front joint. Such an inorganic board can be manufactured without excessive weight increase. Water intrusion from the first front joint and the second back joint and the second front joint. Suitable for suppressing the following:

[0015] Preferably, in the pressing step, the raw material mat is pressed from the first portion to the second portion in the first direction. The fifth part, which is part of the gap between the two parts, is compressed by pressing it from the opposite side of the backing plate towards the backing plate. .

[0016] When this pressing process is performed, the raw mat to be subjected to the curing process is the fifth part. A raw material mat having a locally large amount of raw material deposited per unit thickness can be formed, and therefore, locally high An inorganic board having a dense (i.e., dense) first back side joint portion, a first front side joint portion, and a fifth portion The fifth portion is suitable for functioning as a reinforcing portion of the inorganic board. The fifth part is suitable for suppressing deflection of the inorganic board during transportation and installation. This is suitable for suppressing the occurrence of microcracks inside the inorganic board due to the bending. Suppression of such microcracks is preferable in order to realize high water resistance of the inorganic board.

[0017] Preferably, in the pressing step, the raw mat is pressed from the third portion to the fourth portion in the second direction. The sixth part, which is part of the gap between the two plates, is compressed by pressing it from the opposite side of the plate towards the plate. .

[0018] When such a pressing process is performed, the raw mat to be subjected to the curing process has a thickness of 100 mm per unit thickness. A raw material mat having a locally large amount of raw material deposited thereon can be formed even in the sixth portion. An inorganic board having a dense (i.e., dense) sixth portion can be manufactured. Specifically, the fifth portion is suitable for functioning as a reinforcing portion of the be.

[0019] Preferably, a third raw material containing a hydraulic third inorganic material and a third reinforcing material is deposited. The method further includes at least one third deposition step for forming a third layer. Before the first deposition step, a third layer is formed on the receiving plate by a third deposition step, and in the first deposition step, Alternatively, a third deposition step may be performed between the planarization step and the curing step to form a second layer. Alternatively, a third layer is formed on the first layer by carrying out a third deposition step before the first deposition step. forming a third layer, forming a first layer on the third layer in a first deposition step, and Between the first and second curing steps, a third deposition step is carried out to form a third layer on the second layer.

[0020] This configuration allows the third raw material to be used, which is more suitable for forming the surface layer than the first raw material and the second raw material. It is suitable for forming a third layer as a surface layer from the material. For example, the first reinforcement and the second reinforcement The third material containing the third reinforcing material smaller than the first material is denser than the second material. This is suitable for forming a hardened layer as a surface layer.

[0021] Preferably, the backing plate and / or the press plate has a mold having an uneven shape on the surface facing the raw material mat. It is a board.

[0022] Such a configuration is useful for producing an inorganic board having a design surface with surface irregularities on one or both sides. In this configuration, the rear joining portion (first rear joining portion) of the raw mat is A template having a protrusion at a location corresponding to a planned location for forming the first side joint, the second back side joint, By using it as a template, the processing work for the backside joint during the processing process can be reduced. can.

[0023] According to a second aspect of the present invention, there is provided an inorganic board. The inorganic board has a surface and The inorganic board has a front surface and a back surface opposite to the front surface, and has a thickness between the front surface and the back surface. a first rear-side joint portion located at one end in a first direction intersecting the first direction, and a second rear-side joint portion located at the other end and a first front joint portion.

[0024] The first rear-side joint portion is the same as a first inner portion adjacent to the first rear-side joint portion in the first direction. a first base portion having a thickness equal to or greater than the thickness of the first base portion; The first base portion and the first extension portion have a first inner side. It is denser than the rest of the body.

[0025] The first front-side joint portion is the same as the second inner portion adjacent to the first front-side joint portion in the first direction. a second base portion having a thickness equal to or greater than the thickness of the first base portion; The second extending portion has a width greater than that of the first extending portion in the thickness direction. The second base portion and the second extension portion are located on the surface side of the second inner portion. be.

[0026] Such inorganic boards are used to avoid excessive weight while providing a locally high density first backside joint. This inorganic board is suitable for preventing water penetration in the joint portion of the first surface side and the joint portion of the second surface side. The inorganic board can be manufactured by the above-described inorganic board manufacturing method according to the first aspect of the present invention.

[0027] In a preferred embodiment, the first rear-side joint portion and the first front-side joint portion are The laminated structure includes a first hardening layer and a second hardening layer. Suitable for changing the physical properties and characteristics in the thickness direction at the joint and the first surface side joint. do.

[0028] Preferably, the inorganic board has a length from the first rear joint portion to the first front joint portion in the first direction. The first reinforcing portion includes a first hardened layer and a second hardened layer. and a thickness equal to or greater than that of a portion adjacent to the first reinforcing portion in the first direction. and has a higher density than the adjacent portion.

[0029] The first reinforcing portion, which has a higher density than the adjacent portions, is suitable for performing the reinforcing function of the inorganic board. Specifically, the first reinforcing portion serves to suppress deflection of the inorganic board during transportation and installation of the inorganic board. Therefore, the occurrence of microcracks inside the inorganic board due to the bending is suppressed. Such suppression of microcracks is advantageous in realizing high water resistance of inorganic boards. I wish.

[0030] Preferably, the inorganic board has a second back-side joint located at one end in a second direction intersecting the thickness direction and the first direction, and a second front-side joint located at the other end. The second back-side joint has a third base portion having a thickness equal to or greater than that of a third inner portion adjacent to the second back-side joint in the second direction, and a third extension portion that is thinner than the third base and extends outward from the third base in the second direction. The third base portion and the third extension portion have a higher density than the third inner portion. The second front-side joint has a fourth base portion having a thickness equal to or greater than that of a fourth inner portion adjacent to the second front-side joint in the second direction, and a fourth extension portion that is thinner than the fourth base portion and extends outward from the fourth base in the second direction. 4 The extension portion is the first in the thickness direction. 3 The fourth base portion and the fourth extension portion are located closer to the surface than the extension portion. The fourth base portion and the fourth extension portion have a higher density than the fourth inner portion.

[0031] Such inorganic boards are used to avoid excessive weight while providing a locally high density first backside joint. The first surface joint, the second back side joint, and the second surface joint are provided with a structure for preventing water from entering the first surface joint. Suitable for

[0032] In a preferred embodiment, the second back side joint portion and the second front side joint portion are The laminated structure includes a first hardening layer and a second hardening layer. Suitable for changing the physical properties and characteristics in the thickness direction at the joint and the first surface side joint. do.

[0033] Preferably, the inorganic board has a length from the second rear side joint portion to the second front side joint portion in the second direction. The second reinforcing portion includes a first hardened layer and a second hardened layer. and a thickness equal to or greater than that of a portion adjacent to the second reinforcing portion in the second direction. and has a higher density than the adjacent portion.

[0034] The second reinforcing portion, which has a higher density than the adjacent portion, is suitable for performing the reinforcing function of the inorganic board. Specifically, it is the same as that described above regarding the first reinforcing portion.

[0035] Preferably, the inorganic board includes a first hardened layer, a second hardened layer, and a third hardened layer in this order. A laminated structure or a laminated structure including a third hardening layer, a first hardening layer, and a second hardening layer in this order. Alternatively, the third hardened layer, the first hardened layer, the second hardened layer, and the third hardened layer may be formed. It has a laminated structure including the above in this order.

[0036] In this configuration, a hardened layer having properties different from those of the first and second hardened layers is called a third hardened layer. As a hardened layer having properties different from those of the first hardened layer and the second hardened layer, , a hardened layer having a higher density than the first and second hardened layers. As a surface layer of the inorganic board, it helps to achieve high water resistance in the inorganic board. [Brief explanation of the drawings]

[0037] [Figure 1] 2 illustrates some steps of an inorganic board manufacturing method according to a first embodiment of the present invention. [Figure 2] This represents a step subsequent to the step shown in FIG. [Figure 3] 1 is a schematic plan view of an inorganic board manufactured by a manufacturing method according to a first embodiment. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3, with some parts omitted. [Figure 5]FIG. 4 is a cross-sectional view taken along line VV in FIG. 3, with some parts omitted. [Figure 6] 3 shows an example of a roller that can be used in the pressing step in the first embodiment. [Figure 7] 1(a) is a partially omitted cross-sectional view of an inorganic board manufactured by a method for manufacturing an inorganic board according to a modified example, and FIG. 1(b) is another partially omitted cross-sectional view of the same inorganic board. [Figure 8] 5 shows some steps of an inorganic board manufacturing method according to a second embodiment of the present invention. [Figure 9] This represents a step subsequent to the step shown in FIG. [Figure 10] FIG. 6 is a schematic plan view of an inorganic board manufactured by a manufacturing method according to a second embodiment. [Figure 11] FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. 10, with some parts omitted. [Figure 12] 11 is a cross-sectional view taken along line XII-XII in FIG. 10, with some parts omitted. [Figure 13] 10 shows an example of a roller that can be used in the pressing step in the second embodiment. [Figure 14] 6 illustrates some steps of an inorganic board manufacturing method according to a third embodiment of the present invention. [Figure 15] This represents the process following the process shown in FIG. [Figure 16] This represents the process following the process shown in FIG. [Figure 17] FIG. 10 is a schematic plan view of an inorganic board manufactured by a manufacturing method according to a third embodiment. [Figure 18] 18 is a cross-sectional view taken along line XVIII-XVIII in FIG. 17, with some parts omitted. [Figure 19] 19 is a cross-sectional view taken along line XIX-XIX in FIG. 17, with some parts omitted. DETAILED DESCRIPTION OF THE INVENTION

[0038] 1 and 2 show a method for manufacturing an inorganic board according to a first embodiment of the present invention. FIG. 5 shows an inorganic board X1, which is an example of an inorganic board manufactured by this manufacturing method.

[0039] The inorganic board X1 has a front surface F1 and an opposite back surface F2. a first rear-side joint portion P1 located at one end in a first direction D1 intersecting with the thickness direction T; and a first front-side joining portion P2 located at the other end, and A second rear-side joint portion P3 is located at one end in a second direction D2 intersecting with D1, and the other end The first back side joint P1 and the first front side joint P2 are provided. The second rear-side joint portion P3 and the second front-side joint portion P2 extend in the second direction D2. 4 each extend in the first direction D1.

[0040] The present manufacturing method is a method for manufacturing such an inorganic board, and includes the following steps: The process includes a stacking step, a pressing step, a second stacking step, a planarizing step, a curing step, and a processing step.

[0041] In the first deposition step, as shown in FIG. 1(a), the first raw material is deposited on a backing plate B1, The first layer L1 is formed. In FIG. 1(a), the diagram on the left side shows the inorganic board X1. 1 is a schematic cross-sectional view of the inorganic board X1 in the first direction D1. This is a schematic cross-sectional view of the metal mold in the direction D2 (the same applies to other process diagrams described later). The thickness of the formed first layer L1 is, for example, 5 to 20 mm.

[0042] In this embodiment, the receiving plate B1 has an uneven surface on the raw material mat side (the surface on which the raw material is piled up). Specifically, the mold plate has a first protrusion Ba and a second protrusion Bb. The first protrusion Ba is located at a position corresponding to the planned formation position of the first rear-side joint P1. The second protrusion Bb is located at a position corresponding to the planned position where the second rear-side joint P3 is to be formed. The backing plate B1 of this embodiment defines the shape of the front surface F1 side of the inorganic plate X1.

[0043] In this embodiment, the first raw material used in this step is a hydraulic first inorganic material and a first silica The adhesive layer includes an acidic material and a first reinforcing material.

[0044] Examples of the first inorganic material include cement, gypsum, and slag. Examples of cement include ordinary Portland cement, high-early-strength Portland cement, and aluminum. Examples of gypsum include gypsum cement, blast furnace cement, and fly ash cement. Examples of slag include anhydrous gypsum, hemihydrate gypsum, and dihydrate gypsum. Examples of the first inorganic material include blast furnace slag and converter slag. Alternatively, two or more types of the first inorganic material may be used. The area is, for example, 2000 to 10,000 cm 2 / g.

[0045] Examples of the first siliceous material include silica sand, silica powder, silica powder, coal ash, and fly ash. One type of first siliceous material may be used, or two types may be used. The above-mentioned first siliceous material may be used. The Blaine specific surface area of ​​the first siliceous material may be, for example, 3000~30000cm 2 / g. The first inorganic material and the first silicon dioxide in the raw material mixture The mass ratio to the acidic material is preferably 6:4 to 3:7.

[0046] Examples of the first reinforcing material include organic reinforcing materials such as plant-based reinforcing materials and synthetic fibers. Examples of plant-based reinforcing materials include wood flour, wood wool, wood chips, wood pulp, wood fiber, and wood fiber. Examples of synthetic fibers include fiber bundles, waste paper, bamboo fiber, hemp fiber, bagasse, rice husks, and rice straw. Examples of the fibers include polyester fibers, polyamide fibers, polyethylene fibers, and polypropylene fibers. Fiber and acrylic fiber. One type of primary reinforcing material may be used, or two types may be used. If wood flour is used as the first reinforcing material, the The size of the wood powder is, for example, 20 to 50 mesh. Wood chips are used as the first reinforcing material. In this case, the width of the piece of wood is, for example, 0.5 to 2 mm, and the length is, for example, 1 to 20 mm. The aspect ratio (length / width) is, for example, 20 to 30. When fiber bundles are used, the diameter of the wood fiber bundles is, for example, 0.1 to 2 mm; The length is, for example, 2 to 35 mm. The wood fiber bundle may have a branched shape or a curved shape. It may have a shape or a bent shape.

[0047] The first raw material may be, for example, expanded polystyrene beads, microspheres, perlite, fluorine, or the like. Among ash balloons, shirasu balloons, expanded shale, expanded clay, and calcined diatomaceous earth One type of hollow body may be used, or two or more types of hollow bodies may be used. The median diameter (diameter D50) of the hollow body is preferably 0.05 to 2 mm. is.

[0048] The first raw material may contain other materials in addition to the above-mentioned constituent materials. For example, admixtures can be used. Examples of admixtures include mica, paper sludge incineration ash, Silica fume, wollastonite, calcium carbonate, magnesium hydroxide, aluminum hydroxide Minium, vermiculite, sepiolite, tobermorite, xonotlite, kaolinite Examples of the mica include crushed zeolite, granulated mineral boards, and pulverized mineral boards. Flakes with a size of 200 to 700 μm and an aspect ratio of 60 to 100 are preferred. The crushed inorganic boards are defective pre-hardened inorganic boards that are generated during the manufacturing process of inorganic boards. Crushed materials and crushed materials of defective inorganic boards after hardening, as well as inorganic boards generated at construction sites, etc. Examples of the crushed materials include scraps and waste materials. The average particle size of these crushed materials is, for example, 50 to 150 μm. m.

[0049] In the pressing step, as shown in FIG. 1(b), the first portion M of the raw mat M including the first layer L1 is pressed. a, the second part Mb, the third part Mc, and the fourth part Md are received from the side opposite to the receiving plate B1. The first portion Ma is pressed and compressed toward the plate B1. The first portion Ma is located at one end in the first direction D1. The second portion Mb is located at the other end in the first direction D1. The third portion Mc is located at the other end in the first direction D1. The fourth portion Md is located at one end in the second direction D2. Located at the end.

[0050] As the pressing means, a device (not shown) equipped with a roller 100 as shown in FIG. 6 can be used. The roller 100 has a shaft 101 and two roller parts 102. The shaft core 101 is supported so as to be displaceable and rotatable. The distance between the two roller parts 102 is set to the distance between the parts to be pressed simultaneously. It can be adjusted according to the distance.

[0051] In the pressing step, for example, a load is applied to the first portion Ma and the second portion Mb of the raw material mat M. The two rollers 102 of the roller 100 are brought into contact with each other and pressed against each other, while the raw mat M is rotated in the second direction D2. Thereafter, for example, the third portion Mc and the fourth portion Md of the raw material mat M are The two roller portions 102 of the roller 100 are brought into contact with each other and pressed against each other, while the raw mat M is rotated in a first direction. The pressure is, for example, 1 to 10 kg / cm. 2 This process is Thus, the first portion Ma, the second portion Mb, the third portion Mc, and the fourth portion Mb are formed in the raw material mat M. The portions Md become thinner, respectively.

[0052] In the second deposition step, as shown in FIG. 1(c), a second source material is deposited on the first layer L1. The second layer L2 is formed by depositing the second source material over the entire first layer L1. The thickness of L2 is, for example, 10 to 30 mm. The composite material includes a second inorganic material, a second siliceous material, and a second reinforcing material.

[0053] The second inorganic material may include those materials described above with respect to the first inorganic material. Examples of the silicate material include those materials described above for the first siliceous material. Examples of the second raw material include the materials mentioned above for the first reinforcing material. The first source material may have the same composition as that of the first source material used in the first deposition step described above, or may have a different composition. It may have.

[0054] In the flattening process, as shown in FIG. 2(a), the exposed surface of the second layer L2 (which is different from the backing plate B1) is flattened. The exposed surface of the second layer (L2) is then flattened by touching it with a brush. While the brush is being moved, the exposed surface of the second layer L2 is swept with the brush, and air is blown onto the exposed surface of the second layer L2. By this process, the amount of deposited raw material per unit thickness is increased to the first portion Ma and the second portion Ma. The raw mat M is formed in a locally large amount in the third portion Mc and the fourth portion Md.

[0055] In the curing process, as shown in FIG. 2(b), the raw material mat including the first layer L1 and the second layer L2 is After placing the press plate B2 on the mat M, the raw mat M is placed between the receiving plate B1 and the press plate B2. The raw mat M is then cured under pressure to form a hardened board M'. The press plate B2 defines the shape of the rear surface F2 side of the inorganic plate X1.

[0056] In this step, the pressing pressure is, for example, 20 to 70 kg / cm 2 and the temperature is, for example, 50 The temperature is between 100°C and 80°C, and the curing time is, for example, 6 to 12 hours. If autoclave curing is performed as a further curing, In the curing, the temperature is, for example, 150°C or more, and the pressure is, for example, 0.5 MPa or more. The curing time is 3 to 15 hours.

[0057] By undergoing such a curing process, the first part Ma, the second part Mb, the third part Mc, In the fourth portion Md, the raw material is locally compressed and the density of that portion is locally increased. The hardened plate M' is formed by the first hardened layer 11 and the second hardened layer 12. The first cured layer 11 is a layer formed by curing the first layer L1. The second cured layer 12 is a layer formed by curing the second layer L2 described above.

[0058] In the processing step, as shown in FIG. 2(c), the first portion Ma is processed to form a first backside joint P1 The second portion Mb is processed to form the first front-side joint P2, and the third portion Mc is processed. The fourth portion Md is processed to form the second rear-side joint P3, and the fourth portion Md is processed to form the second front-side joint P4. (In Figure 2(c), the hardened plate M' shown in Figure 2(b) is shown upside down.) The processing method is as follows: For example, cutting.

[0059] 3 to 5 show an example of an inorganic board manufactured through the above steps. The inorganic board X1 is a laminate including the first hardening layer 11 and the second hardening layer 12. It has a structure.

[0060] As described above, the inorganic board X1 has a front surface F1 and a rear surface F2 opposite thereto. , a first rear-side joint portion P1 located at one end in the first direction D1 and a second rear-side joint portion P2 located at the other end a first front-side joint portion P2 and a second back-side joint portion P3 located at one end in the second direction D2; The inorganic board X1 has a first joint P3 and a second front-side joint P4 located at the other end thereof. The dimension in the direction D1 is, for example, 200 to 1000 mm, and the dimension in the second direction D2 is, for example, 9 00~3200mm.

[0061] The first rear-side joint portion P1 is an end portion having a shape suitable for joining inorganic boards together, In this embodiment, the first back-side bonding portion P1 is an end portion having a solid structure. and a second hardened layer 12, and has a first base portion P1a and a first extending portion P1b. The first base portion P1a is adjacent to the first rear-side joint portion P1 in the first direction D1, for example. The first extension portion P1b has a thickness equal to or greater than that of the inner portion (first inner portion). 1b and extends outward from the first base portion P1a in the first direction D1.

[0062] The first rear-side joint P1 (first base P1a, first extension P1b) has a higher density than the inner portion (first inner portion) adjacent to the first rear-side joint P1 in the first direction D1. density is, for example, 1.05 to 1.15 g / cm 3 and the inner portion adjacent to the first rear-side joint portion P1 density is, for example, 0.9 to 1.1 g / cm 3 is.

[0063] The first front-side joint portion P2 is an end portion having a shape suitable for joining inorganic boards together, In this embodiment, the first surface-side bonding portion P2 is an end portion having a solid upper structure. and a second hardened layer 12, and has a second base portion P2a and a second extending portion P2b. The second base portion P2a is adjacent to the first front-side joint portion P2 in the first direction D1, for example. The second extending portion P2b has a thickness equal to or greater than that of the inner portion (second inner portion). The second extension portion P2a is thinner than the second base portion P2a and extends outward in the first direction D1. The protruding portion P2b is located closer to the surface F1 side than the first extending portion P1b in the thickness direction T. That is, the first extending portion P1b is located closer to the rear surface F2 than the second extending portion P2b in the thickness direction T. Place.

[0064] The first surface-side joint P2 (second base portion P2a, second extension portion P2b) has a higher density than the inner portion (second inner portion) adjacent to the first surface-side joint P2 in the first direction D1. density is, for example, 1.05 to 1.15 g / cm 3 and the inner portion adjacent to the second rear-side joint portion P2 densityis, for example, 0.9 to 1.1 g / cm 3 is.

[0065] The second rear side joint portion P3 is an end portion having a shape suitable for joining inorganic boards together, In this embodiment, the second back-side bonding portion P3 is an end portion having a solid structure. and a second hardened layer 12, and has a third base portion P3a and a third extending portion P3b. The third base portion P3a is adjacent to the second rear-side joint portion P3 in the second direction D2, for example. The third extension portion P3b has a thickness equal to or greater than that of the inner portion (third inner portion). 3a and extends outward from the third base portion P3a in the second direction D2.

[0066] The second backside bonding portion P3 (third base portion P3a, third extension portion P3b) has a higher density than the inner portion (third inner portion) adjacent to the second backside bonding portion P3 in the second direction D2. density is, for example, 1.05 to 1.15 g / cm 3 and the inner portion adjacent to the second rear side joint portion P3 density is, for example, 0.9 to 1.1 g / cm 3 is.

[0067] The second front-side joint portion P4 is an end portion having a shape suitable for joining inorganic boards together, In this embodiment, the second surface-side bonding portion P4 is an end portion having a solid upper structure. and a second hardened layer 12, and has a fourth base portion P4a and a fourth extending portion P4b. The fourth base portion P4a is, for example, adjacent to the second front-side joint portion P4 in the second direction D2. The fourth extension portion P4b has a thickness equal to or greater than that of the inner portion (fourth inner portion). The fourth extension portion P4a is thinner than the fourth base portion P4a and extends outward in the second direction D2. The protruding portion P4b is located closer to the front surface F1 than the third protruding portion P3b in the thickness direction T. That is, the third extending portion P3b is located closer to the rear surface F2 side than the fourth extending portion P4b in the thickness direction T. Place.

[0068] The second front-side joint portion P4 (the fourth base portion P4a and the fourth extension portion P4b) is The density of the inner portion (fourth inner portion) adjacent to the second front-side joint portion P4 is higher than that of the inner portion (fourth inner portion). The specific gravity of the second front-side joint portion P4 (the fourth base portion P4a and the fourth extension portion P4b) is, for example, 1.05 to 1.15g / cm 3 The specific gravity of the inner portion adjacent to the second front-side joint portion P4 is, for example, 0.9~1.1g / cm 3 is.

[0069] When constructing a wall using the inorganic boards X1, a plurality of inorganic boards X1 are joined together in the vertical direction (longitudinal direction) or the left-right direction (lateral direction). Specifically, a plurality of inorganic boards X1 are joined together, for example, in the vertical direction, at their ends (first rear-side joint P1, first front-side joint P2) extending in the second direction D2. inorganic The plates X1 are joined together by joining their ends (second back side joint P3, second front side joint P4) extending in the first direction D1, for example, in the left-right direction (the same applies to the method of installing inorganic plates in the embodiments described later).

[0070] The inorganic board manufacturing method of the present invention includes a first stacking step, a pressing step, and a second stacking step. , and the planarization process (Fig. 2(a)), as described above, the raw material per unit thickness The deposition amount is locally large in the first part Ma, the second part Mb, the third part Mc, and the fourth part Md. A raw material mat M can be formed.

[0071] In the subsequent curing process (FIG. 2(b)), as described above, the first portion Ma, the second portion Mb, In the third part Mc and the fourth part Md, the raw material is locally compressed and the parts are locally compressed. A locally densified hardened plate M' can be formed.

[0072] Then, through the subsequent processing step (Fig. 2(c)), the material becomes locally dense (i.e., dense). The first back side joint P1, the first front side joint P2, the second back side joint P3, and the second front side joint P4 are tightly packed. An inorganic board X1 having a joint P4 is obtained.

[0073] According to the method for manufacturing an inorganic board of the present invention, as described above, the first back surface having a locally high density can be formed. The side joint P1, the first front joint P2, the second back joint P3, and the second front joint P4 The inorganic board X1 can be manufactured by using the base portions P1a, P2a, P3a, and P 4a has a thickness equal to or greater than that of each inner portion). Such an inorganic board X1 is While avoiding excessive weight, the first back side joint P1, the first front side joint P2, and the second back side joint P 3, and water penetration from the edge of the inorganic board that is processed to form the second front joint P4. That is, the manufacturing method of the present invention is suitable for suppressing the above-mentioned problems in the inorganic board X1 to be manufactured. This makes it suitable for achieving high water resistance.

[0074] In this manufacturing method, as described above, the back side joint portion (first back side joint portion P1 A template having a protrusion (protrusion) at a location corresponding to a location where the second back side joint P3 is to be formed is provided. This is used as the backing plate B1. The amount of processing work required for the joints is reduced.

[0075] In this manufacturing method, if necessary, the second back side joint portion P3 and The support plate B1 may have a second front-side joint portion P4. By using the plate, the second back side joint P3 and the second front side joint P4 are densified. Therefore, the inorganic board X1 can be manufactured.

[0076] In this manufacturing method, the support plate B1 has a first protrusion Ba and a second protrusion Bb. A press plate B2 is used, and the first back side joint P1 is to be formed at the planned location. The first protrusion Ba is located at a position corresponding to the second rear-side joint P3. Alternatively, a press plate having a second protrusion Bb located at a position other than the first protrusion Bb may be used.

[0077] The inorganic board X1 manufactured in this modified example is shown in FIG. 7 is a partially omitted cross-sectional view (cross-sectional view in the first direction D1) of the inorganic board X1 according to the modified example. b) is another partially omitted cross-sectional view (cross-sectional view in the second direction D2) of the inorganic board X1 according to the modified example. The inorganic board X1 shown in FIG. 7 also has a localized structure similar to the inorganic board X1 shown in FIGS. a first rear-side joint P1, a first front-side joint P2, a second rear-side joint P3, and The second front-side joint P4 is provided at the end, which is suitable for realizing high water resistance.

[0078] 8 and 9 show a method for manufacturing an inorganic board according to a second embodiment of the present invention. FIG. 12 shows an inorganic board X1', which is an example of an inorganic board manufactured by this manufacturing method. .

[0079] The inorganic board X1' has the same structure as above except that it further includes a first reinforcing portion P5 and a second reinforcing portion P6. It has the same configuration as the inorganic board X1 described above.

[0080] The first reinforcing portion P5 is a part of the area between the first back-side bonding portion P1 and the first front-side bonding portion P2 in the first direction D1, and extends in the second direction D2. Preferably, the first reinforcing portion P5 is located at or near the center of the inorganic board X1' in the first direction D1. The first reinforcing portion P5 has a layered structure including a first hardening layer 11 and a second hardening layer 12. The first reinforcing portion P5 has a higher density than the area adjacent to the first reinforcing portion P5 in the first direction D1. density is, for example, 1.05 to 1.15 g / cm 3 and the part adjacent to the first reinforcing part P5 density is, for example, 0.9 to 1.1 g / cm 3 is.

[0081] The second reinforcing portion P6 is a part of the area between the second back-side bonding portion P3 and the second front-side bonding portion P4 in the second direction D2, and extends in the first direction D1. Preferably, the second reinforcing portion P6 is located at or near the center of the inorganic board X1' in the second direction D2. The second reinforcing portion P6 has a layered structure including a first hardening layer 11 and a second hardening layer 12. The second reinforcing portion P6 has a higher density than the area adjacent to the second reinforcing portion P6 in the second direction D2. density is, for example, 1.05 to 1.15 g / cm 3 and the part adjacent to the second reinforcing part P6 density is, for example, 0.9 to 1.1 g / cm 3 is.

[0082] Other configurations of the inorganic board X1' are similar to those of the inorganic board X1 described above.

[0083] The present manufacturing method is a method for manufacturing such an inorganic board, and includes the following steps: The process includes a stacking step, a pressing step, a second stacking step, a planarizing step, a curing step, and a processing step.

[0084] In the first deposition step, as shown in FIG. 8(a), the first raw material is deposited on a backing plate B1, The first layer L1 is formed in the same manner as in the first deposition step described above with reference to FIG. is.

[0085] In the pressing step, as shown in FIG. 8(b), the first portion M of the raw mat M including the first layer L1 is pressed. a, the second portion Mb, the third portion Mc, the fourth portion Md, the fifth portion Me, and the sixth portion Mf The fifth portion Me is pressed from the opposite side of the backing plate B1 toward the backing plate B1 to compress it. A part between the first portion Ma and the second portion Mb in the direction D1, and the first reinforcing portion Preferably, the fifth portion Me is located at a position corresponding to the intended formation position of the fifth portion P5. The fifth portion M is located at the center of the inorganic board X1′ in the first direction D1 and in the vicinity thereof. The sixth portion Mf extends in the second direction D2 from the third portion Mc in the second direction D2. A part of the fourth portion Md, which corresponds to the location where the second reinforcing portion P6 is to be formed. Preferably, the sixth portion Mf is located in the second direction in the inorganic board X1′ to be manufactured. The sixth portion Mf is located at or near the center of the first direction D2. The sixth portion Mf extends in the first direction D1. The fourth portions Ma, Mb, Mc, and Md are as described above with reference to FIG. 1(b). do.

[0086] The pressing means in this embodiment is a device equipped with a roller 200 as shown in FIG. The roller 200 includes a shaft 201 and three roller parts 202. In the device, the shaft core 201 is supported so as to be displaceable and rotatable. 2 are fixed to the shaft core 201. The distance between the roller parts 202 is It can be adjusted according to the distance between the points to be pressed.

[0087] In the pressing step, for example, the first portion Ma, the second portion Mb, and the fifth portion Mb of the raw material mat M are pressed together. The three roller portions 202 of the roller 200 are brought into contact with and pressed against the raw mat Me. M is conveyed in the second direction D2. Then, for example, the third portion Mc and the fourth portion The three roller portions 202 of the roller 200 are pressed against the sixth portion Md and the sixth portion Mf. The raw material mat M is conveyed in the first direction D1 while being pressed. The pressing pressure is, for example, 1 to 10 kg. / cm 2 By undergoing this process, the first to sixth portions Ma, M of the raw material mat M are b, Mc, Md, Me, and Mf become thinner, respectively.

[0088] In the second deposition step, as shown in FIG. 8(c), a second source material is deposited on the first layer L1. The second layer L2 is formed by depositing the second source material over the entire first layer L1. The second deposition step is the same as that described above with reference to FIG. 1(c).

[0089] In the flattening process, as shown in FIG. 9(a), the exposed surface of the second layer L2 (which is different from the receiving plate B1) is flattened. Specifically, the surface (opposite surface) is planarized in the same manner as the planarization step described above with reference to FIG. By this process, the amount of deposited raw material per unit thickness is increased to the first portion Ma, the second portion Mb, and The third part Mc, the fourth part Md, the fifth part Me, and the sixth part Mf contain locally abundant raw material ma. The set M is formed.

[0090] In the curing process, as shown in FIG. 9(b), the raw material mat including the first layer L1 and the second layer L2 is After placing the press plate B2 on the mat M, the raw mat M is placed between the receiving plate B1 and the press plate B2. The raw mat M is then cured under pressure to form a hardened board M'. The press plate B2 defines the shape of the back surface F2 side of the inorganic plate X1'. The conditions are the same as those in the curing step described above with reference to FIG. 2(b). do.

[0091] By undergoing such a curing process, the first part Ma, the second part Mb, the third part Mc, The raw material is locally compressed in the fourth part Md, the fifth part Me, and the sixth part Mf. As a result, a hardened plate M' is formed in which the relevant portion is locally densified.

[0092] In the processing step, as shown in FIG. 9(c), the first portion Ma is processed to form a first backside joint P1 The second portion Mb is processed to form the first front-side joint P2, and the third portion Mc is processed. The fourth portion Md is processed to form the second rear-side joint P3, and the fourth portion Md is processed to form the second front-side joint P4. (In FIG. 9(c), the hardened plate M' shown in FIG. 9(b) is shown upside down.) The processing method is as follows: For example, cutting.

[0093] The inorganic board X1' manufactured by the inorganic board manufacturing method according to the second embodiment is As in the above-described inorganic board manufacturing method according to the embodiment, the first rear bonding portion having a locally high density P1, a first front side joint P2, a second back side joint P3, and a second front side joint P4 are provided at the end. can.

[0094] Such an inorganic board X1' can be used to securely connect the first rear joint P1 and the first front joint P2 while avoiding excessive weight. The substrate is processed to form a side joint P2, a second back joint P3, and a second front joint P4. This is suitable for suppressing water penetration from the end of the inorganic board. The inorganic board manufacturing method according to the present invention has high water resistance, similar to the inorganic board manufacturing method according to the first embodiment. It is suitable for manufacturing inorganic boards.

[0095] In addition, in the inorganic board manufacturing method of the second embodiment, the curing step (FIG. 9(b)) is performed. As for the raw material mat M, the raw material deposition amount per unit thickness in the fifth part Me and the sixth part Mf is A raw mat having locally high density (i.e., denser) can be formed. The first reinforcing portion P5 (hardened fifth portion Me) and the second reinforcing portion P6 (hardened sixth portion M f) can be manufactured.

[0096] The first reinforcing portion P5 and the second reinforcing portion P6 each have a function of reinforcing the inorganic board X1'. Specifically, the first reinforcing portion P5 and the second reinforcing portion P6 are each made of an inorganic board. It is suitable for suppressing the deflection of the inorganic board X1' during transportation and installation of X1', and therefore, This is suitable for suppressing the occurrence of microcracks inside the inorganic plate X1' caused by the above. Suppressing such microcracks is preferable for realizing high water resistance of the inorganic board X1'.

[0097] In this manufacturing method, the support plate B1 has a first protrusion Ba and a second protrusion Bb. A press plate B2 is used, and the first back side joint P1 is to be formed at the planned location. The first protrusion Ba is located at a position corresponding to the second rear-side joint P3. A press plate having a second protrusion Bb located at a position other than the first protrusion Bb may be used.

[0098] Even in this embodiment, the first rear-side joint portion P1, the first front-side joint portion P2, and the second rear-side joint portion P3 are formed. The insulated bag includes a joint portion P3, a second front-side joint portion P4, a first reinforcing portion P5, and a second reinforcing portion P6. The substrate board X1' can be manufactured.

[0099] In this manufacturing method, if necessary, the second back side joint portion P3 and The support plate B1 may have a second front-side joint portion P4. By using the plate, the second back side joint P3 and the second front side joint P4 are densified. Therefore, an inorganic board X1' can be manufactured.

[0100] In this manufacturing method, if necessary, an inorganic board X1' that does not have the first reinforcing portion P5 may be manufactured. In the pressing step shown in FIG. 8(b), the fifth portion Me of the raw material mat M is pressed. By not performing the above-described steps, such an inorganic board X1' can be manufactured.

[0101] In this manufacturing method, if necessary, an inorganic board X1' that does not have the second reinforcing portion P6 may be manufactured. In the pressing step shown in FIG. 8(b), the sixth portion Mf of the raw material mat M is pressed. By not performing the above-described steps, such an inorganic board X1' can be manufactured.

[0102] 14 to 16 show an inorganic board manufacturing method according to a third embodiment of the present invention. 19 shows an inorganic board X2, which is an example of an inorganic board manufactured by this manufacturing method. .

[0103] The inorganic board X2 has a third hardened layer 13 located on its front surface F1 side and a back surface F2 side. The inorganic board X1 has the same structure as the inorganic board X1 described above, except that it has a laminated structure including the third hardening layer 13. It has.

[0104] The present manufacturing method is a method for manufacturing such an inorganic board, and includes the following third stack: deposition process, first deposition process, pressing process, second deposition process, flattening process, additional third deposition process, and This includes raw and processed processes.

[0105] In the third deposition step, as shown in FIG. 14(a), the third raw material is deposited on the above-mentioned backing plate B1. The third layer L3 has a thickness of, for example, 5 to 15 mm. In this embodiment, the raw materials include a hydraulic third inorganic material, a third siliceous material, and a third reinforcing material. Contains:

[0106] The third inorganic material may include those materials described above with respect to the first inorganic material. Examples of the silicate material include those materials described above for the first siliceous material. Examples of the material include the materials mentioned above for the first reinforcing material.

[0107] The third reinforcing member is smaller than the first reinforcing member and the second reinforcing member. When wood flour is used as the third reinforcement material, the size of the wood flour used as the third reinforcement material must be the same as that of the first and second reinforcement materials. As long as it is smaller than the size of the wood flour used as a strength material, it is, for example, 15 to 40 mesh. When wood pieces are used as the first to third reinforcing materials, the wood piece as the third reinforcing material is As long as it is smaller than the wood piece as the second reinforcing material, the width is, for example, 0.4 to 1.8 mm, The length is, for example, 0.8 to 4 mm. When wood fiber bundles are used as the first to third reinforcing materials, In this case, the wood fiber bundles as the third reinforcing material are smaller than the wood fiber bundles as the first and second reinforcing materials. At the very least, the diameter is, for example, 0.08 to 1.8 mm, and the length is, for example, 1.8 to 30 mm.

[0108] In the first deposition step, as shown in FIG. 14(b), the first source material is deposited on the third layer L3. The second source material is deposited over the entire first layer L1. In this embodiment, the thickness of the first layer L1 is, for example, 10 to 30 mm.

[0109] In the pressing step, as shown in FIG. 14(c), the raw material matrix including the third layer L3 and the first layer L1 is pressed. The first part Ma, the second part Mb, the third part Mc, the fourth part Md, the fifth part Me, and The sixth portion Mf is pressed from the side opposite to the backing plate B1 toward the backing plate B1 and compressed.

[0110] In the raw material mat M, the first portion Ma is located at one end in the first direction D1. The second portion Mb is located at the other end in the first direction D1. The portions Mb each extend in the second direction D2.

[0111] In the raw material mat M, the third portion Mc is located at one end in the second direction D2. The fourth portion Md is located at the other end in the second direction D2. The segments Md each extend in a first direction D1.

[0112] In the raw material mat M, the fifth portion Me is a portion extending from the first portion Ma to the second portion Ma in the first direction D1. The fifth portion Me extends in the second direction D2. The sixth portion Mf , a part between the third part Mc and the fourth part Md in the second direction D2. f extends in the first direction D1.

[0113] The pressing means in this embodiment is a device equipped with a roller 200 as shown in FIG. The pressing method and conditions are the same as those in the second embodiment. The method and conditions for pressing by the roller 200 are the same as those described above with respect to the process.

[0114] In the second deposition step, as shown in FIG. 15(a), a second source material is deposited on the first layer L1. , forming a second layer L2. The second raw material is deposited over the entire first layer L1. In essence, this is the same as the second deposition step described above with reference to FIG. The thickness of the second layer L2 is, for example, 10 to 30 mm.

[0115] In the flattening step, as shown in FIG. 15(b), the exposed surface of the second layer L2 (the backing plate B1 and Specifically, the planarization step described above with reference to FIG. This process is similar. The amount of deposited raw material per unit thickness is the first portion Ma and the second portion Mb. , the third part Mc, the fourth part Md, the fifth part Me, and the sixth part Mf are locally rich in raw materials. A mat M is formed.

[0116] In the additional third deposition step, as shown in FIG. 15(c), a third source material is deposited on the second layer L2. The additional third layer L3 is formed by stacking the layers. The thickness of the additional third layer L3 is, for example, 5 to 15 mm. m.

[0117] In the curing process, as shown in FIG. 16(a), the third layer L3, the first layer L1, the second layer L2, and the additional third layer L3 are stacked. L3 After placing the press plate B2 on the raw material mat M containing the above, the raw material mat M is cured while being pressed between the backing plate B1 and the press plate B2, to form a hardened plate M' from the raw material mat M. The press plate B2 in this embodiment determines the shape of the back surface F2 side of the inorganic plate X2. The curing conditions in this step are the same as those in the curing step described above with reference to FIG. 2(b), for example.

[0118] By undergoing such a curing process, the first part Ma, the second part Mb, the third part Mc, The raw material is locally compressed in the fourth part Md, the fifth part Me, and the sixth part Mf. As a result, a hardened plate M' is formed in which the relevant portion is locally densified.

[0119] The hardened plate M' includes a third hardened layer 13, a first hardened layer 11, a second hardened layer 12, and an additional third hardened layer 13. The third hardened layer 13 has a laminated structure including the upper hardened layer 13 and the lower hardened layer 14 in this order from the surface F1 side. The first hardened layer 11 is a layer formed by hardening the third layer L3 described above. The second cured layer 12 is a layer formed by curing the second layer L2. The additional third hardened layer 13 is a layer formed by hardening the aforementioned additional third layer L3. is.

[0120] In the processing step, as shown in FIG. 16(b), the first portion Ma is processed to form a first backside joint P 1, the second portion Mb is machined to form the first front-side joint P2, and the third portion Mc is machined. The fourth portion Md is processed to form the second rear side joint portion P3, and the fourth portion Md is processed to form the second front side joint portion P4. (In FIG. 16(b), the hardened plate M' shown in FIG. 16(a) is shown upside down.) The method is, for example, cutting.

[0121] 17 to 19 show examples of inorganic boards manufactured through the above steps. The inorganic board X2 has a front surface F1 and a back surface F2 opposite thereto. The first rear-side joint portion P1 is located at one end in the first direction D1, and the second rear-side joint portion P2 is located at the other end. The first front joint P2 and the second back joint P3 are located at one end in the second direction D2. The first and second front-side joint portions P3 and P4 are located at the other end of the first and second directions D1 and D2. The dimensions of the inorganic board X2 in the two directions D2 are the same as those of the inorganic board X1.

[0122] The inorganic board X2 includes a third hardened layer 13, a first hardened layer 11, a second hardened layer 12, and an additional hardened layer 13a. The third hardened layer 13 is laminated in this order from the surface F1 side. The first hardened layer 11 is a layer formed by hardening the third layer L3. The second cured layer 12 is a layer formed by curing the layer L1. The additional third cured layer 13 is formed by curing the aforementioned additional third layer L3. This is the layer.

[0123] The first rear-side joint portion P1 is an end portion having a shape suitable for joining inorganic boards together, In this embodiment, the first back-side bonding portion P1 is an end portion having a solid structure. The laminated structure includes a first hardened layer 11, a second hardened layer 12, and an additional third hardened layer 13. The first extending portion P1b is connected to the first base portion P1a. 1b and extends outward from the first base portion P1a in the first direction D1.

[0124] The first backside joint P1 has a higher density than an inner portion adjacent to the first backside joint P1 in the first direction D1. density is, for example, 1.05 to 1.15 g / cm 3 and the inner portion adjacent to the first rear-side joint portion P1 density is, for example, 0.9 to 1.1 g / cm 3 is.

[0125] The first front-side joint portion P2 is an end portion having a shape suitable for joining inorganic boards together, In this embodiment, the first surface-side joint portion P2 is an end portion having a solid upper structure. The first hardened layer 11, the second hardened layer 12, and the additional third hardened layer 13 are formed from the surface F1 side. It has a laminated structure including the above-mentioned components, and has a second base portion P2a and a second extension portion P2b. The protruding portion P2b is thinner than the second base portion P2a and is The second extending portion P2b is located on the outer side of the first extending portion P1b in the thickness direction T. That is, the first extending portion P1b is located on the surface F1 side. It is located on the back side F2 side of P2b.

[0126] The first front-side joint P2 has a higher density than the inner portion adjacent to the first front-side joint P2 in the first direction D1. density is, for example, 1.05 to 1.15 g / cm 3 and the inner portion adjacent to the second rear-side joint portion P2 density is, for example, 0.9 to 1.1 g / cm 3 is.

[0127] The second rear side joint portion P3 is an end portion having a shape suitable for joining inorganic boards together, In this embodiment, the second back side bonding portion P3 is an end portion having a solid structure. The first hardened layer 11, the second hardened layer 12, and the additional third hardened layer 13 are formed from the surface F1 side. The third extension portion P3b has a laminated structure including the third base portion P3a and the third extension portion P3b in this order. The protruding portion P3b is thinner than the third base portion P3a and is and extends outward.

[0128] The second backside joint P3 has a higher density than the inner portion adjacent to the second backside joint P3 in the second direction D2. density is, for example, 1.05 to 1.15 g / cm 3 and the inner portion adjacent to the second rear side joint portion P3 density is, for example, 0.9 to 1.1 g / cm 3 is.

[0129] The second front-side joint portion P4 is an end portion having a shape suitable for joining inorganic boards together, In this embodiment, the second surface-side joint portion P4 is an end portion having a solid upper structure. The first hardened layer 11, the second hardened layer 12, and the additional third hardened layer 13 are formed from the surface F1 side. The fourth extension portion P4b has a laminated structure including the fourth base portion P4a and the fourth extension portion P4b in this order. The protruding portion P4b is thinner than the fourth base portion P4a and is The fourth extending portion P4b is located further outward than the third extending portion P3b in the thickness direction T. That is, the third extending portion P3b is located on the surface F1 side. It is located on the back side F2 side of P4b.

[0130] The second front-side joint P4 has a higher density than the inner portion adjacent to the second front-side joint P4 in the second direction D2. density is, for example, 1.05 to 1.15 g / cm 3 and the inner portion adjacent to the second front-side joint portion P4 density is, for example, 0.9 to 1.1 g / cm 3 is.

[0131] The inorganic board X2 manufactured by the inorganic board manufacturing method according to the third embodiment is the same as that of the first embodiment. As in the above-described inorganic board manufacturing method according to the embodiment, the first back side bonding portion P 1, a first front side joint P2, a second back side joint P3, and a second front side joint P4 are provided at the end can.

[0132] Such an inorganic board X2 can be used to securely connect the first rear side joint P1 and the first front side joint P2 while avoiding excessive weight. The substrate is processed to form the joint P2, the second back side joint P3, and the second front side joint P4. This is suitable for suppressing water penetration from the edge of the inorganic board. The inorganic board manufacturing method achieves high water resistance, similar to the inorganic board manufacturing method according to the first embodiment. It is suitable for producing inorganic boards with a high surface roughness.

[0133] In the inorganic board manufacturing method of the third embodiment, the curing step (FIG. 16(a)) is performed. As for the raw material mat M, the raw material deposition amount per unit thickness in the fifth part Me and the sixth part Mf is A raw mat having locally high density (i.e., denser) can be formed. The first reinforcing portion P5 (hardened fifth portion Me) and the second reinforcing portion P6 (hardened sixth portion M f) can be manufactured.

[0134] The first reinforcing portion P5 and the second reinforcing portion P6 each have a function of reinforcing the inorganic board X2. Specifically, the first reinforcing portion P5 and the second reinforcing portion P6 are each made of an inorganic board X 2 is suitable for suppressing deflection of the inorganic board X2 during transportation and installation, and therefore, This is suitable for suppressing the occurrence of microcracks inside the inorganic plate X2. Suppressing cracks is preferable for realizing high water resistance of the inorganic board X2.

[0135] In addition, in the inorganic board manufacturing method of the third embodiment, a third hard layer on the surface F1 side is used as the surface layer. The third hardened layer 13 is formed on the rear surface F2 side. In this embodiment, a third reinforcing member is included, which is smaller than the first reinforcing member and the second reinforcing member. The third hardened layer 13 is formed from the first hardened layer 11 formed from the first raw material. This allows the second hardened layer 12 to function as a denser surface layer than the second hardened layer 12 formed from the second raw material. Such a third hardened layer 13 helps to realize high water resistance in the inorganic board X2.

[0136] In this manufacturing method, the support plate B1 has a first protrusion Ba and a second protrusion Bb. A press plate B2 is used, and the first back side joint P1 is to be formed at the planned location. The first protrusion Ba is located at a position corresponding to the second rear-side joint P3. A press plate having a second protrusion Bb located at a position other than the first protrusion Bb may be used.

[0137] Even in this embodiment, the first rear-side joint portion P1, the first front-side joint portion P2, and the second rear-side joint portion P3 are formed. The insulated bag includes a joint portion P3, a second front-side joint portion P4, a first reinforcing portion P5, and a second reinforcing portion P6. Can produce 2x mechanical boards.

[0138] In this manufacturing method, if necessary, the second back side joint portion P3 and The support plate B1 may have a second front-side joint portion P4. By using the plate, the second back side joint P3 and the second front side joint P4 are densified. Therefore, inorganic board X2 can be manufactured.

[0139] In this manufacturing method, if necessary, an inorganic board X2 that does not have the first reinforcing portion P5 may be manufactured. In the pressing step shown in FIG. 14(c), the fifth portion Me of the raw material mat M may be pressed. By not performing the above-described steps, such an inorganic board X2 can be manufactured.

[0140] In this manufacturing method, an inorganic board X2 that does not have the second reinforcing portion P6 may be manufactured as needed. 6 portion Mf By not pressing the inorganic board X2, such an inorganic board X2 can be manufactured. End

[0141] In the above-described manufacturing method, the third deposition step described above with reference to FIG. 14(a) must be performed. In this case, the inorganic board X2 having no third hardened layer 13 on the surface F1 side is manufactured. In addition, in this manufacturing method, the additional third deposition step described above with reference to FIG. 15(c) is In this case, the inorganic board X2 without the third hardening layer 13 on the back surface F2 side is Manufactured. [Explanation of symbols]

[0142] D1 1st direction D2 1st direction T thickness direction B1 catch plate Ba First protrusion Bb 2nd protrusion B2 press plate M Raw material mat Ma part 1 Mb 2nd part Mc Part 3 Md 4th part Me Part 5 Mf 6th part L1 1st layer L2 2nd layer L3 3rd layer X1,X1',X2 Inorganic board 11 First hardened layer 12 Second hardened layer 13 Third hardened layer P1 First backside joint P1a 1st base P1b 1st extension P2 1st front joint P2a 2nd base P2b 2nd extension P3 Second backside joint P3a 3rd base P3b 3rd extension P4 2nd front joint P4a 4th base P4b 4th extension P5 First reinforcement part P6 Second reinforcement part

Claims

1. a first depositing step of depositing a first raw material containing a hydraulic first inorganic material and a first reinforcing material on a backing plate to form a first raw material mat consisting of a first layer; a first pressing step of locally pressing and compressing a first portion, which is one end of the first raw material mat in a first direction, and a second portion, which is the other end of the first raw material mat, from the side opposite the backing plate toward the backing plate; a second depositing step of depositing a second raw material containing a hydraulic second inorganic material and a second reinforcing material on the first raw material mat to form a second raw material mat consisting of the first layer and the second layer; and a second depositing step of flattening an exposed surface of the second raw material mat on the side opposite the backing plate. a second pressing step of placing a press plate on the second raw material mat and then pressing the entire surface of the second raw material mat between the backing plate and the press plate; a curing step of curing the second raw material mat in a state pressed between the backing plate and the press plate to form a hardened plate from the second raw material mat; and a processing step of forming a first back-side joint portion so that a portion of the hardened plate made of the first raw material corresponding to the first portion has a recessed shape, and forming a first front-side joint portion so that a portion of the hardened plate made of the first raw material corresponding to the second portion has a recessed shape.

2. 2. The inorganic board manufacturing method according to claim 1, wherein in the first pressing step, a third portion, which is one end of the first raw material mat in a second direction intersecting with the first direction, and a fourth portion, which is the other end, are locally pressed and compressed from the side opposite the backing plate toward the backing plate, and in the processing step, a second back side joint is formed so that a portion made of the first raw material corresponding to the third portion of the hardened board has a concave shape, and a second front side joint is formed so that a portion made of the first raw material corresponding to the fourth portion of the hardened board has a concave shape.

3. 3. The inorganic board manufacturing method of claim 1, wherein in the first pressing step, a fifth portion of the first raw material mat, which is a portion between the first portion and the second portion in the first direction, is locally pressed and compressed from the side opposite the backing plate toward the backing plate.

4. 3. The inorganic board manufacturing method of claim 2, wherein in the first pressing step, a sixth portion of the first raw material mat, which is a portion between the third portion and the fourth portion in the second direction, is locally pressed and compressed from the side opposite the backing plate toward the backing plate.

5. 5. The inorganic board manufacturing method according to claim 1, further comprising at least one third depositing step of depositing a third raw material containing a hydraulic third inorganic material and a third reinforcing material to form a third layer, wherein the third depositing step is carried out before the first depositing step to form the third layer on a backing plate, and in the first depositing step, the first layer is formed on the third layer to form the first raw material mat, or the third depositing step is carried out between the planarizing step and the curing step to form the second raw material mat having the third layer on the second layer, or the third depositing step is carried out before the first depositing step to form the third layer on a backing plate, and in the first depositing step, the first layer is formed on the third layer to form the first raw material mat, and the third depositing step is carried out between the planarizing step and the curing step to form the second raw material mat having the third layer on the second layer.

6. 6. The method for manufacturing an inorganic board according to claim 1, wherein the backing plate and / or the press plate is a template having an uneven shape on the surface facing the raw material mat.

7. 7. The inorganic board manufacturing method according to claim 1, wherein the first rear side joint comprises a first base having a thickness equal to or greater than that of a first inner portion adjacent to the first rear side joint, and a first extension portion extending from the first base in the first direction so as to be thinner than the first base and have a concave shape made of the first raw material; and the first front side joint comprises a second base having a thickness equal to or greater than that of a second inner portion adjacent to the first front side joint, and a second extension portion extending from the second base in the first direction so as to be thinner than the second base and have a concave shape made of the first raw material.

8. The inorganic board manufacturing method according to claim 7 , wherein the second extending portion is made of only the first raw material.

9. The inorganic board manufacturing method according to claim 1 , wherein the first raw material and the second raw material are different raw materials.

10. An inorganic board having a surface and a back surface opposite to the surface, and having a thickness between the surface and the back surface, the inorganic board comprising: a first back-side joint portion located at one end in a first direction intersecting the thickness direction; and a first front-side joint portion located at the other end, the first back-side joint portion having a thickness in the first direction equal to or greater than that of a first inner portion adjacent to the first back-side joint portion; and a first extension portion that is thinner than the first base portion and extends outward from the first base portion in the first direction so that the surface side has a concave shape. an inorganic board, wherein the joint portion has a second base portion having a thickness equal to or greater than that of a second inner portion adjacent to the first front-side joint portion in the first direction, and a second extension portion that is thinner than the second base portion and extends outward in the first direction from the second base portion so as to have a concave shape on the back surface side, the second extension portion being located closer to the front surface side than the first extension portion in the thickness direction, and at least the portion of the first extension portion facing the front surface side and at least the portion of the second extension portion facing the back surface side having a higher density than the portion of the first extension portion facing the back surface side.

11. 11. The inorganic board according to claim 10, wherein the first base portion of the first back side joint portion and the second base portion of the first front side joint portion have a laminated structure including a first hardened layer and a second hardened layer having a lower density than the first hardened layer in the thickness direction.

12. 12. The inorganic board according to claim 10 or 11, further comprising a first reinforcing portion that is a portion between the first back-side joint and the first front-side joint in the first direction, wherein the first reinforcing portion has a thickness equal to or greater than that of a portion adjacent to the first reinforcing portion in the first direction and has a higher density than the adjacent portion.

13. 11. The inorganic board according to claim 10, comprising: a second back-side joint located at one end in a second direction intersecting the thickness direction and the first direction; and a second front-side joint located at the other end, wherein the second back-side joint has a third base portion having a thickness equal to or greater than a third inner portion adjacent to the second back-side joint in the second direction; and a third extension portion thinner than the third base and extending outward from the third base in the second direction; wherein the second front-side joint has a fourth base portion having a thickness equal to or greater than a fourth inner portion adjacent to the second front-side joint in the second direction; and a fourth extension portion thinner than the fourth base, extending outward from the fourth base in the second direction, and located closer to the front surface in the thickness direction than the third extension portion; and wherein at least a portion of the third extension portion facing the front surface side and at least a portion of the fourth extension portion facing the back surface side have a higher density than a portion of the third extension portion facing the back surface side.

14. 14. The inorganic board according to claim 13, wherein the third base portion of the second back side joint portion and the fourth base portion of the second front side joint portion have a laminated structure including a first hardened layer and a second hardened layer having a lower density than the first hardened layer in the thickness direction.

15. 15. The inorganic board according to claim 13 or 14, further comprising a second reinforcing portion that is a portion of the area between the second back-side joint and the second front-side joint in the second direction, wherein the second reinforcing portion has a thickness equal to or greater than that of a portion adjacent to the second reinforcing portion in the second direction and has a higher density than the adjacent portion.

16. 15. The inorganic board according to claim 11 or 14, wherein the first hardened layer and the second hardened layer each contain a reinforcing material, and the first base portion of the first back-side joining portion and the second base portion of the first front-side joining portion have a laminated structure including: a third hardened layer containing a reinforcing material smaller than the reinforcing material contained in the first hardened layer and the second hardened layer.

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