Substrate working machine and method for measuring the depth of a viscous body

Abstract

To efficiently measure a depth of a viscous material in an accumulation part for accumulating the viscous material attached to a component.SOLUTION: A substrate working machine executes a work against a substrate. The substrate working machine comprises: a nozzle that absorbs a component; an accumulation part that accumulates a viscous material attached to the component; a measurement member that is used for measuring a depth of the viscous material accumulated in the accumulation part; a head that detachably mounts the nozzle and the measurement member; an imaging device that images the measurement member mounted to the head from a lower direction, and images the component absorbed by the nozzle mounted to the head; a moving device that moves the head between the accumulation part and the imaging device; and a specification part that specifies the depth of the viscous material in the accumulation part from the imaging image of a lower surface of the measurement member imaged by the imaging device after the measurement member mounted to the head is dropped to a predetermined height in the accumulation part.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a substrate processing machine and a method for measuring the depth of a viscous body. [Background technology]

[0002] In a board processing machine (e.g., a component mounter) that performs a predetermined operation on a board, a viscous material (e.g., flux) may be applied to components (e.g., electrodes of electronic components) during the operation on the board. For this reason, the board processing machine may be provided with a storage unit for storing the viscous material. In this type of board processing machine, it is necessary to grasp the depth of the viscous material stored in the storage unit in order to accurately apply the viscous material to the components. For example, the board processing machine disclosed in Patent Document 1 includes a mechanism for measuring the depth of the viscous material stored in the storage unit. The board processing machine of Patent Document 1 includes a measuring jig with multiple rod-shaped measuring units. Since the multiple measuring units have different lengths, the positions of the lower ends of the multiple measuring units are different. During measurement, the measuring jig is positioned at a predetermined height relative to the storage unit, and the multiple measuring units are pressed against the surface of the stored viscous material, leaving measurement marks on the surface of the viscous material. Then, an imaging device is used to capture an image of the surface of the viscous material from above, and the measurement marks are detected from the captured image. As described above, since the positions of the lower ends of the multiple measurement parts are different, the depth range of the viscous material is measured by identifying which measurement part detected the measurement mark. The imaging device uses a mark camera for capturing images of marks, etc., attached to the surface of the circuit board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2013 / 084387 Summary of the Invention [Problem to be solved by the invention]

[0004] In the circuit board working machine of Patent Document 1, when measuring the depth of a viscous material in a storage section, a measurement mark is made on the surface of the viscous material, and then the measurement mark is imaged from above using a mark camera. By using a mark camera, an existing camera installed in the circuit board working machine can be used, and there is no need to install a new imaging device to image the measurement mark. However, a mark camera images marks made on a circuit board or the like, and generally has a narrow imaging range. As a result, it is sometimes not possible to simultaneously image multiple measurement marks.

[0005] The present specification discloses a technique for efficiently measuring the depth of a viscous material in a reservoir that stores the viscous material to be adhered to a part. [Means for solving the problem]

[0006] The board working machine disclosed in this specification performs work on a board. The board working machine includes a nozzle for suctioning components, a storage unit for storing a viscous material to be attached to the components, a measuring member used to measure the depth of the viscous material stored in the storage unit, a head to which the nozzle and the measuring member are detachably attached, an imaging device for imaging the measuring member attached to the head from below and the component sucked by the nozzle attached to the head, a moving device for moving the head between the storage unit and the imaging device, and an identifying unit for lowering the measuring member attached to the head to a predetermined height in the storage unit and then identifying the depth of the viscous material in the storage unit from an image of the underside of the measuring member captured by the imaging device.

[0007] In the circuit board processing machine, a measuring member is immersed in the viscous material in the storage portion, and the depth of the viscous material in the storage portion is determined from an image captured by the measuring member after immersion. This eliminates the need to capture an image of the viscous material in the storage portion after immersion of the measuring member, as in conventional technology, and allows the depth of the viscous material in the storage portion to be measured efficiently. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a diagram showing a schematic configuration of a component mounter that is an example of a board processing machine according to an embodiment; [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 3 is a side view showing a schematic configuration of a measuring member. [Figure 4] FIG. 4 is a bottom view showing a schematic configuration of a measuring member. [Figure 5] FIG. 2 is a block diagram showing a control system of the component mounter. [Figure 6] 10 is a flowchart showing an example of a process for measuring a film thickness of flux stored in a storage section using a measuring member. [Figure 7] 10 is a diagram showing an example of an image captured from below of the measuring member after the measuring member has been lowered to a predetermined height in the storage section; FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] The main features of the embodiments described below are listed below. Note that the technical elements described below are independent technical elements that exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

[0010] In the circuit board processing machine disclosed in this specification, the imaging device images the measuring member from below, so an imaging device that images the component from below (i.e., a parts camera) can be used. Part cameras generally have a wider imaging range and higher resolution than mark cameras. Therefore, by using an imaging device that images the measuring member from below, it is possible to obtain an image with a wider imaging range and higher resolution. By using this image, it is possible to more easily identify the depth of the viscous material in the storage section.

[0011] In the substrate processing machine disclosed in this specification, a mark that is displayed in a color different from the color of the viscous material may be provided on the underside of the measuring member. The identifying unit may identify the depth of the viscous material based on whether the mark is captured in the captured image. With this configuration, the depth of the viscous material in the storage unit can be more easily identified.

[0012] In the circuit board processing machine disclosed in this specification, the measuring member may have multiple protrusions protruding downward from a reference surface. The multiple protrusions may have different lengths of protrusion from the reference surface. Each protrusion may have a mark on its underside. With this configuration, by providing multiple protrusions of different lengths, when the measuring member is lowered to a predetermined height in the storage section, only the protrusions with a length corresponding to the depth of the viscous material in the storage section are immersed in the viscous material. After performing a single operation of lowering the measuring member into the storage section, the depth of the viscous material in the storage section can be determined from an image captured from below of the multiple protrusions. Therefore, the depth of the viscous material in the storage section can be efficiently determined without having to perform the operation of lowering the measuring member into the storage section multiple times.

[0013] In the circuit board processing machine disclosed in this specification, the multiple protrusions may be arranged so as to be located within the imaging range of the imaging device when the imaging device captures an image of the measurement member from below. With this configuration, by arranging the multiple protrusions so as to be located within the imaging range of the imaging device, it is possible to simultaneously capture images of the multiple protrusions in a single image. [Example]

[0014] A board processing machine according to an embodiment will be described with reference to the drawings. Here, a component mounter 10 will be described as an example of a board processing machine. The component mounter 10 is a device that mounts electronic components 4 on a circuit board 2. The component mounter 10 is also called an electronic component placement device or a chip mounter. Typically, the component mounter 10 is installed alongside other board processing machines such as a solder printer and a board inspection machine, forming a continuous mounting line.

[0015] 1 and 2, the component mounter 10 includes a plurality of component feeders 12, a feeder holder 14, a mounting head 16, a head moving device 18, a board conveyor 20, an imaging device 30, a nozzle housing 34, a flux unit 40, a control device 26, and a touch panel 24. A management device 8 configured to be able to communicate with the component mounter 10 is disposed outside the component mounter 10.

[0016] Each component feeder 12 stores a plurality of electronic components 4. The component feeders 12 are detachably attached to the feeder holder 14 and supply the electronic components 4 to the mounting head 16. The specific configuration of the component feeders 12 is not particularly limited. Each component feeder 12 may be, for example, a tape feeder that supplies a plurality of electronic components 4 stored on a tape, a tray feeder that supplies a plurality of electronic components 4 stored on a tray, or a bulk feeder that supplies a plurality of electronic components 4 stored randomly in a container.

[0017] The feeder holding unit 14 has a plurality of slots, each of which can detachably accommodate a component feeder 12. The feeder holding unit 14 may be fixed to the component mounter 10, or may be detachable from the component mounter 10.

[0018] The placement head 16 has a nozzle 6 that picks up the electronic component 4. The nozzle 6 is detachably attached to the placement head 16. The placement head 16 is capable of moving the nozzle 6 in the Z direction (here, the vertical direction) to move the nozzle 6 toward and away from the component feeder 12 and the circuit board 2. The placement head 16 can pick up the electronic component 4 from the component feeder 12 using the nozzle 6, and can also place the electronic component 4 picked up by the nozzle 6 onto the circuit board 2. Note that the placement head 16 is not limited to one having a single nozzle 6, and may be one having multiple nozzles 6.

[0019] The head moving device 18 moves the mounting head 16 between the component feeder 12 and the circuit board 2. As an example, the head moving device 18 in this embodiment is an XY robot that moves a moving base 18a in the X and Y directions, and the mounting head 16 is fixed to the moving base 18a. Note that the mounting head 16 is not limited to being fixed to the moving base 18a, but may also be detachably attached to the moving base 18a.

[0020] The board conveyor 20 is a device that carries in, positions, and carries out the circuit board 2. As an example, the board conveyor 20 of this embodiment includes a pair of belt conveyors and a support device (not shown) that supports the circuit board 2 from below.

[0021] As shown in FIG. 2, the imaging device 30 is disposed between the component feeder 12 and the board conveyor 20 (more specifically, the board conveyor 20 of the pair of board conveyors 20 that is installed on the component feeder 12 side). The imaging device 30 includes a camera and a light source. The camera is disposed so that its imaging direction faces upward, and captures an image of the nozzle 6 from below while the nozzle 6 is holding an electronic component 4. That is, when the nozzle 6 picks up the electronic component 4, the camera captures an image of the bottom surface of the electronic component 4 held by the nozzle 6. The camera may be, for example, a CCD camera. The light source is constituted by an LED, and illuminates the bottom surface (imaging surface) of the electronic component 4 held by the nozzle 6. Image data of the image captured by the imaging device 30 is stored in a memory (not shown) of the control device 26.

[0022] The nozzle housing section 34 is disposed between the component feeder 12 and the board conveyor 20 (more specifically, the board conveyor 20 of the pair of board conveyors 20 that is installed on the component feeder 12 side). The nozzle housing section 34 can accommodate multiple nozzles 6 and transfers the nozzles 6 to and from the mounting head 16. The multiple nozzles 6 are housed in nozzle holders 36 attached to the nozzle housing section 34. The nozzle holders 36 can accommodate multiple types of nozzles 6. The nozzle holders 36 are detachable from the nozzle housing section 34 and are removed from the nozzle housing section 34, for example, when an operator wants to replace a nozzle 6 in the nozzle holder 36.

[0023] The nozzle holder 36 also houses a measuring member 50. The measuring member 50 is used to measure the thickness of the flux film in a reservoir 42 (described later) of the flux unit 40. The measuring member 50 is attachable to the mounting head 16 and has a shape that allows it to be housed in the nozzle holder 36. In this embodiment, the base end of the measuring member 50 has the same shape as the nozzle 6, and the tip end is provided with a plurality of protrusions 54 that are used to measure the thickness of the flux film. The configuration of the measuring member 50 will be described in detail later.

[0024] The flux unit 40 can be installed on the feeder holding section 14. The dimension of the flux unit 40 in the X direction is larger than the dimension of the component feeder 12 in the X direction. Therefore, the flux unit 40 is installed across multiple slots of the feeder holding section 14. A storage section 42 and a cleaning section 44 are provided on the upper surface of the flux unit 40.

[0025] The reservoir 42 has a rectangular box shape in a plan view, and stores a viscous material therein. In this embodiment, the viscous material is flux that is applied to the electronic components 4 (e.g., electrodes of the electronic components 4) when the electronic components 4 are mounted on the circuit board 2. The reservoir 42 is disposed on the board conveyor 20 side of the flux unit 40 (the leading end side when the flux unit 40 is inserted for installation in the feeder holding unit 14). The reservoir 42 is disposed in a position accessible to the placement head 16. Therefore, with the nozzle 6 attached to the placement head 16 sucking the top surface of the electronic component 4, the flux in the reservoir 42 can be applied to the bottom side of the electronic component 4 (e.g., the bottom surface of the electronic component 4 or an electrode installed on the bottom side of the electronic component 4).

[0026] The cleaning unit 44 has a rectangular box shape in a plan view and contains a cleaning liquid. The cleaning unit 44 is sized and shaped to accommodate the measuring member 50 (more specifically, the multiple protrusions 54 described below) and is used to clean flux adhering to the measuring member 50. In this embodiment, the cleaning unit 44 is configured to remove flux adhering to the measuring member 50 using ultrasonic waves. A known ultrasonic cleaning device can be used for the cleaning unit 44, and detailed description thereof will be omitted. The cleaning unit 44 is located on the PCB conveyor 20 side of the flux unit 40 (the leading end side when the flux unit 40 is inserted for installation in the feeder holder 14). The cleaning unit 44 is located in a position accessible to the mounting head 16. Therefore, flux adhering to the measuring member 50 can be cleaned by the cleaning unit 44 while the measuring member 50 is attached to the mounting head 16.

[0027] The measuring member 50 will now be described in detail. As shown in FIGS. 3 and 4, the tip of the measuring member 50 is provided with a flat reference surface 52 and multiple protrusions 54 protruding downward from the reference surface 52. The reference surface 52 is exposed downward and is substantially parallel (i.e., horizontal) to the surface of the circuit board 2 when the measuring member 50 is attached to the mounting head 16. The multiple protrusions 54 each have a different length of protrusion downward from the reference surface 52. When the measuring member 50 is lowered to a predetermined height in the flux storage section 42, the multiple protrusions 54 are immersed in the flux according to the depth of the flux in the flux storage section 42. That is, as the depth of the flux in the flux storage section 42 increases, the number of the multiple protrusions 54 immersed in the flux increases accordingly, and as the depth of the flux in the flux storage section 42 decreases, the number of the multiple protrusions 54 immersed in the flux decreases accordingly. When the measuring member 50 is lowered to a predetermined height in the storage section 42, the depth of the flux in the storage section 42 can be determined by detecting which of the multiple protrusions 54 are immersed and which are not.

[0028] In this embodiment, nine protrusions 54a to 54i are provided, each having a length that differs by 20 μm. Protrusion 54a is the longest, and has a length such that when measuring member 50 is lowered to a predetermined height in storage portion 42, the distance from the lower surface of protrusion 54a to the bottom of storage portion 42 is 20 μm. Therefore, when measuring member 50 is lowered to the predetermined height in storage portion 42, protrusion 54a is immersed in the flux if the flux is 20 μm deep or more. Similarly, when measuring member 50 is lowered to a predetermined height in storage section 42, protrusion 54b has a length that makes it 40 μm long to the bottom of storage section 42, protrusion 54c has a length that makes it 60 μm long to the bottom of storage section 42, protrusion 54d has a length that makes it 80 μm long to the bottom of storage section 42, protrusion 54e has a length that makes it 100 μm long to the bottom of storage section 42, protrusion 54f has a length that makes it 120 μm long to the bottom of storage section 42, protrusion 54g has a length that makes it 140 μm long to the bottom of storage section 42, protrusion 54h has a length that makes it 160 μm long to the bottom of storage section 42, and protrusion 54i has a length that makes it 180 μm long to the bottom of storage section 42. In other words, the "predetermined height" is the height at which, when measuring the depth of the flux in the storage section 42, the lower surface of each protrusion 54 is positioned at a distance set for measurement from the bottom of the storage section 42 (for example, 20 μm for the protrusion 54a).

[0029] Furthermore, a mark 56 is provided on the underside of each of the protrusions 54a to 54i. The mark 56 has a color different from the flux. When the undersides of the protrusions 54a to 54i are immersed in the flux, the mark 56 provided on the protrusions 54a to 54i is covered by the flux and becomes invisible. When the measuring member 50 is attached to the mounting head 16 and positioned above the imaging device 30, the measuring member 50 can be imaged from below by the imaging device 30. When the measuring member 50 is imaged from below by the imaging device 30 without the undersides of the protrusions 54a to 54i being immersed in the flux, the mark 56 is not covered by the flux and is imaged by the imaging device 30. On the other hand, when the measuring member 50 is imaged from below by the imaging device 30 after the undersides of the protrusions 54a to 54i are immersed in the flux, the mark 56 is covered by the flux and is not imaged. The plurality of protrusions 54a to 54i are arranged so as to be within the imaging range of the imaging device 30 when the measuring member 50 is imaged from below by the imaging device 30.

[0030] The control device 26 is configured using a computer equipped with a CPU and a storage device. The control device 26 controls the operation of each part of the component mounter 10 based on a production program transmitted from the management device 8. As shown in Fig. 5, the control device 26 is connected to the head moving device 18, the board conveyor 20, the touch panel 24, and the imaging device 30, and controls each part of the head moving device 18, the board conveyor 20, the touch panel 24, and the imaging device 30. The touch panel 24 is a display device that provides the operator with various information about the component mounter 10, and is also an input device that receives instructions and information from the operator.

[0031] Next, a process for measuring the film thickness (depth) of the flux stored in storage section 42 using measuring member 50 will be described. The process for measuring the film thickness of the flux stored in storage section 42 is performed, for example, before the process for mounting electronic component 4 on circuit board 2 is executed. By performing the following process, it is possible to accurately identify the film thickness of the flux stored in storage section 42. When applying flux to electronic component 4, control device 26 controls the position of electronic component 4 with respect to storage section 42 based on the measured value of the film thickness of the flux, thereby enabling the flux to be applied appropriately to electronic component 4.

[0032] 6, first, the control device 26 mounts the measuring member 50 on the mounting head 16 (S12). Specifically, the control device 26 moves the moving base 18a so that the mounting head 16 is positioned above the measuring member 50 in the nozzle holder 36. Then, the control device 26 moves the mounting head 16 downward, and mounts the measuring member 50 on the mounting head 16 in the same procedure as when mounting the nozzle 6.

[0033] Next, control device 26 lowers measuring member 50 to a predetermined height above storage portion 42 (S14). Specifically, control device 26, with measuring member 50 attached to mounting head 16, moves movable base 18a so that measuring member 50 is positioned above storage portion 42. Then, control device 26 moves measuring member 50 downward until measuring member 50 is positioned at a predetermined height. When measuring member 50 is lowered to a predetermined height above storage portion 42, some of multiple protrusions 54a to 54i are immersed in the flux depending on the film thickness of the flux in storage portion 42.

[0034] Next, the control device 26 images the measuring member 50 with the imaging device 30 (S16). Specifically, the control device 26 moves the mounting head 16 upward and removes the measuring member 50 (more specifically, the protruding portions 54a to 54i) immersed in the flux in the storage portion 42 from the storage portion 42. Then, the control device 26 moves the moving base 18a so that the measuring member 50 is positioned above the imaging device 30. Then, the control device 26 images the measuring member 50 from below with the imaging device 30. As described above, the multiple protruding portions 54a to 54i are arranged so as to fall within the imaging range of the imaging device 30. Therefore, when the measuring member 50 is imaged from below with the imaging device 30, the lower surfaces of the multiple protruding portions 54a to 54i are all imaged at once.

[0035] Next, the control device 26 identifies the thickness of the flux film in the storage section 42 from the captured image (S18). Specifically, the control device 26 identifies from the captured image which of the multiple protrusions 54a-54i have flux attached and which do not. As described above, a mark 56 is attached to the bottom surface of each of the protrusions 54a-54i, and if flux is attached to the mark 56, the mark 56 is not imaged by the imaging device 30. The control device 26 identifies from the captured image which protrusions 54 have the mark 56 attached to them and which protrusions 54 have the mark 56 not imaged, and thereby identifies the thickness of the flux film in the storage section 42.

[0036] 7, assume that the marks 56 on the protrusions 54a to 54e are not captured on the imaging screen, but the marks 56 on the protrusions 54f to 54i are captured. When the measuring member 50 is lowered to a predetermined height in the storage portion 42, the distance between the lower surface of the protrusion 54e and the bottom of the storage portion 42 is 100 μm, and the distance between the lower surface of the protrusion 54f and the bottom of the storage portion 42 is 120 μm. Because the mark 56 on the lower surface of the protrusion 54e is not captured, but the mark 56 on the lower surface of the protrusion 54f is captured, it is possible to determine that the film thickness of the flux in the storage portion 42 is between 100 and 120 μm.

[0037] Next, the control device 26 cleans the flux adhering to the measurement member 50 in the cleaning unit 44 (S20). Specifically, the control device 26 moves the moving base 18a so that the measurement member 50 is positioned above the cleaning unit 44. Then, the control device 26 moves the mounting head 16 downward until the multiple protrusions 54a to 54i of the measurement member 50 are immersed in the cleaning liquid in the cleaning unit 44. As a result, the flux adhering to each of the protrusions 54a to 54i is removed in the cleaning unit 44, allowing the measurement member 50 to be used repeatedly.

[0038] In this embodiment, the underside of the measuring member 50 is imaged using an imaging device 30 that images the electronic component 4 from below. The imaging device 30 is used to image the electronic component 4 from below and is a so-called parts camera. Part cameras generally have a wider imaging range and higher resolution than mark cameras that image marks or the like attached to the surface of the circuit board 2. Therefore, even if the measuring member 50 has multiple protrusions 54a-54i, the multiple protrusions 54a-54i can be simultaneously imaged. This allows the thickness of the flux in the storage section 42 to be efficiently determined. Furthermore, the parts camera is typically installed in the component mounter 10. Therefore, an existing imaging device can be used to measure the thickness of the flux in the storage section 42 without installing an additional imaging device for measuring the thickness of the flux in the storage section 42.

[0039] In this embodiment, the protrusions 54 had lengths that differed by 20 μm, but this configuration is not limited thereto. The difference in length between the protrusions 54 may be greater than or less than 20 μm. In this embodiment, the measuring member 50 had nine protrusions 54, but this configuration is not limited thereto. The number of protrusions 54 provided on the measuring member 50 may be less than or greater than nine. Furthermore, when the measuring member 50 is lowered to a predetermined height in the storage section 42, if flux does not adhere to all of the protrusions 54 or if flux adheres to all of the protrusions 54, the predetermined height may be changed and the process shown in FIG. 6 may be performed again. For example, even when the number of protrusions 54 provided on the measuring member 50 is reduced, the thickness of the flux film in the storage section 42 can be accurately measured by changing the predetermined height and repeating the process shown in FIG. 6.

[0040] Furthermore, in this embodiment, the multiple protrusions 54a to 54i are arranged so as to fall within the imaging range of the imaging device 30 when the measuring member 50 is imaged from below by the imaging device 30, but this configuration is not limited to this. The multiple protrusions 54 may be arranged in a range wider than the imaging range of the imaging device 30. In this case, when the measuring member 50 is imaged from below by the imaging device 30, the measuring member 50 may be moved and images of the measuring member 50 may be taken multiple times so that the undersides of all of the protrusions 54 are imaged.

[0041] Furthermore, in this embodiment, the mounter 10 is configured to be able to measure the thickness of the flux film in the reservoir 42, but the present invention is not limited to such a configuration. Any board working machine that has a reservoir for storing a viscous material can employ a configuration similar to that of this embodiment, and for example, a coater that coats a viscous material or a printer that prints a viscous material may be provided with a configuration similar to that of this embodiment.

[0042] Points to note regarding the board work machine described in the embodiment are as follows: The component mounter 10 in the embodiment is an example of a "board work machine," the electronic components 4 are an example of a "component," the mounting head 16 is an example of a "head," the head moving device 18 is an example of a "moving device," and the control device 26 is an example of a "specifying unit."

[0043] Although specific examples of the technology disclosed in this specification have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and variations of the specific examples exemplified above. Furthermore, the technical elements described in this specification or drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or drawings simultaneously achieves multiple objectives, and achieving one of those objectives itself has technical utility. [Explanation of symbols]

[0044] 2: Circuit board 4: Electronic components 6: Nozzle 10: Component mounter 12: Parts feeder 14: Feeder holder 16: Mounting head 18: Head moving device 20: PCB conveyor 24: Touch panel 26: Control device 30: Imaging device 34: Nozzle housing 36: Nozzle holder 40: Flux Unit 42: Storage section 44: Cleaning section 50: Measuring member 52: Reference plane 54:Protrusion 56: Mark

Claims

1. A board working machine that performs work on a board, A nozzle for suctioning a part; a storage section for storing the viscous material to be attached to the part; a measuring member used to measure the depth of the viscous material stored in the storage portion; a head to which the nozzle and the measuring member are detachably attached; an imaging device that images the measuring member attached to the head from below and also images the component sucked by the nozzle attached to the head; a moving device that moves the head between the storage unit and the imaging device; and an identification unit that identifies the depth of the viscous body in the storage unit from an image of the underside of the measuring member captured by the imaging device after the measuring member attached to the head is lowered to a predetermined height in the storage unit, the measuring member has a plurality of protrusions protruding downward from a reference surface, the plurality of protrusions have different lengths that protrude downward from the reference surface, the reference surface is a rectangle having a first side and a second side perpendicular to the first side, Each of the plurality of protrusions is a quadrangular prism having a square bottom surface, the plurality of protrusions are arranged in a grid pattern on the reference surface, a plurality of protrusions are arranged parallel to the first side of the reference surface, and a plurality of protrusions are arranged parallel to the second side of the reference surface, A mark is provided on the underside of each protrusion, the mark being displayed in a color different from that of the viscous body; The identification unit identifies the depth of the viscous body based on whether or not the mark is captured in the captured image.

2. 2. The circuit board processing machine according to claim 1, wherein the measuring member is disposed so as to be positioned within an imaging range of the imaging device when the imaging device images the measuring member from below.

3. 1. A method for measuring the depth of a viscous material in a reservoir that stores the viscous material to be adhered to a part, comprising: a lowering step of lowering the measuring member to a predetermined height in the storage section; an imaging step of imaging a lower surface of the measuring member after the lowering step; a determining step of determining whether or not a viscous material has adhered to the lower surface of the measuring member in the lowering step from the captured image taken in the imaging step, the measuring member has a plurality of protrusions protruding downward from a reference surface, the plurality of protrusions have different lengths that protrude downward from the reference surface, the reference surface is a rectangle having a first side and a second side perpendicular to the first side, Each of the plurality of protrusions is a quadrangular prism having a square bottom surface, the plurality of protrusions are arranged in a grid pattern on the reference surface, a plurality of protrusions are arranged parallel to the first side of the reference surface, and a plurality of protrusions are arranged parallel to the second side of the reference surface; A mark is provided on the underside of each protrusion, the mark being displayed in a color different from that of the viscous body; The determining step determines the depth of the viscous body based on whether the mark is captured in the captured image.

Images