cable

Abstract

To provide a cable which can maintain grounding performance even when a cable is ground-faulted, and a cable manufacturing method.SOLUTION: In a cable 1, an insulator has insulation properties and covers the outer periphery of a conductor. A copper tape 50 is partially overlapped and spirally wound around the outer periphery of the insulator, and thereby can flow current to a grounding side at the time of short circuit. A press winding tape 60 is partially overlapped and is spirally wound around the outer periphery of the copper tape 50, and presses the copper tape 50 to the insulator side. A sheath coats the press winding tape 60. As for the copper tape 50, in a copper tape overlapped part 53 where the copper tape 50 is partially overlapped, a copper tape 51 on one side X1 in an extension direction X and the conductor side of a copper tape 52 on the other side X2 in the extension direction X are overlapped. As for the press winding tape 60, in a press winding tape overlapped part 63 where the press winding tape 60 is partially overlapped, a press winding tape 61 on the one side X1 in the extension direction X and a side opposite to the conductor side of a press winding tape 62 on the other side X2 in the extension direction X are overlapped.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a cable and a method for manufacturing a cable. [Background technology]

[0002]

[0003] Conventionally, for example, there has been a cable that includes a metal shielding layer (shielding tape) formed by wrapping a metal tape around the outside of a cable core portion that is formed by sequentially arranging an inner semiconductive layer, an insulating layer, and an outer semiconductive layer on a conductor, a presser tape layer that presses down the metal shielding layer, and a protective sheath layer that protects them. Here, in the shielding tapes of commonly used cables, at the shielding tape overlap portion where they partially overlap, the shielding tape on one side in the extending direction is overlapped on the conductor side of the shielding tape on the other side in the extending direction, and the presser tape that presses down the shielding tape is also overlapped on the same side as the metal tape. Patent Document 1 describes a waterproof power cable that includes a metal shielding layer formed by wrapping a metal tape around the outside of a cable core portion that is formed by sequentially arranging an inner semiconductive layer, an insulating layer, and an outer semiconductive layer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Utility Model Application Publication No. 05-017850 Summary of the Invention [Problem to be solved by the invention]

[0004] However, with the above-mentioned cable, when the protective sheath layer shrinks, the shielding tape may be pulled and damaged by the protective sheath layer, which may result in the cable being unable to maintain its grounding performance, and there is room for further improvement in this regard.

[0005] Therefore, the present invention has been made in view of the above, and an object of the present invention is to provide a cable and a method for manufacturing the cable that can maintain grounding performance. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, a cable according to the present invention comprises a conductor that is conductive, electrically connects devices together, and extends in an extension direction; an insulator that is insulating and covers the outer periphery of the conductor; a metal tape that is formed in a strip shape and wound spirally around the outer periphery of the insulator with a portion overlapping, for causing current to flow to the ground side in the event of a short circuit; a pressure winding tape that is formed in a strip shape and wound spirally around the outer periphery of the metal tape with a portion overlapping, for pressing the metal tape against the insulator; and a sheath that covers the pressure winding tape, wherein the metal tape has a metal tape overlapping portion that is partially overlapped with the metal tape on one side in the extension direction. is overlapped on the conductor side of the metal tape on the other side in the extension direction, and the pressure wrapping tape is overlapped on the opposite side to the conductor side of the pressure wrapping tape on the other side in the extension direction at the pressure wrapping tape overlapping portion where the parts are overlapped, and the pressure wrapping tape is pressed down by the pressure wrapping tape as the pressure wrapping tape packs against contraction of the sheath from the other side in the extension direction, and movement of the metal tape from the other side to one side in the extension direction is suppressed, and the metal tape is packed against contraction of the sheath from one side in the extension direction, on the other hand The feature is that movement from one side to the other is suppressed.

[0007] The manufacturing method of the cable according to the present invention is characterized by including an insulating step of insulating a conductive conductor by covering its outer periphery with an insulator; a metal tape winding step of spirally winding a strip-shaped metal tape, which allows current to flow to the ground side in the event of a short circuit, around the outer periphery of the insulator that has insulated the conductor in the insulating step from one side to the other in the extension direction of the conductor, with a portion overlapping; a pressure winding tape winding step of spirally winding a strip-shaped pressure winding tape, which presses the metal tape against the insulator side, around the outer periphery of the metal tape wound in the metal tape winding step from the other side to one side in the extension direction, with a portion overlapping; and a covering step of covering the pressure winding tape wound in the pressure winding tape winding step with a sheath. [Effects of the Invention]

[0008] In the cable and cable manufacturing method according to the present invention, the way the metal tape overlaps in the metal tape overlapping portion and the way the pressure winding tape overlaps in the pressure winding tape overlapping portion are different, so that when the sheath shrinks from both sides, the pressure winding tape clogs and holds down the metal tape against shrinkage from one side of the sheath, thereby suppressing movement of the metal tape, and when the sheath shrinks from the other side of the sheath, the metal tape clogs and suppresses movement of the metal tape. As a result, in the cable and cable manufacturing method, when the sheath shrinks from both sides, the movement of the metal tape is suppressed even if the metal tape is pulled by the sheath, so the metal tape is not damaged and grounding performance can be maintained even when the cable has a ground fault. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a cross-sectional view showing an example of the configuration of a cable according to an embodiment. [Figure 2] FIG. 2 is a schematic diagram showing an example of the configuration of the metal tape overlapping portion and the pressure wrapping tape overlapping portion according to the embodiment. [Figure 3]FIG. 3 is a front view showing a cable according to a comparative example after sheath shrinking. [Figure 4] FIG. 4 is a schematic diagram showing a cable according to a comparative example before sheath shrinking. [Figure 5] FIG. 5 is a schematic diagram showing a cable according to a comparative example after sheath shrinking. [Figure 6] FIG. 6 is a schematic diagram showing the cable according to the embodiment after the sheath has been shrunk. [Figure 7] FIG. 7 is a flowchart showing a method for manufacturing a cable according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0011] [Embodiment] A cable 1 according to an embodiment and a method for manufacturing the cable 1 will be described with reference to the drawings. The cable 1 is, for example, a high-voltage CV cable (cross-linked polyethylene insulated vinyl sheath cable) that electrically connects a high-voltage power source and a switchboard that are disposed at a distance from each other. As shown in FIG. 1, the cable 1 includes a conductor 10, an inner semiconductive layer 20, an insulator 30, an outer semiconductive layer 40, a copper tape 50 as a metal tape, a pressure winding tape 60, and a sheath 70.

[0012] The conductor 10 is a component that allows an electric current to flow. The conductor 10 is formed by bundling together a plurality of conductive metal wires, such as wires (not shown) made of aluminum, aluminum alloy, copper, copper alloy, or the like. The conductor 10 has a circular cross section and extends along an extension direction X. The conductor 10, for example, passes the electric current of power supplied from a high-voltage power supply to a switchboard.

[0013] Next, the internal semiconductive layer 20 will be described. The internal semiconductive layer 20 homogenizes the electric field. The internal semiconductive layer 20 is made of, for example, polyethylene mixed with carbon and extruded, a fibrous (cloth) tape coated with a conductive material, or a combination of these, and is semiconductive. The internal semiconductive layer 20 is laminated on the conductor 10 and formed to cover the outer periphery of the conductor 10. That is, the internal semiconductive layer 20 has a cylindrical shape, extends along the extension direction X, and is provided between the conductor 10 and the insulator 30. In other words, the conductor 10 and the insulator 30 are provided via the internal semiconductive layer 20. The internal semiconductive layer 20 homogenizes the electric field between the conductor 10 and the insulator 30 and prevents the electric field from concentrating in one area between the conductor 10 and the insulator 30.

[0014] Next, the insulator 30 will be described. The insulator 30 insulates the conductor 10. The insulator 30 is formed, for example, from an insulating thermoplastic resin, such as polyethylene, and is laminated on the internal semiconductive layer 20. The insulator 30 has a cylindrical shape, extends along the extension direction X, and is provided between the internal semiconductive layer 20 and the external semiconductive layer 40. The insulator 30 insulates the conductor 10 by covering the outer periphery of the conductor 10 via the internal semiconductive layer 20.

[0015] Next, the outer semiconductive layer 40 will be described. The outer semiconductive layer 40 homogenizes the electric field. The outer semiconductive layer 40 is made of, for example, polyethylene mixed with carbon and extruded, a fibrous (cloth) tape coated with a conductive material, or a combination of these, and is semiconductive. The outer semiconductive layer 40 is laminated on the insulator 30 and formed to cover the outer periphery of the insulator 30. That is, the outer semiconductive layer 40 has a cylindrical shape, extends along the extension direction X, and is provided between the insulator 30 and the copper tape 50. In other words, the insulator 30 and the copper tape 50 are provided with the outer semiconductive layer 40 interposed therebetween. The outer semiconductive layer 40 homogenizes the electric field between the insulator 30 and the copper tape 50, and prevents the electric field from concentrating in one area between the insulator 30 and the copper tape 50.

[0016] Next, the copper tape 50 will be described. The copper tape 50 is used to pass current to the ground side in the event of a short circuit, and is electrically connected to the ground. The copper tape 50 is formed, for example, in a strip shape from copper, and has a thickness of about 0.1 mm or more and less than 0.15 mm. The copper tape 50 is suitable for, for example, a conductor 10 having a size of 20 mm. 2The copper tape 50 has a width of approximately 25 mm relative to the conductor 10, but is not limited to this. When the size of the conductor 10 is relatively large, the copper tape 50 may have a larger width in response to the larger conductor 10, and when the size of the conductor 10 is relatively small, the copper tape 50 may have a smaller width in response to the smaller conductor 10. The copper tape 50 is wound around the outer periphery of the insulator 30, and in this example, is wound around the outer periphery of the insulator 30 via the outer semiconductive layer 40. That is, the copper tape 50 is wound around the outer periphery of the outer semiconductive layer 40 formed on the insulator 30. For example, the copper tape 50 is wound around the outer periphery of the outer semiconductive layer 40 in a spiral shape from one side X1 to the other side X2 in the extension direction X, with portions of the copper tape 50 overlapping. When viewed from a direction intersecting the extension direction X, the copper tape 50 is formed in a spiral shape that is inclined from one circumferential end of the copper tape 50 to the other circumferential end, and is inclined along a Z-shape. That is, the copper tape 50 is so-called Z-wound, and is continuously spirally wound without gaps from one side X1 to the other side X2 in the extending direction X, with portions of the copper tape 50 overlapping. The copper tape 50 is wound around the outer periphery of the external semiconductive layer 40, with the copper tape 50 overlapping by a length that is at least one-fifth but less than one-half of its width, which is its length in the width direction. As shown in FIG. 2 , the copper tape 50 is arranged such that the copper tape 51 on one side X1 in the extending direction X overlaps the conductor 10 side (lower side) of the copper tape 52 on the other side X2 in the extending direction X at a copper tape overlapping portion 53 where the copper tape 50 partially overlaps. The copper tape 50 wound around the external semiconductive layer 40 is formed in a cylindrical shape, and allows current to flow to the ground side in the event of a short circuit.

[0017] Next, the pressure winding tape 60 will be described. The pressure winding tape 60 presses the copper tape 50 against the insulator 30 side, and in this example, presses the copper tape 50 against the outer semiconductive layer 40. The pressure winding tape 60 is formed in a strip shape from, for example, nonwoven fabric, and has a thickness equivalent to that of the copper tape 50, for example, not less than 0.1 mm and less than 0.15 mm. The pressure winding tape 60 is suitable for, for example, a conductor 10 having a size of 20 mm. 2The tape width of the pressure wrapping tape 60 is approximately 25 mm relative to the conductor 10, but is not limited to this. When the size of the conductor 10 is relatively large, the tape width of the pressure wrapping tape 60 may be increased accordingly, and when the size of the conductor 10 is relatively small, the tape width may be decreased accordingly. The pressure wrapping tape 60 is wound around the outer periphery of the copper tape 50. For example, the pressure wrapping tape 60 is wound around the outer periphery of the copper tape 50 in a spiral shape from the other side X2 to one side X1 of the extending direction X, with portions of the pressure wrapping tape 60 overlapping. When viewed from a direction intersecting the extending direction X, the pressure wrapping tape 60 is formed in a spiral shape that is inclined from the other end side of the pressure wrapping tape 60 in the circumferential direction toward one end side of the circumferential direction, and is formed in an S-shape. In other words, the pressure wrapping tape 60 is a so-called S-winding tape, and is continuously and spirally wound without gaps from the opposite direction to the winding direction of the copper tape 50, with the pressure wrapping tape 60 partially overlapping. The pressure wrapping tape 60 is formed so that its width, which is its length in the width direction, is equal to the width of the copper tape 50. The pressure wrapping tape 60 is wound around the outer periphery of the copper tape 50, with the overlapping length being approximately 1 / 10 to less than 1 / 5 of the width. As shown in FIG. 2 , in the pressure wrapping tape overlapping portion 63 where the pressure wrapping tape 60 partially overlaps, the pressure wrapping tape 61 on one side X1 in the extending direction X is overlapped on the opposite side (upper side) from the conductor 10 side of the pressure wrapping tape 62 on the other side X2 in the extending direction X. The pressure wrapping tape 60 wound around the copper tape 50 is formed into a cylindrical shape and presses the copper tape 50 against the outer semiconductive layer 40. 2, the pressure wrapping tape overlap portion 63 is illustrated as partially overlapping the copper tape overlap portion 53, but it does not have to overlap with the copper tape overlap portion 53. In other words, the relative positional relationship between the pressure wrapping tape overlap portion 63 and the copper tape overlap portion 53 is not particularly limited.

[0018] Next, the sheath 70 will be described. The sheath 70 protects the conductor 10 and the like, and is made of, for example, polyvinyl chloride or polyethylene. The sheath 70 is laminated on the pressure wrapping tape 60 and is formed so as to cover the outer periphery of the pressure wrapping tape 60. In other words, the sheath 70 has a cylindrical shape, extends along the extension direction X, is provided on the outer periphery of the pressure wrapping tape 60, and covers the pressure wrapping tape 60. The sheath 70 covers the pressure wrapping tape 60, thereby protecting the conductor 10, the inner semiconductive layer 20, the insulator 30, the outer semiconductive layer 40, the copper tape 50, and the pressure wrapping tape 60.

[0019] Next, a cable 100 according to a comparative example will be described. As shown in FIGS. 3 to 5, the cable 100 includes a conductor (not shown), an inner semiconductive layer (not shown), an insulator (not shown), an outer semiconductive layer 101, a copper tape 102, a pressure wrapping tape 103, and a sheath 104. In the cable 100, both the copper tape 102 and the pressure wrapping tape 103 are spirally wound from one side X1 to the other side X2 in the extension direction X. The copper tape 102 and the pressure wrapping tape 103 are overlapped in the same manner. That is, as shown in FIG. 4, the copper tape 102b on one side X1 in the extension direction X is overlapped on the conductor side (lower side) of the copper tape 102a on the other side X2 in the extension direction X. Similarly, the pressure wrapping tape 103 is arranged such that the pressure wrapping tape 103b on one side X1 in the extending direction X is overlapped on the conductor side (lower side) of the pressure wrapping tape 103a on the other side X2 in the extending direction X. In the cable 100 configured in this manner, as shown in Fig. 5, when the residual stress in the sheath 104 is released due to a temperature change in the ambient environment and the sheath 104 shrinks from both sides along the extending direction X of the sheath 104, i.e., when shrink-back occurs in which the sheath 104 shrinks in the directions of arrows M1 and M2, the copper tape 102 and the pressure wrapping tape 103 are pulled by the sheath 104 in response to the shrinkage from the other side X2 (arrow direction M2) of the sheath 104, damaging the copper tape 102. In the cable 100, when the sheath 104 shrinks from the one side X1 (arrow direction M1), the copper tape 102 is blocked at position P3, as shown in Fig. 5, thereby preventing the movement of the copper tape 102.

[0020] 6 , in the cable 1 according to the embodiment, in contrast to the cable 100 according to the comparative example, when the residual stress in the sheath 70 is released due to a temperature change in the surrounding environment and the sheath 70 shrinks from both sides along the extension direction X, i.e., when shrink-back occurs in which the sheath 70 shrinks in the directions of the arrows M1 and M2, the pressure wrapping tape 60 is jammed at position Q1 against the shrinkage from the other side X2 (arrow direction M2) of the sheath 70, and the pressure wrapping tape 60 can press the copper tape 50 against the outer semiconductive layer 40 at position Q2, thereby suppressing movement of the copper tape 50. In this case, in the cable 1, the pressure wrapping tape 60 presses the copper tape 50, stopping the movement of the copper tape 50 toward one side X1 in the extension direction X, and the stopping of the movement of the copper tape 50 also stops the shrinkage of the sheath 70. Furthermore, in the cable 1, when the sheath 70 shrinks from one side X1 (arrow direction M1), the copper tape 50 is jammed at position Q5, thereby restricting movement of the copper tape 50. At this time, the clogging of the copper tape 50 stops the movement of the copper tape 50 toward the other side X2 in the extension direction X, and the stopping of the movement of the copper tape 50 also stops the shrinkage of the sheath 70. In this way, even if the sheath 70 shrinks from both sides along the extension direction X, the cable 1 can restrict the movement of the copper tape 50, thereby preventing damage to the copper tape 50.

[0021] Next, a method for manufacturing the cable 1 will be described. FIG. 7 is a flowchart showing a method for manufacturing the cable 1 according to the embodiment. As shown in FIG. 7, the method for manufacturing the cable 1 includes an insulating step (step S1), a copper tape winding step (step S2), a pressure winding tape winding step (step S3), and a covering step (step S4). Each step is performed by a cable manufacturing apparatus (not shown). In the insulating step, the cable manufacturing apparatus insulates the conductor 10 by covering the outer periphery of the conductor 10 with an insulator 30 (step S1). In this example, in the insulating step, the cable manufacturing apparatus layers an inner semiconductive layer 20 on the outer periphery of the conductor 10, layers an insulator 30 on the outer periphery of the inner semiconductive layer 20, and layers an outer semiconductive layer 40 on the outer periphery of the insulator 30. In detail, the cable manufacturing apparatus sequentially extrudes the inner semiconductive layer 20, the insulator 30, and the outer semiconductive layer 40 onto the conductor 10 by extrusion molding, thereby sequentially stacking the inner semiconductive layer 20, the insulator 30, and the outer semiconductive layer 40 on the conductor 10. Next, in a copper tape winding process, the cable manufacturing apparatus spirally winds the copper tape 50 around the outer periphery of the insulator 30 that insulated the conductor 10 in the insulating process (step S2). The cable manufacturing apparatus, for example, spirally winds the copper tape 50 around the outer periphery of the outer semiconductive layer 40 that was laminated on the insulator 30 in the insulating process, from one side X1 to the other side X2 in the extending direction X, so that a portion of the copper tape 50 overlaps. Next, in a pressure winding tape winding process, the cable manufacturing apparatus spirally winds the pressure winding tape 60 around the outer periphery of the copper tape 50 wound in the copper tape winding process (step S3). For example, the cable manufacturing apparatus spirally winds the pressure winding tape 60 around the outer periphery of the copper tape 50, from the other side X2 to one side X1 in the extending direction X, so that a portion of the pressure winding tape 60 overlaps. Next, in a covering step, the cable manufacturing apparatus covers the pressure wrapping tape 60 wound in the pressure wrapping tape 60 winding step with the sheath 70 by extrusion molding (step S4). As a result, the manufacturing method for the cable 1 can manufacture a cable 1 that can suppress movement of the copper tape 50 and prevent damage to the copper tape 50 even if the sheath 70 shrinks from both sides along the extension direction X.

[0022] As described above, the cable 1 according to the embodiment includes a conductor 10, an insulator 30, a copper tape 50, a pressure winding tape 60, and a sheath 70. The conductor 10 is conductive and extends along the extension direction X. The insulator 30 is insulating and covers the outer periphery of the conductor 10. The copper tape 50 is formed in a strip shape and is wound spirally around the outer periphery of the insulator 30 with a partial overlap, allowing current to flow to the ground side in the event of a short circuit. The pressure winding tape 60 is formed in a strip shape and is wound spirally around the outer periphery of the copper tape 50 with a partial overlap, pressing the copper tape 50 against the insulator 30. The sheath 70 covers the pressure winding tape 60. At the copper tape overlap portion 53 where a portion of the copper tape 50 overlaps, the copper tape 51 on one side X1 in the extension direction X overlaps the conductor 10 side of the copper tape 52 on the other side X2 in the extension direction X. In the pressure winding tape 60, at the pressure winding tape overlapping portion 63 where the pressure winding tape 61 on one side X1 of the extending direction X is overlapped on the opposite side of the conductor 10 side of the pressure winding tape 62 on the other side X2 of the extending direction X.

[0023] With this configuration, the cable 1 has a different overlapping manner of the copper tape 50 at the copper tape overlap portion 53 and the pressure winding tape 60 at the pressure winding tape overlap portion 63. Therefore, when the sheath 70 shrinks from both sides, the pressure winding tape 60 clogs the sheath 70 from the other side X2, thereby pressing down the copper tape 50 and suppressing movement of the copper tape 50. Furthermore, when the sheath 70 shrinks from one side X1, the copper tape 50 clogs the sheath 70, thereby suppressing movement of the copper tape 50. As a result, when the sheath 70 shrinks from both sides, the cable 1 suppresses movement of the copper tape 50 even if the copper tape 50 is pulled by the sheath 70. Therefore, the copper tape 50 is not damaged, and the cable 1 can maintain its grounding performance even when a ground fault occurs.

[0024] The cable 1 further comprises an inner semiconductive layer 20 provided between the conductor 10 and the insulator 30 to uniformize the electric field between the conductor 10 and the insulator 30, and an outer semiconductive layer 40 provided between the insulator 30 and the copper tape 50 to uniformize the electric field between the insulator 30 and the copper tape 50. With this configuration, the cable 1 can be configured as a CV cable (cross-linked polyethylene insulated vinyl sheath cable).

[0025] The manufacturing method of the cable 1 includes an insulating step (step S1), a copper tape winding step (step S2), a pressure winding tape winding step (step S3), and a covering step (step S4). In the insulating step, the outer periphery of the conductive conductor 10 is insulated by covering it with an insulator 30. In the copper tape winding step, a strip-shaped copper tape 50 for passing current to the ground side in the event of a short circuit is spirally wound around the outer periphery of the insulator 30, which has insulated the conductor 10 in the insulating step, from one side X1 to the other side X2 in the extension direction X in which the conductor 10 extends, so as to overlap in part. In the pressure winding tape winding step, a strip-shaped pressure winding tape 60 for pressing the copper tape 50 toward the insulator 30 is spirally wound around the outer periphery of the copper tape 50 wound in the copper tape winding step, from the other side X2 to one side X1 in the extension direction X, so as to overlap in part. In the covering step, the pressure wrapping tape 60 wound in the pressure wrapping tape 60 winding step is covered with the sheath 70. With this configuration, the manufacturing method of the cable 1 has the same effect as the cable 1 described above.

[0026] In the method for manufacturing cable 1, in the insulating step, for example, an inner semiconductive layer 20 is laminated on the outer periphery of conductor 10, an insulator 30 is laminated on the outer periphery of the inner semiconductive layer 20, and an outer semiconductive layer 40 is laminated on the outer periphery of the insulator 30. In addition, in the copper tape winding step, copper tape 50 is wound spirally around the outer periphery of the outer semiconductive layer 40 laminated in the insulating step from one side X1 to the other side X2 in the extension direction X so that part of the copper tape 50 overlaps. With this configuration, the method for manufacturing cable 1 can produce a CV cable (crosslinked polyethylene insulated vinyl sheath cable).

[0027] In the above description, an example has been described in which the cable 1 has an inner semiconductive layer 20 and an outer semiconductive layer 40, but this is not limited to this, and the cable 1 does not necessarily have to have the inner semiconductive layer 20 and the outer semiconductive layer 40.

[0028] The manufacturing method of cable 1 has been described as an example in which the inner semiconductive layer 20 and the outer semiconductive layer 40 are laminated in the insulation process, but this is not limited to this, and the inner semiconductive layer 20 and the outer semiconductive layer 40 do not have to be laminated.

[0029] Although the example in which the copper tape 50 is used as the metal tape has been described, the present invention is not limited to this, and may be, for example, a metal tape such as an aluminum tape made of aluminum.

[0030] Although an example has been described in which the copper tape 50 is wound in a so-called Z-winding and the pressure winding tape 60 is wound in a so-called S-winding, this is not limited to this, and the copper tape 50 and the pressure winding tape 60 may each be wound in any manner (Z-winding, S-winding).

[0031] The copper tape 50 may have a conductive adhesive formed on one side (rear side) thereof, and may be adhered to the outer semiconductive layer 40 by the conductive adhesive.

[0032] Although the conductor 10 has been described as being formed by bundling a plurality of wires, the present invention is not limited to this and may be, for example, a single wire. [Explanation of symbols]

[0033] 1 cable 10 Conductors 20 Internal semiconducting layer 30 Insulator 40 outer semiconductive layer 50 Copper tape (metal tape) 53 Copper tape overlapping part (metal tape overlapping part) 60 Presser tape 63 Presser tape overlap 70 Sheath X extension direction X1 One side of the extension direction X2: The other side of the extension direction

Claims

1. a conductor that is conductive, electrically connects the devices, and extends along the extension direction; an insulator having insulating properties and covering the outer periphery of the conductor; a metal tape formed in a strip shape, partially overlapping and spirally wound around the outer periphery of the insulator, for passing current to the ground side in the event of a short circuit; a pressure winding tape formed in a band shape, partially overlapping and spirally wound around the outer periphery of the metal tape, and pressing the metal tape against the insulator; a sheath that covers the press-wrap tape, In the metal tape overlapping portion where the metal tapes are partially overlapped, the metal tape on one side in the extending direction is overlapped on the conductor side of the metal tape on the other side in the extending direction, In the overlapping portion of the pressure winding tape, the pressure winding tape on one side in the extending direction is overlapped on the side of the pressure winding tape on the other side in the extending direction opposite to the conductor side, The metal tape is held down by the pressure wrapping tape as the pressure wrapping tape packs against the shrinkage of the sheath from the other side in the extension direction, thereby restricting movement from the other side to one side in the extension direction, and the metal tape is also restricted by the shrinkage of the sheath from one side in the extension direction as the metal tape packs against the shrinkage of the sheath from one side in the extension direction.

2. an internal semiconductive layer provided between the conductor and the insulator to homogenize the electric field between the conductor and the insulator; 10. The cable of claim 1, further comprising an outer semiconducting layer disposed between the insulation and the metal tape to homogenize the electric field between the insulation and the metal tape.

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