Plug, plug manufacturing method, and component for semiconductor manufacturing equipment

Abstract

To provide a plug which can be manufactured at a high yield.SOLUTION: A plug 50 comprises: a plug body 58; a spiral gas flow passage 51; and a branch passage 56. The spiral gas flow passage 51 is provided inside the plug body 58 and extends from the bottom to the top of the plug body 58. The branch passage 56 is provided so as to be branched in the middle of the spiral gas flow passage 51 and opens on the outer circumferential face of the plug body 58. A mold which is used upon manufacturing the plug 50 is integrated with a spiral core corresponding to the spiral gas flow passage 51, and the spiral core is held to the inner circumferential face of the mold via a rod-shaped core corresponding to the branch passage 56. Therefore, the breakage of the core can be prevented to manufacture the plug 50 at a high yield.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a plug, a plug manufacturing method, and a member for a semiconductor manufacturing apparatus. [Background technology]

[0002] Conventionally, semiconductor manufacturing equipment components include electrostatic chucks with a wafer mounting portion on their upper surface. For example, Patent Document 1 discloses an electrostatic chuck including a ceramic plate for adsorbing and holding a wafer, a plug mounting hole formed in the ceramic plate, a plug mounted in the plug mounting hole, and a cooling plate bonded to the underside of the ceramic plate. The plug has a spiral gas flow path within its dense plug body. When processing a wafer mounted on the wafer mounting portion with plasma, high-frequency power is applied between the cooling plate and a flat electrode placed above the wafer to generate plasma above the wafer. At the same time, to improve thermal conduction between the wafer and the ceramic plate, helium, a thermally conductive gas, is supplied to the backside of the wafer through the spiral gas flow path of the plug. The plug manufacturing method described in Patent Document 1 includes a step of producing a molded body by injecting ceramic slurry into a resin mold integrated with a core corresponding to the spiral gas flow path and solidifying it. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7144603 Summary of the Invention [Problem to be solved by the invention]

[0004] However, because the core integrated into the mold is a single, long, spiral-shaped resin member, it is prone to breakage when supported only on the bottom surface of the mold, making it difficult to manufacture plugs with a high yield.

[0005] The present invention has been made to solve such problems, and a main object of the present invention is to provide a plug that can be manufactured with a high yield. [Means for solving the problem]

[0006] [1] The plug of the present invention is A plug used in a semiconductor manufacturing equipment member having a wafer placement portion, The plug body and a spiral gas flow path provided inside the plug body and extending from the lower surface to the upper surface of the plug body; The spiral gas flow path is branched off midway and opens onto the outer circumferential surface of the plug body, or the spiral gas flow path is provided separately from the plug body. Main unit a branch passage communicating with another spiral gas flow passage provided so as to extend from the lower surface to the upper surface of the spiral gas passage; It is equipped with the following.

[0007] This plug has a branch passage provided inside the plug body so as to branch off midway through the spiral gas flow passage. When the branch passage opens onto the outer peripheral surface of the plug body, a forming die used to produce the plug is provided with a spiral core corresponding to the spiral gas flow passage, and the spiral core is held on the inner peripheral surface of the forming die via a retaining core corresponding to the branch passage. This makes it possible to prevent damage to the spiral core, and to produce plugs with a high yield. Furthermore, when the branch passage communicates with another spiral gas flow passage provided separately from the spiral gas flow passage, the forming die used to produce the plug is provided with a spiral core corresponding to the spiral gas flow passage and another spiral core corresponding to the other spiral gas flow passage, and these cores are held together via a retaining core corresponding to the branch passage. This makes it possible to prevent damage to the cores, and to produce plugs with a high yield.

[0008] Although the present invention is sometimes described using terms such as up / down, left / right, front / back, etc., these terms merely refer to relative positional relationships. Therefore, if the orientation of the plug is changed, up / down may become left / right, or left / right may become up / down, and such cases are also within the technical scope of the present invention.

[0009] [2] In the above-described plug (the plug described in [1] above), the branch channel may be provided so as to communicate with the other spiral gas channel and to open onto the outer circumferential surface of the plug body. This will significantly enhance the effect of preventing damage to the core.

[0010] [3] In the above-described plug (the plug described in [1] or [2] above), the branch passage may be provided so as to branch off at a plurality of locations along the spiral gas flow path. In this way, a spiral core provided in a molding die used in producing the plug is held to the inner circumferential surface of the molding die or to other spiral cores by a plurality of holding cores. This enhances the effect of preventing damage to the core.

[0011] [4] In the above-described plug (the plug described in [3] above), the plurality of branch passages may be provided at equal angular intervals along concentric circles of the plug body in a plan view. In this way, a spiral core provided in a molding die used to manufacture the plug is stably held by a plurality of holding cores provided at equal angular intervals along concentric circles of the plug body in a plan view.

[0012] [5] In the above-described plug (the plug described in any one of [1] to [4] above), the branch passage may be provided so as to communicate with the other helical gas flow passage, and the helical gas flow passage may be provided so as to surround the other helical gas flow passage. In this way, the area of ​​the plug body surrounded by the helical gas flow passage can be effectively utilized to provide the other helical gas flow passage.

[0013] [6] In the plug described above (the plug described in any one of [1] to [4] above), the branch passage may be provided so as to communicate with the other helical gas flow passage, and the other helical gas flow passage may be provided in parallel to the helical gas flow passage. This allows for relatively free design of the helical diameter of the helical gas flow passage and the helical diameter of the other helical gas flow passage.

[0014] [7] A method for producing a plug of the present invention is a method for producing the above-mentioned plug (the plug described in any one of the above [1] to [6]), (a) preparing a molding die from an organic material, the molding die having a molding space of the same shape as the green body that is a precursor of the plug, and in which a core corresponding to the spiral gas flow path and the branch passage, or a core corresponding to the spiral gas flow path, the other spiral gas flow path, and the branch passage, is integrated; (b) injecting a ceramic slurry into the molding cavity of the mold and solidifying it to produce the green body in the mold; (c) removing the molding die from the integrated body formed by integrating the molding die and the molded body to obtain the molded body; (d) firing the compact to obtain the plug; It includes:

[0015] According to this method for manufacturing a plug, the above-mentioned plug (the plug described in any one of the above [1] to [6]) can be manufactured with a good yield.

[0016] In step (a), the mold is produced using a 3D printer. The model material may be a material that is insoluble in the prescribed cleaning fluid and the components contained in the ceramic slurry after hardening, and the support material may be a material that is soluble in the prescribed cleaning fluid after hardening. In this specification, "insoluble" includes not only completely insoluble materials but also materials that are soluble enough to maintain the desired shape. This allows for relatively easy production of a mold with an integrated core, and eliminates the risk of the mold being dissolved by components contained in the ceramic slurry to the extent that it is unable to maintain its shape.

[0017] In step (b), a ceramic slurry containing a ceramic powder and a gelling agent may be used, and the ceramic slurry may be poured into a mold and then gelled by a chemical reaction of the gelling agent to produce a green body in the mold. In this way, the ceramic slurry fills the molding cavity of the mold integrated with the core without any gaps, so that the green body precisely matches the shape of the molding cavity.

[0018] The method for eliminating the mold in step (c) is not particularly limited, and for example, the mold may be eliminated by melting and removing it, or by chemical decomposition (including, for example, thermal decomposition).

[0019] [8] The semiconductor manufacturing equipment member of the present invention is a ceramic plate having a wafer placement portion on its upper surface; the plug (the plug according to any one of [1] to [6] above) installed in a plug installation hole that passes through the ceramic plate in the vertical direction; It is equipped with the following.

[0020] According to this semiconductor manufacturing equipment member, gas can be supplied to the underside of the wafer placed on the wafer placement portion by utilizing the spiral gas flow path of the plug. [Brief explanation of the drawings]

[0021] [Figure 1] FIG. 2 is a longitudinal cross-sectional view of a semiconductor manufacturing equipment member 10. [Figure 2] FIG. [Figure 3] FIG. [Figure 4] FIG. [Figure 5] FIG. [Figure 6] FIG. [Figure 7] FIG. [Figure 8] FIG. [Figure 9] FIG. 10 is a reference perspective view of a molded body 180. [Figure 10] FIG. [Figure 11] FIG. [Figure 12] FIG. [Figure 13] FIG. [Figure 14] FIG. [Figure 15] FIG. 10 is a reference perspective view of a molded body 380. [Figure 16] FIG. [Figure 17] FIG. [Figure 18] FIG. 4 is a perspective view of a mold 470. DETAILED DESCRIPTION OF THE INVENTION

[0022] [First embodiment] A preferred embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a longitudinal sectional view of a semiconductor manufacturing equipment member 10, Fig. 2 is a plan view of a ceramic plate 20, Fig. 3 is a perspective view of a plug 50, and Fig. 4 is a plan view of the plug 50.

[0023] The semiconductor manufacturing equipment member 10 includes a ceramic plate 20, a cooling plate 30, a bonding layer 40, a plug 50, and an insulating tube 60.

[0024] The ceramic plate 20 is a circular plate (e.g., 300 mm in diameter and 5 mm in thickness) made of ceramic such as sintered alumina or sintered aluminum nitride. The ceramic plate 20 incorporates an electrode 22. As shown in FIG. 2, a seal band 21a is formed along the outer edge of the wafer placement portion 21 of the ceramic plate 20, and a plurality of small circular protrusions 21b are formed on the entire surface. The seal band 21a and the small circular protrusions 21b have the same height, e.g., several μm to several tens of μm. The electrode 22 is a flat mesh electrode used as an electrostatic electrode, to which a DC voltage can be applied. When a DC voltage is applied to the electrode 22, the wafer W is attracted and fixed to the wafer placement portion 21 (specifically, the upper surfaces of the seal band 21a and the small circular protrusions 21b) by electrostatic attraction. When the DC voltage is released, the wafer W is released from the attraction and fixation to the wafer placement portion 21. The portion of the wafer placement portion 21 where the seal band 21a and the small circular protrusions 21b are not provided is referred to as a reference surface 21c.

[0025] The plug installation holes 24 are cylindrical through-holes that penetrate the ceramic plate 20 in the vertical direction. The plug installation holes 24 are provided at multiple locations on the ceramic plate 20 (for example, at multiple locations equally spaced along the circumferential direction as shown in FIG. 2). Plugs 50, which will be described later, are installed in the plug installation holes 24.

[0026] The cooling plate 30 is bonded to the underside of the ceramic plate 20. The cooling plate 30 is a circular plate with good thermal conductivity (a circular plate with the same diameter as or larger than the ceramic plate 20). The cooling plate 30 has a refrigerant flow path 32 through which a refrigerant circulates and a gas hole 34 through which gas is supplied to the plug 50. The refrigerant is preferably a liquid and is preferably electrically insulating. Examples of electrically insulating liquids include fluorine-based inert liquids. The refrigerant flow path 32 is formed in a single stroke from the inlet to the outlet across the entire surface of the cooling plate 30 in a plan view. The gas hole 34 is a cylindrical hole and is located opposite the plug installation hole 24. Examples of materials for the cooling plate 30 include metal materials and composite materials of metal and ceramic. Examples of metal materials include Al, Ti, Mo, and alloys thereof. Examples of composite materials of metal and ceramic include metal matrix composites (MMCs) and ceramic matrix composites (CMCs). Specific examples of such composite materials include materials containing Si, SiC, and Ti, materials in which porous SiC is impregnated with Al and / or Si, and composite materials of Al2O3 and TiC. Materials containing Si, SiC, and Ti are called SiSiCTi, materials in which porous SiC is impregnated with Al are called AlSiC, and materials in which porous SiC is impregnated with Si are called SiSiC. It is preferable to select a material for the cooling plate 30 that has a thermal expansion coefficient close to that of the material for the ceramic plate 20. The cooling plate 30 also serves as an RF electrode. Specifically, an upper electrode (not shown) is disposed above the wafer placement portion 21, and plasma is generated when high-frequency power is applied between the parallel plate electrodes consisting of the upper electrode and the cooling plate 30.

[0027] The bonding layer 40 bonds the lower surface of the ceramic plate 20 to the upper surface of the cooling plate 30. The bonding layer 40 may be, for example, a layer formed of solder or a metal brazing material. The bonding layer 40 is formed, for example, by TCB (thermal compression bonding). TCB is a known method in which a metal bonding material is sandwiched between two components to be bonded, and the two components are pressure-bonded while heated to a temperature below the solidus temperature of the metal bonding material. The bonding layer 40 may be an organic bonding layer (resin bonding layer). The organic resin layer is formed, for example, by curing an organic adhesive. The bonding layer 40 has a round hole 42 that penetrates the bonding layer 40 in the vertical direction at a position opposite the gas hole 34.

[0028] The plug 50 is a cylindrical member and is installed in the plug installation hole 24. The outer circumferential surface of the plug 50 is bonded to the inner circumferential surface of the plug installation hole 24 via an adhesive layer 26. The adhesive layer 26 may be an organic adhesive layer (resin adhesive layer) or an inorganic adhesive layer. As shown in FIGS. 3 and 4 , the plug 50 includes a cylindrical plug body 58 made of dense ceramic, a spiral gas flow path 51 provided inside the plug body 58, and a branch path 56 provided so as to branch off from the spiral gas flow path 51. The plug body 58 may be made of the same ceramic material as the ceramic plate 20, for example. The spiral gas flow path 51 is a flow path that allows gas to flow and is provided from the lower surface to the upper surface of the plug body 58. A portion of the spiral gas flow path 51 that opens to the lower surface of the plug body 58 is referred to as a lower opening 51a, and a portion that opens to the upper surface of the plug body 58 is referred to as an upper opening 51b. The branch passages 56 are provided so as to branch off at multiple locations along the spiral gas flow passage 51, and have openings 56a on the outer peripheral surface of the plug body 58. The branch passages 56 are provided horizontally in the left-right direction. When the plug 50 is viewed from above, the multiple branch passages 56 are provided at equal angular intervals (180° intervals in FIG. 4 ) along concentric circles of the plug body 58.

[0029] The maximum vertical length Hmax of the spiral gas flow channel 51 and the branch channel 56 is preferably 0.5 mm or less. This effectively prevents arc discharge within the spiral gas flow channel 51 and the branch channel 56. When the thermal conduction gas is helium, arc discharge is believed to occur when helium supplied to the plug 50 from the gas hole 34 is ionized during plasma generation, resulting in electrons accelerating and colliding with other helium. If the maximum vertical length Hmax of the spiral gas flow channel 51 and the branch channel 56 is 0.5 mm or less, electrons collide with other helium without being sufficiently accelerated (i.e., with insufficient energy), preventing arc discharge. To further enhance the arc discharge prevention effect, the maximum length Hmax is preferably 0.3 mm or less. The diameter of the spiral gas flow channel 51 and the branch channel 56 is preferably 0.5 mm or less, and more preferably 0.3 mm or less.

[0030] The insulating tube 60 is a tube made of dense ceramic and circular in plan view. The outer circumferential surface of the insulating tube 60 is bonded to the inner circumferential surfaces of the circular holes 42 in the bonding layer 40 and the inner circumferential surfaces of the gas holes 34 in the cooling plate 30 via an adhesive layer (not shown). The adhesive layer may be an organic adhesive layer (resin adhesive layer) or an inorganic adhesive layer. An adhesive layer may also be provided between the upper surface of the insulating tube 60 and the lower surface of the ceramic plate 20. The interior of the insulating tube 60 is in communication with the plug 50. Therefore, when gas is introduced into the insulating tube 60, the gas passes through the plug 50 and is supplied to the backside of the wafer W.

[0031] Next, an example of how the semiconductor manufacturing equipment component 10 configured as described above is described. First, with the semiconductor manufacturing equipment component 10 installed in a chamber (not shown), a wafer W is placed on the wafer placement portion 21. The chamber is then depressurized using a vacuum pump to a predetermined vacuum level, and a DC voltage is applied to the electrode 22 of the ceramic plate 20 to generate an electrostatic adsorption force, thereby adsorbing and fixing the wafer W to the wafer placement portion 21 (specifically, the upper surface of the seal band 21a or the upper surface of the small circular protrusions 21b). Next, a reactive gas atmosphere at a predetermined pressure (e.g., several tens to several hundreds of Pa) is created in the chamber. In this state, a high-frequency voltage is applied between an upper electrode (not shown) installed in the ceiling of the chamber and the cooling plate 30 of the semiconductor manufacturing equipment component 10 to generate plasma. The surface of the wafer W is treated with the generated plasma. A coolant circulates through the coolant flow path 32 of the cooling plate 30. A backside gas is introduced through the gas hole 34 from a gas cylinder (not shown). A thermally conductive gas (e.g., helium) is used as the backside gas. The backside gas is supplied and sealed in the space between the back surface of the wafer W and the reference surface 21c of the wafer mounting portion 21 through the insulating tube 60 and the plug 50. The presence of this backside gas allows efficient heat conduction between the wafer W and the ceramic plate 20.

[0032] Next, a manufacturing example of the plug 50 will be described. The plug 50 is manufactured by performing the following steps (a) to (d) in this order. FIG. 5 is a perspective view of a compact 80. The compact 80 shown in FIG. 5 becomes the plug 50 after sintering, and the dimensions of the compact 80 are determined based on the dimensions of the plug 50, taking into account that the compact 80 will be densified during sintering. The compact 80 has hollow portions 81 and 86 inside a compact body 88, which will become the spiral gas flow path 51 and the branch path 56 after sintering. The hollow portion 81 opens to the top and bottom surfaces of the compact body 88. The hollow portion 86 opens to the outer circumferential surface of the compact body 88.

[0033] ·Process (a) In step (a), a molding die 70 is prepared. FIG. 6 is a perspective view of the molding die 70. As shown in FIG. 6, the molding die 70 comprises a cylindrical molding die body 78 with a bottom, and cores 71 and 76 that correspond to the hollow portions 81 and 86 of the molded body 80. The core 71 is a spiral-shaped member that corresponds to the hollow portion 81 (the portion that will eventually become the spiral gas flow path 51). The core 76 is a rod-shaped member that corresponds to the hollow portion 86 (the portion that will eventually become the branch path 56). The molding die 70 has a molding space 77 that has the same shape as the molded body 80. The molding space 77 is the space remaining inside the cylindrical space of the molding die body 78, excluding the spiral-shaped core 71 and the rod-shaped core 76. The lower end of spiral core 71 is integrated with the bottom surface of mold body 78, and the upper end of core 71 is fixed via holder 79 to bridge portion 78a that is provided to bridge the upper part of mold body 78. Rod-shaped core 76 extends horizontally (radially outward) from the middle of core 71 and is integrated with the inner peripheral surface of mold body 78.

[0034] The mold 70 is fabricated using a well-known 3D printer. The 3D printer creates a structure by repeating a series of operations: ejecting a pre-hardening fluid from a head toward a stage to form a pre-hardening layered material, and then hardening the pre-hardening layered material. The 3D printer includes two pre-hardening fluids: a model material, which is the material that will ultimately form the required portion of the mold 70, and a support material, which is the material that will ultimately form the portion of the mold 70 that will support the model material and be removed. Here, the model material is a material (e.g., wax such as paraffin wax) that is insoluble in a predetermined cleaning liquid (e.g., water, organic solvent, acid, alkaline solution) and components contained in the ceramic slurry described below after hardening, while the support material is a material (e.g., hydroxylated wax) that is soluble in a predetermined cleaning liquid after hardening. An example of the predetermined cleaning liquid is isopropyl alcohol. The 3D printer creates a structure using slice data obtained by slicing the mold 70 horizontally at predetermined intervals from bottom to top. The slice data is created by processing CAD data. Some slice data contains a mixture of model material and support material, while other slice data contains only model material. The structure created by the 3D printer is immersed in isopropyl alcohol to dissolve and remove the hardened support material, resulting in an object consisting only of the hardened model material, i.e., mold 70.

[0035] ·Process (b) In step (b), a green body 80 is produced in the forming die 70. Here, the green body 80 is produced by mold casting. In mold casting, a ceramic slurry containing ceramic powder, a solvent, a dispersant, and a gelling agent is poured into the forming space 77 of the forming die 70, and the gelling agent is chemically reacted to gel the ceramic slurry, thereby producing the green body 80 in the forming die 70. The mold casting can be performed in accordance with the content described in Patent Document 1.

[0036] ·Process (c) In step (c), molding die 70 is removed from the integrated body formed by integrating molding die 70 and molded body 80, thereby obtaining molded body 80. If a material having a melting point below the drying temperature of molded body 80 (the upper limit temperature if the melting point is expressed as a temperature range) is used as the material for molding die 70, molding die 70 can be melted and removed at the drying temperature when drying molded body 80. For example, if wax that melts at 70°C is used as the material for molding die 70, molding die 70 can be melted and removed when drying molded body 80 at 80°C, thereby obtaining molded body 80.

[0037] ·Process (d) In step (d), the compact 80 is degreased and then fired to produce the plug 50. The degreasing temperature and firing temperature (maximum temperature) may be set appropriately taking into consideration the temperature at which the ceramic powder contained in the compact 80 is sintered. The degreasing atmosphere and firing atmosphere may be appropriately selected from air, inert gas, vacuum, hydrogen, etc.

[0038] The plug 50 described above in detail has a branch passage 56 provided inside the plug body 58 so as to branch off midway along the spiral gas flow passage 51. The branch passage 56 opens to the outer peripheral surface of the plug body 58. A forming die 70 used in producing the plug 50 is integrated with a spiral core 71 corresponding to the spiral gas flow passage 51, and the spiral core 71 is held on the inner peripheral surface of the forming die body 78 via a rod-shaped core 76 corresponding to the branch passage 56. Therefore, damage to the spiral core 71 can be prevented, and the plug 50 can be produced with a good yield.

[0039] Furthermore, the branch passages 56 of the plug 50 are provided so as to branch off at multiple locations along the spiral gas flow path 51. As a result, the spiral core 71 provided in the molding die 70 used to manufacture the plug 50 is held on the inner circumferential surface of the molding die 70 by the multiple rod-shaped cores 76. This enhances the effect of preventing damage to the spiral core 71.

[0040] Furthermore, the multiple branch paths 56 are provided at equal angular intervals along concentric circles of the plug body 58 in plan view. As a result, a spiral core 71 provided in a molding die 70 used to manufacture the plug 50 is stably held by multiple rod-shaped cores 76 provided at equal angular intervals in plan view.

[0041] [Second embodiment] The second embodiment uses a plug 150 instead of the plug 50 in the first embodiment. Therefore, the following will describe the plug 150. Fig. 7 is a reference perspective view of the plug 150 (first and second spiral gas flow paths 151, 152 and branch path 156 should actually be shown with hidden lines (dotted lines), but for convenience, they are shown with solid lines in this perspective view), and Fig. 8 is a plan view of the plug 150.

[0042] The plug 150 is a cylindrical member. The plug 150 includes a cylindrical plug body 158 made of dense ceramic, first and second spiral gas channels 151 and 152 provided inside the plug body 158, and a branch channel 156 provided so as to branch off from the first spiral gas channel 151. The plug body 158 may be formed of, for example, the same ceramic material as the ceramic plate 20. The first spiral gas channel 151 is a channel that allows gas to flow and is provided from a lower opening 151a provided on the lower surface of the plug body 158 to an upper opening 151b provided on the upper surface. The second spiral gas channel 152 is a channel that allows gas to flow and is provided separately from the first spiral gas channel 151, from a lower opening 152a provided on the lower surface of the plug body 158 to an upper opening 152b provided on the upper surface. The first spiral gas flow passage 151 is provided to surround the second spiral gas flow passage 152. The first spiral gas flow passage 151 and the second spiral gas flow passage 152 have the same center, and the inner diameter of the first spiral gas flow passage 151 is larger than the outer diameter of the second spiral gas flow passage 152.

[0043] The branch passages 156 are provided so as to branch off at multiple locations along the first spiral gas passage 151 and communicate with the second spiral gas passage 152. The branch passages 156 are provided horizontally. The maximum vertical length Hmax of the first and second spiral gas passages 151, 152 and the branch passage 156 is preferably 0.5 mm or less. This sufficiently prevents arc discharge from occurring inside the first and second spiral gas passages 151, 152 and the branch passage 156. The diameters of the first and second spiral gas passages 151, 152 and the branch passage 156 are preferably 0.5 mm or less. When the plug 150 is viewed from above, the multiple branch passages 156 are provided at equal angular intervals (180° intervals in FIG. 8 ) along concentric circles of the plug body 158.

[0044] Next, a manufacturing example of the plug 150 will be described. The plug 150 is manufactured by performing the following steps (a) to (d) in this order. FIG. 9 is a reference perspective view of a compact 180 (the hollow portions 181, 182, and 186 should be shown with hidden lines (dotted lines), but for convenience, they are shown with solid lines). The compact 180 shown in FIG. 9 will become the plug 150 after firing, and the dimensions of the compact 180 are determined based on the dimensions of the plug 150, taking into account that the compact will be sintered during firing. The compact 180 has hollow portions 181, 182, and 186 inside a compact body 188, which will become the first and second spiral gas flow paths 151 and 152 and the branch path 156 after firing. The hollow portions 181 and 182 are open to the top and bottom surfaces of the compact body 188.

[0045] ·Process (a) In step (a), a molding die 170 is prepared. FIG. 10 is a perspective view of the molding die 170. As shown in FIG. 10, the molding die 170 includes a cylindrical molding die body 178 with a bottom, and cores 171, 172, and 176 corresponding to the hollow portions 181, 182, and 186 of the molded body 180. The core 171 is a spiral-shaped member corresponding to the hollow portion 181 (the portion that will eventually become the first spiral gas flow channel 151), and the core 172 is a spiral-shaped member corresponding to the hollow portion 182 (the portion that will eventually become the second spiral gas flow channel 152). The core 176 is a rod-shaped member corresponding to the hollow portion 186 (the portion that will eventually become the branch channel 156). The molding die 170 has a molding space 177 having the same shape as the molded body 180. Molding space 177 is the space inside mold body 178, excluding cores 171, 172, and 176. The lower ends of spiral cores 171 and 172 are integrated with the bottom surface of mold body 178, and the upper ends of cores 171 and 172 are fixed via holders 179 to bridge portion 178a that is provided to bridge the upper part of mold body 178. Rod-shaped core 176 extends horizontally (inward in the radial direction) from the middle of spiral core 171 and is connected to another spiral core 172. Such a molding mold 170 is produced using the well-known 3D printer described in the first embodiment.

[0046] ·Process (b)~(d) In step (b), the compact 180 is produced in the molding die 170. Here, the compact 180 is produced by mold casting. In step (c), the molding die 170 is removed from the integrated body formed by integrating the molding die 170 and the compact 180, thereby obtaining the compact 180. In step (d), the compact 180 is degreased and then fired to produce the plug 150. These steps (b) to (d) are performed in accordance with steps (b) to (d) of the first embodiment.

[0047] The plug 150 described above in detail has a branch passage 156 provided inside the plug body 158 so as to branch off midway from the first spiral gas passage 151. The branch passage 156 is connected to another second spiral gas passage 152 provided separately from the first spiral gas passage 151. A molding die 170 used to manufacture the plug 150 is provided with a spiral core 171 corresponding to the first spiral gas passage 151 and a spiral core 172 corresponding to the second spiral gas passage 152, and these cores 171, 172 are held together by a rod-shaped core 176 corresponding to the branch passage 156. This prevents damage to the spiral cores 171, 172, and enables the plug 150 to be manufactured with a high yield.

[0048] Furthermore, the branch passages 156 of the plug 150 are provided so as to branch off at multiple locations along the first spiral gas flow passage 151. As a result, the spiral core 171 provided in the molding die 170 used to manufacture the plug 150 is held together with other spiral cores 172 by multiple rod-shaped cores 176, which enhances the effect of preventing damage to the spiral cores 171, 172.

[0049] Furthermore, the multiple branch paths 156 are provided at equal angular intervals along concentric circles of the plug body 158 in plan view. As a result, the spiral core 171 provided in the molding die 170 is stably held by the multiple rod-shaped cores 176 provided at equal angular intervals in plan view.

[0050] Furthermore, the first spiral gas flow passage 151 is provided so as to surround the second spiral gas flow passage 152. Therefore, the area of ​​the plug body 158 surrounded by the first spiral gas flow passage 151 can be effectively utilized to provide the second spiral gas flow passage 152.

[0051] Furthermore, in the second embodiment, the number of spiral gas flow paths is greater than in the first embodiment, and therefore the flow rate of gas supplied to the lower surface of the wafer W can be increased.

[0052] [Third embodiment] The third embodiment uses a plug 250 instead of the plug 50 in the first embodiment. Therefore, the following will describe the plug 250. Fig. 11 is a reference perspective view of the plug 250 (the first and second spiral gas flow paths 151, 152 and the branch path 256 should actually be shown with hidden lines (dotted lines), but for convenience, they are shown with solid lines in this perspective view), and Fig. 12 is a plan view of the plug 250.

[0053] The plug 250 has the same structure as the plug 150, except that the branch passage 156 of the plug 150 is extended to open onto the outer peripheral surface of the plug body 158 to form the branch passage 256. Therefore, the same components of the plug 250 as those of the plug 150 are denoted by the same reference numerals, and their description will be omitted. When the plug 250 is viewed from above, the multiple branch passages 256 are provided at equal angular intervals (180° intervals in FIG. 12 ) along concentric circles of the plug body 158.

[0054] Next, a description will be given of a manufacturing example of the plug 250. The plug 250 is manufactured in accordance with steps (a) to (d) of the second embodiment. However, the molding die used to manufacture the plug 250 is a modified molding die 170 of the second embodiment, in which the rod-shaped core 176 extends radially outward to reach the inner circumferential wall of the molding die body 178.

[0055] The plug 250 described above in detail provides the same effects as the plug 150 of the second embodiment. In addition, the branch passage 256 opens to the outer peripheral surface of the plug body 158. Therefore, in a molding die used to manufacture the plug 250, the spiral core corresponding to the first spiral gas flow passage 151 and the spiral core corresponding to the second spiral gas flow passage 152 are not only held to each other via the rod-shaped core corresponding to the branch passage 256, but are also held to the inner peripheral surface of the molding die via the rod-shaped core. This significantly reduces the effect of preventing damage to the spiral cores.

[0056] [Fourth embodiment] The fourth embodiment uses a plug 350 instead of the plug 50 in the first embodiment. Therefore, the following will describe the plug 350. Fig. 13 is a reference perspective view of the plug 350 (first to fifth spiral gas flow channels 351 to 355 should actually be shown with hidden lines (dotted lines), but for convenience, they are shown with solid lines in this perspective view), and Fig. 14 is a plan view of the plug 350.

[0057] The plug 350 is a cylindrical member. The plug 350 includes a cylindrical plug body 358 made of dense ceramic, first to fifth spiral gas flow channels 351 to 355 provided inside the plug body 358, and branch channels 356a to 356d provided so as to branch off from the first spiral gas flow channel 351. The plug body 358 may be formed of, for example, the same ceramic material as the ceramic plate 20. The first to fifth spiral gas flow channels 351 to 355 are flow channels that allow gas to flow and are provided so as to extend from lower openings (not shown) provided on the lower surface of the plug body 358 to upper openings 351b to 355b provided on the upper surface, respectively. The first to fifth spiral gas flow channels 351 to 355 are arranged in parallel in the plug body 358. Specifically, the central axis of the first spiral gas flow passage 351 coincides with the central axis of the plug body 358, and the second to fifth spiral gas flow passages 352 to 354 are arranged to surround the first spiral gas flow passage 351.

[0058] The branch passages 356a are provided so as to branch off at multiple locations along the first spiral gas passage 351, communicate with the second spiral gas passage 352, and open to the outer circumferential surface of the plug body 358. The multiple branch passages 356a are aligned vertically. The branch passages 356b are provided so as to branch off at multiple locations along the first spiral gas passage 351, communicate with the third spiral gas passage 353, and open to the outer circumferential surface of the plug body 358. The multiple branch passages 356b are aligned vertically. The branch passages 356c are provided so as to branch off at multiple locations along the first spiral gas passage 351, communicate with the fourth spiral gas passage 354, and open to the outer circumferential surface of the plug body 358. The multiple branch passages 356c are aligned vertically. The branch passages 356d are provided so as to branch off at a plurality of points along the first spiral gas passage 351. 5 Spiral gas flow path 355 and opens onto the outer peripheral surface of the plug body 358. The branch passages 356d are aligned vertically. The maximum vertical length Hmax of the first to fifth spiral gas passages 351 to 355 and the branch passages 356a to 356d is preferably 0.5 mm or less. This sufficiently prevents arc discharge from occurring inside the first to fifth spiral gas passages 351 to 355 and the branch passages 356a to 356d. The diameter of the first to fifth spiral gas passages 351 to 355 and the branch passages 356a to 356d is preferably 0.5 mm or less. When the plug 350 is viewed from above, the branch passages 356a to 356d are radially arranged at equal angular intervals (90° intervals in FIG. 14 ) along concentric circles of the plug body 358. The branch passages 356a to 356d are also horizontally arranged.

[0059] The first spiral gas flow channel 351 corresponds to the spiral gas flow channel of the present invention, and the second to fifth spiral gas flow channels 352 to 355 correspond to the other spiral gas flow channels.

[0060] Next, a manufacturing example of the plug 350 will be described. The plug 350 is manufactured by performing the following steps (a) to (d) in this order. FIG. 15 is a reference perspective view of a compact 380 (the hollow portions 381 to 385 and 386a to 386d should be shown with hidden lines (dotted lines), but for convenience, they are shown with solid lines). The compact 380 shown in FIG. 15 will become the plug 350 after firing, and the dimensions of the compact 380 are determined based on the dimensions of the plug 350, taking into account that the compact 380 will be sintered during firing. The compact 380 has, inside a compact body 388, hollow portions 381 to 385 that will become the first to fifth spiral gas flow channels 351 to 355 after firing, and hollow portions 386a to 386d that will become branch channels 356a to 356d after firing. The hollow portions 381 to 385 are open to the upper and lower surfaces of the molded body main body 388 .

[0061] ·Process (a) In step (a), a molding die 370 is prepared. Fig. 16 is a perspective view of molding die 370. As shown in Fig. 16, molding die 370 includes a cylindrical molding die body 378 with a bottom, spiral cores 371-375 corresponding to hollow portions 381-385 of molded body 380, and rod-shaped cores 376a-376d corresponding to hollow portions 386a-386d. Molding die 370 has molding space 377 having the same shape as molded body 380. Molding space 377 is the space remaining inside the cylindrical space of molding die body 378, excluding cores 371-375 and 376a-376d. The lower ends of spiral cores 371-375 are integrated with the bottom surface of forming mold body 378, and the upper ends of cores 371-375 are fixed via holders to bridge portion 378a that is provided so as to span the upper part of forming mold body 378 in a cross shape. Such forming mold 370 is produced using the well-known 3D printer described in the first embodiment.

[0062] ·Process (b)~(d) In step (b), a compact 380 is produced in a molding die 370. Here, the compact 380 is produced by mold casting. In step (c), the molding die 370 is removed from the integrated body formed by integrating the compact 380 with the molding die 370, thereby obtaining the compact 380. In step (d), the compact 380 is degreased and then fired to produce the plug 350. These steps (b) to (d) are performed in accordance with steps (b) to (d) of the first embodiment.

[0063] The plug 350 described above has branch passages 356a to 356d branching off from the first spiral gas passage 351 inside the plug body 358. The branch passage 356a communicates with the second spiral gas passage 352 and opens onto the outer circumferential surface of the plug body 358. The branch passage 356b communicates with the third spiral gas passage 353 and opens onto the outer circumferential surface of the plug body 358. The branch passage 356c communicates with the fourth spiral gas passage 354 and opens onto the outer circumferential surface of the plug body 358. The branch passage 356d communicates with the fifth spiral gas passage 355 and opens onto the outer circumferential surface of the plug body 358. A molding die 370 used to manufacture the plug 350 is provided with spiral cores 371 to 375 corresponding to the first to fifth spiral gas passages 351 to 355, respectively. Cores 371 and 372 are held together via rod-shaped core 376a corresponding to branch passage 356a, and are further fixed to the inner circumferential surface of mold body 378 via core 376a. Cores 371 and 373 are held together via rod-shaped core 376b corresponding to branch passage 356b, and are further fixed to the inner circumferential surface of mold body 378 via core 376b. Cores 371 and 374 are held together via rod-shaped core 376c corresponding to branch passage 356c, and are further fixed to the inner circumferential surface of mold body 378 via core 376c. Cores 371 and 375 are held together via rod-shaped core 376d corresponding to branch passage 356d, and are further fixed to the inner circumferential surface of mold body 378 via core 376d. Therefore, the spiral core 371 ~ 375 The effect of preventing damage to the plug is remarkable, and the yield is high. 350 can be manufactured.

[0064] The branch paths 356a to 356d of the plug 350 are: So Each of these is provided so as to branch off at a plurality of locations along first spiral gas flow path 351. This enhances the effect of preventing damage to spiral cores 371-375 provided in molding die 370.

[0065] Furthermore, the multiple branch paths 356a-356d are provided at equal angular intervals in plan view along concentric circles of the plug body 358. As a result, the spiral core 371 provided in the forming die 370 is stably held by the multiple rod-shaped cores 376a-376d provided at equal angular intervals in plan view.

[0066] Furthermore, since the first to fifth spiral gas flow channels 351 to 355 are arranged side by side inside the plug body 358, the spiral diameters of the first to fifth spiral gas flow channels 351 to 355 can be designed relatively freely.

[0067] Furthermore, in the fourth embodiment, the number of spiral gas flow paths is greater than in the first to third embodiments, and therefore the flow rate of gas supplied to the lower surface of the wafer W can be increased.

[0068] [Fifth embodiment] The fifth embodiment uses a plug 450 instead of the plug 50 of the first embodiment. Therefore, the following will describe the plug 450. Fig. 17 is a reference perspective view of the plug 450 (the first to eighth spiral gas flow paths 451 to 458 and the branch path B should actually be shown with hidden lines (dotted lines), but for convenience, they are shown with solid lines in this perspective view), and Fig. 18 is a perspective view of a molding die 470.

[0069] The plug 450 is a cylindrical member. The plug 450 has a cylindrical plug body 459 made of dense ceramic, first to eighth spiral gas flow paths 451 to 458 provided inside the plug body 459, and a branch path B provided so as to branch off from the first to eighth spiral gas flow paths 451 to 458 midway. The plug body 459 may be made of, for example, the same ceramic material as the ceramic plate 20.

[0070] The first to eighth spiral gas flow channels 451 to 458 are flow channels that allow gas to flow, and are provided from a lower opening on the lower surface of the plug body 459 to an upper opening on the upper surface. The first, third, fifth, and seventh spiral gas flow channels 451, 453, 455, and 457 are flat, band-shaped flow channels with rectangular cross sections that are spirally formed so as to rotate clockwise from top to bottom. The first, third, fifth, and seventh spiral gas flow channels 451, 453, 455, and 457 are provided so as to be offset by 90° along the circumferential direction. The second, fourth, sixth, and eighth spiral gas flow channels 452, 454, 456, and 458 are flat, band-shaped flow channels with rectangular cross sections that are spirally formed so as to rotate counterclockwise from top to bottom. The second, fourth, sixth, and eighth spiral gas flow channels 452, 454, 456, and 458 are circumferentially offset by 90°. The second, fourth, sixth, and eighth spiral gas flow channels 452, 454, 456, and 458 are surrounded by the first, third, fifth, and seventh spiral gas flow channels 451, 453, 455, and 457. On the top surface of the plug body 459, the upper openings of the first, third, fifth, and seventh spiral gas flow channels 451, 453, 455, and 457 are located outside the upper openings of the second, fourth, sixth, and eighth spiral gas flow channels 452, 454, 456, and 458.

[0071] In the plug 450, the branch path B (indicated by a circle with a dashed line) is formed at a point where the side surfaces of two of the first to eighth spiral gas flow paths 451 to 458 are in contact with each other. Specifically, the branch path B includes a portion where the outer side surface of the first spiral gas flow path 451 communicates with the inner side surfaces of the second, fourth, sixth, and eighth spiral gas flow paths 452, 454, 456, and 458, a portion where the outer side surface of the third spiral gas flow path 453 communicates with the inner side surfaces of the second, fourth, sixth, and eighth spiral gas flow paths 452, 454, 456, and 458, and a portion where the outer side surface of the fifth spiral gas flow path 453 communicates with the inner side surfaces of the second, fourth, sixth, and eighth spiral gas flow paths 452, 454, 456, and 458. 455 the portion where the outer side of the seventh spiral gas flow channel 457 is connected to the inner side of the second, fourth, sixth, and eighth spiral gas flow channels 452, 454, 456, and 458; and the portion where the outer side of the seventh spiral gas flow channel 457 is connected to the inner side of the second, fourth, sixth, and eighth spiral gas flow channels 452, 454, 456, and 458.

[0072] The maximum vertical length Hmax of the first to eighth spiral gas flow paths 451 to 458 and the branch path B is preferably 0.5 mm or less, which makes it possible to sufficiently suppress the occurrence of arc discharge inside the first to eighth spiral gas flow paths 451 to 458 and the branch path B.

[0073] Such a plug 450 can be manufactured in accordance with the first to fourth embodiments. Specifically, a molding die 470 shown in FIG. 18 is prepared. The molding die 470 includes a cylindrical molding die body 478 with a bottom and a core 476. The core 476 is an assembly of spiral members having substantially the same shape as the first to eighth spiral gas flow paths 451 to 458. Two of these spiral members, one inside and one outside, adjacent to each other have a portion where their side surfaces meet (a portion that will eventually become branch path B). The lower end of the core 476 is fixed to the bottom surface of the molding die body 478, and the upper end is fixed to a bridge 478a that is provided to bridge the upper part of the molding die body 478. Such a molding die 470 is manufactured using the well-known 3D printer described in the first embodiment. This molding die 470 is used to prepare a green body (which will become the plug 450 after firing), and the obtained green body is degreased and then fired to prepare the plug 450.

[0074] The plug 450 described above in detail has a branch channel B provided inside the plug body 459 so as to branch off midway through the first to eighth spiral gas channels 451 to 458. One branch channel B connects two of the first to eighth spiral gas channels 451 to 458. A molding die 470 used to manufacture the plug 450 is provided with a core 476, which is an assembly of spiral members corresponding to the first to eighth spiral gas channels 451 to 458, and these spiral members are held together via portions corresponding to the branch channel B. This prevents damage to the core 476 and enables the plug 450 to be manufactured with a high yield.

[0075] Furthermore, branched passage B of plug 450 is provided so as to branch off at multiple locations along one spiral gas flow path, so that one spiral member constituting core 476 provided in molding die 470 used to manufacture plug 450 is held together with other spiral members at multiple locations, thereby enhancing the effect of preventing damage to core 476.

[0076] Furthermore, the multiple branch paths B may be provided at equal angular intervals along concentric circles of plug body 459 in plan view. In this way, the helical member constituting core 476 provided in molding die 470 is stably held by the multiple connection points provided at equal angular intervals in plan view.

[0077] Furthermore, the first, third, fifth, and seventh spiral gas flow channels 451, 453, 455, and 457 are provided to surround the second, fourth, sixth, and eighth spiral gas flow channels 452, 454, 456, and 458. Therefore, the area of ​​the plug body 459 surrounded by the first, third, fifth, and seventh spiral gas flow channels 451, 453, 455, and 457 can be effectively utilized to provide the second, fourth, sixth, and eighth spiral gas flow channels 452, 454, 456, and 458.

[0078] Furthermore, since the first to eighth spiral gas flow channels 451 to 458 have a rectangular cross section, it is easier to increase the flow channel area compared to spiral gas flow channels with a circular cross section.

[0079] Furthermore, because branch path B is a portion where the gas is in almost point contact, the flow rate of the gas flowing through branch path B is small. Therefore, gas particles are less likely to collide with each other, and the gas flows more smoothly.

[0080] Furthermore, the rotational direction (counterclockwise from top to bottom) of the second, fourth, sixth, and eighth spiral gas channels 452, 454, 456, and 458 located inside the plug 450 is opposite to the rotational direction (clockwise from top to bottom) of the first, third, fifth, and seventh spiral gas channels 451, 453, 455, and 457 located outside the plug 450. Therefore, the two spiral members with different rotational directions that form the core 476 of the molding die 470 firmly support each other at their contact points.

[0081] [Other embodiments] It goes without saying that the present invention is not limited to the above-described embodiment, and can be embodied in various forms as long as it falls within the technical scope of the present invention.

[0082] For example, in the first embodiment described above, the branch path 56 is provided linearly in the horizontal direction, but this is not particularly limited. For example, the branch path 56 may be provided linearly diagonally upward (or diagonally downward), or the branch path 56 may be provided so as to curve rather than be linear. This also applies to the second to fourth embodiments.

[0083] In the first embodiment described above, the branch passages 56 are provided so as to branch off at multiple locations along the spiral gas flow path 51, but this is not particularly limited. For example, in FIG. 4, the branch passages 56 are provided on both the left and right sides of the spiral gas flow path 51, but they may be provided on either the left or right side. Alternatively, the branch passage 56 may be provided at a single location along the spiral gas flow path 51. This also applies to the second and third embodiments. Furthermore, in the fourth embodiment, the branch passages 356a to 356d are provided at multiple locations in the vertical direction, but they may be provided at a single location in the vertical direction.

[0084] In the first embodiment described above, the branch paths 56 are provided at 180° intervals along the concentric circles of the plug body 58 in a plan view, but this is not particularly limited. For example, instead of 180°, the angles may be 120°, 90°, or 60°. Furthermore, the branch paths 56 may be provided at random intervals rather than at equal angular intervals. This also applies to the second and third embodiments.

[0085] In the first embodiment described above, the insulating pipe 60 is provided, but the insulating pipe 60 may be omitted. Also, instead of providing the gas holes 34 in the cooling plate 30, a gas channel structure may be provided. As the gas channel structure, the inside of the cooling plate 30 (the refrigerant flow path 32 Alternatively, a structure may be employed that includes a ring portion that is provided on the back surface of the cooling plate 30 (above the cooling plate 30) and is concentric with the cooling plate 30 in a plan view, an inlet portion that introduces gas from the back surface of the cooling plate 30 to the ring portion, and a distributor portion that distributes the gas from the ring portion to each plug 50. The number of inlet portions may be less than the number of distributor portions, and may be, for example, one. This also applies to the second to fourth embodiments.

[0086] In the first embodiment described above, an electrostatic electrode is exemplified as the electrode 22 built into the ceramic plate 20, but this is not particularly limited. For example, instead of or in addition to the electrode 22, a heater electrode (resistance heating element) or an RF electrode may be built into the ceramic plate 20. This also applies to the second to fourth embodiments.

[0087] In the fourth embodiment described above, the first to fifth spiral gas flow paths 351 to 355 are provided inside the plug body 358, but the present invention is not limited to this. For example, one to three of the second to fifth spiral gas flow paths 352 to 355 may be omitted from the plug body 358. In this case, the branch paths connected to the omitted spiral gas flow paths may be retained or omitted.

[0088] In the first to fourth embodiments described above, the cross section of the spiral gas flow path is circular, but is not limited to this. For example, the cross section of the spiral gas flow path may be elliptical or polygonal (for example, square or rectangular). In the fifth embodiment described above, the cross section of the spiral gas flow path is rectangular, but is not limited to this. For example, the cross section of the spiral gas flow path may be circular, elliptical, or another polygonal (for example, square).

[0089] In the fifth embodiment described above, the first spiral gas flow path is formed on the upper surface of the plug 450. 451 The upper opening and the second spiral gas flow path 452 However, the present invention is not limited to this. For example, the first spiral gas flow passage 451 The upper opening and the second spiral gas flow path 452 The upper opening of the third spiral gas flow passage may be spaced apart from the upper opening of the third spiral gas flow passage. 453 The upper opening and the fourth spiral gas flow path 454 The upper opening of the fifth spiral gas flow passage 455 Upper opening and sixth spiral gas flow path 456 The upper opening of the seventh spiral gas flow passage 457 Top opening and No. 8 spiral gas flow path 458 The same applies to the upper opening of the .

[0090] In the fifth embodiment described above, the first to eighth spiral gas flow paths 451 ~ 458 However, The number of spiral gas flow passages may be any number equal to or greater than two. [Explanation of symbols]

[0091] 10 semiconductor manufacturing equipment member, 20 ceramic plate, 21 wafer mounting portion, 21a seal band, 21b small circular protrusion, 21c reference surface, 22 electrode, 24 plug installation hole, 26 adhesive layer, 30 cooling plate, 32 refrigerant flow path, 34 gas hole, 40 bonding layer, 42 round hole, 50 plug, 51 spiral gas flow path, 51a lower opening, 51b upper opening, 56 branch path, 56a opening, 58 plug body, 60 insulating tube, 70 forming mold, 71 spiral core, 76 rod-shaped core, 77 forming space, 78 forming mold body, 78a bridge portion, 79 holder, 80 molded body, 81 hollow portion, 86 hollow portion, 88 molded body body, 150 plug, 151 first spiral gas flow path, 151a Lower opening, 151b Upper opening, 152 Second spiral gas flow path, 152a Lower opening, 152b Upper opening, 156 Branch passage, 158 Plug body, 170 Forming mold, 171, 172 Spiral core, 176 Rod-shaped core, 177 Forming space, 178 Forming mold body, 178a Bridge portion, 179 Holder, 180 Green body, 181, 182, 186 Hollow portion, 188 Green body body, 250 Plug, 256 Branch passage, 350 Plug, 351 to 355 First to fifth spiral gas flow paths, 351b to 355b Upper opening, 356a to 356d Branch passage, 358 Plug body, 370 Forming mold, 371 to 375 Spiral core, 376a to 376d Rod-shaped core, 377 molding space, 378 mold body, 378a bridge portion, 380 molded body, 381 to 385, 386a to 386d hollow portion, 388 molded body body, 450 plug, 451 to 458 first to eighth spiral gas flow paths, 459 plug body, 470 mold, 476 core, 478 mold body, 478a bridge portion, B branch path, W wafer.

Claims

1. A plug used in a semiconductor manufacturing equipment member having a wafer placement portion, The plug body and a spiral gas flow path provided inside the plug body and extending from the lower surface to the upper surface of the plug body; a branch passage that branches off from the spiral gas flow passage midway and opens onto the outer peripheral surface of the plug body, or that is in communication with another spiral gas flow passage that is provided separately from the spiral gas flow passage and extends from the lower surface to the upper surface of the plug body; Plug with.

2. the branch passage is provided so as to communicate with the other spiral gas flow passage and to open onto the outer peripheral surface of the plug body. The plug according to claim 1.

3. The branch passage is provided so as to branch off at a plurality of points along the spiral gas flow passage. The plug according to claim 1 or 2.

4. the plurality of branch paths are provided at equal angular intervals along concentric circles of the plug body when viewed in a plan view; The plug according to claim 3.

5. the branch passage is provided so as to communicate with the other spiral gas passage, the spiral gas flow path is provided to surround the other spiral gas flow path; The plug according to claim 1 or 2.

6. the branch passage is provided so as to communicate with the other spiral gas passage, The other spiral gas flow path is arranged in parallel to the spiral gas flow path. The plug according to claim 1 or 2.

7. A method for manufacturing the plug according to claim 1 or 2, comprising the steps of: (a) preparing a molding die from an organic material, the molding die having a molding space of the same shape as the green body that is a precursor of the plug, the molding die being integrated with a core corresponding to the spiral gas flow path and the branch passage, or a core corresponding to the spiral gas flow path, the other spiral gas flow path, and the branch passage; (b) injecting a ceramic slurry into the molding cavity of the mold and solidifying it to produce the green body in the mold; (c) removing the molding die from the integrated body formed by integrating the molding die and the molded body to obtain the molded body; (d) firing the compact to obtain the plug; A plug manufacturing method comprising:

8. a ceramic plate having a wafer placement portion on its upper surface; the plug according to claim 1 or 2, which is installed in a plug installation hole that passes through the ceramic plate in the vertical direction; A semiconductor manufacturing equipment component comprising:

Images