SUBSTRATE TRANSFER DEVICE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

Abstract

To provide a substrate transfer device capable of preventing damage to a substrate and a substrate processing apparatus including the same.SOLUTION: A substrate transfer device 2 includes an indexer robot IR that enters a carrier C capable of accommodating a plurality of substrates W and transfers a substrates W accommodated in the carrier C, an imaging unit 21 and an image processing unit 53 that acquire shape information of the substrates W accommodated in the carrier C, and a control unit CU that controls the indexer robot IR based on the shape information. This shape information is shape information as seen in a direction in which the indexer robot IR enters the carrier C, and includes at least shape information at a center position in a depth direction of the substrate W accommodated in the carrier C, which is obtained using near-infrared rays. This shape information is less susceptible to the influence of reflected light from the surface of the substrate W, the influence of multiple reflections between substrates W, and the influence of objects reflected behind the substrate W. Therefore, damage to the substrate can be prevented.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate transport device and a substrate processing apparatus including the same, for substrates such as semiconductor wafers, liquid crystal display substrates, organic electroluminescence (EL) substrates, FPD (Flat Panel Display) substrates, optical display substrates, magnetic disk substrates, optical disk substrates, magneto-optical disk substrates, photomask substrates, and solar cell substrates. [Background technology]

[0002] Conventionally, this type of device has a cassette for storing substrates, a substrate transport mechanism for removing the substrates from the cassette and loading them into a substrate processing apparatus, and an imaging means for imaging the substrates stored in the cassette, in which the substrates stored in the cassette are imaged and the shape of the substrate is determined based on the image of the substrate, and the substrate transport mechanism transports the substrate to a processing unit based on the determined shape of the substrate (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-69386 A (page 2, Figure 2) Summary of the Invention [Problem to be solved by the invention]

[0004] However, the conventional example having such a configuration has the following problems. In other words, in conventional devices, the captured image obtained by the imaging means capturing images of the substrates held in the cassette is affected by light reflected from the substrate surface and multiple reflections between the substrates, the color of the cassette reflected behind the substrate, and objects installed behind the cassette reflected in the transparent part of the cassette, making it difficult to obtain appropriate contrast at the boundary between the shape of the substrate and the background. Therefore, when the substrate transport device unloads the substrate from the cassette, the substrate transport device may interfere with the substrate and come into contact with the surface of the substrate, scratching or damaging the substrate.

[0005] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate transport device that can prevent damage to substrates, and a substrate processing apparatus including the same. [Means for solving the problem]

[0006] In order to achieve the above object, the present invention has the following configuration. That is, the substrate transport device according to the present invention is capable of accommodating a plurality of substrates stacked with gaps therebetween, and transports the substrates between a carrier having an inlet / outlet on one side thereof, and includes a holding hand that holds the substrate, a transport unit that transports the substrate by moving the holding hand back and forth from the inlet / outlet of the carrier to the gaps between the substrates, an acquisition unit that acquires shape information of the substrate when the substrate is accommodated in the carrier in the direction of advance / retraction of the holding hand and viewed from the side of the carrier's inlet / outlet, and a control unit that controls the transport unit based on the shape information, and is characterized in that the acquisition unit acquires the shape information of the substrate by irradiating light in a wavelength range longer than visible light from the direction of advance / retraction of the holding hand. The shape information includes a cross-sectional shape of the substrate at a predetermined position in the advancing / retracting direction of the holding hand, and a virtual shape of either an upper edge portion or a lower edge portion of the substrate accommodated in the carrier, and the virtual shape of either the upper edge portion or the lower edge portion is a virtual line connecting both ends of the cross-sectional shape of the substrate when the substrate is viewed from the loading / unloading port side of the carrier. .

[0007] According to the substrate transport device of the present invention, the shape information of the substrate used to control the transport unit is shape information when the substrate is viewed from the carrier's loading / unloading port side in the direction of movement of the holding hand, and is shape information obtained by irradiating the substrate with light in a wavelength range longer than visible light in the direction of movement of the holding hand, thereby making it less susceptible to the effects of light reflected from the substrate surface, the effects of multiple reflections between substrates, and the effects of objects reflected behind the substrate.As a result, appropriate contrast can be obtained at the boundary between the shape of the substrate and the background, preventing damage to the substrate. The shape information also includes the cross-sectional shape of the substrate at a predetermined position in the direction of movement of the holding hand, and a virtual shape of either the upper or lower edge of the substrate accommodated in the carrier, where the virtual shape of either the upper or lower edge is a virtual line connecting both ends of the cross-sectional shape of the substrate when viewed from the carrier's loading / unloading port side, thereby making it possible to grasp the three-dimensional shape of the substrate at a predetermined position in the direction of movement of the holding hand.

[0008] In the substrate transport device according to the present invention, it is preferable that the light in the wavelength region longer than visible light is light in a wavelength region that passes through the inside of the substrate (claim 2). This makes it possible to eliminate the influence of light reflected from the surface of the substrate, the influence of multiple reflections between substrates, and the influence of objects reflected behind the substrate.

[0009] In the substrate transport device according to the present invention, the light in the wavelength region longer than visible light is preferably light in the near-infrared wavelength region (claim 3), which makes it possible to effectively eliminate the influence of light reflected from the substrate surface, the influence of multiple reflections between substrates, and the influence of objects reflected behind the substrate.

[0011] In the substrate transport device according to the present invention, the predetermined position in the depth direction of the substrate is preferably the center of the substrate accommodated in the carrier (see claim 1). 4 This makes it possible to identify areas of the substrate housed in the carrier where warping or thickness is likely to increase.

[0013] In the substrate transport device according to the present invention, it is preferable that the acquisition unit includes an imaging unit that captures an image of the substrate accommodated in the carrier using light in a wavelength region longer than the visible light, and acquires a substrate image, and acquires the shape information from the substrate image (see claim 1). 5This makes it possible to acquire images of boards that are less affected by light reflected from the board surface, by multiple reflections between boards, or by objects reflected behind the board.

[0014] In the substrate transport device according to the present invention, the imaging unit is preferably provided in the transport unit (claim 6 This allows you to freely adjust the imaging position and imaging order of the imaging unit.

[0015] Furthermore, the substrate transport device according to the present invention preferably includes a platform on which the carrier is placed, and an opening mechanism that opens a door of the carrier placed on the platform, and the imaging unit preferably images the substrate when the opening mechanism has opened the door or when the opening mechanism is in the process of opening the door (see claim 1). 7 This makes it possible to accurately obtain shape information about the substrate immediately before it is transferred to the transfer section.

[0016] In the substrate transport device according to the present invention, the imaging unit is preferably provided in the opening mechanism (see claim 8 This allows the transport unit to be simply configured without including the imaging unit.

[0017] Furthermore, in the substrate transport device according to the present invention, it is preferable to further include a gap information acquisition unit that acquires gap information between the substrates that the transport unit enters based on the shape information of the plurality of substrates accommodated in the carrier, and the control unit controls the transport unit based on the gap information (see claim 1). 9 This makes it possible to obtain gap information that is less affected by the effects of reflected light from the surface of the board, the effects of multiple reflections between boards, and objects reflected behind the board.

[0018] In the substrate transport device according to the present invention, it is preferable that the control unit adjusts the insertion height position of the holding hand based on the gap information (see claim 10 This effectively prevents damage to the board.

[0019] Furthermore, it is preferable that the substrate processing apparatus according to the present invention comprises the substrate transport device and a processing section that performs a predetermined process on the substrate transported by the substrate transport device (see claim 1). 11 ) This allows the substrate to be processed without damaging it. [Effects of the Invention]

[0020] According to the substrate transport device of the present invention and the substrate processing apparatus equipped with the same, the shape information of the substrate used to control the transport section is less susceptible to the influence of reflected light from the substrate surface, the influence of multiple reflections between substrates, and the influence of objects reflected behind the substrate, thereby preventing damage to the substrate. The shape information also includes the cross-sectional shape of the substrate at a predetermined position in the direction of movement of the holding hand, and a virtual shape of either the upper or lower edge of the substrate accommodated in the carrier, where the virtual shape of either the upper or lower edge is a virtual line connecting both ends of the cross-sectional shape of the substrate when viewed from the carrier's loading / unloading port side, thereby making it possible to grasp the three-dimensional shape of the substrate at a predetermined position in the direction of movement of the holding hand. [Brief explanation of the drawings]

[0021] [Figure 1] 1 is a plan view showing an overall configuration of a substrate processing apparatus according to a first embodiment. [Figure 2] 10(a) to 10(e) are side views showing the configuration and operation of the carry-in / out block. [Figure 3] FIG. 1A is a diagram illustrating an imaging unit, and FIG. 1B is a diagram illustrating a method for imaging a substrate accommodated in a carrier. [Figure 4] FIG. 2 is a plan view schematically showing a substrate and an imaging unit. [Figure 5] 1A and 1B are diagrams showing an example of a substrate warped into a bowl shape, where (a) is a view from the front-rear direction X, and (b) is a view from the width direction Y. FIG. [Figure 6] 1(a) to 1(c) are diagrams showing the principle of acquiring a near-infrared image of the lower edge W of a substrate. [Figure 7] FIG. 1(a) is a front view showing a part of a substrate accommodated in a carrier, and FIG. 1(b) is a near-infrared image thereof. [Figure 8] FIG. 2 is a block diagram showing an example of a control system. [Figure 9] 10(a) to 10(c) are diagrams conceptually showing how to obtain information about the gap between boards using infrared images. [Figure 10] 10(a) and 10(b) are diagrams conceptually showing how to find the center position between substrates. [Figure 11] 1A and 1B are diagrams showing an example of a substrate warped in an umbrella shape, where FIG. 1A is a view from the front-rear direction X, and FIG. 1B is a view from the width direction Y. FIG. [Figure 12] 1A and 1B are diagrams showing an example of a substrate warped in a half-pipe shape, where FIG. 1A is a view from the front-rear direction X, and FIG. 1B is a view from the width direction Y. FIG. [Figure 13] 10(a) and 10(b) are diagrams showing the arrangement of the imaging unit according to a modified example. [Figure 14] 10(a) and 10(b) are diagrams showing a method of imaging a substrate according to a modified example. [Figure 15] 15(a) and 15(b) are diagrams showing a method of imaging a substrate according to a modified example different from that shown in FIG. 14. DETAILED DESCRIPTION OF THE INVENTION

[0022] The present invention will be described below with reference to various examples. [Example]

[0023] A first embodiment of the present invention will be described below with reference to the drawings.

[0024] FIG. 1 is a plan view showing the overall configuration of a substrate transfer device 2 and a substrate processing apparatus 1 including the same according to a first embodiment.

[0025] <1. Overall structure>

[0026] The substrate processing apparatus 1 includes a carry-in / out block 3, an indexer block 5, and a processing block 7. The carry-in / out block 3 and the indexer block 5 constitute a substrate transfer apparatus 2.

[0027] The substrate processing apparatus 1 processes substrates W. The substrates W have, for example, a circular shape in a plan view. The substrate processing apparatus 1 performs, for example, a cleaning process on the substrates W. The substrate processing apparatus 1 processes the substrates W in a processing block 7 in a single-wafer manner. In the single-wafer manner, each substrate W is processed one by one in a horizontal position.

[0028] For convenience, in this specification, the direction in which the load-unload block 3, indexer block 5, and processing block 7 are lined up is referred to as the "front-to-back direction X." The front-to-back direction X is horizontal. Within the front-to-back direction X, the direction from the processing block 7 toward the load-unload block 3 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-to-back direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For reference, in each figure, front, back, right, left, top, and bottom are indicated as appropriate.

[0029] <2. Loading / unloading block>

[0030] The carry-in / out block 3 comprises an input section 9 and an output section 11. The input section 9 and the output section 11 are arranged in the width direction Y. A plurality of substrates W (e.g., 25 substrates) are stored in a single carrier C in a stacked manner in a horizontal position at regular intervals. A carrier C storing unprocessed substrates W is placed in the input section 9. The input section 9 comprises, for example, two mounting tables 13 on which the carriers C are placed. The carrier C stores the substrates W one by one with the surfaces of the substrates W spaced apart. The carrier C stores the substrates W, for example, with their surfaces facing upward. An example of the carrier C is a front-opening unify pod (FOUP). A FOUP is a sealed container. The carrier C may be an open container, and any type of carrier is acceptable.

[0031] The unloading unit 11 is disposed on the opposite side of the loading unit 9 across the center of the width direction Y of the substrate processing apparatus 1. The unloading unit 11 is located to the left Y of the loading unit 9. The unloading unit 11 stores processed substrates W in carriers C and unloads the carriers C. The unloading unit 11, which functions in this manner, is equipped with, for example, two mounting tables 13 for placing the carriers C, similar to the loading unit 9. The loading unit 9 and the unloading unit 11 are also called load ports.

[0032] <3. Indexer Block>

[0033] The indexer block 5 is disposed adjacent to the rear X of the carry-in / out block 3 in the substrate processing apparatus 1. The indexer block 5 includes an indexer robot IR and a transfer unit 15.

[0034] The indexer robot IR is configured to be rotatable around the vertical direction Z. The indexer robot IR is configured to be movable in the width direction Y. The indexer robot IR is equipped with a hand 19. The hand 19 holds one substrate W. The hand 19 is configured to be able to independently advance and retreat in the forward and backward direction X. The indexer robot IR moves in the width direction Y and rotates around the vertical direction Z, advancing and retreating the hand 19 to transfer the substrate W between the cassette C and the transfer section 15. The direction in which the hand 19 moves when transferring the substrate W between the carrier C is referred to as the advance and retreat direction FD.

[0035] The advancing / retreating direction FD is indicated by one arrow indicating the front-rear direction X and two arrows indicating diagonal directions relative to the front-rear direction X. The arrows indicating diagonal directions may deviate from the diagonal directions shown in the figure as long as they are diagonal directions relative to the front-rear direction X. Furthermore, the advancing / retreating direction FD may include components of the width direction Y and the vertical direction Z as long as they are components in the direction in which the hand 19 moves.

[0036] Furthermore, the substrate transport device 2 controls the indexer robot IR based on shape information of the substrate W, which is obtained using near-infrared rays and includes at least shape information of the substrate W accommodated in the carrier C at a predetermined position in the depth direction. The shape information of the substrate W is acquired, for example, in the indexer block 5. The indexer block 5 includes an imaging unit 21 that captures an image of the substrate W accommodated in the carrier C by irradiating near-infrared rays from the forward / backward direction FD of the carrier C, thereby acquiring an image of the substrate W accommodated in the carrier C. The imaging unit 21 is provided, for example, in the indexer robot IR.

[0037] Here, near-infrared rays are roughly defined as infrared rays within the infrared wavelength range that are shorter than the wavelength range of far-infrared rays. That is, infrared rays are electromagnetic waves within a wavelength range that is 0.76 to 0.8 μm, which is the upper limit of visible light, at the lower limit, and up to about 1 mm. Near-infrared rays are infrared rays within the infrared wavelength range that are 2.5 μm or less. The near-infrared rays used in the present invention are preferably within a wavelength range that allows for the acquisition of a near-infrared image that clearly distinguishes the shape of the substrate W from the carrier C behind the substrate W. The near-infrared rays are preferably reflected by the edge of the substrate W, penetrate the interior of the substrate W, and have a lower near-infrared transmittance for the carrier C made of synthetic resin than for the substrate W. In the present invention, the edge corresponds to the outermost periphery of the substrate W when the substrate W accommodated in the carrier C is viewed through the opening of the carrier C. In the case of a substrate W with a downward convex center, the upper edge W in FIG. 6 is defined as the upper edge W. ue and the lower edge W Le The edge corresponds to the edge. The edge is the interface between the substrate W and the atmosphere, and a difference in refractive index occurs between the substrate W and the atmosphere. Therefore, when light is incident on the edge, the light is reflected. In addition, in the present invention, the inside corresponds to the part other than the edge when the substrate W accommodated in the carrier C is viewed from the opening of the carrier C.

[0038] The transfer section 15 is disposed on the boundary between the indexer block 5 and the processing block 7. The transfer section 15 is disposed, for example, in the center in the width direction Y. The transfer section 15 includes an inversion unit (not shown) that inverts the substrate W upside down.

[0039] <4. Processing Block>

[0040] The processing block 7 performs, for example, a cleaning process on the substrate W. The cleaning process is, for example, a process using a brush in addition to a processing liquid. As shown in FIG. 1, the processing block 7 is divided, for example, into a first row R1, a second row R2, and a third row R3 in the width direction Y. In detail, the first row R1 is disposed on the left side Y. The second row R2 is disposed in the center of the width direction Y. In other words, the second row R2 is disposed on the right side Y of the first row R1. The third row R3 is disposed on the right side Y of the second row R2.

[0041] The processing block 7 is configured as described above. An example of the operation of the center robot CR will now be briefly described. The center robot CR receives the substrate W from the delivery section 15. The center robot CR transports the substrate W to one of the back surface cleaning units SSR in the first row R1 or the third row R3 to have the back surface of the substrate W cleaned. The center robot CR receives the substrate W that has been cleaned in one of the back surface cleaning units SSR in the first row R1 or the third row R. The center robot CR transports the substrate W to the delivery section 15.

[0042] <5. Mounting table>

[0043] The above-mentioned carry-in / out block 3 will now be described in detail with reference to Figures 1 and 2. Figures 2(a) to 2(e) are side views showing the configuration and operation of the carry-in / out block.

[0044] The load / unload block 3 includes a mounting table 13, an opening 39, and a lid opening / closing mechanism 41. A carrier C is mounted on the mounting table 13. The mounting table 13 includes a mechanism (not shown) for moving the carrier C in the forward / backward direction X. The mounting table 13 can move the carrier C forward and backward relative to the opening 39. The carrier C has a load / unload opening CT. The load / unload opening CT is formed on one side of the carrier C. Multiple substrates W stored in a stack in the carrier C are loaded and unloaded through the load / unload opening CT. The carrier C includes a lid CL. The lid CL is configured to be detachable from the load / unload opening CT of the carrier C. The lid CL seals the inside of the carrier C. When the lid CL is attached to the carrier C, the carrier C is isolated from the atmosphere outside.

[0045] The lid opening / closing mechanism 41 is provided with an attachment / detachment unit 43 at the front X. The attachment / detachment unit 43 removes the lid CL from the carrier C and attaches the lid CL to the carrier C. The attachment / detachment unit 43 is movable in the vertical direction Z and the front-rear direction X while holding the lid CL. The lid opening / closing mechanism 41 is movable in the front-rear direction X in the opening 39 while holding the lid CL. The lid opening / closing mechanism 41 is movable up and down in the vertical direction Z while holding the lid CL. The lid opening / closing mechanism 41 can move downward in the vertical direction Z from the opening 39 while holding the lid CL. The lid opening / closing mechanism 41 can fully open the opening 39 by descending while holding the lid CL.

[0046] First, as shown in Fig. 2(a), a carrier C is placed on the mounting table 13. The carrier C accommodates a plurality of stacked substrates W and is closed with a lid CL. At this time, the lid opening / closing mechanism 41 positions the attachment / detachment unit 43 at the opening 39. This separates the interior of the indexer block 5 from the external atmosphere.

[0047] As shown in FIG. 2(b), the mounting table 13 moves the carrier C backward X. The carrier C is positioned at the loading / unloading port CT and the lid CL is positioned at the opening 39. At this time, the attachment / detachment unit 43 unlocks the lid CL and holds the lid CL. The holding is performed, for example, by the attachment / detachment unit 43 sucking the lid CL.

[0048] 2(c), the lid opening / closing mechanism 41 moves rearward X. As a result, the lid CL is moved rearward X from the opening 39. The lid CL is moved into the inside of the indexer block 5.

[0049] 2(d), the lid opening / closing mechanism 41 moves downward in the vertical direction Z. The lid opening / closing mechanism 41 lowers the attachment / detachment unit 43 to the bottom of the loading / unloading opening CT. The lid opening / closing mechanism 41 lowers the attachment / detachment unit 43 until the top of the attachment / detachment unit 43 is positioned below the opening 39.

[0050] As shown in Figure 2(e), the lid opening / closing mechanism 41 moves to the lowest position. The lid opening / closing mechanism 41 descends to a position where the attachment / detachment unit 43 does not overlap with the opening 39 in the front-rear direction X. This fully opens the opening 39. The multiple substrates W in the carrier C can be seen from the indexer block 5 through the opening 39.

[0051] <6. Configuration of the imaging unit and carrier C>

[0052] 3A is a diagram illustrating the imaging unit 21, and FIG. 3B is a diagram illustrating a method for imaging the substrates W accommodated in the carrier C. FIG.

[0053] 3(a), the imaging unit 21 is provided in the indexer block 5. The imaging unit 21 is provided in, for example, the indexer robot IR.

[0054] The imaging unit 21 includes a near-infrared irradiation unit 23 that irradiates the substrate W with near-infrared rays, and a near-infrared camera 25 that images the substrate W stored in the carrier C using near-infrared rays reflected from the substrate W stored in the carrier C. The near-infrared camera 25 includes a lens 27 that transmits near-infrared rays from incident light, and an imaging sensor 29 that converts the incident near-infrared rays into an electrical signal. The lens 27 blocks visible light from entering the imaging sensor 29 during imaging.

[0055] The imaging unit 21 images the substrate W accommodated in the carrier C using near-infrared light while the substrate W is viewed from the indexer block 5 through the opening 39, and acquires an image of the substrate W accommodated in the carrier C. In the first embodiment, the imaging unit 21 images the substrate W accommodated in the carrier C while the opening 39 of the carrier C is fully open, but the imaging unit 21 may also image the substrate W accommodated in the carrier C while the lid opening / closing mechanism 41 is moving downward in the vertical direction Z.

[0056] As shown in FIG. 3(b), the imaging unit 21 images, for example, three substrates W at a time out of, for example, 25 substrates W accommodated in a carrier C. In this case, the imaging unit 21 divides the substrates W into, for example, three portions—left, center, and right—according to the width of the field of view VA indicated by the two-dot chain line in the figure and images them. An image of one substrate W is completed by superimposing the three acquired images. The imaging unit 21 is moved by the indexer robot IR, for example, in the order of the upper left, lower left, lower center, upper center, upper right, and lower right of the opening 39, and images the substrates W accommodated in the carrier C at each position. Specifically, if the imaging unit first images the substrates W in the first to third rows in the field of view VA at the upper left, then images the substrates W in the third to fifth rows in the next field of view VA. This is because the gaps between the substrates W are calculated from the acquired images.

[0057] If the field of view range VA is large enough to include all three substrates W, it is possible to capture images of all three substrates W in one imaging session. In this case, the imaging unit 21 can acquire near-infrared images of all of the substrates W accommodated in the carrier C simply by moving the indexer robot IR from top to bottom.

[0058] The carrier C is a box-shaped resin molded product surrounded by a bottom, both sides, a top, and a back. In the illustration, the carrier C has an open loading / unloading port CT. The carrier C is molded, for example, from a synthetic resin. The synthetic resin is a transparent or translucent resin. The transparent synthetic resin is, for example, a colored transparent resin such as orange, or a colorless transparent resin. For example, all sides of the carrier C may be molded from a transparent resin, or only the back side may be molded from a transparent resin. Synthetic resin has a lower near-infrared transmittance than the substrate W. Therefore, in a near-infrared image of the substrate W accommodated in the carrier C, the difference between the substrate W and the back side of the carrier C is clearly visible. In other words, an appropriate contrast can be obtained at the boundary between the substrate W and the background.

[0059] <7. Imaging the substrate W>

[0060] Here, reference is made to Figure 4. Figure 4 is a plan view that schematically shows how the imaging unit captures an image of the substrate W. For ease of explanation, the upper parts of the carrier C and the indexer robot IR are shown in cross section.

[0061] In Figure 4, the substrate W is viewed from the indexer block 5 through the opening 39. The image capture location of the substrate W is the center of the substrate W. The center of the substrate W falls within the field of view of the near-infrared camera 25. The near-infrared irradiation unit 23 irradiates near-infrared rays over a range wider than the field of view of the near-infrared camera 25. The near-infrared camera 25 is provided in the vicinity of the hand 19, in other words, around the hand 19. In this embodiment, the center of the near-infrared camera 25 in the width direction Y is aligned with the center of the hand 19 in the width direction Y. The near-infrared irradiation unit 23 is provided in the vicinity of the near-infrared camera 25, in other words, around the near-infrared camera 25. The irradiation direction of the chief ray of near-infrared rays is the advancing / retreating direction FD indicated by the three arrows, which is oblique to the forward / backward direction X.

[0062] An image of the substrate W accommodated in the carrier C is captured by adjusting the focus of the near-infrared camera 25 to the center position Wc in the depth direction of the substrate W so as to include shape information at the center position Wc in the depth direction (front-rear direction X) of the substrate W accommodated in the carrier C. The center position Wc is also the center position in the width direction Y of the substrate W. In the figure, a dashed line is shown passing through the center position Wc and drawn along the width direction Y. This dashed line is referred to as the substrate center line Wcl. The near-infrared image of the substrate W accommodated in the carrier C is a tomographic image taken along this substrate center line Wcl. In this case, the central portion refers to an area that includes at least the center (center position Wc) of the substrate W when viewed in a plan view. The central portion may be determined based on the diameter of the substrate W. In the case of a substrate W with a diameter of 300 mm, for example, the central portion may be a range of 150 mm in diameter centered at the center position Wc, which is half the diameter. For a curved substrate W, the most convex or concave portion on the substrate is likely to be near the center position Wc of the substrate W. Therefore, by acquiring a tomographic image at the center, it is possible to measure the most convex or concave portion on the substrate W. Furthermore, the most convex or concave portion on the substrate W does not necessarily have to coincide with the center position Wc, and even if it does not coincide, a tomographic image of the substrate W can be suitably acquired by measuring the center of the substrate W.

[0063] <8. Warpage of the substrate W>

[0064] Here, reference is made to Figure 5. Figure 5 shows an example of a substrate warped into a bowl shape, where (a) is a view seen from the front-rear direction X, and (b) is a view seen from the width direction Y.

[0065] The substrate W undergoes various processes, has films with different thermal expansion coefficients attached thereto, and is further subjected to various heat treatments, so that the substrate W may be warped into a complex shape.

[0066] FIG. 5 shows a substrate W that is warped in a bowl shape. That is, the substrate W has a concave center and a high outer periphery. A substrate W that is warped in a bowl shape has a narrower downward gap in the vertical direction Z from the substrate W stored below it in the carrier C. FIG. 5(a) is a view from the front-rear direction X, showing the substrate W as seen from the indexer block 5 through the loading / unloading port CT. In other words, FIG. 5(a) is a view looking toward the back of the carrier C from the advancing / retreating direction FD of the hand 19 of the indexer robot CR. FIG. 5(b) is a view from the width direction Y, showing the advancing / retreating direction FD of the hand 19 from the side. The substrate W shown in FIGS. 5(a) and 5(b) is curved downward in a convex shape.

[0067] Here, the lowest point on the bottom surface of the substrate W is the lowest point W L1 In the substrate W shown in FIG. L1 is located directly below the center position Wc of the substrate. L1 The cross section of the substrate W passing through the lower edge W and extending in the width direction Y along the warp of the substrate W is Le The solid line of the warp of the substrate W shown in FIG. Le The broken line inside the warp indicates the bottom edge W Le The lower edge W Le When the substrate is stored in the carrier C, it is located at the same depth as the substrate center line Wcl shown in FIG. 4. In addition, in FIG. 5, the solid line extending horizontally indicates the upper edge W ue It is called the upper edge W ue are the upper and lower edges of the periphery of the substrate W when viewed from the front-rear direction X. In the near-infrared image of the substrate W accommodated in the carrier C, the substrate center line Wcl is the focal position of the near-infrared camera 25, so the bottom edge W Le is obtained.

[0068] 9. Principle of Obtaining Near-Infrared Images of the Lower Edge of a Substrate

[0069] FIG. 6 shows the lower edge W of the substrate W accommodated in the carrier C. Le1A and 1B are front views of a substrate W accommodated in a carrier C, and FIG. 1C is an acquired near-infrared image. The area indicated by a solid line on the substrate W is the outer periphery of the substrate W that is visible with visible light when the substrate W is viewed from the front-rear direction X, and the area indicated by a dashed line is the upper side of the substrate W in a virtual cross section at the center position Wc when the substrate W is viewed from the front-rear direction X.

[0070] FIG. 6(a) shows a state in which near-infrared rays are irradiated from the near-infrared irradiating unit 23. For convenience of explanation, the field of view VA is assumed to cover the entire substrate W. For convenience of illustration, the near-infrared rays are shown irradiated from the front of the substrate W. That is, the direction in which the near-infrared rays are irradiated is the front in the front-rear direction X, and a representative portion of the substrate W irradiated with the near-infrared rays is indicated by an X mark in a circle. In contrast, the direction in which the near-infrared rays are reflected from a representative portion of the substrate W irradiated with the near-infrared rays is the rear in the front-rear direction X, and is indicated by a black circle mark in a circle. Symbols Ir1 to Ir6 represent near-infrared rays irradiated from the near-infrared irradiating unit 23. Ir1 is the reflection of the near-infrared rays from the upper edge W of the substrate W. ue Ir2 is the near-infrared ray irradiated to the upper edge W ue Ir3 is the near-infrared ray irradiated to the inside of the upper edge of the substrate W. L1 The lower edge W along the width direction Y passing through Le Ir4 is the near-infrared ray irradiated to the lower edge W Le Ir5 is near-infrared light irradiated onto other portions of the substrate W. Ir6 is near-infrared light irradiated onto the cassette C located behind the substrate W.

[0071] 6(b) shows how near-infrared rays irradiated from the near-infrared irradiating unit 23 are reflected from the substrate W and the carrier C. Specifically, the upper edge W ue and the lower edge W Le Near-infrared rays Ir1 and Ir3 irradiated to the upper edge W ue and the lower edge W LeThe near-infrared rays Ir2, Ir4, and Ir5 irradiated onto the inside of the upper edge, the inside of the lower edge, and other locations of the substrate W are transmitted through the interior of the substrate W. Of the near-infrared rays Ir6 irradiated onto the cassette C located behind the substrate W, some wavelength regions of the near-infrared rays are transmitted through or absorbed by the cassette C due to the material of the carrier C, while other wavelength regions of the near-infrared rays are reflected by the cassette C.

[0072] 6(c) is an image of the substrate W accommodated in the carrier C taken by the near-infrared camera 25. In this image, the bottom edge W of the substrate W Le and the lower edge W Le The background is black except for the bottom edge. The inside of the bottom edge is black. Le The image shows the bottom edge W of the substrate W. Le This image shows the cross-sectional contour of the upper edge W ue When taking the image, the near-infrared camera was positioned at the upper edge W ue In this embodiment, the focus is not set on the center position Wc in the depth direction of the substrate W, but on the upper edge W of the substrate W at the center position Wc. ue Therefore, the lower edge W of the substrate W Le In the area other than the bottom edge W, the carrier C located behind the substrate W is shown as a uniform background BK. Le The image of the background BK is displayed in a uniform gray color that is lighter than black. Le can be clearly distinguished from the background BK by a computer during image processing.

[0073] <10. Near-infrared image>

[0074] FIG. 7(a) is a diagram showing a substrate W accommodated in a carrier C included in the field of view VA of the near-infrared camera 25, and (b) is a diagram showing a near-infrared image acquired from (a).

[0075] FIG. 7(a) shows a state in which substrates W are accommodated in a carrier C. The substrates W are accommodated with the left and right edges of their peripheral edges resting on locking portions 57 attached to the left and right sides of the carrier C. FIG. 7(a) shows three substrates W from the top of the carrier C. The field of view VA of the near-infrared camera 25 includes the three substrates W accommodated in the carrier C. The upper and lower substrates W are warped. Hereinafter, these will be referred to as warped substrate W1. The middle substrate W is a substrate W formed by bonding two substrates W together. Hereinafter, these will be referred to as bonded substrate W2. The bonded substrate W2 also warps. The magnitude of the warping varies depending on the substrate W. If the warped substrate W1 and the bonded substrate W2 were photographed using visible light, the visible light image would be affected by reflections from the upper and lower substrates W and the background BK reflected behind the carrier C. Therefore, it is difficult for a computer to accurately measure the shapes of the warped substrate W1 and the bonded substrate stack W2 by image processing and to accurately obtain information about the gaps between the substrates W.

[0076] As shown in FIG. 7(b), in the near-infrared image, the reflected light (visible light) from the upper and lower substrates W is cut off by the lens 27 and is therefore not reflected. Also, in the near-infrared image, a uniformly opaque gray background BK is displayed behind the warped substrate W1 and the bonded substrate W2, so objects located behind the carrier C are not reflected. Also, in the bonded substrate W2, the lower edge W of each of the bonded substrates W2a and W2b is not reflected. Le Therefore, the computer can accurately measure the shapes of the warped substrate W1 and the bonded substrate W2 by image processing, and can accurately obtain information about the gaps between the substrates W. <11. Control System>

[0077] FIG. 8 is a block diagram showing an example of a control system of the substrate processing apparatus 1 shown in FIG.

[0078] The substrate processing apparatus 1 is comprehensively controlled by a control unit CU. The control unit CU includes a CPU, a memory, and the like. The control unit CU operates according to a program stored in advance in a storage unit 51. The control unit CU controls a mechanism (not shown) that moves the carrier C on the mounting table 10 in the forward and backward direction X. The control unit CU controls the attachment and detachment operation of the lid CL by the attachment and detachment unit 43 of the lid opening and closing mechanism 41, and the lifting and lowering operation of the lid opening and closing mechanism 41. When the control unit CU causes the lid opening and closing mechanism 41 to lift and lower, the control unit CU controls the lifting and lowering operation while referring to the height position in the vertical direction Z output from the lid opening and closing mechanism 41. The control unit CU controls the indexer robot IR. Specifically, the control unit CU controls the movement of the hand 19 of the indexer robot IR in the forward and backward direction FD, the movement of the hand 19 in the vertical direction Z, and the rotation of the indexer robot IR about the vertical direction Z. The control unit CU controls the processing of the substrate W in the processing unit 31. The control unit CU controls the center robot CR. The control unit CU controls the forward and backward movement of the hand 33 of the center robot CR, the movement of the hand 33 in the vertical direction Z, and the rotation of the center robot CR about the vertical direction Z.

[0079] The control unit CU will be explained in more detail. The control unit CU grasps the current position of the indexer robot IR based on signals output from sensors provided in each drive unit of the indexer robot IR. The control unit CU controls the indexer robot IR so that the imaging unit 21 is positioned at the imaging start position when the lid opening / closing mechanism 41 finishes descending in the vertical direction Z. The control unit CU controls the imaging unit 21 and the indexer robot IR so that the imaging unit 21 acquires infrared images in sequence while moving through multiple imaging positions in the order of upper left, lower left, lower center, upper center, upper right, and lower right, as shown in FIG. 3(b).

[0080] The imaging unit 21 and the indexer robot IR each have a control unit. The control unit provided in the indexer robot drives each drive unit of the indexer robot IR based on instructions from the control unit CU. The control unit provided in the imaging unit 21 controls the near-infrared irradiation unit 23 and the near-infrared camera 25 based on instructions from the control unit CU.

[0081] <12. Image processing unit>

[0082] When the imaging unit 21 acquires a near-infrared image of a substrate W accommodated in a carrier C, the imaging unit 21 transmits the acquired near-infrared image data to the image processing unit 53. The image processing unit 53 is a computer different from the control unit CU. The image processing unit 53 may be the same computer as the control unit CU. The image processing unit 53 calculates the shape of the substrate W using the near-infrared image data, and calculates, from the calculated shape of the substrate W, the inter-substrate gap information GPw, the standard inter-substrate center position CP0, the individual inter-substrate center position CP1, the gaps GP1 and GP2, etc., which will be described later. The image processing unit 53 transmits the calculated information to the control unit CU. The control unit CU controls the indexer robot IR based on the information received from the image processing unit 53. Specifically, the control unit CU adjusts the insertion height position of the hand 19 and determines whether or not the hand 19 can be inserted based on the inter-substrate gap information GPw. The processing performed by the image processing unit 53 is described below.

[0083] 13. How to Obtain Board Gap Information Using Near-Infrared Images 9(a) to 9(c) are diagrams for explaining how to obtain the substrate gap information GPw using a near-infrared image.

[0084] 9(a) is a diagram showing a formal gap region GS1 between the substrates. The gap region GS1 between the substrates is defined by the upper edge W Ue The formal gap area GS1 between the substrates is calculated from a tomographic image (near-infrared image) at the substrate center line Wcl. When capturing the tomographic image, the focal position is set at the substrate center line Wcl, so the upper edge W of the substrate W located in front of the focal position is calculated. Uedoes not form an image. The formal inter-substrate gap area GS1 calculated from the tomographic image is the area sandwiched between the upper and lower substrates W, excluding the area overlapping with the locking portion 57 in the vertical direction Z. The formal inter-substrate gap area GS1 is obtained, for example, from position information of the substrate W in the vertical direction Z, thickness information of the substrate W, and shape information of the warpage of the substrate W. These pieces of information are associated with the pixels of the imaging sensor 29. The correspondence between the pixels of the near-infrared image and the actual length is known.

[0085] FIG. 9(b) shows the warped substrate W1, the overlapping substrate W2, and the imaginary upper edge W of the overlapping substrate W2 in the formal gap region GS1 between the substrates. Ue The upper edge W Ue is the dashed line, and the lower edge W Le The line connecting the upper ends of both the left and right sides of the lower edge W Le The line connecting the upper ends of both the left and right sides is the imaginary upper edge W Ue The imaginary upper edge W Ue corresponds to the upper edge of the actual substrate W2.

[0086] 9(c) is a diagram showing the substantial gap region GS2 between the substrates. The substantial gap region GS2 between the substrates is the region between the imaginary upper edge W Ue This is an area where the hand 19 cannot enter, taking into consideration the upper edge of the actual substrate W2. Ue From the line indicating the bottom edge W Le The area up to is an inaccessible area GS3 into which the hand 19 cannot enter due to the presence of the superposed substrate W2. The inaccessible area GS3 is shown in the figure with dark shading. The area obtained by excluding the inaccessible area GS3 from the formal substrate gap area GS1 is the actual inter-substrate gap area GS2. As a result, at any position in the width direction Y of the actual inter-substrate gap area GS2, the length in the vertical direction Z of the actual inter-substrate gap area GS2 can be obtained as inter-substrate gap information GPw.

[0087] 14. How to determine the center position between substrates using near-infrared images FIG. 10 is a diagram for explaining how to determine the center position between the substrates using a near-infrared image.

[0088] The left diagram in Figure 10(a) shows the standard inter-substrate center position CP0. The standard inter-substrate center position CP0, which indicates the height in the vertical direction Z, is found by determining the spacing between the locking portions 57 of the carrier C and the thickness of a standard substrate Wt. The standard inter-substrate center position CP0 is located midway along the length obtained by subtracting the thickness of the standard substrate Wt from the spacing between the locking portions 57. If the substrate W housed in the carrier C is the same as the standard substrate Wt, the insertion height of the hand 19 is the standard inter-substrate center position CP0. Note that the standard substrate Wt is a test substrate W that does not have any warpage, or virtual data for such a substrate W.

[0089] The right diagram of FIG. 10(a) shows the inter-substrate center position CP1. The inter-substrate center position CP1 is an inter-substrate center position that is optimized from the standard inter-substrate center position CP0 to match the shape of the substrate W. In the near-infrared image shown in the right diagram of FIG. 10(a), warped substrates W1 are accommodated in the upper, middle, and lower tiers. First, when removing the warped substrate W1 from the upper tier, it is determined whether the insertion height of the hand 19 should be set to the standard inter-substrate center position CP0. This determination is made based on whether the inter-substrate gap information GPw will come into contact with either the upper or lower substrate W1, W1 when the hand 19 is inserted or retracted at the standard inter-substrate center position CP0. This determination is made using inter-substrate gap information GPw1 at the insertion position of the hand 19 in the width direction Y. If the inter-substrate gap information GPw1 is a value that will not cause the hand 19 to come into contact with the substrates W1, W1 when the hand 19 is advanced or retreated from the standard inter-substrate center position CP0, the insertion height of the hand 19 remains at the standard inter-substrate center position CP0, although this is not shown in the figure. If the inter-substrate gap information GPw1 is a value that will cause the hand 19 to come into contact with the substrates W1, W1 when the hand 19 is advanced or retreated from the standard inter-substrate center position CP0, a determination is made as to whether or not to change the insertion height of the hand 19 to the individual inter-substrate center position CP1.

[0090] Specifically, when the hand 19 is inserted at the standard inter-substrate center position CP0, if the length between the bottom end of the hand 19 and the bottom end of the inter-substrate gap information GPw1 exceeds a contact threshold value that serves as a predetermined criterion for contact determination, it is determined that the hand 19 will not come into contact with the lower substrate W. Furthermore, if the length between the top end of the hand 19 and the top end of the inter-substrate gap information GPw1 exceeds the contact threshold value, it is determined that the hand 19 will not come into contact with the upper substrate W either. This determines that insertion of the hand 19 is possible. Conversely, if the length between the bottom end of the hand 19 and the bottom end of the inter-substrate gap information GPw1 is less than the contact threshold value, it is determined that the hand 19 will come into contact with the lower substrate W. Furthermore, if the length between the top end of the hand 19 and the top end of the inter-substrate gap information GPw1 is less than the contact threshold value, it is determined that the hand 19 will come into contact with the upper substrate W. If either of these conditions is met, it is determined that insertion of the hand 19 is not possible.

[0091] The individual substrate center position CP1 is the intermediate position between the values ​​of the substrate gap information GPw1. If the hand 19 does not come into contact with the substrates W1, W1 when entering or retracting at the individual substrate center position CP1, the insertion height of the hand 19 is changed to the individual substrate center position CP1. In this case, it is determined in which direction in the vertical direction Z the individual substrate center position CP1 is located relative to the standard substrate center position CP0. Also, the length of the gap GP1 between the standard substrate center position CP0 and the individual substrate center position CP1 is measured. Then, the hand 19 is moved in the determined direction by the length of the gap GP1. If the hand 19 comes into contact with the substrates W1, W1 when entering or retracting at the individual substrate center position CP1, the entry and retraction of the hand 19 is prohibited.

[0092] When removing the warped substrate W1 in the middle row, the inter-substrate gap information is obtained in the same way as when removing the warped substrate W1 in the upper row. When removing the warped substrate W1 in the middle row, it may be determined whether the shape of the warped substrate W1 in the lower row is the same as the shape of the warped substrate W1 in the middle row. In this case, if the two shapes are the same, the same inter-substrate gap information GPw1 as when removing the warped substrate 1 in the upper row may be used, and if the two shapes are different, the inter-substrate gap information may be obtained in the same way as described above. The above-mentioned determination may be made by the control unit CU based on information acquired by the image processing unit 53, or the image processing unit 53 may make the determination and transmit the result to the control unit CU.

[0093] When the indexer robot IR sequentially removes substrates W housed in the carrier C from top to bottom, if the hand 19 can enter between the substrates W, the hand 19 that has lifted the substrate W can be retracted without coming into contact with the upper substrate W1. Therefore, it is important whether the hand 19 can enter between the substrates W without coming into contact with either the upper or lower substrate W. When the indexer robot IR sequentially removes substrates W housed in the carrier C from bottom to top, even if the hand 19 can enter between the substrates W, the hand 19 that has lifted the substrate W may come into contact with the upper substrate when retracting the substrate W. In this case, it is also important whether the hand 19 that has lifted the substrate W can be retracted without coming into contact with the upper substrate W. Furthermore, whether the hand 19 that has lifted the substrate W will come into contact with the upper substrate W when retracting the substrate W may be determined using the substrate gap information GPw1.

[0094] The left diagram of Figure 10(b) is the same as the left diagram of Figure 10(a). The right diagram of Figure 10(b) is a diagram showing the inter-substrate center position CP2. In the near-infrared image shown in the right diagram of Figure 10(b), the warped substrate W1 is accommodated in the upper row, the bonded substrate W2 in the middle row, and the warped substrate W1 in the lower row. The case of removing the upper warped substrate W1 will be described. The inter-substrate gap information GPw2 is calculated in the same way as the inter-substrate gap information GPw1. When removing the upper warped substrate W1, the inter-substrate gap information GPw2 is a value such that even if the hand 19 is inserted at the standard inter-substrate center position CP0, there will be no contact with either the upper or lower substrate W1, W2, so the hand 19 is inserted at the standard inter-substrate center position CP0. When removing the middle bonded substrate W2, the middle bonded substrate W2 is curved more downwardly than the upper warped substrate W1, so the inter-substrate gap information GPw3 is a value that will cause the hand 19 to come into contact with either the upper or lower substrate W1, W2, if it is advanced at the standard inter-substrate center position CP0. Therefore, the hand 19 is advanced downward in the vertical direction Z by the length of the gap GP2, which is the difference between the substrates W1 and W2, at the individual inter-substrate center position CP2. In this way, accurate measurement of the shape of the substrate W can reduce damage to the substrate W when the hand 19 advances and retreats.

[0095] The correspondence between the above-described first embodiment and the present invention is as follows.

[0096] "Carrier C" corresponds to the "carrier" in the present invention. "Hand 19" corresponds to the "holding hand" in the present invention. "Indexer robot IR" corresponds to the "transport section" in the present invention. "Near infrared" corresponds to the "light in a wavelength region longer than visible light" in the present invention. "Imaging section 21" and "image processing section 53" correspond to the "acquisition section" in the present invention. "Control section CU" corresponds to the "control section" in the present invention. "Load / unload block 3" and "indexer block 5" correspond to the "substrate transport device" in the present invention. Also, "imaging section 21" corresponds to the "imaging section" in the present invention. Also, "center position Wc in the depth direction of substrate W" corresponds to the "predetermined position in the depth direction of substrate W". Also, "lid opening / closing mechanism 41" corresponds to the "opening mechanism" in the present invention. Also, "image processing section 53" corresponds to the "gap information acquisition section". Also, "upper edge W" corresponds to the "gap information acquisition section". Ue " corresponds to the "upper edge" of the present invention.

[0097] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0098] (1) In the present embodiment 1, the substrate processing apparatus 1 having the configuration shown in Fig. 1 has been described as an example. However, the present invention is not limited to this configuration. In other words, the configurations of the indexer block 5 and the processing block 7 are not important.

[0099] (2) In the first embodiment, the substrate W is described as being circular in plan view. However, the present invention is not limited to this. In other words, the shape of the substrate W may be rectangular or the like.

[0100] (3) In the first embodiment, the substrate gap information GPw is explained using the substrate gap information GPw1, GPw2, and GPw3 at the insertion height position of the hand 19 in the width direction Y as an example, but the substrate gap information GPw is not limited to the insertion height position of the hand 19 in the width direction Y. The substrate gap information GPw may be, for example, the lowest point W of the upper substrate W. L1 and the upper edge W of the lower substrate W UeBased on such gap information, the control unit CU can determine whether or not the hand 19 should be inserted.

[0101] (4) In the present embodiment 1, the bowl-shaped warped substrate W1 and the bonded substrate W2 are described, but the substrate W may be warped in a different shape.

[0102] FIG. 11 shows a substrate W warped in an umbrella shape. The substrate W shown in FIG. 11 has a shape that is obtained by turning upside down the bowl-shaped substrate W shown in FIG. 5. The umbrella-shaped substrate W has a periphery (lower edge W Le ) is located at a low position, and the central portion is raised. In other words, the umbrella-shaped substrate W has a raised central portion and a low outer periphery. The substrate W warped in this bowl shape has a narrower upper gap in the vertical direction Z with the substrate W accommodated above it in the carrier C. As can be seen from FIGS. 11(a) and 11(b), the substrate W has a lower upper surface W U is the lower edge W Le It is higher than the vertical Z height of the end face.

[0103] Here, the top surface W U The highest point of U1 Call. Top point W U1 is the upper edge W Ue When measuring the substrate W in FIG. 11, the highest point W U1 In this case, the measurement of the substrate W is performed at the central portion including at least the lower edge W. Le is virtually set, and an entry-prohibited area GS3 where the hand 19 cannot enter is determined. Le " corresponds to the "upper edge" of the present invention.

[0104] FIG. 12 shows a substrate W warped in a half-pipe shape. The substrate W shown in FIG. 12 is warped in an arc shape when viewed from the direction of the central axis CP, with the surfaces of the substrate W spaced apart around the central axis CP, like a cylinder cut along the central axis CP. The half-pipe-shaped substrate W has a low outer periphery and a raised central portion. However, unlike the bowl-shaped and umbrella-shaped substrates described above, the shape of the outer edge of the substrate W is different when viewed from the front-rear direction X and the width direction Y. In other words, the shape of the outer edge of the substrate W is different when viewed from the front-rear direction X and the width direction Y. The substrate W warped in this half-pipe shape has a narrower upper gap in the vertical direction Z between itself and the substrate W accommodated above it in the carrier C, as can be seen from FIGS. 12(a) and 12(b). The substrate W has a lower outer periphery W than the substrate W accommodated above it in the carrier C. U is the lower edge W Le 12, the axis CP on the center side is in the front-to-back direction X, but the axis CP on the center side may also be in the width direction Y. Note that a warped substrate with a half-pipe shape, like that of FIG. 12 turned upside down, may also be housed in carrier C.

[0105] Here, the top surface W U The highest point of U1 Call. Top point W U1 is the upper edge W Ue When measuring the substrate W in FIG. 12, the highest point W U1 In this case, the measurement of the substrate W is performed at the central portion including at least the lower edge W. Le is virtually set, and an entry-prohibited area GS3 where the hand 19 cannot enter is determined. Le " corresponds to the "upper edge" of the present invention.

[0106] (5) In the first embodiment, the imaging unit 21 is provided in the indexer block 5, but the imaging unit 21 may be disposed in a location other than the indexer block 5.

[0107] 13(a) and 13(b) are diagrams showing the arrangement of the imaging unit 21 according to a modified example.

[0108] In FIG. 13(a), the near-infrared irradiator 23 of the imaging unit 21 is provided on the outside of the indexer block 5, for example, on a wall located forward of the mounting table 13. The near-infrared camera 25 of the imaging unit 21 is provided on the indexer robot IR. The near-infrared irradiator 23 on the wall is positioned at a height that allows it to irradiate near-infrared rays onto the substrates W accommodated in the carriers C. The near-infrared rays irradiated from the wall do not penetrate the edges of the substrates W, but penetrate the other parts. The near-infrared camera 25 measures the light transmitted through the center and reflected from the edges. Therefore, a near-infrared image with the shades reversed from those in Example 1 can be obtained. The near-infrared irradiator 23 and the near-infrared camera 25 may be arranged in reverse.

[0109] In FIG. 13(b), the near-infrared irradiator 23 of the imaging unit 21 is provided outside the indexer block 5, for example, on a wall located forward of the mounting table 13. The near-infrared camera 25 of the imaging unit 21 is provided at the upper end of the lid opening and closing mechanism 41. This allows the near-infrared camera 25 to capture an image of the substrate W accommodated in the carrier C as the lid opening and closing mechanism 41 moves downward in the vertical direction Z while holding the lid CL. At this time, the indexer robot IR does not need to move in accordance with the near-infrared camera 25. Therefore, after the imaging by the near-infrared camera 25 is completed, if insertion of the hand 19 is permitted, the substrate W can be quickly removed. The near-infrared irradiator 23 may be attached to the upper end of the lid opening and closing mechanism 41 together with the near-infrared camera 25.

[0110] (6) In the present embodiment 1, the imaging unit 21 moves through a plurality of imaging positions in the order of upper left, lower left, lower center, upper center, upper right, and lower right, imaging the substrates W accommodated in the carrier C in order, and after imaging all of the substrates W, the substrates W are unloaded. However, the method of imaging and unloading the substrates W is not limited to this.

[0111] 14(a) and 14(b) are diagrams showing a method of imaging the substrate W according to a modified example.

[0112] In FIG. 14(a), the indexer robot IR alternately captures images of the substrates W accommodated in the carriers C using the imaging unit 21 and unloads the substrates W. Specifically, the indexer robot IR targets the substrates W in the first to third rows and moves from left to right so that the imaging unit 21 captures images in the field of view VA in the order of left, center, and right. The imaging unit 21 acquires near-infrared images of the substrates W in the first to third rows. If it is determined that the hand 19 can be inserted, the indexer robot IR moves to the center again, inserts the hand 19 between the substrates W in the first and second rows, and unloads the substrates W in the first and second rows. After unloading the substrates W, the indexer robot IR moves the imaging unit 21 to the left so that the imaging unit 21 acquires near-infrared images of the substrates W in the third to fifth rows.

[0113] By imaging and unloading the substrate W in this manner, it is possible to reduce the distance that the indexer robot IR moves in one go, thereby reducing the load on the drive mechanism of the indexer robot IR.

[0114] In FIG. 14(b), the indexer robot IR is equipped with three imaging units 21A, 21B, and 21C. That is, the imaging units 21A, 21B, and 21C can acquire near-infrared images of three rows of substrates W in a single imaging session in the left field of view VA1, the central field of view VA2, and the right field of view VA3. The indexer robot IR may unload the substrates W after the imaging units 21A, 21B, and 21C have finished capturing images of the substrates W housed in the carrier C, or may alternate between capturing images of the substrates W housed in the carrier C with the imaging units 21A, 21B, and 21C and unloading the substrates W. In either case, the imaging time and unloading time can be shortened. The three imaging units 21A, 21B, and 21C are preferably disposed at the left and right ends and the center of the substrate W, respectively, when viewed from the front-rear direction X. This arrangement allows for optimal measurement of a tomographic image of the substrate W.

[0115] 15(a) and 15(b) are diagrams showing methods of imaging the substrate W according to different modifications.

[0116] 15(a), a near-infrared camera 21W having a wide field of view WVA wider than the field of view VA is used. Although the near-infrared image acquired with the wide field of view WVA lacks both the left and right ends of the substrate W, it includes thick portions necessary for measuring the shape of the substrate W and for determining whether or not the hand 19 can be inserted. Therefore, it is possible to determine with sufficient accuracy whether or not the hand 19 can be inserted. In this case, the indexer robot IR may unload the substrate W after the imaging unit 21W has finished imaging the substrate W accommodated in the carrier C, or may alternately image the substrate W accommodated in the carrier C with the imaging unit 21W and unload the substrate W. If necessary, the image processing unit 53 may calculate the complete shape of the substrate W from the acquired shape of the substrate W.

[0117] In Figure 15(b), a near-infrared camera 21F with a full field of view FVA is used, which can capture three rows of substrates W to the left and right ends. The near-infrared image acquired by the full field of view FVA includes the left and right ends of the three rows of substrates W. Therefore, it is possible to determine with high accuracy whether or not the hand 19 can be inserted. In addition, because the imaging unit 21F is compact, the weight of the indexer robot IR can be reduced. In addition, the power consumption related to driving the indexer robot IR can be reduced.

[0118] (7) In this Example 1, the case where a substrate W is unloaded has been described as an example, but the present invention can also be applied to the case where a substrate W is loaded into a carrier C. In other words, when a substrate W has already been loaded into a carrier C and the next substrate W is loaded into the carrier C, if the substrate W is loaded into the carrier C at the standard inter-substrate center position CP0, the individual inter-substrate center position is calculated when the hand 19 comes into contact with the previously loaded substrate W. This makes it possible to prevent damage to the substrate W when the substrate W is loaded into the carrier C.

[0119] (8) In this embodiment 1, the example was explained in which the indexer robot IR transports the substrate W based on an image of the substrate W accommodated in the carrier C, but this may also be applied to the case in which the indexer robot IR receives the substrate W from the transfer section 15 or the case in which the center robot CR receives the substrate W from the transfer section 15.

[0120] (9) In the first embodiment, the near-infrared irradiating unit 23 and the near-infrared camera 25 are used as the imaging unit 21, but infrared rays other than near-infrared rays, such as short-wave infrared rays, may also be used.

[0121] (10) In the first embodiment, an example has been described in which the processing unit 31, which is a processing section, is provided with a back surface cleaning unit SSR. However, the present invention is not limited to a processing section that performs cleaning processing. The present invention may also include a processing section that performs predetermined processing on the substrate W, such as resist coating or development processing.

[0122] (11) In the present embodiment 1, a virtual upper edge portion is set on a tomographic image of the substrate W measured at the center of the substrate W, and an inaccessible area GS3 into which the hand 19 cannot enter is determined. However, the present invention is not limited to this. The upper edge portion may not be set virtually, but may be actually measured using the near-infrared camera 25. In this case, after measuring the center of the substrate W with the near-infrared camera 25, the position of the lens 27 may be changed with respect to the imaging plane of the near-infrared camera 25, and the upper edge portion of the substrate W may be measured as the focal position. In the case of this modified example, the same effect as in embodiment 1 can be obtained. [Explanation of symbols]

[0123] 1... Substrate processing equipment 3...Loading / unloading block 5... Indexer block 7 ... Processing block W: Substrate X…Anteroposterior direction Y: Width direction Z: vertical direction 9 … Input section 11...Payment section C...Career 13 ... Mounting table IR... Indexer robot 19...Hand FD… Advance / retreat direction 21 ... Imaging unit 23 … Near-infrared irradiation section 25... Near-infrared camera 27... Lens 29...imaging sensor 31... Processing unit 37... Front panel 39…Aperture 41... Lid opening and closing mechanism CT… Loading / unloading exit CL... Lid 43 ... Detachable unit CU: Control unit 53... Image processing section 57 ... Locking part GS1: Formal board-to-board gap area GS2: Substantial gap area between boards GS3… No entry area CP0…Standard center position between boards CP1,CP2,CP3 … Center position between individual boards GP1, GP2... Gap

Claims

1. A substrate transport device capable of accommodating a plurality of substrates stacked with gaps therebetween, and transporting the substrates between a carrier having an inlet / outlet on one side thereof, comprising: a transport unit including a holding hand that holds the substrate, and that transports the substrate by moving the holding hand back and forth from the loading / unloading opening of the carrier to the gap between the substrates; an acquisition unit that acquires shape information of the substrate when the substrate is accommodated in the carrier and the substrate is viewed from a loading / unloading port side of the carrier in a direction of movement of the holding hand; a control unit that controls the transport unit based on the shape information, The acquisition unit The method is characterized in that shape information of the substrate is obtained by irradiating the substrate with light in a wavelength region longer than visible light from the direction of advancement and retreat of the holding hand, The shape information is a cross-sectional shape of the substrate at a predetermined position in the advancing / retracting direction of the holding hand; a virtual shape of either an upper edge or a lower edge of the substrate accommodated in the carrier; The imaginary shape of either the upper edge portion or the lower edge portion is an imaginary line connecting both ends of the cross-sectional shape of the substrate when the substrate is viewed from the loading / unloading port side of the carrier. Substrate transport device.

2. 2. The substrate transport device according to claim 1, The light in the wavelength region longer than visible light is light in the wavelength region that passes through the inside of the substrate. A substrate transport device characterized by:

3. 2. The substrate transport device according to claim 1, The light in the wavelength region longer than visible light is light in the near-infrared wavelength region. A substrate transport device characterized by:

4. 2. The substrate transport device according to claim 1, The predetermined position is the center of the substrate accommodated in the carrier. A substrate transport device characterized by:

5. 2. The substrate transport device according to claim 1, The acquisition unit an imaging unit that captures an image of the substrate accommodated in the carrier using light in a wavelength range longer than the visible light, and acquires a substrate image; The shape information is obtained from the substrate image. A substrate transport device characterized by:

6. 6. The substrate transport device according to claim 5, The imaging unit is provided on the transport unit. A substrate transport device characterized by:

7. 6. The substrate transport device according to claim 5, a placement section on which the carrier is placed; an opening mechanism that opens a door of the carrier placed on the placement section, The imaging unit captures an image of the board when the opening mechanism has opened the door or when the opening mechanism is in the process of opening the door. A substrate transport device characterized by:

8. 8. The substrate transport device according to claim 7, The imaging unit is provided in the opening mechanism. A substrate transport device characterized by:

9. 2. The substrate transport device according to claim 1, a gap information acquisition unit that acquires gap information between the substrates that the transport unit enters based on the shape information of the plurality of substrates accommodated in the carrier; The control unit controls the transport unit based on the gap information. A substrate transport device characterized by:

10. 10. The substrate transport apparatus according to claim 9, The control unit adjusts the insertion height position of the holding hand based on the gap information. A substrate transport device characterized by:

11. A substrate transport device according to any one of claims 1 to 10; a processing unit that performs predetermined processing on the substrate transported by the substrate transport device; A substrate processing apparatus comprising:

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