Two-component curing composition set, cured product, and electronic device

Abstract

The present invention provides a two-pack type curable composition set which comprises a first agent and a second agent, wherein: the respective thermal resistances at a thickness of 1.0 mm of the first agent and the second agent as determined by a specific method in accordance with ASTM D5470 are independently within the range of 1.4 to 2.1 cm2∙°C / W; and the respective viscosities of the first agent and the second agent as determined by a rotational rheometer are independently within the range of 50 to 120 Pa∙s.

Description

[Technical Field]

[0001] The present invention relates to a two-component curing composition set, a cured product, and an electronic device. [Background technology]

[0002] As heat-generating electronic components, such as central processing units (CPUs) in personal computers, become smaller and more powerful, the amount of heat generated per unit area by these components has become extremely large. This amount of heat can reach approximately 20 times that of an iron. To prevent these heat-generating electronic components from breaking down over the long term, they must be cooled. Metal heat sinks and housings are used for cooling. However, when a heat-generating electronic component is placed directly in contact with a heat sink, microscopic air exists at the interface, which can impede heat conduction. Therefore, to efficiently transfer heat, a thermally conductive material is often placed between the heat-generating electronic component and the heat sink.

[0003] Thermally conductive materials include, for example, thermally conductive greases made by adding thermally conductive powder to room-temperature curing liquid silicone rubber. Room-temperature curing liquid silicone rubbers are primarily classified into one-component and two-component types, with the two-component type being further divided into condensation reaction and addition reaction types. Thermally conductive greases containing two-component liquid silicone rubbers are used as two-component curing composition sets containing two different compositions.

[0004] For example, Patent Document 1 describes that an addition reaction type silicone rubber composition containing an alkenyl group-containing organopolysiloxane, an organohydrogenpolysiloxane, a platinum catalyst, and an adhesion promoter is less susceptible to the effects of curing inhibitors and has excellent adhesion. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-22284 Summary of the Invention [Problem to be solved by the invention]

[0006] Two-component curing composition sets are used by mixing two types of compositions and then applying them to a predetermined area. Generally, the thermal conductivity of the cured product obtained from the two types of compositions is controlled by adjusting the amount and type of thermally conductive filler added. However, if the amount of thermally conductive filler is increased too much to increase thermal conductivity, the viscosity of the two types of compositions and their mixture increases, resulting in problems such as reduced ease of handling, such as application performance.

[0007] The present inventors have studied conventional thermally conductive greases such as that described in Patent Document 1 and have found that the conventional thermally conductive greases are insufficient in at least one of handling ease and thermal conductivity.

[0008] Therefore, the present invention has been made in consideration of the above-mentioned problems, and aims to provide a two-component curing composition set that is easy to handle and has excellent thermal conductivity, a cured product obtained from the two-component curing composition set, and an electronic device that includes the cured product. [Means for solving the problem]

[0009] As a result of intensive research into achieving the above object, the inventors discovered that a two-component curing composition set in which the thermal resistance values ​​and viscosities of the first and second parts are within predetermined ranges can solve the above problems, and thus completed the present invention.

[0010] That is, the present invention is as follows. [1] A first agent and a second agent are provided, The thermal resistance values ​​of the first agent and the second agent at a thickness of 1.0 mm measured by a method in accordance with ASTM D5470 are each independently 1.4 to 2.1 cm 2 °C / W, the first agent and the second agent each independently have a viscosity of 50 to 120 Pa s as measured by a rotational rheometer; Two-component curing composition set. [2] the first agent comprises a surfactant A1, a vinyl-modified organopolysiloxane B1 having a viscosity of 80 to 120 mPa·s, a thermally conductive filler C1, and an addition reaction catalyst D1; the second agent comprises a surfactant A2, a vinyl-modified organopolysiloxane B2 having a viscosity of 80 to 120 mPa s, a thermally conductive filler C2, and a hydrosilyl-modified organopolysiloxane E2 having a viscosity of 1 to 100 mPa s; [1] The two-component curing composition set according to [1]. [3] the vinyl-modified organopolysiloxane B1 and the vinyl-modified organopolysiloxane B2 each independently have an average of 2.0 or more vinyl groups per molecule, The hydrosilyl-modified organopolysiloxane E2 has an average of more than 2.0 hydrosilyl groups per molecule. [2] The two-component curing composition set according to [2]. [4] In the first agent, the amount of the vinyl-modified organopolysiloxane B1 is 100 parts by weight. The content of the surfactant A1 is 5 to 25 parts by weight, The content of the thermally conductive filler C1 is 1500 to 2400 parts by weight. The two-component curing composition set according to [2] or [3]. [5] In the second agent, for a total of 100 parts by weight of the vinyl-modified organopolysiloxane B2 and the hydrosilyl-modified organopolysiloxane E2, the content of the surfactant A2 is 5 to 25 parts by weight, The content of the thermally conductive filler C2 is 1500 to 2400 parts by weight. The two-component curing composition set according to any one of [2] to [4]. [6] The surfactant A1 and the surfactant A2 are copolymers having (meth)acrylic monomer units α having a carboxy group, (meth)acrylic monomer units β having a tertiary amino group, and (meth)acrylic monomer units γ having a siloxane skeleton. The two-component curing composition set according to any one of [2] to [5]. [7] The number average molecular weight of the monomer unit γ is 1,500 to 50,000. [6] The two-component curing composition set according to [6]. [8] In the copolymer, relative to 100 parts by weight in total of the monomer units α, β, and γ, the content of the monomer unit α is 0.08 to 6.0 parts by weight, the content of the monomer unit β is 0.02 to 4.0 parts by weight, the content of the monomer unit γ is 90.0 to 99.9 parts by weight; [6] or [7]. [9] The surfactant A1 and the surfactant A2 each independently have a weight average molecular weight of 20,000 to 150,000. The two-component curing composition set according to any one of [2] to [8].

[10] the hydrosilyl-modified organopolysiloxane E2 comprises a hydrosilyl-modified organopolysiloxane E21 having hydrosilyl groups at both ends and a hydrosilyl-modified organopolysiloxane E22 having hydrosilyl groups in side chains; The two-component curing composition set according to any one of [2] to [9].

[11] The thermally conductive filler C1 and the thermally conductive filler C2 are each independently one or more selected from the group consisting of boron nitride, aluminum nitride, aluminum oxide, silicon nitride, silicon oxide, magnesium oxide, metallic aluminum, and zinc oxide. The two-component curing composition set according to any one of [2] to

[10] .

[12] The thermally conductive filler C1 and the thermally conductive filler C2 contain aluminum oxide powder.

[11] The two-component curing composition set according to

[11] .

[13] The first agent and the second agent are mixed in equal volumes, molded into a sheet, and then heat-cured at 60°C for 20 minutes, resulting in a sheet having a withstand voltage of 8kV / mm or more as measured in accordance with JIS C2110. The two-component curing composition set according to any one of [1] to

[12] .

[14] When a load of 50 N is applied to a mixture obtained by mixing the first agent and the second agent in equal volumes per 10 mm x 10 mm area, the thickness of the mixture is 70 to 120 μm. The two-component curing composition set according to any one of [1] to

[13] .

[15] The first agent and the second agent are represented by the following formula: R 1 a R 2 b Si(OR 3 ) 4-(a+b) (R 1 are each independently an alkyl group having 1 to 15 carbon atoms, and R 2 are each independently a saturated or unsaturated monovalent hydrocarbon group having 1 to 8 carbon atoms, and R 3 are each independently an alkyl group having 1 to 6 carbon atoms, a is 1 to 3, b is 0 to 2, and a+b is 1 to 3. does not contain organosilane represented by The two-component curing composition set according to any one of [1] to

[14] .

[16] Used as a thermally conductive heat dissipation material, The two-component curing composition set according to any one of [1] to

[15] .

[17] [1] to

[16] , wherein the two-component curing composition set is obtained from a mixture of the first agent and the second agent. cured product.

[18] Used as a thermally conductive heat dissipation material,

[17] The cured product according to

[17] .

[19] An electronic component, the cured product according to

[18] , and a heat sink, the electronic component and the heat sink are in contact with each other via the cured product. electronic equipment. [Effects of the Invention]

[0011] According to the present invention, it is possible to provide a two-component curing composition set that is easy to handle and has excellent thermal conductivity, a cured product obtained from the two-component curing composition set, and an electronic device that includes the cured product. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, an embodiment of the present invention (hereinafter referred to as "the present embodiment") will be described in detail. However, the present invention is not limited to the following embodiment, and various modifications are possible without departing from the gist of the present invention.

[0013] 1. Two-component curing composition set The two-component curing composition set of this embodiment includes a first part and a second part, and the thermal resistance values ​​of the first part and the second part at a thickness of 1.0 mm measured by a method in accordance with ASTM D5470 are each independently 1.4 to 2.1 cm 2 °C / W (both inclusive; the same applies hereinafter in this specification unless otherwise specified), and the viscosity of the first and second parts measured with a rotational rheometer is independently 50 to 120 Pa s.

[0014] The present inventors have found that the thermal resistance values ​​of the first agent and the second agent are each independently 1.4 to 2.1 cm 2 ·°C / W and the above viscosities are each independently 50 to 120 Pa·s, the thermal conductivity and handling properties are well balanced, and the thermal conductivity and handling properties required for practical use are satisfied.

[0015] 1.1.Thermal resistance value The thermal resistance of the first and second layers at a thickness of 1.0 mm measured by a method conforming to ASTM D5470 is 1.4 to 2.1 cm. 2 °C / W, preferably 1.5 to 2.0 cm 2 ℃ / W. The thermal resistance is 2.1cm 2 ·°C / W or less, the cured product obtained from the two-component curing composition set of this embodiment can satisfy the thermal conductivity required for practical use. 2 Since the viscosity of the first and second parts is 0.04 °C / W or more, the viscosity of the first and second parts does not become too high, and the two-part curing composition set of this embodiment can satisfy the handleability required for practical use. The thermal resistance values ​​of the first and second parts are measured at a thickness of 1.0 mm by a method in accordance with ASTM D5470, and more specifically, are measured by the method described in the examples.

[0016] The thermal conductivity of the first and second parts, measured by a method in accordance with ASTM D5470, is preferably 4.7 to 7.0 W / m K, and more preferably 5.0 to 6.5 W / m K. The thermal conductivities of the first and second parts are measured by a method in accordance with ASTM D5470, more specifically, by the method described in the examples.

[0017] In order to set the thermal resistance and thermal conductivity of the first and second agents within the above ranges, for example, the particle size and content of the thermally conductive filler contained in the first and second agents may be adjusted, or a filler with high thermal conductivity may be used. An example of the specific composition of the first and second agents will be described later.

[0018] 1.2.Viscosity The viscosity of the first and second parts, measured with a rotational rheometer, is independently 50 to 120 Pa·s, preferably 60 to 110 Pa·s. Because the viscosity is 50 Pa·s or higher, the two-component curing composition set of this embodiment can satisfy the handleability required for practical use. Furthermore, because the viscosity is 120 Pa·s or lower, the thermal conductivity is not too low, and the cured product obtained from the two-component curing composition set of this embodiment can satisfy the thermal conductivity required for practical use.

[0019] In this specification, the viscosity of the first and second components measured by a rotational rheometer is measured at 25°C and a shear rate of 10 s -1 The viscosity can be measured, for example, using a rotational rheometer "HANKE MARSIII" manufactured by Thermo Fisher Scientific. More specifically, the viscosity is measured using parallel plates with a diameter of 35 mm, a gap of 0.5 mm, a temperature of 25°C, and a shear rate of 10 s -1 The measurement can be performed under the following conditions.

[0020] In order to set the viscosity of the first and second agents within the above range, it is possible to adjust the viscosity of the matrix component such as organopolysiloxane contained in the first and second agents, add a component that improves the wettability between the thermally conductive filler and the matrix component such as organopolysiloxane, or adjust the particle size and content of the thermally conductive filler. An example of a specific composition of the first and second agents will be described later.

[0021] 1.3. Dielectric strength of the cured product obtained from the first and second parts The first and second components are mixed and then applied to a predetermined area for use. The first and second components initiate a curing reaction when mixed, and a cured product is obtained after a predetermined time has passed. When the two-component curing composition set of this embodiment is used in electronic devices, it is expected that the cured product and the electronic components will be placed in electrical contact. Therefore, it is preferable that the cured product obtained by mixing the first and second components has insulating properties.

[0022] More specifically, the withstand voltage of the sheet obtained by mixing equal volumes of the first and second agents, molding the mixture into a sheet, and then heat-curing the mixture at 60°C for 20 minutes, as measured in accordance with JIS C2110, is preferably 8 kV / mm or more, and more preferably 10 kV / mm or more. Having a withstand voltage within the above range ensures the insulating properties of the cured product. There is no particular upper limit to the withstand voltage, but the withstand voltage may be, for example, 50 kV / mm or less.

[0023] The withstand voltage can be reduced by using a thermally conductive filler with low electrical conductivity or by reducing the content of the thermally conductive filler. The withstand voltage may be measured by the method described in the examples.

[0024] 1.4. Minimum film thickness of the cured product obtained from the first and second parts When a load of 50 N is applied to a mixture of equal volumes of the first and second components per 10 mm × 10 mm area, the thickness of the mixture is preferably 70 to 120 μm. In this specification, the thickness of the mixture measured in this manner is defined as the minimum thickness of a film (cured product) that can be formed from the first and second components. Therefore, the minimum thickness of a film that can be formed using the two-component curing composition set of this embodiment is preferably 70 to 120 μm. When the first and second components contain a thermally conductive filler, there is a minimum film thickness that can be formed using the mixture of the first and second components, depending on the particle size and content of the thermally conductive filler. A minimum film thickness between 70 and 120 μm tends to result in a two-component curing composition set that exhibits an excellent balance between ease of handling and thermal conductivity, even when using a relatively inexpensive thermally conductive filler such as boron nitride, aluminum nitride, aluminum oxide, silicon nitride, silicon oxide, magnesium oxide, metallic aluminum, or zinc oxide, especially aluminum oxide. From the same viewpoint, the minimum thickness of the film is more preferably 80 to 100 μm. The minimum thickness of the film may be measured by the method described in the Examples.

[0025] 1.5. Example of composition of first and second agents In this embodiment, the first and second parts are not particularly limited as long as they are a combination that causes a curing reaction when mixed together. The reaction between the first and second parts may be a condensation reaction, an addition reaction, a radical reaction, or the like.

[0026] Combinations of first and second agents that cure by a condensation reaction include, for example, a combination of a first agent containing an epoxy-modified organopolysiloxane having epoxy groups and a second agent containing an amino-modified organopolysiloxane having amino groups. Combinations of first and second agents that cure by an addition reaction include, for example, a combination of a first agent containing a vinyl-modified organopolysiloxane having vinyl groups and a second agent containing a hydrosilyl-modified organopolysiloxane having hydrosilyl groups, and a combination of a first agent and a second agent that undergoes a Michael addition reaction.

[0027] An example of the composition of the first and second components will be described in detail below, taking a combination of a vinyl-modified organopolysiloxane and a hydrosilyl-modified organopolysiloxane as an example, but the first and second components provided in the two-component curing composition set of this embodiment are not limited to these compositions. For example, instead of the combination of a vinyl-modified organopolysiloxane and a hydrosilyl-modified organopolysiloxane, a combination of an epoxy-modified organopolysiloxane and an amino-modified organopolysiloxane may be used.

[0028] 1.5.1. First Agent The first agent preferably contains a surfactant A1, a vinyl-modified organopolysiloxane B1 having a viscosity of 80 to 120 mPa·s, a thermally conductive filler C1, and an addition reaction catalyst D1. The first agent may further contain other components as necessary.

[0029] Surfactant A1 The surfactant A1 is not particularly limited as long as it can improve the wettability of the thermally conductive filler C1 with the vinyl-modified organopolysiloxane B1. From the viewpoint of further improving the wettability of the thermally conductive filler, the surfactant A1 is preferably a copolymer having at least two of an anionic group, a cationic group, and a group having a siloxane skeleton.

[0030] The anionic group is not particularly limited, but examples thereof include a carboxy group, a phosphate group, a phenolic hydroxy group, and a sulfonic acid group. Among these, the anionic group is preferably at least one selected from the group consisting of a carboxy group, a phosphate group, and a phenolic hydroxy group, and is preferably a carboxy group.

[0031] The cationic group is not particularly limited, but examples thereof include a primary amino group, a secondary amino group, a tertiary amino group, and a quaternary ammonium cationic group. Of these, the anionic group is preferably a tertiary amino group.

[0032] The group having a siloxane skeleton is not particularly limited, but examples thereof include groups having an organopolysiloxane skeleton, and among these, the group having a siloxane skeleton is preferably a group having a polydimethylsiloxane skeleton.

[0033] The content of surfactant A1 is, for example, 3 to 28 parts by weight, preferably 4 to 25 parts by weight, more preferably 5 to 20 parts by weight, and even more preferably 5 to 15 parts by weight, per 100 parts by weight of the content of vinyl-modified organopolysiloxane B1. When the content of surfactant A1 is within the above range, the dispersibility of thermally conductive filler C1 is further improved, and the viscosity of the first agent tends to be further reduced.

[0034] The weight-average molecular weight of surfactant A1 is preferably 20,000 to 150,000, more preferably 30,000 to 120,000, and even more preferably 40,000 to 100,000. When the weight-average molecular weight of surfactant A1 is within the above range, the dispersibility of thermally conductive filler C1 is further improved, and the viscosity of the first agent tends to be further reduced. The weight-average molecular weight can be determined by GPC (gel permeation chromatography).

[0035] A preferred embodiment of surfactant A1 will be described in more detail below. In this embodiment, "monomer" refers to a monomer having a polymerizable unsaturated bond before polymerization, and "monomer unit" refers to a repeating unit that constitutes part of a copolymer after polymerization and is derived from a specific monomer. Furthermore, (meth)acrylic includes acrylic and methacrylic, and (meth)acrylic monomers include (meth)acrylate and (meth)acrylamide. Furthermore, hereinafter, "(meth)acrylic monomer unit α" and the like will also be simply referred to as "monomer unit α" and the like.

[0036] The surfactant A1 is preferably a copolymer containing a (meth)acrylic monomer unit α having a carboxy group, a (meth)acrylic monomer unit β having a tertiary amino group, and a (meth)acrylic monomer unit γ having a siloxane skeleton. Use of such a copolymer tends to improve the dispersibility of the thermally conductive filler C1 and reduce the viscosity of the first agent.

[0037] In the copolymer, the monomer units α, β, and γ may be contained randomly or in blocks. In surfactant A1, at least the monomer units α and γ are preferably contained as a random copolymer. When the monomer units α and γ are contained as a random copolymer, the viscosity of the first agent tends to be further reduced.

[0038] 1.5.1.1.1. (Meth)acrylic monomer unit α having a carboxy group The monomer unit α is a repeating unit having a carboxy group. When the surfactant A1 has such a monomer unit, the dispersibility of the thermally conductive filler C1 tends to be further improved.

[0039] The monomer unit α preferably further has an electron-withdrawing group bonded to the carboxy group. Such an electron-withdrawing group is not particularly limited as long as it has the effect of stabilizing the negative charge on the carboxy group. For example, the monomer unit α may be a unit derived from an acrylic monomer containing an electron-withdrawing substituent such as a halogen element on the carbon atom at the α-position of the carboxy group. The inclusion of such a monomer unit tends to further improve the dispersibility of the thermally conductive filler C1.

[0040] The monomer unit α preferably does not have an electron-donating group bonded to the carboxy group or has a group with low electron-donating properties. Such electron-donating groups are not particularly limited as long as they have the effect of destabilizing the negative charge on the carboxy group. For example, the monomer unit α may be a unit derived from an acrylic monomer that does not contain an electron-donating group, such as a methyl group, at the carbon atom at the α-position of the carboxy group. The inclusion of such a monomer unit tends to further improve the dispersibility of the thermally conductive filler C1.

[0041] Such (meth)acrylic monomers are not particularly limited, but examples thereof include acrylic acid, methacrylic acid, 2-acryloyloxyethyl succinic acid, 2-methacryloyloxyethyl succinic acid, etc. Among these, acrylic acid and 2-methacryloyloxyethyl succinic acid are preferred, and acrylic acid is more preferred. By including units derived from such monomers, affinity for the thermally conductive filler C1 is further improved, and the dispersibility of the thermally conductive filler C1 tends to be further improved. The monomer unit α may be used alone or in combination of two or more types.

[0042] The content of the monomer unit α is, for example, 0.05 to 20 parts by weight, preferably 0.08 to 6.0 parts by weight, more preferably 0.1 to 5.0 parts by weight, even more preferably 0.3 to 4.0 parts by weight, and even more preferably 0.5 to 3.0 parts by weight, relative to 100 parts by weight of the total of the monomer units α, β, and γ. Within the above range, the content of the monomer unit α may be 0.7 parts by weight or more, or 2.0 parts by weight or less. When the content of the monomer unit α is within the above range, the dispersibility of the thermally conductive filler C1 is further improved, and the viscosity of the first agent tends to be further reduced.

[0043] 1.5.1.1.2. (Meth)acrylic monomer units β containing tertiary amino groups The monomer unit β is a repeating unit having a tertiary amino group. When the surfactant A1 has such a monomer unit, the dispersibility of the thermally conductive filler C1 tends to be further improved.

[0044] The monomer unit β preferably further has an electron-donating group bonded to the carbon atom adjacent to the nitrogen atom of the tertiary amino group. Such an electron-donating group is not particularly limited as long as it has the effect of stabilizing the positive charge on the tertiary amino group. The monomer unit β may be, for example, a unit derived from an acrylic monomer containing an electron-donating substituent, such as a methyl group, on the carbon atom at the α-position of the tertiary amino group. The inclusion of such a monomer unit tends to further improve the dispersibility of the thermally conductive filler C1.

[0045] The monomer unit β preferably does not have an electron-withdrawing group bonded to the carbon atom adjacent to the nitrogen atom in the tertiary amino group, or has a group with low electron-withdrawing properties. Such electron-withdrawing groups are not particularly limited as long as they have the effect of destabilizing the positive charge on the tertiary amino group. The monomer unit β may be, for example, a unit derived from an acrylic monomer that does not contain a substituent of an electron-withdrawing group such as a carboxyl group on the carbon atom at the α-position of the tertiary amino group. The inclusion of such a monomer unit tends to further improve the dispersibility of the thermally conductive filler C1.

[0046] Such (meth)acrylic monomers are not particularly limited, but examples thereof include dimethylaminoethyl methacrylate, diethylaminoethyl methacrylate, and 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate. Among these, dimethylaminoethyl methacrylate and 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate are preferred, and 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate is more preferred. By including units derived from such monomers, affinity for the thermally conductive filler C1 is further improved, and the dispersibility of the thermally conductive filler C1 tends to be further improved. The monomer unit β may be used alone or in combination of two or more types.

[0047] The content of the monomer unit β is, for example, 0.02 to 4.0 parts by weight, preferably 0.05 to 4.0 parts by weight, more preferably 0.07 to 3.0 parts by weight, even more preferably 0.08 to 2.0 parts by weight, and even more preferably 0.1 to 1.0 parts by weight, relative to 100 parts by weight of the total of the monomer units α, β, and γ. Within the above range, the content of the monomer unit β may be 0.3 parts by weight or more, or 0.8 parts by weight or less. When the content of the monomer unit β is within the above range, the dispersibility of the thermally conductive filler C1 is further improved, and the viscosity of the first agent tends to be further reduced.

[0048] 1.5.1.1.3. (Meth)acrylic monomer unit γ having a siloxane skeleton The monomer unit γ is a repeating unit having a siloxane skeleton. When surfactant A1 contains such a monomer unit, the affinity or compatibility between surfactant A1 and vinyl-modified organopolysiloxane B1 increases, and the viscosity of the first agent tends to decrease.

[0049] Examples of the siloxane skeleton in the monomer unit γ include organopolysiloxane skeletons such as dialkylpolysiloxane, diphenylpolysiloxane, and alkylphenylpolysiloxane. The alkyl contained in the siloxane skeleton is not particularly limited, but examples thereof include methyl, ethyl, propyl, butyl, pentyl, and hexyl groups. The phenyl group contained in the siloxane skeleton is not particularly limited, but examples thereof include phenyl groups and substituted phenyl groups, specifically phenyl and benzyl groups. Examples of the substituent include methyl, ethyl, propyl, butyl, pentyl, and hexyl groups.

[0050] Such (meth)acrylic monomers are not particularly limited, but examples thereof include (meth)acrylic acid polysiloxanes in which the terminals of the siloxane skeletons are modified with (meth)acrylic acid, as described above. Specific examples include α-butyl-ω-(3-methacryloxypropyl)polydimethylsiloxane, etc. The monomer unit γ may be used alone or in combination of two or more.

[0051] The number average molecular weight of the monomer unit γ is preferably 1,500 to 50,000, more preferably 3,000 to 30,000, and even more preferably 4,000 to 20,000. When the number average molecular weight of the monomer unit γ is 1,500 or more, the curability tends to improve when the first and second parts are mixed. When the number average molecular weight of the monomer unit γ is 50,000 or less, the viscosity of the first part tends to decrease. The number average molecular weight of the monomer unit γ can be determined by GPC (gel permeation chromatography).

[0052] The content of the monomer unit γ is, for example, 70.0 to 99.9 parts by weight, preferably 80.0 to 99.5 parts by weight, preferably 90.0 to 99.0 parts by weight, more preferably 93.0 to 98.8 parts by weight, and even more preferably 96.0 to 98.7 parts by weight, per 100 parts by weight of the total of the monomer units α, β, and γ. When the content of the monomer unit γ is within the above range, the dispersibility of the thermally conductive filler C1 tends to be further improved, and the viscosity of the first agent tends to be further reduced. Furthermore, the curability tends to be improved when the first and second agents are mixed.

[0053] The total content of the monomer units α, β, and γ in surfactant A1 is preferably 90% by weight or more, more preferably 95% by weight or more, even more preferably 99% by weight or more, and even more preferably 100% by weight, based on the total amount of surfactant A1. Having this total content within the above range tends to further improve the dispersibility of the thermally conductive filler C1 and further reduce the viscosity of the first agent. The upper limit of the total content of the monomer units α, β, and γ is not particularly limited, and may be, for example, 100% by weight, 99% by weight, 98% by weight, or 95% by weight.

[0054] 1.5.1.1.4. Manufacturing method The method for producing surfactant A1 is not particularly limited, and any known polymerization method for (meth)acrylic monomers can be used. Examples of the polymerization method include radical polymerization and anionic polymerization. Among these, radical polymerization is preferred.

[0055] The thermal polymerization initiator used in radical polymerization is not particularly limited, but examples thereof include azo compounds such as azobisisobutyronitrile; and organic peroxides such as benzoyl peroxide, tert-butyl hydroperoxide, and di-tert-butyl peroxide. The photopolymerization initiator used in radical polymerization is not particularly limited, but examples thereof include benzoin derivatives. Furthermore, known polymerization initiators used in living radical polymerization such as ATRP and RAFT can also be used.

[0056] The polymerization conditions are not particularly limited and can be appropriately adjusted depending on the initiator and boiling point of the solvent used, and the types of other monomers.

[0057] The order of adding the monomers is not particularly limited. For example, when synthesizing a random copolymer, the monomers may be mixed to initiate polymerization, and when synthesizing a block copolymer, the monomers may be added sequentially to the polymerization system.

[0058] 1.5.1.2. Vinyl-modified organopolysiloxane B1 Vinyl-modified organopolysiloxane B1 (hereinafter simply referred to as "organopolysiloxane B1") is an organopolysiloxane having a viscosity of 80 to 120 mPa·s and having at least one vinyl group. Organopolysiloxane B1 may have a vinyl group on a side chain and / or at a terminal. Such organopolysiloxane has a structural unit represented by the following formula (b1-1) or a terminal structure represented by formula (b1-2). Organopolysiloxane B1 may have, for example, at least one of the structural unit represented by formula (b1-1) and the terminal structure represented by formula (b1-2), and a structural unit represented by formula (b1-3).

[0059] [ka]

[0060] In formulas (b1-1), (b1-2), and (b1-3), R represents any monovalent hydrocarbon group which may have a substituent. That is, in organopolysiloxane B1, any monovalent hydrocarbon group which may have a substituent is bonded to a side chain of the siloxane skeleton.

[0061] Such monovalent hydrocarbon groups are not particularly limited, and examples thereof include alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, and dodecyl; cycloalkyl groups such as cyclopentyl and cyclohexyl; aryl groups such as phenyl, tolyl, xylyl, and naphthyl; aralkyl groups such as benzyl, 2-phenylethyl, and 2-phenylpropyl; and groups having a substituent in these groups. Examples of the substituent in the monovalent hydrocarbon group include a halogen atom, particularly a fluorine atom or a chlorine atom.

[0062] The organopolysiloxane B1 is contained in the first agent either alone or in combination of two or more. The number of vinyl groups in the organopolysiloxane B1 contained in the first agent is preferably 2.0 or more on average per molecule. That is, when the first agent contains one type of organopolysiloxane B1, the organopolysiloxane preferably has two or more vinyl groups per molecule. When the first agent contains two or more types of organopolysiloxane B1, the arithmetic average number of vinyl groups in each organopolysiloxane is preferably 2.0 or more. By having 2.0 or more vinyl groups per molecule, when reacted with the hydrosilyl-modified organopolysiloxane E2 contained in the second agent, a network structure is formed, which tends to produce a cured product with superior mechanical strength, such as shear displacement and elongation at break. The upper limit of the number of vinyl groups in organopolysiloxane B1 is not particularly limited, and may be, for example, an average of 4.0, 3.0, or 2.5 per molecule, and the average number of vinyl groups in organopolysiloxane B1 per molecule may be 2.0.

[0063] The average number of vinyl groups per molecule of organopolysiloxane B1 can be measured by NMR. Specifically, for example, an ECP-300NMR manufactured by JEOL Corporation can be used to dissolve organopolysiloxane B1 in deuterated chloroform as a deuterated solvent. The average number of vinyl groups per molecule can be calculated by dividing the measurement result thus obtained by the average molecular weight of organopolysiloxane B1.

[0064] The organopolysiloxane B1 preferably contains at least an organopolysiloxane having vinyl groups at both ends. By using such an organopolysiloxane, it tends to be possible to adjust the crosslink density when the first and second parts are mixed. From the same viewpoint, the organopolysiloxane B1 preferably contains at least a polydimethylsiloxane having vinyl groups at both ends.

[0065] The viscosity of organopolysiloxane B1 at 25°C may be, for example, 30 to 300 mPa·s, preferably 80 to 120 mPa·s, and more preferably 90 to 110 mPa·s. If the viscosity of organopolysiloxane B1 is 300 mPa·s or less, the viscosity of the first agent tends to be further reduced. If the viscosity of organopolysiloxane B1 is 30 mPa·s or more, the mechanical strength of the cured product, such as the shear displacement and elongation at break, described below, tends to be further improved.

[0066] In this specification, the viscosity of organopolysiloxane at 25°C can be measured using a digital viscometer "DV-1" manufactured by Brookfield Corp. Using an RV spindle set and rotor No. 1, a container is used that can accommodate the rotor and that can hold organopolysiloxane up to the reference line, and the rotor is immersed in the organopolysiloxane, and the viscosity is measured at 25°C and 10 rpm.

[0067] As will be described later, vinyl-modified organopolysiloxane B1 undergoes an addition reaction with hydrosilyl-modified organopolysiloxane E2 contained in the second part in the presence of addition reaction catalyst D1. By appropriately adjusting the numbers of vinyl groups and hydrosilyl groups in vinyl-modified organopolysiloxane B1 and hydrosilyl-modified organopolysiloxane E2 and their viscosities, it is possible to control the viscosity of the first and second parts, as well as the curing rate when the first and second parts are mixed.

[0068] The content of the vinyl-modified organopolysiloxane B1 is preferably 60 to 99 wt %, more preferably 70 to 98 wt %, and even more preferably 80 to 95 wt %, based on the total of all components of the first agent other than the thermally conductive filler C1. When the content of the vinyl-modified organopolysiloxane B1 is within the above range, the viscosity of the first agent tends to be further reduced.

[0069] 1.5.1.3. Thermally conductive filler C1 The thermally conductive filler C1 is a filler having thermal conductivity. The thermal conductivity of the thermally conductive filler C1 is not particularly limited, but may be, for example, 10 W / m·K or more, 20 W / m·K or more, or 30 W / m·K or more. The upper limit of the thermal conductivity of the thermally conductive filler C1 is not particularly limited, and may be, for example, 400 W / m·K or 300 W / m·K. Examples of such thermally conductive fillers C1 include, but are not limited to, aluminum oxide (hereinafter also referred to as "alumina"), aluminum nitride, silica, boron nitride, silicon nitride, zinc oxide, aluminum hydroxide, metallic aluminum, magnesium oxide, diamond, carbon, indium, gallium, copper, silver, iron, nickel, gold, tin, metallic silicon, and the like.

[0070] Among these, the first agent preferably contains, as the thermally conductive filler C1, one or more selected from the group consisting of boron nitride, aluminum nitride, aluminum oxide, silicon nitride, silicon oxide, magnesium oxide, metallic aluminum, and zinc oxide, more preferably one or more selected from the group consisting of aluminum oxide, magnesium oxide, aluminum nitride, and metallic aluminum, and even more preferably aluminum oxide powder. This is because the thermally conductive filler has high thermal conductivity, high insulating properties, and is inexpensive. The thermally conductive filler C1 may be used alone or in combination of two or more.

[0071] The thermally conductive filler C1 has an average particle size of preferably 0.05 to 120 μm, more preferably 0.1 to 60 μm. When the average particle size of the thermally conductive filler C1 is within the above range, the fluidity of the first agent and the dispersibility and filling properties of the thermally conductive filler C1 tend to be further improved.

[0072] The thermally conductive filler C1 may be a mixture of fillers with different average particle sizes. Preferably, the thermally conductive filler C1 is a combination of two or more of the thermally conductive filler (C1-1) having an average particle size of 30 to 55 μm, the thermally conductive filler (C1-2) having an average particle size of 1.5 to 25 μm, and the thermally conductive filler (C1-3) having an average particle size of 0.05 to 1.0 μm. It is more preferable to use at least the thermally conductive filler (C1-1) and the thermally conductive filler (C1-2), and even more preferable to use all of the thermally conductive filler (C1-1), the thermally conductive filler (C1-2), and the thermally conductive filler (C1-3).

[0073] The average particle size of thermally conductive fillers can be measured using, for example, a Shimadzu SALD-20 laser diffraction particle size analyzer. The evaluation sample is prepared by adding 50 ml of pure water and 5 g of the thermally conductive filler powder to be measured to a glass beaker, stirring with a spatula, and then dispersing in an ultrasonic cleaner for 10 minutes. The dispersed thermally conductive filler powder solution is then added dropwise to the sampler using a dropper. Once the absorbance stabilizes, measurements can be performed. The laser diffraction particle size analyzer calculates the particle size distribution from the light intensity distribution data of the diffraction / scattering holes detected by the sensor. The average particle size is calculated by multiplying the measured particle size value by the relative particle amount (difference %) and dividing by the total relative particle amount (100%). The average particle size is the average diameter of the particles and can be calculated as the cumulative weight average D50 (median diameter). Note that D50 is the particle size with the highest occurrence rate.

[0074] In this case, the content of the thermally conductive filler (C1-1) is preferably 30 to 70% by weight, more preferably 40 to 60% by weight, based on the total amount of the thermally conductive filler C1. The content of the thermally conductive filler (C1-2) is preferably 10 to 50% by weight, more preferably 20 to 40% by weight, based on the total amount of the thermally conductive filler C1. The content of the thermally conductive filler (C1-3) is preferably 5 to 30% by weight, more preferably 10 to 20% by weight, based on the total amount of the thermally conductive filler C1. The use of the thermally conductive filler C1 as described above tends to further improve the fluidity of the first agent and the dispersibility and filling ability of the thermally conductive filler C1. Note that the average particle size in this specification refers to D50 (median diameter).

[0075] The content of the thermally conductive filler C1 is, for example, 400 to 3000 parts by weight, preferably 1500 to 2400 parts by weight, and more preferably 1700 to 2200 parts by weight, per 100 parts by weight of the vinyl-modified organopolysiloxane B1. When the content of the thermally conductive filler C1 is 400 parts by weight or more, the thermal conductivity of the resulting cured product tends to be further improved, while when it is 3000 parts by weight or less, the viscosity of the first agent tends to be further reduced.

[0076] 1.5.1.4. Addition reaction catalyst D1 The addition reaction catalyst D1 is not particularly limited as long as it catalyzes the addition reaction between the vinyl-modified organopolysiloxane B1 and the hydrosilyl-modified organopolysiloxane E2. Examples of the addition reaction catalyst D1 include platinum compound catalysts, rhodium compound catalysts, and palladium compound catalysts. Among these, platinum compound catalysts are preferred. Use of such an addition reaction catalyst D1 tends to ensure that the curing rate when the first and second parts are mixed can be within a suitable range.

[0077] The platinum compound catalyst is not particularly limited, but examples thereof include simple platinum, platinum compounds, and platinum-supported inorganic powders. The platinum compound is not particularly limited, but examples thereof include chloroplatinic acid, platinum-olefin complexes, platinum-alcohol complexes, platinum coordination compounds, etc. The platinum-supported inorganic powder is not particularly limited, but examples thereof include platinum-supported alumina powder, platinum-supported silica powder, and platinum-supported carbon powder.

[0078] The addition reaction catalyst D1 may be used alone or in combination of two or more. Furthermore, when preparing the first agent, the addition reaction catalyst D1 may be blended alone or in a pre-mixed state with other components, such as the vinyl-modified organopolysiloxane B1 or other organopolysiloxanes.

[0079] The content of addition reaction catalyst D1 is preferably 0.1 to 30 parts by weight, more preferably 0.5 to 20 parts by weight, and even more preferably 1 to 10 parts by weight, per 100 parts by weight of the content of vinyl-modified organopolysiloxane B1. When the content of addition reaction catalyst D1 is within the above range, the curing rate when the first and second parts are mixed tends to be within a suitable range.

[0080] 1.5.1.5. Other ingredients In addition to the above components, the first agent may contain additives such as a colorant and a reaction retarder, if necessary.

[0081] When the first agent contains a colorant, the content of the colorant is preferably 0.001 to 0.2 parts by weight relative to 100 parts by weight of the total amount of the first agent.

[0082] The reaction retarder is not particularly limited as long as it is a component that retards the reaction when the first and second agents are mixed, but examples include alkenyl alcohols, of which 1-ethynyl-1-cyclohexanol is preferred. When the first agent contains a reaction retarder, the content of the reaction retarder is preferably 0.1 to 20 parts by weight, more preferably 0.5 to 10 parts by weight, per 100 parts by weight of the vinyl-modified organopolysiloxane B1. The reaction retarder may not be contained in the first agent, but may be contained only in the second agent.

[0083] The first agent is a compound of the following formula: R 1 a R 2 b Si(OR 3 ) 4-(a+b) (R 1are each independently an alkyl group having 1 to 15 carbon atoms, and R 2 are each independently a saturated or unsaturated monovalent hydrocarbon group having 1 to 8 carbon atoms, and R 3 are each independently an alkyl group having 1 to 6 carbon atoms, a is 1 to 3, b is 0 to 2, and a+b is 1 to 3. It is preferred that the organosilane does not contain an organosilane represented by the formula:

[0084] Although such organosilanes have been conventionally used to improve the wettability of thermally conductive fillers, they are preferably not included in the first part of the two-component curing composition set of this embodiment. In this embodiment, the viscosity of the first part tends to be even lower than when the organosilane is included. The reason for this is not entirely clear, but it is thought that when the first part contains an organosilane, the surfactant A1 and the organosilane compete with each other as components for improving the wettability of the thermally conductive filler, thereby reducing the effect of the surfactant A1.

[0085] R in the above formula 1 Although not particularly limited, examples of R include a methyl group, an ethyl group, a propyl group, a hexyl group, a nonyl group, a decyl group, a dodecyl group, and a tetradecyl group. 1 is preferably an alkyl group having 6 to 12 carbon atoms.

[0086] R in the above formula 2 Examples of the alkyl group include, but are not limited to, alkyl groups such as methyl, ethyl, propyl, hexyl, and octyl; cycloalkyl groups such as cyclopentyl and cyclohexyl; alkenyl groups such as vinyl and allyl; aryl groups such as phenyl and tolyl; aralkyl groups such as 2-phenylethyl and 2-methyl-2-phenylethyl; and halogenated hydrocarbon groups such as 3,3,3-trifluoropropyl, 2-(perfluorobutyl)ethyl, 2-(perfluorooctyl)ethyl, and p-chlorophenyl.

[0087] R in the above formula3 is not particularly limited, and is, for example, an alkyl group having 1 to 6 carbon atoms such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, or a hexyl group, and is preferably a methyl group or an ethyl group.

[0088] In the above formula, a is an integer of 1 to 3, and preferably 1. Furthermore, b is an integer of 0 to 2, and preferably 0. Furthermore, a+b is an integer of 1 to 3, and preferably 1.

[0089] The content of the organosilane in the first agent is preferably 1 part by weight or less, more preferably 0.1 part by weight or less, even more preferably 0.01 part by weight or less, and particularly preferably 0 part by weight (i.e., no organosilane) per 100 parts by weight of the thermally conductive filler C1. By keeping the organosilane content within the above range, the wettability of the thermally conductive filler tends to be effectively improved.

[0090] 1.5.2. Second Agent The second agent preferably contains a surfactant A2, a vinyl-modified organopolysiloxane B2 having a viscosity of 80 to 120 mPa·s, a thermally conductive filler C2, and a hydrosilyl-modified organopolysiloxane E2 having a viscosity of 1 to 100 mPa·s. The second agent may contain other components as necessary.

[0091] 1.5.2.1. Surfactant A2 Specific examples and preferred embodiments of surfactant A2 are the same as those of surfactant A1 contained in the first agent, and therefore redundant explanations will be omitted. Surfactant A1 contained in the first agent and surfactant A2 contained in the second agent may be the same or different.

[0092] In the second agent, the content of surfactant A2 is, for example, 3 to 28 parts by weight, preferably 4 to 25 parts by weight, more preferably 5 to 20 parts by weight, and even more preferably 5 to 15 parts by weight, per 100 parts by weight of the total of vinyl-modified organopolysiloxane B2 and hydrosilyl-modified organopolysiloxane E2. When the content of surfactant A2 is within the above range, the dispersibility of thermally conductive filler C2 is further improved, and the viscosity of the second agent tends to be further reduced.

[0093] 1.5.2.2. Vinyl-modified organopolysiloxane B2 Specific examples and preferred embodiments of the vinyl-modified organopolysiloxane B2 are the same as those of the vinyl-modified organopolysiloxane B1 contained in the first agent, and therefore redundant explanations will be omitted. The vinyl-modified organopolysiloxane B1 contained in the first agent and the vinyl-modified organopolysiloxane B2 contained in the second agent may be the same or different.

[0094] In the second agent, the content of vinyl-modified organopolysiloxane B2 is preferably 30 to 98 parts by weight, more preferably 40 to 95 parts by weight, and even more preferably 45 to 93 parts by weight, per 100 parts by weight of the total of vinyl-modified organopolysiloxane B2 and hydrosilyl-modified organopolysiloxane E2. Having the content of vinyl-modified organopolysiloxane B2 within the above range tends to make it possible to achieve a more suitable curing rate when the first agent and second agent are mixed. Within the above range, the content of vinyl-modified organopolysiloxane B2 may be 90 parts by weight or less, 80 parts by weight or less, or 70 parts by weight or less.

[0095] 1.5.2.3.Thermal Conductive Filler C2 Specific examples and preferred embodiments of the thermally conductive filler C2 are the same as those of the thermally conductive filler C1 contained in the first agent, and therefore, redundant explanations will be omitted. The thermally conductive filler C1 contained in the first agent and the thermally conductive filler C2 contained in the second agent may be the same or different.

[0096] The content of the thermally conductive filler C2 is, for example, 400 to 3000 parts by weight, preferably 1500 to 2400 parts by weight, and more preferably 1700 to 2200 parts by weight, per 100 parts by weight of the total of the vinyl-modified organopolysiloxane B2 and the hydrosilyl-modified organopolysiloxane E2. When the content of the thermally conductive filler C2 is 400 parts by weight or more, the thermal conductivity of the obtained cured product tends to be further improved, while when it is 3000 parts by weight or less, the viscosity of the second agent tends to be further reduced.

[0097] 1.5.2.4. Hydrosilyl-modified organopolysiloxane E2 The hydrosilyl-modified organopolysiloxane E2 (hereinafter also referred to simply as "organopolysiloxane E2") is an organopolysiloxane having a viscosity of 1 to 100 mPa·s and having at least one hydrosilyl group. Organopolysiloxane E2 may have a hydrosilyl group on a side chain and / or at a terminal. Such organopolysiloxanes have a structural unit represented by the following formula (e2-1) or a terminal structure represented by formula (e2-2). Organopolysiloxane E2 may have, for example, at least one of the structural unit represented by formula (e2-1) and the terminal structure represented by formula (e2-2), and a structural unit represented by formula (e2-3).

[0098] [ka] In formulas (e2-1), (e2-2), and (e2-3), R represents any monovalent hydrocarbon group which may have a substituent. That is, in organopolysiloxane E2, any monovalent hydrocarbon group which may have a substituent is bonded to a side chain of the siloxane skeleton.

[0099] Examples of such monovalent hydrocarbon groups include the same monovalent hydrocarbon groups that may be contained in the vinyl-modified organopolysiloxane B1.

[0100] The viscosity of organopolysiloxane E2 at 25°C is 1 to 100 mPa·s, preferably 2 to 80 mPa·s, and more preferably 3 to 50 mPa·s. When the viscosity of organopolysiloxane E2 is 100 mPa·s or less, the viscosity of the second part tends to be further reduced. When the viscosity of organopolysiloxane E2 is 1 mPa·s or more, the mechanical strength of the cured product, such as the shear displacement and elongation at break, described below, tends to be further improved. When organopolysiloxane E2 contains multiple components, it is preferable that the viscosity of each of the multiple components satisfy the above value.

[0101] The organopolysiloxane E2 is contained in the second agent either alone or in combination of two or more. For example, the second agent preferably contains, as organopolysiloxane E2, at least hydrosilyl-modified organopolysiloxane E22 having hydrosilyl groups in side chains, and more preferably contains hydrosilyl-modified organopolysiloxane E21 having hydrosilyl groups at both ends and the hydrosilyl-modified organopolysiloxane E22.

[0102] Organopolysiloxane E21 has at least two hydrosilyl groups at both ends of the organopolysiloxane skeleton. Organopolysiloxane E21 may further have hydrosilyl groups on side chains. Organopolysiloxane E21 may be an organopolysiloxane having hydrosilyl groups only at both ends.

[0103] Organopolysiloxane E22 has at least one hydrogen atom in a side chain of the organopolysiloxane skeleton, and this hydrogen atom and a silicon atom constitute a hydrosilyl group. Organopolysiloxane E22 may further have hydrosilyl groups at both ends of the organopolysiloxane skeleton. The number of hydrosilyl groups in organopolysiloxane E22 is preferably more than 2.0 on average per molecule, more preferably 2.5 or more on average per molecule, and even more preferably 3.0 or more on average per molecule. The upper limit of the hydrosilyl groups in organopolysiloxane E22 is not particularly limited, and may be, for example, 8.0, 6.0, or 5.0 on average per molecule.

[0104] The number of hydrosilyl groups in the organopolysiloxane E2 contained in the second agent is preferably more than 2.0 on average per molecule, and more preferably 2.5 or more on average per molecule. That is, when the second agent contains one type of organopolysiloxane E2, it is preferable that the organopolysiloxane has more than two (i.e., three or more) hydrosilyl groups per molecule. When the second agent contains two or more types of organopolysiloxane E2, it is preferable that the arithmetic average number of hydrosilyl groups in each organopolysiloxane is more than 2.0.

[0105] Because the number of hydrosilyl groups in organopolysiloxane E21 and organopolysiloxane E22 can be controlled separately as described above, by appropriately mixing the two, it tends to be possible to control the viscosity of the second part while also controlling its reactivity with the first part. In particular, when the second part contains organopolysiloxane E22, it tends to form a network structure when reacted with vinyl-modified organopolysiloxanes B1 and B2, resulting in a cured product with superior mechanical strength, such as shear displacement and elongation at break.

[0106] The average number of hydrosilyl groups per molecule of organopolysiloxane E2 can be measured by NMR. Specifically, for example, an ECP-300NMR (manufactured by JEOL) can be used to dissolve organopolysiloxane E2 in deuterated chloroform as a deuterated solvent. The average number of hydrosilyl groups per molecule can be calculated by dividing the measurement result thus obtained by the average molecular weight of organopolysiloxane E2.

[0107] The viscosity of organopolysiloxane E21 at 25°C is preferably 5 to 100 mPa·s, more preferably 10 to 80 mPa·s, and even more preferably 15 to 50 mPa·s. If the viscosity of organopolysiloxane E21 is 100 mPa·s or less, the viscosity of the second part tends to be further reduced. If the viscosity of organopolysiloxane E21 is 5 mPa·s or more, the mechanical strength of the cured product, such as the shear displacement and elongation at break, described below, tends to be further improved.

[0108] The viscosity of organopolysiloxane E22 at 25°C is preferably 1 to 100 mPa·s, more preferably 2 to 90 mPa·s, and even more preferably 3 to 80 mPa·s. When the viscosity of organopolysiloxane E22 is 100 mPa·s or less, the viscosity of the second part tends to be further reduced. When the viscosity of organopolysiloxane E22 is 1 mPa·s or more, the mechanical strength of the cured product, such as the shear displacement and elongation at break, described below, tends to be further improved. The viscosity of organopolysiloxane E22 at 25°C may be 50 mPa·s or less, or 20 mPa·s or less, within the above range. Alternatively, in another embodiment, the viscosity of organopolysiloxane E22 at 25°C may be 60 to 80 mPa·s, within the above range.

[0109] In the second agent, the content of hydrosilyl-modified organopolysiloxane E2 is preferably 2 to 70 parts by weight, more preferably 5 to 60 parts by weight, and even more preferably 7 to 55 parts by weight, per 100 parts by weight of the total of vinyl-modified organopolysiloxane B2 and hydrosilyl-modified organopolysiloxane E2. Having the content of hydrosilyl-modified organopolysiloxane E2 within the above range tends to make it possible to achieve a more suitable curing rate when the first agent and second agent are mixed. Within the above range, the content of hydrosilyl-modified organopolysiloxane E2 may be 10 parts by weight or more, 20 parts by weight or more, or 30 parts by weight or more.

[0110] The total content of the vinyl-modified organopolysiloxane B2 and the hydrosilyl-modified organopolysiloxane E2 is preferably 60 to 99% by weight, more preferably 70 to 98% by weight, and even more preferably 80 to 95% by weight, based on the total of all components other than the thermally conductive filler C1 in the second part. By keeping the content within the above range, the viscosity of the second part tends to be further reduced, and the curing rate when the first and second parts are mixed tends to be within a more suitable range.

[0111] 1.5.2.5. Reaction retarder F2 The reaction retarder F2 is an additive that is optionally added to control the reaction between the hydrosilyl group and the vinylsilyl group. In this embodiment, it is preferable that the first part contains the addition reaction catalyst D1 and the second part contains a reaction retarder. The reaction retarder F2 is not particularly limited as long as it is a component that delays the reaction when the first part and the second part are mixed, but examples thereof include alkenyl alcohols, and 1-ethynyl-1-cyclohexanol is particularly preferred. The use of such a reaction retarder F2 tends to make it possible to keep the curing rate when the first part and the second part are mixed within a suitable range.

[0112] When the second part contains reaction retarder F2, the content of reaction retarder F2 is preferably 0.1 to 20 parts by weight, and more preferably 0.5 to 10 parts by weight, per 100 parts by weight of the total of vinyl-modified organopolysiloxane B2 and hydrosilyl-modified organopolysiloxane E2. By having the content of reaction retarder F2 within the above range, the curing rate when the first part and second part are mixed tends to be within a suitable range.

[0113] Other ingredients In addition to the above components, the second agent may contain additives such as colorants as necessary. Specific examples, preferred embodiments, content, and other details of the colorants are the same as those of the first agent, and redundant explanations will be omitted. The additives contained in the first agent and the additives contained in the second agent may be the same or different.

[0114] The second agent is a compound of the following formula: R 1 a R 2 b Si(OR 3 ) 4-(a+b) (R 1 are each independently an alkyl group having 1 to 15 carbon atoms, and R 2 are each independently a saturated or unsaturated monovalent hydrocarbon group having 1 to 8 carbon atoms, and R 3 are each independently an alkyl group having 1 to 6 carbon atoms, a is 1 to 3, b is 0 to 2, and a+b is 1 to 3. It is preferable that the second agent does not contain an organosilane represented by the following formula: By not containing the above organosilane, the viscosity of the second agent tends to be further reduced.

[0115] The specific aspects of the organosilane are the same as those of the organosilanes that are preferably not contained in the first agent, and the preferred content of the organosilane in the second agent is also the same as that in the first agent.

[0116] 1.6.Applications The two-component curing composition set of the present embodiment can be suitably used as a thermally conductive heat-dissipating material such as thermally conductive grease.

[0117] 2.Cured product The cured product of this embodiment is obtained by mixing the first and second parts of the two-component curing composition set described above. More specifically, the cured product (crosslinked cured product) is obtained by mixing the first and second parts and allowing two or more reactive groups to undergo addition reaction, condensation reaction, radical reaction, or the like in the mixture obtained. In one aspect of this embodiment described above, in which the first part contains a vinyl-modified organopolysiloxane and the second part contains a vinyl-modified organopolysiloxane and a hydrosilyl-modified organopolysiloxane, the cured product is obtained by an addition reaction between the vinyl groups of the vinyl-modified organopolysiloxanes B1 and B2 and the hydrosilyl groups of the hydrosilyl-modified organopolysiloxane E2.

[0118] After mixing the first and second parts, the mixture can be molded into a desired shape before curing to obtain a cured product having a desired shape. In addition, since the cured product of this embodiment contains a thermally conductive filler, it can be suitably used as a thermally conductive heat dissipation material.

[0119] To mix the first and second components, a mixer such as a roll mill, kneader, Banbury mixer, or line mixer is used. More specifically, examples include kneading methods using a universal mixer, hybrid mixer, Trimix (manufactured by Inoue Seisakusho), or static mixer. The preferred molding method is a doctor blade method, but depending on the viscosity of the resin, extrusion, pressing, or calendar roll methods may also be used. The reaction conditions for the addition reaction are not particularly limited, but are typically carried out at room temperature (e.g., 25°C) to 150°C for 0.1 to 24 hours.

[0120] The mixing ratio of the first agent and the second agent can be set appropriately depending on the type of the first agent and the second agent used and the purpose of use, but for example, the volume ratio of first agent:second agent may be 1.5:1.0 to 1.0:1.5, or may be 1.0:1.0.

[0121] 3.Electronic equipment The electronic device of this embodiment includes an electronic component, a cured product, and a heat sink, and the electronic component and the heat sink are in contact with each other via the cured product.

[0122] Here, the electronic component is not particularly limited, but examples thereof include heat-generating electronic components such as a motor, a battery pack, a circuit board mounted on an in-vehicle power supply system, a power transistor, a microprocessor, etc. Furthermore, the heat sink is not particularly limited, but examples thereof include a housing, particularly a metal housing, etc. [Example]

[0123] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to the following examples.

[0124] 1.Synthesis of surfactants 1.1. Raw materials ((Meth)acrylic monomer α having a carboxy group) Acrylic acid, manufactured by Toagosei

[0125] ((Meth)acrylic monomer β having a tertiary amino group) 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate, ADEKA Corporation "ADEKA STAB LA-82"

[0126] ((Meth)acrylic monomer γ having a siloxane skeleton) (γ-1)α-butyl-ω-(3-methacryloxypropyl)polydimethylsiloxane), JNC Corporation "Silaplane FM-0725" number average molecular weight 10,000 (γ-2)α-butyl-ω-(3-methacryloxypropyl)polydimethylsiloxane), JNC Corporation "Silaplane FM-0721" number average molecular weight 5000 (γ-3)α-butyl-ω-(3-methacryloxypropyl)polydimethylsiloxane), JNC Corporation "Silaplane FM-0711" number average molecular weight 1000

[0127] 1.2.Surfactant 1 Surfactant 1 was synthesized as follows. First, 1.5 parts by weight of acrylic acid, 0.5 parts by weight of 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate, and 98.0 parts by weight of α-butyl-ω-(3-methacryloxypropyl)polydimethylsiloxane (γ-1) were added to an autoclave equipped with a stirrer. Next, 0.05 parts by weight of azobisisobutyronitrile (manufactured by Tokyo Chemical Industry Co., Ltd.) was added as an initiator relative to 100 parts by weight of the total (meth)acrylic monomers, and 1,000 parts by weight of a mixed solution of toluene (special reagent grade) and isopropyl alcohol (special reagent grade) in a volume ratio of 7:3 was added as a solvent, and the atmosphere inside the autoclave was replaced with nitrogen. The autoclave was then heated in an oil bath at 65°C for 20 hours to carry out radical polymerization. After polymerization was completed, the mixture was degassed under reduced pressure at 120°C for 1 hour to obtain Surfactant 1.

[0128] The polymerization rate relative to 100% of the monomer charge was analyzed by gas chromatography and found to be 98% or more. From this, it was estimated that the ratio of each monomer unit in the surfactant was approximately the same as the ratio of the monomer charge.

[0129] The weight-average molecular weight of the resulting surfactant 1 was determined as a weight-average molecular weight converted into standard polystyrene using a GPC (gel permeation chromatography) method under the following measurement conditions. High-speed GPC equipment: Tosoh Corporation "HLC-8020" Columns: One Tosoh "TSK guardcolumn MP (x L)" 6.0 mm ID x 4.0 cm, and two Tosoh "TSK-GELMULTIPOREHXL-M" 7.8 mm ID x 30.0 cm (16,000 theoretical plates), for a total of three (total theoretical plate count: 32,000). Developing solvent: tetrahydrofuran Detector: RI (differential refractometer)

[0130] 1.3.Surfactants 2-14 Using the composition ratios of the (meth)acrylic monomers listed in Table 1, surfactants 2 to 14 were obtained by radical polymerization in the same manner as surfactant 1, except that the mixing ratio of toluene and isopropyl alcohol was adjusted to control the solubility of the monomers and the weight-average molecular weight of the surfactant. The polymerization rates of the obtained surfactants 2 to 14 were all 98% or higher, and the ratios of the monomer units contained in the surfactants were estimated to be approximately the same as the monomer charging ratios. The weight-average molecular weights were also determined in the same manner as above.

[0131] The monomer compositions are shown in weight percent in Table 1. The weight ratio of α-butyl-ω-(3-methacryloxypropyl)polydimethylsiloxane was calculated based on its number average molecular weight.

[0132] [Table 1]

[0133] 2. Preparation of the first agent First parts I-1 to I-30 were prepared by mixing components A1 to D1 shown below according to the compounding ratios (parts by weight) shown in Table 2. The components were mixed using a hybrid mixer ARE-310 (trade name, manufactured by Thinky Corporation).

[0134] [A1: Surfactant] A1-1 to A1-14: Surfactants 1 to 14 obtained by the above synthesis method (A1-1 to A1-14 correspond to surfactants 1 to 14, respectively.) A1-15: Z6210 (trade name, manufactured by Dow-Toray Industries, Inc.), n-decyltrimethoxysilane

[0135] [B1: Vinyl-modified organopolysiloxane] B1-1: RH-Vi100E (manufactured by Runhe Chemical Industry, product name), vinyl-modified organopolysiloxane, viscosity at 25°C: 105 mPa·s, average number of vinyl groups per molecule: 2, linear structure, vinyl group bonding positions: both terminals B1-2: 621V100 (trade name, manufactured by Elkem Silicones), vinyl-modified organopolysiloxane, viscosity at 25°C: 100 mPa·s, average number of vinyl groups per molecule: 2, linear structure, vinyl group bonding positions: both terminals B1-3: SE1885A (trade name, manufactured by Dow Chemical Japan), vinyl-modified organopolysiloxane, viscosity at 25°C: 500 mPa·s

[0136] [C1: Thermally conductive filler] C1-1: DAW45S (product name, manufactured by Denka), spherical alumina, average particle size: 45 μm, thermal conductivity: 35 W / m·K C1-2: DAW05 (product name, manufactured by Denka), spherical alumina, average particle size: 5 μm, thermal conductivity: 35 W / m·K C1-3: ASFP40 (product name, manufactured by Denka), ultrafine alumina, average particle size: 0.4 μm, thermal conductivity 35 W / m·K C1-4: DMG60 (product name, manufactured by Denka), magnesium oxide, average particle size: 60 μm, thermal conductivity 60 W / m·K C1-5: AN-HF50LG (product name, manufactured by Combustion Synthesis Co., Ltd.), aluminum nitride, average particle size: 50 μm, thermal conductivity 170 W / m·K C1-6: Al-63μm (product name, manufactured by Hikari Materials Industry Co., Ltd.), metallic aluminum, average particle size: 63μm, thermal conductivity 240W / m·K C1-7: DAW70 (product name, manufactured by Denka), spherical alumina, average particle size: 70 μm, thermal conductivity: 35 W / m·K

[0137] [D1: Addition reaction catalyst] D1-1: Platinum complex polymethylvinylsiloxane solution (manufactured by Blue Star Silicones, product name: Silicolyse Catalyst 12070)

[0138] [Table 2]

[0139] 3. Preparation of the Second Agent Second parts II-1 to II-34 were prepared by mixing the following components A2 to C2, E2, and F2 according to the blending ratios (parts by weight) shown in Table 3. The components were mixed using a hybrid mixer ARE-310 (trade name, manufactured by Thinky Corporation).

[0140] [A2: Surfactants] A2-1 to A2-14: Surfactants 1 to 14 obtained by the above synthesis method (A2-1 to A2-14 correspond to surfactants 1 to 14, respectively.) A2-15: Z6210 (trade name, manufactured by Dow Toray Co., Ltd.), n-decyltrimethoxysilane

[0141] [B2: Vinyl-modified organopolysiloxane] B2-1: RH-Vi100E (manufactured by Runhe Chemical Industry, product name), vinyl-modified organopolysiloxane, viscosity at 25°C: 105 mPa·s, average number of vinyl groups per molecule: 2, linear structure, vinyl group bonding positions: both terminals B2-2: 621V100 (trade name, manufactured by Elkem Silicones), vinyl-modified organopolysiloxane, viscosity at 25°C: 100 mPa·s, average number of vinyl groups per molecule: 2, linear structure, vinyl group bonding positions: both terminals

[0142] [C2: Thermally conductive filler] C2-1: DAW45S (product name, manufactured by Denka), spherical alumina, average particle size: 45 μm, thermal conductivity: 35 W / m·K C2-2: DAW05 (product name, manufactured by Denka), spherical alumina, average particle size: 5 μm, thermal conductivity: 35 W / m·K C2-3: ASFP40 (product name, manufactured by Denka), ultrafine alumina, average particle size: 0.4 μm, thermal conductivity: 35 W / m·K C2-4: DMG60 (product name, manufactured by Denka), magnesium oxide, average particle size: 60 μm, thermal conductivity 60 W / m·K C2-5: AN-HF50LG (product name, manufactured by Combustion Synthesis Co., Ltd.), aluminum nitride, average particle size: 50 μm, thermal conductivity: 170 W / m·K C2-6: Al-63μm (product name, manufactured by Hikari Materials Industry Co., Ltd.), metallic aluminum, average particle size: 63μm, thermal conductivity 240W / m·K C2-7: DAW70 (product name, manufactured by Denka Co., Ltd.), spherical alumina, average particle size: 70 μm, thermal conductivity: 35 W / m K

[0143] [E2: Hydrosilyl-modified organopolysiloxane] E2-1: RH-LHC-3 (manufactured by Runhe Chemical Industry Co., Ltd., trade name), hydrosilyl-modified organopolysiloxane, viscosity at 25°C: 5 mPa·s, average number of hydrosilyl groups per molecule: 3 or more, linear structure, hydrosilyl group bonding position: side chain E2-2: 626V30H2.5 (trade name, manufactured by Elkem), hydrosilyl-modified organopolysiloxane, viscosity at 25°C: 30 mPa·s, average number of hydrosilyl groups per molecule: 3 or more, linear structure, hydrosilyl group bonding positions: both terminals and side chains E2-3: RH-H45 (product name, manufactured by Runhe Chemical Industry Co., Ltd.), hydrosilyl-modified organopolysiloxane, viscosity at 25°C: 20 mPa·s, average number of hydrosilyl groups per molecule: 2, linear structure, hydrosilyl group bonding positions: both terminals E2-4: 620V20 (trade name, manufactured by Elkem), hydrosilyl-modified organopolysiloxane, viscosity at 25°C: 20 mPa·s, average number of hydrosilyl groups per molecule: 2, linear structure, hydrosilyl group bonding positions: both terminals E2-5: SE1885B (Dow Chemical Japan, trade name), a mixture of vinyl-modified organopolysiloxane and hydrosilyl-modified organopolysiloxane, viscosity at 25°C: 350 mPa·s

[0144] [F2: Reaction retarder] F2-1: PA90 (trade name, manufactured by Elkem), a mixture of 1-ethynyl-1-cyclohexanol, polyorganosiloxane, and filler

[0145] [Table 3]

[0146] 4. Characteristics of the first and second agents (viscosity) First and second agents at 25°C and a shear rate of 10 s -1 The viscosity at 1000 kJ / s was measured using a rotational rheometer "HANKE MARSIII" manufactured by Thermo Fisher Scientific. Specifically, parallel plates with a diameter of 35 mm were used, with a gap of 0.5 mm, a temperature of 25°C, and a shear rate of 10 s -1 The results are shown in Table 4.

[0147] (Thermal resistance and thermal conductivity) The thermal resistance and thermal conductivity of the first and second parts were measured using a resin material thermal resistance measuring device manufactured by Hitachi Technology Co., Ltd. according to a method in accordance with ASTM D5470.

[0148] Specifically, the first agent and the second agent were each applied to a measurement area of ​​10 mm x 10 mm in thicknesses of 0.2 mm, 0.5 mm, and 1.0 mm, and the thermal resistance values ​​of each were measured.

[0149] Next, the thermal conductivity of the first and second parts was calculated by calculating the slope of the line obtained by plotting the thermal resistance value on the vertical axis and the thickness of the first and second parts on the horizontal axis. The measurement results of the thermal resistance value and thermal conductivity are shown in Table 4.

[0150] 5. Mixing of the first and second agents The first and second components were mixed in a 1:1 volume ratio in the combinations shown in Table 4, and the handleability of each first and second component was evaluated. Specifically, the first and second components were placed in a 50 ml (1:1) cartridge in the combination shown in Table 4, capped, and attached to a dispenser gun (product name "MixPac DMA50"). A mixer (9.5 cm long, 12 blades) for mixing the first and second components was attached to the cartridge's outlet, and the components were mixed and dispensed at a 1:1 volume ratio. As a result, the two-component curing composition sets of the Examples, in which the viscosities of the first and second components, as measured by a rotational rheometer, were independently 50 to 120 Pa·s, exhibited good dischargeability and excellent handleability, and were able to easily form cured products. On the other hand, the two-component curing composition sets of Comparative Examples 7, 15, 18, 19, 26, 27, and 29 to 34, in which the viscosities of the first and / or second components exceeded 120 Pa·s, exhibited poor dischargeability and insufficient handleability.

[0151] In addition, the thermal resistance values ​​of the first and second agents at a thickness of 1.0 mm measured by a method conforming to ASTM D5470 are independently 1.4 to 2.1 cm 2 As shown in Table 4, the two-component curing composition set of the example, which had a thermal resistance of 2.1 cm 2 The cured product obtained from the two-component curing composition set of Comparative Example 14, in which the thermal conductivity exceeded 4.7 W / m K, did not have sufficient thermal conductivity, as shown in Table 4. Cured products with a thermal conductivity of 4.7 W / m K or more were evaluated as having excellent thermal conductivity, and those with a thermal conductivity of less than 4.7 W / m K were evaluated as having poor thermal conductivity.

[0152] (Voltage resistance) The first and second components were mixed in a 1:1 volume ratio in the combinations shown in Table 4, and the resulting mixture was molded into a sheet and then heat-cured at 60°C for 20 minutes to obtain a thermally conductive sheet. The breakdown voltage (withstand voltage) of this thermally conductive sheet was measured using a withstand voltage tester TOS5101 manufactured by Kikusui Electronics Co., Ltd. in accordance with JIS C2110. The measurement results are shown in Table 4.

[0153] (Minimum thickness of film that can be formed) The first and second components were mixed in a 1:1 volume ratio in the combinations shown in Table 4, and the resulting mixture was applied to the measurement surface of a resin material thermal resistance measuring device manufactured by Hitachi Technologies, Ltd., and a 50 N load was applied to a measurement area of ​​10 mm x 10 mm. The thickness of the mixture at this time was taken as the minimum thickness of the film that could be formed. The measurement results are shown in Table 4.

[0154] [Table 4] [Industrial Applicability]

[0155] The two-component curing composition set of this embodiment has industrial applicability as a material for thermally bonding a heat generating element and a heat sink, in particular, to a thermally conductive cured product obtained by mixing and curing the first and second parts.

Claims

1. A first agent and a second agent are provided, The thermal resistance values ​​of the first and second parts at a thickness of 1.0 mm measured by a method in accordance with ASTM D5470 are each independently 1.4 to 2.1 cm 2 ° C. / W, the first agent and the second agent each independently have a viscosity of 50 to 120 Pa s as measured by a rotational rheometer; the first agent comprises a surfactant A1, a vinyl-modified organopolysiloxane B1 having a viscosity of 80 to 120 mPa·s, a thermally conductive filler C1, and an addition reaction catalyst D1; the second agent comprises a surfactant A2, a vinyl-modified organopolysiloxane B2 having a viscosity of 80 to 120 mPa·s, a thermally conductive filler C2, and a hydrosilyl-modified organopolysiloxane E2 having a viscosity of 1 to 100 mPa·s; Two-component curing composition set.

2. the vinyl-modified organopolysiloxane B1 and the vinyl-modified organopolysiloxane B2 each independently have an average of 2.0 or more vinyl groups per molecule, The hydrosilyl-modified organopolysiloxane E2 has an average of more than 2.0 hydrosilyl groups per molecule. The two-component curing composition set according to claim 1 .

3. In the first agent, the amount of the vinyl-modified organopolysiloxane B1 is 100 parts by weight. The content of the surfactant A1 is 5 to 25 parts by weight, The content of the thermally conductive filler C1 is 1500 to 2400 parts by weight. The two-component curing composition set according to claim 1 .

4. In the second agent, for a total of 100 parts by weight of the vinyl-modified organopolysiloxane B2 and the hydrosilyl-modified organopolysiloxane E2, The content of the surfactant A2 is 5 to 25 parts by weight, The content of the thermally conductive filler C2 is 1500 to 2400 parts by weight. The two-component curing composition set according to claim 1 .

5. The surfactant A1 and the surfactant A2 are copolymers having (meth)acrylic monomer units α having a carboxy group, (meth)acrylic monomer units β having a tertiary amino group, and (meth)acrylic monomer units γ having a siloxane skeleton. The two-component curing composition set according to claim 1 .

6. The number average molecular weight of the monomer unit γ is 1,500 to 50,000. The two-component curing composition set according to claim 5 .

7. In the copolymer, relative to 100 parts by weight in total of the monomer units α, β, and γ, the content of the monomer unit α is 0.08 to 6.0 parts by weight, the content of the monomer unit β is 0.02 to 4.0 parts by weight, the content of the monomer unit γ is 90.0 to 99.9 parts by weight; The two-component curing composition set according to claim 5 .

8. The surfactant A1 and the surfactant A2 each independently have a weight average molecular weight of 20,000 to 150,000. The two-component curing composition set according to claim 1 .

9. The hydrosilyl-modified organopolysiloxane E2 comprises a hydrosilyl-modified organopolysiloxane E21 having hydrosilyl groups at both ends and a hydrosilyl-modified organopolysiloxane E22 having hydrosilyl groups in side chains. The two-component curing composition set according to claim 1 .

10. The thermally conductive filler C1 and the thermally conductive filler C2 are each independently one or more selected from the group consisting of boron nitride, aluminum nitride, aluminum oxide, silicon nitride, silicon oxide, magnesium oxide, metallic aluminum, and zinc oxide. The two-component curing composition set according to claim 1 .

11. The thermally conductive filler C1 and the thermally conductive filler C2 contain aluminum oxide powder. The two-component curing composition set according to claim 10.

12. the first agent and the second agent are mixed in equal volumes, molded into a sheet, and then heat-cured at 60°C for 20 minutes, resulting in a sheet having a withstand voltage of 8 kV / mm or more as measured in accordance with JIS C2110; The two-component curing composition set according to claim 1 .

13. The thickness of the mixture when a load of 50 N is applied per 10 mm x 10 mm area to a mixture obtained by mixing the first agent and the second agent in equal volumes is 70 to 120 μm. The two-component curing composition set according to claim 1 .

14. The first agent and the second agent are represented by the following formula: R 1 a R 2 b Si(OR 3 ) 4-(a+b) (R 1 are each independently an alkyl group having 1 to 15 carbon atoms, and R 2 are each independently a saturated or unsaturated monovalent hydrocarbon group having 1 to 8 carbon atoms, and R 3 are each independently an alkyl group having 1 to 6 carbon atoms, a is 1 to 3, b is 0 to 2, and a+b is 1 to 3. does not contain organosilane represented by The two-component curing composition set according to claim 1 .

15. Used as a thermally conductive heat dissipation material, The two-component curing composition set according to any one of claims 1 to 14.

16. The two-component curing composition set according to any one of claims 1 to 14, wherein the two-component curing composition set is obtained from a mixture of the first and second components. cured product.

17. Used as a thermally conductive heat dissipation material, The cured product according to claim 16.

18. An electronic component, the cured product according to claim 17, and a heat sink, the electronic component and the heat sink are in contact with each other via the cured product. electronic equipment.

Images