Memory cards and host devices

Abstract

This memory card can be inserted into and removed from a connector provided in a host device and comprises: a memory that stores heat-dissipating portion information related to the heat-dissipating portion of the memory card; and a processor that sends a response including the heat-dissipating portion information to a heat dissipation performance inquiry command sent from the host device.

Description

[Technical Field]

[0001] The present disclosure relates to a memory card and a host device with improved heat dissipation performance. [Background technology]

[0002] Patent Document 1 discloses an apparatus for managing heat dissipation from a pluggable functional module for a portable computer, and a user-operable release means for releasing the docked module. The apparatus includes a device with a deformable heat sink structure that can contact the docked module to extract waste heat, thereby absorbing waste heat from the functional module. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 10-502755 Summary of the Invention

[0004] The present disclosure provides a memory card that allows appropriate communication between the memory card and a host device into which the memory card is inserted, and enables the host device to implement control that takes heat dissipation performance into consideration.

[0005] One aspect of the present disclosure provides a memory card that can be inserted into or removed from a connector provided in a host device, the memory card having a memory that stores heat dissipation section information regarding the heat dissipation section of the memory card, and a processor that returns a response including the heat dissipation section information in response to a command sent from the host device inquiring about heat dissipation performance.

[0006] The memory card of the present disclosure can realize control that takes heat dissipation performance into consideration when communicating with a host device. [Brief explanation of the drawings]

[0007] [Figure 1] Schematic diagram showing a memory card and a connector mounted on a host device board according to the first embodiment. [Figure 2] Schematic diagram showing a memory card and a connector mounted on a host device board in a second embodiment. [Figure 3] 10 is a schematic diagram showing a memory card and a connector mounted on a host device board according to a third embodiment. [Figure 4] Sequence diagram of the host device and memory card in the first embodiment [Figure 5] Sequence diagram of the host device and memory card in the second embodiment [Figure 6] Sequence diagram of the host device and memory card in the third embodiment [Figure 7] Schematic diagram of a memory card according to the first embodiment [Figure 8] Schematic diagram of a connector according to the first embodiment [Figure 9] Table of information on the presence or absence of a heat dissipation unit and its position information in the first embodiment [Figure 10] Table of material information of heat dissipation part in embodiment 1 [Figure 11] 1A and 1B are a plan view and a cross-sectional view of a connector and a memory card according to a first embodiment; DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, more detailed explanation than necessary may be omitted. For example, detailed explanation of well-known matters or redundant explanation of substantially the same configuration may be omitted. This is to avoid unnecessary redundancy in the following explanation and to facilitate understanding by those skilled in the art.

[0009] The accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

[0010] (Embodiment 1) Hereinafter, the first embodiment will be described with reference to FIGS. 1, 4, and 7 to 11.

[0011] [1-1.Configuration] FIG. 1 is a schematic diagram showing a memory card according to a first embodiment and a connector mounted on a board of a host device.

[0012] The description will be based on the diagram in the upper part of FIG. 1 showing a state in which the memory card 101 has been removed.

[0013] A substrate 105 of the host device is equipped with a connector 103 into which a memory card 101 can be inserted and removed. The connector 103 is equipped with a heat absorption unit 104. The heat absorption unit 104 is made of a material with high thermal conductivity so that heat from the memory card 101 is efficiently conducted to the connector. The heat absorption unit 104 is configured to contact an inserted memory card. The substrate 105 also includes a control unit capable of transmitting and receiving electrical signals. An SoC (System On Chip) 106 is an example of the control unit. The SoC 106 is connected to the connector 103 via a signal line 107, and can transmit electrical signals from the SoC 106 to the connector 103. Information (heat absorption unit information) such as the position and shape of the heat absorption unit 104 equipped on the connector 103 is determined when the host device is manufactured. Therefore, the information is stored and maintained in a storage unit 110, such as a nonvolatile memory, mounted on the host device at the time of manufacture, and the SoC 106 can use the information. The host device further includes an air-cooling fan 111. Note that the storage unit 110 and the cooling fan 111 may not be shown in the figures other than the upper part of FIG.

[0014] Typically, a host device requires a DRAM (Dynamic Random Access Memory) and other peripheral components, but these are omitted as they are not directly related to the contents of this disclosure.

[0015] The memory card 101 includes a heat dissipation unit 102 for dissipating heat within the memory card 101. The heat dissipation unit 102 is made of a material with a higher thermal conductivity than the housing of the memory card 101. The heat dissipation unit 102 is located at a position that comes into contact with the heat absorption unit 104 when the memory card 101 is inserted into the connector 103. The memory card 101 further includes a memory 108 and a processor 109.

[0016] The bottom part of FIG. 1 shows a state in which the memory card 101 is inserted into the connector 103.

[0017] When the memory card 101 is inserted into a connector 103 mounted on a board 105 of a host device, a command in the form of an electrical signal from the SoC 106 is received by the memory card 101 via the connector 103. The memory card 101 can analyze the received electrical signal and transmit an appropriate response in the form of an electrical signal to the SoC 106.

[0018] The shape of connector 103 will be explained using Figure 11. Figure 11 shows a plan view and a cross-sectional view of connector 103 and memory card 101. This cross-sectional view is a cutaway view of the plan view taken along plane AB. The cross-section of heat absorption part 104 is spring-like and semi-cylindrical. In other words, the shape of heat absorption part 104 is convex. This is to ensure reliable adhesion with heat dissipation part 102 for heat dissipation.

[0019] A signal terminal 1101 of the connector is arranged to contact a signal terminal 1102 of the inserted memory card 101. Commands and responses are exchanged via this contact point.

[0020] Although only one signal terminal is depicted in the cross-sectional view of Figure 11, multiple terminals are actually present. Also, connector 103 typically has other required components and mechanisms, but these are omitted as they are not directly related to the contents of this disclosure.

[0021] [1-2-1. Operation] The operation of the memory card 101 configured as above will be explained below.

[0022] FIG. 4 is a sequence diagram for explaining the operations of the host device and the memory card 101 inserted into the connector 103 of the board 105 of the host device.

[0023] The memory card 101 is inserted into a connector 103 on a board 105 of the host device. The connector 103 is connected to an SoC 106 mounted on the host device via a signal line 107, and notifies the SoC 106 of the information that the memory card 101 has been inserted (S401).

[0024] The SoC 106 detects the insertion of the memory card 101 (S402). The SoC 106 transmits a command to the memory card 101 via the signal line 107. The memory card 101 analyzes the command and returns an appropriate response. These commands and responses are repeated multiple times to execute the initialization process (S403). After the initialization process, the memory card 101 is ready for data writing, reading, erasing, and other operations.

[0025] SoC 106 issues a command to memory card 101 requesting heat dissipation unit information (S404). Processor 109 of memory card 101 returns a response including the heat dissipation unit information stored in memory 108 (S405). SoC 106 calculates the heat dissipation performance from the heat dissipation unit information included in the response and the heat absorption unit information already stored in connector 103. For example, if the positions of heat dissipation unit 102 and heat absorption unit 104 match and the materials of heat dissipation unit 102 and heat absorption unit 104 have high thermal conductivity, SoC 106 calculates that the heat dissipation performance is high (S406).

[0026] If it is determined that the heat dissipation performance is high, the SoC 106 determines that high-speed writing and reading that generate a lot of heat can be performed (S407). Thereafter, the SoC 106 performs high-speed writing and reading to the memory card 101 as necessary (S408).

[0027] [1-2-2. Calculation of transmitted and received information and heat dissipation performance] 7 to 10, the heat dissipation unit information exchanged between the SoC 106 mounted on the host substrate and the memory card 101 will be described.

[0028] Figure 7 shows a schematic representation of the positions of heat dissipation sections on memory cards. Memory card 701 with heat dissipation section position A has the heat dissipation section located at the front when inserted into the connector. Memory card 702 with heat dissipation section position B has the heat dissipation section located at the rear when inserted into the connector. Memory card 703 with heat dissipation section position C has the heat dissipation section located across the entire surface. Memory card 704 with heat dissipation section position D has the heat dissipation section located on the right side when inserted into the connector. Memory card 705 with heat dissipation section position E has the heat dissipation section located on the left side when inserted into the connector.

[0029] Figure 8 is a schematic representation of the positions of the heat absorption parts provided on connectors. Connector 801 with heat absorption part position A has the heat absorption part located in front of the memory card in the insertion direction. Connector 802 with heat absorption part position B has the heat absorption part located behind the memory card in the insertion direction. Connector 803 with heat absorption part position C has the heat absorption part located so as to cover the entire memory card. Connector 804 with heat absorption part position D has the heat absorption part located on the right side of the memory card in the insertion direction. Connector 805 with heat absorption part position E has the heat absorption part located on the left side of the memory card in the insertion direction.

[0030] 9 shows an example of how to represent the information on the presence or absence of a heat sink (information indicating whether the memory card has a heat sink) and location information included in a response sent by a memory card. The information on the presence or absence of a heat sink and its location indicates whether the memory card has a heat sink and its location. A value of "000" indicates that the memory card does not have a heat sink, while a value of "001" indicates that the memory card has a heat sink and that the card is memory card 701 at heat sink position A. A value of "010" indicates that the memory card has a heat sink and that the card is memory card 702 at heat sink position B. Similarly, values ​​of "001," "100," and "101" indicate that the memory card is memory card 703 at heat sink position C, memory card 704 at heat sink position D, and memory card 705 at heat sink position E, respectively.

[0031] Figure 10 shows an example of how material information is represented in a response sent by a memory card. The heat sink material name indicates the material name of the heat sink part of the memory card. A value of "000" indicates copper, while "001" indicates aluminum. Similarly, "010," "011," and "100" indicate silver, gold, and epoxy resin, respectively.

[0032] The thermal conductivity of the heat sink indicates the thermal conductivity of the heat sink of the memory card. A value of "000" indicates 400 W / mK or more, while "001" indicates 300 W / mK or more but less than 400 W / mK. Similarly, "010" and "011" indicate 200 W / mK or more but less than 300 W / mK and less than 200 W / mK, respectively.

[0033] Let us take an example where the material names shown in Figure 10 are used as the material information for the heat sink. In response to a command from SoC106 requesting heat sink information, memory card 101 returns a response including the presence or absence of a heat sink, position information "001", and the material name of the heat sink "000". From this information, SoC106 can determine that the memory card 701 is at heat sink position A and that its material is copper. SoC106 also knows the connector information, and if the connector 801 is at heat sink position A, then the positions of the heat sink and heat sink match. Furthermore, because the material is copper, it can be determined that the thermal conductivity is high. From this information, SoC106 can determine that the heat dissipation performance of the memory card 101 inserted into the connector is high.

[0034] [1-3. Effects, etc.] As described above, in the first embodiment, the SoC 106 of the host device issues a command to the inserted memory card 101 requesting heat dissipation unit information. The memory card 101 returns a response including the heat dissipation unit information to the SoC 106. This allows the SoC 106 of the host device to determine whether the inserted memory card 101 has high heat dissipation performance. This makes it easier to determine data write and read speeds appropriate for the heat dissipation performance.

[0035] (Embodiment 2) The second embodiment will be described below with reference to FIGS.

[0036] [2-1.Configuration] FIG. 2 is a schematic diagram showing a memory card according to the second embodiment and a connector mounted on a host device board.

[0037] The explanation will be based on the diagram in the upper part of Figure 2 showing the state in which the memory card has been removed.

[0038] A substrate 105 of the host device is equipped with a connector 103 into which a memory card 201 can be inserted and removed. The connector 103 is equipped with a heat absorption unit 104. The heat absorption unit 104 is made of a material with high thermal conductivity so that heat from the memory card 201 is efficiently conducted to the connector. The heat absorption unit 104 is configured to contact an inserted memory card. The substrate 105 is also equipped with a control unit capable of sending and receiving electrical signals. The SoC 106 is an example of a control unit. The SoC 106 is connected to the connector 103 by a signal line 107, and is capable of transmitting electrical signals from the SoC 106 to the connector 103. Information such as the position and shape of the heat absorption unit 104 equipped on the connector 103 is determined when the host device is manufactured, and is therefore stored and retained in a storage unit (not shown), such as a non-volatile memory, separately installed in the host device during manufacturing, and the SoC 106 can use this information.

[0039] Typically, a host device requires DRAM and other peripheral components, but these are omitted as they are not directly related to the contents of this disclosure.

[0040] The memory card 201 does not have a heat dissipation unit for dissipating heat inside the memory card 201 .

[0041] When the memory card 201 is inserted into the connector 103 mounted on the substrate 105 of the host device, a command in the form of an electrical signal from the SoC 106 is received by the memory card 201 via the connector 103. The memory card 201 can analyze the received electrical signal and transmit an appropriate response in the form of an electrical signal to the SoC 106.

[0042] The bottom part of FIG. 2 shows a state in which a memory card 201 is inserted into the connector 103.

[0043] The shape of the connector 103 is the same as in the first embodiment, and therefore will not be described.

[0044] [2-2. Operation] The operation of the memory card 201 configured as above will be described below. Figure 5 is a sequence diagram for explaining the operation between the host device and the memory card 201 inserted into the connector 103 on the board 105 of the host device. The memory card 201 is inserted into the connector 103 on the board 105 of the host device. The connector 103 is connected to the SoC 106 mounted on the host device by a signal line 107, and notifies the SoC 106 of the information that the memory card 201 has been inserted (S501).

[0045] The SoC 106 detects the insertion of the memory card 201 (S502). The SoC 106 installed in the host device transmits a command to the memory card 201 via the signal line 107. The memory card 201 analyzes the command and returns an appropriate response. These commands and responses are repeated multiple times to execute the initialization process (S503). After the initialization process, the memory card 201 is ready for data writing, reading, erasing, and other operations.

[0046] SoC106 issues a command to memory card 201 requesting heat dissipation unit information (S504). Memory card 201 returns a response including information about the heat dissipation unit that it has (S505). SoC106 calculates the heat dissipation performance from the heat dissipation unit information included in the response and information already held about the heat absorption unit that connector 103 has. For example, if it is determined that no heat dissipation unit is provided, SoC106 calculates that the heat dissipation performance is low (S506).

[0047] If it is determined that the heat dissipation performance is low, the SoC 106 abandons high-speed write and high-speed read, which generate a lot of heat, and determines that continuous execution is possible only for low-speed write and low-speed read (S507). Thereafter, the SoC 106 executes low-speed write and low-speed read to the memory card 201 as necessary (S508).

[0048] The information sent and received and the information used to calculate the heat dissipation performance are the same as in the first embodiment, so only a judgment example will be shown. Take the example of a case where the material names shown in FIG. 10 are used as the material information for the heat dissipation unit. In response to a command from SoC 106 requesting heat dissipation unit information, memory card 201 returns a response including the presence or absence of a heat dissipation unit and its position information as "000," and the material name of the heat dissipation unit as "100." From this information, SoC 106 can determine that the memory card does not have a heat dissipation unit, and that the material of the portion of connector 103 that comes into contact with the heat absorption unit is epoxy resin. SoC 106 knows the connector information, but because memory card 201 does not have a heat dissipation unit, it can determine that the heat dissipation performance is low.

[0049] [2-3. Effects, etc.] As described above, in the second embodiment, the SoC 106 of the host device issues a command requesting heat dissipation unit information to the inserted memory card 201. The memory card 201 returns a response including the heat dissipation unit information to the SoC 106.

[0050] This allows the SoC 106 of the host device to determine whether the inserted memory card 201 has low heat dissipation performance, making it easier to determine data write and read speeds that are suitable for the heat dissipation performance.

[0051] (Embodiment 3) Hereinafter, the third embodiment will be described with reference to FIGS.

[0052] [3-1.Configuration] FIG. 3 is a schematic diagram showing a memory card and a connector mounted on a host device board according to a third embodiment. The following description will be based on the diagram of the memory card removed shown in the upper part of FIG. 3. The host device board 105 is equipped with a connector 103 into which a memory card 301 can be inserted and removed. The connector 103 includes a heat absorption unit 104. The heat absorption unit 104 is made of a material with high thermal conductivity so that heat from the memory card 301 is efficiently conducted to the connector. The heat absorption unit 104 is configured to contact the inserted memory card. The board 105 is also equipped with a control unit capable of transmitting and receiving electrical signals. The SoC 106 is an example of a control unit. The SoC 106 is connected to the connector 103 via a signal line 107, and is capable of transmitting electrical signals from the SoC 106 to the connector 103. Information such as the position and shape of the heat sink 104 in the connector 103 is determined during the manufacture of the host device. The information is stored and maintained in a separate storage unit (not shown), such as a non-volatile memory, installed in the host device during the manufacture, and the SoC 106 can use the information. Typically, a host device requires DRAM and other peripheral components, but these are omitted here as they are not directly relevant to the present disclosure. The memory card 301 includes a heat sink 302 for dissipating heat from the memory card 301. The heat sink 302 is made of a material with a higher thermal conductivity than the housing of the memory card 301. The heat sink 302 is positioned so that it partially contacts the heat sink 104 when inserted into the connector 103. When the memory card 301 is inserted into the connector 103 installed on the board 105 of the host device, commands in the form of electrical signals from the SoC 106 are received by the memory card 301 via the connector 103. The memory card 301 can analyze the received electrical signal and transmit an appropriate electrical response to the SoC 106 .

[0053] 3 shows a state in which memory card 301 is inserted into connector 103. The shape of connector 103 is the same as in the first embodiment, and therefore will not be described.

[0054] [3-2. Operation] The operation of the memory card 301 configured as above will be described below. Figure 6 is a sequence diagram for explaining the operation between the host device and the memory card 301 inserted into the connector 103 on the board 105 of the host device. The memory card 301 is inserted into the connector 103 on the board 105 of the host device. The connector 103 is connected to the SoC 106 mounted on the host device by a signal line 107, and notifies the SoC 106 of the information that the memory card 301 has been inserted (S601).

[0055] The SoC 106 detects the insertion of the memory card 301 (S602). The SoC 106 installed in the host device transmits a command to the memory card 301 via the signal line 107. The memory card 301 analyzes the command and returns an appropriate response. This command and response is repeated multiple times to execute the initialization process (S603). After the initialization process, the memory card 301 is ready for data writing, reading, erasing, and other operations.

[0056] SoC106 issues a command to memory card 301 requesting heat sink information (S604). Memory card 301 returns a response including information about its own heat sink (S605). SoC106 calculates heat sink performance from the heat sink information included in the response and information already stored about the heat sink of connector 103. For example, if the positions of the heat sink and heat sink partially match and the materials of the heat sink and heat sink have high thermal conductivity, SoC106 calculates the heat sink performance to be medium (S606).

[0057] If it is determined that the heat dissipation performance is high, the SoC 106 determines that medium-speed writing and medium-speed reading with medium heat generation are possible (S607). Thereafter, the SoC 106 executes medium-speed writing and medium-speed reading to the memory card 301 as necessary (S608).

[0058] The information to be transmitted and received and the information used to calculate the heat dissipation performance are the same as those in the first embodiment, so only an example of determination will be shown.

[0059] Let's take an example where the material information for the heat sink is the material name shown in Figure 10. In response to a command from SoC106 requesting heat sink information, memory card 301 returns a response including the presence or absence of a heat sink, its position information ("100"), and the material name of the heat sink ("010"). From this information, SoC106 can determine that the memory card 701 is at heat sink position A and that its material is copper. SoC106 also knows the connector information, and if connector 801 is at heat sink position A, the positions of the heat sink and heat sink partially match, indicating that the heat sink performance is medium. Furthermore, since the thermal conductivity of the material is between 200 W / mK and 300 W / mK, it can be determined that the thermal conductivity is also medium. From this information, SoC106 can determine that the heat sink performance of the memory card 301 inserted into the connector is medium.

[0060] [3-3. Effects, etc.] As described above, in the third embodiment, the SoC 106 of the host device issues a command requesting heat dissipation unit information to the inserted memory card 301. The memory card 301 returns a response including the heat dissipation unit information to the SoC 106.

[0061] This allows the SoC 106 of the host device to determine whether the heat dissipation performance of the inserted memory card 301 is medium, making it easier to determine data write and read speeds that are suitable for the heat dissipation performance.

[0062] (Other embodiments) As described above, Embodiments 1 to 3 have been described as examples of the technology disclosed in the present application. However, the technology in the present disclosure is not limited to these, and can be applied to embodiments in which modifications, substitutions, additions, omissions, etc. are made. Furthermore, it is also possible to combine the components described in Embodiments 1 to 3 above to create new embodiments.

[0063] Therefore, other embodiments will be exemplified below.

[0064] In the first to third embodiments, the position and material of the heat dissipation unit have been described as information for calculating the performance of the heat dissipation unit. The information for calculating the performance of the heat dissipation unit may be any information that affects heat dissipation, and therefore this information is not limited to the position and material of the heat dissipation unit. For example, the shape of the heat dissipation unit, such as its length and width, the shape of the memory card itself, the surface area of ​​the memory card itself, whether the memory card has fins, and if so, the orientation of the fins, may also be used.

[0065] In the first to third embodiments, a connector shaped to insert a memory card has been described. The connector may be any connector that can insert and remove a nonvolatile memory, and therefore is not limited to a shape that inserts a memory card. For example, a connector such as an M.2 connector may also be used.

[0066] In the first to third embodiments, the host device limits the write speed to and read speed from the memory card based on the calculated heat dissipation performance. The operation performed by the host device based on the calculated heat dissipation performance may be an operation to compensate for insufficient heat dissipation performance, such as opening the door of the host device's housing to lower the temperature around the memory card, operating the air-cooling fan 111 installed in the host device, or increasing the rotation speed of the air-cooling fan 111. In other words, the host device controls the air-cooling fan 111 based on the calculated heat dissipation performance as an operation to compensate for the heat dissipation performance of the memory card. Alternatively, a warning of insufficient heat dissipation performance may be notified to the host device user.

[0067] It should be noted that the above-described embodiments are intended to illustrate the technology of the present disclosure, and various modifications, substitutions, additions, omissions, etc. may be made within the scope of the claims or their equivalents. [Industrial Applicability]

[0068] The present disclosure is applicable to devices that write and read data while generating heat at high temperatures, specifically digital cameras, movie cameras, smartphones, drones, and the like. [Explanation of symbols]

[0069] 101, 201, 301, 701, 702, 703, 704, 705 memory cards 102, 302 Heat radiation part 103, 801, 802, 803, 804, 805 Connectors 104 Heat absorption part 105 PCB 106 SoC 107 Signal Line 108 memory 109 processors 110 Storage section 111 Air-cooled fan 1101 signal terminal 1102 signal terminal

Claims

1. A memory card that can be inserted into or removed from a connector provided in a host device, a memory for storing heat dissipation unit information relating to the heat dissipation unit of the memory card; a processor that returns a response including the heat dissipation section information in response to a command sent from the host device inquiring about heat dissipation performance.

2. A memory card that can be inserted into or removed from a connector provided in a host device, a memory for storing heat dissipation unit information relating to the heat dissipation unit of the memory card; A memory card comprising: a processor that receives an initialization command sent from the host device, repeatedly returns a response to the host device to complete the initialization process, and then returns a response including information about the heat dissipation unit to a command sent from the host device to inquire about heat dissipation performance.

3. 3. The memory card according to claim 1, wherein the heat dissipation unit information indicates whether the memory card has a heat dissipation unit.

4. 3. The memory card according to claim 1, wherein the heat dissipation unit information is information about the position of the heat dissipation unit.

5. 3. The memory card according to claim 1, wherein the heat dissipation section information is information about the shape of the heat dissipation section.

6. 3. The memory card according to claim 1, wherein the heat dissipation section information is information about the material of the heat dissipation section.

7. The memory card of claim 1 or 2, wherein the heat dissipation section information is a combination of information indicating whether the memory card has a heat dissipation section, information on the position of the heat dissipation section, information on the shape of the heat dissipation section, and information on the material of the heat dissipation section.

8. a connector having a heat absorption part for inserting and removing a memory card; a storage unit for storing heat absorption unit information indicating the position, shape, and material of the heat absorption unit; a control unit capable of utilizing the heat absorption unit information, The control unit issues a command to inquire about the heat dissipation performance of the memory card, receives a response from the memory card that includes heat dissipation unit information, and calculates the heat dissipation performance from the heat absorption unit information and the heat dissipation unit information.

9. The host device according to claim 8 , wherein the control unit limits the speed of writing to and reading from the memory card based on the heat dissipation performance.

10. 10. The host device according to claim 8, wherein the control unit operates to compensate for the heat dissipation performance of the memory card based on the heat dissipation performance.

11. Equipped with more fans, The host device according to claim 10 , wherein the control unit controls the fan based on the heat dissipation performance as an operation to compensate for the heat dissipation performance of the memory card.

12. 10. The host device according to claim 8, wherein the heat absorbing portion has a convex shape.

Images