Photosensitive resin composition, laminate and cured product thereof, and transparent material having the cured product

Abstract

To provide a photosensitive resin composition which enables formation of a cured product that is useful as a transparent material, especially, a material for a transparent antenna of a smart phone or a car navigation employing 5G, and has good resolution, good plating resistance, appropriate transmittance, a suppressed haze value and water vapor transmittance.SOLUTION: There are provided a photosensitive resin composition that contains (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a compound having an unsaturated double bond, (D) a thermosetting resin, and (E) a filler having an average particle size of 120 nm or less, wherein a value of a ratio of total light transmittance at a wavelength of 550 nm to total light transmittance at a wavelength of 430 nm in film thickness of 20 μm of a cured product obtained from the photosensitive resin composition is within a range of 0.90 or more and less than 1.15, and a haze value at a wavelength of 550 nm of the cured product is within a range of more than 0.0% and less than 2.0%; and a cured product of the same.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a photosensitive resin composition, a laminate and a cured product thereof, and a transparent material having the cured product, for example, a transparent protective material for a transparent antenna in a car navigation system, a smartphone, or the like. [Background technology]

[0002] Given the current demand for high-speed, large-capacity data communications, 5G (5th generation mobile communications system) is gaining attention as a mobile communications system that can replace or coexist with the conventional 4G (4th generation mobile communications system). Compared to 4G, 5G has the advantage of significantly improved communication speed and capacity. However, due to the complexity of the circuits that employ 5G, when it is used in the antennas of products such as smartphones or car navigation systems, it may affect the appearance, i.e., design, of the product, and reduce its value. Therefore, in order to alleviate such a situation, one idea that could be considered is to increase the transparency of the entire antenna by constructing the antenna itself, including the protective material, from ultra-fine wiring and transparent materials, thereby maintaining the design of the product. In this regard, various candidates can be given as such transparent materials. For example, Patent Document 1 describes a curable resin composition containing an amide-imide resin, and a cured product obtained from the composition, which has excellent transparency. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5839149 Summary of the Invention [Problem to be solved by the invention]

[0004] However, when targeting transparent antennas in smartphones or car navigation systems that use 5G, protective materials for such antennas must have not only the properties that electronic circuit materials should have, but also high transparency and high gas barrier properties from the perspective of their use as transparent antennas and protecting electronic circuits from various gases. More specifically, such materials are desired to have good resolution, good plating resistance, appropriate transmittance, reduced haze value, and water vapor transmission rate.

[0005] In this regard, the patent document 1 merely describes that the resin composition according to the technology described above is useful as a material for solder resist for printed wiring boards or semiconductor package substrates, but does not specifically propose a material for transparent antennas in products that are premised on the adoption of 5G, or a resin composition that can impart the properties required for such a material.

[0006] Therefore, an object of the present invention is to provide a photosensitive resin composition capable of forming a cured product having good resolution, good plating resistance, appropriate transmittance, reduced haze value, and water vapor permeability, which is useful as a transparent material, particularly as a material for transparent antennas in smartphones or car navigation systems that employ 5G. [Means for solving the problem]

[0007] As a result of intensive research by the present inventors, the above-mentioned problems can be solved by the following: (A) a carboxyl group-containing resin; (B) a photopolymerization initiator; (C) a compound having an unsaturated double bond; (D) a thermosetting resin; (E) a filler having an average particle size of 120 nm or less; A photosensitive resin composition comprising: a cured product obtained from the photosensitive resin composition has a film thickness of 20 μm, and the ratio of the total light transmittance at a wavelength of 550 nm to the total light transmittance at a wavelength of 430 nm is in the range of 0.90 or more and less than 1.15; The haze value of the cured product at a wavelength of 550 nm is in the range of more than 0.0% and less than 2.0%. It has been discovered that this problem can be solved by using a photosensitive resin composition. Of these, a preferred embodiment of the present invention relates to a photosensitive resin composition characterized in that the (A) carboxyl group-containing resin is a resin having a carboxyl group formed by an addition reaction of an acid anhydride. Another preferred embodiment of the present invention relates to a photosensitive resin composition, wherein the (A) carboxyl group-containing resin contains an amide-imide resin obtained by reacting an isocyanurate polyisocyanate synthesized from an isocyanate having an aliphatic structure with a tricarboxylic acid anhydride having an aliphatic structure. Yet another aspect of the present invention relates to a photosensitive resin composition, wherein the thermosetting resin (D) is an epoxy resin having a Gardner color scale of 5 or less. Furthermore, a more preferred embodiment of the present invention relates to a photosensitive resin composition further comprising (F) a thermosetting catalyst that is liquid at a temperature of 20°C or higher and lower than 70°C. Still another aspect of the present invention relates to a photosensitive resin laminate comprising a resin layer obtained by applying the above-mentioned photosensitive resin composition onto a film and drying the applied composition. Yet another aspect of the present invention relates to a cured product obtained by curing the resin layer of the above-mentioned photosensitive resin composition or the photosensitive resin laminate, and a transparent antenna comprising the cured product. In a more preferred embodiment of the present invention, the water vapor permeability of the cured product at a film thickness of 100 μm is 10 g / m 2 / day or less. [Effects of the Invention]

[0008] The cured product obtained from the photosensitive resin composition of the present invention not only exhibits good resolution and good plating resistance, but also has an appropriate transmittance ratio, a reduced haze value, and a water vapor transmission rate. Therefore, it is particularly useful as a transparent material for electronic circuits, particularly as a transparent protective material for transparent antennas in products such as 5G-compatible smartphones and car navigation systems. DETAILED DESCRIPTION OF THE INVENTION

[0009] As described above, the photosensitive resin composition of the present invention is intended to be used, in particular, as a transparent material for a transparent antenna in a 5G-compatible product. Therefore, the component composition of the photosensitive resin composition of the present invention is determined so that the transparency of the cured product satisfies a certain level. Specifically, the transparency of the cured product of the present invention is such that the ratio of the total light transmittance at a wavelength of 550 nm to the total light transmittance at a wavelength of 430 nm at a film thickness of 20 μm (total light transmittance at a wavelength of 550 nm / total light transmittance at a wavelength of 430 nm; hereinafter simply referred to as the "total light transmittance ratio") is in the range of 0.90 or more and less than 1.15, and the haze value of the cured product at a wavelength of 550 nm is in the range of more than 0.0% and less than 2.0%. By specifying the total light transmittance ratio within the above range, the yellowish tinge of the cured product can be suppressed, and by specifying the haze value within the above range, the cloudiness of the cured product can be suppressed. Such total light transmittance can be measured, for example, in accordance with ISO13468 using an integrating sphere device. The haze value can be measured, for example, in accordance with ISO 14782 using an integrating sphere device.

[0010] Furthermore, from the viewpoint of line protection, the photosensitive resin composition according to the present invention is formulated so that the cured product thereof achieves high gas barrier properties. In other words, the photosensitive resin composition according to the present invention is preferably formulated so that the cured product thereof has a more suppressed water vapor transmission rate. More specifically, the cured product of the photosensitive resin composition according to the present invention is formulated so that the water vapor transmission rate of the cured product at a film thickness of 100 μm is 10 g / m 2It is preferable that the dose is less than / day. Such water vapor permeability can be measured, for example, according to JIS Z0208 method.

[0011] The components of the photosensitive resin composition of the present invention will be described below.

[0012] [(A) Carboxyl group-containing resin] The photosensitive resin composition of the present invention employs a resin component into which a carboxyl group has been introduced for the purpose of forming a circuit pattern using exposure and alkaline development. Furthermore, from the viewpoint of the object and application of the present invention, a resin having a structure with high transparency and excellent gas barrier properties must be selected. In the present invention, preferred examples of such (A) carboxyl group-containing resins are resins having carboxyl groups obtained by addition reaction of acid anhydrides. Among these, amide-imide resins, which are particularly excellent in transparency, are preferably used. More preferred (A) carboxyl group-containing resins include amide-imide resins obtained by reacting an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure with a tricarboxylic acid anhydride having an aliphatic structure.

[0013] [Isocyanurate-type polyisocyanates synthesized from isocyanates with aliphatic structures] Examples of the isocyanurate polyisocyanate synthesized from an isocyanate having an aliphatic structure include an isocyanurate polyisocyanate synthesized from an isocyanate having a linear aliphatic structure, and an isocyanurate polyisocyanate synthesized from an isocyanate having an alicyclic structure.

[0014] Examples of isocyanurate polyisocyanates synthesized from isocyanates having a linear aliphatic structure include HDI3N (isocyanurate triisocyanate synthesized from hexamethylene diisocyanate), HTMDI3N (isocyanurate triisocyanate synthesized from trimethylhexamethylene diisocyanate), etc. These may be used alone or in combination.

[0015] Examples of isocyanurate polyisocyanates synthesized from isocyanates having an alicyclic structure include IPDI3N (isocyanurate triisocyanate synthesized from isophorone diisocyanate), HTDI3N (isocyanurate triisocyanate synthesized from hydrogenated tolylene diisocyanate), HXDI3N (isocyanurate triisocyanate synthesized from hydrogenated xylene diisocyanate), NBDI3N (isocyanurate triisocyanate synthesized from norbornane diisocyanate), and HMDI3N (isocyanurate triisocyanate synthesized from hydrogenated diphenylmethane diisocyanate).

[0016] As the isocyanurate polyisocyanate synthesized from an isocyanate having an aliphatic structure used in the present invention, an isocyanurate polyisocyanate synthesized from an isocyanate having an alicyclic structure is preferred, as it can give a cured film (cured product) with a particularly high Tg and excellent thermal properties, and among these, an isocyanurate triisocyanate synthesized from isophorone diisocyanate is preferred.

[0017] The content of the isocyanurate polyisocyanate synthesized from an isocyanate having an alicyclic structure in the isocyanurate polyisocyanate synthesized from an isocyanate having an aliphatic structure is preferably 50 to 80 mass % based on the mass of the isocyanurate polyisocyanate synthesized from an isocyanate having an aliphatic structure, since this results in a cured film (cured product) with a high Tg and excellent thermal properties, more preferably 80 to 100 mass %, and most preferably 100 mass %.

[0018] Furthermore, adducts obtained by urethane reaction of the above isocyanate compounds with various polyols can also be used, provided that the solvent solubility of the (A) carboxyl group-containing resin is not impaired.

[0019] [Tricarboxylic acid anhydrides with aliphatic structures] The carboxyl group-containing resin (A) used in the present invention is synthesized by directly forming an imide bond from the above-mentioned isocyanurate-type polyisocyanate and tricarboxylic acid anhydride, which allows the synthesis of an amide-imide resin with excellent material stability, reproducibility, and solubility, as well as excellent transparency, compared to synthesis via a polyamic acid intermediate. In the present invention, tricarboxylic acids having an aliphatic structure in the molecule are preferably used, particularly to suppress browning of the carboxyl group-containing resin (A) and increase its transparency.

[0020] Examples of the tricarboxylic acid anhydrides having an aliphatic structure include tricarboxylic acid anhydrides having a linear aliphatic structure and tricarboxylic acid anhydrides having an alicyclic structure. Examples of the tricarboxylic acid anhydrides having a linear aliphatic structure include propane tricarboxylic acid anhydride. Examples of the tricarboxylic acid anhydrides having an alicyclic structure include cyclohexane tricarboxylic acid anhydride, methylcyclohexane tricarboxylic acid anhydride, cyclohexene tricarboxylic acid anhydride, methylcyclohexene tricarboxylic acid anhydride, etc.

[0021] Among the tricarboxylic acid anhydrides having an aliphatic structure, tricarboxylic acid anhydrides having an alicyclic structure are preferred because they can give a cured film (cured product) that is transparent, has a high Tg, and is excellent in thermal properties, and it is even more preferred that the isocyanurate polyisocyanate compound is an isocyanurate polyisocyanate synthesized from an isocyanate having an alicyclic structure, and that the tricarboxylic acid anhydride is a tricarboxylic acid anhydride having an alicyclic structure. Examples of tricarboxylic acid anhydrides having an alicyclic structure include cyclohexanetricarboxylic acid anhydride. These can be used alone or in combination with two or more other compounds. In some cases, bifunctional dicarboxylic acid compounds such as adipic acid, sebacic acid, phthalic acid, fumaric acid, maleic acid, and their anhydrides can also be used in combination.

[0022] Examples of the cyclohexanetricarboxylic anhydride include cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride, cyclohexane-1,3,5-tricarboxylic acid-3,5-anhydride, cyclohexane-1,2,3-tricarboxylic acid-2,3-anhydride, etc. Among these, cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride is preferred because it gives an amide-imide resin that is not only transparent but also excellent in solvent solubility, and a cured film (cured product) that has a high Tg and excellent thermal properties can be obtained.

[0023] When the carboxylic acid component of the tricarboxylic acid anhydride reacts with the isocyanate component of the polyisocyanate, imide and amide are formed, resulting in an amide-imide resin. Furthermore, if the tricarboxylic acid anhydride and polyisocyanate are reacted in a ratio that leaves the carboxylic acid component of the tricarboxylic acid anhydride, the resulting polyamide-imide resin will have carboxy groups. These carboxy groups react with polymerizable groups, such as epoxy groups, of the epoxy resin (D) thermosetting resin contained in the photosensitive resin composition of the present invention, described below, to form a crosslinked structure in the cured product. Furthermore, because the reaction rate of imidization is fast, even in the reaction of tricarboxylic acid with triisocyanate, the tricarboxylic acid selectively forms imides at the acid anhydride.

[0024] An isocyanurate polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic acid anhydride having an aliphatic structure are preferably reacted so that the ratio of the number of moles of isocyanate groups (N) of the isocyanurate polyisocyanate synthesized from the isocyanate having an aliphatic structure to the total number of moles of carboxy groups (M1) and acid anhydride groups (M2) of the tricarboxylic acid anhydride having an aliphatic structure [(M1) + (M2)) / (N)] is 1.1 to 3. This is because the polarity in the reaction system is high and the reaction proceeds smoothly, no isocyanate groups remain, resulting in good stability of the resulting polyimide resin, and the amount of remaining tricarboxylic acid anhydride is small, making separation problems such as recrystallization less likely to occur. Of these, a ratio of 1.2 to 2 is more preferred. In the present invention, the acid anhydride group refers to a —CO—O—CO— group obtained by intramolecular dehydration condensation of two carboxylic acid molecules.

[0025] The imidization reaction is preferably carried out by mixing one or more isocyanates having an aliphatic structure with one or more tricarboxylic acid anhydrides in a solvent or without a solvent, and then raising the temperature while stirring. The reaction temperature is preferably 50 to 250°C, and particularly preferably 70 to 180°C. Setting the reaction temperature in this range increases the reaction rate and reduces the occurrence of side reactions, decomposition, etc. The reaction involves decarboxylation, and the acid anhydride group and the isocyanate group form an imide group. The progress of the reaction can be monitored by analytical means such as infrared spectroscopy, acid value determination, and isocyanate group quantification. In the infrared spectrum, the characteristic absorption of the isocyanate group, 2270 cm -1 decreases with the reaction and further increases to 1860cm -1 and 850cm -1 The acid anhydride group, which has a characteristic absorption at 1780cm, decreases. -1 and 1720cm -1The absorption of the imide group increases as the reaction temperature increases. The reaction may be terminated by lowering the temperature while checking the target acid value, viscosity, molecular weight, etc. However, from the viewpoint of stability over time, it is more preferable to continue the reaction until the isocyanate group disappears. Furthermore, during or after the reaction, catalysts, antioxidants, surfactants, other solvents, etc. may be added within a range that does not impair the physical properties of the synthesized resin.

[0026] The acid value of the carboxyl group-containing resin (A) is preferably 70 to 210 KOHmg / g, and particularly preferably 90 to 190 KOHmg / g. If it is 70 to 210 KOHmg / g, excellent performance will be exhibited as cured physical properties. The carboxyl group-containing resin (A) is preferably an amide-imide resin that is soluble in a polar solvent containing neither nitrogen nor sulfur atoms. Examples of such amide-imide resins include branched amide-imide resins having a branched structure and an acid value of 60 KOHmg / g or more.

[0027] From the viewpoint of improving compatibility with other resin components, the number average molecular weight of (A) the carboxyl group-containing resin is preferably small, for example, 500 to 1000, and more preferably 700 to 900. The content of the carboxyl group-containing resin (A) in the photosensitive resin composition of the present invention is preferably 25 to 65 mass %, more preferably 35 to 55 mass %, based on the total solid content of the photosensitive resin composition.

[0028] [(B) Photopolymerization initiator] As the (B) photopolymerization initiator for the photosensitive resin composition of the present invention, any photopolymerization initiator known as a photopolymerization initiator or photoradical generator can be used. For example, bis-(2,6-dichlorobenzoyl)phenylphosphine oxide, bis-(2,6-dichlorobenzoyl)-2,5-dimethylphenylphosphine oxide, bis-(2,6-dichlorobenzoyl)-4-propylphenylphosphine oxide, bis-(2,6-dichlorobenzoyl)-1-naphthylphosphine oxide, bis-(2,6-dimethoxybenzoyl)phenylphosphine oxide, bis-(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, bisacylphosphine oxides such as 2,6-dimethoxybenzoyldiphenylphosphine oxide, bis-(2,6-dimethoxybenzoyl)-2,5-dimethylphenylphosphine oxide, and bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; 2,6-dimethoxybenzoyldiphenylphosphine oxide, 2,6-dichlorobenzoyldiphenylphosphine oxide, 2,4,6-trimethylbenzoylphenylphosphinic acid methyl ester, 2-methylbenzoyldiphenylphosphine oxide, pivalo monoacylphosphine oxides such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide; 1-hydroxy-cyclohexyl phenyl ketone, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methyl-propan-1-one, 2-hydroxy-2-methyl- Hydroxyacetophenones such as 1-phenylpropan-1-one; benzoins such as benzoin, benzil, benzoin methyl ether, benzoin ethyl ether, benzoin n-propyl ether, benzoin isopropyl ether, and benzoin n-butyl ether; benzoin alkyl ethers; benzophenones such as benzophenone, p-methylbenzophenone, Michler's ketone, methylbenzophenone, 4,4'-dichlorobenzophenone, and 4,4'-bisdiethylaminobenzophenone;Acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-1-propanone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-(dimethylamino)-2-[(4-methylphenyl)methyl)-1-[4-(4-morpholinyl)phenyl]-1- Acetophenones such as butanone and N,N-dimethylaminoacetophenone; thioxanthones such as thioxanthone, 2-ethylthioxanthone, 2-isopropylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone; anthraquinone, chloroanthraquinone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 1-chloroanthraquinone, 2-amylanthraquinone anthraquinones such as acetophenone dimethyl ketal and 2-aminoanthraquinone; ketals such as acetophenone dimethyl ketal and benzil dimethyl ketal; benzoic acid esters such as ethyl 4-dimethylaminobenzoate, 2-(dimethylamino)ethyl benzoate, and p-dimethylbenzoic acid ethyl ester; 1,2-octanedione, 1-[4-(phenylthio)-2-(O-benzoyloxime)], ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(O-acetyloxime) Examples of photopolymerization initiators include oxime esters such as bis(η5-2,4-cyclopentadien-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)phenyl)titanium and titanocenes such as bis(cyclopentadienyl)-bis[2,6-difluoro-3-(2-(1-pyr-1-yl)ethyl)phenyl]titanium; phenyl disulfide 2-nitrofluorene, butyroin, anisoin ethyl ether, azobisisobutyronitrile, and tetramethylthiuram disulfide. The photopolymerization initiator may be used alone or in combination of two or more.

[0029] The content of the (B) photopolymerization initiator is preferably 1 to 10 mass % based on the total solid content of the photosensitive resin composition. When the content of the (B) photopolymerization initiator is within the above range based on the total solid content of the photosensitive resin composition, the resulting cured product can have both good surface curability and good resolution.

[0030] [(C) Compounds having unsaturated double bonds] (C) The compound having an unsaturated double bond is photocured by irradiation with active energy rays, and can insolubilize or help insolubilize the photosensitive resin composition of the present invention in an alkaline aqueous solution. Examples of such compounds include commonly known polyester (meth)acrylates, polyether (meth)acrylates, urethane (meth)acrylates, carbonate (meth)acrylates, epoxy (meth)acrylates, and urethane (meth)acrylates. Specific examples include hydroxyalkyl acrylates such as 2-hydroxyethyl acrylate and 2-hydroxypropyl acrylate; glycol diacrylates such as ethylene glycol, methoxytetraethylene glycol, polyethylene glycol, and propylene glycol; acrylamides such as N,N-dimethylacrylamide, N-methylolacrylamide, and N,N-dimethylaminopropylacrylamide; aminoalkyl acrylates such as N,N-dimethylaminoethyl acrylate and N,N-dimethylaminopropyl acrylate;Polyhydric alcohols such as hexanediol, trimethylolpropane, pentaerythritol, dipentaerythritol, and tris-hydroxyethyl isocyanurate, or polyhydric acrylates such as their ethylene oxide adducts, propylene oxide adducts, or ε-caprolactone adducts; bifunctional acrylates such as 1,6-hexanediol diacrylate, 1,9-nonanediol diacrylate, and 1,10-decanediol diacrylate; trimethylolpropane triacrylate, pentaerythritol triacrylate, and tris(2-hydroxyethyl) Trifunctional acrylates such as isocyanurate triacrylate, ethylene oxide-modified trimethylol triacrylate, ethylene oxide-modified trimethylolpropane triacrylate, propylene oxide-modified trimethylolpropane triacrylate, and ε-caprolactone-modified tris-(2-acryloxyethyl) isocyanurate; tetrafunctional acrylates such as ditrimethylolpropane tetraacrylate, pentaerythritol tetraacrylate, and ethoxylated pentaerythritol tetraacrylate; pentafunctional acrylates such as dipentaerythritol pentaacrylate; hexafunctional acrylates such as dipentaerythritol hexaacrylate; phenoxy acrylate; bisphenol A diacrylate; and ethylene oxide derivatives of these phenols. Examples of suitable acrylates include polyhydric acrylates such as propylene oxide adducts or propylene oxide adducts; polyhydric acrylates of glycidyl ethers such as glycerin diglycidyl ether, glycerin triglycidyl ether, trimethylolpropane triglycidyl ether, and triglycidyl isocyanurate; acrylates having a dicyclopentadiene skeleton such as dicyclopentadiene diacrylate; and, without being limited to the above, acrylates and melamine acrylates obtained by directly acridating polyols such as polyether polyols, polycarbonate diols, hydroxyl-terminated polybutadienes, and polyester polyols or by urethane acrylate via diisocyanates, as well as at least one of the methacrylates corresponding to the above acrylates.

[0031] Further examples include epoxy acrylate resins obtained by reacting acrylic acid with a multifunctional epoxy resin such as a cresol novolac epoxy resin, and epoxy urethane acrylate compounds obtained by reacting the hydroxyl groups of the epoxy acrylate resin with a half-urethane compound of a hydroxy acrylate such as pentaerythritol triacrylate and a diisocyanate such as isophorone diisocyanate. Such epoxy acrylate resins can improve photocurability without reducing dryness to the touch. The above-mentioned compounds having an ethylenic double bond in the molecule may be used alone or in combination of two or more.

[0032] Furthermore, the content of the compound (C) having an unsaturated double bond is preferably in the range of approximately 1 to 30 mass %, more preferably 5 to 15 mass %, based on the total solid content of the photosensitive resin composition, from the viewpoint of the properties and sensitivity of the cured film (cured product) to be formed.

[0033] [(D) Thermosetting resin] In principle, the photosensitive resin composition of the present invention may further contain a thermosetting resin (D) in order to improve heat resistance. Examples of the (D) thermosetting resin include known thermosetting resins such as polyfunctional epoxy compounds, polyfunctional oxetane compounds, episulfide resins, etc., which have two or more cyclic ether groups and / or cyclic thioether groups in the molecule; polyisocyanate compounds, blocked isocyanate compounds, etc., which have two or more isocyanate groups or blocked isocyanate groups in one molecule; melamine resins, benzoguanamine resins, etc., amine resins and derivatives thereof; bismaleimides, oxazines, cyclocarbonate compounds, carbodiimide resins, etc.

[0034] Among these, examples of polyfunctional epoxy resins include bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, bisphenol S-type epoxy resins, heterocyclic epoxy resins, phenol novolac-type epoxy resins, cresol novolac-type epoxy resins, alkylphenol novolac-type epoxy resins, biphenyl-type epoxy resins, aralkyl-type epoxy resins, biphenylaralkyl-type epoxy resins, dicyclopentadiene skeleton-containing epoxy resins, epoxidized products of condensation products of phenols with aromatic aldehydes having a phenolic hydroxyl group, naphthalene-type epoxy resins, fluorene-type epoxy resins, and xanthene-type epoxy resins, etc., blended with a curing agent. These epoxy resins may be used alone or in combination of two or more. From the standpoint of reactivity, epoxy resins with an epoxy equivalent weight in the range of 95 to 1000 are preferred.

[0035] As described above, in the present invention, the cured product obtained from the photosensitive resin composition must have high transparency. Therefore, in order to prevent the color of the cured product from becoming dark, the thermosetting resin (D) is preferably selected from epoxy resins having a Gardner color scale of 5 or less. By controlling the Gardner color scale of the epoxy resin to 5 or less, a cured product suitable for use as a transparent material, particularly as a protective material for transparent antennas for smartphones or car navigation systems, can be obtained, and resolution can also be improved. The Gardner color scale can be measured in accordance with JIS K6901.

[0036] Examples of epoxy resins with a Gardner color index of 5 or less include JER828 (epoxy equivalent weight 190: manufactured by Mitsubishi Chemical Corporation), JER834 (epoxy equivalent weight 250: manufactured by Mitsubishi Chemical Corporation), JER1001 (epoxy equivalent weight 475: manufactured by Mitsubishi Chemical Corporation), JER806 (epoxy equivalent weight 165: manufactured by Mitsubishi Chemical Corporation), and JER152 (epoxy equivalent weight 175: manufactured by Mitsubishi Chemical Corporation). KAL Corporation), JER154 (epoxy equivalent 178: Mitsubishi Chemical Corporation), EPICLON840 (epoxy equivalent 185: DIC Corporation), EPICLON850 (epoxy equivalent 189: DIC Corporation), EPICLON1050 (epoxy equivalent 475: DIC Corporation), EPICLON830 (epoxy equivalent 173: DIC Corporation), EPICLON Examples of such epoxy resins include EPICLON N-660 (epoxy equivalent weight 208: manufactured by DIC Corporation), EPICLON N-695 (epoxy equivalent weight 215: manufactured by DIC Corporation), EPICLON N-730A (epoxy equivalent weight 176: manufactured by DIC Corporation), EPICLON N-770 (epoxy equivalent weight 188: manufactured by DIC Corporation), EOCN-1020 (epoxy equivalent weight 199: manufactured by Nippon Kayaku Co., Ltd.), EOCN-104S (epoxy equivalent weight 218: manufactured by Nippon Kayaku Co., Ltd.), and EPPN-201 (epoxy equivalent weight 190: manufactured by Nippon Kayaku Co., Ltd.).

[0037] From the viewpoint of good hardness, heat resistance, electrical insulation properties, and developability of the cured product, the (D) thermosetting resin is used in an amount of preferably 5 to 45 mass %, more preferably 15 to 35 mass %, based on the total solid content of the photosensitive resin composition.

[0038] [(E) Filler having an average particle size of 120 nm or less] The photosensitive resin composition of the present invention contains a filler (E), which enhances the gas barrier properties of the resulting cured product. At the same time, the transparency of the cured product must also be maintained at a high level. In other words, from the viewpoint of achieving both gas barrier properties and transparency, the filler (E) used in the present invention is preferably one having an average particle size of 120 nm or less. By using a filler (E) having an average particle size of 120 nm or less, the haze value of the cured product can be reduced while also reducing the water vapor transmission rate, thereby achieving both gas barrier properties and transparency of the cured product.

[0039] Specific examples of (E) fillers having an average particle size of 120 nm or less include non-metallic fillers such as silica, barium sulfate, calcium carbonate, silicon nitride, aluminum nitride, boron nitride, alumina, magnesium oxide, aluminum hydroxide, magnesium hydroxide, titanium oxide, mica, talc, Neuburg silica, and organic bentonite, and metallic fillers such as copper, gold, silver, palladium, and silicon. In the photosensitive resin composition of the present invention, these fillers may be used alone or in combination of two or more.

[0040] Among these, silica, which has low volume expansion and excellent printability, and calcium carbonate, which has low volume expansion and excellent abrasiveness, are preferred. The silica may be amorphous, crystalline, or a mixture of these. Amorphous (fused) silica is particularly preferred. The calcium carbonate may be either natural ground calcium carbonate or synthetic precipitated calcium carbonate.

[0041] The shape of such inorganic particles may be spherical, needle-like, plate-like, scale-like, hollow, irregular, hexagonal, cubic, or flaky, with spherical being preferred from the viewpoint of high filler loading.

[0042] As described above, the filler (E) preferably has an average particle size of 120 nm or less, more preferably 100 nm or less, even more preferably 50 nm or less, and most preferably 15 nm or less. From the viewpoint of the transparency of the cured product, the smaller the particle size, in principle, the better. However, from the viewpoint of production efficiency, the lower limit of the average particle size is preferably 1 nm or more. Furthermore, if the average particle size is 1 nm or more, the specific surface area is small, and the fillers disperse well due to the effect of their aggregation, making it easy to increase the amount of filler to be filled. The average particle size refers to the average primary particle size. The average particle size (D50) can be measured using a laser diffraction / scattering particle size distribution analyzer and a dynamic light scattering particle size distribution analyzer. Examples of laser diffraction / scattering particle size distribution analyzers include the Microtrac MT3300EXII manufactured by Microtrac-Bell, and examples of dynamic light scattering particle size distribution analyzers include the Nanotrac Wave II UT151 manufactured by Microtrac-Bell.

[0043] (E) The filler having an average particle size of 120 nm or less is preferably a surface-treated inorganic filler. The surface treatment may be a surface treatment using a coupling agent or a surface treatment that does not introduce an organic group, such as an alumina treatment. There are no particular limitations on the surface treatment method, and any known or commonly used method may be used. For example, the surface of the inorganic filler may be treated with a surface treatment agent having a curable reactive group, such as a coupling agent having a curable reactive group.

[0044] The surface treatment is preferably a surface treatment using a coupling agent. Examples of the coupling agent that can be used include silane-based, titanate-based, aluminate-based, and zircoaluminate-based coupling agents. Among these, silane-based coupling agents are preferred. Examples of such silane-based coupling agents include vinyltrimethoxysilane, vinyltriethoxysilane, N-(2-aminomethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-anilinopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, and N-phenyl-3-aminopropyltrimethoxysilane. These can be used alone or in combination. These silane coupling agents are preferably immobilized in advance on the surface of the inorganic filler by adsorption or reaction. The amount of the coupling agent to be used relative to the filler (E) is, for example, 0.1 to 10 mass %, preferably 0.5 to 10 mass %.

[0045] The curable reactive group is preferably a thermosetting reactive group. Examples of the thermosetting reactive group include a hydroxyl group, a carboxyl group, an isocyanate group, an amino group, an imino group, an epoxy group, an oxetanyl group, a mercapto group, a methoxymethyl group, a methoxyethyl group, an ethoxymethyl group, an ethoxyethyl group, and an oxazoline group. Among these, at least one of an amino group and an epoxy group is preferred. The surface-treated inorganic filler may have a photocurable reactive group in addition to the thermosetting reactive group.

[0046] The surface-treated filler may be contained in the resin layer from the photosensitive resin composition in a surface-treated state. The filler and the surface treatment agent may be separately blended into the photosensitive resin composition forming the resin layer, and the filler may be surface-treated in the composition. However, it is preferable to blend a filler that has been surface-treated in advance. Blending a filler that has been surface-treated in advance can prevent a decrease in crack resistance, etc., due to the surface treatment agent that may remain in the composition if blended separately and is not consumed in the surface treatment. When performing surface treatment in advance, it is preferable to blend a pre-dispersion in which the inorganic filler is pre-dispersed in a solvent or curable resin. It is preferable to pre-disperse the surface-treated filler in a solvent and then blend the pre-dispersion into the composition. Alternatively, it is more preferable to pre-disperse a surface-untreated filler in a solvent, thoroughly surface-treat it, and then blend the pre-dispersion into the composition.

[0047] (E) Filler having an average particle size of 120 nm or less is preferably used in the form of a slurry mixed with a solvent or dispersant from the viewpoint of ease of handling. Such a slurry can be obtained, for example, by mixing and stirring the filler, and optionally a coupling agent and a solvent, and then dispersing the mixture using a bead mill.

[0048] The content of (E) filler having an average particle size of 120 nm or less is preferably 5 to 35 mass %, more preferably 10 to 30 mass %, based on the total mass of solids in the photosensitive resin composition of the present invention. When it is 10 to 30 mass %, the transparency of the obtained cured product can be ensured, the photosensitive resin composition can be easily converted into a liquid paste, good printability can be obtained, and the cured product will exhibit sufficiently low volume expansion and good polishability.

[0049] [(F) A thermosetting catalyst that is liquid at temperatures between 20°C and 70°C] The photosensitive resin composition of the present invention contains a thermosetting catalyst to promote the curing of the thermosetting resin (D), but from the viewpoint of not impairing the transparency of the resulting cured product, it preferably contains a thermosetting catalyst (F) that is liquid at temperatures of 20° C. or higher but lower than 70° C. This is because, unlike a powder form, there is very little factor that adversely affects the haze value in the cured product.

[0050] As the thermosetting catalyst, one that is liquid at a temperature of 20°C or higher and lower than 70°C is preferably selected from the following. Examples of the compound include imidazole derivatives such as imidazole, 2-methylimidazole, 2-ethylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole; amine compounds such as dicyandiamide, benzyldimethylamine, 4-(dimethylamino)-N,N-dimethylbenzylamine, 4-methoxy-N,N-dimethylbenzylamine, and 4-methyl-N,N-dimethylbenzylamine; hydrazine compounds such as adipic acid dihydrazide and sebacic acid dihydrazide; phosphorus compounds such as triphenylphosphine and triphenylphosphite; and organotin compounds such as tin octoate. Commercially available compounds include, for example, 2MZ-H, 1,2DMZ, 2MZ-A, 2MA-OK, 2PHZ, and 2P4MHZ (all of which are trade names for imidazole-based compounds) manufactured by Shikoku Chemical Industry Co., Ltd., U-CAT 3502T and U-CAT 3503N (all of which are trade names for dimethylamine-based compounds), U-CAT 5003 (a trade name for a quaternary phosphonium bromide-based compound), U-CAT 5003 (a trade name for a quaternary phosphonium bromide-based compound), DBU, DBN, U-CAT SA 1, U-CAT SA 102, U-CAT SA 506, and U-CAT 5002 (all of which are bicyclic amidine compounds and salts thereof), and POLYCAT 8 (trade name of N,N-dimethylcyclohexylamine), JP-360, JP-3CP, JP-3CP (all trade names of phosphite ester compounds) manufactured by Johoku Chemical Industry Co., Ltd., and KCS-405T (trade name of stannous octoate).

[0051] Among the above compounds, more preferred examples of (F) thermosetting catalysts that are liquid at temperatures of 20°C or higher but lower than 70°C include U-CAT SA 1, U-CAT SA 102, U-CAT SA 506 (bicyclic amidine compounds and salts thereof; manufactured by San-Apro Co., Ltd.), POLYCAT 8 (N,N-dimethylcyclohexylamine; manufactured by San-Apro Co., Ltd.), 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, JP-360 (triphenyl phosphite; manufactured by Johoku Chemical Industry Co., Ltd.), JP-3CP (tricresyl phosphite; manufactured by Johoku Chemical Industry Co., Ltd.), and KCS-405T (stannous octoate; manufactured by Johoku Chemical Industry Co., Ltd.).

[0052] The above-mentioned (F) thermosetting catalyst that is liquid at a temperature of 20° C. or higher and lower than 70° C. can be used alone or in combination of two or more. The content of (F) the thermosetting catalyst that is liquid at 20°C or higher and lower than 70°C is preferably 0.01 to 10.0 mass%, and more preferably 0.1 to 5.0 mass%, based on the total mass of solids in the photosensitive resin composition of the present invention, from the viewpoints of ensuring the transparency of the obtained cured product, the storage stability of the photosensitive resin composition, and the heat resistance of the cured product.

[0053] [solvent] In the present invention, a solvent can be used to adjust the viscosity of the photosensitive resin composition to a level suitable for application to a substrate or a carrier film. Such a solvent is mainly an organic solvent, and specific examples thereof include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, and petroleum-based solvents. More specifically, examples of organic solvents include ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether; esters such as ethyl acetate, butyl acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, and propylene glycol butyl ether acetate; alcohols such as ethanol, propanol, ethylene glycol, and propylene glycol; aliphatic hydrocarbons such as octane and decane; and petroleum-based solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha. These organic solvents may be used alone or in combination of two or more.

[0054] [Other ingredients] The photosensitive resin composition of the present invention may, of course, further contain other components in addition to the above components depending on the required properties. Examples of such components include antifoaming agents, leveling agents, thermal polymerization inhibitors, ultraviolet absorbers, silane coupling agents, plasticizers, foaming agents, flame retardants, antistatic agents, antioxidants, antibacterial and antifungal agents, etc.

[0055] [Photosensitive resin laminate] The photosensitive resin composition of the present invention can be used in the form of a photosensitive resin laminate. For example, the photosensitive resin laminate of the present invention has a resin layer obtained by applying the photosensitive resin composition of the present invention onto a carrier film and drying the applied layer. More specifically, when forming the photosensitive resin laminate of the present invention, first, the photosensitive resin composition of the present invention is diluted with the organic solvent described above to adjust the viscosity to an appropriate level, and then coated to a uniform thickness on a carrier film using a comma coater, blade coater, lip coater, rod coater, squeeze coater, reverse coater, transfer roll coater, gravure coater, spray coater, etc. Then, the coated composition is typically dried at a temperature of 50 to 130°C for 1 to 30 minutes to form a resin layer. There are no particular restrictions on the thickness of the film to be applied to the carrier film, but it is generally selected appropriately so that the film thickness after drying is in the range of 10 to 150 μm, preferably 20 to 60 μm.

[0056] The carrier film used is a plastic film, and examples of the carrier film that can be used include polyester films such as polyethylene terephthalate (PET), polyimide films, polyamideimide films, polypropylene films, polystyrene films, etc. There are no particular restrictions on the thickness of the carrier film, but it is generally selected appropriately in the range of 10 to 150 μm.

[0057] After forming a resin layer on a carrier film, a peelable cover film can be further laminated on the surface of the resin layer to prevent dust and other particles from adhering to the surface of the resin layer, thereby obtaining a photosensitive resin laminate. The peelable cover film may be, for example, a polyethylene film, a polytetrafluoroethylene film, a polypropylene film, surface-treated paper, etc. The cover film may be any film as long as the adhesive strength between the resin layer and the carrier film is smaller than that between the resin layer and the carrier film when the cover film is peeled off.

[0058] In the present invention, the photosensitive resin composition of the present invention may be applied to the cover film and dried to form a resin layer, and a carrier film may be laminated on the surface of the resin layer to form a photosensitive resin laminate. That is, in the present invention, either a carrier film or a cover film may be used as the film onto which the photosensitive resin composition is applied when producing the photosensitive resin laminate.

[0059] [Cured product] The present invention also relates to a cured film (cured product) obtained by curing the resin layer of the above-mentioned photosensitive resin composition or photosensitive resin laminate. The cured film (cured product) of the present invention can be formed, for example, as follows. First, a photosensitive resin composition is applied to a substrate, and the solvent is evaporated and dried. The resulting resin layer is then exposed (irradiated with light), thereby curing the exposed areas (irradiated areas). Specifically, the resin is selectively exposed to active energy rays through a patterned photomask using a contact or non-contact method, or directly exposed to a pattern using a laser direct exposure device. The unexposed areas are then developed with an alkaline aqueous solution (e.g., a 0.3 to 3% by weight sodium carbonate aqueous solution), forming a resist pattern. Further, the composition is post-cured by heating to a temperature of approximately 100 to 180°C, forming a cured product as a cured film with excellent properties such as heat resistance, chemical resistance, moisture absorption resistance, adhesion, and electrical properties.

[0060] Here, the curable resin composition of the present invention can also be adjusted to a viscosity suitable for the coating method using an organic solvent, and applied to a substrate by a method such as dip coating, flow coating, roll coating, bar coating, screen printing, or curtain coating, and then the organic solvent contained in the composition can be evaporated and dried (pre-dried) at a temperature of about 60 to 100°C to form a tack-free resin layer.

[0061] Substrates include printed wiring boards and flexible printed wiring boards with circuits already formed using copper or other materials, as well as copper-clad laminates for high-frequency circuits made from materials such as paper phenol, paper epoxy, glass cloth epoxy, glass polyimide, glass cloth / non-woven cloth epoxy, glass cloth / paper epoxy, synthetic fiber epoxy, fluororesin, polyethylene, polyphenylene ether, polyphenylene oxide, cyanate, etc., including copper-clad laminates of all grades (FR-4, etc.), as well as metal substrates, polyimide film, PET film, polyethylene naphthalate (PEN) film, glass substrates, ceramic substrates, and wafer plates.

[0062] The volatilization drying or thermal curing can be carried out using, for example, a hot air circulation drying oven, an IR oven, a hot plate, a convection oven, etc. (a method in which hot air in the dryer is brought into countercurrent contact using a heat source of an air heating method using steam, or a method in which hot air is blown onto the support from a nozzle).

[0063] The dried photosensitive resin composition or photosensitive resin laminate can be exposed to active energy rays through a photomask having a pattern formed thereon, by contact or non-contact exposure. Alternatively, the photosensitive resin composition or the photosensitive resin laminate can be directly pattern-exposed using a laser direct exposure machine to photo-cure the exposed portions.

[0064] The exposure device used for actinic energy ray irradiation may be a device equipped with a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, a mercury short arc lamp, or the like, and capable of irradiating ultraviolet rays in the range of 350 to 450 nm. Furthermore, a direct imaging device (for example, a laser direct imaging device that directly draws an image with a laser based on CAD data from a computer) may also be used. The lamp or laser light source for the direct imaging device may have a maximum wavelength in the range of 350 to 410 nm. The exposure dose for image formation varies depending on factors such as the film thickness, but is generally 20 to 1000 mJ / cm. 2 , preferably 20 to 800 mJ / cm 2 The range may be:

[0065] The developing method may be a dipping method, a shower method, a spray method, a brush method, or the like, and the developing solution may be an aqueous alkali solution such as potassium hydroxide, sodium hydroxide, sodium carbonate, potassium carbonate, sodium phosphate, sodium silicate, ammonia, or an amine.

[0066] [Electronic Components] By using the photosensitive resin composition of the present invention as described above, high-quality, durable, and reliable electronic components can be provided, for example, components used in electronic circuits, such as active components such as printed wiring boards, transistors, light-emitting diodes, and laser diodes, as well as passive components such as resistors, capacitors, inductors, and connectors. In particular, the photosensitive resin composition of the present invention is also suitable as a material for permanent insulating films such as coverlays for printed wiring boards, solder resists, interlayer insulating materials, and insulating materials for forming rewiring layers.

[0067] [Transparent antenna] The present invention particularly relates to a transparent antenna comprising the above-described cured product. That is, the cured product obtained from the photosensitive resin composition of the present invention not only has excellent resolution and electroless gold plating resistance, but also has reduced haze and water vapor transmission rate. Therefore, it is particularly suitable as a material for transparent antennas in smartphones and car navigation systems, or as a protective material therefor.

[0068] The method for producing the transparent antenna of the present invention is basically the same as the method for forming a circuit on a printed wiring board. For example, an electrolytic copper foil is adhered to a substrate, and after optional chemical conversion treatment, a photosensitive resin laminate is laminated with the copper foil. The photosensitive resin laminate is then subjected to pattern exposure and development to form an antenna pattern. Next, the copper foil in the non-patterned areas is removed by etching, and the photosensitive resin laminate is peeled off to obtain a transparent antenna with a copper antenna pattern.

[0069] The present invention will be specifically described below with reference to examples and comparative examples, but the present invention is not limited to the following examples. Unless otherwise specified, the "parts" and "%" shown are based on mass. [Example]

[0070] <Synthesis Example 1> 5184 g of EDGA (diethylene glycol monoethyl ether acetate), 2070 g (3 mol) of IPDI3N (isocyanurate-type triisocyanate synthesized from isocyanurate: NCO%=18.2) and 1782 g (9 mol) of cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride were added to a flask equipped with a stirrer, thermometer and condenser, and the temperature was raised to 140°C. The reaction proceeded with foaming. The reaction was carried out at this temperature for 8 hours. The system became a pale yellow liquid, and measurement of its characteristic absorption by infrared spectroscopy revealed a peak at 2270 cm, which is the characteristic absorption of the isocyanate group. -1 completely disappeared, and 1780cm -1 , 1720cm -1 The absorption of imide groups was confirmed. The acid value was 140 mg KOH / g in terms of solid content, and the molecular weight was 800 in terms of polystyrene. The resin concentration was 40% by weight. In this way, a resin solution of acid anhydride-added carboxyl group-containing resin A was obtained. This resin solution was designated as resin solution A.

[0071] <Synthesis Example 2> 5184 g of EDGA (diethylene glycol monoethyl ether acetate), 2070 g (3 mol) of IPDI3N (isocyanurate-type triisocyanate synthesized from isocyanurate: NCO%=18.2) and 1782 g (9 mol) of cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride were added to a flask equipped with a stirrer, thermometer and condenser, and the temperature was raised to 140°C. The reaction proceeded with foaming. The reaction was carried out at this temperature for 8 hours. The system became a pale yellow liquid, and measurement of its characteristic absorption by infrared spectroscopy revealed a peak at 2270 cm, which is the characteristic absorption of the isocyanate group. -1 completely disappeared, and 1780cm -1 , 1720cm -1 The imide group absorption was confirmed at 910 cm . Furthermore, 142.0 g (1 mol) of glycidyl methacrylate was added to the reaction mixture obtained, and the reaction was carried out at 115°C for 4 hours. The characteristic absorption was measured by infrared spectroscopy, and the characteristic absorption of the epoxy group was confirmed at 910 cm . -1 The acid value of this resin solution was 117 mg KOH / g in terms of solid content, and the molecular weight was 850 in terms of polystyrene number average molecular weight. The resin concentration was 40 wt %. In this way, a resin solution of acid anhydride-added carboxyl group-containing resin B was obtained. This resin solution was designated as resin solution B.

[0072] <Synthesis Example 3> 600 g of EDGA (diethylene glycol monoethyl ether acetate) was charged with 1070 g of orthocresol novolac epoxy resin (EPICLON N-695 manufactured by DIC Corporation, softening point 95°C, epoxy equivalent weight 214, average functionality 7.6) (number of glycidyl groups (total number of aromatic rings): 5.0 mol), 360 g (5.0 mol) of acrylic acid, and 1.5 g of hydroquinone. The mixture was heated to 100°C with stirring to achieve a homogeneous solution. Next, 4.3 g of triphenylphosphine was added, heated to 110°C, and reacted for 2 hours. The mixture was then heated to 120°C and reacted for an additional 12 hours. 415 g of aromatic hydrocarbon (Solvesso 150) and 534 g (3.0 mol) of methyl-5-norbornene-2,3-dicarboxylic anhydride were added to the resulting reaction solution, reacted at 110°C for 4 hours, cooled, and then discharged. The resulting cresol novolac carboxyl group-containing resin had a solid acid value of 89 mgKOH / g and a resin concentration of 65%. In this way, a resin solution of acid anhydride-added carboxyl group-containing resin C was obtained. This resin solution was designated as resin solution C.

[0073] <Synthesis Example 4> A flask equipped with a thermometer, stirrer, dropping funnel, and reflux condenser was charged with methyl methacrylate, ethyl methacrylate, and methacrylic acid in a molar ratio of 1:1:2. Dipropylene glycol monomethyl ether (DMME) was added as a solvent and azobisisobutyronitrile (AIBN) as a catalyst. The mixture was stirred at 80°C for 4 hours under a nitrogen atmosphere to obtain a resin solution. The resin solution was cooled, and 20 mol% of glycidyl methacrylate was added to the carboxyl groups of the resin using methylhydroquinone as a polymerization inhibitor and tetrabutylphosphonium bromide as a catalyst at 95-105°C for 16 hours. After cooling, the mixture was removed. The resulting carboxyl-containing photosensitive resin, possessing both ethylenically unsaturated bonds and carboxyl groups, had a solids acid value of 120 mgKOH / g and a resin concentration of 70%. In this way, a resin solution of a carboxyl group-containing resin to which no acid anhydride had been added was obtained. This resin solution was designated as resin solution D.

[0074] <Preparation Example 1: Preparation of inorganic filler slurry A> 30 g of spherical silica particles (Admatechs' Admanano YA050C, average particle size: 50 nm), 68 g of PMA (propylene glycol monomethyl ether acetate) as a solvent, and 2 g of a silane coupling agent with a methacrylic group (Shin-Etsu Chemical's KBM-503) were mixed and stirred, and dispersed in a bead mill (Bühler's K-8) at 900 rpm, pump power of 20%, and a dispersion temperature of 40-50°C to obtain a PMA dispersion of silica particles. The resulting dispersion is designated inorganic filler slurry A. The average particle size (D50) of the obtained inorganic filler slurry was measured using a NANOTRAC FLEX manufactured by Microtrac-Bell, and is shown in the following Table 1. The average particle sizes of the other inorganic filler slurries used in the examples and comparative examples were also measured in the same manner.

[0075] <Preparation Example 2: Preparation of Inorganic Filler Slurry B> 30 g of spherical silica particles (Admatechs' Admanano YA100C, average particle size: 100 nm), 68 g of PMA (propylene glycol monomethyl ether acetate) as a solvent, and 2 g of a silane coupling agent with a methacrylic group (Shin-Etsu Chemical's KBM-503) were mixed and stirred, and dispersed in a bead mill (Bühler's K-8) at 900 rpm, pump power of 20%, and a dispersion temperature of 40-50°C to obtain a PMA dispersion of silica particles. The resulting dispersion is designated inorganic filler slurry B.

[0076] <Preparation Example 3: Preparation of Inorganic Filler Slurry C> 30 g of spherical silica particles (Admatechs' Admanano YA010C, average particle size: 10 nm), 68 g of PMA (propylene glycol monomethyl ether acetate) as a solvent, and 2 g of a silane coupling agent with a methacrylic group (Shin-Etsu Chemical's KBM-503) were mixed and stirred, and dispersed in a bead mill (Bühler's K-8) at 900 rpm, pump power of 20%, and a dispersion temperature of 40-50°C to obtain a PMA dispersion of silica particles. The resulting dispersion is designated inorganic filler slurry C.

[0077] <Preparation Example 4: Preparation of Inorganic Filler Slurry D> 30 g of titanium oxide particles (STR-100N, Sakai Chemical Industry Co., Ltd., average particle size: 15 nm), 68 g of PMA (propylene glycol monomethyl ether acetate) as a solvent, and 2 g of a silane coupling agent with a methacrylic group (KBM-503, Shin-Etsu Chemical Co., Ltd.) were mixed and stirred, and dispersed in a bead mill (Bühler K-8) at 900 rpm, pump power of 20%, and a dispersion temperature of 40 to 50°C to obtain a PMA dispersion of silica particles. The resulting dispersion is designated inorganic filler slurry D.

[0078] <Preparation Example 5: Preparation of Inorganic Filler Slurry E> 30 g of spherical silica particles (Admatechs' ADMAFINE SO-C1, average particle size: 250 nm), 68 g of PMA (propylene glycol monomethyl ether acetate) as a solvent, and 2 g of a silane coupling agent with a methacrylic group (Shin-Etsu Chemical's KBM-503) were mixed and stirred, and the mixture was dispersed in a bead mill (BUHLER's K-8) at 900 rpm, 20% pump power, and a dispersion temperature of 40-50°C to obtain a PMA dispersion of silica particles. The resulting dispersion is designated inorganic filler slurry E.

[0079] <Examples 1 to 10 and Comparative Examples 1 to 7> Based on the component compositions shown in Tables 1 and 2 below, the components were blended and premixed in a mixer, and then kneaded and dispersed in a three-roll mill to prepare photosensitive resin compositions according to Examples 1 to 10 and Comparative Examples 1 to 7.

[0080] [Table 1]

[0081] [Table 2]

[0082] The components in Tables 1 and 2 are as follows: ※1 Synthesis Example 1 ※2 Synthesis Example 2 ※3 Synthesis Example 3 ※4 Synthesis Example 4 ※5 2,4,6-trimethylbenzoyldiphenylphosphine oxide ※6 Irgacure OXE02 (BASF) ※7 Dipentaerythritol hexaacrylate ※8 Ethylene oxide modified trimethylolpropane triacrylate ※9 Bisphenol A epoxy resin: JER834 (Mitsubishi Chemical Corporation) (Gardner color scale ≦5) ※10 Naphthalene-type epoxy resin: NC-7000L (manufactured by Nippon Kayaku Co., Ltd.) (Gardner color number > 5) ※11 2-Ethyl-4-methylimidazole (melting point approximately 40°C) ※12 U-CAT SA102 (melting point approx. 40°C) (manufactured by San-Apro Co., Ltd.) ※13 Dicyandiamide (melting point approx. 208°C) ※14 Preparation Example 1 ※15 Preparation Example 2 ※16 Preparation Example 3 ※17 Preparation Example 4 ※18 Preparation Example 5 ※19 Propylene glycol monomethyl ether acetate

[0083] <Optimal exposure> The photosensitive resin composition prepared as described in Tables 1 and 2 above was applied to a carrier film. This was then heated and dried in a hot air dryer at 80°C for 30 minutes to form a 20 μm-thick resin layer of the photosensitive resin composition. A cover film was then attached to the resin layer to obtain a photosensitive resin laminate. The cover film was then peeled off before use, and the resin layer side was attached to a copper-clad laminate substrate, followed by thermal lamination. The carrier film was then peeled off, and the laminate was exposed to light through a photomask (Stouffer, Step Tablet No. 41) using a projection exposure apparatus (Ushio Inc.) equipped with a high-pressure mercury lamp. After peeling off the carrier film, the laminate was developed for 200 seconds using a 1% Na2CO3 aqueous solution at 30°C under a spray pressure of 0.2 MPa, and the number of remaining coating layers was visually determined. The exposure amount resulting in 8 remaining coating layers was defined as the appropriate exposure amount.

[0084] <Transmittance ratio> The photosensitive resin composition prepared as shown in Tables 1 and 2 above was coated onto a carrier film. This was heated and dried for 30 minutes in a hot air dryer at 80°C to form a 20 μm-thick resin layer of the photosensitive resin composition. A cover film was then attached to the resin layer to obtain a photosensitive resin laminate. The cover film was then peeled off before use, and the resin layer side was attached to a glass substrate (soda-lime glass, 1.0 mm thick) for thermal lamination. Solid exposure was then performed at an optimal exposure dose using a projection exposure device (manufactured by Ushio Inc.) equipped with a high-pressure mercury lamp. After peeling off the carrier film, development was performed for 200 seconds using a 1% Na2CO3 aqueous solution at 30°C under a spray pressure of 0.2 MPa. This substrate was then subjected to a UV conveyor furnace for a cumulative exposure dose of 1000 mJ / cm2. 2 After irradiating with ultraviolet light under the conditions above, the coating was heated at 120° C. for 60 minutes for thermal curing, to obtain a glass substrate on which a cured film (cured product) with a film thickness of 20 μm was formed. The total light transmittance of the resulting cured film (cured product) was measured under the following conditions. Apparatus: UV-visible spectrophotometer (JASCO Ubest-V-570DS) connected to an integrating sphere (JASCO ISN-470) Measurement method: Measurements were performed in accordance with ISO 13468. First, white plates included with the integrating sphere device were set on the reference side and sample side of the device, and glass substrates (hereinafter referred to as glass substrate R) to which no photosensitive resin composition had been attached were set on both the reference side and sample side of the UV-visible spectrophotometer, and a baseline measurement was performed. Next, a glass substrate on which a cured film (cured product) prepared by the above method had been formed was set on the sample side of the UV-visible spectrophotometer, and glass substrate R was set on the reference side of the UV-visible spectrophotometer, and the total light transmittance was measured. The transmittance ratio of the obtained cured film (cured product) was calculated using the following formula: The results are shown in Tables 1 and 2 above. Transmittance ratio = total light transmittance at a wavelength of 550 nm of the obtained cured film (cured product) ÷ total light transmittance at a wavelength of 430 nm of the obtained cured film (cured product) The evaluation method is as follows. ◎: Transmittance ratio is 0.90 or more and less than 1.10 ○: Transmittance ratio is 1.10 or more and less than 1.15 △: Transmittance ratio is 1.15 or more and less than 1.20 ×: Transmittance ratio is 1.20 or more

[0085] <Haze value> The photosensitive resin composition prepared as shown in Tables 1 and 2 above was coated onto a carrier film. This was heated and dried for 30 minutes in a hot air dryer at 80°C to form a 20 μm-thick resin layer of the photosensitive resin composition. A cover film was then attached to the resin layer to obtain a photosensitive resin laminate. The cover film was then peeled off before use, and the resin layer side was attached to a glass substrate (soda-lime glass, 1.0 mm thick) for thermal lamination. The carrier film was then peeled off, and the substrate was subjected to solid exposure at an optimal exposure dose using a projection exposure device (manufactured by Ushio Inc.) equipped with a high-pressure mercury lamp. After peeling off the carrier film, development was performed for 200 seconds using a 1% Na2CO3 aqueous solution at 30°C under a spray pressure of 0.2 MPa. The substrate was then subjected to a UV conveyor oven for a cumulative exposure dose of 1000 mJ / cm2. 2 After irradiating with ultraviolet light under the conditions above, the coating was heated at 120° C. for 60 minutes for thermal curing, to obtain a glass substrate on which a cured film (cured product) with a film thickness of 20 μm was formed. The haze value of the resulting cured film (cured product) was measured under the following conditions, and the results are shown in Tables 1 and 2. Apparatus: UV-visible spectrophotometer (JASCO Ubest-V-570DS) connected to an integrating sphere (JASCO ISN-470) Measurement method: Measurements were performed in accordance with ISO 14782. First, white plates included with the integrating sphere device were set on the reference and sample sides, and glass substrates (hereinafter referred to as glass substrate R) without a photosensitive resin composition attached thereto were set on both the reference and sample sides of the UV-visible spectrophotometer, and a baseline measurement was performed. After removing the white plate on the sample side of the integrating sphere device, a glass substrate with a cured film (cured product) formed thereon by the above method was set on the sample side of the UV-visible spectrophotometer, and glass substrate R was set on the reference side of the UV-visible spectrophotometer, and the haze value was measured. The results are shown in Tables 1 and 2 above. The evaluation method is as follows. ◎: Haze value is over 0.0% and less than 1.0% Good: Haze value is 1.0% or more and less than 2.0% △: Haze value is 2.0% or more and less than 4.0% ×: Haze value is 4.0% or more

[0086] <Water vapor permeability> The photosensitive resin composition prepared as described in Tables 1 and 2 above was coated onto a carrier film. This was heated and dried for 30 minutes in a hot air dryer at 80°C to form a 20 μm-thick resin layer of the photosensitive resin composition. A cover film was then attached to the resin layer to obtain a photosensitive resin laminate. The cover film was then peeled off before use, and the resin layer side was attached to a 9 μm-thick electrolytic copper foil (manufactured by Furukawa Electric Co., Ltd.) for thermal lamination. Solid exposure was then performed at an optimal exposure dose using a projection exposure apparatus (manufactured by Ushio Inc.) equipped with a high-pressure mercury lamp. After peeling off the carrier film, development was performed for 200 seconds using a 1% Na2CO3 aqueous solution at 30°C under conditions of a spray pressure of 0.2 MPa. This substrate was then subjected to a UV conveyor furnace for an integrated exposure dose of 1000 mJ / cm2. 2 The substrate was irradiated with ultraviolet light under the conditions of 1000 mJ / cm. A new photosensitive resin laminate was thermally laminated onto the resin layer of the photosensitive resin composition irradiated with ultraviolet light in the same manner as above, and solid exposure was performed at the optimum exposure dose. After peeling off the carrier film, development was performed for 200 seconds using a 1% Na2CO3 aqueous solution at 30°C under a spray pressure of 0.2 MPa. The substrate was then placed in a UV conveyor furnace for 200 seconds with an accumulated exposure dose of 1000 mJ / cm. 2 This procedure was repeated a total of five times, and then the resin layer of the photosensitive resin composition was thermally cured by heating at 120°C for 60 minutes. In this way, a cured film (cured product) having a thickness of 100 μm was formed on the electrodeposited copper foil. Next, the copper foil with this cured film (cured product) was etched away using an etching solution having a composition of 340 g / L of cupric chloride and a free hydrochloric acid concentration of 51.3 g / L, and the copper foil was thoroughly washed with water and dried to prepare a test piece consisting of a cured film (cured product) having a thickness of 100 μm.

[0087] Water vapor transmission rate was evaluated according to JIS Z0208. First, calcium chloride (anhydrous) was placed in a 60 mm inner diameter moisture-permeable cup as a moisture absorbent. A 100 μm thick cured film (cured product) obtained using the above method, processed to a diameter of 70 mm, was placed on top of the moisture-permeable cup, covered with a guide, and then a ring was set. Heat-melted sealing wax was poured into the groove around the moisture-permeable cup. The sealing wax returned to room temperature and solidified, sealing the periphery of the cured film (cured product). The initial mass of the specimen thus obtained was measured, then placed in a constant temperature and humidity chamber at 40°C and 90% RH. It was weighed at 24-hour intervals. The mass increase per unit time was calculated for each of the two consecutive weighings. The value when this value stabilized within 5% was used and evaluated as follows: 〇:10g / m 2 Less than / day △: 10g / m 2 / day or more 100g / m 2 Less than / day ×:100g / m 2 / day or more

[0088] <Resolution> The photosensitive resin composition prepared as shown in Tables 1 and 2 above was applied to a carrier film. This was heated and dried for 30 minutes in a hot air dryer at 80°C to form a 20 μm-thick resin layer of the photosensitive resin composition, and a cover film was laminated onto the resin layer to obtain a photosensitive resin laminate. Thereafter, when in use, the cover film was peeled off, and the resin layer side was attached to a copper-clad laminate substrate. A projection exposure apparatus (manufactured by Ushio Inc.) equipped with a high-pressure mercury lamp was used to perform pattern exposure at an optimal exposure dose. After peeling off the carrier film, development was performed for 200 seconds using a 1% Na2CO3 aqueous solution at 30°C under conditions of a spray pressure of 0.2 MPa, forming a via pattern. This substrate was then heated in a UV conveyor furnace for an integrated exposure dose of 1000 mJ / cm2. 2 After irradiating with ultraviolet light under the conditions above, the composition was heated at 120°C for 60 minutes to be thermally cured. The resolution of the substrate thus prepared was observed using an electron microscope. The via opening size was confirmed and evaluated as follows. The results are shown in Tables 1 and 2. ◎: Via patterns of less than φ50um can be formed ◯: Via patterns of φ50um or more and less than φ100um can be formed △: Via patterns of φ100um or more can be formed ×: Opening shape cannot be formed

[0089] <Electroless gold plating> The photosensitive resin composition prepared as described in Tables 1 and 2 above was applied to a carrier film. This was heated and dried for 30 minutes in a hot air dryer at 80°C to form a 20 μm-thick resin layer of the photosensitive resin composition, and a cover film was attached to the resin layer to obtain a photosensitive resin laminate. The cover film was then peeled off before use, and the resin layer side was attached to a copper-clad laminate substrate. The resin layer and carrier film were thermally laminated, and pattern exposure was performed at an optimal exposure dose using a projection exposure apparatus (manufactured by Ushio Inc.) equipped with a high-pressure mercury lamp. After peeling off the carrier film, development was performed for 200 seconds using a 1% Na2CO3 aqueous solution at 30°C under conditions of a spray pressure of 0.2 MPa, forming a pattern of the photosensitive resin composition. This substrate was then exposed in a UV conveyor furnace with an integrated exposure dose of 1000 mJ / cm2. 2 After irradiating with ultraviolet light under the conditions above, the composition was heated at 120°C for 60 minutes to be thermally cured. The surface of the substrate with the cured film (cured product) thus prepared was subjected to a predetermined pretreatment (acid degreasing + soft etching + sulfuric acid treatment), and gold plating was performed using an electroless nickel plating bath and an electroless gold plating bath under the conditions of nickel 3 μm and gold 0.03 μm, and the presence or absence of peeling of the cured film (cured product) and the presence or absence of penetration of the plating solution were evaluated. The results are shown in Tables 1 and 2. 〇: No peeling or seepage at all. △: Slight peeling or soaking. ×: Peeling or soaking occurs.

[0090] <Fabrication of transparent antenna> An 18 μm thick electrolytic copper foil was bonded to a 100 μm thick transparent polyethylene terephthalate film using a transparent adhesive. After the electrolytic copper foil was subjected to a chemical conversion treatment (low-reflection treatment), a photosensitive resin laminate-type etching resist was laminated onto the copper foil. The etching resist was subjected to pattern exposure and development, forming an antenna pattern in the etching resist. The copper foil in areas without the etching resist pattern was removed by etching, and the etching resist was then peeled off, yielding a polyethylene terephthalate film with a copper antenna pattern formed thereon. This antenna pattern was a square mesh pattern with a line width of 20 μm and a line pitch of 300 μm. In this way, a transparent antenna substrate was produced.

[0091] <Visual evaluation> The photosensitive resin composition prepared as described in Tables 1 and 2 above was applied to a carrier film. This was heated and dried for 30 minutes in a hot air dryer at 80°C to form a 20 μm-thick resin layer of the photosensitive resin composition, and a cover film was attached to the resin layer to obtain a photosensitive resin laminate. The cover film was then peeled off before use, and the resulting photosensitive resin laminate was thermally laminated onto the side of the transparent antenna substrate on which the copper antenna pattern was formed. A pattern was then exposed to light at an optimal exposure dose using a projection exposure apparatus (manufactured by Ushio Inc.) equipped with a high-pressure mercury lamp. After peeling off the carrier film, a pattern of the photosensitive resin composition was formed by developing for 200 seconds using a 1% Na2CO3 aqueous solution at 30°C under conditions of a spray pressure of 0.2 MPa. This substrate was then exposed to light in a UV conveyor furnace at an integrated exposure dose of 1000 mJ / cm2. 2 After irradiating with ultraviolet light under the conditions above, the composition was heated at 120°C for 60 minutes to be thermally cured. The transparent antenna thus fabricated was placed on a piece of white paper with a black "+" character (10.0 mm long, 10.0 mm wide, 1.0 mm thick) printed on it in a room with an illuminance of 500 lux, the same as when ordinary fluorescent lights were turned on, and 10 people visually evaluated how the "+" character looked from a distance of 30 cm. The results are shown in Table 2. 〇: 10 out of 10 people can clearly see the character "ten" on the paper. △: 5 out of 10 people can clearly see the character "ten" on the paper. ×: 10 out of 10 people have difficulty seeing the "10" on the paper.

[0092] <Glass adhesion evaluation> The photosensitive resin composition prepared as described in Tables 1 and 2 above was applied to a carrier film. This was heated and dried for 30 minutes in a hot air dryer at 80°C to form a 20 μm-thick resin layer of the photosensitive resin composition, and a cover film was attached to the resin layer to obtain a photosensitive resin laminate. The cover film was then peeled off before use, and the resulting photosensitive resin laminate was thermally laminated onto the side of the transparent antenna substrate on which the copper antenna pattern was formed. A pattern was then exposed to light at an optimal exposure dose using a projection exposure apparatus (manufactured by Ushio Inc.) equipped with a high-pressure mercury lamp. After peeling off the carrier film, a pattern of the photosensitive resin composition was formed by developing for 200 seconds using a 1% Na2CO3 aqueous solution at 30°C under conditions of a spray pressure of 0.2 MPa. This substrate was then exposed to light in a UV conveyor furnace at an integrated exposure dose of 1000 mJ / cm2. 2 After irradiating with ultraviolet light under the conditions above, the composition was heated at 120°C for 60 minutes to be thermally cured. The transparent antenna thus fabricated was attached to a window separating two rooms with different illuminance levels using Nitto Denko's HJ-3160W transparent double-sided adhesive film. One room was set to an illuminance of 300 lux, the brightness of a normal fluorescent lamp, and the other room was set to an illuminance of 3000 lux, the brightness of a normal fluorescent lamp. The transparent antenna was observed by 10 people from a position 3 m away from the window. The results are shown in Tables 1 and 2. ◎: 10 out of 10 people did not notice any difference in cloudiness or color when looking from one room to the other Good: 8 to 9 people out of 10 did not notice any difference in cloudiness or color when looking from one room to the other. △: 3 to 7 out of 10 people did not notice any difference in cloudiness or color when looking from one room to the other. ×: Less than 2 people out of 10 people do not notice any difference in cloudiness or color when viewed from one room side or the other.

Claims

1. (A) a carboxyl group-containing resin; (B) a photopolymerization initiator; (C) a compound having an unsaturated double bond; (D) a thermosetting resin; (E) a filler having an average particle size of 120 nm or less; A photosensitive resin composition comprising: the (A) carboxyl group-containing resin contains an amide-imide resin obtained by reacting an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure with a tricarboxylic acid anhydride having an aliphatic structure, the content of the filler (E) having an average particle size of 120 nm or less is 5 to 35 mass% based on the total mass of the solid contents in the photosensitive resin composition, does not contain any filler other than the filler (E) having an average particle size of 120 nm or less, a cured product obtained from the photosensitive resin composition has a ratio of a total light transmittance at a wavelength of 550 nm to a total light transmittance at a wavelength of 430 nm in a film thickness of 20 μm in the range of 0.90 or more and less than 1.15; The haze value of the cured product at a wavelength of 550 nm is in the range of more than 0.0% and less than 2.0%. Photosensitive resin composition.

2. 2. The photosensitive resin composition according to claim 1, wherein the thermosetting resin (D) is an epoxy resin having a Gardner color scale of 5 or less.

3. 3. The photosensitive resin composition according to claim 1, further comprising (F) a thermosetting catalyst that is liquid at a temperature of 20°C or higher but lower than 70°C.

4. A photosensitive resin laminate comprising a resin layer obtained by applying the photosensitive resin composition according to any one of claims 1 to 3 onto a film and drying the applied resin layer.

5. A cured product obtained by curing the photosensitive resin composition according to any one of claims 1 to 3 or the resin layer of the photosensitive resin laminate according to claim 4.

6. The cured product of claim 5 has a water vapor permeability of 10 g / m2 at a film thickness of 100 μm. ２ The photosensitive resin composition according to any one of claims 1 to 3, wherein the curing time is less than 1 / day.

7. A transparent antenna comprising the cured product according to claim 5.

Images