Stripping system and stripping method

Abstract

To improve the efficiency of a series of stripping processes.SOLUTION: A stripping system according to an embodiment of the present disclosure includes a mounting unit, a removal device, and a transport device. On the mounting unit, a first cassette that can accommodate a superimposed substrate in which a first substrate and a second substrate are bonded via a separation layer, a second cassette that can accommodate the first substrate, and a third cassette that can accommodate the second substrate are placed. The removal device removes the separation layer by irradiating the superimposed substrate with a laser. The transport device performs a process of transporting the superimposed substrate to the removal device, and a process of transporting the first substrate and the second substrate separated from the superimposed substrate to the mounting unit.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to stripping systems and methods. [Background technology]

[0002] Conventionally, a technique has been known in which a separation layer (first material layer) is formed between a substrate and a layer to be peeled, a part of the separation layer is irradiated with laser light to remove the part of the separation layer, and then the layer to be peeled off from the substrate using physical force, such as by human hands. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-163338 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that can improve the efficiency of a series of peeling processes. [Means for solving the problem]

[0005] A delamination system according to one embodiment of the present disclosure includes a mounting unit, a removal device, and a transport device. The mounting unit is configured to mount a first cassette capable of accommodating a laminated substrate in which a first substrate and a second substrate are bonded via a separation layer, a second cassette capable of accommodating the first substrate, and a third cassette capable of accommodating the second substrate. The removal device irradiates the laminated substrate with a laser to remove the separation layer. The transport device transports the laminated substrate to the removal device and transports the first substrate and second substrate separated from the laminated substrate to the mounting unit. [Effects of the Invention]

[0006] According to the present disclosure, the efficiency of a series of peeling processes can be improved. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic plan view showing the configuration of a separation system according to an embodiment. [Figure 2] FIG. 2 is a schematic side view of the laminated substrate according to the embodiment. [Figure 3] FIG. 3 is a schematic side view showing the configuration of the second transfer device according to the embodiment. [Figure 4] FIG. 4 is a schematic side view showing the configuration of the removal device according to the embodiment. [Figure 5] FIG. 5 is a schematic side view showing the configuration of a peeling device according to an embodiment. [Figure 6] FIG. 6 is a diagram showing an example of the operation of the delamination process by the delamination device. [Figure 7] FIG. 7 is a diagram showing an example of the operation of the delamination process by the delamination device. [Figure 8] FIG. 8 is a diagram showing an example of the operation of the delamination process by the delamination device. [Figure 9] FIG. 9 is a diagram showing an example of the operation of the delamination process by the delamination device. [Figure 10] FIG. 10 is a diagram showing an example of the operation of the delamination process by the delamination device. [Figure 11] FIG. 11 is a diagram showing an example of the operation of the delamination process by the delamination device. [Figure 12] FIG. 12 is a schematic side view showing the configuration of the cleaning device according to the embodiment. [Figure 13] FIG. 13 is a block diagram showing the configuration of the control device according to the embodiment. [Figure 14] FIG. 14 is a flowchart illustrating a procedure of a process executed by the separation system according to the embodiment. [Figure 15] FIG. 15 is a diagram illustrating an example of the configuration of a detection unit according to the first modified example. [Figure 16] FIG. 16 is a diagram showing an example of the operation of the peeled state determination process according to the first modified example. [Figure 17] FIG. 17 is a diagram showing an example of the operation of the peeled state determination process according to the first modified example. [Figure 18] FIG. 18 is a schematic plan view showing the configuration of a separation system according to a second modified example. [Figure 19] FIG. 19 is a diagram showing an example of the operation of the peeling process according to the second modified example. [Figure 20] FIG. 20 is a diagram showing an example of the operation of the peeling process according to the second modified example. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, with reference to the accompanying drawings, a detailed description will be given of a mode for carrying out the peeling system and peeling method disclosed in the present application (hereinafter referred to as "embodiments"). Note that the present disclosure is not limited to these embodiments. Furthermore, each embodiment and modified example can be appropriately combined within the scope of not causing any contradiction in the processing content. Furthermore, in each of the following embodiments and modified examples, the same parts are given the same reference numerals, and duplicated explanations will be omitted.

[0009] Furthermore, in the following embodiments, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not necessarily mean "constant," "orthogonal," "perpendicular," or "parallel" in the strict sense. In other words, the above expressions allow for deviations due to, for example, manufacturing precision, installation precision, etc.

[0010] In addition, for ease of understanding, the drawings referred to below may show an orthogonal coordinate system in which the X-axis, Y-axis, and Z-axis directions are defined as being orthogonal to each other, with the positive Z-axis direction being the vertically upward direction. Also, the direction of rotation around the vertical axis may be referred to as the θ direction.

[0011] It should be noted that the drawings are schematic and that the dimensional relationships and ratios of each element may differ from reality. Furthermore, there may be parts in which the dimensional relationships and ratios of each element differ from those of the drawings.

[0012] <Overall configuration of peeling system 1> First, the configuration of a delamination system 1 according to an embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a schematic plan view showing the configuration of the delamination system 1 according to an embodiment. Fig. 2 is a schematic side view of a laminated substrate according to an embodiment.

[0013] The delamination system 1 shown in FIG. 1 separates a laminated substrate T, in which a first substrate W1 and a second substrate W2 are bonded together, into the first substrate W1 and the second substrate W2.

[0014] The first substrate W1 is a semiconductor wafer such as a silicon substrate. The first substrate W1 has a surface film F. The surface film F is, for example, an adhesive. However, the surface film F is not limited thereto and may be an SiO2 film, a TEOS film, a SiC film, a SiCN film, or the like. The first substrate W1 may also have a device layer at the interface with the surface film F.

[0015] The second substrate W2 is also a semiconductor wafer such as a silicon substrate. The second substrate W2 has a separation layer P. The separation layer P is located between the second substrate W2 and the surface film F. The separation layer P absorbs the laser light irradiated from the laser irradiation unit 39, as will be described later. The separation layer P is, for example, a metal film. Note that, in order to increase the transmittance of the laser light, the second substrate W2 may have a film such as an anti-reflection film on both sides. In this case, the separation layer P is formed on the film such as the anti-reflection film. Note that the second substrate W2 may be a glass substrate, a TFT (Thin Film Transistor) substrate, or the like.

[0016] The first substrate W1 and the second substrate W2 are bonded together via a surface film F and a separation layer P.

[0017] 1, the peeling system 1 includes a loading / unloading station 2 and a processing station 3. The loading / unloading station 2 and the processing station 3 are arranged in the positive direction of the X-axis in this order. The loading / unloading station 2 and the processing station 3 are also integrally connected.

[0018] The loading / unloading station 2 includes a mounting section 10 and a transport area 20. The mounting section 10 includes a plurality of mounting plates 11. A first cassette C1, a second cassette C2, and a third cassette C3 are mounted on each mounting plate 11, and each cassette holds a plurality of substrates (e.g., 25 substrates) in a horizontal position. The first cassette C1 is a cassette that houses a superimposed substrate T, the second cassette C2 is a cassette that houses a first substrate W1, and the third cassette C3 is a cassette that houses a second substrate W2. In addition to the cassettes C1 to C3, the mounting plate 11 may also house, for example, a fourth cassette C4 for recovering defective substrates.

[0019] The transport area 20 is disposed adjacent to the placement unit 10 on the positive side of the X-axis. The transport area 20 is provided with a transport path 21 extending in the Y-axis direction and a first transport device 22 movable along the transport path 21.

[0020] The first transfer device 22 is movable not only in the Y-axis direction but also in the X-axis direction and rotatable around the Z-axis. The first transfer device 22 transfers the laminated substrate T, the first substrate W1, and the second substrate W2 between the cassettes C1 to C3 placed on the mounting plate 11 and the third processing block G3 of the processing station 3, which will be described later.

[0021] Processing station 3 is provided with multiple processing blocks equipped with various devices, for example, three processing blocks G1, G2, and G3. For example, a first processing block G1 is provided on the front side of processing station 3 (the negative Y-axis side in FIG. 1), and a second processing block G2 is provided on the back side of processing station 3 (the positive Y-axis side in FIG. 1). Furthermore, a third processing block G3 is provided on the loading / unloading station 2 side of processing station 3 (the negative X-axis side in FIG. 1).

[0022] The first processing block G1 is provided with a removal device 30. The removal device 30 irradiates the laminated substrate T with laser light from above the laminated substrate T to remove the separation layer P. The configuration of the removal device 30 will be described later.

[0023] The second processing block G2 is provided with a peeling device 40 and a cleaning device 50. The peeling device 40 separates the laminated substrate T into the first substrate W1 and the second substrate W2 by pulling the laminated substrate T in a direction separating the first substrate W1 and the second substrate W2 while suction-holding both surfaces of the laminated substrate T. The configuration of the peeling device 40 will be described later.

[0024] The cleaning device 50 cleans the surface of the first substrate W1 separated from the laminated substrate T. The cleaning device 50 may clean not only the first substrate W1 but also the second substrate W2. The configuration of the cleaning device 50 will be described later.

[0025] In the third processing block G3, transition devices (transfer units) for the laminated substrate T, the first substrate W1, and the second substrate W2 are arranged in a multi-tiered stack.

[0026] A transfer region 60 is formed in an area surrounded by the first processing block G1, the second processing block G2, and the third processing block G3. A second transfer device 70 is disposed in the transfer region 60. The second transfer device 70 has a transfer arm that is movable, for example, vertically, horizontally, and around a vertical axis.

[0027] The second transfer device 70 moves within the transfer region 60 and transfers the laminated substrate T, the first substrate W1, and the second substrate W2 to given devices within the first processing block G1, the second processing block G2, and the third processing block G3 adjacent to the transfer region 60. The configuration of the second transfer device 70 will be described later.

[0028] The peeling system 1 also includes a control device 80. The control device 80 controls the operation of the peeling system 1. The configuration of the control device 80 will be described later.

[0029] The arrangement of the removal apparatus 30, the peeling apparatus 40, and the cleaning apparatus 50 shown in FIG. 1 is merely an example. For example, the peeling apparatus 40 may be arranged adjacent to the removal apparatus 30. While the example shown here illustrates a case in which the peeling system 1 includes one each of the removal apparatus 30, the peeling apparatus 40, and the cleaning apparatus 50, the peeling system 1 may include multiple removal apparatuses 30, multiple peeling apparatuses 40, and multiple cleaning apparatuses 50. For example, the peeling system 1 may be configured such that the first processing block G1 includes one each of the removal apparatus 30, the peeling apparatus 40, and the cleaning apparatus 50, and the second processing block G2 also includes one each of the removal apparatus 30, the peeling apparatus 40, and the cleaning apparatus 50. Furthermore, the multiple removal apparatuses 30, the multiple peeling apparatuses 40, and the multiple cleaning apparatuses 50 may each be stacked in multiple stages.

[0030] <Second conveying device 70> Next, the configuration of the second transfer device 70 will be described with reference to Fig. 3. Fig. 3 is a schematic side view showing the configuration of the second transfer device 70 according to the embodiment.

[0031] 3, the second transfer device 70 includes a first holding unit 71, a second holding unit 72, a first advancing / retreating mechanism 73, a second advancing / retreating mechanism 74, a lifting mechanism 75, and a horizontal movement mechanism 76. The second transfer device 70 also includes an inverting mechanism 77.

[0032] The first holding part 71 holds the first substrate W1. The second holding part 72 is disposed above the first holding part 71 and holds the second substrate W2. The first holding part 71 and the second holding part 72 each include, for example, a bifurcated, flat base part 710, 720, and a plurality of suction pads 711, 721 provided on the surface of the base part 710, 720.

[0033] The plurality of suction pads 711 included in the first holding unit 71 are connected to a suction device 713 via suction pipes 712. The suction device 713 is, for example, a vacuum pump. The first holding unit 71 can adsorb the first substrate W1 onto the suction pads 711 using the suction force generated by the suction device 713. Similarly, the plurality of suction pads 721 included in the second holding unit 72 are connected to the suction device 723 via suction pipes 722. The second holding unit 72 can adsorb the second substrate W2 onto the suction pads 721 using the suction force generated by the suction device 723. In this way, the first holding unit 71 and the second holding unit 72 horizontally adsorb and hold the first substrate W1 and the second substrate W2, respectively.

[0034] The first advancing / retreating mechanism 73 advances and retreats the first holding unit 71 in the horizontal direction, specifically, along the Y-axis direction perpendicular to the extension direction of the transport area 60. The second advancing / retreating mechanism 74 advances and retreats the second holding unit 72 along the Y-axis direction.

[0035] The lifting mechanism 75 moves the first advancing / retreating mechanism 73 and the second advancing / retreating mechanism 74 in the vertical direction, thereby lifting and lowering the first holding unit 71 and the second holding unit 72. The lifting mechanism 75 can lift and lower the first advancing / retreating mechanism 73 and the second advancing / retreating mechanism 74 independently. The first advancing / retreating mechanism 73, the second advancing / retreating mechanism 74, and the lifting mechanism 75 may be configured, for example, by a horizontal articulated robot. The horizontal movement mechanism 76 moves the lifting mechanism 75 along the X-axis direction, thereby horizontally moving the first holding unit 71 and the second holding unit 72 in the extension direction of the transfer area 60 (the X-axis direction). The reversing mechanism 77 reverses the second holding unit 72.

[0036] <Removal device 30> Next, the configuration of the removal device 30 will be described with reference to Fig. 4. Fig. 4 is a schematic side view showing the configuration of the removal device 30 according to the embodiment.

[0037] As shown in Fig. 4, the removal device 30 has a chuck 31 that suction-holds the upper surface of the laminated substrate T. The chuck 31 suction-holds the entire lower surface (the surface on the first substrate W1 side) of the laminated substrate T. Note that the chuck 31 may suction-hold only a portion of the lower surface of the laminated substrate T. The chuck 31 is provided with a plurality of lifting pins 32 for supporting the laminated substrate T from below and lifting it up and down. The plurality of lifting pins 32 are inserted into through-holes (not shown) formed through the chuck 31, and are configured to be freely raised and lowered by a lifting mechanism 320.

[0038] The chuck 31 is supported by a slider table 34 via an air bearing 33. A rotation mechanism 35 is provided on the underside of the slider table 34. The rotation mechanism 35 has a built-in motor, for example, as a drive source. The chuck 31 is configured to be rotatable around the θ-axis (vertical axis) via the air bearing 33 by the rotation mechanism 35. The slider table 34 is configured to be movable along a rail 38 that is provided on a base 37 and extends in the Y-axis direction by a movement mechanism 36 provided on the underside of the slider table 34. The drive source of the movement mechanism 36 is not particularly limited, but a linear motor, for example, is used.

[0039] The removal device 30 also includes a laser irradiation unit 39. The laser irradiation unit 39 is disposed above the chuck 31 and irradiates laser light toward the upper surface of the chuck 31, in other words, toward the upper surface of the laminated substrate T held by suction on the chuck 31.

[0040] The laser light is, for example, an infrared laser light. Alternatively, the laser light may be a CO2 laser light. The laser light emitted from the laser irradiation unit 39 passes through the second substrate W2 and is irradiated onto the separation layer P. The laser irradiation unit 39 is configured to be freely raised and lowered by an elevation mechanism (not shown). A light source of the laser light is provided at a position outside the laser irradiation unit 39.

[0041] Here, an example of the removal process by the removal device 30 configured as described above will be described. The laminated substrate T is carried into the removal device 30 by the second transfer device 70, and placed on a plurality of lifting pins 32 protruding from the upper surface of the chuck 31.

[0042] The removal device 30 uses the lifting mechanism 320 to lower the plurality of lifting pins 32, thereby placing the laminated substrate T placed on the plurality of lifting pins 32 on the upper surface of the chuck 31. Thereafter, the removal device 30 uses the chuck 31 to suction-hold the laminated substrate T.

[0043] Next, the removal device 30 irradiates the upper surface of the laminated substrate T with laser light, for example in pulses, from the laser irradiation unit 39. The laser light passes through the second substrate W2 and is absorbed by the separation layer P. Then, this laser light causes peeling at the interface between the separation layer P and the second substrate W2.

[0044] While the separation layer P is being irradiated with the laser light, the removal apparatus 30 rotates the chuck 31 and the superimposed substrate T using the rotation mechanism 35 and moves the chuck 31 in the Y-axis direction using the movement mechanism 36. The laser light is then irradiated onto the separation layer P from the outside to the inside in the radial direction, resulting in a spiral irradiation from the outside to the inside. The removal apparatus 30 may also control the rotation mechanism 35 and the movement mechanism 36 so that the laser light is irradiated concentrically rather than spirally. In this case, the removal apparatus 30 may alternately rotate the chuck 31 once using the rotation mechanism 35 and horizontally move the chuck 31 using the movement mechanism 36. While the example of horizontally moving the chuck 31 has been described above, the removal apparatus 30 may also be configured to horizontally move the laser irradiation unit 39. In this case, the removal apparatus 30 may be provided with a movement mechanism that horizontally moves the laser irradiation unit 39.

[0045] The delamination system 1 includes a detection unit 101. In the embodiment, the detection unit 101 is a distance measurement unit. The detection unit 101 as a distance measurement unit is provided in the removal device 30. Specifically, the detection unit 101 is disposed above the chuck 31, and measures a distance D from a reference position in the detection unit 101 to the upper surface of the laminated substrate T. In the delamination system 1 according to the embodiment, based on the detection result of the detection unit 101, it is determined whether the laminated substrate T has been separated into the first substrate W1 and the second substrate W2 in the removal process by the removal device 30.

[0046] <Peeling device 40> Next, the configuration of the peeling device 40 will be described with reference to Fig. 5. Fig. 5 is a schematic side view showing the configuration of the peeling device 40 according to the embodiment.

[0047] As shown in FIG. 5, the peeling device 40 includes a first suction unit 41, a second suction unit 42, and an inversion mechanism 44.

[0048] The first suction portion 41 suction-holds the upper surface of the laminated substrate T. The first suction portion 41 suction-holds the entire lower surface (the surface on the first substrate W1 side) of the laminated substrate T. The first suction portion 41 is provided with a plurality of lifting pins 45. The plurality of lifting pins 45 are inserted into through-holes (not shown) formed through the first suction portion 41, and are configured to be freely raised and lowered by a lifting mechanism 410.

[0049] The second suction portion 42 is disposed above the first suction portion 41 and suction-holds the overlapped substrate T. The second suction portion 42 suction-holds the entire upper surface (the surface on the second substrate W2 side) of the overlapped substrate T. The second suction portion 42 is provided with a plurality of lifting pins 46. The plurality of lifting pins 46 are inserted into through-holes (not shown) formed through the second suction portion 42 and are configured to be freely raised and lowered by a lifting mechanism 460. The inversion mechanism 44 inverts the second suction portion 42 and the plurality of lifting pins 46 together.

[0050] An example of the operation of the peeling process by the peeling device 40 will now be described with reference to Figures 6 to 11. Figures 6 to 11 are diagrams showing an example of the operation of the peeling process by the peeling device 40.

[0051] The laminated substrate T is carried into the peeling device 40 by the second transport device 70, and placed on a plurality of lifting pins 45 protruding from the upper surface of the first suction section 41 (see FIG. 6).

[0052] Next, the peeling device 40 uses the lifting mechanism 410 to lift the first suction portion 41, thereby placing the laminated substrate T placed on the plurality of lifting pins 45 on the upper surface of the first suction portion 41 (see FIG. 7). Thereafter, the peeling device 40 uses the first suction portion 41 to suck and hold the laminated substrate T.

[0053] Next, the peeling device 40 further raises the first suction portion 41 to bring the upper surface of the laminated substrate T into contact with the lower surface (the suction surface) of the second suction portion 42 (see FIG. 8). Thereafter, the peeling device 40 uses the second suction portion 42 to suction-hold the laminated substrate T.

[0054] Next, the peeling device 40 uses the lifting mechanism 410 to lower the first suction portion 41 while the upper and lower surfaces of the laminated substrate T are suction-held by the first suction portion 41 and the second suction portion 42. This separates the laminated substrate T into the first substrate W1 and the second substrate W2 (see FIG. 9). The peeling device 40 releases the suction-holding of the first substrate W1 by the first suction portion 41.

[0055] Next, the peeling device 40 uses the reversing mechanism 44 to reverse the second suction portion 42 and the plurality of lifting pins 46 (see FIG. 10). Thereafter, the peeling device 40 releases the second suction portion 42 from suction holding of the second substrate W2.

[0056] Next, the peeling device 40 lowers the first suction unit 41 to transfer the first substrate W1 to the plurality of lift pins 45 (see FIG. 11). The peeling device 40 also raises the lift pins 46 to transfer the second substrate W2 to the plurality of lift pins 46. The first substrate W1 and the second substrate W2 are then carried out of the peeling device 40 by the second transfer device 70. The second transfer device 70 receives the first substrate W1 placed on the plurality of lift pins 45 by using the first holding unit 71 to scoop up the first substrate W1 from below, and then suction-holds the received first substrate W1. Similarly, the second transfer device 70 receives the second substrate W2 placed on the plurality of lift pins 46 by using the second holding unit 72 to scoop up the second substrate W2 from below, and then suction-holds the received second substrate W2. The second transfer device 70 may unload the first substrate W1 and the second substrate W2 simultaneously or sequentially.

[0057] <Cleaning device 50> Next, the configuration of the cleaning device 50 will be described with reference to Fig. 12. Fig. 12 is a schematic side view showing the configuration of the cleaning device 50 according to the embodiment.

[0058] As shown in FIG. 12, the cleaning apparatus 50 includes a chamber 51, a substrate holding mechanism 52, a processing liquid supply unit 54, and a collection cup 55.

[0059] The chamber 51 accommodates a substrate holding mechanism 52, a processing liquid supply unit 54, and a collection cup 55. An FFU (Fan Filter Unit) 511 is provided on the ceiling of the chamber 51. The FFU 511 forms a downflow within the chamber 51.

[0060] The substrate holding mechanism 52 includes a holder 521, a support 522, and a driver 523. The holder 521 holds the first substrate W1 or the second substrate W2 horizontally. The support 522 is a member extending in the vertical direction, and its base end is rotatably supported by the driver 523, with its tip end supporting the holder 521 horizontally. The driver 523 rotates the support 522 around a vertical axis. The substrate holding mechanism 52 rotates the support 522 using the driver 523, thereby rotating the holder 521 supported by the support 522, and thereby rotating the first substrate W1 or the second substrate W2 held by the holder 521.

[0061] The processing liquid supply unit 54 supplies a cleaning liquid to the first substrate W1 or the second substrate W2. The processing liquid supply unit 54 is connected to a processing fluid supply source 541.

[0062] The collection cup 55 is disposed to surround the holder 521, and collects the processing liquid scattered from the first substrate W1 or the second substrate W2 by the rotation of the holder 521. A drain port 551 is formed in the bottom of the collection cup 55, and the cleaning liquid collected by the collection cup 55 is discharged from the drain port 551 to the outside of the cleaning apparatus 50. In addition, an exhaust port 552 is formed in the bottom of the collection cup 55, which discharges the gas supplied from the FFU 511 to the outside of the cleaning apparatus 50.

[0063] <Control device 80> Next, the configuration of the control device 80 will be described with reference to Fig. 13. Fig. 13 is a block diagram showing the configuration of the control device 80 according to the embodiment.

[0064] 13, the control device 80 is, for example, a computer, and includes a control unit 81 and a storage unit 82. The storage unit 82 stores programs for controlling various processes such as the removal process and the peeling process. The control unit 81 controls the operation of the peeling system 1 by reading and executing the programs stored in the storage unit 82.

[0065] Such a program may be recorded on a computer-readable recording medium and installed from that recording medium into the storage unit 82 of the control device 80. Examples of computer-readable recording media include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

[0066] The control unit 81 is electrically connected to the detection unit 101, the first transfer device 22, the removal device 30, the peeling device 40, the cleaning device 50, the second transfer device 70, etc., and controls the operations of the first transfer device 22, the removal device 30, the peeling device 40, the cleaning device 50, the second transfer device 70, etc. In particular, the control unit 81 according to the embodiment changes the transfer route of the substrate (first substrate W1, second substrate W2, or overlapped substrate T) according to the detection result by the detection unit 101, i.e., the measurement result of the distance D to the top surface of the overlapped substrate T in the removal device 30.

[0067] Next, a specific operation of the delamination system 1 will be described with reference to Fig. 14. Fig. 14 is a flowchart showing the procedure of processing executed by the delamination system 1 according to the embodiment. Note that the series of processing shown in Fig. 14 is executed under the control of the control unit 81.

[0068] 14, in the separation system 1, first, a carry-in process is performed (step S101). In the carry-in process, the first transfer device 22 removes the laminated substrate T from the first cassette C1 and places it on a transition device arranged in the third processing block G3. Next, the second transfer device 70 removes the laminated substrate T from the transition device and carries it into the removal device 30. The removal device 30 lowers the plurality of lift pins 32 to transfer the laminated substrate T placed on the plurality of lift pins 32 to the chuck 31. Then, the removal device 30 uses the chuck 31 to suction-hold the laminated substrate T.

[0069] Next, a pre-processing measurement process is performed in the delamination system 1 (step S102). In the pre-processing measurement process, the distance D to the top surface of the laminated substrate T is measured using the detection unit 101.

[0070] Subsequently, in the delamination system 1, a removal process is performed (step S103). As a result, the separation layer P is removed from the laminated substrate T.

[0071] Subsequently, a post-processing measurement process is performed in the delamination system 1 (step S104). In the post-processing measurement process, the distance D to the top surface of the laminated substrate T is measured again using the detection unit 101.

[0072] Next, the control unit 81 determines whether or not the separation of the superposed substrate T has been achieved by the removal process (step S105). Specifically, if the separation of the superposed substrate T has been achieved, that is, if the separation layer P has been completely removed and the superposed substrate T has been completely separated into the first substrate W1 and the second substrate W2, the second substrate W2 will rise from the first substrate W1, thereby reducing the distance D. Alternatively, the second substrate W2 may sink, thereby increasing the distance D. In either case, if the separation of the superposed substrate T has been achieved, the distance D will change.

[0073] The control unit 81 determines that peeling of the laminated substrate T has been achieved when the absolute value of the difference between the measurement result in the pre-processing measurement process (distance D before the removal process) and the measurement result in the post-processing measurement process (distance D after the removal process) exceeds a threshold value.

[0074] When it is determined in step S105 that the separation of the laminated substrate T has been achieved (Yes in step S105), the separation system 1 performs a cleaning process (step S106).

[0075] In the cleaning process, the second transfer device 70 carries the second substrate W2 out of the removal device 30 and into the cleaning device 50. Specifically, the second transfer device 70 suction-holds the upper surface of the second substrate W2 using the second holding unit 72 with the suction pads 721 of the second holding unit 72 facing downward. Next, the second transfer device 70 lifts the second substrate W2 by raising the second holding unit 72 using the lifting mechanism 75, and then removes the second substrate W2 from the removal device 30. Next, the second transfer device 70 inverts the second holding unit 72 using the inverting mechanism 77, thereby inverting the second substrate W2. Thereafter, the second transfer device 70 carries the second substrate W2 with the peeled surface facing upward into the cleaning device 50. Then, the cleaning device 50 cleans the peeled surface of the second substrate W2.

[0076] The second transfer device 70 then carries the first substrate W1 out and into the cleaning device 50. Specifically, the removal device 30 releases the suction hold by the chuck 31, and then uses the lifting mechanism 320 to raise the plurality of lifting pins 32. The second transfer device 70 then receives the first substrate W1 supported by the plurality of lifting pins 32 by scooping it up from below, and carries the received first substrate W1 into the cleaning device 50.

[0077] Although an example has been shown here in which both the first substrate W1 and the second substrate W2 are cleaned by the cleaning apparatus 50, the delamination system 1 does not necessarily need to clean the second substrate W2. When cleaning of the second substrate W2 is not performed, the delamination system 1 may omit the cleaning process for the second substrate W2 and perform the carry-out process described below.

[0078] Next, in the separation system 1, the first substrate W1 and the second substrate W2 are unloaded. In the unloading process, the second transfer device 70 removes the first substrate W1 after the cleaning process from the cleaning device 50 and places it in the transition device of the third processing block G3. Then, the first transfer device 22 removes the first substrate W1 from the transition device and stores it in the second cassette C2. Similarly, the second transfer device 70 removes the second substrate W2 after the cleaning process from the cleaning device 50 and places it in the transition device of the third processing block G3. Then, the first transfer device 22 removes the second substrate W2 from the transition device and stores it in the third cassette C3. Note that if the second substrate W2 is not to be cleaned, the second transfer device 70 removes the second substrate W2 from the removal device 30 and places it in the transition device of the third processing block G3.

[0079] On the other hand, if the separation of the laminated substrate T has not been achieved in step S105 (step S105, No), the separation system 1 performs a separation process (step S108).

[0080] In the peeling process, first, the second transfer device 70 takes out the laminated substrate T from the removal device 30 and carries it into the peeling device 40. Thereafter, the peeling device 40 performs the above-described peeling process on the laminated substrate T, thereby separating the laminated substrate T into the first substrate W1 and the second substrate W2.

[0081] Thereafter, a cleaning process (step S106) and a carrying-out process (step S107) are performed in the delamination system 1. Specifically, the second transfer device 70 sequentially transfers the first substrate W1 and the second substrate W2 from the delamination device 40 to the cleaning device 50, and the cleaning device 50 sequentially performs a cleaning process on the transferred first substrate W1 and second substrate W2. Note that the delamination system 1 does not necessarily need to perform a cleaning process on the second substrate W2.

[0082] When the carrying-out process in step S107 is completed, the separation system 1 completes the series of separation processes.

[0083] The bonding state of the overlapped substrates T (for example, bonding strength, thickness of the separation layer P, etc.) may differ between overlapped substrates T. Furthermore, the state of laser irradiation in the removal process may differ for each process. Due to these circumstances, the peeling state of the overlapped substrates T after the removal process may differ between overlapped substrates T. That is, some overlapped substrates T are properly separated into the first substrate W1 and the second substrate W2 by the removal process, while in other overlapped substrates T the separation layer P cannot be completely removed and the first substrate W1 and the second substrate W2 are not completely separated.

[0084] Therefore, in the delamination system 1 according to the embodiment, it is determined whether or not the delamination of the overlapped substrate T has been achieved by the removal process based on the detection result by the detection unit 101, and the subsequent process is changed depending on the determination result. That is, when the delamination of the overlapped substrate T has been achieved, the delamination system 1 cleans and carries out the separated first substrate W1 and second substrate W2, while for the overlapped substrate T for which the delamination of the overlapped substrate T has not been achieved, the delamination system 1 performs the delamination process using the delamination device 40.

[0085] In the delamination system 1, the delamination process is performed only on the laminated substrate T for which delamination has not been achieved, and is not performed on the laminated substrate T for which delamination has been achieved. Therefore, the delamination system 1 according to the embodiment can improve the efficiency of the series of delamination processes.

[0086] (First Modification) Fig. 15 is a diagram showing an example of the configuration of a detection unit according to the first modified example, and Figs. 16 and 17 are diagrams showing an example of the operation of the peeled state determination process according to the first modified example.

[0087] In the above-described embodiment, an example has been described in which the detection unit 101 is a distance measurement unit that measures the distance D to the top surface of the laminated substrate T placed on the chuck 31 of the removal device 30. However, the detection unit 101 does not necessarily have to be a distance measurement unit.

[0088] 15, the peeling system 1 may include a detection unit 103. The detection unit 103 is a load detection unit that is provided in the lifting mechanism 75 and detects the load or torque associated with the lifting mechanism 75. The detection unit 103 as a load detection unit is, for example, a load cell or a torque sensor.

[0089] The peeling system 1 may also include a detection unit 102. The detection unit 102 is a pressure detection unit that detects the suction pressure of the suction pad 721 of the second holding unit 72 of the second conveying device 70. The detection unit 102 as a pressure detection unit is provided, for example, in the middle of the suction pipe 722.

[0090] 16 , after the removal process is completed, the control unit 81 causes the second transfer device 70 to suck and hold the upper surface of the laminated substrate T using the suction pads 721 of the second holding unit 72, with the laminated substrate T being sucked and held by the chuck 31. Thereafter, the control unit 81 causes the lifting mechanism 75 of the second transfer device 70 to lift the second holding unit 72. The detection unit 103, which serves as a load detection unit, detects the load acting on the lifting mechanism 75 when the second holding unit 72 is lifted.

[0091] The control unit 81 determines whether the load detected by the detection unit 103 exceeds a threshold value. If the load detected by the detection unit 103 is equal to or less than the threshold value, the control unit 81 determines that the separation of the superposed substrate T has been achieved by the removal process. On the other hand, if the load detected by the detection unit 103 exceeds the threshold value, the control unit 81 determines that the separation of the superposed substrate T has not been achieved by the removal process. In this case, the control unit 81 performs the separation process on the superposed substrate T using the separation device 40.

[0092] Furthermore, the detection unit 102, which functions as a pressure detection unit, detects the suction pressure of the suction pad 721 when the second holding unit 72 is raised. If the bonding force between the first substrate W1 and the second substrate W2 is greater than the suction force of the suction pad 721 when the superposed substrate T is not peeled off in the removal process, the suction pad 721 will come off the upper surface of the superposed substrate T, as shown in FIG. 17 . At this time, the suction pressure detected by the detection unit 102 drops sharply. Therefore, if the suction pressure detected by the detection unit 102 is equal to or less than a threshold value, the control unit 81 determines that the superposed substrate T has not been peeled off in the removal process. In this case, the control unit 81 performs a peeling process on the superposed substrate T using the peeling device 40. On the other hand, if the suction pressure detected by the detection unit 102 exceeds the threshold value, the control unit 81 determines that the superposed substrate T has been peeled off in the removal process.

[0093] Although an example in which the peeling system 1 is equipped with both the detection unit 102 and the detection unit 103 has been described here, the peeling system 1 may also be configured to be equipped with only one of the detection unit 102 and the detection unit 103.

[0094] (Second Modification) Fig. 18 is a schematic plan view showing the configuration of a delamination system 1 according to the second modified example, and Figs. 19 and 20 are views showing an example of the operation of the delamination process according to the second modified example.

[0095] In the above-described embodiment, an example has been described in which the stripping system 1 includes the stripping device 40 and the cleaning device 50. However, the configuration of the stripping system 1 is not limited to the above example.

[0096] 18, the delamination system 1 may be configured without the delamination device 40 and the cleaning device 50. The delamination system 1 may be configured with at least the load / unload station 2, the third processing block G3 (transition device), the remover 30, and the second transfer device 70.

[0097] Assume that the control unit 81 determines that the removal process has not achieved peeling of the laminated substrate T based on the detection result by the detection unit 101, which serves as a distance measurement unit, for example. In this case, after the removal process is completed, the control unit 81 causes the second transfer device 70 to suck and hold the upper surface of the laminated substrate T using the suction pad 721 of the second holding unit 72, with the laminated substrate T being sucked and held by the chuck 31, as shown in FIG.

[0098] 20, the control unit 81 separates the laminated substrate T into the first substrate W1 and the second substrate W2 by raising the second holding unit 72 using the lifting mechanism 75 of the second transfer device 70. With this configuration, the laminated substrate T that has not been separated by the removal process can be separated into the first substrate W1 and the second substrate W2 without the need to separately provide a separation device 40.

[0099] (Other variations) In the above-described embodiment, the removal device 30 determines whether or not separation of the laminated substrate T has been achieved, and performs the separation process only on the laminated substrates T for which separation has not been achieved. However, the separation system 1 may perform the removal process in the removal device 30 so that a portion of the separation layer P intentionally remains, and then perform the separation process by the removal device 40 on all of the laminated substrates T after the removal process. For example, the removal system 1 may leave the separation layer P located at the outer periphery of the laminated substrate T in the removal device 30, and remove the remaining separation layer P. Alternatively, the removal system 1 may leave the separation layer P located at the center of the laminated substrate T in the removal device 30, and remove the remaining separation layer P.

[0100] The delamination system 1 may also perform the delamination process using the first holding unit 71 and the second holding unit 72 of the second transfer device 70. Specifically, the second transfer device 70 adsorbs and holds the lower surface of the laminated substrate T using the suction pad 711 of the first holding unit 71, and adsorbs and holds the upper surface of the laminated substrate T using the suction pad 721 of the second holding unit 72. The control unit 81 then controls the lifting mechanism 75 to separate the first holding unit 71 and the second holding unit 72. For example, the control unit 81 may lower the first holding unit 71 while maintaining the height of the second holding unit 72, or may raise the second holding unit 72 while maintaining the height of the first holding unit 71. The control unit 81 may also lower the first holding unit 71 and raise the second holding unit 72. This allows the laminated substrate T to be separated into the first substrate W1 and the second substrate W2.

[0101] As described above, the delamination system according to the embodiment (for example, the delamination system 1) includes a mounting unit (for example, the mounting unit 10), a removal device (for example, the removal device 30), and transport devices (for example, the first transport device 22 and the second transport device 70). The mounting unit receives a first cassette (for example, the first cassette C1) capable of accommodating an overlapped substrate (for example, an overlapped substrate T) in which a first substrate (for example, a first substrate W1) and a second substrate (for example, a second substrate W2) are bonded via a separation layer (for example, a separation layer P), a second cassette (for example, the second cassette C2) capable of accommodating the first substrate, and a third cassette (for example, the third cassette C3) capable of accommodating the second substrate. The removal device irradiates a laser onto the overlapped substrate to remove the separation layer. The transport device performs a process of transporting the overlapped substrate to the removal device and a process of transporting the first substrate and the second substrate separated from the overlapped substrate to the mounting unit.

[0102] Therefore, the peeling system according to the embodiment can improve the efficiency of the series of peeling processes.

[0103] The peeling system according to the embodiment may include a detection unit (for example, detection units 101 to 103) that detects the peeled state of the superposed substrate in the removal device, and a control unit (for example, control unit 81) that determines whether the superposed substrate has been separated into the first substrate and the second substrate based on the detection result by the detection unit. In this case, when the control unit determines that the superposed substrate has been separated into the first substrate and the second substrate, the control unit may control the transport device to transport the first substrate and the second substrate out of the removal device and transport them to the mounting unit. This makes it possible to prevent superposed substrates that have not been peeled by the removal device from being erroneously transported to the mounting unit.

[0104] The detection unit (for example, detection unit 101) may be disposed above the laminated substrate in the removal device and measure the distance to the upper surface of the laminated substrate. In this case, the control unit may determine that the laminated substrate has been separated into the first substrate and the second substrate when the absolute value of the difference between the distance measured by the detection unit before processing by the removal device and the distance measured by the detection unit after processing by the removal device exceeds a threshold value. This makes it possible to determine whether or not the removal device has achieved peeling of the laminated substrate.

[0105] The transport device (for example, the second transport device 70) may include an adsorption / holding unit (for example, the second holding unit 72) that holds an object by suction, and an elevation mechanism (for example, the elevation mechanism 75) that raises and lowers the adsorption / holding unit. In this case, the detection unit (for example, the detection unit 102) may detect the suction pressure of the adsorption / holding unit. Furthermore, after the processing by the removal device, the control unit may control the transport device with the lower surface of the laminated substrate adsorbed and held by the removal device, adsorb and hold the upper surface of the laminated substrate by the adsorption / holding unit, and raise the adsorption / holding unit. If the suction pressure detected by the detection unit exceeds a threshold value, the control unit may determine that the laminated substrate has been separated into the first substrate and the second substrate. This makes it possible to determine with a relatively simple configuration whether the removal device has achieved separation of the laminated substrate.

[0106] The transport device may include a suction holding unit that holds an object by suction and an elevating mechanism that raises and lowers the suction holding unit. In this case, the detection unit (for example, detection unit 103) may detect the load or torque applied to the elevating mechanism. Furthermore, after processing by the removal device, the control unit may control the transport device while the lower surface of the laminated substrate is suction-held by the removal device, so that the upper surface of the laminated substrate is suction-held by the suction holding unit and the suction holding unit is raised. If the load or torque detected by the detection unit is equal to or less than a threshold, the control unit may determine that the laminated substrate has been separated into the first substrate and the second substrate. This makes it possible to determine with a relatively simple configuration whether the removal device has achieved separation of the laminated substrate.

[0107] The transport device may be provided with an inversion mechanism (for example, inversion mechanism 77) that inverts the suction holding part, so that the second substrate that has been taken out of the removal device in a downward position can be inverted on the transport device.

[0108] The delamination system according to the embodiment may include a delamination device including a first suction unit (for example, first suction unit 41) that adsorbs the laminated substrate from the first substrate side, a second suction unit (for example, second suction unit 42) that adsorbs the laminated substrate from the second substrate side, and an elevation mechanism (for example, elevation mechanism 410) that moves one of the first and second suction units in a direction away from the other. The delamination device separates the laminated substrate into the first and second substrates by using the elevation mechanism to move one of the first and second suction units in a direction away from the other while the laminated substrate is being adsorbed using the first and second suction units. In this case, if the control unit determines that the laminated substrate has not been separated into the first and second substrates, the control unit may control the transport device to transport the laminated substrate from the removal device to the delamination device and control the delamination device to separate the laminated substrate into the first and second substrates. This allows the delamination device to reliably delaminate the laminated substrates that were not separated in the removal device.

[0109] The separation system according to the embodiment may include a cleaning device (for example, the cleaning device 50) that cleans at least one of the first substrate and the second substrate separated from the laminated substrate. This allows, for example, the separation layer remaining on the separation surface of the first substrate or the second substrate to be removed by cleaning.

[0110] The transport device may include an adsorption / holding unit that holds an object by suction and an elevating mechanism that raises and lowers the adsorption / holding unit. In this case, after processing by the removal device, the control unit may control the transport device, while the lower surface of the laminated substrate is adsorbed and held by the removal device, to adsorb and hold the upper surface of the laminated substrate by the adsorption / holding unit and raise the adsorption / holding unit, thereby separating the laminated substrate into the first substrate and the second substrate. This makes it possible to delaminate the laminated substrate that was not delaminated by the removal device without providing a separate device dedicated to delaminating the laminated substrate.

[0111] The disclosed embodiments should be considered in all respects as illustrative and not restrictive. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0112] 1 Peeling System 2 Loading / unloading station 3 Processing Stations 10. Placement section 20 Conveying Area 30 Removal device 40 Peeling device 50 Cleaning Equipment 60 conveying area 70 Second conveying device 80 Control device 81 Control Unit 82 Memory section 101~103 Detection unit D distance F surface film P separation layer T Polymer Substrate W1 First board W2 Second board

Claims

1. a mounting section on which a first cassette capable of accommodating a laminated substrate in which a first substrate and a second substrate are bonded via a separation layer, a second cassette capable of accommodating the first substrate, and a third cassette capable of accommodating the second substrate are mounted; a removal device that irradiates the laminated substrate with a laser to remove the separation layer; a transport device that transports the laminated substrate to the removal device and transports the first substrate and the second substrate separated from the laminated substrate to the mounting unit; a detection unit that detects a peeled state of the laminated substrate in the removal device; a control unit that determines whether the laminated substrate has been separated into the first substrate and the second substrate based on a detection result by the detection unit; Equipped with When the control unit determines that the laminated substrate has been separated into the first substrate and the second substrate, the control unit controls the transport device to transport the first substrate and the second substrate out of the removal device and transport them to the placement unit.

2. the detection unit is disposed above the laminated substrate in the removal device and measures a distance to an upper surface of the laminated substrate; 2. The delamination system according to claim 1, wherein the control unit determines that the laminated substrate has been separated into the first substrate and the second substrate when an absolute value of a difference between a distance measured by the detection unit before processing by the removal device and a distance measured by the detection unit after processing by the removal device exceeds a threshold value.

3. The conveying device is a suction holding unit that holds an object by suction; a lifting mechanism for lifting and lowering the suction holding unit; Equipped with the detection unit detects the suction pressure of the suction holding unit, 2. The delamination system according to claim 1, wherein, after the processing by the removal device, the control unit controls the transport device while the lower surface of the laminated substrate is adsorbed and held by the removal device, to adsorb and hold the upper surface of the laminated substrate by the adsorption and holding unit, and then raises the adsorption and holding unit, and if the suction pressure detected by the detection unit exceeds a threshold value, the control unit determines that the laminated substrate has been separated into the first substrate and the second substrate.

4. The conveying device is a suction holding unit that holds an object by suction; a lifting mechanism for lifting and lowering the suction holding unit; Equipped with the detection unit detects a load or torque applied to the lifting mechanism, 2. The delamination system according to claim 1, wherein, after the processing by the removal device, the control unit controls the transport device while the lower surface of the laminated substrate is adsorbed and held by the removal device, to adsorb and hold the upper surface of the laminated substrate by the adsorption holding unit and raise the adsorption holding unit, and when a load or torque detected by the detection unit is equal to or less than a threshold value, the control unit determines that the laminated substrate has separated into the first substrate and the second substrate.

5. The peeling system according to claim 3 or 4, wherein the transport device includes a reversing mechanism that reverses the suction holding unit.

6. a first suction unit that suctions the laminated substrate from the first substrate side; a second suction unit that suctions the laminated substrate from the second substrate side; and a lifting mechanism that moves one of the first suction unit and the second suction unit in a direction away from the other. Equipped with the peeling device separates the laminated substrate into the first substrate and the second substrate by using the lifting mechanism to move one of the first suction portion and the second suction portion in a direction away from the other while the laminated substrate is being adsorbed using the first suction portion and the second suction portion; 6. The delamination system according to claim 1, wherein, when it is determined that the laminated substrate has not been separated into the first substrate and the second substrate, the control unit controls the transport device to transport the laminated substrate from the removal device to the delamination device, and controls the delamination device to separate the laminated substrate into the first substrate and the second substrate.

7. a first suction unit that suctions the laminated substrate from the first substrate side; a second suction unit that suctions the laminated substrate from the second substrate side; and a lifting mechanism that moves one of the first suction unit and the second suction unit in a direction away from the other. Equipped with 2. The peeling system according to claim 1, wherein the peeling device separates the laminated substrate into the first substrate and the second substrate by using the lifting mechanism to move one of the first suction portion and the second suction portion in a direction away from the other while the laminated substrate is being adsorbed using the first suction portion and the second suction portion.

8. a cleaning apparatus for cleaning at least one of the first substrate and the second substrate separated from the laminated substrate; The peeling system according to any one of claims 1 to 7, comprising:

9. The control unit controls the conveying device, The conveying device is a suction holding unit that holds an object by suction; a lifting mechanism for lifting and lowering the suction holding unit; Equipped with 2. The delamination system according to claim 1, wherein, after the treatment by the removal device, while the lower surface of the laminated substrate is adsorbed and held by the removal device, the control unit controls the transfer device to adsorb and hold the upper surface of the laminated substrate by the adsorption holding unit and raise the adsorption holding unit, thereby separating the laminated substrate into the first substrate and the second substrate.

10. placing a first cassette capable of accommodating a laminated substrate in which a first substrate and a second substrate are bonded via a separation layer, a second cassette capable of accommodating the first substrate, and a third cassette capable of accommodating the second substrate on a placement section for placing the first cassette, the second cassette, and the third cassette; using a transport device to remove the laminated substrate from the first cassette placed on the placement unit and transport the laminated substrate to a removal device that irradiates a laser onto the laminated substrate to remove the separation layer; removing the separation layer from the polymeric substrate using the removal device; detecting a peeled state of the laminated substrate in the removing device using a detecting unit; using a control unit, based on a detection result by the detection unit, to determine whether the laminated substrate has been separated into the first substrate and the second substrate; when it is determined using the control unit that the laminated substrate has been separated into the first substrate and the second substrate, controlling the transport device to unload the first substrate and the second substrate from the removal device and transport them to the placement unit; using the transport device, the first substrate and the second substrate separated from the laminated substrate are placed in the second cassette and the third cassette, respectively, which are placed on the placement section; A peeling method comprising:

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