Prediction device, inspection system, prediction method, and prediction program

Abstract

To provide information for actualizing an efficient conveyance schedule by a conveyance part.SOLUTION: A prediction device has: a calculation part which calculates a test period when a wafer is tested by a tester; a test period prediction part which predicts a current test period based upon a past test period calculated by the calculation part; an end time prediction part which predicts an end time of a test on a wafer as a test object based upon the predicted test period when acquiring a start time of the test of the wafer as the test object by the tester; and a storage part in which at least the predicted test period and the predicted end time are stored in a readable state.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a prediction device, an inspection system, a prediction method, and a prediction program. [Background technology]

[0002] An inspection system is known in which multiple testers (inspection units) are arranged to test the electrical characteristics of wafers, and multiple wafers are transported to each tester to test them simultaneously. In this inspection system, each tester runs the same test program, and each time a test is completed, a transport unit retrieves the wafer from the corresponding tester and transports the next wafer to that tester.

[0003] The time required to test a wafer depends on the electrical characteristics of the wafer, and varies from wafer to wafer even when the same test program is executed. For this reason, in the above-mentioned inspection system, the tester notifies the transport unit of the completion of the test, and the transport unit starts operations such as collection and transport. However, if the transport schedule is set so that the transport unit starts its operations when the tester notifies the transport unit of the completion of the test, the tester's availability rate will be limited. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2019-621138 Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides information for realizing an efficient transport schedule by the transport unit. [Means for solving the problem]

[0006] A prediction device according to an aspect of the present disclosure has, for example, the following configuration: A prediction device connected to an inspection device having a plurality of testers and a prober that transports wafers one by one to the plurality of testers, The aforementioned a calculation unit that calculates a test time when a wafer is tested by a tester; a test time prediction unit that predicts a current test time based on the past test time calculated by the calculation unit; an end time prediction unit that predicts an end time of the test of the wafer to be tested based on the predicted test time when a start time of the test of the wafer to be tested by the tester is acquired; a storage unit that readably stores at least the predicted test time and the predicted end time; 、 With death, The transport schedule of the prober is determined based on the predicted end time of the test of the wafer to be tested. . [Effects of the Invention]

[0007] According to the present disclosure, it is possible to provide information for realizing an efficient transport schedule by the transport unit. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a first diagram showing an example of the configuration of an inspection device. [Figure 2] FIG. 2 is a second diagram showing an example of the configuration of the inspection device. [Figure 3] FIG. 1 is a first diagram showing an example of a system configuration of an inspection system. [Figure 4] FIG. 2 illustrates an example of a hardware configuration of a prediction device. [Figure 5] FIG. 10 is a diagram showing an example of variations in test time for each wafer. [Figure 6] FIG. 2 is a diagram illustrating an example of a functional configuration of an actual measurement data collection unit. [Figure 7] FIG. 10 is a diagram illustrating an example of actual measurement data stored in an actual measurement data storage unit. [Figure 8] FIG. 10 illustrates an example of a functional configuration of a test time prediction unit. [Figure 9]3A and 3B are diagrams illustrating an example of a functional configuration of a table generating unit and an example of a table to be generated; [Figure 10] 10 is an example of a first flowchart illustrating the flow of a prediction process. [Figure 11] 10 is an example of a second flowchart illustrating the flow of a prediction process. [Figure 12] FIG. 2 is a second diagram showing an example of the system configuration of the inspection system. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, each embodiment will be described with reference to the accompanying drawings. In this specification and drawings, components having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0010] [First embodiment] <Inspection equipment overview> First, an overview of an inspection device constituting an inspection system according to a first embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 and Fig. 2 are first and second diagrams showing an example of the configuration of the inspection device, Fig. 1 showing a horizontal cross section of the inspection device, and Fig. 2 showing a vertical cross section taken along line II-II' in Fig. 1. In the first embodiment, the inspection device 110 tests the electrical characteristics of a plurality of devices under test (DUTs (Devices Under Test), hereinafter simply referred to as devices) formed on a wafer, which is an object under inspection.

[0011] The inspection device 110 includes a plurality of testers (inspection units) and a prober. A mechanism for transporting wafers to multiple testers; - A wafer stage (chuck top) that holds the wafer by suction corresponding to each tester, An interface such as a probe card for establishing electrical connections between the devices formed on the wafer and each tester; It has.

[0012] In FIG. 1, the inspection device 110 has a housing 111, and the housing 111 contains: an inspection area 112 for testing electrical characteristics of devices formed on the wafer W; A carry-in / out area 113 that carries in and out wafers W and probe cards to and from the inspection area 112 and has a control system; a transport area 114 provided between the inspection area 112 and the carry-in / out area 113; Includes:

[0013] 2, in the inspection area 112, four inspection chambers 120 are arranged along the X direction, and such rows of inspection chambers are arranged in three stages in the Z direction (vertical direction). Each inspection chamber 120 is provided with a tester 150 that tests the electrical characteristics of devices formed on the wafer W. These testers 150 are controlled by a tester control unit 160.

[0014] Also, on each stage of the inspection area 112, one aligner 122 that functions as a wafer transfer stage movable in the X direction relative to the inspection chambers 120 arranged in the X direction is provided below the tester 150. Furthermore, on each stage of the inspection area 112, one upper alignment camera 124 is provided that is movable in the X direction in a portion closer to the transfer area 114 than the tester 150.

[0015] The loading / unloading area 113 is divided into a plurality of ports. The plurality of ports includes a plurality of wafer loading / unloading ports 116a that accommodate FOUPs 117, which are containers that accommodate a plurality of wafers W, and a pre-alignment unit 116b that aligns the wafers to be transported. The plurality of ports also includes a probe card loader 116c that loads and unloads probe cards, and a control port 116d that houses a prober control unit 140 that controls the operation of the prober of the inspection device 110.

[0016] A transfer mechanism 119 having multiple transfer arms is disposed in the transfer region 114. The main body of the transfer mechanism 119 is movable in the Z and θ directions, and the transfer arms are movable in the forward and backward directions. This allows the transfer mechanism 119 to move the wafer W in the X, Y, Z, and θ directions. The transfer mechanism 119 can also access all levels of the inspection chambers 120. Specifically, the transfer mechanism 119 receives a wafer W from a wafer load / unload port 116a in the load / unload region 113 and transports it to a chuck top (wafer stage) in the inspection unit 130. The transfer mechanism 119 also receives a wafer W, whose device electrical characteristics have been tested, from the chuck top of the corresponding inspection unit 130 and transports it to the wafer load / unload port 116a. The transfer of the wafer W to and from the chuck top is performed using an aligner 122, and the aligner 122 and the transfer mechanism 119 form a wafer W transport section.

[0017] The transport mechanism 119 transports probe cards that require maintenance from each inspection chamber 120 to the probe card loader 116c, and also transports new or maintained probe cards to each inspection chamber 120.

[0018] Within each testing chamber 120 is a testing unit 130 having a tester 150 and other elements required for testing.

[0019] 2 is a test program executed by each tester 150 (in the example of FIG. 2, tester names="tester #1" to "tester #12") that tests the electrical characteristics of devices formed on a wafer W. Each tester 150 executes the test program 200. That is, in the case of the inspection device 110, the electrical characteristics of devices can be tested on 12 wafers W at the same time.

[0020] 2, in this embodiment, the test program 200 is composed of six blocks, and tests of different test items are sequentially executed on one wafer W. In the example of FIG. 2, the six blocks are named "TestBlock_1" to "TestBlock_6."

[0021] <Inspection system configuration> Next, the system configuration of the inspection system according to the first embodiment will be described. Fig. 3 is a diagram showing an example of the system configuration of the inspection system. As shown in Fig. 3, the inspection system 300 includes an inspection device 110, a prediction device 310, and a scheduling device 320.

[0022] The inspection device 110, the prediction device 310, and the scheduling device 320 may be configured as separate devices or may be configured as an integrated device, as shown in Fig. 3. Alternatively, either the prediction device 310 or the scheduling device 320 may be configured as an integrated device with the inspection device 110.

[0023] When the prediction device 310 and the inspection device 110 are configured as an integrated unit, the functions of the prediction device 310 may be realized, for example, in the tester control unit 160. Also, when the scheduling device 320 and the inspection device 110 are configured as an integrated unit, the functions of the scheduling device 320 may be realized, for example, in the prober control unit 140.

[0024] Of the inspection system 300 shown in FIG. 3, the inspection device 110 has already been explained using FIGS. 1 and 2, so here, the prediction device 310 and the scheduling device 320 will be explained.

[0025] A prediction program is installed in the prediction device 310, and by executing the prediction program, the prediction device 310 functions as an actual measurement data collection unit 311, a test time prediction unit 313, and a table generation unit 314.

[0026] The actual measurement data collection unit 311 acquires the start time and the end time when each tester 150 of the inspection equipment 110 tests the electrical characteristics of the devices formed on the wafer W. Specifically, the actual measurement data collection unit 311 The test start time when each tester 150 starts the test, The block execution start time when each tester 150 starts executing each block, The block execution end time when each tester 150 finishes executing each block, The test completion time when each tester 150 completes the test, The test start time is equal to the block execution start time of the block with block name="TestBlock1", and the test end time is equal to the block execution end time of the block with block name="TestBlock6".

[0027] Furthermore, the actual measurement data collecting unit 311 calculates the test time of each tester 150 for each wafer W based on the acquired test start time and test end time of each tester 150. Furthermore, the actual measurement data collecting unit 311 calculates the block execution time of each block for each wafer W based on the acquired execution start time and block execution end time of each block.

[0028] Furthermore, the actual measurement data collection unit 311 stores the acquired test start time and test end time of each tester 150, as well as the calculated test time of each tester 150 and block execution time of each block, as actual measurement data for each wafer W in the actual measurement data storage unit 312.

[0029] The test time prediction unit 313 reads out the actual measurement data stored in the actual measurement data storage unit 312, and predicts the block execution time and test time of each block when the electrical characteristics of the device on the wafer W to be tested are tested in the corresponding tester. The test time prediction unit 313 also acquires the test start time and block execution start time of the wafer W to be tested from the actual measurement data collection unit 311. Then, the test time prediction unit 313 predicts the test end time by adding the predicted test time (predicted test time value) or the predicted block execution time (predicted block execution time value) to the acquired test start time and block execution start time.

[0030] When a device formed on a wafer W is being tested in each tester 150, the table generating unit 314 generates at least The predicted test time value of each tester predicted by the test time prediction unit 313; The test end time (predicted end time) of each tester 150 predicted by the test time prediction unit 313; The table generating unit 314 then stores the generated table in the table storage unit 315 so that it can be accessed.

[0031] A transport scheduling program is installed in the scheduling device 320, and the scheduling device 320 functions as a transport scheduler 321 by executing the transport scheduling program.

[0032] The transfer scheduler 321 accesses the table storage unit 315 of the prediction device 310 and reads out the predicted end time of each tester 150 recorded in the table. In addition, the transfer scheduler 321 generates a transfer schedule for the transfer unit based on the read predicted end time and notifies the prober control unit 140 of the schedule.

[0033] In this way, in the inspection system 300 according to the first embodiment, the test end time of each tester 150 is predicted based on the actual measurement data, and a transport schedule is generated based on the predicted end time.

[0034] This improves the availability of each tester 150 compared to when the transport unit starts operation after each tester 150 notifies the end of the test. In other words, the prediction device 310 according to the first embodiment can provide appropriate information (table) for realizing an efficient transport schedule by the transport unit.

[0035] <Hardware configuration of the prediction device> Next, a description will be given of the hardware configuration of the prediction device 310. Fig. 4 is a diagram showing an example of the hardware configuration of the prediction device.

[0036] 4, the prediction device 310 includes a processor 401, a memory 402, an auxiliary storage device 403, a user interface device 404, a connection device 405, a communication device 406, and a drive device 407. The hardware components of the prediction device 310 are connected to each other via a bus 408.

[0037] The processor 401 has various arithmetic devices such as a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), etc. The processor 401 reads various programs (for example, a prediction program, etc.) into the memory 402 and executes them.

[0038] The memory 402 has a main storage device such as a ROM (Read Only Memory), a RAM (Random Access Memory), etc. The processor 401 and the memory 402 form a so-called computer, and the processor 401 executes various programs read onto the memory 402, causing the computer to realize the various functions described above.

[0039] The auxiliary storage device 403 stores various programs and various data used when the various programs are executed by the processor 401. The actual measurement data storage unit 312 and the table storage unit 315 are realized in the auxiliary storage device 403.

[0040] The user interface device 404 includes, for example, a keyboard or touch panel used by the user of the prediction device 310 when inputting various commands, a display for displaying the processing contents of the prediction device 310, and the like.

[0041] The connection device 405 is a connection device that connects to other devices (such as the inspection device 110 and the scheduling device 320) in the inspection system 300. The communication device 406 is a communication device for communicating with external devices (not shown) via a network.

[0042] The drive device 407 is a device for loading a recording medium 410. The recording medium 410 here includes media that record information optically, electrically, or magnetically, such as a CD-ROM, a flexible disk, a magneto-optical disk, etc. The recording medium 410 may also include semiconductor memories that record information electrically, such as ROMs, flash memories, etc.

[0043] The various programs to be installed in the auxiliary storage device 403 are installed, for example, by setting the distributed recording medium 410 in the drive device 407 and reading the various programs recorded on the recording medium 410 by the drive device 407. Alternatively, the various programs to be installed in the auxiliary storage device 403 may be installed by being downloaded from a network via the communication device 406.

[0044] <Test time variations for each wafer> Next, the variation in test time for each wafer W in the tester 150 will be described. FIG. 5 is a diagram showing an example of the variation in test time for each wafer W. In FIG. 5, as an example, Tester 150 with tester name="tester#1", - Each block with block name = "TestBlock_1" to "TestBlock_6", 10 shows the block execution time for each wafer W (wafer W with wafer name="wafer 1" to "wafer 7") and the test time for all blocks.

[0045] The length of each arrow in Fig. 5 indicates the length of the block execution time of each block. For example, arrow 501 indicates that for wafer W with wafer name="Wafer 1", the block with block name="TestBlock_1" completed execution in the standard block 1 execution time.

[0046] Also, arrow 502 indicates that, for wafer W with wafer name="Wafer 3", the block with block name="TestBlock_1" completed execution in a time shorter than the standard execution time for block 1. Also, arrow 503 indicates that, for wafer W with wafer name="Wafer 4", the block with block name="TestBlock_1" completed execution in a time longer than the standard execution time for block 1.

[0047] As described above, even when testing the same block in the same tester 150, there is variation in the block execution time for each wafer W. This is because, as described above, the electrical characteristics of the devices differ for each wafer W. Even in a situation where the proportion of non-defective products is high (i.e., high yield) and the wafer W being tested is actually a non-defective product, the block execution time will differ if the electrical characteristics of the devices differ. Generally, the block execution time tends to exhibit, for example, the following: Immediately after starting up the manufacturing process for manufacturing wafers W, the yield is not stable, so the block execution time is long and there is large variation. Also, as time passes and the yield stabilizes, the block execution time becomes shorter and the variation becomes smaller. When viewed per tester, the yield decreases as the block progresses and the block execution time becomes shorter. Wafers W manufactured through the same manufacturing process (i.e., wafers W from the same lot) have similar block execution times for each block.

[0048] The prediction device 310 according to this embodiment predicts the test time of each tester and the block execution time of each block of each tester, taking into account the above-mentioned trends.

[0049] In addition, in Figure 5, the columns without arrows (symbols 511 and 512) indicate that the corresponding block was not executed because the corresponding wafer was determined to be defective when the block before the corresponding block was executed.

[0050] For example, wafer W with wafer name="Wafer 5" was determined to be defective when the block with block name="TestBlock_4" was executed. As a result, the test program ended without executing the subsequent blocks (block names="TestBlock_5", "TestBlock_6").

[0051] Furthermore, as shown in FIG. 5, the prediction device 310 according to this embodiment calculates the test time for a wafer W for which execution of the block with block name="TestBlock_6" has been completed. The test time is calculated for each wafer W by adding up the block execution times for all blocks. The example in FIG. 5 shows how test times="T1_1", "T1_2", "T1_3", "T1_4", "T1_6", and "T1_7" are calculated for each wafer W with wafer names="Wafer 1" to "Wafer 4", "Wafer 6", and "Wafer 7".

[0052] <Details of each functional part of the prediction device> Next, the details of each functional unit (measurement data collection unit 311, test time prediction unit 313, table generation unit 314) of the prediction device 310 will be described.

[0053] (1) Details of the measurement data collection section First, the functional configuration of the actual measurement data collection unit 311 will be described. Fig. 6 is a diagram showing an example of the functional configuration of the actual measurement data collection unit. As shown in Fig. 6, the actual measurement data collection unit 311 Tester #1 start / end time acquisition unit 610_1 to tester #12 start / end time acquisition unit 610_12, Tester #1 test time calculation unit 620_1 to tester #12 test time calculation unit 620_12, Storage control unit 630, It has.

[0054] The tester #1 start / end time acquisition unit 610_1 to the tester #12 start / end time acquisition unit 610_12 are The test start time and test end time of the corresponding tester 150, and The block execution start time and block execution end time of each block of the corresponding tester 150; is obtained for each wafer W.

[0055] The tester #1 test time calculation unit 620_1 to the tester #12 test time calculation unit 620_12 calculate the test time by subtracting the test start time from the test end time of the corresponding tester 150. Also, the tester #1 test time calculation unit 620_1 to the tester #12 test time calculation unit 620_12 calculate the block execution time by subtracting the block execution start time from the block execution end time of each block of the corresponding tester 150.

[0056] The storage control unit 630 stores the test start time, test end time, test time of each tester 150, and block execution time of each block of each tester 150 for each wafer W in the actual measurement data storage unit 312.

[0057] In FIG. 7, graphs 711 to 716 represent the block execution time for each block ("TestBlock1" to "TestBlock6") of the tester with tester name="Tester #1" for each wafer W. In graphs 711 to 716, the horizontal axis represents the number of wafers, and the vertical axis represents the block execution time. Note that symbols 701 and 702 in graphs 715 and 716 are outliers. Outliers are information indicating machine differences, disturbances, failures, etc., and are used for comparison with other testers. For example, outliers stored in the actual measurement data storage unit 312 may be sequentially read out and compared with the corresponding block execution times of other testers to analyze the cause of their occurrence.

[0058] 7, reference numerals 721 to 723 indicate the test start time, test end time, and test duration of the tester 150 with the tester name="tester #1" stored for each wafer W.

[0059] Test start time="ST1_1" indicates the test start time when the first wafer W is tested in the tester 150 with tester name="tester #1". Test start time="ST1_2" indicates the test start time when the second wafer W is tested in the tester with tester name="tester #1".

[0060] Test end time="ET1_1" indicates the test end time when the test of the first wafer W is completed in the tester 150 with tester name="tester #1". Also, test end time="ET1_2" indicates the test end time when the test of the second wafer W is completed in the tester 150 with tester name="tester #1".

[0061] Test time = "T1_1" indicates the test time (="ET1_1"-"ST1_1") of the first wafer W in the tester 150 with tester name = "tester #1". Also, test time = "T1_2" indicates the test time (="ET1_2"-"ST1_2") of the second wafer W in the tester 150 with tester name = "tester #1".

[0062] In this way, the actual measurement data storage unit 312 stores the following data every time the test of the wafer W to be tested is completed in each tester 150 with the tester names="tester #1" to "tester #12": · Block execution time for each block, Test start time, Test end time, Test time, is accumulated.

[0063] Note that the storage control unit 630 may be configured to automatically delete actual measurement data stored in the actual measurement data storage unit 312 after a certain period of time has passed. Alternatively, the block execution time and test time of the actual measurement data after a certain period of time may be compressed and stored as data showing past trends by performing a process of calculating a variance or an average value for each predetermined time range.

[0064] (2) Details of the test time prediction section Next, the functional configuration of the test time prediction unit 313 will be described. Fig. 8 is a diagram showing an example of the functional configuration of the test time prediction unit. As shown in Fig. 8, the test time prediction unit 313 Tester #1 analysis target acquisition unit 810_1 to tester #12 analysis target acquisition unit 810_12, Tester #1 outlier removal unit 820_1 to tester #12 outlier removal unit 820_12, Tester #1 predicted value calculation unit 830_1 to tester #12 predicted value calculation unit 830_12, It has.

[0065] The tester #1 analysis target acquiring units 810_1 to 810_12 acquire, as analysis targets, the block execution times of each block for a predetermined number of wafers W from among the block execution times of each block of the corresponding tester 150. The predetermined number here refers to, for example, the most recent x wafers W (see reference numerals 811 and 812).

[0066] The example in Figure 8 shows how the tester #1 analysis target acquisition unit 810_1 acquires the block execution times of each block for the most recent six wafers W from among the block execution times of each block for each wafer W included in graphs 711 to 716.

[0067] Similarly, the example in Figure 8 shows that the tester #12 analysis target acquisition unit 810_12 has acquired the block execution times of each block for the most recent six wafers W from the block execution times of each block for each wafer W included in graphs 801 to 806.

[0068] The tester #1 outlier removal unit 820_1 to the tester #12 outlier removal unit 820_12 remove outlier block execution times from the block execution times acquired by the tester #1 analysis target acquisition unit 810_1 to the tester #12 analysis target acquisition unit 810_12, respectively. The tester #1 outlier removal unit 820_1 to the tester #12 outlier removal unit 820_12 may be configured to run constantly, or may be configured to run only when instructed by the user of the prediction device 310.

[0069] The tester #1 predicted value calculation unit 830_1 to the tester #12 predicted value calculation unit 830_12 perform statistical processing on the block execution times from which outliers have been removed, thereby predicting the block execution time for each tester 150 and for each block. Note that the statistical processing here includes any of the processing of calculating a variance value, calculating an average value, calculating a median value, and calculating a maximum value.

[0070] Furthermore, the tester #1 predicted value calculation units 830_1 to 830_12 predict the test time of the corresponding tester 150 by adding up the predicted values ​​of the block execution times of the blocks of the corresponding tester 150 across all the blocks.

[0071] The example of FIG. 8 shows how the tester #1 predicted value calculation unit 830_1 calculates predicted values ​​of block execution times for each block ("TestBlock_1" to "TestBlock6") of the tester 150 with tester name="tester #1". Specifically, it shows how the tester #1 predicted value calculation unit 830_1 calculates predicted values ​​of block 1 execution time to block 6 execution time. It also shows how the tester #1 predicted value calculation unit 830_1 calculates the predicted test time for the tester 150 with tester name="tester #1" by adding up the predicted values ​​of block 1 execution time to block 6 execution time.

[0072] 8 shows how the tester #12 predicted value calculation unit 830_12 calculates predicted values ​​of block execution times for each block ("TestBlock_1" to "TestBlock6") of the tester 150 with tester name="tester #12". Specifically, the example shows how the tester #12 predicted value calculation unit 830_12 calculates predicted values ​​of block 1 execution time to block 6 execution time. The example also shows how the tester #12 predicted value calculation unit 830_12 calculates the predicted value of test time for the tester 150 with tester name="tester #12" by adding up the predicted values ​​of block 1 execution time to block 6 execution time.

[0073] (3) Details of the table generation part Next, a description will be given of a functional configuration of the table generating unit 314 and a specific example of a table generated by the table generating unit 314. Fig. 9 is a diagram showing an example of a functional configuration of the table generating unit and an example of a table generated.

[0074] As shown in FIG. 9, the table generation unit 314 Tester #1 start time acquisition unit 910_1 to tester #12 start time acquisition unit 910_12, Tester #1 test time estimated value acquisition unit 920_1 to tester #12 test time estimated value acquisition unit 920_12, Tester #1 end time prediction unit 930_1 to tester #12 end time prediction unit 930_12, It has.

[0075] The tester #1 start time acquiring section 910_1 to the tester #12 start time acquiring section 910_12 acquire the time when the execution of the block with the block name="TestBlock_1" is started in the corresponding tester 150, and record it in the table 940 as the test start time.

[0076] Moreover, the tester #1 start time acquiring section 910_1 to the tester #12 start time acquiring section 910_12 acquire the block execution start time of each block of the corresponding tester 150.

[0077] Furthermore, the tester #1 start time acquiring section 910_1 to the tester #12 start time acquiring section 910_12 notify the acquired test start time and block execution start time to the tester #1 end time predicting section 930_1 to the tester #12 end time predicting section 930_12, respectively.

[0078] The tester #1 test time predicted value acquisition units 920_1 to 920_12 acquire the test time predicted value calculated by the tester #1 predicted value calculation units 830_1 to 830_12, respectively. · Block execution time predictions for each block, the corresponding test time estimate for the tester 150; Get.

[0079] Moreover, the tester #1 test time predicted value acquisition unit 920_1 to the tester #12 test time predicted value acquisition unit 920_12 record the acquired block execution time predicted value and test time predicted value of each block in a table 940. Furthermore, the tester #1 test time predicted value acquisition unit 920_1 to the tester #12 test time predicted value acquisition unit 920_12 notify the tester #1 end time prediction unit 930_1 to the tester #12 end time prediction unit 930_12 of the block execution time predicted value and the test time predicted value, respectively.

[0080] When the tester #1 end time prediction unit 930_1 to the tester #12 end time prediction unit 930_12 acquire the test start time of the corresponding tester 150, they add the predicted test time value of the corresponding tester 150 to the test start time. As a result, the tester #1 end time prediction unit 930_1 to the tester #12 end time prediction unit 930_12 predict the test end time of the wafer W for which the current test has started. Furthermore, the tester #1 end time prediction unit 930_1 to the tester #12 end time prediction unit 930_12 record the predicted test end time in the table 940 as the predicted end time.

[0081] Furthermore, when the tester #1 end time prediction unit 930_1 to the tester #12 end time prediction unit 930_12 acquire the block execution start time of the corresponding tester 150, they add the predicted block execution time value for the block after the block to the block execution start time. As a result, the tester #1 end time prediction unit 930_1 to the tester #12 end time prediction unit 930_12 predict the test end time at which the test of the wafer W currently being tested will end. Furthermore, the tester #1 end time prediction unit 930_1 to the tester #12 end time prediction unit 930_12 update the table 940 with the predicted test end time as the latest predicted end time.

[0082] 9, table 940 includes information items such as "tester #1" to "tester #12." Table 940 also includes information items such as "target wafer," "test start time," "estimated block execution time," "estimated test time," and "estimated end time."

[0083] In table 940, the "target wafer", "test start time", and "estimated end time" for "tester #1" are blank because the test of the wafer W by the tester 150 with tester name="tester #1" has now been completed and the wafer W is currently being collected. Alternatively, this is because the next wafer W to be tested is currently being transported to the tester 150 with tester name="tester #1". In other words, the "target wafer", "test start time", and "estimated end time" are deleted from table 940 each time the test of a wafer W is completed.

[0084] Meanwhile, since the test of wafer W has been completed, the block execution time and test time of each block of tester 150 with tester name="tester #1" have been added to the actual measurement data, and therefore the predicted block execution time and predicted test time are updated. As a result, the "predicted block execution time" and "predicted test time" are recorded with the updated predicted block execution time and predicted test time of each block.

[0085] Meanwhile, table 940 indicates that "tester #12" is currently testing wafer W with wafer name="wafer 10", and that the test started at "XX:XX:XX." The "predicted block execution time" and "predicted test time" fields record the predicted block execution time and predicted test time for each block, which were updated when the previous test of wafer W (wafer W with wafer name="wafer 9") was completed. The "predicted end time" field records the predicted end time ("YY:YY:YY"). The "predicted end time" field records the predicted end time ("YY:YY:YY"). The "predicted end time" field records the predicted end time for wafer W with wafer name="wafer 10" that is currently being tested.

[0086] The predicted end time ("YY hour, YY minute, YY second") is updated every time the block execution start time is acquired.

[0087] <Prediction process flow> Next, the flow of the prediction process by the prediction device 310 will be described with reference to Fig. 10 and Fig. 11. Fig. 10 and Fig. 11 are first and second flowcharts showing the flow of the prediction process.

[0088] In step S1001 of FIG. 10, the actual measurement data collection unit 311 acquires, from the inspection device 110, the test start time and test end time of each tester 150, and the block execution start time and block execution end time of each block of each tester 150.

[0089] In step S1002, the actual measurement data collection unit 311 calculates the test time for each tester 150 based on the acquired test start time and test end time, and stores this as actual measurement data together with the test start time and test end time in the actual measurement data storage unit 312. The actual measurement data collection unit 311 also calculates the block execution time for each block for each tester 150 based on the acquired block execution start time and block execution end time for each block, and stores this as actual measurement data in the actual measurement data storage unit 312.

[0090] In step S1003, the actual measurement data collection unit 311 determines whether actual measurement data has been accumulated for a sufficient number of wafers W to predict the test time of each tester and the block execution time of each block of each tester.

[0091] In step S1003, if it is determined that no actual measurement data has been accumulated (NO in step S1003), the process returns to step S1001.

[0092] On the other hand, if it is determined in step S1003 that actual measurement data has been accumulated for a sufficient number of wafers W (YES in step S1003), the process proceeds to step S1004.

[0093] In step S1004, the test time prediction unit 313 reads out the block execution time of the block to be analyzed from the block execution times of each block of each tester 150 stored in the actual measurement data storage unit 312, and predicts the block execution time of each block of each tester 150. The test time prediction unit 313 also predicts the test time of each tester 150 by adding up the predicted block execution time values ​​of each block of each tester 150 across all blocks for each tester 150.

[0094] In step S1005, the table generation unit 314 stores the predicted test time value of each tester 150 and the predicted block execution time value of each block of each tester 150 predicted by the test time prediction unit 313 in the table 940 of the table storage unit 315.

[0095] 11, the actual measurement data collection unit 311 determines whether or not it has acquired the test start time of any tester 150 or the block execution start time of any block. If it determines in step S1101 that neither the test start time nor the block execution start time has been acquired (NO in step S1101), the process proceeds to step S1107.

[0096] On the other hand, if it is determined in step S1101 that the test start time or block execution start time has been acquired (YES in step S1101), the process proceeds to step S1102.

[0097] In step S1102, the test time prediction unit 313 predicts the test end time by adding the predicted test time value to the test start time, or by adding the predicted block execution time values ​​of the blocks after the block to the block execution start time.

[0098] In step S 1103 , the table generation unit 314 updates the table 940 with the test start time and the test end time predicted by the test time prediction unit 313 .

[0099] In step S1104, the actual measurement data collection unit 311 determines whether or not the test end time (or block execution end time) has been acquired from any tester. If it is determined in step S1104 that the test end time (or block execution end time) has not been acquired (NO in step S1104), the process proceeds to step S1107.

[0100] On the other hand, if it is determined in step S1104 that the test end time (or block execution end time) has been acquired (YES in step S1104), the process proceeds to step S1105.

[0101] In step S1105, the actual data collection unit 311 calculates the test time of the corresponding tester 150 (or the block execution time of each block of the corresponding tester 150). The test time prediction unit 313 also recalculates the predicted test time value (or the predicted block execution time value of each block) including the test time (or the block execution time of each block) calculated by the actual data collection unit 311.

[0102] In step S1106, the table generation unit 314 updates the table 940 with the test time prediction value recalculated by the test time prediction unit 313 (or the block execution time prediction value of each block).

[0103] In step S1107, the actual measurement data collection unit 311 determines whether or not to end the prediction process, and if it is determined not to end the prediction process (NO in step S1107), the process returns to step S1101.

[0104] On the other hand, if it is determined in step S1107 that the prediction process is to be ended (YES in step S1107), the prediction process is ended.

[0105] <Summary> As is clear from the above description, the prediction device 310 according to the first embodiment: The test time when the wafer W is tested by the tester 150 of the inspection device 110 is calculated. -Predict the current test time based on calculated past test times. When the test start time of the wafer W to be tested by the tester 150 is acquired, the test end time of the wafer W to be tested is predicted based on the predicted test time value. At least the predicted test time value and predicted end time are stored in the table 940 so that they can be read out.

[0106] As a result, the prediction device 310 according to the first embodiment can improve the availability of the tester 150 compared to a case where the transport unit starts operating after the tester 150 of the inspection device 110 notifies the end of the test. In other words, the prediction device 310 according to the first embodiment can provide the scheduling device 320 with appropriate information (table) for realizing an efficient transport schedule by the transport unit of the inspection device 110.

[0107] In the case of the prediction device 310 according to the first embodiment, the user of the prediction device 310 does not need to make any settings on the prediction device 310, and can provide information that contributes to improving the availability of the tester simply by accumulating actual measurement data.

[0108] [Second embodiment] In the above first embodiment, the table 940 generated by the table generating unit 314 is described as being stored in the table storage unit 315 in an accessible manner in order to realize an efficient transport schedule by the transport unit of the inspection device 110. However, the use of the table 940 generated by the table generating unit 314 is not limited to this.

[0109] For example, if the information recorded in the table 940 can be monitored, the operator of the inspection device 110 can identify the timing of maintenance and check the inspection device 110 for abnormalities.

[0110] That is, the table 940 stored in the table storage unit 315 can be visualized and used for purposes such as identifying the timing of maintenance and checking for abnormalities.

[0111] Fig. 12 is a second diagram showing an example of the system configuration of the inspection system. The difference from the system configuration described using Fig. 3 is that in Fig. 12, the prediction device 310 also functions as a display control unit 1201.

[0112] The display control unit 1201 accesses the table storage unit 315 in which the table 940 is stored in an accessible manner, and displays the table 940 to the operator of the inspection device 110 by visualizing the information recorded in the table 940 in real time.

[0113] This allows the operator of the inspection device 110 to monitor the information recorded in the table 940. As a result, the operator of the inspection device 110 can identify the timing for maintenance of the inspection device 110 and check for abnormalities in the inspection device 110.

[0114] Specifically, if the block execution time prediction values ​​differ between testers, there is a possibility that poor contact has occurred due to dust on the probe tip of the tester 150. This allows the operator of the inspection device 110 to identify the timing for maintenance (tip polishing) of the corresponding tester 150. Furthermore, by monitoring the block execution time prediction values, the operator of the inspection device 110 can recognize the occurrence of, for example, disturbances (temperature, vibration).

[0115] [Third embodiment] In the above first embodiment, the prediction device 310 is described as being located near the inspection device 110, but the prediction device 310 may be located remotely from the inspection device 110. For example, the prediction device 310 may be realized on the cloud.

[0116] In the first embodiment, the prediction program is executed by a single unit of the prediction device 310. However, if the prediction device 310 is configured with, for example, multiple computers and the prediction program is installed on the multiple computers, the prediction program may be executed in a distributed computing format.

[0117] Furthermore, in the above-described first embodiment, a method of downloading and installing the prediction program via a network (not shown) has been mentioned as an example of a method of installing the prediction program into the auxiliary storage device 403. At this time, no particular mention was made of the download source. However, when installing using this method, the download source may be, for example, a server device that stores the prediction program in an accessible manner. Furthermore, the server device may be, for example, a device that accepts access from the prediction device 310 via a network (not shown) and downloads the prediction program on the condition that a fee is charged. In other words, the server device may be a device that provides a service of providing the prediction program on the cloud.

[0118] In the first embodiment, the test time for the most recent predetermined number of wafers W is used to calculate the predicted value of the test time, but the analysis target used to calculate the predicted value of the test time is not limited to this. For example, the test time for the first wafer W through the test time for the previous wafer W may be used to calculate the predicted value of the test time.

[0119] In the first embodiment, the method for calculating the predicted value of the test time is exemplified by calculating the variance, the average, the median, or the maximum value. However, the method for calculating the predicted value of the test time is not limited to these, and the calculation may be performed by any other statistical processing.

[0120] The present invention is not limited to the configurations described in the above embodiments, but may be combined with other elements, etc. These aspects can be changed without departing from the spirit of the present invention, and can be appropriately determined depending on the application form. [Explanation of symbols]

[0121] 110: Inspection equipment 112: Inspection area 113: Loading / unloading area 114: Transport area 140: Prober control unit 150: Tester 160: Tester control section 200: Test program 300: Inspection system 310: Prediction device 311: Measurement data collection section 312: Measurement data storage section 313: Test time prediction unit 314: Table generation unit 315: Table storage section 320: Scheduling device 321: Transport Scheduler 610_1 to 610_12: Tester #1 to Tester #12 start / end time acquisition section 620_1 to 620_12: Tester #1 to Tester #12 test time calculation section 630: Storage control unit 810_1 to 810_12: Tester #1 to Tester #12 analysis target acquisition unit 820_1 to 820_12: Tester #1 to Tester #12 outlier removal section 830_1 to 830_12: Tester #1 to Tester #12 predicted value calculation unit 910_1 to 910_12: Tester #1 to Tester #12 start time acquisition section 920_1 to 920_12: Tester #1 to Tester #12 test time prediction value acquisition unit 930_1 to 930_12: Tester #1 to Tester #12 end time prediction section 940: Table 1201: Display control unit

Claims

1. A prediction device connected to an inspection device having a plurality of testers and a prober that transports wafers one by one to the plurality of testers, a calculation unit that calculates a test time when a wafer is tested by the tester; a test time prediction unit that predicts a current test time based on the past test time calculated by the calculation unit; an end time prediction unit that predicts an end time of the test of the wafer to be tested based on the predicted test time when a start time of the test of the wafer to be tested by the tester is acquired; a storage unit that readably stores at least the predicted test time and the predicted end time; the transport schedule of the prober is determined based on a predicted end time of testing of the wafer to be tested; Prediction device.

2. 2. The prediction device according to claim 1, wherein the test time prediction unit predicts a current test time by statistically processing test times for a predetermined number of wafers among past test times calculated by the calculation unit.

3. 3. The prediction device according to claim 2, wherein the test time prediction unit predicts the current test time by statistically processing test times from among test times for a predetermined number of wafers, with outliers removed.

4. The prediction device according to claim 2 , wherein the test time prediction unit predicts a current test time every time the calculation unit calculates the test time.

5. 2. The prediction device according to claim 1, wherein the end time prediction unit predicts the end time of the test of the wafer to be tested by adding the current test time to the start time of the test of the wafer to be tested.

6. The prediction device according to claim 5 , wherein the end time prediction unit predicts the end time each time the start time is obtained.

7. The test includes a plurality of blocks each having a different test item; the calculation unit calculates an execution time for each of the plurality of blocks; 2. The prediction device according to claim 1, wherein the test time prediction unit predicts a current execution time for each block based on the past execution times of each block calculated by the calculation unit, and predicts the current test time by adding up the predicted execution times for each block.

8. 8. The prediction device according to claim 7, wherein, when the end time prediction unit acquires an execution start time of any one of the plurality of blocks, it predicts an end time of the test of the wafer to be tested based on the execution times predicted for each block subsequent to the block whose execution start time has been acquired.

9. The prediction device according to claim 7 , wherein the storage unit further readably stores the acquired start time and the predicted execution time of each block.

10. the predicted test time and the predicted execution time of each block stored in the storage unit are updated every time a test on a wafer to be tested is completed or every time execution of any one of the plurality of blocks on a wafer to be tested is completed; The acquired start time stored in the storage unit is stored every time a test on a wafer to be tested is started, 10. The prediction device according to claim 9, wherein the predicted end time stored in the storage unit is updated each time a test of a wafer under test is started or each time execution of any one of the plurality of blocks is started for a wafer under test.

11. The prediction device according to claim 1 , wherein the storage unit deletes the acquired start time and the predicted end time each time testing of a wafer to be tested is completed.

12. A prediction device according to any one of claims 1 to 11; an inspection device having a plurality of testers and testing wafers; An inspection system having:

13. A prediction method in a prediction device connected to an inspection device having a plurality of testers and a prober that transports wafers one by one to the plurality of testers, comprising: a calculation step of calculating a test time when a wafer is tested by the tester; a test time prediction step of predicting a current test time based on the past test time calculated in the calculation step; an end time prediction step of predicting an end time of the test of the wafer to be tested based on the predicted test time when a start time of the test of the wafer to be tested by the tester is acquired; a storing step of storing at least the predicted test time and the predicted end time in a readable manner, A prediction method in which the transport schedule of the prober is determined based on a predicted end time of testing of the wafer to be tested.

14. A prediction method in a prediction device connected to an inspection device having a plurality of testers and a prober that transports wafers one by one to the plurality of testers, comprising: a calculation step of calculating a test time when a wafer is tested by the tester; a test time prediction step of predicting a current test time based on the past test time calculated in the calculation step; an end time prediction step of predicting an end time of the test of the wafer to be tested based on the predicted test time when a start time of the test of the wafer to be tested by the tester is acquired; a storing step of storing at least the predicted test time and the predicted end time in a readable manner; a prediction program for determining a transport schedule for the prober based on a predicted end time of testing the wafer to be tested;

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