Heat dissipation structure and electronic device

Abstract

To suppress heat transfer to a housing.SOLUTION: A heat radiation structure comprises: a heat transfer device that transfers heat from a heat source disposed inside a housing; a radiator to which an end portion of the heat transfer device is connected and that radiates the heat from the heat source; a blower having a fan and an air blowing duct; a first air blowing path that is branched from the air blowing duct and blows air to the radiator; a second air blowing path that is branched from the air blowing duct and blows air between the housing and the heat transfer device. The air blowing duct has a first opening connected to the first air blowing path and a second opening connected to the second air blowing path, and the second opening is located on a side closer to the fan than the first opening.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present disclosure relates to a heat dissipation structure and an electronic device including the heat dissipation structure. [Background technology]

[0002] Patent Document 1 discloses an electronic device that provides a first duct member between a fan unit and a heat dissipation fin, and switches the airflow by changing the position of the first duct member in conjunction with the movement of a cover member. Patent Document 2 discloses an electronic device in which a dust collection member disposed between the fan unit and the heat dissipation fin member is configured to be detachable from an opening in the housing. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-53330 [Patent Document 2] Japanese Patent Application Laid-Open No. 2007-189183 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure aims to provide a heat dissipation structure that suppresses heat transfer to a housing, and an electronic device that includes the heat dissipation structure. [Means for solving the problem]

[0005] A heat dissipation structure according to one aspect of the present disclosure includes: a heat transfer device disposed inside the housing for transferring heat from a heat source; a heat sink connected to an end of the heat transfer device and configured to dissipate the heat from the heat source; a blower having a fan and a blower duct; a first air passage branching from the air duct and sending air to the radiator; a second air passage branching from the air duct to send air between the housing and the heat transfer device, the air duct has a first opening connected to the first air passage and a second opening connected to the second air passage, The second opening is located closer to the fan than the first opening.

[0006] An electronic device according to one aspect of the present disclosure includes the heat dissipation structure described above. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to provide a heat dissipation structure that suppresses heat transfer to a housing, and an electronic device that includes the heat dissipation structure. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic perspective view illustrating an example of an electronic device according to an embodiment of the present disclosure. [Figure 2] Bottom view of the electronic device shown in Figure 1 [Figure 3] FIG. 2 is a perspective view of a heat dissipation structure disposed in the electronic device shown in FIG. [Figure 4] 4 is a perspective view of the heat dissipation structure shown in FIG. 3, viewed from the opposite direction. [Figure 5] Front view of the heat dissipation structure shown in Figure 3 [Figure 6] Bottom view of the heat dissipation structure shown in Figure 3 [Figure 7] A cross-sectional perspective view of the heat dissipation structure shown in Figure 5 taken along line VII-VII. [Figure 8] Cross-sectional view of the heat dissipation structure shown in Figure 5 taken along line VIII-VIII [Figure 9] Cross-sectional view of the heat dissipation structure shown in Figure 6 taken along line IX-IX [Figure 10] 7 is a bottom view showing the heat dissipation structure shown in FIG. 6 with the second lower housing removed. DETAILED DESCRIPTION OF THE INVENTION

[0009] (Background to this disclosure) An example of an electronic device is a notebook computer (laptop PC). The notebook computer includes a first housing having a display unit, a second housing having an input unit, and a hinge unit that rotatably connects the first and second housings. In the notebook computer, the first and second housings rotate so that the display unit and the input unit face each other.

[0010] Electronic devices such as notebook computers house various electronic components within their housings. In recent years, as electronic devices have become more powerful, the load on the electronic components has increased, resulting in a tendency for the amount of heat generated by the electronic components to increase. For this reason, heat dissipation structures are incorporated into the housings to dissipate the heat generated by the electronic components as quickly as possible. In the heat dissipation structure, for example, heat generated by the electronic components is transferred to a heat sink via a heat transfer device, and heat is exchanged by blowing air from a blower into the heat sink, and the heated air is then discharged through an exhaust port in the housing. As the amount of heat generated increases and the housings become smaller, the gap between the housing and the heat transfer unit becomes smaller, making it easier for heat from the heat transfer device to be transferred to the housing via the heated air, which can cause the housing to become hot.

[0011] Therefore, the present inventors have discovered a heat dissipation structure that suppresses heat transfer to the housing, and have arrived at the following invention.

[0012] The heat dissipation structure of the first aspect of the present disclosure includes: a heat transfer device disposed inside the housing for transferring heat from a heat source; a heat sink connected to an end of the heat transfer device and configured to dissipate the heat from the heat source; a blower having a fan and a blower duct; a first air passage branching from the air duct and sending air to the radiator; a second air passage branching from the air duct to send air between the housing and the heat transfer device, the air duct has a first opening connected to the first air passage and a second opening connected to the second air passage, The second opening is located closer to the fan than the first opening.

[0013] With this configuration, heat transfer to the housing can be suppressed.

[0014] A heat dissipation structure according to a second aspect of the present disclosure is the same as that according to the first aspect, the housing is provided with a dust collection opening that opens in a direction intersecting the air blowing direction of the air blower duct, the housing has a lid cover that is detachably attached to the dust collection opening, The second opening may be positioned to face the dust collection opening.

[0015] With this configuration, the upstream side of the radiator, where dust is likely to accumulate, can be easily accessed through the second opening and the dust collection opening, and dust that has accumulated on the upstream side of the radiator can be cleaned.

[0016] A heat dissipation structure according to a third aspect of the present disclosure is, in the first or second aspect described above, In the facing portion of the second air passage facing the heat transfer device, the outlet gap formed between the heat transfer device and the housing downstream of the second air passage may be narrower than the facing gap formed between the heat transfer device and the housing upstream of the outlet gap.

[0017] This configuration makes it possible to prevent foreign matter from entering the second air passage through the exhaust port and to improve the flow rate in the second air passage.

[0018] A heat dissipation structure according to a fourth aspect of the present disclosure is the same as that according to the third aspect, The housing may define a downstream side of the second air passage further downstream than the outlet gap, and may have a downstream curved portion that is rounded.

[0019] With this configuration, the airflow resistance when the air flows out of the second airflow path is reduced, and the flow rate in the second airflow path is improved, thereby suppressing heat transfer to the housing.

[0020] A heat dissipation structure according to a fifth aspect of the present disclosure is any one of the first to fourth aspects, A cross-sectional area of ​​a gap formed in the second air passage downstream of the second opening and between the blower and the housing may be smaller than an opening area of ​​the first opening.

[0021] With this configuration, the heat sink to which the heat transfer device is connected can be cooled effectively.

[0022] An electronic device according to a sixth aspect of the present disclosure includes: The heat dissipation structure includes any one of the first to fifth aspects.

[0023] With this configuration, heat transfer to the housing of the electronic device can be suppressed.

[0024] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. In each drawing, elements are exaggerated for ease of explanation. Note that the X, Y, and Z directions in the drawings indicate the width, depth, and height directions of the electronic device 1, respectively.

[0025] (Embodiment) [Electronic equipment] FIG. 1 is a schematic perspective view of an example of an electronic device 1 according to an embodiment of the present disclosure.

[0026] 1, the electronic device 1 is, for example, a notebook computer (laptop PC). The electronic device 1 includes a first housing 2 and a second housing 3. Each of the first housing 2 and the second housing 3 has a thin, box-shaped outer shell and is rectangular in plan view.

[0027] A display panel 4 serving as a display unit is housed in the first housing 2. The display panel 4 is, for example, a liquid crystal panel or an organic EL panel. The outer periphery of the display panel 4 is covered by a first frame 2a of the first housing 2. It is sufficient that the first frame 2a covers at least both side edges of the display panel 4.

[0028] The second housing 3 has a second upper housing 3a and a second lower housing 3b. The second housing 3 houses a keyboard 5 and a touchpad 6, which function as input units. The outer periphery of the keyboard 5 is covered by the second upper housing 3a of the second housing 3. The touchpad 6 is provided on the front side of the keyboard 5 as seen from the user. The user can move the cursor or scroll on the display panel 4 by tracing the touchpad 6 with their finger.

[0029] For example, a secondary battery, a hard disk drive (HDD) or solid state drive (SSD) as a primary storage device, and other devices (none of which are shown) are disposed inside the second housing 3. The electronic device 1 may also include, for example, an antenna module for wireless LAN communication, a disc drive compatible with Blu-ray discs and DVD discs, a webcam element, an audio microphone, a speaker, and various other input / output terminals. However, because these components and functions are conventionally well known, illustrations and detailed descriptions of these components will be omitted.

[0030] The first housing 2 and the second housing 3 are rotatably connected via a hinge portion 7, and the electronic device 1 can be in an open state or a closed state. The "open state" refers to a state in which the first housing 2 and the second housing 3 are separated, exposing the display panel 4, keyboard 5, and touchpad 6. The "closed state" refers to a state in which the first housing 2 and the second housing 3 are positioned opposite each other, the display panel 4 faces the keyboard 5 and touchpad 6, and the display panel 4, keyboard 5, and touchpad 6 are not exposed.

[0031] FIG. 2 is a bottom view of the electronic device 1 shown in FIG. 1. As shown in FIG. 2, the second housing 3 includes a second upper housing 3a, a second lower housing 3b, and an exhaust cover 3c. The exhaust cover 3c is attached to the second lower housing 3b, located on the side of the hinge 7. Multiple openings are provided on the sides and bottom of the second lower housing 3b. Of the multiple openings, an opening provided on the rear side of the second lower housing 3b communicates with an exhaust port 8 formed on the side of the exhaust cover 3c. The second lower housing 3b (housing) is provided with a dust collection opening 13 (shown in FIGS. 6 to 9) that opens in a direction intersecting (e.g., perpendicular to) the airflow direction of a blower duct 60 (described later). A lid cover 9 is detachably provided for the dust collection opening 13. In other words, the dust collection opening 13 can be opened and closed by attaching and detaching the lid cover 9.

[0032] FIG. 3 is a perspective view of the heat dissipation structure 10 disposed in the electronic device 1 shown in FIG. 1. FIG. 4 is a perspective view of the heat dissipation structure 10 shown in FIG. 3, viewed from the opposite direction. FIG. 5 is a front view of the heat dissipation structure 10 shown in FIG. 3. FIG. 6 is a bottom view of the heat dissipation structure 10 shown in FIG. 3. FIG. 7 is a cross-sectional perspective view of the heat dissipation structure 10 shown in FIG. 5, taken along line VII-VII. FIG. 8 is a cross-sectional view of the heat dissipation structure 10 shown in FIG. 5, taken along line VIII-VIII. FIG. 9 is a cross-sectional view of the heat dissipation structure 10 shown in FIG. 6, taken along line IX-IX. FIG. 10 is a bottom view showing the heat dissipation structure 10 shown in FIG. 6 with the second lower housing 3b removed.

[0033] 3 to 8, the heat dissipation structure 10 disposed inside the second housing (housing) 3 includes a heat transfer device 15, a heat sink 20, and a blower 40. The heat dissipation structure 10 discharges heat generated by a heat source 11 disposed inside the housing 3 to the outside.

[0034] Heat source 11 is a device that generates a large amount of heat when it operates, and is, for example, a central processing unit (CPU).

[0035] The heat transfer device 15 transfers heat generated from the heat source 11 to the heat sink 20. As shown in FIGS. 7 and 8, the heat transfer device 15 is disposed on the underside of the heat sink 20 and is thermally connected to it. The heat transfer device 15 is made of a metal with high thermal conductivity, such as copper or aluminum, and is a hollow or solid heat pipe. In the YZ cross section of FIG. 8, the heat transfer device 15 has, for example, a flattened track shape and has a heat transfer upper surface 15a and a heat transfer lower surface 15b.

[0036] 3, 5, 6, and 10, one side of heat transfer device 15 is disposed in close contact with heat source 11 or disposed via another thermally conductive member, and is thermally connected to heat source 11 by being pressed against it with a pressing member (not shown). The other side of heat transfer device 15 is disposed in close contact with heat sink 20 or disposed via another thermally conductive member. Heat transfer device upper surface 15a on the other side of heat transfer device 15 is thermally connected to heat sink 20 by fastening, for example, by brazing or soldering.

[0037] The heat sink 20 has the function of releasing heat by exchanging heat with the air blown by the blower 40. The heat sink 20 is a heat sink in which a plurality of thin plate-like fins or needle-like bodies made of a metal with high thermal conductivity, such as copper or aluminum, are arranged. In the heat sink 20 illustrated in Fig. 7, for example, a plurality of fins 21 extending along the YZ plane are arranged at predetermined fin intervals in the X-axis direction.

[0038] Blower 40 has a function of blowing air toward radiator 20. Blower 40 is, for example, a centrifugal fan that blows air in a centrifugal direction. As shown in FIGS. 3 to 6 , blower 40 has a fan case 41, a rotating shaft 42, a motor 43, an intake port, a fan 45, an air outlet 47, and a branching portion 48.

[0039] Fan case 41 of blower 40 has upper case 41a and lower case 41b. The portion of fan case 41 located on the opposite side (downstream side) from fan 45 functions as air duct 60. In blower 40, fan 45 housed inside fan case 41 is rotated around rotation shaft 42 by motor 43. This causes fan 45 to take in ambient air through an intake port formed in upper case 41a and / or lower case 41b, and blow the air out of air outlet 47 through air duct 60. The air blown out from air outlet 47 is supplied to radiator 20 via branch portion 48.

[0040] A branching portion 48 is disposed at a position connecting the heat sink 20 and the blower 40. In the embodiment shown in FIG. 8 , the fan case 41 has the branching portion 48 downstream of the air outlet 47. The branching portion 48 functions as a rectangular branching duct formed by the upper case 41a and the lower case 41b. A branching passage 49 is formed inside the branching portion 48. The branching passage 49 of the branching portion 48 causes the air duct 60 to branch into the first air passage 36 and the second air passage 38. The air duct 60 has a first opening 66 connected to the first air passage 36 and a second opening 67 connected to the second air passage 38. In other words, the first opening 66 and the second opening 67 are formed at the branching portion 48 of the air duct 60. The second opening 67 is larger than the first opening 66.

[0041] The first opening 66 is formed on the downstream side of the branching portion 48 and is positioned to face the exhaust port 8 via the heat sink 20. The first opening 66 is formed by an upper case inner surface 63 and a lower case inner surface 64 of the fan case 41 (branching portion 48). The first opening 66 is configured so that the upstream ends of the fins 21 can be attached and held therein. The second opening 67 is formed in the lower case 41b of the fan case 41 (branching portion 48) and is positioned so as to face the dust collection opening 13 of the second lower housing 3b. The second opening 67 is positioned closer to the fan 45 than the first opening 66.

[0042] The second opening 67 communicates with the dust collection opening 13 in the Z-axis direction. As described above, the dust collection opening 13 can be opened and closed by attaching and detaching the lid cover 9. This allows easy access to the upstream side of the fins 21 of the heat sink 20, where dust tends to accumulate, through the second opening 67 and the dust collection opening 13, and allows dust that has accumulated on the upstream side of the fins 21 of the heat sink 20 to be cleaned.

[0043] As shown in FIGS. 7 and 8, an upper insulating material 50 is disposed in the gap between the second upper housing 3a and the heat sink 20, and in the gap between the second upper housing 3a and the branching portion 48. In other words, the upper surface of the heat sink 20 is separated from the upper inner surface 61 of the second upper housing 3a via the upper insulating material 50. The upper insulating material 50 provides a heat insulating separation structure between the second upper housing 3a and the heat sink 20. The upper insulating material 50 is a foam of an organic material that has shielding and heat insulating properties (low thermal conductivity). The upper insulating material 50 is, for example, a sponge made of melamine resin.

[0044] As shown in FIG. 10 , a lower insulating material 51 is disposed above the heat transfer device 15, the branching portion 48, and the lower case 41b. In other words, the lower insulating material 51 is disposed in the gap between the second lower housing 3b and the heat transfer device 15, the gap between the second lower housing 3b and the branching portion 48, and the gap between the second lower housing 3b and the lower case 41b. The lower insulating material 51 has a U-shape and is disposed above the lower case 41b so that the bottom of the U-shape does not overlap with the second opening 67. The lower insulating material 51 functions to regulate the air flowing through the gap between the second lower housing 3b and the heat transfer device 15, the gap between the second lower housing 3b and the branching portion 48, and the gap between the second lower housing 3b and the lower case 41b. The lower insulating material 51 is a foam of an organic material that has shielding and heat insulating properties (low thermal conductivity). The lower heat insulating material 51 is, for example, a sponge made of melamine resin.

[0045] The heat dissipation structure 10 and the air flow will be described in detail with reference to Fig. 8. Arrows in Fig. 8 schematically show the air flows (first air F1 to ninth air F9) in the heat dissipation structure 10.

[0046] In blower 40, air blown out from fan 45 flows as first air F1 through blower duct 60. After passing through blower port 47, first air F1 branches into second air F2 and third air F3 at branch path 49 of branch section 48.

[0047] The heat radiator 20 has a first air passage 36 formed by a plurality of adjacent fins 21. The first air passage 36 starts at a first opening 66 of the branch portion 48 and extends in the Y-axis direction to a junction duct 39, which will be described later.

[0048] In the first air passage 36, the second air flow F2 is introduced through the first opening 66, and the fourth air flow F4 flows between adjacent fins 21. The air flowing between the fins 21 removes heat from the heated fins 21 (i.e., cools the heated fins 21), lowering the temperature of the fins 21. The fourth air flow F4 then flows as the fifth air flow F5 in the junction duct 39. The fifth air flow F5 merges with the eighth air flow F8, which will be described later, to become the ninth air flow F9. The ninth air flow F9 flows out from the exhaust port 8 of the exhaust cover 3c.

[0049] A second air flow path 38 is formed in the gap between the second lower housing 3b and the heat transfer device 15 and in the gap between the second lower housing 3b and the branching portion 48. The second air flow path 38 starts from the second opening 67 of the branching portion 48 and extends in the Y-axis direction to the junction duct 39.

[0050] In the second air flow passage 38, the third air flow F3 is introduced through the second opening 67, the sixth air flow F6 flows through the gap between the lower case 41b and the second lower housing 3b (lid cover 9), and the seventh air flow F7 flows through the gap between the heat transfer device 15 and the second lower housing 3b. That is, the seventh air flow F7 flows through the gap formed by the lower inner surface 62 of the second lower housing 3b and the heat transfer device lower surface 15b of the heat transfer device 15. The seventh air flow F7 then flows into the junction duct 39 through the outlet gap G2, where it flows as the eighth air flow F8. In this way, the air heated in the gap between the heat transfer device 15 and the second lower housing 3b flows into the junction duct 39, thereby suppressing the temperature rise of the second lower housing 3b. The eighth air flow F8 merges with the fifth air flow F5 to become the ninth air flow F9. The ninth air flow F9 flows out from the exhaust port 8 of the exhaust cover 3c.

[0051] 7 and 8, a gap 68 is formed in second air passage 38 at a position in the Z axis direction downstream of second opening 67 and corresponding to first opening 66. Gap 68 is formed between a lower case outer surface 65 (shown in FIG. 9) of lower case 41b of blower 40 and a peripheral edge portion of second lower housing 3b that defines dust collection opening 13. In order to attach lid cover 9, the peripheral edge portion of second lower housing 3b that defines dust collection opening 13 rises in the Z axis direction more than a portion of second lower housing 3b that faces heat transfer lower surface 15b of heat transferer 15.

[0052] The opening area of ​​the first opening 66 is configured to be larger than the cross-sectional area of ​​the intermediate gap 68. In other words, the cross-sectional area of ​​the intermediate gap 68 is smaller than the opening area of ​​the first opening 66. The first height H1 of the first opening 66 in the Z-axis direction is configured to be higher than the second height H2 of the intermediate gap 68 in the Z-axis direction. This allows the heat radiator 20 to be connected to the heat transfer device 15 to be effectively cooled. The ratio of the first height H1 to the second height H2 in the Z-axis direction is, for example, 3:1 to 7:1, preferably 4:1 to 6:1, and more preferably 5:1.

[0053] As described above, the second opening 67 is larger than the first opening 66. The second opening 67 needs to be somewhat large to clean the upstream side of the fin 21 through the dust collection opening 13. However, if the second opening 67 is too large, air from the blower 40 flows more easily into the second air passage 38 than into the first air passage 36. Therefore, by making the cross-sectional area of ​​the intermediate gap 68 smaller than the opening area of ​​the first opening 66, it is made more difficult for air to flow into the second air passage 38 than into the first air passage 36. In other words, the flow rate of the first air passage 36 is greater than the flow rate of the second air passage 38. This makes it possible to balance the heat dissipation through the first air passage 36 and the heat dissipation through the second air passage 38, effectively reducing the temperature of the ninth air F9 discharged from the exhaust port 8.

[0054] A facing gap G1 and an outlet gap G2 are formed in a facing portion of the second air passage 38 facing the heat transfer device 15. The facing gap G1 is located upstream of the outlet gap G2 in the second air passage 38. The facing gap G1 is defined by a flat portion of the heat transfer device lower surface 15b of the heat transfer device 15 and a flat portion of the lower inner surface 62 of the second lower housing 3b in the second air passage 38. The outlet gap G2 is defined by a downstream edge of the heat transfer device lower surface 15b of the heat transfer device 15 and the lower inner surface 62 of the second lower housing 3b in the second air passage 38. In a facing portion of the second air passage 38 facing the heat transfer device 15, the outlet gap G2 is narrower than the facing gap G1. This prevents foreign matter from entering the second air passage 38 through the exhaust port 8 and improves the flow rate in the second air passage 38.

[0055] The second lower housing 3b also has a downstream curved portion 3f that defines the downstream side of the second air flow passage 38, further downstream than the outlet gap G2. The downstream curved portion 3f is located on the most downstream side of the second lower housing 3b and is located upstream of the exhaust cover 3c. A lower inner surface 62 of the downstream curved portion 3f extends upward toward the exhaust port 8 and is curved in a rounded shape. This reduces ventilation resistance when air flows out of the second air flow passage 38, thereby improving the flow rate in the second air flow passage 38 and suppressing heat transfer to the second lower housing 3b.

[0056] The effect of the heat dissipation structure 10 was simulated using a general-purpose structural grid three-dimensional thermal fluid analysis system (STREAM (registered trademark), Thermal Design PAC V2020, manufactured by Software Cradle Co., Ltd.). As a comparative example, a configuration in which the second air passage 38 was closed by changing the shape of the lower insulation material 51 was used.

[0057] The analysis conditions were a power of 28 W for heat source 11, a room temperature of 25°C, and fan settings using the same PQ table. Using room temperature of 25°C as the reference temperature, the heat generation temperature of the portion of second lower housing 3b facing heat transfer device 15 was simulated, and the temperature rise was calculated by subtracting the reference temperature from the heat generation temperature when heat source 11 was made to generate heat.

[0058] The simulation results showed that the temperature rise rate of the second lower housing (housing) 3b according to the embodiment of this disclosure was reduced by approximately 11% compared to the comparative embodiment. Therefore, the heat dissipation structure 10 according to the above embodiment can suppress heat transfer to the second lower housing 3b (housing). Note that the above simulation was performed using a metal material for the second lower housing (housing) 3b, but it goes without saying that the temperature rise suppression effect in the second lower housing (housing) 3b depends on the material of the second lower housing (housing) 3b.

[0059] [effect] According to the heat dissipation structure 10 of this embodiment, the following effects can be achieved.

[0060] The heat dissipation structure 10 includes a heat transfer device 15, a heat radiator 20, a blower 40, a first air flow path 36, and a second air flow path 38. The heat transfer device 15 transfers heat from a heat source 11 disposed inside the housing 3b. An end of the heat transfer device 15 is connected to the heat radiator 20, which dissipates the heat from the heat source 11. The blower 40 includes a fan 45 and an air flow duct 60. The first air flow path 36 branches off from the air flow duct 60 and sends air to the heat radiator 20. The second air flow path 38 branches off from the air flow duct 60 and sends air between the housing 3b and the heat transfer device 15. The air flow duct 60 includes a first opening 66 connected to the first air flow path 36 and a second opening 67 connected to the second air flow path 38. The second opening 67 is located closer to the fan 45 than the first opening 66.

[0061] With this configuration, heat transfer to the housing 3b can be suppressed.

[0062] In heat dissipation structure 10 of the present embodiment, housing 3b is provided with dust collection opening 13 that opens in a direction intersecting the air flow direction of air blower duct 60. Housing 3b has lid cover 9 that is detachably attached to dust collection opening 13. Second opening 67 is positioned to face dust collection opening 13.

[0063] With this configuration, the upstream side of the radiator 20, where dust tends to accumulate, can be easily accessed through the second opening 67 and the dust collection opening 13, and dust adhering to the upstream side of the radiator 20 can be cleaned.

[0064] In the heat dissipation structure 10 of this embodiment, in the facing portion facing the heat transfer device 15 in the second air flow path 38, the outlet gap G2 formed between the heat transfer device 15 and the housing 3b on the downstream side of the second air flow path 38 is narrower than the facing gap G1 formed between the heat transfer device 15 and the housing 3b on the upstream side of the outlet gap G2.

[0065] Such a configuration makes it possible to prevent foreign matter from entering second air passage through exhaust port 8 and to improve the flow rate in second air passage .

[0066] In the heat dissipation structure 10 of the present embodiment, the housing 3b defines the downstream side of the second air passage 38 further downstream than the outlet gap G2, and has a rounded downstream curved portion 3f.

[0067] With this configuration, the resistance to ventilation when the air flows out of the second airflow path 38 is reduced, and the flow rate in the second airflow path 38 is improved, so that heat transfer to the housing 3b can be suppressed.

[0068] In the heat dissipation structure 10 of this embodiment, the cross-sectional area of ​​the intermediate gap 68 formed downstream of the second opening 67 in the second air flow path 38 and between the blower 40 and the housing 3b is smaller than the opening area of ​​the first opening 66.

[0069] With this configuration, the heat radiator 20 to which the heat transfer device 15 is connected can be cooled effectively.

[0070] The electronic device 1 of the present embodiment includes the heat dissipation structure 10 described above.

[0071] With this configuration, in the electronic device 1, heat transfer to the housing 3b can be suppressed.

[0072] In the above embodiment, a CPU has been described as an example of heat source 11 that generates heat during operation. However, heat source 11 is not limited to a CPU, and may be any of a variety of devices that need to release generated heat to the outside of housings 2 and 3, such as an image processing device (GPU: Graphics Processing Unit) or a secondary battery.

[0073] In the above embodiment, a notebook computer (laptop PC) has been described as an example of the electronic device 1. However, the electronic device 1 is not limited to such a notebook computer (laptop PC), and may be, for example, a tablet PC, a mobile phone, a portable game console, a small television receiver, a disk drive, a navigation system, or other portable devices, or even a desktop PC, a liquid crystal projector, or other stationary devices.

[0074] In the above embodiment, the branching portion 48 is configured as a part of the blower 40 (fan case 41), but may be configured as a separate member from the blower 40 (fan case 41).

[0075] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various changes and modifications will be apparent to those skilled in the art, and such changes and modifications are to be understood as being included within the scope of the present disclosure as defined by the appended claims unless they depart therefrom. [Industrial Applicability]

[0076] The present disclosure is useful for a heat dissipation structure disposed inside an electronic device such as a notebook computer (laptop PC). [Explanation of symbols]

[0077] 1...Electronic equipment 2...1st enclosure (enclosure) 2a...1st slot 3...Second housing (housing) 3a...Second upper housing 3b...Second lower housing (housing) 3c…Exhaust cover 3f...Downstream bend 4...Display panel 5. Keyboard 6...Touchpad 7...Hinge part 8...Exhaust port 9...Lid cover 10…Heat dissipation structure 11...Heat source 13...Dust collection opening 15...Heat transfer device 15a...Top surface of heat transfer device 15b…Bottom surface of heat exchanger 20…Radiator 21...Finn 36...1st ventilation duct 38…Second ventilation duct 39...Confluence duct 40...Blower 41...Fan case 41a...Upper case 41b...Lower case 42...Rotation axis 43...Motor 44...Intake port 45...Fan 47...Air outlet 48...Branch 49...Fork in the road 50...Top insulation 51...Under insulation 60...Ventilation duct 61...Upper inner surface 62…Lower inner surface 63...Inside of upper case 64...Inside of the lower case 65...Outer surface of lower case 66...First opening 67...Second opening 68...Middle gap F1...First airflow F2: Second airflow F3...Third airflow F4...Fourth airflow F5...5th airflow F6…6th fan F7...7th airflow F8...8th airflow F9...9th airflow H1...First height H2: Second height G1: Opposite gap G2…Exit gap

Claims

1. a heat transfer device disposed inside the housing for transferring heat from a heat source; a heat sink connected to an end of the heat transfer device and configured to dissipate the heat from the heat source; a blower having a fan and a blower duct; a first air passage branching from the air duct and supplying air to the radiator; a second air passage branching from the air duct to send air between the housing and the heat transfer device, the air duct has a first opening connected to the first air passage and a second opening connected to the second air passage, the second opening is located closer to the fan than the first opening, A heat dissipation structure, wherein a cross-sectional area of ​​a gap formed in the second air passage downstream of the second opening and between the blower and the housing is smaller than an opening area of ​​the first opening.

2. A heat transfer device that transfers heat from a heat source disposed inside the housing; a heat sink connected to an end of the heat transfer device and configured to dissipate the heat from the heat source; a blower having a fan and a blower duct; a first air passage branching from the air duct and supplying air to the radiator; a second air passage branching from the air duct to send air between the housing and the heat transfer device, the air duct has a first opening connected to the first air passage and a second opening connected to the second air passage, the second opening is located closer to the fan than the first opening, the housing is provided with a dust collection opening that opens in a direction intersecting the air blowing direction of the air blower duct, the housing has a lid cover that is detachably attached to the dust collection opening, The second opening is positioned to face the dust collection opening.

3. A heat transfer device that transfers heat from a heat source disposed inside the housing; a heat sink connected to an end of the heat transfer device and configured to dissipate the heat from the heat source; a blower having a fan and a blower duct; a first air passage branching from the air duct and supplying air to the radiator; a second air passage branching from the air duct to send air between the housing and the heat transfer device, the air duct has a first opening connected to the first air passage and a second opening connected to the second air passage, the second opening is located closer to the fan than the first opening, A heat dissipation structure in which, in the facing portion of the second air flow path facing the heat transfer device, the outlet gap formed between the heat transfer device and the housing on the downstream side of the second air flow path is narrower than the facing gap formed between the heat transfer device and the housing on the upstream side of the outlet gap.

4. The heat dissipation structure according to claim 3 , wherein the housing defines a downstream side of the second air passage further downstream than the outlet gap, and has a downstream curved portion that is rounded.

5. An electronic device comprising the heat dissipation structure according to claim 1 .

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