Temperature Control Module

Abstract

PURPOSE: To provide a temperature adjustment module that may effectively adjust a temperature of a peripheral circuit element on a mother board.SOLUTION: A temperature adjustment module includes a temperature changing module and a temperature control module. The temperature changing module includes a temperature changing area. The temperature changing module is in contact with a peripheral circuit element on a motherboard through the temperature changing area and a heat conduction material. The temperature control module is electrically connected to the temperature changing module and configured to control a temperature of the temperature changing module to reach a target temperature. The temperature changing module further includes a printed circuit board in the temperature changing area, and the temperature of the temperature changing module is changed by at least one of a winding wire and an electronic component on the printed circuit board.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a regulation module, and in particular to a temperature regulation module. [Background technology]

[0002] Currently, during extreme overclocking of central processing unit (CPU) chips, graphics processing unit (GPU) chips, and / or memory modules on a computer motherboard (MB), liquid nitrogen or liquid helium is used to cool the overclocked components, which can cause the overclocked components' frequencies to increase to extremely high frequencies. Furthermore, during the cooling process, peripheral circuit components on the motherboard adjacent to the overclocked components may also be cooled simultaneously. This can prevent the optimal operating temperatures of the peripheral circuit components from dropping too low, or can result in insufficient cooling, preventing the overclocked components from operating normally or efficiently due to the peripheral circuit components. As a result, the actual operating efficiency of the overclocked components cannot achieve the corresponding efficiency improvement achieved by overclocking. Summary of the Invention [Problem to be solved by the invention]

[0003] The present invention provides a temperature regulation module that can effectively regulate the temperature of peripheral circuit elements on a motherboard. [Means for solving the problem]

[0004] The temperature adjustment module of the present invention includes a temperature change module and a temperature control module. The temperature change module includes a temperature change region. The temperature change module contacts peripheral circuit elements on a motherboard via the temperature change region and a thermally conductive material. The temperature control module is electrically connected to the temperature change module and configured to control the temperature of the temperature change module to reach a target temperature. The temperature change module further includes a printed circuit board within the temperature change region, and the temperature of the temperature change module is changed by at least one of windings or electronic components on the printed circuit board. [Effects of the Invention]

[0005] As described above, the temperature control module of the present invention can perform temperature control on the peripheral circuit elements around the main circuit element after the cooling module cools the main circuit element, so that the main circuit element can be operated under good operating conditions.

[0006] In order to make the features and advantages of the present invention clearer and easier to understand, the following embodiments are provided and will be described in detail below in conjunction with the accompanying drawings. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a schematic circuit diagram of a temperature adjustment module according to one embodiment of the present invention; [Figure 2] 1 is a schematic circuit diagram of a temperature adjustment module according to one embodiment of the present invention; [Figure 3] FIG. 2 is a schematic diagram of a temperature adjustment module disposed on a motherboard according to one embodiment of the present invention. [Figure 4] 3 is a flowchart of a temperature adjustment method according to one embodiment of the present invention. [Figure 5] FIG. 2 is a schematic diagram of a temperature adjustment module disposed on a motherboard according to one embodiment of the present invention. [Figure 6] FIG. 2 is a schematic diagram of a temperature adjustment module disposed on a motherboard according to one embodiment of the present invention. [Figure 7] 1 is a schematic distribution diagram of multiple temperature change regions of a temperature change module according to one embodiment of the present invention. [Figure 8] 1 is a schematic distribution diagram of multiple temperature change regions of a temperature change module according to one embodiment of the present invention. [Figure 9] 1 is a schematic distribution diagram of multiple temperature change regions of a temperature change module according to one embodiment of the present invention. [Figure 10] FIG. 2 is a schematic structural diagram of a temperature control module and a temperature adjustment module according to one embodiment of the present invention; [Figure 11] FIG. 2 is a schematic structural diagram of a temperature control module and a temperature adjustment module according to one embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0008] To facilitate understanding of the present invention, the following specific embodiments are shown as actual embodiments of the present invention, and wherever possible, elements / components / steps with the same reference numbers in the drawings and embodiments represent the same or similar parts.

[0009] The main circuit elements described in each embodiment of the present invention may include at least one of a central processing unit (CPU) chip, a graphics processing unit (GPU) chip, and a memory module mounted on a computer motherboard (MB). The memory module may be, for example, a double data rate synchronous dynamic random access memory (DDR SDRAM). The peripheral circuit elements described in each embodiment of the present invention may include circuit elements disposed around the main circuit elements, such as resistors, capacitors, inductors, transistors, power stage circuits, other functional chips, and / or associated circuit wiring.

[0010] FIG. 1 is a schematic circuit diagram of a temperature adjustment module according to one embodiment of the present invention. Referring to FIG. 1, the temperature adjustment module 100 includes a temperature control module 110 and a temperature change module 120. The temperature control module 110 is electrically connected to the temperature change module 120. In this embodiment, the temperature adjustment module 100 is configured to be disposed on a motherboard and to perform temperature adjustment on peripheral circuit elements. Specifically, the temperature change module 120 may include a temperature change region, and the temperature change module 120 may contact the peripheral circuit elements via the temperature change region and a thermally conductive material. The thermally conductive material may be, for example, thermal paste or a related thermal interface material. In this embodiment, the temperature control module 110 is configured to control the temperature of the temperature change module 120 to reach a target temperature. That is, the temperature control module 110 may directly adjust the temperature of the peripheral circuit elements via the temperature change module 120.

[0011] It should be noted that the temperature change area provided in each embodiment of the present invention can include a printed circuit board (PCB). The temperature change module provided in each embodiment of the present invention can achieve the function of changing (or influencing) the temperature of surrounding electronic elements in contact with it by inducing a temperature change through windings on the PCB (e.g., increasing the voltage or current on the windings), by inducing a temperature change through temperature-variable electronic components (e.g., thermistors, thermocouples, thermal resistors, etc.) on the PCB, or by inducing a temperature change simultaneously through windings and temperature-variable electronic components on the PCB. Furthermore, the temperature change area provided in each embodiment of the present invention can be a single temperature change area or can include multiple temperature change areas, and each temperature change area can have a single sub-temperature change area or multiple sub-temperature change areas. The temperatures of all temperature change areas and sub-temperature change areas can be controlled together or individually.

[0012] FIG. 2 is a schematic circuit diagram of a temperature adjustment module according to one embodiment of the present invention. Referring to FIG. 2, the temperature adjustment module 200 includes a temperature control module 210, a temperature change module 220, and a temperature sensor 230. The temperature control module 210 is electrically connected to the temperature change module 220 and the temperature sensor 230. In this embodiment, the temperature adjustment module 200 is configured to be disposed on a motherboard and to perform temperature adjustment on peripheral circuit elements. Specifically, the temperature change module 220 may include a temperature change area, and the temperature change module 220 may be in contact with the peripheral circuit elements via the temperature change area and a thermally conductive material. The temperature sensor 230 may be disposed within the temperature change area of ​​the temperature change module 220. In this embodiment, the temperature control module 210 is configured to detect the ambient temperature of the peripheral circuit elements in contact with the temperature change area in real time via the temperature sensor 230, and correspondingly control the temperature of the temperature change module 220 to reach a target temperature based on the ambient temperature of the peripheral circuit elements. That is, the temperature control module 210 can adjust the temperature of the peripheral circuit element via the temperature change module 220 based on the ambient temperature of the peripheral circuit element.

[0013] FIG. 3 is a schematic diagram of a temperature adjustment module disposed on a motherboard according to one embodiment of the present invention. Referring to FIG. 3, the arrangement of the temperature adjustment module provided in each embodiment of the present invention is shown in FIG. 3. In this embodiment, the motherboard 300 may have a first surface S1 (e.g., the front surface of the motherboard) and a second surface S2 (e.g., the back surface of the motherboard). The first surface S1 may be parallel to the second surface S2. The first surface S1 and the second surface S2 may be parallel to a plane formed by extending the directions D1 and D2, respectively. The directions D1, D2, and D3 are perpendicular to each other. In this embodiment, a main circuit element 301 may be disposed on the first surface S1 of the motherboard 300. A peripheral circuit element 302 may be disposed on the first surface S1 of the motherboard 300 adjacent to the periphery of the main circuit element 301. A peripheral circuit element 303 may be disposed on the second surface S2 of the motherboard 300 at a position corresponding to the main circuit element 301 in the direction D3. Peripheral circuit elements 304 may be disposed on the second surface S2 of the motherboard 300 adjacent to a periphery corresponding to the position of the main circuit elements 301 in the direction D3.

[0014] In this embodiment, a cooling module 310 may be disposed on the main circuit element 301. Temperature change modules 320-340 may be disposed on the peripheral circuit elements 302-304. In this embodiment, the main circuit element 301 may perform an overclocking operation. However, during the overclocking operation, the main circuit element 301 itself may generate heat. Therefore, to enable the main circuit element 301 to maintain normal and highly efficient operation functions (e.g., data processing functions) during the overclocking operation, the cooling module 310 may cool the main circuit element 301 to a first temperature, which may be lower than or equal to a target temperature. In one embodiment, the cooling module 310 may be, for example, an air-cooled heat dissipation type, a water-cooled heat dissipation type, or an extreme heat dissipation type (e.g., using liquid nitrogen or liquid helium).

[0015] In particular, the cooling module 310 may be an extreme heat dissipation type to dissipate extreme heat from the main circuit element 301. In this case, the cooling module 310 can cool to extremely low temperatures (e.g., −196°C (liquid nitrogen) or −267°C (liquid helium)), which may affect the peripheral circuit elements 302-304. Therefore, in this embodiment, the temperature change modules 320-340 can heat the peripheral circuit elements 302-304 to a target temperature (i.e., an optimal operating temperature) to prevent the peripheral circuit elements 302-304 from becoming too low in temperature, which would make them unusable or cause poor operating efficiency (i.e., not at their optimal operating temperature). Instead, to reduce the operating efficiency after overclocking the main circuit element 301, the temperature change modules 320-340 can heat the peripheral circuit elements 302-304 to a target temperature (i.e., an optimal operating temperature). From another perspective, the main circuit element 301 and the peripheral circuit elements 302-304 can have different optimal operating temperatures.

[0016] Alternatively, in one embodiment, when the optimal operating temperature of the peripheral circuit elements 302-304 is lower than the current ambient temperature, the temperature change modules 320-340 may cool the peripheral circuit elements 302-304. Furthermore, in another embodiment, the peripheral circuit elements 302-304 may have different target temperatures (i.e., optimal operating temperatures), or the temperature change modules 320-340 may cool or heat the peripheral circuit elements 302-304 to different degrees.

[0017] It should also be noted that the mounting, placement positions, and quantities of the main and peripheral circuit elements of the present invention are not limited to those shown in Fig. 3. Fig. 3 is merely an example. The peripheral circuit elements shown in each embodiment of the present invention may be placed on the same surface as the main circuit elements on the same circuit board. Alternatively, the peripheral circuit elements and main circuit elements shown in each embodiment of the present invention may be placed on different surfaces of the same circuit board. Furthermore, the peripheral circuit elements and main circuit elements may be placed on different circuit boards.

[0018] FIG. 4 is a flowchart of a temperature adjustment method according to one embodiment of the present invention. Referring to FIGS. 2 and 4, the temperature adjustment module 200 of FIG. 2 can perform the following steps S410 to S430. In step S410, while the cooling module on the main circuit element of the motherboard cools the main circuit element, the temperature control module 210 can detect the ambient temperature of the peripheral circuit element via the temperature sensor 230. In step S420, the temperature control module 210 can determine whether the ambient temperature is lower or higher than the target temperature. If the ambient temperature is neither lower nor higher than the target temperature, the temperature control module 210 waits a predetermined time, then again detects the ambient temperature of the peripheral circuit element via the temperature sensor 230, and again determines whether the ambient temperature is lower or higher than the target temperature. If the ambient temperature is lower or higher than the target temperature, the temperature control module 210 operates the temperature change module 220 to adjust the temperature of the peripheral circuit element to reach the target temperature. In this case, when the temperature control module 210 determines that the ambient temperature is lower than a predetermined target temperature (i.e., for example, the optimal operating temperature of the peripheral circuit elements), the temperature control module 210 can operate the temperature change module 220 to heat the peripheral circuit elements so that the target temperature is reached. Also, when the temperature control module 210 determines that the ambient temperature is higher than the predetermined target temperature, the temperature control module 210 can operate the temperature change module 220 to cool the peripheral circuit elements so that the target temperature is reached. In this way, when the main circuit elements are in an overclocking operation state, the peripheral circuit elements can be maintained at a good (or optimal) operating temperature, so that the main circuit elements, when operating together with the peripheral circuit elements, can effectively achieve high-efficiency operation after overclocking. Furthermore, the temperature adjustment method provided in this embodiment can also be applied to the temperature adjustment module 100 of FIG. 1.

[0019] 3, in the embodiment of FIG. 3, the temperature sensors of the temperature change modules 320-340 can detect the ambient temperatures of the peripheral circuit elements 302-304, respectively, and the temperature control modules can individually determine whether temperature adjustment is necessary based on the ambient temperatures. That is, at least some of the temperature change modules 320-340 can adjust the temperatures of the peripheral circuit elements 302-304 to different degrees.

[0020] FIG. 5 is a schematic diagram of a temperature adjustment module disposed on a motherboard according to one embodiment of the present invention. Referring to FIG. 5, a peripheral circuit element 501 may be disposed on a surface S2 of a motherboard 500. A temperature change module 520 is disposed on the peripheral circuit element 501, and a thermally conductive material 502 is present between the temperature change module 520 and the peripheral circuit element 501. The temperature control module 510 is electrically connected to the temperature change module 520. A surface S4 of the temperature change module 520 may have a temperature change region. The temperature change region on the surface S4 of the temperature change module 520 may be in contact with the peripheral circuit element 501 via the thermally conductive material 502, and a temperature sensor may be disposed within the temperature change region.

[0021] In this embodiment, the temperature control module 510 and the temperature change module 520 may be disposed on different circuit boards. That is, the temperature control module 510 may be disposed on an external circuit board, and the temperature control module 510 may be electrically connected to the temperature change module 520 and the temperature sensor via connecting wires. Alternatively, in one embodiment, the temperature control module 510 and the temperature change module 520 may be disposed (integrated) on the same circuit board.

[0022] FIG. 6 is a schematic diagram of a temperature adjustment module disposed on a motherboard according to one embodiment of the present invention. Referring to FIG. 6, a peripheral circuit element 601 may be disposed on a surface S2 of a motherboard 600. The temperature adjustment module provided in this embodiment may include a metal thermostat 630. The metal thermostat 630 is disposed on the peripheral circuit element 601, and a thermally conductive material 602 is present between the metal thermostat 630 and the peripheral circuit element 601. The temperature control module 610 is electrically connected to a temperature change module 620. A surface S4 of the temperature change module 620 may have a temperature change region. The temperature change region on the surface S4 of the temperature change module 620 may contact the peripheral circuit element 601 via the metal thermostat 630 and the thermally conductive material 602, and a temperature sensor may be disposed within the temperature change region.

[0023] In this embodiment, the metal thermostat 630 is disposed between the temperature changing module 620 and the peripheral circuit element 601. The contact area between the metal thermostat 630 and the peripheral circuit element 601 via the thermally conductive material 602 is larger than the contact area between the metal thermostat 630 and the temperature changing module 620. That is, the temperature changing module 620 provided in this embodiment can increase the contact area for temperature change via the metal thermostat 630, and therefore can cover more components and a wider area of ​​the peripheral circuit element 601.

[0024] FIG. 7 is a schematic distribution diagram of multiple temperature change regions in a temperature change module according to one embodiment of the present invention. The temperature change module 720 provided in this embodiment can be used to adjust the temperature of multiple peripheral circuit elements in multiple sub-regions on the back surface of a motherboard on which a CPU chip is mounted. Referring to FIG. 7 , the surface S4 of the temperature change module 720 can include multiple temperature change regions 701-709. The temperature change regions 701-709 can be arranged, for example, in an array, but the present invention is not limited thereto. The temperature change regions 701-709 can contact multiple peripheral circuit elements via a thermally conductive material (or even via multiple metal thermostats), and multiple temperature sensors can be disposed within each of the temperature change regions 701-709. In one embodiment, at least some of the temperature change regions 701-709 can correspond to different target temperatures.

[0025] Specifically, in this embodiment, the temperature change module 720 can be mounted on the motherboard behind the CPU chip socket of the motherboard. Because the back of the motherboard's CPU chip socket is not a flat surface, a thermally conductive material can be provided between the temperature change module 720 and the back of the motherboard, and the temperature change module 720 can be fixed to the back of the CPU chip socket of the motherboard. A temperature sensor can be disposed in each of the temperature change areas 701-709. In this embodiment, the temperature change area 705 can, for example, directly face the front and back areas of the motherboard's CPU chip socket. During extreme overclocking, cooling the CPU chip via liquid nitrogen can make the temperature of the temperature change area 705 the lowest temperature relative to the other temperature change areas. Therefore, the temperature change area 705 can correspond to a specific target temperature that is lower or higher. Additionally, the remaining temperature change areas 701-704 and 706-709 can be designed to accommodate different target temperatures based on factors such as, for example, different relative positions to temperature change area 705, different electronic components on the motherboard, or different layouts and wiring.

[0026] In this embodiment, assuming that the temperature change areas 701, 702, 703, 706, and 709 correspond to the positions of the power circuits of the CPU chips on the motherboard, the temperatures of the temperature change areas 701, 702, 703, 706, and 709 may become relatively high during extreme overclocking. Therefore, by setting the target temperatures of the temperature change areas 701, 702, 703, 706, and 709 to, for example, 0°C or higher, the motherboard and electronic components can be protected from freezing due to low temperatures, and damage to the motherboard caused by liquid water after the ice melts can also be prevented.

[0027] FIG. 8 is a schematic distribution diagram of multiple temperature change regions of a temperature change module according to one embodiment of the present invention. The temperature change module 820 provided in this embodiment can be used to adjust the temperature of multiple peripheral circuit elements in multiple sub-regions of a rear region of a motherboard on which memory modules are arranged. Referring to FIG. 8, the surface S4 of the temperature change module 820 can include multiple temperature change regions 801-804. The temperature change regions 801-804 can be arranged in a direction D2, for example, but the present invention is not limited thereto. The temperature change regions 801-804 can contact multiple peripheral circuit elements via a thermally conductive material (or even via multiple metal thermostats), and multiple temperature sensors can be arranged in the temperature change regions 801-804, respectively. In one embodiment, at least some of the temperature change regions 801-804 can correspond to different target temperatures.

[0028] Specifically, in this embodiment, the temperature change module 820 can be disposed on the motherboard behind the memory module socket on the motherboard. Because the back of the motherboard memory module socket is not a flat surface, a thermally conductive material can be provided between the temperature change module 820 and the back of the motherboard, and the temperature change module 820 can be fixed to the back of the memory module socket on the motherboard. Two temperature sensors can be provided in each of the temperature change areas 801-804. In this embodiment, the temperature change areas 801 and 802 can, for example, directly face the front and rear areas of the motherboard memory module socket. During extreme overclocking, cooling the memory modules via liquid nitrogen can make the temperatures of the temperature change areas 801 and 802 the lowest relative to the other temperature change areas. Therefore, the temperatures of the temperature change areas 801 and 802 can correspond to a specific target temperature, which can be lower or higher. Additionally, the remaining temperature change areas 803 and 804 can be designed to correspond to different target temperatures based on factors such as different relative locations to temperature change areas 801 and 802, different electronic components on the motherboard, or different layouts and wiring.

[0029] In this embodiment, assuming that the temperature change areas 803 and 804 correspond to the positions of the power circuits or function buttons of the memory modules on the motherboard, freezing is likely to occur at the temperatures of the temperature change areas 803 and 804 during extreme overclocking, which may cause abnormalities in the function buttons. Therefore, by setting the target temperatures of the temperature change areas 803 and 804 to, for example, 0 degrees or higher, it is possible to prevent the motherboard and electronic components from being affected by freezing due to low temperatures, and also to prevent damage to the motherboard from liquid water after the ice melts.

[0030] FIG. 9 is a schematic distribution diagram of multiple temperature change regions of a temperature change module according to one embodiment of the present invention. The temperature change module 920 provided in this embodiment can be applied to adjust the temperature of multiple peripheral circuit elements in multiple sub-regions of the rear or front peripheral region of a motherboard on which a GPU chip is arranged. Referring to FIG. 9, the surface S4 of the temperature change module 920 can include multiple temperature change regions 901-904. The temperature change regions 901-904 can be arranged, for example, in a ring shape, but the present invention is not limited thereto. The temperature change regions 901-904 can contact multiple peripheral circuit elements via a thermally conductive material (or even via multiple metal thermostats), and multiple temperature sensors can be arranged in the temperature change regions 901-904, respectively. In one embodiment, at least some of the temperature change regions 901-904 can correspond to different target temperatures.

[0031] Specifically, in this embodiment, the temperature change module 920 can be disposed on the rear area of ​​the GPU chip socket on the motherboard. Because the rear area of ​​the GPU chip socket on the motherboard is not a flat surface, a thermally conductive material can be provided between the temperature change module 920 and the rear surface of the motherboard, and the temperature change module 920 can be fixed to the rear area of ​​the GPU chip socket on the motherboard. Two temperature sensors can be provided in each of the temperature change areas 901-904. In this embodiment, the temperature change areas 901-903 can, for example, directly face the graphics card memory area of ​​the GPU chip. During extreme overclocking, cooling the GPU chip via liquid nitrogen can make the temperature of the temperature change areas 901-903 the lowest relative to the other temperature change areas. Therefore, the temperature change areas 901-903 can correspond to specific lower or higher target temperatures. Furthermore, the temperature change area 904 can be designed to correspond to different target temperatures.

[0032] In this embodiment, whether the graphics card memory of the GPU chip operates at the optimal operating temperature has a serious impact on the performance of the GPU chip after overclocking. In addition, there is a difference between the optimal operating temperature of the graphics card memory and the optimal operating temperature of the passive components. Therefore, during extreme overclocking, the target temperature of the temperature change regions 901-903 can be set to, for example, above room temperature, so that the motherboard and electronic components are not affected by freezing due to low temperatures, and the subsequent damage to the motherboard caused by liquid water caused by melting ice can also be prevented.

[0033] FIG. 10 is a schematic diagram of a temperature control module and a temperature adjustment module according to one embodiment of the present invention. Referring to FIG. 10, the temperature control modules provided in each embodiment of the present invention can be arranged as described in this embodiment. In this embodiment, the temperature control modules 1011 and 1012 can be arranged on a motherboard 1000. The temperature control modules 1011 and 1012 can be, for example, microcontroller units (MCUs) or control chips. In one embodiment, the temperature control modules 1011 and 1012 can be implemented via a basic input / output system (BIOS) chip or an application program (App) of an operating system (OS).

[0034] In this embodiment, temperature control module 1011 is electrically connected to temperature change module 1021 (and corresponding temperature sensors) via a dedicated connector and connection lines, and can control temperature change module 1021. Temperature control module 1012 is electrically connected to multiple temperature change modules 1022-1024 (and corresponding multiple temperature sensors) via a dedicated connector and multiple connection lines, and can control temperature change modules 1022-1024. In one embodiment, temperature control modules 1011 and 1012 can also use hardware circuits to control temperature change modules 1021-1024 via various switches or jumpers, and perform temperature adjustments for peripheral circuit elements in multiple specific areas on the motherboard.

[0035] In this embodiment, the temperature change modules 1021-1024 each include a power input interface and are configured to connect to a DC power terminal or interface on the motherboard to obtain a power signal. Alternatively, in one embodiment, the temperature change modules 1021-1024 can each obtain a corresponding power signal from the temperature control modules 1011 and 1012 through a corresponding connection line.

[0036] 11 is a schematic diagram of a temperature control module and a temperature adjustment module according to one embodiment of the present invention. Referring to FIG. 11, the temperature control modules provided in each embodiment of the present invention can be arranged as described in this embodiment. In this embodiment, the temperature control modules 1111 and 1112 can be arranged on the same or different external circuit boards. The temperature control modules 1111 and 1112 can be, for example, microcontrollers or control chips.

[0037] In this embodiment, the temperature control module 1111 is electrically connected to the connection interface 1101 (having a specific or dedicated connector) on the motherboard 1100 via a connecting line, and is also electrically connected to the temperature change module 1121 (and a corresponding temperature sensor) via a connecting line, so as to control the temperature change module 1121. The temperature control module 1112 is electrically connected to the connection interface 1102 (having a specific or dedicated connector) on the motherboard 1100 via a connecting line, and is also electrically connected to multiple temperature change modules 1122-1124 (and corresponding multiple temperature sensors) via multiple connecting lines, so as to control the temperature change modules 1122-1124. In one embodiment, the temperature control modules 1111 and 1112 can also use hardware circuits to control the temperature change modules 1121-1124 via various switches or jumpers, thereby adjusting the temperatures of peripheral circuit elements in multiple specific areas on the motherboard.

[0038] As described above, the temperature adjustment module and temperature adjustment method provided in the present invention can synchronously adjust the temperature of the peripheral circuit elements through the temperature change module in contact with the peripheral circuit elements during the extreme cooling process of operating the main circuit elements in overclocking mode, so that the peripheral circuit elements can operate at an appropriate temperature, thereby allowing both the main circuit elements and the peripheral circuit elements to operate in a highly efficient state.

[0039] Although the present invention has been described with reference to the above embodiments, these embodiments are not intended to limit the present invention. Those skilled in the art can make changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the following claims. [Industrial Applicability]

[0040] The temperature regulation module of the present invention can be applied in the field of extreme overclocking. [Explanation of symbols]

[0041] 100, 200 Temperature Control Module 110, 210, 510, 610, 1011, 1012, 1111, 1112 Temperature Control Module 120, 220, 320~340, 520, 620, 720, 820, 920, 1021~1024, 1121~1124 Temperature change module 230 Temperature Sensor 300, 500, 1000, 1100 motherboards 301 Main circuit element 302~304, 501, 601 Peripheral circuit elements 310 Cooling Module 502, 602 Thermal Conductive Materials 630 Metal Thermostat 701~709, 801~804, 901~904 Temperature change area 1101, 1102 connection interface S1, S2, S4 surface S410~S430 Step D1~D3 direction

Claims

1. a temperature change module including a temperature change area and in contact with peripheral circuit elements on a motherboard via the temperature change area and a thermally conductive material; a temperature control module electrically connected to the temperature change module and configured to control the temperature of the temperature change module to reach a target temperature; a temperature sensor disposed within the temperature change area and electrically connected to the temperature control module; the temperature change module further includes a printed circuit board within the temperature change area, and the temperature of the temperature change module is changed by at least one of a winding or an electronic component on the printed circuit board; When the cooling module on the main circuit element of the motherboard cools the main circuit element, the temperature sensor detects the ambient temperature of the peripheral circuit element; A temperature adjustment module that determines whether the temperature control module determines whether the ambient temperature is lower or higher than the target temperature and determines whether to control the temperature of the temperature change module to reach the target temperature.

2. The temperature adjustment module also 2. The temperature adjustment module of claim 1, further comprising a metal thermostat disposed between the temperature change module and the peripheral circuit element, wherein a first contact area between the metal thermostat and the peripheral circuit element is larger than a second contact area between the metal thermostat and the temperature change module.

3. 2. The temperature adjustment module of claim 1, wherein the cooling module cools the main circuit elements to a first temperature, the first temperature being less than or equal to the target temperature.

4. The temperature change module also The temperature adjustment module of claim 1 , comprising a plurality of temperature change regions configured to contact a plurality of peripheral circuit elements via the thermally conductive material.

5. The temperature regulation module of claim 4 , wherein at least some of the plurality of temperature change regions correspond to different target temperatures.

6. 2. The temperature adjustment module according to claim 1, wherein the peripheral circuit elements and the main circuit elements are arranged on the same side of the same substrate.

7. 2. The temperature adjustment module according to claim 1, wherein the peripheral circuit elements and the main circuit elements are arranged on different sides of the same substrate.

8. The temperature adjustment module of claim 1 , wherein the temperature control module is disposed on the motherboard, and the temperature control module is electrically connected to the temperature change module via a connecting wire.

9. The temperature adjustment module of claim 8 , wherein the temperature control module is electrically connected to a plurality of temperature change modules via a plurality of connecting wires.

10. The temperature adjustment module of claim 1 , wherein the temperature control module is disposed on an external substrate, and the temperature control module is electrically connected to the temperature change module via connecting wires.

11. The temperature adjustment module of claim 10 , wherein the temperature control module is electrically connected to a plurality of temperature change modules via a plurality of connecting wires.

12. The temperature adjustment module of claim 1 , wherein the temperature control module and the temperature change module are disposed on the same substrate, and the temperature control module is electrically connected to the temperature change module via connecting wires.

13. The temperature adjustment module according to claim 1 , wherein the main circuit element performs an overclocking operation.

14. The thermal regulation module of claim 1 , wherein the main circuit elements include at least one of a central processing unit chip, a graphics processing unit chip, and a memory module.

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