Antenna structure with insulating metal placed between transmitting and receiving antennas and electronic device using same

Abstract

To provide an antenna structure in which signal interference between antennas is reduced, and a compact electronic device using the same.SOLUTION: An antenna structure is disposed on a dielectric substrate 20 having a first surface 210 and a second surface 220 opposite to the first surface 210. A grounded metal sub-structure is disposed on the first surface 210. An electromagnetic wave transmitting sub-structure 230, an electromagnetic wave receiving sub-structure 240, and an insulation metal sub-structure 250 are disposed on the second surface 220. The electromagnetic wave transmitting sub-structure 230 and the electromagnetic wave receiving sub-structure 240 extend along a first direction. The insulation metal sub-structure 250 is disposed between the electromagnetic wave transmitting sub-structure 230 and the electromagnetic wave receiving sub-structure 240, has a cross-shaped metal block and a plurality of linear metal blocks spaced apart from each other and extends along the first direction.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an antenna structure and an electronic device using the same, and more particularly to an antenna structure having an insulating metal disposed between a transmitting antenna and a receiving antenna, and an electronic device using the same. [Background technology]

[0002] It is very common for people skilled in the art to place multiple antennas on the same printed circuit board (PCB). This kind of antenna design can reduce the size of electronic devices equipped with antennas. However, since the space on the PCB is very limited, sufficient insulation cannot be formed between the antennas, which results in problems such as severe signal interference between antennas, poor communication quality, shortened transmission distance and reduced transmission speed. Summary of the Invention [Problem to be solved by the invention]

[0003] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an antenna structure with better isolation between antennas to reduce signal interference between the antennas.

[0004] Another object of the present invention is to provide a compact electronic device using the antenna structure. [Means for solving the problem]

[0005] In one aspect, the present invention provides an antenna structure disposed on a dielectric substrate having a first surface and a second surface opposite to the first surface, the antenna structure comprising: a grounded metal substructure disposed on the first surface; an electromagnetic wave transmitting substructure disposed on the second surface and extending along a first direction, the electromagnetic wave transmitting substructure having a signal input portion, and radiating an input signal from the signal input portion to an external environment as a radiated electromagnetic wave; an electromagnetic wave receiving substructure disposed on the second surface and extending along the first direction, the electromagnetic wave receiving substructure having a signal output portion, and converting a received input electromagnetic wave into an output signal and outputting it from the signal output portion; and an insulated metal substructure disposed on the second surface between the electromagnetic wave transmitting substructure and the electromagnetic wave receiving substructure, the insulated metal substructure extending along the first direction, the insulated metal substructure having a cross-shaped metal block and a plurality of linear metal blocks spaced apart from each other, the cross-shaped metal block being disposed between the signal input portion and the signal output portion, each of the cross-shaped metal block and the linear metal blocks including a plurality of metal holes, each of the metal holes being connected to the grounded metal substructure.

[0006] In one embodiment, the antenna structure further comprises an outer insulating metal configured in a U-shape to partially surround the electromagnetic wave transmitting substructure and the electromagnetic wave receiving substructure. In a further embodiment, the electromagnetic wave receiving substructure includes a plurality of electromagnetic wave receiving antennas, and the antenna structure further comprises a plurality of branched insulating metals, each of which is disposed between two adjacent electromagnetic wave receiving antennas.

[0008] In another aspect, the present invention provides an electronic device characterized in that it uses any one of the antenna structures described in the technical solution provided herein. [Effects of the Invention]

[0009] By using the above technical solutions, the cross-shaped metal block disposed between the signal input section and the signal output section can increase the current flow length existing between the signal input section and the signal output section, and further, the electromagnetic bandgap (EBG)-like structure formed by the cross-shaped metal block and the plurality of linear metal blocks can increase the magnetic isolation between the electromagnetic wave transmitting sub-structure and the electromagnetic wave receiving sub-structure, so that the isolation between the electromagnetic wave transmitting sub-structure and the electromagnetic wave receiving sub-structure can be enhanced by using the antenna structure provided by the above technical solutions, and at the same time, the size of the electronic device using these antenna structures can be reduced. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a circuit block diagram of an electronic device according to an embodiment of the present invention.

[0011] [Figure 2] 1 is a schematic diagram of an antenna structure according to an embodiment of the present invention;

[0012] [Figure 3A] 1 is a schematic diagram of an antenna structure according to an embodiment of the present invention disposed on one side of a dielectric substrate;

[0013] [Figure 3B] 3 is a schematic diagram of an antenna structure according to an embodiment of the present invention disposed on another side of a dielectric substrate.

[0014] [Figure 4] FIG. 2 is an equivalent circuit diagram of an insulated metal sub-structure according to an embodiment of the present invention.

[0015] [Figure 5] 2 is a schematic diagram of an antenna structure disposed on a surface 220 according to an embodiment of the present invention.

[0016] [Figure 6] 2 is a schematic diagram of an antenna structure disposed on a surface 220 according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0017] The present invention will be more particularly described with reference to the following embodiments. It should be noted that the following description of preferred embodiments of the present invention is presented herein for purposes of illustration and description only. It is not intended to be exhaustive or limited to the precise form disclosed.

[0018] Furthermore, as will be readily understood by those skilled in the art, it should be noted that when a first unit is electrically connected to a second unit, it means that electronic signals can be transmitted between the first unit and the second unit, and unless other restrictions are imposed, the transmission of electronic signals can be unidirectional or bidirectional, and the method of transmitting electronic signals can be wired or wireless.

[0019] Please refer to FIG. 1, which is a circuit block diagram of an electronic device according to an embodiment of the present invention. In this embodiment, the electronic device 10 includes a controller 100, an antenna structure 110, and a power supply 120. The power supply 120 supplies power to the controller 100 and the antenna structure 110 so that they can operate normally. The controller 100 is electrically connected to the antenna structure 110 for receiving and transmitting electronic data with other devices. To ensure a fast and accurate electronic data receiving and transmitting process, it is necessary to ensure sufficient insulation between the portion of the antenna structure 110 used for receiving electronic data and the portion of the antenna structure 110 used for transmitting electronic data, to prevent the antenna structure 110 from signal interference problems.

[0020] Please refer to FIG. 2, which is a schematic diagram of an antenna structure according to one embodiment of the present invention. In this embodiment, the antenna structure includes a plurality of metal structures disposed on a dielectric substrate 20. As shown in FIG. 2, the dielectric substrate 20 has a surface 210 and a surface 220 opposite to the surface 210. A grounded metal substructure is disposed on the surface 210 so that the antenna structure is grounded via the grounded metal substructure. An electromagnetic wave transmitting substructure 230, an electromagnetic wave receiving substructure 240, and an insulating metal substructure 250 disposed between the electromagnetic wave transmitting substructure 230 and the electromagnetic wave receiving substructure 240 are disposed on the surface 220. The grounded metal substructure disposed on the surface 210 can be designed by any method known to those skilled in the art. For example, the entire metal layer can be used as the grounded metal substructure 30, as shown in FIG. 3A. Using the entire metal layer facilitates the fabrication of the grounded metal substructure, thereby reducing the time and cost required to fabricate the antenna structure. Furthermore, a conductor 31 is also arranged to electrically connect the grounded metal substructure 30 to the power source 120 shown in Figure 1, and the grounded metal substructure 30 can be grounded via a conductive path starting from the conductor 31 and leading to the power source 120.

[0021] Please refer to Figures 1, 2, and 3B. Here, Figure 3B is a schematic diagram of an antenna structure disposed on the surface 220 of the dielectric substrate 20 according to one embodiment of the present invention. As described above, an electromagnetic wave transmitting substructure 230, an electromagnetic wave receiving substructure 240, and an insulated metal substructure 250 are disposed on the surface 220. In this embodiment, the electromagnetic wave transmitting substructure 230 includes two electromagnetic wave transmitting antennas 300 and 310 elongated along the Y-axis direction and aligned in the X-axis direction, with each of the electromagnetic wave transmitting antennas 300 and 310 also elongated along the Y-axis direction. Similarly, the electromagnetic wave receiving substructure 240 includes three electromagnetic wave receiving antennas 320, 330, and 340 elongated along the Y-axis direction and aligned in the X-axis direction, with each of the electromagnetic wave receiving antennas 320, 330, and 340 also elongated along the Y-axis direction. It should be noted that the electromagnetic wave transmitting substructure 230 and the electromagnetic wave receiving substructure 240 can be any structure capable of performing their function and are not limited to the types and numbers of antennas provided in this embodiment.

[0022] 3B, the electromagnetic wave transmitting antenna 300 is electrically connected to the controller 100 shown in FIG. 1 through a signal input terminal 302, and the input signal IN transmitted from the controller 100 is received through the input terminal 302 and radiated to the outside as a radiated electromagnetic wave from the electromagnetic wave transmitting antenna 300. Similarly, the electromagnetic wave transmitting antenna 310 is electrically connected to the controller 100 through a signal input terminal 312, and the input signal IN transmitted from the controller 100 is received through the input terminal 312 and radiated to the outside as a radiated electromagnetic wave from the electromagnetic wave transmitting antenna 310. In another embodiment, the electromagnetic wave receiving antennas 320, 330, and 340 are electrically connected to the controller 100 through signal output terminals 322, 332, and 342, respectively, and the input electromagnetic waves received by the electromagnetic wave receiving antennas 320, 330, and 340 are first converted into output signals OUT and then transmitted to the controller 100 through the signal output terminals 322, 332, and 342, respectively.

[0023] In the following description, the signal input terminals included in the electromagnetic wave transmitting antenna, such as the signal input terminals 302 and 312, are collectively referred to as the signal input section 30A of the electromagnetic wave transmitting sub-structure having the electromagnetic wave transmitting antenna. Similarly, the signal output terminals included in the electromagnetic wave receiving antenna, such as the signal output terminals 322, 332 and 342, are collectively referred to as the signal output section 30B of the electromagnetic wave receiving sub-structure having the electromagnetic wave receiving antenna.

[0024] Referring again to FIG. 3B , in this embodiment, the insulated metal sub-structure 250 includes a cross-shaped metal block 350 and a plurality of spaced-apart linear metal blocks 360, 370, 380, and 390. The cross-shaped metal block 350 and the linear metal blocks 360, 370, 380, and 390 are arranged in the Y-axis direction. The major axis of each linear metal block 360, 370, 380, and 390 extends along the Y-axis direction. The cross-shaped metal block 350 is disposed between the signal input section 30A and the signal output section 30B and includes a first metal portion 352 and a second metal portion 354. The first metal portion 352 extends along the X-axis, and the second metal portion 354 extends along the Y-axis. The first metal portion 352 intersects with the second metal portion 354. Furthermore, a plurality of metal holes MH are formed in the cross-shaped metal block 350 and each of the linear metal blocks 360, 370, 380, and 390, respectively, with one end of the metal hole MH formed in the ground metal substructure 30 disposed on the surface 210 and the other end formed in one of the cross-shaped metal block 350 and the linear metal blocks 360, 370, 380, and 390, and each of the metal holes MH penetrates the dielectric substrate 20. A metal layer is formed inside each metal hole MH so that the ground metal substructure 30 can be electrically connected to the insulating metal substructure 250 through the metal hole MH. The metal layer of the metal hole MH can be formed by coating or other appropriate methods known to those skilled in the art. The current flow length and direction in the dielectric substrate 20 can be easily changed by applying the above-mentioned antenna structure and considering the frequency of the transmitted electromagnetic wave when designing the distance between adjacent metal blocks. 5, the current flow path between the signal input terminal 312 and the signal output terminal 322 is changed from the path indicated by arrow 50A to the paths indicated by arrows 50B, 50C, 50D, and 50E. That is, the current flow path is changed from a straight line between the signal input terminal and the signal output terminal to a curved line that bypasses the insulated metal substructure 250. Therefore, the electric and magnetic fields generated by the current flow are also changed, and the influence of these electric and magnetic fields on the electromagnetic wave transmitting substructure 230 and the electromagnetic wave receiving substructure 240 can be reduced. An equivalent circuit diagram of the above-mentioned insulated metal substructure is simply shown in FIG. 4.

[0025] Please refer to Figure 4, which is an equivalent circuit diagram of the insulated metal sub-structure 250 shown in Figure 3B. As shown in this figure, the equivalent circuit 400 includes multiple inductors L connected in parallel, each inductor L being one of the metal holes MH connected between the cross-shaped metal block 350 and the grounded metal sub-structure 30. Similarly, equivalent circuit 410 includes multiple inductors L connected in parallel, each inductor L being one of the metal holes MH connected between straight metal block 360 and grounded metal substructure 30; equivalent circuit 420 includes multiple inductors L connected in parallel, each inductor L being one of the metal holes MH connected between straight metal block 370 and grounded metal substructure 30; equivalent circuit 430 includes multiple inductors L connected in parallel, each inductor L being one of the metal holes MH connected between straight metal block 380 and grounded metal substructure 30; and equivalent circuit 440 includes multiple inductors L connected in parallel, each inductor L being one of the metal holes MH connected between straight metal block 390 and grounded metal substructure 30.

[0026] It should be noted that the capacitance formed between the cross-shaped metal block 350 and the straight metal block 360 is not included in the equivalent circuit diagram. This means that the distance between the cross-shaped metal block 350 and the nearest straight metal block 360 is large enough that the capacitance formed between the cross-shaped metal block 350 and the straight metal block 360 is small enough that it is not taken into account when evaluating the insulating effect provided by the isolated metal sub-structure 250. Furthermore, since the capacitance formed between the cross-shaped metal block 350 and the nearest straight metal block is negligible, the capacitance formed between the cross-shaped metal block 350 and the straight metal blocks 370, 380, and 390 can also be negligible. Similarly, the capacitance formed between any two of the linear metal blocks 360, 370, 380, 390 is not included in the equivalent circuit diagram, which means that the distance between any two of the linear metal blocks 360, 370, 380, 390 is large enough that the capacitance formed between them is small enough that the capacitance does not need to be taken into account when evaluating the insulating effect provided by the insulated metal sub-structure 250.

[0027] Although the capacitance formed between the metal blocks is not taken into account when evaluating the insulating effect provided by the insulated metal substructure 250, the insulated metal substructure can be designed to increase the current flow length and adjust the current flow direction. Furthermore, the electromagnetic bandgap (EBG)-like structure formed by the cross-shaped metal block and multiple linear metal blocks increases the magnetic insulating ability. Therefore, the insulated metal substructure 250 can provide good insulating effect by preventing one of the electromagnetic wave receiving substructure and the electromagnetic wave transmitting substructure from affecting the other. Furthermore, since the capacitance formed between any two adjacent metal blocks does not need to be taken into account when constructing the insulated metal substructure provided by the present invention, the two adjacent metal blocks can be spaced apart at a greater distance than in the past, and the distance between the two adjacent metal blocks does not need to be maintained at a constant value. Therefore, the EBG-like structure provided by the present invention requires less manufacturing precision than an EBG structure that uses an inductor-capacitor circuit (LC circuit) to provide an insulating effect.

[0028] It should be noted that the antenna structure provided in the above embodiment can be combined with current antenna isolation technology. See FIG. 5, which is a schematic diagram of an antenna structure according to a second embodiment of the present invention arranged on a surface 220. In this embodiment, in addition to the insulating metal substructure 250 used to establish insulation between the electromagnetic wave transmitting substructure 230 and the electromagnetic wave receiving substructure 240 shown in FIG. 3B, an outer insulating metal 500 and multiple branch insulating metals 510, 520 are applied to strengthen the insulation of the entire antenna structure and further reduce interference. Here, multiple metal holes are arranged to connect the outer insulating metal 500 and the branch insulating metals 510, 520 to the ground metal substructures, respectively, in the same manner as the above-mentioned metal hole MH. Furthermore, the outer insulating metal 500 is configured in a U-shape that partially surrounds the electromagnetic wave transmitting substructure and the electromagnetic wave receiving substructure, so that interference from the outside environment of the antenna structure can be reduced. The electromagnetic wave transmitting substructure includes the electromagnetic wave transmitting antennas 300, 310, and the electromagnetic wave receiving substructure includes the electromagnetic wave receiving antennas 320, 330, 340. Furthermore, the branched insulating metal 510 is disposed between adjacent electromagnetic wave receiving antennas 320 and 330, and the branched insulating metal 520 is disposed between adjacent electromagnetic wave receiving antennas 330 and 340. This allows one branched insulating metal to be disposed between two adjacent electromagnetic wave receiving antennas, thereby reducing interference from other electromagnetic wave receiving antennas.

[0029] In the previous embodiments, the cross-shaped metal block was positioned at the lowest position along the Y-axis direction in the insulating metal sub-structure, but as shown in the embodiment of Figure 6, at least one linear metal block may be positioned at a lower position than the cross-shaped metal block along the Y-axis direction.

[0030] In summary, by using the above-mentioned technical solution, the cross-shaped metal block disposed between the signal input section and the signal output section can increase the current flow length existing between the signal input section and the signal output section. Furthermore, the EBG-like structure formed by the cross-shaped metal block and the multiple linear metal blocks can increase the magnetic isolation between the electromagnetic wave transmitting substructure and the electromagnetic wave receiving substructure. Therefore, the isolation between the electromagnetic wave transmitting substructure and the electromagnetic wave receiving substructure can be enhanced using the antenna structure provided by the above-mentioned technical solution, while the size of the electronic device using these antenna structures can be reduced. Furthermore, compared with EBG structures that use an inductor-capacitor circuit (LC circuit) to provide the isolation effect, the EBG-like structure provided by the embodiment of the present invention requires lower manufacturing precision. Therefore, the antenna structure provided by the present invention is less difficult to manufacture, which increases the incentive to promote and develop the above-mentioned technical solution.

Claims

1. 1. An antenna structure disposed on a dielectric substrate having a first surface and a second surface opposite the first surface, a ground metal substructure disposed on the first surface; an electromagnetic wave transmitting substructure disposed on the second surface and extending along a first direction, the electromagnetic wave transmitting substructure having a signal input portion, wherein an input signal from the signal input portion is radiated to an external environment as a radiated electromagnetic wave; an electromagnetic wave receiving substructure disposed on the second surface, extending along the first direction, and having a signal output portion, wherein a received input electromagnetic wave is converted into an output signal and output from the signal output portion; an insulated metal substructure disposed on the second surface between the electromagnetic wave transmitting substructure and the electromagnetic wave receiving substructure, extending along the first direction, and including a cross-shaped metal block and a plurality of linear metal blocks spaced apart from one another; The cross-shaped metal block is disposed between the signal input section and the signal output section, and each of the cross-shaped metal block and the straight metal block includes a plurality of metal holes, each of which is connected to the ground metal sub-structure.

2. 10. The antenna structure of claim 1, further comprising an outer insulating metal configured in a U-shape to partially surround the electromagnetic wave transmitting substructure and the electromagnetic wave receiving substructure.

3. 3. The antenna structure of claim 2, wherein the electromagnetic wave receiving substructure comprises a plurality of electromagnetic wave receiving antennas.

4. 4. The antenna structure according to claim 3, further comprising a plurality of branched insulating metals, each of which is disposed between two adjacent electromagnetic wave receiving antennas.

5. An electronic device comprising an antenna structure disposed on a dielectric substrate having a first surface and a second surface opposite the first surface, the antenna structure comprising: a ground metal substructure disposed on the first surface; an electromagnetic wave transmitting substructure disposed on the second surface and extending along a first direction, the electromagnetic wave transmitting substructure having a signal input portion, wherein an input signal from the signal input portion is radiated to an external environment as a radiated electromagnetic wave; an electromagnetic wave receiving substructure disposed on the second surface, extending along the first direction, and having a signal output portion, wherein a received input electromagnetic wave is converted into an output signal and output from the signal output portion; an insulated metal substructure disposed on the second surface between the electromagnetic wave transmitting substructure and the electromagnetic wave receiving substructure, extending along the first direction, and including a cross-shaped metal block and a plurality of linear metal blocks spaced apart from one another; the cross-shaped metal block is disposed between the signal input section and the signal output section, and each of the cross-shaped metal block and the straight metal block includes a plurality of metal holes, each of which is connected to the ground metal sub-structure.

6. The electronic device described in Claim 5, further comprising an outer insulating metal configured in a U-shape to partially surround the electromagnetic wave transmitting substructure and the electromagnetic wave receiving substructure.

7. The electronic device described in Claim 6, characterized in that the electromagnetic wave receiving substructure includes multiple electromagnetic wave receiving antennas.

8. An electronic device as described in Claim 7, further comprising a plurality of branched insulating metals, each of which is arranged between two adjacent electromagnetic wave receiving antennas.

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