electronic machinery

Abstract

An electronic device capable of efficiently cooling an electronic module is provided. [Solution] The electronic device comprises a housing having a vertical wall with an air vent formed therein, a board provided within the housing and having a connector mounted thereon, a card-type electronic module connected to the connector, and a sheet metal part that holds the electronic module, the sheet metal part having a support part supported by the board or the housing, a holding part that is thermally connected to the electronic module and holds the electronic module, and a heat dissipation part that extends from the holding part and has a plurality of fins arranged facing the air vent.

Description

[Technical Field]

[0001] The present invention relates to an electronic device. [Background technology]

[0002] BACKGROUND ART In electronic devices such as tablet PCs and notebook PCs, a connector is mounted on a board on which a CPU and the like are mounted, and an electronic module such as an SSD is connected to the connector (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2020-057737 Summary of the Invention [Problem to be solved by the invention]

[0004] As electronic modules like those mentioned above increase in capacity and speed, the amount of heat they generate also increases, creating a need for efficient cooling. However, there is a strong demand for thinner electronic device housings. For this reason, it can be difficult to use thermal modules, which are used to cool CPUs and other components, to cool these electronic modules.

[0005] The present invention has been made in consideration of the above-mentioned problems of the conventional technology, and has an object to provide an electronic device capable of efficiently cooling an electronic module. [Means for solving the problem]

[0006] An electronic device according to one aspect of the present invention comprises a housing having a vertical wall with an air vent formed therein, a substrate provided within the housing and having a connector mounted thereon, a card-type electronic module connected to the connector, and a sheet metal part that holds the electronic module, the sheet metal part having a support portion supported by the substrate or the housing, a pressing portion that is thermally connected to the electronic module and presses the electronic module, and a heat dissipation portion that extends from the pressing portion and has a plurality of fins arranged facing the air vent. [Effects of the Invention]

[0007] According to the above aspects of the present invention, the electronic module can be cooled efficiently. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic plan view of an electronic device according to an embodiment. [Figure 2] FIG. 2 is a plan view schematically showing the internal structure of the electronic device shown in FIG. [Figure 3A] FIG. 3A is a schematic exploded perspective view of an electronic module and a sheet metal part. [Figure 3B] FIG. 3B is a perspective view of the electronic module shown in FIG. 3A in a state where it is held down by a sheet metal part. [Figure 4] FIG. 4 is a schematic perspective cross-sectional view of the housing including the electronic module and its surrounding area. [Figure 5] FIG. 5 is a schematic cross-sectional side view of an electronic device including an electronic module and its surroundings. DETAILED DESCRIPTION OF THE INVENTION

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of an electronic device according to the present invention will be described in detail with reference to the accompanying drawings.

[0010] Fig. 1 is a schematic plan view of an electronic device 10 according to an embodiment. Fig. 2 is a schematic plan view showing the internal structure of the electronic device 10 shown in Fig. 1. In this embodiment, a tablet PC (tablet terminal) is exemplified as the electronic device 10. The electronic device 10 may be other than a tablet PC, and may be, for example, a desktop PC, a notebook PC, a smartphone, a mobile phone, an electronic organizer, or the like.

[0011] As shown in FIGS. 1 and 2, electronic device 10 includes a housing 12 and a display 14. Housing 12 has, for example, a rectangular parallelepiped shape. Hereinafter, the housing 12 and each component mounted thereon will be described by referring to the longitudinal direction of housing 12 shown in FIG. 1 as the X direction, the lateral direction as the Y direction, and the thickness direction as the Z direction. The X direction may be referred to as the X1 and X2 directions, separately for the left and right sides, and similarly, the Y and Z directions may be referred to as the Y1, Y2, Z1, and Z2 directions. These directions are defined for the sake of convenience and may naturally change depending on the usage state or installation posture of electronic device 10, etc.

[0012] The housing 12 is a flat box. Various electronic and mechanical components are housed in the internal space of the housing 12. The housing 12 has a housing member 16 that covers the electronic device 10 from the back surface to the outer peripheral side surfaces. The housing member 16 may be composed of a cover plate 16A and a standing wall 16B. The cover plate 16A is a plate-like member that forms the back surface of the electronic device 10. The standing wall 16B is a side wall member that stands in the Z1 direction from the outer peripheral edge of the cover plate 16A. The standing wall 16B may be molded integrally with the cover plate 16A. The standing wall 16B may be formed separately from the cover plate 16A, and the two may be configured to be detachable. The housing member 16 may be composed of, for example, a thin plate made of resin or metal.

[0013] The front surface (Z1 side surface) of the housing member 16 is open. The display 14 is supported by the upper end (Z1 side end) of the standing wall 16B and closes the front opening of the housing member 16. The display 14 can be configured, for example, as a touch-operable organic EL display panel or a liquid crystal display panel. The periphery of the display 14 may be surrounded by a bezel member 18. The housing member 16 may be configured, for example, to have a frame member directly below the display 14 for supporting a substrate 20, etc., which will be described later, and to have a cover plate 16A that can be attached and detached to this frame member.

[0014] 2, the housing 12 houses, for example, a circuit board 20, a thermal module 22, an electronic module 24, a sheet metal part 25, and a battery device 26. The battery device 26 is a rechargeable battery that serves as a power source for the electronic device 10. The housing 12 may also house various electronic components such as a memory, an antenna, a speaker, etc.

[0015] The substrate 20 is a printed circuit board that serves as the motherboard of the electronic device 10. The substrate 20 is disposed, for example, near the center of the housing 12 and fixed to the inner surface of the cover plate 16A. A CPU (Central Processing Unit) 28 and a connector 30 are mounted on the substrate 20. The CPU 28 is an arithmetic processing device that performs calculations related to the main control and processing of the electronic device 10. The connector 30 complies with a predetermined connection standard, for example, the M.2 (M.2) standard. An electronic module 24 is connected to the connector 30. Various electronic components, such as an arithmetic processing device such as a GPU (Graphics Processing Unit), memory, and a communication module, are also mounted on the substrate 20. For example, the Z1-side surface of the substrate 20 serves as the mounting surface 20a for the CPU 28 and connector 30. It goes without saying that the shape, arrangement, and mounted components of the substrate 20 are not limited to those described above.

[0016] The thermal module 22 can absorb heat generated by the CPU 28 and dissipate the heat to the outside of the housing 12. The thermal module 22 may include a metal plate 32, a heat pipe 33, a heat sink 34, and a fan 35.

[0017] The metal plate 32 is a thin plate-like member made of a metal with high thermal conductivity, such as copper or aluminum. In this embodiment, the metal plate 32 is a copper plate. The metal plate 32 may be configured as a plate-like member (vapor chamber) in which a working fluid is sealed in an airtight space formed between two metal plates. The metal plate 32 is installed so as to cover part of the mounting surface 20a of the board 20 from the Z1 side together with the CPU 28. This allows the metal plate 32 to absorb and dissipate heat generated by the CPU 28 and its surrounding components.

[0018] The heat pipe 33 is a pipe-shaped heat transfer member. The heat pipe 33 is configured, for example, by crushing a copper pipe into a thin, flattened shape with an elliptical cross section and sealing a working fluid in the sealed space inside. For example, one end of the heat pipe 33 is thermally connected to the CPU 28 via the metal plate 32, and the other end is thermally connected to the heat sink 34. This allows the heat pipe 33 to transfer heat from the CPU 28 to the heat sink 34 with high efficiency.

[0019] The heat sink 34 has a structure in which thin metal fins made of, for example, copper or aluminum are arranged at equal intervals in the Y direction. Each fin stands up in the Z direction and extends in the X direction. A gap is formed between adjacent fins, allowing air discharged from the fan 35 to pass through.

[0020] The fan 35 has a fan housing 35a, an inlet 35b, and an outlet 35c. The inlet 35b is an opening formed on one or both surfaces of the fan housing 35a in the thickness direction (Z direction). The outlet 35c is an opening formed on a side surface of the fan housing 35a. The heat sink 34 faces the outlet 35c in close proximity. The fan 35 can be configured as a centrifugal fan that rotates an impeller housed inside the fan housing 35a using a motor. The fan 35 can draw air in through the inlet 35b and discharge it from the outlet 35c.

[0021] Ventilation openings 38, 39 may be formed on the side surfaces of the housing 12. The ventilation openings 38, 39 are formed, for example, in the left and right standing walls 16B extending in the Y direction, respectively. The ventilation openings 38, 39 can be formed, for example, by a plurality of small window-like openings lined up along the longitudinal direction of the standing wall 16B (see also FIG. 4). The ventilation opening 38 on the X1 side faces the outlet 35c of the fan 35 across the heat sink 34. This allows the ventilation opening 38 to function as an exhaust port that discharges air discharged from the fan 35 to the outside of the housing 12. The ventilation opening 39 on the X2 side functions as an intake port that introduces air from outside the housing 12 into the housing 12. The outside air introduced through the ventilation opening 39 is introduced into the fan housing 35a through the intake port 35b. The arrows indicated by dashed dotted lines in FIG. 2 schematically show the air flow.

[0022] In this thermal module 22, heat from the CPU 28 is diffused by the metal plate 32 and transported to the heat sink 34 by the heat pipe 33. The fan 35 draws outside air into the intake port 35b through the ventilation hole 39 and expels it from the exhaust port 35c. This air cools the heat sink 34 as it passes through it, and is then expelled to the outside of the housing 12 through the ventilation hole 38.

[0023] Next, the configuration of the electronic module 24, the sheet metal part 25, and the surrounding area will be described.

[0024] Fig. 3A is a schematic exploded perspective view of the electronic module 24 and the sheet metal part 25. Fig. 3B is a perspective view of the electronic module 24 shown in Fig. 3A being held down by the sheet metal part 25. Fig. 4 is a schematic perspective cross-sectional view of the housing 12 including the electronic module 24 and its surrounding area. Fig. 5 is a schematic side cross-sectional view of the electronic device 10 including the electronic module 24 and its surrounding area.

[0025] The electronic module 24 is a card-type module component that can be connected to a connector 30 that complies with the M.2 standard, for example. The electronic module 24 is, for example, a storage device. The electronic module 24 of this embodiment is an SSD (Solid State Drive). The connection standard of the connector 30 may be another standard. The electronic module 24 may also be, for example, a communication module that supports a WWAN (Wireless Wide Area Network). As shown in FIGS. 2 and 4, the electronic module 24 is disposed, for example, near the standing wall 16B on the X2 side in the X direction, with its longitudinal direction aligned with the Y direction. Of course, the electronic module 24 may be disposed or oriented in a different manner.

[0026] 3A to 4, the electronic module 24 has a module substrate 24a and a semiconductor chip 24b mounted on the module substrate 24a. The module substrate 24a is a printed circuit board. The module substrate 24a has a connection terminal for the connector 30 at one end (the Y2 end). In the electronic module 24 which is an SSD, the semiconductor chip 24b can be exemplified by a controller, a NAND flash memory, a DRAM (Dynamic Random Access Memory), etc.

[0027] 2 to 5, the sheet metal part 25 is a part for pressing and holding the electronic module 24 against the substrate 20 and the housing member 16. The sheet metal part 25 is also a part for cooling the electronic module 24.

[0028] The sheet metal part 25 is preferably made of a metal with high thermal conductivity, such as copper or aluminum. In this embodiment, the sheet metal part 25 is made of copper. The sheet metal part 25 can be formed integrally by, for example, performing bending or the like on a punched part made of a thin copper plate. The fins 46b, which will be described later, may be formed by joining the punched part by soldering or the like. Of course, other methods for forming the sheet metal part 25 may also be used.

[0029] The thickness of the sheet metal part 25 is extremely thin, for example, about 0.1 mm to 0.4 mm. In the sheet metal part 25 of this embodiment, the thickness of the support part 40, the pressing part 42, the elastic support part 44, the extension part 46a, and the fins 46b, which will be described later, is all 0.2 mm. The thickness of the metal plate 32 that constitutes the thermal module 22 is, for example, about 0.8 mm to 1.2 mm. In other words, the thickness of the sheet metal part 25 is significantly thinner than the thickness of the metal plate 32.

[0030] The sheet metal part 25 may have a pair of support portions 40, 40, a pressing portion , a pair of elastic support portions 44, 44, and a heat dissipation portion .

[0031] The support portion 40 is a portion for fixing the sheet metal part 25 to the housing 12 (housing member 16). The support portion 40 is formed, for example, by a tongue-shaped plate piece that protrudes from the center of a semicircular ring-shaped elastic support portion 44 toward the pressing portion 42. The pair of support portions 40, 40 are arranged to straddle the electronic module 24 between them in the longitudinal direction (Y direction) and face each other. One of the pair of support portions 40 may be fixed to the substrate 20, and the other may be fixed to the inner surface of the cover plate 16A. One or three or more support portions 40 may be provided.

[0032] The support portion 40 may be fastened to the housing member 16 or the substrate 20 fixed to the housing member 16 with a screw 40a (see FIG. 2). A hole 40b for inserting the screw 40a is formed in the support portion 40. The screw 40a is not shown in FIGS. 3A to 4. A stud portion (boss portion) for fastening the screw 40a may be provided on the inner surface of the cover plate 16A or the mounting surface 20a of the substrate 20. The stud portion is a cylindrical member provided with a threaded hole into which the screw 40a can be fastened. For example, one of the pair of support portions 40, 40 may be configured with a claw portion that can be engaged with and disengaged from a hook formed on the substrate 20 or the cover plate 16A.

[0033] The holding portion 42 is a plate portion that holds down the electronic module 24 from above (Z1 side). The holding portion 42 is thermally connected to the electronic module 24 and also functions as a heat absorption portion that absorbs heat generated by the electronic module 24. The holding portion 42 has an outer shape that is the same as or slightly smaller than the electronic module 24 in a plan view. The holding portion 42 may also have an outer shape that is larger than the electronic module 24. As shown in FIGS. 2 to 4, the holding portion 42 is preferably disposed between a pair of support portions 40, 40. This allows the sheet metal part 25 to hold the electronic module 24 more stably.

[0034] It is preferable to sandwich a thermally conductive member 48 between the retainer 42 and the surface of the electronic module 24 (see FIGS. 4 and 5). The thermally conductive member 48 can be formed, for example, from a material called TIM (Thermal Interface Material). The thermally conductive member 48 is a sheet- or pad-shaped member made of a resin such as silicone or epoxy filled with a thermally conductive filler, and has high thermal conductivity.

[0035] The elastic support portions 44 are provided between the respective support portions 40 and the pressing portions 42, and elastically support the pressing portions 42 in the Z direction relative to the support portions 40. The elastic support portions 44 have, for example, a narrow semicircular ring shape. The elastic support portions 44 support the pressing portions 42 so that they can be elastically displaced in the Z direction relative to the support portions 40 fixed to the substrate 20 (housing member 16). This allows the pressing portions 42 to easily adapt to differences in thickness due to the type and individual differences of the electronic module 24 and the heat conduction member 48. Furthermore, the pressing portions 42 are pressed against the electronic module 24 by the elastic support portions 44. This improves the sheet metal part 25's retention stability of the electronic module 24 and its heat absorption efficiency from the electronic module 24.

[0036] The heat dissipation section 46 is a section for efficiently dissipating heat from the electronic module 24 that is absorbed by the pressing section 42. The heat dissipation section 46 may have an extension section 46a and a plurality of fins 46b.

[0037] The heat dissipation section 46 of this embodiment can dissipate heat from the electronic module 24 to the ventilation opening 39 located close to the electronic module 24 while diffusing the heat. The extension section 46a is an extension plate for positioning the fins 46b in a position facing the ventilation opening 39. The extension section 46A protrudes in approximately the X2 direction from the X2-side edge of the pressing section 42 facing the ventilation opening 39. More specifically, in the plan view shown in FIG. 2, the extension section 46a extends from the pressing section 42 toward the ventilation opening 39 on the X2 side while inclining toward the Y1 side. It goes without saying that the shape of the extension section 46a is not limited to the shape shown in FIG. 2 etc., and may, for example, extend linearly.

[0038] A bent piece 46c may be provided on one or both edges of the extension 46a in the width direction. The bent piece 46c is a plate piece formed by bending the edge of the extension 46a toward the Z2 side. The plate thickness of the extension 46a is extremely thin, for example, 0.2 mm. The bent piece 46c increases the rigidity of the extension 46a. Depending on the length and shape of the extension 46a, the bent piece 46c may be omitted.

[0039] The pressing portion 42 may also be provided with a bent piece 42a similar to the bent piece 46c (see FIGS. 4 and 5). The bent piece 42a is a plate piece formed by bending the edge of the pressing portion 42 on the opposite side to the extension portion 46a in the width direction (X direction) of the pressing portion 42 toward the X2 side. The bent piece 42a increases the rigidity of the pressing portion 42.

[0040] Each fin 46b is, for example, a thin copper fin arranged at equal intervals in the Y direction. Each fin 46b may be formed from a copper plate having the same thickness as other portions of the sheet metal part 25, such as the retaining portion 42 or the extension portion 46a. Each fin 46b stands upright in the Z2 direction from the Z2-side surface of the extension portion 46a, for example, and extends in the X direction. Gaps are formed between adjacent fins 46b, 46b. This increases the surface area of ​​the heat dissipation portion 46, promoting heat dissipation from the fins 46b and allowing outside air that has passed through the ventilation openings 39 to come into contact with each fin 46b.

[0041] As shown in FIG. 5, in the electronic device 10 of this embodiment, the height h1 of the standing wall 16B is, for example, 8 mm, and the height h2 of the internal space of the housing 12 is, for example, 5.4 mm. The height of the inner wall surface 16B1 of the standing wall 16B is the same as the height h2. Meanwhile, the height h3 of the ventilation opening 39 is, for example, 3.5 mm. Therefore, the inner wall surface 16B1 can only secure a margin of, for example, about 0.9 mm above and below the ventilation opening 39. This makes it difficult to attach a mesh member or the like to the inner wall surface 16B1 to prevent foreign matter such as dust from entering through the ventilation opening 39.

[0042] The thickness t1 of the electronic module 24 is, for example, 2.4 mm, and the thickness t2 of the electronic module 24 including the heat conductive member 48 is, for example, 3.2 mm. That is, the thickness of the heat conductive member 48 is, for example, 0.8 mm. In the sheet metal part 25, the plate thickness t3 of the pressing portion 42, the extension portion 46a, etc. is, for example, 0.2 mm, and the height h4 of the fins 46b is, for example, 3.7 mm.

[0043] As described above, the electronic device 10 has an extremely thin housing 12, and the components housed therein are also thin. Therefore, due to the limited space within the housing 12, the electronic device 10 has a structure that makes it difficult to cool the electronic module 24 with the thermal module 22.

[0044] Therefore, in the electronic device 10 of this embodiment, the sheet metal part 25 that holds down the electronic module 24 includes a heat dissipation part 46 in addition to the support part 40 and the holding part 42. The heat dissipation part 46 extends from the holding part 42 and has a plurality of fins 46b that are arranged facing the ventilation opening 39.

[0045] Therefore, in the electronic device 10, the sheet metal part 25 that holds the electronic module 24 can also be used to cool the electronic module 24. That is, the sheet metal part 25 can dissipate heat received by the retaining part 42 that is thermally connected to the electronic module 24, through the heat dissipation part 46. When the fan 35 is stopped or when the electronic device 10 is configured without a fan 35, the heat dissipation part 46 can passively dissipate heat from the electronic module 24 from the fins 46b to the vent 39. When the fan 35 is driven, the heat dissipation part 46 can actively dissipate heat from the electronic module 24 through the vent 39 using outside air flowing around the fins 46b.

[0046] Furthermore, the fins 46b are disposed facing the ventilation opening 39. This allows the fins 46b to function as a protective fence to prevent dust and other foreign matter from entering the housing 12 through the ventilation opening 39. As described above, the height h1 of the vertical wall 16B of the electronic device 10 is very low. Therefore, it is difficult to install a mesh member or the like on the inner wall surface 16B1 of the vertical wall 16B to prevent foreign matter from entering through the ventilation opening 39. In this regard, the heat-dissipating fins 46b of the electronic device 10 can also be used as a mesh member. This allows the electronic device 10 to reduce the number of parts, thereby reducing parts costs and manufacturing costs such as assembly work. In particular, the electronic device 10 of this embodiment is equipped with a fan 35. Therefore, by disposing the fins 46b facing the ventilation opening 39, which serves as an air intake, the electronic device 10 can prevent dust from entering the housing 12 and prevent malfunctions of the fan 35.

[0047] The fins 46b are formed integrally with the sheet metal part 25 that holds down the electronic module 24. Therefore, even if the fins 46b become clogged with dust, they can be easily cleaned by simply removing the sheet metal part 25, making maintenance easy.

[0048] 5, the distance L between the fins 46b and the ventilation opening 39 is not particularly limited as long as it is a distance that can prevent foreign matter from entering through the ventilation opening 39. The distance L may be, for example, zero or a negative value, meaning that part of the fins 46b may be inserted into the ventilation opening 39. However, it is preferable that the distance L is, for example, about several millimeters, specifically about 5 mm to 10 mm. This improves the workability when assembling the sheet metal part 25. It also makes it easier to remove the sheet metal part 25 during maintenance, replacing the SSD, etc.

[0049] It is preferable that a pair of support portions 40 are provided so as to straddle the electronic module 24 in the longitudinal direction. The pressing portion 42 is preferably disposed between the pair of support portions 40, 40. It is preferable that the heat dissipation portion 46 protrudes from the pressing portion 42 in a direction intersecting the longitudinal direction of the electronic module 24. This improves the installation stability of the pressing portion 42 and the heat dissipation portion 46.

[0050] The electronic device 10 may have a CPU 28, which is an arithmetic processing unit mounted on the substrate 20, and a metal plate 32 for absorbing and dissipating heat from the CPU 28. In this case, it is preferable that the thickness of the retaining portion 42 is thinner than the thickness of the metal plate 32. That is, the sheet metal part 25 is not intended to cool the CPU 28, which generates an extremely large amount of heat, like the metal plate 32. For this reason, if the sheet metal part 25, including the retaining portion 42, is formed from a thinner sheet metal than the metal plate 32, problems with installation space within the slim housing 12 are less likely to arise.

[0051] The housing 12 may have another vent 38 formed at a position different from the vent 39 in the standing wall 16B. The outlet 35c of the fan 35 and the heat sink 34 may be disposed facing the vent 38. A heat pipe 33, which is a heat transport member that transports heat from the CPU 28 and other components received by the metal plate 32, may be connected to the heat sink 34. In this case, the vent 38 serves as an exhaust port, and the vent 39 serves as an intake port into the housing 12. Therefore, the fins 46b can effectively prevent foreign matter from entering through the vent 39, which serves as an intake port. The heat generated by the electronic module 24 is sufficiently smaller than the heat generated by the CPU 28 and other components that are to be cooled by the metal plate 32. Therefore, even if the fins 46b are provided at the vent 39, the temperature of the outside air introduced into the housing 12 will not become excessively high.

[0052] The electronic device 10 described above is a single-plate tablet PC. The electronic device 10 may have, for example, two or more housings connected to each other so that they can rotate relative to each other. In this configuration, the display 14 may be a dual display type in which each housing is individually mounted, or a flexible display type that extends across each housing. In such an electronic device, for example, an electronic module 24 may be housed in a specific housing, and a sheet metal part 25 may be attached to the electronic module 24 for cooling.

[0053] It should be noted that the present invention is not limited to the above-described embodiment, and can be freely modified without departing from the spirit of the present invention. [Explanation of symbols]

[0054] 10 Electronic equipment 12. Case 14 Display 16 Housing parts 16B Standing wall 20 Substrate 22 Thermal Module 24 Electronic Module 25 Sheet metal parts 28 CPU 30 connectors 32 Metal Plate 35 Fans 38,39 Ventilation holes 40 Support part 42 Presser foot 44 Elastic support part 46 Heat radiation part 46a Extension 46b Fin

Claims

1. An electronic device, a housing having a vertical wall with a vent hole formed therein; a substrate provided in the housing and having a connector mounted thereon; a card-type electronic module connected to the connector; a sheet metal part that holds the electronic module; Equipped with The sheet metal part is a support portion formed from a single metal plate and supported by the substrate or the housing; a pressing portion formed integrally with the support portion from the single metal plate, thermally connected to the electronic module, and pressing the electronic module; a heat dissipation portion provided with a plurality of fins extending from the pressing portion and arranged facing the ventilation hole; have An electronic device characterized by:

2. An electronic device, a housing having a vertical wall with a vent hole formed therein; a substrate provided in the housing and having a connector mounted thereon; a card-type electronic module connected to the connector; a sheet metal part that holds the electronic module; Equipped with The sheet metal part is a support portion supported by the substrate or the housing; a pressing portion that is thermally connected to the electronic module and presses the electronic module; a heat dissipation portion provided with a plurality of fins extending from the pressing portion and arranged facing the ventilation hole; and The sheet metal part has an elastic support portion that is provided between the support portion and the pressing portion and elastically supports the pressing portion with respect to the support portion. An electronic device characterized by:

3. An electronic device, a housing having a vertical wall with a vent hole formed therein; a substrate provided in the housing and having a connector mounted thereon; a card-type electronic module connected to the connector; a sheet metal part that holds the electronic module; Equipped with The sheet metal part is a support portion supported by the substrate or the housing; a pressing portion that is thermally connected to the electronic module and presses the electronic module; a heat dissipation portion provided with a plurality of fins extending from the pressing portion and arranged facing the ventilation hole; and a pair of the support portions are provided so as to straddle the electronic module between them in the longitudinal direction; the pressing portion is disposed between the pair of support portions, The heat dissipation portion protrudes from the pressing portion in a direction intersecting the longitudinal direction of the electronic module. An electronic device characterized by:

4. An electronic device, a housing having a vertical wall with a vent hole formed therein; a substrate provided in the housing and having a connector mounted thereon; a card-type electronic module connected to the connector; a sheet metal part that holds the electronic module; Equipped with The sheet metal part is a support portion supported by the substrate or the housing; a pressing portion that is thermally connected to the electronic module and presses the electronic module; a heat dissipation portion provided with a plurality of fins extending from the pressing portion and arranged facing the ventilation hole; and a processing unit mounted on the substrate; a metal plate that is provided to cover a part of the substrate together with the arithmetic processing device and that can absorb and diffuse heat from the arithmetic processing device; Equipped with The thickness of the pressing portion is thinner than the thickness of the metal plate. An electronic device characterized by:

5. 5. The electronic device according to claim 4, The standing wall has a second ventilation hole formed at a position different from the ventilation hole, The electronic device further comprises: a fan having an outlet provided at a position facing the second ventilation port; a heat sink disposed between the outlet of the fan and the second vent; a heat transfer member that thermally connects the metal plate and the heat sink; Equipped with The vent is an intake port that can introduce air into the housing. An electronic device characterized by:

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