Antenna module and communication device

Abstract

To provide an antenna substrate, an integrated circuit, an IC package, an antenna module, and a communication device that enable millimeter wave communication in a compact form.SOLUTION: An antenna module 100 includes an antenna patch support 110 including a flexible portion 115 and other portions 113, an integrated circuit (IC) package 108 coupled to the antenna patch support, and an antenna unit 104 having an antenna patch coupled to the antenna patch support.SELECTED DRAWING: Figure 16B

Description

[Technical Field]

[0001] Wireless communication devices, such as handheld computing devices and wireless access points, have antennas. The frequencies at which communication may occur may depend, among other things, on the shape and placement of the antenna or antenna array. [Brief explanation of the drawings]

[0002] The embodiments will be readily understood from the following detailed description taken in conjunction with the accompanying drawings, in which: To facilitate this description, like reference numerals refer to like structural elements. Embodiments are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which:

[0003] [Figure 1] 1 is a cross-sectional side view of an antenna module, according to various embodiments.

[0004] [Figure 2] 1 is a cross-sectional side view of an exemplary antenna substrate, according to various embodiments. [Figure 3] 1 is a cross-sectional side view of an exemplary antenna substrate, according to various embodiments. [Figure 4] 1 is a cross-sectional side view of an exemplary antenna substrate, according to various embodiments.

[0005] [Figure 5] FIG. 1 is a top view of an exemplary antenna patch, according to various embodiments.

[0006] [Figure 6] 1 is a cross-sectional side view of an exemplary antenna substrate, according to various embodiments. [Figure 7] 1 is a cross-sectional side view of an exemplary antenna substrate, according to various embodiments. [Figure 8] 1 is a cross-sectional side view of an exemplary antenna substrate, according to various embodiments. [Figure 9] 1 is a cross-sectional side view of an exemplary antenna substrate, according to various embodiments. [Figure 10]1 is a cross-sectional side view of an exemplary antenna substrate, according to various embodiments. [Figure 11] 1 is a cross-sectional side view of an exemplary antenna substrate, according to various embodiments.

[0007] [Figure 12] 1 is a cross-sectional side view of an exemplary antenna patch according to various embodiments. [Figure 13] 1 is a cross-sectional side view of an exemplary antenna patch according to various embodiments.

[0008] [Figure 14] 1 is a cross-sectional side view of an integrated circuit (IC) package that may be included in an antenna module, according to various embodiments.

[0009] [Figure 15A] 1 illustrates an exemplary antenna module, according to various embodiments. [Figure 15B] 1 illustrates an exemplary antenna module, according to various embodiments. [Figure 15C] 1 illustrates an exemplary antenna module, according to various embodiments.

[0010] [Figure 16A] 1 is a cross-sectional side view of an exemplary antenna module, according to various embodiments. [Figure 16B] 1 is a cross-sectional side view of an exemplary antenna module, according to various embodiments. [Figure 17] 1 is a cross-sectional side view of an exemplary antenna module, according to various embodiments. [Figure 18] 1 is a cross-sectional side view of an exemplary antenna module, according to various embodiments.

[0011] [Figure 19] FIG. 1 illustrates a bottom view of an exemplary antenna patch arrangement on an antenna substrate, according to various embodiments. [Figure 20] FIG. 1 illustrates a bottom view of an exemplary antenna patch arrangement on an antenna substrate, according to various embodiments.

[0012] [Figure 21] 1 is a cross-sectional side view of an exemplary antenna patch arrangement within an antenna substrate, according to various embodiments.

[0013] [Figure 22] 1 is a cross-sectional side view of a portion of a communication device having an antenna module, according to various embodiments.

[0014] [Figure 23] FIG. 1 is a cross-sectional side view of an exemplary assembly having an antenna module and a circuit board, according to various embodiments. [Figure 24] FIG. 1 is a cross-sectional side view of an exemplary assembly having an antenna module and a circuit board, according to various embodiments.

[0015] [Figure 25A] 1A-1D are various views of an exemplary communication device having an antenna module, according to various embodiments. [Figure 25B] 1A-1D are various views of an exemplary communication device having an antenna module, according to various embodiments.

[0016] [Figure 26A] 1A-1D are various views of an exemplary communication device having an antenna module, according to various embodiments. [Figure 26B] 1A-1D are various views of an exemplary communication device having an antenna module, according to various embodiments.

[0017] [Figure 27] FIG. 2 is a top view of an exemplary antenna substrate, according to various embodiments.

[0018] [Figure 28] FIG. 28 is a cross-sectional side view of the antenna substrate of FIG. 27 coupled to an antenna substrate fixture, according to various embodiments.

[0019] [Figure 29]FIG. 2 is a top view of an exemplary antenna substrate, according to various embodiments.

[0020] [Figure 30] FIG. 30 is a cross-sectional side view of the antenna substrate of FIG. 29 coupled to an antenna substrate fixture, according to various embodiments.

[0021] [Figure 31A] 1A and 1B are top and side cross-sectional views, respectively, of an antenna substrate coupled to an antenna substrate fixture, according to various embodiments. [Figure 31B] 1A and 1B are top and side cross-sectional views, respectively, of an antenna substrate coupled to an antenna substrate fixture, according to various embodiments.

[0022] [Figure 32] FIG. 1 is a cross-sectional side view of an antenna substrate coupled to an antenna substrate fixture, according to various embodiments.

[0023] [Figure 33] FIG. 1 is an exploded perspective view of an exemplary antenna module, according to various embodiments. [Figure 34] FIG. 1 is an exploded perspective view of an exemplary antenna module, according to various embodiments. [Figure 35] FIG. 1 is an exploded perspective view of an exemplary antenna module, according to various embodiments. [Figure 36] FIG. 1 is an exploded perspective view of an exemplary antenna module, according to various embodiments.

[0024] [Figure 37A] 1A and 1B are top and bottom perspective views, respectively, of an exemplary antenna module, according to various embodiments. [Figure 37B] 1A and 1B are top and bottom perspective views, respectively, of an exemplary antenna module, according to various embodiments.

[0025] [Figure 38] 1 is a perspective view of a handheld communication device having an antenna module, according to various embodiments.

[0026] [Figure 39] 1 is a perspective view of a notebook communication device having multiple antenna modules, according to various embodiments.

[0027] [Figure 40] FIG. 1 is a top view of a wafer and die that may be included in an antenna module according to any of the embodiments disclosed herein.

[0028] [Figure 41] 1 is a cross-sectional side view of an IC device that may be included in an antenna module according to any of the embodiments disclosed herein.

[0029] [Figure 42] FIG. 1 is a cross-sectional side view of an IC device assembly that may be included in an antenna module according to any of the embodiments disclosed herein.

[0030] [Figure 43] FIG. 1 is a block diagram of an example communication device that may be included in an antenna module, according to any of the embodiments disclosed herein. DETAILED DESCRIPTION OF THE INVENTION

[0031] Conventional millimeter-wave antenna arrays use circuit boards with more than 14 layers (e.g., more than 18 layers) of dielectric / metal stacks to achieve the desired performance. Such boards are typically expensive, have low yields, and exhibit a poor balance between metal density and dielectric thickness. Furthermore, such boards can be difficult to test, and the shielding required for regulatory compliance may not be easily integrated.

[0032] Disclosed herein are antenna substrates, integrated circuits, IC packages, antenna modules, and communication devices that can enable millimeter wave communications in a compact form. In some embodiments disclosed herein, an antenna module can include an antenna substrate and one or more IC packages that can be manufactured separately and assembled to improve design flexibility and yield. The various antenna modules disclosed herein can exhibit little or no warping during operation or installation, be easy to assemble, be low-cost, ship quickly, facilitate easy material handling, and / or have good thermal performance. The various antenna modules disclosed herein can allow for the replacement of different antennas and / or IC packages into existing modules.

[0033] In the following detailed description, reference is made to the accompanying drawings which form a part hereof, in which like reference numerals refer to like parts throughout, and which show, by way of example, embodiments which may be practiced. It should be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure. Therefore, the following detailed description is not to be taken in a limiting sense.

[0034] Various operations may be described sequentially as multiple separate processes or operations in a manner that best contributes to an understanding of the claimed subject matter. However, the order of description should not be construed as implying that these operations are necessarily order dependent. In particular, these operations need not be performed in the order presented. The described operations may be performed in a different order than in the described embodiment. Various additional operations may be performed and / or described operations may be omitted in additional embodiments.

[0035] For purposes of this disclosure, the phrase "A and / or B" means (A), (B), or (A and B). For purposes of this disclosure, the phrase "A, B and / or C" means (A), (B), (C), (A and B), (A and C), (B and C), or (A, B and C). The drawings are not necessarily to scale. While many of the drawings show rectilinear structures with flat walls and square corners, this is for illustrative purposes only. Actual devices made using these techniques will exhibit rounded corners, surface roughness, and other features.

[0036] The description uses the phrases "in one embodiment" or "in an embodiment," each of which may refer to one or more of the same or different embodiments. Furthermore, when used with respect to multiple embodiments of the present disclosure, terms such as "comprising," "including," and "having" are synonymous. As used herein, "package" and "IC package" are synonymous. When describing a dimensional range, the phrase "X to Y" refers to the range inclusive of X and Y. For convenience, the phrase "FIG. 15" can refer to FIGS. 15A, 15B, and 15C, the phrase "FIG. 16" can refer to FIGS. 16A and 16B, and so on.

[0037] Any of the features described with reference to any of the accompanying drawings may be combined with any other features as appropriate to form the antenna substrate 102, the antenna module 100, or the communication device 151. In the figures, many elements are common to other figures. For the sake of brevity, descriptions of these elements will not be repeated. These elements may take the form of any of the embodiments disclosed herein.

[0038] FIG. 1 is a cross-sectional side view of an antenna module 100, according to various embodiments. The antenna module 100 may include an IC package 108 coupled to an antenna substrate 102. As described further below, the antenna module 100 may provide an RF head and may be coupled to a circuit board by a cable or other connection. While FIG. 1 shows a single IC package 108, the antenna module 100 may include multiple IC packages 108 (e.g., as described below with reference to FIGS. 34 through 37). As described in further detail below, the antenna substrate 102 may include conductive paths (e.g., provided by conductive vias and lines through one or more dielectric materials) and radio frequency (RF) transmission structures (e.g., antenna feed structures such as stripline, microstripline, coplanar waveguide, etc.) that may enable one or more antenna units 104 (not shown) to receive and transmit electromagnetic waves under the control of circuitry within the IC package 108. In some embodiments, the IC package 108 may be coupled to the antenna substrate 102 by a second-level interconnect (not shown, but described below with reference to FIG. 14 ). In some embodiments, at least a portion of the antenna substrate 102 may be fabricated using printed circuit board (PCB) technology and may have two to eight PCB layers. Examples of IC packages 108 and antenna substrates 102 are described in more detail below. In some embodiments, the antenna module 100 may include different IC packages 108 to control different antenna units 104. In another embodiment, the antenna module 100 may include a single IC package 108 having circuitry to control multiple antenna units 104. In some embodiments, the total z-height of the antenna module 100 may be less than 3 millimeters (e.g., between 2 millimeters and 3 millimeters). In some embodiments, the antenna module 100 may include multiple IC packages 108 coupled to a single antenna substrate 102. In other embodiments, the antenna module 100 may include multiple antenna substrates 102 coupled to a single IC package 108.

[0039] 2 through 4 are cross-sectional side views of an exemplary antenna substrate 102 according to various embodiments. FIG. 2 is a schematic representation of an example antenna substrate 102 including one or more antenna units 104 coupled to an antenna patch support 110. In some embodiments, the antenna units 104 may be electrically coupled to the antenna patch support 110 by conductive material paths through the antenna patch support 110 that are in conductive contact with the conductive material of the antenna units 104. Meanwhile, in other embodiments, the antenna units 104 may be mechanically coupled to the antenna patch support 110 but without contacting the conductive material paths through the antenna patch support 110. In some embodiments, at least a portion of the antenna patch support 110 may be produced using PCB technology and may include two to eight PCB layers. While FIG. 2 (and other accompanying figures) specifically shows the antenna units 104, this is merely exemplary, and the antenna substrate 102 may include fewer or more antenna units 104. For example, the antenna board 102 may include four antenna units 104 (e.g., arranged in a linear array, as described below with reference to Figures 29-31 and 39), eight antenna units 104 (e.g., arranged in one linear array, as described below with reference to Figures 35, 37, and 38, or two linear arrays), sixteen antenna units 104 (e.g., arranged in a 4x4 array, as described below with reference to Figures 34 and 36), or thirty-two antenna units 104 (e.g., arranged in two 4x4 arrays, as described below with reference to Figures 34 and 36). In some embodiments, the antenna units 104 may be surface-mounted components.

[0040] In some embodiments, the antenna module 100 may include one or more arrays of antenna units 104 to support multiple communication bands (e.g., dual-band operation or tri-band operation). For example, some of the antenna modules 100 disclosed herein may support tri-band operation at 28 GHz, 39 GHz, and 60 GHz. Various antenna modules 100 disclosed herein may support tri-band operation at 24.5 GHz to 29 GHz, 37 GHz to 43 GHz, and 57 GHz to 71 GHz. Various antenna modules 100 disclosed herein may support 5G communication and 60 GHz communication. Various antenna modules 100 disclosed herein may support 28 GHz and 39 GHz communication. Various antenna modules 100 disclosed herein may support millimeter wave communication. The various antenna modules 100 disclosed herein may support high frequency bands and low frequency bands.

[0041] In some embodiments, the antenna substrate 102 may include an antenna unit 104 adhesively coupled to an antenna patch support 110. FIG. 3 illustrates an antenna substrate 102 in which the antenna patch support 110 includes a circuit board 112 (e.g., having two to eight PCB layers), a solder resist 114 and conductive contacts 118 on one side of the circuit board 112, and an adhesive 106 on the other side of the circuit board 112. As used herein, a "conductive contact" may refer to a portion of a conductive material (e.g., a metal) that interfaces between different components. The conductive contact may be recessed, flush, or spaced apart from the surface of a component and may take any suitable form (e.g., a conductive pad or socket). The circuit board 112 may include traces, vias, and other structures made of a conductive material (e.g., a metal such as copper) as known in the art. The conductive structures in the circuit board 112 may be electrically insulated from one another by a dielectric material. Any suitable dielectric material may be used (e.g., a laminate material). In some embodiments, the dielectric material can be an organic dielectric material, a flame-retardant grade 4 material (FR-4), a bismaleimide triazine (BT) resin, a polyimide material, a glass-reinforced epoxy matrix material, or low-k and ultra-low-k dielectrics (e.g., carbon-doped dielectrics, fluorine-doped dielectrics, porous dielectrics, and organic polymer dielectrics).

[0042] In the embodiment of FIG. 3 , the antenna unit 104 may be affixed to an adhesive 106. The adhesive 106 may be non-conductive, and therefore the antenna unit 104 may not be electrically coupled to the circuit board 112 by a conductive material path. In some embodiments, the adhesive 106 may be an epoxy. The thickness of the adhesive 106 may control the distance between the antenna unit 104 and the adjacent side of the circuit board 112. When the antenna board 102 of FIG. 3 (and others in the accompanying figures) is used in the antenna module 100, the IC package 108 may be coupled to a portion of the conductive contacts 118. In some embodiments, the thickness of the circuit board 112 of FIG. 3 may be less than 1 millimeter (e.g., 0.35 to 0.5 millimeters). In some embodiments, the thickness of the antenna unit 104 may be less than 1 millimeter (e.g., 0.4 to 0.7 millimeters).

[0043] In some embodiments, the antenna substrate 102 may include an antenna unit 104 solder-coupled to an antenna patch support 110. Figure 4 shows an antenna substrate 102 in which the antenna patch support 110 includes a circuit board 112 (e.g., having two to eight PCB layers), a solder mask 114 and conductive contacts 118 on one side of the circuit board 112, and a solder mask 114 and conductive contacts 116 on the opposite side of the circuit board 112. The antenna unit 104 may be secured to the circuit board 112 by solder 122 (or other secondary interconnect) between the conductive contacts 120 of the antenna unit 104 and the conductive contacts 116. In some embodiments, the conductive contacts 116 / solder 122 / conductive contacts 120 may provide a conductive material path through which signals may be transmitted to and received from the antenna unit 104. In another embodiment, the conductive contacts 116 / solder 122 / conductive contacts 120 may be used solely for mechanical coupling between the antenna unit 104 and the antenna patch support 110. The height of the solder 122 (or other interconnect) may control the distance between the antenna unit 104 and the adjacent side of the circuit board 112. FIG. 5 is a top view of an exemplary antenna unit 104 that may be used in an antenna substrate 102, such as the antenna substrate 102 of FIG. 4, according to various embodiments. The antenna unit 104 of FIG. 5 may have multiple conductive contacts 120 regularly distributed over its surface. Other antenna units 104 having conductive contacts 120 may have different arrangements of the conductive contacts 120.

[0044] In some embodiments, the antenna substrate may have an antenna unit 104 coupled to a bridge structure. FIG. 6 shows an antenna substrate 102 in which an antenna patch support 110 includes a circuit board 112 (e.g., having two to eight PCB layers), a solder resist 114 and conductive contacts 118 on one side of the circuit board 112, and a bridge structure 124 secured to the opposite side of the circuit board 112. The bridge structure 124 may have one or more antenna units 104 coupled to an inner surface of the bridge structure 124 and one or more antenna units 104 coupled to an outer surface of the bridge structure 124. In the embodiment of FIG. 6, the antenna unit 104 is coupled to the bridge structure 124 with an adhesive 106. In the embodiment of FIG. 6, the bridge structure 124 may be coupled to the circuit board 112 with an adhesive 106. The thickness of the adhesive 106 and the dimensions of the bridge structure 124 (i.e., the distance between the inner surface and the adjacent surface of the circuit board 112, and the thickness between the inner surface and the outer surface of the bridge structure 124) can control the distance between the antenna unit 104 and the adjacent surface of the circuit board 112 (including the distance between the “inner” antenna unit 104 and the “outer” antenna unit 104). The bridge structure 124 can be made of any suitable material. For example, the bridge structure 124 can be formed of a non-conductive plastic. In some embodiments, the bridge structure 124 of FIG. 6 can be manufactured using 3D printing techniques. In some embodiments, the bridge structure 124 of FIG. 6 can be fabricated in a PCB as a recess defining an inner surface (e.g., using recessed board manufacturing techniques). In the embodiment of FIG. 6, the bridge structure 124 can introduce an air gap 149 between the antenna unit 104 and the circuit board 112 to increase the bandwidth of the antenna module 100.

[0045] FIG. 7 illustrates an antenna substrate 102 similar to that of FIG. 6, but with a curved (e.g., arched) bridge structure 124. Such a bridge structure 124 may be formed, for example, from flexible plastic or other materials. FIG. 7 illustrates an antenna substrate 102 in which an antenna patch support 110 includes a circuit board 112 (e.g., having two to eight PCB layers), a solder resist 114 and conductive contacts 118 on one side of the circuit board 112, and a bridge structure 124 secured to the opposite side of the circuit board 112. The bridge structure 124 may have one or more antenna units 104 coupled to an inner surface of the bridge structure 124 and one or more antenna units 104 coupled to an outer surface of the bridge structure 124. In the embodiment of FIG. 7, the antenna units 104 are coupled to the bridge structure 124 with adhesive 106. In the embodiment of FIG. 6, the bridge structure 124 may be coupled to the circuit board 112 with adhesive 106. The thickness of the adhesive 106 and the dimensions of the bridge structure 124 (i.e., the distance between the inner surface and the adjacent surface of the circuit board 112, and the thickness between the inner surface and the outer surface of the bridge structure 124) can control the distance between the antenna unit 104 and the adjacent surface of the circuit board 112 (including the distance between the “inner” antenna unit 104 and the “outer” antenna unit 104). The bridge structure 124 of FIG. 7 can be made of any suitable material. For example, the bridge structure 124 can be formed of a non-conductive plastic. In the embodiment of FIG. 7, the bridge structure 124 can introduce an air gap 149 between the antenna unit 104 and the circuit board 112 to increase the bandwidth of the antenna module 100.

[0046] FIG. 8 illustrates an antenna substrate 102 similar to the antenna substrate 102 of FIGS. 6 and 7 , except that the bridge structure 124 itself is a flat circuit board or other structure with conductive contacts 126. The bridge structure 124 may be coupled to the circuit board 112 by solder 122 (or other interconnections) between the conductive contacts 126 and the conductive contacts 116 of the circuit board 112. In the antenna substrate 102 of FIG. 8 , the antenna patch support 110 includes the circuit board 112 (e.g., having two to eight PCB layers), solder resist 114 and conductive contacts 118 on one side of the circuit board 112, and a bridge structure 124 fixed to the opposite side of the circuit board 112. The bridge structure 124 may have one or more antenna units 104 coupled to an inner surface of the bridge structure 124 and one or more antenna units 104 coupled to an outer surface of the bridge structure 124. In the embodiment of FIG. 8 , the antenna units 104 are coupled to the bridge structure 124 by adhesive 106. The thickness of the adhesive 106, the height of the solder 122, and the dimensions of the bridge structure 124 (i.e., the thickness of the bridge structure 124 between the inner and outer surfaces) can control the distance between the antenna unit 104 and the adjacent side of the circuit board 112 (including the distance between the “inner” antenna unit 104 and the “outer” antenna unit 104). The bridge structure 124 of FIG. 8 can be formed of any suitable material. For example, the bridge structure 124 can be formed of a non-conductive plastic or a PCB. In the embodiment of FIG. 8, the bridge structure 124 can introduce an air gap 149 between the antenna unit 104 and the circuit board 112 to increase the bandwidth of the antenna module 100.

[0047] FIG. 9 illustrates an antenna substrate 102 similar to that of FIG. 8 , except that the bridge structure 124 itself is a flat circuit board or other structure. The bridge structure 124 and the antenna units 104 coupled thereto are all coupled to the circuit board 112 with adhesive 106. In the antenna substrate 102 of FIG. 9 , the antenna patch support 110 includes a circuit board 112 (e.g., having two to eight PCB layers), solder resist 114 and conductive contacts 118 on one side of the circuit board 112, and a bridge structure 124 fixed to the opposite side of the circuit board 112. The bridge structure 124 may have one or more antenna units 104 coupled to an inner surface of the bridge structure 124 and one or more antenna units 104 coupled to an outer surface of the bridge structure 124. In the embodiment of FIG. 9 , the antenna units 104 are coupled to the bridge structure 124 with adhesive 106. The thickness of the adhesive 106 and the dimensions of the bridge structure 124 (i.e., the thickness of the bridge structure 124 between the inner and outer surfaces) can control the distance between the antenna unit 104 and the adjacent side of the circuit board 112 (including the distance between the “inner” antenna unit 104 and the “outer” antenna unit 104). The bridge structure 124 of FIG. 9 can be formed of any suitable material. For example, the bridge structure 124 can be formed of a non-conductive plastic or a PCB. In some embodiments, the circuit board 112 can be a 1-2-1 core board and the bridge structure 124 can be a 0-2-0 core board. In some embodiments, the circuit board 112 can use a different dielectric material than the dielectric material of the bridge structure 124 (e.g., the bridge structure 124 can include polytetrafluoroethylene (PTFE) or a PTFE-based formulation and the circuit board 112 can include another dielectric material).

[0048] In some embodiments, the antenna substrate 102 may include recesses "above" the antenna units 104 to provide air gaps 149 between the antenna units 104 and other portions of the antenna substrate 102. FIG. 10 illustrates an antenna substrate 102 similar to that of FIG. 3, but in which the circuit board 112 includes recesses 130 located "above" each antenna unit 104. These recesses 130 may provide air gaps 149 between the antenna units 104 and other portions of the antenna substrate 102, which may provide improved performance. In the embodiment of FIG. 10, the antenna patch support 110 includes a circuit board 112 (e.g., having two to eight PCB layers), solder resist 114 and conductive contacts 118 on one side of the circuit board 112, and adhesive 106 on the opposite side of the circuit board 112. The antenna units 104 may be attached to the adhesive 106. The adhesive 106 may be non-conductive, such that the antenna unit 104 may not be electrically coupled to the circuit board 112 by a conductive material path. In some embodiments, the adhesive 106 may be an epoxy. The thickness of the adhesive 106 may control the distance between the antenna unit 104 and the adjacent side of the circuit board 112. In some embodiments, the recess 130 may have a depth of 200 microns to 400 microns.

[0049] In some embodiments, the antenna substrate 102 may have recesses located between the attachment locations of different antenna units 104 to the circuit board 112, rather than “above” the antenna units 104. For example, FIG. 11 illustrates an antenna substrate 102 similar to that of FIG. 10 , except that the circuit board 112 includes additional recesses 132 located “between” each of the antenna units 104. These recesses 132 may help isolate the different antenna units 104 from each other, thereby improving performance. In the embodiment of FIG. 11 , the antenna patch support 110 includes a circuit board 112 (e.g., having two to eight PCB layers), solder resist 114 and conductive contacts 118 on one side of the circuit board 112, and adhesive 106 on the opposite side of the circuit board 112. The antenna units 104 may be affixed to the adhesive 106. The adhesive 106 may be non-conductive, and therefore the antenna units 104 may not be electrically coupled to the circuit board 112 by a conductive material path. In some embodiments, the adhesive 106 may be an epoxy. The thickness of the adhesive 106 may control the distance between the antenna unit 104 and the adjacent side of the circuit board 112. In some embodiments, the recess 132 may have a depth of 200 microns to 400 microns. In some embodiments, the recess 132 may be a through-hole (i.e., the recess 132 may extend completely through the circuit board 112).

[0050] Any suitable antenna structure may provide the antenna unit 104 of the antenna module 100. In some embodiments, the antenna unit 104 may have one, two, or three antenna layers. For example, Figures 12 and 13 are side cross-sectional views of exemplary antenna units 104, according to various embodiments. In Figure 12, the antenna unit 104 has one antenna patch 172, while in Figure 13, the antenna unit 104 has two antenna patches 172 separated by an intervening structure 174.

[0051] The IC package 108 included in the antenna module 100 may have any suitable structure. For example, FIG. 14 illustrates an exemplary IC package 108 that may be included in the antenna module 100. The IC package 108 may have a package substrate 134 to which one or more components 136 may be coupled by a first-level interconnect 150. Specifically, conductive contacts 146 on one side of the package substrate 134 may be coupled to conductive contacts 148 on the side of the component 136 by the first-level interconnect 150. The primary interconnects 150 shown in FIG. 14 are solder bumps, but any suitable primary interconnect 150 may be used. A solder resist 114 may be disposed around the conductive contacts 146. The package substrate 134 may include a dielectric material and may have conductive paths (e.g., including conductive vias and lines) extending through the dielectric material between faces or between different portions of each face. In some embodiments, the package substrate 134 may have a thickness of less than 1 millimeter (e.g., 0.1 to 0.5 millimeters). Conductive contacts 144 may be disposed on the other side of the package substrate 134, and secondary interconnects 142 may couple these conductive contacts 144 to the antenna substrate 102 (not shown) within the antenna module 100. While the secondary interconnects 142 shown in FIG. 14 are solder balls (e.g., for a ball grid array arrangement), any suitable secondary interconnects 142 may be used (e.g., pins in a pin grid array arrangement or lands in a land grid array arrangement). Solder resist 114 may be disposed around the conductive contacts 144. In some embodiments, a molding compound 140 may be disposed around the component 136 (e.g., as an underfill material between the component 136 and the package substrate 134). In some embodiments, the molding compound may be less than 1 millimeter thick. Exemplary materials that may be used for the molding compound 140 include suitable epoxy molding compounds. In some embodiments, a conformal shield 152 may be disposed around the component 136 and the package substrate 134 to provide electromagnetic shielding for the IC package 108.

[0052] The components 136 may include any suitable IC components. In some embodiments, one or more of the components 136 may include a die. For example, one or more of the components 136 may be an RF communication die. In some embodiments, one or more of the components 136 may include resistors, capacitors (e.g., bypass capacitors), inductors, DC-DC conversion circuitry, or other circuit elements. In some embodiments, the IC package 108 may be a system-in-package (SiP). In some embodiments, the IC package 108 may be a flip-chip (FC) chip-scale package (CSP). In some embodiments, one or more of the components 136 may include a memory device programmed with instructions to perform beamforming, scanning, and / or codebook functions.

[0053] In some embodiments, the antenna patch support 110 of the antenna substrate 102 may include one or more flexible portions. For example, the antenna patch support 110 may include a flexible PCB (also referred to as a "flexible circuit"). The antenna patch support 110 may be entirely flexible, or in another embodiment, may include one or more rigid portions and one or more flexible portions. This latter embodiment may also be referred to as a "rigid / flexible substrate." An antenna patch support 110 that is referred to herein as having a "flexible portion" may be entirely flexible. In some embodiments in which the antenna patch support 110 has a flexible portion, one or more antenna units 104 may be disposed on the flexible portion, some antenna units 104 may be disposed on the flexible portion, some antenna units 104 may be disposed on the rigid portion (if present), or no antenna units may be disposed on the flexible portion. In some embodiments, the flexible portion(s) of the antenna substrate 102 may be used to electrically connect the antenna substrate 102 to another component (e.g., the circuit board 101 described below with reference to FIG. 22).

[0054] The flexible portion of the antenna patch support 110 may be fabricated using any suitable technique and any suitable material. For example, the flexible portion of the antenna patch support 110 may include a flexible insulating material (e.g., polyimide, polyester, polyethylene terephthalate, polyether ether ketone, etc.) printed or laminated with a conductive material (e.g., copper, aluminum, silver, etc.). The flexible portion of the antenna patch support 110 may include one or more layers of circuitry. In some embodiments, the flexible portion of the antenna patch support 110 may be optionally bonded to one or more local stiffeners to provide mechanical support. In some embodiments, the flexible portion of the antenna patch support 110 may be thinner than other, less flexible portions of the antenna patch support 110. For example, if the antenna patch support 110 is a rigid / flexible substrate, the flexible portion(s) may be thicker than the rigid portion(s).

[0055] Any of the antenna substrates 102 disclosed herein may include an antenna patch support 110 having a flexible portion. For example, any of the antenna patch support 110 or antenna substrates 102 described above with reference to FIGS. 1 through 11 or below with reference to FIGS. 18 through 29 may have one or more flexible portions or may be part of an antenna patch support 110 having one or more flexible portions. FIGS. 15 through 17 show various examples of antenna modules 100 including a flexible portion. Any of the antenna modules 100 of FIGS. 15 through 17 may have any of the other structures disclosed herein (e.g., the antenna patch support 110 of the antenna modules of FIGS. 15 through 17 may include or take the form of any of the antenna patch support 110 described above with reference to FIGS. 3 through 11).

[0056] 15A and 15B illustrate an antenna module 100 including an antenna patch support 110 having a flexible section 115 between two other sections 113. The other sections 113 can be flexible or rigid. The flexible section 115 can allow the antenna module 100 to bend or twist into a desired configuration without significantly damaging the antenna patch support 110. FIG. 15A illustrates a "flat" configuration, while FIG. 15B illustrates a configuration in which one of the sections 113 is disposed at an angle θ relative to the other sections 113. Thus, the flexible section 115 can act as a hinge that allows the antenna module 100 to bend so that different sections of the antenna module 100 are not flush with each other. In the antenna module 100 of FIG. 15, an IC package 108 is provided on one side of the antenna patch support 110, and multiple antenna units 104 are provided on the opposite side of the antenna patch support 110 (e.g., as described in any of the embodiments disclosed herein). In the embodiment of FIG. 15 , the IC package is coupled to one of the portions 113, and the antenna unit 104 is coupled to the other portion 113. Antenna modules 100 such as those shown in FIG. 15 can be arranged in any desired configuration within a communications device. For example, antenna modules 100 such as those shown in FIG. 15 can be used in communications devices 151, as described below with reference to FIG. 25 or with reference to FIG. 26. More generally, antenna modules 100 can be mounted to electronic components (e.g., within communications devices 151) in a non-coplanar configuration (e.g., using any of the mounting fixtures described herein with reference to FIGS. 27-32, 37, and 38). This allows antenna units 104 at different locations on the antenna substrate 102 to radiate and receive at different angles. Alternatively, antenna units 104 can radiate and receive at angles different from those in a substantially “flat” configuration. In some embodiments, the thickness of flexible portion 115 can be less than the thickness of the other portions 113. In some embodiments, the other portion 113 may be rigid (and thus the antenna patch support 110 may be a rigid / flexible substrate).In some embodiments, the antenna module 100 of Figure 15 may have an additional flexible section 115 or other section 113 (not shown). In some embodiments, the IC package 108 and the antenna unit 104 may be disposed on the same surface of the antenna patch support 110 of Figure 15.

[0057] In some embodiments, the flexible portion 115 may be used to transmit control and / or RF signals to various other electronic components of the communication device 151, eliminating or reducing the need for additional connectors and cables. For example, such control lines may control how the antenna unit 114 interacts with the IC package 108 (e.g., an active RF IC chip). RF signals transmitted through the flexible portion 115 may carry transmit signals from a circuit board (e.g., circuit board 101, described below, which may be a motherboard), and these RF signals may be radiated through the antenna unit (e.g., after post-processing by the antenna module 100).

[0058] In some embodiments, the antenna module 100 may have multiple flexible portions 115 between a pair of other portions 113. For example, FIG. 15C is a perspective view of the antenna module 100 in which a portion 113-1 (e.g., a rigid portion) is coupled to another portion 113-2 (e.g., a rigid portion) by two flexible portions 115. The portion 113-2 may have an "L-shape" extending around the portion 113-1 as shown, and each flexible portion 115 may be coupled to a different "leg" of the portion 113-2. In some embodiments of the antenna module 100 of FIG. 15C, a large antenna unit 104-1 may be disposed (e.g., by printing) on ​​the portion 113-2, and one or more smaller antenna units 104-2 may be disposed (e.g., by printing) within the boundaries of the large antenna unit 104-1. The large antenna unit 104-1 may communicate at a lower frequency than the smaller antenna unit 104-2. Thus, the operation of the large antenna unit 104-1 may be prevented from interfering with the operation of the smaller antenna unit 104-2 (and vice versa). For example, the antenna unit 104-1 may be a WiFi, Long Term Evolution (LTE), or Global Positioning System (GNSS) antenna, while the antenna unit 104-2 may be a millimeter-wave antenna. In some embodiments, the antenna unit 104-1 may be a planar inverted-F antenna (PIFA).

[0059] FIG. 16A illustrates an antenna module 100 including an antenna patch support 110 having two flexible sections 115 sandwiching a second section 113 therebetween. The second section 113 can be flexible or rigid. While the flexible sections 115 of the antenna module 100 of FIG. 16 are shown as being substantially flush with one another, this is merely one configuration. As discussed above with reference to FIG. 15, the flexible sections 115 can be bent or twisted to a desired configuration. In the antenna module 100 of FIG. 16, an IC package 108 is provided on one side of the antenna patch support 110, and multiple antenna units 104 are provided on the opposite side of the antenna patch support 110 (e.g., as described in any of the embodiments disclosed herein). In the embodiment of FIG. 16, the IC package is coupled to the section 113, and one or more antenna units 104 are coupled to each flexible section 115. An antenna module 100 such as that shown in FIG. 16 can be arranged in any desired configuration within a communication device. For example, the antenna module 100 shown in FIG. 15 can be used in a communication device 151, as described below with reference to FIG. 25 or FIG. 26. More generally, the antenna module 100 can be mounted to an electronic component (e.g., within a communication device 151) in a non-coplanar configuration (e.g., using any of the mounting fixtures described herein with reference to FIGS. 27-32, 37, and 38). This allows the antenna units 104 at different locations on the antenna substrate 102 to radiate and receive at different angles. Alternatively, the antenna units 104 can radiate and receive at angles different from those in a substantially "flat" arrangement. In some embodiments, the thickness of the flexible portion 115 can be less than the thickness of the other portion 113. In some embodiments, the other portion 113 can be rigid (and thus the antenna patch support portion 110 can be a rigid / flexible substrate). In some embodiments, the antenna module 100 of FIG. 16 can have additional flexible portions 115 or other portions 113 (not shown). In some embodiments, the IC package 108 and the antenna unit 104 may be disposed on the same surface of the antenna patch support 110 of FIG.

[0060] As discussed above with reference to FIG. 15 , the flexible portion 115 of the antenna patch support 110 allows the antenna module 100 to be positioned in any of a number of orientations. For example, FIG. 16B shows an antenna module 100 with a flexible portion 115 "folded" over portion 113, allowing the corresponding antenna unit 104 to irradiate upward toward the IC package 108 (and, for example, may use the ground of the IC package 108 as a reference). An antenna unit 104 located on another flexible portion 115 (and / or on the bottom surface of portion 113, not shown) may irradiate downward toward the IC package 108. Thus, the antenna module 100 shown in FIG. 16B may be capable of omnidirectional or multi-directional irradiation. Furthermore, by arranging one or more antenna units 104 to be located "above" the IC package 108, the antenna module 100 disclosed in this specification may enjoy the advantage that available space is not limited to "below" the IC package 108, but also exists "above" the IC package 108 within the communication device 151.

[0061] FIG. 17 illustrates an antenna module 100 similar to that of FIG. 16 , but with an antenna unit 104 mounted on one flexible portion 115 and a connector 105 mounted on the other flexible portion 115. The connector 105 can be used to transmit signals into and out of the antenna module 100. In some embodiments, the connector 105 can be a coaxial cable connector or any other connector (e.g., a flat cable connector, as described below with reference to FIGS. 37 and 38 ). The connector 105 can be suitable for transmitting RF signals and can be used instead of or in addition to a cable, for example, in the antenna module 100 of FIG. 17 . While FIG. 17 illustrates a single connector 105, the antenna module 100 can have one or more connectors 105. Furthermore, while FIG. 17 illustrates the connector 105 as being on the same side of the antenna patch support 110 as the antenna unit 104, the connector 105 can be on the opposite side of the antenna patch support 110. More generally, the elements of the antenna module 100 of FIG. 17 may take the form of any of the embodiments described above with reference to FIG.

[0062] The array of antenna units 104 in the antenna module 100 can be used in any of several ways. For example, the array of antenna units 104 can be used as a broadside array or an end-fire array. In some embodiments in which the array of antenna units 104 is used as an end-fire array, the sides of the conformal shield 152 on the IC package 108 can provide a reflector or ground plane for the end-fire array. For example, FIG. 18 shows an example of an antenna module 100 in which the array of antenna units 104 is used as an end-fire array, where transmission is directed in the direction indicated by the bolded array. In this embodiment, the portions of the conformal shield 152 on the sides of the IC package 108 can act as a reflector or ground plane for the array of antenna units 104 to operate as an end-fire array. While FIG. 18 illustrates a specific antenna module 100, any suitable antenna module 100 disclosed herein can operate as an end-fire array as described with reference to FIG. 18.

[0063] In an antenna module 100 including multiple antenna units 104, the multiple antenna units 104 may be arranged in any suitable manner. For example, FIGS. 19 and 20 are bottom views of exemplary arrangements of antenna units 104 within an antenna substrate 102, according to various embodiments. In the embodiment of FIG. 19, the antenna units 104 are arranged in a linear array in the x-direction, with the x-axis of each antenna unit 104 (indicated in FIG. 19 by the small arrows adjacent each antenna unit 104) aligned with the axis of the linear array. In other embodiments, the antenna units 104 may be arranged such that one or more of their axes are not aligned with the direction of the array. For example, FIG. 20 illustrates an embodiment in which the antenna units 104 are distributed in a linear array in the x-direction, but the antenna units 104 are rotated in the xy plane (relative to the embodiment of FIG. 19) such that the x-axis of each antenna unit 104 is not aligned with the axis of the linear array. As another example, FIG. 21 illustrates an embodiment in which the antenna units 104 are distributed in a linear array in the x direction, but the antenna patches are rotated in the x-z plane (relative to the embodiment of FIG. 19) so that the x-axis of each antenna unit 104 is not aligned with the axis of the linear array. In the embodiment of FIG. 21, the antenna patch support 110 may include an antenna board mount 164 that can maintain the antenna units 104 at a desired angle. In some embodiments, the "rotations" of FIGS. 20 and 21 may be combined. That is, when the antenna units 104 are part of a linear array distributed in the x direction, the antenna units 104 are rotated in the x-y and x-z planes. In some embodiments, some, but not all, of the antenna units 104 in a linear array may be "rotated" relative to the axis of the array. Rotating the antenna units 104 relative to the direction of the array may reduce inter-patch coupling (by reducing the mutual addition of resonant currents between the antenna units 104), thereby improving impedance bandwidth and beam pointing range. The arrangements of Figures 19 to 21 (and combinations of such arrangements) are referred to herein as having the antenna units 104 "rotated off" from a linear array.

[0064] 19-21 show multiple antenna units 104 mounted on a common antenna patch support 110 on a single antenna substrate 102, the rotationally offset arrangements of Figures 19-21 may also be used when multiple antenna units 104 are distributed among different antenna substrates 102. For example, in an embodiment in which multiple different antenna substrates 102 are mounted on a common IC package 108, the antenna units 104 on each of the multiple different antenna substrates 102 may together provide a linear array and may be rotationally offset relative to the linear array.

[0065] The antenna module 100 disclosed herein may be included in any suitable communication device (e.g., a computing device with wireless communication capabilities, a wearable device with wireless communication circuitry, etc.). FIG. 22 is a side cross-sectional view of a portion of a communication device 151 including the antenna module 100, according to various embodiments. Specifically, the communication device 151 shown in FIG. 22 may be a handheld communication device such as a smartphone or tablet. The communication device 151 may have a glass or plastic back cover 176 adjacent to a metal or plastic housing 178. In some embodiments, the housing 178 may be laminated onto the inner surface of the back cover 176 or may be attached to the back cover 176 with an adhesive. In some embodiments, the portion of the housing 178 adjacent to the back cover 176 may have a thickness of 0.1 to 0.4 millimeters. In some such embodiments, the portion of the housing 178 may be made of metal. In some embodiments, the back cover 176 may have a thickness of 0.3 to 1.5 millimeters. In some such embodiments, the back cover 176 may be made of glass. The housing 178 may have one or more windows 181 aligned with the antenna units 104 (not shown) of the antenna module 100 for improved performance. An air gap 180-1 may separate at least a portion of the antenna module 100 from the back cover 176. In some embodiments, the height of the air gap 180-1 may be 0.5 millimeters to 3 millimeters. In some embodiments, the antenna module 100 may be mounted on one side of the circuit board 101 (e.g., a motherboard), and other components 129 (e.g., other IC packages) may be provided on the opposite side of the circuit board 101. In some embodiments, the circuit board 101 may have a thickness of 0.2 millimeters to 1 millimeter (e.g., 0.3 millimeters to 0.5 millimeters). Another air gap 180-2 may be disposed between the circuit board 101 and the display 182 (e.g., a touchscreen display).In another embodiment, the antenna module 100 may not be mounted on the circuit board 101; instead, the antenna module 100 may be fixed directly to the housing 178 (e.g., as described below). In some embodiments, the spacing between the antenna unit 104 (not shown) of the antenna module 100 and the back cover 176 may be selected and controlled to within tens of microns to achieve desired performance. An air gap 180-2 may separate the antenna module 100 from a display 182 on the front side of the communication device 151. In some embodiments, the display 182 may have a metal layer adjacent to the air gap 180-2 to conduct heat away from the display 182. A metal or plastic housing 184 may provide the “sides” of the communication device 151.

[0066] The antenna module 100 may be coupled to the circuit board 101 in the communication device 151 in any suitable manner. For example, the antenna module 100 may have a connector 105 to which a cable (e.g., a coaxial cable or a flat printed circuit cable) may mate. The other end of the cable may mate with the connector 105 on the circuit board 101 (not shown). In some embodiments, the connectors 105 on the antenna module 100 and the circuit board 101 may mate directly with each other without the use of an intervening cable. For example, FIGS. 23 and 24 show two different arrangements in which the connector 105-1 on the antenna module 100 mates directly with the connector 105-2 on the circuit board 101, thereby electrically coupling the antenna module 100 and the circuit board 101. The connector 105-1 on the antenna module 100 may be located on the antenna board 102 or the IC package 108, as appropriate. 23 embodiment, the circuit board 101 and the antenna module 100 are oriented such that the circuit board 101 substantially “overlays” the antenna module 100. In the embodiment of FIG. 24 embodiment, the circuit board 101 and the antenna module 100 are oriented such that the circuit board 101 and the antenna module 100 are “offset” from one another. The connector 105 may take any suitable form. For example, the connector 105 may be a coaxial connector suitable for transmitting RF signals between the antenna module 100 and the circuit board 101. Furthermore, although a single connector 105 is shown for each of the antenna module 100 and the circuit board 101, the antenna module 100 and the circuit board 101 may be interconnected by multiple connectors 105. In such an embodiment, a cable between the antenna module 100 and the circuit board 101 may be eliminated, reducing the complexity and volume of components within the communication device 151.

[0067] As described above, the antenna module 100 with the flexible portion 115 may be oriented in any suitable manner within the communication device 151. Specifically, the antenna module 100 with the flexible portion 115 may be used to orient an array of antenna units 104 within the communication device such that the antenna units 104 are positioned at a desired angle relative to the display 182, the back cover 176, and / or the housing 184. In some embodiments, an antenna module 100 with an array of antenna units 104 “tilted” relative to the display 182, the back cover 176, and / or the housing 184 may achieve a combination of edge-fire and broadside radiation coverage from the array. In some embodiments, the angle at which the antenna units 104 are positioned within the communication device 151 may be selected to adjust the array radiation direction to achieve a desired spatial coverage depending on the integration environment (e.g., of the handheld communication device 151 and the glass back cover 176) and the desired application.

[0068] For example, Figure 25 shows a communications device 151 comprising a substantially "flat" first antenna module 100-1 and a second antenna module 100-2. The second antenna module 100-2 has a flexible section 115 that acts as a hinge to allow different sections of the second antenna module 100-2 to not be flush with one another. Figure 25A is an "exploded view" showing the antenna module 100 outside the communications device 151, while Figure 25B shows the antenna module 100 positioned within the communications device 151.

[0069] In the embodiment of FIG. 25 , the antenna module 100-1 has an IC package 108 on one side of the antenna substrate 102 and an array of antenna units 104 on the opposite side. The antenna module 100-1 may be positioned within the communication device 151 such that the array of antenna units 104 is positioned parallel to and proximate to a window 181 in the back cover 176. This window 181 may enable improved transmission of RF signals between the antenna module 100-1 and the external environment compared to embodiments without the window 181. In some embodiments, the antenna module 100-1 may generate radiation beams for both 5G and 60 GHz communication paths. In some embodiments, an audio speaker (not shown) may be positioned proximate the antenna module 100-1 and may emit audio signals through the window 181. The window 181 may have any suitable dimensions. In some embodiments, for example, window 181 may have an area of ​​50 square millimeters to 200 square millimeters (e.g., 75 square millimeters to 125 square millimeters). In some embodiments, window 181 may not be present. There may also be a window 179 in housing 178 adjacent back cover 176 (not shown in FIG. 25). In some embodiments, window 179 may not be present.

[0070] The antenna module 100-2 in FIG. 25 has an IC package 108 on the same side of the antenna substrate 102 as the array of antenna units 104. The antenna module 100-2 may have substantially the same configuration as that described above with reference to FIG. 15, but the IC package 108 and the antenna units 104 are on the same side of the antenna patch support 110. The flexible portion 115 of the antenna module 100-2 may act as a hinge. This allows the antenna module 100-2 to be placed within the communication device 151 so that the portion of the antenna patch support 110 (not numbered in FIG. 25) to which the IC package 108 is coupled can be parallel to the back cover 176, and the portion of the antenna patch support 110 to which the antenna units 104 are coupled can be perpendicular to the back cover 176 (and parallel to the side of the communication device 151 provided by the housing 184). In some embodiments, the antenna module 100-2 may generate radiation beams for both the 5G communication path and the 60 GHz communication path. In some embodiments, the housing 184 may include a window 187. The array of antenna units 104 may be positioned parallel to and proximate to the window 187. The window 187 may allow for improved transmission of RF signals between the antenna module 100-2 and the external environment compared to embodiments without the window 187. The window 187 may have any suitable dimensions. In some embodiments, for example, the window 187 may have an area of ​​50 square millimeters to 200 square millimeters (e.g., 75 square millimeters to 125 square millimeters, or rectangular and having dimensions of approximately 5 millimeters by 18 millimeters or greater). In some embodiments, the window 187 may be absent.

[0071] Figure 26 shows another example communications device 151 including a first antenna module 100-1 and a second antenna module 100-2. The first and second antenna modules 100 of Figure 26 each have a flexible portion 115 that acts as a hinge, allowing different portions of the antenna module 100 to not be flush with one another. Figure 26A is an "exploded view" showing the antenna module 100 located outside the communications device 151, while Figure 26B shows the antenna module 100 located inside the communications device 151.

[0072] 26, the antenna module 100 has an IC package 108 on the same side of the antenna substrate 102 as the array of antenna units 104, and the antenna module 100 may have a configuration substantially similar to that described above with reference to FIG. 15, but the IC package 108 and the antenna units 104 are on the same side of the antenna patch support 110. The flexible portion 115 of the antenna module 100 may act as a hinge, allowing the antenna module 100 to be placed within the communication device 151 such that the portion of the antenna patch support 110 (not numbered in FIG. 26) to which the IC package 108 is coupled can be parallel to the back cover 176, and the portion of the antenna patch support 110 to which the antenna units 104 are coupled can be positioned at an angle that is neither parallel nor perpendicular to the back cover 176 (and neither parallel nor perpendicular to the side of the communication device 151 provided by the housing 184). For example, the antenna units 104 may be oriented at a 45-degree angle relative to the back cover 176 / housing 184. In some embodiments, windows 187-1 and 187-2 may be present in the housing 184. The arrays of antenna units 104 of the antenna modules 100-1 and 100-2 may be positioned proximate the windows 187-1 and 187-2, respectively. These windows 187 may allow for improved transmission of RF signals between the antenna modules 100, as described above. In some embodiments, there may be one or fewer windows 187.

[0073] The antenna module 100 disclosed herein may be secured within a communication device in any desired manner. For example, as described above, in some embodiments, the antenna module 100 may be secured to the housing 178. In the embodiments described below, reference is made to a fixture for securing the antenna module 100 (or, for simplicity of illustration, the antenna substrate 102) to the housing 178 of the communication device; however, any of the fixtures described below may be used to secure the antenna module 100 to any suitable portion of the communication device. For example, in some embodiments, the portion to which the antenna substrate 102 may be secured may be the flexible portion 115 or other portion 113 of the antenna patch support portion 110, as described above.

[0074] In some embodiments, the antenna board 102 may have notches that can be used to secure the antenna board 102 to the housing 178. For example, FIG. 27 is a top view of an exemplary antenna board 102 having two notches 154 on both longitudinal ends of the antenna board 102. The antenna board 102 of FIG. 27 may be part of an antenna module 100, but for ease of illustration, only the antenna board 102 is shown in FIG. 27. FIG. 28 is a side cross-sectional view of the antenna board 102 of FIG. 27 coupled to an antenna board fixture 164, according to various embodiments. Specifically, the antenna board fixture 164 of FIG. 28 may have two assemblies on both longitudinal ends of the antenna board 102. Each assembly may have a boss 160 (on or part of the housing 178), a spacer 162 on the top surface of the boss 160, and a screw 158 that extends through a hole in the spacer 162 and threads into a threaded hole in the boss 160. Tightened screws 158 can clamp the antenna substrate 102 between the spacer 162 and the top of the boss 160. At least a portion of the boss 160 can be disposed within the adjacent notch 154. In some embodiments, the outer dimensions of the antenna substrate 102 of FIG. 27 can be approximately 5 millimeters by approximately 38 millimeters.

[0075] In some embodiments, the screws 158 disclosed herein can be used to dissipate heat generated from the antenna module 100 during operation. Specifically, in some embodiments, the screws 158 can be made of metal, and the bosses 160 and housing 178 can also be made of metal (or can be non-metallic but have high thermal conductivity). During operation, heat generated from the antenna module 100 can be conducted through the screws 158 into the housing 178, away from the antenna module 100, thereby mitigating or preventing overheating. In some embodiments, a thermal interface material (TIM), such as thermal grease, can be present between the antenna substrate 102 and the screws 158 / bosses 160 to increase thermal conductivity.

[0076] In some embodiments, the screws 158 disclosed herein may be used as additional antennas for the antenna module 100. In some such embodiments, the bosses 160 (and other materials that the screws 158 contact) may be made of plastic, ceramic, or other non-conductive materials. The shape and location of the screws 158 may be selected such that the screws 158 act as antenna units 104 for the antenna substrate 102.

[0077] The antenna board 102 may include other arrangements of cutouts. For example, FIG. 29 is a top view of an exemplary antenna board 102 having a cutout 154 at one longitudinal end and a hole 168 adjacent the other longitudinal end. While the antenna board 102 of FIG. 29 may be part of an antenna module 100, for ease of illustration, only the antenna board 102 is shown in FIG. 29. FIG. 30 is a side cross-sectional view of the antenna board 102 of FIG. 29 coupled to an antenna board fixture 164, according to various embodiments. Specifically, the antenna board fixture 164 of FIG. 30 may include two assemblies at both longitudinal ends of the antenna board 102. The assembly adjacent the cutout 154 may include the boss 160 / spacer 162 / screw 158 arrangement described above with reference to FIG. 28. The assembly adjacent the hole 168 may include a pin 170 extending from a housing 178. At one longitudinal end (at least a portion of the boss 160 may be provided within the adjacent notch 154), the antenna substrate 102 may be clamped between the spacer 162 and the top of the boss 160 by a tightened screw 158. At the other longitudinal end, a pin 170 in a hole 168 may prevent movement within the xy plane.

[0078] In some embodiments, the antenna module 100 may be secured to a communications device at one or more points along the length of the antenna substrate 102, in addition to or instead of at the longitudinal ends of the antenna substrate 102. For example, FIGS. 31A and 31B are top and side cross-sectional views, respectively, of an antenna substrate 102 coupled to an antenna substrate mount 164, according to various embodiments. The antenna substrate 102 in FIG. 31 may be part of the antenna module 100, but for ease of illustration, only the antenna substrate 102 is shown in FIG. 31. The antenna substrate mount 164 in FIG. 31 has a boss 160 (on or part of the housing 178), a spacer 162 on the top surface of the boss 160, and a screw 158 that extends through a hole in the spacer 162 and threads into the thread of the boss 160. The outer shape of the boss 160 in FIG. 31 may have a square cross-section, and the spacer 162 may have a square recess on its bottom surface to partially encompass the boss 160 while being prevented from rotating around the boss 160. Tightened screws 158 may clamp the antenna substrate 102 between the spacer 162 and the top of the boss 160. In some embodiments, the antenna substrate 102 may not have a notch 154 along its longitudinal length (as shown), while in other embodiments, the antenna substrate 102 may have one or more notches 154 along its longitudinal edges.

[0079] In some embodiments, the antenna module 100 may be secured to a surface of a communications device such that the antenna module 100 (e.g., the array of antenna units 104 within the antenna module) is not parallel to the surface of the communications device. Generally, the antenna units 104 may be positioned at any desired angle relative to the housing 178 or other elements of the communications device. FIG. 32 shows an antenna board fixture 164 in which the antenna board 102 may be held at an angle relative to the surface of the housing 178 below it. The antenna board 102 in FIG. 32 may be part of the antenna module 100, but for ease of illustration, only the antenna board 102 is shown in FIG. 32. The antenna board fixture 164 may be similar to the antenna board fixtures of FIGS. 28, 30, and 31, but may have a boss 160 with an angled portion on which the antenna board 102 rests. Tightening the screws 158 may hold the antenna board 102 at a desired angle relative to the housing 178.

[0080] The antenna substrate 102, IC package 108, and other elements disclosed herein may be arranged in any suitable manner within the antenna module 100. For example, the antenna module 100 may have one or more connectors 105 for transmitting signals into and out of the antenna module 100. Figures 33 through 36 are exploded perspective views of an exemplary antenna module 100, according to various embodiments.

[0081] In the embodiment of FIG. 33 , the antenna substrate 102 includes four antenna units 104. The antenna units 104 may be disposed within the antenna substrate 102 according to any of the embodiments disclosed herein (e.g., on the bridge structure 124, with the recesses 130 / 132 rotated relative to the axis of the array, etc.). One or more connectors 105 may be disposed on the antenna substrate 102. As shown, the connectors 105 may be coaxial cable connectors or any other connectors (e.g., flat cable connectors, as described below with reference to FIGS. 37 and 38 ). The connectors 105 may be suitable for transmitting RF signals, for example. The IC package 108 may include a package substrate 134, one or more components 136 coupled to the package substrate 134, and a conformal shield 152 covering the components 136 and the package substrate 134. In some embodiments, the four antenna units 104 may provide a 1×4 array for 28 / 39 GHz communications or a 1×8 array of 60 GHz dipoles.

[0082] In the embodiment of FIG. 34 , the antenna substrate 102 has two sets of 16 antenna units 104, each arranged in a 4×4 array. The antenna units 104 may be arranged within the antenna substrate 102 according to any of the embodiments disclosed herein (e.g., on the bridge structure 124, with the recesses 130 / 132 rotated relative to the axis of the array, etc.). The antenna module 100 of FIG. 34 has two IC packages 108. One IC package 108 is associated with (disposed on) one set of antenna units 104, and the other IC package 108 is associated with (disposed on) the other set of antenna units 104. In some embodiments, one set of antenna units 104 may support 28 GHz communication, and the other set of antenna units 104 may support 39 GHz communication. The IC package 108 may include a package substrate 134, one or more components 136 coupled to the package substrate 134, and a conformal shield 152 covering the components 136 and the package substrate 134. One or more connectors 105 may be disposed on the package substrate 134. The connectors 105 may be coaxial cable connectors, as shown, or any other connectors (e.g., flat cable connectors, as described below with reference to Figures 37 and 38). The conformal shield 152 may not extend over the connectors 105. In some embodiments, the antenna module 100 of Figure 34 may be suitable for use in routers and customer premises equipment (CPE). In some embodiments, the outer dimensions of the antenna substrate 102 may be approximately 22 millimeters by approximately 40 millimeters.

[0083] In the embodiment of FIG. 35 , the antenna substrate 102 has two sets of four antenna units 104, each arranged in a 1×4 array. In some embodiments, one set of antenna units 104 may support 28 GHz communication, and the other set of antenna units 104 may support 39 GHz communication. The antenna units 104 may be arranged within the antenna substrate 102 according to any of the embodiments disclosed herein (e.g., on the bridge structure 124, with the recesses 130 / 132 rotated relative to the axis of the array, etc.). One or more connectors 105 may be arranged on the antenna substrate 102. As shown, the connectors 105 may be coaxial cable connectors or any other connectors (e.g., flat cable connectors, as described below with reference to FIGS. 37 and 38 ). The antenna module 100 of FIG. 35 has two IC packages 108. One IC package 108 is associated with (disposed on) one set of antenna units 104, and the other IC package 108 is associated with (disposed on) the other set of antenna units 104. The IC packages 108 may include a package substrate 134, one or more components 136 coupled to the package substrate 134, and a conformal shield 152 covering the components 136 and the package substrate 134. In some embodiments, the outer dimensions of the antenna substrate 102 may be approximately 5 millimeters by approximately 32 millimeters.

[0084] In the embodiment of FIG. 36 , the antenna substrate 102 has two sets of 16 antenna units 104, each arranged in a 4×4 array. The antenna units 104 may be arranged within the antenna substrate 102 according to any of the embodiments disclosed herein (e.g., on the bridge structure 124, with the recesses 130 / 132 rotated relative to the axis of the array, etc.). The antenna module 100 of FIG. 36 has four IC packages 108. Two IC packages 108 are associated with (disposed on) one set of antenna units 104, and two other IC packages 108 are associated with (disposed on) the other set of antenna units 104. The IC packages 108 may include a package substrate 134, one or more components 136 coupled to the package substrate 134, and a conformal shield (not shown) covering the components 136 and the package substrate 134. One or more connectors 105 may be arranged on the antenna substrate 102. These connectors 105 may be coaxial cable connectors as shown, or any other connectors (eg, flat cable connectors, as described below with reference to Figures 37 and 38).

[0085] 37A and 37B are top and bottom perspective views, respectively, of another exemplary antenna module 100, according to various embodiments. In the embodiment of FIG. 37, an antenna substrate 102 has two sets of four antenna units 104, each arranged in a 1×4 array. The antenna units 104 may be arranged within the antenna substrate 102 according to any of the embodiments disclosed herein (e.g., on the bridge structure 124, with the recesses 130 / 132 rotated relative to the axis of the array, etc.). One or more connectors 105 may be arranged on the antenna substrate 102. The connectors 105 may be flat cable connectors (e.g., flexible printed circuit (FPC) cable connectors) to which a flat cable 196 may be coupled. The antenna module 100 of FIG. 35 has two IC packages 108. One IC package 108 is associated with (disposed on) one set of antenna units 104, and the other IC package 108 is associated with (disposed on) the other set of antenna units 104. The antenna module 100 of FIG. 35 may also have notches 154 on both longitudinal edges. FIG. 37A shows the antenna module 100 secured with the antenna board fixture 164 of FIG. 28 (both longitudinal edges) and the antenna board fixture 164 of FIG. 31 (middle portion). In some embodiments, the antenna unit 104 of the antenna module 100 of FIG. 37 may use the edge proximate to the antenna board 102 for vertically and horizontally polarized edge-fire antennas. In such embodiments, the conformal shield 152 of the IC package 108 may act as a reference. More generally, the antenna units 104 disclosed herein may be used for broadside or edge-fire applications, as appropriate.

[0086] Any suitable communications device may include one or more antenna modules 100 disclosed herein. For example, FIG. 38 is a perspective view of a handheld communications device 198 including an antenna module 100, according to various embodiments. Specifically, FIG. 38 shows the antenna module 100 (and associated antenna board mount 164) of FIG. 37 coupled to a housing 178 of the handheld communications device 198 (which may be the communications device 151 of FIG. 22). In some embodiments, the handheld communications device 198 may be a smartphone.

[0087] FIG. 39 is a perspective view of a notebook communication device 190 including multiple antenna modules 100, according to various embodiments. Specifically, FIG. 38 shows an antenna module 100 with four antenna units 104 on either side of the keyboard of the notebook communication device 190. The antenna units 104 may occupy an area on the exterior housing of the notebook communication device 190. The area may be equal to or less than the area required for approximately two adjacent Universal Serial Bus (USB) connectors (i.e., approximately 5 millimeters high by 22 millimeters wide by 2.2 millimeters deep). The antenna module 100 of FIG. 39 may be adjusted for operation within the housing (e.g., ABS plastic) of the device 190. In some embodiments, the antenna module 100 within the device 190 may be tilted at a desired angle relative to the housing of the device 190.

[0088] The antenna module 100 included in a communication device (eg, a fixed wireless access device) may comprise an antenna array having any desired number of antenna units 104 (eg, 4×8 antenna units 104).

[0089] Although various of the accompanying figures show the antenna substrate 102 having a larger footprint than the IC package 108, the antenna substrate 102 and the IC package 108 (which may be, for example, a SiP) may have any suitable relative dimensions. For example, in some embodiments, the footprint of the IC package 108 in the antenna module 100 may be larger than the footprint of the antenna substrate 102. Such an embodiment may be true, for example, when the IC package 108 includes multiple dies as components 136.

[0090] The antenna modules 100 disclosed herein may include or be included in any suitable electronic components. Figures 40 through 43 show various examples of devices that may include or be included in any of the antenna modules 100 disclosed herein.

[0091] FIG. 40 is a top view of a wafer 1500 and die 1502 that may be included in any of the antenna modules 100 disclosed herein. For example, the die 1502 may be included in the IC package 108 (e.g., as component 136) or the antenna unit 104. The wafer 1500 may be composed of a semiconductor material and may include one or more die 1502 having IC structures formed on the surface of the wafer 1500. Each die 1502 may be a repeating unit of a semiconductor product, including any suitable IC. After semiconductor product fabrication is complete, the wafer 1500 may undergo a dicing process to separate the die 1502 from one another and provide individual "chips" of the semiconductor product. The die 1502 may include one or more transistors (e.g., a portion of transistor 1640 in FIG. 41 , described below) and / or support circuitry that transmits electrical signals to the transistors, as well as any other IC components. In some embodiments, wafer 1500 or die 1502 may include memory devices (e.g., random access memory (RAM) devices, such as static RAM (SRAM) devices, magnetic RAM (MRAM) devices, resistive RAM (RRAM) devices, conductive bridge RAM (CBRAM) devices, etc.), logic devices (e.g., AND, OR, NAND, or NOR gates), or any suitable circuit elements. Multiple of these devices may be combined on a single die 1502. For example, a memory array formed of multiple memory devices may be formed on the same die 1502, as may a processing device (e.g., processing device 1802 of FIG. 43 ) or other logic configured to store information in the memory devices or execute instructions stored in the memory array.

[0092] FIG. 41 is a cross-sectional side view of an IC device 1600 that may be included in any of the antenna modules 100 disclosed herein. For example, the IC device 1600 may be included in an IC package 108 (e.g., as a component 136). The IC device 1600 may be formed on a substrate 1602 (e.g., wafer 1500 of FIG. 40) or included in a die (e.g., die 1502 of FIG. 40). The substrate 1602 may be a semiconductor substrate composed of a semiconductor material system. The material system may include, for example, an n-type or p-type material system (or a combination of both). The substrate 1602 may include, for example, a crystalline substrate formed using bulk silicon or a silicon-on-insulator (SOI) substructure. In some embodiments, the substrate 1602 may be formed using alternative materials. These may or may not be combined with silicon and include, but are not limited to, germanium, indium antimonide, lead telluride, indium arsenide, indium phosphide, gallium arsenide, or gallium antimonide. Additionally, materials classified as II-VI, III-V, or IV may also be used to form substrate 1602. While some examples of materials from which substrate 1602 may be formed are provided herein, any material that may form the basis of IC device 1600 may be used. Substrate 1602 may be part of a singulated die (e.g., die 1502 of FIG. 40) or a wafer (e.g., wafer 1500 of FIG. 40).

[0093] The IC device 1600 may include one or more device layers 1604 disposed on a substrate 1602. The device layer 1604 may include features of one or more transistors 1640 (e.g., metal-oxide-semiconductor field-effect transistors (MOSFETs)) formed on the substrate 1602. The device layer 1604 may include, for example, one or more source and / or drain (S / D) regions 1620, a gate 1622 that controls current flow of the transistor 1640 between the S / D regions 1620, and one or more S / D contacts 1624 that transmit electrical signals to / from the S / D regions 1620. The transistor 1640 may include additional features such as device isolation regions, gate contacts, and the like, which are not shown for purposes of clarity. The transistor 1640 is not limited to the type and configuration shown in FIG. 41 but may include a variety of other types and configurations, such as, for example, planar transistors, non-planar transistors, or a combination of both. Planar transistors can include bipolar junction transistors (BJTs), heterojunction bipolar transistors (HBTs), or high electron mobility transistors (HEMTs). Non-planar transistors can include FinFET transistors, such as double-gate or tri-gate transistors, and wrap-around or all-around gate transistors, such as nanoribbon and nanowire transistors.

[0094] Each transistor 1640 may include a gate 1622 formed of at least two layers: a gate dielectric and a gate electrode. The gate dielectric may include one layer or a stack of layers. One or more layers may include silicon oxide, silicon dioxide, silicon carbide, and / or a high-k dielectric material. The high-k dielectric material may include elements such as hafnium, silicon, oxygen, titanium, tantalum, lanthanum, aluminum, zirconium, barium, strontium, yttrium, lead, scandium, niobium, and zinc. Examples of high-k materials that may be used in the gate dielectric include, but are not limited to, hafnium oxide, hafnium silicon oxide, lanthanum oxide, lanthanum aluminum oxide, zirconium oxide, zirconium silicon oxide, tantalum oxide, titanium oxide, barium strontium titanium oxide, barium titanium oxide, strontium titanium oxide, yttrium oxide, aluminum oxide, lead scandium tantalum oxide, and lead zinc niobate. In some embodiments, an annealing process may be performed on the gate dielectric to improve its quality if a high-k material is used.

[0095] A gate electrode may be formed on the gate dielectric and may include at least one p-type work function metal or n-type work function metal, depending on whether transistor 1640 is intended to be a p-type metal oxide semiconductor (PMOS) or n-type metal oxide semiconductor (NMOS) transistor. In some implementations, the gate electrode may consist of a stack of two or more metal layers, where one or more metal layers are work function metal layers and at least one metal layer is a fill metal layer. Additional metal layers may be included for other purposes, such as barrier layers. For PMOS transistors, metals that may be used for the gate electrode include, but are not limited to, ruthenium, palladium, platinum, cobalt, nickel, conductive metal oxides (e.g., ruthenium oxide), and any of the metals described below for NMOS transistors (e.g., for work function tuning). For NMOS transistors, metals that may be used for the gate electrode include, but are not limited to, hafnium, zirconium, titanium, tantalum, aluminum, alloys of these metals, carbides of these metals (e.g., hafnium carbide, zirconium carbide, titanium carbide, tantalum carbide, and aluminum carbide), and any of the metals described above for PMOS transistors (e.g., for work function tuning).

[0096] In some embodiments, when viewed as a cross-section of transistor 1640 along the source-channel-drain direction, the gate electrode can be comprised of a U-shaped structure, including a bottom portion substantially parallel to the surface of the substrate and two sidewalls substantially perpendicular to the top surface of the substrate. In another embodiment, at least one of the metal layers forming the gate electrode can simply be a planar layer substantially parallel to the top surface of the substrate and does not include sidewalls substantially perpendicular to the top surface of the substrate. In another embodiment, the gate electrode can be comprised of a combination of a U-shaped structure and a planar, non-U-shaped structure. For example, the gate electrode can be comprised of one or more U-shaped metal layers formed on one or more planar, non-U-shaped layers.

[0097] In some embodiments, pairs of sidewall spacers sandwiching the gate stack may be formed on opposing surfaces of the gate stack. The sidewall spacers may be formed from materials such as silicon nitride, silicon oxide, silicon carbide, carbon-doped silicon nitride, and silicon oxynitride. Processes for forming sidewall spacers are well known in the art and generally include deposition and etching steps. In some embodiments, multiple spacer pairs may be used. For example, two, three, or four pairs of sidewall spacers may be formed on opposing surfaces of the gate stack.

[0098] The S / D regions 1620 may be formed in the substrate 1602 adjacent to the gate 1622 of each transistor 1640. The S / D regions 1620 may be formed using, for example, an implantation / diffusion process or an etching / deposition process. In the former process, dopants such as boron, aluminum, antimony, phosphorus, or arsenic may be ion-implanted into the substrate 1602 to form the S / D regions 1620. An annealing process may be performed after the ion-implantation process to activate the dopants and further diffuse them into the substrate 1602. In the latter process, the substrate 1602 may first be etched to form recesses at the locations of the S / D regions 1620. An epitaxial deposition process may then be performed to fill the recesses with the material used to create the S / D regions 1620. In some forms, the S / D regions 1620 may be created using silicon germanium or a silicon alloy such as silicon carbide. In some embodiments, epitaxially deposited silicon alloys may be doped in situ with dopants such as boron, arsenic, or phosphorus. In some embodiments, S / D regions 1620 may be formed using one or more alternative semiconductor materials, such as germanium or III-V materials or alloys. In further embodiments, one or more layers of metal and / or metal alloys may be used to form S / D regions 1620.

[0099] Electrical signals, such as power and / or input / output (I / O) signals, may be transmitted to and / or from devices (e.g., transistor 1640) in device layer 1604 through one or more interconnect layers (shown as interconnect layers 1606-1610 in FIG. 41 ) disposed on device layer 1604. For example, electrically conductive features (e.g., gate 1622 and S / D contacts 1624) in device layer 1604 may be electrically coupled with interconnect structures 1628 in interconnect layers 1606-1610. One or more interconnect layers 1606-1610 may form a metallization stack (also referred to as an “ILD stack”) 1619 of IC device 1600.

[0100] Interconnect structures 1628 are disposed within interconnect layers 1606 through 1610 and may transmit electrical signals according to a variety of designs. (In particular, the arrangement is not limited to the specific configuration of interconnect structures 1628 shown in FIG. 41.) While a specific number of interconnect layers 1606 through 1610 are shown in FIG. 41, embodiments of the present disclosure include IC devices having more or fewer interconnect layers than shown.

[0101] In some embodiments, the interconnect structures 1628 may include lines 1628a and / or vias 1628b filled with a conductive material, such as a metal. The lines 1628a may be arranged to carry electrical signals in a plane substantially parallel to the surface of the substrate 1602 on which the device layer 1604 is formed. For example, the lines 1628a may carry electrical signals in a direction into and out of the page, from the perspective of FIG. 41 . The vias 1628b may be arranged to carry electrical signals in a plane substantially perpendicular to the surface of the substrate 1602 on which the device layer 1604 is formed. In some embodiments, the vias 1628b may electrically interconnect the lines 1628a of different interconnect layers 1606-1610.

[0102] 41, the interconnect layers 1606-1610 may include a dielectric material 1626 disposed between interconnect structures 1628. In some embodiments, the dielectric material 1626 disposed between the interconnect structures 1628 of different ones of the interconnect layers 1606-1610 may have different compositions, while in other embodiments, the composition of the dielectric material 1626 between different interconnect layers 1606-1610 may be the same.

[0103] A first interconnect layer 1606 can be formed above the device layer 1604. In some embodiments, the first interconnect layer 1606 can include lines 1628a and / or vias 1628b as shown. The lines 1628a of the first interconnect layer 1606 can be coupled to contacts (e.g., S / D contacts 1624) of the device layer 1604.

[0104] A second interconnect layer 1608 can be formed above the first interconnect layer 1606. In some embodiments, the second interconnect layer 1608 can include vias 1628b coupling lines 1628a of the second interconnect layer 1608 to lines 1628a of the first interconnect layer 1606. Although the lines 1628a and the vias 1628b are structurally defined by lines within each interconnect layer (e.g., within the second interconnect layer 1608) for purposes of clarity, in some embodiments the lines 1628a and the vias 1628b can be structurally and / or materially continuous (e.g., can be filled simultaneously during a dual damascene process).

[0105] The third interconnect layer 1610 (and optionally additional interconnect layers) may be formed successively on the second interconnect layer 1608 according to similar techniques and configurations described with respect to the second interconnect layer 1608 or the first interconnect layer 1606. In some embodiments, interconnect layers that are "higher" in the metallization stack 1619 in the IC device 1600 (i.e., further from the device layer 1604) may be thicker.

[0106] The IC device 1600 may have a solder resist material 1634 (e.g., polyimide or a similar material) and one or more conductive contacts 1636 formed on the interconnect layers 1606 to 1610. In FIG. 41 , the conductive contacts 1636 are shown to take the form of bond pads. The conductive contacts 1636 may be electrically coupled to the interconnect structure 1628 and configured to transmit electrical signals from the transistor 1640 to other external devices. For example, solder joints may be formed on the one or more conductive contacts 1636 to mechanically and / or electrically couple a chip including the IC device 1600 to other components (e.g., a circuit board). The IC device 1600 may include additional or alternative structures that transmit electrical signals from the interconnect layers 1606 to 1610. For example, the conductive contacts 1636 may include other similar features (e.g., posts) that transmit electrical signals to external components.

[0107] 42 is a cross-sectional side view of an IC device assembly 1700 that may include one or more antenna modules 100 disclosed herein. Specifically, any suitable antenna module 100 disclosed herein may replace any of the components of the IC device assembly 1700 (e.g., an antenna module 100 may replace any of the IC packages of the IC device assembly 1700).

[0108] The IC device assembly 1700 has multiple components disposed on a circuit board 1702 (which may be, for example, a motherboard). The IC device assembly 1700 includes components disposed on a first side 1740 of the circuit board 1702 and an opposite second side 1742 of the circuit board 1702. In general, components may be disposed on one or both of the sides 1740 and 1742.

[0109] In some embodiments, circuit board 1702 may be a PCB including multiple metal layers spaced apart by layers of dielectric material and interconnected by conductive vias. Any one or more of the metal layers may be formed (optionally in conjunction with other metal layers) to carry electrical signals between components coupled to circuit board 1702 in a desired circuit pattern. In another embodiment, circuit board 1702 may be a non-PCB substrate.

[0110] The IC device assembly 1700 shown in Figure 42 has a package-on-interposer structure 1736 coupled to a first surface 1740 of a circuit board 1702 by coupling components 1716. The coupling components 1716 may electrically and mechanically couple the package-on-interposer structure 1736 to the circuit board 1702 and may include solder balls (shown in Figure 42), male and female sockets, adhesive, underfill material, and / or any other electrical and / or mechanical coupling structure.

[0111] The package-on-interposer structure 1736 may include an IC package 1720 coupled to the interposer 1704 by a coupling component 1718. The coupling component 1718 may take any suitable form depending on the application, such as those described above with reference to the coupling component 1716. While a single IC package 1720 is shown in FIG. 42 , multiple IC packages may be coupled to the interposer 1704. Indeed, additional interposers may be coupled to the interposer 1704. The interposer 1704 may provide an intermediate substrate used to bridge the circuit board 1702 and the IC package 1720. The IC package 1720 may be or include, for example, a die (such as the die 1502 in FIG. 40 ), an IC device (such as the IC device 1600 in FIG. 41 ), or any suitable component. Generally, the interposer 1704 may spread connections to a wider pitch or reroute connections to different connections. For example, the interposer 1704 may couple an IC package 1720 (e.g., a die) to a set of ball grid array (BGA) conductive contacts of the mating component 1716 for coupling to the circuit board 1702. In the embodiment shown in Figure 42, the IC package 1720 and the circuit board 1702 are each mounted on opposite sides of the interposer 1704. In another embodiment, the IC package 1720 and the circuit board 1702 may each be mounted on the same side of the interposer 1704. In some embodiments, the interposer 1704 may couple three or more components.

[0112] In some embodiments, the interposer 1704 may be a PCB including multiple metal layers separated from one another by layers of dielectric material and interconnected by conductive vias. In some embodiments, the interposer 1704 may be formed from a polymeric material such as epoxy, glass-reinforced epoxy, epoxy with inorganic fillers, ceramic material, or polyimide. In some embodiments, the interposer 1704 may be formed from alternating rigid or flexible materials, including the same materials described above for use in semiconductor substrates. Examples include silicon, germanium, and other III-V and IV materials. The interposer 1704 may include vias 1710, including, but not limited to, metal interconnects 1708 and through-silicon vias (TSVs) 1706. The interposer 1704 may further include embedded devices 1714, including both passive and active devices. Such devices may include, but are not limited to, capacitors, decoupling capacitors, resistors, inductors, fuses, diodes, transformers, sensors, electrostatic discharge (ESD) devices, and memory devices. More complex devices such as RF devices, power amplifiers, power management devices, antennas, arrays, sensors, and micro electro mechanical system (MEMS) devices may also be formed on the interposer 1704. The package-on-interposer structure 1736 may take the form of any package-on-interposer structure known in the art.

[0113] IC device assembly 1700 may include an IC package 1724 coupled to a first surface 1740 of circuit board 1702 by a coupling component 1722. Coupling component 1722 may take the form of any of the embodiments described above with reference to coupling component 1716, and IC package 1724 may take the form of any of the embodiments described above with reference to IC package 1720.

[0114] 42 has a package-on-package structure 1734 coupled to a second surface 1742 of a circuit board 1702 by a coupling component 1728. The package-on-package structure 1734 may include an IC package 1726 and an IC package 1732 coupled together by a coupling component 1730 such that the IC package 1726 is disposed between the circuit board 1702 and the IC package 1732. The coupling components 1728 and 1730 may take the form of any of the embodiments of the coupling component 1716 described above, and the IC packages 1726 and 1732 may take the form of any of the embodiments of the IC package 1720 described above. The package-on-package structure 1734 may take the form of any of the package-on-package structures known in the art.

[0115] FIG. 43 is a block diagram of an exemplary communication device 1800 that may include one or more antenna modules 100 according to any of the embodiments disclosed herein. Communication device 151 ( FIG. 22 ), handheld communication device 198 ( FIG. 38 ), and notebook communication device 190 ( FIG. 39 ) may be examples of communication device 1800. Any appropriate component of communication device 1800 may include one or more of IC package 1650, IC device 1600, or die 1502 disclosed herein. While multiple components are shown included in communication device 1800 in FIG. 43 , any one or more of these components may be omitted or duplicated depending on the application. In some embodiments, some or all of the components included in communication device 1800 may be mounted on one or more motherboards. In some embodiments, some or all of these components may be fabricated on a single system-on-chip (SoC) die.

[0116] 43 , but may have interface circuitry for coupling to one or more of those components. For example, the communications device 1800 may not have a display device 1806, but may have display device interface circuitry (e.g., connectors and driver circuits) to which the display device 1806 may be coupled. In various other examples, the communications device 1800 may not have an audio input device 1824 or an audio output device 1808, but may have audio input or output device interface circuitry (e.g., connectors and supporting circuits) to which the audio input device 1824 or the audio output device 1808 may be coupled.

[0117] The communications device 1800 may have a processing device 1802 (e.g., one or more processing devices). As used herein, the term “processing device” or “processor” may refer to any device or portion of a device that processes electronic data from registers and / or memory and converts the electronic data into other electronic data that may be stored in registers and / or memory. The processing device 1802 may include one or more digital signal processors (DSPs), application specific integrated circuits (ASICs), central processing units (CPUs), graphics processing units (GPUs), cryptoprocessors (dedicated processors that perform cryptographic logic in hardware), server processors, or any other suitable processing devices. The communications device 1800 may include memory 1804. The memory 1804 may itself include one or more memory devices, such as volatile memory (e.g., dynamic random access memory (DRAM)), non-volatile memory (e.g., read-only memory (ROM)), flash memory, solid-state memory, and / or a hard drive. In some embodiments, the memory 1804 may include memory that shares a die with the processing device 1802. This memory may be used as cache memory and may include embedded dynamic random access memory (eDRAM) or spin-transfer magnetoresistive memory (STT-MRAM).

[0118] In some embodiments, the communication device 1800 may include a communication module 1812 (e.g., one or more communication modules). For example, the communication module 1812 may be configured to manage wireless communications for data transfer to or from the communication device 1800. The term "wireless" and its derivatives may be used to describe circuits, devices, systems, methods, techniques, communication channels, etc. that may perform data communication using modulated electromagnetic radiation through a non-solid medium. This term does not imply that the associated device does not include any wires, although in some embodiments it may not. The communication module 1812 may be or include any of the antenna modules 100 disclosed herein.

[0119] The communications module 1812 may implement any of a number of wireless standards or protocols, including, but not limited to, Wi-Fi (e.g., the IEEE 802.11 family), Institute for Electrical and Electronic Engineers (IEEE) standards, including the IEEE 802.16 standard (e.g., the IEEE 802.16-2005 amendment), and the LTE project (e.g., the Advanced LTE project, the Ultra Mobile Broadband (UMB) project (also known as "3GPP2")) with any amendments, updates, and / or revisions. IEEE 802.16-compatible broadband wireless access (BWA) networks are commonly referred to as WiMAX® networks. This acronym stands for Worldwide Interoperability for Microwave Access, and is a certification mark for products that have passed IEEE 802.16 standard compliance and interoperability testing. The communications module 1812 may operate in accordance with Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Universal Mobile Telecommunications System (UMTS), High Speed ​​Packet Access (HSPA), Evolved HSPA (E-HSPA), or LTE networks. The communications module 1812 may operate in accordance with Enhanced Data for GSM Evolution (EDGE), GSM EDGE Radio Access Network (GERAN), Universal Terrestrial Radio Access Network (UTRAN), or Evolved UTRAN (E-UTRAN). The communications module 1812 may operate in accordance with Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Evolution Data Optimized (EV-DO), and any other wireless protocols designated as such, including derivatives, 3G, 4G, 5G, and beyond. In other embodiments, the communications module 1812 may operate according to other wireless protocols.The communications device 1800 may include an antenna 1822 for improving wireless communications and / or receiving other wireless communications (such as AM or FM radio transmissions).

[0120] In some embodiments, the communications module 1812 may manage wired communications, such as electrical, optical, or any other suitable communications protocol (e.g., Ethernet). As described above, the communications module 1812 may include multiple communications modules. For example, the first communications module 1812 may be dedicated to short-range wireless communications, such as Wi-Fi or Bluetooth. The second communications module 1812 may be dedicated to longer-range wireless communications, such as Global Positioning System (GPS), EDGE, GPRS, CDMA, WiMAX, LTE, or EV-DO. In some embodiments, the first communications module 1812 may be dedicated to wireless communications, and the second communications module 1812 may be dedicated to wired communications. In some embodiments, the communications module 1812 may include an antenna module 100 that supports millimeter wave communications.

[0121] Communications device 1800 may include battery / power circuitry 1814. Battery / power circuitry 1814 may include one or more power storage devices (e.g., batteries or capacitors) and / or circuitry for coupling components of communications device 1800 to a power source (e.g., AC line power) separate from communications device 1800.

[0122] The communications device 1800 may include a display device 1806 (or corresponding interface circuitry, as described above). The display device 1806 may include any visual indicator, such as a heads-up display, a computer monitor, a projector, a touchscreen display, a liquid crystal display (LCD), a light-emitting diode display, or a flat panel display.

[0123] The communications device 1800 may include an audio output device 1808 (or corresponding interface circuitry as described above). The audio output device 1808 may include any device that produces an audible indication, such as a speaker, a headset, or earphones.

[0124] Communications device 1800 may include audio input device 1824 (or corresponding interface circuitry as described above), which may include any device that generates a signal representing sound, such as a microphone, a microphone array, or a digital device (e.g., a device with a musical instrument digital interface (MIDI) output).

[0125] Communications device 1800 may include a GPS device 1818 (or corresponding interface circuitry as described above), which may communicate with a satellite-based system and receive the location of communications device 1800, as is well known in the art.

[0126] The communications device 1800 may include other output devices 1810 (or corresponding interface circuitry as described above). Examples of other output devices 1810 may include an audio codec, a video codec, a printer, a wired or wireless transmitter for providing information to other devices, or an additional storage device.

[0127] The communications device 1800 may include other input devices 1820 (or corresponding interface circuitry as described above). Examples of the other input devices 1820 may include an accelerometer, a gyroscope, a compass, an image capture device, a keyboard, a cursor control device such as a mouse, a stylus, a touchpad, a barcode reader, a quick response (QR) code reader, any sensor, or a radio frequency identification tag (RFID) reader.

[0128] Communications device 1800 may take any desired form, such as a handheld or mobile communications device (e.g., a mobile phone, a smartphone, a mobile internet device, a music player, a tablet computer, a notebook computer, a netbook computer, an ultrabook computer, a personal digital assistant (PDA), an ultramobile personal computer, etc.), a desktop communications device, a server or other network computing component, a printer, a scanner, a monitor, a set-top box, an entertainment control unit, a vehicle control unit, a digital camera, a digital video recorder, or a wearable communications device. In some embodiments, communications device 1800 may be any other electronic device that processes data.

[0129] The following paragraphs provide examples of various embodiments disclosed herein.

[0130] Example 1 is an electronic assembly comprising an antenna module having an antenna patch support including a flexible portion, an integrated circuit (IC) package coupled to the antenna patch support, and an antenna patch coupled to the antenna patch support.

[0131] Example 2 includes the subject matter of Example 1 and further specifies that the antenna patch is a millimeter-wave antenna patch.

[0132] Example 3 includes the subject matter of any of Examples 1-2, and further specifies that the IC package and the antenna patch are coupled to opposing surfaces of the antenna patch support.

[0133] Example 4 includes the subject matter of any of Examples 1 to 3, and further specifies that the IC package is coupled to a first portion of the antenna patch support, the antenna patch is coupled to a second portion of the antenna patch support, and the flexible portion is between the first portion and the second portion.

[0134] Example 5 includes the subject matter of Example 4, and further specifies that the plane of the first region is not parallel to the plane of the second region.

[0135] Example 6 includes the subject matter of Example 5, and further specifies that the plane of the first region is not perpendicular to the plane of the second region.

[0136] Example 7 includes the subject matter of any of Examples 1-3, and further specifies that the antenna patch is coupled to the flexible portion.

[0137] Example 8 includes the subject matter of any of Examples 1 to 7, and further specifies that the flexible portion is a first flexible portion, the antenna patch support portion further has a second flexible portion and a rigid portion, and the rigid portion is between the first flexible portion and the second flexible portion.

[0138] Example 9 includes the subject matter of any of Examples 1 to 8, and further specifies that the flexible portion includes a flexible printed circuit board.

[0139] Example 10 includes the subject matter of any of Examples 1-9, further including a connector on the flexible portion.

[0140] Example 11 includes the subject matter of Example 10, and further specifies that the connector is a first connector, and the electronic assembly further comprises a circuit board having a second connector that mates with the first connector.

[0141] Example 12 includes the subject matter of any of Examples 1-11, and further specifies that the IC package and the antenna patch are coupled to the same surface of the antenna patch support.

[0142] Example 13 includes the subject matter of any of Examples 1-12, and further specifies that the thickness of the flexible portion is less than the thickness of the remainder of the antenna patch support portion.

[0143] Example 14 includes the subject matter of any of Examples 1 to 13, and further specifies that the electronic assembly is a communications device, the communications device comprising a housing, the housing having a window, and the antenna patch proximate to the window.

[0144] Example 15 includes the subject matter of any of Examples 1-14, further comprising a display, and specifying that the plane of the antenna patch is neither perpendicular nor parallel to the plane of the display.

[0145] Example 16 includes the subject matter of any of Examples 1 to 15, and further specifies that the antenna module is a first antenna module, and the electronic assembly further includes a second antenna module, the second antenna module having an antenna patch support, an IC package coupled to the antenna patch support of the second antenna module, and an antenna patch coupled to the antenna patch support of the second antenna module.

[0146] Example 17 includes the subject matter of Example 16, and further specifies that the first antenna module includes a first array of antenna patches, the second antenna module includes a second array of antenna patches, and an axis of the first array is perpendicular to an axis of the second array.

[0147] Example 18 includes the subject matter of any of Examples 1-17, and further specifies that the antenna patch is one of a plurality of antenna patches of the antenna module.

[0148] Example 19 includes the subject matter of Example 18 and further specifies that the IC package has a conformal shield.

[0149] Example 20 includes the subject matter of Example 19, and further specifies that the conformal shield provides a reflector or ground plane for multiple antenna patches acting as an edge-fire array.

[0150] Example 21 is an electronic assembly comprising: an antenna module having an integrated circuit (IC) package, an antenna substrate, and a first connector, the IC package coupled to the antenna substrate, the antenna substrate having an antenna patch array, and the first connector secured to a rigid portion of the IC package or the antenna substrate; and a circuit board having a second connector, the second connector secured to a rigid portion of the circuit board, and the first connector mated to the second connector.

[0151] Example 22 includes the subject matter of Example 21, and further specifies that the first connector mates with the second connector without an intervening cable.

[0152] Example 23 includes the subject matter of any of Examples 21 to 22, and further specifies that the antenna module is coupled to the circuit board via a first connector mated to the second connector, and the antenna board is between the array of antenna patches and the circuit board.

[0153] Example 24 includes the subject matter of any of Examples 21-23, and further specifies that the device includes a display, and wherein at least a portion of the circuit board is between at least a portion of the antenna module and the display.

[0154] Example 25 includes the subject matter of any of Examples 21 to 24, and further specifies that the electronic assembly is a handheld communication device.

[0155] Example 26 includes the subject matter of any of Examples 21-25, and further specifies that the first connector and the second connector are radio frequency connectors.

[0156] Example 27 is a communications device comprising a display, a back cover, and an antenna array between the back cover and the display, wherein the plane of the antenna array is not parallel to the display or the back cover.

[0157] Example 28 includes the subject matter of Example 27, and further specifies that the antenna array is a first antenna array, and the communications device further comprises a second antenna array between the back cover and the display, and a plane of the second antenna array is not parallel to a plane of the first antenna array.

[0158] Example 29 includes the subject matter of Example 28, and further specifies that the plane of the second antenna array is perpendicular to the plane of the first antenna array.

[0159] Example 30 includes the subject matter of Example 28, and further specifies that the plane of the second antenna array is not perpendicular to the plane of the first antenna array.

[0160] Example 31 includes the subject matter of Example 28, and further specifies that the plane of the second antenna array is parallel to the display.

[0161] Example 32 includes the subject matter of any of Examples 27-31, further comprising a housing providing a side surface for the communication device.

[0162] Example 33 includes the subject matter of Example 32, and further specifies that the plane of the antenna array is parallel to a near side of the communication device.

[0163] Example 34 includes the subject matter of Example 32, and further specifies that the plane of the antenna array is not parallel to a near side of the communication device.

[0164] Example 35 includes the subject matter of any of Examples 32-34, and further specifies that the housing has a window on at least one side of the communication device.

[0165] Example 36 includes the subject matter of any of Examples 27-35, and further specifies that the antenna array is coupled to an antenna patch support having a flexible portion.

[0166] Example 37 includes the subject matter of any of Examples 27 to 36, and further specifies that the antenna array is a millimeter-wave antenna array.

[0167] Example 38 includes the subject matter of any of Examples 27-37, and further specifies that the communication device is a handheld communication device.

[0168] Example 39 includes the subject matter of any of Examples 27-38, and further specifies that the communication device is a tablet computer.

[0169] Example 40 is a method of manufacturing a communication device, the method including: placing an antenna module having at least one flexible portion within a housing of the communication device; and bending the at least one flexible portion.

[0170] Example 41 includes the subject matter of Example 40, further including fixing the antenna module within the communication device to maintain bending of the at least one flexible portion.

[0171] Example 42 includes the subject matter of Example 41, and further specifies that the antenna module comprises at least one antenna unit on the flexible portion.

[0172] Example 43 includes the subject matter of any of Examples 41 to 42, and further specifies that bending the at least one flexible portion includes folding the at least one flexible portion to cover an integrated circuit (IC) package of the antenna module.

[0173] Example 44 includes the subject matter of any of Examples 41-42, further including coupling the antenna module to a circuit board of the communication device.

Claims

1. an antenna patch support portion including a flexible portion and other portions; an integrated circuit (IC) package coupled to the antenna patch support; an antenna module having an antenna patch coupled to the antenna patch support portion, wherein the flexible portion is thinner than the other portion; An electronic assembly, wherein the IC package has a conformal shield that provides a reflector or ground plane for multiple antenna patches acting as an edge-fire array.

2. 2. The electronic assembly of claim 1, wherein the IC package and the antenna patch are coupled to opposite surfaces of the antenna patch support.

3. the other portion is a first portion, the IC package is coupled to the first portion of the antenna patch support; the antenna patch is coupled to a second portion of the antenna patch support; The electronic assembly of claim 1 , wherein the flexible portion is between the first portion and the second portion.

4. 4. The electronic assembly of claim 3, wherein the plane of the first portion is not parallel to the plane of the second portion.

5. 5. The electronic assembly of claim 4, wherein the plane of the first portion is not perpendicular to the plane of the second portion.

6. The electronic assembly of claim 1 , wherein the antenna patch is coupled to the flexible portion.

7. 2. The electronic assembly of claim 1, wherein the flexible portion is a first flexible portion, and the antenna patch support further comprises a second flexible portion and a rigid portion, the rigid portion being between the first flexible portion and the second flexible portion.

8. 2. The electronic assembly of claim 1, wherein the IC package and the antenna patch are bonded to the same surface of the antenna patch support.

9. An electronic assembly according to any one of claims 1 to 8; The display and a back cover; the plurality of antenna patches comprise an antenna array between the back cover and the display; A communications device, wherein the plane of the antenna array is not parallel to the display or the back cover.

10. the antenna array is a first antenna array, The plurality of antenna patches further comprises: a second antenna array between the back cover and the display; 10. The communications device of claim 9, wherein the plane of the second antenna array is not parallel to the plane of the first antenna array.

11. The communications device of claim 10 , wherein the plane of the second antenna array is perpendicular to the plane of the first antenna array.

12. The communications device of claim 10 , wherein the plane of the second antenna array is not perpendicular to the plane of the first antenna array.

13. The communication device of claim 9 further comprising a housing providing a side surface of the communication device.

14. The communications device of claim 13 , wherein the plane of the antenna array is parallel to an adjacent side of the communications device.

15. The communications device of claim 13 , wherein the plane of the antenna array is not parallel to a near side of the communications device.

16. A method for manufacturing the communication device of claim 9, comprising: disposing the antenna module within a housing of the communication device; bending the flexible section.

17. The method of claim 16 , further comprising fixing the antenna module within the communication device so as to maintain bending of the flexible section.

18. The method of claim 16, wherein the step of bending the flexible portion includes the step of folding the flexible portion to cover the IC package.

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