Solder ball mounting device, control method, and program

Abstract

To provide a solder ball mounting device or the like capable of stably mounting a solder ball on an electrode of a substrate that is a solder ball mounting target.SOLUTION: A solder ball mounting device includes: a suction block in which a plurality of holes are formed at a plurality of locations including locations aligned with an electrode of a substrate that is a solder ball mounting target and that can decompress an inside by exhaust with a vacuum source; a thin plate that is arranged on a lower surface of the suction block and in which a plurality of suction holes are formed at a position corresponding to a position of the electrode of the substrate; a push-out unit that vertically detaches / attaches the thin plate from / to the lower surface of the suction block; and a vertical drive source that vertically moves the push-out unit.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a solder ball mounting device, a control method, and a program. [Background technology]

[0002] Solder balls are mounted on electrodes of packages (substrates) such as BGA (Ball Grid Array). To mount the solder balls, they are vacuum-sucked onto a suction block and then transported above an electrode that has been coated with flux. When the vacuum suction is turned off with the solder ball positioned above the electrode, the solder ball is mounted on the electrode. The adhesive power of the flux causes the solder ball to adhere to the terminal.

[0003] Packages may have a certain degree of warping. In such packages, when the solder balls are mounted, there may be areas where the solder balls do not make sufficient contact with the flux. In such areas, the solder balls may remain attached to the suction block even when the vacuum suction is turned off due to snagging on the contact surface between the solder balls and the suction block or static electricity. Packages where this occurs will have bumps not formed on some of the electrodes, resulting in a defective product.

[0004] Patent Document 1 discloses a conductive ball mounting device that mounts conductive balls on a package. The device in Patent Document 1 has an alignment mask that holds the solder balls by suction. A sheet that covers the upper ends of multiple ejector pins that are slidably supported is placed inside the alignment mask. The device in Patent Document 1 has a pin holder that holds the sheet down with compressed air adjusted to the required pressure.

[0005] Patent Document 2 discloses a ball mounting jig for mounting solder balls on a substrate. The jig in Patent Document 2 has an elastic material on the surface that attracts the solder balls.

[0006] Patent Document 3 discloses a semiconductor manufacturing device having a ball mount tool. A flexible deformation plate is placed on the underside of the main body of the ball mount tool. In the method of Patent Document 3, when the solder balls are mounted, the deformation plate in contact with the solder balls is deformed by pressing with air. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-110234 [Patent Document 2] Japanese Patent Application Laid-Open No. 2000-340935 [Patent Document 3] Japanese Patent Application Laid-Open No. 2001-351938 Summary of the Invention [Problem to be solved by the invention]

[0008] The device of Patent Document 1 has one ejector pin for each solder ball that is held by suction. Generally, the number of solder balls mounted on a package at one time ranges from several hundred to several thousand. To accommodate such packages, the device of Patent Document 1 has several hundred to several thousand ejector pins. Incorporating these pins into the device would require enormous costs.

[0009] The jig in Patent Document 2 absorbs warpage of the board by deforming the elastic material. The elastic material deforms when the solder balls are attached. The elastic material also deforms in accordance with the warpage of the package when the solder balls are mounted. Therefore, with the jig in Patent Document 2, the hole diameter of the elastic material may widen, causing the solder balls to become stuck in the attachment holes.

[0010] In the method of Patent Document 3, when the solder balls are mounted, the deformable plate in contact with the solder balls is pressed with air to deform it and conform to the package warpage. According to the method of Patent Document 3, when the suction block is released from suction, more than half of the solder balls leave the suction block and fall onto the package to be mounted. If positive pressure air comes out of the suction port at this stage, the position of the solder balls mounted on the package will be shifted.

[0011] An object of the present disclosure is to provide a solder ball mounting device, a control method, and a program that can stably mount solder balls on electrodes of a substrate that are the target for mounting the solder balls. [Means for solving the problem]

[0012] A solder ball mounting device according to one embodiment of the present disclosure comprises an adsorption block having a plurality of holes formed at a plurality of locations including positions aligned with the electrodes of a substrate on which the solder balls are to be mounted, and capable of reducing the pressure inside by exhausting using a vacuum source; a thin plate arranged on the underside of the adsorption block and having a plurality of adsorption holes formed at positions aligned with the positions of the electrodes of the substrate; an extrusion unit that detaches the thin plate from the underside of the adsorption block in the vertical direction; and an up / down drive source that moves the extrusion unit up and down.

[0013] In one embodiment of the present disclosure, there is provided a method for controlling a solder ball mounting device comprising: an adsorption block having a plurality of holes formed at a plurality of locations including positions aligned with the electrodes of a substrate on which the solder balls are to be mounted, and the interior of which can be depressurized by exhausting with a vacuum source; a thin plate arranged on the underside of the adsorption block and having a plurality of adsorption holes formed at positions aligned with the positions of the electrodes of the substrate; a push-out unit that vertically detaches and attaches the thin plate from the underside of the adsorption block; and an up-and-down drive source that moves the push-out unit up and down, wherein when the solder balls are set below the adsorption block, the vacuum source is operated; when the substrate is aligned downward, the up-and-down drive source is driven to move the push-out unit downward; and depending on the adhesion of the solder balls to the electrodes of the substrate, the vacuum source is stopped and the up-and-down drive source is driven to move the push-out unit upward.

[0014] A program according to one embodiment of the present disclosure is a program for controlling a solder ball mounting device that includes an adsorption block having multiple holes formed at multiple locations including positions aligned with the electrodes of a substrate on which solder balls are to be mounted, and whose interior can be depressurized by exhausting air from a vacuum source; a thin plate that is arranged on the underside of the adsorption block and has multiple adsorption holes formed at positions aligned with the positions of the electrodes of the substrate; a push-out unit that vertically detaches and attaches the thin plate from the underside of the adsorption block; and an up-and-down drive source that moves the push-out unit up and down.The program causes a computer to perform the following processes: when a solder ball is set below the adsorption block, operate the vacuum source; when the substrate is aligned downward, drive the up-and-down drive source to move the push-out unit downward; stop the vacuum source in response to the adhesion of the solder ball to the electrode of the substrate; and drive the up-and-down drive source to move the push-out unit upward. [Effects of the Invention]

[0015] According to the present disclosure, it is possible to provide a solder ball mounting device, a control method, and a program that can stably mount solder balls on electrodes of a substrate on which the solder balls are to be mounted. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a conceptual diagram showing an example of the configuration of a solder ball mounting device according to a first embodiment. [Figure 2] 1 is a plan view of a solder ball mounting device according to a first embodiment, seen from above. [Figure 3] 3 is a bottom view of the suction block of the solder ball mounting device according to the first embodiment, seen from a lower perspective. FIG. [Figure 4] 2 is a bottom view of the thin plate of the solder ball mounting device according to the first embodiment, viewed from below. FIG. [Figure 5] 3 is an enlarged conceptual view of a connecting portion between an ejector pin and a thin plate of the solder ball mounting device according to the first embodiment. FIG. [Figure 6]3 is an enlarged conceptual view of a connecting portion between an ejector pin and a thin plate of the solder ball mounting device according to the first embodiment. FIG. [Figure 7] 3 is a conceptual diagram showing an example of a state in which a solder ball is sucked onto the lower surface of the solder ball mounting device according to the first embodiment. FIG. [Figure 8] 1 is a conceptual diagram showing an example of a state in which a substrate is placed below the solder ball mounting device according to the first embodiment. FIG. [Figure 9] 3 is a conceptual diagram showing an example of a state in which solder balls are attached to electrodes of a substrate placed below the solder ball mounting device according to the first embodiment. FIG. [Figure 10] 3 is a conceptual diagram showing an example of a state in which solder balls are mounted on electrodes of a substrate placed below the solder ball mounting device according to the first embodiment. FIG. [Figure 11] 10 is a conceptual diagram showing another example of a state in which solder balls are attached to electrodes of a substrate placed below the solder ball mounting device according to the first embodiment. FIG. [Figure 12] 10 is a conceptual diagram showing another example of a state in which solder balls are mounted on electrodes of a substrate placed below the solder ball mounting device according to the first embodiment. FIG. [Figure 13] FIG. 10 is a conceptual diagram showing yet another example of a state in which solder balls are attached to electrodes of a substrate placed below the solder ball mounting device according to the first embodiment. [Figure 14] 3 is a conceptual diagram showing an example of a state in which solder balls are mounted on electrodes of a substrate placed below the solder ball mounting device according to the first embodiment. FIG. [Figure 15] 5 is a flowchart for explaining an example of the operation of the solder ball mounting device according to the first embodiment. [Figure 16] FIG. 10 is a conceptual diagram showing an example of the configuration of a solder ball mounting device according to a second embodiment. [Figure 17] FIG. 10 is a conceptual diagram showing an example of the configuration of a solder ball mounting device according to a second embodiment. [Figure 18] FIG. 10 is a plan view of the solder ball mounting device according to the second embodiment, seen from above. [Figure 19] FIG. 10 is a bottom view of the suction block of the solder ball mounting device according to the second embodiment, as seen from below. [Figure 20] FIG. 10 is a bottom view of the thin plate of the solder ball mounting device according to the second embodiment, seen from a lower perspective. [Figure 21] FIG. 10 is a conceptual diagram showing an example of the configuration of a solder ball mounting device according to a third embodiment. [Figure 22] FIG. 10 is a conceptual diagram showing an example of the configuration of a solder ball mounting device according to a third embodiment. [Figure 23] FIG. 2 is a block diagram showing an example of a hardware configuration for executing control and processing according to each embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. However, the embodiments described below are limited in a manner that is technically preferable for carrying out the present invention, but the scope of the invention is not limited to the following. In all drawings used to describe the following embodiments, the same reference numerals are used for similar parts unless otherwise specified. Furthermore, in the following embodiments, repeated explanations of similar configurations and operations may be omitted.

[0018] (First embodiment) First, a solder ball mounting device according to a first embodiment will be described with reference to the drawings. The solder ball mounting device of this embodiment is used in a manufacturing process for mounting solder balls on electrodes of a semiconductor package (hereinafter also referred to as a package or a substrate) such as a BGA (Ball Grid Array). The drawings used in the following description are conceptual diagrams, and may not accurately depict the size, shape, positional relationship, etc. of the components.

[0019] (composition) Fig. 1 is a conceptual diagram showing an example of the configuration of a solder ball mounting device 10 of this embodiment. Fig. 1 is a cross-sectional view of the inside of the solder ball mounting device 10 as seen from a side perspective. Fig. 1 shows a cross-section of a representative portion, rather than a cross-section cut along a linear cutting line.

[0020] The solder ball mounting device 10 includes a suction block 11, a thin plate 13, a connecting plate 120, a vertical drive source 15, a first support 130, a second support 152, a control unit 16, and a vacuum source 17. The solder ball mounting device 10 further includes a first push shaft 121, a first compression spring 123, a second push shaft 126, a second compression spring 127, a first push pin 131, a connecting plate 150, and a second push pin 151.

[0021] The connecting plate 120, the first push shaft 121, the first compression spring 123, the first support 130, and the first push pin 131 constitute a first push unit. The second push shaft 126, the second compression spring 127, the connecting plate 150, the second push pin 151, and the second support 152 constitute a second push unit. The first push unit and the second push unit move up and down in conjunction with the movement of the connecting plate 120. The thin plate 13 moves up and down in conjunction with the up and down movement of the first push unit and the second push unit. The first compression spring 123 and the second compression spring 127 expand and contract independently in accordance with the warpage of the substrate on which the solder balls are to be mounted. Therefore, when the solder balls are mounted on the substrate, the thin plate 13 deforms in accordance with the warpage of the substrate.

[0022] The suction block 11 is a housing used to suction solder balls. The suction block 11 is hollow. Some of the components of the solder ball mounting device 10 are housed inside the suction block 11. An exhaust port V, which is used to adjust the internal pressure of the suction block 11, is opened on the side (wall) of the suction block 11. The exhaust port V may be formed on the upper surface (ceiling) of the suction block 11. The exhaust port V is connected to a vacuum source 17 via an air hose 175. For example, the vacuum source 17 is realized by a vacuum pump. When the vacuum source 17 is operated, air is exhausted through the exhaust port V, creating a negative pressure inside the suction block 11. As a result, a suction force is generated through holes formed on the lower surface of the suction block 11. For example, the pressure inside the suction block 11 may be adjusted by controlling the exhaust volume of the vacuum source 17. There are no particular limitations on the vacuum source 17 or the air hose 175.

[0023] FIG. 2 is a plan view of the solder ball mounting device 10 as seen from above. Through holes are formed in the upper surface of the suction block 11 for inserting the first extrusion shaft 121 and the second extrusion shaft 126. The upper ends of the first extrusion shaft 121 and the second extrusion shaft 126 are connected to the lower surface of the connection plate 120. As shown in FIG. 2, the first extrusion shaft 121 is connected to each of the four corners of the connection plate 120. The second extrusion shaft 126 is connected to the center of the connection plate 120. The first extrusion shaft 121 and the second extrusion shaft 126 are arranged inside the through holes formed in the upper surface of the suction block 11 so as to be movable up and down. The lower portions of the first extrusion shaft 121 and the second extrusion shaft 126 are arranged inside the suction block 11.

[0024] FIG. 3 is a bottom view of the solder ball mounting device 10 (suction block 11) from which the thin plate 13 has been removed, as viewed from below. The bottom surface of the suction block 11 has a first hole h1, a second hole h2, a third hole h3, and a fourth hole h4. The first hole h1 is a hole used for suction of the solder balls. In the example of FIG. 3, 25 first holes h1 arranged in a grid pattern are opened on the bottom surface of the suction block 11. The second holes h2 are holes used for suction of the thin plate 13. In the example of FIG. 3, four second holes h2 are opened on the bottom surface of the solder suction block 11. The third hole h3 is a hole through which the second ejection pin 151 passes. The second ejection pin 151 moves up and down within the third hole h3. In the example of FIG. 3, four third holes h3 are opened on the bottom surface of the suction block 11. The fourth hole h4 is a hole through which the first support 130 is disposed. 3, four fourth holes h4 are opened in the lower surface of the suction block 11. The first hole h1, second hole h2, third hole h3, and fourth hole h4 shown in FIG. 3 are merely examples, and do not limit the positions, number, size, shape, etc. of the holes formed in the lower surface of the suction block 11. The positions, number, size, shape, etc. of the holes formed in the lower surface of the suction block 11 are set according to the size and type of the substrate (package) on which the solder balls are to be mounted.

[0025] The thin plate 13 is placed on the underside of the suction block 11. The thin plate 13 is detachable from the underside of the suction block 11. The thin plate 13 is flexible. For example, the thin plate 13 is made of a flexible metal plate. The thin plate 13 may also be made of a flexible resin plate. The thin plate 13 has suction holes H formed in it at positions corresponding to the first holes h1 formed in the underside of the suction block 11. There are no limitations on the method for forming the suction holes H in the thin plate 13. When the thin plate 13 is made of metal, the suction holes H are formed by a method such as etching or an additive method.

[0026] 4 is a bottom view of the solder ball mounting device 10 (thin plate 13) to which the thin plate 13 is attached, as seen from below. In the example of FIG. 4, 25 suction holes H arranged in a grid pattern are formed in the thin plate 13. FIG. 4 also shows the positions corresponding to the first hole h1, second hole h2, third hole h3, and fourth hole h4 formed in the underside of the suction block 11. The multiple suction holes H are formed at positions corresponding to the multiple first holes h1.

[0027] The vertical drive source 15 moves the connecting plate 120 up and down in accordance with the control of the control unit 16. There are no limitations on the mechanism by which the vertical drive source 15 moves the connecting plate 120 up and down. For example, the vertical drive source 15 may be an air cylinder that expands and contracts using air pressure. In accordance with the up and down movement of the connecting plate 120, the first push-out shaft 121 and the second push-out shaft 126 connected below the connecting plate 120 move up and down. In accordance with the up and down movement of the first push-out shaft 121 and the second push-out shaft 126, the thin plate 13 moves up and down. In other words, the thin plate 13 moves up and down in conjunction with the up and down movement of the connecting plate 120.

[0028] The upper end of the first extrusion shaft 121 is connected to the lower surface of the connecting plate 120. A storage space is formed below the first extrusion shaft 121. The storage space stores the first compression spring 123 and the upper end of the first extrusion pin 131. The first compression spring 123 is disposed between the upper surface of the storage space of the first extrusion shaft 121 and the upper surface of the first extrusion pin 131. The first compression spring 123 presses the first extrusion pin 131 downward. The first extrusion pin 131 is disposed between the first extrusion shaft 121 and the thin plate 13. The upper and lower ends of the first extrusion pin 131 have a larger cross-sectional area than the main shaft. The upper end of the first extrusion pin 131 is stored in the storage space of the first extrusion shaft 121. The lower end of the first extrusion pin 131 is supported by a first support 130. The first support 130 is disposed on the upper surface of the thin plate 13. The first support 130 is disposed inside a fourth hole h4 formed in the lower surface of the suction block 11. The solder ball mounting device 10 includes four first supporters 130. Each of the four first supporters 130 is disposed corresponding to one of the four corners of the upper surface of the thin plate 13. The first supporters 130 support the lower ends of the first push-out pins 131 in a manner that envelops them.

[0029] The upper end of the second push-out shaft 126 is connected to the lower end of the vertical drive source 15. The lower end of the second push-out shaft 126 is supported by a second support 152. A narrowed portion having a smaller cross-sectional area than the upper and lower ends is formed at the lower part of the second push-out shaft 126. A second compression spring 127 is disposed in the narrowed portion of the second push-out shaft 126. The second compression spring 127 is disposed between the upper end of the narrowed portion of the second push-out shaft 126 and the upper surface of the second support 152. The second compression spring 127 presses the second support 152 downward. The second support 152 is disposed on the upper surface of the connecting plate 150. The second support 152 is disposed above third holes h3 formed in the lower surface of the suction block 11. The solder ball mounting device 10 has four third holes h3. A second push-out pin 151 is disposed in each of the four third holes h3. The upper end of the second push-out pin 151 is connected to the lower surface of the connecting plate 150. The lower end of the second push-out pin 151 is connected to the upper surface of the thin plate 13 via the third hole h3.

[0030] For example, assume that the thickness of thin plate 13 is 0.2 millimeters (mm), the outer dimensions of thin plate 13 corresponding to the outer shape of substrate 180 are 60 mm × 60 mm, and the amount of warping of substrate 180 is 0.2 mm. In order to bend the thin plate 13 by 0.2 mm in accordance with the warping of substrate 180, a force of about 1 Newton (N) is applied to each of the plurality of first push-out pins 131 and the plurality of second push-out pins 151. In this case, springs that can generate a force of about 1 Newton (N) on each of the plurality of first push-out pins 131 and the plurality of second push-out pins 151 are used as first compression spring 123 and second compression spring 127.

[0031] 5 and 6 are enlarged conceptual diagrams of the connection portion between the first push pin 131 and the thin plate 13. FIG. 5 shows the thin plate 13 in close contact with the lower surface of the suction block 11. FIG. 6 shows the thin plate 13 separated from the lower surface of the suction block 11. The first support 130 is disposed in the fourth hole h4, into which the lower end L of the first push pin 131 is accommodated. The first support 130 is fixed to the thin plate 13. The upper end T of the first push pin 131 is accommodated in a storage space below the first push shaft 121. The lower end L of the first push pin 131 is accommodated in the internal space of the first support 130. When the lower end L of the first push pin 131 is accommodated, a gap is present in the internal space of the first support 130. The gap in the internal space of the first support 130 allows horizontal deformation of the thin plate 13 resulting from vertical deformation of the thin plate 13. A tapered portion T1 tapering from bottom to top is formed at the lower inner portion of the fourth hole h4 of the suction block 11. Furthermore, a tapered portion T2 tapering from bottom to top is formed at the lower outer portion of the first support 130. As shown in Figure 5, when the thin plate 13 is in close contact with the underside of the suction block 11, the tapered portion T1 and the tapered portion T2 come into contact with each other, thereby restoring the horizontal deformation of the thin plate 13 caused by the vertical deformation of the thin plate 13.

[0032] As first push-out shaft 121 and second push-out shaft 126 move up and down in response to the drive of vertical drive source 15, the positional relationship between the underside of suction block 11 and thin plate 13 changes. First compression spring 123 and second compression spring 127 expand and contract independently of each other. Therefore, the peripheral portion and the central portion of thin plate 13 can be at different distances from the underside of suction block 11. Therefore, thin plate 13 can deform in accordance with the warpage of the substrate on which the solder balls are to be mounted.

[0033] 7 is a conceptual diagram showing an example of a state in which solder balls 100 are sucked onto the underside of the solder ball mounting device 10. When the pressure inside the suction block 11 is reduced by exhausting air from the exhaust port V, the pressure inside the suction block 11 becomes negative. As a result, a suction force toward the inside of the suction block 11 is generated in each of the multiple suction holes H formed in the thin plate 13. Therefore, the solder balls 100 arranged below are sucked into each of the multiple suction holes H formed in the thin plate 13.

[0034] 8 is a conceptual diagram showing an example of a state in which a substrate 180 is placed below the solder ball mounting device 10. A plurality of electrodes 181 are formed on the upper surface of the substrate 180. Each of the plurality of electrodes 181 is aligned below one of the plurality of solder balls 100. Flux 185 is applied to each of the plurality of electrodes 181. Note that solder paste may be applied to each of the plurality of electrodes 181 instead of the flux 185. The solder balls 100 attracted to the lower surface of the suction block 11 are positioned above the plurality of electrodes 181 to which the flux 185 is applied.

[0035] FIG. 9 is a conceptual diagram showing an example of a state in which solder balls 100 are attached to electrodes 181 of a substrate 180. In the example of FIG. 9, the substrate 180 is not bent. In the example of FIG. 9, as the vertical drive source 15 drives the connecting plate 120 downward, the solder balls 100 are attached to each of the electrodes 181 to which flux 185 is applied. When the connecting plate 120 is further moved downward with all the solder balls 100 in contact with the electrodes 181, the first compression springs 123 and the second compression springs 127 are compressed. Therefore, as long as the first compression springs 123 and the second compression springs 127 are within their deformable ranges, the thin plate 13 does not descend even if the connecting plate 120 is moved downward from a state in which all the solder balls 100 are in contact with the electrodes 181.

[0036] 10 is a conceptual diagram showing an example of the state in which solder balls 100 are mounted on electrodes 181 of substrate 180 in the example of FIG. 9. When vacuum source 17 is stopped and moved above connecting plate 120 by vertical drive source 15, solder balls 100 are mounted on each of the multiple electrodes 181 to which flux 185 has been applied. With solder balls 100 mounted on electrodes 181, substrate 180 is reflowed, whereby solder balls 100 are mounted on electrodes 181.

[0037] FIG. 11 is a conceptual diagram showing another example of a state in which solder balls 100 are attached to electrodes 181 of a substrate 180. In the example of FIG. 11, the central portion of the substrate 180 is warped upward relative to the peripheral portion. In the example of FIG. 11, as the vertical drive source 15 drives the connecting plate 120 downward, solder balls 100 are attached to each of the multiple electrodes 181 to which flux 185 is applied. In response to the warping of the substrate 180, the central portion of the thin plate 13 is warped upward relative to the peripheral portion. As the second compression springs 127 deform more than the first compression springs 123, the thin plate 13 deforms along the warping of the substrate 180. As a result, solder balls 100 are attached to all of the electrodes 181 of the substrate 180.

[0038] 12 is a conceptual diagram showing another example of the state in which solder balls 100 are mounted on electrodes 181 of substrate 180 in the example of FIG. 11. As connecting plate 120 is driven upward by vertical drive source 15, solder balls 100 are mounted on each of the plurality of electrodes 181 to which flux 185 is applied. Because thin plate 13 deforms in response to warping of substrate 180, solder balls 100 do not remain on the side of solder ball mounting device 10. By reflowing the solder balls 100 while they are mounted on electrodes 181, the solder balls 100 are soldered to electrodes 181.

[0039] FIG. 13 is a conceptual diagram showing yet another example of a state in which solder balls 100 are attached to electrodes of a substrate 180. In the example of FIG. 13, the peripheral portion of the substrate 180 is warped upward relative to the central portion. In the example of FIG. 13, as the vertical drive source 15 drives the connecting plate 120 downward, solder balls 100 are attached to each of the multiple electrodes 181 to which flux 185 is applied. In response to the warping of the substrate 180, the peripheral portion of the thin plate 13 is warped upward relative to the central portion. As the first compression springs 123 deform more than the second compression springs 127, the thin plate 13 deforms along the warping of the substrate 180. As a result, solder balls 100 are attached to all of the electrodes 181 of the substrate 180.

[0040] 14 is a conceptual diagram showing an example of a state in which solder balls 100 are mounted on electrodes 181 of substrate 180 in the example of FIG. 13. As connecting plate 120 is driven upward by vertical drive source 15, solder balls 100 are mounted on each of the plurality of electrodes 181 to which flux 185 is applied. Since thin plate 13 deforms in response to warping of substrate 180, solder balls 100 do not remain on the side of solder ball mounting device 10. By reflowing the solder balls 100 while they are mounted on electrodes 181, the solder balls 100 are soldered to electrodes 181.

[0041] The control unit 16 (controller) controls the vacuum source 17 and the vertical drive source 15. For example, the control unit 16 is realized by a microcomputer including a processor and a memory. The control unit 16 controls the vacuum source 17 to adjust the internal pressure of the suction block 11. The control unit 16 drives the vacuum source 17 to evacuate the interior of the suction block 11, thereby reducing the pressure inside the suction block 11. The control unit 16 adjusts the pressure inside the suction block 11 by controlling the degree of evacuation by the vacuum source 17. The control unit 16 stops evacuation by the vacuum source 17 and returns the pressure inside the suction block 11 to normal pressure.

[0042] The control unit 16 drives the vertical drive source 15 to control the position (height) of the connecting plate 120 in the vertical direction. The control unit 16 moves the vertical drive source 15 downward to move the connecting plate 120 downward. As a result, the thin plate 13, which moves in conjunction with the connecting plate 120, moves downward. The control unit 16 moves the vertical drive source 15 upward to move the connecting plate 120 upward. As a result, the thin plate 13, which moves in conjunction with the connecting plate 120, moves upward.

[0043] When the solder balls 100 are set below the solder ball mounting device 10, the control unit 16 operates the vacuum source 17. For example, the solder balls 100 are set below the solder ball mounting device 10 by a transport device (not shown). The solder balls 100 may also be set below the solder ball mounting device 10 by an operator. In response to the operation of the vacuum source 17, a negative pressure is created inside the suction block 11, and a suction force is generated from the suction holes H of the thin plate 13 toward the inside of the suction block 11. As a result, the solder balls 100 arranged below the thin plate 13 are sucked into the suction holes H of the thin plate 13. In addition, the suction force via the second holes h2 causes the thin plate 13 to adhere to the underside of the suction block 11. In this way, the suction block 11 adheres to the thin plate 13 in accordance with the suction of the solder balls 100, eliminating any waviness of the thin plate 13.

[0044] When the substrate 180 is set below the solder ball mounting device 10, the control unit 16 weakens the exhaust by the vacuum source 17. The exhaust by the vacuum source 17 is weakened to the extent that the thin plate 13 can be moved downward. If the inside of the suction block 11 remains depressurized, the control unit 16 may stop the vacuum source 17. For example, the substrate 180 is set below the solder ball mounting device 10 by a conveying device (not shown). For example, the conveying device may be controlled by the control unit 16. For example, the substrate 180 may be set below the solder ball mounting device 10 by an operator. After weakening the exhaust by the vacuum source 17, the control unit 16 drives the vertical drive source 15 to press the connecting plate 120 downward. In conjunction with the movement of the connecting plate 120, the thin plate 13 is released from the lower surface of the suction block 11 with the solder balls 100 still adsorbed to the suction holes H of the thin plate 13. For example, if the thin plate 13 can be moved downward without weakening the exhaust by the vacuum source 17, the control unit 16 may drive the up / down drive source 15 to push the connecting plate 120 downward without weakening the exhaust by the vacuum source 17.

[0045] When connecting plate 120 is lowered to a position where solder balls 100 adhere to electrodes 181 of substrate 180, control unit 16 stops vacuum source 17. Thereafter, control unit 16 drives vertical drive source 15 to move connecting plate 120 upward. Thin plate 13 moves upward in conjunction with the upward movement of connecting plate 120. Control unit 16 moves connecting plate 120 upward to a position where thin plate 13 is in close contact with the underside of suction block 11. In this manner, solder balls are mounted on electrodes 181 of substrate 180.

[0046] (operation) Next, an example of the operation of the solder ball mounting device 10 according to this embodiment will be described with reference to the drawings. An example of control by the control unit 16 provided in the solder ball mounting device 10 will be described below. Fig. 15 is a flowchart for explaining an example of the operation of the solder ball mounting device 10. In explaining the processing according to the flowchart of Fig. 15, the control unit 16 will be described as the main operator.

[0047] 15, first, the control unit 16 operates the vacuum source 17 with the solder balls 100 set below (step S11). As a result, the pressure inside the suction block 11 is reduced, and the solder balls 100 are attracted to the suction holes H. Furthermore, the thin plate 13 is brought into close contact with the lower surface of the suction block 11 by the suction force through the second holes h2. In this state, the positions of the solder balls 100 and the electrodes 181 of the substrate 180, which are the targets for mounting the solder balls 100, are aligned. For example, the positions of the electrodes 181 of the substrate 180 and the solder balls 100 may be aligned by a conveyance device (not shown). For example, the positions of the electrodes 181 of the substrate 180 and the solder balls 100 may be aligned by the control of the control unit 16.

[0048] Next, with the substrate 180 positioned below the suction block 11, the control unit 16 weakens the exhaust by the vacuum source 17 (step S12). The control unit 16 weakens the exhaust by the vacuum source 17 to the extent that the thin plate 13 can be released from below the suction block 11. If the thin plate 13 can be released from below the suction block 11 without weakening the exhaust by the vacuum source 17, step S12 may be omitted.

[0049] Next, control unit 16 drives vertical drive source 15 to move connecting plate 120 downward (step S13). Control unit 16 moves connecting plate 120 downward to a position where first compression spring 123 and second compression spring 127 are compressed. As a result, all of solder balls 100 that have been sucked into suction holes H of thin plate 13 are attached to electrodes 181 (flux 185) of substrate 180.

[0050] Next, the control unit 16 stops the vacuum source 17 (step S14). When the vacuum source 17 is stopped, the reduced pressure in the suction block 11 is released, and the suction force in the suction holes H of the thin plate 13 disappears.

[0051] Next, control unit 16 drives vertical drive source 15 to move connecting plate 120 upward (step S15). As a result, thin plate 13 moves upward with solder balls 100 mounted on electrodes 181 of substrate 180. As shown in FIGS. 5 and 6, tapered portion T2 of first support 130 moves upward along tapered portion T1 of fourth hole h4 of suction block 11. Therefore, the horizontal positions of first support 130 and thin plate 13 return to their original positions in the state in which thin plate 13 was in close contact with the lower surface of suction block 11.

[0052] As described above, the solder ball mounting device of this embodiment includes a suction block, a push-out unit, a thin plate, a vertical drive source, a control unit, and a vacuum source. The suction block has multiple holes formed at multiple locations, including positions aligned with the electrodes of the substrate on which the solder balls are to be mounted, and the interior can be depressurized by exhausting with the vacuum source. The bottom surface of the suction block has a first hole, a second hole, a third hole, and a fourth hole. The first hole is formed to match the position of the electrodes on the substrate. The second hole is formed to suck the thin plate. A push-out pin is inserted into the third hole. The fourth hole is formed to correspond to the four corners of the suction block. The push-out unit attaches and detaches the thin plate from the bottom surface of the suction block in the vertical direction. The thin plate is placed on the bottom surface of the suction block, and multiple suction holes are formed at positions aligned with the electrodes on the substrate. The control unit controls the vertical drive source and the vacuum source. The vertical drive source moves the push-out unit up and down in accordance with the control of the control unit. The vacuum source operates in accordance with the control of the control unit.

[0053] The push-out unit includes a push-out pin, a push-out shaft, a connecting plate, a first support, a second support, and a connecting plate. The push-out pin is inserted into one of a plurality of holes formed on the underside of the suction block, and its lower end is connected to the upper surface of the thin plate. The push-out pin includes a first push-out pin and a second push-out pin. The first push-out pin has its lower end supported by the first support. The second push-out pin has its upper end connected to the lower surface of the connecting plate, inserted into a third hole, and fixed to the upper surface of the thin plate. The push-out shaft is inserted into a plurality of holes formed on the upper surface of the suction block, and supports the push-out pin so that it can move up and down. The push-out shaft includes a first push-out shaft and a second push-out shaft. The lower end of the first push-out shaft is supported by the first support. The second push-out shaft has its upper end connected to the center of the lower surface of the connecting plate, inserted into a hole formed in the center of the upper surface of the suction block, and supported by the second support. The connecting plate is placed on the upper surface of the suction block and the upper end of the push shaft is fixed thereto. The first support is placed inside the fourth hole and fixed to the upper surface of the thin plate. The second support supports one of the lower ends of the push shaft. The second support is fixed to the upper surface of the connecting plate.

[0054] A deformable thin plate is placed on the underside of a suction block provided in the solder ball mounting device of this embodiment. A mechanism for moving the thin plate up and down with an appropriate load is placed inside the suction block. When mounting solder balls, the thin plate is pushed downward and deforms to follow the warp of the substrate (package), causing the flux applied to the electrodes of the substrate to come into contact with the solder balls. According to this embodiment, even if the substrate on which the solder balls are to be mounted is warped, the solder balls will make sufficient contact with the electrodes to which the flux is applied. Therefore, according to this embodiment, the solder balls can be stably mounted on the electrodes of the substrate on which the solder balls are to be mounted.

[0055] The board on which the solder balls are mounted may have some degree of warping. If the board is significantly warped, the flux applied to the electrodes may not make sufficient contact with the solder balls when they are mounted. If this occurs, even when the vacuum suction is turned off, the solder balls will remain attached to the suction block due to snagging on the contact surface between the solder balls and the suction block or static electricity. If the solder balls remain attached to the suction block, a defect will occur in which the solder balls are not mounted on some of the board's electrodes.

[0056] In one aspect of this embodiment, the first pusher shaft has a storage space in which the upper end portion of the first pusher pin is stored. The second pusher shaft has a narrowed portion at its lower portion. Compression springs are disposed between the ceiling surface of the storage space and the upper surface of the pusher pin, and between the upper surface of the narrowed portion of the second pusher shaft and the upper surface of the second support. According to this aspect, the first pusher pin and the second pusher pin expand and contract independently, thereby enabling stable mounting of solder balls on electrodes of a substrate on which the solder balls are to be mounted.

[0057] In one aspect of this embodiment, the control unit operates the vacuum source with the solder balls set below the suction block. With the substrate positioned downward, the control unit drives the vertical drive source to move the push-out unit downward. The control unit stops the vacuum source in response to the adhesion of the solder balls to the electrodes of the substrate. The control unit drives the vertical drive source to move the push-out unit upward. According to this aspect, the control of the control unit enables the solder balls to be stably placed on the electrodes of the substrate that are the target for the solder balls to be placed.

[0058] (Second embodiment) Next, a solder ball mounting device according to a second embodiment will be described with reference to the drawings. The solder ball mounting device of this embodiment differs from the solder ball mounting device of the first embodiment in the structure of the push-out unit. In this embodiment, figures showing the mounting of solder balls by the solder ball mounting device will be omitted. The mounting of solder balls is the same as in the first embodiment.

[0059] (composition) 16 to 17 are conceptual diagrams showing an example of the configuration of the solder ball mounting device 20 of this embodiment. Figures 16 to 17 are cross-sectional views of the inside of the solder ball mounting device 20 as seen from a side perspective. Figures 16 to 17 do not show cross sections cut along the same cutting line, but show cross sections of representative parts.

[0060] The solder ball mounting device 20 includes a suction block 21, a thin plate 23, a connecting plate 220, a vertical drive source 25, a support 230, a control unit 26, and a vacuum source 27. The solder ball mounting device 20 further includes a push-out shaft 221, a compression spring 223, a first push-out pin 231, and a second push-out pin 251.

[0061] The connecting plate 220, the push-out shaft 221, the compression spring 223, the support 230, the first push-out pin 231, and the second push-out pin 251 constitute a push-out unit. The push-out unit attaches and detaches the thin plate 23 in the vertical direction from the lower surface of the suction block 21. FIG. 17 shows the push-out unit pushed downward. The push-out unit moves up and down in conjunction with the movement of the connecting plate 220. The thin plate 23 moves up and down in conjunction with the up and down movement of the push-out unit. The multiple compression springs 223 expand and contract independently in accordance with the warpage of the substrate on which the solder balls are to be mounted. Therefore, when the solder balls are mounted on the substrate, the thin plate 23 deforms in accordance with the warpage of the substrate.

[0062] The suction block 21 has a configuration similar to that of the suction block 11 of the first embodiment. The suction block 21 is a housing used to suction solder balls. The suction block 21 is hollow. Some of the components of the solder ball mounting device 20 are housed inside the suction block 21. An exhaust port V used to adjust the internal pressure of the suction block 21 is opened on the side (wall) of the suction block 21. The exhaust port V may be formed on the upper surface (ceiling) of the suction block 21. The exhaust port V is connected to a vacuum source 27 via an air hose 275. For example, the vacuum source 27 is realized by a vacuum pump. When the vacuum source 27 is operated, air is exhausted through the exhaust port V, creating a negative pressure inside the suction block 21. As a result, a suction force is generated through holes formed on the lower surface of the suction block 21. For example, the pressure inside the suction block 21 may be adjusted by controlling the exhaust rate of the vacuum source 27. There are no particular limitations on the vacuum source 27 or the air hose 275.

[0063] 18 is a plan view of the solder ball mounting device 20 as seen from above. A through hole for inserting a push-out shaft 221 is formed in the upper surface of the suction block 21. The upper end of the push-out shaft 221 is connected to the lower surface of the connecting plate 220. The push-out shaft 221 is arranged inside the through hole formed in the upper surface of the suction block 21 so as to be able to move up and down. The lower portion of the push-out shaft 221 is arranged inside the suction block 21.

[0064] FIG. 19 is a bottom view of the solder ball mounting device 20 (suction block 21) from which the thin plate 23 has been removed, as viewed from below. The bottom surface of the suction block 21 has a first hole h1, a second hole h2, a third hole h3, and a fourth hole h4. The first hole h1 is a hole used for suction of solder balls. In the example of FIG. 19, 100 first holes h1 are arranged in a grid pattern on the bottom surface of the suction block 21. The second holes h2 are holes used for suction of the thin plate 23. In the example of FIG. 19, 20 second holes h2 are opened on the bottom surface of the solder suction block 21. The third hole h3 is a hole through which the second ejection pin 251 passes. The second ejection pin 251 moves up and down inside the third hole h3. In the example of FIG. 19, five third holes h3 are opened on the bottom surface of the suction block 21. The fourth holes h4 are holes in which the supports 230 are placed. In the example of Fig. 19, four fourth holes h4 are opened in the lower surface of the suction block 21. The first hole h1, second hole h2, third hole h3, and fourth hole h4 shown in Fig. 19 are merely examples, and do not limit the positions, number, size, shape, etc. of the holes formed in the lower surface of the suction block 21. The positions, number, size, shape, etc. of the holes formed in the lower surface of the suction block 21 are set depending on the size and type of the substrate (package) on which the solder balls are to be mounted.

[0065] The thin plate 23 is disposed on the underside of the suction block 21. The thin plate 23 is detachable from the underside of the suction block 21. The thin plate 23 is flexible. For example, like the thin plate 13 of the first embodiment, the thin plate 23 is made of a flexible metal plate or the like. The thin plate 23 may also be made of a flexible resin plate. The thin plate 23 has suction holes H formed at positions corresponding to the first holes h1 formed in the underside of the suction block 21. There are no particular limitations on the method for forming the suction holes H in the thin plate 23.

[0066] Fig. 20 is a bottom view of the solder ball mounting device 20 (thin plate 23) as seen from below. In the example of Fig. 20, 100 suction holes H arranged in a grid pattern are formed in the thin plate 23. Fig. 20 also shows the positions corresponding to the first hole h1, second hole h2, third hole h3, and fourth hole h4 formed in the underside of the suction block 21. The multiple suction holes H are formed at positions corresponding to the multiple first holes h1.

[0067] The vertical drive source 25 has the same configuration as the vertical drive source 15 of the first embodiment. The vertical drive source 25 moves the connecting plate 220 up and down in accordance with the control of the control unit 26. For example, the vertical drive source 25 may be realized by an air cylinder that expands and contracts using air pressure. There are no limitations on the mechanism of the vertical drive source 25 as long as it can move the connecting plate 220 up and down. In accordance with the up and down movement of the connecting plate 220, the push-out shaft 221 connected below the connecting plate 220 moves up and down. In accordance with the up and down movement of the push-out shaft 221, the thin plate 23 moves up and down. In other words, the thin plate 23 moves up and down in conjunction with the up and down movement of the connecting plate 220.

[0068] The push shaft 221 has the same configuration as the first push shaft 121 of the first embodiment. The upper end of the push shaft 221 is connected to the lower surface of the connecting plate 220. A storage space is formed below the push shaft 221. The storage space of the push shaft 221 connected to the lower surface of the four corners of the connecting plate 220 stores the compression spring 223 and the upper end of the first push pin 231. The storage space of the push shaft 221 connected to the lower surface of the connecting plate 220 other than the four corners stores the compression spring 223 and the upper end of the second push pin 251. The compression spring 223 is disposed in the storage space of the push shaft 221. The compression spring 223 presses the first push pin 231 or the second push pin 251 downward relative to the push shaft 221.

[0069] The first pusher pin 231 is disposed between the pusher shaft 221 and the thin plate 23. The upper and lower ends of the first pusher pin 231 have a larger cross-sectional area than the main shaft. The upper end of the first pusher pin 231 is housed in the housing space of the pusher shaft 221. A downward stress is applied to the upper surface of the first pusher pin 231 by a compression spring 223. The lower end of the first pusher pin 231 is supported by a support 230. The support 230 is disposed on the upper surface of the thin plate 23. The support 230 is disposed inside a fourth hole h4 formed in the lower surface of the suction block 21. The solder ball mounting device 20 includes four supports 230. Each of the four supports 230 is disposed corresponding to one of the four corners of the upper surface of the thin plate 23. The support 230 supports the lower end of the first pusher pin 231 in a manner that envelops it.

[0070] The second push pin 251 is disposed between the push shaft 221 and the thin plate 23. The upper end of the second push pin 251 has a larger cross-sectional area than the main shaft. The upper end of the second push pin 251 is housed in the housing space of the push shaft 221. A downward stress is applied to the upper surface of the second push pin 251 by the compression spring 223. The lower portion of the second push pin 251 is inserted into the inside of a third hole h3 formed in the lower surface of the suction block 21. The lower end of the second push pin 251 is connected to the upper surface of the thin plate 23.

[0071] As push-out shaft 221 moves up and down in response to the drive of vertical drive source 25, the positional relationship between the bottom surface of suction block 21 and thin plate 23 changes. Multiple compression springs 223 expand and contract independently of each other. Therefore, the peripheral portion and the central portion of thin plate 23 can be at different distances from the bottom surface of suction block 21. Therefore, thin plate 23 can deform in accordance with the warpage of the substrate on which the solder balls are to be mounted.

[0072] The control unit 26 (controller) has the same configuration as the control unit 16 of the first embodiment. The control unit 26 controls the vacuum source 27 and the up / down drive source 25. For example, the control unit 26 is realized by a microcomputer including a processor and a memory. The control unit 26 controls the vacuum source 27 to adjust the internal pressure of the suction block 21. The control unit 26 drives the vacuum source 27 to evacuate the interior of the suction block 21, thereby reducing the pressure inside the suction block 21. The control unit 26 adjusts the pressure inside the suction block 21 by controlling the degree of evacuation by the vacuum source 27. The control unit 26 stops evacuation by the vacuum source 27 and returns the pressure inside the suction block 21 to normal pressure.

[0073] The control unit 26 drives the vertical drive source 25 to control the position (height) of the connecting plate 220 in the vertical direction. The control unit 26 moves the vertical drive source 25 downward to move the connecting plate 220 downward. As a result, the thin plate 23, which moves in conjunction with the connecting plate 220, moves downward. The control unit 26 moves the vertical drive source 25 upward to move the connecting plate 220 upward. As a result, the thin plate 23, which moves in conjunction with the connecting plate 220, moves upward.

[0074] When a solder ball is set below the solder ball mounting device 20, the control unit 26 activates the vacuum source 27 to evacuate the inside of the suction block 21. As the vacuum source 27 is activated, a negative pressure is created inside the suction block 21, generating an airflow from the suction holes H of the thin plate 23 toward the inside of the suction block 21. As a result, the solder balls arranged below the thin plate 23 are sucked into the suction holes H of the thin plate 23. Furthermore, the suction force via the second holes h2 causes the thin plate 23 to adhere to the underside of the suction block 21. In this way, the suction block 21 adheres to the thin plate 23 in accordance with the suction of the solder balls, eliminating any undulations in the thin plate 23.

[0075] When the substrate is set below the solder ball mounting device 20, the control unit 26 weakens the exhaust by the vacuum source 27. After weakening the exhaust by the vacuum source 27, the control unit 26 drives the vertical drive source 25 to press down the connecting plate 220. In conjunction with the movement of the connecting plate 220, the thin plate 23 is released from the lower surface of the suction block 21 with the solder balls still adsorbed to the suction holes H of the thin plate 23. The control unit 26 may also drive the vertical drive source 25 to press down the connecting plate 220 without weakening the exhaust by the vacuum source 27.

[0076] When connecting plate 220 is lowered to a position where the solder balls will adhere to the electrodes of the substrate, control unit 26 stops vacuum source 27. Thereafter, control unit 26 drives vertical drive source 25 to move connecting plate 220 upward. Thin plate 23 moves upward in conjunction with the upward movement of connecting plate 220. Control unit 26 moves connecting plate 220 upward to a position where thin plate 23 is in close contact with the underside of suction block 21. In this manner, the solder balls are mounted on the electrodes of the substrate.

[0077] As described above, the solder ball mounting device of this embodiment includes a suction block, a push-out unit, a thin plate, a support, a vertical drive source, a control unit, and a vacuum source. The suction block has multiple holes formed at multiple locations, including positions aligned with the electrodes of the substrate on which the solder balls are to be mounted, and the interior can be depressurized by exhausting with the vacuum source. The bottom surface of the suction block has a first hole, a second hole, a third hole, and a fourth hole. The first hole is formed to match the position of the electrodes on the substrate. The second hole is formed to suck the thin plate. A push-out pin is inserted into the third hole. The fourth hole is formed to correspond to the four corners of the suction block. The push-out unit vertically attaches and detaches the thin plate from the bottom surface of the suction block. The thin plate is placed on the bottom surface of the suction block, and multiple suction holes are formed at positions aligned with the electrodes on the substrate. The control unit controls the vertical drive source and the vacuum source. The vertical drive source moves the push-out unit up and down in accordance with the control of the control unit. The vacuum source operates in accordance with the control of the control unit.

[0078] The ejection unit includes an ejector pin, an ejector shaft, a connecting plate, a support, and a connecting plate. The ejector pin is inserted into one of a plurality of holes formed on the lower surface of the suction block, and its lower end is connected to the upper surface of the thin plate. The ejector pin includes a first ejector pin and a second ejector pin. The lower end of the first ejector pin is supported by the support. The second ejector pin is inserted into a third hole, and its lower end is fixed to the upper surface of the thin plate. The ejector shaft is inserted into a plurality of holes formed on the upper surface of the suction block, and supports the ejector pin so that it can move up and down. The connecting plate is disposed on the upper surface of the suction block, and the upper end of the ejector shaft is fixed thereto. The first support is disposed inside a fourth hole and fixed to the upper surface of the thin plate.

[0079] A deformable thin plate is placed on the underside of a suction block provided in the solder ball mounting device of this embodiment. A mechanism for moving the thin plate up and down with an appropriate load is placed inside the suction block. When mounting solder balls, the thin plate is pushed downward and deforms to follow the warp of the substrate (package), causing the flux applied to the electrodes of the substrate to come into contact with the solder balls. According to this embodiment, even if the substrate on which the solder balls are to be mounted is warped, the solder balls will make sufficient contact with the electrodes to which the flux is applied. Therefore, according to this embodiment, the solder balls can be stably mounted on the electrodes of the substrate on which the solder balls are to be mounted.

[0080] In one aspect of this embodiment, the ejector shaft has a storage space in which the upper end portions of the ejector pins are stored. A compression spring is disposed between the ceiling surface of the storage space and the upper surfaces of the ejector pins. According to this aspect, the multiple ejector pins expand and contract independently, thereby enabling stable mounting of solder balls onto electrodes of a substrate on which the solder balls are to be mounted.

[0081] In one aspect of this embodiment, the control unit operates the vacuum source with the solder balls set below the suction block. With the substrate positioned downward, the control unit drives the vertical drive source to move the push-out unit downward. The control unit stops the vacuum source in response to the adhesion of the solder balls to the electrodes of the substrate. The control unit drives the vertical drive source to move the push-out unit upward. According to this aspect, the control of the control unit enables the solder balls to be stably placed on the electrodes of the substrate that are the target for the solder balls to be placed.

[0082] (Third embodiment) Next, a solder ball mounting device according to a third embodiment will be described with reference to the drawings. The solder ball mounting device of this embodiment has a simplified configuration of the solder ball mounting devices of the first and second embodiments.

[0083] 21 and 22 are conceptual diagrams showing an example of the configuration of a solder ball mounting device 30 of this embodiment. The solder ball mounting device 30 includes a suction block 31, a push-out unit 32, a thin plate 33, and a vertical drive source 35. Fig. 22 shows a state in which the push-out unit 32 is pushed downward.

[0084] The suction block 31 has multiple holes formed in multiple locations, including positions aligned with the electrodes of the substrate on which the solder balls are to be mounted, and the interior can be depressurized by exhausting using a vacuum source. The push-out unit 32 vertically detaches the thin plate 33 from the underside of the suction block 31. The thin plate 33 is placed on the underside of the suction block 31, and multiple suction holes H are formed at positions aligned with the positions of the electrodes on the substrate. The vertical drive source 35 moves the push-out unit 32 up and down.

[0085] The solder ball mounting device of this embodiment includes a thin plate that can be attached and detached from the underside of a suction block. When solder balls are mounted on a substrate, the thin plate deforms along the warp of the substrate. This allows multiple solder balls to be pressed against the electrodes with a uniform force, conforming to the warp of the substrate. According to this embodiment, the solder balls adhere stably to the electrodes, preventing them from being carried away by the suction block, and allowing the solder balls to be stably mounted on the electrodes of the substrate on which they are to be mounted.

[0086] (Hardware) Next, a hardware configuration for executing control and processing according to each embodiment of the present disclosure will be described with reference to the drawings. Here, an information processing device 90 (computer) shown in FIG. 23 is given as an example of such a hardware configuration. The information processing device 90 in FIG. 23 is an example of a configuration for executing control and processing according to each embodiment, and does not limit the scope of the present disclosure.

[0087] As shown in Fig. 23, an information processing device 90 includes a processor 91, a main storage device 92, an auxiliary storage device 93, an input / output interface 95, and a communication interface 96. In Fig. 23, interface is abbreviated as I / F (Interface). The processor 91, the main storage device 92, the auxiliary storage device 93, the input / output interface 95, and the communication interface 96 are connected to each other via a bus 98 so as to be able to communicate data with each other. The processor 91, the main storage device 92, the auxiliary storage device 93, and the input / output interface 95 are also connected to a network such as the Internet or an intranet via the communication interface 96.

[0088] The processor 91 loads a program (instructions) stored in an auxiliary storage device 93 or the like onto the main storage device 92. For example, the program is a software program for executing the control and processing of each embodiment. The processor 91 executes the program loaded onto the main storage device 92. The processor 91 executes the program to execute the control and processing of each embodiment.

[0089] The main memory device 92 has an area in which a program is loaded. The processor 91 loads a program stored in the auxiliary memory device 93 or the like into the main memory device 92. The main memory device 92 is realized by a volatile memory such as a DRAM (Dynamic Random Access Memory). Alternatively, a non-volatile memory such as an MRAM (Magneto-resistive Random Access Memory) may be configured / added to the main memory device 92.

[0090] The auxiliary storage device 93 stores various data such as programs. The auxiliary storage device 93 is realized by a local disk such as a hard disk or flash memory. Note that it is also possible to configure the main storage device 92 to store various data, thereby omitting the auxiliary storage device 93.

[0091] The input / output interface 95 is an interface for connecting the information processing device 90 to peripheral devices based on standards and specifications. The communication interface 96 is an interface for connecting to external systems and devices via a network such as the Internet or an intranet based on standards and specifications. The input / output interface 95 and the communication interface 96 may be a common interface for connecting to external devices.

[0092] Input devices such as a keyboard, mouse, and touch panel may be connected to the information processing device 90 as needed. These input devices are used to input information and settings. When a touch panel is used as the input device, a screen having the function of the touch panel serves as the interface. The processor 91 and the input devices are connected via an input / output interface 95.

[0093] The information processing device 90 may be equipped with a display device for displaying information. When a display device is equipped, the information processing device 90 is equipped with a display control device (not shown) for controlling the display of the display device. The information processing device 90 and the display device are connected via an input / output interface 95.

[0094] The information processing device 90 may be equipped with a drive device. The drive device acts as an intermediary between the processor 91 and a recording medium (program recording medium) to read data and programs stored on the recording medium and to write processing results of the information processing device 90 to the recording medium. The information processing device 90 and the drive device are connected via an input / output interface 95.

[0095] The above is an example of a hardware configuration for enabling control and processing according to each embodiment of the present disclosure. The hardware configuration of Fig. 23 is an example of a hardware configuration for executing control and processing according to each embodiment, and does not limit the scope of the present disclosure. A program that causes a computer to execute control and processing according to each embodiment is also included in the scope of the present disclosure.

[0096] A program recording medium on which a program according to each embodiment is recorded is also included within the scope of the present disclosure. The recording medium can be realized, for example, as an optical recording medium such as a CD (Compact Disc) or a DVD (Digital Versatile Disc). The recording medium may also be realized as a semiconductor recording medium such as a USB (Universal Serial Bus) memory or an SD (Secure Digital) card. The recording medium may also be realized as a magnetic recording medium such as a flexible disk or other recording medium. When a program executed by a processor is recorded on a recording medium, the recording medium corresponds to a program recording medium.

[0097] The components of each embodiment may be combined in any manner, may be realized by software, or may be realized by a circuit.

[0098] Although the present invention has been described above with reference to the embodiments, the present invention is not limited to the above embodiments. Various modifications that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention. [Explanation of symbols]

[0099] 10, 20, 30 Solder ball mounting equipment 11, 21 Suction block 13, 23 thin plate 15, 25, 35 Vertical drive source 16, 26 Control unit 17, 27 Vacuum source 32 Extrusion unit 120, 220 connecting plate 121 First Extrusion Shaft 123 First compression spring 126 Second Extrusion Shaft 127 Second compression spring 130 1st support 131, 231 First ejection pin 150 Connecting plate 151, 251 Second ejection pin 152 Second support 175, 275 air hose 221 Extrusion shaft 223 Compression Spring 230 Supports

Claims

1. a suction block having a plurality of holes formed at a plurality of locations including positions aligned with electrodes of a substrate on which the solder balls are to be mounted, the interior of which can be depressurized by exhausting with a vacuum source; a thin plate disposed on the lower surface of the suction block, the thin plate having a plurality of suction holes formed at positions aligned with the positions of the electrodes of the substrate; a push-out unit that vertically pushes and detaches the thin plate from the lower surface of the suction block; a vertical drive source that moves the push-out unit up and down, The extrusion unit comprises: at least one ejection pin inserted into one of a plurality of holes formed on the lower surface of the suction block and having a lower end connected to the upper surface of the thin plate; at least one push-out shaft that is inserted into a plurality of holes formed in the upper surface of the suction block and supports the push-out pin so that the push-out pin can move up and down; a connecting plate disposed on the upper surface of the suction block and to which the upper end of the push-out shaft is fixed.

2. The lower surface of the suction block is At least one first hole formed in alignment with the position of an electrode of the substrate; At least one second hole formed for sucking the thin plate; at least one third hole into which the ejector pin is inserted; 2. The solder ball mounting device according to claim 1, wherein said suction block has four corners, and four holes are formed corresponding to the four corners of said suction block.

3. The extrusion unit comprises: at least one support disposed within the fourth hole and fixed to an upper surface of the thin plate; At least one of the ejector pins is At least one first ejection pin whose lower end is supported by the support; 3. The solder ball mounting device according to claim 2, further comprising: at least one second ejection pin inserted into said third hole and having a lower end fixed to the upper surface of said thin plate.

4. At least one of the extrusion shafts is At least one of the first ejection pin and the second ejection pin is supported so as to be movable up and down; The ejection shaft supporting the first ejection pin includes: a storage space for storing an upper end portion of the first ejection pin; The ejection shaft supporting the second ejection pin includes: a storage space for storing an upper end portion of the second ejection pin; 4. The solder ball mounting device according to claim 3, wherein a compression spring is disposed between the ceiling surface of the storage space in which the upper end portion of the first ejector pin is stored and the upper surface of the first ejector pin, and between the ceiling surface of the storage space in which the upper end portion of the second ejector pin is stored and the upper surface of the second ejector pin.

5. At least one first support disposed within the fourth hole and fixed to the upper surface of the thin plate; a second support that supports a lower end of one of the at least one extrusion shafts; a connecting plate having an upper surface to which the second support tool is fixed, At least one of the ejector pins is At least one first ejection pin whose lower end is supported by the first support; at least one second ejection pin having an upper end connected to the lower surface of the connecting plate, inserted into the third hole, and having a lower end fixed to the upper surface of the thin plate; The extruded shaft comprises: at least one first extrusion shaft whose lower end is supported by the first support; a second push-out shaft whose upper end is connected to the central portion of the lower surface of the connecting plate, whose upper end is inserted into a hole formed in the center of the upper surface of the suction block, and whose lower end is supported by the second support.

6. The first extrusion shaft a storage space for storing an upper end portion of the first ejection pin; The second extrusion shaft is It has a narrowed portion at the lower part, 6. The solder ball mounting device according to claim 5, wherein compression springs are arranged between the ceiling surface of the storage space and the upper surface of the first ejector pin, and between the upper surface of the narrowed portion of the second ejector shaft and the upper surface of the second support.

7. a control unit for controlling the vertical drive source and the vacuum source, The control unit With the solder balls set below the suction block, the vacuum source is operated; With the substrate positioned downward, the vertical drive source is driven to move the push-out unit downward; deactivating the vacuum source in response to the attachment of the solder balls to the electrodes of the substrate; 7. The solder ball mounting device according to claim 1, wherein the push-out unit is moved upward by driving the vertical drive source.

8. a thin plate disposed on the underside of the suction block and having a plurality of suction holes formed at positions aligned with the positions of the electrodes of the substrate; a push-out unit for attaching and detaching the thin plate in the up and down direction from the underside of the suction block; and a vertical drive source for moving the push-out unit up and down, wherein the push-out unit includes at least one push-out pin inserted into one of a plurality of holes formed in the underside of the suction block and having a lower end connected to an upper surface of the thin plate, at least one push-out shaft inserted into a plurality of holes formed in the upper surface of the suction block and supporting the push-out pin so that it can move up and down; and a connecting plate disposed on the upper surface of the suction block and to which an upper end of the push-out shaft is fixed, The computer With the solder balls set below the suction block, the vacuum source is operated; With the substrate positioned downward, the vertical drive source is driven to move the push-out unit downward; deactivating the vacuum source in response to attachment of the solder balls to the electrodes of the substrate; A control method for driving the vertical drive source to move the push-out unit upward.

9. a thin plate disposed on the underside of the suction block and having a plurality of suction holes formed at positions aligned with the positions of the electrodes of the substrate; a push-out unit for attaching and detaching the thin plate in the up and down direction from the underside of the suction block; and a vertical drive source for moving the push-out unit up and down, wherein the push-out unit has at least one push-out pin inserted into one of a plurality of holes formed in the underside of the suction block and having a lower end connected to an upper surface of the thin plate, at least one push-out shaft inserted into a plurality of holes formed in the upper surface of the suction block and supporting the push-out pin so that it can move up and down; and a connecting plate disposed on the upper surface of the suction block and to which an upper end of the push-out shaft is fixed, a step of operating the vacuum source while the solder balls are set below the suction block; a process of driving the vertical drive source to move the push-out unit downward in a state where the substrate is aligned downward; deactivating the vacuum source in response to the solder balls adhering to the electrodes of the substrate; and a process of driving the vertical drive source to move the push-out unit upward.

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