Component mounting system and component mounting method

Abstract

To provide a component mounting system capable of achieving satisfactory mounting accuracy for various parts mounted on a board, and a component mounting method.SOLUTION: The component mounting method includes the steps of: taking an image of the part held by the nozzle to obtain a piece of first misalignment information of a component to a nozzle based on the captured image (ST2); mounting the component onto the board based on the first misalignment information (ST3); determining the propriety of using the correction value at the time of mounting based on the first misalignment information (ST6, ST7); when determining that the correction value is used, calculating the correction value based on a piece of second misalignment information of components mounted on the board (ST8); and subsequently mounting the component onto the board based on the first misalignment information and the correction value (ST10).SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present invention relates to a component mounting system and a component mounting method for mounting components on a board. [Background technology]

[0002] A known component mounting system for mounting components on a board includes an inspection device that inspects the mounting state, such as misalignment, of the components mounted on the board by the component mounting device, calculates a correction value for mounting the components on the board based on the inspection results of the inspection device, and the component mounting device mounts the components on the board based on the correction value (for example, Patent Document 1).The system described in Patent Document 1 discloses that the effect of correction can be grasped by feedback of the inspection results by displaying an evaluation value after correction based on the inspection results and the correction value so that it is possible to compare the evaluation value when there is no correction. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-139364 Summary of the Invention [Problem to be solved by the invention]

[0004] However, there are known components that, due to variations in component shape and external dimensions, can become unstable when component mounting is performed using feedback correction values ​​from inspection results. Therefore, there is room for further improvement in order to achieve good mounting accuracy for a variety of components mounted on a board.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a component mounting system and a component mounting method that can achieve good mounting accuracy for a variety of components to be mounted on a board. [Means for solving the problem]

[0006] A component mounting system of the present invention includes a nozzle that holds a component; an imaging unit that images the component held by the nozzle; an acquisition unit that acquires first positional deviation information of the component relative to the nozzle based on the captured image; a correction value calculation unit that calculates a correction value for mounting the component on a board based on board inspection information that includes at least second positional deviation information of the component mounted on the board; a component mounting unit that mounts the component held by the nozzle on a board based on the first positional deviation information and the correction value; and a determination unit that determines whether or not to use the correction value during mounting based on the first positional deviation information. The determination unit determines that the correction value should be used if the distribution of data related to the first positional deviation information follows a normal distribution. . Furthermore, a component mounting system of the present invention includes a nozzle that holds a component, an imaging unit that images the component held by the nozzle, an acquisition unit that acquires first positional misalignment information of the component relative to the nozzle based on the captured image, a correction value calculation unit that calculates a correction value for mounting the component on a board based on board inspection information including at least second positional misalignment information of the component mounted on the board, a component mounting unit that mounts the component held by the nozzle on a board based on the first positional misalignment information and the correction value, and a judgment unit that judges whether or not to use the correction value during mounting based on the first positional misalignment information, and if the distribution of data related to the first positional misalignment information does not follow a normal distribution, the judgment unit judges whether or not to use the correction value based on the kurtosis of the data.

[0007] A component mounting method of the present invention includes capturing an image of a component held by a nozzle, acquiring first positional deviation information of the component relative to the nozzle based on the captured image, mounting the component on a board based on the first positional deviation information, determining whether or not to use a correction value during mounting based on the first positional deviation information, and if it is determined that the correction value should be used, calculating the correction value based on second positional deviation information of the component mounted on the board, and then mounting the component on the board based on the first positional deviation information and the correction value. In determining whether or not to use the correction value, if the distribution of data related to the first positional deviation information follows a normal distribution, it is determined that the correction value should be used. . Furthermore, a component mounting method of the present invention includes capturing an image of a component held by a nozzle, obtaining first positional deviation information of the component relative to the nozzle based on the captured image, mounting the component on a board based on the first positional deviation information, determining whether or not to use a correction value during mounting based on the first positional deviation information, and if it is determined that the correction value should be used, calculating the correction value based on second positional deviation information of the component mounted on the board, and then mounting the component on the board based on the first positional deviation information and the correction value. In determining whether or not to use the correction value, if the distribution of data related to the first positional deviation information does not follow a normal distribution, determining whether or not to use the correction value is based on the kurtosis of the data. [Effects of the Invention]

[0008] According to the present invention, good mounting accuracy can be achieved for a variety of components mounted on a board. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram illustrating the configuration of a component mounting system according to an embodiment of the present invention. [Figure 2] FIG. 1 is a plan view showing a configuration of a main part of a component mounting device provided in a component mounting system according to an embodiment of the present invention. [Figure 3] FIG. 1 is a side view showing a configuration of a main part of a component mounting apparatus according to an embodiment of the present invention; [Figure 4] FIG. 1 is a diagram illustrating the configuration of a mounting head and a component supply unit of a component mounting device according to an embodiment of the present invention; [Figure 5] FIG. 1 is a block diagram showing the configuration of a control system of a component mounting system according to an embodiment of the present invention. [Figure 6] FIG. 10 is an explanatory diagram of the amount of component mounting position deviation acquired by the inspection device according to the embodiment of the present invention. [Figure 7] FIG. 10 is an explanatory diagram of the amount of component pickup position deviation acquired in the component mounting device according to the embodiment of the present invention; [Figure 8] FIG. 10 is an explanatory diagram of the relationship between the pickup position deviation amount and the correction value during mounting in the component mounting device according to the embodiment of the present invention. [Figure 9] FIG. 1A is an explanatory diagram of an example of a normal distribution of pickup position deviation amounts acquired in a component mounting system according to an embodiment of the present invention; FIG. 1B is an explanatory diagram of an example of a non-normal distribution with high kurtosis; and FIG. 1C is an explanatory diagram of an example of a non-normal distribution with low kurtosis. [Figure 10] 1A and 1B show an example of a component that may be subject to significant misalignment when a calculated correction value is used in a component mounting system according to an embodiment of the present invention. FIG. 1B is an explanatory diagram of an image of the pickup position. FIG. 1C is a plan view showing the component mounted on the board. [Figure 11] 1 is a flow diagram of a component mounting method in a component mounting system according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanatory purposes and can be modified as appropriate depending on the specifications of the component mounting system, management computer, component mounting device, and inspection device. Corresponding elements in all drawings will be denoted by the same reference numerals, and redundant description will be omitted. In FIG. 2 and some of the drawings described below, two axes perpendicular to each other in a horizontal plane are shown: the X-axis (left-right direction in FIG. 2) in the substrate transport direction, and the Y-axis (up-down direction in FIG. 2) perpendicular to the substrate transport direction. In FIG. 3 and some of the drawings described below, the Z-axis (up-down direction in FIG. 3) is shown as the height direction perpendicular to the horizontal plane. In FIG. 4 and some of the drawings described below, the θ-direction is shown, which is the direction of rotation around the Z-axis.

[0011] First, the configuration of component mounting system 1 will be described with reference to Figure 1. Component mounting system 1 has the function of mounting components on a board to produce a mounted board. Component mounting system 1 is equipped with solder printing device M1, component mounting devices M2 and M3, and inspection device M4. These devices are connected to management computer 3 via communication network 2. Note that the number of component mounting devices M2 and M3 equipped in component mounting system 1 is not limited to two, and may be one, three, or more.

[0012] The solder printing device M1 screen-prints cream solder for component bonding onto the substrate to be mounted. The component mounting devices M2 and M3 perform a component mounting operation in which the component mounting unit 12 picks up components from the component supply unit 7 and transfers and mounts them onto the substrate 6 on which the cream solder for component bonding has been printed (see FIG. 2). The inspection device M4 uses an inspection camera 32 (see FIG. 5) to inspect the state of components mounted on the substrate 6 on which the components have been mounted by the component mounting devices M2 and M3, acquires information such as deviations in the mounting positions from the correct positions of the components, and judges the quality of the mounted substrate. In addition to its line management function, the management computer 3 has the function of judging the appropriateness of the use of correction values ​​in the component mounting devices M2 and M3 based on the deviations in the component pickup positions acquired by the component mounting devices M2 and M3.

[0013] Next, the configuration of component mounting devices M2 and M3 will be described with reference to Figures 2 and 3. Figure 3 schematically shows a portion of component mounting devices M2 and M3 in Figure 2. Component mounting devices M2 and M3 have the function of performing mounting work, which involves mounting components supplied from a component supply unit 7 onto a board 6. In Figure 2, a board transport mechanism 5 is arranged along the X-axis in the center of base 4. The board transport mechanism 5 transports the board 6 transported from upstream to the mounting work position, positions it, and holds it. In addition, the board transport mechanism 5 transports the board 6 downstream after the component mounting work has been completed.

[0014] Component supply units 7 are arranged on both sides (front side and rear side) of the board transport mechanism 5. Each component supply unit 7 has multiple tape feeders 8 arranged along the X axis. The tape feeders 8 feed a carrier tape, on which pockets for storing components are formed, by pitch feed in a direction (tape feed direction) from the outside of the component supply unit 7 toward the board transport mechanism 5, thereby supplying components to a component suction position where a mounting head 11 of a component mounting unit 12 suctions the components.

[0015] 2 and 3, a Y-axis table 9 equipped with a linear drive mechanism is arranged along the Y-axis at both ends of the X-axis on the top surface of the base 4. Two beams 10 (on the front and rear sides), also equipped with linear drive mechanisms, are connected to the Y-axis table 9 so that they can move freely along the Y-axis. The beams 10 are arranged along the X-axis. A mounting head 11 is attached to each of the two beams 10 so that it can move freely along the X-axis. The mounting head 11 is equipped with multiple (eight in this example) suction units 11a that pick up and hold components D and can move up and down. A nozzle 11b that picks up and holds a component D is attached to the lower end of each suction unit 11a.

[0016] 2, by driving the Y-axis table 9 and the beam 10, the mounting head 11 moves in the horizontal direction (X-axis direction, Y-axis direction). As a result, the two mounting heads 11 pick up and remove components D from the component suction positions of the tape feeders 8 arranged in the corresponding component supply units 7 using the nozzles 11b, and mount them at the mounting points of the board 6 positioned by the board transport mechanism 5. In other words, the Y-axis table 9, the beam 10, and the mounting heads 11 constitute a component mounting unit 12 that mounts the components D on the board 6.

[0017] 2 and 3, a component recognition camera 13 is disposed between the component supply unit 7 and the board transport mechanism 5. When the mounting head 11, which has picked up a component D from the component supply unit 7, moves above the component recognition camera 13, the component recognition camera 13 captures an image of the component D held by the nozzle 11b. In other words, the component recognition camera 13 is an imaging unit that captures an image of the component D held by the nozzle 11b. From the imaging result, information about the pickup position deviation of the component D with respect to the nozzle 11b is obtained. A head camera 14 is attached to the plate 10a on which the mounting head 11 is attached. The head camera 14 moves integrally with the mounting head 11.

[0018] As the mounting head 11 moves, the head camera 14 moves above the board 6 positioned by the board transport mechanism 5 and captures an image of a board mark (not shown) provided on the board 6. The position of the board 6 is recognized from the image capture results. The head camera 14 also moves above the component suction position of the tape feeder 8 and captures an image of the component D housed on the carrier tape near the component suction position. The image capture results indicate the state of the supplied component D. When the mounting head 11 mounts components on the board 6, the mounting position is corrected taking into account the image capture results of the component D taken by the component recognition camera 13 and the image capture results of the board position taken by the head camera 14.

[0019] 2, touch panels 15 operated by the workers are installed at the positions where the workers work on the front and rear sides of the component mounting devices M2 and M3. The touch panels 15 display various information on their display units, and the workers input data and operate the component mounting devices M2 and M3 using operation buttons and the like displayed on the display units.

[0020] 3, a carriage 16 is set in the component supply unit 7, with a plurality of tape feeders 8 pre-installed on a feeder base 16a. A plurality of slots for installing the tape feeders 8 are formed in the feeder base 16a. The tape feeders 8 installed on the carriage 16 are managed based on the position of the installed slot and the position (front side, rear side) of the carriage 16 installed on the component mounting devices M2, M3. The carriage 16 holds a tape reel 18 that stores a wound carrier tape 17 holding components D. The carrier tape 17 pulled out from the tape reel 18 is pitch-fed to a component suction position by a tape feeding mechanism (not shown) built into the tape feeder 8.

[0021] Next, the configuration of the mounting head 11 will be described with reference to Figure 4. The mounting head 11 is equipped with multiple suction units 11a, and each suction unit 11a is equipped with a drive mechanism (not shown). By driving the drive mechanism, a shaft 11c having a nozzle 11b attached to its lower end moves up and down (arrow a), and the shaft 11c rotates, causing the nozzle 11b to rotate in the θ direction around the nozzle axis AN (arrow b).

[0022] Next, the configuration of the control system of component mounting system 1 will be described with reference to FIG. 5. Among the functions possessed by component mounting system 1, the following will focus on the function of determining whether or not to use a correction value in component mounting devices M2 and M3 based on pickup position deviation information (first position deviation information) of component D held by nozzle 11b. Management computer 3, component mounting devices M2 and M3, and inspection device M4 are interconnected via communication network 2. Component mounting devices M2 and M3 each include a mounting control device 20, a board conveying mechanism 5, a tape feeder 8, a component mounting unit 12, a component recognition camera 13, a head camera 14, and a touch panel 15. Mounting control device 20 includes a mounting memory unit 21, an acquisition unit 22, a mounting control unit 23, and a mounting communication unit 24.

[0023] Mounting communication unit 24 transmits and receives data to and from inspection device M4 and management computer 3 via communication network 2. Mounting memory unit 21 is a storage device that stores mounting data 21a, correction value information 21b, correction suitability information 21c, suction deviation information 21d, etc. Mounting data 21a includes information such as the production model name of the mounted board (board name), the type (component name) of component D to be mounted on board 6, the mounting position (XY coordinates), the mounting direction (θ direction), the mounting position of tape feeder 8 that supplies component D, and the mounting position of nozzle 11b.

[0024] The correction value information 21b stores correction values ​​calculated by the inspection device M4 when mounting the component D on the board 6, which are transmitted from the inspection device M4. The correction value information 21c stores, for each type of component D, information on whether or not to use a correction value when mounting the component D on the board 6. The acquisition unit 22 acquires pickup position deviation information (pickup position deviation amounts Xb, Yb) of the component D relative to the nozzle 11b based on an image of the component D held by the nozzle 11b captured by the component recognition camera 13 (imaging unit) during mounting by the component mounting unit 12. The acquired pickup position deviation information (first position deviation information) is stored in the mounting storage unit 21 as pickup position deviation information 21d. The acquired pickup position deviation information is also transmitted to the management computer 3 and stored in the management storage unit 41 as pickup position deviation information 41c.

[0025] 7, the pickup position deviation information (first position deviation information) of the component D relative to the nozzle 11b acquired by the acquisition unit 22 will be described based on the captured image 13a of the component D held by the nozzle 11b captured by the component recognition camera 13 (imaging unit). The captured image 13a displays a center line 13x in the X-axis direction and a center line 13y in the Y-axis direction superimposed on each other. The intersection of the center line 13x in the X-axis direction and the center line 13y in the Y-axis direction is the center 13c of the captured image 13a. During imaging, control is performed so that the center 13c of the captured image 13a coincides with the center Q of the nozzle 11b. In other words, the center 13c of the captured image 13a (center Q of the nozzle 11b) is the original pickup target position.

[0026] The acquiring unit 22 detects the center Cb of the component D from the outline of the component D in the captured image 13a. Furthermore, the acquiring unit 22 calculates the pickup position deviation amount Xb in the X-axis direction and the pickup position deviation amount Yb in the Y-axis direction from the positions of the center 13c of the captured image 13a and the center Cb of the component D. Hereinafter, the pickup position deviation amount Xb in the X-axis direction and the pickup position deviation amount Yb in the Y-axis direction will be referred to as the "pickup position deviation amounts Xb, Yb." The bottom surface Db of the component D is captured in the captured image 13a (see FIG. 10(a)). Therefore, the center Cb of the component D in the captured image 13a is the center Cb of the bottom surface Db of the component D.

[0027] 5, mounting control unit 23 controls tape feeder 8, component mounting unit 12, component recognition camera 13, and head camera 14 to mount component D on board 6 based on the mounting position and mounting direction included in mounting data 21a, the correction value included in correction value information 21b, the suitability information of the correction value included in correction suitability information 21c, and the suction position deviation information (first position deviation information) included in suction deviation information 21d. That is, component mounting unit 12 corrects the position of mounting head 11 based on the position of board 6 imaged by head camera 14, the suction position deviation information, and the correction value included in correction value information 21b, and mounts component D on board 6. In this case, component mounting unit 12 uses the correction value for component D designated as "suitable" in the suitability information included in correction suitability information 21c, and mounts component D on board 6 without using the correction value for component D designated as "unsuitable."

[0028] 5, inspection device M4 includes an inspection control device 30, a board conveying mechanism 31, an inspection camera 32, and an inspection camera moving mechanism 33. Inspection control device 30 includes an inspection memory unit 34, an inspection control unit 35, a recognition processing unit 36, a correction value calculation unit 37, and an inspection communication unit 38. The inspection communication unit 38 transmits and receives data to and from component mounting devices M2 and M3 and management computer 3 via communication network 2. Inspection memory unit 34 is a storage device that stores inspection data 34a and the like. Inspection data 34a includes the production model name of the mounted board (board name), the type of component (component name) mounted on board 6, the mounting position (XY coordinates), the mounting direction (θ direction), and a defect determination value.

[0029] The inspection control unit 35 controls the board transport mechanism 31 to transport the mounted board 6 transported from the upstream component mounting device M3 into the inspection work position, position it, and hold it there, and then transport the board 6 downstream after the inspection work has been completed. Furthermore, the inspection control unit 35 controls the inspection camera moving mechanism 33 based on the inspection data 34a to move the inspection camera 32 sequentially above the mounting position of the board 6 held at the inspection work position, and causes the inspection camera 32 to capture images of the components D mounted on the board 6.

[0030] 5, the recognition processing unit 36 ​​recognizes and processes the image captured by the inspection camera 32 to calculate the mounting position deviation amounts ΔX, ΔY, and Δθ (see FIG. 6) of the component D mounted on the board 6 from the correct mounting position N. Furthermore, if the calculated mounting position deviation amounts ΔX, ΔY, and Δθ exceed the defective judgment values ​​included in the inspection data 34a, the recognition processing unit 36 ​​determines that the component D is defective. Furthermore, the recognition processing unit 36 ​​creates, for each board 6, board inspection information 41b including second position deviation information (mounting position deviation amounts ΔX, ΔY, and Δθ) of the component D mounted on the board 6 and a pass / fail judgment result for the mounted board, and transmits the board inspection information 41b to the management computer 3. The management processing device 40 of the management computer 3 stores the received board inspection information 41b in the management storage unit 41.

[0031] 6, an example of a method for calculating mounting position deviation amounts ΔX, ΔY, Δθ (second position deviation information) of component D mounted on board 6 from its normal mounting position N, performed by recognition processing unit 36, will be described. Inspection control unit 35 causes inspection camera 32 to capture an image of component D mounted on board 6 at a position where the center of image capture coincides with the normal mounting position N of component D. Recognition processing unit 36 ​​detects center C of mounted component D by performing recognition processing on the captured image.

[0032] Then, the recognition processing unit 36 ​​calculates the positional deviation ΔX in the X-axis direction and the positional deviation ΔY in the Y-axis direction from the difference between the center C(ΔX, ΔY) and the mounting position N(0,0). Furthermore, the recognition processing unit 36 ​​calculates the tilt of the component D in the θ direction as the positional deviation Δθ. The top surface Da of the component D appears in the image captured by the inspection camera 32 (see FIGS. 10(b) and 10(c)). Therefore, the center C(ΔX, ΔY) recognized by the recognition processing unit 36 ​​is the center C of the top surface Da of the component D.

[0033] 5, correction value calculation unit 37 calculates a correction value to be used by component mounting devices M2 and M3 when mounting component D on board 6, based on the mounting position deviation amounts ΔX, ΔY, and Δθ (second position deviation information) of component D calculated by recognition processing unit 36. Correction value calculation unit 37 also creates correction value information including the calculated correction value and transmits it to component mounting devices M2 and M3. Mounting control device 20 of component mounting devices M2 and M3 stores the received correction value information in mounting storage unit 21 as correction value information 21b.

[0034] 8, a method for calculating the correction value ΔCn by the correction value calculation unit 37 will be described. First, the correction value calculation unit 37 calculates the average center position Cn(Xn, Yn) of the component D from the mounting position deviations ΔX, ΔY, and Δθ of a predetermined number of boards 6 (e.g., 30 boards) included in the board inspection information 41b for the boards 6 on which the component D is mounted, without using the correction value ΔCn. The average center position Cn(Xn, Yn) corresponds to the amount of positional deviation caused by factors that cannot be eliminated by correcting the mounting position by taking into account the pickup position deviations Xb, Yb of the component D held by the nozzle 11b during component mounting and the board position deviation of the board position. Therefore, the correction value calculation unit 37 calculates the correction value ΔCn(Xc(Xc=-Xn), Yc(Yc=-Yn)) from the average center position Cn(Xn, Yn) so that the center of the component D is aligned with the mounting position N(0,0) (arrow c).

[0035] When calculating the latest correction value ΔCn(Xc, Yc) from the board inspection information 41b of the board 6 using the correction value ΔCn1(Xc1, Yc1), the correction value calculation unit 37 calculates the latest correction value ΔCn(Xc(Xc=Xc1-Xn), Yc(Yc=Yc1-Yn)) from the used correction value ΔCn1(Xc1, Yc1) and the average center position Cn(Xn, Yn) calculated from the board inspection information 41b. In this way, the correction value calculation unit 37 calculates the correction value ΔCn(Xc, Yc) when mounting the component D on the board 6 based on the board inspection information 41b including at least the second positional deviation information (mounting positional deviation amounts ΔX, ΔY, Δθ) of the component D mounted on the board 6.

[0036] Next, with reference to FIG. 8, correction of various positional deviations during mounting by the component mounting unit 12 will be described. Note that in FIG. 8, for simplicity, the positional deviation of the board position is assumed to be zero. The center Cb of the component D held by the nozzle 11b during mounting is (Xb, Yb). If the correction value ΔCn is not used, the component mounting unit 12 corrects the position of the nozzle 11b by the first correction amount ΔCb1 (-Xb, -Yb) (arrow d) based on the pickup positional deviation amount Xb, Yb (first positional deviation information) and mounts the component D on the board 6. However, due to factors that cannot be resolved even by correcting the pickup positional deviation amount Xb, Yb (first positional deviation information), the center C of the component D will be mounted at the average center position Cn (arrow e).

[0037] Therefore, the mounting target position P is set to (Xc(-Xn), Yc(-Yn)) by moving it from the mounting position N(0,0) by the correction value ΔCn (arrow f) so that the component D is mounted at the correct mounting position N(0,0). That is, when the correction value ΔCn is used, the component mounting unit 12 corrects the position of the nozzle 11b (arrow g) by the second correction amount ΔCb2 (-Xb+Xc, -Yb+Yc) based on the pickup position deviation amounts Xb, Yb (first position deviation information) and the correction value ΔCn(Xc, Yc), and mounts the component D on the board 6. This ensures that the center C of the component D mounted on the board 6 coincides with the correct mounting position N(0,0). In this way, the component mounting unit 12 mounts the component D on the board 6 based on the correction value ΔCn.

[0038] 5, the management processing device 40 of the management computer 3 includes a management storage unit 41, a judgment unit 42, a setting unit 43, an input unit 44, a display unit 45, and a management communication unit 46. The input unit 44 is an input device such as a keyboard, a touch panel, or a mouse, and is used to input operation commands and data. The display unit 45 is a display device such as a liquid crystal panel, and displays various information such as various screens, including an operation screen for operation by the input unit 44. The management communication unit 46 is a communication interface, and transmits and receives signals and data to and from the component mounting devices M2 and M3 and the inspection device M4 via the communication network 2.

[0039] Management memory unit 41 is a storage device that stores production data 41a, board inspection information 41b, suction deviation information 41c, etc. Production data 41a includes information such as the name of the production model of the mounted board (board name), the type (component name) of component D to be mounted on board 6, the size of component D, the mounting position (XY coordinates), the mounting direction (θ direction), information specifying component mounting devices M2 and M3 (component mounting unit 12) that mount component D, the mounting position of tape feeder 8 that supplies component D, and the mounting position of nozzle 11b.

[0040] 5, the determination unit 42 determines whether or not to use the correction value ΔCn during mounting based on the pickup position shift amounts Xb in the X-axis direction and the pickup position shift amount Yb in the Y-axis direction, which are pickup position shift amounts Xb, Yb (first position shift information) included in the pickup position shift information 41c. Specifically, the determination unit 42 determines whether or not to use the correction value ΔCn based on the degree of deviation of the distribution of data related to the pickup position shift amounts Xb, Yb (first position shift information) from a normal distribution.

[0041] Here, with reference to FIGS. 9(a) to 9(c), an example of data distribution and determination by the determination unit 42 as to the appropriateness of using the correction value ΔCn will be described. The graphs shown in FIGS. 9(a) to 9(c) are examples in which data relating to the pickup position deviation amount Xb in the X-axis direction or the pickup position deviation amount Yb in the Y-axis direction is represented in the form of a histogram. The determination unit 42 determines whether or not to use the correction value ΔCn for each of the pickup position deviation amount Xb in the X-axis direction and the pickup position deviation amount Yb in the Y-axis direction. If both are "appropriate," the determination unit 42 determines that the correction value ΔCn should be used, and if either is "inappropriate," the determination unit 42 determines that the correction value ΔCn should not be used.

[0042] FIG. 9( a) shows an example in which the data distribution follows a normal distribution G. For example, if the determination unit 42 determines that the data distribution follows a normal distribution G using a method such as a kurtosis test, a skewness test, a Shapiro-Wickle test, or a Kolmogorov-Smirnov test, the determination unit 42 determines to use the correction value ΔCn. Furthermore, if the data distribution does not follow a normal distribution, the determination unit 42 determines whether or not to use the correction value ΔCn based on the kurtosis of the data distribution. For example, if the kurtosis of the data distribution is equal to or greater than a predetermined value (e.g., 5), the determination unit 42 determines to use the correction value ΔCn. Alternatively, the determination unit 42 may determine whether or not to use the correction value ΔCn based on a combination of the skewness and kurtosis of the data distribution. For example, the determination unit 42 determines to use the correction value ΔCn if the absolute value of the skewness is equal to or less than 1 and the kurtosis is equal to or greater than -0.2.

[0043] 9(b) shows an example where the kurtosis is equal to or greater than a predetermined value, and FIG. 9(c) shows an example where the kurtosis is less than the predetermined value. Kurtosis is a numerical value that indicates the degree of peaking of the data distribution or the extent of the spread of the data's tail. In other words, a large kurtosis indicates that the data distribution is peaked (narrow tail), and a small kurtosis indicates that the data distribution is not peaked (wide tail). Therefore, even if the data distribution does not follow a normal distribution, the judgment unit 42 judges that the correction value ΔCn should be used if the kurtosis of the data distribution is large and the tail of the data distribution is narrow.

[0044] Here, referring to FIG. 10, an example of component D1 in which the distribution of data related to pickup positional deviation amounts Xb, Yb (first positional deviation information) may deviate from normal distribution G will be described. FIG. 10(a) is a schematic side view of component D1 held by nozzle 11b being imaged by component recognition camera 13. FIG. 10(b) is a schematic top view of component D1 mounted on substrate 6. FIG. 10(c) is a schematic side view of component D1 mounted on substrate 6. Component D1 is a chip component in which the center C of its upper surface Da is misaligned from the center Cb of its lower surface Db. That is, component D1 has a cross-sectional shape of a parallelogram, and the center C of its upper surface Da and the center Cb of its lower surface Db are misaligned in the horizontal direction by an error E.

[0045] The pickup position deviation amounts Xb, Yb (first position deviation information) obtained from the image captured by the component recognition camera 13 are obtained from the center Cb of the bottom surface Db of the component D1. Furthermore, the mounting position deviation amounts ΔX, ΔY (second position deviation information) obtained from the image captured by the inspection camera 32 are obtained from the center C of the top surface Da of the component D1. When the component D1 having a parallelogram cross section is accommodated in the pocket of the carrier tape 17 with the sides Dd and Dd oriented irregularly, the component D1 will be held by the nozzle 11b with the sides Dd and Dd oriented irregularly.

[0046] For such components D1, the amount and direction of error E differ for each component D1, resulting in low repeatability of the position of the center Cb of the component D1 held by the nozzle 11b, and the correction value ΔCn calculated by the correction value calculation unit 37 does not necessarily correct the misalignment during mounting in the correct direction. Therefore, using the correction value ΔCn during mounting may not result in the mounting position misalignment amounts ΔX and ΔY of the component D1 converging. Because the error E due to the shape of the component D differs depending on the type of component D and the manufacturer that manufactures the component D, the judgment unit 42 judges whether or not to use the correction value ΔCn for each type of component D and each manufacturer of the component D.

[0047] 5, the setting unit 43 sets the component mounting unit 12 to use the correction value ΔCn when the determination unit 42 determines that the use of the correction value ΔCn is appropriate. Also, the setting unit 43 sets the component mounting unit 12 not to use the correction value ΔCn when the determination unit 42 determines that the use of the correction value ΔCn is inappropriate (inappropriate). Specifically, the setting unit 43 changes (sets) the information of "appropriate" or "inappropriate" in the correction appropriateness information 21c stored in the component mounting devices M2 and M3 that mount the component D for which the appropriateness of the correction value ΔCn is to be changed.

[0048] As a result, the component mounting units 12 of the component mounting devices M2 and M3 mount the component D on the board 6 using the second correction amount ΔCb2 that uses the correction value ΔCn or the first correction amount ΔCb1 that does not use the correction value ΔCn, in accordance with the setting of the changed correction suitability information 21c. In other words, the setting unit 43 sets whether or not to use the correction value ΔCn during mounting by the component mounting units 12.

[0049] 11, a component mounting method will be described in which the component mounting system 1 determines whether or not to use the correction value ΔCn in the component mounting devices M2 and M3 based on the pickup positional deviation information (first positional deviation information) of the component D held by the nozzle 11b. First, when the production of mounted boards is started in the component mounting system 1 (ST1), the component mounting devices M2 and M3 perform the component mounting work of mounting the component D on the board 6 without using the correction value ΔCn (ST3) until the first positional deviation information (pickup positional deviation amounts Xb, Yb) and second positional deviation information (mounting positional deviation amounts ΔX, ΔY) for a predetermined number of boards (e.g., 30 boards) are acquired (No in ST4).

[0050] That is, in component mounting devices M2 and M3, component recognition camera 13 (imaging unit) images components D held by nozzle 11b, and first positional deviation information (adsorption positional deviation amounts Xb and Yb) for a predetermined number of boards is acquired based on the captured images (ST2). Then, component mounting unit 12 starts mounting components onto the first board and mounts components D onto the first board with first correction amount ΔCb1 that does not use correction value ΔCn until the predetermined number of boards have been mounted (ST3).

[0051] When the first positional deviation information (adsorption positional deviation amounts Xb, Yb) for a predetermined number of sheets is acquired (Yes in ST4), the determination unit 42 analyzes the distribution of data related to the first positional deviation information (ST5: data analysis step). If the analysis result in the data analysis step (ST5) shows that the data distribution follows a normal distribution (Yes in ST6) or does not follow a normal distribution (No in ST6) but the kurtosis of the data distribution is equal to or greater than a predetermined value (Yes in ST7), the determination unit 42 determines that the correction value ΔCn should be used (appropriate).

[0052] 11, the correction value calculation unit 37 then calculates the correction value ΔCn based on the second positional deviation information (mounting positional deviation amounts ΔX, ΔY) of the predetermined number of components acquired in (ST3) (ST8: correction value calculation step). Next, the setting unit 43 sets (changes) the suitability information of the component D determined to be "suitable" in the corrected suitability information 21c of the component mounting devices M2 and M3 that mount the component D to "suitable" (ST9).

[0053] If the analysis result in the data analysis step (ST5) indicates that the data distribution does not follow a normal distribution (No in ST6) and the kurtosis of the data distribution is smaller than a predetermined value (No in ST7), the judgment unit 42 judges that the correction value ΔCn should not be used (unsuitable). In this case, the setting unit 43 does not change the suitability information of the component D judged as "unsuitable" in the correction suitability information 21c of the component mounting apparatuses M2 and M3 that mount the component D (set it to "unsuitable"). In this way, the judgment unit 42 judges the suitability of using the correction value ΔCn based on the first positional deviation information (chuck positional deviation amounts Xb and Yb) of a predetermined number of first substrates (ST6, ST7).

[0054] 11, component mounting apparatuses M2 and M3 then perform component mounting work to mount components D on board 6 based on the updated correction suitability information 21c (ST10). That is, for components D determined to be "unsuitable" in (ST6, ST7), the component mounting work continues with a first correction amount ΔCb1 that does not use the correction value ΔCn, and for components D determined to be "suitable," the component mounting work is performed with a second correction amount ΔCb2 that uses the correction value ΔCn. In this way, the suitability of the correction value ΔCn is determined for each component D according to the degree of repeatability, and an appropriate component mounting method is applied. This allows for good mounting accuracy to be achieved for a variety of components D mounted on board 6.

[0055] If the component D to be mounted on the board 6 is changed to a component D made by another manufacturer while the component mounting operation is being performed in (ST10), steps (ST2) to (ST9) are executed for the changed component D. That is, when the component D is changed during component mounting on the first board, the determination unit 42 determines whether or not to use the correction value ΔCn based on the first positional deviation information (chuck positional deviation amounts Xb, Yb) of a predetermined number of changed components D acquired in (ST2) to (ST4) for the second time (ST6, ST7 for the second time). Thereafter, if the determination is "appropriate," the setting unit 43 sets the appropriateness information for the component D in the correction appropriateness information 21c of the component mounting apparatus M2, M3 that mounts the component D to "appropriate" (ST9 for the second time).

[0056] As described above, the component mounting method of this embodiment captures an image of the component D held by the nozzle 11b, acquires first positional deviation information (adsorption positional deviation amounts Xb, Yb) of the component D relative to the nozzle 11b based on the captured image (ST2), and mounts the component D on the board 6 based on the first positional deviation information (ST3). Then, based on the first positional deviation information, it is determined whether or not to use the correction value ΔCn during mounting (ST6, ST7). If it is determined that the correction value ΔCn should be used (Yes in ST6, or No in ST6 and Yes in ST7), the correction value ΔCn is calculated based on the second positional deviation information of the component D mounted on the board 6 (ST8). Thereafter, the component D is mounted on the board 6 based on the first positional deviation information and the correction value ΔCn (ST10).

[0057] As described above, the component mounting system 1 of this embodiment includes the nozzle 11b that holds the component D, an imaging unit (component recognition camera 13) that images the component D held by the nozzle 11b, an acquisition unit 22 that acquires first positional deviation information (pickup positional deviation amounts Xb, Yb) of the component D relative to the nozzle 11b based on the captured image, a correction value calculation unit 37 that calculates a correction value ΔCn when mounting the component D on the board 6 based on board inspection information 41b that includes at least second positional deviation information (mounting positional deviation amounts ΔX, ΔY) of the component D mounted on the board 6, a component mounting unit 12 that mounts the component D held by the nozzle 11b on the board 6 based on the first positional deviation information and the correction value ΔCn, and a judgment unit 42 that judges whether or not to use the correction value ΔCn during mounting based on the first positional deviation information.

[0058] This makes it possible to determine the appropriateness of the correction value ΔCn according to the degree of repeatability for each component D, and to obtain good mounting accuracy for a variety of components D mounted on the board 6.

[0059] In the above embodiment, the inspection device M4 is configured to calculate the correction value ΔCn, but the component mounting system 1 of this embodiment is not limited to this configuration. For example, the management computer 3 may be provided with a correction value calculation unit 37, which calculates a correction value based on the board inspection information 41b and transmits it to the component mounting devices M2 and M3. Furthermore, the component mounting devices M2 and M3 may each be provided with a correction value calculation unit 37, which acquires the board inspection information 41b from the inspection device M4 and calculates the correction value ΔCn.

[0060] Furthermore, in the above embodiment, information regarding the appropriateness of use of the correction value ΔCn is stored in the mounting storage unit 21 as correction appropriateness information 21c separate from the mounting data 21a, but the storage destination of the information regarding the appropriateness of use of the correction value ΔCn is not limited to this configuration. For example, information regarding the appropriateness of use of the correction value ΔCn may be stored as information regarding component D in the mounting data 21a, or may be stored as component data regarding component D separate from the mounting data 21a. Furthermore, the acquired information regarding the appropriateness of use of the correction value ΔCn for each component D may be used in component mounting operations on different mounting boards. [Industrial Applicability]

[0061] The component mounting system and component mounting method of the present invention have the effect of being able to obtain good mounting accuracy for a variety of components to be mounted on a board, and are useful in the field of mounting components on a board. [Explanation of symbols]

[0062] 1. Component mounting system 6 PCB 11b nozzle 12 Component mounting section 13 Part recognition camera (imaging unit) D, D1 parts G normal distribution M2, M3 component mounting equipment Xb, Yb Adsorption position deviation amount (first position deviation information) ΔCn correction value ΔX, ΔY Substrate positional deviation amount (second positional deviation information)

Claims

1. a nozzle for holding the part; an imaging unit that images the component held by the nozzle; an acquisition unit that acquires first positional deviation information of the component with respect to the nozzle based on the captured image; a correction value calculation unit that calculates a correction value when mounting the component on the board based on board inspection information that includes at least second positional deviation information of the component mounted on the board; a component mounting unit that mounts the component held by the nozzle onto a board based on the first positional deviation information and the correction value; a determination unit that determines whether or not to use the correction value during mounting based on the first positional deviation information, The determination unit determines that the correction value should be used if the distribution of data related to the first positional deviation information follows a normal distribution.

2. A nozzle for holding a part; an imaging unit that images the component held by the nozzle; an acquisition unit that acquires first positional deviation information of the component with respect to the nozzle based on the captured image; a correction value calculation unit that calculates a correction value when mounting the component on the board based on board inspection information that includes at least second positional deviation information of the component mounted on the board; a component mounting unit that mounts the component held by the nozzle onto a board based on the first positional deviation information and the correction value; a determination unit that determines whether or not to use the correction value during mounting based on the first positional deviation information, When the distribution of data relating to the first positional deviation information does not follow a normal distribution, the determination unit determines whether or not to use the correction value based on the kurtosis of the data.

3. The component mounting system according to claim 2 , wherein the determining unit determines that the correction value should be used when the kurtosis of the distribution of the data is equal to or greater than a predetermined value.

4. The component mounting system according to claim 1 , wherein the determining unit determines whether or not use of the correction value is appropriate for each type of component.

5. 4. The component mounting system according to claim 1, wherein the determining unit determines whether or not use of the correction value is appropriate for each type of component and each manufacturer of the component.

6. the component mounting unit starts mounting components onto a first board and mounts the components onto the first board without using the correction value up to a predetermined number of boards; The component mounting system according to claim 1 , wherein the determining unit determines whether or not use of the correction value is appropriate based on the first misalignment information for the predetermined number of sheets.

7. If a component is changed during component mounting on the first board, The component mounting system according to claim 1 , wherein the determining unit determines whether or not to use the correction value based on the first positional deviation information for a predetermined number of the components after the component is changed.

8. An image of the part held by the nozzle is taken. acquiring first positional deviation information of the component relative to the nozzle based on the captured image; Mounting the component on a board based on the first positional deviation information; determining whether or not to use a correction value during mounting based on the first positional deviation information; If it is determined that the correction value is to be used, the correction value is calculated based on second positional deviation information of the component mounted on the board; Then, the component is mounted on the board based on the first positional deviation information and the correction value; In determining whether or not to use the correction value, if the distribution of data related to the first positional deviation information follows a normal distribution, it is determined that the correction value should be used.

9. Taking an image of a part held by a nozzle; acquiring first positional deviation information of the component relative to the nozzle based on the captured image; Mounting the component on a board based on the first positional deviation information; determining whether or not to use a correction value during mounting based on the first positional deviation information; If it is determined that the correction value is to be used, the correction value is calculated based on second positional deviation information of the component mounted on the board; Then, the component is mounted on the board based on the first positional deviation information and the correction value; A component mounting method, wherein, in determining whether or not to use the correction value, if the distribution of data related to the first positional deviation information does not follow a normal distribution, the appropriateness of using the correction value is determined based on the kurtosis of the data.

Images