Light emitting device and method for manufacturing the same

Abstract

To improve waterproof characteristics of a light-emitting device by a waterproof resin.SOLUTION: A light-emitting device includes: a resin package which includes a lead and a resin member, has a main surface, a rear face and a side face part, and has a lead having a region exposed from the resin member in a main surface; a light-emitting element arranged in the exposure region of the lead; and a mold resin part including a base part for sealing the light-emitting element and a lens part. The base part has an upper face positioned above the main surface of the resin package, and a side face part of the base part covering a part of the side face part of the resin package, in cross-sectional view, a first point is positioned on a side closer to the side of a plurality of lens parts than a second point, the second point is positioned outside a third point, the first point is an outermost side point on the upper face of the base part, the second point is an outermost side point of the side face part of the base part, the third point is an outermost side point where the side face part of the resin package is brought into contact with the side face part of the base part, and a first light-emitting element is positioned on a side closer to the rear face side of the resin package than the first point and above the second point.SELECTED DRAWING: Figure 2D

Description

[Technical Field]

[0001] The present disclosure relates to a light emitting device and a method for manufacturing the same. [Background technology]

[0002] Known light-emitting devices, including light-emitting diodes (LEDs), include leaded bullet-type (lamp-type) light-emitting devices, surface-mounted light-emitting devices, etc. Lamp-type light-emitting devices have a high light distribution in the front direction, and are therefore suitable for use in large display devices, such as LED displays, in which light-emitting devices are arranged in a matrix as pixels.

[0003] Furthermore, Patent Document 1 describes a light emitting device that has a lens on the light emitting surface side and can be surface mounted. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 10-261821 Summary of the Invention [Problem to be solved by the invention]

[0005] A non-limiting exemplary embodiment of the present disclosure provides a light emitting device that can reduce degradation of the characteristics of the light emitting device caused by a waterproof resin. [Means for solving the problem]

[0006] A light emitting device according to an embodiment of the present disclosure includes a resin package including a plurality of leads and a resin member that fixes at least a portion of the plurality of leads, the resin package having a main surface, a back surface opposite to the main surface, and a side portion that is located between the main surface and the back surface, and each of the plurality of leads having an exposed region that is exposed from the resin member on the main surface; and a plurality of light emitting elements including a first light emitting element, a second light emitting element, and a third light emitting element, each of the plurality of light emitting elements being disposed in the exposed region of any of the plurality of leads. a molded resin portion including a base portion that seals the plurality of light-emitting elements, and a plurality of lens portions located above the base portion and integrally formed with the base portion, wherein the plurality of lens portions include a first lens portion that overlaps the first light-emitting element, a second lens portion that overlaps the second light-emitting element, and a third lens portion that overlaps the third light-emitting element in a plan view, and the base portion has an upper surface located above the main surface of the resin package, and a side surface portion of the base portion that covers a part of the side surface portion of the resin package in a direction from the upper surface of the base portion toward the back surface of the resin package, In a cross-sectional view, the first point is located closer to the plurality of lens portions than the second point, and the second point is located outside than the third point, the first point is the outermost point of the top surface of the base portion, the second point is the outermost point of the side portion of the base portion, and the third point is the outermost point where the side portion of the resin package and the side portion of the base portion contact, and in a cross-sectional view, the first light-emitting element is located closer to the back surface of the resin package than the first point and above the second point.

[0007] A light emitting device according to another embodiment of the present disclosure includes a resin package including a plurality of leads and a resin member that fixes at least a portion of the plurality of leads, the resin package having a recess defined by the resin member and the plurality of leads on a main surface, and each of the plurality of leads having an exposed region exposed on an inner upper surface of the recess; a plurality of light-emitting elements including a first light-emitting element, a second light-emitting element, and a third light-emitting element arranged in the one recess of the resin package, each of the plurality of light-emitting elements being arranged in the exposed region of any of the plurality of leads; The molded resin portion includes a base portion that seals the plurality of light-emitting elements, and a plurality of lens portions located above the base portion and integrally formed with the base portion, wherein the plurality of lens portions include, in a planar view, a first lens portion that overlaps with the first light-emitting element, a second lens portion that overlaps with the second light-emitting element, and a third lens portion that overlaps with the third light-emitting element.

[0008] A manufacturing method for a light emitting device according to an embodiment of the present disclosure includes a preparation step of preparing a first structure including a resin package containing a plurality of leads and a resin, and a plurality of light emitting elements mounted on a main surface of the resin package, wherein the resin member has a first step surface on a side portion of the resin package that faces the same direction as the main surface; and a molded resin part formation step of forming a molded resin part that seals the plurality of light emitting elements in the first structure, wherein the molded resin part formation step includes a resin injection step of injecting a resin material into a casting case, a step of immersing the plurality of light emitting elements in the first structure and a portion of the resin package including the main surface in the resin material, wherein a portion of the resin material creeps up from between the side portion of the resin package and the inner wall of the casting case along the side portion of the resin package toward the first step surface, and a curing step of curing the resin material. [Effects of the Invention]

[0009] According to the embodiments of the present disclosure, it is possible to provide a light emitting device that can reduce degradation of the characteristics of the light emitting device caused by the waterproof resin. [Brief explanation of the drawings]

[0010] [Figure 1]FIG. 1 is a schematic perspective view of a light emitting device according to one embodiment of the present disclosure. [Figure 2A] FIG. 2A is a schematic side view of the light emitting device shown in FIG. 1 as viewed from the y-axis direction. [Figure 2B] FIG. 2B is a schematic side view of the light emitting device shown in FIG. 1 as viewed from the x-axis direction. [Figure 2C] FIG. 2C is a schematic top perspective view of the light emitting device shown in FIG. 1 as viewed from the z-axis direction. [Figure 2D] FIG. 2D is a schematic cross-sectional view taken along line 2D-2D shown in FIG. 2C. [Figure 2E] FIG. 2E is a schematic cross-sectional view taken along line 2E-2E shown in FIG. 2C. [Figure 2F] FIG. 2F is a schematic top perspective view showing a resin package in which a light emitting element is formed. [Figure 2G] FIG. 2G is a schematic cross-sectional view showing the resin package taken along line 2G-2G shown in FIG. 2F. [Figure 2H] FIG. 2H is a schematic cross-sectional view showing the resin package taken along line 2H-2H shown in FIG. 2F. [Figure 3A] FIG. 3A is a schematic cross-sectional view showing a part of a display device using the light-emitting device shown in FIG. [Figure 3B] 3B is a schematic enlarged cross-sectional view showing a part of the display device shown in FIG. 3A. FIG. [Figure 4A] 4A is a cross-sectional view showing a manufacturing process of the light emitting device shown in FIG. [Figure 4B] 4B is a cross-sectional view showing a manufacturing process of the light emitting device shown in FIG. [Figure 4C] 4C is a cross-sectional view showing a manufacturing process of the light emitting device shown in FIG. [Figure 4D] 4D is a cross-sectional view showing a manufacturing process of the light emitting device shown in FIG. [Figure 4E] 4E is a cross-sectional view showing a manufacturing process of the light emitting device shown in FIG. [Figure 4F] 4F is a cross-sectional view showing a manufacturing process of the light emitting device shown in FIG. [Figure 4G] 4G is a cross-sectional view showing a manufacturing process of the light emitting device shown in FIG. [Figure 5A] FIG. 5A is an enlarged cross-sectional view showing a manufacturing process of another light emitting device. [Figure 5B] FIG. 5B is an enlarged cross-sectional view showing another manufacturing process of the light emitting device. [Figure 5C] FIG. 5C is an enlarged cross-sectional view showing another manufacturing process of a light emitting device. [Figure 6A] FIG. 6A is a schematic enlarged cross-sectional view showing a part of another light-emitting device. [Figure 6B] FIG. 6B is a schematic enlarged cross-sectional view showing a part of another light-emitting device. [Figure 6C] FIG. 6C is a schematic enlarged cross-sectional view showing a part of another light-emitting device. [Figure 7A] FIG. 7A is a schematic side view of the light emitting device of Modification 1 as viewed from the y-axis direction. [Figure 7B] FIG. 7B is a schematic side view of the light emitting device of Modification 1 as viewed from the x-axis direction. [Figure 7C] FIG. 7C is a schematic top view of the light emitting device of Modification 1 as viewed from the z-axis direction. [Figure 7D] FIG. 7D is a schematic cross-sectional view taken along line 7D-7D shown in FIG. 7C. [Figure 8A] FIG. 8A is a cross-sectional view showing a manufacturing process of the light emitting device of Modification 1. [Figure 8B] FIG. 8B is a cross-sectional view showing a manufacturing process of the light emitting device of the first modification. [Figure 9A] FIG. 9A is a schematic side view of the light emitting device of Modification 2 as viewed from the y-axis direction. [Figure 9B] FIG. 9B is a schematic side view of the light emitting device of Modification 2 as viewed from the x-axis direction. [Figure 9C] FIG. 9C is a schematic top view of the light emitting device of the second modification. [Figure 9D] FIG. 9D is a schematic cross-sectional view taken along line 9D-9D shown in FIG. 9C. [Figure 10A]FIG. 10A is a schematic top view of a resin package and a light emitting element in a light emitting device according to Modification 3. FIG. [Figure 10B] FIG. 10B is a schematic cross-sectional view taken along line 10B-10B shown in FIG. 10A. [Figure 10C] FIG. 10C is a schematic top view of another light emitting device according to the third modification. [Figure 11A] FIG. 11A is a schematic top view of a resin package and a light emitting element in a light emitting device according to Modification 4. FIG. [Figure 11B] FIG. 11B is a schematic top view of another light emitting device according to the fourth modification. [Figure 11C] FIG. 11C is a schematic top view of yet another light emitting device according to the fourth modification. [Figure 12] FIG. 12 is a schematic perspective view of a light emitting device according to the fifth modification. [Figure 13A] FIG. 13A is a cross-sectional view showing a manufacturing process of the light emitting device of Modification 5. [Figure 13B] FIG. 13B is a cross-sectional view showing a manufacturing process of the light emitting device of the fifth modification. [Figure 14A] FIG. 14A is a schematic top perspective view of a light emitting device according to Modification 6. FIG. [Figure 14B] FIG. 14B is a schematic cross-sectional view taken along line 14B-14B shown in FIG. 14A. [Figure 15A] FIG. 15A is a schematic plan view illustrating the light emission luminance distribution of the first light emitting element 51. FIG. [Figure 15B] FIG. 15B is a schematic plan view illustrating the light emission luminance distribution of the third light emitting element 53. As shown in FIG. [Figure 16] FIG. 16 is a plan view showing an arrangement of the first light emitting element 51 to the third light emitting element 53 in a reference example. [Figure 17] FIG. 17 is a plan view showing the arrangement of first light emitting element 51 to third light emitting element 53 in the light emitting device shown in FIG. 14A. [Figure 18] FIG. 18 is a plan view showing another example of the arrangement of the first to third light emitting elements 51 to 53. In FIG. [Figure 19A] FIG. 19A is a side view illustrating an example of the arrangement of lens portions. [Figure 19B] FIG. 19B is a side view showing another example of the arrangement of the lens portions. [Figure 19C] FIG. 19C is a side view showing yet another example of the arrangement of lens portions. [Figure 20] FIG. 20 is a schematic cross-sectional view of another light emitting device according to the sixth modification. [Figure 21] FIG. 21 is a schematic perspective view of the light emitting device of the seventh modification example with the mold resin portion removed. [Figure 22A] FIG. 22A is a schematic top view of the light emitting device shown in FIG. [Figure 22B] FIG. 22B is a schematic cross-sectional view taken along line 22B-22B shown in FIG. 22A. [Figure 22C] FIG. 22C is a schematic cross-sectional view taken along line 22C-22C shown in FIG. 22A. [Figure 23] FIG. 23 is a plan view showing an example of the arrangement relationship between the lead frame, the light emitting element, and the protrusion. [Figure 24] FIG. 24 is a schematic perspective view of another light emitting device according to the seventh modification, with the mold resin portion removed. [Figure 25] FIG. 25 is a schematic perspective view of yet another light emitting device of the seventh modification example, from which the mold resin portion has been removed. [Figure 26] FIG. 26 is a schematic top view of the light emitting device shown in FIG. [Figure 27] FIG. 27 is a schematic perspective view of yet another light emitting device of Modification 7 from which the mold resin portion has been removed. [Figure 28A] FIG. 28A is a schematic top view of the light emitting device shown in FIG. [Figure 28B] FIG. 28B is a schematic cross-sectional view taken along line 28B-28B shown in FIG. 28A. [Figure 28C] 28C is an enlarged top view showing a portion of the light emitting device shown in FIG. [Figure 29] FIG. 29 is a schematic perspective view of yet another light emitting device of Modification 7 from which the mold resin portion has been removed. [Figure 30]FIG. 30 is a schematic perspective view of yet another light emitting device of Modification 7 from which the mold resin portion has been removed. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings as appropriate. However, the light-emitting device described below is intended to embody the technical concept of the present disclosure, and unless otherwise specified, the present disclosure is not limited to the following. Furthermore, the content described in one embodiment can also be applied to other embodiments and modified examples. Furthermore, the size and positional relationship of components shown in the drawings may be exaggerated for clarity of explanation.

[0012] In the following description, components having substantially the same functions are denoted by common reference symbols, and their descriptions may be omitted. Alternatively, components not referred to in the description may not be designated by reference symbols. In the following description, terms indicating specific directions or positions (e.g., "up," "down," "right," "left," and other terms incorporating these terms) may be used. However, these terms are used merely to facilitate understanding of relative directions or positions in the referenced drawings. As long as the relative direction or position relationship indicated by terms such as "up" and "down" in the referenced drawings is the same, drawings other than those disclosed herein, actual products, manufacturing equipment, etc. may not necessarily have the same arrangement as the referenced drawings. In this disclosure, "parallel" includes cases where two lines, sides, surfaces, etc. are at an angle of approximately 0° to ±5°, unless otherwise specified. In addition, in this disclosure, "perpendicular" or "orthogonal" includes cases where two lines, sides, surfaces, etc. are at an angle of approximately 90° to ±5°, unless otherwise specified.

[0013] When describing a direction with reference to an axis, if it is important whether it is the + or - direction of the axis relative to the reference point, the + and - axes will be distinguished. Therefore, the direction toward the + side of the x axis is called the "+x direction," and the direction toward the - side of the x axis is called the "-x direction." Similarly, the directions toward the + sides of the y and z axes are called the "+y direction" and "+z direction," and the directions toward the - sides of the y and z axes are called the "-y direction" and "-z direction." On the other hand, if it is important which axis the direction is along and it does not matter whether it is the + or - direction of the axis, it will simply be described as the "axial direction." Furthermore, the plane containing the x and y axes is called the "xy plane," the plane containing the x and z axes is called the "xz plane," and the plane containing the y and z axes is called the "yz plane."

[0014] (Embodiment) FIG. 1 is a schematic perspective view of a light emitting device 1000 according to an embodiment of the present disclosure. FIG. 1 also shows arrows indicating mutually orthogonal x-, y-, and z-axes. Arrows indicating these directions may also be shown in other drawings of the present disclosure. In the configuration shown in FIG. 1, the light emitting device 1000 has a generally rectangular shape when viewed from above. Each side of the rectangular shape is parallel to the x-axis or y-axis shown in the figure. The z-axis is perpendicular to the x-axis and y-axis. Note that the shape of the light emitting device 1000 when viewed from above does not have to be rectangular.

[0015] Fig. 2A is a schematic side view of light emitting device 1000 as viewed from the y-axis direction, and Fig. 2B is a schematic side view of light emitting device 1000 as viewed from the x-axis direction. Fig. 2C is a schematic top perspective view of light emitting device 1000 as viewed from the z-axis direction. Figs. 2D and 2E are schematic cross-sectional views taken along lines 2D-2D and 2E-2E, respectively, shown in Fig. 2C.

[0016] As shown in FIGS. 2C to 2E, the light emitting device 1000 includes a resin package 100, a plurality of light emitting elements 50 including a first light emitting element 51, a second light emitting element 52, and a third light emitting element 53, and a molded resin part 60.

[0017] The resin package 100 includes a plurality of leads 11a to 13b and a resin member. In this embodiment, the resin member is, for example, a dark-colored resin member 40 made of a dark-colored resin. The "dark-colored resin" here refers to a resin in which at least the portion exposed on the main surface 100a of the resin package 100 has a dark color in a plan view. The resin package 100 has a main surface 100a, a back surface 100b located opposite the main surface 100a, and a side portion (hereinafter referred to as an "outer portion") 100c of the resin package 100 located between the main surface 100a and the back surface 100b. Each of the plurality of leads 11a to 13b has an exposed region 30 on the main surface 100a that is exposed from the dark-colored resin member 40. The outer portion may be covered by a molded resin portion or may be uncovered and exposed to the outside.

[0018] Each of the first to third light emitting elements 51 to 53 is disposed in the exposed region 30 of one of the plurality of leads 11a to 13b.

[0019] The molded resin portion 60 has a base portion 61 that seals the plurality of light emitting elements 50 , and a plurality of lens portions 70 positioned above the base portion 61 .

[0020] The plurality of lens portions 70 are integrally formed with the base portion 61. The plurality of lens portions 70 include a first lens portion 71 overlapping with the first light-emitting element 51, a second lens portion 72 overlapping with the second light-emitting element 52, and a third lens portion 73 overlapping with the third light-emitting element 53 in a plan view.

[0021] As shown in FIGS. 2A and 2B, the base portion 61 has an upper surface 61a and a side surface 61b of the base portion 61. The upper surface 61a is located higher than the main surface 100a of the resin package 100. In this example, the upper surface 61a is a surface including the starting point of the lens portion 70. The side surface 61b covers a part of the outer surface 100c of the resin package 100 in a direction from the upper surface 61a of the base portion 61 toward the back surface 100b of the resin package 100. The side surface 61b continuously covers from the upper surface 61a of the base portion 61 to a part of the outer surface 100c of the resin package 100.

[0022] 2D and 2E , in this specification, in a cross-sectional view taken in a direction perpendicular to the normal direction of the main surface 100a, the outermost point P on the upper surface 61a of the base portion 61 is referred to as a “first point,” the outermost point Q on the side surface portion 61b of the base portion 61 is referred to as a “second point,” and the outermost point R at which the outer portion 100c of the resin package 100 and the side surface portion 61b of the base portion 61 contact each other is referred to as a “third point.” In this embodiment, in a cross-sectional view, the first point P is located closer to the lens unit 70 than the second point Q, and the second point Q is located outside the third point R.

[0023] In this embodiment, a lens unit 70 is provided on the emission side of each light-emitting element 50. This allows the light-emitting device 1000 to extract light in the front direction (+z direction) with high efficiency, resulting in a light-emitting device 1000 with high brightness.

[0024] Furthermore, since the base portion 61 and the resin package 100 are arranged such that the first point P is located closer to the lens portion 70 than the second point Q in a cross-sectional view, the molded resin portion 60 can be easily removed from the casting case when forming the molded resin portion 60 by a casting molding method, for example. The second point Q is preferably located below (in the −z direction) the main surface 100a of the resin package 100.

[0025] Furthermore, since the base unit 61 and the resin package 100 are arranged such that the second point Q is located outside the third point R in a cross-sectional view, when waterproof resin is formed on the side surface of the light-emitting device 1000 in a display device such as an outdoor display using the light-emitting device 1000, it is possible to reduce the waterproof resin from creeping up the side surface of the light-emitting device 1000 in the +z direction and adhering from the upper surface 61a to the lens unit 70. Therefore, it is possible to reduce a decrease in brightness and a decrease in light distribution caused by part of the waterproof resin being disposed on the lens unit 70.

[0026] As shown in FIGS. 1, 2A, and 2B, in this embodiment, the molded resin part 60 is exposed at the upper part of the side surface of the light emitting device 1000, and the resin package 100 is exposed at the lower part. In a side view of the light emitting device 1000, there is a boundary 1000u between the molded resin part 60 and the resin package 100. In this specification, the boundary 1000u between the molded resin part 60 and the resin package 100 on the side surface of the light emitting device 1000 is referred to as an "interface part." The interface part 1000u can be a moisture intrusion part through which moisture can easily penetrate into the light emitting device 1000 from the outside. Therefore, it is preferable that the waterproof resin described above is disposed so as to protect at least the interface part 1000u and not to come into contact with the lens part 70. The configuration of the display device and the waterproof resin will be described later with reference to FIG. 3B.

[0027] Note that "planar view" refers to a planar view seen from the +z-axis direction. "Top view" refers to a top view seen from the +z-axis direction. "Side view" refers to a side view seen from a direction perpendicular to one of the sides of the outline of the light emitting device in plan view.

[0028] Each component will be described in detail below.

[0029] [Resin Package 100] In this embodiment, the resin package 100 is a surface-mount type package.

[0030] Fig. 2F is a schematic top perspective view showing the resin package 100 in which the light emitting element 50 is formed. Fig. 2G is a schematic cross-sectional view of the resin package 100 taken along line 2G-2G shown in Fig. 2F. Fig. 2H is a schematic cross-sectional view of the resin package taken along line 2H-2H shown in Fig. 2F.

[0031] As shown in FIGS. 2F and 2H, the resin package 100 has a main surface 100a, a back surface 100b opposite the main surface 100a, and an outer portion 100c located between the main surface 100a and the back surface 100b. In the illustrated configuration, the main surface 100a of the resin package 100 has a rectangular shape when viewed from above. Each side of the rectangle of the main surface 100a is parallel to the x-axis or y-axis. The outer portion 100c of the resin package 100 includes four side portions 100c1 to 100c4 shown in FIG. 2F. The back surface 100b of the resin package 100 includes a mounting surface for each lead when fixing the light emitting device 1000 to a mounting substrate. Here, the back surface 100b (or the mounting surface for the leads) is parallel to the xy plane.

[0032] The shape of the main surface 100a when viewed from above may be a shape other than a rectangle, and may be, for example, an approximately triangular, approximately rectangular, approximately pentagonal, approximately hexagonal, or other polygonal shape, or a shape with curves such as a circular shape or an elliptical shape.

[0033] The resin package 100 includes a plurality of leads 11a to 13b and a dark colored resin member 40 that fixes at least a portion of the plurality of leads 11a to 13b.

[0034] <Step surface of resin package 100> As shown in FIG. 2D, the dark-colored resin member 40 has a first step surface st1 in the outer portion 100c of the resin package 100. The first step surface st1 faces in the same direction as the main surface 100a. That is, the first step surface st1 is a surface facing upward (facing the +z direction). The first step surface st1 is located closer to the back surface 100b than the second point Q of the base portion 61. In this specification, the term "step surface" refers to a surface that corresponds to the tread of a staircase when the cross section has a stepped shape, regardless of whether a step surface is added.

[0035] In the example shown in FIG. 2D , in a cross-sectional view, the outer portion 100c of the resin package 100 includes a first surface p1 extending from the main surface 100a toward the back surface 100b, a second surface p2 located closer to the back surface 100b and outward than the first surface p1, and a first step surface st1 facing upward (facing the +z direction) and located between the first surface p1 and the second surface p2. As shown in the figure, the outer portion 100c may further include a third surface p3 located closer to the back surface 100b than the second surface p2, and a second step surface st2 facing upward (facing the +z direction) and located between the second surface p2 and the third surface p3. The third surface p3 is preferably located further outward from the light emitting device 1000 than the second surface p2. More preferably, the third surface p3 is located from the first surface p1 to the second surface p2 and then to the third surface p3 toward the outside of the light emitting device 1000.

[0036] 2F, the first step surface st1 may be formed along the periphery of the resin package 100. Note that the first step surface st1 may be disposed on only a part of the periphery of the resin package 100.

[0037] Providing the first step surface st1 makes it possible to control the shape of the molded resin part 60. This allows the light emitting device 1000 to have the rear surface 100b of the resin package 100 exposed from the molded resin part 60. This reduces mounting defects of the light emitting device 1000 during mounting (for example, if the rear surface 100b of the resin package 100 is covered by the molded resin part 60, there is a possibility that the solder will not wet during mounting), and improves the reliability of the light emitting device 1000.

[0038] The distance Hs from the back surface 100b of the resin package 100 to the first step surface st of the resin package 100 (hereinafter referred to as the "height of the first step surface st1") may be, for example, 0.2 mm or more. Alternatively, the ratio Hs / Hq of the height Hs of the first step surface st1 to the height Hq of the second point Q may be, for example, 0.2 or more. By setting the height Hs or the ratio Hs / Hq within the above range, it is possible to reduce the resin material that will become the molded resin portion 60 from creeping up to the leads during the immersion step when forming the molded resin portion 60 by casting. The height Hs of the first step surface st1 is more preferably 0.3 mm or more, and even more preferably 0.35 mm. The ratio Hs / Hq is more preferably 0.4 or more. The height Hs of the first step surface st1 is the shortest distance along the z-axis direction between the back surface 100b of the resin package 100 and the first step surface st1. The height Hq of the second point Q is the shortest distance along the z-axis direction between the rear surface 100b of the resin package 100 and the second point Q in a cross-sectional view.

[0039] On the other hand, the height Hs of the first step surface st1 may be, for example, 1.5 mm or less. Alternatively, the ratio Hs / Hq of the height Hs of the first step surface st1 to the height Hq of the second point Q may be, for example, 0.8 or less. By setting the height Hs or the ratio Hs / Hq within the above range, the distance between the first step surface st1 and the point where the resin material that will become the molded resin portion 60 starts to creep up in the −z direction during the immersion process of forming the molded resin portion 60 can be ensured. This increases the maximum amount of resin material that can be placed on the outer portion 100c of the resin package 100 by creeping up during the immersion process (the maximum volume of resin material that can creep up in the −z direction), thereby more stably fixing the resin package 100. The height Hs of the first step surface st1 is more preferably 1.0 mm or less, and even more preferably 0.7 mm or less. The ratio Hs / Hq is more preferably 0.7 or less.

[0040] The width ws1 may be, for example, 0.1 mm or more. More preferably, it is 0.15 mm or more and 0.4 mm or less. When the width ws1 is 0.1 mm or more, it is possible to reduce creeping up of the resin material that will become the molded resin portion 60 when the molded resin portion 60 is formed. As shown in FIG. 2D , the width ws1 of the first step surface st1 may be smaller than the width Wq, which is the distance from the second point Q of the base portion 61 to the outer portion 100c of the resin package 100 in a plane (xy plane) parallel to the main surface 100a of the resin package 100.

[0041] In a cross-sectional view, the outermost point of the first step surface st1 of the resin package 100 may be located inside the second point Q of the molded resin part 60. By having the side surface 61b of the molded resin part 60 protrude outward from the first step surface st1 in this manner, it is possible to prevent the waterproof resin (FIGS. 3A and 3B) from creeping upward (in the +z direction) beyond the second point Q of the side surface 61b. In FIG. 2A, the outermost point of the first step surface st1 coincides with the third point R at which the molded resin part 60 and the resin package 100 contact each other on the side surface of the light emitting device 1000. In this case, when forming the molded resin part 60 by a casting molding method, it is possible to control the position of the bottom of the molded resin part 60 at a lower position. This allows the waterproof resin to cover the interface 1000u (FIG. 2A, etc.) between the molded resin part 60 and the resin package 100, which is the moisture intrusion area, with the waterproof resin while reducing the amount of waterproof resin. The point located on the outermost side of the first step surface st1 does not have to coincide with the third point R.

[0042] As shown in FIG. 2G, the height Ha of the main surface 100a is the distance along the z-axis from the back surface 100b of the resin package 100 to the uppermost portion of the main surface 100a. The ratio Hs / Ha of the height Hs of the first step surface st1 to the height Ha of the main surface 100a may be, for example, 0.5 or less. This increases the maximum amount of resin that can be placed on the outer portion 100c of the resin package 100 (the volume of resin material that creeps up in the −z direction) during the immersion process for forming the molded resin portion 60, thereby more firmly fixing the resin package 100. On the other hand, the ratio Hs / Ha may be, for example, 0.15 or more. This makes it easier to control the position of the bottom end of the molded resin portion 60 so that the molded resin portion 60 does not come into contact with the leads 11a to 13b.

[0043] In the example shown in FIG. 2G, in the outer portion 100c of the resin package 100, the dark-colored resin member 40 further has a second step surface st2 located below the first step surface st1. The width ws2 of the second step surface st2 may be smaller than the width ws2 of the first step surface. The width ws2 is, for example, 0.2 mm or less. The second step surface st2 may be located outside the first step surface st1.

[0044] By providing the second step surface st2, when a portion of the resin material that creeps up from the casting case in the -z direction does not stop at the first step surface st1, the resin material that does not stop at the first step surface st1 can be blocked by the second step surface st2. This reduces contact between the molded resin part 60 and the multiple leads 11a to 13b. At least a portion of the outer part 100c of the resin package 100 that is located closer to the back surface 100b than the second step surface st2 may be exposed from the molded resin part 60. The bottom end of the molded resin part 60 may be in contact with the second step surface st2.

[0045] As shown in FIG. 2F, in a top view, a first step surface st1 may be positioned so as to surround the main surface 100a of the resin package 100, and a second step surface st2 may be positioned outside the first step surface st1 so as to surround the main surface 100a and the first step surface st1.

[0046] <First recess 21> As shown in FIGS. 2F and 2G, the main surface 100a of the resin package 100 may have one first recess 21 defined by the dark-colored resin member 40 and multiple leads 11a to 13b. The inner upper surface of the first recess 21 includes an exposed region 30 of at least one lead. The first to third light-emitting elements 51 to 53 are arranged in one first recess 21. Note that, although the first to third light-emitting elements 51 to 53 are arranged in one recess 21 here, one or two light-emitting elements may be arranged in one recess.

[0047] 2F and 2G, the first recess 21 is defined by a bottom surface (inner upper surface) 21a and an inner side surface 21c surrounding the inner upper surface 21a. The inner upper surface 21a of the first recess 21 is an upward-facing surface (facing toward the +z side). In a plan view, the inner upper surface 21a of the first recess 21 is located higher than the inner upper surface 21a and is surrounded by a surface or ridge line made of the dark-colored resin member 40. The inner side surface 21c of the first recess 21 is made of the dark-colored resin member 40. The inner side surface 21c of the first recess 21 (here, side surfaces s1 and s2) may be perpendicular to the inner upper surface 21a of the first recess 21 or may be inclined with respect to the vertical plane of the inner upper surface 21a.

[0048] 2F, in this embodiment, the inner upper surface 21a of the first recess 21 is made up of a portion of the leads 11a to 13a and the first resin portion 41 of the dark colored resin member 40. The inner upper surface 21a is surrounded by the second resin portion 42, which has an upper surface located higher (toward the lens portion 70) than the first resin portion 41. The inner side surface 21c of the first recess 21 is made up of the side surface of the second resin portion 42.

[0049] In the example shown in FIG. 2F, the inner upper surface 21a of the first recess 21 has a planar shape that is long in one direction (here, the y-axis direction). The inner upper surface 21a of the first recess 21 includes a first resin portion 41 and exposed regions 30a of the leads 11a to 13a that are arranged in the y-axis direction. The first resin portion 41 is located between the exposed regions 30a of two adjacent leads. First to third light-emitting elements 51 to 53 are arranged in the exposed regions 30a of the leads 11a to 13a, respectively.

[0050] The main surface 100a of the resin package 100 may further have at least one second recess defined by the dark colored resin member 40 and the plurality of leads 11a to 13b. In this example, the main surface 100a has a plurality of (here, two) second recesses 22, 23.

[0051] Similar to the first recess 21, the second recesses 22 and 23 have inner upper surfaces 22a and 23a and inner side surfaces 22c and 23c. In a plan view, the inner upper surface 22a of the second recess 22 is surrounded by the upper surface of the second resin portion 42. In a plan view, the inner upper surface 23a of the second recess 23 is surrounded by the upper surface of the second resin portion 42. In this embodiment, the first recess 21, the second recess 22, and the second recess 23 are separated from one another via the second resin portion 42 in a top view.

[0052] Each of the inner upper surfaces 22a, 23a of the second recesses 22, 23 includes at least one exposed region of a lead. The exposed region of the lead includes a connection region wr to which a wire is bonded for electrically connecting the lead and the light emitting element 50.

[0053] In the example shown in FIG. 2F , the second recesses 22 and 23 are located on the −x and +x sides of the first recess 21, respectively, in a top view. That is, the first recess 21 is located between the second recesses 22 and 23. Each of the second recesses 22 and 23 has a planar shape that is elongated in the y-axis direction. The inner upper surface 22a of the second recess 22 includes the first resin portion 41 and the exposed regions 30b of the leads 11a to 13a arranged in the y-axis direction. The first resin portion 41 is located between the exposed regions 30b of two adjacent leads. The exposed regions 30b of the leads 11a to 13a are electrically connected to one of the positive and negative electrodes of the first to third light-emitting elements 51 to 53 via wires, respectively. Similarly, the inner upper surface 23a of the second recess 23 includes the first resin portion 41 and the exposed regions 30b of the leads 11b to 13b arranged in the y-axis direction. The first resin portion 41 is located between the exposed regions 30b of two adjacent leads. The exposed regions 30b of the leads 11b to 13b are electrically connected to the other of the positive and negative electrodes of the first to third light emitting elements 51 to 53 by wires, respectively.

[0054] As shown in FIGS. 2C to 2E, a reflective member 150 may be disposed inside the first recess 21. The reflective member 150 may be in contact with the side surface of each light-emitting element 50, for example. The position of the reflective member 150 may be controlled by utilizing the inner wall of the first recess 21. For example, the reflective member 150 may be in direct contact with at least a portion of the inner wall of the first recess 21.

[0055] 2D, for example, a second dark-colored resin member 190 may be disposed within the second recesses 22, 23. This reduces a decrease in display contrast caused by external light entering the light-emitting device 1000 being reflected by the exposed regions 30b of the leads. The second dark-colored resin member 190 may be formed using the same resin material and colorant as the dark-colored resin member 40. For example, a resin material obtained by adding carbon black to a silicone resin material, an epoxy resin material, or an epoxy-modified silicone resin material can be used as the second dark-colored resin member 190.

[0056] The arrangement, number, planar shape, etc. of the recesses 21 to 23 are not limited to the example shown in the drawing.

[0057] <Dark-colored resin member 40> The dark-colored resin member 40 has insulating properties to electrically isolate the light-emitting element from the outside. At least the portion of the dark-colored resin member 40 located on the main surface 100a of the resin package 100, i.e., the light-emission observation surface, is preferably a dark color such as black or gray. For example, the dark-colored resin member 40 may be colored dark. Alternatively, the dark-colored resin member 40 may be a white resin with dark ink printed on it. Alternatively, the dark-colored resin member 40 may be molded from two colors, a dark resin and a white resin. This reduces the reduction in contrast caused by reflection of external light or the like on the main surface 100a of the resin package 100. Note that, in this specification, "dark" refers to a color with a brightness of 4.0 or less in the Munsell color system (20 hues). The hue is not particularly limited, and the saturation can be determined as needed. Preferably, the brightness is 4.0 or less and the saturation is 4.0 or less.

[0058] As described above, in the example shown in Figures 2F and 2G, on the main surface 100a, the dark-colored resin member 40 includes a first resin portion 41 exposed on the inner upper surfaces 21a to 23a of the first recess 21 and the second recesses 22, 23, and a second resin portion 42 having an upper surface located above (in the +z direction) the first resin portion 41.

[0059] In this example, the second resin portion 42 includes, in top view, a resin portion 42A (also referred to as the "surrounding resin portion") that surrounds the inner upper surfaces 21a to 23a of the first recess 21 and the second recesses 22, 23, a resin portion 42B (also referred to as the "outer resin portion") that is located outside the resin portion 42A, and a pair of resin portions 42C (also referred to as the "partitioning resin portions") that are located respectively between the first recess 21 and the second recess 22 and between the first recess 21 and the second recess 23. Note that there may be a single resin portion 42C, or there may be one or more pairs of resin portions 42C.

[0060] The top surface of the resin portion 42A is located higher (on the +z side) than the top surfaces of the resin portions 42B and 42C. By making the top surface of the resin portion 42A higher than the top surfaces of the resin portions 42B and 42C, it is easier to arrange the light-transmitting resin member 180 in the region defined by the resin portion 42A. The top surface of the resin portion 42C may also be located higher than the top surface of the resin portion 42B. This allows the thickness of the light-transmitting resin member 180 to be secured above the light-emitting element 50 by utilizing the top surface of the resin portion 42C. Furthermore, by making the top surface of the resin portion 42B lower than the resin portion 42A, the thickness of the portion of the base portion 61 located above the resin portion 42B can be increased. Note that in this specification, the "top surface" of each resin portion refers to the surface located closest to the +z side. The portion of each resin portion located closest to the +z side may be a ridge line. In that case, it is sufficient that the portion (ridge line or surface) of each resin portion located closest to the +z side has the above-described positional relationship.

[0061] Each of the resin portions 42C is, for example, a wall-like portion having a rectangular planar shape extending in the y-axis direction. In a plan view, the resin portions 42C partition the first recess 21 and the second recess 22, and the first recess 21 and the second recess 23, respectively. In a plan view, each end of the resin portion 42C in the longitudinal direction may be in contact with the resin portion 42A. In addition, here, the light-emitting element 50 is disposed between a pair of resin portions 42C arranged in the x-axis direction to face each other.

[0062] In a plan view, a pair of resin portions 42D may be further disposed between the pair of resin portions 42C. Each resin portion 42D is located between the first resin portion 41 and the resin portion 42A on the inner upper surface 21a of the first recess 21. Each of the resin portions 42D has, for example, a rectangular planar shape extending in the x-axis direction. In this embodiment, the resin portions 42C and 42D are connected to surround the inner upper surface 21a of the first recess 21.

[0063] According to the above configuration, as shown in FIG. 2F, the first recess 21 has an inner upper surface 21a surrounded by a pair of resin portions 42C and a pair of resin portions 42D, and an inner side surface 21c. The inner side surface 21c is formed by a first side surface s1 of the resin portion 42C and a first side surface s2 of the resin portion 42D. The second recesses 22 and 23 each have an inner upper surface 22a, 23a surrounded by one of the pair of resin portions 42C and the resin portion 42A, and inner side surfaces 22c, 23c. The inner side surfaces 22c, 23c of the second recesses 22 and 23 are each formed by a second side surface v1 of the resin portion 42C and a side surface s3 of the resin portion 42A. The side surface s3 of the resin portion 42A is located opposite the resin portion 42B in a plan view.

[0064] As shown in FIG. 2G, each resin portion 42C has a first side surface s1 in contact with the inner upper surface 21a of the first recess 21, a second side surface v1 located on the second recess 22, 23 side, an upper surface u1, and a tapered surface t1 located between the upper surface u1 and the second side surface v1. As shown in the figure, the first side surface s1 of the first recess 21 may further have an upward-facing (facing toward the lens unit 70) stepped surface between the first side surface s1 and the upper surface u1. This allows the thickness (thickness in the z-axis direction) of the reflective member 150 (FIG. 2D) to be controlled by the height of the stepped surface of the first side surface s1. The height of the upper end of the second side surface v1 may be lower than the upper surface u1 and the stepped surface of the first side surface s1. The thickness of the second dark-colored resin member 190 (FIG. 2D) can be controlled by the height of the upper end of the second side surface v1. The tapered surface t1 is inclined from the upper surface 1u to the upper end of the second side surface v1. By providing the tapered surface t1, it is possible to reduce contact of the wire loop with the resin portion 42C when forming the wire loop.

[0065] As shown in FIG. 2H, each resin portion 42D has a first side surface s2 and an upper surface u2 of the first recess 21. The upper surface u2 of the resin portion 42D is connected to a step surface located between the first side surface s1 and the upper surface u1 of the resin portion 42C, and provides the same effect as the step surface of the resin portion 42C. Each resin portion 42D may be connected to the resin portion 42A. For example, each resin portion 42D may be a step portion that protrudes inward from a part of the side surface of the resin portion 42A.

[0066] The dark-colored resin member 40 is not limited to the shape shown in the figure, as long as it has a shape that can hold at least a portion of the plurality of leads 11a to 13b. Preferably, the dark-colored resin member 40 integrally fixes the plurality of leads (here, three pairs of leads). By firmly fixing each lead with the dark-colored resin member 40, vibration of the leads can be reduced when the molded resin part 60 is formed by transfer molding.

[0067] The material selected for the dark colored resin member 40 may have a small coefficient of thermal expansion and excellent adhesion to the molded resin part 60. The coefficient of thermal expansion of the dark colored resin member 40 may be approximately equal to that of the molded resin part 60, or may be smaller than that of the molded resin part 60, taking into account the influence of heat from the light emitting element 50.

[0068] The dark-colored resin member 40 can be formed using, for example, a thermoplastic resin. Examples of suitable thermoplastic resins include aromatic polyamide resins, polyphthalamide resins (PPA), sulfone resins, polyamide-imide resins (PAI), polyketone resins (PK), polycarbonate resins, polyphenylene sulfide (PPS), liquid crystal polymers (LCP), ABS resins, and PBT resins. These thermoplastic resins may also contain glass fibers. By incorporating glass fibers, a resin package with high rigidity and strength can be formed. In this specification, the term "thermoplastic resin" refers to a material with a linear polymer structure that softens or even liquefies when heated and solidifies when cooled. Examples of such thermoplastic resins include styrene-based, acrylic-based, cellulose-based, polyethylene-based, vinyl-based, polyamide-based, and fluorocarbon-based resins.

[0069] Alternatively, the dark colored resin member 40 may be formed using a thermosetting resin such as a silicone resin or an epoxy resin.

[0070] The resin material of the dark-colored resin member 40 may contain a colorant to impart a dark color. Various dyes and pigments are suitable for use as the colorant. Specific examples include Cr2O3, MnO2, Fe2O3, and carbon black. The amount of colorant added may be, for example, 0.3% to 3.0%, and preferably 1.0% to 2.0%, of the base resin material. For example, a thermoplastic resin material containing a small amount of dark-colored particles such as carbon added to polyphthalamide (PPA) may be used.

[0071] <Lead> Each lead is electrically conductive and functions as an electrode for supplying power to the corresponding light emitting element 50 .

[0072] 2F, this embodiment includes six leads 11a to 13b. Leads 11a and 11b form a first lead pair, leads 12a and 12b form a second lead pair, and leads 13a and 13b form a third lead pair.

[0073] In the configuration illustrated in FIG. 2G, each of the pair of leads 11a, 11b constituting the first lead pair is bent to have a portion 91 located on the main surface 100a side of the resin package 100, a portion 92 located on the back surface 100b side of the resin package 100, and a portion 93 located between these portions 91, 92 and extending along the outer portion 100c of the resin package 100. At least a portion of the portion 92 of the leads 11a, 11b is exposed on the back surface 100b of the resin package 100 and serves as a mounting surface when the light emitting device 1000 is fixed to a mounting substrate. The mounting surfaces of the leads 11a, 11b may be flush with the bottom surface of the dark-colored resin member 40. The second and third lead pairs have the same structure as the first lead pair.

[0074] 2F, the first lead pair, the second lead pair, and the third lead pair are arranged, for example, in the y-axis direction on the main surface 100a of the resin package 100. On the main surface 100a, the ends of the two leads constituting each lead pair are arranged spaced apart and facing each other.

[0075] Each of the leads 11a, 12a, and 13a on one side of the first to third lead pairs has an exposed region 30a on the inner upper surface 21a of the first recess 21. Each exposed region 30a includes an element mounting region where the corresponding light emitting element 50 is disposed. Each of the leads 11a, 12a, and 13a also has an exposed region 30b on the inner upper surface 22a of the second recess 22, which serves as a connection region wr. The connection region wr is a region electrically connected to the positive and negative electrodes of the corresponding light emitting element by a wire. Each of the leads 11b, 12b, and 13b on the other side of the first to third lead pairs has an exposed region 30 on the inner upper surface 23a of the second recess 23, which serves as the connection region wr.

[0076] The leads 11a to 13b may be composed of a substrate and a metal layer covering the surface of the substrate. The substrate may contain metals such as copper, aluminum, gold, silver, iron, nickel, or alloys thereof, phosphor bronze, and iron-containing copper. These may be single layers or may have a laminated structure (e.g., clad material). Copper may be used for the substrate. The metal layer is, for example, a plating layer. The metal layer may contain, for example, silver, aluminum, nickel, palladium, rhodium, gold, copper, or alloys thereof. When the leads 11a to 13b have such a metal layer, light reflectivity and / or bondability with metal wires, etc., as described below, can be improved. For example, leads may be used that have a silver plating layer on the surface of a copper alloy substrate.

[0077] The arrangement, shape, number, etc. of the leads used in the light emitting device 1000 are not limited to the example shown in the figure. In the example shown in the figure, six leads are used, but if two or more light emitting elements 50 among the first light emitting element 51 to the third light emitting element 53 are connected to a common lead, the number of leads may be less than six. For example, one common lead may be provided instead of the leads 11b to 13b described above.

[0078] [Light emitting element 50] The light emitting elements 50 are semiconductor light emitting elements such as semiconductor lasers, light emitting diodes, etc. The emission wavelength of each light emitting element 50 can be selected arbitrarily.

[0079] The shape of the light emitting element 50 in a plan view is, for example, rectangular. There are no particular limitations on the size of the light emitting element 50. The length and width of the light emitting element 50 are, for example, 100 μm or more and 1000 μm or less. For example, the light emitting element 50 has a square shape with a side of 320 μm in a plan view.

[0080] In this embodiment, the plurality of light-emitting elements 50 includes a first light-emitting element 51 that emits a first light, a second light-emitting element 52 that emits a second light having a shorter wavelength than the first light, and a third light-emitting element 53 that emits a third light having a shorter wavelength than the second light. The emission wavelength of each light-emitting element 50 may be selected so that a mixed color light of white or warm white is obtained when the plurality of light-emitting elements 50 are turned on. For example, the first light-emitting element 51 may be a red light-emitting element that emits red light, the second light-emitting element 52 may be a green light-emitting element that emits green light, and the third light-emitting element 53 may be a blue light-emitting element that emits blue light. The number of light-emitting elements and the combination of emitted colors are merely examples and are not limited to these examples. The three light-emitting elements 50 may emit light of the same wavelength.

[0081] Blue and green light emitting elements are made of ZnSe and nitride semiconductors (In X Al Y Ga 1-X-YA light-emitting element using a semiconductor layer containing GaN (N, 0≦X, 0≦Y, X+Y≦1) can be used. For example, a light-emitting element in which a semiconductor layer containing GaN is formed on a support substrate such as sapphire can be used. GaAs, AlInGaP, AlGaAs-based semiconductors can be used as a red light-emitting element. For example, a light-emitting element in which a semiconductor layer containing AlInGaP is formed on a support substrate such as silicon, aluminum nitride, or sapphire can be used. Furthermore, semiconductor light-emitting elements made of other materials can also be used. The composition, emission color, size, number, etc. of the light-emitting element can be selected appropriately depending on the purpose.

[0082] Furthermore, by arranging a phosphor that converts the wavelength of the emitted light around a semiconductor chip made of a nitride-based semiconductor or the like, it is possible to obtain any desired light emission. In this specification, the term "light-emitting element 50" includes not only a semiconductor chip made of a nitride-based semiconductor or the like, but also an element composed of a semiconductor chip and a phosphor. Specific examples of phosphors that can be used include cerium-activated yttrium aluminum garnet, cerium-activated lutetium aluminum garnet, europium- and / or chromium-activated nitrogen-containing calcium aluminosilicate (part of the calcium can be replaced with strontium), europium-activated sialon, europium-activated silicate, europium-activated strontium aluminate, and manganese-activated potassium fluorosilicate. For example, the first light-emitting element 51, the second light-emitting element 52, and the third light-emitting element 53 may all have a semiconductor chip that emits blue light. In this case, by disposing a phosphor around the semiconductor chip in at least two of these light emitting elements, the first light emitting element 51, the second light emitting element 52, and the third light emitting element 53 can emit light in different colors.

[0083] The first light emitting element 51, the second light emitting element 52, and the third light emitting element 53 can each be bonded to the exposed region 30 of any of the leads 11a to 13b by a bonding material such as resin, solder, or conductive paste.

[0084] The first light emitting element 51 to the third light emitting element 53 may be disposed in the exposed regions 30a of three different leads (here, leads 11a, 12a, and 13a), respectively. This allows the heat dissipation paths of the first light emitting element 51, the second light emitting element 52, and the third light emitting element 53 to be separated from one another, allowing the heat generated in each light emitting element 50 to be dissipated efficiently.

[0085] As shown in FIG. 2D, the positive and negative electrodes of the first light-emitting element 51 are electrically connected to the leads 11a and 11b of the first lead pair by a pair of wires 81 consisting of wires 81a and 81b. One end of the wire 81a is connected to a portion (connection region wr) of the exposed region 30a of the lead 11a, and the other end is connected to one of the positive and negative electrodes of the first light-emitting element 51. One end of the wire 81b is connected to a portion (connection region wr) of the exposed region 30b of the lead 11b, and the other end is connected to the other of the positive and negative electrodes of the first light-emitting element 51. Similarly, as shown in FIG. 2C, the positive and negative electrodes of the second light-emitting element 52 and the third light-emitting element 53 are electrically connected to the leads of the second lead pair and the third lead pair by a pair of wires 82 and 83, respectively.

[0086] Metal wires of gold, silver, copper, platinum, aluminum, or alloys thereof can be used for the wires 81 to 83. Among these, it is preferable to use gold wires, which have excellent ductility, or gold-silver alloy wires, which have a higher reflectivity than gold wires.

[0087] In the configuration shown in FIG. 2C, the first to third light-emitting elements 51 to 53 overlap one another in a side view from the y-axis direction. The arrangement of the first to third light-emitting elements 51 to 53 is not limited to the example shown in the figure. For example, in a plan view, one light-emitting element located in the center in the y-axis direction may be positioned offset from the line connecting the centers of the other two light-emitting elements. In such a configuration, only two of the three light-emitting elements may overlap one another in a side view from the y-axis direction.

[0088] [Reflective member 150] In this embodiment, a reflective member 150 may be disposed around each light-emitting element 50 in a plan view. The reflective member 150 reflects light emitted from the side surface of each light-emitting element 50 and guides the light above the light-emitting element 50. This can improve the utilization efficiency of the light emitted from the light-emitting element 50.

[0089] In this specification, "the reflective member 150 is located in the vicinity of the light-emitting element 50" includes the case where the reflective member 150 is located close to the side surface of the light-emitting element 50 in a planar view. The reflective member 150 may or may not be in direct contact with the side surface of the light-emitting element 50. Preferably, the reflective member 150 is in contact with the side surface of the light-emitting element 50. It is more preferable that the reflective member 150 surrounds the side surface of the light-emitting element 50 in a planar view. It is preferable that the reflective member 150 is provided in contact with all of the side surfaces of the light-emitting element 50. This makes it possible to more effectively reduce leakage of light emitted from the light-emitting element 50 in the ±x and ±y directions.

[0090] The reflective member 150 only needs to be disposed close to the side surface of the light-emitting element 50, and does not have to be disposed over the entire inner upper surface 21a of the first recess 21. For example, a light-emitting element 50 whose side surfaces are covered with the reflective member 150 may be prepared, and the light-emitting element 50 may be disposed on the inner upper surface 21a (see FIG. 10C ). This makes it possible to reduce the area of ​​the region on the inner upper surface 21a of the first recess 21 where the reflective member 150 is disposed. Reducing the area of ​​the region where the reflective member 150 is disposed reduces stress on the light-emitting element 50 that occurs during the manufacturing process, and reduces lifting of the light-emitting element 50 from the lead 11.

[0091] As shown in Figures 2C to 2E, the light emitting device 1000 of this embodiment, when viewed in a plan view, has, on the main surface 100a of the resin package 100, a first reflective member 151 located around the first light emitting element 51, a second reflective member 152 located around the second light emitting element 52, and a third reflective member 153 located around the third light emitting element 53.

[0092] By arranging the first to third reflective members 151 to 153, light from the side surfaces of each light-emitting element 50 is reflected toward the light-emitting element 50, and the light can be emitted from the top surface of the light-emitting element 50 toward the front (+z direction) of the light-emitting device 1000. Therefore, when viewed from above, it is possible to reduce the size of the light source surface from which light from the first to third light-emitting elements 51 to 53 is emitted (point light source). Point light source refers to a state in which the light emitted from the side surfaces of the light-emitting element 50 is 10% or less. Therefore, by making the light-emitting elements 50 point light sources, the planar shape of each lens unit 70 can be made smaller. Therefore, by making the lens unit 70 smaller, the size of the light-emitting device 1000 can be reduced. By controlling the emission direction of light from each light-emitting element 50 within a desired range, it is possible to reduce light loss due to total reflection on the inner surface of the lens unit 70. The inner surface of the lens unit 70 is the surface into which light emitted from the light-emitting element 50 enters from the inside. The inner surface of the lens portion 70 may be referred to as the outer surface of the light emitting device 1000. Therefore, the light extraction of the light emitting device 1000 can be maintained, and light can be extracted in the front direction with high efficiency.

[0093] In this embodiment, the first to third reflective members 151 to 153 are located in one first recess 21 of the resin package 100. This makes it possible to control the positions of the first to third reflective members 151 to 153 using the inner side surface 21c of the first recess 21, and therefore the reflective member 150 can be arranged around the first to third light emitting elements 51 to 53. It is preferable that the reflective member 150 is not formed in areas of the main surface 100a other than the first recess 21.

[0094] 2C, the first reflective member 151, the second reflective member 152, and the third reflective member 153 may be connected to one another within the first recess 21. Note that these reflective members 151 to 153 may also be arranged apart from one another.

[0095] The first to third reflective members 151 to 153 may also be disposed between the exposed region 30a of the lead and the lower surfaces of the first to third light emitting elements 51 to 53, respectively. For example, a reflective member (e.g., a resin containing a light-reflective material) may be applied in advance to the inside of the first recess 21, and the first to third light emitting elements 51 to 53 may be disposed thereon. This makes it possible to more effectively reduce leakage of light emitted from the first to third light emitting elements 51 to 53 in the -z direction. Also, die bond resin for bonding the first to third light emitting elements 51 to 53 to the main surface 100a is not required.

[0096] The reflective member 150 is, for example, a reflective resin. The reflective resin includes a resin that serves as a base material and a light-reflective substance dispersed in the resin. The base material may be an epoxy resin, a silicone resin, an epoxy-modified silicone resin, a resin mixture of these, or a light-transmitting material such as glass. From the viewpoints of light resistance and ease of molding, it is preferable to select a silicone resin as the base material.

[0097] Examples of light-reflecting materials that can be used include titanium oxide, silicon oxide, zirconium oxide, yttrium oxide, yttria-stabilized zirconia, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, and mullite. In this embodiment, titanium oxide is used, for example. The concentration of the light-reflecting material in the reflective member 150 is preferably 10% by weight or more and 80% by weight or less. The reflective member 150 preferably contains titanium oxide as the light-reflecting material. The reflective member 150 may also contain a glass filler or the like to reduce thermal expansion and contraction of the resin base material. The concentration of the glass filler is preferably more than 0% by weight and less than 40% by weight. However, the concentrations of the light-reflecting material, glass filler, and the like are not limited to these.

[0098] The reflective member 150 may be any member that reflects light emitted from the light emitting element 50. The reflective member 150 is preferably formed from a material that has a reflectance of 80% or more for light emitted from the light emitting element 50. The reflective member 150 may also be a member that blocks light emitted from the light emitting element 50. For example, the reflective member 150 may be a single-layer or multilayer film made of metal, or a multilayer film (dielectric multilayer film) in which two or more types of dielectrics are stacked. For example, a DBR (distributed Bragg reflector) film may be used as the dielectric multilayer film.

[0099] [Translucent resin member 180] As shown in FIGS. 2D and 2E , the light emitting device 1000 may further include a light-transmitting resin member 180 between the reflective member 150 and the light emitting element 50 and the molded resin portion 60. The light-transmitting resin member 180 may be made of the same material as the molded resin portion 60, such as an epoxy resin, a urea resin, or a silicone resin. In particular, it is preferable to use an epoxy resin for the molded resin portion 60 and a silicone resin for the light-transmitting resin member 180. This can improve heat resistance, light resistance, strength, and the like. Alternatively, a phenyl silicone resin can be used for the molded resin portion 60 and a dimethyl silicone resin can be used for the light-transmitting resin member 180. This can further improve heat resistance, light resistance, and the like.

[0100] In the illustrated example, the light-transmitting resin member 180 is disposed within a region surrounded by the resin portion 42A, which is the tallest of the second resin portions 42, in the +z direction. This allows the upper surface of the resin portion 42A to be used to form the light-transmitting resin member 180 with a uniform thickness over the entire region surrounded by the resin portion 42A. The light-transmitting resin member 180 may cover the light-emitting element 50, the reflective member 150, and the resin portion 42C. The light-transmitting resin member 180 preferably has a thickness of 40 μm to 180 μm from the upper surface of the light-emitting element 50. More preferably, the thickness is 50 μm to 140 μm. Even more preferably, the thickness is 60 μm to 100 μm.

[0101] The light-transmitting resin member 180 may be disposed so as to cover, for example, the reflective member 150 and the light-emitting element 50. For example, the light-transmitting resin member 180 may be disposed in a region surrounded by the resin portion 42C and the resin portion 42D. In this case, the light-transmitting resin member 180 may be disposed, in a cross-sectional view, by utilizing a step portion located between the first side surface s1 and the upper surface u1 of the pair of resin portions 42C. For example, the light-transmitting resin member 180 may be disposed so as to cover the step portion but not the upper surface u1. The interface between the light-transmitting resin member 180 and the molded resin portion 60 may be a surface (incident surface) onto which light emitted from the light-emitting element 50 is incident. A resin having excellent heat resistance and weather resistance (for example, a silicone resin, an epoxy resin, or an epoxy-modified silicone resin) may be used as the light-transmitting resin member 180.

[0102] [Molded resin part 60] The molded resin portion 60 includes a base portion 61 and a plurality of lens portions 70. The base portion 61 and the lens portions 70 are molded integrally.

[0103] <Base part 61> 2A to 2E, the base portion 61 of the molded resin portion 60 covers the main surface 100a of the resin package 100 and the plurality of light-emitting elements 50. The base portion 61 seals the light-emitting elements 50 and also has the function of holding the lens portion 70 integrally formed with the base portion 61 in a predetermined position.

[0104] In this embodiment, the base portion 61 has, for example, an upper surface 61a located above the main surface 100a of the resin package 100. The upper surface 61a may be slightly larger than the main surface 100a of the resin package 100.

[0105] The base portion 61 has a side surface portion 61b extending from an upper surface 61a of the base portion 61 toward the back surface of the resin package 100 in a side view. The side surface portion 61b covers at least a part of an outer portion 100c of the resin package 100.

[0106] The side surface portion 61b preferably covers only a portion of the outer surface 100c of the resin package 100. In other words, a portion of the outer surface 100c of the resin package 100 is preferably exposed from the side surface portion 61b of the base portion 61. As shown in the drawing, for example, the outer surface 100c of the resin package 100 may be exposed from the side surface portion 61b of the base portion 61 on the rear surface 100b side of the first step surface st1.

[0107] It is preferable that the bottom end of the base portion 61, which is located furthest in the -z direction, is located above the portion of the outer portion 100c where the leads 11a to 13b are exposed, and that the molded resin portion 60 and the leads 11a to 13b are not in direct contact with each other. This prevents a portion of the molded resin portion 60 from partially covering the mounting surface of the leads 11a to 13b. This makes it possible to reduce the reduction in the area of ​​the mounting surface caused by the molded resin portion 60.

[0108] In this embodiment, in a cross-sectional view, the first light-emitting element 51 is preferably located closer to the back surface 100b of the resin package 100 (-z side) than the first point P and higher than the second point Q (+z side). In the z-axis direction, the first light-emitting element 51 may be located between the first point P and the second point Q. This reduces the distance in the z-axis direction between the first light-emitting element 51 and the first lens portion 71. Similarly, each of the second light-emitting element 52 and the third light-emitting element 53 may be located closer to the back surface 100b of the resin package 100 than the first point P and higher than the second point Q.

[0109] In the cross-sectional views shown in FIGS. 2D and 2E , the portion of the side surface portion 61b of the base portion 61 extending from the first point P to the second point Q does not have a bent portion. The absence of a bent portion means that the portion extending from the first point P to the second point Q does not have a bent shape in the cross-sectional view. The portion of the side surface portion 61b extending from the first point P to the second point Q may be an inclined surface inclined with respect to the back surface 100b (parallel to the xy plane in this case). The angle between the inclined surface and the xy plane may be, for example, 5° to 45°. This facilitates the release of the casting case 120 from the molded resin portion 60 in the curing process described below. As shown in the drawings, in the cross-sectional view, the portion of the side surface portion 61b of the base portion 61 located between the first point P and the second point Q may be linear (i.e., a line segment connecting the first point P and the second point Q). In the cross-sectional view, the second point Q may be located outside the first point P. The third point R may be located more inward than the first point P in a cross-sectional view.

[0110] Furthermore, by arranging the first light-emitting element 51 to the third light-emitting element 53 above the second point Q, the first light-emitting element 51 to the third light-emitting element 53 can be sufficiently separated from the interface 1000u between the molded resin part 60 and the resin package 100.

[0111] In a cross-sectional view, the second point Q is preferably located closer to the back surface 100b of the resin package 100 than the inner upper surface 21a of the first recess 21. In the z-axis direction, the second point Q may be located between the inner upper surface 21a of the first recess 21 and the back surface 100b of the package 100. This allows the first to third light-emitting elements 51 to 53 to be sufficiently separated from the interface 1000u between the molded resin part 60 and the resin package 100.

[0112] In a cross-sectional view, it is preferable that a portion of the side surface portion 61b of the base portion 61 extending from the second point Q to the third point R be concavely curved. In the example shown in FIGS. 2D and 2E, in a cross-sectional view, the entire portion S of the outer surface of the side surface portion 61b located between the second point Q and the third point R (hereinafter referred to as the "first portion") is curved convexly (concave outward) toward the outer surface 100c of the resin package 100. Including a curved portion in the first portion S of the outer surface effectively prevents the waterproof resin disposed on the side surface of the light emitting device 1000 from creeping up from the back surface 100b of the resin package 100 to the upper surface 61a of the base portion 61. Furthermore, the curvature of the first portion S increases the length of the first portion S in a cross-sectional view, thereby increasing the adhesive area between the first portion S and the waterproof resin and improving the adhesion between the waterproof resin and the molded resin portion 60. Furthermore, a curved surface of the first portion S makes it easier to hold the waterproof resin on the first portion S. For example, in a cross-sectional view, the uppermost end of the portion of the outer surface of the molded resin part 60 that comes into contact with the waterproof resin may be the second point Q (see Figure 3B), or it may be any point on the first portion S of the outer surface.

[0113] Increasing the length of the first portion S in cross-sectional view can further improve waterproof performance. The reason for this is as follows: When moisture penetrates from the top of the contact portion between the side surface of the light emitting device 1000 and the waterproof resin, the penetrated moisture flows downward (in the -z direction) between the waterproof resin and the first portion S on the outer surface of the molded resin portion 60. If some of this moisture reaches the interface 1000u (see FIG. 2A, etc.) between the molded resin portion 60 and the resin package 100, it may penetrate from the interface 1000u into the light emitting device 1000, potentially degrading the characteristics of the light emitting device 1000. In contrast, increasing the length of the first portion S in cross-sectional view can lengthen the path that moisture that penetrates from the top of the contact portion between the waterproof resin and the side surface of the light emitting device 1000 takes to reach the interface 1000u, thereby more effectively reducing moisture penetration.

[0114] In this embodiment, the height Hr of the third point R is preferably less than half the height Ha of the main surface 100a of the resin package 100. The height Hr of the third point R is the shortest distance in the z-axis direction between the third point R and the back surface 100b. This allows the interface 1000u, which is the moisture intrusion portion, to be located further downward (on the -z side) of the light emitting device 1000, thereby further improving the waterproof performance of the light emitting device 1000.

[0115] 2D , the length of the first portion S in a cross-sectional view can be adjusted by, for example, the height Hq of the second point Q, the height Hr of the third point R, and the distance (shortest distance) Hx between the second point Q and the third point R in the x-axis direction. As an example, the length of the first portion S can be ensured by setting the ratio Hr / Hq of the height Hr of the third point to the height Hq of the second point Q to 0.8 or less, preferably 0.7 or less. Note that in order to prevent contact between the molded resin portion 60 and the leads, the ratio Hr / Hq can be set to 0.2 or more, preferably 0.4 or more.

[0116] The distance Hx in the x-axis direction between the second point Q and the third point R is not particularly limited, but may be, for example, 0.05 mm or more, preferably 0.1 mm or more. This more effectively prevents the waterproof resin from creeping up above the first portion S. Furthermore, by increasing the distance Hx, the length of the first portion S in cross-sectional view can be increased. On the other hand, from the viewpoint of miniaturizing the light emitting device 1000, the distance Hx may be, for example, 0.5 mm or less, preferably 0.3 mm or less.

[0117] This configuration can more effectively reduce the creeping up of the waterproof resin disposed on the side surface of the light emitting device 1000. As will be described later, the side surface portion 61b having the above-described cross-sectional shape can be easily formed by utilizing the creeping up of the resin material when forming the molded resin portion.

[0118] In a cross-sectional view, the second point Q of the molded resin part 60 is preferably located above (on the +z side) the first step surface st1 of the resin package 100 and below (on the -z side) the main surface 100a. This reduces contact of the bottom end of the molded resin part 60 with the leads 11a to 13b. This ensures a mounting surface between the mounting substrate and the leads 11a to 13b when mounting the light emitting device 1000.

[0119] As shown in FIG. 2D , the distance Hq from the back surface 100b of the resin package 100 to the second point Q of the molded resin portion 60 (the height of the second point Q) is 0.6 mm or more and 1.9 mm or less, more preferably 0.7 mm or more and 1.4 mm or less, and even more preferably 0.75 mm or more and 1.1 mm or less. If the height Hq of the second point Q is 0.6 mm or more, the distance between the lead mounting surface on the back surface 100b of the resin package 100 and the point where the resin material that becomes the molded resin portion 60 starts to creep up in the −z direction can be increased during the immersion process used to form the molded resin portion 60 by casting. This reduces the risk of part of the resin material reaching the lead mounting surface, thereby improving the reliability of the light emitting device 1000. On the other hand, if the height Hq of the second point Q is 1.9 mm or less, the resin package 100 can be more firmly fixed by the molded resin portion 60.

[0120] 2D , in a cross-sectional view, the width Wq, which is the distance in a plane (xy plane) parallel to the main surface 100a from the second point Q of the base portion 61 to the outer portion 100c of the resin package 100, is 0.2 mm or more and 0.6 mm or less, and more preferably 0.4 mm or more and 0.5 mm or less. Furthermore, for example, the ratio of the width Wq to the maximum width W1 of the first surface p1 of the resin package 100 in a direction parallel to the main surface 100a is 0.1 or more and 0.5 or less. In the illustrated example, the resin package 100 has a shape in which the width in a direction parallel to the main surface 100a increases from the main surface 100a toward the back surface 100b.

[0121] If the ratio Wq / W1 is 0.1 or more, a sufficient distance can be secured between the resin package 100 located inside the casting case and the inner wall of the casting case when forming the molded resin part 60 by a casting molding method. Therefore, voids in the resin material injected into the casting case can easily escape to the outside through the gap between the casting case and the side of the resin package 100.

[0122] If the gap between the resin package 100 and the inner wall of the casting case is too small, the maximum amount of resin material that can creep up to the outer portion 100c of the resin package 100 when the resin package 100 is immersed in the casting case—i.e., the maximum amount of resin material that creeps up through the gap and does not reach the leads—is reduced. As a result, sufficient resin material may not be deposited on the outer portion 100c of the resin package 100, or the amount of resin material may exceed the predetermined range, making it difficult to reduce the creeping of the resin material at the first step surface st1. Even in such cases, a base portion 61 having a desired shape can be formed by, for example, increasing the width of the first step surface st1. On the other hand, if Wq / W1 is 0.1 or greater when W1 is fixed, the gap between the resin package 100 and the inner wall of the casting case becomes larger, thereby widening the range of the amount of creeping resin material that can achieve the desired shape. Therefore, a base portion 61 having a desired shape can be formed. Furthermore, since the amount of resin material is easily adjusted, it is possible to increase the degree of freedom in designing the first step surface st1, which allows control of the shape of the molded resin portion 60. The width Wq is preferably designed to be, for example, 0.4 mm or more. On the other hand, when the size of W1 is fixed, if Wq / W1 is 0.5 or less, the size of the light emitting device 1000 can be kept small.

[0123] <Lens part 70> The lens section 70 has a light distribution function that controls the direction and distribution of emitted light.

[0124] In this embodiment, each of the lens units 70 has a convex shape that protrudes upward from the upper surface 61a of the base unit 61. The planar shape of each lens unit 70 is, for example, elliptical or circular. In the illustrated example, the planar shape of each lens unit 70 is elliptical, with the major axis of the ellipse extending in the x-axis direction and the minor axis extending in the y-axis direction. This results in a light distribution that is wide in the x-axis direction and narrow in the y-axis direction. A light-emitting device 1000 having such a light distribution is particularly suitable for use in display devices such as LED displays. Note that, in a side view seen from the x-axis or y-axis direction, the outer edge of the lens unit 70 may have a straight portion in addition to a curved portion such as an elliptical arc or arc. The straight portion may be located between the curved portion and the upper surface 61a of the base unit 61. For example, the lens unit 70 may have a shape in which a portion of a sphere (e.g., a hemisphere) is arranged on a truncated cone, or a shape in which a portion of an ellipsoid is arranged on a truncated elliptical cone.

[0125] Each of the plurality of lens units 70 is arranged corresponding to one of the light emitting elements 50. The optical axis of each lens unit 70 may coincide with the center (center of the light emitting surface) of the corresponding light emitting element 50. This can further improve the controllability of the light distribution of the light emitting device 1000.

[0126] The shape and arrangement of each lens portion 70 in a plan view can be appropriately selected taking into consideration the light distribution, light collection, etc. Furthermore, the cross-sectional shape of the lens portion is not limited to a convex shape. The lens portion may be, for example, a concave shape or a Fresnel lens.

[0127] In this embodiment, the first light emitted by the first light-emitting element 51 passes through the first lens unit 71 and is emitted from the emission surface of the light-emitting device 1000. The direction and distribution of the emitted first light are controlled by the first lens unit 71. Similarly, the second light emitted by the second light-emitting element 52 passes through the second lens unit 72, and the third light emitted by the third light-emitting element 53 passes through the third lens unit 73. The second lens unit 72 and the third lens unit 73 control the distribution of the second light and the third light, respectively.

[0128] When the first light-emitting element 51, the second light-emitting element 52, and the third light-emitting element 53 are lit, the light that is a mixture of the light that has passed through the first lens portion 71, the second lens portion 72, and the third lens portion 73 is, for example, white.

[0129] 2C, the first lens unit 71, the second lens unit 72, and the third lens unit 73 are arranged in the y-axis direction in a plan view. In a plan view, the centers of the first lens unit 71 to the third lens unit 73 may be located on a straight line parallel to the y-axis. The arrangement of the lens units 70 is not limited to this example. For example, the center of the lens unit that is located in the middle in the x-axis direction or the y-axis direction among the first lens unit 71, the second lens unit 72, and the third lens unit 73 does not have to be located on the line connecting the centers of the other two lens units.

[0130] <Material of molded resin portion 60> The molded resin part 60 includes a light-transmitting base material. The molded resin part 60 preferably has a light transmittance of 90% or more at the peak wavelength of each of the plurality of light-emitting elements 50. This can further increase the light extraction efficiency of the light-emitting device 1000.

[0131] The base material of the molded resin portion 60 is preferably a thermosetting resin or glass having excellent weather resistance and light transmittance, such as epoxy resin, urea resin, silicone resin, or modified silicone resin such as epoxy modified silicone resin.

[0132] The molded resin part 60 in this embodiment can also contain a light diffusing material to improve the uniformity of the light quality of the light emitting device 1000. By containing a light diffusing material in the molded resin part 60, it is possible to reduce unevenness in the intensity of the light by diffusing the light emitted from the light emitting element 50. Suitable light diffusing materials include inorganic materials such as barium oxide, barium titanate, silicon oxide, titanium oxide, and aluminum oxide, and organic materials such as melamine resin, CTU guanamine resin, and benzoguanamine resin.

[0133] Various fillers may be contained in the molded resin portion 60. The specific materials are the same as the light diffusing material, but the light diffusing material has a central particle diameter (D 50 ) are different. In this specification, filler refers to a material having a median particle size of 100 nm or more and 100 μm or less. When filler having such a particle size is contained in the light-transmitting resin, the light scattering effect improves the chromaticity variation of the light-emitting device 1000, and the thermal shock resistance of the light-transmitting resin is improved and the internal stress of the resin is alleviated. Or It is possible.

[0134] The surface roughness of the base portion 61 is not particularly limited, but a larger surface roughness is preferable from the viewpoint of improving display contrast. For example, a portion or the entire surface of the base portion 61 may be roughened. At least the portion of the upper surface 61a of the base portion 61 that does not overlap the lens units 70 in a plan view is preferably roughened. The outer surfaces of the side portions 61b of the base portion 61 may also be roughened. The surface roughness of the upper surface 61a and the outer surface of the side portions 61b may be the same or different. For ease of processing, it is preferable that the surface roughness of the upper surface 61a and the outer surfaces of the side portions 61b be the same. A large surface roughness of the base portion 61 allows external light, such as sunlight, to be scattered on the surface of the base portion 61, thereby reducing reflection intensity. This makes it possible for the light-emitting device 1000 to be less susceptible to a decrease in contrast due to external light reflection.

[0135] The surface roughness of the portion of the upper surface 61a of the base portion 61 that does not overlap with the plurality of lens portions 70 in a planar view may be greater than the surface roughness of the lens portions 70, for example. Such a structure can be obtained, for example, by forming the molded resin portion 60 including the base portion 61 and the lens portions 70, and then performing a roughening process such as blasting on a predetermined region of the surface of the base portion 61. Alternatively, a casting case (see FIG. 4) having a partially roughened inner surface may be used to form the molded resin portion 60. As will be described in detail later, for example, by roughening the portion of the inner surface of the casting case that forms the upper surface 61a of the base portion 61, the surface roughness of the portion of the upper surface 61a of the base portion 61 that does not overlap with the plurality of lens portions 70 in a planar view can be increased.

[0136] The arithmetic mean roughness Ra of the upper surface 61a of the base portion 61 is preferably 0.4 μm or more and 5 μm or less. More preferably, Ra is 0.8 μm or more and 3 μm or less. The Ra of the outer surface of the side portion 61b of the base portion 61 may also be in the same range as above. Ra can be measured in accordance with the surface roughness measurement method of JIS B 0601-2001. Specifically, Ra can be expressed by the following equation when a portion of measurement length L is extracted from the roughness curve in the direction of its center line, the center line of this extracted portion is the X-axis, the direction of longitudinal magnification is the Y-axis, and the roughness curve is y=f(x): JPEG0007776752000001.jpg1173

[0137] The Ra can be measured using a contact surface roughness measuring instrument, a laser microscope, etc. In this specification, a Keyence VK-250 laser microscope is used.

[0138] The base portion 61 preferably has a light transmittance of 90% or more at the peak wavelength of each of the plurality of light emitting elements 50. This allows the light extraction efficiency of the light emitting device 1000 to be further improved.

[0139] (Display device 2000) The light emitting device of this embodiment can be applied to display devices such as outdoor displays, etc. An example of a display device using the light emitting device of this embodiment will be described below.

[0140] FIG. 3A is a schematic cross-sectional view showing a display device 2000. As shown in FIG.

[0141] Display device 2000 includes substrate 1 such as a printed circuit board, a plurality of light emitting devices 2 arranged two-dimensionally on substrate 1, and waterproof resin 3. Light emitting device 2 shown in FIG. 3A differs from light emitting device 1000 described with reference to FIGS. 1 and 2 to 2H in the arrangement of the lens portion, but may otherwise have a similar structure. Light emitting device 1000 described with reference to FIGS. 1 and 2 to 2H may be used as light emitting device 2. FIG. 3B is an enlarged cross-sectional view showing a portion of display device 2000 when the light emitting device shown in FIGS. 1 and 2 to 2H is used as light emitting device 2.

[0142] The waterproof resin 3 covers the surface of the substrate 1 and part of the side surface of the display device 2000. The waterproof resin 3 prevents moisture from entering the inside of the light emitting device 2 and protects the terminal portion and the light emitting element.

[0143] In the illustrated configuration, moisture from outside the display device 2000 easily penetrates into the light emitting device 2 from, for example, the interface 1000u (including the third point R) between the resin package 100 and the molded resin part 60. For this reason, it is preferable that the waterproof resin 3 covers from the bottom of the side surface of the light emitting device 2 to a part located above the interface between the resin package 100 and the molded resin part 60, which is the moisture penetration part. On the other hand, it is preferable that the top end of the waterproof resin 3 is located below the upper surface 61a of the base part 61. This is because if the waterproof resin 3 is arranged on the upper surface 61a of the base part 61 or the lens part 70, the light extraction efficiency from the light emitting device 2 may decrease, or the light distribution controllability by the lens part 70 may decrease.

[0144] The waterproof resin (e.g., silicone resin) 3 is typically applied after mounting multiple light emitting devices 2 on the substrate 1. In this embodiment, in a cross-sectional view of the light emitting device 2, the third point R, which is the moisture intrusion point, is located closer to the lens unit 70 than the second point Q, which is the outermost point of the side surface 61b of the base unit 61. Therefore, the waterproof resin 3 is likely to be disposed so as to cover the side surface of the light emitting device 2 from the bottom to at least the third point R. This can more effectively reduce moisture intrusion from the interface 1000u between the molded resin unit 60 and the resin package 100. Furthermore, because the side surface of the light emitting device 1000 (the outer surface of the base unit 61) extends up to the second point Q like an eave, the waterproof resin 3 is less likely to creep up the side surface of the light emitting device 2 beyond the second point Q. This can reduce the likelihood of part of the waterproof resin 3 being disposed on the upper surface 61a of the base unit 61 or the lens unit 70. For example, in a cross-sectional view, the uppermost end of the waterproof resin 3 may be located above the interface portion 1000u and below the second point Q. In other words, a portion of the side surface of the base portion 61 located above the second point Q may be exposed from the waterproof resin 3.

[0145] Although the display device 2000 for outdoor display has been described as an example here, there is no particular limitation on the use of the display device 2000. Furthermore, even when the side surfaces of the light-emitting device 2 are covered with resin for purposes other than waterproofing, the arrangement of the resin can be controlled depending on the shape of the side surfaces of the light-emitting device 2, and therefore, the same effect as above can be achieved.

[0146] [Method of manufacturing the light emitting device 1000] An example of a method for manufacturing the light emitting device 1000 will now be described.

[0147] 4A to 4G are cross-sectional views illustrating steps in the method for manufacturing light emitting device 1000, and show a cross section taken along line 2D-2D in FIG. 2C.

[0148] (First step: Preparation of resin package 100) In the first step, as shown in Fig. 4A, a resin package 100 including a dark colored resin member 40 and a plurality of leads is prepared. The resin package 100 can be formed by transfer molding, insert molding, or the like. Here, a method for forming the resin package 100 by transfer molding will be described.

[0149] First, a lead frame including a plurality of leads is prepared. In this example, the lead frame includes three pairs of leads for one package. Each pair of leads includes leads 10a and 10b spaced apart from each other.

[0150] Next, a mold is prepared and the lead frame is placed in the mold. After this, a dark-colored thermoplastic resin material is poured into the mold and allowed to solidify by cooling. This results in a resin package 100 in which multiple leads 10a, 10b are held by a dark-colored resin member 40.

[0151] The structure of the resin package 100 is similar to that described above with reference to Figures 2F to 2H. The dark colored resin member 40 in the resin package 100 is arranged so as to define the first recess 21 and the second recesses 22 and 23. The dark colored resin member 40 also has a first step surface st1 on the outer side 100c of the resin package 100. The configuration of the dark colored resin member 40 can be formed in this process depending on the shape of the mold.

[0152] (Second step: Mounting the light emitting element 50) 4B, in the second step, a plurality of light-emitting elements 50 are mounted in the resin package 100. First, the light-emitting elements 50 are bonded to a portion of the exposed region 30 of one lead 10a of each lead pair on the main surface 100a of the resin package 100 using, for example, a conductive paste. Next, the positive and negative electrodes of each light-emitting element 50 are electrically connected to a portion of the exposed region 30 of the leads 10a and 10b, respectively, using a pair of wires 80.

[0153] (Third step: Formation of the reflective member 150 and the light-transmitting resin member 180) In the third step, as shown in FIG. 4C, a reflective member 150 and a light-transmitting resin member 180 are formed around each light-emitting element 50.

[0154] First, a first resin material that will become a reflective member is applied into the first recess 21 of the resin package 100 using a nozzle, and then the first resin material is cured to obtain the reflective member 150.

[0155] Alternatively, a dark-colored resin material may be applied to the second recesses 22, 23 and cured to form the second dark-colored resin member 190. The first resin material and the resin material that will become the second dark-colored resin member may be applied and cured simultaneously using multiple nozzles. This simplifies the process, as the work can be performed simultaneously. Alternatively, the first resin material may be applied after the second dark-colored resin has been applied and cured.

[0156] Next, a second resin material that will become a translucent resin member is applied within the area defined by resin portion 42A of second resin portion 42 so as to cover light-emitting element 50, reflective member 150, and resin portion 42C, and is cured to obtain translucent resin member 180.

[0157] Alternatively, the resin material for the reflective member and the second dark-colored resin member may be heated at a temperature lower than the curing temperature to temporarily cure it, and the second resin material for the translucent resin member may be placed on the temporarily cured body for the reflective member and the second dark-colored resin member. The temporarily cured body and the second resin material for the reflective member and the second dark-colored resin member may then be heated at a temperature equal to or higher than the curing temperature to permanently cure them. Alternatively, the molded resin portion may be formed in a temporarily cured state of the resin materials for the reflective member, the second dark-colored resin member, and the translucent resin member. In this case, these resin materials may be permanently cured in the curing process for forming the molded resin portion. In this manner, the first structure 110 is obtained, in which the light-emitting element 50, the reflective member 150, and the translucent resin member 180 are arranged on the main surface 100a of the resin package 100.

[0158] (Fourth step: Formation of molded resin portion 60) In the third step, the molded resin part 60 is formed by, for example, casting. The base part 61 and the lens part 70 of the molded resin part 60 are, for example, integrally formed. The base part and the lens part 70 of the molded resin part 60 may be separate parts.

[0159] ·Preparing the Casting Case 120 First, as shown in FIG. 4D, a casting case 120 is prepared, which has an opening 120p, an upper cavity 121, and multiple lower cavities 130. The upper cavity 121 has a bottom surface 121b and an inner wall 121c formed continuously from the bottom surface 121b. The opening 120p is located on the opposite side (-z side) of the bottom surface 121b. Each lower cavity 130 protrudes from the bottom surface 121b of the upper cavity 121 in the direction opposite to the opening 120p (+z side).

[0160] The upper cavity 121 has a shape corresponding to a part of the base portion. For example, the bottom surface 121b of the upper cavity 121 corresponds to the upper surface 61a (FIG. 2D) of the base portion 61, and the inner wall 121c has a shape corresponding to a part of the side surface portion 61b (FIG. 2D) of the base portion 61. In a top view of the casting seen from the opening 120p side, the peripheral edge e1 of the bottom surface 121b is located inside the upper end e2 of the inner wall 121c.

[0161] The lower cavities 130 have a shape corresponding to the lens portions. Here, the plurality of lower cavities 130 are three lower cavities including a first cavity that becomes a first lens portion, a second cavity that becomes a second lens portion, and a third cavity that becomes a third lens portion.

[0162] - Injection process of the third resin material Next, as shown in FIG. 4E, a third resin material 142 containing a thermosetting resin as a base material is injected into each of the lower cavities 130.

[0163] Here, epoxy resin is used as the base material of the third resin material 142. The third resin material 142 is injected into the lower cavity 130 and the upper cavity 121. The amount of the third resin material 142 injected into the upper cavity 121 is preferably set to be smaller than the combined volume of the upper cavity 121 and the lower cavity 130. This allows the amount of the third resin material 142 that creeps up in the subsequent immersion process to be controlled by the first step surface st1. As shown in the figure, the third resin material 142 may have a concave upper surface that contacts the periphery of the opening 120p. On the other hand, if the amount of the third resin material 142 injected is too small, the third resin material 142 will not creep up in the subsequent immersion process. Therefore, the amount of the third resin material 142 injected is set to be greater than the inner volume of the upper cavity 121 minus the volume of the immersed portion of the resin package 100. Alternatively, the third resin material 142 may be injected into the lower cavity 130 and temporarily cured, and then the third resin material 142 may be injected into the upper cavity 121.

[0164] ·Soaking process 4F , first structure 110 is placed facing downward, and a portion of first structure 110 is immersed in third resin material 142 in casting case 120. Specifically, light emitting elements 50 in first structure 110 and main surface 100a of resin package 100 are immersed in third resin material 142 so that each of the plurality of light emitting elements 50 overlaps a corresponding one of the plurality of lower cavities 130 in a plan view.

[0165] A predetermined gap (clearance) d is formed between the outer portion 100c of the resin package 100 and the inner wall 121c of the upper cavity 121 of the casting case 120. The gap d corresponds to the width Wq shown in Fig. 2D. In a cross-sectional view, the gap d is the distance parallel to the xy plane between the upper end of the inner wall 121c and the outer portion 100c of the resin package 100.

[0166] By immersing the first structure 110, a portion of the third resin material 142 creeps up from between the outer portion 100c of the resin package 100 and the inner wall 121c of the upper cavity 121 of the casting case 120 along the outer portion 100c of the resin package 100 toward the first step surface st1, as shown by arrow 800 in Figure 4F.

[0167] The creeping up of the third resin material 142 is reduced by a first step surface st1 provided on the outer portion 100c of the resin package 100. As shown in FIG. 4F, the creeping up of the third resin material 142 is blocked by the first step surface st1. For example, an upper end 142e of the creeping up portion of the third resin material 142 (the end portion (in the -z direction) located farthest from the casting case 120) may be in contact with the first step surface st1.

[0168] The shape of the third resin material 142 is not limited to the shape shown in FIG. 4F. It may vary depending on the amount of the third resin material 142, the interval d, the immersion depth of the first structure 110, the shape of the outer portion 100c of the resin package 100, and other factors. For example, as illustrated in FIG. 5A, the upper end 142e of the rising portion of the third resin material 142 may be partially in contact with the first step surface st1. Alternatively, as illustrated in FIG. 5B, a portion of the third resin material 142 may be located below (on the +z side of) the first step surface st1. Furthermore, as illustrated in FIG. 5C, a portion of the third resin material 142 may extend beyond the first step surface st1 and reach the second step surface st2. Even in this case, the rising of the third resin material 142 is restricted by the first step surface st1, which reduces the possibility of the third resin material 142 rising to the point of contacting, for example, the leads 10a and 10b.

[0169] ·Curing process While the first structure 110 is immersed in the third resin material 142, the third resin material 142 is cured. The curing process is performed at a temperature equal to or higher than the curing temperature of the base material of the third resin material 142. After curing, the casting case 120 is removed. As a result, as shown in FIG. 4G, a molded resin part 60 is formed, which includes a base part 61 covering the main surface 100a of the resin package 100 and a plurality of (here, three) lens parts 70. The lens parts 70 and the base part 61 of the molded resin part 60 are formed from the third resin material 142.

[0170] Here, the third resin material 142 is injected into the lower cavity 130 and the upper cavity 121 successively, but after injection into the lower cavity 130, the third resin material 142 injected into the lower cavity 130 may be temporarily cured, and then the third resin material 142 may be injected into the upper cavity 121, and the temporarily cured lower cavity 130 and the third resin material 142 injected into the upper cavity 121 may be permanently cured.

[0171] The first point P of the molded resin part 60 may be a point corresponding to the corner between the bottom surface 121b and the inner wall 121c of the upper cavity 121. The second point Q may be a point corresponding to the upper end of the opening 120p of the upper cavity 121. The third point R may be a point corresponding to the upper end 142e of the rising portion of the third resin material 142.

[0172] 5A to 5C, when the molded resin portion 60 is formed by curing the third resin material 142, the point corresponding to the upper end 142e of the raised portion of the third resin material 142 can become the third point R. The molded resin portion 60 formed from the third resin material 142 shown in FIGS. 5A to 5C is shown in FIGS. 6A to 6C, respectively.

[0173] Thereafter, the leads 11a to 13b are cut from the lead frame and separated into individual pieces, thereby obtaining the light emitting device 1000.

[0174] According to the manufacturing method of this embodiment, in the dipping step of the first structure, the molded resin portion 60 having a desired shape can be formed by utilizing the rising of the resin material, thereby reducing the manufacturing cost and the number of manufacturing steps.

[0175] The light emitting device can be modified in various ways. For example, the structure and arrangement of the light emitting element, the structure and form of the resin package, the configuration of the molded resin part, etc. are not limited to the forms described in the above embodiments. Forms other than those described in the embodiments can be suitably used for the light emitting device of the present disclosure.

[0176] Modified examples of the light emitting device of the present disclosure will be described below. Differences from light emitting device 1000 will be mainly described below, and explanations of structures similar to those of light emitting device 1000 will be omitted. For ease of understanding, in each drawing showing the modified examples, components similar to those of light emitting device 1000 are assigned the same reference numerals.

[0177] (Variation 1) Fig. 7A is a schematic side view of light emitting device 1001 of Modification 1 as viewed from the y-axis direction, Fig. 7B is a schematic side view of light emitting device 1001 as viewed from the x-axis direction, Fig. 7C is a schematic top view of light emitting device 1000, and Fig. 7D is a schematic cross-sectional view taken along line 7D-7D in Fig. 7C.

[0178] Light emitting device 1001 differs from light emitting device 1000 shown in FIGS. 2A to 2G in that base portion 61 of molded resin portion 60 has a step.

[0179] In this modified example, in a cross-sectional view, the outer surface of the side surface portion 61b of the base portion 61 includes a step surface (hereinafter referred to as a "base step surface") 62 facing in the same direction as the main surface 100a, between a first point P and a second point Q. The outer surface of the side surface portion 61b of the base portion 61 is stepped in a cross-sectional view, and the base step surface 62 is a surface corresponding to the tread of the steps. In this example, the base step surface 62 is located below the main surface 100a of the resin package 100. Furthermore, in a top view, the base step surface 62 is formed around the outer periphery of the base portion 61.

[0180] 7D, the distance h1 along the z-axis direction from the upper surface 61a of the base portion 61 to the base step surface 62 may be greater than the distance h2 along the z-axis direction from the xy plane including the second point Q to the base step surface 62. The distance h2 may be, for example, 0.1 mm or more and 0.3 mm or less. The width w1 of the base step surface 62 in a direction parallel to the main surface 100a may be smaller than the width Wq, which is the distance in a plane (xy plane) parallel to the main surface 100a from the second point Q of the base portion 61 to the outer portion 100c of the resin package 100. The width w1 may be, for example, 0.1 mm or more and 0.4 mm or less.

[0181] The resin package 100 in this modification may further have a tapered surface 100t inclined with respect to the main surface 100a between the main surface 100a and the outer portion 100c of the resin package 100. The tapered surface 100t is located above the second point Q of the base portion 61. In a side view, the base step surface 62 may overlap the tapered surface 100t.

[0182] The tapered surface 100t is a surface inclined in the -z direction with respect to the main surface 100a (here, the xy plane) at an angle θt of, for example, 35° to 45°. The inclination angle θt of the tapered surface 100t with respect to the xy plane is smaller than the inclination angle θc of the portion of the outer portion 100c that contacts the tapered surface 100t.

[0183] As shown in FIG. 7C, in plan view, the tapered surface 100t may be disposed on the outer side of the resin portion 42A so as to be in contact with the resin portion 42A.

[0184] The structures of the first resin portion 41 and the second resin portions 42A, 42C, and 42D in this modification are not particularly limited, and may be the same as or different from those of the above-described light-emitting device 1000. As shown in Fig. 7D, the resin portion 42C does not have to have an upward step surface located between the inner side surface 21c of the first recess 21 and the upper surface u1.

[0185] According to this modification, a molded resin part with reduced voids can be formed by casting molding by forming a base stepped surface 62 on the base part 61. Hereinafter, a description will be given with reference to the drawings.

[0186] 8A and 8B are cross-sectional views showing steps in a method for forming a molded resin portion by casting.

[0187] 8A shows a process of injecting third resin material 142 into lower cavity 130 and upper cavity 121 of casting case 120. As shown in the figure, in this modification, the inner wall of upper cavity 121 of casting case 120 has step surface 123 corresponding to base step surface 62 (FIG. 7D) of base portion 61. The amount of third resin material 142 can be set, for example, to be larger than the volume from bottom surface 121b of upper cavity 121 to step surface 123, but smaller than the volume of the entire upper cavity 121. As a result, third resin material 142 injected into upper cavity 121 has a convex upper surface that contacts the inner edge of step surface 123.

[0188] In this modification, the amount of the third resin material 142 is set to be less than the volume of the upper cavity 121, and the step surface 123 is used to control the upper surface of the third resin material 142 to be convex.

[0189] A distance c1 (corresponding to the distance h1 of the base portion) along the z-axis direction from the bottom surface 121b of the upper cavity 121 to the step surface 123 may be greater than a distance c2 (corresponding to the distance h2 of the base portion) along the z-axis direction from the upper end of the inner wall 121c of the upper cavity 121 to the step surface 123. This makes it possible to contain a desired amount of third resin material 142 in the upper cavity 121 and make the upper surface thereof convex while suppressing the size (volume) of the upper cavity 121.

[0190] FIG. 8B shows a step of immersing the first structure 110 including the resin package 100 and the light emitting element 50 in the third resin material 142 injected into the upper cavity 121.

[0191] In this step, since the third resin material 142 has a convex upper surface, it is possible to reduce the occurrence of voids v that occur in the third resin material 142 when the first structure 110 including the resin package 100 is immersed. More specifically, since the upper surface of the third resin material 142 is convex, the central portion of the resin package 100 comes into contact with the third resin material 142 before the peripheral portion.

[0192] Furthermore, in this modification, the resin package 100 has a tapered surface 100t, which increases the volume of the portion of the upper cavity 121 located between the outer portion 100c of the resin package 100 and the inner wall 121c of the upper cavity 121. As the resin package 100 is immersed deeper, voids v generated in the third resin material 142 move from the center of the upper cavity 121 (the portion located between the center of the immersed resin package 100 and the bottom surface 121b of the upper cavity 121) toward the inner wall 121c, along arrow 801 shown in FIG. 8B. The voids v that reach the vicinity of the inner wall 121c of the upper cavity 121 are released into the space above from between the resin package 100 and the upper end of the inner wall 121c of the upper cavity 121, along arrow 802 shown in FIG. 8B. Therefore, the path along which the voids v in the third resin material 142 travel when moving along the arrow 802 becomes wider, and the voids v can be reduced more effectively.

[0193] If the upper cavity 121 has a step surface 123, the passage of the void v is likely to become narrower below (on the +z side of) the step surface 123. In this case, the passage of the void v can be secured by increasing the distance d between the upper end of the inner wall 121c of the upper cavity 121 and the outer part 100c of the resin package 100. Furthermore, by providing the resin package 100 with a tapered surface 100t, the passage of the void v can be secured without increasing the volume of the upper cavity 121 (i.e., increasing the size of the base part).

[0194] The width of the step surface 123 in a direction parallel to the main surface 100a (corresponding to the width w1 of the step surface of the molded resin portion) may be set to be smaller than the distance d between the upper end of the inner wall 121c of the upper cavity 121 and the outer portion 100c of the resin package 100. This ensures a path for the void v between the inner wall 121c and the outer portion 100c of the resin package 100.

[0195] The effect of the tapered surface 100t does not depend on the shape of the upper cavity. For example, even if the upper cavity does not have a stepped surface, the effect of making it easier for voids to escape can be obtained by providing the resin package with the tapered surface 100t.

[0196] (Variation 2) 9A and 9B are schematic side views of a light emitting device 1002 of Modification 2, and FIG. 9C is a top perspective view of the light emitting device 1002. FIG. 9D is a schematic cross-sectional view taken along line 9D-9D in FIG. 9C. The perspective view of the light emitting device 1002 is similar to the schematic view of the light emitting device 1000 shown in FIG.

[0197] The light emitting device 1002 differs from the light emitting device 1001 of variant 1 in that the upper surface of the resin part 42F located between the first recess 21 and the second recesses 22, 23 on the main surface 100a of the resin package 100 is higher than the upper surface of the resin part 42E located further outwards.

[0198] In this modification, on the main surface 100a, the dark-colored resin member 40 includes a first resin portion 41 located on the inner upper surface 21a of the first recess 21, and a second resin portion 42 that surrounds the inner upper surface 21a of the first recess 21 in a plan view and has an upper surface located higher than the upper surface of the first resin portion 41. In a plan view of the main surface 100a of the resin package 100, the second resin portion 42 includes a resin portion 42E (sometimes referred to as a "third resin portion") and a resin portion 42F (sometimes referred to as a "fourth resin portion") located between the resin portion 42E and the first resin portion 41. The upper surface of the resin portion 42F is located higher than the upper surface of the resin portion 42E, which is located higher than the upper surface of the first resin portion 41. In a top view, a tapered surface 100t may be formed on the outer side of the resin portion 42E.

[0199] 9D, the thickness of the portion of the base portion 61 located on the main surface 100a of the resin package 100 (hereinafter referred to as the "top surface portion") is thin on the resin portion 42F and thick on the first resin portion 41 and the resin portion 42E. The top surface portion of the base portion 61 can have a sufficient thickness T except for the portion that overlaps with the resin portion 42F in a plan view. Therefore, the area ratio of the portion of the top surface portion of the base portion 61 where the thickness is thin in a plan view can be reduced, thereby ensuring the strength of the base portion 61.

[0200] 9C, the upper inner surface 21a of the first recess 21 is surrounded by a resin part 42F. The side surface of the resin part 42F on the side of the upper inner surface 21a becomes the inner side surface 21c of the first recess 21.

[0201] The resin portion 42F has, for example, a pair of wall portions having a rectangular planar shape extending in the y-axis direction and a pair of wall portions having a rectangular planar shape extending in the x-axis direction, and these wall portions define each side of the rectangular inner upper surface 21a in a plan view. The inner upper surfaces 22a, 23a of the second recesses 22, 23 are surrounded by the resin portion 42F and the resin portion 42E, respectively. For example, the resin portion 42E includes a pair of wall portions located on the -x side and the +x side of the resin portion 42E in a plan view. Each wall portion of the resin portion 42E extends to define three of the four sides of the rectangular inner upper surfaces 22a, 23a in a plan view, excluding one side located on the resin portion 42F side. In other words, one of the four sides of the inner upper surfaces 22a, 23a in a plan view is defined by the resin portion 42F, and the other three sides are defined by the resin portion 42E. The cross-sectional shape of resin part 42F is not particularly limited, but as shown in FIG. 9D, resin part 42F may have a shape similar to that of resin part 42C shown in FIG. 2G, or may have a shape similar to that of resin part 42C shown in FIG. 7D.

[0202] (Variation 3) Fig. 10A is a schematic top perspective view showing the light emitting element and resin package in light emitting device 1003 of Modification 3, Fig. 10B is a schematic cross-sectional view taken along line 10B-10B in Fig. 10A, and Fig. 10C is a schematic top view showing the light emitting element, resin package, and lens portion in another light emitting device 1003a of Modification 3.

[0203] Light emitting devices 1003 and 1003a of this modification differ from resin package 100 of light emitting device 1000 shown in FIGS. 2A to 2G in that a connection region wr for wire bonding is further arranged within one first recess 21.

[0204] In the light-emitting device 1003 shown in FIGS. 10A and 10B , the inner upper surface 21a of the first recess 21 disposed on the main surface 100a of the resin package 100 includes, in a plan view, three element mounting regions 201-203 arranged in the y-axis direction and two intervening regions 211 and 212. The element mounting regions 201-203 are connected to each other via the intervening regions 211 and 212. The element mounting region 201 includes a region where the first light-emitting element 51 is disposed. Similarly, the element mounting region 202 includes a region where the second light-emitting element 52 is disposed. The element mounting region 203 includes a region where the third light-emitting element 53 is disposed. Each of the element mounting regions 201-203 may also include a connection region wr that connects the corresponding light-emitting element to a pair of leads. The intervening region 211 is located between the element mounting region 201 and the element mounting region 202 in the y-axis direction. The width of intervening region 211 in the x-axis direction is smaller than the width of element mounting regions 201 and 202 in the x-axis direction. Similarly, intervening region 212 is located between element mounting regions 202 and 203 in the y-axis direction. The width of intervening region 212 in the x-axis direction is smaller than the width of element mounting regions 202 and 203 in the x-axis direction.

[0205] In this modification, a reflective member may also be disposed in the first recess 21. The reflective member is disposed in at least each of the element mounting regions 201 to 203. The reflective member may also be disposed in the intervening regions 211 and 212.

[0206] The light-emitting device 1003a shown in FIG. 10C differs from the light-emitting device 1003 shown in FIGS. 10A and 10B in that the widths of the element mounting regions 201-203 in the x-axis direction are the same as the widths of the intervening regions 211 and 212 in the x-axis direction. As shown in the figure, the reflective member 150 may be disposed only in the element mounting regions 201-203 in the first recess 21. Such a structure can be obtained, for example, by disposing the first to third light-emitting elements 51-53, whose side surfaces have been covered with the reflective member 150, on the inner upper surface 21a of the first recess 21. This allows the reflective member 150 to be disposed only in areas of the inner upper surface 21a of the first recess 21 that are close to the first to third light-emitting elements 51-53. Alternatively, a second dark-colored resin member 190 may be disposed in areas where the first to third light-emitting elements 51-53, whose side surfaces have been covered with the reflective member 150, are not disposed.

[0207] (Variation 4) Fig. 11A is a schematic top perspective view showing a light emitting element and a resin package in a light emitting device 1004 of Modification 4. Fig. 11B and Fig. 11C are schematic top views showing a light emitting element, a resin package, and a lens portion in other light emitting devices 1004a and 1004b of Modification 4, respectively.

[0208] Light emitting devices 1004, 1004a, and 1004b of this modification differ from the above-described light emitting devices 1000 to 1003 in that the first recess 21 is not provided on the main surface 100a of the resin package 100. That is, in this modification, the area where the light emitting elements are arranged is not surrounded by a resin portion having an upper surface higher than the first resin portion 41. When manufacturing the light emitting devices 1004, 1004a, and 1004b, it is preferable to arrange the first to third light emitting elements 51 to 53, whose side surfaces have been covered with a reflective member in advance, on the main surface 100a of the resin package 100 (see FIG. 10C ).

[0209] In the light emitting device 1004 shown in FIG. 11A, the dark colored resin member 40 has a plurality of protrusions 45a, 45b on the main surface 100a of the resin package 100. In the example shown, two protrusions 45a, 45b are provided, but the number of protrusions is not particularly limited. The main surface 100a includes a first region 300 located in an area other than the area where the protrusions 45a, 45b are arranged. The first region 300 includes the exposed regions of the plurality of leads 11a to 13b and the first resin portion 41. The upper surfaces of the protrusions 45a, 45b are located above the first region 300 (in the +z direction).

[0210] The protruding portions 45a and 45b are spaced apart from each other. In this example, the protruding portion 45b is disposed on the +x side of the protruding portion 45a with a gap therebetween. The protruding portions 45a and 45b each have sidewalls that face each other with the element mounting regions 201 to 203 and the intervening regions 211 and 212 sandwiched therebetween. These sidewalls define a portion of the periphery of the first region 300. Other portions of the periphery of the first region 300 (here, the portions located on the -y side and +y side) may be defined by the periphery of the main surface 100a of the resin package 100.

[0211] Each of the first to third light emitting elements 51 to 53 is disposed in the exposed region 30 of one of the leads 11a to 13b in the first region 300. The first region 300 may include a connection region wr.

[0212] 11A, the first region 300 may include element mounting regions 201-203 and intervening regions 211, 212, similar to the inner upper surface of the first recess in Variation 3. In a plan view, the protrusion 45a has sidewalls that define the peripheries of the element mounting regions 201-203 and the intervening regions 211, 212, for example, of portions located to the left (-x side) of the first light emitting element 51 to the third light emitting element 53. The protrusion 45b has sidewalls that define the peripheries of the element mounting regions 201-203 and the intervening regions 211, 212, for example, of portions located to the right (+x side) of the first light emitting element 51 to the third light emitting element 53.

[0213] In this modification, the shapes of the protrusions 45a, 45b in a plan view and the shape of the first region 300 defined by the protrusions 45a, 45b in a plan view are not limited to the example shown in Fig. 11A. For example, in a light-emitting device 1004a shown in Fig. 11B, the protrusions 45a, 45b are configured so that the widths of the element mounting regions 201-203 in the x-axis direction and the widths of the intervening regions 211, 212 in the x-axis direction in the first region 300 are the same. As shown in Fig. 11B, the side surfaces of the protrusions 45a, 45b facing the first region 300 may be substantially parallel to the y-axis direction. Furthermore, the widths of the protrusions 45a, 45b in the x-axis direction may be substantially constant along the y-axis direction.

[0214] Light emitting device 1004a may include, instead of protrusion 45a, a plurality of protrusions spaced apart from one another. Similarly, instead of protrusion 45b, light emitting device 1004a may include a plurality of protrusions spaced apart from one another. Each of the plurality of protrusions may be located on a corresponding lead and have a side surface that defines the periphery of element mounting regions 201-203. In plan view, the width of each protrusion in the y-axis direction may be greater than the width of the corresponding lead.

[0215] The light emitting device 1004b shown in FIG. 11C differs from the light emitting device 1004a shown in FIG. 11B in that the main surface 100a of the resin package 100 has second recesses 22 and 23 on the +x side and the −x side of the first region 300, respectively. The inner upper surfaces 22a and 23a of the second recesses 22 and 23 include connection regions wr for wire bonding. In plan view, the protrusions 45a and 45b may be annular and surround the inner upper surfaces 22a and 23a of the second recesses 22 and 23, respectively. In plan view, each of the second recesses 22 and 23 may extend in the y-axis direction to include, for example, connection regions wr for multiple (here, three) leads. In this example, the inner upper surface 22a of the second recess 22 includes connection regions wr for electrically connecting the first light emitting element 51 to the third light emitting element 53 to the leads 11a to 13a. The inner upper surface 23a of the second recess 23 includes a connection region wr for electrically connecting the first to third light emitting elements 51 to 53 to the leads 11b to 13b. The width of each of the second recesses 22, 23 in the x-axis direction may be approximately constant along the y-axis direction. Furthermore, the width of the first region 300 in the x-axis direction may be approximately constant along the y-axis direction.

[0216] (Variation 5) FIG. 12 is a schematic perspective view of the light emitting device 1005. As shown in FIG.

[0217] Light emitting device 1005 differs from light emitting devices 1000 to 1003 described above in that lens portion 70 is colored in a similar color to the light emitted by the corresponding light emitting element.

[0218] By arranging a lens portion 70 colored in a similar color to the light-emitting color of the light-emitting element 50 above (in the +z direction) the light-emitting element 50, the light-emitting color of the light-emitting element 50 is not hindered when the light-emitting element 50 is turned on, and when the light-emitting element 50 is turned off, the decrease in display contrast caused by external light reflection on the exposed surfaces of the reflective members and leads located around the light-emitting element 50 can be reduced.

[0219] Furthermore, when the first light-emitting element 51, the second light-emitting element 52, and the third light-emitting element 53 are all turned off, the first lens portion 71, the second lens portion 72, and the third lens portion 73 appear to be a darker color, i.e., a color with lower brightness, than the color they are colored in due to subtractive color mixing of the colors of the first lens portion 71, the second lens portion 72, and the third lens portion 73. As a result, the light-emitting surface of the light-emitting device 1005 appears dark, further improving the display contrast.

[0220] The molded resin portion 60 of the light emitting device 1005 can be manufactured by, for example, a casting molding method.

[0221] 13A and 13B are cross-sectional views showing steps in a method for forming the molded resin portion 60 by casting.

[0222] As shown in FIG. 13A, a resin material colored in a similar color to the light-emitting color of the corresponding light-emitting element is injected into each of the three lower cavities 130 of the prepared casting case 120, and the resin material is temporarily cured to obtain a temporarily cured body 141a. Next, as shown in FIG. 13B, a light-transmitting third resin material 142 is injected onto the temporarily cured body 141a. Thereafter, an immersion step is performed in which the first structure including the resin package and the light-emitting element is immersed in the third resin material 142, similar to the step described above with reference to FIG. 4F. Next, the temporarily cured body 141a of the colored resin material and the light-transmitting third resin material 142 are permanently cured to obtain a molded resin part 60. Other steps are the same as those described above with reference to FIGS. 4A to 4G. The resin material used and the structure of the casting case are also the same as those described above.

[0223] (Variation 6) FIG. 14A is a schematic top view of a light emitting device 3000 of Modification 6, and FIG. 14B is a schematic cross-sectional view taken along line 14B-14B shown in FIG. 14A.

[0224] The light emitting device 3000 of variant example 6 differs from the light emitting device 1000 shown in Figures 1 and 2A to 2H and the light emitting device 1001 shown in Figures 7A to 7D in that at least one of the multiple light emitting elements 50 is arranged non-parallel to the other light emitting elements in a planar view, and the height of the apex of at least one of the multiple lens portions 70 is made different from the height of the apex of the other lens portions.

[0225] In this modification, each of the first light-emitting element 51, the second light-emitting element 52, and the third light-emitting element 53 has a rectangular planar shape. In a plan view, each side of the rectangle of at least one light-emitting element (here, the third light-emitting element 53) among the first light-emitting element 51, the second light-emitting element 52, and the third light-emitting element 53 is non-parallel to each side of the rectangle of the other light-emitting elements (here, the first light-emitting element 51 and the second light-emitting element 52).

[0226] This makes it possible to improve the light distribution controllability of the light emitting device 3000 and achieve a desired light distribution, as will be described in detail below.

[0227] [Structure and arrangement of light-emitting elements] Each of the first to third light emitting elements 51 to 53 has a first surface located on the side of the leads 11a to 13b, a second surface located on the opposite side to the first surface (i.e., the lens portion side), and two electrodes located on the second surface. Note that in each of the first to third light emitting elements 51 to 53, both the positive and negative electrodes (positive and negative electrodes) are described as being located on the second surface, but one may be located on the first surface and the other on the second surface.

[0228] 14A, two electrodes (positive and negative electrodes) ce1 and ce2 are located on the second surface of each of the first to third light-emitting elements 51 to 53. Of the first to third light-emitting elements 51 to 53, the two electrodes ce1 and ce2 of the first light-emitting element 51 and the second light-emitting element 52 are respectively disposed at two mutually facing corners (i.e., diagonal corners) of the rectangular second surface. In contrast, the two electrodes ce1 and ce2 of the third light-emitting element 53 are respectively disposed near the centers of two mutually facing sides of the rectangular second surface. The emitted colors of the first to third light-emitting elements 51 to 53 are not particularly limited, but in this modification, the first light-emitting element 51 may be a red light-emitting element that emits red light, the second light-emitting element 52 may be a blue light-emitting element that emits blue light, and the third light-emitting element 53 may be a green light-emitting element that emits green light.

[0229] In the example shown in FIG. 14A, the first to third light-emitting elements 51 to 53 are arranged in a row on a virtual line m0. Here, the line m0 is a line connecting center points C1 to C3 of the first to third lens units 71 to 73 in a plan view. All four sides constituting the rectangular planar shapes of the first light-emitting element 51 and the second light-emitting element 52 (here, the four sides constituting the rectangular outer edge of the second surface) are non-parallel to the line m0. In a plan view, each of the first light-emitting element 51 and the second light-emitting element 52 may be arranged such that a pair of opposite sides on the rectangular outer edge of the second surface forms an angle of 45° with the line m0. On the other hand, a pair of opposite sides on the rectangular planar shape of the third light-emitting element 53 (here, the pair of opposite sides on the rectangular outer edge of the second surface) is parallel to the line m0.

[0230] In this specification, the smallest angle α between each side of the rectangular outer edge of the light-emitting element and the line m0 in a plan view is referred to as the “inclination angle with respect to the line m0.” In the illustrated example, the inclination angle α of the first light-emitting element 51 and the second light-emitting element 52 with respect to the line m0 is 45°.

[0231] In a light-emitting device having a light-emitting element and a lens positioned above the light-emitting element and covering the light-emitting element, as the size of the lens becomes smaller, the light distribution of the light-emitting device becomes more susceptible to the influence of the light distribution characteristics of the near field of the light-emitting element. This may make it difficult to control the light distribution of the light-emitting device by adjusting the curvature of the lens. The light distribution characteristics of the near field of the light-emitting element may change depending on, for example, the structure of the electrode on the light-emitting element, such as the position and size of the electrode.

[0232] In contrast to this, in this modified example, the first light-emitting element 51 to the third light-emitting element 53 are arranged in the resin package 100 taking into consideration the positions of the electrodes of the first light-emitting element 51 to the third light-emitting element 53, more specifically, taking into consideration the light-emitting brightness distribution that reflects the positions of the electrodes on the second surfaces of these light-emitting elements, thereby realizing a light-emitting device 3000 having the desired light distribution (directional characteristics).

[0233] The relationship between the light emission luminance distribution of the light emitting elements and the arrangement of the light emitting elements in a plan view will be specifically described below.

[0234] 15A and 15B are schematic plan views illustrating the emission luminance distributions of the second surfaces 51a and 53a of the first light-emitting element 51 and the third light-emitting element 53, respectively. In FIGS. 15A and 15B, areas with high emission luminance are shown in white, and areas with lower emission luminance than the white areas are shown in black. In the following description, the white areas of the second surfaces 51a and 53a with high emission luminance are referred to as "light-emitting portions," and the black areas with lower emission luminance are referred to as "non-light-emitting portions." The electrodes of the first light-emitting element 51 and the third light-emitting element 53 are connected to leads by wires.

[0235] As shown in FIG. 15A, the light emission luminance distribution of the second surface 51a of the first light-emitting element 51 includes a light-emitting portion 611 and a non-light-emitting portion 612 having a lower luminance than the light-emitting portion 611. The non-light-emitting portions 612 are located at two corners facing each other. The positions of the non-light-emitting portions 612 correspond to the positions of the electrodes ce1 and ce2 (FIG. 14A). In this specification, the "non-light-emitting portion" refers not only to non-light-emitting regions of the second surface but also to regions where electrodes are formed and where light is not emitted, and regions that appear dark due to the shadow of wires. If the maximum luminance of the second surface 51a is 100%, the luminance of the light-emitting portion 611 is 40% or more and 100% or less, and the luminance of the non-light-emitting portion 612 is 0% or more and less than 40%. In this example, the width 611a of the light-emitting portion 611 along a diagonal line connecting two corners of the second surface 51a where no electrodes are formed is greater than the width 611b along a diagonal line connecting two corners where electrodes are formed. The "width of the light-emitting portion along the diagonal line" refers to the length of the light-emitting portion cut out by the diagonal line, that is, the length of the portion of the light-emitting portion that overlaps the diagonal line in a plan view.

[0236] The second light-emitting element 52 has an electrode in the same position as the first light-emitting element 51. Therefore, in the light emission luminance distribution of the second light-emitting element 52, similar to the first light-emitting element 51, the width of the light-emitting portion on the diagonal line connecting two corners on the second surface where no electrode is formed can be larger than the width of the light-emitting portion on the diagonal line connecting two corners on which an electrode is formed.

[0237] 15B, the light emission luminance distribution of the second surface 53a of the third light-emitting element 53 includes a light-emitting portion 611 and a non-light-emitting portion 612 that is located near the center of two opposing sides and has lower luminance than the light-emitting portion 611. The position of the non-light-emitting portion 612 of the third light-emitting element 53 in FIG. 15B corresponds to the position of the electrodes ce1 and ce2 in FIG. 14A. A width 611c of the light-emitting portion 611 along a line connecting the centers of the two sides of the second surface 53a where no electrodes are formed is greater than a width 611d of the light-emitting portion 611 along a line connecting the centers of the two sides where electrodes are formed. Note that the "width of the light-emitting portion along the line connecting the centers" refers to the length of the light-emitting portion cut out by the line connecting the centers of the two sides, i.e., the length of the portion of the light-emitting portion that overlaps with the line connecting the centers of the two sides in a plan view.

[0238] In this modification, the first to third light-emitting elements 51 to 53 are preferably arranged on a line m0 connecting center points C1 to C3 in a plan view of the first to third lens portions 71 to 73. In a plan view, the centers of the second surfaces of the first to third light-emitting elements 51 to 53 may be arranged on the line m0.

[0239] FIG. 16 is a plan view showing the arrangement of the first to third light-emitting elements 51 to 53 of a reference example having the emission luminance distribution described with reference to FIGS. 15A and 15B. FIG. 17 is a plan view showing the arrangement of the first to third light-emitting elements 51 to 53 in the light-emitting device 3000 of this modified example shown in FIGS. 14A and 14B. FIGS. 16 and 17 only show the second surfaces 51a to 53a of the first to third light-emitting elements 51 to 53 and the emission luminance distributions of the first to third light-emitting elements 51 to 53, and omit other components such as lens units. These figures also show, for each of the first to third light-emitting elements 51 to 53, an imaginary line m1 that passes through the center of the second surface and forms a 45° angle clockwise from the line m0, and an imaginary line m2 that passes through the center of the second surface and forms a 135° angle clockwise from the line m0. 17 also shows, by a dashed line, an imaginary line m3 that passes through the center of the second surface and is perpendicular to the line m0 for each of the first to third light-emitting elements 51 to 53. In the examples shown in FIGS. 16 and 17, the centers of the second surfaces of the first to third light-emitting elements 51 to 53 coincide with the central points C1 to C3 of the first to third lens portions.

[0240] In the reference example shown in FIG. 16, in a plan view, two sides (a pair of opposite sides) of the rectangular second surface of each of the first light-emitting element 51 to the third light-emitting element 53 are parallel to the line m0. In the reference example shown in FIG. 16, in the first light-emitting element 51 and the second light-emitting element 52, the width of the light-emitting portion 611 at the line m1 is smaller than the width of the light-emitting portion 611 at the line m2. In this specification, the "width of the light-emitting portion at the line m1 (or line m2)" refers to the length of the light-emitting portion cut out by the line m1 (or line m2) in a plan view, that is, the length of the portion of the light-emitting portion that overlaps with the line m1 (or line m2) in a plan view. For example, in the first light-emitting element 51 shown in FIG. 16, the width of the light-emitting portion 611 at the line m1 is the length 611e of the light-emitting portion 611 cut out by the line m1, and the width of the light-emitting portion 611 at the line m2 is the length 611f of the light-emitting portion 611 cut out by the line m2. For this reason, the first light-emitting element 51 and the second light-emitting element 52 may have different light emission distributions on line m1 (light emission distributions in a cross section that includes line m1 and is perpendicular to the second surface) and on line m2 (light emission distributions in a cross section that includes line m2 and is perpendicular to the second surface). The half-value angle (spectral angle) of the first light-emitting element 51 on line m1 may be smaller than the half-value angle on line m2 by, for example, approximately 6.6° (for example, the difference between the half-value angle (spectral angle) of the third light-emitting element 53 on line m1 and the half-value angle (spectral angle) on line m2 is, for example, approximately 1.6°). In this specification, the difference in light distribution indicated by the half-value angle (spectral angle) on line m1 and the half-value angle (spectral angle) on line m2 may be abbreviated as "light distribution difference." Note that, in the third light-emitting element 53, the width of the light-emitting portion 611 on line m1 is approximately the same as the width of the light-emitting portion 611 on line m2. Therefore, the light distribution difference of the third light-emitting element 53 is kept smaller than that of the first light-emitting element 51 and the second light-emitting element 52.

[0241] When the light emitting device arranged as in this reference example is applied to a display device, the display characteristics such as the color of the image and the video may be affected by the difference in light distribution between the first and second light emitting elements 51 and 52. For example, since the light distribution on the line m1 of the first light emitting element 51 (e.g., red light emitting element) is narrow (the half-value angle is small), when a display device using the light emitting device is viewed from the direction of the line m1, image distortion such as a weakened red color may occur.

[0242] In contrast, in the light-emitting device 3000 of this modification, as shown in FIG. 17 , in a plan view, each of the first light-emitting element 51 and the second light-emitting element 52 is arranged such that two sides (a pair of opposing sides) of the rectangular second surfaces 51a and 52a form an angle of 45° with respect to the line m0. That is, the inclination angle α of the first light-emitting element 51 and the second light-emitting element 52 with respect to the line m0 is 45°. This makes it possible to reduce the difference between the width of the light-emitting portion 611 on the line m1 and the width of the light-emitting portion 611 on the line m2 in each of the first light-emitting element 51 and the second light-emitting element 52 compared to the reference example. In this example, the width of the light-emitting portion 611 on the line m1 and the width of the light-emitting portion 611 on the line m2 can be made substantially the same. As a result, the difference between the light distribution on the line m1 and the light distribution on the line m2 can be reduced. This makes it possible to further reduce the influence of the near-field light distribution characteristics of the first light-emitting element 51 and the second light-emitting element 52 on the light distribution of the light-emitting device 3000, thereby further improving light distribution controllability.

[0243] In this modification, the first to third light-emitting elements 51 to 53 may be arranged so as to reduce the difference between the width of the light-emitting portion 611 on the line m1 and the width of the light-emitting portion 611 on the line m2. For example, the first to third light-emitting elements 51 to 53 may be arranged so that their electrodes do not overlap the lines m1 and m2 in a plan view (that is, so that the electrodes are offset from the lines m1 and m2). Alternatively, the first to third light-emitting elements 51 to 53 may be arranged so that the shape of their light-emitting portions 611 in a plan view is approximately symmetrical (axisymmetric) with respect to the line m0 and / or the line m3.

[0244] By using the light emitting device 3000 of this modified example, a display device can be realized in which the color and video disturbances of the image caused by the difference in light distribution are further reduced.

[0245] As shown in FIGS. 14A and 17, the electrodes ce1 and ce2 of the first to third light-emitting elements 51 to 53 are preferably arranged on the line m0 in a plan view. This allows the direction connecting the electrodes ce1 and ce2 of each of the first to third light-emitting elements 51 to 53, i.e., the direction in which the width of the light-emitting portion becomes relatively smaller in the emission luminance distribution of the first to third light-emitting elements 51 to 53, to be aligned with the minor axis of the corresponding lens portion, and the direction in which the width of the light-emitting portion becomes relatively larger in the emission luminance distribution of the first to third light-emitting elements 51 to 53 to be aligned with the major axis of the corresponding lens portion. In this way, by increasing the size of the corresponding lens portions 71 to 73 relative to the width of the light-emitting portion of each of the light-emitting elements 51 to 53, total reflection on the inner surfaces of the lens portions 71 to 73 can be reduced, allowing more light to be captured by the lens portions 71 to 73. This increases the efficiency with which light is captured from each light-emitting element to the corresponding lens, thereby improving the light extraction efficiency.

[0246] FIG. 18 is a plan view showing another example of the arrangement of the first to third light-emitting elements 51 to 53. In the example shown in FIG. 18, the positions of the electrodes of the first to second light-emitting elements 51 and 52 differ from the example shown in FIG. 17. In the example shown in FIG. 18, in a plan view, the electrodes of the first to third light-emitting elements 51 to 53 are arranged on a line m3 that passes through the center of the rectangular second surface of each light-emitting element and forms a 90° angle clockwise from the line m0. In a plan view, the direction connecting the electrodes of each of the first to third light-emitting elements 51 to 53 may coincide with the major axis of the corresponding lens portion. Even in this case, the difference in light distribution between the line m1 and the line m2 of each of the first to third light-emitting elements 51 to 53 can be reduced.

[0247] The shape of each of the first to third light-emitting elements 51 to 53 in a plan view may be square. In this case, by arranging the first to third light-emitting elements 51 to 53 as illustrated in Fig. 17 or 18, the difference in light distribution on the line m1 and the line m2 of each light-emitting element can be further reduced.

[0248] The inclination angle α of each of the first to third light emitting elements 51 to 53 relative to the line m0 in a planar view can be set depending on the position of the electrodes in the light emitting element, regardless of the wavelength of light emitted by the light emitting element. The inclination angle α of each of the first to third light emitting elements 51 to 53 relative to the line m0 can be selected between 0° and 45° depending on the planar shape of the light emitting element, the position and shape of the electrodes, etc. When the planar shape of the light emitting element is rectangular and the electrodes are provided at two mutually facing corners, the inclination angle α of the light emitting element relative to the line m0 may be greater than 0° and less than 45°.

[0249] [Lens size and shape] In this modification, the height of the apex of at least one of the first lens portion 71, the second lens portion 72, and the third lens portion 73 is different from the height of the apex of the other lens portions.

[0250] 14B, the height HL3 of the vertex T3 of the third lens portion 73 is greater than the height HL1 of the vertex T1 of the first lens portion 71 and the height HL2 of the vertex T2 of the second lens portion 72. The height HL1 of the vertex T1 of the first lens portion 71 and the height HL2 of the vertex T2 of the second lens portion 72 may be the same or different. The heights HL1 to HL3 of the vertices T1 to T3 of the first to third lens portions 71 to 73 refer to the heights of the vertices T1 to T3 from the upper surface 61a of the base portion 61, i.e., the shortest distance between the vertices T1 to T3 and the upper surface 61a of the base portion 61. In the illustrated example, the heights HL1 to HL3 of the vertices T1 to T3 refer to the shortest distance between the vertex of the convex shape of each lens portion 71 to 73 and the bottom surface.

[0251] Furthermore, the sizes (minor axis widths WS1 to WS3, major axis widths WL1 to WL3) of the first to third lens portions 71 to 73 in a plan view may be different from one another. Here, the minor axis width WS3 of the third lens portion 73 is larger than the minor axis widths WS1 and WS2 of the first lens portion 71 and the second lens portion 72, and the major axis width WL3 of the third lens portion 73 is larger than the major axis widths WL1 and WL2 of the first lens portion 71 and the second lens portion 72. The sizes of the first lens portion 71 and the second lens portion 72 in a plan view may be the same or different from one another.

[0252] 14B, the size of each lens portion 71-73 may be adjusted so that the light emitted from that lens portion has a desired luminous intensity distribution. For example, the half-power angle on the major axis of the lens portion may be 100° to 120°, and the half-power angle on the minor axis may be 50° to 70°. The heights HL1 and HL2 of the vertices T1 and T2 of the first and second lens portions 71 and 72 are 0.3 mm to 0.5 mm, for example, 0.40 mm, and the height HL3 of the vertex T3 of the third lens portion 73 is 0.4 mm to 0.6 mm, for example, 0.50 mm. The width WS1 of the first lens portion 71 in the minor axis direction is 0.6 mm to 1.0 mm, for example, 0.8 mm, and the width WL1 of the first lens portion 71 in the major axis direction is 1.0 mm to 1.4 mm, for example, 1.2 mm. The width WS2 of the second lens portion 72 in the minor axis direction is 0.6 mm to 1.0 mm, for example 0.8 mm, and the width WL2 of the second lens portion 72 in the major axis direction is 1.0 mm to 1.4 mm, for example 1.2 mm. The width WS3 of the third lens portion 73 in the minor axis direction is 0.8 mm to 1.2 mm, for example 1.0 mm, and the width WL3 of the third lens portion 73 in the major axis direction is 1.4 mm to 1.8 mm, for example 1.6 mm.

[0253] As described above, in a side view seen from the x-axis direction and / or the y-axis direction, the outer edges of the first to third lens portions 71 to 73 may include straight lines in addition to curved lines. As an example, in a side view seen from the y-axis direction, each of the lens portions 71 to 73 may include straight lines, while in a side view seen from the x-axis direction, each of the lens portions 71 to 73 may not include straight lines. Furthermore, the shapes of the outer edges of the first to third lens portions 71 to 73 in side views may be different from one another. For example, in a side view seen from the y-axis direction, the outer edge of at least one of the first to third lens portions 71 to 73 may include straight lines, while the outer edges of the other lens portions may not include straight lines.

[0254] The curvature of at least one of the first to third lens portions 71 to 73 may be different from the curvature of the other lens portions. The curvatures of the first to third lens portions 71 to 73 may be different from one another. Alternatively, the first to third lens portions 71 to 73 may have the same curvature. In this specification, the "curvature of a lens portion" refers to the curvature of a curved portion of the outer edge of the lens portion that includes the apex of the lens portion in a cross section along the major axis direction or the minor axis direction of the lens portion.

[0255] According to this modification, by adjusting the size (e.g., heights HL1 to HL3 of vertices T1 to T3, widths WS1 to WS3 in the minor axis direction, and widths WL1 to WL3 in the major axis direction) and curvature of the corresponding lens portion 70 in accordance with the emission luminance distribution of each of the first to third light-emitting elements 51 to 53, it is possible to improve the light distribution controllability of the light emitting device 3000 and the light extraction efficiency by combining the above-described configuration in which the direction in which the width of the light-emitting portion becomes relatively smaller in the emission luminance distribution of each of the first to third light-emitting elements 51 to 53 is aligned with the minor axis of the corresponding lens portion and the direction in which the width of the light-emitting portion becomes relatively larger in the emission luminance distribution of each of the first to third light-emitting elements 51 to 53 is aligned with the major axis of the corresponding lens portion, with a configuration in which the size of the corresponding lens portion 70 is increased in accordance with the emission luminance distribution of each of the first to third light-emitting elements 51 to 53.

[0256] For example, to narrow the light distribution of light emitted from a certain light-emitting element through a lens section, the curvature of that lens section is first adjusted. If adjusting the curvature alone does not sufficiently narrow the light distribution, the size of that lens section may be made larger than the other lens sections. Alternatively, the size of that lens section may be increased without changing the curvature of that lens section.

[0257] When the light distribution of a certain light-emitting element (here, third light-emitting element 53) is wider than the light distribution of the other light-emitting elements, the light distribution of the light (here, green light) emitted through third lens portion 73 can be narrowed by making the size (e.g., height HL3 of the apex of lens portion 73) of third lens portion 73 corresponding to third light-emitting element 53 larger than the other lens portions 71, 72. For example, as shown in FIG. 17 , when the light distribution on line m0 of third light-emitting element 53 is wider than the light distribution on line m0 of first and second light-emitting elements 51, 52, height HL3 of the apex of third lens portion 73 corresponding to third light-emitting element 53 may be made larger than the other lens portions 71, 72.

[0258] In this modification, the size of the third lens portion 73 is larger than the first lens portion 71 and the second lens portion 72, but there is no particular limitation on the size relationship between the first lens portion 71 to the third lens portion 73. The sizes of these lens portions 71 to 73 can be set according to the emission luminance distribution due to the electrode position of each light-emitting element, etc.

[0259] The lens portion having the largest apex height among the first to third lens portions 71 to 73 (hereinafter referred to as the "largest lens portion") is preferably arranged at one end of a row (hereinafter referred to as the "lens row") in which the first to third lens portions 71 to 73 are arranged in one direction in a plan view. In the example shown in FIG. 14A, the third lens portion 73, which is the largest lens portion, is arranged at one end (here, the end furthest to the +y side) of the lens row consisting of the first to third lens portions 71 to 73. This reduces the proportion of light that is blocked by the largest lens portion (light from the other lens portions is incident on the largest lens portion and its emission direction is changed) among light that is emitted from the other lens portions. Note that if the apex heights of the first to third lens portions 71 to 73 are different from one another, the largest lens portion may be arranged at one end of the lens row, and the lens portion having the smallest apex height (hereinafter referred to as the "smallest lens portion") may be arranged at the other end of the lens row.

[0260] When the light-emitting device of this modification is used in a display device such as an outdoor display, the three lens portions 70a-70c of the light-emitting device may be arranged along the vertical direction of the display surface (the surface from which light is emitted) of the display device. When such a display surface is viewed from below, if the largest lens portion 70a is located in the center of the lens row, as illustrated in FIG. 19A, some of the light traveling downward (toward the viewer) from the lens portion 70b located at the top of the lens row is incident on the largest lens portion 70a and is therefore less likely to be emitted toward the viewer. In contrast, if the largest lens portion 70a is located at the top of the lens row, as illustrated in FIG. 19B, the proportion of light traveling downward from the lens portion (largest lens portion) 70a at the top of the lens row that is incident on the other lens portions 70b and 70c can be reduced compared to the example illustrated in FIG. 19A. Therefore, the light traveling downward from each of the three lens portions 70a-70c can be more efficiently emitted toward the viewer.

[0261] When the vertices of the three lens portions 70a to 70c are at different heights, it is preferable to place the largest lens portion 70a at the top of the lens row and the smallest lens portion 70c at the bottom of the lens row, as shown in Fig. 19C. This reduces the proportion of light that is blocked by other lens portions among the light that travels downward from the lens portion (largest lens portion) 70a at the top of the lens row and the lens portion 70b located in the center.

[0262] FIG. 20 is a schematic cross-sectional view of another light-emitting device 3001 of this modified example, showing a cross section that includes the line m0 and is parallel to the yz plane.

[0263] Light emitting device 3001 and light emitting device 3000 shown in FIGS. 14A and 14B differ in the shapes and sizes of first to third lens units 71 to 73. The shapes and sizes of first to third lens units 71 to 73 of light emitting device 3001 are adjusted so that they have a narrower light distribution (i.e., higher directivity) than light emitting device 3000. In this example, the sizes (vertex heights HL1 to HL3, minor axis widths WS1 to WS3, and major axis widths WL1 to WL3) of first to third lens units 71 to 73 of light emitting device 3001 are larger than those of light emitting device 3000. Furthermore, the curvatures of first to third lens units 71 to 73 of light emitting device 30001 are smaller than those of first to third lens units 71 to 73 of light emitting device 3000.

[0264] 20, the size of each lens portion 71-73 may be adjusted so that the light emitted from that lens portion has a desired light distribution. For example, the half-power angle on the major axis of the lens portion may be 80° or more and less than 100°, and the half-power angle on the minor axis may be 35° or more and less than 50°. The heights HL1 and HL2 of the vertices T1 and T2 of the first and second lens portions 71 and 72 are 0.6 mm to 0.8 mm, for example, 0.7 mm, and the height HL3 of the vertex T3 of the third lens portion 73 is 0.8 mm to 1.0 mm, for example, 0.9 mm. The width WS1 of the first lens portion 71 in the minor axis direction is 0.8 mm to 1.2 mm, for example, 1.0 mm, and the width WL1 of the first lens portion 71 in the major axis direction is 1.2 mm to 1.6 mm, for example, 1.4 mm. The width WS2 of the second lens portion 72 in the minor axis direction is 0.8 mm to 1.2 mm, for example 1.0 mm, and the width WL2 of the second lens portion 72 in the major axis direction is 1.3 mm to 1.7 mm, for example 1.5 mm. The width WS3 of the third lens portion 73 in the minor axis direction is 1.0 mm to 1.4 mm, for example 1.2 mm, and the width WL3 of the third lens portion 73 in the major axis direction is 1.6 mm to 2.0 mm, for example 1.8 mm.

[0265] In this modification, the arrangement (inclination angle α with respect to the line m0) of at least one of the first to third light-emitting elements 51 to 53 may be different from that of the other light-emitting elements in accordance with the emission luminance distribution of the first to third light-emitting elements 51 to 53, and the sizes of the first to third lens portions 71 to 73 may be the same. Alternatively, the size of at least one of the first to third lens portions 71 to 73 may be different from that of the other lens portions in accordance with the emission luminance distribution of the first to third light-emitting elements 51 to 53, and the inclination angle α with respect to the line m0 of the first to third light-emitting elements 51 to 53 may be the same.

[0266] (Variation 7) Fig. 21 is a schematic perspective view of light emitting device 4000 of Modification Example 7 from which the molded resin portion has been removed. Fig. 22A is a schematic top view of light emitting device 4000 of Modification Example 7 from which the molded resin portion has been removed. Figs. 22B and 22C are schematic cross-sectional views taken along lines 22B-22B and 22C-22C, respectively, shown in Fig. 22A.

[0267] 14A and 14B in that the first resin portion 41 located on the inner upper surface 21a of the first recess 21 on the main surface 100a of the resin package 100 includes at least one protrusion 46. In plan view, the protrusion 46 is located at least between the first light-emitting element 51 and the second light-emitting element 52, or between the second light-emitting element 52 and the third light-emitting element 53. In plan view, the protrusion 46 is disposed at a distance from the inner surface 21c of the first recess 21.

[0268] In the example shown in FIG. 22A, within the first recess 21, the first resin portion 41 includes a plurality of (here, four) protrusions 46 arranged at a distance from one another. Some or all of the plurality of protrusions 46 are located between two adjacent light-emitting elements among the plurality of light-emitting elements 50. Each protrusion 46 has, for example, a rectangular upper surface. An upper surface 46u of each protrusion 46 is located above the exposed region 30 of the lead. The portion of the first resin portion 41 other than the protrusions 46 is, for example, substantially flush with the exposed region 30 of the lead. "Substantially flush" means that errors due to dimensional tolerances, manufacturing tolerances, and material tolerances are included within the allowable range.

[0269] At least a portion of the side surface of each convex portion 46 is in contact with the reflective member 150. The upper surface 46u of each convex portion 46 may be exposed from the reflective member 150. By exposing the upper surface 46u of each convex portion 46 from the reflective member 150 arranged in the first recess 21, the reflective member 150 has a plurality of holes corresponding to each convex portion 46 in a planar view. This makes it possible to reduce a decrease in display contrast caused by external light reflection by the reflective member 150. The upper surface 46u of each convex portion 46 may be covered with a translucent resin member 180. This makes it possible to reduce a decrease in display contrast caused by external light reflection by the reflective member 150. The upper surface 46u of each convex portion 46 may be covered with a translucent resin member 180. The reflective member 150 arranged in the first recess 21 may have a plurality of holes corresponding to each convex portion 46 in a planar view.

[0270] According to this modification, in a plan view, the reflective member 150 can be disposed in a region of the inner upper surface 21a of the first recess 21 excluding the region where the convex portion 46 is formed. This reduces the volume of the reflective member 150. This reduces stress on the light emitting element 50 generated during the manufacturing process and reduces lifting of the light emitting element 50 from the lead 11. Furthermore, since the first resin portion has a convex portion, it is possible to form holes or grooves in the reflective member 150 corresponding to the convex portion 46, or to dispose the reflective member 150 in two or more regions spaced apart from each other across the convex portion 46. This reduces defects caused by stress generated between the reflective member 150 and the light emitting element 50 during manufacturing or mounting of the light emitting device 4000.

[0271] In the example shown in FIG. 22C , the upper surfaces of the multiple light-emitting elements 50 are located higher (on the +z side) than the upper surfaces 46u of the convex portions 46. The heights of the upper surfaces of the first to third light-emitting elements 51 to 53 may differ from one another. As described above, the reflective member 150 is formed in the first recess 21, for example, by applying and curing a first resin material. If the upper surfaces 46u of the convex portions 46 are located higher (on the +z side) than the upper surfaces of the light-emitting elements 50, a portion of the first resin material disposed between two adjacent convex portions 46 may creep up onto the light-emitting elements 50 due to surface tension. As a result, the reflective member 150 may be disposed on all or part of the upper surface of the light-emitting element 50, potentially reducing the brightness of the light-emitting device 4000. In this modification, the upper surfaces 46u of the convex portions 46 are located lower (on the -z side) than the upper surfaces of the light-emitting elements 50, thereby reducing the first resin material forming the reflective member 150 from creeping up onto the upper surface of the light-emitting element 50. Therefore, it is possible to reduce the decrease in brightness of the light emitting device 4000 caused by the first resin material creeping up.

[0272] The distance k1 in the z-axis direction between the upper surface 46u of the protrusion 46 and the exposed region 30 is, for example, 0.1 mm. When the upper surface 46u of the protrusion 46 is non-parallel to the xy plane, the distance k1 is the distance in the z-axis direction from the exposed region 30 to the portion of the upper surface 46u of the protrusion 46 that is located closest to the +z side. The distance in the z-axis direction between the upper surface of the light-emitting element 50 and the exposed region 30 is larger than the distance k1 and is, for example, 0.12 mm to 0.2 mm.

[0273] In a plan view of the main surface 100a of the resin package 100, at least one protrusion 46 is located between two adjacent leads among the plurality of leads and includes a portion overlapping at least one of the two adjacent leads. For example, the protrusion 46 is arranged to overlap a portion of the exposed region 30 in a plan view. This allows the lead frame to be fixed by the protrusion 46 so that the lead frame does not rise up from the dark colored resin member 40 during manufacturing of the resin package 100.

[0274] In the example shown in FIG. 22A, four protrusions 46 are arranged in the first recess 21. The four protrusions 46 include two protrusions 461 and 462 located between the first light-emitting element 51 and the second light-emitting element 52, and two protrusions 463 and 464 located between the second light-emitting element 52 and the third light-emitting element 53 in a plan view. In a plan view, the protrusion 461 is arranged so that a portion thereof overlaps the lead 11a. Similarly, in a plan view, each of the protrusions 462 and 463 partially overlaps the lead 12a, and the protrusion 464 is arranged so that it partially overlaps the lead 13a. FIG. 23 is a plan view illustrating the arrangement relationship between the lead frame F1 and the protrusions 46. For example, in a plan view, the lead frame F1 has a region in which the light-emitting elements 51 to 53 are arranged with a different width from a region on the −x side of the region in which the light-emitting elements 51 to 53 are arranged. Varying the width of the lead frame in the y-axis direction increases the contact area between the resin package 100 and the lead frame, thereby improving the adhesion between the resin package 100 and the lead frame. Note that the width of the region where the light emitting elements 51 to 53 are arranged and the width of the region on the -x side of the region where the light emitting elements 51 to 53 are arranged in plan view may be the same.

[0275] The number of protrusions 46 is not limited to the example shown in the drawings. The light emitting device 4000 of this modified example is required to have at least one protrusion 46 in the first recess 21, and may have five or more protrusions 46.

[0276] The following describes other light emitting devices 4001 to 4005 of Modification 7. The following mainly describes the differences from light emitting device 4000, and omits a description of the same structure and effects as light emitting device 4000.

[0277] Fig. 24 is a schematic perspective view of another light emitting device 4001 of Variation 7, with the molded resin portion removed. The light emitting device 4001 differs from the light emitting device 4000 shown in Fig. 21 and Fig. 22A to Fig. 22C in that the first resin portion 41 located on the inner upper surfaces 22a, 23a of the second recesses 22, 23 on the main surface 100a of the resin package 100 includes at least one protrusion 47. In the example shown in Fig. 24, the protrusion 47 is disposed apart from the inner side surfaces 21c of the second recesses 22, 23 in a plan view.

[0278] 24, a plurality of (here, four) protrusions 47 are arranged spaced apart from one another inside each of the second recesses 22 and 23. The upper surface of the light-emitting element 50 is located higher than the upper surfaces of the protrusions 47. The height of the upper surface of the protrusions 47 may be the same as the height of the upper surface of the protrusion 46.

[0279] 24 , at least a portion of the side surface of each protrusion 47 is in contact with the second dark color resin member 190. The upper surface of each protrusion 47 is exposed from the second dark color resin member 190. The upper surface of each protrusion 47 may be covered by the second dark color resin member 190. For example, the second dark color resin member 190 disposed in the second recesses 22, 23 may have a plurality of holes corresponding to the plurality of protrusions 47 in a plan view.

[0280] According to this modification, in plan view, the second dark colored resin member 190 can be disposed in the region of the inner upper surface 21a of the second recesses 22, 23 excluding the region where the protrusion 47 is formed. This reduces the volume of the second dark colored resin member 190. It also makes it possible to form holes or grooves in the second dark colored resin member 190, or to dispose the second dark colored resin member 190 in two or more regions spaced apart from each other across the protrusion 47. This reduces the effects of stresses that occur during the manufacturing or mounting of the light emitting device 4001. For example, it is possible to reduce stresses that are applied to the bonded portions between the wires and the leads due to changes in the volume of the second dark colored resin member 190.

[0281] In plan view, each protrusion 47 is preferably arranged so that a portion thereof overlaps the corresponding lead, thereby enabling the lead frame to be fixed by the protrusion 47 so that the lead frame does not rise up from the dark colored resin member 40 during manufacturing of the resin package 100.

[0282] Fig. 25 is a schematic perspective view of yet another light emitting device 4002 of Variation 7, with the molded resin portion removed. Fig. 26 is a schematic top view of light emitting device 4002, with the molded resin portion removed. Light emitting device 4002 differs from light emitting device 4001 shown in Fig. 24 in that it includes a first recess 21 and a plurality of (six in the illustrated example) third recesses 24 on the main surface 100a of the resin package 100. Each third recess 24 includes a connection region wr for wire bonding.

[0283] In the example shown in FIG. 25, the dark colored resin member 40 includes four protrusions 48 on the main surface 100a of the resin package 100. Each protrusion 48 is disposed between two adjacent third recesses 24 and contacts the resin portions 42A and 42C. The height of the upper surface 48u of each protrusion 48 is the same as the height of the upper surface 46u of the protrusion 46. The upper surface 48u of each protrusion 48 may be higher or lower than the upper surface of the protrusion 46. In the example shown in FIG. 25, each third recess 24 is defined by the resin portions 42A and 42C and the protrusion 48. A second dark colored resin member 190 is disposed on the inner upper surface 24a of each third recess 24. The second dark colored resin member 190 preferably covers at least the leads 11a to 13b.

[0284] In the light emitting device 4002, by providing the convex portion 48, the second dark colored resin member 190 can be arranged separately in six third concave portions 24 that are spaced apart from one another. This reduces the effect of stress that occurs during the manufacturing or mounting of the light emitting device 4002. Furthermore, by arranging the convex portion 48 so as to connect the resin portions 42A and 42C in a plan view, it is possible to reduce warping of the resin package 100 during the manufacturing or mounting of the light emitting device 4002.

[0285] Fig. 27 is a schematic perspective view of yet another light emitting device 4003 of Modification Example 7, with the molded resin portion removed. Fig. 28A is a schematic top view of light emitting device 4003 with the molded resin portion removed. Fig. 28B is a schematic cross-sectional view taken along line 28B-28B in Fig. 28A. Light emitting device 4003 differs from light emitting device 4000 shown in Fig. 21 and Figs. 22A to 22C in that upper surface 49u of at least one protrusion 49 located inside first recess 21 is located higher than the upper surface of light emitting element 50.

[0286] 27, the height of the upper surface 49u of the protrusion 49 is the same as the height of the upper surface of the second resin portion 42 that surrounds the inner upper surface 21a of the first recess 21. The height of the upper surface 49u of the protrusion 49 and the height of the upper surface of the second resin portion 42 can be defined, for example, by the distance in the z-axis direction from the rear surface 100b of the resin package 100 to the upper surface. By positioning the upper surface 49u of the protrusion 49 higher than the upper surface of the light-emitting element 50 (here, at the same height as the upper surface of the second resin portion 42), it is easy to control the area within the first recess 21 where the reflective member 150 is disposed.

[0287] The structure of resin package 100 of light emitting device 4003 is the same as that of resin package 100 of light emitting device 1003b shown in FIG. 10C, except that protrusions 49 are provided.

[0288] 28A, a plurality of (here, two) protrusions 49 are arranged in the first recess 21. The two protrusions 49 include a protrusion 491 located between the element mounting regions 201 and 202 in plan view, and a protrusion 492 located between the element mounting regions 202 and 203. Each of the protrusions 491 and 492 is arranged apart from the second resin portion 42, which is the side wall of the first recess 21.

[0289] A reflective member 150 is disposed in each of the element mounting regions 201 to 203. The reflective members 150 disposed in each of the element mounting regions 201 to 203 may be separated from one another by a protrusion 49. This reduces the effect of stress generated during manufacturing or mounting. For example, it is possible to further reduce stress applied to the light emitting element 50 due to expansion and / or contraction of the reflective member 150. This reduces peeling between the light emitting element 50 and the leads 11a, 12a, and 13a. The reflective members 150 disposed in each of the element mounting regions 201 to 203 may be formed continuously in the first recess 21.

[0290] In the example shown in FIG. 27 , at least the upper surface 49u of the convex portion 49 is exposed from the reflective member 150. This reduces the area of ​​the reflective member 150 that occupies on the inner upper surface 21a of the first recess 21 in a plan view, thereby further improving the display contrast. When the light-transmitting resin member 180 is disposed on the reflective member 150 within the first recess 21, at least a portion of the upper surface of the convex portion 49 may be exposed from the light-transmitting resin member 180. The exposed portion of the convex portion 49 may be in contact with the molded resin portion. The upper surface of the convex portion 49 may be covered by the light-transmitting resin member 180.

[0291] 28A, in a plan view of the main surface 100a of the resin package 100, a portion of each protrusion 49 includes a portion overlapping with multiple leads. In the example shown in FIG. 28A, in a plan view of the main surface 100a of the resin package 100, the protrusion 491 includes a portion overlapping with each of the leads 11a, 11b, 12a, and 12b and a portion located between these leads. The protrusion 492 includes a portion overlapping with each of the leads 12a, 12b, 13a, and 13b and a portion located between these leads. As a result, during the manufacturing of the resin package 100, the protrusions 491 and 492 can reduce lifting of the lead frame from the dark-colored resin member 40.

[0292] In the example shown in FIG. 28C, the side surface of each protrusion 49 has a step surface 49st facing in the same direction as the main surface 100a. In a cross-sectional view, each protrusion 49 has a stepped side surface, and the step surface 49st is an upward surface corresponding to the tread of a staircase. The upper surface of the light-emitting element 50 is preferably located above the step surface 49st. By providing the step surface 49st lower than the upper surface of the light-emitting element 50, it is possible to reduce the reflective member 150 from creeping up onto the upper surface of the light-emitting element 50. As an example, the distance k2 between the upper surface 49u of the protrusion 49 and the exposed region 30 in the z-axis direction is 0.2 mm, and the distance k3 between the step surface 49st of the protrusion 49 and the exposed region 30 in the z-axis direction is 0.1 mm. In the example shown in FIG. 28A, the step surface 49st is arranged to surround the upper surface 49u of the protrusion 49 in a plan view. In a plan view, the shape of the outer edge of the step surface 49st of the protrusion 49 may be similar to the shape of the outer edge of the upper surface 49u of the protrusion 49. The step surface 49st may be disposed on one of the side surfaces of the protrusion 49 that faces the light emitting element 50 in a plan view. The planar shape of the protrusion 49 will be described below with reference to FIG. 28A. The protrusion 49 includes a first width portion, a second width portion, and a third width portion, each having a different width in the y-axis direction. The first width portion faces the light emitting element 50. The second width portions are located on the +x side and the -x side of the light emitting element 50 and are disposed so as to sandwich the light emitting element 50 in a plan view. The third width portion is located at the extreme end in the x-axis direction in a plan view. The first width portion has a smaller width in the y-axis direction than the second width portion. The second width portion has a larger width in the y-axis direction than the third width portion. The first width portion has a larger width in the y-axis direction than the third width portion. This allows the first width portion and the light emitting element 50 to be disposed close to each other in a planar view. This allows the volume of the reflective member 150 disposed between the first width portion and the light emitting element 50 to be reduced. This reduces stress on the light emitting element 50 generated during the manufacturing process, making it less likely for the light emitting element 50 to lift off the lead 11. Furthermore, in a planar view, the distance in the y-axis direction from the third width portion to the second resin portion 42 can be increased. This allows the area of ​​the connection region wr to be increased. This makes it easier to bond the connection region to the wire. The first width portion and the third width portion may have the same width in the y-axis direction.

[0293] 28A, the second resin portion 42 has a step surface 42st facing in the same direction as the main surface 100a. The step surface 42st is disposed between the inner side surface and the inner upper surface 21a of the second resin portion 42 in a plan view. In the illustrated example, the step surface 42st is disposed so as to surround the resin package 100. The height of the step surface 42st may be the same as the height of the step surface 49st of the protrusion 49.

[0294] 28A, the element mounting region 201 is defined by the inner surface of the second resin portion 42 and the side surface of the convex portion 491, the element mounting region 202 is defined by the side surfaces of the convex portions 491 and 492, and the element mounting region 203 is defined by the inner surface of the second resin portion 42 and the side surface of the convex portion 492. In the example shown in FIG. 28A, in plan view, each of the element mounting regions 201 to 203 includes a portion Pd where the corresponding light emitting element 50 is located and two constricted portions Pn located on the +x side and the −x side of the portion Pd. The constricted portions Pn and the portion Pd are defined by the difference in width in the y-axis direction of the second resin portion in plan view. In the example shown in FIG. 28A, in plan view, the width in the y-axis direction of each constricted portion Pn is smaller than the width in the y-axis direction of the portion Pd. This makes it easy to use capillary action to place the first resin material that will become the reflective member 150 in a region close to each light-emitting element 50 via the constricted portion Pn. The second resin portion 42 will now be described with reference to FIG. 28A. The second resin portion 42, which extends in the x-axis direction, includes a narrow portion facing the light-emitting element 50 and a wide portion that is wider in the y-axis direction than the narrow portion. Here, an example is shown in which the wide portion of the second resin portion 42 includes a portion extending in the +y direction. However, the wide portion of the second resin portion 42 may also include a portion extending in the -y direction. The wide portion of the second resin portion 42 is disposed to face the second width portion of the protrusion 49. This defines the constricted portion Pn and the portion Pd. The two wide portions of the second resin portion 42 are disposed to sandwich the light-emitting element 50.

[0295] 28C , an example of a method for arranging the reflective member 150 will be described using the element mounting region 202 as an example. In the light-emitting device 4003, for example, the regions located on the +x side and the −x side of the element mounting region 202 (regions that will become the connection region wr) can be used as nozzle arrangement regions 700 in which nozzles for disposing the first resin material are arranged. When a nozzle is arranged in the nozzle arrangement region 700 and the first resin material is discharged, the first resin material passes through the constricted portion Pn and flows into the portion Pd of the element mounting region 202 by capillary action, as shown by arrow 701. The first resin material that flows in from the constricted portion Pn wraps around between the side surface of the second light-emitting element 52 and the side surfaces of the convex portions 491 and 492. In this way, the reflective member 150 can be arranged in the gap between the side surface of the second light-emitting element 52 and the side surfaces of the convex portions 491 and 492. At least a part of the side surface of the protrusion 49 may be in direct contact with the reflective member 150. The side surface of the protrusion 49 may be exposed from the reflective member 150.

[0296] The presence of the constricted portion Pn increases the surface area of ​​the second resin portion 42, thereby increasing the contact area with the molded resin portion. The presence of the constricted portion Pn increases the adhesive strength between the molded resin portion and the resin package 100, allowing the molded resin portion to be fixed to the resin package 100 more stably.

[0297] 27, the second dark color resin member 190 is preferably disposed in the first recess 21 in a region defined by the side surface of the second resin portion 42 and the portion of the side surface of each protrusion 49 extending in the y-axis direction. The second dark color resin member 190 can cover the leads 11a to 13b. This can improve the contrast of the light emitting device 4003. The second dark color resin member 190 does not necessarily have to be disposed.

[0298] 29 is a schematic perspective view of yet another light emitting device 4004 of Modification Example 7, with the mold resin portion removed. Light emitting device 4004 differs from light emitting device 4003 shown in FIGS. 27, 28A, and 28B in that upper surface 49u of at least one protrusion 49 has a depression 49h on main surface 100a of resin package 100.

[0299] The molded resin portion may include a portion located inside the depression 49h of each protrusion 49. The interior of the depression 49h may be in contact with the translucent resin member 180. The translucent resin member 180 may be disposed in a portion of the interior of the depression 49h, and the molded resin portion may be disposed in another portion of the interior of the depression 49h. The inner surface of the depression 49h may be in contact with the molded resin portion. For example, when forming the molded resin portion, a resin material that will become the molded resin portion may be applied so as to fill the depression 49h of each protrusion 49 and then hardened. This can increase the adhesive strength between the molded resin portion and the resin package 100 (anchor effect). Therefore, the molded resin portion can be more stably fixed to the resin package 100. In the example shown in FIG. 29, the inner upper surface of the depression 49h has, for example, a cross shape in plan view, in which a portion extending in the x-axis direction and a portion extending in the y-axis direction intersect. This can further enhance the anchor effect. In a top view, the shape of the opening of the first recess 21 is, for example, a substantially rectangular shape. A substantially rectangular shape includes a rectangle. In the example shown in FIG. 29, the outer edge of the first recess 21 is a rectangle with rounded corners (rounded quadrangle). In addition, in the example shown in FIG. 29, the second resin portion 42 extending in the x-axis direction is straight. In the example shown in FIG. 29, the width of the second resin portion 42 extending in the x-axis direction in a plan view is constant in the y-axis direction. Note that, in the shape of the opening of the first recess 21, a portion of the second resin portion 42 may have a deformed shape. For example, in a plan view, a portion or all of the second resin portion 42 may include a curve or have an elliptical shape in a plan view.

[0300] Fig. 30 is a schematic perspective view of yet another light emitting device 4005 of Modification Example 7 with the molded resin portion removed. The light emitting device 4005 differs from the light emitting device 4004 shown in Fig. 29 in that, in plan view, the outer edges of each of the two protrusions 49 arranged in the first recess 21 of the resin package 100 are rectangular. In the example shown in Fig. 30, in plan view, the outer edges of the depressions 49h of each of the protrusions 49 are rectangular.

[0301] According to the light emitting device 4005, the width of each of the element mounting regions 201-203 in the y-axis direction can be made larger than that of the light emitting device 4004. Therefore, for example, it is relatively easy to arrange the light emitting element 50, the side of which is covered in advance with the reflective member 150, in each of the element mounting regions 201-203.

[0302] In the example shown in FIG. 30, in a cross section parallel to the yz plane, the width of the opening of the recess 49h is larger than the width of the bottom (inner upper surface) of the recess 49h. This makes it easier to fill the interior of the recess 49h with the resin material that will become the molded resin portion. The width of the opening of the recess 49h may be the same as or smaller than the width of the bottom of the recess 49h. In the example shown in FIG. 30, the inner surface of the recess 49h is a flat surface inclined with respect to the xz plane. The recess 49h has, for example, a V-shaped cross section.

[0303] This specification discloses a light emitting device and a method for manufacturing the light emitting device described in the following items. [Item 1] a resin package including a plurality of leads and a resin member that fixes at least a portion of the plurality of leads, the resin package having a main surface, a back surface located opposite the main surface, and a side surface located between the main surface and the back surface, and each of the plurality of leads having an exposed region exposed from the resin member on the main surface; a plurality of light-emitting elements including a first light-emitting element, a second light-emitting element, and a third light-emitting element, each of the plurality of light-emitting elements being disposed in the exposed region of any of the plurality of leads; a mold resin portion including a base portion that seals the plurality of light-emitting elements and a plurality of lens portions that are located above the base portion and are integrally formed with the base portion; the plurality of lens portions include, in a plan view, a first lens portion overlapping with the first light-emitting element, a second lens portion overlapping with the second light-emitting element, and a third lens portion overlapping with the third light-emitting element; the base portion has an upper surface located above the main surface of the resin package, and a side surface portion of the base portion covering a part of the side surface portion of the resin package in a direction from the upper surface of the base portion toward the back surface of the resin package, In cross section, the first point is located closer to the plurality of lens portions than the second point, and the second point is located outside the third point; the first point is the outermost point of the top surface of the base portion, the second point is the outermost point of the side surface of the base portion, and the third point is the outermost point where the side surface of the resin package and the side surface of the base portion come into contact with each other; In a cross-sectional view, the first light-emitting element is located closer to the back surface of the resin package than the first point and is located above the second point. [Item 2] Item 2. The light emitting device according to item 1, wherein, in a cross-sectional view, the portion of the side surface of the base portion extending from the second point to the third point has a concavely curved outer surface. [Item 3] 3. The light emitting device according to item 1 or 2, wherein a part of the side surface of the resin package is exposed from the side surface of the base. [Item 4] the resin member has a first step surface at the side surface of the resin package, the first step surface facing the same direction as the main surface; 4. The light emitting device according to any one of items 1 to 3, wherein the first step surface is located closer to the back surface of the resin package than the second point of the base portion. [Item 5] 5. The light emitting device according to item 4, wherein the ratio of the distance from the back surface of the resin package to the first step surface to the distance from the back surface of the resin package to the second point of the molded resin portion is 0.2 or more and 0.8 or less. [Item 6] In the side surface portion of the resin package, the resin member further has a second step surface located below the first step surface, Item 6. The light emitting device according to item 4 or 5, wherein the width of the first step surface is greater than the width of the second step surface. [Item 7] 7. The light emitting device according to any one of items 4 to 6, wherein, in a cross-sectional view, the outermost point of the first step surface of the resin package is located more inward than the second point of the molded resin portion. [Item 8] In a cross-sectional view, the outer surface of the side surface portion of the base portion is 8. The light emitting device according to any one of items 1 to 7, further comprising a step surface facing the same direction as the main surface between the first and second substrates. [Item 9] the resin package further includes a tapered surface between the main surface of the resin package and the side surface of the resin package, the tapered surface being inclined with respect to the main surface; 9. The light emitting device according to any one of items 1 to 8, wherein the tapered surface is located above the second point of the base portion. [Item 10] 10. The light emitting device according to any one of items 1 to 9, wherein, in a cross-sectional view, a width in a direction parallel to the main surface from the second point of the base portion to the side portion of the resin package is 0.1 to 0.5 times the maximum width in a direction parallel to the main surface of a portion of the resin package located above the second point. [Item 11] the main surface of the resin package has one recess defined by the resin member and the plurality of leads, and an inner upper surface of the one recess includes the exposed regions of each of the plurality of leads; 11. The light emitting device according to any one of items 1 to 10, wherein each of the plurality of light emitting elements is disposed in one of the recesses of the resin package. [Item 12] a resin package including a plurality of leads and a resin member that fixes at least a portion of the plurality of leads, the resin package having a recess defined by the resin member and the plurality of leads on a main surface, wherein each of the plurality of leads has an exposed region exposed on an inner upper surface of the recess; a plurality of light-emitting elements including a first light-emitting element, a second light-emitting element, and a third light-emitting element arranged in the one recess of the resin package, each of the plurality of light-emitting elements being arranged in the exposed region of any of the plurality of leads; a molded resin part including a base part that seals the plurality of light-emitting elements, and a plurality of lens parts located above the base part and integrally formed with the base part, the plurality of lens parts including, in a plan view, a first lens part that overlaps with the first light-emitting element, a second lens part that overlaps with the second light-emitting element, and a third lens part that overlaps with the third light-emitting element; A light emitting device comprising: [Item 13] Item 13. The light emitting device according to item 11 or 12, further comprising, within the one recess of the resin package, a first reflective member positioned around the first light emitting element, a second reflective member positioned around the second light emitting element, and a third reflective member positioned around the third light emitting element. [Item 14] Item 14. The light emitting device according to item 13, wherein the first reflective member, the second reflective member, and the third reflective member are connected to each other within the one recess. [Item 15] The resin member on the main surface of the resin package is a first resin portion located on the inner upper surface of the one recess; Item 15. The light emitting device according to any one of items 11 to 14, further comprising: a second resin portion surrounding the inner upper surface of the one recess in plan view. [Item 16] In a plan view of the main surface of the resin package, the second resin portion includes a third resin portion and a fourth resin portion located between the third resin portion and the first resin portion, and an upper surface of the fourth resin portion is located higher than an upper surface of the third resin portion, and an upper surface of the third resin portion is located higher than the Item 16. The light emitting device according to item 15, wherein the light emitting element is located above the upper surface of the resin part. [Item 17] the first light-emitting element emits first light, the second light-emitting element emits second light having a shorter wavelength than the first light, and the third light-emitting element emits third light having a shorter wavelength than the second light, 17. The light emitting device according to any one of items 1 to 16, wherein the first lens portion is colored in a similar color to the first light, the second lens portion is colored in a similar color to the second light, and the third lens portion is colored in a similar color to the third light. [Item 18] Item 18. The light emitting device according to any one of items 1 to 17, wherein each of the plurality of lens portions has a convex shape that protrudes upward from the upper surface of the base portion. [Item 19] each of the first light-emitting element, the second light-emitting element, and the third light-emitting element has a rectangular planar shape; 19. The light emitting device according to any one of items 1 to 18, wherein, in a plan view, each side of the rectangle of at least one of the first light emitting element, the second light emitting element, and the third light emitting element is non-parallel to each side of the rectangle of the other light emitting elements. [Item 20] 20. The light emitting device according to any one of items 1 to 19, wherein the height of the apex of at least one of the first lens portion, the second lens portion, and the third lens portion is greater than the height of the apex of the other lens portions. [Item 21] each of the first light-emitting element, the second light-emitting element, and the third light-emitting element has a first surface located on the lead side, a second surface located opposite to the first surface, and at least one electrode located on the second surface; 21. The light-emitting device according to any one of items 1 to 20, wherein the at least one electrode of each of the first light-emitting element, the second light-emitting element, and the third light-emitting element is arranged on a line connecting center points of the first lens portion, the second lens portion, and the third lens portion in a planar view. [Item 22] the first resin portion includes at least one protrusion, Item 16. The light emitting device according to item 15, wherein the upper surfaces of the plurality of light emitting elements are positioned above the at least one convex portion. [Item 23] the first resin portion includes at least one protrusion, Item 16. The light emitting device according to item 15, wherein the height of the upper surface of the at least one protrusion is the same as the height of the upper surface of the second resin portion. [Item 24] Item 24. The light emitting device according to item 23, wherein the first resin portion has a step surface on a side surface of the at least one protrusion that faces the same direction as the main surface. [Item 25] Item 25. The light emitting device according to item 24, wherein upper surfaces of the plurality of light emitting elements are located above the step surface. [Item 26] 26. The light emitting device according to any one of items 23 to 25, wherein the upper surface of the at least one protrusion has a depression. [Item 27] 27. The light emitting device according to any one of items 22 to 26, wherein, in a planar view of the main surface of the resin package, the at least one protrusion includes a portion located between two adjacent leads of the plurality of leads and a portion overlapping at least one of the two adjacent leads. [Item 28] a preparation step of preparing a first structure including a resin package including a resin member and a plurality of leads, and a plurality of light-emitting elements mounted on a main surface of the resin package, wherein the resin member has a first step surface on a side surface of the resin package that faces the same direction as the main surface; a molding resin portion forming step of forming a molding resin portion that seals the plurality of light-emitting elements in the first structure, The mold resin portion forming step includes: a resin injection step of injecting a resin material into the casting case; a step of immersing the plurality of light-emitting elements in the first structure and a portion of the resin package including the main surface in the resin material, wherein a portion of the resin material creeps up from between the side surface of the resin package and an inner wall of the casting case along the side surface of the resin package toward the first step surface; a curing step of curing the resin material; A method for manufacturing a light-emitting device, comprising: [Item 29] Item 29. The method for manufacturing a light emitting device according to Item 28, wherein in the immersion step, creeping up of the resin material is blocked by the first step surface. [Item 30] the light emitting device further includes a reflective member disposed in the one recess of the resin package; the reflective member is in contact with a side surface of the at least one protrusion, Item 23. The light emitting device according to item 22, wherein at least a portion of the upper surface of the at least one protrusion is exposed from the reflective member. [Item 31] In a plan view of the main surface of the resin package, the reflective member includes a first reflective member located around the first light-emitting element, a second reflective member located around the second light-emitting element, and a third reflective member located around the third light-emitting element, the first reflective member, the second reflective member, and the third reflective member being connected to one another; Item 31. The light emitting device according to item 30, wherein the reflective member has a hole corresponding to the at least one protrusion. [Item 32] the at least one protrusion includes a plurality of protrusions, Item 32. The light emitting device according to any one of items 22, 30, and 31, wherein, in a plan view of the main surface of the resin package, each of the plurality of protrusions is located between two adjacent ones of the plurality of light emitting elements. [Item 33] The resin member on the main surface of the resin package is a first resin portion located on the inner upper surface of the one recess; a second resin portion that surrounds the inner upper surface of the one recess in a plan view, an upper surface of the second resin portion is located higher than an upper surface of the first resin portion; the first resin portion includes at least one protrusion, Item 13. The light emitting device according to item 12, wherein an upper surface of the at least one convex portion is positioned higher than upper surfaces of the plurality of light emitting elements. [Item 34] the light emitting device further includes a reflective member disposed in the one recess of the resin package; Item 34. The light emitting device according to item 23 or 33, wherein the reflective member includes a plurality of portions arranged in two or more regions spaced apart from each other with the at least one convex portion sandwiched therebetween.

[0304] [Item 35] Item 35. The light emitting device according to any one of items 22, 23, and 30 to 34, wherein, in a plan view of the main surface of the resin package, the at least one protrusion is spaced apart from the second resin portion.

[0305] [Item 36] Item 16. The light emitting device according to item 15, wherein the upper surface of the second resin portion is located higher than the upper surface of the first resin portion. [Industrial Applicability]

[0306] The light-emitting device of the present disclosure can be suitably used in light-emitting devices for various applications, particularly in display devices such as LED displays, which are used in, for example, billboards, large-screen televisions, advertisements, traffic signs, 3D displays, and lighting fixtures. [Explanation of symbols]

[0307] 2, 1000-1003, 3000, 3001, 4000-4005: light emitting device, 3: waterproof resin, 10a, 10b, 11a-13a, 11b-13b: leads, 21: first recess, 21a: inner upper surface of first recess, 21c: inner side surface of first recess, 22, 23: second recess, 22a, 23a: inner upper surface of second recess, 22c, 23c: inner side surface of second recess, 30, 30a , 30b: exposed region of lead, 40: dark colored resin member, 41: first resin portion, 42, 42A to 42F: second resin portions, 45a, 45b, 46 to 49: convex portions, 50: light emitting element, 51: first light emitting element, 52: second light emitting element, 53: third light emitting element, 60: molded resin portion, 61: base portion, 61a: upper surface of base portion, 61b: side portion of base portion, 62: stepped surface of base portion, 70: lens portion, 71: first lens portion, 72: second lens portion, 73: third lens portion, 100: resin package, 100a: main surface of resin package, 100b: back surface of resin package, 100c: outer portion of resin package, 150: reflective member, 151: first reflective member, 152: second reflective member, 153: third reflective member, 180: light transmissive Resin member, 190: second dark-colored resin member, 201 to 203: element mounting region, 211, 212: intervening region, 300: first region, 1000u: interface portion, 2000: display device, Pn: constricted portion, 49h: depression, 46u, 48u, 49u: upper surface of convex portion, P: first point, Q: second point, R: third point, st1: first step surface, st2: second step surface, wr: connection region

Claims

1. a resin package including a plurality of leads and a resin member that fixes at least a portion of the plurality of leads, the resin package having a main surface, a back surface located opposite the main surface, and a side surface located between the main surface and the back surface, and each of the plurality of leads having an exposed region exposed from the resin member on the main surface; a plurality of light-emitting elements including a first light-emitting element, a second light-emitting element, and a third light-emitting element, each of the plurality of light-emitting elements being disposed in the exposed region of any of the plurality of leads; a mold resin portion including a base portion that seals the plurality of light-emitting elements and a plurality of lens portions that are located above the base portion and are integrally formed with the base portion; the plurality of lens portions include, in a plan view, a first lens portion overlapping with the first light-emitting element, a second lens portion overlapping with the second light-emitting element, and a third lens portion overlapping with the third light-emitting element; the base portion has an upper surface located above the main surface of the resin package, and a side surface portion of the base portion covering a part of the side surface portion of the resin package in a direction from the upper surface of the base portion toward the back surface of the resin package, In cross section, the first point is located closer to the plurality of lens portions than the second point, and the second point is located outside the third point; the first point is the outermost point of the top surface of the base portion, the second point is the outermost point of the side surface of the base portion, and the third point is the outermost point where the side surface of the resin package and the side surface of the base portion come into contact with each other; In a cross-sectional view, the first light-emitting element is located closer to the back surface of the resin package than the first point and above the second point.

2. The light emitting device according to claim 1 , wherein in a cross-sectional view, a portion of the side surface of the base extending from the second point to the third point has an outer surface that is curved in a concave shape.

3. The light emitting device according to claim 1 , wherein a part of the side surface of the resin package is exposed from the side surface of the base.

4. the resin member has a first step surface at the side surface of the resin package, the first step surface facing the same direction as the main surface; The light emitting device according to claim 1 , wherein the first step surface is located closer to the back surface of the resin package than the second point of the base portion.

5. 5. The light emitting device according to claim 4, wherein the ratio of the distance from the back surface of the resin package to the first step surface to the distance from the back surface of the resin package to the second point of the molded resin portion is 0.2 or more and 0.8 or less.

6. the resin member further has a second step surface located below the first step surface at the side surface of the resin package; The light emitting device according to claim 4 , wherein the width of the first step surface is greater than the width of the second step surface.

7. The light emitting device according to claim 4 , wherein, in a cross-sectional view, an outermost point of the first step surface of the resin package is located inside the second point of the molded resin portion.

8. In a cross-sectional view, the outer surface of the side surface portion of the base portion is The light emitting device according to claim 1 , further comprising a step surface facing the same direction as the main surface between the first and second electrodes.

9. the resin package further includes a tapered surface between the main surface of the resin package and the side surface of the resin package, the tapered surface being inclined with respect to the main surface; The light emitting device according to claim 1 , wherein the tapered surface is located above the second point of the base portion.

10. 3. The light emitting device of claim 1, wherein, in a cross-sectional view, the width in a direction parallel to the main surface from the second point of the base portion to the side portion of the resin package is 0.1 to 0.5 times the maximum width in a direction parallel to the main surface of a portion of the resin package located above the second point.

11. the main surface of the resin package has one recess defined by the resin member and the plurality of leads, and an inner upper surface of the one recess includes the exposed regions of each of the plurality of leads; The light emitting device according to claim 1 , wherein each of the plurality of light emitting elements is disposed in the one recess of the resin package.

12. the first light-emitting element emits first light, the second light-emitting element emits second light having a shorter wavelength than the first light, and the third light-emitting element emits third light having a shorter wavelength than the second light, 3. The light emitting device according to claim 1, wherein the first lens portion is colored in a similar color to the first light, the second lens portion is colored in a similar color to the second light, and the third lens portion is colored in a similar color to the third light.

13. The light emitting device according to claim 1 , wherein each of the plurality of lens portions has a convex shape that protrudes upward from the upper surface of the base portion.

14. each of the first light-emitting element, the second light-emitting element, and the third light-emitting element has a rectangular planar shape; 3. The light-emitting device according to claim 1, wherein, in a planar view, each side of the rectangle of at least one of the first light-emitting element, the second light-emitting element, and the third light-emitting element is non-parallel to each side of the rectangle of the other light-emitting elements.

15. The light emitting device according to claim 1 , wherein the height of the apex of at least one of the first lens portion, the second lens portion, and the third lens portion is greater than the height of the apex of the other lens portions.

16. each of the first light-emitting element, the second light-emitting element, and the third light-emitting element has a first surface located on the lead side, a second surface located opposite to the first surface, and at least one electrode located on the second surface; 3. The light-emitting device according to claim 1, wherein the at least one electrode of each of the first light-emitting element, the second light-emitting element, and the third light-emitting element is arranged on a line connecting the center points of the first lens portion, the second lens portion, and the third lens portion in a planar view.

Images