Filter and antenna combination components

Abstract

To realize a filter capable of adjusting the influence of a cavity resonator on the overall characteristics.SOLUTION: A filter 1 includes a first port 3, a second port 4, a path 5, a circuit portion 10, and cavity resonators 21 and 22. The path 5 connects the first port 3 and the second port 4. The circuit portion 10 is provided on the path 5. Each of the cavity resonators 21 and 22 is coupled to the path 5 from outside the path 5 due to the circuit configuration. The cavity resonator 21 is coupled to the path 5 between the first port 3 and the circuit portion 10. The cavity resonator 22 is coupled to the path 5 between the second port 4 and the circuit portion 10.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a filter having a cavity resonator and an antenna composite component having the filter. [Background technology]

[0002] Bandpass filters are one of the electronic components used in communication devices, and are required to have low insertion loss within the passband and high insertion loss outside the passband.

[0003] Patent Document 1 describes a filter device that combines a bandpass filter and a band elimination filter (band rejection filter). In this filter device, the band rejection filter increases the insertion loss in a frequency range higher than the pass band.

[0004] Patent Document 2 describes a filter resonator having a sidewall made of a conductive material and a dielectric. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2020-155836 [Patent Document 2] Patent Publication No. 2021-531708 Summary of the Invention [Problem to be solved by the invention]

[0006] Currently, communication services using fifth-generation mobile communication systems (hereinafter referred to as 5G) are beginning to be provided. 5G is expected to use frequency bands above 10 GHz, particularly the quasi-millimeter wave band of 10 to 30 GHz and the millimeter wave band of 30 to 300 GHz. Similar to the frequency bands used in mobile communication systems up to fourth generation, multiple standards with relatively close frequency bands exist in these frequency bands. Therefore, bandpass filters used in 5G are also required to have a sharp change in insertion loss in the frequency range close to the passband.

[0007] Here, in order to obtain a characteristic in which the insertion loss of a bandpass filter changes sharply in the frequency range close to the passband, it is considered to use a band elimination filter. In this case, the center frequency of the stopband of the band elimination filter must be set close to the passband. However, this causes a problem in that the insertion loss in the passband of the bandpass filter increases.

[0008] A so-called cavity resonator, such as that described in Patent Document 2, can increase the Q value. Therefore, it is conceivable to use a cavity resonator to construct a band elimination filter. Even when a cavity resonator is used, it is necessary to prevent the insertion loss in the passband of the bandpass filter from increasing. To achieve this, it is necessary to devise a way to appropriately adjust the influence of the cavity resonator on the pass attenuation characteristics of the bandpass filter. However, such a way has not been fully considered in the past.

[0009] The present invention has been made in view of the above problems, and an object of the present invention is to provide a filter and antenna composite component that makes it possible to adjust the influence of a cavity resonator on the overall characteristics. [Means for solving the problem]

[0010] The filter of the present invention includes a first port, a second port, a path connecting the first port and the second port, a circuit portion provided in the path, and at least one cavity resonator coupled to the path from outside the path in terms of the circuit configuration.

[0011] In the filter of the present invention, at least one cavity resonator may be configured by a conductor surrounding a three-dimensional region and a dielectric present in the region.

[0012] In the filter of the present invention, at least one cavity resonator may constitute a band elimination filter.

[0013] In the filter of the present invention, the path may include a conductor portion disposed in the at least one cavity resonator and extending in one direction. The conductor portion may be located at a position offset from the center of gravity of the at least one cavity resonator when viewed from the one direction. The at least one cavity resonator may be coupled to the conductor portion.

[0014] In the filter of the present invention, the at least one cavity resonator may be a plurality of cavity resonators, which may include a first cavity resonator coupled to the path between the first port and the circuit portion, and a second cavity resonator coupled to the path between the second port and the circuit portion.

[0015] In the filter of the present invention, the circuit portion may be a band-pass filter, or may be a line.

[0016] The filter of the present invention may further include a body for integrating the first port, the second port, the path, the circuit portion, and the at least one cavity resonator. The body may have a first surface and a second surface facing opposite each other. In this case, a dimension of the at least one cavity resonator in a direction perpendicular to the first surface may be smaller than a dimension of the at least one cavity resonator in a direction parallel to the first surface.

[0017] Furthermore, when the main body has a first surface and a second surface, the first port may be disposed on the first surface, and the second port may be disposed at a position different from the first surface in a direction perpendicular to the first surface, or the first port and the second port may be disposed on the first surface.

[0018] The antenna composite component of the present invention includes the filter of the present invention and an antenna connected to the second port. [Effects of the Invention]

[0019] In the filter and antenna composite component of the present invention, at least one cavity resonator is coupled to the path connecting the first port and the second port from outside the path in terms of the circuit configuration, which makes it possible to realize a filter in which the influence of the cavity resonator on the overall characteristics can be adjusted. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a circuit diagram showing a circuit configuration of a filter according to a first embodiment of the present invention. [Figure 2] 3 is an explanatory view showing a pattern-formed surface of a first dielectric layer in a main body of a filter according to a first embodiment of the present invention. FIG. [Figure 3] 3 is an explanatory view showing a pattern-formed surface of a second dielectric layer in the main body of the filter according to the first embodiment of the present invention. FIG. [Figure 4]3 is an explanatory diagram showing pattern formation surfaces of the third to ninth dielectric layers in the main body of the filter according to the first embodiment of the present invention. FIG. [Figure 5] 3 is an explanatory view showing a pattern-formed surface of a tenth dielectric layer in the main body of the filter according to the first embodiment of the present invention. FIG. [Figure 6] 3 is an explanatory diagram showing a pattern-formed surface of an eleventh dielectric layer in the main body of the filter according to the first embodiment of the present invention. FIG. [Figure 7] 3 is an explanatory diagram showing the pattern-forming surfaces of the twelfth to seventeenth dielectric layers in the main body of the filter according to the first embodiment of the present invention. FIG. [Figure 8] 3 is an explanatory view showing a terminal formation surface of an 18th dielectric layer in the main body of the filter according to the first embodiment of the present invention. FIG. [Figure 9] 1 is a perspective view showing the appearance of a filter according to a first embodiment of the present invention. [Figure 10] 1 is a perspective view showing the inside of a main body of a filter according to a first embodiment of the present invention. FIG. [Figure 11] 1 is a plan view showing the inside of a main body of a filter according to a first embodiment of the present invention. FIG. [Figure 12] FIG. 2 is a characteristic diagram showing an example of frequency characteristics of the filter according to the first embodiment of the present invention. [Figure 13] FIG. 12 is a characteristic diagram showing an enlarged portion of the frequency characteristics shown in FIG. [Figure 14] FIG. 10 is a circuit diagram showing a circuit configuration of an antenna composite component according to a second embodiment of the present invention. [Figure 15] FIG. 10 is an explanatory view showing a pattern-formed surface of a first dielectric layer in a main body of an antenna composite component according to a second embodiment of the present invention. [Figure 16] FIG. 10 is an explanatory view showing a pattern-formed surface of a second dielectric layer in a main body of an antenna composite component according to a second embodiment of the present invention. [Figure 17] FIG. 10 is an explanatory view showing pattern formation surfaces of the third to eighth dielectric layers in the main body of the antenna composite component according to the second embodiment of the present invention. [Figure 18] FIG. 10 is an explanatory view showing a pattern-formed surface of a ninth dielectric layer in a main body of an antenna composite component according to a second embodiment of the present invention. [Figure 19] 10 is an explanatory view showing a pattern-formed surface of a tenth dielectric layer in a main body of an antenna composite component according to a second embodiment of the present invention. FIG. [Figure 20] FIG. 10 is an explanatory view showing a pattern-formed surface of an eleventh dielectric layer in a main body of an antenna composite component according to a second embodiment of the present invention. [Figure 21] FIG. 10 is an explanatory diagram showing pattern formation surfaces of twelfth to seventeenth dielectric layers in the main body of the antenna composite component according to the second embodiment of the present invention. [Figure 22] FIG. 10 is an explanatory view showing a pattern-formed surface of an 18th dielectric layer in a main body of an antenna composite component according to a second embodiment of the present invention. [Figure 23] 10 is an explanatory diagram showing pattern formation surfaces of the nineteenth and twentieth dielectric layers in the main body of the antenna composite component according to the second embodiment of the present invention. FIG. [Figure 24] FIG. 10 is an explanatory view showing a pattern-formed surface of a 21st dielectric layer in a main body of an antenna composite component according to a second embodiment of the present invention. [Figure 25] 10 is an explanatory diagram showing pattern formation surfaces of the 22nd and 23rd dielectric layers in the main body of the antenna composite component according to the second embodiment of the present invention. FIG. [Figure 26] FIG. 10 is an explanatory view showing a pattern-formed surface of a 24th dielectric layer in a main body of an antenna composite component according to a second embodiment of the present invention. [Figure 27] 10 is an explanatory diagram showing the pattern-formed surfaces of the 25th to 32nd dielectric layers in the main body of the antenna composite component according to the second embodiment of the present invention. FIG. [Figure 28] FIG. 10 is an explanatory view showing a pattern-formed surface of a 33rd dielectric layer in a main body of an antenna composite component according to a second embodiment of the present invention. [Figure 29]FIG. 10 is an explanatory view showing a pattern-formed surface of a 34th dielectric layer in the main body of the antenna composite component according to the second embodiment of the present invention. [Figure 30] FIG. 10 is an explanatory view showing a pattern-formed surface of a 35th dielectric layer in a main body of an antenna composite component according to a second embodiment of the present invention. [Figure 31] FIG. 10 is an explanatory diagram showing pattern formation surfaces of the 36th to 54th dielectric layers in the main body of the antenna composite component according to the second embodiment of the present invention. [Figure 32] FIG. 10 is an explanatory view showing a pattern-formed surface of a 55th dielectric layer in a main body of an antenna composite component according to a second embodiment of the present invention. [Figure 33] FIG. 10 is a perspective view showing the appearance of an antenna composite component according to a second embodiment of the present invention. [Figure 34] FIG. 10 is a perspective view showing the inside of a first portion of a main body of an antenna composite component according to a second embodiment of the present invention. [Figure 35] FIG. 10 is a plan view showing the inside of a second portion of a main body of an antenna composite component according to a second embodiment of the present invention. [Figure 36] FIG. 10 is a plan view showing the inside of a first portion of a main body of an antenna composite component according to a second embodiment of the present invention. [Figure 37] FIG. 10 is a circuit diagram showing a circuit configuration of an antenna composite component according to a third embodiment of the present invention. [Figure 38] FIG. 10 is an explanatory view showing a pattern-formed surface of a second dielectric layer in a main body of an antenna composite component according to a third embodiment of the present invention. [Figure 39] FIG. 10 is an explanatory view showing pattern formation surfaces of the third to ninth dielectric layers in the main body of the antenna composite component according to the third embodiment of the present invention. [Figure 40] FIG. 11 is an explanatory view showing a pattern-formed surface of a tenth dielectric layer in a main body of an antenna composite component according to a third embodiment of the present invention. [Figure 41] FIG. 10 is an explanatory diagram showing pattern formation surfaces of 11th to 17th dielectric layers in the main body of the antenna composite component according to the third embodiment of the present invention. [Figure 42] FIG. 11 is a perspective view showing the inside of a first portion of a main body of an antenna composite component according to a third embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0021] [First embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, an outline of the configuration of a filter 1 according to a first embodiment of the present invention will be described with reference to FIG. 1. FIG. 1 is a circuit diagram showing the circuit configuration of filter 1. Filter 1 includes a first port 3, a second port 4, a path 5 connecting first port 3 and second port 4, a circuit portion 10 provided in path 5, and at least one cavity resonator. Each of the first and second ports 3 and 4 is a port for inputting or outputting a signal.

[0022] In this embodiment, the circuit portion 10 is a band-pass filter. The filter 1 as a whole functions as a band-pass filter.

[0023] In the circuit configuration, at least one cavity resonator is coupled to the path 5 from outside the path 5. In addition, in the circuit configuration, at least one cavity resonator is not provided on the path 5. In this application, the expression "in the circuit configuration" is used to refer to the arrangement on the circuit diagram, not the arrangement in the physical configuration. Therefore, as long as at least one cavity resonator is coupled to the path 5 from outside the path 5 in the circuit diagram, the path 5 may physically pass through the interior of at least one cavity resonator.

[0024] In particular, in this embodiment, the at least one cavity resonator configures a band elimination filter. Furthermore, the at least one cavity resonator is a plurality of cavity resonators. In the example shown in Fig. 1, the plurality of cavity resonators includes a cavity resonator 21 coupled to a path 5 between a first port 3 and a circuit portion 10, and a cavity resonator 22 coupled to the path 5 between a second port 4 and the circuit portion 10. In Fig. 1, each of the cavity resonators 21 and 22 is represented by an equivalent circuit including two inductors and two capacitors.

[0025] An example of the circuit configuration of the filter 1 and the circuit section 10 will be described below with reference to Fig. 1. The circuit section 10 includes two resonators 11 and 12 arranged in this order from the first port 3 side in the circuit configuration. Each of the resonators 11 and 12 is a quarter-wave resonator with one end shorted and the other end open. The resonators 11 and 12 are magnetically coupled to each other.

[0026] One end of the resonator 11 is coupled to the first port 3. One end of the resonator 12 is coupled to the second port 4. The other ends of the resonators 11 and 12 are connected to ground. In Fig. 1, symbol L3 denotes the inductance component of the line connecting the resonators 11 and 12 to ground.

[0027] The filter 1 further includes a capacitor C1 arranged in the circuit configuration between the resonator 11 and the first port 3, and a capacitor C2 arranged in the circuit configuration between the resonator 12 and the second port 4.

[0028] The path 5 includes conductor portions L1 and L2. The conductor portion L1 is located between the first port 3 and the capacitor C1 in terms of the circuit configuration. The conductor portion L2 is located between the second port 4 and the capacitor C2 in terms of the circuit configuration. The cavity resonators 21 and 22 are coupled to the conductor portions L1 and L2, respectively. In FIG. 1, two curves marked with the symbol M represent the coupling between the cavity resonator 21 and the conductor portion L1 and the coupling between the cavity resonator 22 and the conductor portion L2, respectively.

[0029] Next, the physical configuration of the filter 1 will be described. The filter 1 includes a main body 50 for integrating the components of the filter 1 described with reference to Fig. 1. The first port 3, the second port 4, the path 5, the circuit portion 10, and the cavity resonators 21 and 22 are integrated into the main body 50. The main body 50 is shown in Fig. 9, which will be described later.

[0030] The main body 50 includes a plurality of laminated dielectric layers, and a plurality of conductor layers and a plurality of through holes formed in the plurality of dielectric layers. The plurality of dielectric layers and the plurality of conductor layers constituting the main body 50 will be described below with reference to FIGS. 2 to 8. In this embodiment, the main body 50 has 18 laminated dielectric layers. Hereinafter, these 18 dielectric layers will be referred to as the 1st to 18th dielectric layers, in order from the bottom up. The 1st to 18th dielectric layers will be denoted by reference numerals 51 to 68.

[0031] FIG. 2 shows the pattern-forming surface of the first dielectric layer 51. A plurality of conductor layers are formed on the pattern-forming surface of the dielectric layer 51. The plurality of conductor layers include conductor layers 511 and 512. Furthermore, a plurality of through holes connected to the plurality of conductor layers are formed in the dielectric layer 51. The plurality of through holes include specific through holes 51T1 and 51T2 connected to the conductor layers 511 and 512, respectively. FIG. 2 depicts a plurality of first circles and a plurality of second circles located inside the plurality of first circles. The plurality of first circles represent a plurality of conductor layers, and the plurality of second circles represent a plurality of through holes.

[0032] FIG. 3 shows the pattern-forming surface of the second dielectric layer 52. Conductor layers 521, 522, and 523 are formed on the pattern-forming surface of the dielectric layer 52. Specific through holes 51T1 and 51T2 formed in the dielectric layer 51 are connected to the conductor layers 521 and 522, respectively. A plurality of through holes (excluding the specific through holes 51T1 and 51T2) formed in the dielectric layer 51 are connected to the conductor layer 523. Furthermore, the dielectric layer 52 has two specific through holes 52T1 and 52T2 connected to the conductor layers 521 and 522, respectively, and a plurality of through holes connected to the conductor layer 523. In FIG. 3, a plurality of circles drawn within the conductor layer 523 represent a plurality of through holes.

[0033] FIG. 4 shows the pattern-forming surfaces of the third to ninth dielectric layers 53 to 59. A plurality of through holes are formed in each of the dielectric layers 53 to 59. The plurality of through holes includes specific through holes 53T1 and 53T2 formed in each of the dielectric layers 53 to 59. The specific through holes 52T1 and 52T2 formed in the dielectric layer 52 are connected to specific through holes 53T1 and 53T2 formed in the dielectric layer 53, respectively. In FIG. 4, a plurality of circles represent a plurality of through holes. Furthermore, in the dielectric layers 53 to 59, adjacent through holes are connected to each other vertically.

[0034] FIG. 5 shows the pattern-forming surface of the tenth dielectric layer 60. Resonator conductor layers 601 and 602 and conductor layers 603 and 604 are formed on the pattern-forming surface of the dielectric layer 60. The conductor layers 601 and 602 each have a first end and a second end located opposite each other. The first end of the conductor layer 601 and the first end of the conductor layer 602 are connected to each other. The second end of the conductor layer 601 is adjacent to the conductor layer 603 with a predetermined gap therebetween. The second end of the conductor layer 602 is adjacent to the conductor layer 604 with a predetermined gap therebetween. Specific through-holes 53T1 and 53T2 formed in the dielectric layer 59 are connected to the conductor layers 603 and 604, respectively.

[0035] Furthermore, a plurality of through holes are formed in the dielectric layer 60. In Fig. 5, a plurality of circles represent a plurality of through holes.

[0036] Fig. 6 shows the pattern-formed surface of the eleventh dielectric layer 61. Conductor layers 611 and 612 are formed on the pattern-formed surface of the dielectric layer 61. A plurality of through-holes are also formed in the dielectric layer 61. In Fig. 6, a plurality of circles represent a plurality of through-holes.

[0037] Fig. 7 shows the pattern-forming surfaces of the twelfth to seventeenth dielectric layers 62 to 67. A plurality of through holes are formed in each of the dielectric layers 62 to 67. In Fig. 7, a plurality of circles represent a plurality of through holes. Furthermore, in the dielectric layers 62 to 67, adjacent through holes in the vertical direction are connected to each other.

[0038] 8 shows the pattern formation surface of the 18th dielectric layer 68. A conductor layer 681 is formed on the pattern formation surface of the dielectric layer 68. The plurality of through holes formed in the dielectric layer 67 are connected to the conductor layer 681.

[0039] FIG. 9 shows a main body 50 formed by laminating 1st to 18th dielectric layers 51 to 68. FIGS. 10 and 11 show the interior of the main body 50. The main body 50 has a bottom surface 50A and a top surface 50B located at both ends in the lamination direction T of the multiple dielectric layers, and four side surfaces 50C to 50F connecting the bottom surface 50A and the top surface 50B. The side surfaces 50C and 50D face in opposite directions from each other, and the side surfaces 50E and 50F also face in opposite directions from each other. The side surfaces 50C to 50F are perpendicular to the bottom surface 50A and the top surface 50B.

[0040] Here, the X direction, Y direction, and Z direction are defined as shown in FIG. 9. The X direction, Y direction, and Z direction are perpendicular to each other. In this embodiment, a direction parallel to the stacking direction T is defined as the Z direction. Furthermore, the direction opposite to the X direction is defined as the −X direction, the direction opposite to the Y direction is defined as the −Y direction, and the direction opposite to the Z direction is defined as the −Z direction.

[0041] As shown in FIG. 9, the bottom surface 50A is located at the end of the main body 50 in the -Z direction. The top surface 50B is located at the end of the main body 50 in the Z direction. The side surface 50C is located at the end of the main body 50 in the -X direction. The side surface 50D is located at the end of the main body 50 in the X direction. The side surface 50E is located at the end of the main body 50 in the -Y direction. The side surface 50F is located at the end of the main body 50 in the Y direction.

[0042] The bottom surface 50A and the top surface 50B face in opposite directions. The bottom surface 50A corresponds to the "first surface" in the present invention. The top surface 50B corresponds to the "second surface" in the present invention.

[0043] The main body 50 is configured by laminating the first to eighteenth dielectric layers 51 to 68 such that the pattern-formed surface of the first dielectric layer 51 becomes the bottom surface 50A of the main body 50, and the surface of the eighteenth dielectric layer 68 opposite to the pattern-formed surface becomes the top surface 50B of the main body 50. As shown in Fig. 10, inside the main body 50, the multiple conductor layers and multiple through holes shown in Figs. 2 to 8 are laminated.

[0044] Each of the multiple through holes shown in Figures 2 to 7, excluding the multiple specific through holes mentioned above, is connected to a conductor layer that overlaps with it in the stacking direction T or to another through hole that overlaps with it in the stacking direction T when the first to eighteenth dielectric layers 51 to 68 are stacked.

[0045] The following describes the correspondence between the components of the filter 1 shown in Fig. 1 and the internal components of the main body 50 shown in Figs. 2 to 10. The first port 3 is formed by a conductor layer 511. The second port 4 is formed by a conductor layer 512. In this embodiment, the first port 3 and the second port 4 are both arranged on the bottom surface 50A of the main body 50.

[0046] The resonator 11 of the circuit section 10 is formed by a conductor layer 601 for the resonator. The resonator 12 of the circuit section 10 is formed by a conductor layer 602 for the resonator.

[0047] The capacitor C1 is composed of a resonator conductor layer 601, conductor layers 603 and 611, and a dielectric layer 60 between these conductor layers. The capacitor C2 is composed of a resonator conductor layer 602, conductor layers 604 and 612, and a dielectric layer 60 between these conductor layers.

[0048] The conductor portion L1 of the path 5 is formed by specific through holes 52T1 and 53T1. The conductor portion L2 of the path 5 is formed by specific through holes 52T2 and 53T2.

[0049] Here, a structure formed by connecting two or more through holes in series is called a through-hole row. A through-hole row is a conductor structure extending in a direction parallel to the Z direction. The main body 50 includes through-hole rows T1 and T2. The through-hole row T1 is formed by specific through-holes 52T1 and 53T1. The through-hole row T2 is formed by specific through-holes 52T2 and 53T2. The conductor portion L1 of the path 5 is formed by the through-hole row T1. The conductor portion L2 of the path 5 is formed by the through-hole row T2.

[0050] The main body 50 further includes a plurality of through-hole rows T3, a plurality of through-hole rows T4, a plurality of through-hole rows T5, a plurality of through-hole rows T6, and a plurality of through-hole rows T7. As shown in FIG. 11 , the plurality of through-hole rows T3 are arranged in a direction parallel to the Y direction near the side surface 50C. The plurality of through-hole rows T4 are arranged in a direction parallel to the Y direction near the side surface 50D. The plurality of through-hole rows T5 are arranged in a direction parallel to the X direction near the side surface 50E. The plurality of through-hole rows T6 are arranged in a direction parallel to the X direction near the side surface 50F. The plurality of through-hole rows T7 are arranged in a direction parallel to the Y direction in the central portion of the main body 50 in the direction parallel to the X direction.

[0051] Each of the through-hole arrays T3, T4, T5, T6, and T7 connects the conductor layer 523 and the conductor layer 681. The through-holes (excluding specific through-holes 51T1 and 51T2) formed in the dielectric layer 51 are connected to the conductor layer 523 and to the conductor layers (excluding conductor layers 511 and 512) formed on the pattern-forming surface of the dielectric layer 51. The conductor layers (excluding conductor layers 511 and 512) formed on the pattern-forming surface of the dielectric layer 51 are connected to ground. Therefore, the through-hole arrays T3, T4, T5, T6, and T7, as well as the conductor layers 523 and 681, are connected to ground. The through-hole arrays T7 include a through-hole array connected to the resonator conductor layers 601 and 602.

[0052] 11, the plurality of through hole rows T3, the plurality of through hole rows T5, the plurality of through hole rows T6, and the plurality of through hole rows T7, and the conductor layers 523 and 681 surround a three-dimensional region R1. Also, the plurality of through hole rows T4, the plurality of through hole rows T5, the plurality of through hole rows T6, and the plurality of through hole rows T7, and the conductor layers 523 and 681 surround a three-dimensional region R2.

[0053] A first dielectric exists in region R1. The first dielectric is made up of a portion of each of the dielectric layers 52 to 67. A second dielectric exists in region R2. The second dielectric is made up of another portion of each of the dielectric layers 52 to 67.

[0054] The cavity resonator 21 is composed of conductors (plurality of through-hole rows T3, plurality of through-hole rows T5, plurality of through-hole rows T6, plurality of through-hole rows T7, and conductor layers 523, 681) surrounding a three-dimensional region R1, and a first dielectric (a part of each of the dielectric layers 52 to 67) present in this region R1. The cavity resonator 22 is composed of conductors (plurality of through-hole rows T4, plurality of through-hole rows T5, plurality of through-hole rows T6, plurality of through-hole rows T7, and conductor layers 523, 681) surrounding a three-dimensional region R2, and a second dielectric (another part of each of the dielectric layers 52 to 67) present in this region R2.

[0055] Next, structural features of the filter 1 according to this embodiment will be described with reference to FIGS. 2 to 11. The through-hole array T1, i.e., the conductor portion L1 of the path 5, is disposed within the cavity resonator 21, specifically within the region R1. The conductor portion L1 extends in a direction parallel to the Z direction. When viewed from the Z direction, i.e., when the main body 50 is viewed from a position spaced apart from the main body 50 in the Z direction, the conductor portion L1 is positioned at a distance from the center of gravity of the cavity resonator 21 in the X direction. In this embodiment, the conductor portion L1 is positioned at a distance from the center of gravity of the cavity resonator 21 in the Z direction. The distance from the conductor portion L1 to the plurality of through-hole arrays T7 is shorter than the distance from the conductor portion L1 to the plurality of through-hole arrays T3.

[0056] The through hole row T2, i.e., the conductor portion L2 of the path 5, is disposed within the cavity resonator 22, specifically within the region R2. The conductor portion L2 extends in a direction parallel to the Z direction. When viewed from the Z direction, the conductor portion L2 is positioned at a location offset from the center of gravity of the cavity resonator 22. In particular, in this embodiment, the conductor portion L2 is positioned at a location offset in the −X direction from the center of gravity of the cavity resonator 22 when viewed from the Z direction. The distance from the conductor portion L2 to the plurality of through hole rows T7 is shorter than the distance from the conductor portion L1 to the plurality of through hole rows T4.

[0057] The dimension of the cavity resonator 21 in a direction parallel to the Z direction is smaller than the dimension of the cavity resonator 21 in a direction parallel to the bottom surface 50A (for example, the dimension of the cavity resonator 21 in a direction parallel to the X direction and the dimension of the cavity resonator 21 in a direction parallel to the Y direction). The resonance mode of the cavity resonator 21 is the TE011 mode.

[0058] The dimension of the cavity resonator 22 in a direction parallel to the Z direction is smaller than the dimension of the cavity resonator 22 in a direction parallel to the bottom surface 50A (for example, the dimension of the cavity resonator 22 in a direction parallel to the X direction and the dimension of the cavity resonator 22 in a direction parallel to the Y direction). The resonance mode of the cavity resonator 22 is the TE011 mode.

[0059] The cavity resonator 21 and the cavity resonator 22 are aligned in a direction parallel to the X direction. In particular, in this embodiment, the cavity resonator 21 is arranged closer to the side surface 50C than to the side surface 50D. The cavity resonator 22 is arranged closer to the side surface 50D than to the side surface 50C.

[0060] The resonator conductor layer 601 constituting the resonator 11 extends from the outside of the region R1 to the inside of the region R1. The resonator conductor layer 602 constituting the resonator 12 extends from the outside of the region R2 to the inside of the region R2.

[0061] Next, an example of the frequency characteristics of the filter 1 according to this embodiment will be shown. Fig. 12 is a characteristic diagram showing an example of the frequency characteristics of the filter 1. Fig. 13 is a characteristic diagram showing an enlarged view of a portion of the frequency characteristics shown in Fig. 12, specifically, a frequency region near the pass band. In Figs. 12 and 13, the horizontal axis represents frequency and the vertical axis represents attenuation. In Figs. 12 and 13, the curve labeled 91 represents insertion loss, and the curve labeled 92 represents return loss.

[0062] 12 and 13, the center frequency of the stopband of the band elimination filter formed by the cavity resonators 21 and 22 exists in a frequency range on the lower side of the passband of the bandpass filter formed by the circuit portion 10. As shown in FIGS. 12 and 13, according to this embodiment, it is possible to obtain a characteristic in which the insertion loss (attenuation) changes sharply in a frequency range close to the passband. Furthermore, the magnitude of the insertion loss (absolute value of attenuation) in the passband is sufficiently small.

[0063] Next, the operation and effect of the filter 1 according to this embodiment will be described. In this embodiment, each of the cavity resonators 21 and 22 is coupled to the path 5 from outside the path 5 in terms of the circuit configuration. As a result, according to this embodiment, the coupling between the cavity resonators 21 and 22 and the first and second ports 3 and 4 can be made weaker than the coupling between the circuit portion 10 and the first and second ports 3 and 4. As a result, according to this embodiment, the influence of the cavity resonators 21 and 22 on the characteristics of the entire filter 1 can be adjusted, that is, suppressed.

[0064] Furthermore, in this embodiment, the conductor portion L1 of the path 5 is located at a position shifted in the X direction from the center of gravity of the cavity resonator 21 when viewed from the Z direction. In this embodiment, the strength of the coupling between the cavity resonator 21 and the path 5 can be adjusted by adjusting the distance from the conductor portion L1 to the plurality of through hole rows T7. Specifically, when the distance from the conductor portion L1 to the plurality of through hole rows T7 is reduced, the coupling between the cavity resonator 21 and the path 5 becomes weaker. The distance from the conductor portion L1 to the plurality of through hole rows T7 can be adjusted, for example, by shifting the positions of the plurality of through hole rows T7 in a direction parallel to the X direction.

[0065] Similarly, in this embodiment, the conductor portion L2 of the path 5 is located at a position shifted in the −X direction from the center of gravity of the cavity resonator 22 when viewed from the Z direction. In this embodiment, the strength of the coupling between the cavity resonator 22 and the path 5 can be adjusted by adjusting the distance from the conductor portion L2 to the plurality of through hole rows T7. Specifically, when the distance from the conductor portion L2 to the plurality of through hole rows T7 is reduced, the coupling between the cavity resonator 22 and the path 5 becomes weaker. The distance from the conductor portion L2 to the plurality of through hole rows T7 can be adjusted, for example, by shifting the positions of the plurality of through hole rows T7 in a direction parallel to the X direction.

[0066] In the present embodiment, the cavity resonators 21 and 22 are arranged in a direction parallel to the X direction. As a result, according to the present embodiment, the dimension of the main body 50 in the direction parallel to the Z direction can be made smaller than when the cavity resonators 21 and 22 are stacked in a direction parallel to the Z direction.

[0067] [Second embodiment] Next, a second embodiment of the present invention will be described. First, an outline of the configuration of an antenna composite component 101 according to this embodiment will be described with reference to Fig. 14. Fig. 14 is a circuit diagram showing the circuit configuration of antenna composite component 101.

[0068] The antenna composite component 101 includes a first filter 1A and a second filter 1B. The circuit configuration of each of the first and second filters 1A and 1B is the same as the circuit configuration of the filter 1 according to the first embodiment. Like the filter 1, each of the first and second filters 1A and 1B functions as a band-pass filter.

[0069] In the following description, the components of the first and second filters 1A and 1B will be denoted by the same reference numerals as those of the filter 1, except for the first and second ports. The first port of the first filter 1A will be denoted by reference numeral 3A, the second port of the first filter 1A will be denoted by reference numeral 4A, the first port of the second filter 1B will be denoted by reference numeral 3B, and the second port of the second filter 1B will be denoted by reference numeral 4B.

[0070] The antenna composite component 101 further includes two dividers 111 and 112 and two antennas 121 and 122. The divider 111 has a first end 111a, a second end 111b, and a third end 111c. The divider 112 has a first end 112a, a second end 112b, and a third end 112c.

[0071] The second port 4A of the first filter 1A is connected to a first end 111a of a divider 111. The second end 111b of the divider 111 is connected to an antenna 121. The third end 111c of the divider 111 is connected to an antenna 122. The divider 111 has a function of distributing the signal output from the second port 4A of the first filter 1A to the antennas 121 and 122.

[0072] The second port 4B of the second filter 1B is connected to a first end 112a of a divider 112. The second end 112b of the divider 112 is connected to an antenna 121. The third end 112c of the divider 112 is connected to an antenna 122. The divider 112 has a function of distributing the signal output from the second port 4B of the second filter 1B to the antennas 121 and 122.

[0073] Each of the antennas 121 and 122 is connected via a divider 111 to the second port 4A of the first filter 1A and via a divider 112 to the second port 4B of the second filter 1B.

[0074] Next, the physical configuration of the antenna composite component 101 will be described. The antenna composite component 101 includes a main body 150 for integrating the components of the antenna composite component 101 described with reference to FIG. 14. The first filter 1A, the second filter 1B, the dividers 111 and 112, and the antennas 121 and 122 are integrated into the main body 150. The main body 150 also serves as a main body for integrating the components of the first filter 1A. Similarly, the main body 150 also serves as a main body for integrating the components of the second filter 1B. The main body 150 is shown in FIGS. 33 and 34, which will be described later.

[0075] The main body 150 includes a plurality of laminated dielectric layers, and a plurality of conductor layers and a plurality of through holes formed in the plurality of dielectric layers. The plurality of dielectric layers and conductor layers constituting the main body 150 will be described below with reference to FIGS. 15 to 32. In this embodiment, the main body 150 has 55 laminated dielectric layers. Hereinafter, the 55 dielectric layers will be referred to as the first to 55th dielectric layers, from the bottom up. The first to 55th dielectric layers will be denoted by reference numerals 151 to 205.

[0076] FIG. 15 shows the pattern-formed surface of the first dielectric layer 151. A plurality of conductor layers are formed on the pattern-formed surface of the dielectric layer 151. The plurality of conductor layers include conductor layers 511A and 511B. Furthermore, a plurality of through holes connected to the plurality of conductor layers are formed in the dielectric layer 151. The plurality of through holes include specific through holes 51T1A and 51T1B connected to conductor layers 511A and 511B, respectively. FIG. 15 depicts a plurality of first circles and a plurality of second circles located inside the plurality of first circles. The plurality of first circles represent a plurality of conductor layers, and the plurality of second circles represent a plurality of through holes.

[0077] FIG. 16 shows the pattern-forming surface of the second dielectric layer 152. Conductor layers 521A, 521B, and 1521 are formed on the pattern-forming surface of the dielectric layer 152. Specific through holes 51T1A and 51T1B formed in the dielectric layer 151 are connected to the conductor layers 521A and 521B, respectively. A plurality of through holes (excluding the specific through holes 51T1A and 51T1B) formed in the dielectric layer 151 are connected to the conductor layer 1521. Furthermore, the dielectric layer 152 has two specific through holes 52T1A and 52T1B connected to the conductor layers 521A and 521B, respectively, and a plurality of through holes connected to the conductor layer 1521 formed therein. In FIG. 16, a plurality of circles drawn within the conductor layer 1521 represent a plurality of through holes.

[0078] FIG. 17 shows the pattern-forming surfaces of the third to eighth dielectric layers 153 to 158. A plurality of through holes are formed in each of the dielectric layers 153 to 158. The plurality of through holes includes specific through holes 53T1A and 53T1B formed in each of the dielectric layers 153 to 158. The specific through holes 52T1A and 52T1B formed in the dielectric layer 152 are connected to specific through holes 53T1A and 53T1B formed in the dielectric layer 153, respectively. In FIG. 17, a plurality of circles represent a plurality of through holes. Furthermore, in the dielectric layers 153 to 158, adjacent through holes are connected to each other vertically.

[0079] Fig. 18 shows the pattern-formed surface of the ninth dielectric layer 159. Conductor layers 591A and 591B are formed on the pattern-formed surface of the dielectric layer 159. Furthermore, a plurality of through holes are formed in the dielectric layer 159. The plurality of through holes includes two specific through holes 59T1A and 59T1B that are connected to specific through holes 53T1A and 53T1B formed in the dielectric layer 158, respectively. In Fig. 18, a plurality of circles represent a plurality of through holes.

[0080] FIG. 19 shows the pattern-formed surface of the tenth dielectric layer 160. Resonator conductor layers 601A, 601B, 602A, and 602B, and conductor layers 603A, 603B, 604A, and 604B are formed on the pattern-formed surface of the dielectric layer 160. Each of the conductor layers 601A, 601B, 602A, and 602B has a first end and a second end located opposite each other. The first end of the conductor layer 601A and the first end of the conductor layer 602A are connected to each other. The second end of the conductor layer 601A is adjacent to the conductor layer 603A with a predetermined gap therebetween. The second end of the conductor layer 602A is adjacent to the conductor layer 604A with a predetermined gap therebetween. A specific through-hole 59T1A formed in the dielectric layer 159 is connected to the conductor layer 603A.

[0081] A first end of the conductor layer 601B and a first end of the conductor layer 602B are connected to each other. A second end of the conductor layer 601B is adjacent to the conductor layer 603B with a predetermined gap therebetween. A second end of the conductor layer 602B is adjacent to the conductor layer 604B with a predetermined gap therebetween. A specific through-hole 59T1B formed in the dielectric layer 159 is connected to the conductor layer 603B.

[0082] Furthermore, a plurality of through holes are formed in the dielectric layer 160. The plurality of through holes includes two specific through holes 60T2A and 60T2B connected to the conductor layers 604A and 604B, respectively. In Fig. 19, a plurality of circles represent a plurality of through holes.

[0083] Figure 20 shows the pattern-forming surface of the eleventh dielectric layer 161. Conductor layers 611A and 611B are formed on the pattern-forming surface of the dielectric layer 161. Furthermore, a plurality of through holes are formed in the dielectric layer 161. The plurality of through holes includes two specific through holes 61T2A and 61T2B that are connected to specific through holes 60T2A and 60T2B formed in the dielectric layer 160, respectively. In Figure 20, a plurality of circles represent a plurality of through holes.

[0084] FIG. 21 shows the pattern-forming surfaces of the twelfth to seventeenth dielectric layers 162-167. A plurality of through holes are formed in each of the dielectric layers 162-167. The plurality of through holes includes specific through holes 62T2A and 62T2B formed in each of the dielectric layers 162-167. The specific through holes 61T2A and 61T2B formed in the dielectric layer 161 are connected to specific through holes 62T2A and 62T2B formed in the dielectric layer 162, respectively. In FIG. 21, a plurality of circles represent a plurality of through holes. Furthermore, in the dielectric layers 162-167, adjacent through holes are connected to each other vertically.

[0085] 22 shows the pattern formation surface of the 18th dielectric layer 168. Conductor layers 681A, 681B, and 1681 are formed on the pattern formation surface of the dielectric layer 168. Specific through holes 62T2A and 62T2B formed in the dielectric layer 167 are connected to the conductor layers 681A and 681B, respectively. The multiple through holes (excluding the specific through holes 62T2A and 62T2B) formed in the dielectric layer 167 are connected to the conductor layer 1681.

[0086] Furthermore, two specific through holes 68T3A and 68T3B connected to conductor layers 681A and 681B, respectively, and a plurality of through holes connected to conductor layer 1681 are formed in dielectric layer 168. In FIG. 22, hatched region 168T represents the region where a plurality of through holes are formed. The plurality of through holes are preferably evenly arranged in region 168T at predetermined intervals. Note that in figures similar to FIG. 22 described below, the plurality of through holes, excluding the specific through holes, will be represented in the same manner as in FIG. 22.

[0087] FIG. 23 shows the pattern-forming surfaces of the 19th and 20th dielectric layers 169 and 170. A plurality of through holes are formed in each of the dielectric layers 169 and 170. The plurality of through holes includes specific through holes 69T3A and 69T3B formed in each of the dielectric layers 169 and 170. Specific through holes 68T3A and 68T3B formed in the dielectric layer 168 are connected to specific through holes 69T3A and 69T3B formed in the dielectric layer 169, respectively. The plurality of through holes formed in the dielectric layer 168 (excluding the specific through holes 68T3A and 68T3B) are connected to the plurality of through holes formed in the dielectric layer 169 (excluding the specific through holes 69T3A and 69T3B). In FIG. 23, the hatched region 169T represents a region where a plurality of through holes are formed. Furthermore, in the dielectric layers 169 and 170, adjacent through holes are connected to each other.

[0088] FIG. 24 shows the pattern-formed surface of the 21st dielectric layer 171. Conductor layers 711A, 711B, 712A, and 712B are formed on the pattern-formed surface of the dielectric layer 171. Each of the conductor layers 711A, 711B, 712A, and 712B has a first end and a second end located opposite each other. A specific through-hole 69T3A formed in the dielectric layer 170 is connected to a portion of the conductor layer 711A near the first end. The second end of the conductor layer 711A is connected to the conductor layer 712A. A specific through-hole 69T3B formed in the dielectric layer 170 is connected to a portion of the conductor layer 711B near the first end. The second end of the conductor layer 711B is connected to the conductor layer 712B.

[0089] Furthermore, a plurality of through holes are formed in the dielectric layer 171. The plurality of through holes includes four specific through holes: 71T4A, 71T4B, 71T5A, and 71T5B. The specific through hole 71T4A is connected to a portion of the conductor layer 712A near the first end. The specific through hole 71T5A is connected to a portion of the conductor layer 712B near the first end. The specific through hole 71T4B is connected to a portion of the conductor layer 712A near the second end. The specific through hole 71T5B is connected to a portion of the conductor layer 712B near the second end. In FIG. 24, the hatched region 171T represents the region where the plurality of through holes are formed, excluding the specific through holes 71T4A, 71T4B, 71T5A, and 71T5B. The region 171T has a shape that surrounds the conductor layers 711A, 711B, 712A, and 712B.

[0090] FIG. 25 shows the patterned surfaces of the 22nd and 23rd dielectric layers 172 and 173. A plurality of through holes are formed in each of the dielectric layers 172 and 173. The plurality of through holes includes specific through holes 72T4A, 72T4B, 72T5A, and 72T5B formed in each of the dielectric layers 172 and 173. Specific through holes 71T4A, 71T4B, 71T5A, and 71T5B formed in the dielectric layer 171 are connected to specific through holes 72T4A, 72T4B, 72T5A, and 72T5B formed in the dielectric layer 172, respectively. In FIG. 25, the hatched region 172T represents the region where a plurality of through holes are formed, excluding the specific through holes 72T4A, 72T4B, 72T5A, and 72T5B. Furthermore, in the dielectric layers 172 and 173, adjacent through holes are connected to each other.

[0091] 26 shows the pattern formation surface of the 24th dielectric layer 174. Conductor layers 741A, 741B, 742A, 742B, and 1741 are formed on the pattern formation surface of the dielectric layer 174. Specific through holes 72T4A, 72T4B, 72T5A, and 72T5B formed in the dielectric layer 173 are connected to the conductor layers 741A, 741B, 742A, and 742B, respectively. The multiple through holes formed in the dielectric layer 173 (excluding the specific through holes 72T4A, 72T4B, 72T5A, and 72T5B) are connected to the conductor layer 1741.

[0092] Furthermore, a plurality of through holes are formed in the dielectric layer 174. The plurality of through holes includes four specific through holes 74T4A, 74T4B, 74T5A, and 74T5B connected to the conductor layers 741A, 741B, 742A, and 742B, respectively. In FIG. 26, hatched regions 174TA and 174TB represent regions where a plurality of through holes are formed, excluding the four specific through holes 74T4A, 74T4B, 74T5A, and 74T5B. Region 174TA has a shape that surrounds the conductor layers 741A and 742A. Region 174TB has a shape that surrounds the conductor layers 741B and 742B.

[0093] FIG. 27 shows the pattern-forming surfaces of the 25th and 32nd dielectric layers 175-182. A plurality of through holes are formed in each of the dielectric layers 175-182. The plurality of through holes includes specific through holes 75T4A, 75T4B, 75T5A, and 75T5B formed in each of the dielectric layers 175-182. Specific through holes 74T4A, 74T4B, 74T5A, and 74T5B formed in the dielectric layer 174 are connected to specific through holes 75T4A, 75T4B, 75T5A, and 75T5B formed in the dielectric layer 175, respectively. In FIG. 27, hatched regions 175TA and 175TB represent regions where a plurality of through holes are formed, excluding the specific through holes 75T4A, 75T4B, 75T5A, and 75T5B. Furthermore, in the dielectric layers 175 to 182, the through holes adjacent to each other above and below are connected to each other.

[0094] 28 shows the pattern formation surface of the 33rd dielectric layer 183. Conductor layers 831A and 831B are formed on the pattern formation surface of the dielectric layer 183. Specific through holes 75T4A and 75T4B formed in the dielectric layer 182 are connected to the conductor layers 831A and 831B, respectively.

[0095] Furthermore, a plurality of through holes are formed in the dielectric layer 183. The plurality of through holes includes two specific through holes 83T5A and 83T5B, which are connected to specific through holes 75T5A and 75T5B, respectively, formed in the dielectric layer 182. In FIG. 28, hatched regions 183TA and 183TB represent regions where a plurality of through holes are formed, excluding the specific through holes 83T5A and 83T5B. Region 183TA has a shape that surrounds the conductor layer 831A. Region 183TB has a shape that surrounds the conductor layer 831B.

[0096] FIG. 29 shows the pattern formation surface of the 34th dielectric layer 184. Conductor layers 841A, 841B, 842A, and 842B are formed on the pattern formation surface of the dielectric layer 184. Specific through holes 83T5A and 83T5B formed in the dielectric layer 183 are connected to the conductor layers 842A and 842B, respectively. Furthermore, multiple through holes are formed in the dielectric layer 184. In FIG. 29, hatched regions 184TA and 184TB represent regions where multiple through holes are formed. Region 184TA has a shape that surrounds the conductor layers 841A and 842A. Region 184TB has a shape that surrounds the conductor layers 841B and 842B.

[0097] FIG. 30 shows the pattern formation surface of the 35th dielectric layer 185. Conductor layers 851A and 851B are formed on the pattern formation surface of the dielectric layer 185. Furthermore, a plurality of through holes are formed in the dielectric layer 185. In FIG. 30, hatched regions 185TA and 185TB represent regions where a plurality of through holes are formed. Region 185TA has a shape that surrounds the conductor layer 851A. Region 185TB has a shape that surrounds the conductor layer 851B.

[0098] Fig. 31 shows the pattern-forming surfaces of the 36th and 54th dielectric layers 186-204. A plurality of through holes are formed in each of the dielectric layers 186-204. In Fig. 31, hatched areas 186TA and 186TB represent areas where a plurality of through holes are formed. Furthermore, in the dielectric layers 186-204, adjacent through holes in the vertical direction are connected to each other.

[0099] 32 shows the pattern formation surface of the 55th dielectric layer 205. On the pattern formation surface of the dielectric layer 205, conductor layers 2051 and 2052 are formed.

[0100] FIG. 33 shows a main body 150 configured by laminating 1st to 55th dielectric layers 151-205. FIG. 34 shows the inside of a portion of the main body 150 including dielectric layers 151-167 (hereinafter referred to as a first portion 1501). FIG. 35 shows the inside of a portion of the main body 150 including dielectric layers 168-205 (hereinafter referred to as a second portion 1502). Note that FIG. 35 omits a number of through-holes except for a number of specific through-holes. FIG. 36 is a plan view showing the inside of the first portion 1501.

[0101] The main body 150 has a bottom surface 150A and a top surface 150B located at both ends in the stacking direction T of the multiple dielectric layers, and four side surfaces 150C to 150F connecting the bottom surface 150A and the top surface 150B. The side surfaces 150C and 150D face in opposite directions from each other, and the side surfaces 150E and 150F also face in opposite directions from each other. The side surfaces 150C to 150F are perpendicular to the bottom surface 150A and the top surface 150B.

[0102] FIG. 33 shows the X direction, Y direction, and Z direction defined in FIG. 9 in the first embodiment. In this embodiment, as in the first embodiment, a direction parallel to the stacking direction T is defined as the Z direction. As shown in FIG. 33, bottom surface 150A is located at the end of main body 150 in the -Z direction. Top surface 150B is located at the end of main body 150 in the Z direction. Side surface 150C is located at the end of main body 150 in the -X direction. Side surface 150D is located at the end of main body 150 in the X direction. Side surface 150E is located at the end of main body 150 in the -Y direction. Side surface 150F is located at the end of main body 150 in the Y direction.

[0103] The bottom surface 150A and the top surface 150B face in opposite directions. The bottom surface 150A corresponds to the "first surface" in the present invention. The top surface 150B corresponds to the "second surface" in the present invention.

[0104] The main body 150 is configured by laminating the first to 55th dielectric layers 151 to 205 so that the pattern-formed surface of the first dielectric layer 151 becomes the bottom surface 150A of the main body 150, and the surface of the 55th dielectric layer 205 opposite to the pattern-formed surface becomes the top surface 150B of the main body 150. As shown in Figures 34 and 35, inside the main body 150, the multiple conductor layers and multiple through holes shown in Figures 15 to 32 are laminated.

[0105] Each of the multiple through holes shown in Figures 15 to 31 excluding the multiple specific through holes described above is connected to a conductor layer that overlaps it in the stacking direction T or to another through hole that overlaps it in the stacking direction T when the 1st to 55th dielectric layers 151 to 205 are stacked. Furthermore, of the multiple through holes shown in Figures 15 to 31 excluding the multiple specific through holes described above, a through hole that is located within a conductor layer is connected to that conductor layer.

[0106] The planar shape (shape viewed from the Z direction) of each of the regions 168T, 169T, and 173T is the same as the planar shape of the region 171T. The multiple through holes arranged in each of the regions 168T, 169T, 171T, and 173T are arranged so as to form multiple through hole rows when the 1st to 55th dielectric layers 151-205 are stacked.

[0107] The planar shape of each of the regions 175TA, 183TA to 186TA is the same as that of the region 174TA. The plurality of through holes arranged in each of the regions 174TA, 175TA, 183TA to 186TA are arranged so as to form a plurality of through hole rows when the 1st to 55th dielectric layers 151 to 205 are laminated.

[0108] The planar shape of each of the regions 175TB, 183TB to 186TB is the same as that of the region 174TB. The plurality of through holes arranged in each of the regions 174TB, 175TB, 183TB to 186TB are arranged so as to form a plurality of through hole rows when the 1st to 55th dielectric layers 151 to 205 are stacked.

[0109] The following describes the correspondence between the components of the antenna composite component 101 shown in Fig. 14 and the internal components of the main body 150 shown in Figs. 15 to 32. First, the components of the first filter 1A excluding the cavity resonators 21 and 22 will be described. The first port 3A is formed by a conductor layer 511A. The second port 4A is formed by a conductor layer 681A. In this embodiment, the first port 3A is disposed on the bottom surface 150A of the main body 150. The second port 4A is disposed at a position different from the bottom surface 150A in the direction parallel to the Z direction.

[0110] In the first filter 1A, the resonator 11 of the circuit section 10 is formed by a resonator conductor layer 601A. The resonator 12 of the circuit section 10 is formed by a resonator conductor layer 602A. The capacitor C1 is formed by the resonator conductor layer 601A, conductor layers 603A and 611A, and a dielectric layer 160 between these conductor layers. The capacitor C2 is formed by the resonator conductor layer 602A, conductor layers 591A and 604A, and a dielectric layer 159 between these conductor layers. The conductor portion L1 of the path 5 is formed by a through-hole array T1A consisting of specific through-holes 52T1A, 53T1A, and 59T1A. The conductor portion L2 of the path 5 is formed by a through-hole array T2A consisting of specific through-holes 60T2A, 61T2A, and 62T2A.

[0111] Next, components of the second filter 1B excluding the cavity resonators 21 and 22 will be described. The first port 3B is formed by a conductor layer 511B. The second port 4B is formed by a conductor layer 681B. In this embodiment, the first port 3B is disposed on the bottom surface 150A of the main body 150. The second port 4B is disposed at a position different from the bottom surface 150A in a direction parallel to the Z direction.

[0112] In the second filter 1B, the resonator 11 of the circuit section 10 is formed by a resonator conductor layer 601B. The resonator 12 of the circuit section 10 is formed by a resonator conductor layer 602B. The capacitor C1 is formed by the resonator conductor layer 601B, conductor layers 603B and 611B, and a dielectric layer 160 between these conductor layers. The capacitor C2 is formed by the resonator conductor layer 602B, conductor layers 591B and 604B, and a dielectric layer 159 between these conductor layers. The conductor portion L1 of the path 5 is formed by a through-hole array T1B consisting of specific through-holes 52T1B, 53T1B, and 59T1B. The conductor portion L2 of the path 5 is formed by a through-hole array T2B consisting of specific through-holes 60T2B, 61T2B, and 62T2B.

[0113] Next, the cavity resonators 21 and 22 of the first filter 1A and the second filter 1B will be described. As shown in Fig. 36, four three-dimensional regions R1A, R1B, R2A, and R2B exist in the first portion 1501 of the main body 150. The regions R1A, R1B, R2A, and R2B are arranged in this order from the side surface 150C along a direction parallel to the X direction.

[0114] A first dielectric is present in each of the regions R1A and R1B. The first dielectric is made up of a portion of each of the dielectric layers 152 to 167. A second dielectric is present in each of the regions R2A and R2B. The second dielectric is made up of another portion of each of the dielectric layers 152 to 167.

[0115] The cavity resonator 21 of the first filter 1A is composed of conductors (plurality of through holes and conductor layers 1521, 1681) surrounding a three-dimensional region R1A and a first dielectric (part of each of the dielectric layers 152-167) present in this region R1A. The cavity resonator 22 of the first filter 1A is composed of conductors (plurality of through holes and conductor layers 1521, 1681) surrounding a three-dimensional region R2A and a second dielectric (another part of each of the dielectric layers 152-167) present in this region R2A.

[0116] The cavity resonator 21 of the second filter 1B is composed of conductors (plurality of through holes and conductor layers 1521, 1681) surrounding a three-dimensional region R1B and a first dielectric (a part of each of the dielectric layers 152-167) present in this region R1B. The cavity resonator 22 of the second filter 1B is composed of conductors (plurality of through holes and conductor layers 1521, 1681) surrounding a three-dimensional region R2B and a second dielectric (another part of each of the dielectric layers 152-167) present in this region R2B.

[0117] The plurality of conductors constituting the cavity resonators 21 and 22 of the first filter 1A and the second filter 1B, excluding the conductor layer 1521, are connected to the conductor layer 1521. The plurality of through holes (excluding specific through holes 51T1A and 51T1B) formed in the dielectric layer 151 are connected to the conductor layer 1521 and are also connected to the plurality of conductor layers (excluding the conductor layers 511A and 511B) formed on the pattern formation surface of the dielectric layer 151. The plurality of conductor layers (excluding the conductor layers 511A and 511B) formed on the pattern formation surface of the dielectric layer 151 are connected to ground. Therefore, the plurality of conductors constituting the cavity resonators 21 and 22 of the first filter 1A and the cavity resonators 21 and 22 of the second filter 1B are connected to ground.

[0118] The cavity resonators 21 and 22 of the first filter 1A are aligned in a direction parallel to the X direction. The cavity resonators 21 and 22 of the second filter 1B are also aligned in a direction parallel to the X direction. In this embodiment, particularly, all of the cavity resonators of the first and second filters 1A and 1B are aligned in a direction parallel to the X direction.

[0119] Next, the dividers 111 and 112 will be described. The divider 111 is composed of conductor layers 711A and 712A. The conductor layer 711A is connected to the conductor layer 681A that constitutes the second port 4A of the first filter 1A via specific through holes 68T3A and 69T3A.

[0120] The divider 112 is composed of conductor layers 711B and 712B. The conductor layer 711B is connected to the conductor layer 681B that constitutes the second port 4B of the second filter 1B via specific through holes 68T3B and 69T3B.

[0121] Next, the antennas 121 and 122 will be described. The antenna 121 is composed of a conductor layer 2051 that functions as a radiation conductor and conductor layers 841A and 851A that function as feeding conductors. The conductor layer 841A extends in a direction parallel to the Y direction. The conductor layer 841A supplies a vertically polarized signal to the conductor layer 2051. The conductor layer 851A extends in a direction parallel to the X direction. The conductor layer 851A supplies a horizontally polarized signal to the conductor layer 2051.

[0122] The conductor layer 841A faces the conductor layer 831A via the dielectric layer 183 and is capacitively coupled to the conductor layer 831A. The conductor layer 831A is connected to a portion of the conductor layer 712A constituting the divider 111 near the first end thereof via specific through holes 71T4A and 72T4A, the conductor layer 741A, and specific through holes 74T4A and 75T4A.

[0123] The conductor layer 851A faces the conductor layer 842A via the dielectric layer 184 and is capacitively coupled to the conductor layer 842A. The conductor layer 842A is connected to a portion of the conductor layer 712B constituting the divider 112 near a first end thereof via specific through holes 71T5A and 72T5A, the conductor layer 742A, and specific through holes 74T5A, 75T5A, and 83T5A.

[0124] The antenna 122 is composed of a conductor layer 2052 that functions as a radiation conductor and conductor layers 841B and 851B that function as feeding conductors. The conductor layer 841B extends in a direction parallel to the Y direction. The conductor layer 841B supplies a vertically polarized signal to the conductor layer 2052. The conductor layer 851B extends in a direction parallel to the X direction. The conductor layer 851B supplies a horizontally polarized signal to the conductor layer 2052.

[0125] The conductor layer 841B faces the conductor layer 831B via the dielectric layer 183 and is capacitively coupled to the conductor layer 831B. The conductor layer 831B is connected to a portion of the conductor layer 712A constituting the divider 111 near the second end thereof via specific through holes 71T4B and 72T4B, the conductor layer 741B, and specific through holes 74T4B and 75T4B.

[0126] The conductor layer 851B faces the conductor layer 842B via the dielectric layer 184 and is capacitively coupled to the conductor layer 842B. The conductor layer 842B is connected to a portion of the conductor layer 712B constituting the divider 112 near the second end thereof via specific through holes 71T5B and 72T5B, the conductor layer 742B, and specific through holes 74T5B, 75T5B, and 83T5B.

[0127] Other configurations, actions, and effects of this embodiment are the same as those of the first embodiment.

[0128] [Third embodiment] Next, a third embodiment of the present invention will be described. First, an outline of the configuration of an antenna composite component 301 according to this embodiment will be described with reference to Fig. 37. Fig. 34 is a circuit diagram showing the circuit configuration of antenna composite component 301.

[0129] The configuration of the antenna composite component 301 according to this embodiment differs from the configuration of the antenna composite component 101 according to the second embodiment in the following points: The antenna composite component 301 includes first and second filters 301A and 301B instead of the first and second filters 1A and 1B in the second embodiment.

[0130] The configuration of the first filter 301A is the same as the configuration of the first filter 1A, except for the circuit portion 10 and the capacitors C1 and C2. The configuration of the second filter 301B is the same as the configuration of the second filter 1B, except for the circuit portion 10 and the capacitors C1 and C2. In this embodiment, the circuit portion 10 of the first filter 301A and the circuit portion 10 of the second filter 301B are both lines 13. Furthermore, neither the first nor the second filter 301A, 301B is provided with capacitors C1, C2.

[0131] Next, differences between the configuration of the main body 150 of the antenna composite component 301 and the configuration of the main body 150 of the antenna composite component 101 according to the second embodiment will be described. In the present embodiment, the main body 150 has second to seventeenth dielectric layers 252 to 267 instead of the second to seventeenth dielectric layers 152 to 167 in the first embodiment.

[0132] FIG. 38 shows the pattern-forming surface of the second dielectric layer 252. Conductor layers 521C, 521D, and 2521 are formed on the pattern-forming surface of the dielectric layer 252. Specific through holes 51T1A and 51T1B (see FIG. 15) formed in the dielectric layer 151 are connected to the conductor layers 521C and 521D, respectively. A plurality of through holes (excluding the specific through holes 51T1A and 51T1B) formed in the dielectric layer 151 are connected to the conductor layer 2521. Furthermore, the dielectric layer 252 has two specific through holes 52T1C and 52T1D connected to the conductor layers 521C and 521D, respectively, and a plurality of through holes connected to the conductor layer 2521 formed therein. In FIG. 38, a plurality of circles drawn within the conductor layer 2521 represent a plurality of through holes.

[0133] FIG. 39 shows the pattern-forming surfaces of the third to ninth dielectric layers 253-259. A plurality of through holes are formed in each of the dielectric layers 253-259. The plurality of through holes includes specific through holes 53T1C and 53T1D formed in each of the dielectric layers 253-259. The specific through holes 52T1C and 52T1D formed in the dielectric layer 252 are connected to specific through holes 53T1C and 53T1D formed in the dielectric layer 253, respectively. In FIG. 39, a plurality of circles represent a plurality of through holes. Furthermore, in the dielectric layers 253-259, adjacent through holes are connected to each other vertically.

[0134] FIG. 40 shows the pattern-formed surface of the tenth dielectric layer 260. Conductor layers 601C and 601D are formed on the pattern-formed surface of the dielectric layer 260. Each of the conductor layers 601C and 601D has a first end and a second end located opposite each other. A specific through-hole 53T1C formed in the dielectric layer 259 is connected to a portion of the conductor layer 601C near the first end. A specific through-hole 53T1D formed in the dielectric layer 259 is connected to a portion of the conductor layer 601D near the first end.

[0135] Furthermore, a plurality of through holes are formed in the dielectric layer 260. The plurality of through holes includes two specific through holes 60T2C and 60T2D. The specific through hole 60T2C is connected to a portion of the conductor layer 601C near the second end. The specific through hole 60T2D is connected to a portion of the conductor layer 601D near the second end. In FIG. 40, a plurality of circles represent a plurality of through holes.

[0136] FIG. 41 shows the pattern-forming surfaces of the eleventh to seventeenth dielectric layers 261-267. A plurality of through holes are formed in each of the dielectric layers 261-267. The plurality of through holes includes specific through holes 61T2C and 61T2D formed in each of the dielectric layers 261-267. The specific through holes 60T2C and 60T2D formed in the dielectric layer 260 are connected to specific through holes 61T2C and 61T2D formed in the dielectric layer 261, respectively. In FIG. 40, a plurality of circles represent a plurality of through holes. Furthermore, in the dielectric layers 261-267, adjacent through holes are connected to each other vertically.

[0137] The specific through holes 61T2C and 61T2D formed in the dielectric layer 267 are connected to conductor layers 681A and 681B (see FIG. 22) formed on the pattern formation surface of the dielectric layer 168, respectively. The multiple through holes (excluding the specific through holes 61T2C and 61T2D) formed in the dielectric layer 267 are connected to a conductor layer 1681 (see FIG. 22) formed on the pattern formation surface of the dielectric layer 168.

[0138] The main body 150 in this embodiment is configured by laminating a first dielectric layer 151 (see FIG. 15), second to seventeenth dielectric layers 252 to 267, and eighteenth to fifty-fifth dielectric layers 168 to 205 (see FIGS. 22 to 32). The main body 150 in this embodiment also includes a first portion 3501 instead of the first portion 1501 in the second embodiment. The first portion 3501 is a portion of the main body 150 that includes the dielectric layers 151, 252 to 267. FIG. 42 shows the inside of the first portion 3501.

[0139] The line 13 of the first filter 301A is formed by a conductor layer 601C. The conductor layer 601C is connected to the conductor layer 511A (see FIG. 15) that constitutes the first port 3A of the first filter 301A via a specific through-hole 51T1A (see FIG. 15), a conductor layer 521C, and specific through-holes 52T1C and 53T1C. The conductor layer 601C is also connected to the conductor layer 681A (see FIG. 22) that constitutes the second port 4A of the first filter 301A via specific through-holes 60T2C and 61T2C.

[0140] In the first filter 301A, the conductor portion L1 of the path 5 is formed by a through-hole array T1C consisting of specific through-holes 52T1C and 53T1C. The conductor portion L2 of the path 5 is formed by a through-hole array T2C consisting of specific through-holes 60T2C and 61T2C.

[0141] The line 13 of the second filter 301B is formed by a conductor layer 601D. The conductor layer 601D is connected to the conductor layer 511B (see FIG. 15) that constitutes the first port 3B of the second filter 301B via a specific through-hole 51T1B (see FIG. 15), a conductor layer 521D, and specific through-holes 52T1D and 53T1D. The conductor layer 601D is also connected to the conductor layer 681B (see FIG. 22) that constitutes the second port 4B of the second filter 301B via specific through-holes 60T2D and 61T2C.

[0142] In the second filter 301B, the conductor portion L1 of the path 5 is formed by a through-hole row T1D consisting of specific through-holes 52T1D and 53T1D. The conductor portion L2 of the path 5 is formed by a through-hole row T2D consisting of specific through-holes 60T2D and 61T2D.

[0143] In this embodiment, the first and second filters 301A and 301B each function as a band elimination filter.

[0144] Other configurations, actions, and effects of this embodiment are the same as those of the second embodiment.

[0145] The present invention is not limited to the above-described embodiments, and various modifications are possible. For example, the number of cavity resonators may be one, or may be three or more. [Explanation of symbols]

[0146] 1...filter, 3...first port, 4...second port, 5...path, 10...circuit portion, 11, 12...resonator, 21, 22...cavity resonator, 50...main body, 50A...bottom surface, 50B...top surface, 50C to 50F...side surfaces, 51 to 68...dielectric layers.

Claims

1. a first port; a second port; and a path connecting the first port and the second port; a circuit portion provided on the path; and at least one cavity resonator coupled to the path from outside the path in terms of circuit configuration; A filter, wherein the coupling between the at least one cavity resonator and the path includes magnetic coupling.

2. A first port; a second port; and a path connecting the first port and the second port; a circuit portion provided on the path; and at least one cavity resonator coupled to the path from outside the path in terms of circuit configuration; A filter characterized in that the resonant mode of the at least one cavity resonator is a TE011 mode.

3. 3. The filter according to claim 1, wherein the at least one cavity resonator is formed by a conductor surrounding a three-dimensional region and a dielectric material present in the region.

4. 4. A filter according to claim 1, wherein said at least one cavity resonator constitutes a band elimination filter.

5. the path includes a conductor portion disposed within the at least one cavity resonator and extending in one direction; the conductor portion is located at a position displaced from the center of gravity of the at least one cavity resonator when viewed from the one direction, 5. A filter according to claim 1, wherein said at least one cavity resonator is coupled to said conductor portion.

6. 6. A filter according to claim 1, wherein the at least one cavity resonator is a plurality of cavity resonators.

7. 7. The filter according to claim 6, wherein the plurality of cavity resonators includes a first cavity resonator coupled to the path between the first port and the circuit portion, and a second cavity resonator coupled to the path between the second port and the circuit portion.

8. 8. A filter according to claim 1, wherein the circuit portion is a band-pass filter.

9. 8. The filter according to claim 1, wherein the circuit portion is a line.

10. further comprising a body for integrating the first port, the second port, the path, the circuit portion, and the at least one cavity resonator; 10. A filter according to any preceding claim, wherein the body has a first surface and a second surface facing in opposite directions.

11. A filter as described in claim 10, characterized in that in at least one cavity resonator, the dimension in a direction perpendicular to the first surface is smaller than the dimension in a direction parallel to the first surface.

12. the first port is disposed on the first surface; 12. The filter according to claim 10, wherein the second port is disposed at a position different from the first surface in a direction perpendicular to the first surface.

13. 12. The filter according to claim 10, wherein the first port and the second port are disposed on the first surface.

14. A filter according to any one of claims 1 to 12; an antenna connected to the second port.

Images