Imprinting apparatus, imprinting method and article manufacturing method

Abstract

To provide an advantageous technique for forming a pattern of imprint material on a board.SOLUTION: An imprint apparatus for forming a pattern of an imprint material in each of a plurality of shot regions of a board by using a mold includes a mold holding unit that holds the mold, a deformation unit that deforms the pattern surface by adjusting the pressure in a closed space defined between the mold holding unit and a surface of the mold on an opposite side to the pattern surface in a state where the mold is held in the mold holding unit, and a control unit that controls the shape of the pattern surface by adjusting the pressure in the closed space according to the position of a shot region using the deformation unit so that the shape of the pattern surface follows the surface shape of the shot region when the pattern is formed in each of the plurality of shot regions.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to an imprint apparatus, an imprint method, and a method for manufacturing an article. [Background technology]

[0002] An imprinting apparatus forms a pattern on a substrate by bringing a mold on which a pattern has been formed into contact with an imprinting material on a substrate, hardening the imprinting material, and then separating the mold from the hardened imprinting material (see Patent Document 1). Patent Document 1 discloses that when the mold and the imprinting material on a substrate are brought into contact, the fluid pressure of the imprinting material present between the mold and the substrate causes the mold (surface shape) to follow the unevenness (surface shape) of the substrate, resulting in a uniform thickness of the imprinting material on the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5543502 Summary of the Invention [Problem to be solved by the invention]

[0004] A substrate to be processed in an imprint apparatus may be deformed into a concave or convex shape overall (as the entire substrate) due to film stress during the manufacturing process. In the imprint apparatus, a substrate holder holds (fixes) the substrate so that the substrate is flat, but the outer periphery of the substrate may not be held sufficiently, leaving the substrate (itself) in its original shape. In addition, the substrate holder may intentionally hold the substrate so that it has a predetermined concave or convex shape. Even in such cases, the imprint apparatus must perform an imprint process on the substrate held by the substrate holder, using a mold to form a pattern of imprint material on the substrate.

[0005] For example, consider a case where the outer periphery of the substrate is a range of 3 mm inward from the outer edge, and this outer periphery is not held by the substrate holder and hangs down under its own weight (the substrate as a whole is deformed into a convex shape). In this case, if an imprint process is performed using a mold with a field of view (pattern surface) of 30 mm x 30 mm, it will not be possible to apply sufficient force to the outer periphery of the substrate, resulting in a defective pattern being formed on the substrate.

[0006] Patent Document 1 discloses that the fluid pressure of the imprinting material can be used to make the mold conform to localized irregularities in the substrate. However, the present inventors have found that the fluid pressure of the imprinting material has limitations in making the mold conform to the surface shape of the substrate in units of the angle of view (pattern surface).

[0007] The present invention has been made in view of the above problems of the conventional technology, and has an exemplary object to provide a technology that is advantageous for forming a pattern of an imprint material on a substrate. [Means for solving the problem]

[0008] In order to achieve the above object, one aspect of the present invention is an imprinting apparatus that forms a pattern of an imprint material in each of a plurality of shot areas of a substrate using a mold, and includes a mold holding unit that holds the mold, and a device that adjusts the pressure in a closed space defined between the mold holding unit and a surface of the mold opposite to a pattern surface thereof when the mold is held by the mold holding unit, thereby forming the pattern surface. Transform a deformation unit that deforms the shot areas when forming the pattern in each of the plurality of shot areas; ,before a control unit that controls the shape of the pattern surface by adjusting the pressure in the closed space according to the position of the shot area using the deformation unit so that the shape of the pattern surface follows the surface shape of the shot area. death , the control unit controls the shape of the pattern surface by adjusting the pressure in the closed space with the deformation unit, for a shot area that is located on the outer periphery of the substrate and includes a non-facing area that does not face the holding surface when the substrate is held by the substrate holding unit, so that the shape of the pattern surface follows the curvature that occurs in the non-facing area when the substrate is held by the substrate holding unit. It is characterized by:

[0009] Further objects and other aspects of the present invention will become apparent from the following description of the embodiments with reference to the accompanying drawings. [Effects of the Invention]

[0010] According to the present invention, for example, it is possible to provide a technique that is advantageous for forming a pattern of an imprint material on a substrate. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a schematic diagram showing the configuration of an imprint apparatus according to one aspect of the present invention. [Figure 2] FIG. 2 is a diagram showing an example of a specific configuration of a mold driving unit. [Figure 3] FIG. 2 is a diagram showing an arrangement of a plurality of shot areas on a substrate. [Figure 4] 10A and 10B are diagrams for explaining changes in pressure in an air chamber during imprint processing on a full shot region in a comparative example. [Figure 5] 10A and 10B are diagrams for explaining changes in pressure in an air chamber during imprint processing on a partial shot region in a comparative example. [Figure 6] FIG. 10 is a diagram for explaining the transition of the pressure in the air chamber during the imprint process on the partial shot area in the first embodiment. [Figure 7] 10 is a diagram showing an example of sensitivity information indicating the sensitivity of deformation of the pattern surface of the mold to the pressure value of the air chamber. FIG. [Figure 8] FIG. 10 is a diagram for explaining the transition of the pressure in the air chamber during the imprint process on the full shot region in the second embodiment. [Figure 9] 1A to 1C are diagrams for explaining a method for manufacturing an article. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0013] FIG. 1 is a schematic diagram showing the configuration of an imprint apparatus IMP according to one aspect of the present invention. The imprint apparatus IMP is a lithography apparatus employed in a lithography process, which is a manufacturing process for devices such as semiconductor elements, liquid crystal display elements, and magnetic storage media, for forming a pattern on a substrate. The imprint apparatus IMP forms a pattern of the imprint material on the substrate by using a mold to shape an imprint material (viscous material) on the substrate. In this embodiment, the imprint apparatus IMP brings the mold into contact with the imprint material placed (supplied) on the substrate, and applies energy for curing to the imprint material, thereby forming a pattern in a cured material to which the pattern of the mold has been transferred.

[0014] The imprint material is a material (curable composition) that hardens when curing energy is applied. The curing energy may be electromagnetic waves, heat, or the like. Electromagnetic waves include, for example, light having a wavelength selected from the range of 10 nm to 1 mm, specifically infrared rays, visible light, ultraviolet rays, and the like.

[0015] The curable composition is a composition that cures upon irradiation with light or heat. The photocurable composition that cures upon irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent, as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, a polymer component, and the like.

[0016] The imprint material may be applied to the substrate in the form of a film using a spin coater or a slit coater. Alternatively, the imprint material may be applied to the substrate in the form of droplets, or in the form of islands or a film formed by connecting multiple droplets using a liquid jet head. The viscosity of the imprint material (at 25°C) is, for example, 1 mPa·s or more and 100 mPa·s or less.

[0017] The substrate may be made of glass, ceramics, metal, semiconductor, resin, etc., and may have a member made of a material different from the substrate formed on its surface as needed. Specifically, the substrate may be made of a silicon wafer, a compound semiconductor wafer, quartz glass, etc.

[0018] In this specification and the accompanying drawings, directions are indicated in an XYZ coordinate system, with the XY plane representing a direction parallel to the surface of the substrate (the surface on which the substrate is placed). The directions parallel to the X, Y, and Z axes in the XYZ coordinate system are the X direction, Y direction, and Z direction, respectively, and rotation around the X axis, Y axis, and Z axis are referred to as θX, θY, and θZ, respectively. Control or drive about the X, Y, and Z axes refers to control or drive about a direction parallel to the X axis, a direction parallel to the Y axis, and a direction parallel to the Z axis, respectively. Control or drive about the θX, θY, and θZ axes refers to control or drive about a rotation around an axis parallel to the X axis, a rotation around an axis parallel to the Y axis, and a rotation around an axis parallel to the Z axis, respectively. Position is information determined based on coordinates of the X, Y, and Z axes, and orientation is information determined by values ​​of the θX, θY, and θZ axes. Positioning means controlling (correcting or changing) the position and / or attitude. Alignment includes controlling (correcting or changing) the position, attitude and / or shape of at least one of the substrate and mold.

[0019] 1, the imprint apparatus IMP has a substrate holding unit 12, a substrate driving unit 13 that drives the substrate holding unit 12 (substrate 11), and a position measurement unit 4 that measures the position (position in the X and Y directions) of the substrate 11 held by the substrate holding unit 12. The substrate holding unit 12 holds the substrate 11 on a substrate holding surface 12A. In this embodiment, the size (area) of the substrate holding surface 12A is configured to be smaller than the size (area) of the substrate 11. Therefore, the substrate 11 is held by the substrate holding unit 12 with its outer periphery (for example, the outermost peripheral region 3 mm inward from the outer edge of the substrate 11) projecting outward from the substrate holding surface 12A.

[0020] The imprint apparatus IMP also has a mold holding unit 9 that holds the mold 10, and a mold driving unit 8 that drives the mold holding unit 9 (mold 10). The mold 10 includes a pattern surface 16 on which a pattern to be transferred to the substrate 11 is formed.

[0021] The substrate driving unit 13 and the mold driving unit 8 constitute a driving mechanism that drives at least one of the substrate 11 and the mold 10 about six axes, namely the X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis, so as to adjust the relative position and / or attitude of the substrate 11 and the mold 10 (pattern surface 16 thereof). Adjustment of the relative position of the substrate 11 and the mold 10 by such a driving mechanism includes driving to bring the imprint material on the substrate into contact with the mold 10 (pressing the mold 10 against the imprint material on the substrate), and driving to separate the mold 10 from the hardened imprint material on the substrate.

[0022] The substrate driving unit 13 drives the substrate holding unit 12 to drive the substrate 11 about multiple axes (e.g., three axes: X-axis, Y-axis, and θZ-axis, preferably six axes: X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis). The mold driving unit 8 drives the mold holding unit 9 to drive the mold 10 about multiple axes (e.g., three axes: Z-axis, θX-axis, and θY-axis, preferably six axes: X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis).

[0023] FIG. 2 is a diagram showing an example of a specific configuration of the mold driving unit 8. As shown in FIG. 2, the mold driving unit 8 includes three driving systems Z1, Z2, and Z3 that drive the mold holding unit 9 in the Z direction. The driving systems Z1, Z2, and Z3 are configured, for example, with actuators that can be driven independently in the Z direction. Each of the driving systems Z1, Z2, and Z3 includes a sensor that detects the position in the Z direction and the force acting in the Z direction, and is driven under the control of the control unit 1 based on the output (detection result) of the sensor. This makes it possible to control (adjust) the position and posture of the mold 10 and the force applied to the mold 10.

[0024] For example, drive systems Z1 and Z2 drive (push) the mold holding unit 9 toward the substrate (-Z direction), and drive system Z3 drives the mold holding unit 9 toward the opposite side of the substrate 11 (+Z direction), thereby tilting the mold 10 held by the mold holding unit 9 in the +X direction. In this way, drive systems Z1, Z2, and Z3 (mold driving unit 8) can control the tilt (attitude) of the mold 10 (pattern surface 16 thereof), and realize, for example, attitude control of the mold 10 according to the tilt and / or shape (in-plane shape) of the substrate 11.

[0025] As shown in FIG. 1, the imprint apparatus IMP further includes a deformation unit 14, a light source 5, a beam splitter 6, a relay optical system 7, a mold measurement unit 2, a substrate measurement unit 3, and a control unit 1.

[0026] The deformation unit 14 has the function of deforming the mold 10 held by the mold holding unit 9, particularly the pattern surface 16 of the mold 10, into a convex shape toward the substrate 11 side or a concave shape toward the substrate 11 side. The deformation unit 14 deforms the pattern surface 16 of the mold 10 by applying a force to the surface (back surface) opposite to the pattern surface 16 of the mold 10 (the surface on which the pattern is formed).

[0027] In this embodiment, the deformation unit 14 includes a pressure adjustment mechanism that adjusts the pressure of an air chamber 15 defined (formed) between the back surface of the mold 10 (a recess provided therein) and the mold holding unit 9 when the mold 10 is held by the mold holding unit 9. The air chamber 15 is a closed space also called a cavity or a core-out, and is configured as a cylindrical recess structure that covers the pattern surface 16. The mold holding unit 9 may include a sealing member such as seal glass on the back surface side of the mold 10 to define the air chamber 15. Adjusting the pressure of the air chamber 15 corresponds to adjusting the force applied to the back surface (recess) of the mold 10, so adjusting the pressure of the air chamber 15 can deform the pattern surface 16 of the mold 10 held by the mold holding unit 9. For example, adjusting the pressure of the air chamber 15 to a pressure higher than atmospheric pressure can deform the pattern surface 16 of the mold 10 into a convex shape toward the substrate side. In this way, the deformation section 14 continuously deforms the pattern surface 16 of the mold 10 into a convex or concave shape toward the substrate side by adjusting the pressure in the air chamber 15 to a positive or negative pressure relative to the external pressure (atmospheric pressure) surrounding the air chamber 15.

[0028] The light source 5, the beam splitter 6, and the relay optical system 7 function as a curing unit that applies energy for curing to the imprint material on the substrate to cure the imprint material. The light source 5 irradiates the imprint material on the substrate with light (e.g., ultraviolet light) via the beam splitter 6 and the relay optical system 7, thereby curing the imprint material.

[0029] The mold measurement unit 2 has a function of acquiring (measuring) the shape of the surface of the mold 10, specifically, the pattern surface 16 of the mold 10. In this embodiment, the mold measurement unit 2 includes a sensor that is provided below the mold 10 and is capable of measuring distance, and acquires the shape of the pattern surface 16 by measuring the heights (distances to the multiple positions) at multiple positions on the pattern surface 16 of the mold 10.

[0030] The substrate measurement unit 3 has a function of acquiring (measuring) the shape of the surface of the substrate 11. In this embodiment, the substrate measurement unit 3 includes a sensor that is provided above the substrate 11 and is capable of measuring distance, and acquires the shape of the surface of the substrate 11 by measuring the heights at multiple positions on the surface of the substrate 11 (the distances to the multiple positions).

[0031] The control unit 1 is configured as an information processing device (computer) including a CPU, memory, etc. The control unit 1 comprehensively controls each unit of the imprint apparatus IMP to operate the imprint apparatus IMP in accordance with a program stored in the storage unit. The control unit 1 controls the imprint process that uses a mold 10 to form a pattern made of a cured product of an imprint material on a substrate.

[0032] The imprint apparatus IMP may also have a dispenser (not shown) that places (supplies) the imprint material on the substrate. The dispenser places the imprint material on each shot area of ​​the substrate 11, for example, by ejecting (droplets of) the imprint material onto each shot area of ​​the substrate 11. The dispenser may place the imprint material on each individual shot area out of the multiple shot areas of the substrate 11, or may place the imprint material on several shot areas at once. Instead of the imprint apparatus IMP having a dispenser, the substrate 11 on which the imprint material has been placed by an external apparatus (such as a spin coater) separate from the imprint apparatus IMP may be carried into the imprint apparatus IMP.

[0033] The imprint process performed in the imprint apparatus IMP under the control of the control unit 1 will be described.

[0034] First, the substrate driving unit 13 drives the substrate holding unit 12 holding the substrate 11 so that the shot area where the imprint material is placed is positioned below the mold 10. Then, the mold driving unit 8 drives the mold holding unit 9 holding the mold 10 toward the substrate 11 (in the -Z direction), thereby bringing the mold 10 into contact with the imprint material on the shot area of ​​the substrate 11 (sandwiching the imprint material between the mold 10 and the substrate 11). This process from driving the substrate 11 below the mold 10 to bringing the mold 10 into contact with the imprint material on the substrate is referred to as the contact (liquid contact) process.

[0035] In this embodiment, when the imprint material on the substrate is brought into contact with the mold 10, the mold holding unit 9 is driven toward the substrate 11, but instead of driving the mold holding unit 9, the substrate holding unit 12 may be driven toward the mold 10 (in the +Z direction). Also, the imprint material on the substrate may be brought into contact with the mold 10 by driving both the mold holding unit 9 and the substrate holding unit 12 relatively.

[0036] In the contact step, the deformation unit 14 adjusts the pressure in the air chamber 15 defined between the back surface of the mold 10 and the mold holding unit 9, thereby deforming the pattern surface 16 of the mold 10 into a convex shape toward the substrate 11. As a result, when the pattern surface 16 of the mold 10 is brought into contact with the imprint material on the substrate, gas present between the mold 10 (pattern surface 16) and the substrate 11 is pushed outward, reducing the gas that enters the imprint material on the substrate (air bubbles mixed in the imprint material).

[0037] In the contact step, for the partial shot region of the substrate 11, the deformation unit 14 may adjust the pressure of the air chamber 15 defined between the back surface of the mold 10 and the mold holding unit 9 to deform the pattern surface 16 of the mold 10 into a concave shape toward the substrate 11. In other words, for the partial shot region of the substrate 11, the deformation unit 14 may deform the pattern surface 16 of the mold 10 into a convex shape toward the mold holding unit 9. In this embodiment, an example will be described in which the pattern surface 16 of the mold 10 is deformed into a convex shape toward the substrate 11, but the same concept applies to the case in which the pattern surface 16 of the mold 10 is deformed into a concave shape toward the substrate 11. The partial shot region is also called a missing shot region, and is a shot region that includes the outer edge of the substrate 11 and has an area smaller than the area of ​​the pattern surface 16 of the mold 10.

[0038] Furthermore, in this embodiment, the convex and concave shapes on the mold 10 or the pattern surface 16 of the mold 10 refer to the shapes (two-dimensional curves) that are deformed by the deformation section 14, and do not refer to the shape (convex and concave) of the pattern formed on the pattern surface 16.

[0039] Once the mold 10 has been brought into contact with the imprint material on the substrate, the mold drive unit 8 continues to drive the mold holding unit 9 holding the mold 10 toward the substrate 11 (in the -Z direction) in order to spread the imprint material over the entire pattern surface 16 of the mold 10 (to expand the contact surface between the mold 10 and the imprint material). Such driving may be performed by position control based on the distance between the mold 10 and the substrate 11, or by force control based on the force acting on the mold 10.

[0040] The imprinting apparatus IMP forms a pattern of the imprinting material on the substrate by sandwiching the imprinting material between the pattern surface 16 of the mold 10 and the substrate 11. Therefore, after the mold 10 is brought into contact with the imprinting material on the substrate, the deformation unit 14 adjusts the pressure in the air chamber 15 and the mold driving unit 8 drives the mold holding unit 9 simultaneously until the imprinting material spreads over the entire pattern surface 16 of the mold 10. The process from bringing the mold 10 into contact with the imprinting material on the substrate to spreading the imprinting material over the entire pattern surface 16 of the mold 10 is referred to as the imprinting process.

[0041] Once the imprint material on the substrate has spread over the entire pattern surface 16 of the mold 10, the mold 10 (pattern surface 16) and the substrate 11 (shot area) are aligned, and the imprint material is filled into the pattern surface 16 of the mold 10. At this time, the shape of the deformation of the pattern surface 16 of the mold 10 by the deformation unit 14 is determined from the perspective of improving alignment accuracy. The process from spreading the imprint material over the entire pattern surface 16 of the mold 10 to applying energy for curing to the imprint material is called the filling process.

[0042] Once the mold 10 and the substrate 11 are aligned and the imprint material is filled onto the pattern surface 16 of the mold 10, the curing unit applies curing energy to the imprint material between the pattern surface 16 of the mold 10 and the substrate 11 to harden the imprint material. This process of hardening the imprint material filled onto the pattern surface 16 of the mold 10 (the imprint material on the substrate) is referred to as the curing (exposure) process.

[0043] Once the imprint material on the substrate has hardened, the mold holding unit 9 holding the mold 10 is driven by the mold driving unit 8 to the opposite side (+Z direction) of the substrate 11, thereby separating the mold 10 from the hardened imprint material on the substrate. This forms a pattern made of the cured imprint material on the shot area of ​​the substrate 11. The process from hardening the imprint material on the substrate to separating the mold 10 is referred to as the mold releasing process.

[0044] The imprint process, which includes the contacting step, imprinting step, filling step, curing step, and demolding step, is sequentially performed on each of the multiple shot areas of the substrate 11. After the imprint process has been performed on all of the shot areas of the substrate 11, the substrate 11 is carried out from the imprint apparatus IMP (substrate holding part 12).

[0045] <Comparative Example> Here, as a comparative example, we will explain the transition of the pressure in the air chamber 15, which is adjusted by the deformation unit 14 under the control of the control unit 1, during the contact step, imprinting step, and filling step of a typical imprint process. The multiple shot areas on the substrate 11 are basically classified into two types, and as shown in Figure 3, they include a full shot area 21 having the same area as the area of ​​the pattern surface 16 of the mold 10, and the partial shot area 22 as described above. First, with reference to Figures 4(a) to 4(d), we will explain the transition of the pressure in the air chamber 15 during a typical imprint process (contact step, imprinting step, and filling step) for the full shot area 21.

[0046] FIG. 4(a) shows a schematic diagram and a graph illustrating the state of the mold 10 and the pressure of the air chamber 15 during the contact step. In the graph shown in FIG. 4(a), the vertical axis represents the pressure (pressure value) of the air chamber 15, and the horizontal axis represents time. During the contact step, the mold 10 (pattern surface 16 thereof) is positioned facing the substrate 11 or aligned (adjusted for alignment). The pressure in the air chamber 15 is adjusted by the deformation unit 14 to a positive pressure relative to atmospheric pressure, specifically, to the maximum pressure that prevents the mold 10 from falling off the mold holding unit 9, in order to prevent gas (air) from entering between the mold 10 and the substrate 11.

[0047] FIG. 4(b) shows a schematic diagram and a graph illustrating the state of the mold 10 and the pressure in the air chamber 15 during the imprinting process. In the graph shown in FIG. 4(b), the vertical axis represents the pressure (pressure value) in the air chamber 15, and the horizontal axis represents time. During the imprinting process, the pressure in the air chamber 15 is maintained by the deformation unit 14 at the high pressure (positive pressure relative to atmospheric pressure) adjusted during the contacting process, specifically, at the maximum pressure. Furthermore, the imprinting material is spread on the pattern surface 16 by controlling the drive amount of the mold driver 8 toward the substrate 11 (in the -Z direction) (the pressing of the mold 10 against the imprinting material on the substrate).

[0048] FIG. 4(c) shows, as a schematic diagram and a graph, the state of the mold 10 and the pressure of the air chamber 15 during the transition from the imprinting process to the filling process. In the graph shown in FIG. 4(c), the vertical axis represents the pressure (pressure value) of the air chamber 15, and the horizontal axis represents time. During the transition from the imprinting process to the filling process, it is necessary to spread the imprint material over the entire pattern surface 16 of the mold 10 and to shape the mold 10 (pattern surface 16) into a shape (convex or concave) adjusted for alignment with the substrate 11. Therefore, the pressure in the air chamber 15 is reduced from a high pressure (maximum pressure) by the deformation unit 14 and adjusted toward atmospheric pressure.

[0049] 4(d) is a schematic diagram and a graph showing the state of the mold 10 and the pressure of the air chamber 15 during the filling step. In the graph shown in FIG. 4(d), the vertical axis represents the pressure (pressure value) of the air chamber 15, and the horizontal axis represents time. During the filling step, the pressure of the air chamber 15 is adjusted by the deformation unit 14 to become atmospheric pressure or to maintain atmospheric pressure, in order to minimize the positional deviation (relative position) between the pattern surface 16 of the mold 10 and the substrate 11.

[0050] Next, with reference to FIGS. 5(a) to 5(d), the transition of the pressure in the air chamber 15 during a general imprint process (contact step, imprinting step, and filling step) on the partial shot area 22 will be described.

[0051] As described above, the substrate holding part 12 holds the substrate 11 on the substrate holding surface 12A, which is smaller than the size of the substrate 11. Therefore, as shown in FIG. 5(a), the outer periphery of the substrate 11 is not held by the substrate holding part 12 (i.e., does not face the substrate holding surface 12A) and hangs down toward the substrate holding part 12 (in the -Z direction), causing it to curve (deform). Furthermore, because deformation such as warping may occur in the entire substrate due to film stress in the device manufacturing process, the curvature that occurs in the outer periphery of the substrate 11 is not limited to hanging down. In this way, when the substrate 11 is held by the substrate holding part 12, the region of the substrate 11 that does not face the substrate holding surface 12A and is not held by the substrate holding surface 12A and thus is curved is referred to below as the non-facing region NFR.

[0052] 5(a), 5(b), and 5(c) are schematic diagrams and graphs respectively showing the state of the mold 10 and the pressure of the air chamber 15 during the contacting step, the imprinting step, the transition from the imprinting step to the filling step, and the filling step. The state of the mold 10 and the pressure of the air chamber 15 during the contacting step, the imprinting step, the transition from the imprinting step to the filling step, and the filling step are similar to those shown in FIGS. 4(a), 4(b), and 4(c) (full shot region 21), and therefore detailed description thereof will be omitted here.

[0053] FIG. 5(d) shows a schematic diagram and a graph illustrating the state of the mold 10 and the pressure in the air chamber 15 during the filling process. As described above, during the filling process, the pressure in the air chamber 15 is adjusted by the deformation unit 14 to be atmospheric pressure or to maintain atmospheric pressure in order to minimize misalignment between the pattern surface 16 of the mold 10 and the substrate 11, i.e., from the perspective of alignment accuracy. However, in the partial shot region 22, as shown in FIG. 5(d), there is an area in the non-facing region NFR where the pattern of the mold 10 cannot be properly transferred to the imprint material on the substrate. This is because the curvature of the curve (secondary shape of the droop) occurring in the non-facing region NFR of the substrate 11 is significantly larger than the curvature of the shape of the pattern surface 16 deformed by the deformation unit 14 from the perspective of alignment accuracy. In such a case, the shape of the pattern surface 16 of the mold 10 does not follow the surface shape of the non-facing region NFR of the substrate 11, resulting in an area where the imprint material cannot be sandwiched between the pattern surface 16 of the mold 10 and the substrate 11. In such an area, the pattern surface 16 of the mold 10 is not in contact with the imprint material, and therefore the pattern of the mold 10 cannot be transferred to the imprint material.

[0054] As described above, in a typical imprint process for the partial shot region 22, particularly in the filling step, sufficient consideration is not given to the curvature (sagging) that occurs in the non-facing region NFR of the substrate 11. Therefore, it is not possible to form a pattern made of a cured product of the imprint material to which the pattern of the mold 10 has been transferred over the entire partial shot region 22.

[0055] Therefore, in this embodiment, during the imprinting process, particularly the filling process, the shape of the pattern surface 16 of the mold 10 is controlled by adjusting the pressure of the air chamber 15 according to the position of the shot area using the deformation unit 14 so that the shape of the pattern surface 16 follows the surface shape of each shot area.

[0056] <First Example> As a first example, we will explain the transition of the pressure in the air chamber 15, which is adjusted by the deformation unit 14 under the control of the control unit 1, during the contact step, imprinting step, and filling step of the imprinting process of this embodiment. Here, we will explain the transition of the pressure in the air chamber 15 during the imprinting process (contact step, imprinting step, and filling step) of this embodiment for the partial shot area 22, with reference to Figures 6(a) to 6(d).

[0057] 6(a), 6(b), and 6(c) are schematic diagrams and graphs respectively showing the state of the mold 10 and the pressure of the air chamber 15 during the contacting step, the imprinting step, the transition from the imprinting step to the filling step, and the filling step. In this example, the state of the mold 10 and the pressure of the air chamber 15 during the contacting step, the imprinting step, the transition from the imprinting step to the filling step, and the filling step are similar to those in the comparative example (FIGS. 5(a), 5(b), and 5(c)), and therefore detailed description thereof will be omitted here.

[0058] FIG. 6(d) is a schematic diagram and a graph showing the state of the mold 10 and the pressure of the air chamber 15 during the filling step. In this embodiment, during the filling step, the pressure of the air chamber 15 is adjusted by the deformation unit 14 so that the shape of the pattern surface 16 of the mold 10 follows the surface shape of the non-facing region NFR of the substrate 11 (the curvature (secondary drooping shape) occurring in the non-facing region NFR). Specifically, when the curvature occurring in the non-facing region NFR of the substrate 11 is a secondary drooping shape, the pressure of the air chamber 15 is adjusted by the deformation unit 14 to a negative pressure relative to atmospheric pressure, thereby controlling the shape of the pattern surface 16 of the mold 10 to be concave toward the substrate 11. As a result, the shape of the pattern surface 16 of the mold 10 follows the surface shape (curvature) of the non-facing region NFR of the substrate 11, and the entire pattern surface 16 of the mold 10 comes into contact with the imprint material (the imprint material is sandwiched between the pattern surface 16 of the mold 10 and the substrate 11). Therefore, in this embodiment, a pattern made of a cured product of the imprint material to which the pattern of the mold 10 has been transferred can be formed over the entire partial shot region 22 .

[0059] In this embodiment, since the curvature occurring in the non-facing region NFR of the substrate 11 is a secondary shape with a drooping shape, the shape of the pattern surface 16 of the mold 10 is controlled in the filling step so that the pattern surface 16 has a concave shape toward the substrate 11. However, as described above, the curvature occurring in the non-facing region NFR of the substrate 11 may have a secondary shape with an upward warp due to film stress during the manufacturing process. In such a case, the pressure in the air chamber 15 can be adjusted by the deformation unit 14 to a positive pressure relative to atmospheric pressure, thereby controlling the shape of the pattern surface 16 of the mold 10 to have a convex shape toward the substrate 11. For example, the pressure in the air chamber 15 can be reduced from the pressure in the air chamber 15 in the imprinting step to atmospheric pressure.

[0060] Furthermore, the surface shape of each of the multiple shot areas (full shot area 21 and partial shot area 22) of the substrate 11 can be acquired by the substrate measurement unit 3. In this way, the substrate measurement unit 3 functions as an acquisition unit that acquires shape information related to the surface shape of each of the multiple shot areas of the substrate 11. Therefore, based on the shape information acquired by the substrate measurement unit 3, the shape of the pattern surface 16 can be controlled by adjusting the pressure in the air chamber 15 using the deformation unit 14 so that the shape of the pattern surface 16 of the mold 10 matches the surface shape of the shot area. Note that it is preferable to acquire shape information for each substrate loaded into the imprint apparatus IMP.

[0061] The pressure value of the air chamber 15 required to match the shape of the pattern surface 16 of the mold 10 with the surface shape of each shot area of ​​the substrate 11 can be determined, for example, by trial and error (a method of matching actual objects). Specifically, in the filling step, the pressure (pressure value) of the air chamber 15 can be changed and the pressure value of the air chamber 15 can be determined from the viewpoint of the uniformity of the remaining film thickness (thickness of the imprint material) of the pattern formed on the substrate and the uniformity of the dimensions of the pattern formed on the substrate.

[0062] Alternatively, sensitivity information indicating the sensitivity of deformation of pattern surface 16 of mold 10 to the pressure value of air chamber 15 may be acquired in advance, and the pressure value of air chamber 15 required to make the shape of pattern surface 16 match the surface shape of each shot area of ​​substrate 11 may be determined based on this information. Specifically, the pressure value of air chamber 15 that minimizes the shape difference between the shape of pattern surface 16 of mold 10 and the surface shape of the shot area may be determined from the sensitivity information and the surface shape (shape information) of the shot area of ​​substrate 11 acquired by substrate measurement unit 3. Then, the pressure of air chamber 15 is adjusted by controlling deformation unit 14 so that the pressure of air chamber 15 becomes the determined pressure value.

[0063] Note that sensitivity information indicating the sensitivity of deformation of the pattern surface 16 of the mold 10 to the pressure value of the air chamber 15 can be obtained in advance, for example, by measuring (changes in) the shape of the pattern surface 16 of the mold 10 with the mold measurement unit 2 while changing the pressure value of the air chamber 15. FIG. 7 is a diagram showing an example of sensitivity information indicating the sensitivity of deformation of the pattern surface 16 of the mold 10 to the pressure value of the air chamber 15. In FIG. 7, the vertical axis represents the curvature (deformation sensitivity) of the pattern surface 16 of the mold 10, and the horizontal axis represents the pressure value of the air chamber 15. Because sensitivity information differs depending on individual differences in the mold 10, it is preferable to obtain the information in advance for each mold used in the imprint apparatus IMP, as shown in FIG.

[0064] Furthermore, before the substrate 11 is carried into the imprint apparatus IMP, the shape (shape information) of each shot area of ​​the substrate 11 may be acquired in advance using an apparatus other than the substrate measurement unit 3, for example, an atomic force microscope (AFM). In such cases, the pressure value of the air chamber 15 required to make the shape of the pattern surface 16 match the surface shape of each shot area of ​​the substrate 11 may be determined based on the shape of each shot area of ​​the substrate 11 acquired by such an apparatus.

[0065] <Second Example> As a second example, the transition of the pressure in the air chamber 15, which is adjusted by the deformation unit 14 under the control of the control unit 1, will be described during the contact step, imprint step, and filling step of the imprinting process of this embodiment. Here, with reference to Figures 8(a) to 8(d), the transition of the pressure in the air chamber 15 during the imprinting process (contact step, imprinting step, and filling step) of this embodiment for the full shot region 21 will be described. Also, as shown in Figure 8(a), a recessed portion 12B is present on the substrate holding surface 12A of the substrate holding unit 12, and when the substrate holding unit 12 holds the substrate 11 on the substrate holding surface 12A, the surface shape of the region of the substrate 11 corresponding to the recessed portion 12B becomes a concave shape.

[0066] 8(a), 8(b), and 8(c) are schematic diagrams and graphs respectively showing the state of the mold 10 and the pressure of the air chamber 15 during the contacting step, the imprinting step, the transition from the imprinting step to the filling step, and the filling step. In this embodiment, the state of the mold 10 and the pressure of the air chamber 15 during the contacting step, the imprinting step, the transition from the imprinting step to the filling step, and the filling step are the same as in the first embodiment (FIGS. 6(a), 6(b), and 6(c)), and therefore detailed description thereof will be omitted here.

[0067] FIG. 8(d) shows a schematic diagram and a graph illustrating the state of the mold 10 and the pressure of the air chamber 15 during the filling process. In this embodiment, the recess 12B present on the substrate holding surface 12A causes a curve, specifically, a concave deformation, in the shot area (full shot area 21) of the substrate 11. Therefore, if the shape of the pattern surface 16 of the mold 10 is controlled by adjusting the pressure of the air chamber 15 from the perspective of alignment accuracy, as in the comparative example (FIG. 4(d)), the center of the pattern surface 16 will float. As a result, an area where the imprint material cannot be sandwiched between the pattern surface 16 of the mold 10 and the substrate 11 will be generated. Therefore, in this embodiment, the shape of the pattern surface 16 is controlled by adjusting the pressure of the air chamber 15 using the deformation unit 14 in the filling process so that the shape of the pattern surface 16 of the mold 10 follows the surface shape of the shot area of ​​the substrate 11, depending on the shape of the substrate holding surface 12A. For example, based on the shape of the substrate holding surface 12A, the surface shape of the shot region when the substrate 11 is held by the substrate holding unit 12 is predicted, and the pressure in the air chamber 15 is adjusted by the deformation unit 14 so that the shape of the pattern surface 16 matches the predicted surface shape of the shot region. Specifically, the pressure in the air chamber 15 is adjusted by the deformation unit 14 to a positive pressure relative to atmospheric pressure in accordance with the predicted surface shape (concave shape) of the shot region, thereby controlling the shape of the pattern surface 16 of the mold 10 to be a convex shape toward the substrate 11. As a result, the shape of the pattern surface 16 of the mold 10 follows the surface shape (curvature) of the shot region of the substrate 11, and the entire pattern surface 16 of the mold 10 comes into contact with the imprint material (the imprint material is sandwiched between the pattern surface 16 of the mold 10 and the substrate 11). Therefore, in this embodiment, a pattern made of a cured product of the imprint material to which the pattern of the mold 10 has been transferred can be formed over the entire partial shot region 22.

[0068] In this embodiment, the curvature occurring in the shot area of ​​the substrate 11 due to the shape of the substrate holding surface 12A is concave, and therefore, in the filling step, the shape of the pattern surface 16 of the mold 10 is controlled so that the pattern surface 16 has a convex shape toward the substrate 11. However, if the curvature occurring in the shot area of ​​the substrate 11 due to the shape of the substrate holding surface 12A is convex, then in the filling step, the shape of the pattern surface 16 of the mold 10 should be controlled so that the pattern surface 16 has a concave shape toward the substrate 11.

[0069] The shape (surface shape) of the substrate holding surface 12A of the substrate holding part 12 can be acquired by the substrate measuring part 3 by replacing the measurement object from the substrate 11 with the substrate holding surface 12A.

[0070] <Third Example> The pattern of the cured product formed using the imprinting apparatus IMP (imprinting method) of this embodiment is used permanently on at least a part of various articles, or temporarily when manufacturing various articles. Examples of articles include electrical circuit elements, optical elements, MEMS, recording elements, sensors, and molds. Examples of electrical circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGA. Examples of molds include molds for imprinting.

[0071] The pattern of the cured product may be used as it is as at least a part of a component of the above-mentioned article, or may be used temporarily as a resist mask, which is removed after etching or ion implantation is performed in a substrate processing step.

[0072] Next, a specific method for manufacturing the article will be described. As shown in Figure 9(a), a substrate such as a silicon wafer is prepared with a workpiece material such as an insulator formed on its surface. Next, an imprint material is applied to the surface of the workpiece by an inkjet method or the like. Here, the imprint material in the form of multiple droplets is shown applied to the substrate.

[0073] As shown in Figure 9(b), the imprinting mold is placed with the side on which the concave-convex pattern is formed facing the imprinting material on the substrate. As shown in Figure 9(c), the substrate on which the imprinting material has been applied is brought into contact with the mold, and pressure is applied. The imprinting material fills the gap between the mold and the workpiece. In this state, when light is irradiated through the mold as hardening energy, the imprinting material hardens.

[0074] As shown in Figure 9(d), after the imprint material is cured, the mold and substrate are separated, forming a pattern of the cured imprint material on the substrate. In this cured material pattern, the recesses of the mold correspond to the protrusions of the cured material, and vice versa. In other words, the recessed and protrusion patterns of the mold are transferred to the imprint material.

[0075] As shown in Figure 9(e), when etching is performed using the cured material pattern as an etching-resistant mask, the portions of the surface of the workpiece where no cured material is present or where only a thin layer remains are removed, forming grooves. As shown in Figure 9(f), when the cured material pattern is removed, an article with grooves formed on the surface of the workpiece can be obtained. Here, the cured material pattern was removed, but it may also be used as an interlayer insulating film included in semiconductor devices, i.e., a component of an article, without being removed after processing.

[0076] The disclosure of the present specification includes the following imprint apparatus, imprint method, and article manufacturing method.

[0077] (Item 1) An imprint apparatus that uses a mold to form a pattern of an imprint material in each of a plurality of shot areas of a substrate, a mold holding unit that holds the mold; a deformation unit that deforms the pattern surface by adjusting the pressure in a closed space defined between the mold holding unit and a surface of the mold opposite to the pattern surface when the mold is held by the mold holding unit; and a control unit that controls a shape of the pattern surface by adjusting a pressure in the closed space according to a position of the shot region, using the deformation unit, when forming the pattern in each of the plurality of shot regions, so that the shape of the pattern surface follows the surface shape of the shot region; and An imprinting apparatus comprising:

[0078] (Item 2) an acquisition unit that acquires shape information relating to the surface shape of each of the plurality of shot areas; the control unit controls the shape of the pattern surface by adjusting the pressure in the closed space using the deformation unit, based on the shape information acquired by the acquisition unit, so that the shape of the pattern surface matches the surface shape of the shot area. 2. The imprint apparatus according to claim 1,

[0079] (Item 3) The imprint apparatus described in item 2 is characterized in that the control unit determines the pressure value of the closed space required to match the shape of the pattern surface to the surface shape of the shot area based on sensitivity information indicating the sensitivity of the deformation of the pattern surface to the pressure value of the closed space, and controls the deformation unit so that the pressure in the closed space becomes the determined pressure value.

[0080] (Item 4) the control unit controls the shape of the pattern surface by adjusting the pressure in the closed space using the deformation unit, based on sensitivity information indicating sensitivity of deformation of the pattern surface to the pressure value in the closed space, so that the shape of the pattern surface coincides with the surface shape of the shot area. 2. The imprinting apparatus according to item 1,

[0081] (Item 5) The imprinting apparatus described in any one of items 1 to 4, characterized in that, in the process of filling the pattern surface with the imprinting material arranged in each of the multiple shot areas, the control unit controls the shape of the pattern surface by adjusting the pressure in the closed space using the deformation unit so that the shape of the pattern surface follows the surface shape of the shot area.

[0082] (Item 6) a substrate holding portion that holds the substrate on a holding surface; the size of the holding surface is smaller than the size of the substrate; the control unit controls the shape of the pattern surface by adjusting the pressure in the closed space with the deformation unit, for a shot area that is located on the outer periphery of the substrate and includes a non-facing area that does not face the holding surface when the substrate is held by the substrate holding unit, so that the shape of the pattern surface follows a curvature that occurs in the non-facing area when the substrate is held by the substrate holding unit. 6. The imprinting apparatus according to any one of items 1 to 5, wherein:

[0083] (Item 7) 7. The imprint apparatus according to item 6, wherein the shot area including the non-opposing area includes a partial shot area having an area smaller than an area of ​​the pattern surface.

[0084] (Item 8) a substrate holding portion that holds the substrate on a holding surface; when forming the pattern in each of the plurality of shot areas, the control unit controls the shape of the pattern surface by adjusting the pressure in the closed space using the deformation unit in accordance with the shape of the holding surface so that the shape of the pattern surface follows the surface shape of the shot area. 8. The imprinting apparatus according to any one of items 1 to 7, wherein:

[0085] (Item 9) The imprint apparatus described in item 8 is characterized in that the control unit predicts the surface shape of the shot area when the substrate is held by the substrate holding unit based on the shape of the holding surface, and controls the shape of the pattern surface by adjusting the pressure in the closed space using the deformation unit so that the shape of the pattern surface matches the predicted surface shape of the shot area.

[0086] (Item 10) The imprinting apparatus described in any one of items 1 to 9, characterized in that the deformation unit deforms the pattern surface by adjusting the pressure in the closed space to a positive pressure or a negative pressure relative to the external pressure around the closed space.

[0087] (Item 11) The imprinting apparatus described in any one of items 1 to 10, characterized in that the deformation unit continuously deforms the pattern surface so that the pattern surface becomes convex or concave toward the substrate.

[0088] (Item 12) An imprinting method for forming a pattern of an imprint material in each of a plurality of shot areas of a substrate using a mold, the method comprising: a step of deforming the pattern surface by adjusting a pressure in a closed space defined between the mold holding part and a surface of the mold opposite to the pattern surface while the mold is held by the mold holding part, In the step, when forming the pattern in each of the plurality of shot areas, the shape of the pattern surface is controlled by adjusting the pressure in the closed space according to the position of the shot area so that the shape of the pattern surface follows the surface shape of the shot area. An imprint method comprising:

[0089] (Item 13) Forming a pattern on a substrate using the imprint method according to item 12; processing the substrate on which the pattern has been formed in the process; manufacturing an article from the processed substrate; A method for manufacturing an article, comprising:

[0090] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0091] IMP: Imprinting device 1: Control unit 9: Mold holding unit 10: Mold 11: Substrate 12: Substrate holding unit 12A: Substrate holding surface 14: Deformation unit 15: Air chamber

Claims

1. An imprint apparatus that uses a mold to form a pattern of an imprint material in each of a plurality of shot areas of a substrate, a mold holding unit that holds the mold; a deformation unit that deforms the pattern surface by adjusting the pressure in a closed space defined between the mold holding unit and a surface of the mold opposite to the pattern surface when the mold is held by the mold holding unit; and a control unit that controls a shape of the pattern surface by adjusting a pressure in the closed space according to a position of the shot region, using the deformation unit, when forming the pattern in each of the plurality of shot regions, so that the shape of the pattern surface follows the surface shape of the shot region; and and a substrate holding portion that holds the substrate on a holding surface; the size of the holding surface is smaller than the size of the substrate; the control unit controls the shape of the pattern surface by adjusting the pressure in the closed space with the deformation unit, for a shot area that is located on the outer periphery of the substrate and includes a non-facing area that does not face the holding surface when the substrate is held by the substrate holding unit, so that the shape of the pattern surface follows a curvature that occurs in the non-facing area when the substrate is held by the substrate holding unit. An imprinting apparatus comprising:

2. 2. The imprint apparatus according to claim 1, wherein the shot area including the non-facing area includes a partial shot area having an area smaller than an area of ​​the pattern surface.

3. An imprinting method for forming a pattern of an imprint material in each of a plurality of shot areas of a substrate using a mold, the method comprising: holding the substrate on a holding surface of a substrate holding part having a holding surface smaller than the size of the substrate; a step of deforming the pattern surface by adjusting a pressure in a closed space defined between the mold holding part and a surface of the mold opposite to the pattern surface while the mold is held by the mold holding part, In the deformation step, when forming the pattern in each of the plurality of shot areas, for a shot area that is located on the outer periphery of the substrate and includes a non-facing area that does not face the holding surface when the substrate is held by the substrate holding section, the shape of the pattern surface is controlled by adjusting the pressure in the closed space according to the position of the shot area so that the shape of the pattern surface follows the curvature that occurs in the non-facing area when the substrate is held by the substrate holding section. An imprint method comprising:

4. forming a pattern on a substrate using the imprint method according to claim 3; processing the substrate on which the pattern has been formed in the process; manufacturing an article from the processed substrate; A method for manufacturing an article, comprising:

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