Connector frame units and connector frame strips for Chiclet

The frame strip with integrated contact springs and shielding elements addresses the challenge of achieving stable chiclet-PCB connections, providing robust and EMI-shielded connections that meet tight tolerances and reduce assembly errors.

JP7778200B2Active Publication Date: 2025-12-01TE CONNECTIVITY BELGIUM BV
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Patent Information

Application Number
JP2024160562
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2023-09-22
Filing Date
2024-09-18
Publication Date
2025-12-01
Estimated Expiration
2044-09-18

AI Technical Summary

Technical Problem

Chiclet connectors face challenges in achieving tight tolerances and stable electrical and physical connections to PCBs, leading to potential mechanical distortion and stress-induced failures, which can shorten the lifespan of components.

Method used

A frame strip comprising multiple connected frame units with features like conductive openings, contact springs, shielding elements, and standoffs to facilitate secure and electromagnetic interference (EMI)-shielded connections between chiclets and PCBs, ensuring precise alignment and reduced assembly errors.

Benefits of technology

The solution provides robust, EMI-shielded connections that meet tight mechanical and electrical tolerances, reducing assembly errors and extending the lifespan of components by distributing mechanical strain and ensuring reliable electrical contact.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a frame unit capable of rapidly placing variable numbers of components, such as chicklets and PCBs, to form devices of variable complexity.SOLUTION: A frame unit 710 includes at least one fixing member 750a that fixes the frame unit 710 to a PCB, and an opening 760 that accepts and holds a chicklet therein. The frame unit 710 accepts a chicklet such that electrical connections are formed between the chicklet and the PCB beneath the frame unit 710. The edge 770 of the opening 760 can flex and / or make conductive contact with the chicklet, and fixing members 755a, 755b, 755c, 755d can make electrical contact to the PCB. The frame unit 710 and a frame strip can facilitate chicklet placement within strict tolerances.SELECTED DRAWING: Figure 7
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Description

[Technical Field]

[0001] The present disclosure relates to electrical connectors and assemblies thereof. A connection assembly and printed circuit board (PCB) for, for example, chiclets, is described herein. [Background technology]

[0002] Electrical connectors between different electrical components are used in many devices. Disclosed herein are a frame unit for connecting chiclets to a PCB, and a frame strip comprising a plurality of frame units. The frame strip can be used to connect various numbers of chiclets to one or more PCBs.

[0003] Chiclet connectors can be used to make electrical connections to PCBs, for example, between PCBs and / or between surface-mounted devices (SMDs) and PCBs. Connection modules such as chiclets have tolerances for connecting to PCBs. Chiclet connectors with rigid housings, such as rigid metal housings to reduce electromagnetic interference (EMI), have tighter tolerances than more flexible connectors, such as connectors with softer housings. Making strong physical and / or electrical contact between chiclets and PCBs can be difficult, and the assembly process can be susceptible to stress-induced failure, such as when tolerances are not met. When making electrical and physical contact between chiclets and PCBs, there can be issues with mechanical distortion of joints, connections, and other components, which can shorten the lifespan of the components. Summary of the Invention [Problem to be solved by the invention]

[0004] Disclosed herein are frame units that can help meet tolerance requirements for the assembly of devices that utilize chiclets and PCBs. The frame units described herein can be used singly or in combination to hold one or more chiclets to a PCB.

[0005] Furthermore, the ability to quickly and flexibly form electrical devices of varying complexity and / or functionality is a key manufacturing challenge. A manufacturing process that can be flexibly adapted to produce various types of surface mount devices is desirable. Disclosed herein is a frame strip of multiple connected frame units that can be used to attach one or more chiclets to one or more PCBs. During manufacturing, it is desirable to be able to rapidly arrange various numbers of components, such as chiclets and PCBs, to form devices of varying complexity. [Means for solving the problem]

[0006] Described herein is a frame strip comprising a plurality of connected frame units. The frame units of the frame strip may be as described herein.

[0007] A frame unit configured to connect a chiclet to a PCB is disclosed, the frame unit including at least one fixing member configured to fix the frame unit to the PCB and an opening configured to receive the chiclet and to form an electrical connection between the chiclet and the PCB below the frame unit. The opening is configured to hold the chiclet therein. This configuration can function as an intermediate between the chiclet and the PCB, and thus can transmit some of the mechanical strain of the attachment between the chiclet and the PCB to the frame unit. Alternatively / in addition, the opening can function to guide the chiclet to the appropriate position, for example, to reduce assembly errors.

[0008] Each of the above frame units and frame strips can be further improved by one or more optional features as shown in the following embodiments, each of which is advantageous in itself and can be independently combined with other optional features.

[0009] The frame unit according to any of the embodiments described herein can be in conductive contact with the chiclet, for example, at least a portion of the edge of the opening can be in conductive contact with the chiclet. By making electrical contact, better electromagnetic shielding can occur. For example, good electrical contact can shield sensitive high-frequency signals passing through the chiclet. Alternatively / in addition, ground loops can be avoided.

[0010] The opening of any of the frame units described herein can be aligned with at least one PCB contact to electrically couple the PCB contact to at least one electrical connector of the chiclet. Alternatively / in addition, the opening is configured so that an electrical connection is formed between the electrical connector and the PCB below the opening of the frame unit, for example, directly below the opening. The location of the opening can help simplify the assembly process; for example, when the chiclet is inserted into the opening, the contact of the PCB can be (possibly directly) accessible. The frame unit can help guide the chiclet to the appropriate position, reducing assembly errors. Alternatively / in addition, the close contact of the chiclet with the PCB below (possibly directly below) the opening can help shield from electromagnetic interference (EMI).

[0011] At least a portion of the edge of the opening can optionally bend to hold the chiclet. The flexible edge can inhibit the transfer of mechanical strain to the chiclet. Alternatively / in addition, the flexible edge can provide a variable contact force for holding the chiclet, e.g., a contact force that tends to hold the chiclet in a desired position, e.g., on a PCB contact. Alternatively / in addition, as described above, at least a portion of the edge can electromagnetically shield signals passing through the chiclet and / or at least one PCB contact. For example, it may be desirable to provide multiple capabilities, such as providing electrical contact, EMI shielding, and / or mechanical retention of the chiclet / PCB assembly.

[0012] The frame unit may include at least one contact spring at an edge of the opening for holding the chiclet and / or making electrical contact with the chiclet, the contact spring effectively holding the chiclet, for example, for alignment between a PCB contact and a chiclet terminal.

[0013] The frame unit may include at least one shielding element extending above the bottom of the edge of the opening. Additional EMI shielding, particularly near the junction of the frame unit and the chiclet, may be desirable, for example, to avoid signal crosstalk between conductors on the PCB and / or the chiclet. At least one contact spring may extend above the at least one shielding element (790). A very long contact spring may facilitate easier adjustment of the contact force, for example, because the stiffness of the contact spring can be adjusted with its length to provide a contact force within acceptable tolerances (e.g., greater than a minimum to provide sufficient retention force, but less than a maximum to avoid breakage). Multiple contact springs and shielding elements may be present, and the contact springs and shielding elements may alternate along the edge.

[0014] Multiple contact springs can help distribute the contact force along the length of the opening and / or the length of the chiclet. High local stresses can be avoided in the frame unit and / or the chiclet. Multiple shielding elements can help provide sufficient spatial shielding as needed, for example, to avoid EMI. Having alternating shielding elements and contact springs can balance their respective effects, for example, more evenly distributing the contact force while providing good spatial protection from EMI.

[0015] The opening can have a minor axis and a major axis, and the contact spring can be along the major axis. Having the contact spring along the major axis can distribute the contact force more evenly along the longer axis, for example, to distribute stress more evenly. Alternatively / additionally, distributing the contact force can more reliably secure the chiclet in place, for example, for alignment with a PCB, and can reduce assembly errors.

[0016] A fastening member according to any of the embodiments described herein may include one or more standoffs extending below the frame unit. The standoffs may be solderable and / or weldable to form a connection, such as an electrical connection with a PCB. Having a connection between the standoffs at the bottom of the frame unit and the PCB can help meet tight mechanical tolerances (e.g., positioning the frame opening relative to the PCB) and / or provide a more robust electrical connection between the frame unit and the PCB (e.g., to reduce ground loops and / or EMI). The standoffs can provide a uniform distance between the bottom of the frame unit and the PCB, which can aid in the alignment and positioning of the chiclets relative to the PCB. Tight positional tolerances are more easily met and / or assembly errors are reduced.

[0017] Any of the fixing members described herein may include a guide element extending below the frame unit. The guide unit may fit into a hole in the PCB. The guide element may help accurately position the frame unit relative to the PCB. Optionally, the guide element includes at least one chamfered edge configured to contact the hole in the PCB to fix the frame unit to the PCB. The guide element may help hold the frame unit relative to the PCB.

[0018] The materials of the frame units and frame strips described herein may include solderable and / or weldable materials. The materials may help provide an electromechanical connection with the PCB. The materials may include at least one of beryllium copper, tin-coated metals, such as tin-coated copper, tin-coated stainless steel, or tin-coated copper alloys, such as tin-coated copper alloy 10. Beryllium copper may have desirable elastic properties, such as for flexing to hold chiclets. The tin coating may help provide a weldable / solderable surface. Copper is also desirable for its low resistivity and / or thermal conductivity, which may reduce unwanted heating.

[0019] The frame strips described herein can include a groove between two adjacent frame units. The groove can separate the two adjacent frame units. For example, it may be desirable to have a frame strip that can separate individual adjacent frame units or groups of adjacent frame units for flexible manufacturing of devices with various numbers of chiclet connections.

[0020] The frame strips described herein can include a first rail and a second rail on opposing edges of each opening in the frame unit. A plurality of frame members connect the first rail and the second rail, and the frame members are aligned with the major axis of each opening. The frame members can include edges of the openings. The rails can be aligned with the minor axis of the openings, and multiple frame units can be connected side-by-side along the length of the rails of the frame strip. The openings of adjacent frame units can be separated by frame members. The rails and frame members can provide rigidity and / or continuity with the frame strip.

[0021] The frame strip herein has a securing member extending below at least one of the first rail and the second rail or frame member. The contact springs and / or shielding elements extend above the frame members. Extending the contact springs and / or shielding elements upward on the opposite side of the frame strip from the securing member allows for a shorter distance between the PCB and the frame strip and / or chiclets. This can help meet positional tolerances for connecting the chiclets to the PCB and / or reduce EMI.

[0022] Disclosed herein is a connection assembly comprising a PCB and at least one chiclet electrically connected to at least one PCB contact of the PCB and held by at least one respective frame unit. The frame units described herein can, for example, help meet tolerance requirements for attaching the chiclet to the PCB.

[0023] The following description and examples are provided with reference to the drawings. The embodiments are described such that features of one embodiment can be combined with other embodiments. For example, a given feature described in one embodiment but not specified in another embodiment can be incorporated into an embodiment that does not specify the given feature. Furthermore, the description herein explicitly or implicitly refers to optional features that may be omitted from an embodiment, such as when the technical effect of the optional feature is not important for a particular application. [Brief explanation of the drawings]

[0024] [Figure 1] FIG. 1 illustrates a frame strip according to an embodiment. [Figure 2] 1 illustrates a frame strip, chiclets, and a PCB according to an embodiment. [Figure 3] 1 illustrates a frame strip, chiclets, and a PCB according to an embodiment. [Figure 4] 1 illustrates a frame strip and a PCB according to an embodiment. [Figure 5] 1 illustrates a frame strip and a PCB according to an embodiment. [Figure 6] FIG. 1 is a schematic diagram of a portion of a PCB according to an embodiment. [Figure 7] FIG. 2 illustrates a frame unit according to an embodiment. [Figure 8] FIG. 1 illustrates a portion of a frame strip on a PCB, according to an embodiment. [Figure 9] 10A-10C illustrate a portion of a frame strip holding chiclets on a PCB, according to an embodiment. [Figure 10] FIG. 10 is a diagram illustrating a portion of an edge of a frame unit according to an embodiment. [Figure 11] FIG. 10 is a diagram illustrating a portion of an edge of a frame unit according to an embodiment. [Figure 12] 10A-10C illustrate guide elements according to an embodiment. [Figure 13]1 illustrates a portion of a frame strip according to an embodiment. [Figure 14] 1 illustrates a chiclet according to an embodiment. [Figure 15] 1 illustrates a connection assembly according to an embodiment. [Figure 16] 1 illustrates a connection assembly according to an embodiment. [Figure 17] FIG. 1 illustrates a frame strip according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0025] 1 illustrates a frame strip according to an embodiment. The frame strip 100 can include one or more frame units 110a, 110b, and 110c, each including a respective opening 160a, 160b, and 160c. The frame strip 100 can include fastening members 150a, 150b, and 150c that can attach the frame strip 100 or at least one of the frame units 110a to a PCB.

[0026] Figure 2 shows a frame strip 200 attached to a PCB 230, according to an embodiment. A chiclet 220 is shown in Figure 2 to schematically illustrate alignment of the chiclet with respect to the frame strip 200, such as during assembly. Each of the openings 160a, 160b, 160c in the frame strip 200 is capable of holding a chiclet 220 therein and is appropriately sized to allow for insertion and / or retention of the chiclet.

[0027] FIG. 3 illustrates an assembled frame strip, chiclets, and PCB according to an embodiment. The frame strip 201 attached to the PCB 230 can accommodate one or more chiclets 222, with each chiclet 222 being received in an opening 160a, 160b, or 160c in the frame strip 201. An electrical connection is formed between the chiclets 222 and the PCB beneath each of the frame units 110 of the frame strip 201. The electrical connection can be formed directly between each chiclet 222 and a respective portion of the PCB beneath each of the frame units 110a, 110b, or 110c. The electrical connection formed between each chiclet and the PCB can be directly beneath a respective opening 160a, 160b, or 160c in each of the frame units 110. Each chiclet can form one or more electrical connections with the PCB. The openings 160a, 160b, 160c are in a plane parallel to the PCB 230.

[0028] FIG. 4 is an exploded view of the frame strip 100 and PCB 230 according to an embodiment. FIG. 4 shows the PCB contacts 235 and PCB holes 237a, 237b. The openings 160a of the frame unit 110a are aligned with at least one respective PCB contact 235. The frame strip 100 can enable alignment of the openings 160a, 160b, 160c with each of the respective PCB contacts 235. Electrical coupling between the at least one PCB contact 235 and at least one electrical connector of each chiclet held by each opening 160a of the frame unit 110a is possible. The PCB 230 may include holes 237a, 237b that may mate with complementary features on the frame unit and / or frame strip to guide and / or secure the frame unit 110 and / or frame strip relative to the PCB. For example, the securing units 150a, 150b, 150c shown in FIG. 1 may be used to guide and / or secure the frame strip 100 relative to the PCB 230.

[0029] FIG. 5 shows a frame strip 200 attached to a PCB. Respective openings 160a, 160b, 160c are shown in each of one or more frame units 110a, 110b, 110c of the frame strip 200. FIG. 5 also shows PCB contacts 235a, 235b below opening 160a. When a chiclet (not shown) is held in each opening 160, the chiclet can make electrical contact with the PCB 230, for example, via PCB contacts 235a, 235b.

[0030] FIG. 6 shows a schematic of a portion of a PCB according to an embodiment. FIG. 6 shows a footprint 600 corresponding to a portion of a PCB in an area of ​​approximately two side-by-side frame units (corresponding to the areas of approximately two openings in each of the frame units). For ease of interpretation, the numbered features in FIG. 6 correspond to the area of ​​the first frame unit 110a on the right. Most of the reference numbers used in FIG. 6 refer to features corresponding to one frame unit having one opening. Each frame unit of the frame strip may be aligned with a complementary area of ​​the PCB, e.g., an area directly below each opening in each frame unit, to contact each chiclet held in the respective opening.

[0031] FIG. 7 shows a frame unit according to an embodiment.

[0032] For example, the PCB shown in FIG. 6 can include holes 637a, 637b that can fit into respective guide elements 750a, 750b of the frame unit 710 and / or frame strip to, for example, guide and / or secure the frame unit and / or frame strip relative to the PCB. For example, each frame unit can include two fastening members (such as guide elements 750a, 750b) at diagonal corners that can be inserted into corresponding holes 637a, 637b in the PCB. FIG. 6 also shows two more holes 637c, 637d for fastening a second frame unit, for example, a second frame unit of a frame strip of at least two frame units.

[0033] Instead of or in addition to the one or more holes 637a, 637b, the PCB may also include complementary features for connecting to features on the underside of the frame unit and / or frame strip. One or more pads 650a, 650b, 650c, 650d, 651a, 651b, 651c, 651d may be aligned with complementary features on the frame unit 710.

[0034] For example, the frame units and / or frame strips may include weldable and / or solderable materials and may be welded and / or soldered to the PCB, for example, via pads. The frame units and / or frame strips may, in some cases, be formed from stamped metal, which may reduce manufacturing costs. A monolithic frame unit and / or frame strip may, for example, reduce manufacturing costs; for example, the stamped metal may be coated (e.g., with tin) before or after stamping. Metals such as beryllium copper, tin-coated metals, for example, tin-coated copper, tin-coated stainless steel, or tin-coated copper alloys, such as tin-coated copper 10 alloy or tin-coated beryllium copper, may be used for the frame units and / or frame strips. The metal frame unit and / or frame strips can also help make conductive contact between the frame and the PCB, and between the frame and the chiclets. Beryllium copper can be useful for its elastic properties, for example, for use as contact springs to hold the chiclets in their respective openings.

[0035] The PCB contacts 635a, 635b, 635c can include those for making electrical contact with the chiclet, e.g., PCB contacts 635a, 635b, 635c on the surface of the PCB contact complementary contacts on the chiclet. For example, one or more of the PCB contacts 635a, 635b, 635c can be signal contacts that connect to corresponding connectors on the chiclet to transmit signals. One or more of the PCB contacts 634a, 634b, 634c, 636a, 6346, 636c can contact a conductive housing on the chiclet.

[0036] Each opening 160 of the frame unit 110 may be configured to align with one or more respective PCB contacts 635a, 635b, 635c, 634a, 634b, 634c, 636a, 636b, 636c for a chiclet, for example, such that PCB contacts 634a, 634b, 634c, 636a, 636b, 636c, 635a, 635b, 635c are beneath respective openings 160a of the frame unit 110a. The openings 160 are aligned to allow for electrical coupling between at least one PCB contact and at least one electrical connector of the chiclet.

[0037] Alternatively / in addition, the openings can help guide the chiclet to corresponding electrical contacts on the PCB, particularly during assembly. Alternatively / in addition, the openings that hold the chiclet can provide structural support for assembly of the chiclet and the PCB. The openings 160 can be configured such that an electrical connection is formed between the chiclet's electrical connector and the PCB below the openings 160 in the frame unit 110 (such a connection can be a direct connection). The connection with the PCB can be formed directly below the openings. By forming the connection directly below the chiclet, the chiclet's conductive housing can help electromagnetically shield the connection from the surrounding environment. Alternatively / in addition, manufacturing can be simplified, for example, the chiclet can be inserted into the opening and contacted to the PCB with fewer assembly operations.

[0038] The frame unit 710 has an opening 760 for holding a chiclet. The frame unit 710 connects the chiclet and the PCB. At least one fastening member 755a, 755b, 755c, 755d can fasten the frame unit 710 to the PCB. For example, the bottom surface of the frame unit is attached to the PCB using at least one fastening member 755a, 755b, 755c, 755d. The fastening member can protrude downward toward the PCB. The fastening member can be weldable and / or solderable to the PCB via a complementary feature on the PCB, such as a pad. The fastening member can form a connection, such as an electrical connection, between the frame unit 710 and the PCB. Having multiple electrical connections can avoid EMI, ground loops, and / or provide a stronger electrical connection between the frame unit 710 and the PCB, and between the frame strip and the PCB.

[0039] Alternatively or additionally, at least one of the fixing members 755a, 755b, 755c, and 755d can act as a standoff extending below the frame. The standoff can provide a uniform distance between the frame unit and the PCB. Providing a uniform distance can help meet tight mechanical and / or electrical tolerances between the chiclet and the PCB.

[0040] The opening 760 of the frame unit 710 can be surrounded by at least one edge 770 of the frame unit 710. The edge 770 can completely surround the opening 760. The opening 760 configured to receive a chiclet can enable an electrical connection to be formed between the chiclet and a PCB underneath the frame unit (e.g., directly underneath the opening 760). For example, when a chiclet is held in the opening 760, at least a portion of the edge 770 of the opening 760 can make electrical contact with the chiclet. The electrical contact with the chiclet can help shield electromagnetic noise (EM noise), such as EM noise, between the connection between the PCB and the chiclet.

[0041] Edge 770, or at least a portion of edge 770, can bend to hold the chiclet. Alternatively / in addition, at least a portion of edge 770 of opening 760 can provide electromagnetic shielding. For example, edge 770, or a portion thereof, electromagnetically shields signals passing through the chiclet and / or at least one PCB contact. The bend can help hold the chiclet intact and / or can help make a low-resistance electrical connection.

[0042] FIG. 7 shows contact springs 780 at edges 770 of openings 760 in frame unit 710. Contact springs 780 can hold and / or make electrical contact with chiclets. Such functionality can help enable the assembly process to meet tight electrical and / or mechanical tolerances for making connections between chiclets and PCBs. Contact springs 780 can be more flexible than chiclets. The flex can help hold chiclets without damage and / or help make low-resistance electrical connections.

[0043] The contact spring 780 extends above the edge 770 of the opening. As used herein, "up" or the upward direction 713 is away from the downward direction 712, which is the direction toward the PCB. The bottom of the frame unit 710 can be connected to the PCB. The contact spring 780 can extend above 711 the edge 770 of the opening 760, and the guide elements 750a, 750b can extend in the downward direction 712. The contact spring 780 can have an upper portion 785 and a lower portion 782. The upper portion 785 and the lower portion 782 can form different angles with respect to the plane of the opening and / or the surface of the chiclet. The chiclet can be held at the edge 770 of the opening 760 (which can include above the edge 770 of the opening 760) by contact force from the edge 770 and / or the contact spring (780).

[0044] At least one of the upper portion 785 or lower portion 782 of the contact spring 780 can extend at an angle toward the area of ​​space directly above the opening 760. The angle of the upper portion 785 or lower portion 782 can be non-perpendicular to the plane of the PCB and / or the plane of the opening. The other of the upper portion 785 and lower portion 782 can present a surface that is approximately perpendicular to the opening 760 and can make good contact with the chiclet.

[0045] At least the angled portion of contact spring 780 can extend into a region of space directly above the opening, such as when no chiclet is present. For example, lower portion 782 can be angled to extend into a region of space directly above opening 760 when no chiclet is present, and when a chiclet is held in opening 760, lower portion 782 can bend away from opening 760 and / or upper portion 785 can make surface contact with the chiclet. The bending can provide sufficient contact force to hold the chiclet in opening 760, such as along edge 770. When a chiclet is held, contact spring 780 can extend directly upward and contact the chiclet directly above and / or flush with edge 770 of opening 760.

[0046] FIG. 7 also shows a shielding element 790. The frame unit 710 can include the shielding element 790. The shielding element can extend above the bottom of the edge 770 of the opening 760, for example, in a vertically upward direction 711. The shielding element 790 can be shaped to at least partially fill the space between the contact springs 780, for example, along the edge 770. The shielding element 790 can reduce electromagnetic interference of the chiclet and / or PCB signals. A shielding element 790 such as that shown in FIG. 7 can extend above the opening 760. As shown in FIG. 7, the contact springs 780 can extend to a height above the height of the shielding element 790. The shielding element 790 can have a surface that extends parallel to the surface of the chiclet. Alternatively / in addition, the surface of the shielding element 790 closest to the chiclet is perpendicular to the opening 760.

[0047] The upper portion 785 of the contact spring can help guide the chiclet into the opening 760 during assembly of the device. The upper portion 785 of the contact spring can extend further above the plane of the opening 760 than the shield element 790, for example, to help guide the insertion of the chiclet into the opening and / or to help guide the formation of a connection between the chiclet and a PCB.

[0048] The lower portion 782 and / or upper portion 785 of the contact spring 780 may, in some cases, aid in electromagnetic shielding, for example, in conjunction with a shielding element 790 .

[0049] The opening 760 can have a major axis 714 and a minor axis 713. The contact springs 780 and / or shield elements 790 can be aligned along the major axis 714 of the opening 760. The contact springs 780 and / or shield elements 790 can be positioned on either side of the opening 760 along respective opposing edges 770 of the opening 760. The contact springs can be positioned diametrically opposite each other across the opening 760 from the shield elements 790. This interleaving of the contact springs 780 and shield elements 790 can more evenly distribute stress from the spring contact forces and help extend the life of the electrical and mechanical connections.

[0050] The guide elements 750a, 750b can be inserted into holes in the PCB to, for example, aid in aligning the openings 760 with the PCB contacts. Alternatively / in addition, the guide elements 750a, 750b can include features, such as chamfered surfaces 752a, 752b, that help securely fasten the frame unit 710 to the PCB.

[0051] 8 illustrates a portion of a frame strip in a PCB, according to an embodiment. The portion illustrated in FIG. 8 may be exemplary of any of the frame strips described herein. A frame unit (e.g., of a frame strip described herein) may include a fixing member 150, such as a guide element 850a and / or a standoff 850b.

[0052] To aid in understanding, Figure 8 shows holes 837 in PCB 830. Guide elements 850a of frame strip 801 (part of which is shown in Figure 8) are inserted into holes 837.

[0053] FIG. 8 also shows standoffs 850b on the frame strip 801, which can extend below the frame strip 801. The standoffs 850b can be soldered and / or welded to the PCB, for example, to pads on the PCB. The standoffs can provide a uniform distance between the frame unit and / or frame strip and the PCB. Alternatively / in addition, the standoffs can provide a planar orientation of the openings 160 in the frame unit and / or frame strip 801, for example, an orientation parallel to the plane of the PCB. Having a fixed orientation of the plane of the frame unit and / or frame strip 801 can aid in the installation of the chiclets, considering that the connection between the PCB and the chiclets may have tight physical and / or electrical tolerances.

[0054] 8, two openings are partially visible, showing PCB contacts 834. The PCB contacts 834 may contact the chiclets, for example, to the chiclets' terminals, pins, and / or housings.

[0055] 8 shows grooves 840 that can be used to optionally separate one or more frame units from a frame strip. During device assembly, it can be convenient to use a strip of frame units (herein, frame strip) so that one or more frame units can be connected to a PCB at once, after which chiclets are inserted into respective openings in the frame units and connected to the PCB. The frame strip can comprise multiple connected frame units (which can be separable, for example, along respective grooves 840).

[0056] 8 shows a shield element 890 and a spring contact 880 (with optional upper and lower portions 885 and 882) along an edge 870 of an opening 860. There may be a gap 886 between adjacent shield elements and spring contacts. For example, there may be a gap (886) between the nearest adjacent shield element and contact spring, the gap being along the major axis of the edge of the opening and / or the major axis of the opening.

[0057] At least one gap 886 may be present along the edge 870 of the opening between adjacent lower portions 882 of the spring contacts 880 and each adjacent shield element 890. The gap 886 may allow flexing of the spring contacts 880, and thus, for example, the spring contacts 880 may require less force to insert a chiclet into the opening. The reduced force may minimize the risk of damage, such as cracking of the PCB, during assembly. The gap may be along the long axis of each edge 870, for example, to allow for even distribution of the contact force of the contact spring on each chiclet.

[0058] FIG. 9 illustrates a portion of a frame strip for a PCB and a chiclet. The illustrated portion of the frame strip and the exemplary interaction with a chiclet 920 illustrated in FIG. 9 may be exemplary of any of the frame strips described herein. Chiclet 920 may be held, for example, in each opening of a frame unit of the frame strip. Each opening can hold one chiclet, for example, via a contact force of the edge of the respective opening of the respective frame unit against the surface of the held chiclet. FIG. 9 illustrates an edge 970 of the opening that can bend to hold the chiclet 920. The bending edge 970, or a portion thereof, can bend reversibly, such that, for example, a contact force occurs between the edge 970, or a portion thereof, and the chiclet 920 and / or its surface 922.

[0059] 9 illustrates electrical and / or physical contact between contact spring 980 and chiclet 920. For example, a side 922 of chiclet 920 contacts contact spring 980, e.g., top 985 of contact spring 980. A bottom of chiclet 920 can make mechanical and / or electrical contact with a PCB, such as directly under an opening in a frame unit.

[0060] A lower portion 982 of the contact spring 980 may be angled toward the chiclet 920. The optional shield element 990 may also make electrical and / or physical contact with the chiclet 920, e.g., by contact between respective surfaces, including the side 922, of the chiclet 980. Contact with the chiclet 920 (and / or its surface 922) may be made along the edge 970 of the opening, e.g., along its longitudinal axis 714. The chiclet may make electrical and / or physical connection with the PCB 930, e.g., directly below the opening, e.g., optionally without any intervening material or mechanism other than solder, solder paste, solder flux, and / or flux, between the chiclet and the surface of the PCB below the chiclet.

[0061] An opening edge 970 of the frame unit (which may have two opposing long edges and two opposing short edges) may abut against the chiclet 920 on either side of the chiclet 920 along the opening long edge 970. Additionally, the top of the frame unit at the opening narrow edge may abut against the bottom of the chiclet 920 at the chiclet's short edge. The opening edge (970) may include a contact spring (980) and / or a shield element (990).

[0062] FIG. 10 shows a portion of an edge 1070 of a frame unit. The portion of the frame unit shown in FIG. 10 may be illustrative of any of the frame strips described herein. The edge 1070 may have a spring contact 1080 and / or a shield element 1090 along its length, e.g., along its long axis. The spring contact 1080 may include an upper portion 1085 and a lower portion 1082. The shield element 1090 may have a contact surface configured to contact the side 922 of a chiclet. Alternatively / in addition, the upper portion 1085 of the spring contact 1080 may have a surface for directly contacting the chiclet and / or a surface thereof (e.g., a side).

[0063] FIG. 11 shows a portion of an edge 1170 of a frame unit. The portion of the frame unit shown in FIG. 11 may be illustrative of any of the frame strips described herein. The bottom of the portion of the frame unit is shown. A downward direction 1112 toward the PCB is shown, as is an upward direction 1111. The edge 1117 may include a shielding element 1190 and / or a contact spring 1180. The bottom of the frame unit portion shows a type of fastening member 150 for fastening the frame unit and / or frame strip to the PCB. The fastening member may be for mechanical attachment (mechanical connection) and / or electrical connection.

[0064] The fixing members 150 of the frame units and / or frame strips described herein may include standoffs 1150, such as those shown in FIG. 11 . One or more standoffs 1150 may extend below the frame units and / or frame strips. The standoffs may be solderable and / or weldable to form connections (such as electrical connections with a PCB). The standoffs may provide a uniform distance between the frame units and the PCB. Alternatively / in addition, the standoffs may provide a uniform distance between the frame strips and the PCB.

[0065] FIG. 12 illustrates a guide element according to an embodiment. The guide element 1250 may be part of any of the frame units and / or frame strips described herein. The guide element 1250 may be insertable into a hole in a PCB and may function to guide the attachment of the frame unit and / or strip to the PCB. The guide element 1250 extends downwardly from the frame unit. The guide element may include at least one chamfered edge, such as edge 1252, that may make frictional contact with a hole in the PCB and help secure the frame unit to the PCB. The guide element 1250 may include a slot 1255 or the like, thereby reversibly reducing the radial dimension of the guide element 1250, for example, during insertion into a hole.

[0066] The tip of the guide element can have a cross-sectional area that increases from the bottom of the guide element 1250 upward to a point of maximum cross-sectional area. Above the point of maximum cross-sectional area, the cross-sectional area of ​​the guide element can decrease. This decrease can take the form of a chamfered edge 1252, such as that shown in FIG. 12.

[0067] The chamfered edge 1252 may be sized to press outward against the holes in the PCB, helping to secure the frame unit and / or frame strip to the PCB. Additionally, a shank portion 1251 may be present, which can help ensure a uniform distance between the PCB and the frame unit and / or frame strip. At least two of the chamfered edge 1252, shank portion 1251, and standoff 1150 described herein may act synergistically to ensure a uniform distance between the PCB and the frame unit. The standoff 1150, in combination with the size of the shank portion 1251 and the size and angle of the chamfered edge 1252, may be sized to provide a retention force that holds the PCB against the underside of the frame unit and / or frame strip.

[0068] FIG. 13 shows a groove between two adjacent frame units. The groove may be part of any of the frame strips described herein. FIG. 13 shows only a portion of a frame unit 1301. The groove 1300 may be positioned between two adjacent frame units 1301, for example, at the boundary between adjacent frame units of a frame strip. The groove 1300 may allow a frame unit to be easily separated from an adjacent frame unit or from the remainder of the frame strip. Alternatively, the groove 1300 may allow multiple frame units to be separated from the remainder of the frame strip. To facilitate reconfigurable manufacturing, it may be convenient to be able to separate any number of frame units from a frame strip, depending, for example, on the desired number of chiclets to be attached to a PCB.

[0069] The groove 1300 can have a long axis aligned with the long axis of the opening of an adjacent frame unit. The groove 1300 can include a through hole 1305 (e.g., in the form of a slot that can extend with its long axis aligned with the long axis of the groove 1300). Alternatively / in addition, the groove 1300 can include a partial cut 1307 in the material of the frame strip, for example along the outer edge of the frame unit. The groove 1300 can include a portion through the frame strip 1301, for example, a slot and a portion that forms a trench or partial cut 1307 in the frame strip 1301.

[0070] The inner edge of the frame unit opening may be configured to hold a chiclet, and the outer edge may be the location of a groove 1300 that allows separation from adjacent frame units.

[0071] The frame strip may include a groove 1300 between two adjacent frame units configured to separate the two adjacent frame units. The groove may extend in the direction of the long axis of the opening of the frame unit. The groove may include at least one through hole and / or at least one recess, such as the partial cut described above.

[0072] FIG. 14 shows a chiclet. A frame unit described herein can hold a chiclet such as the chiclet of FIG. 14. An up direction 1413 and a down direction 1412 are shown. The chiclet can have a metal housing, which can be, for example, a rigid housing 1401 that is more rigid than a plastic housing. The chiclet can have one or more connectors 1440 configured to connect to a PCB, for example, at the bottom, e.g., directly to the PCB. The frame unit described herein is configured to facilitate connecting the chiclet 1400 to the PCB at the bottom. The side 1420 of the chiclet can be metal. The housing of the chiclet can be metal. The metal can aid in EMI shielding. An additional connector 1445 can connect to other devices, such as another PCB, a surface mounted device, and / or another connector assembly. The additional connector 1445 can protrude from the narrow side. The narrow side connects to a larger side configured to receive contact force from an edge of an opening in the frame unit and / or a contact spring.

[0073] The side 1420 for receiving the contact is, for example, the largest side of the generally rectangular prism shape of the chiclet 1400. The frame units described herein may be configured to apply a contact force to the side 1420, particularly both sides, of the held chiclet 1400.

[0074] The chiclet may be configured to contact the PCB via its bottom side (the side of the chiclet facing the PCB). For example, two sides 1420 of the chiclet 1400 (the second side is at the rear in FIG. 15 ) are held by openings and / or contact springs in the frame unit (such as its edges). Between the sides 1420 of the chiclet 1400, a conductive element can connect a connector 1440 at the bottom of the chiclet to an additional connector 1445 on one of the narrow sides. The sides 1420 can provide EM shielding. The sides formed from metal can be contacted by conductive features of the frame unit, such as the edges of the openings and / or contact springs.

[0075] 15 illustrates a connection assembly according to an embodiment. The connection assembly 1500 can include a PCB 1530, at least one chiclet 1400, and at least one frame unit 110 that holds the at least one chiclet. The frame unit 110 can be any of the frame units described herein and can also be part of any of the frame strips described herein.

[0076] 16 shows a connector assembly. The connector assembly 1600 can include a PCB 1630 and at least one chiclet 1400 electrically connected to at least one PCB contact of the PCB 1630. Each chiclet can be held by a respective frame unit (e.g., any of the frame units described herein), such as a frame unit of a frame strip (e.g., any of the frame strips described herein).

[0077] FIG. 17 illustrates a frame strip according to an embodiment. The features described with respect to the frame strip 1700 of FIG. 17 may be part of any of the frame strips described herein. The frame strip 1700 includes an opening 1760, such as the opening of any of the frame units described herein. The frame strip 1700 may include a first rail 1710 and a second rail 1720 at opposing edges 1711, 1721 of each opening 1760 of the frame unit. The frame strip 1700 may include multiple frame members 1730 connecting the first rail 1710 and the second rail 1720, the frame members aligning with the major axis of each opening 1760. Each of the frame members 1730 can include an edge for holding a chiclet and, optionally, a groove as described herein. The frame strip 1700 can include a plurality of frame units, where the frame units are as described herein. The frame members 1730 can include an edge of an opening in the frame unit (possibly including a spring contact and / or a shield member) as described herein.

[0078] Herein, the frame unit may have a length of about 15 to 35 mm in the longitudinal direction and a length of 4 to 8 mm in the transverse direction. Herein, the opening of the frame unit may have a length along its major axis of 10 to 30 mm and a length along its minor axis of 2 to 5 mm. Herein, the frame member of the frame strip may have a width (in the direction of the minor axis of the opening) of 2 to 6 mm, for example, 3 to 5 mm. Herein, the rail of the frame strip may have a width (in the direction of the major axis of the opening) of 3 to 10 mm, or 4 to 8 mm, for example, about 5 to 6 mm.

[0079] Herein, the contact springs may be electrically conductive to form an electrical connection with, for example, a chiclet.

[0080] As used herein, "and / or" and " / " mean "and" or "or," for example, "weldable and / or solderable" means only weldable, only solderable, or both weldable and solderable. "Weldable and / or solderable" can also be expressed as "weldable / solderable."

[0081] As used herein, "above" can mean reaching a point higher than a reference point, for example, reaching a position away from the PCB in a direction perpendicular to the PCB surface. As used herein, "directly above" can mean reaching a point higher than a reference point along a line, for example, "directly above an opening" can mean reaching a position along a line perpendicular to both the opening and the PCB, on the opposite side of the opening from the PCB.

[0082] As used herein, the upward direction of a frame unit and / or frame strip is the direction perpendicular to the plane of the opening of the frame unit and / or frame strip. As used herein, the downward direction of a frame unit and / or frame strip is the direction perpendicular to the plane of the opening of the frame unit and / or frame strip.

[0083] The chiclets described herein can include metal housings, such as rigid metal housings, which can provide good electromagnetic shielding, particularly compared to similarly sized plastic housings. The chiclets herein can be contact modules for connecting electrical components, such as PCBs to other connectors, particularly surface-mounted device (SMD) connectors.

[0084] In this specification, a chiclet may be an electrical connector having a rigid metal housing. The chiclet may be for connecting high-frequency signal lines, such as between a PCB and another PCB or between a PCB and a surface-mounted device. In this specification, the described guide element may be considered, for example, a board lock for locking a frame unit to a PCB.

[0085] Rigid housings, particularly chiclet rigid housings, can have tighter tolerances than more flexible housings for alignment with a PCB, such as alignment with a complementary mounting structure of the PCB and / or alignment with a complementary electrical connector of the PCB. The need for larger tolerances can impact manufacturing error rates. The frame units and / or frame strips described herein can reduce manufacturing error rates, for example, by providing a mechanism for meeting required electrical and / or mechanical connection tolerances.

[0086] Below is a list of reference signs used in this specification, which are presented here as illustrative, non-limiting examples: [Explanation of symbols]

[0087] 100 Frame Strips 110a, 110b, 110c frame units 150a, 150b, 150c fixing members 160a, 160b, 160c opening 170a, 170b, 170c Edges of openings 200 Frame Strips 201 Frame Strip 220 Chiclet 222 Chiclet 230 PCB 235a, 235b PCB contacts 237a, 237b PCB holes 600 footprint 634a, 634b, 634c PCB Contacts to Housing 635a, 635b, 635c PCB Contacts 636a, 636b, 636c PCB Contacts to Housing 637a, 637b PCB holes 650 PCB complementary fixing member (pad for standoff) 651a, 651b, 651c Complementary fixing members for PCB 710 Frame Unit 711 Upper 712 Downward 713 Short axis 714 Long axis 750a, 750b Guide elements 752a, 752b chamfered edges 755a, 755b, 755c, 755d Fixing members 760 opening 770 Edge 780 Contact Spring 790 Shield Elements 801 Partial Frame Strip 830 PCB 837 PCB holes 840 Groove 850a Guide Element 850b standoff 860 opening 870 Edge 880 Spring Contact 882 Lower 885 upper 886 Gap 890 Shield Element 920 Chiclet 922 Surface 930 PCB 970 Edge 980 Contact Spring 982 Lower 985 Upper 990 Shield Element 1070 Edge 1080 Contact spring 1082 Lower 1085 upper part 1090 Shield Element 1111 top 1112 lower 1150 Standoff 1170 Edge 1180 Contact spring 1182 Lower 1185 upper 1190 Shield Element 1250 Guide Elements 1251 Shank 1252 Chamfered part 1253 Chamfered part 1255 slots 1300 Groove 1301 Adjacent frame unit 1305 Through hole 1307 Partial cut 1400 Chiclet 1401 Housing 1412 lower 1413 top 1420 Side 1440 Connector 1445 additional connectors 1500 Connector Assembly 1530 PCB 1600 Connector Assembly 1630 PCB 1650 plug 1700 Frame Strip 1710 First Rail 1711 First Edge 1720 Second Rail 1721 Second Edge 1730 Frame members 1760 opening

Claims

1. A frame unit (110, 710) configured to connect a chiclet (220) and a printed circuit board (PCB) (230), comprising: The frame unit (110, 710) - at least one fixing member (150) configured to fix said frame unit to said PCB (230); - an opening (160, 760) configured to receive a chiclet (220), wherein the opening (160, 760) is configured to form an electrical connection between the chiclet (220) and the PCB (230) below the frame unit (110, 710); Equipped with the opening is configured to hold the chiclet therein; the frame unit (110) is configured to make conductive contact with the chiclet (220), and at least a portion of an edge (170, 770) of the opening (160) is configured to make conductive contact with the chiclet; Frame unit (110, 710).

2. the opening (160) is configured to align with at least one PCB contact (235a, 235b) for electrically coupling the at least one PCB contact (235a, 235b) with at least one electrical connector (225) of the chiclet (220); and / or The opening (160) is configured so that an electrical connection is formed between the electrical connector (225) and the PCB (230) below the opening (160) of the frame unit (110). A frame unit (110, 710) according to claim 1.

3. At least a portion of the edge (170) of said opening (160, 760) is configured to flex to retain said chiclet (220); and / or at least a portion of the edge (170) of the opening (160) is configured to electromagnetically shield signals passing through the chiclet and / or the at least one PCB contact (235); A frame unit (110, 710) according to claim 2.

4. and further comprising at least one contact spring (780) at said edge (170, 770) of said opening for retaining said chiclet (220) and / or for making electrical contact with said chiclet. A frame unit (110, 710) according to claim 3.

5. at least one shield element (790) extending above a bottom of the edge (170, 770) of the opening (160, 760); the at least one contact spring (780) extends above the at least one shield element (790); the at least one contact spring (780) is a plurality of contact springs, the at least one shield element is a plurality of shield elements, and the contact springs and the shield elements are arranged alternately along the edge (170, 770); A frame unit (110, 710) according to claim 4.

6. the opening (160, 760) has a minor axis (713) and a major axis (714), and the at least one contact spring (780) is along the major axis; A frame unit (110, 710) according to claim 4.

7. the at least one fixing member (150) includes one or more standoffs (850b) extending below the frame unit (110, 710); the one or more standoffs are solderable and / or weldable to form an electrical connection with the PCB (230); Alternatively, the one or more standoffs (850b) are configured to provide a uniform distance between the frame unit (110, 710) and the PCB (230). A frame unit (110, 710) according to any one of claims 1 to 6.

8. the at least one fixing member (150) includes a guide element (750) extending below the frame unit; the guide element is configured to fit into a hole (237, 637f) of the PCB (230); the guide element includes at least one chamfered edge (752) configured to contact the hole in the PCB (230) to secure the frame unit to the PCB (230); A frame unit (110, 710) according to any one of claims 1 to 6.

9. the frame unit comprises a solderable and / or weldable material, the material comprising at least one of beryllium copper, tin-coated metal, and tin-coated copper alloy; A frame unit (110, 710) according to any one of claims 1 to 6.

10. A plurality of connected frame units (110, 710), Each frame unit is as defined in any one of claims 1 to 6. Frame strips (100, 200, 201, 1700).

11. further comprising a groove (1300) between two adjacent frame units (110, 710, 1301); 11. The frame strip (100, 200, 201, 1700) of claim 10, wherein the groove (1300) is configured to separate the two adjacent frame units.

12. - a first rail (1710) and a second rail (1720) on opposite edges (1711, 1721) of each of the openings (160, 760, 1760) of the frame units (110, 710); a plurality of frame members (1730) connecting the first rail and the second rail, the frame members being aligned with the longitudinal axes (714) of the respective openings; and Further provided with A frame strip (100, 200, 201, 1700) according to claim 10.

13. the at least one securing member (150) extends below at least one of the first rail (1710), the second rail (1720), or the frame member (1730); A frame strip (100, 200, 201, 1700) according to claim 12.

14. - PCB (230), at least one chiclet (220) electrically connected to at least one PCB contact (235, 634, 635, 636) of said PCB and held by at least one respective frame unit (110, 710) according to any one of claims 1 to 6, Connection assembly.

Citation Information

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