Electromagnetic interference (EMI) protection method for a high voltage connector assembly having a conductive outer housing with at least one conductive tab and containing a seal spring therein

Abstract

The present invention relates to a method of providing electromagnetic interference (EMI) protection to a high voltage connector assembly by employing a conductive outer housing having one or more conductive tabs, the conductive outer housing also housing a seal (seal spring), a second outer housing, and a conductive third outer housing, thereby reducing the effects of EMI. The tabs are formed with a conductive coating to provide an element or part of a grounding scheme for the connector assembly including the outer housing. The conductive tabs substantially contact the conductive third outer housing to complete the grounding scheme part of the connector assembly. The seal spring provides additional force, a greater force for a higher contact pressure with the third outer housing than would be the case without the seal spring, resulting in better electrical conductivity between the conductive tabs and the conductive third outer housing in use.

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This patent application claims priority to Provisional Patent Application No. 63 / 169,511, filed April 1, 2021, which is incorporated herein by reference in its entirety. [Background technology]

[0002] Electromagnetic interference (EMI) affects electrical circuits through electromagnetic induction, capacitive coupling, or conduction due to disturbances from external sources. EMI can degrade circuit performance or even cause the circuit to cease functioning. If the circuit includes a data path, EMI can affect the effectiveness of the data path by increasing error rates, leading to complete loss of data. Sources that can cause current and voltage changes that can cause EMI include, for example, automobile injectors and cellular networks in mobile phones. Therefore, it is essential to manage EMI generation in order to avoid the adverse effects caused by EMI and, as a result, maximize the effectiveness of electrical circuits that are otherwise susceptible to EMI.

[0003] Methods for avoiding or reducing the adverse effects of EMI include conduction and shielding. Conducted EMI protection is achieved by conducting EMI between conductive elements or conductors that are in physical contact, while shielding EMI protection is achieved by shielding radiated EMI through induction (i.e., the absence of physical contact between conductors). In high-voltage connector assemblies, conducted EMI is directed through the paths of adjacent conductive elements or conductors toward devices in series with or attached to, or mounted on, the connector assembly, or devices that function as ground.

[0004] Therefore, the structure or structural arrangement of the conductive outer housing used in the high-voltage connector assembly of the present invention preferably provides complete or substantial EMI coverage by using conductively coated tabs that provide contact pressure against the conductive third outer housing, which contacts and completes the grounding system within the completed high-voltage connector assembly. The conductive outer housing may also contain a seal (seal spring) that provides additional force against the conductive tabs, providing a higher contact pressure against the conductive third outer housing when used within the completed high-voltage connector assembly and when the completed high-voltage connector assembly is in use. The higher contact pressure results in better electrical conductivity between the conductive tabs and the conductive third outer housing during use. Summary of the Invention [Means for solving the problem]

[0005] The present invention relates to a method for reducing the effects of electromagnetic interference (EMI) by providing EMI protection to a high-voltage connector assembly employing a conductive outer housing having one or more conductive tabs within an internal cavity. The conductive outer housing, in use, can accommodate a seal (seal spring), a second outer housing, and a conductive third outer housing within its internal cavity. The conductive tabs of the conductive outer housing extend within the internal cavity of the conductive outer housing toward an opening in the conductive outer housing. The conductive outer housing also has a seal advancement stop for preventing further forward movement of the seal (seal spring) into the internal cavity. The seal (seal spring) interacts with the tab when the seal (seal spring) is inserted into the internal cavity, and applies a spring force to the conductive tab when the seal (seal spring) is fully inserted.

[0006] The conductive tab of the conductive outer housing is formed with a conductive coating to provide an element or portion of a grounding system for a connector assembly employing the conductive outer housing. When the outer housing is used in a completed high-voltage connector assembly, the conductive tab can substantially contact the conductive third outer housing to complete part of the connector assembly grounding system. This reduces the effects of electromagnetic interference (EMI) and aids in EMI suppression. If the conductive outer housing is provided with a seal spring, the seal spring provides a greater, additional force to increase contact pressure with the conductive third outer housing than would be possible without the seal spring.

[0007] For example, in an embodiment of the present invention in which at least one conductive tab of the conductive outer housing contacts, for example, a conductive third outer housing, generated EMI passes from the conductive outer housing to at least one of the conductive tabs and then into the conductive third outer housing. The EMI path goes directly from the conductive third outer housing to an additional connector grounding scheme (not shown) or conventional shielding (i.e., stamped shield, not shown) to ground. Alternatively, the reverse of the aforementioned path is also possible if the EMI flow path is in the opposite direction due to the location of the ground, grounding device, or grounding element. EMI can also pass through the connector grounding scheme (not shown) or conventional shielding (i.e., stamped shield), to the conductive third outer housing, to the conductive tabs 230a, 230b, to the conductive outer housing 200, to one of the wire shields (not shown), the connector grounding scheme (not shown), or conventional shielding (i.e., stamped shield), and then to ground. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 2 is an end perspective view of the conductive outer housing of the present invention. [Figure 2] 1 is a cross-sectional view of a conductive outer housing and a seal spring, the seal spring being within the conductive outer housing. [Figure 3] 1 is a cross-sectional view of a conductive outer housing having a seal spring inserted into a cavity of the conductive outer housing and a second outer housing installed thereon. [Figure 4] FIG. 1 is a cross-sectional view of a completed connector assembly having a conductive outer housing with a seal spring inserted and residing in a cavity of the conductive outer housing, a mounted second outer housing, and a mounted conductive third outer housing, illustrating an EMI path along the high voltage connector assembly. [Figure 5] 1 is a flowchart illustrating the path taken by EMI along a high voltage connector assembly employing a conductive outer housing having conductive tabs. DETAILED DESCRIPTION OF THE INVENTION

[0009] 1 shows a conductive outer housing 200 of a high voltage connector assembly. The conductive outer housing 200 has a body 206. One end of the body 206 is a first end 212 and an opposite end is a second end 222. The body 206 also has an internal cavity 204, the internal cavity 204 having a sidewall 214. The internal cavity 204 of the conductive outer housing 200 also has an opening 202 at the first end 212 of the conductive outer housing 200. The opening 202 leads to the internal cavity 204. The internal cavity 204 of the conductive outer housing 200 also has a seal advance stop 250 having a surface 252. The seal advance stop 250 includes a surface 252 extending along its length from the side wall 214 substantially perpendicular to the longitudinal direction of the conductive outer housing 200 (defined as the direction from the first end 212 to the second end 222, and vice versa). The seal advance stop 250 and its surface 252 are provided to interact with the seal spring 100 when the seal spring 100 is inserted into the internal cavity 204 and used with the conductive outer housing 200. The seal advance stop 250 is provided to prevent and stop the seal spring 100 from being inserted further forward into the internal cavity 204 toward the second end 222 (see FIGS. 2-4).

[0010] Preferably, the conductive outer housing 200 is constructed of a continuous, unitary structure or form without welding or brazing. Furthermore, the conductive outer housing 200 of the present invention is substantially a continuous, unitary structure throughout. No part or portion of the conductive outer housing 200 of the present invention is constructed of welded, soldered, or brazed parts or portions.

[0011] The conductive outer housing 200 is made of a conductive metal-infused material, a conductive metal-filled material, or the like, and the material may be plastic, resin, nylon, or a similar material that has similar properties during intended use. The conductive metal in the metal-infused or metal-filled material of the conductive outer housing 200 may be, for example, stainless steel or a metal with similar conductive properties. An example of a conductive metal-infused or conductive metal-filled material for the conductive outer housing 200 is stainless steel-filled resin or stainless steel-infused resin manufactured by RTP Corp.

[0012] Also shown in Figure 1 is a first conductive tab 230a of the conductive outer housing 200 and a second conductive tab 230b of the conductive outer housing 200. Each tab 230a, 230b is also preferably provided with a conductive coating for use in a grounding system, as will be described below. Figures 4 and 52). The conductive outer housing 200 may have a pair of first conductive tabs 230a as shown, but the number thereof is not limited thereto. The conductive outer housing 200 may have a pair of second conductive tabs 230b as shown, but the number thereof is not limited thereto. The first conductive tab 230a of the conductive outer housing 200 and the second conductive tab 230b of the conductive outer housing 200 extend into the internal cavity 204 and extend substantially perpendicularly from a rear wall 240 of the conductive outer housing 200. The rear wall 240 is within the internal cavity 204 and extends along its length from the side wall 214 of the internal cavity 204 of the conductive outer housing 200 substantially perpendicular to the longitudinal direction of the conductive outer housing 200 (defined as the direction from the first end 212 to the second end 222, and vice versa). The first conductive tab 230a and the second conductive tab 230b each have a tip 232a, 232b located at the end of each conductive tab 230a, 230b. The conductive tabs 230a, 230b extend toward the opening 202 within the internal cavity 204, with the tip 232a, 232b pointing substantially toward the opening 202 in the conductive outer housing 200. The opposite ends of the conductive tabs 230a, 230b are mounting ends 239a, 239b. The mounting ends 239a, 239b are the portions of the conductive tabs 230a, 230b that are attached to the rear wall 240 of the conductive outer housing 200. Each conductive tab 230a, 230b has a cantilever arm 238a, 238b, respectively. Cantilever arms 238a, 238b are formed along the length of conductive tabs 230a, 230b, and more specifically, by the portion of conductive tabs 230a, 230b between mounting ends 239a, 239b and tips 232a, 232b.

[0013] The first conductive tab 230a also has a beveled leading portion at 236a, and the second conductive tab 230b also has a beveled leading portion at 236b. Each of the beveled leading portions at 236a, 236b is beveled or tapered generally along its length toward the tip 232a, 232b, tapering in a direction relative to the longitudinal direction of the conductive outer housing 200 (defined as the direction from the first end 212 to the second end 222, or vice versa). Each of the beveled leading portions at 236a, 236b substantially faces the sidewall 214 of the internal cavity 204 of the conductive outer housing 200. The beveled leading portions at 236a, 236b of each of the first conductive tab 230a and the second conductive tab 230b are configured to contact the seal spring 100 in use, as described below.

[0014] The first conductive tab 230a also has a first surface 234a and a second surface 235a, and the second conductive tab 230b also has a first surface 234b and a second surface 235b. Each first surface 234a, 234b faces the interior cavity 204 of the conductive outer housing 200. Each first surface may face the other first surface 234a, 234b. As shown in FIG. 1 , along its length, the first surface 234a of the first conductive tab 230a substantially faces the opposite first surface 234b of the second conductive tab 230b, and vice versa. The second surfaces 235a, 235b face the sidewall 214 of the interior cavity 204 of the conductive outer housing 200.

[0015] 2 shows the conductive outer housing 200 with the seal spring 100 inserted therein. Here, the seal spring 100 is inserted into the conductive outer housing 200 with the first face 102 first toward the rear 222 of the conductive outer housing 200. The first face 102 and the first face surface 112 of the seal spring 100 may also abut against the advancement stop 250 and surface 252. The first and second conductive tabs 230a and 230b of the conductive outer housing 200 enter the internal aperture 108 of the seal spring 100 with their respective tips 232a and 232b first entering the internal aperture 108 of the seal spring 100 and making contact with the seal spring 100. Additionally, the inclined leading edge at 236a, 236b of each of the one or more conductive tabs 230a, 230b further contacts the inner sidewall 109 of the seal spring 100 as the seal spring 100 is further inserted into the conductive outer housing 200, as shown.

[0016] As shown in Fig. 3, the seal spring 100 may be inserted into a conductive outer housing 200, and the seal spring 100 is held within the conductive outer housing 200 by a second outer housing 300. The cavity of the conductive outer housing 200 and the seal spring 100 has a space into which a conductive third outer housing 400 may be inserted and accommodated, as shown in Fig. 4.

[0017] As described above, the conductive tabs 230a, 230b abut and contact the surface 110 of the interior sidewall 109 of the seal spring 100. More specifically, the conductive tabs 230a, 230b abut and contact the flared or angled portion of the interior sidewall 109. When the conductive tabs 230a, 230b enter the interior aperture 108 and contact the seal spring 100, the flared or angled portion of the interior sidewall 109 of the seal spring 100 compresses, causing the seal spring 100 to exert a spring-like force against the conductive tabs 230a, 230b. The conductive tabs 230a, 230b are press-fit and wedged into the interior surface 109 of the seal spring 100, as shown in FIG. 2 . The seal spring 100 can be further inserted into the conductive outer housing 200 and conductive tabs 230a, 230b, and when the second outer housing 300 and then the conductive third outer housing 400 are inserted (see FIGS. 3 and 4), they are further pressed into the inner surface 109 of the seal spring 100. In use, the seal spring 100 provides and exerts an appropriate spring force against the conductive tabs 230a, 230b, and applies the spring force by pushing itself outward against the tip portions 232a, 232b, the beveled leading portions at 236a, 236b, and the second surfaces 235a, 235b of the conductive tabs 230a, 230b. Additionally, the angle or taper of the inner sidewall 109 is such that when the conductive tabs 230a, 230b are in substantial contact with the inner sidewall surface 110 of the seal spring 100, the angled leading edges of the conductive tabs 230a, 230b at portions 236a, 236b reside above the flared or angled portion of the inner sidewall 109. The leading edges 232a, 232b of each conductive tab 230a, 230b may not substantially contact the first surface 102 of the seal spring 100 when inserted into the housing 200. When the seal spring 100 is inserted, the first surface 102 resides therein with the leading edges 232a, 232b, the angled leading edges at 236a, 236b, and the second surfaces 235a, 235b below. Additionally, the angle or taper of the inner sidewall 109 is such that the flared or angled portion of the inner sidewall 109 resides below the angled leading edge of the portions 236a, 236b of the respective conductive tabs 230a, 230b.Thus, the spring force of the seal spring 100 is exerted by the sloped or tapered portions of the inner sidewall 109 and applied to the conductive tabs 230, 230b. More specifically, the spring force is generally directed toward the sloped leads at the portions 236a, 236b of the conductive tabs 230a, 230b. The conductive tabs 230a, 230b are preferably slightly flexible, and are flexible along their lengths at the portions of the cantilever arms 238a, 238b. The conductive tabs 230a, 230b flex when the sloped leads, or second surfaces 235a, 235b, at the tips 232a, 232b or 236a, 236b, respectively, contact the seal spring 100 (see FIGS. 3 and 4). The angle or taper of the inner sidewall 109 of the seal 100 also prevents the seal spring 100 from being damaged, distorted, torn, ripped, or destroyed during use when the seal spring 100 comes into contact with conductive tabs 230a, 230b or similar features of the connector housing when inserted and in use. Similarly, the beveled leads at 236a, 236b prevent the seal spring 100 or other inserted seals from being damaged, warped, torn, ripped, or destroyed during use.

[0018] The conductive tabs 230a, 230b of the conductive outer housing 200 have a conductive coating, and thus the conductive tabs 230a, 230b can provide an element or part of a grounding scheme for a high-voltage connector assembly including the conductive outer housing 200. Here, the conductive coating on the conductive tabs 230a, 230b enables the conductive outer housing 200 to establish conductive contact with an inserted conductive third outer housing 400 (see FIG. 4). This is also facilitated by the cantilevered portions of the conductive tabs 230a, 230b substantially contacting the conductive third outer housing 400. Specifically, the first surfaces 234a, 234b of each of the conductive tabs 230a, 230b contact the surface of the conductive third outer housing 400. When assembled, the seal spring 100 also exerts a compression and spring force on the conductive tabs 230a, 230b, pressing the conductive tabs 230a, 230b against the conductive third outer housing 400. Thus, when the conductive coating on the conductive tabs 230a, 230b contacts the conductive third outer housing 400, the grounding portion of the connector assembly is completed.

[0019] 4 shows an example of conductive outer housing 200 assembled into a complete connector assembly, including seal spring 100, second outer housing 300, and conductive third outer housing 400. Here, as described above, cantilever arms 238a, 238b are slightly deflected, the deflection being opposite or counter to the direction in which conductive tabs 230a, 230b contact interior sidewall 109 of seal spring 100. The deflection of conductive tabs 230a, 230b is generally inward, i.e., toward interior cavity 204, interior aperture 108, or the other opposing conductive tab 230a, 230b (as described above). Thus, as shown in FIG. 4 , the first surfaces 234a, 234b of each conductive tab 230a, 230b are inserted into the conductive outer housing 200 of the completed connector assembly and further contact the surface of the conductive third outer housing 400 present therein. Here, the conductive third outer housing 400 engages the first surfaces 234a, 234b, further pressing the conductive tabs 230a, 230b against the inner sidewall 109 of the seal spring 100. This compresses the seal spring 100, resulting in an upward spring force on the conductive tabs 230a, 230b, providing additional force to increase the contact pressure of the conductive tabs 230a, 230b against the conductive third outer housing 400 than would be possible without the seal spring 100. This provides better electrical conductivity and results in higher contact pressure between the conductive tabs 230a, 230b and the conductive third outer housing 400 when the high-voltage connector assembly is in use. Additionally, this force and subsequent pressure are much more resistant to stress relaxation compared to using conductive tabs 230a, 230b, cantilever arms 238a, 238b, and housing 200 made solely from resin. Again, an advantage of seal spring 100 is the higher contact pressure between conductive outer housing 200 and conductive third outer housing 400. Conductive third outer housing 400 is preferably a conductive plated resin housing that is a grounding element within the connector assembly and aids in shielding of the connector assembly.As mentioned above, the conductive outer housing 200 is also preferably conductive, metallic, and constructed from a metal-infused resin to aid in shielding of the connector assembly during use. The grounding element within each conductive outer housing 200 may be, for example, a plated surface, a conventional stamped shield, a foil-lined surface, or other conductive material utilized within, on, or by the conductive outer housing 200 for grounding purposes. As mentioned above, contact between the conductive tabs 230a, 230b and the conductive third outer housing 400 completes the grounding portion of the connector assembly using the conductive outer housing 200.

[0020] The method for shielding and grounding a connector assembly utilizing the conductive outer housing 200 of the present invention is shown by way of example only. Figure 4 EMI path A includes an EMI flow path A, which is shown by a single dashed line in FIG. 1. EMI flow path A travels, for example, from one of a wire shield (not shown), a connector grounding scheme (not shown), or a conventional shielding means (not shown, i.e., stamped shield) that contacts the surface of the conductive outer housing 200 and abuts the interior of the conductive outer housing 200 or each such shielding means (not shown), and the EMI then travels and conducts through the conductive outer housing 200, passes through the conductive tabs 230a, 230b on which the conductive coating is formed, then travels and conducts through the conductive third outer housing 400, and then travels and conducts through the connector grounding scheme (not shown) or a conventional shielding means (not shown, i.e., stamped shield) to ground. The reverse of this flow path is also possible, and if the EMI flow path is in the opposite direction, the EMI may travel through a ground, ground device, or ground element ( Figures 4 and 5 It depends on the position of the

[0021] Figure 5 2 is a flow chart illustrating the path EMI takes along a high voltage connector assembly employing a conductive outer housing 200. Figure 5As shown in Figure 1, EMI travels in step 1 (S1) directly from, for example, a wire shield (not shown), a connector grounding scheme (not shown), or one of the conventional shielding means (i.e., stamped shields, not shown) to the conductive outer housing 200. In step 2 (S2), the EMI travels through the conductive outer housing 200 directly to the conductive tabs 230a, 230b that contact the conductive third outer housing 400. In step 3 (S3), the EMI travels from the conductive tabs 230a, 230b directly to the conductive third outer housing 400. Then, in step 4 (S4), the EMI travels directly to a further connector grounding scheme (not shown) or conventional shielding means (i.e., stamped shields, not shown) to ground.

[0022] Figure 5 The reverse of the aforementioned flow path is also possible if the EMI flow path is in the opposite direction due to the location of the ground, ground device, or ground element, as alternatively shown in Figure 1. EMI can also proceed through a connector ground scheme (not shown) or conventional shielding means (not shown, i.e., stamped shield) to the conductive third outer housing 400 as in step 4 (S4), to the conductive tabs 230a, 230b as in step 3 (S3), to the conductive outer housing 200 as in step 2 (S2), to one of the wire shield (not shown), connector ground scheme (not shown), or conventional shielding means (not shown, i.e., stamped shield) as in step 1 (S1), and then directly to ground.

[0023] It should be noted that while the foregoing description is directed to preferred embodiments of the invention, other variations and modifications will be apparent to those skilled in the art and can be made without departing from the spirit or scope of the invention. Furthermore, features described in connection with one embodiment of the invention may be used in conjunction with other embodiments, even if not explicitly stated above.

Claims

1. providing a connector assembly with a conductive outer housing having at least a first conductive tab contiguous with the conductive outer housing; inserting the conductive outer housing into another conductive outer housing; conducting EMI generated by at least the conductive outer housing to the at least first conductive tab; conducting the EMI from the at least first conductive tab to the further conductive outer housing; thereafter conducting the EMI from the other conductive outer housing to ground; the conductive outer housing having an interior cavity; a seal spring is pressed against the conductive outer housing and the second conductive outer housing and compressed when pressed against the first conductive tab, thereby simultaneously maintaining a sealing force and a spring force between the conductive outer housing and the second conductive outer housing; A method for reducing the effects of electromagnetic interference (EMI) to provide EMI protection for a connector assembly having a conductive outer housing.

2. 10. The method for reducing the effects of electromagnetic interference (EMI) to provide EMI protection for a connector assembly having a conductive outer housing as recited in claim 1, further characterized by the step of providing a second conductive tab on the conductive outer housing.

3. 10. The method for reducing the effects of electromagnetic interference (EMI) to provide EMI protection for a connector assembly having a conductive outer housing as recited in claim 1, further characterized by the steps of: providing a second conductive tab on the conductive outer housing; and providing a conductive coating on the second conductive tab.

4. 2. The method for reducing the effects of electromagnetic interference (EMI) to provide EMI protection for a connector assembly having a conductive outer housing as recited in claim 1, wherein the seal spring is inserted into the internal cavity of the conductive outer housing, the first conductive tab has a sloped leading edge that contacts the seal spring, the seal spring simultaneously provides the sealing force and a spring force, and the seal spring applies the spring force to the first conductive tab.

5. providing a connector assembly with a conductive outer housing having at least a first conductive tab contiguous with the conductive outer housing; inserting the conductive outer housing into another conductive outer housing; conducting EMI generated by at least the other conductive outer housing to the at least first conductive tab; conducting the EMI from the at least first conductive tab to the conductive outer housing; thereafter conducting the EMI from the conductive outer housing to ground; the conductive outer housing having an interior cavity; inserting a seal spring into an internal cavity of the conductive outer housing and applying a spring force of the seal spring to the first conductive tab. A method for reducing the effects of electromagnetic interference (EMI) to provide EMI protection for a connector assembly having a conductive outer housing.

6. 6. The method for reducing the effects of electromagnetic interference (EMI) to provide EMI protection for a connector assembly having a conductive outer housing as recited in claim 5, further characterized by the step of providing a second conductive tab on the conductive outer housing.

7. 6. The method for reducing the effects of electromagnetic interference (EMI) to provide EMI protection for a connector assembly having a conductive outer housing as recited in claim 5, further characterized by the steps of: providing a second conductive tab on the conductive outer housing; and providing a conductive coating on the second conductive tab.

8. 6. The method for reducing the effects of electromagnetic interference (EMI) to provide EMI protection for a connector assembly having a conductive outer housing as recited in claim 5, further characterized by the step of: said first conductive tab having a sloped leading edge that contacts said seal spring.

9. providing a connector assembly including a conductive outer housing having at least a first conductive tab contiguous with the conductive outer housing; inserting the conductive outer housing into another conductive outer housing; conducting EMI generated from at least the conductive outer housing to the first conductive tab; conducting the EMI from the first conductive tab to the further conductive outer housing; and then conducting the EMI from the other conductive outer housing to ground, the conductive outer housing having an interior cavity; a seal spring within the internal cavity simultaneously maintaining a sealing force and a spring force between the conductive outer housing and the second conductive outer housing; A method for reducing the effects of electromagnetic interference (EMI) to provide EMI protection for a connector assembly having a conductive outer housing.

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