Light emitting module and manufacturing method thereof

Abstract

To provide a light-emitting module having good visual quality through a lens without degrading the operation of electronic components, and a manufacturing method of the same.SOLUTION: A manufacturing method S10 of a light-emitting device is a manufacturing method of a light-emitting module comprising a substrate, a light-emitting element and a light receiving element placed on the substrate, a lens facing the light-emitting element and the light receiving element, and includes: a preparation step S11 of preparing a substrate on which the light-emitting element and the light receiving element are arranged adjacent to one another; a coating step S12 of coating the light receiving element with a coating member; and a lens arrangement step S13 of arranging the lens to face the light-emitting element and the light receiving element. The coating step includes: a first dropping step S12a of dropping the coating member on one side of the light receiving element which is far from the light-emitting element; and a second dropping step S12b of dropping a coating member on the other side of the light receiving element which is near to the light-emitting element so as to be in contact with the coating member dropped on the one side and a side face of the light-emitting element.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a light emitting module and a method for manufacturing the same. [Background technology]

[0002] BACKGROUND ART A configuration in which a light emitting element and a lens are combined is known as a light emitting module used in flashes for digital cameras, tablet terminals, smartphones, and the like (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2015-508509 Summary of the Invention [Problem to be solved by the invention]

[0004] In a light emitting module, the appearance is unattractive if electronic components arranged within the lens range are visible through the lens, so it is desirable to make the electronic components inconspicuous through the lens in a light emitting module. An object of an embodiment of the present disclosure is to provide a light-emitting module that looks good through a lens and a method for manufacturing the same. [Means for solving the problem]

[0005] A manufacturing method for an optical emitting module according to an embodiment of the present disclosure is a manufacturing method for an optical emitting module including a substrate, a light emitting element and a light receiving element placed on the substrate, and a lens facing the light emitting element and the light receiving element, and includes a preparation step of preparing a substrate on which the light emitting element and the light receiving element are arranged adjacent to each other, a covering step of covering the light receiving element with a covering material, and a lens arrangement step of arranging the lens facing the light emitting element and the light receiving element, and the covering step includes a first dropping step of dropping the covering material on one side of the light receiving element that is farther from the light emitting element, and a second dropping step of dropping the covering material on the other side of the light receiving element that is closer to the light emitting element so that the covering material dropped on one side comes into contact with the side of the light emitting element.

[0006] A light-emitting module according to an embodiment of the present disclosure includes a substrate, a light-emitting element and a light-receiving element mounted adjacent to each other on the substrate, a lens positioned opposite the light-emitting element and the light-receiving element at a distance from the light-emitting element and the light-receiving element, and a covering member exposing an upper surface of the light-emitting element and covering an upper surface of the light-receiving element, wherein the light-receiving element has a light-receiving portion on its upper surface closer to the light-emitting element, and the top of the covering member covering the light-receiving element is spaced apart from the light-receiving portion in a plan view and is positioned on the upper surface farther from the light-emitting element. The covering member is arranged so that the top surface of the light-receiving portion is thinner than the top surface of the covering member farther from the top. [Effects of the Invention]

[0007] According to an embodiment of the present disclosure, it is possible to provide a light-emitting module that looks good through a lens without impairing the operation of the light-receiving element, and a method for manufacturing the same. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view schematically showing a part of a mobile device using a light-emitting module according to an embodiment. [Figure 2] FIG. 2 is an enlarged cross-sectional view taken along line II-II in FIG. [Figure 3]FIG. 2 is a plan view schematically illustrating a state in which a lens of the light-emitting module according to the embodiment has been removed. [Figure 4] 4 is an enlarged cross-sectional view schematically illustrating the state of a light receiving element of the light emitting module according to the embodiment. FIG. [Figure 5] 1 is a flowchart illustrating a method for manufacturing a light-emitting module according to an embodiment. [Figure 6A] 1A to 1C are cross-sectional views schematically illustrating a method for manufacturing a light-emitting module according to an embodiment. [Figure 6B] 1A to 1C are cross-sectional views schematically illustrating a method for manufacturing a light-emitting module according to an embodiment. [Figure 6C] 1A to 1C are cross-sectional views schematically illustrating a method for manufacturing a light-emitting module according to an embodiment. [Figure 7A] 1A to 1C are plan views schematically showing a method for manufacturing a light-emitting module according to an embodiment. [Figure 7B] 1A to 1C are plan views schematically showing a method for manufacturing a light-emitting module according to an embodiment. [Figure 8] 10 is a flowchart showing an application example of the method for manufacturing a light emitting module according to the embodiment. [Figure 9] 10A and 10B are plan views schematically showing an application example of the manufacturing method for the light emitting module according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of a light emitting module according to the present invention will be described. The drawings referred to in the following description are intended to provide a schematic illustration of the present invention, and therefore the scale, spacing, and positional relationships of each component may be exaggerated, or some components may be omitted. Furthermore, the scale and spacing of each component may not match between the plan view and the cross-sectional view. In the following description, the same names and symbols generally indicate the same or similar components, and detailed descriptions will be omitted as appropriate.

[0010] In addition, in the light-emitting modules according to the embodiments of the present invention, the directions such as "X," "Y," and "Z" are interchangeable depending on the situation. In this specification, "up," "down," "right," and "left" indicate the relative positions of components in the drawings referred to for explanation, and are not intended to indicate absolute positions unless otherwise specified. In addition, in this specification, the same term "covering member" is used appropriately for both the resin state before hardening and the solid object after hardening.

[0011] (Embodiment) [Light-emitting module configuration] First, the configuration of a light emitting module according to an embodiment of the present invention will be described with reference to Fig. 1 to Fig. 4. Fig. 1 is a plan view schematically showing a part of a mobile device using a light emitting module according to an embodiment. Fig. 2 is an enlarged cross-sectional view taken along line II-II in Fig. 1. Fig. 3 is a plan view schematically showing a state in which a lens has been removed from the light emitting module according to the embodiment. Fig. 4 is an enlarged cross-sectional view schematically showing a state of a light receiving element of the light emitting module according to the embodiment. The light emitting module 100 constitutes, for example, a flash module of a camera CA. The light emitting module 100 is incorporated together with the camera CA into a housing 90 of a mobile device such as a smartphone or tablet terminal. The housing 90 includes, for example, a main body made of resin, metal, or the like, and a cover glass 80 that covers the lens 70 of the light emitting module 100 incorporated within the housing 90. Note that the housing 90 does not necessarily have to include the cover glass 80. In this case, the light emitting module 100 may be configured so that the lens 70 is directly exposed from the main body without the cover glass 80 in between.

[0012] The light-emitting module 100 includes a substrate 40, a light-emitting element 1 and a light-receiving element 10 mounted on the substrate 40, a lens 70 positioned opposite the light-emitting element 1 and the light-receiving element 10 at a distance from the light-emitting element 1 and the light-receiving element 10, and a covering member 30 that exposes the upper surface of the light-emitting element 1 and covers the upper surface of the light-receiving element 10. Furthermore, in the light-emitting module 100, the light-receiving element 10 has a light-receiving portion 12 on its upper surface closer to the light-emitting element 1, and in a planar view, a top portion 30A of the covering member 30 covering the light-receiving element 10 is spaced apart from the light-receiving portion 12 and is located on the upper surface farther from the light-emitting element 1. In other words, in a planar view, the top portion of the covering member 30 does not overlap with the light-receiving portion 12. In the light-emitting module 100, the light-emitting element 1 is mounted on the substrate 40 as a light-emitting device 5 having at least one light-emitting element 1. Here, as an example, a light emitting module 100 will be described that includes a plurality (for example, four) of light emitting devices 5 each having one light emitting element 1, and a compound lens 70 having a plurality (for example, four) of lens portions corresponding to the number of light emitting elements 1. Note that in this specification, a light emitting device 5 that is rectangular in plan view may be described as a light emitting element 1 that is rectangular in plan view. Each component of the light emitting module 100 will be described below.

[0013] The substrate 40 includes an insulating base material and conductive wiring 41 arranged at predetermined positions on the upper surface of the base material. The substrate 40 is a member that supports the light emitting element 1 and the light receiving element 10. Examples of the substrate include ceramic substrates such as aluminum nitride and silicon nitride, metal substrates such as aluminum and copper, and resin substrates such as glass epoxy. The conductor wiring 41 supplies power to the light-emitting element 1 and the light-receiving element 10 and is patterned into a predetermined shape on the substrate. The conductor wiring 41 is connected to an external power supply via a wiring portion that penetrates the substrate and a wiring portion that is exposed from the underside of the substrate. The conductor wiring 41 can be made of a metal material, such as gold (Au), silver (Ag), aluminum (Al), nickel (Ni), rhodium (Rh), copper (Cu), titanium (Ti), platinum (Pt), palladium (Pd), molybdenum (Mo), chromium (Cr), or tungsten (W), or an alloy containing these metals. More preferably, the conductor wiring 41 can be made of a metal such as silver (Ag), aluminum (Al), platinum (Pt), or rhodium (Rh), which has excellent light reflectivity, or an alloy containing these metals.

[0014] The substrate 40 preferably has a resist layer on its surface that is similar in color to the appearance color of the upper surface of the light emitting device 5. The resist layer provided on the surface of the substrate 40 may be white. The resist layer covering the surface of the substrate 40 serves to protect the conductor wiring 41. The resist layer may also contain a reflective material, which can also increase the light extraction efficiency of the light emitting module 100. The shape of the substrate 40 in a plan view may be any shape, such as rectangular or circular.

[0015] The light emitting device 5 has positive and negative element electrodes 2 on its back surface, and the element electrodes 2 are connected to conductive wiring 41 on the substrate 40. The light emitting device 5 includes one or more light emitting elements 1, a light-transmitting member 3 placed on the light extraction surface of the light emitting element 1, and a protective member 4 covering the side surfaces of the light emitting element 1. The side surfaces of the light-transmitting member 3 may be covered with the protective member 4, or may be exposed from the protective member 4 to form the side surfaces of the light emitting device 5. As an example, the light emitting device 5 has a light emitting element that is rectangular in plan view. Here, four light emitting devices 5 that are rectangular in plan view are arranged in two rows and two columns so that one side of each rectangle faces each other in plan view, and are mounted on the substrate 40. The light emitting device 5 is mounted at a position that overlaps with the lens 70 in plan view. Here, the light emitting device 5 is formed to emit white light.

[0016] The light-emitting element 1 includes a light-transmitting support substrate such as sapphire and a semiconductor layer. The semiconductor layer includes, for example, an n-side semiconductor layer, an active region, and a p-side semiconductor layer in this order from the support substrate side. The light-emitting element 1 that can emit ultraviolet light and visible light ranging from blue light to green light is, for example, a nitride semiconductor such as In X Al Y Ga 1-X-Y GaN-based or InGaN-based materials expressed as N(0≦X≦1, 0≦Y≦1, X+Y<1) can be used. The planar shape of the light-emitting element 1 is, for example, rectangular, but may also be polygonal, such as circular, elliptical, triangular, or hexagonal. The light emitting element 1 preferably has positive and negative element electrodes 2 (2a, 2b) on the same side, which allows it to be flip-chip mounted on the substrate 40. The positive and negative electrodes 2 (2a, 2b) of the light emitting element 1 are electrically connected to the conductor wiring 41 of the substrate 40 via bonding members such as bumps, conductive paste, or solder.

[0017] The light-transmitting member 3 is a plate-like member having a substantially rectangular shape in a plan view and is disposed on the light-emitting element 1 so as to cover the upper surface of the light-emitting element 1. The light-transmitting member 3 can be formed using a light-transmitting resin or an inorganic material such as ceramics or glass. Examples of resins that can be used include thermosetting resins such as silicone resin, silicone-modified resin, epoxy resin, and phenolic resin. Examples of thermoplastic resins that can be used include polycarbonate resin, acrylic resin, methylpentene resin, and polynorbornene resin. Silicone resin or its modified resins, which have excellent light resistance and heat resistance, are particularly suitable. Note that the term "light-transmitting" as used herein refers to the ability to transmit 60% or more of the light emitted by the light-emitting element 1. Furthermore, the light-transmitting member 3 may contain a light diffusing member or a phosphor that converts the wavelength of at least a portion of the light emitted by the light-emitting element 1. Examples of light-transmitting members 3 containing a phosphor include the above-mentioned resin materials, ceramics, glass, etc., containing a phosphor, and a sintered body of a phosphor.

[0018] The phosphor is an yttrium-aluminum-garnet phosphor (e.g., Y3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet phosphors (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (e.g., Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate phosphors (e.g., Ca8MgSiO 16 Cl2:Eu), β-sialon-based phosphors (e.g., (Si,Al)3(O,N)4:Eu) or α-sialon-based phosphors (e.g., Ca(Si,Al) 12 (O,N) 16Oxynitride phosphors such as (Eu), SLA phosphors (e.g., SrLiAl3N4:Eu), CASN phosphors (e.g., CaAlSiN3:Eu), or SCASN phosphors (e.g., (Sr,Ca)AlSiN3:Eu) and other nitride phosphors, KSF phosphors (e.g., K2SiF6:Mn), KSAF phosphors (e.g., K2Si 0.99 Al 0.01 F 5.99 :Mn), or fluoride phosphors such as MGF phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), phosphors having a perovskite structure (e.g., CsPb(F,Cl,Br,I)3), or quantum dot phosphors (e.g., CdSe, InP, AgInS2, or AgInSe2) can be used.

[0019] The KSAF phosphor may have a composition represented by the following formula (I). M2[Si p Al q Mn r F s (I)

[0020] In formula (I), M represents an alkali metal and may contain at least K. Mn may be tetravalent Mn ions. p, q, r, and s may satisfy 0.9 ≦ p + q + r ≦ 1.1, 0 < q ≦ 0.1, 0 < r ≦ 0.2, 5.9 ≦ s ≦ 6.1. Preferably, 0.95 ≦ p + q + r ≦ 1.05 or 0.97 ≦ p + q + r ≦ 1.03, 0 < q ≦ 0.03, 0.002 ≦ q ≦ 0.02 or 0.003 ≦ q ≦ 0.015, 0.005 ≦ r ≦ 0.15, 0.01 ≦ r ≦ 0.12 or 0.015 ≦ r ≦ 0.1, 5.92 ≦ s ≦ 6.05 or 5.95 ≦ s ≦ 6.025. For example, K2[Si 0.946 Al 0.005 Mn 0.049 F 5.995 , K2[Si 0.942 Al 0.008 Mn 0.050 F 5.992 , K2[Si 0.939 Al 0.014 Mn 0.047 F 5.986Such a KSAF-based phosphor can provide red light emission with high brightness and a narrow half-width of the emission peak wavelength.

[0021] For example, by using a blue light-emitting element as the light-emitting element 1 and making the light-transmitting member 3 contain a yellow phosphor, a light-emitting device 5 that emits white light can be obtained. The light diffusing material contained in the light-transmitting member 3 may be, for example, titanium oxide, barium titanate, aluminum oxide, silicon oxide, or the like.

[0022] The protective member 4 is a member that protects the side surfaces of the light-emitting element 1 and covers the side surfaces of the light-emitting element 1 directly or indirectly. The protective member 4 may also cover the side surfaces of the light-transmitting member 3. The upper surface of the light-transmitting member 3 is exposed from the protective member 4 and constitutes the light-emitting surface (i.e., the main light extraction surface) of the light-emitting device 5. The protective member 4 preferably has high light reflectivity, for example. The protective member 4 may be made of a resin containing a light-reflecting material. Examples of light-reflecting materials include titanium oxide, silicon oxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, zinc oxide, and mullite. Furthermore, the resin preferably has a base material that is primarily composed of a thermosetting resin such as epoxy resin, silicone resin, silicone-modified resin, or phenolic resin. If necessary, the protective member 4 may also be made of a material that is translucent to visible light.

[0023] The light-receiving element 10 is electrically connected to the substrate 40. In addition to the light-receiving element 10, the light-emitting module 100 may include electronic components 20 such as a Zener diode, a thermistor, and a capacitor. Here, the light-receiving element 10 has, for example, a rectangular shape in a plan view and an overall rectangular parallelepiped shape. The light-receiving element 10 is disposed on the substrate 40 at a distance from the lens 70 and at a position where the lens 70 and the light-receiving unit 12 face each other. Note that the other electronic components 20 may be disposed on the substrate 40 so as to face the lens 70, or may not face the lens 70. For example, the light-receiving element 10 is disposed directly below the lens 70 and is connected to the conductor wiring 41 of the substrate 40 via a wire 13. For example, as shown in FIG. 7 , the wire 13 is disposed in a direction perpendicular to the direction in which the light-receiving element 5 and the light-emitting device 5 face each other in a plan view of the light-receiving element 10, which has a rectangular shape in a plan view. That is, here, two wires 13 are arranged on two opposing sides of the light receiving element 10, straddling one side of the light receiving element 10, and two wires are arranged on the other side of the light receiving element 10, and each is connected to the substrate 40. Also, as an example, as shown in Figures 3 and 4, the light receiving element 10 is arranged with the light emitting device 5 having a rectangular shape in a plan view so that one side of the rectangle faces each other in a plan view.

[0024] The light-emitting element 1 and the light-receiving element 10 are arranged adjacent to each other on the substrate 40. The light-receiving element 10 is arranged so that the maximum distance D1 between the light-emitting device 5 including the light-emitting element 1 and the light-receiving element 10 in a direction from the other side closer to the light-emitting element 10 to the one side farther from the light-emitting element 10 in a plan view is smaller than the maximum distance D2 from the light-receiving element 10 to the end of the substrate 40. The light receiving element 10 includes an element housing 11 and a light receiving unit 12 disposed on the upper surface of the element housing 11. The light receiving unit 12 is exposed from the element housing 11 at a position offset from the center on the upper surface of the light receiving element 10. Here, the light receiving element 10 is mounted on the substrate 40 so that the light receiving unit 12 is positioned closer to the light emitting element 1. The light receiving element 10 is, for example, a component for controlling the drive current of the light emitting device 5 based on the intensity of light received through the lens 70. Therefore, if the covering member 30 disposed on the light receiving unit 12 of the light receiving element 10 is thick, there is a risk that the control operation of the light receiving element 10 will not function properly.

[0025] The electronic component 20 generally has an exterior color of black or a color close to black. Therefore, it is preferable to cover the electronic component 20 including the light-receiving element 10 with a covering member 30, which makes the black exterior color less visible from the outside through the lens 70. Furthermore, for electronic components such as the light-receiving element 10 that convert received light into an electrical signal, it is required that the covering member 30 not only look good through the lens, but also that the light-receiving function is not impaired.

[0026] As shown in FIGS. 2 and 3 , the covering member 30 covers the upper surface of the light-receiving element 10 facing the lens 70. The covering member 30 is a light-transmitting member containing a coloring substance. In the covering member 30 covering the light-receiving element 10, the thickness of the covering member 30 covering the light-receiving unit 12 is preferably thinner so as not to impair the function of the light-receiving element 10. For example, it is preferable that the top portion 30A of the covering member 30 covering the light-receiving element 10 is located away from the light-receiving unit 12 and on one side of the upper surface that is far from the light-emitting element 1. In other words, the covering member 30 is arranged on the light-receiving element 10 so that the thickness covering the other side of the upper surface 31 that is closer to the light-emitting element 1 is thinner than the thickness covering the one side of the upper surface 32 that is on the end side of the substrate 40. In this way, by making the thickness of the upper surface 31 on the other side of the covering member 30 relatively thinner than the thickness of the upper surface 32 on one side, the thickness of the covering member 30 can be adjusted so as not to interfere with the operation of the light receiving element 10.

[0027] The covering member 30 can be disposed on the light-receiving element 10 by dripping a liquid resin using a dispensing device such as a jet dispenser. The covering member 30 is disposed at a distance from the lens 70 so as not to obstruct the light emitted from the light-emitting element 1 and directed toward the lens 70. The covering member 30 is preferably formed by containing a coloring substance so as to have a color similar to that of the light-emitting surface of the light-emitting device 5 (i.e., the upper surface of the light-transmitting member 3 containing a phosphor or a light-diffusing member) and / or the resist layer formed on the substrate. Alternatively, the covering member 30 is formed by containing a coloring substance so as to have a white color. In addition, the covering member 30 covers the entire upper and side surfaces of the light-receiving element 10, for example.

[0028] Here, the covering member 30 is disposed on the upper surface of the light-receiving element 10 and on the upper surfaces of the other multiple electronic components 20. The multiple (e.g., four) electronic components 20, excluding the light-receiving element 10, do not have an optically functional surface such as a light-receiving unit on their upper surfaces. Therefore, the covering members 30 that cover the upper surfaces of the electronic components 20 are disposed so that their thicknesses are approximately uniform or their peaks are located at the center of the upper surfaces. In contrast, the covering member 30 that covers the light-receiving element 10, which has an optically functional surface on its upper surface, is disposed so that the other side, where the light-receiving unit 12 of the light-receiving element 10 is located, is thinner than the other side. The lower limit of the thickness of the covering member 30 may be a thickness that does not allow the black color of the electronic component 20 to show through when a coloring substance is contained therein. The covering member 30 may be disposed so that its thickness varies depending on the type, shape, and height of the electronic component 20.

[0029] The covering member 30 may use, as a base material, a resin such as silicone resin, epoxy resin, or polycarbonate resin. The covering member 30 also contains a coloring substance. The coloring substance may include one or more of a phosphor, a pigment, and a dye. The phosphor may be the same as the phosphor contained in the light-transmitting member 3. The pigment may be, for example, an inorganic material or an organic material.

[0030] Examples of inorganic materials include red iron oxide (Fe2O3), red lead (Pb3O4), titanium oxide (TiO2), chromium oxide (Cr2O3), titanium nickel antimony oxide, titanium nickel barium oxide, titanium chromium antimony oxide, titanium chromium niobium oxide, etc. Examples of organic materials include anthraquinones, azos, quinacridones, perylenes, diketopyrrolopyrroles, monoazos, disazos, pyrazolones, benzimidazolones, quinoxalines, azomethines, isoisodolinones, etc. Examples of dyes include anthraquinone dyes, methine dyes, azomethine dyes, oxazine dyes, azo dyes, styryl dyes, coumarin dyes, porphyrin dyes, dibenzofuranone dyes, diketopyrrolopyrrole dyes, rhodamine dyes, xanthene dyes, pyrromethene dyes, etc. Pigments and dyes are preferably those that do not convert the light from the light-emitting element 1 into a different wavelength. The covering member 30 contains a coloring substance in its base material. The covering member 30 is preferably formed with the coloring substance so that it is white or a similar color to the light-transmitting member 3. Note that a similar color is considered to be within a range equivalent to 15 steps of the MacAdam ellipse.

[0031] As described above, the covering member 30 contains a coloring substance and covers the upper surface of the light-receiving element 10, making it difficult to see the electronic component 20 through the lens 70. Furthermore, by making the thickness of the covering member 30 that covers the light-receiving section 12 thinner, it is possible to improve the appearance through the lens 70 without impairing the operation of the light-receiving element 10 that receives light that passes through the covering member 30.

[0032] As shown in FIGS. 1 to 3 , the lens 70 is disposed above the light-emitting device 5 via a lens frame 71. The lens frame 71 is attached to the substrate 40 at a distance from the light-emitting device 5 using an adhesive such as resin. The lens frame 71 is disposed integrally with the lens 70 so that the lens 70 can be supported at a distance from the substrate 40. The lens frame 71 is also disposed so that it can abut against and support the substrate 40 as well as the support substrate 60 of the entire mobile device to which the light-emitting module 100 is attached. The lens 70 is disposed so that it covers the entire light-emitting surface of the light-emitting element 1 in a planar view. The lens 70 may have an outer shape, such as a rectangle, a circle, or an ellipse, in a planar view. The lens 70 can be manufactured using a material known in the art and by a known manufacturing method. Examples of the material include resin and glass. These materials may contain a light-diffusing material or the like.

[0033] Here, a Fresnel lens is used as an example of the lens 70. The Fresnel lens is arranged so that one surface with concaves and convexes faces the light emitting device 5, allowing light emitted from the light emitting device 5 to enter and exit from the other flat surface. Using a Fresnel lens as the lens 70 allows the lens 70 to be made thinner. This shortens the length of light extraction from the light emitting element 1, which is the light source of the light emitting module 100. Furthermore, forming the lens 70 thin makes it easier to create an air gap between the lens 70 and the light emitting device 5. By creating this air gap, the spread of light from the light emitting device 5 can be adjusted. The lens 70 has lens portions corresponding to the number of light emitting devices 5. As an example, when four light emitting devices 5 are provided, the lens 70 is a compound lens having four lens portions composed of Fresnel lenses.

[0034] <Operation of the light emitting module> In the light emitting module 100 configured as described above, current is supplied to the light emitting element 1 from an external power source via the conductor wiring 41, causing the light emitting element 1 to emit light. The light from this light emitting element 1 is extracted to the outside from the upper surface of the light emitting element 1 through the lens 70. Furthermore, since the light emitting module 100 includes the light receiving element 10, when used as a camera flash module, the covering member 30 on the light receiving section 12 side is thinly covered, so that the light can be automatically and appropriately emitted as a flash in accordance with the brightness of the subject's environment without impairing the operation of the light receiving element 10. Furthermore, since the light emitting module 100 includes the covering member 30 that covers the light receiving element 10, the light receiving element 10 is less visible from the outside, and looks good through the lens.

[0035] [Manufacturing method of light emitting module] Next, a method for manufacturing a light emitting module will be described with reference to Fig. 5 to Fig. 9. As shown in Fig. 5, a method for manufacturing a light emitting module will be described here for manufacturing a light emitting module 100 that includes four light emitting devices 5 each having a light emitting element 1 and one light receiving element 10 adjacent to the light emitting device 5. In Fig. 7B, the numbers 1 to 6 of the dropped covering members 30 indicate the order in which the covering members 30 are dropped. The method S10 for manufacturing an optical emitting module includes a substrate, a light emitting element and a light receiving element placed on the substrate, and a lens facing the light emitting element and the light receiving element, and includes a preparation step S11 for preparing a substrate on which the light emitting element and the light receiving element are arranged adjacent to each other, a covering step S12 for covering the light receiving element with a covering material, and a lens arrangement step S13 for arranging a lens facing the light emitting element and the light receiving element. The covering step S12 includes a first dropping step S12a for dropping the covering material onto one side of the light receiving element that is farther from the light emitting element, and a second dropping step S12b for dropping the covering material onto the other side of the light receiving element that is closer to the light emitting element so that the covering material dropped on one side comes into contact with the side of the light emitting element.

[0036] The preparation step S11 is a step of preparing a substrate 40 on which a light-emitting element 1 and a light-receiving element 10 are mounted. In the preparation step S11, the light-emitting element 1 is mounted in an installation area of ​​the substrate 40, and the substrate 40 on which the light-receiving element 10 is mounted is also prepared. In the preparation step S11, the light-emitting element 1 may be mounted on the substrate 40 in the form of an unpackaged chip, or the light-emitting element 1 may be mounted on the substrate 40 in the form of a packaged light-emitting device 5. The light-emitting element 1 and the light-receiving element 10 prepared in the preparation step S11 are rectangular in plan view, and the light-emitting element 1 and the light-receiving element 10 are mounted adjacent to each other on the substrate 40 so that one side of each rectangle faces each other in plan view. Here, four light-emitting devices 5 each having a rectangular shape in plan view are arranged in two rows and two columns as the light-emitting element 1, and are disposed on the substrate 40 to form a rectangular shape overall. The light-receiving element 10 prepared in the preparation step S11 is connected to the substrate 40 via wires 13. Furthermore, the positional relationship between the substrate 40 prepared in the preparation step S11 and the light-emitting element 1 and the light-receiving element 10 is such that, in a plan view, the maximum distance D1 separating the light-emitting element 1 and the light-receiving element 10 in a direction from the other side to one side (i.e., in a direction in which the light-emitting element 1 and the light-receiving element 10 face each other) is smaller than the maximum distance D2 from the light-receiving element 10 to the end of the substrate 40. Note that, in the state of the aggregate substrate before being singulated in the manufacturing process, the end of the substrate 40 may be the end of the substrate 40 after singulation, or may be the end of the region located directly below the lens.

[0037] The covering step S12 is a step of covering the light-receiving element 10 with a covering member 30. The covering step S12 includes a first dropping step S12a of dropping a covering member 30a onto one side of the light-receiving element 10 that is farther from the light-emitting element 1, and a second dropping step S12b of dropping a covering member 30b onto the other side of the light-receiving element 10 that is closer to the light-emitting element 1 so as to contact the covering member 30a dropped onto one side and the side surface of the light-emitting element 1. In the first dropping step S12a and the second dropping step S12b, the dropping of the covering member 30 (30a, 30b) can be performed using a jet dispenser NR. Note that, since the covering member 30 is dropped using the jet dispenser NR, the dropped covering member 30 is a liquid resin containing the coloring substance as described above. 6A and 7B, in the first dropping step S12a, the covering material 30a is dropped multiple times onto the upper surface of one side of the light-receiving element 10 along one side of the light-receiving element 10. In the first dropping step S12a, as an example, the covering material 30a is dropped three times along one side of the light-receiving element 10, thereby dropping the covering material 30a so as to cover half of the element housing 11 of the light-receiving element 10. The number of times that the covering material 30a is dropped is set depending on the length of one side of the light-receiving element 10, and is not particularly limited.

[0038] In the first dropping step S12a, the covering member 30a is dropped onto the upper surface of one side of the light-receiving element 10, which is the side farthest from the light-emitting element 1. That is, in the first dropping step S12a, the covering member 30a is not dropped directly above the light-receiving unit 12. The dropped covering member 30a spreads to cover the upper and side surfaces of one side of the light-receiving element 10 due to the impact of the dropping. Next, in the second dropping step S12b, the covering member 30b is dropped onto the upper surface of the other side of the light-receiving element 10. That is, in the second dropping step S12b, the covering member 30b is dropped from above the light-receiving unit 12 located on the upper surface of the other side, preferably directly above the light-receiving unit 12. Note that the dropping onto the upper surface of the other side is performed at a position where the dropped covering member 30b comes into contact with the covering member 30a dropped in the first dropping step S12a. The covering member 30b dropped in this second dropping process S12b is integrated with the covering member 30a dropped in the first dropping process S12a, and the integrated covering member 30 spreads to cover the other side surface of the light receiving element 10 and the side surface of the light emitting element 1 facing the other side surface.

[0039] In this way, the top surface of the light-receiving element 10 and both side surfaces of the light-receiving element 10 are covered with the covering member 30 through the first dispensing process S12a and the second dispensing process S12b. The covering member 30b dispensed in the second dispensing process S12b comes into contact with and integrates with the covering member 30a dispensed in the first dispensing process S12a before contacting the side surfaces of the light-emitting element 1. Therefore, the surface tension of the integrated resin prevents the covering member 30b from creeping up toward the light-emitting element 1. Furthermore, the impact of dispensing the covering member 30b in the second dispensing process S12b applies stress from the other side to one side to the integrated resin. This makes the covering member 30b dispensed in the second dispensing process S12b more likely to be biased toward one side rather than remaining on the top surface of the other side or spreading toward the light-emitting element. In this way, the top 30A of the covering member 30 is formed biased toward one side. Therefore, the covering material 30 dropped in the first dropping process S12a and the second dropping process S12b will have a thinner covering on the other upper surface 31 covering the light receiving section 12 which is closer to the light emitting element 1 than the top 30A, as shown in Figures 6C and 4, than on the one upper surface 32 on the opposite side of the top 30A. Furthermore, since the maximum distance D1 separating the light-emitting element 1 and the light-receiving element 10 is smaller than the maximum distance D2 from the light-receiving element 10 to the end of the substrate 40, that is, since the distance from the light-receiving element 10 to the end of the substrate 40 is large, the covering material 30a dripped in the first dripping process S12a tends to spread to one side, absorbing the stress generated in the second dripping process S12b and suppressing the flow of resin to the other side.

[0040] In this way, in the covering step S12, the covering members 30a and 30b are dropped separately onto one side and the other side of the light-receiving element 10 via the first dropping step S12a and the second dropping step S12b, respectively. This causes the upper surface 31 on the other side of the covering member 30, which covers the light-receiving section 12 side of the light-receiving element 10, to be thinner than the upper surface 32 on the one side, thereby configuring a thickness that does not interfere with the operation of the light-receiving element 10. Furthermore, by being covered with the covering member 30, the appearance of the light-receiving element 10 is difficult to see through the lens 70. The covering member 30 is formed, for example, to have an appearance similar in color to the appearance of the light-transmitting member 3 that constitutes the light-emitting surface of the light-emitting device 5. Note that the covering member 30 may be formed to have a color similar to that of the protective member 4 of the light-emitting device 5, such as white. In the covering step S12, for electronic components 20 that do not include an optically functional surface on their upper surfaces, the covering member 30 may be dropped at a time to cover one electronic component 20. In addition, when covering electronic components 20 other than the light receiving element 10 with the covering member 30, the covering member 30 may be dropped before or after the first dropping step S12a and the second dropping step S12b, or may be dropped between the first dropping step S12a and the second dropping step S12b.

[0041] The lens arrangement step S13 is a step of arranging the lens 70 so as to face the light-emitting element 1 and the light-receiving element 10. In the lens arrangement step S13, the lens 70 is fixed via a lens frame 71 onto the substrate 40 on which the light-emitting device 5 and the light-receiving element 10 are placed. As an example, the lens 70 is a substantially circular Fresnel lens placed on the light-emitting device 5. At this time, the lens frame 71 is fixed onto the substrate 40 so that the upper surface of the light-emitting device 5 and the lens 70 are spaced apart. The light emitting module 100 can be manufactured through the above steps S11 to S13. When forming a resist layer on the surface of the substrate 40, a mask or the like is used to form the resist layer in an area other than the mounting area of ​​the electronic components 20 including the light emitting device 5 and the light receiving element 10. The resist layer can be formed by a known method using a known material. The resist layer may be formed in the preparation step S11, or the substrate 40 on which the resist layer has been formed in advance may be prepared in the preparation step S11.

[0042] In this way, in the manufacturing method S10 of the light-emitting module, by performing the covering step S12 separately as a first dropping step S12a and a second dropping step S12b, it is possible to cover the other upper surface 31 of the covering member 30 so that it is thinner than the one upper surface 32. Therefore, in the light-emitting module 100, the external shape and external color (mainly black) of the light-receiving element 10 are difficult to see without impairing the operation of the light-receiving element 10. In other words, the light-emitting module 100 can be made to look good through a lens without impairing the operation of the light-receiving element 10.

[0043] As an application example, the covering member 30 described in the light-emitting module 100 and the method for manufacturing the light-emitting module may be configured to include a third covering step S12c in the covering step S12, as shown in Fig. 8. The configurations and steps already described may be denoted by the same reference numerals and omitted as appropriate. In this light-emitting module 100A, two light-emitting devices 5, each having a light-emitting element 1, are mounted on a substrate 40. In the light-emitting module 100B, the area of ​​the covering member 30 covering the light-receiving element 10 is wider than in the above-described configuration. In this way, by widening the area of ​​the covering member 30 covering the light-receiving element 10, the covering member 30 can reliably cover the light-receiving element 10.

[0044] To manufacture the light emitting module 100B, the light emitting module manufacturing method S10A is performed as described below. That is, in the light emitting module manufacturing method S10A, the preparation step S11, the covering step S12, and the lens arrangement step S13 already described are performed, and the covering step S12 is a procedure in which a first dispensing step S12a, a second dispensing step S12b, and a third dispensing step S12c are performed. Note that the third dispensing step S12c described here is called "third" to indicate that it is a different dispensing step from the first dispensing step S12a and the second dispensing step S12b, and is not limited to being performed after the second dispensing step S12b. Also, the numbers 1 to 8 of the dispensed covering members in FIG. 9 indicate the order in which they were dispensed.

[0045] 9, in the third dispensing step S12c, the covering member 30 is dispensed using a jet dispenser NR so as to cover the wire 13 of the light-receiving element 10. Note that in the third dispensing step S12c, the covering member 30 may be dispensed so as to cover the wire 13 on the left side of the light-receiving element 10 before the first dispensing step S12a is performed, and then, after the first dispensing step S12a is completed, the covering member 30 may be dispensed so as to cover the wire 13 on the right side of the light-receiving element 10. Also, the third dispensing step S12c may be performed before the first dispensing step S12a, or may be performed after the second dispensing step S12b is completed. In this way, in the manufacturing method S10A of the light-emitting module, by performing the third dripping process S12c, the light-receiving element 10 can be more reliably covered with the covering material 30, making it difficult to see the light-receiving element 10 even when viewing the light-emitting surface of the module from an oblique direction.

[0046] 1 to 4, the emission wavelengths of the light-emitting elements 1 and the phosphors contained in the light-transmitting members of the light-emitting device 5 may be selected so that two of the light-emitting elements emit white light and the other two emit amber light. Here, amber refers to a chromaticity range consisting of the long-wavelength region of yellow and the short-wavelength region of yellow-red in JIS standard Z8110, or a region sandwiched between the yellow and short-wavelength regions of yellow-red in JIS standard Z9101 for safety colors, and refers to a region located in the range of 580 nm to 600 nm in terms of dominant wavelength, for example. Note that, as an example of the red phosphor contained in the light-transmitting member 3, it is preferable to include, for example, a nitride-based phosphor, and examples thereof include sialon-based phosphors (SiAlON-based phosphors), as well as (Sr0.97Eu0.03)2Si5N8, (Ca0.985Eu0.015)2Si5N8, (Sr0.679Ca0.291Eu0.03)2Si5N8, etc. Note that the base material of the light-transmitting member 3 containing the red phosphor can be the above-mentioned resin material, glass, etc. In addition to the above-mentioned phosphors, other known phosphors can be used as the phosphor contained in the light-transmitting member. By using a combination of these phosphors, a light-emitting device emitting a desired emission color can be obtained.

[0047] 1 to 4, when two of the light emitting devices 5 emit white light and the other two emit amber light, the substrate 40 may have a first region for mounting the two white light emitting devices 5 and a second region for mounting the other two amber light emitting devices 5. The first region may have a yellow resist layer on the surface of the substrate, similar in color to the translucent member 3 containing the phosphors of the two light emitting devices, and the second region may have an amber resist layer on the surface of the substrate, similar in color to the translucent member 3 containing the phosphors of the other two light emitting devices 5. The resist layers in the first and second regions also function as protective films for the wiring to be formed. Furthermore, the resist layer may contain a reflective material, thereby improving the light extraction efficiency of the light emitting module 100.

[0048] The lens 70 may be configured to use a single lens or a compound lens corresponding to the number of light emitting devices 5. The lens surface of the compound lens is preferably formed as a Fresnel lens. The Fresnel lens is arranged so that one surface with concaves and convexes faces the light emitting devices 5 and light is emitted from the other flat surface.

[0049] Furthermore, the number of light-emitting devices 5 may be four, two, three, five, or more, as described above. The number of lens portions of the compound lens increases in accordance with the number of light-emitting devices. When four light-emitting devices are used, the light-emitting devices may be arranged in a matrix, with the light-emitting devices 5 emitting white light arranged in the first row and the first column and the second row and the light-emitting devices 5 emitting amber light arranged in the second row and the first column, alternating in an array. Therefore, the light-emitting module 100 can prevent uneven illuminance distribution among the emitted colors by covering the light-receiving element 10 with a covering member 30 of a similar color to the surrounding components. Furthermore, the light-emitting module 100 can irradiate the illumination color uniformly within the illumination range, even with the color-adjusted light from the light-emitting device 5. [Explanation of symbols]

[0050] 1 Light-emitting element 2. Element electrode 3 Translucent material 4 Protective materials 5. Light-emitting device 10 Photodetector 11 Element housing 12 Light receiving part 13 wires 20 Electronic Components 30 Covering material 30A top 30a Covering member 30b Covering member 31 Upper surface of the other side (covering member) 32 Upper surface of one side (covering member) 40 boards 41 Conductor wiring 60 Support substrate 70 lenses 71 Lens Frame 80 cover slips 90 Case 100, 100A light emitting module NR Jet Dispenser Manufacturing method for S10 and S10A light-emitting modules S11 Preparation process S12 Coating process S13 Lens placement process S12a 1st dropping process S12b 2nd dropping process S12c 3rd dropping process

Claims

1. A method for manufacturing a light emitting module including a substrate, a light emitting element and a light receiving element mounted on the substrate, and a lens facing the light emitting element and the light receiving element, the method comprising: a preparation step of preparing a substrate on which the light emitting element and the light receiving element are mounted adjacent to each other; a covering step of covering the light receiving element with a covering member; a lens arranging step of arranging the lens so as to face the light emitting element and the light receiving element, The method for manufacturing a light-emitting module includes a first dripping process in which the covering material is dripped onto one side of the light-receiving element that is farther from the light-emitting element, and a second dripping process in which the covering material is dripped onto the other side of the light-receiving element that is closer to the light-emitting element so that the covering material dripped onto one side contacts the side of the light-emitting element.

2. In the coating step, the first dropping step includes dropping the covering member onto the upper surface of the one side of the light-receiving element a plurality of times along the one side of the light-receiving element; The method for manufacturing a light emitting module according to claim 1 , wherein the second dropping step drops the covering member onto the upper surface of the other side of the light receiving element a plurality of times along the other side of the light receiving element.

3. the light-emitting element and the light-receiving element are rectangular in plan view, 3. The method for manufacturing a light-emitting module according to claim 1, wherein the light-emitting element and the light-receiving element are mounted on the substrate so that one side of each of the light-emitting elements and the light-receiving element faces each other in a plan view.

4. the light receiving element is connected to the substrate via a wire, 4. The method for manufacturing a light-emitting module according to claim 1, wherein the covering step includes a third dropping step of dropping the covering material onto the wire.

5. In a plan view, in a direction from the other side to the one side, 5. The method for manufacturing a light-emitting module according to claim 1, wherein a maximum distance between the light-emitting element and the light-receiving element is smaller than a maximum distance from the light-receiving element to an end of the substrate.

6. 6. The method for manufacturing a light-emitting module according to claim 1, wherein the coating step involves dropping the coating material using a jet dispenser.

7. 7. The method for manufacturing a light-emitting module according to claim 1, wherein the covering step uses a translucent resin containing a coloring substance as the covering member.

8. A substrate; a light emitting element and a light receiving element mounted adjacent to each other on the substrate; a lens disposed at a position facing the light emitting element and the light receiving element and spaced apart from the light emitting element and the light receiving element; a covering member exposing an upper surface of the light-emitting element and covering an upper surface of the light-receiving element, the light receiving element has a light receiving portion on an upper surface closer to the light emitting element, the covering member covering the upper surface of the light receiving element is disposed so as to be in contact with a side surface of the light emitting element, In a plan view, a top portion of the covering member that covers the light receiving element is spaced apart from the light receiving portion, A light-emitting module is located on the top surface farther from the light-emitting element.

9. A plurality of the light-emitting elements are provided, The light-emitting module according to claim 8 , wherein the lens is a compound lens having a plurality of lens portions corresponding to the light-emitting elements.

10. 10. The light-emitting module according to claim 8, wherein the light-receiving element is disposed directly below the lens in a plan view.

11. 11. The light-emitting module according to claim 8, wherein the covering member is disposed so that the thickness of the other side where the light-receiving portion of the light-receiving element is located is thinner than that of the one side.

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