Light-emitting module and method for manufacturing the same

Abstract

To provide a light-emitting module that suppresses emitted light from being scattered, and a method of manufacturing the light-emitting module.SOLUTION: A light-emitting module comprises: a plurality of light-emitting elements 1; a first substrate 10 having a first external connection terminal 11 and a second external connection terminal 12 arranged on one side and the other side across an element mount region 13 where the light-emitting elements are mounted; a second substrate 20 having a first wire connection terminal 21 and a second wire connection terminal 22 arranged along one side and the other side across a substrate mount region 23 where the first substrate is mounted; a plurality of first wires 31 electrically connecting the first external connection terminal and first wire connection terminal; a plurality of second wires 32 electrically connecting the second external connection terminal and the second wire connection terminal; and dark-color coating resin 40 covering the first wire and second wire and encircling the element mount region at an adjacent position, the coating resin being made different in height between a top of a first wire and the wire, and between a top of a second wire and the wire.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a light emitting module and a method for manufacturing the light emitting module. [Background technology]

[0002] Conventionally, light emitting modules using multiple light emitting elements have been used as light sources for vehicles and projectors. When a light emitting module is used, light is irradiated via a lens on the optical path. In the light emitting module, a black resin is disposed at a position away from the light extraction surface of the light emitting element, so that the surface of the resin can be processed and light reflection can be prevented (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-212301 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in conventional light-emitting modules, the light-emitting element and the black resin are separated by a distance, which makes it difficult to suppress scattered light, and there is a demand for an improvement in light extraction efficiency. An object of an embodiment according to the present disclosure is to provide a light-emitting module that suppresses scattered light and has excellent light extraction efficiency, and a method for manufacturing the light-emitting module. [Means for solving the problem]

[0005] A light-emitting module according to an embodiment of the present disclosure includes a first substrate having a plurality of light-emitting elements and an element mounting area on which the plurality of light-emitting elements are mounted and electrically connected, the first substrate having, outside the element mounting area, a plurality of first external connection terminals arranged on one side of the element mounting area and a plurality of second external connection terminals arranged on the other side opposite the element mounting area; a second substrate having a substrate mounting area on which the first substrate is mounted, the second substrate having, outside the substrate mounting area, a plurality of first wire connection terminals arranged along one side of the substrate mounting area and a plurality of second wire connection terminals arranged along the other side opposite the substrate mounting area; and a light-emitting module electrically connecting the first external connection terminals and the first wire connection terminals. and arranged along one side of the first substrate; a plurality of second wires that electrically connect the second external connection terminal and the second wire connection terminal and are arranged along the other side of the first substrate; and a dark-colored coating resin that covers the plurality of first wires and the plurality of second wires and surrounds the element mounting area at adjacent positions, wherein, in a cross-sectional view at a position where the tops of the plurality of first wires are connected, the height of the coating resin between adjacent first wires is lower than the height at the point where the first wires are arranged, and, in a cross-sectional view at a position where the tops of the plurality of second wires are connected, the height of the coating resin between adjacent second wires is lower than the height at the point where the second wires are arranged.

[0006] A method for manufacturing a light emitting module according to an embodiment of the present disclosure includes the steps of: mounting a plurality of light emitting elements on an element mounting area of ​​a first substrate; mounting and connecting the first substrate on a substrate mounting area of ​​a second substrate; connecting, with a plurality of first wires, a plurality of first external connection terminals arranged on one side of the element mounting area of ​​the first substrate outside the element mounting area to a plurality of first wire connection terminals arranged along one side of the element mounting area of ​​the second substrate outside the substrate mounting area; connecting, with a plurality of second wires, a plurality of second external connection terminals arranged on the other side opposite to the one side across the element mounting area of ​​the first substrate outside the element mounting area to a plurality of second wire connection terminals arranged along the other side opposite to the one side across the substrate mounting area of ​​the second substrate outside the substrate mounting area; and forming a dark-colored first resin frame in a position on the second substrate outside the plurality of first wires and the plurality of second wires that surrounds the first substrate; and filling the space between the first resin frame and the second resin frame with a dark-colored coating resin having a lower viscosity than the first resin frame and the second resin frame, wherein the coating resin is formed so that, in a cross-sectional view taken along a line connecting the tops of the plurality of first wires, the height of the coating resin between adjacent first wires is lower than the height at the point where the first wire is arranged, and so that, in a cross-sectional view taken along a line connecting the tops of the plurality of second wires, the height of the coating resin between adjacent second wires is lower than the height at the point where the second wire is arranged. [Effects of the Invention]

[0007] According to an embodiment of the present disclosure, it is possible to provide a light-emitting module that suppresses scattered light and has excellent light extraction efficiency, and a method for manufacturing the same. [Brief explanation of the drawings]

[0008] [Figure 1]1 is a perspective view schematically illustrating the entire light-emitting module according to an embodiment. [Figure 2] 1 is a plan view schematically illustrating the entire light-emitting module according to an embodiment. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. [Figure 4] FIG. 4 is a cross-sectional view of a portion taken along line IV-IV in FIG. 2. [Figure 5] 3 is an enlarged cross-sectional view schematically illustrating the second wire and the coating resin in FIG. 2. FIG. [Figure 6A] FIG. 3 is a cross-sectional view taken along line VIA-VIA in FIG. 2. [Figure 6B] FIG. 3 is a cross-sectional view taken along line VIB-VIB in FIG. [Figure 7] 7 is an enlarged cross-sectional view schematically showing a portion taken along line VII-VII in FIG. 2. FIG. [Figure 8] 10 is a plan view schematically showing the state of the first wire, the second wire, and the third wire with the coating resin removed from between the first resin frame and the second resin frame in the light-emitting module according to the embodiment. FIG. [Figure 9] 1 is a flowchart illustrating a method for manufacturing a light emitting module according to an embodiment. [Figure 10A] 3 is a plan view schematically showing a first substrate in the method for manufacturing the light emitting module according to the embodiment. FIG. [Figure 10B] 3 is a plan view of a first substrate, schematically illustrating a state in which a light emitting element is mounted on an element mounting region in a manufacturing method for a light emitting module according to an embodiment. FIG. [Figure 10C] 10A and 10B are schematic diagrams illustrating enlarged views of a portion of the alignment of light emitting elements in a method for manufacturing a light emitting module according to an embodiment. [Figure 10D] 5 is a plan view schematically showing a second substrate in the method for manufacturing the light emitting module according to the embodiment. FIG. [Figure 10E] 10 is a plan view schematically showing a state in which a first substrate is placed on a substrate placement area of ​​a second substrate in a manufacturing method of a light emitting module according to an embodiment. FIG. [Figure 10F]FIG. 10 is a plan view schematically showing a state in which a first wire is connected to a first external connection terminal and a first wire connection terminal, a second wire is connected to a second external connection terminal and a second wire connection terminal, and a third wire is connected to a first drive terminal and a second drive terminal in a manufacturing method of a light-emitting module according to an embodiment. [Figure 10G] 10 is a plan view showing a state in which the first resin frame and the second resin frame have been formed in the method for manufacturing the light emitting module according to the embodiment. FIG. [Figure 11A] 10 is an explanatory diagram showing a cross section of the difference in height between the position of the top of the first wire and the position between the wires in the coating resin of the light-emitting module according to the embodiment; FIG. [Figure 11B] 10 is an explanatory diagram showing a cross section of another embodiment for explaining the difference in height between the position of the top of the first wire and the position between the wires in the coating resin of the light-emitting module according to the embodiment; FIG. [Figure 11C] 10 is an explanatory diagram showing a cross section of another embodiment for explaining the difference in height between the position of the top of the first wire and the position between the wires in the coating resin of the light-emitting module according to the embodiment; FIG. [Figure 12] 10 is a cross-sectional view schematically showing a modified example of the second substrate of the light-emitting module according to the embodiment. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] The light emitting device according to the embodiment will be described below with reference to the drawings. Note that the size and positional relationship of components shown in each drawing may be exaggerated for clarity of explanation. Also, the dimensions and position of each component may not strictly match between the plan view and the corresponding cross-sectional view. Furthermore, in the following description, up, down, left, right, front, and back are relative and do not indicate absolute directions. Furthermore, the same names and symbols generally indicate the same or similar components, and detailed explanations may be omitted as appropriate.

[0010] First Embodiment [Configuration of light-emitting device] The configuration of the light emitting device according to the embodiment will be described with reference to FIGS. FIG. 1 is a perspective view schematically showing the entire light-emitting module according to the embodiment. FIG. 2 is a plan view schematically showing the light-emitting module according to the embodiment. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. FIG. 4 is a cross-sectional view of a portion taken along line IV-IV in FIG. 2. FIG. 5 is an enlarged cross-sectional view schematically showing the second wire and coating resin in FIG. 2. FIG. 6A is a cross-sectional view taken along line VIA-VIA in FIG. 2. FIG. 6B is a cross-sectional view taken along line VIB-VIB in FIG. 2. FIG. 7 is an enlarged cross-sectional view schematically showing the portion taken along line VII-VII in FIG. 2. FIG. 8 is a plan view schematically showing the state of the first wire, the second wire, and the third wire after removing the coating resin between the first resin frame and the second resin frame in the light-emitting module according to the embodiment.

[0011] The light-emitting module 100 has a plurality of light-emitting elements 1 and an element mounting area 13 on which the plurality of light-emitting elements 1 are electrically connected and mounted, and further has a first substrate 10 having a plurality of first external connection terminals 11 arranged on one side of the element mounting area 13 outside the element mounting area 13 and a plurality of second external connection terminals 12 arranged on the other side opposite the element mounting area 13, and a substrate mounting area 23 (see FIG. 10D) on which the first substrate 10 is mounted, and further has a plurality of first wire connection terminals 21 arranged along one side of the substrate mounting area 23 outside the substrate mounting area 23. and a second substrate (20) having a plurality of second wire connection terminals (22) arranged along the other side opposite the substrate mounting area (23); a plurality of first wires (31) electrically connecting the first external connection terminals (11) and the first wire connection terminals (21) and arranged along one side of the first substrate (10); a plurality of second wires (32) electrically connecting the second external connection terminals (12) and the second wire connection terminals (22) and arranged along the other side of the first substrate (10); and a dark-colored coating resin (40) covering the plurality of first wires (31) and the plurality of second wires (32) and surrounding the element mounting area (13) at an adjacent position.

[0012] The coating resin 40 is formed so that, in a cross-sectional view at a position where the apexes 31a of the plurality of first wires 31 are connected, the height of the coating resin 40 between adjacent first wires 31 is lower than the height at the point where the first wires 31 are arranged, and, in a cross-sectional view at a position where the apexes 32a of the plurality of second wires 32 are connected, the height of the coating resin 40 between adjacent second wires 32 is lower than the height at the point where the second wires 32 are arranged. Note that the light-emitting module 100 is provided with a wavelength conversion member 5 on the light extraction surface side of the light-emitting element 1, and with a reflective member 7 covering the side surface of the light-emitting element 1. That is, the light-emitting module 100 includes a plurality of light-emitting elements 1, a first substrate 10 on which the light-emitting elements 1 are mounted and which has a first external connection terminal 11 and a second external connection terminal 12, a second substrate 20 on which the first substrate 10 is mounted and which has a first wire connection terminal 21 and a second wire connection terminal 22, a first wire 31 and a second wire 32 which electrically connect the first substrate 10 and the second substrate 20, a rectangular ring-shaped coating resin 40 provided around the light-emitting elements 1 on the first substrate 10 so as to cover the first wire 31 and the second wire 32, a reflective member 7 which covers the side surfaces of the light-emitting elements 1, and a wavelength conversion member 5 provided on the light extraction surface of the light-emitting elements 1. Each component will be described below.

[0013] (First board) The first substrate 10 comprises a flat support member, an element mounting region 13 on the upper surface and inside of the support member where wiring is formed, a first external connection terminal 11, and a second external connection terminal 12. The first substrate 10 is a semiconductor substrate made of silicon or the like, and portions of the upper surface where the wiring is not exposed are covered with an insulating film. The wiring forms a semiconductor integrated circuit. The element mounting area 13 is an area where the light emitting element 1 and the protective element are mounted and wiring is arranged to form a predetermined electric circuit. The element mounting area 13 can be a rectangular area in a plan view. This element mounting area 13 is a rectangular area. The element mounting area 13 is also an area located between the first external connection terminal 11 and the second external connection terminal 12, and is equivalent to the wavelength conversion member 5 described below, or an area surrounding the portion to which the light emitting element 1 is connected. A plurality of first external connection terminals 11 are formed outside the element mounting region 13 on one long side of the rectangular element mounting region 13. These first external connection terminals 11 are terminals to which one ends of first wires 31 are connected. Here, as an example, the first external connection terminals 11 are each formed into a rectangle and spaced apart from each other and aligned in a row along one long side of the element mounting region 13. The first external connection terminals 11 can be aligned at equal intervals. The interval at which the first external connection terminals 11 are aligned can be 20 μm or more and 100 μm or less. A plurality of second external connection terminals 12 are formed outside the element mounting region 13 along the other long side of the rectangular element mounting region 13 (the side opposite the one long side across the element mounting region 13). These second external connection terminals 12 are terminals to which one end of the second wires 32 is connected. Here, as an example, the second external connection terminals 12 are each formed into a rectangle and spaced apart from each other in a row along the other long side of the element mounting region 13. The second external connection terminals 12 can be aligned at equal intervals. The interval at which the second external connection terminals 12 are aligned can be 20 μm or more and 100 μm or less. The interval at which the first external connection terminals 11 are aligned and the interval at which the second external connection terminals 12 are aligned may be the same.

[0014] As an example, the first substrate 10 has first driving terminals 15 for driving the light-emitting elements 1 formed on the outer side of the external connection terminals at a distance from each other. A third wire 33, which will be described later, is connected to the first driving terminals 15. In addition, the light-emitting elements 1 mounted on the first substrate 10 may be aligned in multiple units in the vertical and horizontal directions, with multiple light-emitting elements 1 connected by wiring across one first external connection terminal 11 and one second external connection terminal 12, and the wiring pattern may be such that multiple light-emitting elements 1 are connected in series or parallel in groups of a predetermined number. The first external connection terminal 11 and the second external connection terminal 12 are provided on the upper surface of the support member and can be formed using, for example, a metal such as Cu, Ag, Au, Al, Pt, Ti, W, Pd, Fe, or Ni, or an alloy thereof. Such first external connection terminal 11 and second external connection terminal 12 can be formed by electrolytic plating, electroless plating, vapor deposition, sputtering, or the like. Furthermore, for example, when Au bumps are used to mount the light-emitting element 1, using Au on the outermost surface of the wiring improves the bondability with the light-emitting element 1.

[0015] (Second board) The second substrate 20 includes a flat base material, a substrate mounting area 23 arranged on the upper surface of the base material, a first wire connection terminal 21, and a second wire connection terminal 22. The substrate mounting area 23 is an area where the first substrate 10 is mounted via a bonding member. This substrate mounting area 23 is located, for example, between the first wire connecting terminal 21 and the second wire connecting terminal 22, and is set as an area having the same area as the area of ​​the first substrate 10. If the first substrate 10 is rectangular in plan view, the substrate mounting area 23 can also be rectangular. A plurality of first wire connection terminals 21 are formed outside the rectangular substrate mounting area 23 on one long side of the substrate mounting area 23. These first wire connection terminals 21 are terminals to which the other ends of the first wires 31 are connected. Here, as an example, the first wire connection terminals 21 are each formed into a rectangle and spaced apart from each other in a row along one long side of the substrate mounting area 23. The first wire connection terminals 21 can be aligned at equal intervals. The interval at which the first wire connection terminals 21 are aligned can be 50 μm or more and 200 μm or less. A plurality of second wire connection terminals 22 are formed outside the substrate mounting area 23 on the other long side of the rectangular substrate mounting area 23 (the side opposite the one long side across the substrate mounting area 23 from the aforementioned one long side). These second wire connection terminals 22 are terminals to which the other ends of the second wires 32 are connected. Here, as an example, the second wire connection terminals 22 are each formed into a rectangle and spaced apart from each other in a row along the other long side of the substrate mounting area 23. The second wire connection terminals 22 can be aligned at equal intervals. The interval at which the second wire connection terminals 22 are aligned can be 50 μm or more and 200 μm or less. The interval at which the first wire connection terminals 21 are aligned and the interval at which the second wire connection terminals 22 are aligned may be the same. The first wire connection terminal 21 and the second wire connection terminal 22 are provided on the upper surface of the substrate and can be formed, for example, using the same material and forming method as the first external connection terminal 11 and the second external connection terminal 12 already described.

[0016] The substrate is preferably made of a material with high heat dissipation properties, and more preferably a material with high light-shielding properties and substrate strength. Specific examples include ceramics such as alumina, aluminum nitride, and mullite; resins such as phenolic resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), and polyphthalamide (PPA); and composite materials composed of resin and metal or ceramic. The substrate mounting area 23 of the substrate uses a bonding material for bonding the first substrate 10, such as sintered Ag, solder, or adhesive resin. The substrate may be flat, or may have a cavity on its upper surface into which a heat dissipation member is inserted.

[0017] The first wire 31 and the second wire 32 may be conductive wires made of metals such as gold, copper, platinum, and aluminum, or alloys containing at least these metals. Gold, which has excellent thermal resistance, is particularly preferable. The diameter of the wire is preferably 15 μm or more and 70 μm or less, and more preferably 23 μm or more and 45 μm or less. Here, a third wire 33 is used to handle a driving signal for turning on and off the light-emitting element 1. The third wire 33 is connected to a first driving terminal 15 formed on the first substrate 10 outside the first external connection terminal 11 and a second driving terminal 16 formed on the second substrate 20. The third wire 33 is made of the same material as the first wire 31 or the second wire 32, except for its length.

[0018] The first wires 31 connected to the first external connection terminals 11 and the first wire connection terminals 21 can be arranged so as to be perpendicular to the long sides of the first substrate 10 in a plan view. The second wires 32 connected to the second external connection terminals 12 and the second wire connection terminals 22 can be arranged so as to be perpendicular to the long sides of the first substrate 10 in a plan view. Furthermore, of the aligned first wires 31, the first wires 31 located in the center may be arranged so as to be perpendicular to the long sides of the first substrate 10 in a planar view as described above, while the first wires 31 located on the edge sides may be arranged diagonally to the long sides of the first substrate 10 in a planar view. The same applies to the second wires 32. The interval at which the multiple first wires 31 are aligned may be the same as or different from the interval at which the multiple first wires 31 are aligned. The interval at which the first wires 31 are aligned may be 20 μm or more and 100 μm or less. The interval at which the second wires 32 are aligned may be 20 μm or more and 100 μm or less. The interval at which the first wires 31 are aligned may be the same as the interval at which the second wires 32 are aligned.

[0019] (light-emitting element) The light-emitting element 1 has, for example, a substantially rectangular shape in plan view, and includes a light-transmitting substrate and a semiconductor laminate, with a pair of electrodes provided on the surface of the semiconductor laminate. The light-emitting element 1 preferably has a pair of positive and negative electrodes on the same side. This allows the light-emitting element 1 to be flip-chip mounted on the first substrate 10. In this case, the surface opposite to the surface on which the pair of electrodes is formed becomes the main light extraction surface of the light-emitting element 1. In the light-emitting module 100, the light-emitting elements 1 are used aligned in a matrix direction at predetermined intervals. The light emitting element 1 can be selected from those with any wavelength. For example, a blue-green light emitting element 1 can be made of ZnSe or nitride semiconductor (In X Al Y Ga 1-X-Y N, 0≦X, 0≦Y, X+Y≦1), or GaP can be selected. Furthermore, nitride semiconductors represented by GaAlAs and AlInGaP can be suitably used as the red light emitting element 1. Furthermore, semiconductor light emitting elements made of materials other than these can also be used. The composition, emission color, size, number, etc. of the light emitting element 1 to be used can be appropriately selected depending on the purpose.

[0020] (protective element) The light-emitting module 100 may include a semiconductor element (e.g., a protective element) different from the light-emitting element 1. The protective element is provided to protect the light-emitting element 1 from electrostatic discharge. A Zener diode can be suitably used as the protective element. The protective element may not be provided depending on the use of the light-emitting module. When a semiconductor element other than the light-emitting element 1, such as a protective element or a transistor for driving and controlling the light-emitting element 1, is provided on the first substrate 10, it is preferable to arrange it between the element mounting region 13 and the first resin frame 41.

[0021] (jointing material) As shown in FIG. 7, the light-emitting element 1 is bonded to wiring provided on the upper surface of the first substrate 10 by a bonding member, which is a conductive member for mechanically and electrically bonding. When flip-chip mounting the light-emitting element 1 on the first substrate 10, metal bumps made of metal materials such as Au, Ag, Cu, and Al, such as wire bumps and plated bumps, can be used as the bonding member. The metal bumps may be provided in advance so as to bond to the n-side electrode and p-side electrode of the light-emitting element 1 or to each wiring, before bonding the light-emitting element 1 to the first substrate 10. In this case, the light-emitting element 1 can be bonded to the first substrate 10 by ultrasonic bonding. The bonding material may be a solder such as an AuSn alloy or a Sn-based lead-free solder. In this case, the light-emitting element 1 can be bonded to the first substrate 10 by a reflow method. The bonding material may also be a conductive adhesive made of resin containing conductive particles. The bonding members can be formed by plating, and examples of the material include copper.

[0022] (reflective material) As shown in FIGS. 3, 4, and 7, the reflective member 7 is a member that covers the side surface of the light-emitting element 1. The reflective member 7 seals the light-emitting element 1 to protect it from external forces, dust, gas, and the like, and is provided to improve the heat resistance, weather resistance, and light resistance of the light-emitting element 1 and the like. The reflective member 7 also reflects light emitted from the side surface of the light-emitting element 1, allowing it to be emitted from the upper surface of the wavelength conversion member 5, which is the light-emitting surface of the light-emitting module 100. This improves the light extraction efficiency of the light-emitting module 100, makes the boundary between the light-emitting area and the non-light-emitting area clear without blurring (improves visibility), and also improves the contrast ratio between the light-emitting area and the non-light-emitting area. The reflective member 7 is also provided spaced apart from the coating resin 40 (first resin frame 41).

[0023] The reflective member 7 is preferably made of a soft resin with relatively low elasticity and excellent shape conformability. The reflective member 7 can be made of a resin material with good transparency and insulating properties, such as a thermosetting resin such as an epoxy resin or a silicone resin. The reflective member 7 is preferably made of a white resin that is imparted with light reflectivity by incorporating particles of a light-reflecting material into the base resin. Examples of light-reflecting materials that can be used include titanium oxide, aluminum oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, and glass filler. The white resin can impart light reflectivity to the reflective member 7. The reflective member 7, which covers the side surfaces of the light-emitting element 1, is not limited to a reflective material and may be made of a light-absorbing material (black resin).

[0024] Before providing the reflective member 7, an underfill may be provided on the lower surface of the light-emitting element 1 and the upper surface of the first substrate 10. The underfill fills the space between the upper surface of the first substrate 10 and the lower surface of the light-emitting element 1, and is provided to a height that covers part of the side surface of the light-emitting element 1. When an underfill is provided, the reflective member 7 is formed on top of the underfill. The underfill can be made of the same resin or light-reflective material as the reflective member 7.

[0025] (wavelength conversion material) The wavelength conversion member 5 is provided on the upper surface side of the plurality of light-emitting elements 1. The wavelength conversion member 5 has a substantially rectangular shape in a plan view, and contains a material that can convert light emitted from the light-emitting elements 1 and extract the converted light to the outside. The side surfaces of the wavelength conversion member 5 may be covered with a light-blocking material. When the side surfaces of the wavelength conversion member 5 are covered with a light-blocking material, the contrast ratio between the light-emitting area and the non-light-emitting area is improved. Alternatively, the side surfaces of the wavelength conversion member 5 may not be covered with a light-blocking material. In this case, light is not absorbed by the side surfaces of the wavelength conversion member 5, and therefore light extraction is improved. The wavelength conversion member 5 has a substantially rectangular shape that is larger than the aggregate of all the aligned light emitting elements 1 in a plan view, and is disposed so as to encompass and cover the element mounting region 13 in which the light emitting elements 1 are disposed.

[0026] The wavelength conversion member 5 is a translucent member containing a light diffusing material and a wavelength conversion material (e.g., a phosphor) that converts at least a portion of the light incident from the light-emitting element 1 into light of a different wavelength. Examples of the wavelength conversion member 5 include film (sheet), plate, and layered materials applied by spraying. Specific examples of wavelength conversion materials include a sintered body of a phosphor and a material such as YAG glass, in which phosphor powder is impregnated in resin, glass, or other inorganic materials. The phosphor sintered body may be formed by sintering only the phosphor, or may be formed by sintering a mixture of the phosphor and a sintering aid. When sintering a mixture of the phosphor and the sintering aid, it is preferable to use an inorganic material such as silicon oxide, aluminum oxide, or titanium oxide as the sintering aid. This prevents discoloration and deformation of the sintering aid due to light or heat, even when the light-emitting element 1 has a high output. The wavelength conversion member 5 preferably has high transparency. The thickness of the wavelength conversion member 5 is not particularly limited and can be changed as appropriate, but can be set to, for example, about 50 μm or more and 300 μm or less.

[0027] The phosphor can be selected from phosphors used in this field. For example, phosphors that can be excited by blue or ultraviolet light-emitting elements include cerium-activated yttrium-aluminum-garnet phosphors (Ce:YAG), cerium-activated lutetium-aluminum-garnet phosphors (Ce:LAG), nitrogen-containing calcium aluminosilicate phosphors (CaO-Al2O3-SiO2) activated with europium and / or chromium, europium-activated silicate phosphors ((Sr,Ba)2SiO4), β-sialon phosphors, nitride-based phosphors such as CASN phosphors and SCASN phosphors, KSF phosphors (K2SiF6:Mn), sulfide-based phosphors, and quantum dot phosphors. By combining these phosphors with blue or ultraviolet light-emitting elements, light-emitting devices of various colors (e.g., white light-emitting devices) can be manufactured. When light-emitting module 100 is configured to be capable of emitting white light, the white light is adjusted by adjusting the type and concentration of the phosphor contained in wavelength conversion member 5. The concentration of the phosphor contained in wavelength conversion member 5 is, for example, about 5 to 50 mass %. Examples of light diffusing materials that can be contained in wavelength conversion member 5 include titanium oxide, barium titanate, aluminum oxide, and silicon oxide.

[0028] (coating resin) The coating resin 40 is formed of a dark-colored resin that covers the first wire 31 and the second wire 32 and surrounds the element mounting region 13 at adjacent positions. Here, "adjacent positions" refers to a distance of 100 μm to 500 μm. The coating resin 40 is formed to also cover the third wire 33. The coating resin 40 is formed to be spaced apart from the wavelength conversion member 5 and surround the periphery with an annular rectangular frame (a frame whose inner and outer peripheries are both rectangular in plan view). Because the coating resin 40 is spaced apart from the wavelength conversion member 5, the optical contrast with the wavelength conversion member 5, which serves as the light extraction surface, becomes clear. (In other words, when the coating resin 40 and the wavelength conversion member 5 are in contact with each other, light emitted from the wavelength conversion member 5 penetrates the coating resin 40, making the area of ​​the coating resin 40 appear to glow. This blurs the boundary between the light-emitting area and the non-light-emitting area, and reduces the contrast ratio between the light-emitting area and the non-light-emitting area.) The distance between the wavelength conversion member 5 and the coating resin 40 is preferably 100 μm or more and 500 μm or less. If it is less than 100 μm, light from the light-emitting element is likely to penetrate the coating resin 40, and if it does penetrate, the contrast ratio between the light-emitting area and the non-light-emitting area will deteriorate as described above. If it is more than 500 μm, the package size will increase, resulting in higher costs.

[0029] Similarly, the distance between the reflective member 7 and the coating resin 40 is preferably 100 μm or more and 500 μm or less. The distance between the wavelength conversion member 5 and the coating resin 40 may be the same as or different from the distance between the reflective member 7 and the coating resin 40. Furthermore, the coating resin 40 is formed so that the width of the long-side region covering the first wire 31 and the second wire 32 is wide so as to cover the wires from the end of the wires on the external connection terminal side to the end of the wire connection terminal side, while the width of the short-side region of the coating resin 40 is narrower. Furthermore, the coating resin 40 is formed so that the top position 40MX of the long-side region is higher than that of the short-side region. The coating resin 40 is higher on the long-side side of the first substrate 10 and lower on the short-side side. In particular, the low height of the coating resin 40 on the short-side side allows light from the light-emitting element to be emitted to the outside without being blocked by the coating resin 40, thereby improving light extraction. Furthermore, the amount of resin used can be reduced by reducing the height of the coating resin 40 on the short-side side. The coating resin 40 is formed so that the top position 40MX of the coating resin 40 is higher than the top of the first resin frame 41 described below. The top position 40MX of the coating resin 40 may be higher than the top of the first resin frame 41.

[0030] The coating resin 40 is formed so that, in a cross-sectional view at a position where the apexes 31a of the multiple first wires 31 are connected, the height of the coating resin 40 between adjacent first wires 31 is lower than the height of the coating resin 40 at the position where the first wires 31 are arranged. Furthermore, the coating resin 40 is formed so that, in a cross-sectional view at a position where the apexes 32a of the multiple second wires 32 are connected, the height of the coating resin 40 between adjacent second wires 32 is lower than the height of the coating resin 40 at the position where the second wires 32 are arranged. Therefore, the coating resin 40 is formed so that it is higher at positions 40a of the apexes 31a of the first wires 31 and the apexes 32a of the second wires 32 and lower at positions 40b between the wires, resulting in a repeated unevenness in the cross-sectional view. By varying the height of the coating resin 40 in a cross-sectional view at the positions of the apexes 31a of the first wires 31 and the apexes 32a of the second wires 32, light from the light-emitting element 1 is more easily emitted to the outside. This is because light arriving at the location where the height of the coating resin 40 between the wires is lower is emitted to the outside without hitting the coating resin 40. In comparison, if the height of the coating resin 40 between the wires is approximately the same as the height of the coating resin 40 at the point where the wires are arranged, the light arriving between the wires will hit the coating resin 40, resulting in reduced light extraction. In addition, the dark color of the coating resin 40 can absorb light (scattered light) that has bounced off the lens. Furthermore, the uneven shape of the top surface of the coating resin 40 absorbs more light than a flat surface that is incident perpendicularly (or at an angle close to perpendicular) on the top surface of the coating resin 40.

[0031] Furthermore, the height difference of the uneven shape of the coating resin 40 between position 40a at the apex 31a of the first wire 31 and position 40b between the wires, and the height difference of the uneven shape of the coating resin 40 between position 40a at the apex 32a of the second wire 32 and position 40b between the wires, become gentler toward the inner periphery and outer periphery of the frame-shaped coating resin 40. The outer periphery of the frame is formed so as to be flush with the surface without any height difference. On the other hand, it is preferable that the uneven shape of the coating resin 40 remains near the inner periphery of the frame. The remaining height difference of the uneven shape of the coating resin 40 reduces the amount of light from the light-emitting element that strikes the coating resin 40, improving light extraction. The position 40MX of the top of the coating resin 40 and the position 40a of the coating resin 40 on the top 31a of the first wire 31 may be the same position or different positions. It is preferable that the uneven shape of the coating resin 40 in a cross-sectional view at the position where the apexes 31a of the multiple first wires 31 are joined is similar to the uneven shape of the coating resin 40 in a cross-sectional view at the position where the apexes 32a of the multiple second wires 32 are joined. By making the shapes similar, it is possible to make the light appear symmetrical.

[0032] The coating resin 40 can be made of, for example, a translucent base material containing a dark-colored material that is less likely to absorb or reflect light. The coating resin 40 can be made dark black by, for example, incorporating pigment, carbon powder, carbon black, or graphite into the base material and dispersing particles of a light-absorbing material. The base resin can be a thermosetting resin such as epoxy resin or silicone resin. The dark-colored carbon powder or pigment can be black or a color close to black that absorbs light.

[0033] The coating resin 40 may be provided between a first resin frame 41 provided to surround adjacent element mounting regions 13 on the first substrate 10 and a second resin frame 42 provided on the second substrate 20 to surround the first substrate 10 outside the first wires 31 and the second wires 32. That is, the coating resin 40 may be formed by first providing a frame-shaped resin dam and then filling the frame. The first resin frame 41 and the second resin frame 42 are formed to a predetermined height by providing multiple layers of resin with adjusted viscosity in the height direction. For example, the first resin frame 41 and the second resin frame 42 are formed by spraying resin adjusted to a predetermined viscosity from a nozzle once around the substrate, and then repeating this process to overlap the resin to reach the predetermined height.

[0034] The height of the second resin frame 42 may be higher than the height of the first resin frame when compared on the same plane. By making the second resin frame taller, it is possible to prevent the coating resin 40 from spilling out of the second resin frame. The resin used here may be a thermosetting resin such as an epoxy resin or a silicone resin. Note that the coating resin 40 filled into the first resin frame 41 and the second resin frame 42 after their formation preferably has a lower viscosity than the viscosity of the first resin frame 41 and the second resin frame 42. Note that the coating resin 40 may be formed by filling the gap between the first resin frame 41 and the second resin frame 42 multiple times. When the first substrate 10 is rectangular and the plurality of first external connection terminals 11, the plurality of second external connection terminals 12, the plurality of first wire connection terminals 21, and the plurality of second wire connection terminals 22 are arranged on the long side of the first substrate 10, it is preferable that the distance between the first resin frame 41 and the second resin frame 42 is narrower on the short side of the first substrate 10 than on the long side of the first substrate 10. This makes the top of the coating resin 40 provided on the short side of the first substrate 10 lower than the top of the coating resin 40 provided on the long side of the first substrate 10, improving light extraction.

[0035] The light emitting module 100 having the above configuration can be used, for example, as a light source for headlights on vehicles, ships, or aircraft. The light emitting module 100 may have a lens system arranged on its optical path. The light emitting module 100 turns on the light emitting elements 1 with an external power switch. The light emitting module 100 is configured so that some or all of the preset light emitting elements 1 can be turned on and off. Light emitted from the light emitting module 100 exits the wavelength converting member 5 along the optical path and is sent to a lens system arranged on the optical path.

[0036] In the light-emitting module 100, the coating resin 40 has a different height between the position 40a of the apex 31a of the first wire 31 and the position 40b between the first wires, and also between the position 40a of the apex 32a of the second wire 32 and the position 40b between the second wires, thereby forming an uneven shape. Therefore, light directed toward a position where the coating resin 40 has a lower height is emitted to the outside, improving light extraction. In addition, in the light-emitting module 100, scattered light reflected and returned from a lens system disposed on the optical path can be absorbed by the coating resin 40 formed adjacent to the light-emitting surface. Furthermore, light reflected and returned from the lens system that is incident perpendicularly (or at an angle close to perpendicular) on the top surface of the coating resin 40 is absorbed more than with a flat surface due to the uneven top surface of the coating resin 40. Therefore, the light-emitting module 100 suppresses scattered light returning from the lens system and has high light extraction efficiency.

[0037] [Method of manufacturing a light-emitting device] Next, a method for manufacturing the light emitting module will be described with reference to FIGS. 9 to 10G. FIG. 9 is a flowchart illustrating a manufacturing method of a light emitting module according to an embodiment. FIG. 10A is a plan view schematically illustrating a first substrate in a manufacturing method of a light emitting module according to an embodiment. FIG. 10B is a plan view of the first substrate schematically illustrating a state in which light emitting elements are mounted on an element mounting area in a manufacturing method of a light emitting module according to an embodiment. FIG. 10C is a schematic enlarged view of a portion of an aligned state of light emitting elements in a manufacturing method of a light emitting module according to an embodiment. FIG. 10D is a plan view schematically illustrating a second substrate in a manufacturing method of a light emitting module according to an embodiment. FIG. 10E is a plan view of the second substrate schematically illustrating a state in which the first substrate is mounted on the substrate mounting area of ​​the second substrate in a manufacturing method of a light emitting module according to an embodiment. FIG. 10F is a plan view schematically illustrating a state in which a first wire is connected to a first external connection terminal and a first wire connecting terminal, a second wire is connected to a second external connection terminal and a second wire connecting terminal, and a third wire is connected to a first drive terminal 15 and a second drive terminal 16 in a manufacturing method of a light emitting module according to an embodiment. 10GF is a plan view showing the state after the first resin frame and the second resin frame are formed in the manufacturing method of the light-emitting module according to the embodiment. Note that the light-emitting elements 1 are placed with a predetermined interval between them, but the interval is omitted in the drawings other than FIG. 10C due to size considerations.

[0038] The method for manufacturing the light-emitting module includes an element mounting step S11 in which a plurality of light-emitting elements 1 are mounted and connected to an element mounting area 13 of a first substrate 10, a first substrate mounting step S13 in which the first substrate 10 is mounted on a substrate mounting area 23 of a second substrate 20, and a first wire mounting step S13 in which a plurality of first external connection terminals 11 arranged on one side of the element mounting area 13 outside the element mounting area 13 of the first substrate 10 and a plurality of first wire connection terminals 21 arranged along one side of the element mounting area 13 outside the substrate mounting area 23 of the second substrate 20 are connected by a plurality of first wires 31, and a plurality of second external connection terminals 12 arranged on the other side opposite to the one side with the element mounting area 13 sandwiched between them outside the element mounting area 13 of the first substrate 10 and a substrate mounting step S13 in which the first substrate 10 is mounted on the substrate mounting area 23 outside the substrate mounting area 23 of the second substrate 20. The process includes a wire connection process S14 in which a plurality of second wires 32 are connected to a plurality of second wire connection terminals 22 arranged along one side of the element mounting area 23 and the other side opposite the side of the element mounting area 23; a resin frame formation process S15 in which a dark-colored first resin frame 41 is formed on the first substrate 10 in a position adjacent to and surrounding the element mounting area 13 and inside the plurality of first external connection terminals 11 and the plurality of second external connection terminals 12, and a dark-colored second resin frame 42 is formed on the second substrate 20 in a position outside the plurality of first wires 31 and the plurality of second wires 32 and surrounding the first substrate 10; and a resin filling process S16 in which a dark-colored coating resin 40 having a lower viscosity than the first resin frame 41 and the second resin frame 42 is filled between the first resin frame 41 and the second resin frame 42.

[0039] The light emitting module manufacturing method also includes a wavelength conversion member forming step S17, which is a step of forming a wavelength conversion member 5 on the upper surface side of the plurality of light emitting elements, after the resin filling step S16 of filling with coating resin 40. Furthermore, the light emitting module manufacturing method includes a reflective member forming step S12, which is a step of forming a reflective member 7 that reflects light on each side surface of the plurality of light emitting elements 1, before the first substrate placing step S13. Each step will be described below.

[0040] The element mounting step S11 is a step of mounting and connecting multiple light-emitting elements 1 to the element mounting region 13 of the first substrate 10. In the element mounting step S11, multiple light-emitting elements 1 are attached to a sapphire substrate, then transferred to a support substrate, and individually diced to a size corresponding to the element mounting region 13 of the first substrate 10. These individual elements are then bonded to the element mounting region 13. Furthermore, before the light-emitting elements 1 are mounted on the first substrate 10, first external connection terminals 11 and second external connection terminals 12 and wiring are formed. The first external connection terminals 11 and second external connection terminals 12 can be formed by attaching a metal foil such as Cu or Al, applying a paste of metal powder such as Cu or Ag, or plating with Cu or the like. Furthermore, wiring electrically connected to the light-emitting elements 1 can be patterned by etching, printing, or the like. The light-emitting elements 1 can be electrically connected to the element mounting region 13 on the first substrate 10 by plating. The light emitting elements 1 are arranged in rows and columns at predetermined intervals.

[0041] The reflective member forming step S12 is a step of forming a reflective member to cover the side surfaces of the light-emitting element 1 after the light-emitting element 1 is mounted on the element mounting region 13 of the first substrate 10. When the reflective member forming step S12 is performed, after the light-emitting element 1 is mounted on the first substrate 10, a reflective member, such as a white resin, is provided on the side surfaces of the light-emitting element 1 by filling the spaces between the light-emitting elements 1. In the reflective member forming step S12, it is preferable to provide a mask on the upper surface of the light-emitting element 1 before filling the white resin. Removing the mask after filling the white resin can prevent the white resin from being formed on the upper surface of the light-emitting element 1.

[0042] The first substrate placing step S13 is a step of placing the first substrate 10 on the substrate placing area 23 of the second substrate 20. In the first substrate placing step S13, the first substrate 10 on which the light-emitting element 1 is placed is bonded to the substrate placing area 23 of the second substrate 20 with a bonding material such as sintered Ag. Note that the second substrate 20 has wiring such as a first wire connecting terminal 21 and a second wire connecting terminal 22 formed in advance. Furthermore, when a third wire 33 is used, a first driving terminal 15 and a second driving terminal 16 are also formed.

[0043] The wire connecting step S14 is a step of connecting the plurality of first external connection terminals 11 of the first substrate 10 to the plurality of first wire connection terminals 21 of the second substrate 20 with a plurality of first wires 31, and connecting the plurality of second external connection terminals 12 of the first substrate 10 to the plurality of second wire connection terminals 22 of the second substrate 20 with a plurality of second wires 32. In the wire connecting step S14, a third wire 33 is connected to the first drive terminal 15 of the first substrate 10 and the second drive terminal 16 of the second substrate 20. It is preferable that the wire is first connected to the first external connection terminal 11 provided on the first substrate 10, and then connected to the first wire connection terminal 21 provided on the second substrate. By connecting the wires in this order, it is possible to form a shape in which the top of the wire is raised.

[0044] The resin frame forming step S15 is a step of forming a dark-colored first resin frame 41 on the first substrate 10 in a position adjacent to and surrounding the element mounting region 13 and inside the plurality of first external connection terminals 11 and the plurality of second external connection terminals 12, and forming a dark-colored second resin frame 42 on the second substrate 20 in a position surrounding the first substrate 10 and outside the plurality of first wires 31 and the plurality of second wires 32. In the resin frame forming step S15, the first resin frame 41 may be formed first, and then the second resin frame 42 may be formed, or the second resin frame 42 may be formed first, and then the first resin frame 41 may be formed. Alternatively, the resin frame forming step S15 may form the first resin frame 41 and the second resin frame 42 approximately simultaneously. In the resin frame forming step S15, the first resin frame 41 and the second resin frame 42 are formed by applying resin having a viscosity adjusted in advance from a resin application nozzle. When forming the first resin frame 41 and the second resin frame 42, resin is applied from a nozzle multiple times, and the resin is layered to a predetermined height.

[0045] The resin filling step S16 is a step of filling the gap between the first resin frame 41 and the second resin frame 42 with a dark-colored coating resin having a lower viscosity than the first resin frame 41 and the second resin frame 42. In the resin filling step S16, the resin may be filled between the first resin frame 41 and the second resin frame 42 in a single filling, or may be filled multiple times. The top position 40MX of the coating resin 40 formed in the resin filling step S16 is formed so as to be higher than the top 41a of the first resin frame 41. To position the top position 40MX of the coating resin 40 higher than the top 41a of the first resin frame 41, for example, it is preferable to refill the filled resin before it completely hardens, and repeat this process until the predetermined height is reached. Furthermore, the coating resin 40 is formed so that the tops of the long-side regions of the rectangular frame are higher than the tops of the short-side regions.

[0046] Furthermore, when filling the coating resin 40, it may be applied along the direction in which the multiple first wires 31 are arranged, and also along the direction in which the multiple second wires 32 are arranged. In this case, the coating resin 40 is applied only to the region where the gap between the first resin frame and the second resin frame is wide, so that the coating resin filled in the region where the gap between the first resin frame and the second resin frame is wide flows and fills the region where the gap between the first resin frame and the second resin frame is narrow. By doing so, the operation of the nozzle that supplies the resin when filling the coating resin 40 can be minimized, thereby improving work efficiency, and further, the coating resin 40 can be prevented from spilling outside the second resin frame 42. When filling the coating resin 40, it is preferable to apply it from directly above the top of the wire. This makes it easier for the top of the wire to be coated with the coating resin 40.

[0047] The resin frame forming step S15 and the resin filling step S16 together constitute a coating resin forming step. The first resin frame 41 and the second resin frame 42 are made of, for example, silicone resin. The resin to be filled is, for example, epoxy resin. The viscosity of the uncured resin material for the coating resin can be adjusted by the amount of solvent used in the resin material or the amount of appropriate filler added. Furthermore, in this step, forming the first resin frame 41 and the second resin frame 42 includes the placement of uncured or, preferably, partially cured resin material, and is not limited to the completion of full curing.

[0048] The coating resin 40 is formed so that, when viewed in cross section at a position where the tops of multiple first wires are virtually connected, the height of position 40b of the coating resin 40 between adjacent first wires is lower than the height of position 40a of the coating resin 40 at the point where the first wire 31 is placed, and when viewed in cross section at a position where the tops of multiple second wires 32 are virtually connected, the height of position 40b of the coating resin 40 between adjacent second wires 32 is lower than the height of position 40a of the coating resin 40 at the point where the second wire 32 is placed. The coating resin 40 forms alternating high and low portions at the tops and between the first wires 31, and at the tops and between the second wires 32, creating a dark uneven state adjacent to the light extraction surface.

[0049] The wavelength conversion member forming step S17 is a step of forming wavelength conversion members 5 on the upper surfaces of multiple light-emitting elements 1. In the wavelength conversion member forming step S17, the wavelength conversion members 5 are formed adjacent to but spaced apart from the inner surface of the coating resin 40. Note that the inner surface of the coating resin 40 indicates the same position as the inner surface of the first resin frame 41. The wavelength conversion members 5 are formed to a predetermined size in advance and are joined to the light extraction surface of the light-emitting element 1 via a joining member. Because the wavelength conversion members 5 are adjacent to but spaced apart from the coating resin 40, the wavelength conversion members 5, which form the light extraction surface, are clearly visible, resulting in a clear light contrast. Note that in the specification, the term "spaced apart" is used to indicate that they are spaced apart from each other, as is clear from the relationship between the coating resin 40 and the wavelength conversion members 5 shown in Figure 12.

[0050] 11A to 11C, the position 40a of the coating resin 40 at the top 31a of the first wire 31 and the top 32a of the second wire 32, and the position 40b between the wires, can be adjusted. Note that the position 40a of the coating resin 40 at the top 31a of the first wire 31 and the position 40b of the coating resin between the wires, and the position 40a of the coating resin 40 at the top 32a of the second wire 32 and the position 40b of the coating resin 40 between the wires are shown similarly in cross-sectional views, so the configuration on the first wire 31 side will be described as a representative, and the configuration on the second wire 32 side will be omitted.

[0051] 11A, the position 40a of the top 31a of the first wire 31 in the coating resin 40 is formed to be higher than the position 40b of the coating resin 40 between the wires. This height difference L1 is formed to be large in a cross-sectional view at a position where the tops 31a of the first wire 31 are virtually connected, and is formed to become smaller toward one end or the other end of the first wire 31. As shown in FIG. 11B, the position 40a1 of the coating resin 40 at the top 31a of the first wire 31 is higher than the position 40b1 of the coating resin 40 between the wires. The height difference L2 of the coating resin 40 is smaller than in the configuration of FIG. 11A, so that the position 40b1 of the coating resin 40 between the wires is substantially flush with the top surface of the first wire 31. The thickness of the coating resin 40 at the position 40a1 of the top 31a of the first wire 31 is greater than the thickness in FIG. 11A. This configuration ensures that the wire is reliably covered with the coating resin 40, improving product quality. Note that the height difference L2 of the coating resin 40 results in a gentler unevenness when compared to the configuration of FIG. 11A.

[0052] As shown in FIG. 11C, position 40a2 of coating resin 40 at top 31a of first wire 31 is higher than position 40b2 of coating resin 40 between the wires. Height difference L3 of coating resin 40 is larger than that of the configuration of FIG. 11A, so that position 40b2 of coating resin 40 between the wires is lower than the underside of first wire 31, and the thickness of coating resin 40 at position 40a2 at top 31a of first wire 31 is thinner than the thickness in FIG. 11A. Note that height difference L3 of coating resin 40 results in a larger height difference when the uneven state is assumed to be based on FIG. 11A. This larger height difference allows light from light-emitting element 1 to pass through more easily, thereby improving light extraction efficiency. As described above, the coating resin 40 can suppress scattered light by forming height differences L, L1, L2 between positions 40a, 40a1, 40a of the top 31a of the first wire 31 and positions 40b, 40b1, 40b2 between the wires, and the greater the height difference, the more likely it is to absorb scattered light.

[0053] 12, the second substrate 20A may have a recess 24 formed in the center, and the substrate mounting area 23A may be set within the recess 24. In this way, by forming the recess 24 in the second substrate 20A and setting the substrate mounting area 23A, the overall thickness of the light-emitting module 100A can be reduced. While the light-emitting device and the manufacturing method thereof according to the present invention have been specifically described above using the preferred embodiments, the scope of the present invention is not limited to these descriptions and should be broadly interpreted based on the claims. Furthermore, it goes without saying that various changes and modifications based on these descriptions are also included in the scope of the present invention. [Industrial Applicability]

[0054] The light emitting module 100 according to the embodiment of the present disclosure can be used in various light sources such as headlights for vehicles, ships, and aircraft, and projector devices. [Explanation of symbols]

[0055] 1 Light-emitting element 5 Wavelength conversion material 7 Reflective material 10 First board 11 First external connection terminal 12 Second external connection terminal 13 Element mounting area 15 First drive terminal 16 Second drive terminal 20,20A 2nd board 21 First wire connection terminal 22 Second wire connection terminal 23 Substrate placement area 24 recess 31 First Wire 31a Top of first wire 32 Second Wire 32a Top of second wire 33 Third Wire 40 Coating resin 41 First resin frame 42 Second resin frame 100,100A light emitting module S11 Element mounting process S12 Reflective member forming process S13 First substrate placement process S14 Wire connection process S15 Resin frame forming process S16 Resin filling process S17 Wavelength conversion member forming process

Claims

1. A plurality of light-emitting elements; a first substrate having an element mounting area on which the plurality of light-emitting elements are mounted and electrically connected, and further having, outside the element mounting area, a plurality of first external connection terminals arranged on one side of the element mounting area and a plurality of second external connection terminals arranged on the other side opposite to the element mounting area; a second substrate having a substrate placement area on which the first substrate is placed, and further having a plurality of first wire connection terminals arranged along one side of the substrate placement area outside the substrate placement area, and a plurality of second wire connection terminals arranged along the other side located on the opposite side of the substrate placement area; a plurality of first wires electrically connecting the first external connection terminals and the first wire connection terminals and arranged along one side of the first substrate; a plurality of second wires that electrically connect the second external connection terminals and the second wire connection terminals and are arranged along the other side of the first substrate; a coating resin that covers the plurality of first wires and the plurality of second wires and surrounds the element mounting region at adjacent positions; a reflective member provided between adjacent light-emitting elements in the plurality of light-emitting elements, covering each side surface of the plurality of light-emitting elements, and having light reflectivity; A light-emitting module, wherein the coating resin is provided between a first resin frame provided to surround the element mounting area on the first substrate at adjacent positions, and a second resin frame provided on the second substrate to surround the first substrate outside the plurality of first wires and the plurality of second wires.

2. The light-emitting module according to claim 1 , wherein the first resin frame and the second resin frame are each formed by stacking a plurality of resin frames in a height direction.

3. 3. The light-emitting module according to claim 1, wherein a wavelength conversion member is disposed on an upper surface side of the plurality of light-emitting elements, the wavelength conversion member being provided at a position adjacent to the first resin frame.

4. The light emitting module according to claim 1 , wherein the reflective member is spaced apart from the first resin frame.

5. 5. The light-emitting module according to claim 1, wherein the coating resin is formed so that a top portion thereof is higher than a top portion of the first resin frame.

6. the first substrate is rectangular; the plurality of first external connection terminals, the plurality of second external connection terminals, the plurality of first wire connection terminals, and the plurality of second wire connection terminals are arranged on a long side of the first substrate, The light-emitting module described in any one of claims 1 to 5, wherein the distance between the first resin frame and the second resin frame is narrower on the short side of the first substrate than on the long side of the first substrate.

7. The light-emitting module according to claim 6 , wherein the top of the coating resin provided on the short side of the first substrate is lower than the top of the coating resin provided on the long side of the first substrate.

8. An optical emitting module described in claim 3 or any one of claims 4 to 7 which cite claim 3, wherein the top of the coating resin is higher than the upper surface of the wavelength conversion member.

9. Mounting a plurality of light-emitting elements on an element mounting region of a first substrate; a step of providing a reflective member having light reflectivity between adjacent light-emitting elements in the plurality of light-emitting elements and covering each side surface of the plurality of light-emitting elements; placing and connecting the first substrate to a substrate placement area of ​​a second substrate; a step of connecting, with a plurality of first wires, a plurality of first external connection terminals arranged on one side of the element mounting area of ​​the first substrate outside the element mounting area and a plurality of first wire connection terminals arranged along one side of the element mounting area of ​​the second substrate outside the substrate mounting area, and connecting, with a plurality of second wires, a plurality of second external connection terminals arranged on the other side opposite to the one side across the element mounting area of ​​the first substrate outside the element mounting area and a plurality of second wire connection terminals arranged along the other side opposite to the one side across the substrate mounting area of ​​the second substrate outside the substrate mounting area; providing a first resin frame on the first substrate so as to surround the element mounting region at adjacent positions, and providing a second resin frame on the second substrate so as to surround the first substrate outside the plurality of first wires and the plurality of second wires; providing a coating resin between the first resin frame and the second resin frame to cover the plurality of first wires and the plurality of second wires and to surround the element mounting region at adjacent positions; A method for manufacturing a light emitting module, comprising:

10. The method for manufacturing a light-emitting module according to claim 9 , wherein the coating resin is applied along the direction in which the plurality of first wires are arranged and also along the direction in which the plurality of second wires are arranged.

11. a step of forming a wavelength conversion member on an upper surface side of the plurality of light emitting elements after the step of providing the coating resin; The method for manufacturing a light emitting module according to claim 9 or 10, wherein the wavelength conversion member is formed adjacent to and spaced apart from the first resin frame.

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