Ceramic chip removal device

Abstract

To provide a ceramic debris removal device which can easily remove ceramic debris that is a residue of a ceramic green sheet from a surface of a support film.SOLUTION: A ceramic debris removal device (100) includes: a conveyance mechanism (20) for conveying a film (1) which is composed of a support film (3) and ceramic debris (7) that is a residue of a ceramic green sheet attached to a surface (3a) of the support film (3); a cooling mechanism (30) for cooling the ceramic debris (7); and a peeling mechanism (40) for peeling the cooled ceramic debris (7) from the support film (3).SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a ceramic debris removal device. [Background technology]

[0002] A known method for manufacturing electronic components such as multilayer ceramic capacitors involves stacking ceramic green sheets, which are made by forming unfired ceramic material into sheets, press-molding them, and then firing and dividing them into individual pieces, thereby mass-producing small electronic components at once.

[0003] To improve ease of handling, ceramic green sheets are usually formed on the surface of a resin film (also called a support film) that serves as a support, and are peeled off from the surface of the support film when used. When peeling the ceramic green sheet from the support film, part of the ceramic green sheet may remain on the surface of the support film. In order to reuse such a support film, a process of cleaning (removing) the ceramic dust, which is the residue of the ceramic green sheet, is required.

[0004] For example, Patent Document 1 discloses a method for recycling a release film that includes a film cleaning step of bringing a first adhesive roll into contact with a resin film and causing any adhering matter on the resin film to adhere to the first adhesive roll. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-005597 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in recent years, ceramic green sheets have become thinner as electronic components become smaller in size. As the ceramic green sheet becomes thinner, its handling becomes worse. To prevent this, the holding force between the ceramic green sheet and the support film may be increased.

[0007] Therefore, in the method described in Patent Document 1, the holding force between the ceramic green sheet and the support film is strong, and there are cases where the ceramic chips remaining from the ceramic green sheet cannot be completely removed.

[0008] The present invention has been made to solve the above problems, and has an object to provide a ceramic chip removal device that can easily remove ceramic chips, which are residues of ceramic green sheets, from the surface of a support film. [Means for solving the problem]

[0009] The ceramic chip removal device of the present invention is characterized by comprising a conveying mechanism for conveying a film consisting of a support film and ceramic chips, which are residues of ceramic green sheets adhered to the surface of the support film, a cooling mechanism for cooling the ceramic chips, and a peeling mechanism for peeling the cooled ceramic chips from the support film. [Effects of the Invention]

[0010] According to the present invention, ceramic chips, which are residues of the ceramic green sheets, can be easily removed from the surface of the support film. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view schematically showing an example of a film from which ceramic chips are removed by the ceramic chip removing device of the present invention. [Figure 2] FIG. 2 is a cross-sectional view schematically showing an example of a ceramic chip removing device according to the present invention. [Figure 3]FIG. 3 is a partially enlarged view of the peeling mechanism and its surroundings in FIG. [Figure 4] FIG. 4 is a cross-sectional view schematically showing another example of the peeling mechanism. DETAILED DESCRIPTION OF THE INVENTION

[0012] The ceramic chip removal device of the present invention will be described below. However, the present invention is not limited to the following configuration, and can be appropriately modified and applied within the scope that does not change the gist of the present invention. Note that a combination of two or more of the individual desirable configurations of the present invention described below also constitutes the present invention.

[0013] In this specification, terms indicating the relationship between elements (e.g., "opposite," "orthogonal," etc.) and terms indicating the shape of elements (e.g., "rectangular," etc.) are not expressions that express only a strict meaning, but are expressions that include a substantially equal range, for example, a difference of a few percent.

[0014] The drawings shown below are schematic diagrams, and the dimensions, aspect ratios, and other scales may differ from those of the actual product.

[0015] [Ceramic chip removal device] The ceramic chip removal device of the present invention is characterized by comprising a conveying mechanism for conveying a film consisting of a support film and ceramic chips, which are residues of ceramic green sheets adhered to the surface of the support film, a cooling mechanism for cooling the ceramic chips, and a peeling mechanism for peeling the cooled ceramic chips from the support film.

[0016] FIG. 1 is a perspective view schematically showing an example of a film from which ceramic chips are removed by the ceramic chip removing device of the present invention. The film 1 shown in FIG. 1 is composed of a support film 3 and ceramic scraps 7, which are residues of ceramic green sheets attached to the surface of the support film 3.

[0017] The support film 3 has a sheet shape with an upper surface 3a and a lower surface 3b facing each other, and the ceramic chips 7 are attached to the upper surface 3a of the support film 3.

[0018] The film 1 is in a state after a ceramic green sheet of a predetermined shape has been cut out from a laminated sheet formed by laminating a support film 3 and a ceramic green sheet and peeled off. A portion of the ceramic green sheet laminated on the surface of the support film 3 is cut out for use, and the portion not cut out remains on the surface of the support film. This is the unpeeled ceramic green sheet 5 shown in FIG.

[0019] Furthermore, even when the ceramic green sheet laminated on the surface of the support film 3 is peeled off, the ceramic green sheet may not be completely peeled off. In such cases, small pieces of the ceramic green sheet (pieces that were not peeled off) remain on the surface of the support film after the ceramic green sheet is peeled off. This is the peeled residue 6 of the ceramic green sheet shown in FIG.

[0020] As a result, the ceramic green sheets 5 that were not peeled off and the peeled residues 6 of the ceramic green sheets are attached to the surface 3 a of the film 1 as ceramic chips 7 .

[0021] The ceramic chip removal device of the present invention is a device for removing ceramic chips from the above-mentioned film.

[0022] FIG. 2 is a cross-sectional view schematically showing an example of a ceramic chip removing device according to the present invention. The ceramic chip removing device 100 shown in FIG. 2 includes a housing 10, and a transport mechanism 20, a cooling mechanism 30, and a peeling mechanism 40 arranged inside the housing 10.

[0023] The transport mechanism 20 is a mechanism for transporting the film 1. The transport mechanism 20 includes a transport roll 21 for transporting the film 1, a dancer roll 23 for adjusting the tension of the transported film 1, and a suction roll 25 for preventing the transmission of tension. 2 indicates the direction in which the film 1 is transported, and the thin double-headed arrow indicates that the dancer roll 23 can move up and down.

[0024] Film 1 is unwound from unwinding mechanism 50 relative to transport mechanism 20.

[0025] The cooling mechanism 30 is a mechanism for cooling the ceramic chips that make up the film 1. The cooling mechanism 30 shown in FIG. 2 is a mechanism that introduces cooled gas (indicated by a thick single arrow in FIG. 2) into the housing 10. The inside of the housing 10 is cooled by the cooled gas, thereby cooling the film 1 being transported inside the housing 10. As a result, the ceramic chips that make up the film 1 are also cooled.

[0026] The peeling mechanism 40 is a mechanism for peeling the cooled ceramic chips from the support film. The peeling mechanism 40 shown in FIG.

[0027] The peeled ceramic chips are collected by a dust collection mechanism 70. The dust collection mechanism 70 comprises a suction nozzle 71 for sucking the peeled ceramic chips, a chip reservoir 75 for storing the ceramic chips, and a suction hose 73 for connecting the suction nozzle 71 and the chip reservoir 75.

[0028] The film (support film) from which the ceramic chips have been peeled off by the peeling mechanism 40 is taken up by the winding mechanism 60.

[0029] Each mechanism constituting the ceramic chip removing device of the present invention will be described below.

[0030] (Transport mechanism) The transport mechanism is a mechanism for transporting the film. The transport mechanism may be, for example, a transport roll that feeds the film by rotation.

[0031] In addition to the transport rolls, the transport mechanism may also include a dancer roll for adjusting the tension of the film during transport, a suction roll for preventing the tension from being transmitted upstream, and the like.

[0032] The speed at which the film is transported by the transport mechanism (transport speed) is not particularly limited, but is preferably 100 m / min or more, and more preferably 200 m / min or less.

[0033] The ceramic chip removing device of the present invention may be provided with an unwinding mechanism and a winding mechanism. The unwinding mechanism is a mechanism that unwinds the film from the transport mechanism. The winding mechanism is a mechanism that winds up the film (support film) after the ceramic debris has been removed.

[0034] The unwinding mechanism may be configured to be freely rotatable, in which case the film is transported by the transport mechanism, causing the unwinding mechanism to rotate freely and unwind the film.

[0035] (cooling mechanism) The cooling mechanism is a mechanism for cooling the ceramic scraps. The object to be cooled by the cooling mechanism is not limited to ceramic chips. That is, the cooling mechanism may cool the ceramic scraps together with the film, or may cool the ceramic scraps together with the winding mechanism around which the film is wound, or may cool the ceramic scraps together with the housing.

[0036] The cooling mechanism is preferably a mechanism that cools the ceramic waste to 20°C or less, and more preferably a mechanism that cools the ceramic waste to 18°C ​​or less.

[0037] The ceramic chips may be cooled at any position and timing before they are peeled off by the cooling mechanism. Therefore, the ceramic scrap may be cooled while being wound onto the winding mechanism, while being transported from the unwinding mechanism to the transport mechanism, while being transported by the transport mechanism, or around the peeling mechanism described below.

[0038] For example, a mechanism that cools ceramic chips by introducing cooled gas into a housing can be said to be a mechanism that cools the ceramic chips together with the housing, and thus corresponds to a cooling mechanism.

[0039] The cooling mechanism may be, for example, a mechanism for introducing gas at a temperature of 0° C. or higher and 20° C. or lower around the peeling mechanism.

[0040] The gas introduced by the cooling mechanism is preferably air. In addition, the gas introduced at this time preferably has low humidity, for example, a humidity of 10% or less at 20°C. If the humidity is higher than the above range, condensation may occur on the surface of the support film.

[0041] In the ceramic chip removing device of the present invention, a refrigerant cooled to a temperature of 0° C. or higher and 20° C. or lower may be used as the cooling mechanism. Such a cooling mechanism may be located, for example, at the center of the unwinding mechanism.

[0042] That is, in the ceramic chip removing device of the present invention, a refrigerant cooled to a temperature of 0° C. or higher and 20° C. or lower may be disposed at the center of the unwinding mechanism as a cooling mechanism. In this case, the unwinding mechanism preferably includes a mechanism for fixing or holding the cooling mechanism disposed in the center.

[0043] The refrigerant may be, for example, a metal rod cooled to a temperature of 0°C or higher and 20°C or lower. The metal constituting the metal rod is not particularly limited, but aluminum, metals containing iron or copper, which have high thermal conductivity, and the like are preferred.

[0044] The refrigerant may be cooled by being stored in a refrigerator or the like before use.

[0045] The refrigerant may be in gaseous or liquid form. Examples of liquid refrigerants include water and nitrogen.

[0046] When a coolant is used, for example, the coolant may be circulated through a flow path including the center of the unwinding mechanism, thereby cooling the ceramic chips via the unwinding mechanism.

[0047] The cooling mechanism may include two or more of the mechanisms described above.

[0048] (peeling mechanism) The peeling mechanism is a mechanism for peeling off the ceramic chips that make up the film from the support film.

[0049] The peeling mechanism may include, for example, an acute-angled member that presses the film from the support film side. An acute-angled member is a member that has a "portion whose cross-sectional shape forms an acute angle (acute-angle portion)." By pressing the acute angled portion from the support film side of the film, the direction of travel of the film is changed, and ceramic chips that cannot follow this change can be peeled off.

[0050] The angle of the acute angle portion may be any angle (less than 90°), but is preferably 30° or more and 70° or less, and more preferably 30° or more and 60° or less.

[0051] It is preferable that the acute angle portion is provided with an R. By providing R at the acute angle portion, the stress applied to the support film can be reduced, and the support film can be prevented from breaking. In the process of punching out the ceramic green sheet, cuts may be formed in the support film, which may cause damage to the support film starting from the cuts. By providing R at the acute corners, damage to the support film starting from the cuts can be prevented.

[0052] The strength with which the acute-angled member is pressed is not particularly limited, but it is preferable that the strength be such that when the acute-angled member is pressed from the support film side, the increase in tension applied to the support film is 10 N or more and 20 N or less.

[0053] The deformation angle of the film caused by pressing with a member having an acute angle is preferably 20° or more and less than 90°.

[0054] FIG. 3 is a partially enlarged view of the peeling mechanism and its surroundings in FIG. As shown in FIG. 3, the peeling mechanism 40 is composed of a member 41 having an acute angle. The acute-angle member 41 has an acute-angle portion 41a at its tip, which forms an acute angle (the angle indicated by θ1 in FIG. 3).

[0055] Acute-angled member 41 presses film 1 so that acute-angled portion 41 a comes into contact with film 1 .

[0056] It can be said that the direction of travel of support film 3 constituting film 1 is changed by the pressure of acute-angled member 41. The angle at this time (the angle indicated by θ2 in FIG. 3) is also called the deformation angle.

[0057] Here, the support film 3 constituting the film 1 has sufficient flexibility, so that it can follow the deformation caused by the member 41 having an acute angle.

[0058] On the other hand, the ceramic scraps 7 that make up the film are cooled by the cooling mechanism, so the resin components that make up the ceramic scraps 7 harden and the ceramic scraps 7 become hard as a whole. Therefore, they cannot follow the deformation like the support film 3, and peel off from the surface of the support film 3. The peeled ceramic chips 7 are sucked by a suction nozzle 71 and collected in a chip bin 75 via a suction hose 73 .

[0059] 3, it is preferable that the acute-angled member 41 presses the film 1 vertically downward (downward on the paper surface, in the direction in which the suction nozzle 71 is disposed). When the film 1 is pressed in this direction, the peeled ceramic debris 7 falls due to gravity, preventing it from re-adhering to the support film 3.

[0060] The suction nozzle 71 is provided at a position opposite the acute-angled member 41 across the film 1. The ceramic scraps 7 that are peeled off by pressing the acute-angled member 41 peel off in the direction opposite the acute-angled member 41, so when the suction nozzle 71 is provided at a position opposite the acute-angled member 41 across the film 1, the peeled ceramic scraps 7 can be easily collected.

[0061] The length of the acute-angled member in the width direction is preferably equal to or greater than the width of the film. The width direction here refers to the direction perpendicular to the direction in which the film is transported. If the length of the acute-angled member in the width direction is equal to or greater than the width of the film, all ceramic debris on the surface of the support film can be peeled off by using one acute-angled member across the entire width of the film.

[0062] The peeling mechanism may further include a blowing nozzle for blowing compressed gas onto the ceramic chips, in addition to the sharp-angled member described above. That is, the peeling mechanism may include a mechanism including an acute-angled member that presses the film from the support film side, and a blow-out nozzle that blows compressed gas onto the ceramic chips to blow them off the surface of the support film.

[0063] An example of a peeling mechanism equipped with a blowing nozzle will be described with reference to FIG.

[0064] FIG. 4 is a cross-sectional view schematically showing another example of the peeling mechanism. The peeling mechanism 40 shown in FIG. 4 further includes a blowout nozzle 43 in addition to the acute-angled member 41 shown in FIG.

[0065] The tip of the blow-out nozzle 43 is positioned toward the position between the support film 3 and the ceramic scraps 7 at the moment when they are peeled off by the sharp-angled member 41, i.e., the position that is the starting point of peeling between the support film 3 and the ceramic scraps 7. By blowing compressed gas toward the position where the peeling of the support film 3 and the ceramic scraps 7 starts, the ceramic scraps 7 can be further peeled from the peeling start point, making it easier to peel the ceramic scraps 7.

[0066] That is, the blow-out nozzle 43 is preferably arranged downstream of the acute-angled member 41 so as to blow compressed gas toward the upstream side.

[0067] The flow rate of the compressed gas blown out from the blowout nozzle is preferably 200 L / min or more and 400 L / min or less.

[0068] The temperature of the compressed gas blown out by the blowout nozzle is preferably 0°C or higher and 20°C or lower. If the temperature of the compressed gas blown out from the blowout nozzle is between 0°C and 20°C, the ceramic chips are not softened when being peeled off, and therefore the ceramic chips cooled by the cooling mechanism are not prevented from being peeled off. The blow-out nozzle, which blows out compressed gas at a temperature between 0°C and 20°C, is merely a peeling mechanism and does not correspond to a cooling mechanism.

[0069] The temperature of the compressed gas referred to here means the temperature of the gas blown out from the blow-out nozzle, and does not mean the temperature of the compressed gas stored in the pressure vessel.

[0070] The humidity of the compressed gas blown out from the blowout nozzle at 20°C is preferably 10% or less.

[0071] Other peeling mechanisms include, for example, removal with a brush, scraping with a blade, and removal by vibration.

[0072] (support film) The support film constituting the film suitable for use in the ceramic chip removal device of the present invention will now be described.

[0073] As the support film constituting the film, a conventionally known film can be suitably used. The support film may be, for example, a multilayer film in which a release layer is formed on one surface of a base film that serves as a base layer, and a backing resin layer is formed on the other surface.

[0074] Examples of resins that can be used to form the substrate layer include polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, polysulfone, polyether ether ketone, polyether sulfone, polyphenylene sulfide, polyetherimide, polyimide, polyamide, and acrylic resins. Among these, polyester is preferred from the viewpoints of ease of processing, durability, heat resistance, cost, etc., and polyethylene terephthalate is particularly preferred.

[0075] In addition to the above resin, a filler may be added to the base layer.

[0076] The substrate film constituting the substrate layer may be a non-stretched film, but is preferably a uniaxially or biaxially stretched film.

[0077] The release layer can be formed, for example, by applying a composition for forming a release layer to one surface of the substrate film, and then heating and curing the composition.

[0078] The back resin layer can be formed, for example, by applying a composition for forming a back resin layer to the other main surface of the substrate film, and then heating and curing the composition.

[0079] The width of the support film is not particularly limited, but is preferably, for example, 100 mm or more and 200 mm or less.

[0080] (ceramic scrap) The ceramic chips that make up the film suitable for use in the ceramic chip removal device of the present invention will now be described.

[0081] The ceramic scraps are residues of the ceramic green sheets that were placed on the surface of the support film. The ceramic green sheet is obtained by coating a slurry made by mixing a ceramic material such as barium titanate and an organic binder with a plasticizer and an organic solvent on the surface of a support film and drying the mixture.

[0082] The ceramic green sheet is handled together with a support film, and then a ceramic green sheet of a predetermined shape is cut out from the support film and peeled off, and used to manufacture electronic components. The ceramic green sheet that was not peeled off from the support film and the fine fragments (peeling residue) of the ceramic green sheet that remain on the surface of the support film after peeling become ceramic waste.

[0083] As described above, the ceramic scraps are residues of the ceramic green sheets remaining on the support film, and therefore the composition of the ceramic scraps is the same as that of the ceramic green sheets.

[0084] Examples of ceramic materials include barium titanate.

[0085] A metal paste that will become an internal electrode may be printed on the surface of the ceramic green sheet, so the ceramic waste may contain residue of the metal paste.

[0086] The ceramic chip removal device of the present invention is preferably applied to a film having ceramic chips attached thereto, the thickness of which is 3 μm or less. Ceramic green sheets are becoming thinner as electronic components become smaller, and ceramic green sheets with a thickness of 3 μm or less are sometimes used. When the thickness of a ceramic green sheet is 3 μm or less, it becomes necessary to increase the holding force between the ceramic green sheet and the support film to improve the handleability of the ceramic green sheet. In this case, it may become difficult to peel the ceramic chips from the support film. The ceramic chip removal device of the present invention can improve the peelability of the ceramic chips, and therefore can be suitably applied to films in which ceramic chips with a thickness of 3 μm or less are strongly adhered to the support film.

[0087] This specification describes the following:

[0088] The present disclosure (1) provides a conveying mechanism for conveying a film made of a support film and ceramic chips, which are residues of ceramic green sheets attached to the surface of the support film; a cooling mechanism for cooling the ceramic scraps; and a peeling mechanism for peeling the cooled ceramic chips from the support film.

[0089] The present disclosure (2) is the ceramic chip removal device according to the present disclosure (1), wherein the cooling mechanism has a mechanism for cooling the ceramic chips to 20°C or less.

[0090] The present disclosure (3) is the ceramic chip removal device according to the present disclosure (1), wherein the cooling mechanism has a mechanism for cooling the ceramic chips to 18°C ​​or less.

[0091] The present disclosure (4) is a ceramic chip removal device that is an arbitrary combination with any of the present disclosures (1) to (3), in which the cooling mechanism has a mechanism for introducing gas at a temperature of 0°C or higher and 20°C or lower around the peeling mechanism.

[0092] The present disclosure (5) is a ceramic chip removal device that is any combination of any of the present disclosures (1) to (4), wherein the peeling mechanism includes an acute-angled member that presses the film from the support film side, and a nozzle that sprays compressed gas onto the ceramic chips and blows them off the surface of the support film.

[0093] The present disclosure (6) is the ceramic chip removal device according to the present disclosure (5), wherein the temperature of the compressed gas is 0°C or higher and 20°C or lower.

[0094] The present disclosure (7) includes a winding mechanism that winds out the film from the conveying mechanism, This is a ceramic chip removal device that can be arbitrarily combined with any of the present disclosures (1) to (6), in which a refrigerant cooled to a temperature of 0°C or higher and 20°C or lower is arranged at the center of the unwinding mechanism as the cooling mechanism.

[0095] The present disclosure (8) is the ceramic chip removal device according to the present disclosure (7), wherein the refrigerant is a metal rod cooled to a temperature of 0°C or higher and 20°C or lower. [Explanation of symbols]

[0096] 1 film 3 Support film 3a Surface of the support film (top surface) 3b Surface (bottom) of support film 5 Ceramic green sheet that was not peeled off 6. Ceramic green sheet peeling residue 7. Ceramic waste 10. Cabinet 20 Transport mechanism 21 Transport roll 23 Dancer Roll 25 Suction Roll 30 Cooling mechanism 40 Peeling Mechanism 41 Sharp-angled components 41a Sharp angle 43 Blowing nozzle 50 Unwinding mechanism 60 Winding mechanism 70 Dust collection mechanism 71 Suction nozzle 73 Suction hose 75 Garbage Pit 100 Ceramic chip removal device θ1 angle of acute angle θ2 deformation angle

Claims

1. a conveying mechanism for conveying a film including a support film and ceramic chips, which are residues of the ceramic green sheet, attached to the surface of the support film; a cooling mechanism for cooling the ceramic scraps; a peeling mechanism for peeling the cooled ceramic chips from the support film.

2. 2. The ceramic chip removal device according to claim 1, wherein the cooling mechanism has a mechanism for cooling the ceramic chips to 20[deg.] C. or less.

3. 2. The ceramic chip removal device according to claim 1, wherein the cooling mechanism has a mechanism for cooling the ceramic chips to 18[deg.] C. or less.

4. 2. The ceramic chip removal device according to claim 1, wherein the cooling mechanism has a mechanism for introducing gas having a temperature of 0° C. or higher and 20° C. or lower around the peeling mechanism.

5. The ceramic chip removal device according to claim 1, wherein the peeling mechanism comprises an acute-angled member that presses the film from the support film side, and a blow-out nozzle that blows compressed gas onto the ceramic chips to blow them off the surface of the support film.

6. 6. The ceramic chip removal device according to claim 5, wherein the temperature of the compressed gas is 0°C or higher and 20°C or lower.

7. a winding mechanism for winding the film relative to the transport mechanism, 2. The ceramic chip removing device according to claim 1, wherein a refrigerant cooled to a temperature of 0° C. or higher and 20° C. or lower is disposed at the center of said unwinding mechanism as said cooling mechanism.

8. 8. The ceramic chip removal device according to claim 7, wherein the refrigerant is a metal rod cooled to a temperature between 0°C and 20°C.

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