Electronic component mounting system

Abstract

To provide an electronic component packaging system capable of improving mounting position accuracy of a recover mounting.SOLUTION: In an electronic component packaging system comprising: a mounting device for picking up a plurality of electronic components from a supply part of an electronic component by a mounting head having a plurality of component suction tools and mounting the electronic components on the substrate; a component recognition device; a component position inspection device; and a control device, the control device stores a recover mounting path corresponded to a lacking pattern as a pattern of component suction tool in which the electronic component is not sucked and the electronic component is lacked, and position correction data related to the mounting position of the electronic component in the recovery mounting path. In addition, the control device controls operation of the mounting device so as to select the recovery mounting path corresponded to the lacking pattern output from the component recognition device, and to execute the recovery mounting on the basis of the position correction data in the recovery mounting path.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electronic component mounting system for mounting electronic components on a substrate. [Background technology]

[0002] In recent years, with the miniaturization and mounting density of electronic components increasing, the demand for mounting position accuracy when mounting electronic components on a board has also become more stringent. To meet this demand, Patent Document 1 proposes an electronic component mounting system in which a component position inspection device is installed downstream of an electronic component mounting device to detect the positions of electronic components mounted on a board and output the position detection results as component position data, and control parameters for controlling the operation of the electronic component mounting device based on the component position data, i.e., position correction data related to the mounting positions of electronic components, and the operation of the electronic component mounting device is controlled based on the position correction data.

[0003] Electronic component mounting devices typically use a mounting head equipped with multiple component suction devices to pick up multiple electronic components from an electronic component supply unit and sequentially mount the multiple electronic components onto a circuit board. Even if a component pickup error occurs, i.e., a component suction device fails to pick up an electronic component, resulting in a component missing from the component suction device, the electronic component currently attached to the component suction device is first mounted onto the circuit board (hereinafter, this mounting is also referred to as "normal mounting"). The missing electronic component is then subjected to recovery mounting after normal mounting is completed. Conventionally, even during recovery mounting, the operation of the electronic component mounting device has been controlled based on the position correction data used during normal mounting. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-134899 Summary of the Invention [Problem to be solved by the invention]

[0005] As a result of analyzing various mounting position data, the inventors found that if the operation of an electronic component mounting device during recovery mounting is controlled based on position correction data used during normal mounting, the mounting position accuracy of recovery mounting will decrease.

[0006] The problem to be solved by the present invention is to provide an electronic component mounting system that can improve the mounting position accuracy of recovery mounting. [Means for solving the problem]

[0007] The inventors investigated the cause of the deterioration in mounting position accuracy during recovery mounting when the operation of an electronic component mounting device is controlled based on position correction data from normal mounting during recovery mounting, and found that the cause is a difference in the mounting path between normal mounting and recovery mounting. In other words, when the mounting path differs, the amount of positional deviation in the X and Y directions of the electronic component mounting device and the amount of vibration of the component suction tool vary. Therefore, when the operation of an electronic component mounting device is controlled based on position correction data from normal mounting during recovery mounting, the mounting position accuracy during recovery mounting decreases. The inventors then came up with the idea of ​​controlling the operation of the electronic component mounting apparatus during recovery mounting based on position correction data that corresponds to the recovery mounting path, and arrived at the present invention.

[0008] That is, according to one aspect of the present invention, the following electronic component mounting system is provided. an electronic component mounting apparatus that uses a mounting head having a plurality of component suction devices to pick up a plurality of electronic components from an electronic component supply unit and mount them on a substrate; a component recognition device that recognizes whether or not electronic components are being picked up by the plurality of component suction devices, and outputs a missing pattern that is a pattern of component suction devices that are not picking up electronic components and are missing electronic components; a component position inspection device that detects the positions of electronic components mounted on a board and outputs the position detection results as component position data; In cooperation with the electronic component supply unit, the component recognition device, and the component position inspection device The aforementioned an electronic component mounting system comprising: a control device for controlling the operation of an electronic component mounting device, the control device causing the electronic component mounting device to first mount electronic components sucked by the plurality of component suction tools onto a board, and after the mounting is completed, to pick up missing electronic components from the electronic component supply unit and recover and mount them onto the board via the component recognition device; The control device stores in a memory a recovery mounting path corresponding to the missing pattern and position correction data related to the mounting position of an electronic component on the recovery mounting path, and controls the operation of the electronic component mounting device to select a recovery mounting path corresponding to the missing pattern output from the component recognition device and perform recovery mounting based on the position correction data on the recovery mounting path. [Effects of the Invention]

[0009] According to the electronic component mounting system of the present invention, it is possible to improve the mounting position accuracy of recovery mounting. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a block diagram showing the configuration of an electronic component mounting system according to an embodiment of the present invention; [Figure 2] FIG. 2 is a perspective view showing an example of a mounting head. [Figure 3] FIG. 10 is a schematic diagram showing an example of a mounting path during normal mounting. [Figure 4] FIG. 10 is a conceptual diagram showing an example of the data structure of position correction data in normal implementation. [Figure 5] FIG. 10 is a schematic diagram showing an example of a recovery implementation path. [Figure 6] FIG. 6 is a conceptual diagram showing an example of the data structure of position correction data in the recovery mounting path shown in FIG. 5 . [Figure 7] FIG. 10 is a schematic diagram showing another example of a recovery implementation path. [Figure 8]FIG. 8 is a conceptual diagram showing an example of the data structure of position correction data in the recovery mounting path shown in FIG. 7 . DETAILED DESCRIPTION OF THE INVENTION

[0011] A block diagram of the configuration of an electronic component mounting system according to one embodiment of the present invention is shown in Figure 1. The electronic component mounting system shown in Figure 1 includes, in this order, an electronic component supply unit (simply referred to as a "supply unit" in Figure 1 and simply referred to as a "supply unit" in the following description), a component recognition device, an electronic component mounting device (simply referred to as a "mounting device" in Figure 1 and simply referred to as a "mounting device" in the following description), and a component position inspection device, as well as a control device that controls the operation of the mounting device in cooperation with the supply unit, component recognition device, and component position inspection device, all of which are connected to each other so as to be able to communicate with each other via a communication network.

[0012] The mounting device includes a mounting head having a plurality of component suction devices. For example, a rotary head type mounting head as disclosed in Japanese Patent Application Laid-Open No. 2016-86095 can be used as the mounting head. Figure 2 shows a mounting head 10 as disclosed in Japanese Patent Application Laid-Open No. 2016-86095. The mounting head 10 shown in the figure is a rotary head type mounting head, in which a rotary head 30 is attached to a fixedly arranged head main body 20 so as to be rotatable in the R direction around a vertical axis. This rotary head 30 has multiple spindles 31 arranged at equal intervals along its circumferential direction, and a nozzle 32 is attached to the bottom end of each spindle 31 as a component suction device that sucks and holds components. The rotary head 30 rotates in the R direction by being driven by an R servo motor 21 installed in the head body 20. Also, each spindle 31 rotates in the T direction around its axis by being driven by a T servo motor 22 installed in the head body 20. Furthermore, a Z servo motor 23 is arranged in the head body 20 as a first elevating means for elevating the spindle 31a (nozzle 32) at a specific position in the Z direction along the axial direction. The mounting head 10 is movable in the X and Y directions by an X and Y movement mechanism (not shown).

[0013] The mounting device picks up multiple electronic components from a supply unit using a mounting head having multiple component suction devices as described above. The picked-up electronic components are then mounted onto a circuit board via a component recognition device. During normal mounting, as described above, even if there is a component suction device that is missing an electronic component due to a component pickup error, i.e., a component suction device that failed to pick up an electronic component, the electronic component that is currently being picked up by the component suction device is first mounted onto the circuit board, and the missing electronic component is then recovered and mounted after normal mounting is completed.

[0014] FIG. 3 shows a schematic diagram of an example of a mounting path during normal mounting. While an actual mounting head has 10 or more component suction devices, as shown in FIG. 2, for the sake of simplicity, the following description assumes that the head has five component suction devices, which pick up five electronic components, components 1 to 5, from a supply unit and sequentially mount them at predetermined positions (mounting positions) on the board via the component recognition device. The designed mounting positions of each component are stored in advance as production data in the memory of the control device. FIG. 3 also shows a mounting path during normal mounting when component 4 is missing due to a pickup error. In this specification, the term "mounting path" refers to the path (route) along which electronic components are mounted on the board, starting from the component recognition device, as indicated by the arrow in FIG. 3.

[0015] 3 shows the case where component 4 is missing, so the mounting path during normal mounting is "component recognition device → component 1 → component 2 → component 3 → component 5." Here, the component recognition device recognizes that component 4 is missing and outputs a missing pattern, which is the pattern of the component suction tool where component 4 is missing. The control device receives this missing pattern and is able to recognize that component 4 is missing. In other words, the control device recognizes that component 4 is missing from the missing pattern output from the component recognition device, and based on this recognition, controls the operation of the mounting device so that during normal mounting, each component is mounted on the board along the mounting path shown in FIG. 3.

[0016] A component position inspection device is installed downstream of the mounting device. The component position inspection device detects the positions of electronic components mounted on the board and outputs the position detection results as component position data. Specifically, as disclosed in Patent Document 1, for example, the board is imaged by a camera and image recognition is performed to detect the XY coordinate position (X position, Y position) on the board plane for each electronic component, and the position detection results are output as component position data. Furthermore, in this embodiment, in addition to the XY coordinate positions (X position, Y position), the Z position representing the mounting height of the electronic component and the angle θ representing the mounting direction of the electronic component are also detected, and the position detection results are output together with the X position and Y position as component position data.

[0017] The control device acquires component position data for electronic components mounted by the normal mounting method described above from the component position inspection device, calculates position correction data for the mounting positions of the electronic components based on the component position data, and stores the position correction data in memory as position correction data for normal mounting. In this embodiment, five electronic components, components 1 to 5, are mounted, so normal mounting position correction data is obtained for each of components 1 to 5, and the control device stores each position correction data in memory. FIG. 4 conceptually illustrates an example of the data structure of position correction data for normal mounting. As shown in FIG. 4, in this embodiment, the position correction data consists of four correction amounts: X position correction amount, Y position correction amount, Z position correction amount, and angle correction amount. Here, the correction amounts are correction amounts for the designed mounting positions (X position, Y position, Z position, and angle θ) of each component, which are stored in advance as production data in the control device's memory as described above. Note that, although component 4 is not mounted in the normal mounting example shown in FIG. 3, there is also normal mounting in which component 4 is mounted, so normal mounting position correction data for component 4 is also obtained as shown in FIG. The control device also has a function of updating the position correction data for each component in-line based on component position data for each component that is sequentially obtained from the component position inspection device during normal mounting.

[0018] Next, recovery implementation will be explained. First, we will explain the recovery mounting after normal mounting shown in Figure 3. In Figure 3, component 4 is missing, so component 4 is mounted in recovery mounting. Here, the memory of the control device stores in advance recovery mounting paths corresponding to likely-occurring missing patterns, and position correction data related to the mounting positions of electronic components on those recovery mounting paths. In this embodiment, the memory stores a recovery mounting path (hereinafter referred to as "missing pattern A") corresponding to a missing pattern in which component 4 is missing (hereinafter referred to as "missing pattern A"), and position correction data related to the mounting positions of electronic components on recovery mounting path A.

[0019] Figure 5 shows a schematic diagram of recovery mounting path A corresponding to missing pattern A. This recovery mounting path A is the mounting path taken when, in missing pattern A where component 4 is missing, after the normal mounting shown in Figure 3 is completed, component 4 is picked up from the supply unit and recovery mounted onto the board via the component recognition device, and recovery mounting path A is "component recognition device → component 4" as shown by the arrow in Figure 5. Here, the mounting path when mounting component 4 on the board using normal mounting is "component recognition device → component 1 → component 2 → component 3 → component 4," which is different from the mounting path used in recovery mounting path A. In other words, as mentioned above, because the mounting paths differ between normal mounting and recovery mounting, if the operation of the mounting device is controlled during recovery mounting based on the position correction data used during normal mounting (Figure 4), the mounting position accuracy during recovery mounting will decrease.

[0020] Therefore, in the present invention, during recovery mounting, the operation of the mounting device is controlled based on position correction data that corresponds to that recovery mounting path. Specifically, in this embodiment, position correction data related to the mounting position of an electronic component (component 4) on recovery mounting path A is stored in memory. This position correction data related to the mounting position of an electronic component (component 4) on recovery mounting path A can be obtained based on component position data obtained by a downstream component position inspection device detecting the position of component 4 on a board on which component 4 has been recovery-mounted via recovery mounting path A using an actual mounting device.

[0021] Figure 6 conceptually shows an example of the data structure of position correction data for recovery mounting path A. As shown in the figure, the position correction data for recovery mounting path A consists of four correction amounts: X position correction amount, Y position correction amount, Z position correction amount, and angle correction amount, just like the position correction data for normal mounting shown in Figure 4, but the absolute values ​​of these correction amounts are not the same. For this reason, in Figure 6, each correction amount for recovery mounting path A is marked with "(A)" to distinguish it from the correction amount for normal mounting.

[0022] Next, as an example of a missing pattern other than missing pattern A in which part 4 is missing, a missing pattern in which parts 2 and 4 are missing (hereinafter referred to as "missing pattern B") will be described. Figure 7 shows a schematic diagram of recovery mounting path B corresponding to missing pattern B. This recovery mounting path B is the mounting path when, in missing pattern B where components 2 and 4 are missing, after normal mounting of components other than components 2 and 4 (components 1 and 3) is completed, components 2 and 4 are picked up from the supply unit and recovery mounted onto the board via the component recognition device, and recovery mounting path B is "component recognition device → component 2 → component 4," as shown by the arrow in Figure 7.

[0023] In this embodiment, similar to the case of the above-described recovery mounting path A, position correction data related to the mounting positions of electronic components (components 2 and 4) in recovery mounting path B is stored in memory. This position correction data related to the mounting positions of electronic components (components 2 and 4) in recovery mounting path B can be obtained based on component position data obtained by a component position inspection device at a subsequent stage detecting the positions of components 2 and 4 for a board on which components 2 and 4 have been recovery-mounted according to recovery mounting path B using an actual mounting device.

[0024] Figure 8 conceptually shows an example of the data structure of position correction data for recovery mounting path B. As shown in the figure, the position correction data for recovery mounting path B, like the position correction data for normal mounting shown in Figure 4 and the position correction data for recovery mounting path A shown in Figure 6, consists of four correction amounts: X position correction amount, Y position correction amount, Z position correction amount, and angle correction amount, but the absolute values ​​of these correction amounts are not the same. For this reason, in Figure 8, each correction amount for recovery mounting path B is marked with "(B)" to distinguish it from the correction amounts for normal mounting and recovery mounting path A.

[0025] Theoretically, there are many possible missing patterns other than the above-mentioned missing patterns A and B for component suction tool patterns in which electronic components are missing. However, it is not realistic to prepare recovery mounting paths and position correction data for those recovery mounting paths in advance for all possible missing patterns. Therefore, in reality, several missing patterns that are likely to occur are selected from past mounting performance data, etc., and recovery mounting paths corresponding to those missing patterns and position correction data for those recovery mounting paths are stored in memory in advance. For convenience, in this embodiment, it is assumed that the recovery mounting paths and position correction data for the above-mentioned missing patterns A and B are stored in memory in advance.

[0026] Based on the above configuration and assumptions, the control device selects a recovery mounting path that corresponds to the missing pattern output from the component recognition device, and controls the operation of the mounting device to perform recovery mounting based on the position correction data for that recovery mounting path. For example, if the missing pattern output from the component recognition device is missing pattern A, the control device selects recovery mounting path A shown in Figure 5, and controls the operation of the mounting device to perform recovery mounting of component 4 based on the position correction data for recovery mounting path A shown in Figure 6. Furthermore, if the missing pattern output from the component recognition device is missing pattern B, the control device selects recovery mounting path B shown in Figure 7, and controls the operation of the mounting device to perform recovery mounting of components 2 and 4 based on the position correction data for recovery mounting path B shown in Figure 8.

[0027] On the other hand, if the missing pattern output from the component recognition device is not stored in memory, the control device stores the missing pattern in memory and also stores the recovery mounting path executed by the mounting device for that missing pattern in memory. Even if the missing pattern and the recovery mounting path corresponding to that missing pattern are not stored in memory, the mounting device will find a recovery mounting path corresponding to that missing pattern through autonomous control by the control device or the mounting device itself and execute recovery mounting using that recovery mounting path. The control device then acquires component position data for the electronic component mounted using that recovery mounting path from the component position inspection device, determines position correction data for the mounting position of the electronic component based on the component position data, and stores the position correction data in memory in association with the recovery mounting path. This stores the new missing pattern, the recovery mounting path corresponding to that missing pattern, and the position correction data for that recovery mounting path in memory. From the next time onwards, the control device will execute recovery mounting based on the position correction data for the recovery mounting path stored in memory. The control device has the function of updating in-line the position correction data for each component on each recovery mounting path based on the component position data for each component sequentially obtained from the component position inspection device during recovery mounting on each recovery mounting path.

[0028] Although the embodiment of the present invention has been described above, the present invention is not limited to the present embodiment, and it will be obvious to those skilled in the art that various modifications and changes are possible without departing from the technical spirit of the present invention. For example, in this embodiment, the position correction data consists of four correction amounts: X position correction amount, Y position correction amount, Z position correction amount, and angle correction amount, but it is sufficient to have at least two correction amounts: X position correction amount and Y position correction amount. [Explanation of symbols]

[0029] 10 Mounting head 20 Head body 21 R servo motor 22T servo motor 23 Z servo motor (first lifting means) 30 Rotary Head 31,31a Spindle 32 Nozzle (parts suction tool)

Claims

1. an electronic component mounting apparatus that uses a mounting head having a plurality of component suction devices to pick up a plurality of electronic components from an electronic component supply unit and mount them on a substrate; a component recognition device that recognizes whether or not electronic components are being picked up by the component suction devices and outputs a missing pattern that is a pattern of component suction devices that are not picking up electronic components and are missing electronic components; a component position inspection device that detects the positions of electronic components mounted on a board and outputs the position detection results as component position data; an electronic component mounting system comprising: a control device that controls the operation of the electronic component mounting device in cooperation with the electronic component supply unit, the component recognition device, and the component position inspection device, and that operates the electronic component mounting device so that electronic components sucked by the plurality of component suction tools are first mounted onto a board, and after the mounting is completed, missing electronic components are picked up from the electronic component supply unit and recovery-mounted onto the board via the component recognition device; The control device stores in a memory a recovery mounting path corresponding to the missing pattern and position correction data related to the mounting position of an electronic component on the recovery mounting path, and controls the operation of the electronic component mounting device to select a recovery mounting path corresponding to the missing pattern output from the component recognition device and perform recovery mounting based on the position correction data on the recovery mounting path.

2. 2. The electronic component mounting system according to claim 1, wherein, when a missing pattern output from the component recognition device is not stored in the memory, the control device stores the missing pattern in the memory and also stores in the memory a recovery mounting path executed by the electronic component mounting device for the missing pattern, and further acquires component position data of electronic components recovery-mounted by the recovery mounting path from the component position inspection device, determines position correction data related to the mounting position of the electronic component based on the component position data, and stores the position correction data in the memory in association with the recovery mounting path.

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