Wireless headset

Abstract

An embodiment of the present application discloses a wireless headset including an ear handle portion and an earphone portion connected to the ear handle portion. The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and multiple chips. The rigid-flexible circuit board includes a rigid board portion and first and second flexible board portions connected to the rigid board portion. The rigid board portions are located within the earphone portion. The first flexible board portion is located within the earphone portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end extends to the ear handle portion. The first substrate and rigid board portions are stacked with a certain gap between them. The first support member is located between the first substrate and the rigid board portion and abuts against each of the first substrate and the rigid board portion. At least one of the multiple chips is fixed to the rigid board portion. At least one of the plurality of chips is fixed to the first substrate. The chip fixed to the first substrate is electrically connected to the rigid board portion by using a first support member. Multiple component layers are stacked on the rigid board portion of the wireless headset, resulting in a high degree of component integration.

Description

[Technical Field]

[0001] This application claims priority to Chinese Patent Application No. 201911056406.0, entitled "Wireless Headset," filed with the China Intellectual Property Office on October 31, 2019, which is incorporated herein by reference in its entirety.

[0002] TECHNICAL FIELD Embodiments of the present application relate to the field of electronic product technology, and in particular to wireless headsets. [Background technology]

[0003] With the advancement of science and technology, the number of chips integrated inside a wireless headset is continuously increasing to achieve multi-function and intelligence. Due to the limitations imposed by the shape of a wireless headset, a rigid circuit board with a relatively large board area cannot be placed in the space inside the wireless headset. Therefore, a conventional wireless headset usually includes a rigid primary circuit board and multiple secondary circuit boards. According to the board size of the circuit board, multiple components in the wireless headset that form a control system are divided and placed on different circuit boards, and the different circuit boards are connected using flexible circuit boards to realize connections between the different components. This results in a low degree of integration of components in the wireless headset. Summary of the Invention [Means for solving the problem]

[0004] An object of embodiments of the present application is to provide a wireless headset with a relatively high degree of component integration.

[0005] According to a first aspect, an embodiment of the present application provides a wireless headset. The wireless headset is wirelessly connected (e.g., Bluetooth connected) to an electronic device such as a mobile phone, a notebook computer, a tablet, or a smart watch, and the wireless headset is used in cooperation with the electronic device. The wireless headset is configured to process audio services of the electronic device, such as media and call services, or other data services.

[0006] The wireless headset has an ear handle portion and an earphone portion connected to the ear handle portion. The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and multiple chips. The rigid-flexible circuit board includes a rigid board portion and first and second flexible board portions connected to the rigid board portion. The rigid board portion is located within the earphone portion, and the first flexible board portion is located within the earphone portion, with one end connected to the rigid board portion, one end of the second flexible board portion connected to the rigid board portion, and the other end extending to the ear handle portion. For example, the wireless headset includes multiple functional modules. The first flexible board portion is configured to connect several functional modules located within the earphone portion. The second flexible board portion is configured to connect several functional modules located within the earphone portion and several functional modules located within the ear handle portion.

[0007] The first substrate and the rigid board portion are stacked at a certain distance from each other. For example, a protrusion of the first substrate on the rigid board portion falls within the range of the rigid board portion. The first support member is located between the first substrate and the rigid board portion and abuts against the first substrate and the rigid board portion, respectively. At least one of the plurality of chips is fixed to the rigid board portion. At least one of the plurality of chips is fixed to the first substrate. The chip fixed to the first substrate is electrically connected to the rigid board portion using the first support member. The portions of the main control module fixed above and below the rigid board portion form a stack assembly. That is, the main control module includes a rigid-flexible circuit board and a stack assembly. The stack assembly is fixed to the rigid board portion and includes a first substrate, a first support member, and a plurality of chips.

[0008] In this embodiment, the main control module includes a first substrate and a rigid board portion stacked together. At least one chip is fixed to the first substrate and at least one chip is fixed to the rigid board portion. Thus, the stack assembly of the main control module can form a stack structure having multiple component layers. All or most of the chips of the wireless headset are integrated into the stack assembly, and the components in the stack assembly can be connected to multiple functional modules of the wireless headset using multiple flexible board portions of the rigid-flex circuit board, such that the control system of the wireless headset is fully integrated within the stack assembly. In this way, multiple secondary circuit boards involved in supporting control system components in conventional wireless headsets can be eliminated, thereby increasing the degree of component integration of the main control module and the headset body components.

[0009] Additionally, the stack assembly, in which multiple component layers are stacked, has a relatively large thickness in a direction perpendicular to the rigid board portion. The stack assembly is fixed to the rigid board portion, and the rigid board portion is located within the earphone portion, so that the stack assembly is located within the earphone portion. Therefore, the stack assembly has relatively little installation difficulty, and the stack assembly can fully utilize the internal cavity space of the earphone portion, improving space utilization of the wireless headset. In some embodiments, the shape of the outer contour of the rigid board portion and the stack assembly can be adapted to the shape of the internal cavity space of the earphone portion. For example, a circular or nearly circular outer shape is used to further improve space utilization of the wireless headset.

[0010] In this embodiment, the chip fixed to the first substrate can be electrically connected to the rigid board portion using the first support member, eliminating the need for a flexible circuit board for signal transmission between the first substrate and the rigid board portion. The signal transmission path between the chip on the first substrate and the rigid board portion is implemented by the first support member, shortening the signal transmission path. This improves the quality of signal transmission. For example, the risk of audio signal distortion during transmission is relatively low. In addition, the main control module in this embodiment does not include a flexible circuit board connected between the first substrate and the rigid board portion. This avoids problems such as product failure and reduced yield due to the flexible circuit board being bent at a relatively large bending angle, which can cause breakage or disconnection in the bending area.

[0011] In any embodiment, the main control module further includes a plurality of chip matching components. At least one of the plurality of chip matching components is fixed to the first substrate, and at least one of the plurality of chip matching components is fixed to the rigid board portion. The chip matching components fixed to the first substrate are electrically connected to the rigid board portion using a first support member. The placement positions of the plurality of chip matching components can be arranged with the corresponding chips.

[0012] In any embodiment, the first support member includes a plurality of first raised pillars, the plurality of first raised pillars being located between the rigid board portion and the first substrate and fixed to the rigid board portion. The main control module further includes a first packaging layer, the first packaging layer being located between the rigid board portion and the first substrate. The first packaging layer packages at least one of the plurality of first raised pillars on the rigid board portion. In this case, an end face of each of the plurality of first raised pillars, the end face facing away from the rigid board portion, protrudes toward the first packaging layer. The first substrate may be connected to the end face of the first raised pillar. The first packaging layer packages a plurality of chip matching components on the rigid board portion. Because the first packaging layer can protect the components packaged by the first packaging layer, the main control module has relatively high reliability and a relatively long service life.

[0013] In this embodiment, the first packaging layer directly packages multiple components onto the rigid board portion. In this way, the multiple components can be directly connected to the functional module of the wireless headset by using the rigid board portion and the first or second flexible board portion. Compared with the conventional packaging layer method in which components are first packaged onto a substrate and then welded to a circuit board before connecting the substrate to an external module, the connection method in this embodiment is more direct and has a simpler structure.

[0014] In an optional embodiment, the rigid board portion includes a first surface facing the first substrate. The first surface includes a first package area and a first non-package area, the first package layer is located within the first package area, and the first non-package area is located around the first package area. That is, there is a specific distance between an edge of the first package area and an edge of the rigid board portion. In this embodiment, the first non-package area abuts against the first flexible board portion or the second flexible board portion, thereby providing a support space for a mold during the molding operation of the first package layer to avoid damage to the rigid-flexible circuit board caused by the mold, thereby ensuring the production yield of the main control module.

[0015] In any embodiment, the main control module further includes at least one first component, the at least one first component being secured to the first non-packaged area, for example, a component not suitable for plastic packaging, including, but not limited to, a surface acoustic wave filter having a cavity, a crystal oscillator having a cavity, a pressure-sensitive component, etc.

[0016] In this embodiment, the first non-packaging area of ​​the rigid board portion not only provides abutment space for the mold in the molding process of the first packaging layer, but is also configured to place the first component that is not suitable for packaging, so that the main control module improves space utilization by reusing the space of the first non-packaging area.

[0017] In any embodiment, the first substrate is welded to the plurality of first raised pillars. The main control module further includes a second packaging layer. The second packaging layer is located on a side of the first substrate away from the rigid board portion. The second packaging layer packages at least one chip on the first substrate. The second packaging layer may further package at least one chip matching component on the first substrate. Because the second packaging layer can protect the components packaged by the second packaging layer, the main control module has relatively high reliability and a relatively long service life.

[0018] In any embodiment, the first support member further includes a plurality of second raised pillars, the plurality of second raised pillars fixed to a side of the first substrate facing the rigid board portion, the plurality of second raised pillars welded to the plurality of first raised pillars in a one-to-one correspondence. The main control module further includes a second packaging layer and a third packaging layer, the second packaging layer located on a side of the first substrate away from the rigid board portion, the second packaging layer packaging at least one chip on the first substrate, and the third packaging layer located on the side of the first substrate facing the rigid board portion, the third packaging layer packaging the plurality of second raised pillars and at least one chip on the first substrate.

[0019] In this embodiment, the first support member includes a first raised pillar and a second raised pillar, and the first raised pillar and the second raised pillar are stacked, so that the first support member has a sufficient height to allow a relatively large gap between the first substrate and the rigid board portion. Two component layers can be arranged between the first substrate and the rigid board portion. In this way, the main control module integrates three component layers in a direction perpendicular to the rigid board portion, and the main control module and wireless headset have a higher component arrangement density and a higher degree of component integration. In addition, the arrangement solutions for the three component layers of the multiple chips and the main control module are more flexible and diverse.

[0020] In any embodiment, the main control module further includes at least one second component secured to a side of the first substrate away from the rigid board portion and located outside the second packaging layer, the second component being a component not suitable for plastic packaging, including, but not limited to, a surface acoustic wave filter with a cavity, a crystal oscillator with a cavity, a pressure-sensitive component, etc.

[0021] In this embodiment, components in the main control module that are not suitable for plastic packaging can be flexibly placed on the rigid board section and / or the first substrate based on function selection and chip placement location, thereby improving the flexibility and diversity of components in the main control module.

[0022] In any embodiment, the main control module further includes a second substrate, a second package layer, a third package layer, and a plurality of third raised pillars. The first substrate is welded to the plurality of first raised pillars. The chip fixed to the first substrate is located on a side of the first substrate away from the rigid board portion. The second substrate is located on a side of the first substrate away from the rigid board portion. The second substrate and the first substrate are stacked with a certain gap between them. The plurality of third raised pillars are located between the second substrate and the first substrate and abut against each of the second substrate and the first substrate. The second package layer is located between the second substrate and the first substrate. The plurality of third raised pillars and the chip fixed to the first substrate are packaged in the second package layer. At least one of the plurality of chips is packaged in the second package layer and fixed to the second substrate. The third packaging layer is located on a side of the second substrate away from the first substrate, and at least one of the plurality of chips is packaged in the third packaging layer and secured to the second substrate. The chip secured to the second substrate is electrically connected to the rigid board portion using the plurality of third raised pillars, the first substrate, and the plurality of first raised pillars.

[0023] In this embodiment, the main control module has components located on all of the following: a side of the rigid board portion facing the first substrate, a side of the first substrate away from the rigid board portion, a side of the second substrate facing the first substrate, and a side of the second substrate away from the first substrate. In this manner, four component layers are stacked perpendicular to the rigid board portion, thereby increasing component density and component integration.

[0024] In any embodiment, the first packaging layer contacts the first substrate. The main control module further includes a second packaging layer. The second packaging layer is fixed to the side of the first substrate away from the rigid board portion. The chip fixed to the first substrate is partially packaged in the first packaging layer and partially packaged in the second packaging layer. In this embodiment, the main control module has components arranged on all of the side of the rigid board portion facing the first substrate, the side of the first substrate facing the rigid board portion, and the side of the first substrate away from the rigid board portion. In this manner, three component layers are stacked in a direction perpendicular to the rigid board portion. Therefore, the main control module and the wireless headset have a relatively high component placement density and a relatively high degree of component integration.

[0025] In an optional embodiment, the main control module further includes a fourth packaging layer secured to the rigid board portion on a side thereof away from the first substrate, and at least one of the chips secured to the rigid board portion is packaged in the fourth packaging layer.

[0026] In this embodiment, the main control module has components located on all of the sides of the rigid board portion away from the first substrate, the side of the rigid board portion facing the first substrate, and the side of the first substrate away from the rigid board portion. As such, three component layers are stacked in a direction perpendicular to the rigid board portion. Therefore, the main control module and the wireless headset have a relatively high component density and a relatively high degree of component integration.

[0027] In any embodiment, the first support member includes a plurality of first raised pillars and a plurality of second raised pillars. The first raised pillars and the second raised pillars are stacked. The plurality of first raised pillars are fixed to the rigid board portion. The plurality of second raised pillars are fixed to the first substrate. The plurality of second raised pillars are welded to the plurality of first raised pillars in a one-to-one correspondence. The main control module further includes a first packaging layer, a second packaging layer, a third packaging layer, and a fourth packaging layer. The first packaging layer is located between the first rigid board portion and the first substrate. The first packaging layer packages the plurality of first raised pillars and at least one chip on the rigid board portion. The second packaging layer is located on a side of the first substrate facing the rigid board portion. A second packaging layer packages the plurality of second raised pillars and at least one chip on the first substrate. A third packaging layer is located on a side of the first substrate away from the rigid board portion. The third packaging layer packages at least one chip on the first substrate. A fourth packaging layer is located on a side of the rigid board portion away from the first substrate. The fourth packaging layer packages at least one chip on the rigid board portion.

[0028] In this embodiment, the main control module has components located on both sides of the rigid board portion and both sides of the first substrate. Thus, four component layers are stacked in a direction perpendicular to the rigid board portion. Therefore, the main control module and wireless headset have a relatively high component density and a relatively high degree of component integration.

[0029] In an optional embodiment, the main control module further includes a third substrate and a second support member. The third substrate is located on a side of the rigid board portion away from the first substrate. The third substrate and the rigid board portion are stacked with a certain gap between them. The second support member is located between the third substrate and the rigid board portion and abuts against each of the third substrate and the rigid board portion. At least one of the plurality of chips is fixed to the third substrate. The chip fixed to the third substrate is electrically connected to the rigid board portion using the second support member. In this embodiment, one or more component layers can be stacked on both sides of the rigid board portion, further increasing the degree of component integration of the main control module and the wireless headset.

[0030] In any embodiment, the first support member includes a plurality of first raised pillars and a plurality of second raised pillars. The first raised pillars and the second raised pillars are stacked. The plurality of first raised pillars are secured to the rigid board portion. The plurality of second raised pillars are secured to the first substrate. The plurality of second raised pillars are welded to the plurality of first raised pillars in a one-to-one correspondence. The second support member includes a plurality of fourth raised pillars, the plurality of fourth raised pillars are secured to the rigid board portion. A third substrate is welded to the plurality of fourth raised pillars, and the chip secured to the third substrate is located on a side of the third substrate away from the rigid board portion.

[0031] The main control module includes a first package layer, a second package layer, a third package layer, a fourth package layer, and a fifth package layer. The first package layer is located between the rigid board portion and the first substrate. The first package layer packages a plurality of first raised pillars and at least one chip on the rigid board portion. The second package layer is located on a side of the first substrate facing the rigid board portion. The second package layer packages a plurality of second raised pillars and at least one chip on the first substrate. The third package layer is located on a side of the first substrate away from the rigid board portion. The third package layer packages at least one chip on the first substrate. The fourth package layer is located on a side of the rigid board portion away from the first substrate. The fourth package layer packages a plurality of fourth raised pillars and at least one chip on the rigid board portion. The fifth packaging layer is located on the side of the third substrate away from the rigid board portion, and packages at least one chip onto the third substrate.

[0032] In this embodiment, the main control module has components located on both sides of the rigid board portion, both sides of the first substrate, and on the side of the third substrate away from the rigid board portion. Thus, five component layers are stacked perpendicular to the rigid board portion. Therefore, the main control module and wireless headset have a relatively high component density and a relatively high degree of component integration.

[0033] In any embodiment, the first support member includes a plurality of first raised pillars and a plurality of second raised pillars. The first raised pillars and the second raised pillars are stacked. The plurality of first raised pillars are secured to a rigid board portion. The plurality of second raised pillars are secured to a first substrate. The plurality of second raised pillars are welded to the plurality of first raised pillars in a one-to-one correspondence. The second support member includes a plurality of fourth raised pillars and a plurality of fifth raised pillars. The fourth raised pillars and the fifth raised pillars are stacked. The plurality of fourth raised pillars are secured to a rigid board portion. The plurality of fifth raised pillars are secured to a third substrate. The plurality of fifth raised pillars are welded to the plurality of fourth raised pillars in a one-to-one correspondence.

[0034] The main control module further includes a first package layer, a second package layer, a third package layer, a fourth package layer, a fifth package layer, and a sixth package layer. The first package layer is located between the rigid board portion and the first substrate. The first package layer packages a plurality of first raised pillars and at least one chip on the rigid board portion. The second package layer is located on a side of the first substrate facing the rigid board portion. The second package layer packages a plurality of second raised pillars and at least one chip on the first substrate. The third package layer is located on a side of the first substrate away from the rigid board portion. The third package layer packages at least one chip on the first substrate. The fourth package layer is located on a side of the rigid board portion away from the first substrate. The fourth package layer packages a plurality of fourth raised pillars and at least one chip on the rigid board portion. A fifth packaging layer is located on a side of the third substrate facing the rigid board portion. The fifth packaging layer packages a plurality of fifth raised pillars and at least one chip on the third substrate. A sixth packaging layer is located on a side of the third substrate away from the rigid board portion. The sixth packaging layer packages at least one chip on the third substrate.

[0035] In this embodiment, the main control module has components located on both sides of the rigid board portion, both sides of the first substrate, and both sides of the third substrate. Thus, six component layers are stacked in a direction perpendicular to the rigid board portion. Therefore, the main control module and the wireless headset have a relatively high component placement density and a relatively high degree of component integration.

[0036] In any embodiment, the first support member includes a plurality of first raised pillars and a plurality of second raised pillars. The first raised pillars and the second raised pillars are stacked. The plurality of first raised pillars are secured to a rigid board portion. The plurality of second raised pillars are secured to a first substrate. The plurality of second raised pillars are welded to the plurality of first raised pillars in a one-to-one correspondence. The second support member includes a plurality of stacked fourth raised pillars, the plurality of fourth raised pillars are secured to a rigid board portion. The third substrate is welded to the plurality of fourth raised pillars.

[0037] The main control module further includes a fourth substrate and a plurality of sixth raised pillars. The fourth substrate is located on a side of the third substrate away from the rigid board portion. The fourth substrate and the third substrate are stacked at a certain distance from each other. The plurality of sixth raised pillars are located between the fourth substrate and the third substrate and support the fourth substrate and the third substrate. At least one of the plurality of chips is fixed to the fourth substrate. The chip fixed to the fourth substrate is electrically connected to the rigid board portion using the sixth raised pillars, the third substrate, and the second support member.

[0038] The main control module further includes a first package layer, a second package layer, a third package layer, a fourth package layer, a fifth package layer, and a sixth package layer. The first package layer is located between the rigid board portion and the first substrate. The first package layer packages a plurality of first raised pillars and at least one chip on the rigid board portion. The second package layer is located on a side of the first substrate facing the rigid board portion. The second package layer packages a plurality of second raised pillars and at least one chip on the first substrate. The third package layer is located on a side of the first substrate away from the rigid board portion. The third package layer packages at least one chip on the first substrate. The fourth package layer is located on a side of the rigid board portion away from the first substrate. The fourth package layer packages a plurality of fourth raised pillars and at least one chip on the rigid board portion. A fifth packaging layer is located between the third substrate and the fourth substrate. The fifth packaging layer packages a plurality of sixth raised pillars and at least one chip on the third substrate and packages at least one chip on the fourth substrate. A sixth packaging layer is located on a side of the fourth substrate away from the third substrate. The sixth packaging layer packages at least one chip on the fourth substrate.

[0039] In this embodiment, the main control module has components located on both sides of the rigid board portion, both sides of the first substrate, the side of the third substrate away from the rigid board portion, and both sides of the fourth substrate. Thus, seven component layers are stacked in a direction perpendicular to the rigid board portion. Therefore, the main control module and wireless headset have a relatively high component density and a relatively high degree of component integration.

[0040] In an optional embodiment, the first support member includes a plurality of first raised pillars, and the second support member includes a plurality of fourth raised pillars. The main control module further includes a first packaging layer, a second packaging layer, a fourth packaging layer, and a fifth packaging layer. The first packaging layer is located between the rigid board portion and the first substrate. The first packaging layer packages the plurality of first raised pillars and at least one chip on the rigid board portion and packages at least one chip on the first substrate. In this case, the first packaging layer packages components located between the rigid board portion and the first substrate. The fourth packaging layer is located between the rigid board portion and a third substrate. The fourth packaging layer packages the plurality of fourth raised pillars and at least one chip on the rigid board portion and packages at least one chip on the third substrate. The fifth packaging layer is fixed to a side of the third substrate away from the rigid board portion. The fifth packaging layer packages at least one chip on the third substrate.

[0041] In this embodiment, the main control module has components located on both sides of the rigid board portion, both sides of the first substrate, and both sides of the third substrate. Thus, six component layers are stacked in a direction perpendicular to the rigid board portion. Therefore, the main control module and the wireless headset have a relatively high component placement density and a relatively high degree of component integration.

[0042] In any embodiment, the first support member is a first raised plate, the first raised plate is a hollow structure, and at least one chip is located inside the first raised plate. The first raised plate is a circuit board structure, and the first raised plate can be fixed to the rigid board portion by assembly or can be integrally molded with the rigid board portion. In this embodiment, the main control module uses the first raised plate to support the component placement space between the first substrate and the rigid board portion, allowing the main control module to integrate at least two component layers. In this way, component placement density is increased, and the main control module and wireless headset have a relatively high degree of component integration.

[0043] In some embodiments, all of the components secured to the rigid board portion are located on the side of the rigid board portion facing the first substrate, some of the components are located inside the first raised plate and some of the components are located outside the first raised plate, and in some other embodiments, some of the components secured to the rigid board portion are located on the side of the rigid board portion facing the first substrate and some are located on the side of the rigid board portion away from the first substrate.

[0044] The main control module further includes a plurality of chip matching components, at least one of which is fixed to the rigid board portion and at least one of which is fixed to the first substrate.

[0045] In any embodiment, at least one of the plurality of chips is fixed to a side of the rigid board portion away from the first substrate, at least one of the plurality of chips is fixed to a side of the rigid board portion facing the first substrate, at least one of the plurality of chips is fixed to a side of the first substrate facing the rigid board portion, and at least one of the plurality of chips is fixed to a side of the first substrate away from the rigid board portion. That is, components are disposed on both sides of the rigid board portion and on both sides of the first substrate. Thus, the main control module integrates four component layers. With a high component density, the main control module and the wireless headset have a high degree of component integration.

[0046] The main control module further includes a first packaging layer located on a side of the first substrate away from the rigid board portion and packaging at least one chip. The first packaging layer may further package at least one chip matching component. The first packaging layer may provide full-size or partial packaging for components secured to the side of the first substrate away from the rigid board portion.

[0047] In an optional embodiment, the main control module further includes a second substrate and a plurality of third raised pillars. The second substrate is located on a side of the first substrate away from the rigid board portion. The second substrate and the first substrate are stacked with a certain distance between them. The plurality of third raised pillars are located between the second substrate and the first substrate and abut against each of the second substrate and the first substrate. At least one of the plurality of chips is fixed to the second substrate. The chip fixed to the second substrate is electrically connected to the rigid board portion using the plurality of third raised pillars, the first substrate, and the first support member.

[0048] The main control module further includes a first packaging layer and a second packaging layer. The first packaging layer is located between the first substrate and the second substrate and is configured to package components between the first substrate and the second substrate. The second packaging layer is located on a side of the second substrate away from the first substrate. The second packaging layer can perform partial or full-size packaging for components fixed to the side of the second substrate away from the first substrate.

[0049] In this embodiment, components are located on both sides of the rigid board section, both sides of the first substrate, and both sides of the second substrate. The main control module integrates six component layers. The component density is high, and the main control module and wireless headset have a high degree of component integration. In another embodiment, components may be located on one side of one or more of the rigid board section, the first substrate, or the second substrate.

[0050] In any embodiment, the main control module further includes a second substrate and a second ridge plate. The second substrate is located on a side of the rigid board portion away from the first substrate, and the second substrate and the rigid board portion are stacked with a certain gap between them. The second ridge plate is located between the second substrate and the rigid board portion and abuts against each of the second substrate and the rigid board portion. At least one of the plurality of chips is fixed to the second substrate. The chip fixed to the second substrate is electrically connected to the ridge board portion using the second ridge plate. The second ridge plate has a hollow structure, and the at least one chip is located inside the second ridge plate.

[0051] In this embodiment, the main control module has a first substrate secured to one side of the rigid board portion using a first raised plate and a second substrate secured to the other side of the rigid board portion using a second raised plate. In this manner, a stack structure having three circuit board layers is formed, and components are flexibly arranged on one or both sides of each of the three circuit board layers to form a stack structure having at least three component layers. Therefore, the main control module and the wireless headset have a high component placement density and a high degree of component integration.

[0052] In any embodiment, the main control module further includes a first packaging layer. The first packaging layer is located on a side of the second substrate away from the rigid board portion. The first packaging layer may provide partial or full-size packaging for components secured to the side of the second substrate away from the rigid board portion. The first packaging layer may protect the components packaged therein and may also provide a support or mounting surface when the main control module and other portions of the wireless headset are assembled, thereby protecting the components within the main control module.

[0053] In any embodiment, the earbud portion includes a receiver module and the first flexible board portion is connected to the receiver module; the ear handle portion includes a battery and the second flexible board portion is connected to the battery; the plurality of chips includes a microcontroller unit chip, a power management chip, and an audio chip; both the power management chip and the audio chip are electrically connected to the microcontroller unit chip; and the microcontroller unit chip is the processing and control center of the wireless headset and the main control module.

[0054] The receiver module is electrically connected to the audio chip using the first flexible board portion and the rigid board portion. The audio chip is configured to encode audio data to form an electrical signal. The receiver module is configured to convert the electrical signal into an audio signal. The battery is electrically connected to the power management chip using the second flexible board portion and the rigid board portion. The battery is configured to provide power to the wireless headset. The power management chip is configured to manage the power input and power output of the battery.

[0055] In any embodiment, the plurality of functional modules of the wireless headset further includes a positive charging terminal and a negative charging terminal. The positive charging terminal is located within the earbud portion. The rigid-flexible circuit board of the main control module further includes a third flexible board portion connected to the rigid board portion, the third flexible board portion being located within the earbud portion. The positive charging terminal is connected to the third flexible board portion and connected to the power management chip using the third flexible board portion and the rigid board portion. The negative charging terminal is located in the bottom section of the ear handle portion. The negative charging terminal is connected to the second flexible board portion and connected to the power management chip using the second flexible board portion and the rigid board portion.

[0056] In any embodiment, the plurality of functional modules of the wireless headset further includes an optical sensor module. The optical sensor module may be used as a proximity detection module and configured to detect whether the wireless headset is attached to a user's ear. The optical sensor module may be located within the earbud portion, for example, at a location of the earbud portion away from the ear handle portion. The optical sensor module may transmit a detection signal and receive a feedback signal through a detection hole in the side housing to perform detection. The optical sensor module is connected to the first flexible board portion and electrically connected to the plurality of chips in the stack assembly using the first flexible board portion and the rigid board portion.

[0057] In any embodiment, the plurality of functional modules of the wireless headset further includes a bone vibration sensor module. The bone vibration sensor module is configured to perform functions such as voice print recognition, voice interpretation and recognition interface, and two-tap activation of the wireless headset. The bone vibration sensor module is located within the earbud portion, and may be located, for example, at a position of the earbud portion facing the bottom section of the ear handle portion. A corresponding interaction through-hole may be disposed in the main housing portion, and the bone vibration sensor module communicates with the user through the interaction through-hole. The bone vibration sensor module is connected to the first flexible board portion and connected to the chip in the stack assembly by using the first flexible board portion and the rigid board portion.

[0058] In any embodiment, the plurality of functional modules of the wireless headset further includes an antenna module. The antenna module includes an antenna support, an antenna, and a power feed member. The antenna is fixed to the antenna support, and the antenna and antenna support are located in the upper section and the connection section of the ear handle portion. The power feed member is located in the connection section of the ear handle portion, fixed to the second flexible board portion, and configured to feed power to the antenna. For example, the power feed member may be an elastomer and welded to the second flexible board portion. In some embodiments, the plurality of chips further includes a radio frequency chip, and the radio frequency chip is configured to modulate and demodulate radio frequency signals. For example, the radio frequency signals operate in the Bluetooth frequency band. The radio frequency chip is electrically connected to the microcontroller unit chip. The antenna is electrically connected to the radio frequency chip using the power feed member, the second flexible board portion, and the rigid board portion. In some other embodiments, the radio frequency chip may be further integrated into the microcontroller unit chip.

[0059] In any embodiment, the plurality of functional modules of the wireless headset further includes a first microphone module configured to convert an audio signal into an electrical signal. The first microphone module is located in the connection section of the ear handle portion. Audio outside the wireless headset can enter the wireless headset through the first audio inlet and be received by the first microphone module. The first microphone module is connected to the second flexible board portion and is connected to the chip in the stack assembly using the second flexible board portion and the rigid board portion.

[0060] In any embodiment, the plurality of functional modules of the wireless headset further includes a second microphone module configured to convert audio signals into electrical signals. The second microphone module is located in a bottom section of the ear handle portion. Audio outside the wireless headset can enter the wireless headset through the second audio inlet and be received by the second microphone module. The second microphone module is connected to the second flexible board portion and connected to the chips in the stack assembly using the second flexible board portion and the rigid board portion.

[0061] In any embodiment, the rigid-flexible circuit board includes at least one flexible dielectric layer and at least two first conductive layers. The at least one flexible dielectric layer and the at least two first conductive layers are stacked. One flexible dielectric layer is disposed between two adjacent first conductive layers. The at least one flexible dielectric layer and the at least two first conductive layers form the first flexible board section, an intermediate layer of the rigid board section, and the second flexible board section. The first flexible board section, the intermediate layer of the rigid board section, and the second flexible board section are an integral and continuous structure. For example, the flexible dielectric layer may be made of a polyimide material so that the first flexible board section and the second flexible board section have relatively good bending resistance.

[0062] The rigid-flexible circuit board further includes at least two rigid dielectric layers and at least two second conductive layers. The at least two rigid dielectric layers and the at least two second conductive layers are stacked. A portion of the at least two rigid dielectric layers is located on one side of the intermediate layer of the rigid board portion, and another of the rigid dielectric layers is located on the other side of the intermediate layer of the rigid board portion. A portion of the at least two second conductive layers is located on one side of the intermediate layer of the rigid board portion, and another of the second conductive layers is located on the other side of the intermediate layer of the rigid board portion. One rigid dielectric layer is disposed between two adjacent second conductive layers on the same side of the intermediate layer of the rigid board portion. One rigid dielectric layer is disposed between the intermediate layer of the rigid board portion and the second conductive layer adjacent to the intermediate layer of the rigid board portion. For example, the rigid dielectric layer may be made of polypropylene to ensure sufficient structural strength of the rigid board portion.

[0063] According to a second aspect, an embodiment of the present application further provides a wireless headset. The wireless headset includes an ear handle portion and an earphone portion connected to the ear handle portion. The wireless headset includes a main control module. The main control module includes a first substrate, a second substrate, a rigid-flexible circuit board, and multiple chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion connected to the rigid board portion. The first substrate and the second substrate are located within the earphone portion. The first substrate and the second substrate are stacked at a certain interval. The rigid board portion has a hollow structure. The rigid board portion is fixed between the first substrate and the second substrate. The first flexible board portion is located within the earphone portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end extends to the ear handle portion. At least one of the plurality of chips is fixed to the first substrate. At least one of the plurality of chips is fixed to the second substrate. At least one of the plurality of chips is located inside the rigid board portion. The chip fixed to the first substrate and the chip fixed to the second substrate are electrically connected to the rigid board portion.

[0064] In this embodiment, the rigid board portion of the rigid-flexible circuit board functions as a raised structure between the first and second substrates, thereby forming a gap between the first and second substrates. Components can be disposed on one or both sides of the first substrate and one or both sides of the second substrate. Thus, the main control module integrates at least two stacked component layers. In this manner, component placement density is relatively high, and the main control module and wireless headset have a high degree of component integration.

[0065] In any embodiment, the main control module further includes a first packaging layer, a second packaging layer, a third packaging layer, and a fourth packaging layer. The first packaging layer is located on a side of the first substrate facing the second substrate. The first packaging layer is located inside the rigid board portion. The first packaging layer packages at least one chip and may further package at least one chip matching component. The second packaging layer is located on a side of the first substrate away from the second substrate. The second packaging layer packages at least one chip and may further package at least one chip matching component. The at least one first component may be further fixed to a side of the first substrate away from the second substrate. The first component is a component not suitable for plastic packaging. The first component is located outside the second packaging layer.

[0066] The third packaging layer is located on the side of the second substrate facing the first substrate. The third packaging layer is located inside the rigid board portion. The third packaging layer packages at least one chip and may further package at least one chip matching component. The fourth packaging layer is located on the side of the second substrate away from the first substrate. The fourth packaging layer packages at least one chip and may further package at least one chip matching component. At least one second component may be further fixed to the side of the second substrate away from the first substrate. The second component is a component not suitable for plastic packaging. The second component is located outside the fourth packaging layer.

[0067] In an optional embodiment, the main control module further includes a third substrate and a plurality of first raised pillars. The third substrate is located on a side of the first substrate away from the second substrate. The third substrate and the first substrate are stacked at a distance from each other. The plurality of first raised pillars are fixed between the third substrate and the first substrate. At least one chip and at least one chip matching component are distributed on each side of the first substrate, each side of the second substrate, and each side of the third substrate. The component fixed to the third substrate is electrically connected to the rigid board portion using the plurality of first raised pillars and the first substrate.

[0068] The main control module further includes a first package layer, a second package layer, a third package layer, a fourth package layer, and a fifth package layer. The first package layer is located on the side of the first substrate facing the second substrate. The first package layer is located inside the rigid board portion. The first package layer packages at least two components. The second package layer is located between the first substrate and the third substrate. The second package layer packages a plurality of first raised pillars and components located between the first substrate and the third substrate. The third package layer is located on the side of the third substrate away from the first substrate. The third package layer packages at least two components. At least one first component may be further fixed to the side of the third substrate away from the first substrate. The first component is a component not suitable for plastic packaging. The first component is located outside the third package layer.

[0069] The fourth package layer is located on the side of the second substrate facing the first substrate. The fourth package layer is located inside the rigid board portion. The third package layer packages at least two components. The fifth package layer is located on the side of the second substrate away from the first substrate. The fifth package layer packages at least two components. At least one second component may be further fixed to the side of the second substrate away from the first substrate. The second component is a component not suitable for plastic packaging. The second component is located outside the fifth package layer.

[0070] In this embodiment, the main control module includes three stacked circuit boards (a first board, a second board, and a third board). Components can be placed on both sides of each circuit board, resulting in six integrated component layers. The component placement density is high, and the main control module and wireless headset have a high degree of component integration.

[0071] In any embodiment, the earbud portion includes a receiver module, and the first flexible board portion is connected to the receiver module. The ear handle portion includes a battery, and the second flexible board portion is connected to the battery. The plurality of chips includes a microcontroller unit chip, a power management chip, and an audio chip. Both the power management chip and the audio chip are electrically connected to the microcontroller unit chip. The microcontroller unit chip is the processing and control center of the wireless headset and the main control module.

[0072] The receiver module is electrically connected to the audio chip using the first flexible board portion and the rigid board portion. The audio chip is configured to encode audio data to form an electrical signal. The receiver module is configured to convert the electrical signal into an audio signal. The battery is electrically connected to the power management chip using the second flexible board portion and the rigid board portion. The battery is configured to provide power to the wireless headset. The power management chip is configured to manage the power input and power output of the battery.

[0073] According to a third aspect, an embodiment of the present application further provides a main control module. The main control module may be applied to an electronic device. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion connected to the rigid board portion. The first substrate and the rigid board portion are stacked with each other at a certain space. For example, a protrusion of the first substrate on the rigid board portion falls within the range of the rigid board portion. The first support member is located between the first substrate and the rigid board portion and abuts against each of the first substrate and the rigid board portion. At least one of the plurality of chips is fixed to the rigid board portion. At least one of the plurality of chips is fixed to the first substrate. The chip fixed to the first substrate is electrically connected to the rigid board portion using the first support member. The portions of the main control module secured above and below the rigid board portion form a stack assembly, i.e., the main control module includes a rigid-flexible circuit board and a stack assembly, which is secured to the rigid board portion and includes a first substrate, a first support member, and a plurality of chips.

[0074] In this embodiment, the main control module includes a stacked first substrate and a rigid board portion. At least one chip is fixed to the first substrate. At least one chip is fixed to the rigid board portion. Thus, the stack assembly of the main control module can form a stack structure having multiple component layers. The main control module has a high component density and a high degree of component integration.

[0075] In this embodiment, the chip fixed to the first substrate can be electrically connected to the rigid board portion using the first support member, eliminating the need for a flexible circuit board for transmitting signals between the first substrate and the rigid board portion. The signal transmission path between the chip on the first substrate and the rigid board portion is implemented by the first support member, shortening the signal transmission path. This improves signal transmission quality. Additionally, the main control module in this embodiment does not include a flexible circuit board connected between the first substrate and the rigid board portion. This avoids the problem of product failure and reduced yield caused by the flexible circuit board being bent at a relatively large bending angle, which can lead to breakage or disconnection in the bending area.

[0076] In any embodiment, the main control module further includes a plurality of chip matching components. At least one of the plurality of chip matching components is fixed to the first substrate, and at least one of the plurality of chip matching components is fixed to the rigid board portion. The chip matching components fixed to the first substrate are electrically connected to the rigid board portion using a first support member. The placement positions of the plurality of chip matching components can be arranged with the corresponding chips.

[0077] In any embodiment, the first support member includes a plurality of first raised pillars, the plurality of first raised pillars being located between the rigid board portion and the first substrate and fixed to the rigid board portion. The main control module further includes a first packaging layer, the first packaging layer being located between the rigid board portion and the first substrate. The first packaging layer packages at least one of the plurality of first raised pillars on the rigid board portion. In this case, an end face of each of the plurality of first raised pillars, the end face facing away from the rigid board portion, protrudes toward the first packaging layer. The first substrate may be connected to the end face of the first raised pillar. The first packaging layer packages a plurality of chip matching components on the rigid board portion. Because the first packaging layer can protect the components packaged by the first packaging layer, the main control module has relatively high reliability and a relatively long service life.

[0078] In this embodiment, the first packaging layer directly packages multiple components onto the rigid board portion. In this way, the multiple components can be directly connected to an external function module by using the rigid board portion and the first or second flexible board portion. Compared with the conventional packaging layer method of first packaging components onto a substrate and then welding the substrate to a circuit board before connecting it to an external module, the connection method in this embodiment is more direct and has a simpler structure.

[0079] In an optional embodiment, the rigid board portion includes a first surface facing the first substrate. The first surface includes a first package area and a first non-package area, the first package layer is located within the first package area, and the first non-package area is located around the first package area. That is, there is a specific distance between an edge of the first package area and an edge of the rigid board portion. In this embodiment, the first non-package area abuts against the first flexible board portion or the second flexible board portion, thereby providing a support space for a mold during the molding operation of the first package layer to avoid damage to the rigid-flexible circuit board caused by the mold, thereby ensuring the production yield of the main control module.

[0080] In any embodiment, the main control module further includes at least one first component, and the at least one first component is fixed in the first non-packaging area. For example, the first component is a component that is not suitable for plastic packaging. In this embodiment, the first non-packaging area of ​​the rigid board portion not only provides a contact space for a mold in a molding process of the first package layer, but is also configured to accommodate the first component that is not suitable for packaging, thereby improving space utilization by reusing the space of the first non-packaging area of ​​the main control module.

[0081] In any embodiment, the first substrate is welded to the plurality of first raised pillars. The main control module further includes a second packaging layer. The second packaging layer is located on a side of the first substrate away from the rigid board portion. The second packaging layer packages at least one chip on the first substrate. The second packaging layer may further package at least one chip matching component on the first substrate. Because the second packaging layer can protect the components packaged by the second packaging layer, the main control module has relatively high reliability and a relatively long service life.

[0082] In any embodiment, the first support member further includes a plurality of second raised pillars, the plurality of second raised pillars fixed to a side of the first substrate facing the rigid board portion, the plurality of second raised pillars welded to the plurality of first raised pillars in a one-to-one correspondence. The main control module further includes a second packaging layer and a third packaging layer, the second packaging layer located on a side of the first substrate away from the rigid board portion, the second packaging layer packaging at least one chip on the first substrate, and the third packaging layer located on the side of the first substrate facing the rigid board portion, the third packaging layer packaging the plurality of second raised pillars and at least one chip on the first substrate.

[0083] In this embodiment, the first support member includes a first raised pillar and a second raised pillar, and the first raised pillar and the second raised pillar are stacked, so that the first support member has a sufficient height to allow a relatively large gap between the first substrate and the rigid board portion. Two component layers can be arranged between the first substrate and the rigid board portion. In this way, the main control module integrates three component layers in a direction perpendicular to the rigid board portion, and the main control module has a higher component arrangement density and a higher degree of component integration. In addition, the arrangement solutions for the three component layers of the multiple chips and main control module are more flexible and diverse.

[0084] In any embodiment, the main control module further includes at least one second component secured to a side of the first substrate away from the rigid board portion and located outside the second packaging layer, the second component being a component not suitable for plastic packaging, including, but not limited to, a surface acoustic wave filter with a cavity, a crystal oscillator with a cavity, a pressure-sensitive component, etc.

[0085] In this embodiment, components in the main control module that are not suitable for plastic packaging can be flexibly placed on the rigid board section and / or the first substrate based on function selection and chip placement location, thereby improving the flexibility and diversity of components in the main control module.

[0086] In any embodiment, the main control module further includes a second substrate, a second package layer, a third package layer, and a plurality of third raised pillars. The first substrate is welded to the plurality of first raised pillars. The chip fixed to the first substrate is located on a side of the first substrate away from the rigid board portion. The second substrate is located on a side of the first substrate away from the rigid board portion. The second substrate and the first substrate are stacked with a certain gap between them. The plurality of third raised pillars are located between the second substrate and the first substrate and abut against each of the second substrate and the first substrate. The second package layer is located between the second substrate and the first substrate. The plurality of third raised pillars and the chip fixed to the first substrate are packaged in the second package layer. At least one of the plurality of chips is packaged in the second package layer and fixed to the second substrate. The third packaging layer is located on a side of the second substrate away from the first substrate, and at least one of the plurality of chips is packaged in the third packaging layer and secured to the second substrate. The chip secured to the second substrate is electrically connected to the rigid board portion using the plurality of third raised pillars, the first substrate, and the plurality of first raised pillars.

[0087] In this embodiment, the main control module has components located on all of the following: a side of the rigid board portion facing the first substrate, a side of the first substrate away from the rigid board portion, a side of the second substrate facing the first substrate, and a side of the second substrate away from the first substrate. In this manner, four component layers are stacked perpendicular to the rigid board portion, thereby increasing component density and component integration.

[0088] In any embodiment, the first packaging layer contacts the first substrate. The main control module further includes a second packaging layer. The second packaging layer is fixed to the first substrate on a side away from the rigid board portion. The chip fixed to the first substrate is partially packaged in the first packaging layer and partially packaged in the second packaging layer.

[0089] In this embodiment, the main control module has components disposed on all of the sides of the rigid board portion facing the first substrate, the side of the first substrate facing the rigid board portion, and the side of the first substrate facing away from the rigid board portion. Thus, three component layers are stacked in a direction perpendicular to the rigid board portion. Therefore, the main control module has a relatively high component density and a relatively high degree of component integration.

[0090] In an optional embodiment, the main control module further includes a fourth packaging layer secured to the rigid board portion on a side thereof away from the first substrate, and at least one of the chips secured to the rigid board portion is packaged in the fourth packaging layer.

[0091] In this embodiment, the main control module has components located on all of the sides of the rigid board portion away from the first substrate, the side of the rigid board portion facing the first substrate, and the side of the first substrate away from the rigid board portion. Thus, three component layers are stacked in a direction perpendicular to the rigid board portion. Therefore, the main control module has a relatively high component placement density and a relatively high degree of component integration.

[0092] In any embodiment, the first support member includes a plurality of first raised pillars and a plurality of second raised pillars. The first raised pillars and the second raised pillars are stacked. The plurality of first raised pillars are fixed to the rigid board portion. The plurality of second raised pillars are fixed to the first substrate. The plurality of second raised pillars are welded to the plurality of first raised pillars in a one-to-one correspondence. The main control module further includes a first packaging layer, a second packaging layer, a third packaging layer, and a fourth packaging layer. The first packaging layer is located between the first rigid board portion and the first substrate. The first packaging layer packages the plurality of first raised pillars and at least one chip on the rigid board portion. The second packaging layer is located on a side of the first substrate facing the rigid board portion. A second packaging layer packages the plurality of second raised pillars and at least one chip on the first substrate. A third packaging layer is located on a side of the first substrate away from the rigid board portion. The third packaging layer packages at least one chip on the first substrate. A fourth packaging layer is located on a side of the rigid board portion away from the first substrate. The fourth packaging layer packages at least one chip on the rigid board portion.

[0093] In this embodiment, the main control module has components located on both sides of the rigid board portion and both sides of the first substrate. Thus, four component layers are stacked in a direction perpendicular to the rigid board portion. Therefore, the main control module has a relatively high component placement density and a relatively high degree of component integration.

[0094] In an optional embodiment, the main control module further includes a third substrate and a second support member. The third substrate is located on a side of the rigid board portion away from the first substrate. The third substrate and the rigid board portion are stacked with a certain gap between them. The second support member is located between the third substrate and the rigid board portion and abuts against each of the third substrate and the rigid board portion. At least one of the plurality of chips is fixed to the third substrate. The chip fixed to the third substrate is electrically connected to the rigid board portion using the second support member. In this embodiment, one or more component layers can be stacked on both sides of the rigid board portion, further increasing the degree of component integration of the main control module.

[0095] In any embodiment, the first support member includes a plurality of first raised pillars and a plurality of second raised pillars. The first raised pillars and the second raised pillars are stacked. The plurality of first raised pillars are secured to the rigid board portion. The plurality of second raised pillars are secured to the first substrate. The plurality of second raised pillars are welded to the plurality of first raised pillars in a one-to-one correspondence. The second support member includes a plurality of fourth raised pillars, the plurality of fourth raised pillars are secured to the rigid board portion. A third substrate is welded to the plurality of fourth raised pillars, and the chip secured to the third substrate is located on a side of the third substrate away from the rigid board portion.

[0096] The main control module includes a first package layer, a second package layer, a third package layer, a fourth package layer, and a fifth package layer. The first package layer is located between the rigid board portion and the first substrate. The first package layer packages a plurality of first raised pillars and at least one chip on the rigid board portion. The second package layer is located on a side of the first substrate facing the rigid board portion. The second package layer packages a plurality of second raised pillars and at least one chip on the first substrate. The third package layer is located on a side of the first substrate away from the rigid board portion. The third package layer packages at least one chip on the first substrate. The fourth package layer is located on a side of the rigid board portion away from the first substrate. The fourth package layer packages a plurality of fourth raised pillars and at least one chip on the rigid board portion. The fifth packaging layer is located on the side of the third substrate away from the rigid board portion, and packages at least one chip onto the third substrate.

[0097] In this embodiment, the main control module has components located on both sides of the rigid board portion, both sides of the first substrate, and on the side of the third substrate away from the rigid board portion. Thus, five component layers are stacked perpendicular to the rigid board portion. Therefore, the main control module has a relatively high component placement density and a relatively high degree of component integration.

[0098] In any embodiment, the first support member includes a plurality of first raised pillars and a plurality of second raised pillars. The first raised pillars and the second raised pillars are stacked. The plurality of first raised pillars are secured to a rigid board portion. The plurality of second raised pillars are secured to a first substrate. The plurality of second raised pillars are welded to the plurality of first raised pillars in a one-to-one correspondence. The second support member includes a plurality of fourth raised pillars and a plurality of fifth raised pillars. The fourth raised pillars and the fifth raised pillars are stacked. The plurality of fourth raised pillars are secured to a rigid board portion. The plurality of fifth raised pillars are secured to a third substrate. The plurality of fifth raised pillars are welded to the plurality of fourth raised pillars in a one-to-one correspondence.

[0099] The main control module further includes a first package layer, a second package layer, a third package layer, a fourth package layer, a fifth package layer, and a sixth package layer. The first package layer is located between the rigid board portion and the first substrate. The first package layer packages a plurality of first raised pillars and at least one chip on the rigid board portion. The second package layer is located on a side of the first substrate facing the rigid board portion. The second package layer packages a plurality of second raised pillars and at least one chip on the first substrate. The third package layer is located on a side of the first substrate away from the rigid board portion. The third package layer packages at least one chip on the first substrate. The fourth package layer is located on a side of the rigid board portion away from the first substrate. The fourth package layer packages a plurality of fourth raised pillars and at least one chip on the rigid board portion. A fifth packaging layer is located on a side of the third substrate facing the rigid board portion. The fifth packaging layer packages a plurality of fifth raised pillars and at least one chip on the third substrate. A sixth packaging layer is located on a side of the third substrate away from the rigid board portion. The sixth packaging layer packages at least one chip on the third substrate.

[0100] In this embodiment, the main control module has components located on both sides of the rigid board portion, both sides of the first substrate, and both sides of the third substrate. Thus, six component layers are stacked in a direction perpendicular to the rigid board portion. Therefore, the main control module has a relatively high component placement density and a relatively high degree of component integration.

[0101] In any embodiment, the first support member includes a plurality of first raised pillars and a plurality of second raised pillars. The first raised pillars and the second raised pillars are stacked. The plurality of first raised pillars are secured to a rigid board portion. The plurality of second raised pillars are secured to a first substrate. The plurality of second raised pillars are welded to the plurality of first raised pillars in a one-to-one correspondence. The second support member includes a plurality of stacked fourth raised pillars, the plurality of fourth raised pillars are secured to a rigid board portion. The third substrate is welded to the plurality of fourth raised pillars.

[0102] The main control module further includes a fourth substrate and a plurality of sixth raised pillars. The fourth substrate is located on a side of the third substrate away from the rigid board portion. The fourth substrate and the third substrate are stacked at a certain distance from each other. The plurality of sixth raised pillars are located between the fourth substrate and the third substrate and support the fourth substrate and the third substrate. At least one of the plurality of chips is fixed to the fourth substrate. The chip fixed to the fourth substrate is electrically connected to the rigid board portion using the sixth raised pillars, the third substrate, and the second support member.

[0103] The main control module further includes a first package layer, a second package layer, a third package layer, a fourth package layer, a fifth package layer, and a sixth package layer. The first package layer is located between the rigid board portion and the first substrate. The first package layer packages a plurality of first raised pillars and at least one chip on the rigid board portion. The second package layer is located on a side of the first substrate facing the rigid board portion. The second package layer packages a plurality of second raised pillars and at least one chip on the first substrate. The third package layer is located on a side of the first substrate away from the rigid board portion. The third package layer packages at least one chip on the first substrate. The fourth package layer is located on a side of the rigid board portion away from the first substrate. The fourth package layer packages a plurality of fourth raised pillars and at least one chip on the rigid board portion. A fifth packaging layer is located between the third substrate and the fourth substrate. The fifth packaging layer packages a plurality of sixth raised pillars and at least one chip on the third substrate and packages at least one chip on the fourth substrate. A sixth packaging layer is located on a side of the fourth substrate away from the third substrate. The sixth packaging layer packages at least one chip on the fourth substrate.

[0104] In this embodiment, the main control module has components located on both sides of the rigid board portion, both sides of the first substrate, the side of the third substrate away from the rigid board portion, and both sides of the fourth substrate. Thus, seven component layers are stacked in a direction perpendicular to the rigid board portions. Therefore, the main control module has a relatively high component placement density and a relatively high degree of component integration.

[0105] In an optional embodiment, the first support member includes a plurality of first raised pillars, and the second support member includes a plurality of fourth raised pillars. The main control module further includes a first packaging layer, a second packaging layer, a fourth packaging layer, and a fifth packaging layer. The first packaging layer is located between the rigid board portion and the first substrate. The first packaging layer packages the plurality of first raised pillars and at least one chip on the rigid board portion and packages at least one chip on the first substrate. In this case, the first packaging layer packages components located between the rigid board portion and the first substrate. The fourth packaging layer is located between the rigid board portion and a third substrate. The fourth packaging layer packages the plurality of fourth raised pillars and at least one chip on the rigid board portion and packages at least one chip on the third substrate. The fifth packaging layer is fixed to a side of the third substrate away from the rigid board portion. The fifth packaging layer packages at least one chip on the third substrate.

[0106] In this embodiment, the main control module has components located on both sides of the rigid board portion, both sides of the first substrate, and both sides of the third substrate. Thus, six component layers are stacked in a direction perpendicular to the rigid board portion. Therefore, the main control module has a relatively high component placement density and a relatively high degree of component integration.

[0107] In an optional embodiment, the first support member is a first raised plate, the first raised plate being a hollow structure, and at least one chip being located inside the first raised plate. The first raised plate is a circuit board structure, and the first raised plate can be fixed to the rigid board portion by assembly or can be integrally molded with the rigid board portion. In this embodiment, the main control module uses the first raised plate to support the component placement space between the first substrate and the rigid board portion, allowing the main control module to integrate at least two component layers. In this way, component placement density is increased, and the main control module has a relatively high degree of component integration.

[0108] In some embodiments, all of the components secured to the rigid board portion are located on the side of the rigid board portion facing the first substrate, some of the components are located inside the first raised plate and some of the components are located outside the first raised plate, and in some other embodiments, some of the components secured to the rigid board portion are located on the side of the rigid board portion facing the first substrate and some are located on the side of the rigid board portion away from the first substrate.

[0109] The main control module further includes a plurality of chip matching components, at least one of which is fixed to the rigid board portion and at least one of which is fixed to the first substrate.

[0110] In any embodiment, at least one of the plurality of chips is fixed to a side of the rigid board portion away from the first substrate, at least one of the plurality of chips is fixed to a side of the rigid board portion facing the first substrate, at least one of the plurality of chips is fixed to a side of the first substrate facing the rigid board portion, and at least one of the plurality of chips is fixed to a side of the first substrate away from the rigid board portion. That is, components are disposed on both sides of the rigid board portion and on both sides of the first substrate. Thus, the main control module integrates four component layers. With a high component density, the main control module has a high degree of component integration.

[0111] The main control module further includes a first packaging layer located on a side of the first substrate away from the rigid board portion and packaging at least one chip. The first packaging layer may further package at least one chip matching component. The first packaging layer may provide full-size or partial packaging for components secured to the side of the first substrate away from the rigid board portion.

[0112] In an optional embodiment, the main control module further includes a second substrate and a plurality of third raised pillars. The second substrate is located on a side of the first substrate away from the rigid board portion. The second substrate and the first substrate are stacked with a certain distance between them. The plurality of third raised pillars are located between the second substrate and the first substrate and abut against each of the second substrate and the first substrate. At least one of the plurality of chips is fixed to the second substrate. The chip fixed to the second substrate is electrically connected to the rigid board portion using the plurality of third raised pillars, the first substrate, and the first support member.

[0113] The main control module further includes a first packaging layer and a second packaging layer. The first packaging layer is located between the first substrate and the second substrate and is configured to package components between the first substrate and the second substrate. The second packaging layer is located on a side of the second substrate away from the first substrate. The second packaging layer can perform partial or full-size packaging for components fixed to the side of the second substrate away from the first substrate.

[0114] In this embodiment, components are located on both sides of the rigid board section, both sides of the first substrate, and both sides of the second substrate. The main control module integrates six component layers. The component placement density is high, and the main control module has a high degree of component integration. In another embodiment, components may be located on one side of one or more of the rigid board section, the first substrate, or the second substrate.

[0115] In any embodiment, the main control module further includes a second substrate and a second ridge plate. The second substrate is located on a side of the rigid board portion away from the first substrate, and the second substrate and the rigid board portion are stacked with a certain distance between them. The second ridge plate is located between the second substrate and the rigid board portion and abuts against each of the second substrate and the rigid board portion. At least one of the plurality of chips is fixed to the second substrate. The chip fixed to the second substrate is electrically connected to the ridge board portion using the second ridge plate. The second ridge plate has a hollow structure, and the at least one chip is located inside the second ridge plate.

[0116] In this embodiment, the main control module has a first substrate secured to one side of the rigid board portion using a first raised plate and a second substrate secured to the other side of the rigid board portion using a second raised plate. In this manner, a stack structure having three layers of circuit boards is formed, and components are flexibly arranged on one or both sides of each of the three layers of circuit boards to form a stack structure having at least three component layers. Therefore, the main control module has a high component placement density and a high degree of component integration.

[0117] In any embodiment, the rigid-flexible circuit board includes at least one flexible dielectric layer and at least two first conductive layers. The at least one flexible dielectric layer and the at least two first conductive layers are stacked. One flexible dielectric layer is disposed between two adjacent first conductive layers. The at least one flexible dielectric layer and the at least two first conductive layers form the first flexible board section, an intermediate layer of the rigid board section, and the second flexible board section. The first flexible board section, the intermediate layer of the rigid board section, and the second flexible board section are an integral and continuous structure. For example, the flexible dielectric layer may be made of a polyimide material so that the first flexible board section and the second flexible board section have relatively good bending resistance.

[0118] The rigid-flexible circuit board further includes at least two rigid dielectric layers and at least two second conductive layers. The at least two rigid dielectric layers and the at least two second conductive layers are stacked. A portion of the at least two rigid dielectric layers is located on one side of the intermediate layer of the rigid board portion, and another of the rigid dielectric layers is located on the other side of the intermediate layer of the rigid board portion. A portion of the at least two second conductive layers is located on one side of the intermediate layer of the rigid board portion, and another of the second conductive layers is located on the other side of the intermediate layer of the rigid board portion. One rigid dielectric layer is disposed between two adjacent second conductive layers on the same side of the intermediate layer of the rigid board portion. One rigid dielectric layer is disposed between the intermediate layer of the rigid board portion and the second conductive layer adjacent to the intermediate layer of the rigid board portion. For example, the rigid dielectric layer may be made of polypropylene to ensure sufficient structural strength of the rigid board portion.

[0119] According to a fourth aspect, an embodiment of the present application further provides a main control module. The main control module includes a first substrate, a second substrate, a rigid-flexible circuit board, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion connected to the rigid board portion. The first substrate and the second substrate are located within the earphone portion. The first substrate and the second substrate are stacked at a certain distance from each other. The rigid board portion has a hollow structure. The rigid board portion is fixed between the first substrate and the second substrate. The first flexible board portion is located within the earphone portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end extends to the ear handle portion. At least one of the plurality of chips is fixed to the first substrate. At least one of the plurality of chips is fixed to the second substrate. At least one of the plurality of chips is located inside the rigid board portion. The chip fixed to the first substrate and the chip fixed to the second substrate are electrically connected to the rigid board portion.

[0120] In this embodiment, the rigid board portion of the rigid-flexible circuit board functions as a raised structure between the first and second substrates, thereby forming a gap between the first and second substrates. Components can be disposed on one or both sides of the first substrate and one or both sides of the second substrate. Thus, the main control module integrates at least two stacked component layers. In this manner, the component placement density is relatively high, and the main control module has a high degree of component integration.

[0121] In any embodiment, the main control module further includes a first packaging layer, a second packaging layer, a third packaging layer, and a fourth packaging layer. The first packaging layer is located on a side of the first substrate facing the second substrate. The first packaging layer is located inside the rigid board portion. The first packaging layer packages at least one chip and may further package at least one chip matching component. The second packaging layer is located on a side of the first substrate away from the second substrate. The second packaging layer packages at least one chip and may further package at least one chip matching component. The at least one first component may be further fixed to a side of the first substrate away from the second substrate. The first component is a component not suitable for plastic packaging. The first component is located outside the second packaging layer.

[0122] The third packaging layer is located on the side of the second substrate facing the first substrate. The third packaging layer is located inside the rigid board portion. The third packaging layer packages at least one chip and may further package at least one chip matching component. The fourth packaging layer is located on the side of the second substrate away from the first substrate. The fourth packaging layer packages at least one chip and may further package at least one chip matching component. At least one second component may be further fixed to the side of the second substrate away from the first substrate. The second component is a component not suitable for plastic packaging. The second component is located outside the fourth packaging layer.

[0123] In an optional embodiment, the main control module further includes a third substrate and a plurality of first raised pillars. The third substrate is located on a side of the first substrate away from the second substrate. The third substrate and the first substrate are stacked at a distance from each other. The plurality of first raised pillars are fixed between the third substrate and the first substrate. At least one chip and at least one chip matching component are distributed on each side of the first substrate, each side of the second substrate, and each side of the third substrate. The component fixed to the third substrate is electrically connected to the rigid board portion using the plurality of first raised pillars and the first substrate.

[0124] The main control module further includes a first package layer, a second package layer, a third package layer, a fourth package layer, and a fifth package layer. The first package layer is located on the side of the first substrate facing the second substrate. The first package layer is located inside the rigid board portion. The first package layer packages at least two components. The second package layer is located between the first substrate and the third substrate. The second package layer packages a plurality of first raised pillars and components located between the first substrate and the third substrate. The third package layer is located on the side of the third substrate away from the first substrate. The third package layer packages at least two components. At least one first component may be further fixed to the side of the third substrate away from the first substrate. The first component is a component not suitable for plastic packaging. The first component is located outside the third package layer.

[0125] The fourth package layer is located on the side of the second substrate facing the first substrate. The fourth package layer is located inside the rigid board portion. The third package layer packages at least two components. The fifth package layer is located on the side of the second substrate away from the first substrate. The fifth package layer packages at least two components. At least one second component may be further fixed to the side of the second substrate away from the first substrate. The second component is a component not suitable for plastic packaging. The second component is located outside the fifth package layer.

[0126] In this embodiment, the main control module includes three stacked circuit boards (a first board, a second board, and a third board). Components can be placed on both sides of each circuit board, resulting in six integrated component layers. With a high component placement density, the main control module has a high degree of component integration. [Brief explanation of the drawings]

[0127] [Figure 1] FIG. 1 is a schematic diagram of the structure of a wireless headset according to one embodiment of the present application. [Figure 2] FIG. 2 is a schematic diagram of the structure of the headset body shown in FIG. [Figure 3] FIG. 3 is a partial schematic exploded view of the headset body shown in FIG. [Figure 4] FIG. 4 is a schematic diagram of the internal structure of the headset body shown in FIG. [Figure 5] FIG. 5 is a schematic diagram of an expanded structure of the main control module shown in FIG. 3 in some embodiments. [Figure 6] FIG. 6 is a schematic diagram of an expanded structure of the main control module shown in FIG. 3 in some other embodiments. [Figure 7] FIG. 7 is a schematic diagram of the internal structure of the rigid-flexible circuit board of the main control module shown in FIG. [Figure 8] FIG. 8 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the first embodiment. [Figure 9] FIG. 9 is a top view of a partial structure of the main control module shown in FIG. [Figure 10] FIG. 10 is a schematic diagram 1 of the structure of the main control module shown in FIG. 8 in the preparation process. [Figure 11] FIG. 11 is a schematic diagram 2 of the structure of the main control module shown in FIG. 8 in the preparation process. [Figure 12] FIG. 12 is a schematic diagram 3 of the structure of the main control module shown in FIG. 8 in the preparation process. [Figure 13] FIG. 13 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the second embodiment. [Figure 14] FIG. 14 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the third embodiment. [Figure 15] FIG. 15 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the fourth embodiment. [Figure 16]FIG. 16 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the fifth embodiment. [Figure 17] FIG. 17 is a schematic diagram 1 of the structure of the main control module shown in FIG. 16 in the preparation process. [Figure 18] FIG. 18 is a schematic diagram 2 of the structure of the main control module shown in FIG. 16 in the preparation process. [Figure 19] FIG. 19 is a schematic diagram 3 of the structure of the main control module shown in FIG. 16 in the preparation process. [Figure 20] FIG. 20 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the sixth embodiment. [Figure 21] FIG. 21 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the seventh embodiment. [Figure 22] FIG. 22 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the eighth embodiment. [Figure 23] FIG. 23 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the ninth embodiment. [Figure 24] FIG. 24 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the tenth embodiment. [Figure 25] FIG. 25 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the eleventh embodiment. [Figure 26] FIG. 26 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the twelfth embodiment. [Figure 27] FIG. 27 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the thirteenth embodiment. [Figure 28] FIG. 28 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the fourteenth embodiment. [Figure 29] FIG. 29 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the fifteenth embodiment. [Figure 30] FIG. 30 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the sixteenth embodiment. [Figure 31]FIG. 31 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the seventeenth embodiment. [Figure 32] FIG. 32 is a schematic diagram of the structure of the main control module shown in FIG. 2 in the eighteenth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0128] Embodiments of the present application will be described below with reference to the accompanying drawings in which embodiments of the present application are described.

[0129] One embodiment of the present application provides a wireless headset. The wireless headset is wirelessly connected (e.g., Bluetooth-connected) to an electronic device such as a mobile phone, a notebook computer, a tablet, or a smart watch, so that the wireless headset can be used in cooperation with the electronic device. The wireless headset is configured to process audio services of the electronic device, such as media and calling services, or some other data services. For example, audio services may include media services such as music playback, recording, audio in video files, background music in games, and incoming call alert sounds for users. The audio services may further include playing peer voice data for a user, collecting user voice data, and sending the voice data to a peer, etc., in call service scenarios such as phone calls, WeChat voice messages, voice calls, video calls, games, and voice assistants.

[0130] 1 is a schematic diagram of the structure of a wireless headset 1000 according to an embodiment of the present application. The wireless headset 1000 may be a true wireless stereo (TWS) headset. The wireless headset 1000 may include two headset bodies 100. The two headset bodies 100 can be used as a left headset and a right headset, respectively. The left headset can be used in conjunction with a user's left ear, and the right headset can be used in conjunction with a user's right ear. The wireless headset 1000 can be an in-ear headset or a semi-in-ear headset. In this embodiment, an explanation is provided by taking an example in which the wireless headset 1000 is a semi-in-ear headset.

[0131] It will be appreciated that in some other embodiments of the present application, the wireless headset 1000 may be another type of wireless headset, such as wireless headphones or necklace headphones, and in some other embodiments of the present application, the wireless headset 1000 may include only one headset body 100.

[0132] In some embodiments, as shown in FIG. 1 , the wireless headset 1000 may further include a battery case 200. The battery case 200 includes a case body 2001 and a case cover 2002 movably connected to the case body 2001. For example, the case cover 2002 may be rotatably connected to the case body 2001 or detachably connected to the case body 2001 by snap-fitting. A storage space 2003 may be formed in the battery case 200, and the headset body 100 may be stored in the storage space 2003. Charging terminals (not shown) are disposed in the battery case 200. When the charging terminals contact the charging terminals (not shown) of the headset body 100, the headset body 100 can be charged. The charging terminals in the battery case 200 may be pogo pins, elastomers, conductive blocks, conductive patches, conductive sheets, pins, connectors, contact pads, jacks, sockets, etc. The specific type of charging terminals in the battery case 200 is not strictly limited in this embodiment of the present application.

[0133] FIG. 2 is a schematic diagram of the structure of the headset body 100 shown in FIG. 1. The headset body 100 has an ear handle portion 1001 and an earphone portion 1002 connected to the ear handle portion 1001. The earphone portion 1002 is configured to fit partially into a user's ear. The ear handle portion 1001 is configured to make contact with the user's ear. When a user wears the headset body 100, the earphone portion 1002 fits partially into the user's ear, and the ear handle portion 1001 is located outside the user's ear and makes contact with the user's ear. For example, the ear handle portion 1001 includes a connection section 1003 connected to the earphone portion 1002, and a top section 1004 and a bottom section 1005 located on either side of the connection section 1003. In some other embodiments, the ear handle portion 1001 may not include the top section 1004. That is, the ear handle portion 1001 includes the connection section 1003 and the bottom section 1005.

[0134] FIG. 3 is a partial schematic exploded view of the headset body 100 shown in FIG. 2 . The headset body 100 includes a housing 10. The housing 10 is configured to house, secure, and protect other parts of the headset body 100. The housing 10 includes a main housing 101, a bottom housing 102, and a side housing 103. The main housing 101 is partially located in the ear handle portion 1001 of the headset body 100 and partially located in the earbud portion 1002 of the headset body 100. The main housing 101 forms a first opening 1011 in the bottom section 1005 of the ear handle portion 1001 of the headset body 100 and a second opening 1012 in the earbud portion 1002 of the headset body 100. Other parts of the headset body 100 can be assembled into the main housing 101 through the first opening 1011 or the second opening 1012. The bottom housing 102 is located in the bottom section 1005 of the ear handle portion 1001 of the headset body 100 and is fixedly connected to the main housing 101. The bottom housing 102 is attached to the first opening 1011. The side housing 103 is located in the earbud portion 1002 of the headset body 100 and is fixedly connected to the main housing 101. The side housing 103 is attached to the second opening 1012.

[0135] In some embodiments, the connection between the bottom housing 102 and the main housing 101 is a detachable connection (e.g., a snap-fit ​​connection or a threaded connection) to facilitate subsequent repair or maintenance of the headset body 100. In some other embodiments, the connection between the bottom housing 102 and the main housing 101 may alternatively be a non-detachable connection (e.g., an adhesively bonded connection) to reduce the risk of the bottom housing 102 being accidentally pulled out, making the headset body 100 more reliable.

[0136] In some embodiments, the connection between the side housing 103 and the main housing 101 is a detachable connection (e.g., a snap-fit ​​connection or a threaded connection) to facilitate subsequent repair or maintenance of the headset body 100. In some other embodiments, the connection between the side housing 103 and the main housing 101 may alternatively be a non-detachable connection (e.g., an adhesively bonded connection) to reduce the risk of the side housing 103 being accidentally pulled out, making the headset body 100 more reliable.

[0137] The side housing 103 includes at least one sound outlet 1031, so that sound within the housing 10 can be transmitted to the outside of the housing 10 through the sound outlet 1031. In this application, "at least one" includes "one" and "two or more." In some embodiments, the side housing 103 may further include at least one detection hole 1032. Detection signals of several detection modules located within the housing 10 may be transmitted to the outside of the housing 10 through the detection hole 1032, and feedback signals outside the housing 10 may be received through the detection hole 1032. In some embodiments, a portion of the main housing 101 located within the connection section 1003 of the ear handle portion 1001 includes at least one first sound inlet 1013, so that sound outside the housing 10 can be transmitted to the inside of the housing 10 through the first sound inlet 1013. In some embodiments, the bottom housing 102 includes at least one sound inlet 1021, so that sound outside the housing 10 can be transmitted into the housing 10 through the second sound inlet 1021. In this embodiment of the present application, the shapes, positions, numbers, etc. of the sound outlet 1031, the detection hole 1032, the first sound inlet 1013, and the second sound inlet 1021 are not strictly limited.

[0138] 3 and 4, FIG. 4 is a schematic diagram of the internal structure of the headset main body 100 shown in FIG.

[0139] The headset main body 100 includes a main control module 20. The main control module 20 is accommodated in the housing 10. The main control module 20 includes a rigid-flexible circuit board 1 and a stack assembly 2. The rigid-flexible circuit board 1 includes a rigid board portion 11, and a first flexible board portion 12 and a second flexible board portion 13 connected to the rigid board portion 11. The rigid board portion 11 is located within the earphone portion 1002. The first flexible board portion 12 is located within the earphone portion 1002, and one end is connected to the rigid board portion 11. One end of the second flexible board portion 13 is connected to the rigid board portion 11, and the other end extends to the ear handle portion 1001. The stack assembly 2 is fixed to the rigid board portion 11. The direction perpendicular to the rigid board portion 11 may be the direction in which the size of the internal space of the earphone portion 1002 is larger. Multiple component layers (not shown) are stacked in a direction perpendicular to the rigid board portion 11 in the stack assembly 2 to increase component placement density. For example, the stack assembly 2 includes multiple chips (not shown) and multiple chip matching components (not shown). The chip matching components include one or more types of capacitors, resistors, or inductors. The stack assembly 2 may further include one or more of a substrate, a raised pillar, a raised plate, and a package layer. As used herein, "multiple" refers to "two or more," and "more than" refers to the number given and values ​​greater than the number given.

[0140] The headset main body 100 further includes a plurality of functional modules. At least one of the plurality of functional modules is located in the earphone portion 1002, and at least one of the plurality of functional modules is located in the ear handle portion 1001. Some of the components in the stack assembly 2 are electrically connected to the functional module located in the earphone portion 1002 by using the rigid board portion 11 and the first flexible board portion 12. Some of the components in the stack assembly 2 are electrically connected to the functional module located in the ear handle portion 1001 by using the rigid board portion 11 and the second flexible board portion 13.

[0141] In this embodiment, the components in the stack assembly 2 of the main control module 20 are electrically connected to the multiple functional modules of the headset body 100 using the rigid-flexible circuit board 1, allowing multiple component layers to be stacked within the stack assembly 2. Therefore, all or most of the chips and chip matching components of the headset body 100 can be integrated into the stack assembly 2, allowing the control system of the headset body 100 to be fully integrated into the stack assembly 2. In this way, the multiple secondary circuit boards that serve to support the control system components in conventional wireless headsets 1000 can be eliminated, thereby increasing the degree of component integration of the main control module 20 and the headset body 100.

[0142] In addition, stack assembly 2, in which multiple component layers are stacked, has a relatively large thickness in a direction perpendicular to rigid board portion 11. Since stack assembly 2 is fixed to rigid board portion 11 and rigid board portion 11 is located within earphone portion 1002, stack assembly 2 is located within earphone portion 1002. Therefore, the difficulty in installing stack assembly 2 is relatively small, and stack assembly 2 can fully utilize the internal cavity space of earphone portion 1002, improving space utilization of headset main body 100. In some embodiments, the outer shapes of rigid board portion 11 and stack assembly 2 can be adapted to the shape of the internal cavity space of earphone portion 1002. For example, a circular or nearly circular outer shape is used to further improve space utilization of headset main body 100.

[0143] 3 and 4, the functional modules of the headset body 100 include a receiver module 30 and a battery 40. The multiple chips (not shown) of the stack assembly 2 include a micro control unit (MCU) chip, a power management chip, and an audio chip. Both the power management chip and the audio chip are electrically connected to the micro control unit chip. The micro control unit chip is the processing and control center of the headset body 100 and the main control module 20.

[0144] The receiver module 30 is disposed in the earphone portion 1002, and the first flexible board portion 12 is connected to the receiver module 30. The receiver module 30 is electrically connected to an audio chip in the stack assembly 2 using the first flexible board portion 12 and the rigid board portion 11. The audio chip is configured to encode audio data to form an electrical signal. The receiver module 30 is configured to convert the electrical signal into an audio signal. The audio signal can be transmitted to the outside of the headset body 100 through the audio outlet 1031 of the side housing 103.

[0145] The battery 40 is disposed in the ear handle portion 1001, and the second flexible board portion 13 is connected to the battery 40. The battery 40 is electrically connected to a power management chip in the stack assembly 2 by using the second flexible board portion 13 and the rigid board portion 11. The battery 40 is configured to supply power to the headset main body 100. The power management chip is configured to manage the power input and power output of the battery 40.

[0146] A microcontroller unit chip is also called a single-chip microcomputer. For example, a microcontroller unit chip is a chip-level computer formed by appropriately reducing the frequency and specifications of a central processing unit (CPU) and integrating units such as a memory, a timer, a universal serial bus (USB), an analog-to-digital converter, a universal asynchronous receiver / transmitter (UART), a programmable logic controller (PLC), and a direct memory access (DMA) unit. In some other embodiments, a microcontroller unit chip may alternatively include fewer or more units.

[0147] The power management chip may include a charging circuit, a voltage drop regulation circuit, a protection circuit, a power measurement circuit, etc. The charging circuit may receive an external charging input. The voltage drop regulation circuit may convert an electrical signal input by the charging circuit and output an electrical signal to the battery 40 to complete charging of the battery 40. The voltage drop regulation circuit may also convert an electrical signal input by the battery 40 and output an electrical signal to the main control module 20 and other functional modules to provide power to components within the main control module 20 and the functional modules of the headset body 100. The protection circuit may be configured to prevent overcharging, over-discharging, short-circuiting, overcurrent, etc. of the battery 40. In addition, the power management unit may be further configured to monitor parameters such as battery capacity, number of battery cycles, and battery health (leakage and impedance) of the battery 40. In some other embodiments, the power management chip may alternatively include fewer or more circuits.

[0148] 3 and 4 , the multiple functional modules of the headset main body 100 further include a positive charging terminal 401 and a negative charging terminal 402. The positive charging terminal 401 is located in the earbud portion 1002. For example, a through-hole (not shown) is located in the earbud portion 1002 of the main housing 101 at a position facing the bottom section 1005 of the ear handle portion 1001. The positive charging terminal 401 is exposed to the outside of the ear handle portion 1001 through the through-hole. The rigid-flexible circuit board 1 of the main control module 20 further includes a third flexible board portion 14 connected to the rigid board portion 11, the third flexible board portion 14 being located in the earbud portion 1002. The positive charging terminal 401 is connected to the third flexible board portion 14 and is connected to the power management chip in the stack assembly 2 using the third flexible board portion 14 and the rigid board portion 11. The negative charging terminal 402 is located in the bottom section 1005 of the ear handle portion 1001. For example, the bottom housing 102 may use a conductive material, and the negative charging terminal 402 is in contact with the bottom housing 102. In some other embodiments, the bottom housing 102 may alternatively use a non-conductive material and may have a connection hole. The negative charging terminal 402 is fixed to the bottom housing 102 and exposed to the outside of the ear handle body through the connection hole. The negative charging terminal 402 is connected to the second flexible board portion 13 and is connected to the power management chip in the stack assembly 2 by using the second flexible board portion 13 and the rigid board portion 11. When the headset body 100 is housed in the battery case 200 (see FIG. 1 ), the positive charging terminal 401 and the negative charging terminal 402 are respectively connected to two charging terminals in the battery case 200, so that the battery case 200 charges the headset body 100. In some other embodiments, the positive charging terminal 401 may alternatively be located in the bottom section 1005 of the ear handle portion 1001. In this case, the positive charging terminal 401 is connected to the second flexible board portion 13 and electrically connected to the power management chip in the stack assembly 2 by using the second flexible board portion 13 and the rigid board portion 11.

[0149] The positive electrode charging terminal 401 may be a pogo pin, an elastomer, a conductive block, a conductive patch, a conductive sheet, a pin, a connector, a contact pad, a jack, a socket, etc. The specific type of the positive electrode charging terminal 401 is not strictly limited in this embodiment of the present application. The negative electrode charging terminal 402 may be a pogo pin, an elastomer, a conductive block, a conductive patch, a conductive sheet, a pin, a connector, a contact pad, a jack, a socket, etc. The specific type of the negative electrode charging terminal 402 is not strictly limited in this embodiment of the present application. The type of the negative electrode charging terminal 402 may be the same as or similar to the type of the positive electrode charging terminal 401. The types of the positive electrode charging terminal 401 and the negative electrode charging terminal 402 are adapted according to the type of charging terminals in the charging case.

[0150] In some embodiments, as shown in FIGS. 3 and 4 , the multiple functional modules of the headset main body 100 further include an optical sensor module 50. The optical sensor module 50 may be used as a proximity detection module and configured to detect whether the headset main body 100 is worn on a user's ear. For example, the optical sensor module 50 may be located in the earphone unit 1002 at a position away from the ear handle unit 1001 and near the side housing 103. The optical sensor module 50 may transmit a detection signal and receive a feedback signal via a detection hole 1032 (see FIG. 2 ) in the side housing 103 to perform detection. The optical sensor module 50 is connected to the first flexible board unit 12 and electrically connected to the multiple chips in the stack assembly 2 using the first flexible board unit 12 and the rigid board unit 11.

[0151] 3 and 4 , the multiple functional modules of the headset main body 100 further include a bone vibration sensor module 60. The bone vibration sensor module 60 is configured to perform functions such as voiceprint recognition, a speech interpretation and recognition interface (SIRI), and two-tap activation of the headset main body 100. The bone vibration sensor module 60 may be located, for example, in the earphone unit 1002 at a position facing the bottom section 1005 of the ear handle unit 1001. A corresponding interaction through-hole 1015 may be disposed in the main housing 101, and the bone vibration sensor module 60 may interact with the user through the interaction through-hole 1015. The bone vibration sensor module 60 is connected to the first flexible board unit 12 and to a chip in the stack assembly 2 by using the first flexible board unit 12 and the rigid board unit 11.

[0152] In some embodiments, as shown in FIGS. 3 and 4 , the multiple functional modules of the headset body 100 further include an antenna module 70. The antenna module 70 includes an antenna support 701, an antenna 702, and a power supply member 703. The antenna 702 is fixed to the antenna support 701, and the antenna 702 and antenna support 701 are located in the upper section 1004 and the connection section 1003 of the ear handle portion 1001. The power supply member 703 is located in the connection section 1003 of the ear handle portion 1001, fixed to the second flexible board portion 13, and configured to supply power to the antenna 702. For example, the power supply member 703 may be an elastomer and welded to the second flexible board portion 13. In some embodiments, the multiple chips of the stack assembly 2 further include a radio frequency chip configured to modulate and demodulate radio frequency signals. For example, the radio frequency signals operate in the Bluetooth frequency band. The radio frequency chip is electrically connected to the microcontroller unit chip. The antenna 702 is electrically connected to the radio frequency chip by using a power supply member 703, a second flexible board portion 13 and a rigid board portion 11. In some other embodiments, the radio frequency chip may be further integrated into the microcontroller unit chip.

[0153] It will be appreciated that in some other embodiments, if the ear handle portion 1001 does not include the top section 1004, the antenna module 70 may be located in the earbud portion 1002 or the connection section 1003 or bottom section 1005 of the earphone portion 1002 or ear handle portion 1001.

[0154] 3 and 4, the multiple functional modules of the headset body 100 further include a first microphone module 80, which is configured to convert an audio signal into an electrical signal. The first microphone module 80 is located in the connection section 1003 of the ear handle portion 1001. Sound outside the headset body 100 can enter the headset 100 through the first audio inlet 1013 and be received by the first microphone module 80. The first microphone module 80 is connected to the second flexible board portion 13 and is connected to a chip in the stack assembly 2 by using the second flexible board portion 13 and the rigid board portion 11.

[0155] 3 and 4 , the multiple functional modules of the headset body 100 further include a second microphone module 90, which is configured to convert audio signals into electrical signals. The second microphone module 90 is located in the bottom section 1005 of the ear handle portion 1001. Audio from outside the headset body 100 can enter the wireless headset 100 through the second audio inlet 1021 and be received by the second microphone module 90. The second microphone module 90 is connected to the second flexible board portion 13 and is connected to a chip in the stack assembly 2 by using the second flexible board portion 13 and the rigid board portion 11. For example, the first microphone module 80 can be used as a primary microphone for the headset body 100, and the second microphone module 90 can be used as a secondary microphone for the headset body 100.

[0156] It will be understood that the foregoing description is an example illustrating the main functional modules, housing structures, and chips within headset body 100. In some embodiments, headset body 100 may alternatively include more or fewer functional modules, different housing structures, and more or fewer chips.

[0157] In this embodiment of the present application, as described above, there are multiple flexible board sections on the rigid-flexible circuit board 1 of the main control module 20, for example, the first flexible board section 12, the second flexible board section 13, and the above-mentioned third flexible board section 14. The multiple flexible board sections are all connected to the rigid board section 11. The number and positions of the flexible board sections can be set based on the positions of the multiple functional modules in the headset main body 100. This is not strictly limited in the present application.

[0158] In some exemplary embodiments, FIG. 5 is a schematic diagram of an enlarged structure of the main control module 20 shown in FIG. 3 in some embodiments. In this embodiment, the connection relationships between the multiple flexible board portions of the rigid-flexible circuit board 1 and the multiple functional modules of the headset body 100 correspond to those described above. Specifically, the first connection region 121, the second connection region 122, and the third connection region 123 are arranged consecutively within the first flexible board portion 12 in a direction away from the rigid board portion 11. The first connection region 121 is configured to connect to the bone vibration sensor module 60. The second connection region 122 is configured to connect to the receiver module 30. The third connection region 123 is configured to connect to the optical sensor module 50. The fourth connection region 131, the fifth connection region 132, the sixth connection region 133, and the seventh connection region 134 are arranged consecutively within the second flexible board portion 13 in a direction away from the rigid board portion 11. The fourth connection region 131 is configured to connect to the antenna module 70. The fifth connection area 132 is configured to connect to the first microphone module 80. The sixth connection area 133 is configured to connect to the second microphone module 90. The seventh connection area 134 is configured to connect to the negative charging terminal 402. The eighth connection area 141 is disposed within the third flexible board portion 14 and is configured to connect to the positive charging terminal 401.

[0159] 6 is a schematic diagram of an enlarged structure of the main control module 20 shown in FIG. 3 in some other exemplary embodiments. Unlike the previous embodiments, this embodiment changes the connection relationship between the flexible board portion of the rigid-flexible circuit board 1 and the multiple functional modules of the headset body 100. Specifically, the first fixing area 124 is disposed within the first flexible board portion 12 and configured to connect to the receiver module 30. The second fixing area 135, the third fixing area 136, the fourth fixing area 137, and the fifth fixing area 138 are disposed consecutively within the second flexible board portion 13 in a direction away from the rigid board portion 11. The sixth fixing area 139 and the seventh fixing area 1310 are further disposed branch-wise between the rigid board portion 11 and the second fixing area 135. The second fixing area 135 is configured to connect to the antenna module 70. The third fixing area 136 is configured to connect to the first microphone module 80. The fourth fixation region 137 is configured to connect to the negative charging terminal 402. The fifth fixation region 138 is configured to connect to the second microphone module 90. The sixth fixation region 139 is configured to connect to the bone vibration sensor module 60. The seventh fixation region 1310 is configured to connect to the positive charging terminal 401.

[0160] FIG. 7 is a schematic diagram of the internal structure of rigid-flexible circuit board 1 of main control module 20 shown in FIG.

[0161] In some embodiments, the rigid-flexible circuit board 1 includes at least one flexible dielectric layer 1a and at least two first conductive layers 1b. The at least one flexible dielectric layer 1a and the at least two first conductive layers 1b are stacked, with one flexible dielectric layer 1a disposed between two adjacent first conductive layers 1b. The at least one flexible dielectric layer 1a and the at least two first conductive layers 1b form a first flexible board portion 12, an intermediate layer of the rigid board portion 11, and a second flexible board portion 13. The first flexible board portion 12, the intermediate layer of the rigid board portion 11, and the second flexible board portion 13 are integral and continuous structures. For example, the flexible dielectric layer 1a may be made of a polyimide (PI) material so that the first flexible board portion 12 and the second flexible board portion 13 have relatively good bending resistance. In some other embodiments, the at least one flexible dielectric layer 1 a and the at least two first conductive layers 1 b alternatively form another flexible board portion, such as third flexible board portion 14 .

[0162] As shown in FIG. 7 , the rigid-flexible circuit board 1 further includes at least two rigid dielectric layers 1c and at least two second conductive layers 1d. The at least two rigid dielectric layers 1c and the at least two second conductive layers 1d are stacked. Portions of the at least two rigid dielectric layers 1c are located on one side of the intermediate layer of the rigid board portion 11, and the other portions of the rigid dielectric layers 1c are located on the other side of the intermediate layer of the rigid board portion 11. Portions of the at least two second conductive layers 1d are located on one side of the intermediate layer of the rigid board portion 11, and the other portions of the second conductive layers 1d are located on the other side of the intermediate layer of the rigid board portion 11. One rigid dielectric layer 1c is disposed between two adjacent second conductive layers 1d on the same side of the intermediate layer of the rigid board portion 11. One rigid dielectric layer 1c is disposed between the second conductive layer 1d adjacent to the intermediate layer of rigid board portion 11 and the intermediate layer of rigid board portion 11. At least two rigid dielectric layers 1c and at least two second conductive layers 1d form a double-sided layer structure of rigid board portion 11. For example, rigid dielectric layer 1c may be made of polypropylene (PP) material so that rigid board portion 11 has sufficient structural strength.

[0163] 7 includes one flexible dielectric layer 1a, two first conductive layers 1b, six rigid dielectric layers 1c, and six second conductive layers 1d. The rigid-flexible circuit board 1 has an eight-layer substrate structure. In some other embodiments, the number of flexible dielectric layers 1a, first conductive layers 1b, rigid dielectric layers 1c, and second conductive layers 1d can be set to different values ​​based on requirements.

[0164] Using an example, the structure of the main control module 20 is described below. The embodiments in the following description can be combined with each other unless a contradiction occurs.

[0165] Fig. 8 is a schematic diagram of the structure of main control module 20 shown in Fig. 2 in the first embodiment. Fig. 9 is a top view of a partial structure of main control module 20 shown in Fig. 8.

[0166] The main control module 20 includes a rigid-flexible circuit board 1 and a stack assembly 2. The rigid-flexible circuit board 1 includes a rigid board portion 11, and a first flexible board portion 12 and a second flexible board portion 13 connected to the rigid board portion 11. The stack assembly 2 is stacked on top of the rigid board portion 11.

[0167] The stack assembly 2 includes a first substrate 211, a first support member 22a, and a plurality of chips 231. The first substrate 211 and the rigid board portion 11 are stacked with a certain distance between them. The first substrate 211 is a rigid circuit board. For example, the protrusion of the first substrate 211 on the rigid board portion 11 is within the range of the rigid board portion 11. The first support member 22a is located between the first substrate 211 and the rigid board portion 11 and abuts against both the first substrate 211 and the rigid board portion 11. In other words, the first support member 22a provides support between the first substrate 211 and the rigid board portion 11. One of the plurality of chips 231 is fixed to the first substrate 211. One of the plurality of chips 231 is fixed to the rigid board portion 11. The chip 231 fixed to the first substrate 211 is electrically connected to the rigid board portion 11 by using the first support member 22a. In some other embodiments, two or more of the plurality of chips 231 are fixed to the first substrate 211 and / or two or more of the plurality of chips 231 are fixed to the rigid board portion 11. That is, in this application, at least one of the plurality of chips 231 is fixed to the first substrate 211 and at least one of the plurality of chips 231 is fixed to the rigid board portion 11. The plurality of chips 231 may be arranged in various ways on the first substrate 211 and the rigid board portion 11. For example, the power management chip and the microcontroller unit chip may be fixed to the rigid board portion 11, and the audio chip may be fixed to the first substrate 211. Alternatively, the power management chip may be fixed to the rigid board portion 11, and the microcontroller unit chip and the audio chip may be fixed to the first substrate 211. FIG. 9 primarily illustrates the structure of rigid board portion 11 of rigid-flexible circuit board 1 and the structure having a single component layer secured directly to rigid board portion 11.

[0168] In this embodiment, the chip 231 fixed to the first substrate 211 can be electrically connected to the rigid board portion 11 using the first support member 22a, eliminating the need for a flexible circuit board for signal transmission between the first substrate 211 and the rigid board portion 11. The signal transmission path between the chip 231 on the first substrate 211 and the rigid board portion 11 is implemented by the first support member 22a, and the signal transmission path is short. This improves signal transmission quality. For example, the risk of audio signals being distorted during transmission is relatively low. In addition, the main control module 20 of this embodiment does not include a flexible circuit board connected between the first substrate 211 and the rigid board portion 11. This avoids problems such as product failure and reduced yield due to the flexible circuit board being bent at a relatively large bending angle, which can cause breakage or disconnection in the bending area.

[0169] The outer contour of rigid board portion 11 of rigid-flexible circuit board 1 is approximately circular or circular to meet the constraints of the shape of the human ear and improve utilization of the internal space of headset body 100. For example, the shape of the outer contour of first substrate 211 is the same as or similar to the shape of the outer contour of rigid board portion 11.

[0170] It will be understood that in this embodiment of the present application, chip 231 may be secured to a circuit board (e.g., rigid board portion 11, first substrate 211, or a substrate structure described below) by surface mounting, welding, bonding, and / or the like. For example, as shown in Figure 8, chip 231 located on first substrate 211 is secured to first substrate 211 by bonding. Chip 231 located on rigid board portion 11 is secured to the circuit board by surface mounting and bonding.

[0171] 8 and 9, in some embodiments, the stack assembly 2 of the main control module 20 further includes a plurality of chip matching components 232. At least one of the plurality of chip matching components 232 is fixed to the first substrate 211, and at least one of the plurality of chip matching components 232 is fixed to the rigid board portion 11. The arrangement positions of the plurality of chip matching components 232 may be arranged together with the corresponding chips 231.

[0172] 8, the first support member 22a includes a plurality of first raised pillars 221, which are located between the rigid board portion 11 and the first substrate 211 and fixed to the rigid board portion 11. The plurality of first raised pillars 221 may be arranged at any position on the rigid board portion 11 based on actual requirements, for example, they may be arranged in the peripheral region of the rigid board portion 11, so that the central region of the rigid board portion 11 has a complete and sufficient component placement area for placing more components. The stack assembly 2 of the main control module 20 further includes a first packaging layer 241. The first packaging layer 241 is located between the rigid board portion 11 and the first substrate 211. The first packaging layer 241 packages a plurality of first raised pillars 221 and at least one chip 231 on the rigid board portion 11. In this case, an end face of each of the plurality of first raised pillars 221 facing away from the rigid board portion 11 protrudes toward the first packaging layer 241. The first substrate 211 may be connected to the end face of the first raised pillars 221. The first packaging layer 241 further packages at least one chip matching component 232 on the rigid board portion 11. Because the first packaging layer 241 can protect the components packaged therein, the main control module 20 has relatively high reliability and a relatively long service life.

[0173] In this embodiment, the first packaging layer 241 packages multiple components (e.g., chip 231 and chip matching component 232) directly on the rigid board portion 11. In this way, the multiple components can be directly connected to the functional modules of the headset main body 100 by using the rigid board portion 11 and the first flexible board portion 12 or the second flexible board portion 13. Compared to the conventional packaging layer method in which components are first packaged on a board and then welded to a circuit board before connecting the board to an external module, the connection method in this embodiment is more direct and has a simpler structure.

[0174] In this embodiment of the present application, it will be understood that a type of raised pillar (e.g., first raised pillar 221 or a raised pillar structure described below) includes, but is not limited to, a filled-molded first pillar body 2201 and / or a pre-molded second pillar body 2202. That is, in some embodiments, the raised pillar includes a first pillar body 2201. In some other embodiments, the raised pillar includes a second pillar body 2202. In yet some other embodiments, the raised pillar includes a first pillar body 2201 and a second pillar body 2202, and the first pillar body 2201 and the second pillar body 2202 may be stacked in a direction perpendicular to the rigid board portion 11.

[0175] A via is formed in a package layer (e.g., the first package layer 241 or a package layer structure described below) formed on a circuit board (e.g., the rigid board unit 11, the first substrate 211, or a substrate structure described below). The via is then filled with a conductive material (e.g., a metal material such as aluminum, copper, or silver) to form a solid first pillar body 2201, or the wall of the via is plated with a layer of a conductive material (e.g., a metal material such as aluminum, copper, or silver) to form a hollow first pillar body 2201. In this case, the first pillar body 2201 can be fixed to the circuit board during molding. Therefore, there is no need to provide a solder layer or an adhesive layer for fixing the first pillar body 2201 and the circuit board. When a signal is transmitted between the first pillar body 2201 and the circuit board, the impedance is relatively small and the signal transmission effect is relatively good.

[0176] It will be appreciated that when multiple raised pillars are fixed to a circuit board, the multiple raised pillars are spaced apart from one another to facilitate subsequent packaging processes and to form a package layer of uniform thickness at each location on the circuit board.

[0177] It will be appreciated that the first pillar body 2201 can perform not only a support function but also conduction. In some embodiments, if the first pillar body 2201 does not need to perform conduction, the material of the first pillar body 2201 may be replaced with a non-conductive material having a relatively high hardness. The hardness of the material of the first pillar body 2201 is greater than the hardness of the material of the package layer.

[0178] The second pillar body 2202 is a pre-prepared pillar structure. The molding operation of the package layer is performed after the second pillar body 2202 and the circuit board (e.g., the rigid board portion 11, the first board 211, or a board structure described below) form an integral structure. In one example, the second pillar body 2202 is fixed to the circuit board by using an assembly process such as welding or adhesive, and a solder or adhesive layer is provided between the second pillar body 2202 and the circuit board. In this example, the second pillar body 2202 may use a conductive material to balance the support function and the conduction function. In this case, the adhesive layer uses a conductive adhesive material. In another example, the second pillar body 2202 and the circuit board connected to the second pillar body 2202 are integrally molded and may be completed together, for example, in a circuit board fabrication process. In this example, the second pillar body 2202 is a raised plate using a circuit board structure, and the second pillar body 2202 can perform a conduction function using its internal circuit structure to balance the support function and the conduction function. Since there is no need to provide a solder layer or adhesive layer between the second pillar body 2202 and the circuit board, the impedance of the signal transmitted between the second pillar body 2202 and the circuit board can be reduced, thereby achieving a better signal transmission effect. In addition, the welding time is shortened, further improving product stability and production yield.

[0179] In this embodiment of the present application, the plurality of first raised pillars 221 may be the same type of raised pillars or may be a combination of two or more types of raised pillars.

[0180] 8 , at least one of the plurality of first raised pillars 221 includes a first pillar body 2201. A first via 2411 is formed in the first package layer 241, and the first via 2411 is filled with a conductive material to form the first pillar body 2201. One end of the first pillar body 2201 is connected to the rigid board portion 11, and the other end protrudes from the first package layer 241.

[0181] At least one of the plurality of first raised pillars 221 includes a second pillar body 2202. One end of the second pillar body 2202 is connected to the rigid board portion 11, and the other end protrudes toward the first package layer 241.

[0182] At least one of the plurality of first raised pillars 221 includes a stacked first pillar body 2201 and a second pillar body 2202, with the second pillar body 2202 located between the rigid board portion 11 and the first pillar body 2201. In the case of a raised pillar including the first pillar body 2201 and the second pillar body 2202, the second pillar body 2202 may first be fixed to the rigid board portion 11, and then the first package layer 241 and the second via 2412 may be formed. The second via 2412 is connected to the second pillar body 2202. Next, the first pillar body 2201 is formed in the second via 2412, the first pillar body 2201 is connected to the second pillar body 2202, and the end of the first pillar body 2201 away from the rigid board portion 11 protrudes toward the first package layer 241.

[0183] 8 and 9 , in some embodiments, the rigid board portion 11 includes a first surface 111 facing the first substrate 211. The first surface 111 includes a first package area 1111 and a first non-package area 1112. The first package layer 241 is located within the first package area 1111. The first non-package area 1112 is located around the first package area 1111. That is, there is a specific distance between the edge of the first package area 1111 and the edge of the rigid board portion 11. In this embodiment, the first non-package area 1112 can provide a support space for the mold during the molding operation of the first package layer 241 to ensure the production yield of the main control module 20 by avoiding damage to the rigid-flexible circuit board 1 caused by the mold abutting against the first flexible board portion 12 or the second flexible board portion 13.

[0184] For example, Fig. 10 is a schematic diagram 1 of the structure of the main control module 20 shown in Fig. 8 in a preparation process. Fig. 11 is a schematic diagram 2 of the structure of the main control module 20 shown in Fig. 8 in a preparation process. Fig. 12 is a schematic diagram 3 of the structure of the main control module 20 shown in Fig. 8 in a preparation process. Fig. 10 corresponds to the component fixing process. Fig. 11 corresponds to the molding process of the first package layer 241. Fig. 12 corresponds to the demolding process of the first package layer 241.

[0185] 10 , a plurality of components (chip 231 and chip matching component 232) and a plurality of second pillar bodies 2202 (a portion of the second pillar bodies 2202 separately forms a first raised pillar, and a portion of the second pillar bodies 2202 forms a portion of the first raised pillar) are fixed to a first package area 1111 on a first surface 111 of a rigid board portion 111. Methods for fixing the plurality of components include, but are not limited to, surface mounting, welding, bonding, adhesive bonding, etc.

[0186] As shown in FIG. 11 , an upper mold 3001 of the injection device abuts against the first non-packaging area 1112 of the rigid board portion 11, forming a package space 3002 with the rigid board portion 11. The second pillar body 2202 of the first raised pillar, the chip 231, and the chip matching component 232 are located within the package space 3002. The side of the upper mold 3001 facing the rigid board portion 11 forms an adhesive injection port 3003. The adhesive injection port 3003 communicates with the package space 3002. Package material can be injected into the package space 3002 through the adhesive injection port 3003 to form a first package layer 241 (shown in FIG. 12 ) within the package space 3002. A lower mold 3004 of the injection device is located on the side of the rigid board portion 11 away from the upper mold 3001 and abuts against the rigid board portion 11. The protrusion of the lower mold 3004 of the injection device above the rigid board portion 11 covers the protrusion of the upper mold 3001 above the rigid board portion 11, thereby completing and supporting the upper mold 3001. The upper mold 3001 and the lower mold 3004 do not come into contact with the first flexible board portion 12 and the second flexible board portion 13 to avoid damaging the first flexible board portion 12 and the second flexible board portion 13.

[0187] 12 , after the first package layer 241 is completed, a plurality of ejection pins 3005 extend from the upper mold 3001. Some of the ejection pins 3005 are pressed against the first non-package area 1112 of the rigid board portion 11, and some of the ejection pins 3005 are pressed against the first package layer 241 to separate the upper mold 3001 from the first package layer 241. The ejection pins 3005 pressed against the first package layer 241 are partially pressed against the end faces of the second pillar bodies 2202, and the second pillar bodies 2202 provide sufficient support for the ejection pins 3005 to prevent them from damaging the first package layer 241, resulting in a relatively high production yield of the main control module 20.

[0188] The injection device may further include an auxiliary push block 3006. The auxiliary push block 3006 is configured to press against the first flexible board portion 12 and the second flexible board portion 13 to assist in demolding. To prevent the first flexible board portion 12 or the second flexible board portion 13 from being damaged by excessively large localized stresses, the contact area between the auxiliary push block 3006 and each of the first flexible board portion 12 and the second flexible board portion 13 is large.

[0189] Still referring to FIGS. 8 and 9 , in some embodiments, the stack assembly 2 of the main control module 20 further includes at least one first component 233, which is fixed to the first non-packaging area 1112. That is, the first packaging layer 241 selectively packages components located on the rigid board portion 11 and does not package the first component 233. For example, the first component 233 is a component that is not suitable for plastic packaging, and includes, but is not limited to, a surface acoustic wave (SAW) filter having a cavity, a crystal oscillator having a cavity, a pressure-sensitive component, etc. The surface acoustic wave filter is primarily configured to filter and amplify radio frequency signals. The crystal oscillator is primarily configured to filter the main input and main output of the power management chip. The pressure-sensitive component includes, but is not limited to, a gyroscope, a triaxial accelerometer, etc. The gyroscope is configured to detect angular velocity. The three-axis accelerometer is configured to sense acceleration.

[0190] In this embodiment, the first non-packaging area 1112 of the rigid board portion 11 is configured not only to provide abutment space for molding in the molding process of the first packaging layer 241, but also to place the first component 233 that is not suitable for packaging, thereby improving space utilization in the main control module 20 by reusing the space of the first non-packaging area 1112.

[0191] In another embodiment, the first component 233 is not placed on the rigid board portion 11, and the first packaging layer 241 packages all components located on the side of the rigid board portion 11 facing the first substrate 211.

[0192] 8 , in some embodiments, the first substrate 211 is welded to the plurality of first raised pillars 221. The stack assembly 2 of the main control module 20 further includes a second packaging layer 242. The second packaging layer 242 is located on a side of the first substrate 211 away from the rigid board portion 11. The second packaging layer 242 packages at least one chip 231 on the first substrate 211. The second packaging layer 242 may further package at least one chip matching component 232 on the first substrate 211. Because the second packaging layer 242 can protect the components packaged therein, the main control module 20 has relatively high reliability and a relatively long service life.

[0193] 8 , in some embodiments, the stack assembly 2 of the main control module 20 further includes at least one second component 234. The at least one second component 234 is fixed to the side of the first substrate 211 away from the rigid board portion 11 and is located outside the second package layer 242. The second component 234 is a component that is not suitable for plastic packaging, and includes, but is not limited to, a surface acoustic wave (SAW) filter having a cavity, a crystal oscillator having a cavity, a pressure-sensitive component, etc. In this embodiment, the components in the main control module 20 that are not suitable for plastic packaging can be flexibly arranged on the rigid board portion 11 and / or the first substrate 211 based on the function selection and arrangement position of the chip 231, thereby improving the flexibility and variety of component arrangement in the main control module 20.

[0194] 8, in some embodiments, the protrusion of the first package layer 241 on the rigid board portion 11 covers the protrusion of the second package layer 242 on the rigid board portion 11. The first package layer 241 and the second package layer 242 form a generally step-like shape with uneven upper and lower steps. In other embodiments, the first package layer 241 and the second package layer 242 may alternatively form another regular or irregular shape.

[0195] 13 is a schematic diagram of the structure of the main control module 20 shown in FIG. 2 in the second embodiment. The following mainly describes the differences between the second embodiment and the first embodiment, and most of the content that is the same as the first embodiment will not be described again.

[0196] The main control module 20 includes a rigid-flexible circuit board 1 and a stack assembly 2. The rigid-flexible circuit board 1 includes a rigid board portion 11, and a first flexible board portion 12 and a second flexible board portion 13 connected to the rigid board portion 11. The stack assembly 2 is stacked on top of the rigid board portion 11.

[0197] The stack assembly 2 includes a first substrate 211, a first support member 22a, and a plurality of chips 231. The first substrate 211 and the rigid board portion 11 are stacked with a certain distance between them. The first support member 22a is located between the first substrate 211 and the rigid board portion 11 and abuts against both the first substrate 211 and the rigid board portion 11.

[0198] The first support member 22a includes a plurality of first raised pillars 221 and a plurality of second raised pillars 222. The plurality of first raised pillars 221 are located between the rigid board portion 11 and the first substrate 211 and are fixed to the rigid board portion 11. The plurality of second raised pillars 222 are fixed to the side of the first substrate 211 facing the rigid board portion 11, and the plurality of second raised pillars 222 are welded to the plurality of first raised pillars 221 in a one-to-one correspondence. For the structure of the second raised pillars 222, see the above description of the raised pillar structure. At least one of the plurality of chips 231 is fixed to the rigid board portion 11, and at least one of the plurality of chips 231 is fixed to the first substrate 211.

[0199] The stack assembly 2 of the main control module 20 further includes a first package layer 241, a second package layer 242, and a third package layer 243. The first package layer 241 is located between the rigid board portion 11 and the first substrate 211. The first package layer 241 packages a plurality of first raised pillars 221 and at least one chip 231 on the rigid board portion 11. The first package layer 241 may further package a plurality of chip matching components 232. The second package layer 242 is located on the side of the first substrate 211 facing the rigid board portion 11. The second package layer 242 packages at least one chip 231 on the first substrate 211. The second package layer 242 may further package a plurality of chip matching components 232. The third package layer 243 is located on the side of the first substrate 211 away from the rigid board portion 11. The third packaging layer 243 packages the plurality of second raised pillars 222 and the at least one chip 231 on the first substrate 211. The third packaging layer 243 may further package a plurality of chip matching components 232. Because the third packaging layer 243 can protect the components packaged by the third packaging layer 243, the main control module 20 has relatively high reliability and a relatively long service life.

[0200] In this embodiment, the first support member 22a includes a first raised pillar 221 and a second raised pillar 222, which are stacked on top of each other, providing a sufficient height for the first support member 22a. This provides a relatively large gap between the first substrate 211 and the rigid board portion 11. Two component layers can be disposed between the first substrate 211 and the rigid board portion 11. Thus, the main control module 20 integrates three component layers in a direction perpendicular to the rigid board portion 11, allowing the main control module 20 and the headset body 100 to have a higher component placement density and a higher degree of component integration. Additionally, the placement solutions for the multiple chips 231 and three component layers of the main control module 20 are more flexible and diversified. For example, a first packaging layer 241 may package a power management chip, a second packaging layer 242 may package a microcontroller unit chip, and a third packaging layer 243 may package an audio chip.

[0201] 13 , first package layer 241 is located in first package area 1111 of rigid board portion 11. At least one first component 233 may be secured to first non-package area 1112 of rigid board portion 11. First component 233 is a component that is not suitable for plastic packaging.

[0202] In some embodiments, as shown in FIG. 13 , the second packaging layer 242 may provide full-size packaging for components on the side of the first substrate 211 facing the rigid board portion 11, and the third packaging layer 243 may provide partial packaging for components on the side of the first substrate 211 away from the rigid board portion 11. In this embodiment of the present application, the packaging layer provides full-size packaging for the components on the substrate. That is, the packaging layer completely covers one side of the substrate. The packaging layer provides partial packaging for the components on the substrate. That is, the packaging layer partially covers one side of the substrate. At least one second component 234 may be further secured to the side of the first substrate 211 away from the rigid board. The second component 234 is a component that is not suitable for plastic packaging. The at least one second component 234 is located outside the third packaging layer 243. In some other embodiments, the second component 234 may not be located on the first substrate 211, and the third packaging layer 243 provides full-size packaging for the components on the side of the first substrate 211 away from the rigid board portion 11.

[0203] 14 is a schematic diagram of the structure of the main control module 20 shown in FIG. 2 in the third embodiment. The following mainly describes the differences between the third embodiment and the previous embodiments, and most of the content that is the same as the previous embodiments will not be described again.

[0204] The main control module 20 includes a rigid-flexible circuit board 1 and a stack assembly 2. The rigid-flexible circuit board 1 includes a rigid board portion 11, and a first flexible board portion 12 and a second flexible board portion 13 connected to the rigid board portion 11. The stack assembly 2 is stacked on top of the rigid board portion 11.

[0205] The stack assembly 2 includes a first substrate 211, a second substrate 212, a first support member 22a, a plurality of third raised pillars 223, a first package layer 241, a second package layer 242, a third package layer 243, and a plurality of chips 231. The first substrate 211 and the rigid board portion 11 are stacked with a certain distance between them. The first support member 22a is located between the first substrate 211 and the rigid board portion 11 and abuts against each of the first substrate 211 and the rigid board portion 11. At least one of the plurality of chips 231 is fixed to the rigid board portion 11, at least one of the plurality of chips 231 is fixed to the first substrate 211, and at least one of the plurality of chips 231 is fixed to the second substrate 212.

[0206] The first support member 22a includes a plurality of first raised pillars 221. The plurality of first raised pillars 221 are located between the rigid board portion 11 and the first substrate 211 and are fixed to the rigid board portion 11. The first packaging layer 241 is located between the rigid board portion 11 and the first substrate 211. The first packaging layer 241 packages the plurality of first raised pillars 221 and at least one chip 231 on the rigid board portion 11. The first packaging layer 241 may further package at least one chip matching component 232. The at least one first component 233 may be further fixed to a first non-package area 1112 of the rigid board portion 11. The first component 233 is a component that is not suitable for plastic packaging.

[0207] The first substrate 211 is welded to the plurality of first raised pillars 221, and the chip 231 fixed to the first substrate 211 is located on the side of the first substrate 211 away from the rigid board portion 11. The second substrate 212 is located on the side of the first substrate 211 away from the rigid board portion 11. The second substrate 212 and the first substrate 211 are stacked with a certain gap between them. The plurality of third raised pillars 223 are located between the second substrate 212 and the first substrate 211 and abut against each of the second substrate 212 and the first substrate 211. For the structure of the third raised pillars 223, please refer to the related description of the raised pillar structure above. The second packaging layer 242 is located between the second substrate 212 and the first substrate 211, and the chip 231 fixed to the plurality of third raised pillars 223 and the first substrate 211 is packaged in the second packaging layer 242. The second packaging layer 242 may package at least one chip matching component 232 on the first substrate 211.

[0208] At least one of the multiple chips 231 is packaged in a second packaging layer 242 and fixed to the second substrate 212. The second packaging layer 242 may package at least one chip matching component 232 on the second substrate 212.

[0209] The third package layer 243 is located on a side of the second substrate 212 away from the first substrate 211. At least one of the multiple chips 231 is packaged in the third package layer 243 and fixed to the second substrate 212. That is, a portion of the chip 231 fixed to the second substrate 212 is located on a side of the second substrate 212 facing the first substrate 211, and a portion of the chip 231 is located on a side of the second substrate 212 away from the first substrate 211. The chip 231 fixed to the second substrate 212 is electrically connected to the rigid board portion 11 by using a plurality of third raised pillars 223, the first substrate 211, and a plurality of first raised pillars 221. The third package layer 243 may further package at least one chip matching component 232 on the second substrate 212.

[0210] In this embodiment, main control module 20 has components arranged on all of the side of rigid board portion 11 facing first substrate 211, the side of first substrate 211 away from rigid board portion 11, the side of second substrate 212 facing first substrate 211, and the side of second substrate 212 away from first substrate 211. In this way, four component layers are stacked in a direction perpendicular to rigid board portion 11, thereby increasing component arrangement density and the degree of component integration.

[0211] 14 , the second packaging layer 242 provides full-size packaging for the components on the first substrate 211 and full-size packaging for the components located on the side of the second substrate 212 facing the first substrate 211. The third packaging layer 243 provides partial packaging for the components located on the side of the second substrate 212 away from the first substrate 211. At least one second component 234 may be further fixed to the side of the second substrate 212 away from the first substrate 211. The second component 234 is a component that is not suitable for plastic packaging. The at least one second component 234 is located outside the third packaging layer 243. It will be understood that in some other embodiments, the second component 234 is not disposed on the second substrate 212, and the third packaging layer 243 provides full-size packaging for the components located on the side of the second substrate 212 away from the first substrate 211.

[0212] 15 is a schematic diagram of the structure of the main control module 20 shown in FIG. 2 in the fourth embodiment. The following mainly describes the differences between the fourth embodiment and the previous embodiments, and most of the content that is the same as the previous embodiments will not be described again.

[0213] The main control module 20 includes a rigid-flexible circuit board 1 and a stack assembly 2. The rigid-flexible circuit board 1 includes a rigid board portion 11, and a first flexible board portion 12 and a second flexible board portion 13 connected to the rigid board portion 11. The stack assembly 2 is stacked on top of the rigid board portion 11.

[0214] The stack assembly 2 includes a first substrate 211, a first support member 22a, and a plurality of chips 231. The first substrate 211 and the rigid board portion 11 are stacked with a certain gap between them. The first support member 22a is located between the first substrate 211 and the rigid board portion 11 and abuts against both the first substrate 211 and the rigid board portion 11.

[0215] The first support member 22a includes a plurality of first raised pillars 221. The plurality of first raised pillars 221 are located between the rigid board portion 11 and the first substrate 211 and are fixed to the rigid board portion 11. For the structure of the first raised pillars 221, please refer to the structure of the second pillar body 2202 described above (shown in FIG. 8).

[0216] The stack assembly 2 of the main control module 20 further includes a first package layer 241 and a second package layer 242. The first package layer 241 is located between the rigid board portion 11 and the first substrate 211. The first package layer 241 packages a plurality of first raised pillars 221 and at least one chip 231 on the rigid board portion 11. The first package layer 241 contacts the first substrate 211. In this case, the first package layer 241 packages components located between the rigid board portion 11 and the first substrate 211. When the main control module 20 is prepared, the first substrate 211 is fixed (e.g., welded or glued) to the plurality of first raised pillars 221, and then a package material is filled between the first substrate 211 and the rigid board portion 11 to form the first package layer 241. The first packaging layer 241 may further package at least one chip matching component 232 on the rigid board portion 11. At least one first component 233 may further be disposed in a first non-packaged area 1112 of the rigid board portion 11. The first component 233 is a component that is not suitable for plastic packaging.

[0217] The second packaging layer 242 is fixed to the side of the first substrate 211 away from the rigid board portion 11. Some of the chips 231 fixed to the first substrate 211 are packaged in the first packaging layer 241, and some are packaged in the second packaging layer 242. That is, some of the chips 231 fixed to the first substrate 211 are fixed to the side of the first substrate 211 facing the rigid board portion 11, and some are fixed to the side of the first substrate 211 away from the rigid board portion 11. The first packaging layer 241 may further package at least one chip matching component 232 on the first substrate 211. The second packaging layer 242 may further package at least one chip matching component 232 on the side of the first substrate 211 away from the rigid board portion 11.

[0218] In this embodiment, main control module 20 has components arranged on all of the sides of rigid board portion 11 facing first substrate 211, the side of first substrate 211 facing rigid board portion 11, and the side of first substrate 211 away from rigid board portion 11. In this way, three component layers are stacked in a direction perpendicular to rigid board portion 11. Therefore, main control module 20 and headset body 100 have a relatively high component arrangement density and a relatively high degree of component integration.

[0219] 15 , the first packaging layer 241 may provide full-size packaging for components fixed to the side of the first substrate 211 facing the rigid board portion 11, and the second packaging layer 242 may provide partial packaging for components fixed to the side of the first substrate 211 away from the rigid board portion 11. At least one second component 234 may be further disposed on the side of the first substrate 211 away from the rigid board portion 11. The second component 234 is a component that is not suitable for plastic packaging. The at least one second component 234 is located outside the second packaging layer 242. In some other embodiments, the second component 234 is not disposed on the first substrate 211, and the second packaging layer 242 provides full-size packaging for components fixed to the side of the first substrate 211 away from the rigid board portion 11.

[0220] It will be understood that in the above-described embodiments, the stack assembly 2 is located on the same side of the rigid board portion 11. The following embodiments describe solutions in which the stack assembly 2 is located partially on one side of the rigid board portion 11 and partially on the other side of the rigid board portion 11. The part of the stack assembly 2 located on the side of the rigid board portion 11 facing the first substrate 211 is referred to as the upper stack portion for short, and the part of the stack assembly 2 located on the side of the rigid board portion 11 away from the first substrate 211 is referred to as the lower stack portion for short.

[0221] 16 is a schematic diagram of the structure of the main control module 20 shown in FIG. 2 in the fifth embodiment. The following mainly describes the differences between the fifth embodiment and the previous embodiments, and most of the content that is the same as the previous embodiments will not be described again.

[0222] The main control module 20 includes a rigid-flexible circuit board 1 and a stack assembly 2. The rigid-flexible circuit board 1 includes a rigid board portion 11, and a first flexible board portion 12 and a second flexible board portion 13 connected to the rigid board portion 11. The stack assembly 2 is stacked on the rigid board portion 11. The stack assembly 2 includes an upper stack portion 2a and a lower stack portion 2b located on either side of the rigid board portion 11.

[0223] The upper stack section 2a includes a first substrate 211, a first support member 22a, a first package layer 241, a second package layer 242, and a plurality of chips 231. The first substrate 211 and the rigid board section 11 are stacked with a certain gap between them. The first support member 22a is located between the first substrate 211 and the rigid board section 11 and abuts against both the first substrate 211 and the rigid board section 11. At least two of the plurality of chips 231 are fixed to the rigid board section 11, and at least one of the plurality of chips 231 is fixed to the first substrate 211.

[0224] The first support member 22a includes a plurality of first raised pillars 221. The plurality of first raised pillars 221 are located between the rigid board portion 11 and the first substrate 211 and are fixed to the rigid board portion 11. For the structure of the first raised pillars 221, please refer to the related description of the raised pillar structure above. The first packaging layer 241 is located between the rigid board portion 11 and the first substrate 211. The first packaging layer 241 packages the plurality of first raised pillars 221 and at least one chip 231 on the rigid board portion 11. The first packaging layer 241 also packages at least one chip matching component 232. The first substrate 211 is welded to the plurality of first raised pillars 221. The second packaging layer 242 is located on the side of the first substrate 211 away from the rigid board portion 11. The second packaging layer 242 packages at least one chip 231 on the first substrate 211. The second packaging layer 242 further packages at least one chip matching component 232.

[0225] The lower stack unit 2b may include a fourth package layer 244. The fourth package layer 244 is fixed to the side of the rigid board unit 11 that is away from the first substrate 211. At least one of the chips 231 fixed to the rigid board unit 11 is packaged in the fourth package layer 244. That is, part of the chip 231 fixed to the rigid board unit 11 is located on the side of the rigid board unit 11 that faces the first substrate 211, and part of the chip 231 is located on the side of the rigid board unit 11 that is away from the first substrate 211.

[0226] In this embodiment, main control module 20 has components arranged on all of the sides of rigid board portion 11 away from first substrate 211, the side of rigid board portion 11 facing first substrate 211, and the side of first substrate 211 away from rigid board portion 11. In this way, three component layers are stacked in a direction perpendicular to rigid board portion 11. Therefore, main control module 20 and headset body 100 have a relatively high component arrangement density and a relatively high degree of component integration.

[0227] 16 , at least one first component 233 may be secured to a first non-packaging area 1112 of the rigid board portion 11. The first component 233 is a component that is not suitable for plastic packaging. The second packaging layer 242 provides partial packaging for the components secured to the side of the first substrate 211 away from the rigid board portion 11. At least one second component 234 may also be disposed on the side of the first substrate 211 away from the rigid board portion 11. The second component 234 is a component that is not suitable for plastic packaging. The at least one second component 234 is located outside the second packaging layer 242. In some other embodiments, the second component 234 is not disposed on the first substrate 211, and the second packaging layer 242 provides full-size packaging for the components secured to the side of the first substrate 211 away from the rigid board portion 11.

[0228] 16 , the rigid board portion 11 further includes a second surface 112 away from the first substrate 211, the second surface 112 being disposed on the opposite side to the first surface 111. The second surface 112 includes a second package region 1121 and a second non-package region 1122 surrounding the second package region 1121. The areas and positions of the second package region 1121 and the first package region 1111 may be the same or different. In this embodiment, an example in which the second package region 1121 covers the first package region 1111 and the area of ​​the second package region 1121 is larger than the area of ​​the first package region 1111 is used for explanation. The fourth package layer 244 is fixed to the second package region 1121, and a gap is formed between an edge of the fourth package layer 244 and an edge of the rigid board portion 11. For example, fourth packaging layer 244 may package all components secured to the side of rigid board portion 11 away from first substrate 211 .

[0229] In this embodiment, components may be attached to the first side 111 of the rigid board portion 11 to form a first package layer 241, and then components may be attached to the second side 112 of the rigid board portion 11 to form a second package layer 242. A package structure including the first substrate 211 and the components attached thereto is then secured onto the first package layer 241 to form the main control module 20.

[0230] Figure 17 is a schematic diagram 1 of the structure of main control module 20 shown in Figure 16 in a preparation process. Figure 18 is a schematic diagram 2 of the structure of main control module 20 shown in Figure 16 in a preparation process. Figure 19 is a schematic diagram 3 of the structure of main control module 20 shown in Figure 16 in a preparation process. Figure 17 corresponds to the process of fixing components to second surface 12. Figure 18 corresponds to the molding process of fourth package layer 244. Figure 19 corresponds to the demolding process of fourth package layer 244.

[0231] For the process of fixing components to the first surface 111 of the rigid board portion 11 and the process of preparing the first package layer 241, please refer to the relevant descriptions of FIGS. 10 to 12 above.

[0232] 17 , in the process of fixing multiple components (including chips 231 and chip matching components 232) to the second surface 112, a support frame 400 abuts the first non-package area 1112 to support the rigid board portion 11, thereby enabling the multiple components to be fixed well to the second surface 112. In this case, the center of the support frame 400 is recessed to avoid the completed first package layer 241. The support frame 400 does not contact the first flexible board portion 12 and the second flexible board portion 13 to avoid damaging the first flexible board portion 12 and the second flexible board portion 13. In some embodiments, the support frame 400 may also abut the first package layer 241 at the same time to further support the rigid board portion 11 using the first package layer 241, thereby providing more balanced support for the rigid board portion 11. Methods for fastening multiple components include, but are not limited to, surface mounting, welding, bonding, adhesive bonding, and the like.

[0233] 18 , in the molding process of the fourth package layer 244, an upper mold 3001 of an injection device abuts against the second non-package region 1122 of the rigid board portion 11, forming a package space 3008 together with the second surface 112 of the rigid board portion 11. The chip 231 and the chip matching component 232 fixed to the second surface 112 are located within the package space 3008. The side of the upper mold 3001 facing the second surface 112 of the rigid board portion 11 forms an adhesive injection port 3009. The adhesive injection port 3009 communicates with the package space 3008. A package material is injected into the package space 3008 from the adhesive injection port 3009, so that the fourth package layer 244 can be formed within the package space 3008. The lower mold 3004 of the injection device is located on the side of the rigid board unit 11 away from the upper mold 3001 and abuts against the first non-package area 1112. The upper mold 3001 and the lower mold 3004 do not contact the first flexible board unit 12 and the second flexible board unit 13 to avoid damaging the first flexible board unit 12 and the second flexible board unit 13.

[0234] As shown in FIG. 19 , after the fourth package layer 244 is completed, a plurality of ejection pins 3005 extend from the upper mold 3001. Some of the ejection pins 3005 press against the second non-package area 1122 of the rigid board portion 11, and some of the ejection pins 3005 press against the fourth package layer 244 to separate the upper mold 3001 from the fourth package layer 244. The injection device may further include an auxiliary push block 3006. The auxiliary push block 3006 is configured to press against the first flexible board portion 12 and the second flexible board portion 13 to assist in demolding. To prevent the first flexible board portion 12 or the second flexible board portion 13 from being damaged by excessively large local stress, the contact area between the auxiliary push block 3006 and each of the first flexible board portion 12 and the second flexible board portion 13 is large.

[0235] It will be understood that the structure of the upper stack section 2a of the stack assembly 2 in the fifth embodiment shown in FIG. 16 is the same as or similar to the structure of the stack assembly 2 in the first embodiment shown in FIG. 8. In some other embodiments, the upper stack section 2a of the fifth embodiment may have the same or similar structure as the stack assembly 2 in the second to fourth embodiments to form a main control module 20 having a structure different from that of the aforementioned embodiments. In some other embodiments, the upper stack section 2a of the stack assembly 2 may have the same or similar structure as the stack assembly 2 in the first to fourth embodiments, and the lower stack section 2b of the stack assembly 2 may have the same or similar structure as the stack assembly 2 in the first to fourth embodiments to form multiple types of main control modules 20 having a structure different from that of the aforementioned embodiments. Examples are provided below for explanation.

[0236] 20 is a schematic diagram of the structure of the main control module 20 shown in FIG. 2 in the sixth embodiment. The following mainly describes the differences between the sixth embodiment and the previous embodiments, and most of the content that is the same as the previous embodiments will not be described again.

[0237] The main control module 20 includes a rigid-flexible circuit board 1 and a stack assembly 2. The rigid-flexible circuit board 1 includes a rigid board portion 11, and a first flexible board portion 12 and a second flexible board portion 13 connected to the rigid board portion 11. The stack assembly 2 is stacked on the rigid board portion 11. The stack assembly 2 includes an upper stack portion 2a and a lower stack portion 2b located on either side of the rigid board portion 11.

[0238] The upper stack section 2a includes a first substrate 211, a first support member 22a, and a plurality of chips 231. The first substrate 211 and the rigid board section 11 are stacked with a certain gap between them. The first support member 22a is located between the first substrate 211 and the rigid board section 11 and abuts against both the first substrate 211 and the rigid board section 11. At least one of the plurality of chips 231 is fixed to the rigid board section 11, and at least one of the plurality of chips 231 is fixed to the first substrate 211.

[0239] The first support member 22a includes a plurality of first raised pillars 221 and a plurality of second raised pillars 222. The first raised pillars 221 and the second raised pillars 222 are stacked. The plurality of first raised pillars 221 are fixed to the rigid board portion 11. The plurality of second raised pillars 222 are fixed to the first substrate 211. The plurality of second raised pillars 222 are welded to the plurality of first raised pillars 221 in a one-to-one correspondence.

[0240] The upper stack unit 2a further includes a first package layer 241, a second package layer 242, and a third package layer 243. The first package layer 241 is located between the rigid board unit 11 and the first substrate 211. The first package layer 241 packages a plurality of first raised pillars 221 and at least one chip 231 on the rigid board unit 11. The second package layer 242 is located on a side of the first substrate 211 facing the rigid board unit 11. The second package layer 242 packages a plurality of second raised pillars 222 and at least one chip 231 on the first substrate 211. The third package layer 243 is located on a side of the first substrate 211 away from the rigid board unit 11. The third package layer 243 packages at least one chip 231 on the first substrate 211.

[0241] The lower stack portion 2b includes a fourth package layer 244 and at least one chip 231. The fourth package layer 244 is located on the side of the rigid board portion 11 away from the first substrate 211. The fourth package layer 244 packages the at least one chip 231 on the rigid board portion 11.

[0242] In this embodiment, main control module 20 has components arranged on both sides of rigid board portion 11 and both sides of first substrate 211. In this manner, four component layers are stacked in a direction perpendicular to rigid board portion 11. Therefore, main control module 20 and headset body 100 have a relatively high component arrangement density and a relatively high degree of component integration.

[0243] 21 is a schematic diagram of the structure of the main control module 20 shown in FIG. 2 in the seventh embodiment. The following mainly describes the differences between the seventh embodiment and the previous embodiments, and most of the content that is the same as the previous embodiments will not be described again.

[0244] The main control module 20 includes a rigid-flexible circuit board 1 and a stack assembly 2. The rigid-flexible circuit board 1 includes a rigid board portion 11, and a first flexible board portion 12 and a second flexible board portion 13 connected to the rigid board portion 11. The stack assembly 2 is stacked on the rigid board portion 11. The stack assembly 2 includes an upper stack portion 2a and a lower stack portion 2b located on either side of the rigid board portion 11.

[0245] The upper stack section 2a includes a first substrate 211 and a first support member 22a. The first substrate 211 and the rigid board section 11 are stacked with a certain distance between them. The first support member 22a is located between the first substrate 211 and the rigid board section 11 and abuts against both the first substrate 211 and the rigid board section 11. The lower stack section 2b includes a third substrate 213 and a second support member 22b. The third substrate 213 is located on the side of the rigid board section 11 away from the first substrate 211. The third substrate 213 and the rigid board section 11 are stacked with a certain distance between them. The second support member 22b is located between the third substrate 213 and the rigid board section 11 and abuts against both the third substrate 213 and the rigid board section 11.

[0246] The stack assembly 2 includes a plurality of chips 231. At least one of the plurality of chips 231 is fixed to the rigid board unit 11, at least one of the plurality of chips 231 is fixed to the first substrate 211, and at least one of the plurality of chips 231 is fixed to the third substrate 213. The chip 231 fixed to the first substrate 211 is electrically connected to the rigid board unit 11 by using a first support member 22a. The chip 231 fixed to the third substrate 213 is electrically connected to the rigid board unit 11 by using a second support member 22b.

[0247] The first support member 22a includes a plurality of first raised pillars 221 and a plurality of second raised pillars 222. The first raised pillars 221 and the second raised pillars 222 are stacked. The plurality of first raised pillars 221 are fixed to the rigid board portion 11. The plurality of second raised pillars 222 are fixed to the first substrate 211. The plurality of second raised pillars 222 are welded to the plurality of first raised pillars 221 in a one-to-one correspondence. The second support member 22b includes a plurality of fourth raised pillars 224, which are fixed to the rigid board portion 11. The third substrate 213 is welded to the plurality of fourth raised pillars 224 , and the chip 231 fixed to the third substrate 213 is located on the side of the third substrate 213 away from the rigid board portion 11 .

[0248] The upper stack unit 2a further includes a first package layer 241, a second package layer 242, and a third package layer 243. The first package layer 241 is located between the rigid board unit 11 and the first substrate 211. The first package layer 241 packages a plurality of first raised pillars 221 and at least one chip 231 on the rigid board unit 11. The second package layer 242 is located on a side of the first substrate 211 facing the rigid board unit 11. The second package layer 242 packages a plurality of second raised pillars 222 and at least one chip 231 on the first substrate 211. The third package layer 243 is located on a side of the first substrate 211 away from the rigid board unit 11. The third package layer 243 packages at least one chip 231 on the first substrate 211.

[0249] The lower stack portion 2b further includes a fourth package layer 244 and a fifth package layer 245. The fourth package layer 244 is located on a side of the rigid board portion 11 that is remote from the first substrate 211. The fourth package layer 244 packages a plurality of fourth raised pillars 224 and at least one chip 231 on the rigid board portion 11. The fifth package layer 245 is located on a side of the third substrate 213 that is remote from the rigid board portion 11. The fifth package layer 245 packages at least one chip 231 on the third substrate 213.

[0250] At least one first component 233 may be secured to a first non-packaging area 1112 of rigid board portion 11. The first component 233 is a component that is not suitable for plastic packaging. The at least one first component 233 may further be secured to a second non-packaging area 1122 of rigid board portion 11. At least one second component 234 may be secured to a side of first substrate 211 away from rigid board portion 11. The second component 234 is a component that is not suitable for plastic packaging. The second component 234 is located outside of third package layer 243. The at least one second component 234 may be secured to a side of third substrate 213 away from rigid board portion 11. The second component 234 is located outside of fifth package layer 245.

[0251] In this embodiment, main control module 20 has components arranged on both sides of rigid board portion 11, both sides of first substrate 211, and on the side of third substrate 213 away from rigid board portion 11. In this manner, five component layers are stacked in a direction perpendicular to rigid board portion 11. Therefore, main control module 20 and headset body 100 have a relatively high component arrangement density and a relatively high degree of component integration.

[0252] 22 is a schematic diagram of the structure of the main control module 20 shown in FIG. 2 in the eighth embodiment. The following mainly describes the differences between the eighth embodiment and the previous embodiments, and most of the content that is the same as the previous embodiments will not be described again.

[0253] The main control module 20 includes a rigid-flexible circuit board 1 and a stack assembly 2. The rigid-flexible circuit board 1 includes a rigid board portion 11, and a first flexible board portion 12 and a second flexible board portion 13 connected to the rigid board portion 11. The stack assembly 2 is stacked on the rigid board portion 11. The stack assembly 2 includes an upper stack portion 2a and a lower stack portion 2b disposed on either side of the rigid board portion 11.

[0254] The upper stack unit 2a includes a first substrate 211 and a first support member 22a. The first substrate 211 and the rigid board unit 11 are stacked with a certain distance between them. The first support member 22a is located between the first substrate 211 and the rigid board unit 11 and abuts against both the first substrate 211 and the rigid board unit 11. The lower stack unit 2b includes a third substrate 213 and a second support member 22b. The third substrate 213 is located on the side of the rigid board unit 11 away from the first substrate 211. The third substrate 213 and the rigid board unit 11 are stacked with a certain distance between them. The second support member 22b is located between the third substrate 213 and the rigid board unit 11 and abuts against both the third substrate 213 and the rigid board unit 11.

[0255] The stack assembly 2 includes a plurality of chips 231. At least one of the plurality of chips 231 is fixed to the rigid board unit 11, at least one of the plurality of chips 231 is fixed to the first substrate 211, and at least one of the plurality of chips 231 is fixed to the third substrate 213. The chip 231 fixed to the first substrate 211 is electrically connected to the rigid board unit 11 by using a first support member 22a. The chip 231 fixed to the third substrate 213 is electrically connected to the rigid board unit 11 by using a second support member 22b.

[0256] The first support member 22a includes a plurality of first raised pillars 221 and a plurality of second raised pillars 222. The first raised pillars 221 and the second raised pillars 222 are stacked. The plurality of first raised pillars 221 are fixed to the rigid board portion 11. The plurality of second raised pillars 222 are fixed to the first substrate 211. The plurality of second raised pillars 222 are welded to the plurality of first raised pillars 221 in a one-to-one correspondence. The second support member 22b includes a plurality of fourth raised pillars 224 and a plurality of fifth raised pillars 225. The fourth raised pillars 224 and the fifth raised pillars 225 are stacked. The plurality of fourth raised pillars 224 are fixed to the rigid board portion 11. The plurality of fifth raised pillars 225 are fixed to the third substrate 213. The plurality of fifth raised pillars 225 are welded to the plurality of fourth raised pillars 224 in a one-to-one correspondence.

[0257] The upper stack unit 2a includes a first package layer 241, a second package layer 242, and a third package layer 243. The first package layer 241 is located between the rigid board unit 11 and the first substrate 211. The first package layer 241 packages a plurality of first raised pillars 221 and at least one chip 231 on the rigid board unit 11. The second package layer 242 is located on a side of the first substrate 211 facing the rigid board unit 11. The second package layer 242 packages a plurality of second raised pillars 222 and at least one chip 231 on the first substrate 211. The third package layer 243 is located on a side of the first substrate 211 away from the rigid board unit 11. The third package layer 243 packages at least one chip 231 on the first substrate 211.

[0258] The lower stack unit 2b further includes a fourth package layer 244, a fifth package layer 245, and a sixth package layer 246. The fourth package layer 244 is located on a side of the rigid board unit 11 away from the first substrate 211. The fourth package layer 244 packages a plurality of fourth raised pillars 224 and at least one chip 231 on the rigid board unit 11. The fifth package layer 245 is located on a side of the third substrate 213 facing the rigid board unit 11. The fifth package layer 245 packages a plurality of fifth raised pillars 225 and at least one chip 231 on the third substrate 213. The sixth package layer 246 is located on a side of the third substrate 213 away from the rigid board unit 11. The sixth package layer 246 packages at least one chip 231 on the third substrate 213.

[0259] At least one first component 233 may be secured to a first non-packaging area 1112 of rigid board portion 11. The first component 233 is a component that is not suitable for plastic packaging. The at least one first component 233 may further be secured to a second non-packaging area 1122 of rigid board portion 11. At least one second component 234 may be secured to a side of first substrate 211 away from rigid board portion 11. The second component 234 is a component that is not suitable for plastic packaging. The second component 234 is located outside of third package layer 243. The at least one second component 234 may be secured to a side of third substrate 213 away from rigid board portion 11. The second component 234 is located outside of sixth package layer 246.

[0260] In this embodiment, main control module 20 has components arranged on both sides of rigid board portion 11, both sides of first substrate 211, and both sides of third substrate 213. In this manner, six component layers are stacked in a direction perpendicular to rigid board portion 11. Therefore, main control module 20 and headset body 100 have a relatively high component arrangement density and a relatively high degree of component integration.

[0261] In this embodiment, the upper stack section 2a and the lower stack section 2b, which are located on both sides of the rigid board section 11, are arranged almost symmetrically, and the main control module 20 integrates more component layers, thereby achieving a high component placement density.

[0262] 23 is a schematic diagram of the structure of the main control module 20 shown in FIG. 2 in the ninth embodiment. The following mainly describes the differences between the ninth embodiment and the previous embodiments, and most of the content that is the same as the previous embodiments will not be described again.

[0263] The main control module 20 includes a rigid-flexible circuit board 1 and a stack assembly 2. The rigid-flexible circuit board 1 includes a rigid board portion 11, and a first flexible board portion 12 and a second flexible board portion 13 connected to the rigid board portion 11. The stack assembly 2 is stacked on the rigid board portion 11. The stack assembly 2 includes an upper stack portion 2a and a lower stack portion 2b located on either side of the rigid board portion 11.

[0264] The upper stack section 2a includes a first substrate 211 and a first support member 22a. The first substrate 211 and the rigid board section 11 are stacked with a certain distance between them. The first support member 22a is located between the first substrate 211 and the rigid board section 11 and abuts against each of the first substrate 211 and the rigid board section 11. The lower stack section 2b includes a third substrate 213, a fourth substrate 214, and a plurality of sixth raised pillars 226. The third substrate 213 is located on the side of the rigid board section 11 away from the first substrate 211. The third substrate 213 and the rigid board section 11 are stacked with a certain distance between them. The second support member 22b is located between the third substrate 213 and the rigid board section 11 and abuts against each of the third substrate 213 and the rigid board section 11. The fourth substrate 214 is located on the side of the third substrate 213 away from the rigid board portion 11. The fourth substrate 214 and the third substrate 213 are stacked with a certain gap between them. A plurality of sixth raised pillars 226 are located between the fourth substrate 214 and the third substrate 213 and abut against each of the fourth substrate 214 and the third substrate 213.

[0265] The stack assembly 2 includes a plurality of chips 231. At least one of the plurality of chips 231 is fixed to the rigid board portion 11, at least one of the plurality of chips 231 is fixed to the first substrate 211, at least one of the plurality of chips 231 is fixed to the third substrate 213, and at least one of the plurality of chips 231 is fixed to the fourth substrate 214. The chip 231 fixed to the first substrate 211 is electrically connected to the rigid board portion 11 using a first support member 22a. The chip 231 fixed to the third substrate 213 is electrically connected to the rigid board portion 11 using a second support member 22b. The chip 231 fixed to the fourth substrate 214 is electrically connected to the rigid board portion 11 using a sixth raised pillar 226, the third substrate 213, and the second support member 22b.

[0266] The first support member 22a includes a plurality of first raised pillars 221 and a plurality of second raised pillars 222. The first raised pillars 221 and the second raised pillars 222 are stacked. The plurality of first raised pillars 221 are fixed to the rigid board portion 11. The plurality of second raised pillars 222 are fixed to the first substrate 211. The plurality of second raised pillars 222 are welded to the plurality of first raised pillars 221 in a one-to-one correspondence. The second support member 22b includes a plurality of stacked fourth raised pillars 224, and the plurality of fourth raised pillars 224 are fixed to the rigid board portion 11. The third substrate 213 is welded to the plurality of fourth raised pillars 224.

[0267] The upper stack unit 2a further includes a first package layer 241, a second package layer 242, and a third package layer 243. The first package layer 241 is located between the rigid board unit 11 and the first substrate 211. The first package layer 241 packages a plurality of first raised pillars 221 and at least one chip 231 on the rigid board unit 11. The second package layer 242 is located on a side of the first substrate 211 facing the rigid board unit 11. The second package layer 242 packages a plurality of second raised pillars 222 and at least one chip 231 on the first substrate 211. The third package layer 243 is located on a side of the first substrate 211 away from the rigid board unit 11. The third package layer 243 packages at least one chip 231 on the first substrate 211.

[0268] The lower stack unit 2b further includes a fourth package layer 244, a fifth package layer 245, and a sixth package layer 246. The fourth package layer 244 is located on a side of the rigid board unit 11 away from the first substrate 211. The fourth package layer 244 packages a plurality of fourth raised pillars 224 and at least one chip 231 on the rigid board unit 11. The fifth package layer 245 is located between the third substrate 213 and the fourth substrate 214. The fifth package layer 245 packages a plurality of sixth raised pillars 226 and at least one chip 231 on the third substrate 213 and packages at least one chip 231 on the fourth substrate 214. The sixth package layer 246 is located on a side of the fourth substrate 214 away from the third substrate 213. The sixth packaging layer 246 packages at least one chip 231 on the fourth substrate 214 .

[0269] At least one first component 233 may be fixed to a first non-packaging area 1112 of the rigid board portion 11. The first component 233 is a component that is not suitable for plastic packaging. The at least one first component 233 may further be fixed to a second non-packaging area 1122 of the rigid board portion 11. The at least one second component 234 may be fixed to a side of the first substrate 211 away from the rigid board portion 11. The second component 234 is a component that is not suitable for plastic packaging. The second component 234 is located outside the third package layer 243. The at least one second component 234 may be fixed to a side of the fourth substrate 214 away from the third substrate 213. The second component 234 is located outside the sixth package layer 246.

[0270] In this embodiment, main control module 20 has components arranged on both sides of rigid board portion 11, both sides of first substrate 211, the side of third substrate 213 away from rigid board portion 11, and both sides of fourth substrate 214. In this manner, seven component layers are stacked in a direction perpendicular to rigid board portion 11. Therefore, main control module 20 and headset body 100 have a relatively high component arrangement density and a relatively high degree of component integration.

[0271] 24 is a schematic diagram of the structure of the main control module 20 shown in FIG. 2 in the tenth embodiment. The following mainly describes the differences between the tenth embodiment and the previous embodiments, and most of the content that is the same as the previous embodiments will not be described again.

[0272] The main control module 20 includes a rigid-flexible circuit board 1 and a stack assembly 2. The rigid-flexible circuit board 1 includes a rigid board portion 11, and a first flexible board portion 12 and a second flexible board portion 13 connected to the rigid board portion 11. The stack assembly 2 is stacked on the rigid board portion 11. The stack assembly 2 includes an upper stack portion 2a and a lower stack portion 2b located on either side of the rigid board portion 11.

[0273] The upper stack section 2a includes a first substrate 211 and a first support member 22a. The first substrate 211 and the rigid board section 11 are stacked with a certain distance between them. The first support member 22a is located between the first substrate 211 and the rigid board section 11 and abuts against both the first substrate 211 and the rigid board section 11. The lower stack section 2b includes a third substrate 213 and a second support member 22b. The third substrate 213 is located on the side of the rigid board section 11 away from the first substrate 211 and the third substrate 213 and the rigid board section 11 are stacked with a certain distance between them. The second support member 22b is located between the third substrate 213 and the rigid board section 11 and abuts against both the third substrate 213 and the rigid board section 11. The first support member 22a includes a plurality of first raised pillars 221, and the second support member 22b includes a plurality of fourth raised pillars 224. For the structure of the first raised pillars 221 and the fourth raised pillars 224, please refer to the related description of the second pillar body 2202 (shown in FIG. 8) above.

[0274] The upper stack portion 2a further includes a first package layer 241 and a second package layer 242. The first package layer 241 is located between the rigid board portion 11 and the first substrate 211. The first package layer 241 packages a plurality of first raised pillars 221 and at least one chip 231 on the rigid board portion 11, and packages the at least one chip 231 on the first substrate 211. In this case, the first package layer 241 packages components located between the rigid board portion 11 and the first substrate 211. When the main control module 20 is prepared, the first substrate 211 may be fixed (e.g., welded or glued) to the plurality of first raised pillars 221, and then a package material may be filled between the first substrate 211 and the rigid board portion 11 to form the first package layer 241. The second package layer 242 is fixed to the side of the first substrate 211 away from the rigid board portion 11. The second package layer 242 packages at least one chip 231 on the first substrate 211.

[0275] The lower stack portion 2b further includes a fourth package layer 244 and a fifth package layer 245. The fourth package layer 244 is located between the rigid board portion 11 and the third substrate 213. The fourth package layer 244 packages a plurality of fourth raised pillars 224 and at least one chip 231 on the rigid board portion 11, and packages the at least one chip 231 on the third substrate 213. In this case, the fourth package layer 244 packages components located between the rigid board portion 11 and the third substrate 213. When the main control module 20 is prepared, the third substrate 213 may be fixed (e.g., welded or glued) to the plurality of fourth raised pillars 224, and then a package material may be filled between the third substrate 213 and the rigid board portion 11 to form the fourth package layer 244. The fifth package layer 245 is fixed to the side of the third substrate 213 away from the rigid board portion 11. The fifth package layer 245 packages at least one chip 231 on the third substrate 213.

[0276] In this embodiment, main control module 20 has components arranged on both sides of rigid board portion 11, both sides of first substrate 211, and both sides of third substrate 213. In this manner, six component layers are stacked in a direction perpendicular to rigid board portion 11. Therefore, main control module 20 and headset body 100 have a relatively high component arrangement density and a relatively high degree of component integration.

[0277] 25 is a schematic diagram of the structure of the main control module 20 shown in FIG. 2 in the eleventh embodiment. The following mainly describes the differences between the eleventh embodiment and the previous embodiments, and most of the content that is the same as the previous embodiments will not be described again.

[0278] The main control module 20 includes a rigid-flexible circuit board 1 and a stack assembly 2. The rigid-flexible circuit board 1 includes a rigid board portion 11, and a first flexible board portion 12 and a second flexible board portion 13 connected to the rigid board portion 11. The stack assembly 2 is stacked on top of the rigid board portion 11.

[0279] The stack assembly 2 includes a first substrate 211, a first support member 22a, and multiple chips 231. The first substrate 211 and the rigid board portion 11 are stacked with a certain gap between them. The first support member 22a is located between the first substrate 211 and the rigid board portion 11 and abuts against both the first substrate 211 and the rigid board portion 11. At least one of the multiple chips 231 is fixed to the rigid board portion 11, and at least one of the multiple chips 231 is fixed to the first substrate 211. The first support member 22a is a first raised plate 227, which has a hollow structure, and at least one chip 231 is located inside the first raised plate 227. The chip 231 fixed to the first substrate 211 is electrically connected to the rigid board portion 11 using the first raised plate 227. The first raised plate 227 is a circuit board structure, and the first raised plate 227 may be fixed to the rigid board portion 11 by assembly or may be integrally molded with the rigid board portion 11 .

[0280] In this embodiment, the main control module 20 uses the first raised plate 227 to support the component placement space between the first substrate 211 and the rigid board portion 11, allowing the main control module 20 to integrate at least two component layers. In this way, the component placement density is increased, and the main control module 20 and the headset body 100 have a relatively high degree of component integration.

[0281] The main control module 20 further includes a plurality of chip matching components 232. At least one of the plurality of chip matching components 232 is fixed to the rigid board portion 11, and at least one of the plurality of chip matching components 232 is fixed to the first substrate 211.

[0282] 25 , all of the components secured to rigid board portion 11 are located on the side of rigid board portion 11 facing first substrate 211. Some of the components are located inside first raised plate 227, and some of the components are located outside first raised plate 227. In some other embodiments, all of the components secured to rigid board portion 11 are located on the side of rigid board portion 11 facing first substrate 211, and inside first raised plate 227. In still other embodiments, some of the components secured to rigid board portion 11 are located on the side of rigid board portion 11 facing first substrate 211, and some are located on the side of rigid board portion 11 away from first substrate 211.

[0283] 25 , some of the components secured to the first substrate 211 are located between the first substrate 211 and the rigid board portion 11, and some are located on the side of the first substrate 211 away from the rigid board portion 11. A first raised plate 227 is connected to the periphery of the first substrate 211, and the components secured to the side of the first substrate 211 facing the rigid board portion 11 are located inside the first raised plate 227. In some other embodiments, the components secured to the first substrate 211 are located between the first substrate 211 and the rigid board portion 11 or on the side of the first substrate 211 away from the rigid board portion 11.

[0284] 26 is a schematic diagram of the structure of the main control module 20 shown in FIG. 2 in the twelfth embodiment. The following mainly describes the differences between the twelfth embodiment and the above-described embodiments, and most of the content that is the same as the above-described embodiments will not be described again.

[0285] The main control module 20 includes a rigid-flexible circuit board 1 and a stack assembly 2. The rigid-flexible circuit board 1 includes a rigid board portion 11, and a first flexible board portion 12 and a second flexible board portion 13 connected to the rigid board portion 11. The stack assembly 2 is stacked on the rigid board portion 11. The stack assembly 2 includes an upper stack portion 2a and a lower stack portion 2b located on either side of the rigid board portion 11.

[0286] The upper stack unit 2a includes a first substrate 211, a first support member 22a, and multiple chips 231. The first substrate 211 and the rigid board unit 11 are stacked with a certain gap between them. The first support member 22a is located between the first substrate 211 and the rigid board unit 11 and abuts against both the first substrate 211 and the rigid board unit 11. At least one of the multiple chips 231 is fixed to the rigid board unit 11, and at least one of the multiple chips 231 is fixed to the first substrate 211. The first support member 22a is a first raised plate 227, which has a hollow structure, and at least one chip 231 is located inside the first raised plate 227. The lower stack unit 2b includes at least one chip 231 fixed to the side of the rigid board unit 11 away from the first substrate 211.

[0287] In this embodiment, at least one of the multiple chips 231 is fixed to the side of the rigid board portion 11 away from the first substrate 211, at least one of the multiple chips 231 is fixed to the side of the rigid board portion 11 facing the first substrate 211, at least one of the multiple chips 231 is fixed to the side of the first substrate 211 facing the rigid board portion 11, and at least one of the multiple chips 231 is fixed to the side of the first substrate 211 away from the rigid board portion 11. In other words, components are arranged on both sides of the rigid board portion 11 and on both sides of the first substrate 211. Therefore, the main control module 20 integrates four component layers. The component arrangement density is high, and the main control module 20 and the headset body 100 have a high degree of component integration.

[0288] The upper stack portion 2a further includes a first packaging layer 241. The first packaging layer 241 is located on the side of the first substrate 211 away from the rigid board portion 11 and packages at least one chip 231. The first packaging layer 241 may further package at least one chip matching component 232. The first packaging layer 241 may provide full-size packaging (as shown in FIG. 26 ) or partial packaging for components fixed on the side of the first substrate 211 away from the rigid board portion 11.

[0289] 27 is a schematic diagram of the structure of the main control module 20 shown in FIG. 2 in the thirteenth embodiment. The following mainly describes the differences between the thirteenth embodiment and the previous embodiments, and most of the content that is the same as the previous embodiments will not be described again.

[0290] The main control module 20 includes a rigid-flexible circuit board 1 and a stack assembly 2. The rigid-flexible circuit board 1 includes a rigid board portion 11, and a first flexible board portion 12 and a second flexible board portion 13 connected to the rigid board portion 11. The stack assembly 2 is stacked on the rigid board portion 11. The stack assembly 2 includes an upper stack portion 2a and a lower stack portion 2b located on either side of the rigid board portion 11.

[0291] The upper stack section 2a includes a first substrate 211, a second substrate 212, a first support member 22a, a plurality of third raised pillars 223, and a plurality of chips 231. The first substrate 211 and the rigid board section 11 are spatially stacked with a certain distance between them. The first support member 22a is located between the first substrate 211 and the rigid board section 11 and abuts against both the first substrate 211 and the rigid board section 11. The second substrate 212 is located on the side of the first substrate 211 away from the rigid board section 11. The second substrate 212 and the first substrate 211 are stacked with a certain distance between them. The plurality of third raised pillars 223 are located between the second substrate 212 and the first substrate 211 and abut against both the second substrate 212 and the first substrate 211. At least one of the multiple chips 231 is fixed to the rigid board portion 11, at least one of the multiple chips 231 is fixed to the first substrate 211, and at least one of the multiple chips 231 is fixed to the second substrate 212. The chip 231 fixed to the first substrate 211 is electrically connected to the rigid board portion 11 by using the first support member 22a. The chip 231 fixed to the second substrate 212 is electrically connected to the rigid board portion 11 by using the multiple third raised pillars 223, the first substrate 211, and the first support member 22a. The lower stack portion 2b includes at least one chip 231 fixed to the side of the rigid board portion 11 away from the first substrate 211.

[0292] The first support member 22a is a first raised plate 227, which has a hollow structure, and at least one chip 231 is located inside the first raised plate 227. The first raised plate 227 is a circuit board structure, which can be fixed to the rigid board portion 11 by assembly or can be integrally molded with the rigid board portion 11. The third raised pillar 223 can use the structure of the second pillar body 2202 described above.

[0293] The upper stack part 2a further includes a first packaging layer 241 and a second packaging layer 242. The first packaging layer 241 is located between the first substrate 211 and the second substrate 212 and is configured to package components between the first substrate 211 and the second substrate 212. The second packaging layer 242 is located on a side of the second substrate 212 away from the first substrate 211. The second packaging layer 242 may perform partial packaging (as shown in FIG. 27 ) or full-size packaging for components fixed on the side of the second substrate 212 away from the first substrate 211.

[0294] In this embodiment, components are arranged on both sides of rigid board portion 11, both sides of first substrate 211, and both sides of second substrate 212. Main control module 20 integrates six component layers. The component arrangement density is high, and main control module 20 and headset body 100 have a high degree of component integration. In another embodiment, components may be arranged on one side of one or more of rigid board portion 11, first substrate 211, or second substrate 212.

[0295] At least one second component 234 may be fixed to a side of the second substrate 212 away from the first substrate 211. The second component 234 is a component that is not suitable for plastic packaging. The second component 234 is located outside the second package layer 242. At least one first component 233 may be fixed to the rigid board portion 11. The first component 233 is a component that is not suitable for plastic packaging. The first component 233 is located outside the first raised plate 227.

[0296] 28 is a schematic diagram of the structure of the main control module 20 shown in FIG. 2 in the fourteenth embodiment. The following mainly describes the differences between the fourteenth embodiment and the previous embodiments, and most of the content that is the same as the previous embodiments will not be described again.

[0297] The main control module 20 includes a rigid-flexible circuit board 1 and a stack assembly 2. The rigid-flexible circuit board 1 includes a rigid board portion 11, and a first flexible board portion 12 and a second flexible board portion 13 connected to the rigid board portion 11. The stack assembly 2 is stacked on the rigid board portion 11. The stack assembly 2 includes an upper stack portion 2a and a lower stack portion 2b located on either side of the rigid board portion 11.

[0298] The upper stack section 2a includes a first substrate 211 and a first raised plate 227. The first substrate 211 and the rigid board section 11 are stacked with a certain distance between them. The first raised plate 227 is located between the first substrate 211 and the rigid board section 11 and abuts against both the first substrate 211 and the rigid board section 11. The lower stack section 2b includes a second substrate 212 and a second raised plate 228. The second substrate 212 is located on the side of the rigid board section 11 away from the first substrate 211, and the second substrate 212 and the rigid board section 11 are stacked with a certain distance between them. The second raised plate 228 is located between the second substrate 212 and the rigid board section 11 and abuts against both the second substrate 212 and the rigid board section 11.

[0299] The stack assembly 2 includes a plurality of chips 231. At least one of the plurality of chips 231 is fixed to the rigid board portion 11, at least one of the plurality of chips 231 is fixed to the first substrate 211, and at least one of the plurality of chips 231 is fixed to the second substrate 212. The first raised plate 227 has a hollow structure, and at least one chip 231 is located inside the first raised plate 227. The chip 231 fixed to the first substrate 211 is electrically connected to the rigid board portion 11 by using the first raised plate 227. The second raised plate 228 has a hollow structure, and at least one chip 231 is located inside the second raised plate 228. The chip 231 fixed to the second substrate 212 is electrically connected to the rigid board portion 11 by using the second raised plate 228.

[0300] In this embodiment, main control module 20 has a first substrate 211 secured to one side of rigid board portion 11 using a first raised plate 227, and a second substrate 212 secured to the other side of rigid board portion 11 using a second raised plate 228. In this manner, a stack structure having three layers of circuit boards is formed, and components are flexibly arranged on one or both sides of each of the three layer circuit boards to form a stack structure having at least three component layers. Therefore, main control module 20 has a high component arrangement density and a high degree of component integration.

[0301] For example, as shown in FIG. 28, at least one chip 231 and at least one chip matching component 232 are fixed to each side of the rigid board portion 11, at least one chip 231 and at least one chip matching component 232 are fixed to each side of the first substrate 211, and at least one chip 231 and at least one chip matching component 232 are fixed to the side of the second substrate 212 facing the rigid board portion 11, so that the main control module 20 forms a stack structure having five component layers.

[0302] 29 is a schematic diagram of the structure of the main control module 20 shown in FIG. 2 in the fifteenth embodiment. The following mainly describes the differences between the fifteenth embodiment and the previous embodiments, and most of the content that is the same as the previous embodiments will not be described again.

[0303] In this embodiment, at least one chip 231 and at least one chip matching component 232 may be fixed to the side of second substrate 212 away from rigid board portion 11, so that main control module 20 forms a stack structure having six component layers. Main control module 20 further includes a first packaging layer 241. First packaging layer 241 is located on the side of second substrate 212 away from rigid board portion 11. First packaging layer 241 may provide partial packaging (as shown in FIG. 29 ) or full-size packaging for the components fixed to the side of second substrate 212 away from rigid board portion 11.

[0304] 30 is a schematic diagram of the structure of the main control module 20 shown in FIG. 2 in the sixteenth embodiment. The following mainly describes the differences between the sixteenth embodiment and the previous embodiments, and most of the content that is the same as the previous embodiments will not be described again.

[0305] The main control module 20 includes a first substrate 211, a second substrate 212, a rigid-flexible circuit board 1, and a plurality of chips 231. The rigid-flexible circuit board 1 includes a rigid board portion 11, and a first flexible board portion 12 and a second flexible board portion 13 connected to the rigid board portion 11. The rigid board portion 11 has a hollow structure. The rigid board portion 11 is located within the earphone portion 1002 (see FIG. 4). The first flexible board portion 12 is located within the earphone portion 1002, and one end is connected to the rigid board portion 11. One end of the second flexible board portion 13 is connected to the rigid board portion 11, and the other end extends to the ear handle portion 1001 (see FIG. 4).

[0306] The first substrate 211 and the second substrate 212 are stacked at a certain distance from each other. The rigid board unit 11 is fixed between the first substrate 211 and the second substrate 212. At least one of the multiple chips 231 is fixed to the first substrate 211. At least one of the multiple chips 231 is fixed to the second substrate 212. The at least one chip 231 is located inside the rigid board unit 11. The chip 231 fixed to the first substrate 211 and the chip 231 fixed to the second substrate 212 are electrically connected to the rigid board unit 11.

[0307] In this embodiment, the rigid board portion 11 of the rigid-flexible circuit board 1 serves as a raised structure between the first board 211 and the second board 212, thereby forming a gap between the first board 211 and the second board 212. Components may be disposed on one or both sides of the first board 211 and one or both sides of the second board 212. Thus, the main control module 20 integrates at least two stacked component layers. In this manner, the component arrangement density is relatively high, and the main control module 20 and the headset body 100 have a high degree of component integration.

[0308] 30, at least one chip 231 and at least one chip matching component 232 are disposed on each side of the first substrate 211, and at least one chip 231 and at least one chip matching component 232 are disposed on each side of the second substrate 212. Components not suitable for plastic packaging may further be disposed on the first substrate 211 and / or the second substrate 212.

[0309] 31 is a schematic diagram of the structure of the main control module 20 shown in FIG. 2 in the seventeenth embodiment. The following mainly describes the differences between the seventeenth embodiment and the previous embodiments, and most of the content that is the same as the previous embodiments will not be described again.

[0310] In this embodiment, the main control module 20 further includes a first package layer 241, a second package layer 242, a third package layer 243, and a fourth package layer 244. The first package layer 241 is located on a side of the first substrate 211 facing the second substrate 212. The first package layer 241 is located inside the rigid board portion 11. The first package layer 241 packages at least one chip 231 and may further package at least one chip matching component 232. The second package layer 242 is located on a side of the first substrate 211 away from the second substrate 212. The second package layer 242 packages at least one chip 231 and may further package at least one chip matching component 232. At least one first component 233 may be further fixed to the side of the first substrate 211 away from the second substrate 212. The first component 233 is a component that is not suitable for plastic packaging. The first component 233 is located outside the second package layer 242.

[0311] The third package layer 243 is located on the side of the second substrate 212 facing the first substrate 211. The third package layer 243 is located inside the rigid board portion 11. The third package layer 243 packages at least one chip 231 and may further package at least one chip matching component 232. The fourth package layer 244 is located on the side of the second substrate 212 away from the first substrate 211. The fourth package layer 244 packages at least one chip 231 and may further package at least one chip matching component 232. At least one second component 234 may be further fixed to the side of the second substrate 212 away from the first substrate 211. The second component 234 is a component that is not suitable for plastic packaging. The second component 234 is located outside the fourth package layer 244.

[0312] 32 is a schematic diagram of the structure of the main control module 20 shown in FIG. 2 in the eighteenth embodiment. The following mainly describes the differences between the eighteenth embodiment and the previous embodiments, and most of the content that is the same as the previous embodiments will not be described again.

[0313] The main control module 20 includes a first substrate 211, a second substrate 212, a third substrate 213, a rigid-flexible circuit board 1, a plurality of first raised pillars 221, and a plurality of chips 231. The rigid-flexible circuit board 1 includes a rigid board portion 11 and a first flexible board portion 12 and a second flexible board portion 13 connected to the rigid board portion 11. The rigid board portion 11 has a hollow structure. The first substrate 211 and the second substrate 212 are stacked with a certain gap between them. The rigid board portion 11 is fixed between the first substrate 211 and the second substrate 212. The third substrate 213 is located on the side of the first substrate 211 away from the second substrate 212. The third substrate 213 and the first substrate 211 are stacked with a certain gap between them. A plurality of first raised pillars 221 are fixed between the third substrate 213 and the first substrate 211. For the first raised pillars 221, please refer to the related description of the second pillar body 2202 (see FIG. 8).

[0314] At least one chip 231 and at least one chip matching component 232 are distributed on each of the two sides of the first substrate 211, the two sides of the second substrate 212, and the two sides of the third substrate 213. The components fixed to the third substrate 213 are electrically connected to the rigid board portion 11 by using a plurality of first raised pillars 221 and the first substrate 211.

[0315] The main control module 20 includes a first package layer 241, a second package layer 242, a third package layer 243, a fourth package layer 244, and a fifth package layer 245. The first package layer 241 is located on the side of the first substrate 211 facing the second substrate 212. The first package layer 241 is located inside the rigid board portion 11. The first package layer 241 packages at least two components. The second package layer 242 is located between the first substrate 211 and the third substrate 213. The second package layer 242 packages a plurality of first raised pillars 221 and components located between the first substrate 211 and the third substrate 213. The third package layer 243 is located on the side of the third substrate 213 away from the first substrate 211. The third package layer 243 packages at least two components. At least one first component 233 may be further fixed to a side of the third substrate 213 away from the first substrate 211. The first component 233 is a component that is not suitable for plastic packaging. The first component 233 is located outside the third package layer 243.

[0316] The fourth package layer 244 is located on the side of the second substrate 212 facing the first substrate 211. The fourth package layer 244 is located inside the rigid board portion 11. The third package layer 243 packages at least two components. The fifth package layer 245 is located on the side of the second substrate 212 away from the first substrate 211. The fifth package layer 245 packages at least two components. At least one second component 234 may be further fixed to the side of the second substrate 212 away from the first substrate 211. The second component 234 is a component that is not suitable for plastic packaging. The second component 234 is located outside the fifth package layer 245.

[0317] In this embodiment, the main control module 20 includes three stacked circuit board layers (first board 211, second board 212, and third board 213). Components can be placed on both sides of each circuit board, resulting in six integrated component layers. The component placement density is high, and the main control module 20 and headset body 100 have a high degree of component integration.

[0318] The above description is merely a specific implementation of the present application and is not intended to limit the scope of protection of the present application. Any modifications or replacements that can be easily understood by those skilled in the art within the technical scope disclosed in the present application shall be included in the scope of protection of the present application. Where no contradiction occurs, the embodiments of the present application and the features within the embodiments may be combined with each other. Therefore, the scope of protection of the present application shall be subject to the scope of protection of the claims.

Claims

1. A wireless headset including an ear handle portion and an earphone portion connected to the ear handle portion, the wireless headset including a main control module, the main control module including a rigid-flexible circuit board, a first substrate, a first support member, a plurality of chips including a first chip and a second chip, and a first packaging layer; the rigid-flexible circuit board includes a rigid board portion, and a first flexible board portion and a second flexible board portion connected to the rigid board portion, the rigid board portion being located within the earphone portion, the first flexible board portion being located within the earphone portion and having one end connected to the rigid board portion, one end of the second flexible board portion being connected to the rigid board portion and the other end extending to the ear handle portion; the first substrate and the rigid board portion are stacked on top of each other with a certain space between them, the first support member is located between the first substrate and the rigid board portion and abuts against each of the first substrate and the rigid board portion, and the first support member includes a plurality of first raised pillars, the plurality of first raised pillars are located between the rigid board portion and the first substrate, and are arranged in a peripheral region of the rigid board portion and fixed to the rigid board portion; the first chip is fixed to the rigid board portion, and the second chip is fixed to the first substrate and electrically connected to the rigid board portion by using the first support member; A wireless headset, wherein the first package layer is located between the rigid board portion and the first substrate, and the first package layer packages the plurality of first raised pillars and the first chip within the first package layer.

2. 2. The wireless headset of claim 1, wherein the rigid board portion includes a first surface facing the first substrate, the first surface including a first package area and a first non-package area, the first package layer being located within the first package area, and the first non-package area being located around the first package area.

3. The wireless headset of claim 2 , wherein the main control module further includes at least one first component, the at least one first component secured to the first unpackaged area.

4. 4. The wireless headset of claim 1, wherein the first substrate is welded to the plurality of first raised pillars, and the main control module further includes a second packaging layer located on a side of the first substrate away from the rigid board portion, and the second packaging layer packages at least one of the chips on the first substrate.

5. the first support member further includes a plurality of second raised pillars, the plurality of second raised pillars being fixed to a side of the first substrate facing the rigid board portion, the plurality of second raised pillars being welded to the plurality of first raised pillars in a one-to-one correspondence; 4. The wireless headset of claim 1, wherein the main control module further includes a second packaging layer and a third packaging layer, the second packaging layer being located on a side of the first substrate facing the rigid board portion, the second packaging layer packaging at least one of the chips on the first substrate, and the third packaging layer being located on a side of the first substrate away from the rigid board portion, the third packaging layer packaging at least one of the plurality of second raised pillars and the chip on the first substrate.

6. 6. The wireless headset of claim 4 or 5, wherein the main control module further includes at least one second component, the at least one second component being fixed to a side of the first substrate away from the rigid board portion and located outside the second package layer.

7. the main control module further includes a second substrate, a second package layer, a third package layer, and a plurality of third raised pillars; the first substrate is welded to the plurality of first raised pillars, the chip fixed to the first substrate is located on a side of the first substrate away from the rigid board portion, the second substrate is located on a side of the first substrate away from the rigid board portion, the second substrate and the first substrate are stacked on each other with a certain space between them, and the plurality of third raised pillars are located between the second substrate and the first substrate and abut against each of the second substrate and the first substrate; the second package layer is located between the second substrate and the first substrate, and the plurality of third raised pillars and the chip fixed to the first substrate are packaged in the second package layer; 4. The wireless headset of claim 1, wherein at least one of the plurality of chips is packaged in the second packaging layer and fixed to the second substrate, the third packaging layer is located on a side of the second substrate away from the first substrate, at least one of the plurality of chips is packaged in the third packaging layer and fixed to the second substrate, and the chip fixed to the second substrate is electrically connected to the rigid board portion using the plurality of third raised pillars, the first substrate, and the plurality of first raised pillars.

8. the first package layer contacts the first substrate, and the main control module further includes a second package layer, the second package layer being secured to a side of the first substrate away from the rigid board portion; 4. The wireless headset according to claim 1, wherein a portion of the chip fixed to the first substrate is packaged in the first package layer, and a portion of the chip is packaged in the second package layer.

9. 4. The wireless headset of claim 1, wherein the main control module further includes a fourth packaging layer, the fourth packaging layer being fixed to a side of the rigid board portion away from the first substrate, and at least one of the chips fixed to the rigid board portion being packaged in the fourth packaging layer.

10. 4. The wireless headset of claim 1, wherein the main control module further includes a third substrate and a second support member, the third substrate being located on a side of the rigid board portion away from the first substrate, the third substrate and the rigid board portion being stacked on top of each other with a certain gap between them, the second support member being located between the third substrate and the rigid board portion and abutting against each of the third substrate and the rigid board portion, at least one of the plurality of chips being fixed to the third substrate, and the chip fixed to the third substrate being electrically connected to the rigid board portion using the second support member.

11. 2. The wireless headset of claim 1, wherein the first support member is a first raised plate, the first raised plate having a hollow structure, and at least one of the tips is located inside the first raised plate.

12. 12. The wireless headset of claim 11, wherein the main control module further includes a second substrate and a second raised plate, the second substrate being located on a side of the rigid board portion away from the first substrate, the second substrate and the rigid board portion being stacked on top of each other with a certain gap between them, the second raised plate being located between the second substrate and the rigid board portion and abutting against each of the second substrate and the rigid board portion, at least one of the plurality of chips being fixed to the second substrate, the chip fixed to the second substrate being electrically connected to the rigid board portion using the second raised plate, the second raised plate having a hollow structure, and at least one of the chips being located inside the second raised plate.

13. the earphone portion includes a receiver module, the first flexible board portion is connected to the receiver module, the ear handle portion includes a battery, and the second flexible board portion is connected to the battery; 13. The wireless headset of claim 1, wherein the plurality of chips include a microcontroller unit chip, a power management chip, and an audio chip, each of the power management chip and the audio chip being electrically connected to the microcontroller unit chip, the receiver module being electrically connected to the audio chip by using the first flexible board portion and the rigid board portion, and the battery being electrically connected to the power management chip by using the second flexible board portion and the rigid board portion.

14. the rigid-flexible circuit board includes at least one flexible dielectric layer and at least two first conductive layers, the at least one flexible dielectric layer and the at least two first conductive layers are stacked, one flexible dielectric layer is disposed between two adjacent first conductive layers, and the at least one flexible dielectric layer and the at least two first conductive layers form the first flexible board portion, an intermediate layer of the rigid board portion, and the second flexible board portion; 14. The wireless headset of claim 1, wherein the rigid-flexible circuit board further includes at least two rigid dielectric layers and at least two second conductive layers, the at least two rigid dielectric layers and the at least two second conductive layers being stacked, a portion of the at least two rigid dielectric layers being located on one side of the intermediate layer of the rigid board section, another of the rigid dielectric layers being located on the other side of the intermediate layer of the rigid board section, a portion of the at least two second conductive layers being located on one side of the intermediate layer of the rigid board section, another of the second conductive layers being located on the other side of the intermediate layer of the rigid board section, one rigid dielectric layer being disposed between two adjacent second conductive layers on the same side of the intermediate layer of the rigid board section, and one rigid dielectric layer being disposed between a second conductive layer adjacent to the intermediate layer of the rigid board section and the intermediate layer of the rigid board section.

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