Monolithic spring contacts for charged particle traps.

Abstract

To provide a module for a trap for charged particles (e.g., ions), a method for manufacturing such a module, a trap including the module, and a method for manufacturing such a modular trap.SOLUTION: A module comprises a monolithic body made of a non-conductive substrate and electrodes arranged on a portion of the surface of the monolithic body. A portion of the monolithic body forms a spring element. A conductive area is positioned on the surface of the spring element, covering a portion of the surface, and is conductively connected to the electrode. The spring element is configured to compress when pressure is applied to the conductive area.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This disclosure relates to a module for generating a trap for charged particles and a method for manufacturing such a module.

[0002] Ion traps, or traps for trapping charged particles in general (hereinafter referred to as "traps"), are typically electrically connected or connectable to other external devices or systems. Furthermore, it is sometimes desirable or necessary to electrically connect different parts of the trap. Both objectives are typically achieved by using wire bonding, soldering, pogo pins, elastomeric connectors, fuzz buttons, metal springs, or the like.

[0003] For example, in ion traps fabricated and manufactured from non-conductive bulk materials that are metallized to define the spatial structure of the electrodes, adding such connections can complicate the manufacturing process, for example, requiring more steps in the manufacturing process, which can result in longer production times and additional sources of product defects.

[0004]

[0004] It would therefore be desirable to design a simpler trap and corresponding manufacturing process.

[0005]

[0005] The present disclosure facilitates providing electrical connections to a trap module.

[0006] For example, a module for a trap for charged particles (e.g., ions), a method for manufacturing such a module, a trap including the module, and the manufacture of such a modular trap are provided. The trap module includes a monolithic body made of a non-conductive substrate and an electrode disposed on a portion of a surface of the monolithic body. The portion of the monolithic body forms a spring element. A conductive region is disposed on the surface of the spring element, covering a portion of the surface, and conductively connected to the electrode. The spring element is configured to compress when pressure is applied to the conductive region.

[0007] These and other features and characteristics of the presently disclosed subject matter, as well as the method of operation and function of the associated elements of structure, combination of parts, and economies of manufacture, will become more apparent from a consideration of the following description and appended claims, taken in conjunction with the accompanying drawings, all of which form a part of this specification. It is to be expressly understood, however, that the drawings are for the purposes of illustration and description only and are not intended as a definition of the limits of the disclosed subject matter. As used in this specification and claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. [Brief explanation of the drawings]

[0008]

[0008] An understanding of the nature and advantages of various embodiments may be realized by reference to the following figures. [Figure 1] 1 is a cross-sectional view illustrating an exemplary spring structure. [Figure 2] FIG. 10 is a cross-sectional view illustrating another exemplary spring structure. [Figure 3] 1 is a schematic diagram of the electrode portions and trapping zone of an exemplary ion trap. [Figure 4] 1 is a schematic diagram of an exemplary conductive interface between a trap module and an external device. [Figure 5] 10 is a schematic diagram of another exemplary conductive interface between a trap module and an external device. FIG. [Figure 6] FIG. 1 is a schematic diagram showing a conductive interface for bonding the trap to an external substrate, e.g., a chip. [Figure 7] FIG. 1 is a schematic diagram showing n trap modules that can be cascaded together to form a modular trap for charged particles such as ions. [Figure 8] FIG. 1 is a flow diagram illustrating an exemplary manufacturing method for manufacturing a trap module. [Figure 9] FIG. 1 is a flow diagram illustrating an exemplary manufacturing method for manufacturing a trap. [Figure 10] FIG. 1 is a perspective view of an exemplary cantilever spring. [Figure 11] FIG. 11 is a cross-sectional side view of the exemplary cantilever spring of FIG. 10. [Figure 12] FIG. 11 is a top view of the exemplary cantilever spring of FIG. 10. [Figure 13] FIG. 1 is a perspective view of an exemplary spiral spring. [Figure 14] FIG. 14 is a cross-sectional side view of the exemplary cantilever spring of FIG. 13. [Figure 15] FIG. 14 is a side view of the exemplary cantilever spring of FIG. 13.

[0009] Like reference numbers and designations in the various figures indicate like elements according to specific exemplary embodiments.

[0010] For purposes of the following description, the terms "end," "upper," "lower," "right," "left," "vertical," "horizontal," "top," "bottom," "lateral," "longitudinal," and derivatives thereof, shall refer to the disclosed subject matter as oriented in the drawings. However, it should be understood that the disclosed subject matter may assume various alternative variations and step sequences, unless expressly specified to the contrary. It should also be understood that the specific devices and processes illustrated in the accompanying drawings and described in the following specification are merely exemplary embodiments or aspects of the disclosed subject matter. Accordingly, specific dimensions and other physical characteristics related to the embodiments or aspects disclosed herein should not be considered limiting, unless otherwise indicated.

[0011] As used herein, aspects, components, elements, structures, acts, steps, functions, instructions, and the like should not be construed as critical or essential unless expressly stated as such. Also, as used herein, the articles "a" and "an" are intended to include one or more items and may be used interchangeably with "one or more" and "at least one." Furthermore, as used herein, the term "set" is intended to include one or more items (e.g., related items, unrelated items, combinations of related and unrelated items, etc.) and may be used interchangeably with "one or more" or "at least one." When only one item is intended, the term "one" or similar language is used. Also, as used herein, terms such as "has," "have," and "having" are intended to be open-ended terms. Furthermore, the phrase "based on" is intended to mean "based at least in part on," unless expressly stated otherwise.

[0012]

[0012] Traps made from non-conductive bulk materials that are metallized to form and define the spatial structure of the electrodes typically must use additional components or processes to provide electrical connections to the trap's external electrical interface, such as a chip carrier or socket, and / or to provide electrical connections between components of a trap comprised of two or more components. When referring to a "conductive" material herein, what is meant is electrical conductivity.

[0013] According to one embodiment, a trap module is provided, the module comprising a monolithic body made of a non-conductive substrate and an electrode disposed on a surface of the monolithic body and covering a portion of the surface.

[0014] The trap is a trap for charged particles, such as a trap for ions. However, the disclosure is not limited thereto and the trap may be a trap for protons, electrons, etc. When referring to a non-conductive material, such a material is not necessarily a dielectric (electrical insulator) but may be, for example, a semiconductor. Example of a spring element

[0015] 1 shows a portion 100 of a trap module on the left side (a). A portion 150 of the monolithic body forms a spring element 110 (also referred to herein as a "spring"). The spring element 110 is an elastic element that may compress (contract) when in contact (under pressure) with an external object 170. The spring 110 may decompress when the contact (pressure) from another object is removed.

[0016] The conductive region 145 is disposed on the surface of the spring element 110, covers a portion of the surface, and is conductively connected to the electrode. The conductive connection to the electrode may be a metallization 140 on the surface of the monolithic material 150 of the trap module. However, the present disclosure is not limited to such a connection. Additionally or alternatively, the conductive connection may penetrate the monolithic material 150. In FIG. 1, the conductive region 145 of the spring 110 is a metallization forming a surface portion of the spring 110 that is fixed on the monolithic material 150 of the trap module. Fixation may be achieved by coating, gluing, etching, or any other technique known in the art, including providing an adhesive layer between the monolithic material and the conductive layer. As shown on the right side (b) of FIG. 1, when pressure is applied to the conductive region 145, the spring element is compressed (120) and forms a stable electrical connection with the external module 170. This may be achieved by applying pressure to bring the conductive region 145 of the spring 110 into contact with the conductive region 175 of the external module 170, where the external module 170 is, for example, another module of the same trap or another external device such as a socket or a chip or a substrate. The external module 170 may include a conductive port that includes the conductive region 175. The port may be configured to receive or engage the conductive region 145 of the spring of the trap module. It should be noted that the ion trap may be constructed as one monolithic trap module or by combining one or more monolithic trap modules.

[0017] FIG. 1 further illustrates the non-conductive material (bulk material in this example) 150 of the trap module and the recess 160 formed therein. The left side (a) of FIG. 1 illustrates the uncompressed spring 110, while the right side (b) of FIG. 1 illustrates the compressed spring 110 in contact with the external module 170. The bottom (c) of FIG. 1 illustrates the recess. The compression of the spring may be achieved by a force applied to connect the external module 170 and the trap module (portion) 100. This disclosure is not limited to a particular method of generating the force. For example, the force may be applied by additional connecting means connecting the external module 170 and the trap module 100. Such connecting means may be one or more screws, bolts, fasteners, etc. Some additional possible connecting means include a snap mechanism, an adhesive layer (e.g., glue), or any other state-of-the-art mechanical connection. In general, such connections may be detachable (allowing for reuse of the module in other assemblies) or fixed.

[0018]

[0018] In FIG. 1, the spring element 110 is a cantilever. As shown in part (c) of FIG. 1, the cantilever may be formed by extending a portion of the flat surface 151 of the monolithic body 150 above the surface 180 of the monolithic material 150. In FIG. 1, the cantilever 110 extends above the recess 160 in the surface 151-152 of the monolithic body 150. However, it should be noted that this is merely one example that can provide the advantage of efficient production. However, the present disclosure is not limited thereto. In general, the cantilever may protrude from the surface 151 of the monolithic body 150 without a recess. Furthermore, the spring element 110 does not necessarily have to be a cantilever and may have any shape that can compress / decompress the conductive portion 145 and apply external pressure to the conductive portion 145. For example, the spring may have a helical form or any other compressible and decompressible form formed from and forming part of the monolithic body material 150.

[0019] 1, in one possible configuration, the spring element 110 is configured to protrude above a flat surface 151 of a monolithic body 150 on which the spring element 110 is formed, and to reduce the protrusion 131 when pressure is applied to the conductive region 145 of the spring 110. In FIG. 1(b), the compressed spring element 110 still protrudes above the surface 151 of the monolithic body such that the conductive region 145 of the spring 110 forms the tip of the trap module (e.g., comprises the highest portion on the monolith relative to the surface 151 from which the spring 110 extends). In particular, the protrusion 131 has been reduced to a smaller protrusion 132 in this example. However, the present disclosure is not limited to reducing the protrusion to a smaller protrusion. The reduction may result in the protrusion 131 being flattened to the level of the flat surfaces 151 and / or 152, and even in the spring element 110 being pressed below the flat surfaces 151 and / or 152 of the monolithic body 150.

[0020]

[0020] Part (c) of Figure 1 shows a particular configuration of spring 110. In particular, monolithic material 150 has a first flat surface portion 151 extending as the outer (upper side facing outward from the monolith) portion of the cantilever forming spring 110. Monolithic material 150 has a recess 160, indicated by rectangle 164, formed therein. In this exemplary recess, the cantilever is a cavity formed in the monolithic material by the inner (lower side facing inward from the monolith) portion of the cantilever and a hollow portion below the cantilever. In this example, the cantilever extends toward, but does not contact, a second flat surface 152 of monolith 150, which is in the same plane as first flat surface 152. However, in general, surfaces 151 and 152 need not be coplanar. In Figure 1(c), a portion 185 of the cavity surface facing the cantilever is also covered with a conductive layer that continues to second surface 152. This may be caused by the specific configuration of the metallization process and is generally not necessary for the function of the trap. Furthermore, the second flat surface 152 may be covered by a conductive layer 184, which may have a counterpart conductive layer 174 on the outer surface 170. However, this additional conductive connection does not need to be present for functional purposes. This conductive connection may also be caused by a metallization / coating process in which the entire surface is coated unless masked / covered. Such a process may be less complex and more robust to imprecision.

[0021] FIG. 2 shows another possible configuration of the trap module portion 200 including the spring element 210. As can be seen, the configuration of FIG. 2 corresponds to the configuration of FIG. 1 set within the connecting recess 266 (see part (c) of FIG. 2). In this configuration, the spring element 210 does not protrude above the flat surface 230 of the monolithic body 250. Rather, the spring element 210 is recessed within the connecting recess 266 such that, when uncompressed, all of the spring element 210 is positioned below the flat surface 230 at 231, as seen in the left side (a) of FIG. 2. In this example, when the spring element 210 is compressed (shown in the right side (b) of FIG. 2), the spring element is still positioned below the flat surface 230 at 232, further below than the uncompressed spring 210. An external module 270 presses against the conductive region of the spring 210, compressing the string 210. In this example, the outer module 270 includes flat portions 271 and 272 and a protruding portion 275 . It should be noted that providing the springs 110, 210 at least partially within the recesses 180, 280 may have the advantage of improving mechanical robustness, for example, it may prevent (or reduce the likelihood of) the springs tearing off. Additionally, the recesses 180, 280 may provide a means for mechanically aligning the trap module relative to another trap module, an external module, or the like.

[0022]

[0022] The protruding portion 275 has a height and shape that fit into the connecting recess 266. In other words, the rectangular portion 275 has a form that is formed (configured) to be housed within the equally rectangular connecting recess 266. However, the cross section of the connecting recess 266 and / or the protruding portion 275 does not have to be rectangular, and may include or be rounded, or may have any other shape.

[0023]

[0023] Similar to FIG. 1, FIG. 2 further shows that the monolithic body 250 is metallized 240. The spring 210 in this example is also a cantilever extending over a spring recess 260, which may be a cavity (hollow space) formed in the monolithic material 250. Furthermore, the second flat portion 272 of the outer module 270 in FIG. 2 is covered with a conductive layer, as is the second flat portion 232 of the monolithic material 250. The trap portion may engage with the outer module 270 by stacking the second flat portion 232 of the trap onto the second flat portion 272 of the outer module 270 (if they are covered with a conductive material, a conductive connection may be established between them). Thus, the protruding portion 275 (at least partially covered with a conductive material) of the outer module 270 applies pressure to the conductive region of the spring 220, compressing the spring 220 and forming a conductive connection.

[0024] 1 and 2 show only examples of string structures that do not limit the present disclosure. Any elastic element having a conductive region formed from the monolith of the trap module may be provided to cause compression of the string by pressure on the conductive region.

[0025] For example, in both Figures 1 and 2, the conductive regions are located on the outer surface of the spring element facing away from the ion trap module. While this feature may facilitate fabrication, particularly for securing the conductive layer on a monolithic material, it is also conceivable to provide the conductive regions on the inner surface of the spring and / or on the cavity surface 180, 280 instead. In that case, an external module may be accommodated within the cavity 180 so as to compress the spring in an outward direction (away from the trap) by applying pressure to the inner portion of the spring 110, 210. In addition to properties important for ion traps, a certain tensile strength may be desirable to fabricate springs small enough to facilitate integration / miniaturization. For example, for fused silica material, the Young's modulus is 72.5 GPa, and a typical tensile strength is 50 MPa. For small dimensions (as specified herein) and, more importantly, for fabrication processes that result in fewer surface defects, tensile strengths of up to 10 GPa have been observed. However, it should be noted that these are merely exemplary values ​​that may vary, as will be apparent to those skilled in the art.

[0026] In any of the above examples, the non-conductive substrate (monolithic material 150, 250) is made of glass, fused silica, sapphire, diamond, silicon, ceramic, etc. In general, a desirable characteristic of the material forming the monolith 150, 250 may be a particular tensile strength in order to produce a sufficiently small spring (depending on the requirements of the implementation).

[0027] For example, a spring made from fused silica with the following dimensions: lever thickness 15 μm, lever length 250 μm, and lever width 100 μm, when subjected to a force of 0.04 N, will have a maximum stress of 1 GPa and a maximum extension of 60 μm. The spring constant is approximately 1 N / mm. Note that the metallization of the cantilever can change the mechanical properties. As will be apparent to those skilled in the art, these values ​​are merely exemplary. Different materials and targets may be used to produce a functional spring.

[0028]

[0028] It should be noted that in general, a multi-layer metal structure may be used for the coating. For example, some layer(s) may be used as tie layers, some as diffusion barriers, etc. These layers can be taken into account when designing the spring, along with the actual monolithic material (and contact metal layers).

[0029] The conductive material covering a portion of the surface of the trap may be any conductive material such as gold, silver, platinum, copper, niobium, aluminum, various alloys, etc. In general, it may be desirable to provide a conductive material that is corrosion resistant. An embodiment of a trap for charged particles including a trap module

[0030]

[0030] The trap module may be a complete trap body including electrodes, or the trap module may be only a part of a trap including a portion of the trap body and at least one electrode for creating a trap zone.

[0031] For example, the trap module may be (part of) an ion trap that is a Paul trap. A schematic example of the components of a Paul trap is shown in FIG. 3. FIG. 3 shows four trap body parts 310, 320, 330, and 340 regularly arranged around a trapping zone 350. Each part of the trap body may carry an electrode. For example, the tip 390 (indicated by the dotted circle) of the body part 310 may be coated with a conductive material forming an electrode. Similar tip electrodes may be provided on the remaining three parts 320, 330, and 340 of the trap body. It should be noted that one or more of the body parts 310, 320, 330, and 340 may carry side electrodes on one or both of their sides, as indicated by the respective dotted circles 381 and 382. Each of the body portions 310, 320, 330, and 340 may be held in place by any means, for example a common monolithic frame or a frame made up of modules joined together.

[0032] In general, the trapping module may include an arrangement of direct current (DC) and radio frequency (RF) electrodes, or portions of such arrangements, for trapping charged particles in the trapping zone 390. Note that FIG. 3 illustrates a three-dimensional (3D) Paul trap for charged particles. However, the present disclosure is not limited thereto. The trap for charged particles may be a surface trap or another type of trap.

[0033] A trap module having a spring formed from a monolithic material as described with reference to FIGS. 1 and 2 may be a trap module that is the basic building block of a trap. In that case, a trap may be constructed by cascading two or more such trap modules. To provide the possibility of cascading two or more trap modules, it may be advantageous for a trap module as described below to further comprise a pressure element (such as protruding portion 275) having a conductive surface and conductively connected to an electrode, ground, or the like. The trap module is the first module of a complete trap. The first module is also configured to be mechanically joined to a second module of the ion trap, which may have a structure similar to the first module (including the pressure element). This makes it possible to prepare a single type of trap module and obtain a trap by cascading multiple trap modules of the same type. However, the present disclosure is not limited thereto. The second trap module may be a trap module (not necessarily including a pressure element) as described with reference to FIGS. 1 or 2. In general, the pressure element of the first module of the ion trap is conductively connected to the spring element of the second module of the ion trap.

[0034] 4 shows an ion trap 400 formed by two trap modules, namely, a first trap module (trap section 1) 410 and a second trap module (trap section 2) 420. The two trap modules 410 and 420 are conductively connected via a connecting portion 450. A dashed-dotted line 405 indicates the dividing line between the first trap module 410 and the second trap module 420. As can be seen from this exemplary diagram, each trap module (410, 420) includes two electrode body portions 480. After connecting the trap modules, an ion trap 400, which is a Paul trap, is obtained.

[0035] 4, the first trapping module 410 (above line 405) and the second trapping module 420 (below line 405) are different in structure. However, as noted above, the two trapping modules can have the same structure, for example, the same structure as the second trapping module 420 (if a spring connection to the trap outer module 470 is desired), or the same structure as the first trapping module 410.

[0036] Trap 400 may be an ion trap, or generally any trap for trapping charged particles, comprising a trap first module 410, which may be a module as shown in or described with reference to Figures 1 or 2. Trap 400 further comprises an ion trap second module 420 configured to be mechanically joined (see connection 450) to ion trap first module 410. Second module 420 comprises 1) an electrode (which may be monolithic) disposed on a surface of the second ion trap module and covering a portion of that surface, and 2) a pressure element having a conductive surface and conductively connected to the electrode.

[0037]

[0037] Electrode(s) may cover the tip and / or sides of the electrode body 480. The pressure element may be similar to the protrusion 275 of FIG. 2, or may simply be a surface for applying pressure to the springs 110, 210 of the first module. The first module 410 of the ion trap 400 and the second module 420 of the ion trap 400 may be mechanically coupled, such that the pressure element of the second module 420 of the ion trap 400 applies pressure to a conductive region (not shown in FIG. 4) of the first module 410 of the ion trap. In response, the electrodes of the first module 410 and the second module 420 are electrically connected. For example, two or more electrodes of the trap modules may be connected to ports for connection to, for example, an RF or DC drive source, or may be directly connected to an RF or DC drive source.

[0038] 4 comprises a connection means (interface) 460 for connecting with an external module 470 (generally an external or outer interface), which may be any external object to which the trap 400 is conductively connected.

[0039] For example, a trap assembly is provided that includes at least one trap module (or a trap module, which is a trap with a monolithic body) as described with reference to FIGS. 1 and 2. The trap assembly also includes a chip carrier or socket for mounting the ion trap module, the chip carrier or socket including a pressure element having a conductive surface configured to be mechanically coupled to the trap module (e.g., by a connection interface 460). The chip carrier or socket may correspond to the external module 470 in FIG. 4. In the assembly, the trap module and the chip carrier or socket are mechanically coupled such that the pressure element applies pressure to the conductive region of the trap module. Thus, one or more electrodes of the trap module 400 are electrically connected to the chip / socket 470.

[0040]

[0040] It should be noted that Figure 4 shows two trap modules 410 and 420, each trap module including two electrodes. However, the present disclosure is not limited to this. Other types of modularity can be provided. For example, each trap module can have a single electrode, or each module can have half of two electrodes, etc. It may be advantageous to provide trap modules with the same structure (shape, size). In this way, manufacturing may be easier. Nevertheless, it is contemplated that trap modules may include different numbers of electrodes.

[0041] FIG. 5 shows a schematic diagram of another example of two trapping modules 510 and 520. In this example, each trapping module 510 and 520 is a standalone trap including four electrode assemblies with one or more electrodes, as shown in FIG. 3. In other words, each trapping module 510 and 520 is capable of trapping ions when appropriately driven, i.e., each trapping module has its own trapping zone. The two trapping modules 510 and 520 are connected using a connecting portion 530. The connecting portion 530 may correspond to a spring, as shown in FIG. 1 or 2, in one module and a pressure means for applying pressure to the spring in the other module. While FIG. 5 shows two connected trapping modules 510 and 520, the present disclosure is not limited thereto and may be used to connect three or more trapping modules similar to the trapping modules 510 and 520 in this manner.

[0042] 5, the trap modules 510 and 520 also include conductive connecting portions 540 and 550, respectively. The connecting portions 540 and 550 serve to connect the respective trap modules 510 and 520 to an external module 560. As described with reference to FIG. 4, the external module may be a socket (or plug) or a chip substrate or chip configured to receive a trap or a trap module. The connecting portions 540 and 550 may correspond to springs or portions that apply pressure to a spring, as described with reference to FIGS. 1 and 2.

[0043] FIG. 6 shows a schematic diagram of a trap assembly 600 including a trap module 620 and an external module 670, mechanically connected to each other by a mechanical connection 650 and electrically connected to each other by a connection portion 640 corresponding to a spring or a portion that applies pressure to the spring, as described with reference to FIGS. 1 and 2 (the spring may be on the trap module 620, and the portion that applies pressure to the spring may be on the external module 670). The mechanical connection 650 applies pressure to the spring, thereby creating an electrical connection. The mechanical connection may be permanent or removable. For example, the mechanical connection 650 may be a fastener that stacks and presses the trap module 620 and the external module 670 together. However, the invention is not limited thereto. Some further exemplary means for mechanical connection include screws, an adhesive (e.g., glue) applied between the trap module and the external module, a snap mechanism formed from the bulk on the trap and / or the external module, etc.

[0044] FIG. 7 schematically illustrates a trap assembly 700 having n cascaded trap modules 700_1 through 700_n. Each of the trap modules 700_1 through 700_n may have the configuration described above with reference to FIGS. 1 and 2. As shown for trap module 700_n, each of these modules may include a plug connection portion 720_n including a spring (e.g., 110, 210) and a socket connection portion 710_n configured to apply pressure to the plug connection portion 710_n when connected. Similar portions are shown schematically for the remaining trap modules 700_1, 700_2, ..., 700_(n-1). Note that two cascaded trap modules may be connected by more than one connection portion at the same time. For example, each trap module i may have connection portions 710_i and 730_i to which the two trap modules are connected. Both of these connections may be of the same type (plug or socket), or one may be of the plug type and the other of the socket type.

[0045]

[0045] Figure 7 shows an example in which trapping modules 700_i (i = 710_1 to 710_n) are cascaded in the z-axis direction. In this way, the trapping modules are stacked along the axis along which the trapping zone extends. Therefore, by stacking more trapping modules, it is easy to extend the length of the trapping zone.

[0046] However, the present disclosure is not limited in this respect. Additionally or alternatively, trapping modules may be cascaded in the x-axis direction or the y-axis direction (orthogonal to the z-axis direction). Such a stack is illustrated for two trapping modules in FIG. 5. Such an arrangement can facilitate the formation of parallel trapping zones. Trap manufacturing

[0047] 8 is a flow diagram of a method 800 for fabricating a module of a trap. Method 800 includes step 810 of forming a monolithic body (e.g., 150, 160, 410, 420, 510, 520, 620, 700_1 through 700_n) from a non-conductive substrate, including forming a spring element (e.g., 110, 210) on a portion of the monolithic body, the spring element configured to compress when pressure is applied to the first spring region. Method 800 further includes step 820 of forming an electrode (e.g., 381, 382, ​​390) and a first spring region (e.g., 145) overlying a portion of the monolithic body surface. Method 800 further includes step 830 of forming an electrical connection between the electrode and the first spring region (e.g., 145).

[0048]

[0048] Note that step 830 does not necessarily have to be a separate manufacturing step. For example, the conductive layer and / or the first spring region of the electrode may be continuous to form an electrical connection, thereby allowing them to be manufactured in a single manufacturing step.

[0049] For example, the monolithic body may be formed 810 via selective laser etching (SLE), laser milling, ion beam milling, or by additive manufacturing. The materials described above may be used with these techniques.

[0050] For example, the step 820 of forming the electrode and first spring region covering a portion of the surface of the monolithic body is performed by coating a metal-based material (e.g., gold, niobium, silver, aluminum, etc., as described above). It should be noted that the step 830 of forming a connection between the electrode and the first spring region may be part of step 820, and the connection may be coated on the surface of the monolithic body. In general, any of the known metal coating techniques may be used, such as physical vapor deposition, electroplating, sputtering, electron beam evaporation, etc.

[0051] However, the present disclosure is not limited to connections between electrodes and first spring regions coated on the surface of the monolithic body. The connections may also be made through the monolithic body as through vias. This may be performed as part of step 810 of forming the monolithic body. In an exemplary embodiment, fabrication includes forming the spring as a cantilever, as described above with reference to FIG. 1 or FIG. 2.

[0052]

[0052] Figure 9 illustrates a method 900 for fabricating an ion trap. Method 900 involves mechanically joining a plurality of trap modules (such as those described in any of the examples above) in a cascade (one following the other, i.e., connected to the other). For every two adjacent modules, a first module (e.g., 410, 510, 700_k) and a second module (e.g., 420, 520, 700_(k+1)) are cascaded together, with the pressure element of the first module of the ion trap conductively connected to the spring element of the second module of the ion trap, where k is an integer between 1 and n-1. Exemplary embodiments of some springs

[0053] 1 and 2, a cross-sectional side view of a spring is shown schematically. FIG. 10 shows an exemplary perspective view of a possible exemplary embodiment of a cantilever spring. In particular, a cantilever spring 1050 is formed on a flat surface portion 1000 made of the same monolithic material. The range of forces that can be applied to such a spring may be 0.01 to 1 N. As can be seen from FIG. 10, the spring 1050 has a slightly different shape than the spring shown in FIGS. 1 and 2.

[0054] In particular, as shown in FIG. 11 , the monolithic material 1100 forms a spring (1150, 1155) above the recess 1130. The spring has a raised end portion 1150 above a (substantially) flat portion 1155 of the spring. It may be this raised end portion 1150 that is used to form a connection with another trap module or an external module by being compressed toward the recess 1130. The entire spring, including both portions 1150 and 1155, may be metal coated as already described above with reference to FIGS. 1 and 2. Some design parameters to consider when designing the spring are the thickness 1110 of the spring and the length of the compressible cantilever portion 1155. These design parameters may be found based on the desired size of the spring, based on the monolithic material, based on the metal coating on the top of the spring (at least the compressible portion 1155), based on the desired force exerted by the spring when compressed, etc. Some illustrative and non-limiting exemplary values ​​have been provided above.

[0055]

[0055] Figure 12 shows a top view of the spring shown in Figures 10 and 11. Monolithic material 1100 forms the spring with connecting end portion 1150. Line 1270 indicates the line through which the cross section of Figure 11 is depicted.

[0056]

[0056] In top view, the spring has a substantially rectangular shape. Note that the width w of the spring shown in Figure 12 is merely exemplary. In general, the ratio of width w to length 1155 (plus possible end portions 1150) may vary (may be larger or smaller).

[0057]

[0057] Although the cantilever spring configuration may provide a simple structure, the spring may have a variety of different shapes. Figures 13-15 show another example where the spring has a helical shape.

[0058]

[0058] Figure 13 shows a perspective (3D) view of a helical spring 1330 formed from the monolithic material 1310 of the trap module and an end portion 1300 of the spring that may be metallized and provides a conductive (contact) portion that corresponds in function to spring portion 145 of Figure 1. By applying pressure to contact portion 1300, spring 1330 is compressed.

[0059]

[0059] Figure 14 shows a cross section of a helical spring containing four nested helices with two windings per helix. This configuration offers the advantage of a smaller footprint compared to a cantilever with a similar spring constant and maximum travel. Such a four-helical spring may be manufactured by any available process, including, for example, selective laser etching (SLE), or by additive manufacturing (e.g., 3D printing).

[0060] 15 shows a side view of spring 1330. Note that contact portion 1300 in this example is shown as rounded with maximum height in the middle. However, this is merely an example, and contact portion 1300 may be flat or have another shape. The rounding may improve the conductive connection.

[0061] 14 also shows exemplary dimensions of spring 1330, which are for illustrative purposes only and not limiting of the present disclosure. For example, the width of the spring is 0.20 mm, and the height of the spring (uncompressed) to the base of the contact portion 1300 is 0.26 mm. The thickness of the outer helix is ​​0.20 mm. The width of the inner notch is 0.08 mm. The range of forces that can be applied to such a spring may be 0.01 to 1 N.

[0062]

[0062] In summary, the present disclosure provides a technique for realizing one or more electrical connections to an electrical interface outside the trap or between different parts of the trap by: ● Creating a mechanical spring (e.g., 110, 210) located at the interface (e.g., 151, 152) between portions (e.g., 410, 420) of the trap (e.g., 400) or at the interface to the trap's outer interface (e.g., 470). This spring is monolithically formed from the same non-conductive bulk material from which the trap 400 is made. The thickness and shape of the spring are tailored to the elasticity and other material properties of the bulk material. The spring (e.g., 110 or 210) can either protrude (132) from the contact surface (151) or be recessed (231) into the bulk (250) if the opposing structure (270) protrudes (275). • Metallizing the surface of the resulting monolithic structure to create a conductive surface and simultaneously creating and defining the electrodes of the trap (e.g., 381, 382, ​​390) and establishing conductive connections to the contact surfaces of the springs. - Attaching and connecting the trap to an electrical interface (e.g., 460, 470, 540, 550, and 640) on the outside of the trap, or mechanically connecting the parts of the trap by physically mating their contact surfaces (e.g., 650). In this way, a mechanical spring is compressed and electrical contact is established with the respective electrode on the opposite side. In this way, electrical contact can be made between an electrode of the trap or part of the trap and the electrical interface on the outside of the trap, or between an electrode of another part of the trap, respectively.

[0063]

[0063] Fabrication or structuring of the mechanical spring within the bulk material can be accomplished by additive manufacturing methods such as machining or milling, selective laser etching (SLE), lithography, focused ion beam milling, or 3D printing. However, the present disclosure is not limited to these specific fabrication steps. The mechanical spring is formed from the same non-conductive bulk material that supports the electrode structure of the trap. Therefore, no separate parts or processes are required to establish the electrical connection. Machining or shaping of the spring contacts can be done by the exact same methods or processes used to create the shape of the trap itself.

[0064]

[0064] The present disclosure is applicable to ion traps made from non-conductive bulk materials that are metallized to form and define the spatial structure of the ion trap, Paul trap, and electrodes of the trap. For example, SLE fabrication based on fused silica as the bulk material may be applied.

[0065] For example, an ion trap module may include a spring monolithically formed on a non-conductive substrate material. A conductive electrode material is coated onto the substrate surface in conductive connection with the bulk electrode. Some useful monolithic material properties include UHV compatibility, low RF loss, bakeability, etc. Some additional desirable features include thermal conductivity and a low coefficient of expansion.

[0066] Some suitable materials include glass (fused silica), sapphire, diamond, silicon, ceramic, etc. The spring contacts connect to the ion trap electrodes. The at least one spring and the at least one ion trap electrode are formed from the same monolithic bulk material. In one example, the monolithic structure is formed via SLE. In another example, the monolithic structure is formed by additive manufacturing. Selected Exemplary Embodiments

[0067] According to a first aspect, there is provided a module for an ion trap (or generally a trap for charged particles). The module comprises a monolithic body made of a non-conductive substrate and an electrode arranged on a part of the surface of the monolithic body. The part of the monolithic body forms a spring element. A conductive region is arranged on the surface of the spring element, covering part of its surface and conductively connected to the electrode. The spring element is configured to compress when pressure is applied to the conductive region.

[0068]

[0068] In addition to the first aspect, according to a second aspect, the spring element is a cantilever formed by extending a portion of the surface of the monolithic body above the surface of the monolithic body.

[0069]

[0069] According to a third aspect in addition to the second aspect, the cantilever extends over a recess in the surface of the monolithic body.

[0070]

[0070] In addition to any of the first to third aspects, according to a fourth aspect, the spring element protrudes from a flat surface of the monolithic body on which it is formed and is configured to reduce the protrusion when pressure is applied to the conductive region.

[0071]

[0071] According to a fifth aspect in addition to any one of the first to third and fourth aspects, the conductive region is disposed on an outer surface of the spring element facing away from the module of the ion trap.

[0072]

[0072] In addition to any of the first to fifth aspects, according to a sixth aspect, the non-conductive substrate is made of glass, fused silica, sapphire, diamond, silicon, or ceramic.

[0073]

[0073] In addition to any of the first to sixth aspects, according to a seventh aspect, the ion trap module is a Paul trap module including a direct current (DC) electrode and radio frequency (RF) electrode device or part of such a device for trapping charged particles.

[0074]

[0074] In addition to any of the first to seventh aspects, according to an eighth aspect, the ion trap module further comprises a pressure element having a conductive surface and conductively connected to the electrode, and the ion trap module is a first module of the ion trap and is configured to be mechanically joined to a second module of the ion trap according to any of the first to sixth aspects, thereby conductively connecting the pressure element of the first module of the ion trap to the spring element of the second module of the ion trap.

[0075] According to a ninth aspect, there is provided an ion trap (or generally a trap for charged particles) comprising: an ion trap first module, which is a module according to any one of the first to eighth aspects; and an ion trap second module configured to be mechanically coupled to the first ion trap module. The second module comprises (i) an electrode disposed on a surface of the second ion trap module and covering a portion of the surface, and (ii) a pressure element having a conductive surface and conductively connected to the electrode. The ion trap first module and the ion trap second module are mechanically coupled such that the pressure element of the second ion trap module applies pressure to the conductive region of the first ion trap module.

[0076]

[0076] According to a tenth aspect, there is provided an ion trap (or generally a charged particle trap) assembly comprising an ion trap module according to any one of the first to ninth aspects. The ion trap assembly further comprises a chip carrier or socket for mounting the ion trap module, the chip carrier or socket comprising a pressure element having a conductive surface configured to be mechanically joined to the ion trap module. The ion trap module and the chip carrier or socket are mechanically joined such that the pressure element applies pressure to the conductive region of the ion trap module.

[0077] According to an eleventh aspect, there is provided a method for manufacturing a module for an ion trap (or a trap for charged particles in general), comprising the steps of: (i) forming a monolithic body from a non-conductive substrate, the method including forming a spring element in a portion of the monolithic body, the spring element being configured to compress when pressure is applied to a first spring region, (ii) forming an electrode and the first spring region overlying a portion of a surface of the monolithic body, and (iii) forming an electrical connection between the electrode and the first spring region.

[0078]

[0078] In addition to the eleventh aspect, according to a twelfth aspect, the monolithic body is formed via selective laser etching (SLE), laser milling, ion beam milling, or by additive manufacturing.

[0079]

[0079] In addition to the eleventh or twelfth aspects, according to a thirteenth aspect, the step of forming the electrode and the first spring region covering a portion of the surface of the monolithic body is performed by coating.

[0080]

[0080] According to a fourteenth aspect, there is provided a method for manufacturing an ion trap (or generally a trap for charged particles) comprising the step of mechanically joining a plurality of modules of an ion trap according to the eighth aspect in a cascade, wherein for every two adjacent modules in the cascade, i.e., the first module and the second module, a pressure element of the first module of the ion trap is conductively connected to a spring element of the second module of the ion trap. [Explanation of symbols]

[0081] 100 Trap Module 110 Spring element 120 spring 131 Protrusion 132 Protrusion 140 Metallization 145 Conductive area 150 Monolithic Body 151 Surface 152 Surface 160 recess 164 rectangle 170 External Module 174 Counterpart conductive layer 175 Conductive area 180 surface 184 Conductive Layer 185 Part of the cavity surface 200 Trap Module 210 Spring Elements 220 Spring 230 Surface 232 Flat area 240 Metallization 250 monolithic body 260 Spring recess 266 Connection recess 270 External Module 271 Flat area 272 Flat area 275 Protruding part 280 surface 310 Trap body part 320 Trap body 330 Trap body part 340 Trap body part 350 Trap Zone 381 yen 382 yen 390 Tip 400 Traps 405 dash-dotted line 410 First Trap Module 420 Second Trap Module 450 Connection part 460 connection interface 470 External Module 480 Electrode body 510 Trap Module 520 Trap Module 530 Connection part 540 Connection part 550 Connection part 560 External Module 600 Trap Assembly 620 Trap Module 640 Connection part 650 Mechanical Connection Means 670 External Module 700 Trap Assembly 700_1 Trap module 700_2 Trap module 700_i Trap Module 700_n Trap Module 710_i Connection part 710_n Socket connection part 720_n plug connection part 1000 surface area 1050 cantilever spring 1100 Monolithic Materials 1110 Thickness 1130 recess 1150 End section 1155 Cantilever part 1300 Contact part 1310 Monolithic Materials 1330 Spiral spring

Claims

1. A module (100) for a trap for charged particles, comprising: a monolithic body (150) made of a non-conductive substrate; an electrode disposed on a surface of the monolithic body and covering a portion of the surface; a portion of said monolithic body forming a spring element (110); a conductive region (145) disposed on the surface of the spring element (110), covering a portion of the surface thereof, and conductively connected to the electrode; the spring element (110) is configured to compress when pressure is applied to the conductive region (145); Charged particle trap module.

2. 2. The module of a trap for charged particles according to claim 1, wherein the spring element (110) is a cantilever formed by extending a portion of the surface of the monolithic body above the surface of the monolithic body.

3. 3. A module of a trap for charged particles according to claim 2, wherein the cantilever extends over a recess (160) in the surface of the monolithic body.

4. 2. The module of a trap for charged particles according to claim 1, wherein the spring element has the form of a spiral (1330).

5. 2. The charged particle trap module of claim 1, wherein the spring elements (110) protrude from the flat surfaces (151, 152) of the monolithic body on which the spring elements are formed, and are configured to reduce the protrusion when the pressure is applied to the conductive region (145).

6. 2. The module of a trap for charged particles according to claim 1, wherein the conductive region (145) is disposed on an outer surface of the spring element facing away from the module (100) of the trap.

7. 2. The module of a trap for charged particles according to claim 1, wherein the non-conductive substrate (150) is made of glass, fused silica, sapphire, diamond, silicon, or ceramic.

8. 2. The module of a trap for charged particles according to claim 1, wherein the module of the trap (100) is a Paul trap module including an arrangement of direct current (DC) electrodes and radio frequency (RF) electrodes for trapping charged particles or a part of such arrangements.

9. a pressure element (275) having a conductive surface (240) and conductively connected to said electrode; 2. A module of a trap for charged particles according to claim 1, wherein the module (200) of the trap is a first module (410; 510) of the trap and is configured to be mechanically joined with a second module (420; 520) of the trap according to claim 1, so that the pressure element (275) of the first module of the trap is conductively connected to the spring element (210) of the second module of the trap.

10. A trap (400) for charged particles, comprising: A first module (410) of the trap, which is a module according to any one of claims 1 to 9; a second module (420) of the trap configured to be mechanically joined to the first module of the trap, an electrode disposed on a surface of the second module of the trap and covering a portion of that surface; a pressure element having a conductive surface and conductively connected to said electrode; Equipped with a second module (420) of said trap; Equipped with the first module (410) of the trap and the second module (420) of the trap are mechanically coupled (450) such that the pressure element of the second module of the trap applies pressure to the conductive region of the first module of the trap; Trap for charged particles.

11. 1. A trap assembly for charged particles, comprising: The module (620) of a trap for charged particles according to claim 10; a chip carrier (610) or socket for mounting said module of the trap, comprising a pressure element with a conductive surface configured to be mechanically joined with said module of the trap; Equipped with the trap module and the chip carrier or socket are mechanically coupled (650) such that the pressure element applies pressure to the conductive region of the trap module; Trap assembly for charged particles.

12. 1. A method for manufacturing a module of a trap for charged particles, comprising: forming (810) a monolithic body from a non-conductive substrate, the monolithic body including forming a spring element in a portion of the monolithic body, the spring element configured to compress when pressure is applied to a first spring region; forming an electrode (820) over a portion of a surface of the monolithic body and the first spring region; forming an electrical connection between the electrode and the first spring region (830); A method comprising:

13. 13. The method of claim 12, wherein the monolithic body is formed (810) via selective laser etching (SLE), laser milling, ion beam milling, or by additive manufacturing.

14. 14. The method of claim 12 or 13, wherein the step (820) of forming an electrode and the first spring region (145) covering a portion of the surface of the monolithic body (150) is performed by coating.

15. 1. A method for manufacturing a trap for charged particles, comprising:

10. A method for mechanically connecting a plurality of modules (700_1 to 700_n) of the trap (700) of claim 9 in a cascade, wherein for every two adjacent modules in the cascade, i.e., a first module and a second module, a pressure element of a first module of the trap is conductively connected to the spring element of a second module of the trap; A method comprising:

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