Bonding device and method for manufacturing bonded parts

The bonding device addresses the high cost and complexity of CCD camera-based alignment by using a movable stage and convex-concave fitting mechanism for precise, cost-effective bonding of workpieces.

JP7785217B1Active Publication Date: 2025-12-12ORIGIN CO LTD(JP)
View PDF 5 Cites 0 Cited by

Patent Information

Application Number
JP2025024446
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-02-18
Publication Date
2025-12-12
Estimated Expiration
2045-02-18

AI Technical Summary

Technical Problem

Existing bonding devices using CCD cameras for precise alignment of workpieces are costly due to their complex configurations.

Method used

A bonding device with a movable first stage supported by a deformable support member, allowing three-dimensional movement and a stationary mechanism with convex and concave fittings to align workpieces without the need for CCD cameras, ensuring proper fitting and bonding.

Benefits of technology

Enables precise bonding of workpieces without CCD cameras, reducing initial costs and ensuring stable, defect-free bonding with reduced stress on the workpieces.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007785217000001_ABST
    Figure 0007785217000001_ABST
Patent Text Reader

Abstract

A laminating device that simply affixes two workpieces in the correct position, and a method for manufacturing a laminated part, are provided. [Solution] The bonding apparatus 1 includes a first stage 10 that supports a first workpiece 91, a second stage 20 that supports a second workpiece 92 at a position opposite the first workpiece 91, a base 31, a support member 38 that movably supports the first stage 10 relative to the base 31, and a moving device 42 that moves the base 31 and / or the second stage 20 in a far direction FN. A manufacturing method for a bonded component includes the steps of: having the first stage 10 support the first workpiece 91; having the second stage 20 support the second workpiece 92; bringing the base 31 and / or the second stage 20 closer to each other to engage fitting structures 95 of the first workpiece 91 and the second workpiece 92; bringing the base 31 and / or the second stage 20 closer to each other to press together the first workpiece 91 and the second workpiece 92, with their fitting structures 95 engaged; and bringing the base 31 and / or the second stage 20 closer to each other to bond them together.
Need to check novelty before this filing date? Find Prior Art

Description

[Technical Field]

[0001] The present disclosure relates to a bonding apparatus for bonding two workpieces together and a method for manufacturing a bonded component. [Background technology]

[0002] For example, there is a device that uses an adhesive to bond two components, such as a liquid crystal panel and a protective glass. In order to perform positioning with high precision, such a device may use a CCD camera to align the positions in a plan view, and then move the components relatively in a vertical direction while keeping their planar positions fixed to bond them together (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-145057 Summary of the Invention [Problem to be solved by the invention]

[0004] However, a device using a CCD camera has a complicated configuration, which also leads to an increase in initial costs.

[0005] In view of the above-mentioned problems, the present disclosure relates to providing a bonding device that can easily bond two workpieces together at a regular position, and a method for manufacturing a bonded component. [Means for solving the problem]

[0006] A bonding device according to a first aspect of the present disclosure is a bonding device that bonds a first workpiece and a second workpiece, wherein the first workpiece and the second workpiece have a fitting structure that fits together properly when they are bonded in the correct position, and includes a first stage that supports the first workpiece, a second stage that supports the second workpiece at a position opposite to the first workpiece, a base, a support member that supports the first stage relative to the base so that it can move at least within a two-dimensional plane, and a moving device that directly or indirectly moves at least one of the base and the second stage in a direction toward and away from each other.

[0007] With this configuration, the first stage can be moved by the support member, so even if the positions of the works held on each stage are misaligned, the fitting of the fitting structure can be prevented from being hindered, and the works can be easily attached in the correct position.

[0008] Furthermore, as a bonding device according to a second aspect of the present disclosure, in the bonding device according to the first aspect of the present disclosure, the support member may be an elastic member that is deformable in the perspective direction and in a direction intersecting the perspective direction.

[0009] With this configuration, the first stage can be moved three-dimensionally relative to the base, and the workpieces can be properly bonded together while preventing excessive stress from acting on the workpieces.

[0010] Furthermore, as a bonding device according to a third aspect of the present disclosure, the bonding device according to the first or second aspect of the present disclosure may be provided with a stationary mechanism that stops the first stage in a position where the first workpiece is placed.

[0011] With this configuration, the first workpiece can be stably placed on the first stage supported by the movable support member.

[0012] Furthermore, a bonding apparatus according to a fourth aspect of the present disclosure may be the bonding apparatus according to the third aspect of the present disclosure, further comprising a positioning mechanism that stops the first stage at a predetermined position.

[0013] With this configuration, it is possible to suppress variations in the placement position of the first workpiece relative to the first stage.

[0014] Furthermore, as a bonding device according to a fifth aspect of the present disclosure, in the bonding device according to the fourth aspect of the present disclosure, the positioning mechanism may include a first part provided on the first stage and a second part provided on the stationary mechanism, and the first part and the second part may include a convex part formed on one of the first part and the second part and a concave part formed on the other, and the convex part may be able to fit into the concave part.

[0015] With this configuration, the first stage can be positioned and made stationary with a simple configuration.

[0016] Furthermore, as a bonding device according to a sixth aspect of the present disclosure, in the bonding device according to the fifth aspect of the present disclosure, the convex portion may be formed in a cone shape or a frustum shape, and the concave portion may be tapered.

[0017] With this configuration, positioning can be performed with a simple configuration.

[0018] Furthermore, as a bonding device according to a seventh aspect of the present disclosure, in the bonding device according to the fifth or sixth aspect of the present disclosure, the second stage may have a pressing member that presses the first component or the first stage to release the engagement between the convex portion and the concave portion.

[0019] With this configuration, the first stage can be made movable without applying a load to the workpiece.

[0020] Furthermore, as a manufacturing method for a bonded component according to an eighth aspect of the present disclosure, there may be provided a method for manufacturing a bonded component by bonding a first workpiece and a second workpiece together using a bonding device according to any one of the first to seventh aspects of the present disclosure, the method including: a step of supporting the first workpiece with the first stage; a step of supporting the second workpiece with the second stage; a step of moving at least one of the base and the second stage in a direction toward each other to fit the fitting structures of the first workpiece and the second workpiece; and a step of moving at least one of the base and the second stage in a direction toward each other to press the first workpiece and the second workpiece, whose fitting structures are fitted together, together in a direction toward each other to bond them together.

[0021] With this configuration, the workpieces can be easily attached in the correct position. [Effects of the Invention]

[0022] According to the present disclosure, the first stage can be moved by the support member, so that even if the positions of the workpieces held on each stage are misaligned, the fitting of the fitting structure can be prevented from being hindered, and the workpieces can be easily attached in the correct position. [Brief explanation of the drawings]

[0023] [Figure 1] 1 is a schematic vertical cross-sectional view showing a schematic configuration of a bonding apparatus according to an embodiment of the present disclosure. [Figure 2] 1 is a flowchart illustrating a manufacturing method of a bonded component according to an embodiment of the present disclosure. [Figure 3] FIG. 10 is a schematic vertical cross-sectional view of a state in which the bottom stage is movable during operation of the bonding device according to the embodiment of the present disclosure. [Figure 4] FIG. 10 is a schematic vertical cross-sectional view of a state in which a bottom stage has moved during operation of a bonding device according to an embodiment of the present disclosure. [Figure 5]FIG. 2 is a schematic vertical cross-sectional view of a state in which two workpieces are pressed together during operation of the bonding device according to the embodiment of the present disclosure. [Figure 6] FIG. 2 is a schematic vertical cross-sectional view of a state in which the bonding apparatus according to the embodiment of the present disclosure has completed bonding of two workpieces. [Figure 7] FIG. 10 is a schematic vertical cross-sectional view showing a schematic configuration of a bonding device according to a modified example of an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0024] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In each drawing, identical or similar reference numerals are used to designate identical or corresponding components, and redundant explanations will be omitted. Furthermore, the dimensions and proportions of the drawings are exaggerated for the sake of explanation and may differ from the actual proportions.

[0025] First, with reference to FIG. 1, a bonding apparatus 1 according to an embodiment of the present disclosure will be described. FIG. 1 is a schematic vertical cross-sectional view showing the general configuration of the bonding apparatus 1. In FIG. 1, hatching representing a cross section is omitted to avoid cluttering the drawing. The bonding apparatus 1 is an apparatus that bonds a first workpiece (hereinafter referred to as a "first workpiece 91") and a second workpiece (hereinafter referred to as a "second workpiece 92"), typically via a resin. The bonding apparatus 1 also functions as an apparatus that manufactures a bonded component in which the first workpiece 91 and the second workpiece 92 are bonded together.

[0026] The first workpiece 91 and the second workpiece 92 may be substrates. Examples of substrates include a liquid crystal panel of a smartphone, a cover glass, and a VR eyeglass lens, but various other substrates may also be used. The first workpiece 91 and / or the second workpiece 92 may be a member to be bonded other than a substrate. The resin that may be supplied between the first workpiece 91 and the second workpiece 92 may function as an adhesive. This resin may be in a liquid state with a predetermined viscosity and fluidity when applied to the first workpiece 91 and / or the second workpiece 92, and may have the property of hardening when the first workpiece 91 and the second workpiece 92 are bonded together and a thickening treatment is applied. The thickening treatment may include irradiating ultraviolet light, heating, waiting for the passage of time, etc., depending on the properties of the resin.

[0027] The first workpiece 91 and the second workpiece 92 have a fitting structure 95 that fits properly when they are bonded together in the correct position. Here, the correct position typically refers to a planned position (or a design position) required for the bonded components to function. Fitting properly typically means fitting together without any defects. Examples of defects include damage such as cracks or breaks, and excessive stress that reduces quality, such as reduced strength or durability. In this embodiment, the fitting structure 95 is configured as a pair of a recess 96 formed on the bonding surface of the first workpiece 91 and a protrusion 97 provided on the bonding surface of the second workpiece 92. Typically, multiple pairs of recesses 96 and protrusions 97 are provided, and the multiple pairs of recesses 96 and protrusions 97 are located apart from each other.

[0028] As described above, the first workpiece 91 and the second workpiece 92 have a regular bonding position where they function as a bonded part when bonded together to form a bonded part. Conventionally, the bonding surfaces of the two components to be bonded are placed opposite each other, and then the planar positions are aligned using a CCD camera, and the two components are brought close together to be bonded. However, devices using a CCD camera have a complex configuration and result in increased initial costs. In contrast, the bonding device 1 according to this embodiment, which bonds the first workpiece 91 and the second workpiece 92 having a fitting structure 95, is a device that easily bonds the first workpiece 91 and the second workpiece 92 in the regular position without using a CCD camera. The bonding device 1 includes a bottom stage 10, a top stage 20, a base 31, a support member 38, and a moving device 42. When resin is applied to the first workpiece 91 and / or the second workpiece 92, a resin supplying device (not shown) may be provided.

[0029] The bottom stage 10 is a stage that supports the first workpiece 91 and corresponds to the first stage. In this embodiment, the bottom stage 10 has a bottom holder 11 and a bottom base 12. The bottom holder 11 holds the first workpiece 91. The bottom holder 11 typically holds the first workpiece 91 by suction, but may hold it by a configuration other than suction, such as chuck jaws. The bottom holder 11 is large enough to encompass the first workpiece 91 in a plan view, and the top surface on which the first workpiece 91 is placed is typically flat. The bottom holder 11 is typically oriented so that the top surface (i.e., the surface on which the first workpiece 91 is placed) is horizontal.

[0030] The bottom base 12 supports the bottom holder 11. The bottom base 12 is typically formed in a plate shape that is larger than the bottom holder 11 while encompassing the bottom holder 11 in a plan view. In this embodiment, the bottom holder 11 is provided on the bottom base 12. A convex portion 15 is provided on the outer edge of the upper surface of the bottom base 12 (i.e., the surface on which the bottom holder 11 is provided). The convex portion 15 extends upward from the upper surface of the bottom base 12. The convex portion 15 is typically formed in a frustum shape whose horizontal cross-sectional area decreases as it goes upward, and in this embodiment, it is formed in a circular frustum shape. Typically, a plurality of convex portions 15 are provided at intervals in the circumferential direction on the upper surface of the bottom base 12.

[0031] The top stage 20 is a stage that supports the second workpiece 92 at a position opposite the first workpiece 91, and corresponds to the second stage. In this embodiment, the top stage 20 has a top holder 21 and a top base 22. The top holder 21 holds the second workpiece 92. The top holder 21 typically holds the second workpiece 92 by suction, but may hold it by a configuration other than suction, such as chuck jaws. The top holder 21 has a size sufficient to encompass the second workpiece 92 in a plan view, and the lower surface with which the second workpiece 92 comes into contact is typically formed flat. The top holder 21 is typically oriented so that the lower surface (i.e., the surface with which the second workpiece 92 comes into contact) is horizontal.

[0032] The top base 22 supports the top holder 21. The top base 22 is typically formed in a plate shape that encompasses the top holder 21 but is larger than the top holder 21 in a plan view. In the present embodiment, the top holder 21 is attached to the underside of the top base 22. The top base 22 is positioned so that the second workpiece 92 held by the top holder 21 is positioned above and facing the first workpiece 91 held by the bottom holder 11. In the present embodiment, the top base 22 has a size that encompasses all of the protrusions 15 provided on the bottom base 12 in a plan view. In the present embodiment, a pressing member 26 is provided on the top base 22.

[0033] The pressing members 26 are members that press the protrusions 15 at appropriate times. Therefore, the number of pressing members 26 corresponds to the number of protrusions 15, and they are typically provided on the outer edge of the lower surface of the top base 22, at positions facing each of the protrusions 15. The pressing members 26 include a pressing plate 28 and an expandable member 29. The pressing plate 28 can contact and press the protrusions 15. The pressing plate 28 is typically a plate-shaped member and is large enough to press the tops of the protrusions 15. The expandable member 29 is a member that connects the top base 22 and the pressing plate 28. In this embodiment, a spring is used as the expandable member 29. The expandable member 29 expands and contracts depending on the distance of the pressing plate 28 from the top base 22. In other words, the pressing plate 28 is connected to the top base 22 via the expandable member 29, and can move toward and away from the top base 22.

[0034] The base 31 is a member that serves as a base for supporting the bottom stage 10. In this embodiment, the base 31 is formed of a plate-like member and has a planar shape large enough to encompass the bottom base 12. The base 31 is arranged so that the surface of the plate-like member faces up and down. In this embodiment, the base 31 has a sidewall 33 that typically extends vertically on the outer edge of its upper surface. The sidewall 33 may be provided along the entire outer periphery of the base 31, but it is sufficient that the sidewall 33 is provided adjacent to the positions where the protrusions 15 are provided. In other words, the sidewalls 33 may be provided adjacent to the respective protrusions 15 at intervals in the circumferential direction of the base 31. Small pieces 34 are provided on the upper part of the sidewall 33, protruding at positions where the protrusions 15 are located in a plan view. The number of small pieces 34 corresponds to the number of protrusions 15. In this embodiment, the small pieces 34 are plate-like members and typically extend horizontally from the sidewall 33 inward (i.e., toward the side where the bottom support 11 is located). The small piece 34 is formed with a recess 35 into which the protrusion 15 fits. In this embodiment, the recess 35 is formed as a hole penetrating the plate-like member of the small piece 34 in the thickness direction. In this embodiment, the recess 35 is tapered so that the horizontal cross-sectional area of ​​the hole penetrating the plate-like member in the thickness direction decreases toward the top. The taper of the recess 35 corresponds to the slope of the truncated cone-shaped outer surface that constitutes the protrusion 15. In other words, the recess 35 is formed with a shape and size that allows the protrusion 15 to fit into it. The diameter of the hole of the recess 35 on the underside of the small piece 34 is larger than the diameter of the top of the truncated cone-shaped protrusion 15 and smaller than the diameter of the bottom.

[0035] The support member 38 movably supports the bottom stage 10 relative to the base 31. In this embodiment, a spring (or coil spring) equivalent to an elastic member is used as the support member 38. A plurality of support members 38 are provided at intervals on the outer edge of the bottom base 12 so as to stably support the bottom stage 10. The same number of support members 38 may be provided at positions corresponding to the protrusions 15 (typically below the protrusions 15). The support member 38 has one end (or first end) of the spring attached to the underside of the bottom base 12 and the other end (or second end) attached to the upper surface of the base 31, and biases the bottom base 12 toward the small piece 34. When the protrusions 15 on the bottom base 12 are fitted into the recesses 35 of the small piece 34 and the bottom base 12 cannot move upward, the spring of the support member 38 may be in a slightly compressed state so as to press the bottom base 12 toward the small piece 34. The support member 38 has a spring constant that causes it to contract before the expandable member 29 contracts when the protrusion 15 is pressed by the pressing member 26. That is, in this embodiment, the support member 38 has a smaller spring constant than the expandable member 29. Note that although the expandable member 29 overcomes the biasing force of the support member 38, it will contract if the top base 22 continues to descend after the pressing plate 28 hits the small piece 34.

[0036] When the protrusions 15 provided on the bottom base 12 are fitted into the recesses 35 of the small pieces 34 by the biasing force of the support members 38, preventing the bottom base 12 from moving upward, the bottom stage 10 is stationary. In this way, the small pieces 34 on which the protrusions 15 and recesses 35 are formed function as a stationary mechanism for stationary the bottom stage 10. Furthermore, when the protrusions 15 are fitted into the recesses 35 of the small pieces 34, preventing the bottom base 12 from moving upward, the bottom stage 10 is always located at the same position (hereinafter, this position will be referred to as the "reference position") in three-dimensional space (or an orthogonal coordinate system). In this way, the small pieces 34 on which the protrusions 15 and recesses 35 are formed also function as a positioning mechanism for stationary the bottom stage 10 at the reference position. The reference position of the bottom stage 10 corresponds to a predetermined position. Furthermore, the protrusions 15 correspond to a first component, and the small pieces 34 on which the recesses 35 are formed correspond to a second component. As described above, the small piece 34 on which the convex portion 15 and the concave portion 35 are formed functions as a stationary mechanism and a positioning mechanism, and hereinafter these may be collectively referred to as a "stationary positioning mechanism 50."

[0037] In this embodiment, the moving device 42 moves the top stage 20 up and down. By moving the top stage 20 up and down, the moving device 42 moves the top stage 20 toward and away from the base 31 and the bottom stage 10. Hereinafter, the direction in which the top stage 20 and the base 31 move toward and away from each other will be referred to as the "near-near direction FN." By moving the top stage 20 in the near-near direction FN, the moving device 42 can move the second workpiece 92 from a spaced position to a contact position relative to the first workpiece 91. The moving device 42 can use various mechanisms for linearly reciprocating an object to be moved. For example, a mechanism combining a linear guide with a ball screw operated by a motor, or a cylinder operated by fluid pressure such as air pressure or hydraulic pressure can be used. The operation of the moving device 42 is typically controlled by a control device (not shown).

[0038] Next, with reference to Figures 2 to 6 in addition to Figure 1, a method for manufacturing a bonded component in which a first workpiece 91 and a second workpiece 92 are bonded together will be described. Figure 2 is a flowchart showing the procedure for manufacturing a bonded component. Figures 3 to 6 are schematic vertical cross-sectional views showing the state of the bonding apparatus 1 in the process of manufacturing the bonded component. Hatching representing cross sections has been omitted from Figures 3 to 6 to avoid cluttering the drawings. The method for manufacturing a bonded component described below is carried out using the bonding apparatus 1 described above. The following description of the method for manufacturing a bonded component using the bonding apparatus 1 also includes a description of the operation of the bonding apparatus 1. In the following description, when the configuration of the bonding apparatus 1 is mentioned, Figure 1 will also be referenced as appropriate.

[0039] When the bonding apparatus 1 is not operating, the bottom stage 10 is in a reference position as shown in Fig. 1. Furthermore, the top stage 20 is in a position where at least the pressing member 26 does not urge (or press) the convex portion 15, and typically the pressing plate 28 is separated from the convex portion 15. At this time, there is a gap between the bottom holding table 11 and the top holding table 21 that allows the first workpiece 91 and the second workpiece 92 to be smoothly inserted.

[0040] When the production of bonded parts is started, first, the first workpiece 91 is placed on the bottom holder 11 with the recess 96 facing upward (i.e., the opposite side from the bottom holder 11) and is supported by the bottom holder 11 (S1). At this time, the bottom stage 10, and therefore the bottom holder 11, are in a reference position. Therefore, even though the bottom stage 10 is supported by support members 38 made up of springs whose relative positions at both ends can move, it is kept stationary by the static positioning mechanism 50. For this reason, the first workpiece 91 can be stably placed on the bottom holder 11. Furthermore, since the bottom stage 10, which is in the reference position by the static positioning mechanism 50, is always in a constant position in three-dimensional space, it is possible to suppress variation in the installation position of the first workpiece 91 on the bottom holder 11, for example, when the first workpiece 91 is transported by a robot arm that moves along a fixed trajectory.

[0041] Next, the second workpiece 92 is brought into contact with the top holder 21 with the protrusion 97 facing downward (i.e., the opposite side from the top holder 21) and supported by the top holder 21 (S2). As a result, the second workpiece 92 is supported by the top holder 21 above the first workpiece 91, facing the first workpiece 91. The position of the second workpiece 92 supported by the top holder 21 does not have to be exactly the correct position relative to the first workpiece 91 in a plan view, and may be close to the correct position. Here, a position close to the correct position preferably means a position where the top of the protrusion 97 is within the opening of the recess 96 in a plan view. Note that the completely correct position is a position where the top of the protrusion 97 coincides with the deepest part of the recess in a plan view. When the second workpiece 92 is supported by the top holder 21, deviation of the second workpiece 92 from the correct position relative to the top holder 21 within a predetermined range is allowed, eliminating the need for alignment using a CCD camera and enabling rapid processing.

[0042] 2, for convenience of explanation, the first workpiece 91 is supported by the bottom holder 11 (S1), and then the second workpiece 92 is supported by the top holder 21 (S2). However, the order may be reversed, such that the second workpiece 92 is supported by the top holder 21 and then the first workpiece 91 is supported by the bottom holder 11, or the support of the first workpiece 91 by the bottom holder 11 and the support of the second workpiece 92 by the top holder 21 may be performed simultaneously. Furthermore, when the bonded component is formed by bonding the first workpiece 91 and the second workpiece 92 together using a resin, the bottom holder 11 or the top holder 21 may support the first workpiece 91 and / or the second workpiece 92 to which the resin has been applied, or the resin may be applied to the first workpiece 91 supported by the bottom holder 11 and / or the second workpiece 92 supported by the top holder 21.

[0043] Once the bottom support table 11 has completed supporting the first workpiece 91 and the top support table 21 has completed supporting the second workpiece 92, the top stage 20 begins to descend (S3). In conventional bonding, the planar position is adjusted using a CCD camera before the top stage 20 is lowered. However, in this embodiment, the top stage 20 may begin to descend without adjusting the planar position. The top stage 20 is lowered by operating the movement device 42 in response to a command from a control device (not shown). As the top stage 20 descends, the pressure plate 28 first contacts the top of the protrusion 15. The top stage 20 continues to descend even after the pressure plate 28 contacts the protrusion 15, and the pressure member 26 presses the protrusion 15 (S4). This causes the protrusion 15 and the bottom stage 10 to descend. The reason the protrusion 15 and the bottom stage 10 descend is because the biasing force of the support member 38, which has a smaller spring constant than the expandable member 29, is overcome by the pressing force of the pressure member 26.

[0044] When the pressing member 26 overcomes the biasing force of the support member 38 and presses down the protrusion 15 and the bottom stage 10, the pressing plate 28 comes into contact with the top surface of the small piece 34, as shown in FIG. 3 . At this time, because the truncated cone-shaped protrusion 15 is pressed down from its reference position, a gap is formed between the protrusion 15 and the small piece 34 within the recess 35, allowing the protrusion 15 to move horizontally (i.e., in a direction intersecting the far-neighbor direction FN) within a range until it hits the small piece 34. This is because the support member 38 is a spring (i.e., an elastic member) that is deformable in the far-neighbor direction FN and in a direction intersecting the far-neighbor direction FN. Furthermore, when the pressing plate 28 comes into contact with the top surface of the small piece 34, it is preferable that the tip of the protrusion 97 of the second workpiece 92 be within the recess 96 of the first workpiece 91. Note that the tip of the protrusion 97 does not need to be within the recess 96 (i.e., it may be located above the joining surface of the first workpiece 91), as long as it is within the range of the recess 96 in a plan view.

[0045] The top stage 20 continues to descend after the pressure plate 28 contacts the upper surface of the small piece 34. However, since the small piece 34 is fixed to the base 31 via the side wall 33 and does not move, the expandable member 29 contracts as the top stage 20 descends. At this time, the bottom stage 10 cannot move vertically but can move horizontally because the protrusion 15 is pressed by the pressure member 26 and the bottom base 12 is biased by the support member 38. Therefore, if the apex of the protrusion 97 does not coincide with the deepest part of the recess 96 in the planar position when the expandable member 29 contracts and the second workpiece 92 approaches the first workpiece 91, the protrusion 97 will descend and the contact area with the recess 96 will increase, causing the bottom stage 10 to move horizontally and adjust its planar position. A ball roller may be provided on the top of the protrusion 15 to smooth the horizontal movement of the bottom stage 10.

[0046] As the top stage 20 descends as described above, the recess 96 and the protrusion 97 completely fit together (S5), as shown in FIG. 4. When the recess 96 and the protrusion 97 completely fit together, the first workpiece 91 and the second workpiece 92 are in contact with each other in the correct position. In the state shown in FIG. 4, the first workpiece 91 and the second workpiece 92 are pressed toward each other mainly by the biasing force of the support member 38. In order to press the first workpiece 91 and the second workpiece 92 toward each other with a stronger force, the top stage 20 is further lowered, and the bottom stage 10 comes into contact with the base 31, as shown in FIG. 5. Once the bottom stage 10 comes into contact with the base 31, it cannot be lowered any further.

[0047] Even after the bottom stage 10 contacts the base 31, the top stage 20 is pressed downward with a predetermined force, thereby applying a predetermined force to the first workpiece 91 and the second workpiece 92. Here, the predetermined force is a force that should be applied to the first workpiece 91 and the second workpiece 92 in order to bring the bonded parts into a bonded state that complies with the specifications. By applying the predetermined force to the first workpiece 91 and the second workpiece 92, the first workpiece 91 and the second workpiece 92 are bonded together (S6). If the first workpiece 91 and the second workpiece 92 are bonded together via a resin, a viscosity increasing measure may be applied at this stage.

[0048] When the bonding of the first workpiece 91 and the second workpiece 92 is complete, the top holder 21 releases support of the second workpiece 92, and the top stage 20 is raised (S7). Then, as shown in FIG. 6, the bottom stage 10, with the bonded parts supported by the bottom holder 11, returns to the reference position by the action of the support member 38 and the stationary positioning mechanism 50, and the top stage 20 returns to the state before the start of bonding. When this state is reached, the bottom holder 11 releases support of the bonded parts, and the bonded parts are removed (S8). This completes the production of one bonded part. If another bonded part is to be subsequently produced, the above-mentioned procedure can be repeated.

[0049] As described above, the bonding apparatus 1 and the manufacturing method for bonded components according to this embodiment have the following advantages. Because the bottom stage 10 can be moved three-dimensionally (or in the perspective direction FN and a direction intersecting the perspective direction FN) by the support members 38, the planar position can be moved to the correct position while bringing the second workpiece 92 closer to the first workpiece 91, and the first workpiece 91 and the second workpiece 92 can be easily bonded together in the correct position. Furthermore, because the static positioning mechanism 50 is provided, the first workpiece 91 can be stably placed on the bottom support base 11, and variation in the placement position of the first workpiece 91 relative to the bottom support base 11 can be reduced. Furthermore, the static positioning mechanism 50 includes a convex portion 15 formed in a truncated cone shape and a small piece 34 formed with a tapered concave portion 35 into which the convex portion 15 fits. This allows the bottom stage 10 to be positioned and stationary with a simple configuration.

[0050] Next, a bonding apparatus 1A according to a modified example of the embodiment of the present disclosure will be described with reference to FIG. 7. FIG. 7 is a schematic vertical cross-sectional view showing the general configuration of the bonding apparatus 1A. In FIG. 7, hatching representing cross sections has been omitted to avoid cluttering the drawing. The bonding apparatus 1A differs from the bonding apparatus 1 (see FIG. 1) mainly in the configuration for stopping and positioning the bottom stage 10. Below, the bonding apparatus 1A will be described, focusing on the differences from the bonding apparatus 1 (see, for example, FIG. 1). In the following description, when referring to the configuration of the bonding apparatus 1 (see FIG. 1), reference will be made to FIG. 1 as appropriate.

[0051] In the bonding apparatus 1A according to this modification, an upright portion 13 extending vertically upward is provided on the outer edge of the upper surface of the bottom base 12. It is sufficient for the upright portion 13 to be provided at a position in the circumferential direction of the bottom base 12 where the convex portion 15 (see FIG. 1) of the bonding apparatus 1 (see FIG. 1) was located, but it is not precluded from being provided over the entire circumferential direction of the bottom base 12. A flange portion 14 protruding horizontally outward is provided at the top of the upright portion 13. A convex portion 15A protruding downward is provided on the underside of the flange portion 14. The convex portion 15A corresponds to the convex portion 15 (see FIG. 1) of the bonding apparatus 1 (see FIG. 1). The convex portion 15A is typically formed in a cone shape whose horizontal cross-sectional area decreases downward, and in this embodiment, it is formed in a conical shape. A plurality of convex portions 15A are typically provided spaced apart in the circumferential direction of the bottom base 12. In this way, in the bonding device 1A, a convex portion 15A is provided in place of the convex portion 15 (see Figure 1) in the bonding device 1 (see Figure 1), and a standing portion 13 and a flange portion 14 are added as a structure for supporting the convex portion 15A.

[0052] Furthermore, in the laminating apparatus 1A, small pieces 24 each having a recess 25 into which the protrusion 15A fits are attached to the top base 22, not the base 31, via the side wall 23. The side wall 23, the small pieces 24, and the recess 25 have functions equivalent to those of the side wall 33, the small pieces 34, and the recess 35 in the laminating apparatus 1 (see FIG. 1), respectively. In the laminating apparatus 1A, the side wall 23 is provided on the outer edge of the lower surface of the top base 22. The side wall 23 may be provided along the entire outer periphery of the top base 22, but it is sufficient that the side wall 23 is provided corresponding to the position where the protrusion 15A is provided. In other words, the side wall 23 may be provided at intervals in the circumferential direction of the top base 22, corresponding to each of the protrusions 15A. The small pieces 24 are provided on the lower part of the side wall 23. The small pieces 24 extend inward from the side wall 23, typically horizontally. The recess 25 formed in the small piece 24 is formed as a hole penetrating the thickness direction of the plate-like member. In this embodiment, the recess 25 is tapered so that the horizontal cross-sectional area of ​​the hole penetrating the thickness direction of the plate-like member decreases toward the bottom. The taper of the recess 25 corresponds to the slope of the conical outer surface that constitutes the protrusion 15A. The diameter of the hole of the recess 25 on the upper surface of the small piece 24 is smaller than the diameter of the upper part of the conical protrusion 15A (i.e., the part that corresponds to the bottom surface of the cone that is placed upside down).

[0053] In the bonding apparatus 1A, the convex portion 15A and the small piece 24 in which the concave portion 25 is formed constitute the stationary positioning mechanism 50A. The convex portion 15A corresponds to the first component, and the small piece 24 in which the concave portion 25 is formed corresponds to the second component. The bonding apparatus 1A does not have the pressing member 26 (see FIG. 1) that was attached to the top base 22 in the bonding apparatus 1 (see FIG. 1), nor the side wall 33 (see FIG. 1) and the small piece 34 (see FIG. 1) that were attached to the base 31. Other than the components of the bonding apparatus 1A described so far, components that are assigned the same reference numerals as those of the bonding apparatus 1 (see FIG. 1) have the same configuration as the bonding apparatus 1 (see FIG. 1).

[0054] When a bonded component is manufactured using the bonding apparatus 1A configured as described above, the bonding apparatus 1A operates in the same manner as when the bonding apparatus 1 (see FIG. 1) is used, except for points related to the operation of the stationary positioning mechanism 50A. Therefore, the manner in which the bottom holder 11 supports the first workpiece 91 and the top holder 21 supports the second workpiece 92 in the bonding apparatus 1A is the same as when the bonding apparatus 1 (see FIG. 1) is used. When the bonding apparatus 1A is not operating, the bottom stage 10 is in the reference position, as shown in FIG. 7. Furthermore, the top stage 20 is positioned with a gap between the bottom holder 11 and the top holder 21 that allows the first workpiece 91 and the second workpiece 92 to be smoothly inserted. Hereinafter, although illustrations are omitted, the operation of the bonding apparatus 1A when manufacturing a bonded component will be described, focusing mainly on the differences from the bonding apparatus 1 (see FIG. 1).

[0055] In the bonding apparatus 1A according to this modification, when the bottom stage 10 is in the reference position, the bottom stage 10 is slightly pulled upward by the top stage 20 via the stationary positioning mechanism 50A, causing the support member 38 to undergo tensile elastic deformation. This allows the convex portion 15A to fit snugly into the concave portion 25, and the bottom stage 10 is stationary and positioned. This reduces variation in the placement position of the first workpiece 91 when it is placed on the bottom support base 11. After the bottom support base 11 and the top support base 21 complete support of the first workpiece 91 and the second workpiece 92, respectively, the top stage 20 begins to descend. When the tensile force acting on the support member 38 is released, the bottom stage 10 descends slightly and stops. The bottom stage 10 stops at the position where the load acting on the support member 38 in relation to the bottom stage 10 and the reaction force of the support member 38 are balanced. As the top stage 20 continues to descend after the bottom stage 10 has stopped, the small pieces 24 move downward away from the convex portions 15A, and the convex portions 15A and the concave portions 25 are no longer fitted together. This allows the bottom stage 10 to move three-dimensionally in the horizontal and vertical directions. Note that in the manufacture of bonded components using the bonding apparatus 1A, step S4 in FIG. 2, which is performed when the bonding apparatus 1 (see FIG. 1) is used, is not performed.

[0056] As the top stage 20 further descends, the first workpiece 91 and the second workpiece 92 approach each other, and the protrusion 97 of the second workpiece 92 enters the recess 96 of the first workpiece 91, completely fitting the recess 96 and the protrusion 97 together. If the apex of the protrusion 97 does not coincide with the deepest part of the recess 96 in plan view during the process of fitting the recess 96 and the protrusion 97 together, the bottom stage 10 moves horizontally as the protrusion 97 descends and the contact area with the recess 96 increases, thereby adjusting the planar position. The bottom stage 10 is supported by the support member 38, which is a spring, on the base 31, allowing it to move horizontally while descending, simplifying the alignment of the first workpiece 91 and the second workpiece 92 in plan view. When the recess 96 and the protrusion 97 completely fit together, the bottom stage 10 is separated from the base 31, and the top stage 20 continues to descend, bringing the bottom stage 10 into contact with the base 31. Then, even after the bottom stage 10 comes into contact with the base 31, the top stage 20 is pressed downward with a predetermined force to apply a predetermined force to the first workpiece 91 and the second workpiece 92, thereby bonding the first workpiece 91 and the second workpiece 92 together.

[0057] Once the bonding of the first workpiece 91 and the second workpiece 92 is complete, the top support table 21 releases support of the second workpiece 92, and the top stage 20 is raised. Then, typically, when the top support table 21 separates from the second workpiece 92, the external force acting on the support member 38 is removed, and the support member 38 returns to its natural state (i.e., a state in which the load related to the bottom stage 10 acting on the support member 38 and the reaction force of the support member 38 are balanced). This results in the planar positions of the convex portion 15A and the concave portion 25 being aligned. The top stage 20 further rises, and the convex portion 15A fits into the concave portion 25. When the convex portion 15A fits snugly into the concave portion 25 with the support member 38 slightly stretched, the bottom stage 10 returns to its reference position. At this point, the top stage 20 has returned to its state prior to the start of bonding. Once this state is reached, the bottom support table 11 releases support of the bonded parts, and the bonded parts can be removed. As described above, the bonding apparatus 1A according to this modified example and the manufacturing method of a bonded component using the same also have the same effects as the bonding apparatus 1 (see FIG. 1) and the manufacturing method of a bonded component using the same.

[0058] In the above description, the fitting structure 95 is described as having the recess 96 formed in the first workpiece 91 and the protrusion 97 provided in the second workpiece 92. However, the recess 96 may be formed in the second workpiece 92 and the protrusion 97 may be provided in the first workpiece 91. Alternatively, for each of a plurality of pairs of recesses 96 and protrusions 97, the recess 96 and the protrusion 97 may be provided on either the first workpiece 91 or the second workpiece 92. For example, in one fitting structure 95, the recess 96 may be formed in the first workpiece 91 and the protrusion 97 may be provided in the second workpiece 92, and in another fitting structure 95, the recess 96 may be formed in the second workpiece 92 and the protrusion 97 may be provided in the first workpiece 91.

[0059] In the above description, the convex portions 15 in the laminating apparatus 1 are formed in a frustum shape (typically a truncated cone shape), but they may be formed in a pyramidal shape (typically a truncated cone shape). Also, the convex portions 15A in the laminating apparatus 1A are formed in a pyramidal shape (typically a truncated cone shape), but they may be formed in a frustum shape (typically a truncated cone shape).

[0060] In the above description, the convex portion 15 in the laminating device 1 is formed in a truncated cone shape whose horizontal cross-sectional area decreases upward, but it may be formed in a columnar (typically columnar) or tubular (typically cylindrical) shape whose horizontal cross-sectional shape does not change even when the axial position changes. Even if formed in this way, it can function as a stationary mechanism. Similarly, the convex portion 15A in the laminating device 1A may be formed in a columnar (typically columnar) or tubular (typically cylindrical) shape whose horizontal cross-sectional shape does not change even when the axial position changes.

[0061] In the above description, the elastic member 29 in the bonding apparatus 1 is a spring, but it may be an elastic member other than a spring, such as rubber.

[0062] In the above description, the static positioning mechanisms 50, 50A are configured to function as both static mechanisms and positioning mechanisms, but the static mechanism and positioning mechanism may also be configured separately and each may function independently.

[0063] In the above description, the laminating device 1 has the convex portion 15, the pressing member 26, and the small piece 34 with the concave portion 35 formed therein and the side wall 33, but these do not have to be provided if there is no need to provide the static positioning mechanism 50. Similarly, in the laminating device 1A, if there is no need to provide the static positioning mechanism 50A, there do not have to be provided the standing portion 13, the flange portion 14, the convex portion 15A, and the small piece 24 with the concave portion 25 formed therein and the side wall 23.

[0064] In the above description, the support member 38 is a spring, but depending on the situation, for example, an elastomer such as rubber, a sponge, a bellows, etc. may be used, which can be applied when metal cannot be used, for example.

[0065] In the above description, the support member 38 is assumed to be a spring (i.e., an elastic member) that allows the bottom stage 10 to move three-dimensionally relative to the base 31. However, the support member 38 only needs to be able to support the bottom stage 10 so that it can move at least in a two-dimensional plane relative to the base 31, and such a configuration may also be one in which two flat plate-like members are movable along each other's surface. In this case, it is preferable that the two flat plate-like members are moved parallel to the mounting surface of the bottom support table 11 (i.e., the surface on which the first workpiece 91 is placed).

[0066] In the above description, the bottom stage 10 is configured to be movable at least in a two-dimensional plane, and typically in three dimensions, using the support member 38, but the top stage 20 may also be configured to be movable in two or three dimensions using a configuration equivalent to the support member 38.

[0067] In the above explanation, the moving device 42 moves the top stage 20 in the far-near direction FN, but it may also move the base 31 in the far-near direction FN, or both the top stage 20 and the base 31 may be moved to move them relatively in the far-near direction FN. Also, in the above explanation, the moving device 42 is attached to the top stage 20 and moves the top stage 20 directly, but it may also move the top stage 20 indirectly via, for example, a gear, a transmission belt, or other member. The same applies when the moving device 42 moves the base 31.

[0068] In the above description, the bonding apparatus 1, 1A and the manufacturing method of bonded components have been described as exemplary embodiments using the drawings. The configuration, structure, number, arrangement, shape, material, etc. of each part in the description are not limited to the above specific examples, and any suitable alternatives selected by a person skilled in the art are also included within the scope of the present invention as long as they include the gist of the present invention. [Explanation of symbols]

[0069] 1, 1A laminating device 10 Bottom Stage (First Stage) 15, 15A Convex part (first part) 20 Top Stage (Second Stage) 24, 34 small pieces (second part) 25, 35 recess 26 Pressing member 31 Foundation 38 Support member 42 Mobile Devices 50, 50A Static Positioning Mechanism (Static Mechanism, Positioning Mechanism) 91 First Work (First Work) 92 Second Work (Second Work) 95 Interlocking structure 96 Depression 97 Protrusion FN Perspective direction

Claims

1. A bonding apparatus that bonds a first workpiece and a second workpiece, the first workpiece and the second workpiece have a fitting structure that allows them to fit together properly when attached to each other in a normal position; a first stage that supports the first workpiece; a second stage supporting the second workpiece at a position opposite to the first workpiece; The base and a moving device that directly or indirectly moves at least one of the base and the second stage in a direction toward or away from each other; a support member that supports the first stage relative to the base so as to be movable at least within a two-dimensional plane in a direction intersecting the perspective direction, Laminating device.

2. the support member is an elastic member that is deformable in the perspective direction and in a direction intersecting the perspective direction, the first stage is movable relative to the base in the perspective direction and in a direction intersecting the perspective direction; The laminating apparatus according to claim 1 .

3. a stationary mechanism for stationary the first stage at a position where the first workpiece is to be placed; The laminating apparatus according to claim 1 or 2.

4. a positioning mechanism for stopping the first stage at a predetermined position; The laminating apparatus according to claim 3 .

5. the positioning mechanism includes a first component provided on the first stage and a second component provided on the stationary mechanism; the first part and the second part include a protrusion formed on one of the first part and the second part and a recess formed on the other of the first part and the second part, and the protrusion can be fitted into the recess. The laminating apparatus according to claim 4 .

6. The convex portion is formed in a cone shape or a frustum shape, the recess is tapered; The laminating apparatus according to claim 5 .

7. the second stage has a pressing member that presses the first component or the first stage to release the engagement between the protrusion and the recess. The laminating apparatus according to claim 5 .

8. A method for manufacturing a bonded component by bonding a first workpiece and a second workpiece together using the bonding apparatus according to claim 1, comprising: the first stage supporting the first workpiece; the second stage supporting the second workpiece; a step of moving at least one of the base and the second stage in a direction toward each other to mate the mating structures of the first workpiece and the second workpiece; and moving at least one of the base and the second stage in a direction in which they approach each other, and pressing the first workpiece and the second workpiece, in which the fitting structures are fitted, in a direction in which they approach each other to bond them together. Manufacturing method for bonded parts.

Citation Information

Patent Citations

  • Pressure attaching device

    JP1994218822A

  • Device for applying skin material onto molding base material

    JP2000117760A

  • Device for supplying skin material into mold

    JP2000218641A

  • Resin molded article unit and method for molding resin molded article unit

    WO2019087889A1

  • Member sticking apparatus

    JP2014145057A