Power Modules and Equipment

Abstract

The power module includes a packaging body, a power chip and a control chip located in the packaging body, and a power pin and a control pin extending from a first side and a second side of the packaging body facing each other. The power chip is electrically connected to the control chip, the power pin is electrically connected to the power chip, and the control pin is electrically connected to the control chip. The packaging body includes a flow guide portion, which is located at at least one corner of the packaging body to prevent the packaging body from generating a void at the corner, and is configured to realize the function of resin flow guide.

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims priority from Chinese patent application No. 202211458029.5 filed on November 17, 2022, Chinese patent application No. 202211442180.X filed on November 17, 2022, and Chinese patent application No. 202223090111.5 filed on November 17, 2022, the entire disclosures of which are incorporated herein by reference.

[0002] The present disclosure relates to the field of electronic devices, and more particularly to power modules and equipment. [Background technology]

[0003] Power modules (PM) have features such as high current density, low saturation voltage, low drive power, high switching frequency, high functionality integration, ease of use, and excellent reliability, and are widely applicable to many fields, including electronic devices, home appliances, automobiles, railway transportation, industrial equipment, new energy sources, and smart grids. Power modules typically package the power chip and control chip in resin to achieve their high integration characteristics. Summary of the Invention [Means for solving the problem]

[0004] In one aspect, a power module is provided. The power module includes a packaging body, a power chip and a control chip provided within the packaging body, power pins extending from a first side of the packaging body, and control pins extending from a second side of the packaging body. The power chip is electrically connected to the control chip, the power pins are electrically connected to the power chip, and the control pins are electrically connected to the control chip. The first side is disposed opposite the second side. The packaging body includes a flow guide portion located at at least one corner of the packaging body and configured to provide a resin flow guide function, thereby preventing the packaging body from generating voids at the corner.

[0005] In another aspect, there is provided an installation comprising a controller and the power module provided by the above embodiment, the power module being connected to the controller. [Brief explanation of the drawings]

[0006] [Figure 1A] 1 is a diagram showing a structure in which a main body structure of a power module is packaged using a transfer molding method in the related art; [Figure 1B] FIG. 1 is a three-dimensional view of a power module according to a related art; [Figure 2] 1 is a three-dimensional view of a power module according to some embodiments. [Figure 3] 1 is a three-dimensional view of a power module according to some embodiments. [Figure 4] 1 is a three-dimensional view of a power module according to some embodiments. [Figure 5] 1 is a three-dimensional view of a power module according to some embodiments. [Figure 6] FIG. 1 is a top view of a power module according to some embodiments. [Figure 7] FIG. 1 is a top view of a power module according to some embodiments. [Figure 8] FIG. 2 is a bottom view of a power module according to some embodiments. [Figure 9] FIG. 1 is a top view of a power module according to some embodiments. [Figure 10] FIG. 10 is a partially enlarged view of the power module shown in FIG. [Figure 11A] 1A and 1B are diagrams illustrating a structure for packaging a power module body structure using a transfer molding method according to some embodiments. [Figure 11B] 1A and 1B are diagrams showing cross sections along the width direction of a power module according to some embodiments. [Figure 11C] 1A and 1B are diagrams showing cross sections along the width direction of a power module according to some embodiments. [Figure 11D] 1A and 1B are diagrams showing cross sections along the width direction of a power module according to some embodiments. [Figure 11E] 1A and 1B are diagrams showing cross sections along the width direction of a power module according to some embodiments. [Figure 12] FIG. 1 is a side view of a power module according to some embodiments. [Figure 13] 1 is a cross-sectional view of a power module according to some embodiments. [Figure 14] FIG. 14 is an enlarged view of a portion D1 of the power module in FIG. [Figure 15] FIG. 14 is an enlarged view of a portion D2 of the power module in FIG. [Figure 16] FIG. 14 is a partial enlarged view of D3 of the power module in FIG. [Figure 17] FIG. 1 is a top view of a power module according to some embodiments. [Figure 18] FIG. 18 is an enlarged view of a portion A1 of the power module in FIG. [Figure 19] 1 is a cross-sectional view of a power module according to some embodiments. [Figure 20] FIG. 20 is a partial enlarged view of B1 of the power module in FIG. [Figure 21]FIG. 20 is a partial enlarged view of B1 of the power module in FIG. [Figure 22] FIG. 1 illustrates the structure of an installation according to some embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0007] Hereinafter, several embodiments of the present disclosure will be clearly and completely described with reference to the drawings. Of course, the embodiments described herein are only a part of the embodiments of the present disclosure, and are not all of the embodiments. All other embodiments that can be conceived by a person skilled in the art based on the embodiments in the present disclosure are intended to be included in the scope of the present disclosure.

[0008] Hereinafter, the terms "first" and "second" are for descriptive purposes only and should not be understood as indicating or implying the relative importance or quantity of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the said features.

[0009] "A and / or B" includes three combinations: A only, B only, and a combination of A and B.

[0010] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized illustrative drawings. In the drawings, thicknesses of layers and regions are exaggerated for clarity. The exemplary embodiments of the present disclosure are not limited to the shapes of regions illustrated herein and should be construed to include deviations in shape due to manufacturing or otherwise. For example, an etching region shown as a rectangle typically has curved features. Thus, the regions shown in the drawings are exemplary in nature, and their shapes are not intended to represent the actual shape of the regions of the equipment and are not intended to limit the scope of the exemplary embodiments.

[0011] In related art, power modules (PMs) are typically packaged using a transfer molding process. As shown in FIG. 1A, for example, the main body of a power module includes a power chip, a control chip, a heat dissipation substrate, and a pin frame (including power pins 40' and a control chip 50'). The power module main body is placed in a mold cavity of a mold 101'. Liquid packaging resin is then injected into the mold cavity through a resin injection port A' on the mold. After the packaging resin hardens, the mold 101' is disassembled to obtain a power module 100' shown in FIG. 1B.

[0012] As shown in FIG. 1A, the mold has an upper housing and a lower housing, which are engaged to form a mold cavity therein. The power pins and control pins are pulled out from the engagement positions between the upper and lower housings. The resin injection port A' is typically provided on the side of the mold 101' from which the power pins 40' are pulled out, and is located near the engagement positions between the upper and lower housings. Therefore, during the resin injection process, the liquid packaging resin flows from the resin injection port to both sides and forward, for example, from the side from which the power pins 40' are pulled out to the side from which the opposing control pins 50' are pulled out, gradually filling the mold cavity.

[0013] However, at the corners of the mold cavity (corresponding to the corners of the formed packaging body 10′ as shown by the dotted circles in FIG. 1B ), the liquid packaging resin is impeded by the side walls of the mold cavity when it tries to flow there, making it difficult for the resin to continue flowing, and the packaging resin stagnates and accumulates there. Meanwhile, the liquid packaging resin is prone to contain air in the areas where it stagnates and accumulates, causing resin void defects. As a result, the formed packaging body 10′ has voids there. The formed power module 100′ has problems where the dielectric strength voltage is reduced at the locations where voids exist, reducing insulation reliability, and the electrical safety of the power module is reduced.

[0014] Based on this, an embodiment of the present disclosure provides a power module. As shown in Figures 11B to 11E, the main body structure of the power module 100 includes a power chip 20, a control chip 30, power pins 40 electrically connected to the power chip 20, and control pins 50 electrically connected to the control chip 30. The power pins 40 are used to connect the power chip 20 to an external driving member, and the control pins 50 are used to connect the control chip 30 to an external controller. The power chip 20 is further electrically connected to the control chip 30, and the control chip 30 is used to drive the power chip 20.

[0015] As shown in FIGS. 2 to 9 and 11B to 11E, the power module 100 further includes a packaging body 10 used to package the main body structure. The packaging body 10 has a first side surface 10A and a second side surface 10B. The first side surface 10A and the second side surface 10B are opposed to each other and extend along the longitudinal direction X of the packaging body. A portion of the power pins 40 (hereinafter referred to as the first portion) is drawn out from the first side surface 10A of the packaging body 10, and another portion (hereinafter referred to as the second portion) is located within the packaging body 10 and electrically connected to the power chip 20. A portion of the control pins 50 (hereinafter referred to as the first portion) is drawn out from the second side surface 10B of the packaging body 10, and another portion (hereinafter referred to as the second portion) is located within the packaging body 10 and electrically connected to the control chip 30.

[0016] As shown in FIGS. 2 to 9, there are a plurality of power pins 40 and a plurality of control pins 50, and the longitudinal direction X of the packaging body is the direction in which the plurality of power pins 40 or the plurality of control pins 50 are arranged.

[0017] In the embodiment of the present disclosure, a transfer molding method is used to package the main body structure of the power module 100 to form the packaging body 10. That is, the main body structure of the power module 100 is placed in a mold cavity, and the mold is provided with a resin injection port (for example, the resin injection port is located on the side of the mold where the power pins 40 are pulled out). Liquid resin is injected into the mold cavity through the resin injection port and fills the gap between the main body structure of the power module located in the mold cavity and the cavity wall of the mold cavity. After the resin is cured, the packaging body 10 as shown in FIG. 2 can be formed. The packaging body 10 can cover and protect the power chip 20 and the control chip 30, thereby improving the structural reliability of the power module 100.

[0018] 2 to 9, the packaging body 10 includes a flow guide portion 103. The flow guide portion 103 is located at at least one corner of the packaging body 10 and configured to achieve the function of a resin flow guide so as to prevent the packaging body 10 from generating a void at the corner.

[0019] Here, a bend refers to the position where two adjacent side surfaces of the packaging body 10 that form an included angle are connected, such as the position where the first side surface 10A of the packaging body is connected to a side surface adjacent to the first side surface 10A and that forms an included angle (for example, the third or fourth side surface described below), or the position where the second side surface 10B of the packaging body is connected to a side surface adjacent to the second side surface 10B and that forms an included angle (for example, the third or fourth side surface described below).

[0020] It should be understood that the shape of the cavity wall of the mold cavity enclosed by the mold should match the outer shape of the packaging body 10 of the power module 100 in the embodiment of the present disclosure. In other words, the mold cavity should have a cavity wall structure corresponding to the outer shape structure of the packaging body 10.

[0021] For example, the portion of the molded packaging body 10 that corresponds to the resin injection port of the mold is called the resin injection portion 11 of the packaging body 10 (as shown in Figure 2), and the roughness of the resin injection portion 11 is greater than the roughness of other portions of the packaging body 10.

[0022] As described above, the cavity wall of the mold cavity has a cavity wall flow guide structure at its corner. This cavity wall flow guide structure corresponds to the flow guide portion 103 of the packaging body 10. When resin flows into this cavity wall flow guide structure, the cavity wall flow guide structure located at the corner of the mold cavity generates a component force that guides the resin to the opposite side. This improves the fluidity of the resin at this corner, guiding the resin to continue flowing and preventing stagnation or accumulation of resin at the corner. This makes it less likely that air will be mixed into the resin, causing resin voids. This prevents voids from occurring at the corner of the formed packaging body 10, ensuring the insulation and electrical safety of the power module 100.

[0023] In addition, in the power module 100 provided by the embodiment of the present disclosure, a flow guide portion 103 is provided at the corner of the packaging body 10, thereby ensuring the insulation and electrical safety of the power module 100, eliminating the need for additional manufacturing equipment and reducing costs.

[0024] In the embodiment of the present disclosure, the flow guide portion 103 may be one or more. For example, the flow guide portion 103 may be provided at a corner on the side where the power pin 40 of the packaging body 10 is pulled out. When the resin is injected, the cavity wall flow guide structure corresponding to the corner in the mold cavity generates a component force acting on the resin toward the opposite side, causing the resin to flow toward the opposite side, thereby reducing stagnation and accumulation of resin at the corner. Similarly, the flow guide portion 103 may also be provided at a corner on the side where the control pin 50 of the packaging body 10 is pulled out. This allows the resin that has flowed into the corner in the mold cavity to flow toward the center of the corner, thereby reducing stagnation and accumulation of resin at the corner.

[0025] It should be understood that other corners that may affect the resin flow in the mold cavity may also be provided with corresponding cavity wall flow guide structures, so that the packaging body 10 forms corresponding flow guide portions 103 to improve the resin flow there, avoid resin stagnation and accumulation, reduce resin void defects, and ensure the electrical safety of the power module.

[0026] In some embodiments, the packaging body 10 includes a flow guide portion (hereinafter referred to as a first flow guide portion, and the first flow guide portion is indicated by 1031 in Figures 2 to 4 and 6 to 9). The flow guide portion is located at a bend in the end of the first side surface 10A of the packaging body 10 along the longitudinal direction X of the packaging body.

[0027] Here, the corner refers to the position where the first side surface 10A of the packaging body 10 and the side surface adjacent to the first side surface 10A (the third side surface 10C or the fourth side surface 10D described later) are connected.

[0028] For example, there may be only one first flow guiding portion 1031. The first flow guiding portion 1031 may be provided at a corner at one end of the first side surface 10A of the packaging body 10 in the longitudinal direction X of the packaging body 10, i.e., at a corner where the first side surface 10A and the fourth side surface 10D are connected. Alternatively, the first flow guiding portion 1031 may be provided at a corner at the other end of the first side surface 10A of the packaging body 10 in the longitudinal direction X of the packaging body 10, i.e., at a corner where the first side surface 10A and the third side surface 10C (i.e., the other side surface adjacent to the first side surface 10A excluding the fourth side surface 10D) are connected.

[0029] 2 to 4 and 6 to 9, the number of first flow guide portions 1031 may be two, and they are provided at the corners of both ends of the first side surface 10A of the packaging body 10 along the longitudinal direction X of the packaging body, i.e., at the corner where the first side surface 10A and the fourth side surface 10D are connected, and at the corner where the first side surface 10A and the third side surface 10C are connected.

[0030] As a result, when resin is injected, the cavity wall flow guide structure corresponding to the first flow guide portion 1031 in the mold cavity can generate a component force action that guides the resin to the opposite side, thereby improving the fluidity of the resin here and guiding the resin to flow forward, thereby reducing stagnation and accumulation of resin at the position corresponding to the bend in the mold cavity, reducing the occurrence of resin voids, and ensuring the electrical safety of the power module.

[0031] 2 to 4 and 6 to 9, the first flow guide portion 1031 may be chamfered. Here, a chamfer can be understood as a surface that forms a certain angle with both the first side surface 10A and the third side surface 10C (or the fourth side surface 10D), and that is formed by cutting off a sharp edge connecting the first side surface 10A and the third side surface 10C (or the fourth side surface 10D).

[0032] For example, the resin injection port is located on the side where the power pin of the mold is pulled out (i.e., the side corresponding to the first side surface 10A of the packaging body 10), and when resin is injected into the mold cavity through the resin injection port and the resin flows to a position corresponding to the first flow guide portion 1031 in the mold cavity, as shown in Figure 9, the cavity wall flow guide structure corresponding to the chamfer in the mold cavity can generate a component force Fy on the resin here that is directed toward the opposite side (e.g., the second side surface 10B), so that the resin that has flowed into the corner in the mold cavity flows forward, preventing stagnation and accumulation at the corner and reducing the occurrence of resin voids.

[0033] As can be seen from the above, the chamfer angle can affect the flow guiding effect of the flow guide portion. For example, as shown in FIG. 10, the chamfer angle θ can satisfy the relationship 50°≦θ≦70°, thereby ensuring a high flow guiding capability of the chamfer and saving raw materials. For example, the chamfer angle θ can be 50°, 60°, or 70°. The chamfer angle θ can be set between 50° and 60°, or between 60° and 70°. Specifically, when the position of the apex of the chamfer is constant and the length of the hypotenuse of the chamfer is the same, setting the chamfer angle θ between 50° and 60° improves the flow guiding capability, but increases the width of the power module, preventing miniaturization and saving raw materials. Setting the chamfer angle θ between 60° and 70° further saves raw materials, but reduces the flow guiding capability. Setting the chamfer angle θ to 60° balances the width and flow guiding capability of the power module. The embodiments of the present disclosure are not limited thereto.

[0034] For example, as shown in FIG. 10 , the side length L of the chamfer may be greater than 1.2 mm to further improve the flow guiding effect of the chamfer. For example, the side length L of the chamfer may be 1.2 mm, 1.4 mm, or 1.6 mm, but the embodiments of the present disclosure are not limited thereto. The side length L of the chamfer may be set to 1.2 mm to 1.4 mm, or may be set to 1.4 mm to 1.6 mm. Specifically, when the position of the apex of the chamfer is constant and the length of the hypotenuse of the chamfer is the same, setting the side length L of the chamfer to 1.2 mm to 1.4 mm reduces the width of the power module but affects the flow guiding capability. Setting the side length L of the chamfer to 1.4 mm to 1.6 mm further improves the flow guiding capability and further reduces the resin gap, but further improves the width of the power module. As shown in FIG. 10 , the side length L of the chamfer may be 1.4 mm. In this case, a balance between the width of the power module and the flow guiding capability can be achieved.

[0035] Since the first flow guide portion 1031 is provided at the corner between the first side surface 10A and the third side surface 10C (or the fourth side surface 10D), when a power module is used, it is usually attached to the center position in the width direction of the power module. Therefore, it should be understood that the side length L of the chamfer does not exceed 0.5 times the dimension of the third side surface 10C (or the fourth side surface 10D) along the width direction Y of the packaging body 10.

[0036] In the embodiment of the present disclosure, the direction in which the first side surface 10A of the packaging body points toward the second side surface 10B is referred to as the width direction Y of the packaging body, and the width direction of the power module coincides with the width direction Y of the packaging body.

[0037] Similarly, in some other examples, the first flow guide portion 1031 may be a convex portion, for example, an arc surface whose arc protrudes outside the packaging body 10, and similarly serves to guide the resin at the corner where the first flow guide portion 1031 of the corresponding packaging body 10 in the mold cavity is located forward, thereby avoiding stagnation or accumulation of resin at the corner, reducing the occurrence of resin voids, and improving the electrical safety of the power module.

[0038] Of course, the shape of the first flow guiding portion 1031 is not limited to this, and the embodiments of the present disclosure are not limited to this.

[0039] In some embodiments, as shown in Figures 2 to 4 and 6 to 9, the packaging body 10 further includes a flow guide portion (hereinafter referred to as the second flow guide portion 1032) at the bend in the end of the second side surface 10B along the longitudinal direction X of the packaging body.

[0040] Here, the corner refers to the position where the second side surface 10B of the packaging body 10 and the side surface adjacent to the second side surface 10B (hereinafter referred to as the third side surface 10C or the fourth side surface 10D) are connected.

[0041] Exemplarily, the number of second flow guiding portions 1032 may be one or two. For example, the second flow guiding portion 1032 may be provided at a corner of at least one end of the second side surface 10B of the packaging body 10 along the longitudinal direction X of the packaging body. That is, the second flow guiding portion 1032 may be provided at a corner where the second side surface 10B and the fourth side surface 10D are connected and / or a corner where the second side surface 10B and the third side surface 10C are connected.

[0042] As a result, when the injected resin flows into the corner corresponding to the second flow guide portion 1032 in the mold cavity, the cavity wall flow guide structure corresponding to that second flow guide portion 1032 in the mold cavity can generate a component force (component force Fy as shown in Figure 9) toward the center on the resin that has flowed here, thereby guiding the resin that has flowed to that position to flow toward the center of the mold cavity, thereby reducing the stagnation and accumulation of resin at this corner, reducing the occurrence of resin voids, and ensuring the electrical safety of the power module.

[0043] In some examples, the second flow guide portion 1032 may be a chamfer, a protrusion, or a recess.

[0044] 2, 3, 6, and 9, the second flow guiding portion 1032 is chamfered. For the chamfer angle and side length, please refer to the above description of the first flow guiding portion 1031, and the description will not be repeated here.

[0045] Also, exemplarily, the second flow guiding portion 1032 may be a convex portion, for example, an arcuate surface (not shown) whose arc protrudes outward from the packaging body.

[0046] 4, 7, and 8, the second flow guide portion 1032 is a recess. Similarly, a cavity wall flow guide structure corresponding to the recess in the mold cavity can push the resin flowing into the corner, directing the resin toward the center of the mold cavity. This prevents the resin from stagnating or accumulating at the corner, reducing the occurrence of resin voids and saving more raw materials.

[0047] In some embodiments, when the second flow guiding portion 1032 is a recess, the second flow guiding portion 1032 may be a single recess, such as the second flow guiding portion 1032 located at the corner between the second side 10B and the fourth side 10D as shown in Figures 7 and 8. The second flow guiding portion 1032 may be two consecutive recesses, such as a first recess 10321 and a second recess 10322, such as the second flow guiding portion 1032 located at the corner between the second side 10B and the third side 10C as shown in Figures 7 and 8.

[0048] 3 to 7 and 11B to 11E, the packaging body 10 further includes a recessed first step portion 12. As shown in FIGS. 11B to 11E, the first step portion 12 is located on a side of a first portion 401 of the power pin 40 that extends toward the outside of the packaging body 10, the side being closer to a bottom surface 10E of the packaging body.

[0049] Here, the recessed first step portion 12 means that the first step portion 12 is recessed toward the inside of the packaging body 10. That is, as shown in FIGS. 11B to 11E, the first step portion 12 has a step surface 12A and a side surface 12B. Along the width direction Y of the packaging body 10, the side surface 12B of the first step portion 12 is closer to the center of the packaging body 10 than the first side surface 10A of the packaging body 10. Also, along the thickness direction Z of the packaging body 10, the step surface 12A of the first step portion 12 is closer to the center of the packaging body 10 than the bottom surface 10E of the packaging body.

[0050] Here, the center of the packaging body 10 can be understood as the physical center of gravity of the packaging body.

[0051] In the power module 100 provided according to some embodiments of the present disclosure, as shown in FIGS. 11B to 11D, the main structure of the power module 100 further includes a heat dissipation substrate 60. The power chip 20 is mounted on the heat dissipation substrate 60, which is used to dissipate heat from the power chip 20 and ensure normal operation of the power chip 20. The bottom surface of the heat dissipation substrate is flush with the bottom surface 10E of the packaging body and is exposed to the outside of the packaging body 10, thereby improving the heat dissipation effect. In this case, the bottom surface 10E of the packaging body 10 is the heat dissipation surface of the power module 100.

[0052] As shown in Figures 11B to 11D, the surface on which the heat dissipation substrate 60 of the packaging body 10 is provided is called the bottom surface 10E of the packaging body 10, the surface opposite the bottom surface 10E of the packaging body 10 is called the top surface 10F of the packaging body, and the direction in which the bottom surface 10E of the packaging body points toward the top surface 10F is called the thickness direction Z of the packaging body.

[0053] For example, as shown in Figure 11B, along the thickness direction Z of the packaging body, the distance H1 from the step surface 12A of the first step portion 12 to the bottom surface 10E of the packaging body is smaller than the distance H0 from the resin injection portion 11 to the bottom surface 10E of the packaging body.

[0054] In some embodiments of the present disclosure, the packaging body has a first step portion 12, and as shown in FIG. 11A, the mold cavity 1011 of the mold 101 used to form the packaging body 10 shown in FIG. 11B has a first cavity wall step 1012 corresponding to the first step portion 12, and the first cavity wall step 1012 is located on the side closer to the bottom of the mold than the resin injection port A, i.e., it should be understood that the distance H11 from the step surface of the first cavity wall step 1012 to the bottom surface of the mold cavity is smaller than the distance H01 from the resin injection port A to the bottom surface of the mold cavity.

[0055] As a result, when resin is injected into the mold cavity through the resin injection port, the resin can first fall onto the first cavity wall step 1012, which provides a certain cushioning effect, reducing the height at which the resin pushes toward the heat dissipation substrate 60 and reducing the diagonally downward impact force of the resin on the heat dissipation substrate 60. This allows the resin to flow as slowly as possible toward the heat dissipation substrate 60, thereby alleviating the problem of misalignment defects in the heat dissipation substrate 60 and improving the electrical safety and stability of the power module.

[0056] Furthermore, by providing the first cavity wall step 1012, the space between the heat dissipation substrate 60 and the side of the mold cavity corresponding to the power pin 40 (i.e., the space between the heat dissipation substrate 60 and the first cavity wall) can be reduced, so that when the resin is injected, the amount of resin that accumulates in the space can be reduced, and the risk of burrs being generated due to resin overflowing from the bottom surface of the heat dissipation substrate 60 can be reduced.

[0057] 11B, a distance H1 from the step surface 12A of the first step portion 12 to the bottom surface 10E of the packaging body is smaller than a distance H2 from the top surface 20A of the power chip 20 (i.e., the surface away from the bottom surface 10E of the packaging body) to the bottom surface 10E of the packaging body 10. Correspondingly, a distance H11 from the step surface of the cavity wall step 1012 provided in the mold cavity to the bottom surface of the mold cavity is smaller than a distance H11 from the top surface 20A of the power chip 20 to the bottom surface of the mold cavity, as shown in FIG.

[0058] As a result, when resin is injected into the mold cavity through the resin injection port A, the resin flows through the cavity wall step 1012 to the heat dissipation substrate 60 and the power chip 20, and at this time, the resin tends to flow slowly horizontally toward the heat dissipation substrate 60, which significantly reduces the impact force of the resin on the heat dissipation substrate 60, and therefore, misalignment defects caused by the impact force of the resin on the heat dissipation substrate 60 can be further reduced.

[0059] Furthermore, if the distance H1 from the step surface 12A of the first step portion 12 to the bottom surface 10E of the packaging body 10 is small, the space between the heat dissipation substrate 60 and the side surface corresponding to the power pin of the mold cavity also becomes small, so the amount of resin accumulated in the space can be further reduced, thereby further reducing the risk of burrs occurring due to resin overflowing from the bottom surface of the heat dissipation substrate 60.

[0060] 3 to 7, the first step portion 12 includes a main body portion 121 and at least one end portion 122. The main body portion 121 extends along the length direction X of the packaging body 10. The end portion 122 extends along the width direction Y of the packaging body 10. Exemplarily, there may be one end portion 122, which is located on one side of the main body portion 121 along the length direction X of the packaging body 10. Also, exemplarily, there may be two end portions 122, which are located on both sides of the main body portion 121 along the length direction X of the packaging body 10.

[0061] In this case, the first step portion 12 further includes a third flow guide portion 1033. The third flow guide portion 1033 connects the main body portion 121 and the end portion 122 of the first step portion 12.

[0062] It should be understood that the third flow guide portion 1033 is located at the corner of the first step portion 12 so as to avoid stagnation or accumulation of resin as it flows to the position corresponding to the corner in the mold cavity.

[0063] For example, when the first step portion 12 has only one end portion 122, the first step portion 12 has only one third flow guiding portion 1033. Also, for example, when the first step portion 12 has two end portions 122, the first step portion 12 may have two third flow guiding portions 1033, and one third flow guiding portion 1033 connects one end portion 122 and the main body portion 121.

[0064] It should be understood that when the first step portion 12 has the third flow guide portion 1033, the first cavity wall step corresponding to the first step portion in the mold cavity of the mold that forms the packaging body 10 also has a cavity wall flow guide structure corresponding to the third flow guide portion 1033.

[0065] As a result, when resin is injected into the mold cavity, if the resin flows into a corner corresponding to the third flow guide section 1033 in the mold cavity, the cavity wall flow guide structure corresponding to the third flow guide section 1033 in the mold cavity can generate a component force action that guides the resin to the opposite side, thereby improving the fluidity of the resin here and guiding the resin to flow forward, preventing the resin from stagnating here and further reducing the occurrence of resin voids.

[0066] In some examples, the third flow guiding portion 1033 may be chamfered as shown in Figures 3, 4, 6, and 7. In some other examples, the third flow guiding portion 1033 may be a convex portion. For example, as shown in Figure 5, the third flow guiding portion 1033 is an arcuate surface that protrudes toward the outside of the packaging body 10.

[0067] Here, for the specific installation and effects of the third flow guiding part 1033, reference may be made to the above description of the first flow guiding part 1031, and the description will not be repeated here.

[0068] 3 to 7 and 11B to 11E, the packaging body 10 further includes a recessed second step portion 13. As shown in FIGS. 11B to 11E, the second step portion 13 is located on a side of the first portion 501 of the control pin 50 that extends toward the outside of the packaging body 10, closer to the bottom surface 10E of the packaging body.

[0069] Here, similar to the recessed first step portion 12, the recessed second step portion 13 means that the second step portion 13 is recessed toward the inside of the packaging body 10. That is, the second step portion 13 has a step surface 13A and a side surface 13B. Along the width direction Y of the packaging body 10, the side surface 13B of the second step portion 13 is closer to the center of the packaging body 10 than the second side surface 10B of the packaging body 10. Also, along the thickness direction Z of the packaging body 10, the step surface 13A of the second step portion 13 is closer to the center of the packaging body 10 than the bottom surface 10E of the packaging body.

[0070] In some embodiments of the present disclosure, a second step portion 13 is provided on a side of the first portion 501 of the control pin 50 extending toward the outside of the packaging body 10, closer to the bottom surface 10E of the packaging body 10. Correspondingly, as shown in Fig. 11A, the mold cavity 1011 of the mold 101 has a second cavity wall step 1013 corresponding to the second step portion 13 of the packaging body 10. Thus, by providing the second cavity wall step 1013, it is possible to reduce the space between the heat dissipation substrate 60 and the side of the mold cavity corresponding to the control pin 50 (i.e., the space between the heat dissipation substrate 60 and the second cavity wall step 1013), thereby reducing the amount of resin that accumulates in that space and further reducing the risk of burrs being generated due to resin overflowing from the bottom surface of the heat dissipation substrate 60.

[0071] In some examples, a distance H13 from the step surface 13A of the second step portion 13 to the bottom surface 10E of the packaging body along the thickness direction Z of the packaging body 10 is approximately equal to a distance H1 from the step surface 12A of the first step portion 12 to the bottom surface 10E of the packaging body. Also, as shown in Fig. 11C, a distance D2 from the side surface 13B of the second step portion 13 to the second side surface 10B of the packaging body 10 along the width direction Y of the packaging body 10 is approximately equal to a distance D1 from the side surface 12B of the first step portion 12 to the first side surface 10A of the packaging body 10. That is, the second step portion 13 and the first step portion 12 are provided approximately symmetrically along the width direction Y of the packaging body 10.

[0072] This arrangement not only simplifies the manufacturing process, but also allows resin to more easily fill the space between the heat dissipation substrate 60 and the side of the mold cavity corresponding to the control pin 50, thereby avoiding defects that would cause resin voids in that space.

[0073] 8 and 11B to 11E, the packaging body 10 further includes a recessed third step portion 14. As shown in FIGS. 11B to 11E, the third step portion 14 is located on a side of the first portion 501 of the control pin 50 that extends toward the outside of the packaging body 10, the side facing away from the bottom surface 10E of the packaging body.

[0074] Here, similar to the recessed first step portion 12, the recessed third step portion 14 means that the third step portion 14 is recessed toward the inside of the packaging body 10. That is, the third step portion 14 has a step surface 14A and a side surface 14B. Along the width direction Y of the packaging body, the side surface 14B of the third step portion 14 is closer to the center of the packaging body 10 than the second side surface 10B of the packaging body 10. Also, along the thickness direction Z of the packaging body, the step surface 14A of the third step portion 14 is closer to the center of the packaging body 10 than the top surface 10F of the packaging body.

[0075] The surface of the packaging body 10 that is perpendicular to the thickness direction and on which the heat dissipation substrate 60 is not provided is referred to as the upper surface 10F of the packaging body 10.

[0076] Because the side of the mold cavity where the control pin 50 is provided is far from the resin injection port, by providing a second step 13 and a third step 14 on either side of the first portion 501 of the control pin 50 of the packaging body 10 that extends toward the outside of the packaging body 10, the flow rate of the resin inside the mold on the side where the control pin 50 is provided inside the mold cavity can be adjusted when the resin is injected, thereby balancing the flow rate inside the entire mold cavity and preventing the occurrence of voids. Furthermore, the resin injection time can be shortened.

[0077] In some examples, as shown in FIG. 11B, the distance H14 from the step surface 14A of the third step portion 14 to the top surface 10F of the packaging body is smaller than the distance H13 from the step surface 13A of the second step portion 13 to the bottom surface 10E of the packaging body, and / or the distance H1 from the step surface 12A of the first step portion 12 to the bottom surface 10E of the packaging body.

[0078] This allows the flow rate of the resin on one side of the control pin in the mold cavity to be further adjusted, on the premise that the resin can fully immerse the control chip 30, to balance the flow rate throughout the entire mold cavity and avoid the occurrence of voids.

[0079] In some embodiments, as shown in FIGS. 3 to 8 , a flow guide portion is provided at the corner of the second step portion 13 and / or the third step portion 14 included in the packaging body 10. The flow guide portion is configured to achieve a resin flow guide function to prevent stagnation or accumulation of resin when it flows to a position corresponding to the corner in the mold cavity. For example, a fourth flow guide portion 1034 is provided at the corner of the second step portion 13. Also, for example, a fifth flow guide portion 1035 is provided at the corner of the third step portion 14.

[0080] 6, the second step portion 13 includes a main body portion 131 and at least one end portion 132. The main body portion 131 extends along the length direction X of the packaging body 10. The end portion 132 extends along the width direction Y of the packaging body 10. The fourth flow guide portion 1034 is connected between the main body portion 131 and the end portion 132.

[0081] 8 , the third step portion 14 includes a main body portion 141 and at least one end portion 142. The main body portion 141 extends along the length direction X of the packaging body 10. The end portion 142 extends along the width direction Y of the packaging body 10. The fifth flow guide portion 1035 is connected between the main body portion 141 and the end portion 142.

[0082] In some embodiments, the fourth flow guiding portion 1034 and / or the fifth flow guiding portion 1035 may be chamfered or convex. For specific shapes and effects of the fourth flow guiding portion 1034 and the fifth flow guiding portion 1035, please refer to the above description of the second flow guiding portion 1032, and will not be described again here.

[0083] In the power module provided by some embodiments of the present disclosure, the main body structure of the power module can adopt various structural layouts and is not particularly limited here.

[0084] For example, the main body structure of the power module 100 employs a layout in which a direct bond copper (DBC) ceramic substrate is arranged. As shown in FIG. 11B, the heat dissipation substrate 60 included in the main body structure of the power module 100 is an integrated double-sided copper-clad ceramic plate (also referred to as a DBC ceramic substrate), and includes a ceramic plate 61 and a copper layer 62 and a copper layer 63 located on either side of the ceramic plate. The power chip 20 may be disposed on the copper layer 62 of the double-sided copper-clad ceramic plate. For example, the power pin 40 may be directly welded onto the copper layer 62 of the double-sided copper-clad ceramic plate, i.e., the copper layer 62 serves as a power chip pad used to support the power chip 20. The other copper layer 63 of the double-sided copper-clad ceramic plate is flush with the bottom surface 10E of the packaging body 10 and is exposed to the outside of the packaging body 10, i.e., the surface of the other copper layer 63 of the double-sided copper-clad ceramic plate away from the ceramic plate 61 is flush with the bottom surface 10E of the packaging body 10 and is exposed to the outside of the packaging body 10. In this embodiment, the DBC ceramic substrate can achieve both conductive connection to the power chip 20 and thermal conduction to the power chip 20. Control chip pads are provided on the second portions 502 of the control pins 50 located within the packaging body 10 (i.e., the side away from the bottom surface 10E of the packaging body), and the control chip is mounted on the control chip pads.

[0085] Also, for example, the main body structure of the power module 100 adopts a layout in which a DBC structure and a printed circuit board (PCB) are installed simultaneously. As shown in FIG. 11C, the heat dissipation substrate 60 included in the main body structure of the power module 100 is a DBC ceramic substrate, the structure of which is the same as that of the DBC ceramic substrate shown in FIG. 11B, and will not be described again here. In this case, the power module 100 also includes a PCB packaged inside the packaging body 10, and the PCB can serve as a control chip pad for mounting the control chip 30. That is, the control chip 30 is mounted on the printed circuit board PCB. The control pins 50 can be welded onto the printed circuit board PCB.

[0086] 11D, the main body structure of the power module 100 employs a layout in which a heat sink is disposed. As shown in FIG. 11D, the heat dissipation substrate 60 included in the main body structure of the power module 100 includes a heat dissipation copper plate 64 and an insulating layer 65 located on the heat dissipation copper plate 64. The second portion 402 of the power pin located within the packaging body can extend to the heat dissipation substrate 60. A power chip pad (not shown in the drawings) is provided on the second portion 402 of the power pin located within the packaging body (i.e., the side away from the heat dissipation substrate 60), and the power chip 20 can be mounted on the power chip pad. A control chip pad is provided on the second portion 502 of the control pin 50 located within the packaging body 10 (i.e., the side away from the bottom surface 10E of the packaging body), and the control chip 30 is mounted on the control chip pad.

[0087] 11E, the second portion 402 located within the power pin packaging body may be a first copper frame, and the power chip 20 may be mounted on the first copper frame; that is, the second portion 402 located within the power pin packaging body may be a power chip pad used to mount the power chip 20. The second portion 502 located within the control pin packaging body 10 may be a second copper frame, and the control chip 30 may be mounted on the second copper frame; that is, the second portion 502 located within the control pin packaging body 10 may be a control chip pad used to mount the control chip 30.

[0088] In some embodiments of the present disclosure, a mold for forming the packaging body 10 using a transfer molding method may have a plurality of resin injection ports. The plurality of resin injection ports may be arranged at intervals on a side of the mold from which the plurality of power pins 40 are drawn. For example, each resin injection port may be located between two power pins 40 along the length direction of the mold (i.e., the length direction X of the packaging body). Correspondingly, in some embodiments, the packaging body 10 has a plurality of resin injection sections 11. The plurality of resin injection sections 11 may be located at intervals on a first side surface 10A of the packaging body.

[0089] 12, the packaging body 10 has two resin injection portions 11, for example, a first resin injection portion 1021 and a second resin injection portion 1022. Along the longitudinal direction X of the packaging body 10, the first resin injection portion 1021 and the second resin injection portion 1022 are uniformly positioned on the first side surface 10A of the packaging body 10. That is, along the longitudinal direction X of the packaging body 10, the distance H101 between the first resin injection portion 1021 and its nearest bend, the distance H102 between the first resin injection portion 1021 and the second resin injection portion 1022, and the distance H103 between the second resin injection portion 1022 and its nearest bend are approximately equal.

[0090] This allows the resin to flow evenly to both sides and the center of the mold cavity when it is injected, which is advantageous for uniformly filling the resin in the mold cavity and also has the effect of reducing resin voids.

[0091] In the power module 100 provided by the embodiment of the present disclosure, the control chip 30 is used to drive and control the power chip 20. Typically, the control chip 30 is used to receive external control signals or commands from a microprocessor and convert these commands into signals suitable for driving the power chip.

[0092] 13, the main body structure of the power module 100 further includes a control chip pad 300 for mounting the control chip 30. The control chip pad 300 can provide a stable and reliable mounting position for the control chip 30, ensuring stable operation of the control chip 30 in the power module 100.

[0093] The main body structure of the power module 100 further includes a bootstrap chip 90 and a bootstrap chip pad 900 used to mount the bootstrap chip 90. The bootstrap chip 90 is connected to an external power supply and can be used, for example, to boost the power supply voltage provided by the external power supply. For example, the bootstrap chip 90 is electrically connected to one pin (referred to as a third function pin in the following embodiments to distinguish between different pins) 53 via a wire 391, which can be a high-voltage pin.

[0094] The bootstrap chip pad 900 is spaced apart from the control chip pad 300. That is, a gap is provided between the bootstrap chip pad 900 and the control chip pad 300, so that the bootstrap chip pad 900 and the control chip pad 300 are not electrically connected to each other, ensuring that the bootstrap chip 90 and the control chip pad 300 each have independent and reliable mounting positions, thereby ensuring the normal operation of the power module 100.

[0095] For example, the bootstrap chip pad 900 and the control chip pad 300 may be spaced apart along the width of the power module 100 .

[0096] The width direction of the power module 100 coincides with the width direction Y of the packaging body, and the length direction of the power module 100 coincides with the length direction X of the packaging body.

[0097] The bootstrap chip pad 900 includes a partition 901. The partition 901 divides the bootstrap chip pad 900 into two sections: a chip welding section 902 and a wire connection section 903. The chip welding section 902 is used to mount the bootstrap chip 90, and the wire connection section 903 is used to electrically connect the bootstrap chip pad 900 and the control chip 30 via wires 39, thereby achieving circuit continuity in the power module 100.

[0098] A partition 901 may be provided on the bootstrap chip pad 900 to separate the chip weld 902 and the wire connection 903 on the bootstrap chip pad 900, provided that the bootstrap chip pad 900 provides a stable and reliable attachment location for the bootstrap chip 90 and a stable and reliable connection location for the wire 39.

[0099] When the bootstrap chip 90 is welded to the tip weld 902, the solder used for welding may overflow and spread from the tip weld 902. In this case, the partition 901 can receive the overflowing solder. This prevents the solder from flowing to the wire connection portion 903 and coming into contact with the wire 39, causing a wire short circuit. This improves the safety and stability of the operation of the power module 100 when the bootstrap chip 90 is welded.

[0100] In some embodiments, as shown in Figures 14 to 16, the dividers 901 are strip-shaped grooves.

[0101] The partition 901 mainly serves to separate the chip welding portion 902 and the wire connection portion 903 on the bootstrap chip pad 900. By configuring the partition 901 as a strip-shaped groove, the partition 901 can extend its length on the bootstrap chip pad 900. This allows the partition 901 to completely separate the chip welding portion 902 and the wire connection portion 903, effectively preventing solder from flowing to the wire connection portion 903 when the bootstrap chip 90 is welded. The partition 901 also has a large solder capacity, allowing the partition 901 to accommodate as much solder as possible. This effectively ensures that the wire 39 used to connect the bootstrap chip pad 90 and the control chip 30 is properly connected to the wire connection portion 903 when the bootstrap chip 90 is welded, improving the circuit stability of the power module 100.

[0102] 13 to 16, the control chip pad 300 and the bootstrap chip pad 900 are spaced apart across the width of the power module 100. A partition 901 extends across the width of the power module 100, thereby dividing the bootstrap chip pad 900 into a chip weld 902 and a wire connection 903 across the length of the power module 100.

[0103] In these embodiments, the control chip pads 300 and the bootstrap chip pads 900 are spaced apart across the width of the power module 100, which not only optimizes the structural placement of the control chip pads 300 and the bootstrap chip pads 900 in the power module 100, but also facilitates routing and connection of the wires 39 used to connect the control chip pads 300 and the control chip 30 in the power module 100.

[0104] Furthermore, by extending partition portion 901 along the width direction of power module 100, partition portion 901 can effectively receive overflowing solder, and the processing length of partition portion 901 on bootstrap chip pad 900 can be shortened, thereby shortening the processing time for partition portion 901, and effectively improving the production efficiency of power module 100.

[0105] At the same time, by extending along the width direction of the power module 100, the bootstrap chip pad 900 can be divided into a chip weld 902 and a wire connection 903 along the length direction of the power module 100. This makes it easy to determine the positions of the chip weld 902 and the wire connection 903 on the bootstrap chip pad 900, so that the chip weld 902 facilitates welding the bootstrap chip 90, and the wire connection 903 facilitates connecting the wire 39, thereby improving the ease of installation of the power module 100.

[0106] 13 , there are multiple bootstrap chip pads 900, and each bootstrap chip 90 is provided on each bootstrap chip pad 900. This not only ensures that the number of bootstrap chips 90 in the power module 100 meets the operational requirements of the electronic equipment to which the power module 100 is applied, but also ensures that each bootstrap chip 90 in the power module 100 has a stable and independent mounting space, thereby ensuring the convenience of mounting the bootstrap chips 90 in the power module 100 and the operational reliability.

[0107] 13, the bootstrap chip pads 900 are spaced apart along the length of the power module 100. At least one of the bootstrap chip pads 900 located at one end along the length of the power module 100 has a wire connection 903 that is closer to the control chip 30 than the chip weld 902.

[0108] This makes it possible to prevent the width of the bootstrap chip pad 900 (i.e., the dimension along the width direction of the power module 100) from increasing when multiple bootstrap chips 90 are attached to the power module 100 at the same time, thereby improving the compactness of the structure of the power module 100 and the space utilization rate of the power module 100.

[0109] Furthermore, when the bootstrap chip pad 900 and the control chip pad 300 are spaced apart across the width of the power module 100, the wire 39 can easily connect the control chip 30 to the wire connection portion 903 of the bootstrap chip pad 900, thereby ensuring circuit continuity of the power module 100 and enabling the power module 100 to operate normally.

[0110] In some examples, as shown in FIGS. 13-16, there are multiple bootstrap chip pads 900, including a first bootstrap chip pad 9001, a second bootstrap chip pad 9002, and a third bootstrap chip pad 9003 spaced apart along the length of the power module 100.

[0111] The second bootstrap chip pad 9002 is located between the first bootstrap chip pad 9001 and the third bootstrap chip pad 9003. The wire connection portions 903 of the first bootstrap chip pad 9001 and the third bootstrap chip pad 9003 are both located close to the second bootstrap chip pad 9002. The wire connection portion 903 of the second bootstrap chip pad 9002 is located close to either the first bootstrap chip pad 9001 or the third bootstrap chip pad 9003.

[0112] Illustratively, the first bootstrap chip pad 9001 is located at one end of the plurality of bootstrap chip pads 900 along the length of the power module 100, and the included wire connection 903 is closer to the control chip 30 than the included chip weld 902. Similarly, the third bootstrap chip pad 9003 is located at the other end of the plurality of bootstrap chip pads 900 along the length of the power module 100, and the included wire connection 903 is also closer to the control chip 30 than the included chip weld 902.

[0113] This arrangement reduces the length of the wires 39 connecting each bootstrap chip pad 900 and the control chip 30, reducing the material consumption of the wires 39 and improving the efficiency with which the wires 39 connect the bootstrap chip pads 900 and the control chip 30.

[0114] The power module 100 provided by some embodiments of the present disclosure includes a plurality of control pins 50. The plurality of control pins 50 can provide an interface for electrical connection between the power module 100 and external equipment. The plurality of control pins 50 are all electrically connected to the control chip 30, which can ensure the reliability of the electrical connection between the control chip 30 and external equipment.

[0115] In some embodiments, one control pin 50 is provided between two adjacent bootstrap chip pads 900. This facilitates electrical connection between the bootstrap chip 90 on each bootstrap chip pad 900 and external equipment, and also ensures the operational reliability of the control chip 30 and the bootstrap chip 90, thereby ensuring the operational reliability of the power module 100.

[0116] 13 , the area occupied by the chip weld 902 is larger than the area occupied by the wire connection 903. This allows the area occupied by the chip weld 902 on the bootstrap chip pad 900 to be sufficient for welding and mounting the bootstrap chip 90. At the same time, this ensures a stable connection between the wire 39 and the bootstrap chip pad 900 and increases the contact area between the bootstrap chip 90 and the chip weld 902, thereby improving the connection reliability of the bootstrap chip 90 with the bootstrap chip pad 900. This makes the structural installation of the bootstrap chip pad 900 more rational and facilitates the manufacture and assembly of the power module 100.

[0117] In some embodiments, as shown in Figures 13-16, the tip weld 902 includes a through hole 16 located on the side of the bootstrap chip 90 mounted on the tip weld 902 away from the control chip 30.

[0118] When the transfer molding method is used to package the main body structure of the power module 100, resin can be poured into the mold cavity through the through-hole 16, and after the resin is hardened, the through-hole 16 is filled with the packaging body 10, thereby improving the bonding between the main body structure of the power module 100 and the packaging body 10.

[0119] Furthermore, the through-holes 16 are filled with the packaging body 10, which can block external water and air. Furthermore, the through-holes 16 are provided between the portion of the chip weld 902 that connects to the outside and the portion on which the bootstrap chip 90 is mounted. This prevents external water and air from passing through the chip weld 902 of the bootstrap chip pad 900 and entering the inside of the chip, thereby further improving the structural reliability of the power module 100.

[0120] 6 to 8 and 13, the packaging body 10 further includes an isolation portion 15. The isolation portion 15 is located on a second side surface 10B of the packaging body 10, i.e., on a side surface of the packaging body 10 from which the plurality of control pins 50 are drawn out. The isolation portion 15 is used to increase the creepage distance between the control pins 50, and can prevent creepage that occurs when the surface of the power module 100 comes into contact with an external conductor, thereby ensuring the safety and stability of the power module 100 during operation.

[0121] For example, the isolation portion 15 may be a recess, which can save raw materials while increasing the creepage distance between the conductors, and can make the structure of the power module more compact.

[0122] For example, there may be a plurality of isolation portions 15. Each isolation portion 15 may be located between two adjacent control pins 50 in order to increase the creepage distance between the control pins 50.

[0123] 13 , the power module 100 provided by some embodiments of the present disclosure further includes a bootstrap chip 90 and a bootstrap chip pad 900. The bootstrap chip pad 900 is connected to an external device via a pin, and a control pin 50 is provided between two adjacent bootstrap chips. In this case, an isolation portion 15 may be located between the control pin 50 and the bootstrap chip pad 900. As long as the bootstrap chip pad 900 in the power module 100 has a stable structure, the creepage distance between the bootstrap chips 40 may be increased, preventing creepage that occurs when the surface of the power module 100 comes into contact with an external conductor. This ensures the safety and stability of the power module 100 during operation.

[0124] In the power module 100 provided by the embodiment of the present disclosure, the control pins 50 are multiple and are drawn out from the second side surface 10B extending along the longitudinal direction X of the packaging body 10, i.e., the multiple control pins 50 are arranged along the second side surface 10B.

[0125] 7, 8, 13, and 17 to 21, the power module 100 further includes a first support pin 70. The first support pin 70 is used only to support the power module 100 and is extended from a third side surface 10C of the packaging body 10. The third side surface 10C is adjacent to the second side surface 10B and extends along the width direction Y of the packaging body 10.

[0126] The plurality of control pins 50 include a first functional pin 51 and a second functional pin 52. Along the longitudinal direction X of the packaging body 10, the second functional pin 52 is located near the center of the second side surface 10B of the packaging body 10, and the first functional pin 51 is located on the side of the second functional pin 52 that is away from the first support pin 70.

[0127] That is, the first functional pins 51, the second functional pins 52 and the first support pins 70 are each arranged approximately uniformly along the longitudinal direction X of the packaging body 10, and are pulled out from different sides of the packaging body 10, and are configured to support the power module 100 from different sides of the power module 100, thereby improving the stability of the power module 100.

[0128] As a result, the first functional pin 51, the second functional pin 52, and the first support pin 70 can support the entire power module 100 from both sides of the power module 100, thereby avoiding the shaking problem caused by supporting the power module 100 from one side of the power module, improving the stability of the power module 100, and preventing deformation of the power module 100.

[0129] Furthermore, since the first support pins 70 are pulled out from the third side surface 10C of the packaging body 10, it is possible to avoid an increase in the space occupied along the longitudinal direction X of the power module 100 and a waste of material, and it is possible to make the installation of each pin used to support the power module 100 more rational and compact, thereby reducing the volume of the power module 100 and improving the degree of miniaturization of the power module 100.

[0130] In addition, the first functional pin 51 and the second functional pin 52 are pulled out from the second side surface 10B of the packaging body 10, and the first support pin 70 is pulled out from the third side surface 10C of the packaging body 10, and the insulation distance between these pins can also be increased, thereby further improving the safety performance of the power module 100.

[0131] 13 and 19, the power module 100 further includes a control chip pad 300. The control chip 30 is mounted on the control chip pad 300, which can ensure the mounting stability and reliability of the control chip 30 and improve the performance of the control chip 30.

[0132] The first functional pins 51, the second functional pins 52, and the first support pins 70 are connected to the control chip pads 300, for example, as an integral structure. Alternatively, it can be understood that in some embodiments, different portions of the control chip pads 300 form the pads used to mount the control chip 30, and the above-mentioned first functional pins 51, second functional pins 52, and first support pins 70, respectively.

[0133] The first functional pins 51 and the second functional pins 52 are drawn out from the second side surface 10B of the packaging body 10 and are both electrically connected to peripheral circuits, which not only ensures the normal operation of the power module 100 but also supports the power module 100 and ensures the reliability of the installation of the power module 100. The first support pins 70 are drawn out from the third side surface 10C of the packaging body 10, which enables the power module 100 to be supported from a side different from the side from which the control pins 50 are drawn out, thereby ensuring the reliability of the installation of the power module 100.

[0134] As can be seen from this, in the power module 100 provided by some embodiments of the present disclosure, the pads used to mount the control chip 30 in the power module 100 can be used to form the pins used to support the power module 100, eliminating the need for additional pads used to support the power module, thereby reducing the space occupied by the pins for supporting the power module and improving the degree of miniaturization of the power module 100.

[0135] 19, the power module 100 includes multiple control chips 30, such as a first control chip 31 and a second control chip 32. According to different applications of the power module 100, the first control chip 31 can be a low-voltage chip and the second control chip can be a high-voltage chip, which can improve the operating performance of the power module 100.

[0136] In this case, the control pad 300 includes a first control chip pad 301 and a second control chip pad 302 that can be integrally molded. The first control chip pad 301 and the second control chip pad 302 are connected in sequence along the longitudinal direction X of the packaging body 10. The first control chip 31 is mounted on the first control chip pad 301, and the second control chip 32 is mounted on the second control chip pad 302, thereby improving the compactness of the power module 100 structure.

[0137] In some examples, the first functional pin 51 is electrically connected to the first control chip 31 and may be used to provide a ground voltage to the first control chip 31. The first functional pin 51 is provided on one side of the first control chip pad 301 along the length of the power module, the first support pin 70 is provided on the side of the second control chip pad 302 away from the first control chip pad 301 along the length of the power module, and the second functional pin 52 is located adjacent to the center of the second control chip pad 302 which is adjacent to the first control chip pad 301. This allows the first functional pins 51, the second functional pins 52, and the first support pins 70 to be more uniformly distributed within the packaging body 10, thereby allowing the first functional pins 51, the second functional pins 52, and the first support pins 70 to more uniformly distribute the support force on the power module 100, improving the reliability and stability of the power module 100.

[0138] 19, the plurality of control pins 50 further includes a third functional pin 53. The third functional pin 53 is electrically connected to the second control chip 32 and can be used to provide, for example, a high voltage to the second control chip 32.

[0139] In this case, as shown in FIGS. 7, 8, 13, and 17 to 21, the power module 100 further includes second support pins 80. The second support pins 80 are protruded from the third side surface 10C of the packaging body 10 and are used only to support the power module 100. The third functional pins 53 are connected to the second support pins 80 as an integrated structure. In addition, along the longitudinal direction X of the packaging body, the third functional pins 53 are located on the side of the second functional pins 52 that is farther away from the first functional pins 51 and close to the center of the second side surface 10B of the packaging body 10. That is, the third functional pins 53 are installed adjacent to the midpoint between the first control chip pads 301 and the second control chip pads 302.

[0140] As a result, the third functional pin 53 and the second support pin 80 may also support the power module 100 from two directions, thereby assisting the first functional pin 51, the second functional pin 52 and the first support pin 70 in supporting the power module 100, thereby further improving the stability of the power module 100.

[0141] Furthermore, the second support pins 80 are drawn out from the side surfaces extending along the width direction of the power module 100, which can avoid an increase in the space occupied along the length direction X of the power module, thereby reducing the volume of the power module 100 and further improving the miniaturization of the power module 100.

[0142] At the same time, in some examples, the third functional pin 53 may be connected to the second support pin 80 as an integrated structure. It can be understood that a high-voltage pin is provided for the control chip 30, with one end of the pin being drawn out from the second side surface 10B of the packaging body 10 as a high-voltage pin (i.e., the third functional pin 53), and the other end extending along the longitudinal direction X of the power module 100 and drawn out from the third side surface 10C of the packaging body 10 as a non-functional pin (i.e., the second support pin 80), which functions to support the power module together with the high-voltage pin. This eliminates the need for additional pads used to support the power module, thereby ensuring support stability for the power module and further improving the degree of miniaturization of the power module 100.

[0143] In the power module 100 provided by some embodiments of the present disclosure, the power module 100 includes a second flow guiding portion 1032. The second flow guiding portion 1032 is located at a bend in the end of the second side surface 10B of the packaging body 10 along the longitudinal direction X of the packaging body 10. The second flow guiding portion 1032 includes at least one recess. This not only reduces the volume of the packaging body 10, saves the resin material required for packaging, and reduces the manufacturing cost of the power module 100, but also makes the structure of the power module 100 more compact, reduces the volume of the power module 100, and improves the degree of miniaturization of the power module 100, while ensuring that the packaging body 10 fulfills its role of protecting the main body structure of the power module 100.

[0144] When the second flow guide portion 1032 has one recess, the first support pin 70 and the second support pin 80 are drawn out from a side surface of the recess that extends along the width direction Y of the packaging body 10.

[0145] When the second flow guide portion 1032 has two consecutive recesses (i.e., the first recess 10321 and the second recess 10322), the entire first recess 10321 extends along the longitudinal direction X of the packaging body 10, and the entire second recess 10322 extends along the width direction Y of the packaging body 10, thereby simplifying the manufacturing process of the packaging body 10 and reducing the difficulty of manufacturing the packaging body 10.

[0146] As can be seen from this, the second recess 10322 is farther from the control pin 50 than the first recess 10321. Therefore, by drawing out the first support pin 70 and the second support pin 80 from the side surface of the second recess 10322 extending along the width direction Y of the packaging body 10, not only can the degree of miniaturization of the power module be improved, but the insulation length between these pins can also be extended.

[0147] 17 and 18, the length of the first support pins 70 and the second support pins 80 pulled out from the packaging body 10 does not exceed the depth of the second recess 10322, i.e., the ends of the first support pins 70 and the second support pins 80 pulled out of the packaging body 10 along the longitudinal direction X of the packaging body 10 do not exceed the third side surface 10C of the packaging body 10. This not only increases the creepage distance between the first support pins 70 and the second support pins 80 and their corresponding functional pins, but also prevents the exposed first support pins 70 and the second support pins 80 from coming into contact with external devices located on the third side surface 10C of the packaging body 10, thereby preventing electric shock or damage.

[0148] 20, both the first recess 10321 and the second recess 10322 are elongated, and the length d1 of the first recess 10321 is equal to or greater than the length d2 of the second recess 10322. This simplifies the design of the shapes of the first recess 10321 and the second recess 10322, makes it easier to mold the first recess 10321 and the second recess 10322, and further reduces the difficulty of manufacturing the packaging body 10.

[0149] Furthermore, since the lengths of the first recess 10321 and the second recess 10322 can be matched with the lengths of the second side surface 10B and the third side surface 10C on which their corresponding portions are located, the structural reliability of the power module 100 can be further improved, assuming that the resin material required for packaging can be saved and the compactness of the structure can be improved.

[0150] In the power module 100 provided by some embodiments of the present disclosure, as shown in FIGS. 18 and 21 , the first recess 10321 includes a first sub-side surface 311 and a second sub-side surface 312. The first sub-side surface 311 extends along the width direction Y of the packaging body 10, and the second sub-side surface 312 extends along the length direction X of the packaging body 10. The first sub-side surface 311 is connected between (e.g., perpendicular to) the second sub-side surface 312 and the second side surface 10B of the packaging body. The length of the first sub-side surface 311 (i.e., the dimension along the width direction Y of the packaging body 10) is smaller than the length of the second sub-side surface 312 (i.e., the dimension along the length direction X of the packaging body 10).

[0151] The second recess 10322 may mainly include a third sub-side surface 321 and a fourth sub-side surface 322. The third sub-side surface 321 extends along the length direction X of the packaging body 10, and the fourth sub-side surface 322 extends along the width direction Y of the packaging body 10. The third sub-side surface 321 is connected between (for example, may be vertically connected to) the fourth sub-side surface 322 and the third side surface 10C of the packaging body.

[0152] This simplifies the structure of the first recess 10321 and the second recess 10322, making it possible to realize a long structure for the first recess 10321 and the second recess 10322, and also reducing the difficulty of manufacturing the second flow guide portion 1032.

[0153] 18 and 21, the first recess 10321 further includes a first transition arc surface 313 between the first sub-side surface 311 and the second sub-side surface 312. This makes it possible to make the stress distribution at the connection portion between the first sub-side surface 311 and the second sub-side surface 312 of the first recess 10321 more uniform and to prevent breakage due to stress concentration at the connection portion between the first sub-side surface 311 and the second sub-side surface 312. This improves the fatigue safety factor of the packaging body 10 in the first recess 10321 and the structural reliability of the packaging body 10 and therefore the power module 100.

[0154] 18 and 21, the second recess 10322 further includes a second transition arc surface 323 between the third sub-side surface 321 and the fourth sub-side surface 322. This makes it possible to make the stress distribution at the connection portion between the third sub-side surface 321 and the fourth sub-side surface 322 of the second recess 10322 more uniform and prevent breakage due to stress concentration at the connection portion between the third sub-side surface 321 and the fourth sub-side surface 322. This improves the fatigue safety factor of the packaging body 10 in the second recess 10332 and improves the structural reliability of the packaging body 10 and the power module 100.

[0155] In some embodiments, the first support pin 70 and the second support pin 80 may each comprise a first pin segment, a second pin segment, and a third pin segment connected in sequence.

[0156] 19 , the first support pin 70 may include a first pin segment 71, a second pin segment 72, and a third pin segment 73 connected in sequence. The first pin segment 71 extends along the longitudinal direction X of the packaging body 10. The second pin segment 72 is connected to one end of the first pin segment 71 that is remote from the second control chip 32, and extends along the width direction Y of the packaging body 10. The third pin segment 73 is connected to one end of the second pin segment 72 that is remote from the first pin segment 71, and is bent and extends along the longitudinal direction X of the packaging body 10. The end of the third pin segment 73 that is remote from the second pin segment 72 is drawn outward from the third side surface 10C of the packaging body 10 (e.g., the fourth sub-side surface 322 of the second recess 10332).

[0157] The second support pin 80 may include a first pin segment 81, a second pin segment 82, and a third pin segment 83 connected in sequence. The connection manner of the first pin segment 81, the second pin segment 82, and the third pin segment 83 of the second support pin 80 is similar to the connection manner of the first pin segment 71, the second pin segment 72, and the third pin segment 73 of the first support pin 70, and will not be described again here.

[0158] This arrangement not only allows the first support pins 70 and the second support pins 80 to be aligned with the structure of the packaging body 10 and ensures that the first support pins 70 and the second support pins 80 are pulled outward from the third side surface 10C of the packaging body 10 (e.g., the fourth sub-side surface 322 of the second recess 10322) and support the power module 100, but also allows the first support pins 70 and the second support pins 80 to be spaced apart from the screw fixing grooves on the power module 100 via their respective first pin segments and second pin segments, avoiding interference or being too close to the screws to ensure the electrical insulation requirements of the power module 100, and improving the reliability of the power module 100.

[0159] In some examples, the width of the second pin segment 82 of the second support pin 80 is greater than the width of the second pin segment 72 of the first support pin 70 (ie, the dimension along the length direction X of the packaging body 10).

[0160] As a result, the second pin segment 82 of the second support pin 80 and the second pin segment 72 of the first support pin 70 can fully utilize the available space on the control chip pad 300 to improve the structural stability of the second support pin 80 and the first support pin 70, thereby improving the stability of the support function of the second support pin 80 and the first support pin 70 to the power module 100.

[0161] Some embodiments of the present disclosure further provide an equipment, and the power module provided by the above embodiments is applied to the equipment.

[0162] As shown in FIG. 22, the facility 1000 includes a controller 200 and a power module 100 provided by any of the above embodiments, and the power module 100 is connected to the controller 200.

[0163] In some embodiments, there may be one or more power modules 100, and the equipment 1000 may include, but is not limited to, an inverter equipment or a rectifier equipment, for example, a motor drive controller.

[0164] For example, the controller 200 can generate a control signal according to a user's command and send the control signal to the power module 100. The power module 100 generates a driving signal according to the control signal and outputs it to a corresponding driving member to achieve driving control, inverter conversion, rectification conversion, etc.

[0165] By employing the power module 100 of the above embodiment, the insulation withstand voltage and insulation reliability of the equipment 1000 provided by the embodiment of the present disclosure are improved, and the electrical safety of the equipment is improved.

[0166] It will be understood by those skilled in the art that the scope of the present disclosure is not limited to the particular embodiments described above, and that modifications and substitutions can be made to the specific elements of the embodiments without departing from the inventive concept of the present application. The scope of the present disclosure is limited by the claims.

Claims

1. A packaging body; a power chip provided in the packaging body; a control chip provided in the packaging body and electrically connected to the power chip; power pins extending from a first side surface of the packaging body and electrically connected to the power chip; a control pin drawn out from a second side surface of the packaging body and electrically connected to the control chip, the control pin being provided on the first side surface facing the second side surface; Equipped with The packaging body includes a flow guide portion located at at least one corner of the packaging body, the flow guide portion being configured to achieve a resin flow guide function so as to prevent the packaging body from generating a gap at the corner, the flow guide portion connecting two adjacent side surfaces of the packaging body that have an included angle in the length direction and width direction of the packaging body, the packaging body further includes a first step portion, the first step portion being located on a side of the power pin that extends outward from the packaging body and that is closer to a bottom surface of the packaging body, the first step portion having a step surface and a side surface, the side surface of the first step portion being closer to a center of the packaging body than a first side surface of the packaging body along the width direction of the packaging body, and the step surface of the first step portion being closer to the center of the packaging body than the bottom surface of the packaging body along the thickness direction of the packaging body; a power module in which the first step portion has a main body portion and an end portion, the main body portion extending along the length direction of the packaging body and the end portion extending along the width direction of the packaging body, the first step portion further having a third flow guide portion, the third flow guide portion connecting the main body portion and the end portion of the first step portion.

2. The flow guide portion includes a first flow guide portion located at a bend in an end portion of a first side surface of the packaging body along the length direction of the packaging body, and / or The flow guide portion includes a second flow guide portion located at a bend in an end portion of a second side surface of the packaging body along the length direction of the packaging body. The power module according to claim 1 .

3. the packaging body further includes a second step portion, the second step portion being located on a side of the control pin that extends toward an outside of the packaging body and that is closer to a bottom surface of the packaging body; the second step portion has a step surface and a side surface, and along the width direction of the packaging body, the side surface of the second step portion is closer to the center of the packaging body than the second side surface of the packaging body, and along the thickness direction of the packaging body, the step surface of the second step portion is closer to the center of the packaging body than the bottom surface of the packaging body; The power module according to claim 1 .

4. the packaging body further includes a third step portion, the third step portion being located on a side of the control pin that extends toward the outside of the packaging body and that is away from a bottom surface of the packaging body; the third step portion has a step surface and a side surface, and along the width direction of the packaging body, the side surface of the third step portion is closer to the center of the packaging body than the second side surface of the packaging body, and along the thickness direction of the packaging body, the step surface of the third step portion is closer to the center of the packaging body than the top surface of the packaging body; The power module according to claim 1 .

5. When the packaging body further includes a second step portion, the second step portion has a main body portion and an end portion, the main body portion extending along the length direction of the packaging body, and the end portion extending along the width direction of the packaging body; The second step portion further includes a fourth flow guide portion, and the fourth flow guide portion connects a main body portion and an end portion of the second step portion, When the packaging body further includes a third step portion, the third step portion has a main body portion and an end portion, the main body portion extending along the length direction of the packaging body, and the end portion extending along the width direction of the packaging body; The third step portion further includes a fifth flow guide portion, and the fifth flow guide portion connects a main body portion and an end portion of the third step portion.

5. The power module according to claim 3 or 4.

6. a control chip pad used for mounting the control chip; at least one bootstrap chip provided within the packaging body; at least one bootstrap chip pad used to mount the at least one bootstrap chip and spaced apart from the control chip pad, the bootstrap chip pad having a partition and a chip weld and a wire connection located on either side of the partition, and the bootstrap chip is mounted on the chip weld; At least one wire used to electrically connect the control chip to a wire connection of a bootstrap chip pad; Further provided with The power module according to claim 1 .

7. the control chip pad and the bootstrap chip pad are spaced apart along the width direction of the power module, and the partition portion extends along the width direction of the power module. The power module according to claim 6.

8. the power module includes a plurality of bootstrap chip pads, the plurality of bootstrap chip pads being spaced apart along a length of the power module; a wire connection portion included in at least one of the bootstrap chip pads located at one end along a length direction of the power module is closer to the control chip than a chip weld portion included in the bootstrap chip pad; The power module according to claim 6.

9. a through hole is provided on the chip weld portion, and the through hole is located on a side of the bootstrap chip mounted on the chip weld portion that is away from the control chip; The power module according to claim 6.

10. a first support pin extending from a third side surface of the packaging body adjacent to the second side surface; the control pins include a first functional pin and a second functional pin, the second functional pin being located near the center of the second side surface along the length direction of the packaging body, and the first functional pin being located on a side of the second functional pin that is farther from the first support pin; the first functional pin, the second functional pin, and the first support pin are configured to support the power module from different sides of the power module. The power module according to claim 1 .

11. a control chip pad used for mounting the control chip, wherein the first function pin, the second function pin, and the first support pin are connected to the control chip pad as an integral structure; a second support pin extending from the third side surface; Furthermore, the control pin further includes a third functional pin, the third functional pin being located on a side of the second functional pin that is farther from the first functional pin along the length direction of the packaging body and close to the center of the second side surface; the second support pin is connected to the third functional pin as an integral structure; The power module according to claim 10.

12. When the power module further includes a second flow guide portion located at a bend in an end portion of the second side surface of the packaging body along the length direction of the packaging body, The second flow guide portion has a recess, and the first support pin and the second support pin are pulled out from the recess; or The second flow guide portion has two consecutive first and second recesses, the first recess extending along the length direction of the packaging body, and the second recess extending along the width direction Y of the packaging body, and both the first support pin and the second support pin are drawn out from the second recess. The power module according to claim 11.

13. A power supply system comprising: a controller; and the power module according to claim 1, wherein the power module is connected to the controller. Equipment.

Images