Ring structure and system for use in a plasma chamber - Patents.com

Abstract

To provide a system and method for securing an edge ring to a support ring within a plasma chamber.SOLUTION: An edge ring is secured to a support ring via a plurality of fasteners 122 inserted into the bottom surface of an edge ring. The edge ring during processing of the substrate within the plasma chamber is stabilized by securing the edge ring to the support ring. In addition, since the support ring is fixed to the insulator ring connected to the insulator wall of the plasma chamber, the edge ring is secured to the plasma chamber by securing the edge ring to the support ring. Additionally, the support ring and edge ring are pulled down vertically using one or more clasp mechanisms during processing of the substrate, and are also pushed up vertically using a clasp mechanism to remove the edge ring and the support ring from the plasma chamber.SELECTED DRAWING: Figure 8D

Description

[Technical Field]

[0001] The present embodiments relate to rings, systems, methods, and structures for securing rings in plasma chambers. [Background technology]

[0002] Plasma chambers are used to perform various processes on wafers. For example, plasma chambers are used to clean wafers, deposit materials on wafers, or etch wafers. Plasma chambers contain various components (such as various rings) that are used to process different portions of the wafer.

[0003] It is in this context that the embodiments described in this disclosure arise. Summary of the Invention

[0004] In the described embodiment, the plasma chamber is provided with an edge ring and a support ring. In one embodiment, the edge ring is coupled to a support ring disposed below the edge ring. The edge ring is coupled to the support ring, for example, by a plurality of screws attached to the underside of the edge ring. To secure the support ring, a plurality of pull-down structures are coupled to the underside of the support ring, which lowers to maintain the edge ring in a secured state during processing. If the edge ring is not properly secured during processing, the adhesive used to secure the edge ring is insufficient. One reason that adhesive alone is insufficient is that the adhesive gel formed between the support ring and the edge ring weakens due to high-temperature cycling in the plasma chamber. Furthermore, because the gel is subjected to constant forces, the gel may break down over time. Therefore, it is desirable for the edge ring and support ring to remain in place during substrate processing, even if the adhesive gel weakens and / or breaks down. For example, it is desirable for the edge ring to be fixed relative to the support ring during substrate processing. Otherwise, if the edge ring shifts during substrate processing, undesired processes may be performed on the substrate or certain portions of the substrate may be processed where processing is undesirable. In one embodiment, the bottom surface of the edge ring has slots (e.g., threaded holes) for receiving a number of fasteners that connect the edge ring to the support ring during substrate processing. This helps prevent the edge ring from moving relative to the support ring.

[0005] In one embodiment, the edge ring desirably has one or more curved edges that reduce the possibility of arcing when a plasma is formed in the plasma chamber.

[0006] In another embodiment, a cover ring is desirably provided to surround the edge ring. The cover ring is further configured with one or more curved edges to reduce the possibility of arcing when plasma is formed in the plasma chamber. The width of the cover ring is selected so that the tracking distance along its width facilitates achieving a standoff voltage at the vertically oriented inner surface of the cover ring. For example, if the radio frequency (RF) voltage dissipated within the cover ring is between about 7 volts (V) and 10 volts (V) per thousandth of an inch (2.54 cm) of the cover ring, the width of the cover ring corresponds to the tracking distance to achieve a predetermined standoff voltage of 5000 volts (V) at the vertically oriented inner surface of the cover ring. The tracking distance is the ratio of a multiple (e.g., two or three times) of the standoff voltage to the voltage dissipated per unit length (e.g., thousandth of an inch) of the cover ring. In some embodiments, the width of the cover ring is the tracking distance provided by the ratio. In another embodiment, the tracking distance is defined by the surface length between the edge ring and ground (e.g., the surface length along several stepped surfaces).

[0007] In one embodiment, the support ring and the edge ring are desirably fixed relative to an insulator ring located below the support ring. Otherwise, the edge ring above the support ring will move due to the moment of the support ring relative to the insulator ring. It is undesirable for the edge ring to move during substrate processing. If the support ring shifts during substrate processing, undesired processes may be performed on the substrate or certain portions of the substrate may be processed where processing is undesirable. It is also desirable for the support ring and the edge ring to be easily removed for maintenance or replacement of either or both of them.

[0008] In some embodiments, an edge ring for use in a plasma processing chamber is described. The edge ring has an annular body that surrounds a substrate support of the plasma processing chamber. The annular body has a bottom side, a top side, an inner side, and an outer side. The edge ring has a plurality of fastener holes disposed in the annular body along the bottom side. Each fastener hole has a threaded inner surface for receiving a fastener used to attach the annular body to a support ring. The edge ring further includes a step disposed on the inner side of the annular body. The step has a lower surface separated from an upper surface of the top side by a sloped surface. The edge ring has a curved edge formed between the upper surface of the top side and an outer side.

[0009] In some embodiments, a cover ring for use in a plasma processing chamber is described. The cover ring has an annular body surrounding an edge ring and adjacent to a ground ring. The annular body has an upper body portion, an intermediate body portion, and a lower body portion. The intermediate body portion defines a reduced width step from the upper body portion such that the intermediate body portion has a first annular width. The lower body portion defines a reduced width step from the intermediate body portion such that the lower body portion has a second annular width that is smaller than the first annular width.

[0010] In various embodiments, a system for securing an edge ring of a plasma chamber is described. The system includes a support ring on which the edge ring is oriented. The system further includes a gel layer disposed between a bottom surface of the edge ring and a top surface of the support ring. The system also includes a plurality of screws configured to secure the edge ring to the support ring. Each of the plurality of screws is attached to a threaded hole disposed on the bottom surface of the edge ring and passing through the support ring. The system also includes a plurality of pressure rods connected to the bottom surface of the support ring. The system includes a plurality of pneumatic pistons. Each of the plurality of pistons is coupled to a corresponding one of the plurality of pressure rods.

[0011] Some advantages of the systems and methods described herein include providing an edge ring with one or more curved edges that are not sharp. Sharp edges (such as edges with 90° angles) typically cause RF power arcing when plasma is formed in a plasma chamber. The curved edge or edges reduce the likelihood of such arcing.

[0012] Additional advantages of the system and method include providing an edge ring with one or more slots (e.g., screw holes) for receiving fasteners (e.g., screws) to couple the edge ring to the support ring. Such edge ring-support ring coupling secures the edge ring relative to the support ring even if the adhesion provided by the gel between the edge ring and the support ring weakens, the gel wears off, or the gel collapses due to forces applied to the gel during substrate processing. Furthermore, the support ring is secured relative to the insulator ring via one or more pressure bars. Therefore, because the edge ring is secured relative to the insulator ring via the support ring, there is no risk of the edge ring shifting during substrate processing. This lack of shifting reduces (e.g., prevents) undesired processes from being performed on the substrate or reduces the likelihood of undesired regions of the substrate being processed.

[0013] Additional advantages of the system and method include providing one or more mechanisms (e.g., one or more pneumatic mechanisms) for lowering or raising the support ring via one or more pressure bars. This lowering action is performed during substrate processing to reduce the likelihood of the support ring becoming misaligned relative to the insulator ring. This lowering action therefore allows the edge ring and support ring to remain secured within the plasma chamber for multiple processing operations (e.g., from one processing operation to the next) until they are replaced or removed from the plasma chamber for maintenance. The raising action is performed to remove the edge ring or support ring for replacement or maintenance (e.g., cleaning).

[0014] Further advantages of the systems and methods described herein include providing a cover ring having one or more curved edges that reduce the likelihood of arcing when a plasma is formed within the plasma chamber, and further, the cover ring has an annular width for achieving a standoff voltage at the vertically oriented inner surface of the cover ring, as described above.

[0015] Other aspects will become apparent from the following detailed description taken in conjunction with the accompanying drawings. [Brief explanation of the drawings]

[0016] The embodiments can be best understood by referring to the following description taken in conjunction with the accompanying drawings.

[0017] [Figure 1] FIG. 1 is a diagram of one embodiment of a system illustrating how an edge ring is secured to a support ring.

[0018] [Figure 2] FIG. 2 is a diagram of one embodiment of the system showing the coupling of the power pins to the support ring.

[0019] [Figure 3A]FIG. 3A is a diagram of one embodiment of the system showing multiple locations for connecting multiple pressure bars to the support ring.

[0020] [Figure 3B] FIG. 3B is an isometric view showing the connection between the pressure bar and the bottom surface of the support ring.

[0021] [Figure 4] FIG. 4 is a side view of one embodiment of a system for securing an edge ring and a support ring to an insulator ring.

[0022] [Figure 5] FIG. 5 is an isometric view of one embodiment of a clasp mechanism.

[0023] [Figure 6A] FIG. 6A is a diagram of one embodiment of a system for demonstrating synchronized lowering of the pressure bars.

[0024] [Figure 6B] FIG. 6B is a diagram of one embodiment of a system for demonstrating synchronized lifting of the pressure bars.

[0025] [Figure 7] FIG. 7 is a block diagram of one embodiment of the system showing the supply of air to multiple clasp mechanisms.

[0026] [Figure 8A] FIG. 8A is an isometric view of one embodiment of an edge ring.

[0027] [Figure 8B] FIG. 8B is a top view of one embodiment of the edge ring of FIG. 8A.

[0028] [Figure 8C] FIG. 8C is a cross-sectional view of the edge ring of FIG. 8B.

[0029] [Figure 8D] FIG. 8D is a diagram of one embodiment of a system showing coupling of fasteners to the edge ring of FIG. 8A.

[0030] [Figure 9A] FIG. 9A is an isometric view of one embodiment of a covering.

[0031] [Figure 9B] FIG. 9B is a bottom view of one embodiment of the cover ring of FIG. 9A.

[0032] [Figure 9C] FIG. 9C is a top view of one embodiment of the cover ring of FIG. 9A.

[0033] [Figure 9D] FIG. 9D is a cross-sectional view of one embodiment of the cover ring of FIG. 9C.

[0034] [Figure 9E] FIG. 9E is a cross-sectional view of one embodiment of the covering of FIG. 9A.

[0035] [Figure 9F] FIG. 9F is a cross-sectional view of one embodiment of the cover ring of FIG. 9A.

[0036] [Figure 9G] FIG. 9G is a cross-sectional view of one embodiment of a cover ring. DETAILED DESCRIPTION OF THE INVENTION

[0037] The following embodiments describe systems and methods for bonding an edge ring in a plasma chamber. It will be apparent that the embodiments may be practiced without some or all of these specific details. In other instances, well-known process operations have not been described in detail in order to not unnecessarily obscure the embodiments.

[0038] FIG. 1 illustrates a system 100 that illustrates how an edge ring 108 is secured to a support ring 112. 0 1 is a diagram of an embodiment of a support ring 112. The support ring 112 is sometimes referred to herein as an adjustable edge sheath (TES) ring. The system 100 includes an edge ring 108, a ground ring 114, and a base ring 116. (See Figure 9G) , insulator ring 106, cover ring 118 (Shown in Figure 9G) , and the chuck 104. The edge ring 108 is made of a conductive material such as silicon, boron-doped single crystal silicon, alumina, silicon carbide, a silicon carbide layer on an alumina layer, an alloy of silicon, or a combination thereof. Note that the edge ring 108 has an annular body, such as a circular body, a ring-shaped body, or a dish-shaped body. Furthermore, the support ring 112 is made of a dielectric material, such as quartz, ceramic, alumina (Al2O3), or a polymer. By way of example, the support ring 112 has an inner diameter of approximately 12.5 inches (approximately 31.75 cm), an outer diameter of approximately 13.5 inches (approximately 34.29 cm), and a thickness along the y-axis of approximately 0.5 inches (approximately 1.27 cm). By way of example, the support ring 112 may have an inner diameter of at least about 12.7 inches (about 32.26 cm) and not more than about 13 inches (about 33.02 cm), an outer diameter of at least about 13.3 inches (about 33.78 cm) and not more than about 14 inches (about 33.56 cm), and a thickness of at least about 0.5 inches (about 1.27 cm) and not more than about 0.7 inches (about 1.78 cm). These are merely exemplary dimensions for a plasma chamber used to process 300 mm wafers.

[0039] Furthermore, the insulator ring 106 is made of an insulator material, such as a dielectric material, and the base ring 116 is also made of a dielectric material. The ground ring 114 is made of a conductive material. The ground ring 114 is coupled to a ground potential. An example of the chuck 104 includes an electrostatic chuck. Each of the rings, such as the edge ring 108, the support ring 112, the ground ring 114, the base ring 116, and the insulator ring 106, has an annular shape, such as a ring or a disk. The cover ring 118 is made of a dielectric material, such as fused silica (fused quartz), or a ceramic material, such as aluminum oxide (Al2O3) or yttrium oxide (Y2O3). The cover ring 118 has an annular body, such as a disk or a ring.

[0040] The bottom surface of the edge ring 108 has a portion P1 that is coupled to the top surface of the support ring 112 via a thermally conductive gel layer 110A and thermally sinks the support ring 112 to the edge ring 108. Examples of thermally conductive gels used herein include polyimide, polyketone, polyetherketone, polyethersulfone, polyethylene terephthalate, fluoroethylene propylene copolymer, cellulose, triacetate, and silicone. The bottom surface of the edge ring 108 further has another portion P2 that is coupled to the top surface of the chuck 104 via a thermally conductive gel layer 110B. Additionally, the bottom surface of the edge ring 108 has yet another portion P3 that is located above and adjacent to the base ring 116.

[0041] The edge ring 108 is positioned above the base ring 116, the support ring 112, and the chuck 104. The bottom surface of the edge ring 108 faces the base ring 116, the support ring 112, and a portion of the chuck 104. The edge ring 108 also surrounds a portion of the chuck 104 (such as the top portion PRTN1). The support ring 112 surrounds a portion of the chuck 104, and the insulator ring 106 surrounds another portion of the chuck 104. The base ring 116 surrounds a portion of the insulator ring 106 and the support ring 112. The cover ring 118 surrounds the edge ring 108 and the base ring 116. The ground ring 114 surrounds a portion of the cover ring 118 and the base ring 116. A portion of the cover ring 118 is positioned above the ground ring 114, and the cover ring 118 is positioned adjacent to a side of the ground ring 114.

[0042] The edge ring 108 has multiple edges, such as edge 1, edge 2, edge 3, edge 4, edge 5, and edge 6. Each of edges 1-6 is curved, such as an arc. For example, each of edges 1-6 is not sharp, has a radius, and has a smooth curve. Note that in various embodiments, the radius of each of edges 1-6 is greater than about 0.01 inches (about 0.0254 cm) and about 0.03 inches (about 0.0762 cm). Having an edge radius of about 0.01 inches (about 0.0254 cm) and about 0.03 inches (about 0.0762 cm) reduces the likelihood of edge chipping during semiconductor wafer fabrication. Chipping forms particles during semiconductor wafer processing.

[0043] In one embodiment, the edge ring 108 has multiple edges. In one embodiment, the edges defining the edge ring 108 are rounded. By way of example, edge 1 of the edge ring 108 is rounded to a radius of about 0.03 inches (about 0.0762 cm) or greater, preferably greater than 0.07 inches (about 0.1778 cm). For example, edge 1 may be rounded to a radius of about 0.03 inches (about 0.0762 cm) or greater and about 0.1 inches (about 0.254 cm) or less. As another example, edge 1 may be rounded to a radius of about 0.07 inches (about 0.1778 cm) or greater and about 0.1 inches (about 0.254 cm) or less. Edge 1 of the edge ring 108 is particularly susceptible to arcing due to its proximity to the ground ring 114. Due to the high power levels used in plasma processing operations, a high electric field is generated between the edge ring 108 and the ground ring 114. The rounding of Edge 1 reduces the likelihood of such arcing. It has been found that less rounding of these edges may be insufficient to prevent or reduce the likelihood of RF power arcing during operation of the plasma chamber. Arcing is affected by the sharpness of the edges of features in the plasma chamber, and reducing the likelihood of arcing can be detrimental to fabrication processes performed on and across semiconductor wafers. A slight rounding of the edges (e.g., Edge 1 of about 0.01 inches or more and about 0.03 inches or less) helps reduce the likelihood of particle generation during semiconductor wafer fabrication or edge chipping during fabrication. Therefore, while some rounding has been applied to the surfaces of features disposed in plasma chambers (e.g., Edge 1), this rounding is less than sufficient to prevent or reduce arcing given the high power levels used in plasma processing operations.

[0044] The curved edges 1-6 reduce the possibility of chipping or arcing occurring when a plasma is formed in the plasma chamber in which the system 100 is located. Note that edge 5 is less rounded compared to edge 1 to reduce the possibility of plasma ions from the plasma entering the gap between edge 5 and the chuck 104. For example, edge 5 has a smaller radius than edge 1. As an example, the edge ring 108 has an outer diameter along the x-axis that is greater than or equal to about 13.6 inches (about 34.544 cm) and less than or equal to about 15 inches (about 38.1 cm). As another example, the edge ring 108 has an outer diameter that is greater than or equal to about 13 inches (about 33.02 cm) and less than or equal to about 15 inches (about 38.1 cm). As yet another example, the edge ring 108 has a thickness measured along the y-axis that is about 0.248 inches (about 0.62992 cm). Illustratively, the thickness of the edge ring 108 is greater than or equal to about 0.24 inches (0.6096 cm) and less than or equal to about 0.256 inches (0.65024 cm). The x-axis is perpendicular to the y-axis. As the outer diameter of the edge ring 108 increases, the distance between the outer surface of the edge ring 108 that is continuous with the edge 1 decreases and the cover ring 118. This decrease in distance reduces the likelihood of RF power arcing between the edge ring 108 and the cover ring 118 when a plasma is formed in the plasma chamber.

[0045] The edge ring 108 includes a plurality of slots (such as slot 125) formed in the bottom surface of the edge ring 108. An example of a slot in an edge ring is a screw hole. Each slot surrounds a fastener hole (such as fastener hole 124A). The fastener holes do not extend the entire length of the edge ring 108 along the y-axis to form through holes in the edge ring 108. The plurality of fastener holes are formed in the bottom surface of the edge ring 108. An example of a fastener hole is a screw hole having a helical thread for receiving a screw. The slot 125 has a top surface TS and a side surface SS. The top surface TS and the side surface SS are surfaces formed by drilling into the lower surface of the edge ring 108. The side surface SS is substantially perpendicular to the top surface TS. For example, the side surface SS is inclined relative to the top surface TS, forming an angle in the range of 85 degrees to 95 degrees. As another example, the side surface SS is perpendicular to the top surface TS. Top surface TS partially surrounds fastener hole 124A and side surface SS partially surrounds fastener hole 124A.

[0046] Additionally, through holes 132A are formed in the support ring 112 for receiving fasteners 122 such as screws, bolts, or pins. ,sa A plurality of additional through-holes (such as through-hole 132A) are formed elsewhere in support ring 112 to receive a plurality of fasteners (such as fasteners 122) that couple port ring 112 to an edge ring described herein. For example, three through-holes are formed in support ring 112 at the vertices of an equilateral triangle in a horizontal plane aligned with the x-axis. As another example, six or nine through-holes are formed in support ring 112, with the distance between the through-holes in one set of adjacent through-holes being substantially equal (e.g., equal to or within a predetermined limit) to the distance between the through-holes in another set of adjacent through-holes. Note that in this set of adjacent through-holes, at least one through-hole is not the same as at least one of the other sets of adjacent through-holes.

[0047] The fastener 122 is made of a metal such as steel, aluminum, a steel alloy, or an aluminum alloy. The through-hole 132A is formed to match the shape of the fastener 122. For example, the fastener 122 has a head with a larger diameter than the body of the fastener 122. The lower part of the through-hole 132A is fabricated to have a diameter slightly (e.g., a fraction of a millimeter (mm)) larger than the head of the fastener 122. Furthermore, the upper part of the through-hole 132A is fabricated to have a diameter slightly (e.g., a fraction of a millimeter) larger than the body of the fastener 122. In addition, Fasteners The diameter of hole 124A is slightly larger (e.g., a fraction of a millimeter) than the threaded portion of fastener 122. Furthermore, a space is formed along the y-axis between top surface TS of slot 125 and the tip of fastener 122. An example of the space is Gap 1, which is greater than or equal to about 0 mm and less than or equal to about 1 mm. Another example of Gap 1 is a space greater than or equal to about 0 mm and less than or equal to about 0.5 mm. Another example of Gap 1 is a space greater than or equal to about 0 mm and less than or equal to about 0.25 mm. Gap 1 is vertically oriented along the y-axis. The space between top surface TS of slot 125 and the threaded portion of fastener 122 is greater than or equal to about 0 mm and less than or equal to about 0.5 mm to reduce the possibility of RF power arcing occurring within the space. If arcing occurs, fastener 122 may melt due to the heat generated as a result of the arcing.

[0048] When fastener 122 is inserted into through-hole 132A, the head and body of fastener 122 are positioned within support ring 112, and the threaded portion of fastener 122 is inserted into fastener hole 124A formed in edge ring 108. A space, such as gap 2, formed between the side surface of fastener 122 and the inner surface of support ring 112 is approximately 0 mm or more and approximately 0.2 mm or less.

[0049] The support ring 112 has embedded therein an electrode EL for receiving radio frequency (RF) power of an RF signal received from an auxiliary RF generator via an auxiliary match, such as an impedance matching circuit.

[0050] In some embodiments, the support ring 112 is a bond ring.

[0051] In various embodiments, the fastener 122 is made of plastic.

[0052] In some embodiments, the conductive gel layer is replaced by a double-sided conductive tape having conductive gel on both sides. In various embodiments, the conductive gel layer is replaced by a caulking bead having conductive gel.

[0053] In some embodiments, instead of providing multiple threaded fastener holes, an insert, such as a metal casing, is installed in the fastener holes in the bottom surface of the edge ring described herein. Illustratively, the metal casing is threaded into a slot formed in the bottom surface of the edge ring. The insert has threads on its inner surface. Fasteners are then threaded into the threads of the insert instead of into the threaded fastener holes.

[0054] FIG. 2 is a diagram of one embodiment of a system 200 illustrating the coupling of power pins 208 to a support ring 112. The system 200 includes an edge ring 228, a cover ring 201, a ground ring 114, an insulator ring 106, a base ring 210, an equipment plate 224, a chuck 104, a support ring 112, a bowl 218, and an insulator wall 230. The insulator wall 230 is a wall of the bias housing of the plasma chamber described herein. The insulator ring 106 is fixed (e.g., non-movable) relative to the insulator wall 230. The ground ring 114 is uncoated. The edge ring 228 is sometimes referred to herein as a hot edge ring (HER). The edge ring 228 is made of the same material as the edge ring 108 of FIG. 1, except that the edge ring 228 has a different shape than the edge ring 108 of FIG. 1. As one example, the edge ring 228 has an outer diameter along the x-axis of about 13.6 inches (about 34.544 cm) or more and about 15 inches (about 38.1 cm) or less. As another example, the outer diameter of the edge ring 228 is about 13 inches (about 33.02 cm) or more and about 15 inches (about 38.1 cm) or less. As yet another example, the edge ring 228 has a thickness measured along the y-axis of about 0.248 inches (about 0.62992 cm). Illustratively, the thickness of the edge ring 228 is about 0.24 inches (about 0.6096 cm) or more and about 0.256 inches (about 0.65024 cm) or less. A plurality of fastener holes, such as fastener holes 124A in FIG. 1, are formed in the edge ring 228 to secure the edge ring 228 to the support ring 112.

[0055] 1 , except that the cover ring 201 has a different shape than the cover ring 118 of FIG. 1 . The cover ring 201 has an annular body, such as a disk-shaped or ring-shaped body. A portion of the cover ring 201 is located above and adjacent to the ground ring 114, and another portion of the cover ring 201 is located above and adjacent to the base ring 210. Similarly, the base ring 210 is located above and adjacent to the base ring 116 of FIG. 1 , except that the base ring 210 has a different shape than the base ring 116 of FIG. 1 , but is made of the same material as the base ring 116 of FIG. 1 .

[0056] A portion P5 of the edge ring 228 is coupled to the support ring 112 via the gel layer 110C, thermally sinking the support ring 112 to the edge ring 228. Similarly, another portion P4 of the edge ring 228 is coupled to a portion of the chuck 104 via the gel layer 110C. The edge ring 228 surrounds the top portion PRTN1 of the chuck 104. Another portion P6 of the edge ring 228 is adjacent to a portion of the top surface of the base ring 210. Furthermore, the cover ring 201 surrounds the edge ring 228. The support ring 112 is located below the edge ring 228 and surrounds a portion of the chuck 104. The insulator ring 106 is located below the support ring 112 and surrounds the bottom of the chuck 104. The base ring 210 is located below the cover ring 201 and surrounds a portion of the insulator ring 106. The ground ring 114 surrounds a portion of the insulator ring 106 and the base ring 210. The bowl 218 is located below the insulator ring 106. The insulator wall 230 is located below a portion of the insulator ring 106 and the ground ring 114. The insulator wall 230 is fabricated from an insulator material.

[0057] The power pin feedthrough 206 is inserted through a through-hole in the insulator ring 106 and a hole formed in the support ring 112. The power pin feedthrough 206 is a sleeve made of an insulator such as plastic or ceramic to protect the power pin 208. The power pin 208 is disposed within the power pin feedthrough 206. 208 are conductive rods made of metal such as aluminum or steel for conducting RF power to the support ring 112 or to the electrodes EL within the support ring 112. 208 The tip of the power pin feedthrough 206 is in contact with the electrode EL and provides RF power to the electrode EL. The middle portion of the power pin feedthrough 206 is surrounded by a mount 216A made from an insulating material.

[0058] An O-ring 214 located on top of and adjacent to the mount 216A seals the mount 216A against the power pin feedthrough 206. The O-ring 214 surrounds the bottom of the power pin feedthrough 206. An example of an O-ring as described herein is a ring made of metal, such as aluminum or steel. Additionally, another O-ring 214 is provided on top of the power pin feedthrough 206, sealing the mount 216A against the power pin feedthrough 206. 208 and the power pin feedthrough 206 from entering the plasma in the plasma chamber that contains the system 200. 208 There is no vacuum between the power pin feedthrough 206 and the O-ring 204. The O-ring 204 surrounds the top of the power pin feedthrough 206.

[0059] Note that in some embodiments, multiple power pins are used. For example, two power pins can be used with a power pin feedthrough, an O-ring surrounding the bottom of each of the power pin feedthroughs, and an O-ring surrounding the top of each of the power pin feedthroughs to provide power to the electrode EL at multiple locations.

[0060] The standoff RF voltage is generated from the RF power of the RF signal received from the auxiliary RF generator via the auxiliary matching. The standoff RF voltage has a trackable distance 213 from the vertically oriented inner surface 203 of the cover ring 201 to the grounded ring 114. The standoff RF voltage is generated via the trackable distance 213 from the vertically oriented inner surface 203 to the grounded ring 114. It should be noted that in some embodiments, the annular width of the cover ring 201 is selected such that the trackable distance 213 between the edge ring 228 and the grounded ring 114 is sufficient to cause loss of RF voltage from the edge ring 228 to the grounded ring 114 to be less than a predetermined amount. For example, if the desired amount of standoff voltage achieved at the vertically oriented inner surface 203 of the covering ring 201 is 5000 volts (V) and 7 to 10 volts are dissipated per thousandth of an inch (2.54 cm) of the covering ring 201, the annular width of the covering ring 201 is selected so that the trackable distance 213 or annular width is a ratio of a multiple (such as 2 or 3) of 5000 volts to 10 volts. Illustratively, the ratio is (2 x 5000) / 10 volts. The trackable distance 213 lies in the xy plane of the cross section of the covering ring 201. The xy plane is formed by and lies between the x and y axes.

[0061] In some embodiments, a plurality of power pin feedthroughs are coupled to the support ring 112 to provide RF power, each of the power pin feedthroughs having a power pin.

[0062] In some embodiments, the ground ring 114 is coated with a conductive material, such as alumina, to increase the electrical conductivity of the ground ring 114 .

[0063] In various embodiments, the gel layer 110C is disposed in multiple locations along the underside of the edge ring 228 and along the upper surfaces of the support ring 112 and chuck 104 to provide electrical and thermal conductivity between the edge ring 228 and the support ring 112, and between the edge ring 228 and the chuck 104.

[0064] 3A is a diagram of one embodiment of system 300. Each of pressure bars 302A and 302B is inserted through a corresponding slot in bottom surface 308 of support ring 112. For example, pressure bar 302A is inserted into a first slot in bottom surface 308 at location L1, securing support ring 112 to insulator ring 106 at location L1. Similarly, pressure bar 302B is inserted into a second slot in bottom surface 308 at location L2, securing support ring 112 to insulator ring 106 at location L2. As another example, each pressure bar 302A and 302B has threads on its top that mate with threads in a respective slot formed in bottom surface 308. As yet another example, each pressure bar 302A and 302B has a spring-based telescoping mechanism that contracts before insertion into its respective slot in bottom surface 308 and expands after insertion.

[0065] It should be noted that the size of each through-hole formed along the length of the support ring 112 measured along the y-axis varies with the outer diameter (OD) and inner diameter (ID) of the support ring 112. The inner diameter of the support ring 112 varies with the diameter of the chuck 104 of FIGS.

[0066] In various embodiments, any number of pressure bars, such as two or more, are used to couple to the support ring 112 .

[0067] FIG. 3B is an isometric view illustrating the connection between the pressure bar 302A and the bottom surface 308 of the support ring 112. A slot 330 is formed in the bottom surface along a portion of the length of the support ring 112. The length of the support ring 112 is along the y-axis. A receptacle 332 made of a metal, such as aluminum, steel, titanium, or an aluminum alloy, steel alloy, or titanium alloy, is received in the slot 330. For example, the receptacle 332 is attached to the surface of the slot 330 via an attachment mechanism, such as a screw thread. Further illustratively, the slot 330 has threads that mate with the threads of the receptacle 332. The tip of the pressure bar 302A is inserted into and engages with the receptacle 332, connecting the pressure bar 302A to the support ring 112.

[0068] FIG. 4 is a side view of one embodiment of a system 900 for securing an edge ring 924 and a support ring 112 to an insulator ring 106. Examples of the edge ring 924 include the edge ring 108 of FIG. 1 and the edge ring 228 of FIG. 2. The system 900 includes a clasp mechanism 920A, an insulator ring 106, a support ring 112, and an edge ring 924. The clasp mechanism 920A includes an air cylinder 912, a pneumatic piston 922, a threaded adapter 908, a push connector 906, and a mount 604A for attaching the pressure bar 302A to the insulator wall 230. The mount 604A is attached to the insulator wall 230 via a plurality of shoulder screws 902. The clasp mechanism 920A is coupled to a plurality of air fittings 914. The air fitting 914 includes an air fitting 914A and an air fitting 914B provided on a side of the clasp mechanism 920A. The clasp mechanisms described herein are made of a metal, such as steel, aluminum, a steel alloy, or an aluminum alloy. Additionally, the air fitting 914 is also made of a metal, such as steel, aluminum, a steel alloy, or an aluminum alloy.

[0069] The piston 922 has a piston body 916 and a piston rod 918. The piston body 916 is within the air cylinder 912. The diameter of the piston body 916 is larger than the diameter of the piston rod 918. The piston body 916 is either integral with or attached to the piston rod 918. The mount 604A is attached to the air cylinder 912 via a number of screws 910 on the top surface of the air cylinder 912. The threaded adapter 908 is inserted into a central opening 930 of the mount 604A. The threaded adapter 908 fits into a slot formed in the top surface of the piston rod 918. The threaded adapter 908 further has a slot into which a push connector 906 fits. The push connector 906 fits with the pressure rod 302A, which is inserted through the central opening 930 of the mount 604A. The push connector 906 is attached, for example, by screws, to the bottom of the pressure rod 302A.

[0070] Similarly, the other pressure bar 302B (FIG. 3A) is coupled to another pneumatic mechanism of a clasp mechanism 920B, described below. For example, the clasp mechanism 920B includes a piston, such as piston 922, coupled to the pressure bar 302B and moving the pressure bar 302B up and down vertically along the y-axis. Threads 932 on the tip of the pressure bar 302A mate with corresponding threads 934 in a slot 931 formed in the bottom surface 308 of the support ring 112. A top portion PR1 of the pressure bar 302A extends through the bottom surface of the support ring 112 and into the slot therein, and a middle portion PR2 of the pressure bar 302A extends through a through-hole in the insulator ring 106. Similarly, the top portion of the pressure bar 302B extends into a slot in the bottom surface of the support ring 112 and a middle portion of the pressure bar 302B extends into a through-hole in the insulator ring 106.

[0071] The support ring 112 is physically connected to the edge ring 924 via one or more fasteners, as described above. When air is supplied to the bottom of the air cylinder 912 via air fitting 914B, pressure is generated by the air below the underside of the piston body 916. The pressure generated below the underside of the piston body 916 causes the piston 922 to move vertically upward along the y-axis, pushing up on the pressure bar 302A. As the pressure bar 302A is pushed up, the support ring 112 is lifted vertically upward relative to the insulator ring 106. Simultaneously with the support ring 112, the edge ring 924 is also lifted vertically upward and away from the insulator ring 106. The support ring 112 and edge ring 924 are then attached to the plasma chamber. Idiot To remove the support ring 112 and edge ring 924 from the insulator ring 106, the support ring 112 and edge ring 924 are pushed vertically upward away from the insulator ring 106. The support ring 112 and edge ring 924 are removed for replacement or maintenance of the support ring 112, or the edge ring 924, or a combination thereof.

[0072] Meanwhile, when air is supplied to the top of the air cylinder 912 via air fitting 914A, pressure is generated by the air above the top surface of the piston body 916. The pressure generated above the top surface of the piston body 916 causes the piston 922 to move vertically downward along the y-axis, pulling down the pressure bar 302A. As the pressure bar 302A is pulled down, the support ring 112 is pulled vertically downward toward the insulator ring 106. Simultaneously with the support ring 112, the edge ring 924 is also pulled vertically downward toward the insulator ring 106. The support ring 112 and edge ring 924 are pulled down toward the insulator ring 106 during processing of a substrate placed on the chuck 104.

[0073] Figure 5 is an isometric view of one embodiment of a clasp mechanism 920A. Shown in Figure 5 is one of the screws 910 and mount 604A.

[0074] FIG. 6A is a diagram of one embodiment of a system 1100 for illustrating the synchronized pulling down of multiple pressure bars 302A and 302B (FIG. 3A). System 1100 includes an air path 1102A, clasp mechanism 920A, clasp mechanism 920B, and clasp mechanism 920C. Clasp mechanisms 920B and 920C have the same structure and function as clasp mechanism 920A. By way of example, clasp mechanisms 920A-920C each include a double-acting cylinder. Clasp mechanism 920B includes ,Ma Yes To Through pressure rod 302B The clasp mechanism 920C is connected to ,Ma Yes To Hold down through On a stick Connected.

[0075] The air pathways described herein have multiple tubes, each made from an insulating material such as a plastic and plasticizer combination or plastic, and are flexible and can be connected to the top or bottom of the clasp mechanisms 920A-920C.

[0076] The air path 1102A includes multiple tubes 1106A, 1106B, 1106C, 1106D, and 1106E. Tubes 1106A and 1106D are connected to tube 1106B via connector C1, and tubes 1106B and 1106E are connected to tube 1106C via connector C2. Each connector connecting multiple tubes described herein has a hollow space that allows air to pass through. As an example, each connector connecting multiple tubes is made of an insulating material.

[0077] Tube 1106D is connected to top 1104A of clasp mechanism 920A via pneumatic fitting 914A (FIG. 4). Similarly, tube 1106E is connected to top 1104C of clasp mechanism 920B via a pneumatic fitting such as pneumatic fitting 914A, and tube 1106C is connected to top 1104E of clasp mechanism 920C via a pneumatic fitting such as pneumatic fitting 914A.

[0078] Air is supplied to top 1104A of clasp mechanism 920A via tube 1106A, connector C1, and tube 1106D. Similarly, air is supplied to top 1104C of clasp mechanism 920B via tube 1106A, connector C1, tube 1106B, connector C2, and tube 1106E. Furthermore, air is supplied to top 1104E of clasp mechanism 920C via tube 1106A, connector C1, tube 1106B, connector C2, and tube 1106C. When air is supplied to tops 1104A, 1104C, and 1104E, the pistons of clasp mechanisms 920A-920C are synchronously (e.g., simultaneously) pulled down along the y-axis, pushing support ring 112 ( FIG. 4 ) and edge ring 924 ( FIG. 4 ) against insulator ring 1106A. 106 Move it towards (Figure 4).

[0079] Power pin 208, pressure rods 302A and 302B, and temperature probe shaft To Surrounding the support ring 112 are multiple barrel seals, described below. These barrel seals exert a vertical upward force along the y-axis on the support ring 112. Clasping mechanisms 920A-920C limit the vertical upward lift, preventing the support ring 112 from floating vertically relative to the chuck 104. Additionally, the clasping mechanisms 920A-920C apply a clamping force to the gel layers 110B and 110C (FIGS. 1 and 2) between the edge ring 924 and the chuck 104. The double-acting cylinder exerts a constant vertical upward or downward force on the support ring 112, regardless of the temperature of the support ring 112.

[0080] FIG. 6B illustrates a plurality of pressure bars 302A and 302B (FIG. 3A). Same as 11 is a diagram of one embodiment of a system 1150 for illustrating a push-up operation. System 1150 includes air path 1102B, clasp mechanism 920A, clasp mechanism 920B, and clasp mechanism 920C.

[0081] Air path 1102 B 1106F, 1106G, 1106H, 1106I, and 1106 J Tubes 1106F and 1106I are connected to tube 1106G via connector C3, and tubes 1106G and 1106J are connected to tube 1106G via connector C4. H Tube 1106I is connected to lower portion 1104B of clasp mechanism 920A via air fitting 914B (FIG. 4). Similarly, tube 1106J is connected to lower portion 1104D of clasp mechanism 920B via an air fitting such as air fitting 914B, and tube 1106 H is connected to the lower portion 1104F of the clasp mechanism 920C via a pneumatic coupling such as pneumatic coupling 914B.

[0082] Air is supplied to lower portion 1104B of clasp mechanism 920A via tube 1106F, connector C3, and tube 1106I. Similarly, air is supplied to lower portion 1104D of clasp mechanism 920B via tube 1106F, connector C3, tube 1106G, connector C4, and tube 1106J. Furthermore, air is supplied to lower portion 1104F of clasp mechanism 920C via tube 1106F, connector C3, tube 1106G, connector C4, and tube 1106H. When air is supplied to lower portions 1104B, 1104D, and 1104F, the pistons of clasp mechanisms 920A-920C are synchronously (e.g., simultaneously) pushed up along the y-axis, forcing support ring 112 ( FIG. 4 ) and edge ring 924 ( FIG. 4 ) against insulator ring 1106B. 106 Move it away from (Figure 4).

[0083] 7 is a block diagram of one embodiment of system 1200 illustrating the supply of air to clasp mechanisms 920A-920C. System 1200 includes multiple air compressors 1202A and 1202B, multiple air pressure regulators 1204A and 1204B, multiple orifices 1206A and 1206B, air paths 1102A and 1102B, and clasp mechanisms 920A-920C. Air compressor 1202A is coupled to the upper portions of clasp mechanisms 920A-920C via regulator 1204A, orifice 1206A, and air path 1102A. Similarly, air compressor 1202B is coupled to the lower portions of clasp mechanisms 920A-920C via regulator 1204B, orifice 1206B, and air path 1102B.

[0084] The air compressor 1202A compresses air to generate compressed air. The compressed air is supplied to the air pressure regulator 1204A. The air pressure regulator 1204A controls the pressure of the compressed air, for example by changing it to a predetermined air pressure, and supplies the compressed air having the predetermined air pressure to the top of the clasp mechanism 920A via the orifice 1206A and the air path 1102A. An example of the predetermined air pressure described herein is an air pressure of 28 pounds per square inch (psi) (12.7006 kg / 2.54 square cm). Another example of the predetermined air pressure described herein is an air pressure in the range of 25 psi to 31 psi.

[0085] Similarly, air compressor 1202B compresses air to generate compressed air. The compressed air is supplied to air pressure regulator 1204B. Air pressure regulator 1204B controls the pressure of the compressed air, for example, by changing it to the predetermined air pressure, and supplies the compressed air having the predetermined air pressure to a lower portion of clasp mechanism 920B via orifice 1206B and air path 1102B.

[0086] 8A is an isometric view of one embodiment of edge ring 228. Edge ring 228 has a top surface 1604. FIG. 8A shows a perspective view of multiple fastener holes 124A, 124B, and 124C formed in a bottom surface 1612 of edge ring 228.

[0087] In some embodiments, any other number of fastener holes (such as six or nine fastener holes) are formed in the bottom surface 1612 to fit the same number of fasteners therein. For example, the distance between two adjacent holes in one set of holes formed in the bottom surface 1612 of the edge ring 228 is the same as the distance between two adjacent holes in another set of holes formed in the bottom surface 1612 of the edge ring 228. Illustratively, any one of the two adjacent holes in one set of holes may or may not be the same as one of the two adjacent holes in the other set.

[0088] 8B is a top view of one embodiment of edge ring 228. Edge ring 228 has an inner diameter ID1 and an outer diameter OD1. The outer diameter OD1 is greater than or equal to about 13.6 inches (about 34.544 cm) and less than or equal to about 15 inches (about 38.1 cm). As another example, outside The diameter OD1 is greater than or equal to about 13.6 inches (about 34.544 cm) and less than or equal to about 16 inches (about 40.64 cm). outside Diameter OD1 is greater than or equal to about 12 inches (about 30.48 cm) and less than or equal to about 18 inches (about 45.72 cm). An outer diameter OD1 greater than 13.6 inches (34.544 cm) (e.g., greater than 14 inches (35.56 cm) or closer to 15 inches (38.1 cm)) reduces the likelihood of RF power arcing between edge ring 228 and cover ring 118. Inner diameter ID1 is the diameter of the inner peripheral edge of edge ring 228, and outer diameter OD1 is the diameter of the outer peripheral edge of edge ring 228. A top view of edge ring 228 shows top surface 1604.

[0089] 8C is a cross-sectional view of the edge ring 228 along the AA section shown in FIG. 8B. The edge ring 228 has a top surface 1604 (sometimes referred to herein as the top side) and a bottom surface 1612 (sometimes referred to herein as the bottom side). Each of the top surface 1604 and the bottom surface 1612 is a horizontally oriented surface. As used herein, the top surface 1604is sometimes referred to as the top side. The edge ring 228 further has an inner surface 1620 (sometimes referred to herein as the inside) and an outer surface 1614 (sometimes referred to herein as the outside). The outer surface 1614 is a vertically oriented surface. It should be noted that the edge ring 228 has an annular body, such as a circular body, a ring-shaped body, or a dish-shaped body.

[0090] Edge ring 228 has a step 1622 including an inclined inner surface 1606 and a horizontally oriented inner surface 1608. Inclined inner surface 1606 forms an angle A2 with respect to vertically oriented inner surface 1610 that is about 15° or about 50°. In one embodiment, angle A2 ranges from about 5° to about 55°. In another embodiment, angle A2 ranges between about 12° to about 20°. In yet another embodiment, angle A2 ranges from about 10° to about 20°. Inclined Inner Surface 1606 is continuous with the top surface 1604. For example, the inclined inner surface 1606 forms a radius R3 with the top surface 1604. Illustratively, the radius R3 is a maximum of about 0.01 inch (about 0.0254 cm). For example, a curve having a radius R3 is formed between the inclined inner surface 1606 and the top surface 1604. Illustratively, the radius R3 is greater than or equal to about 0.009 inch (about 0.02286 cm) and less than or equal to about 0.011 inch (about 0.02794 cm).

[0091] The horizontally oriented inner surface 1608 is inclined Inside The edge ring 228 has a mid-diameter (MD) of approximately 11.858 inches. For example, the horizontally oriented inner surface 1608 forms a radius R4 with respect to the inclined inner surface 1606. Illustratively, the radius R4 is approximately 0.032 inches (approximately 0.08128 cm). For example, a curve having a radius R4 is formed between the horizontally oriented inner surface 1608 and the inclined inner surface 1606. Illustratively, the radius R4 is approximately 0.003 inches (0.00762 cm) or greater and approximately 0.0034 inches (approximately 0.008636 cm) or less. The mid-diameter (MD) of the location on the edge ring 228 where the radius R4 is formed is approximately 11.858 inches (approximately 30.11932 cm). For example, the mid-diameter is approximately 11.856 inches (approximately 30.11424 cm) or greater and approximately 11.86 inches (approximately 30.1244 cm) or less.

[0092] The horizontally oriented surface described herein is substantially parallel to the x-axis, and the vertically oriented surface described herein is substantially parallel to the y-axis. For example, the horizontally oriented surface forms an angle with the x-axis ranging from -5° to +5°, and the vertically oriented surface forms an angle with the y-axis ranging from -5° to +5°. Illustratively, the horizontally oriented surface is parallel to the x-axis and perpendicular to the y-axis, and the vertically oriented surface is parallel to the y-axis and perpendicular to the x-axis. The inclined surface described herein is neither a vertically oriented surface nor a horizontally oriented surface.

[0093] The horizontally oriented inner surface 1608 is separated from the top surface 1604 by the angled inner surface 1606. For example, the angled inner surface 1606 is adjacent to the top surface 1604 and the horizontally oriented inner surface 1608, but the horizontally oriented inner surface 1608 is not adjacent to the top surface 1604.

[0094] Additionally, the inner surface 1620 has a vertically oriented inner surface 1610, which is continuous with the horizontally oriented inner surface 1608. For example, the vertically oriented inner surface 1610 forms a radius R5 with respect to the horizontally oriented inner surface 1608. Illustratively, a curve having a radius R5 is formed between the vertically oriented inner surface 1610 and the horizontally oriented inner surface 1608. Illustratively, the radius R5 is approximately 0.012 inches (approximately 0.03048 cm). Illustratively, the radius R5 is greater than or equal to approximately 0.007 inches (approximately 0.01778 cm) and less than or equal to approximately 0.017 inches (approximately 0.04318 cm). The vertically oriented inner surface 1610 has a distance d3 along the y-axis of approximately 0.0169 inches (approximately 0.042926 cm). For example, distance d3 is greater than or equal to about 0.0164 inches (about 0.041656 cm) and less than or equal to about 0.0174 inches (about 0.044196 cm). The distance of the vertically oriented surfaces is the length of the vertically oriented surfaces along the vertical y-axis. Furthermore, the distance of the horizontally oriented surfaces is the width of the horizontally oriented surfaces along the horizontal x-axis. Furthermore, the distance of the inclined surfaces is measured vertically along the y-axis. The vertically oriented inner surface 1610 has an inner diameter ID1, where ID1 is about 11.7 inches (about 29.718 cm). For example, inner diameter ID1 is greater than or equal to about 11 inches (about 27.94 cm) and less than or equal to about 12.4 inches (about 31.496 cm).

[0095] Furthermore, the inner surface 1620 has an inclined inner surface 1618 that is inclined relative to the vertically-oriented inner surface 1610 and the bottom surface 1612. The inclined inner surface 1618 is continuous with the vertically-oriented inner surface 1610. For example, the inclined inner surface 1618 forms a radius R6 with respect to the vertically-oriented inner surface 1610. Illustratively, a curve having the radius R6 is formed between the inclined inner surface 1618 and the vertically-oriented inner surface 1610. Illustratively, the radius R6 is approximately 0.015 inches (approximately 0.0381 cm). Illustratively, the radius R6 is greater than or equal to approximately 0.0149 inches (approximately 0.037846 cm) and less than or equal to approximately 0.0151 inches (approximately 0.038354 cm). Furthermore, the inclined inner surface 1618 is continuous with the bottom surface 1612. For example, the inclined inner surface 1618 forms a radius R7 with respect to the bottom surface 1612. Illustratively, a curve having a radius R7 is formed between the inclined inner surface 1618 and the bottom surface 1612. Illustratively, radius R7 is approximately twice radius R6. Illustratively, radius R6 is approximately 2×0.0149 inches or more and approximately 2×0.0151 inches or less.

[0096] The length d2 of the inclined inner surface 1618 is approximately 0.035 inches (approximately 0.0889 cm). For example, the length d2 is greater than or equal to approximately 0.0345 inches (approximately 0.08763 cm) and less than or equal to approximately 0.0355 inches (approximately 0.09017 cm). The inclined inner surface 1618 forms an angle A1 of approximately 30° with the vertically-oriented inner surface 1610. For example, the angle A1 is greater than or equal to approximately 28° and less than or equal to approximately 32°. Note that the combination of the inclined inner surface 1606, the horizontally-oriented inner surface 1608, the vertically-oriented inner surface 1610, and the inclined inner surface 1618 may be referred to herein as the inside of the edge ring 228.

[0097] The outer surface 1614 is continuous (e.g., adjacent or continuous) with the bottom surface 1612. For example, the outer surface 1614 forms a radius R2 with the bottom surface 1612. Illustratively, a curve having the radius R2 is formed between the outer surface 1614 and the bottom surface 1612. Illustratively, the radius R2 is approximately 0.012 inches (approximately 0.03048 cm). Illustratively, the radius R2 is greater than or equal to 0.0119 inches (approximately 0.030226 cm) and less than or equal to 0.0121 inches (approximately 0.030734 cm).

[0098] The edge ring 228 includes a curved edge 1616 formed between the top surface 1604 and the outer surface 1614 of the edge ring 228. For example, the curved edge 1616 is adjacent (e.g., adjacent to) the top surface 1604 and the outer surface 1614. The curved edge 1616 has a radius R1. By way of example, the radius R1 is approximately 0.1 inch (approximately 0.254 cm). Illustratively, the radius R1 is in the range of 0.8 inch to 0.12 inch (approximately 2.032 cm to approximately 0.3048 cm). The curvature of the curved edge 1616 reduces the likelihood of RF power arcing occurring between the edge ring 228 and the cover ring 201. Arcing occurs when the plasma is forced to exit the plasma chamber. Inside the This occurs when the curved edge 1616 is formed and maintained at a constant y-axis. Sharp edges increase the likelihood of arcing. outside Distance d1, which is the sum of the perpendicular distance to the length of face 1614 along the y-axis, is approximately 0.23 inches (approximately 0.5842 cm). By way of example, distance d1 is greater than or equal to approximately 0.229 inches (approximately 0.58166 cm) and less than or equal to approximately 0.231 inches (approximately 0.58674 cm). Outer diameter OD1 of outer face 1614 is approximately 14.06 inches (approximately 35.7124 cm), and by way of example, outer diameter OD1 ranges from 13.5 inches (34.29 cm) to 14.5 inches (35.83 cm). Note that the inner or outer or intermediate diameters of the edge rings described herein are defined relative to a central axis passing through the center of gravity of the edge ring.

[0099] It should be noted that the edge rings described herein are consumable items. is the baseboard of For example, the base material may wear out if used multiple times for processing. Board The plasma used for processing leaves behind residual material that corrodes the edge ring, and the plasma also corrodes the edge ring.

[0100] Additionally, the edge ring is replaceable. For example, after repeated use of the edge ring, the edge ring is replaced. Illustratively, the edge ring is removed from the insulator ring 106 (FIG. 2) by vertically pushing it up and away from the insulator ring 106 using the pressure bars 302A and 302B of FIG. 3A. The edge ring is then replaced with another edge ring. The other edge ring is then removed from the substrate. Board For processing another substrate, the substrate is pressed down vertically onto the insulator ring 106 using pressure bars 302A and 302B.

[0101] In some embodiments, the radii R1-R7 of the edge of the edge ring 228 are each greater than about 0.03 inches (0.0762 cm) to reduce the likelihood of RF power arcing toward or away from the edge. Further illustratively, the radii R1-R7 of the edge of the edge ring 228 are each greater than about 0.03 inches (0.0762 cm) and less than or equal to about 0.1 inches (0.254 cm) to reduce the likelihood of RF power arcing toward or away from the edge. Note that in various embodiments, the radii R1-R7 are each greater than about 0.01 inches (0.0254 cm) and less than or equal to about 0.03 inches (0.0762 cm). A radius greater than about 0.01 inches (0.0254 cm) and less than or equal to about 0.03 inches (0.0762 cm) reduces the likelihood of chipping at the edge of the radius during semiconductor wafer fabrication.

[0102] In one embodiment, the edge ring 228 has multiple edges. In one embodiment, the edges defining the edge ring 228 are rounded. For example, the radii RA and RC of the edge ring 228 may be rounded. (Shown in Figure 9E) Edges having a radius of about 0.03 inches (about 0.0762 cm) or greater are rounded. It has been found that less rounding of these edges may be insufficient to prevent or reduce the likelihood of RF power arcing during operation of the plasma chamber. Arcing is affected by the sharpness of the edges of features within the plasma chamber, and reducing the likelihood of arcing can be detrimental to fabrication processes performed on and across semiconductor wafers. Slight rounding of edges (e.g., As shown in Figure 9E Each of the radii RA and RC is less than or equal to about 0.03 inches (about 0.0762 cm); As shown in Figure 9E Radii RA and RC of about 0.01 inches (about 0.0254 cm) or greater and about 0.03 inches (about 0.0762 cm) or less, respectively, help reduce the likelihood of particle generation during semiconductor wafer fabrication or edge chipping during fabrication. Therefore, some degree of roundness (e.g., As shown in Figure 9E Although radiuses RA and RC) have been added, given the high power levels used in plasma processing operations, this rounding is less than sufficient to prevent or reduce arcing.

[0103] FIG. 8D is a diagram of one embodiment of a system 1650 illustrating coupling of fasteners 122 to an edge ring 228. The cross-sectional view of the edge ring 228 is taken along cross-section aa shown in FIG. 8A. A slot 125 is drilled into the bottom surface 1612 of the edge ring 228. In addition to drilling the slot 125, a thread 1652 is formed on a side surface SS of the slot 125. The side surface SS is substantially perpendicular (e.g., perpendicular or in the range of 85-95°) to the top surface TS of the slot 125. The slot 125 surrounds the fastener hole 124A.

[0104] The fastener 122 has a thread 1654 formed at its tip. The fastener 122 further has a body 1658 below the thread 1654. A head 1660 of the fastener 122 is located below the body 1658.

[0105] Fastener 122 is inserted into fastener hole 124A and turned clockwise to engage threads 1654 with threads 1652, connecting support ring 112 ( FIG. 1 ) to edge ring 228. Similarly, additional fasteners (such as fastener 122) are inserted into multiple fastener holes 124B and 124C to connect support ring 112 to edge ring 228. Multiple fastener holes 124B and 124C are formed in respective slots in bottom surface 1612 of edge ring 228. For example, fastener holes 124A-124C form the vertices of an equilateral triangle in the horizontal plane of bottom surface 1612 of edge ring 228. When four or more fastener holes are formed in bottom surface 1612, the fastener holes are spaced substantially equidistant (e.g., equidistant). For example, the distance between two adjacent fastener holes in one set of fastener holes in the bottom surface 1612 is the same as the distance between two adjacent fastener holes in another set of fastener holes in the bottom surface 1612. A set of two fastener holes is different from another set when at least one fastener hole in the set of fastener holes is not the same as a fastener hole in another set of fastener holes. For example, two different sets of fastener holes have at least one fastener hole that is not common. As another example, the distance between two adjacent fastener holes in one set of fastener holes is within a predetermined limit relative to the distance between two adjacent fastener holes in another set of fastener holes in the bottom surface 1612. When the support ring 112 is connected to the edge ring 228 and the edge ring 228 or the support ring 112 is moved, the edge ring 228 and the support ring 112 simultaneously move vertically along the y-axis or horizontally along the x-axis.

[0106] 9A is an isometric view of one embodiment of a covering 202. Covering 202 may be used in some embodiments in place of covering 201 of FIG. 2. Covering 202 has a top surface 1704. Note that the coverings described herein are consumable items. For example, covering is the board Multiple uses during processing can cause wear. For example, plasma radicals Board The process results in residual material that corrodes the covering, and the plasma also corrodes the covering.

[0107] Additionally, the covering may be replaceable, e.g., after repeated use of the covering, the covering may be replaced. For example, the covering may be removed from the plasma chamber to be replaced with another covering. Idiot It is removed from the

[0108] 9B is a bottom view of one embodiment of the cover ring 202. The cover ring has a bottom surface 1705.

[0109] 9C is a top view of one embodiment of the cover ring 202. The cover ring 202 has an inner diameter ID2 and a width W1. The inner diameter ID2 is the diameter of the inner peripheral edge of the cover ring 202. The width W1 is the width of the annular body of the cover ring 202, and the inner diameter ID of the cover ring 202 is the width of the inner peripheral edge of the cover ring 202. 2 and the outer diameter.

[0110] Figure 9D is a cross-sectional view of one embodiment of the covering ring 202 along section AA of Figure 9C. The covering ring 202 has a vertically-oriented inner surface 1724, another vertically-oriented inner surface 1720, a vertically-oriented outer surface 1716, another vertically-oriented outer surface 1714, and a vertically-oriented outer surface 1710. The diameter of the vertically-oriented inner surface 1724 is ID2. Diameter ID2 is approximately 13.615 inches (approximately 34.5821 cm). For example, diameter ID2 is greater than or equal to approximately 13.4 inches (approximately 34.036 cm) and less than or equal to approximately 13.8 inches (approximately 35.052 cm). Furthermore, the diameter of the vertically-oriented inner surface 1720 is D1. Diameter D1 is approximately 13.91 inches (approximately 35.3314 cm). For example, diameter D1 is greater than or equal to approximately 13.8 inches (approximately 35.052 cm) and less than or equal to approximately 14 inches (approximately 35.56 cm). Additionally, the diameter of the vertically oriented outer surface 1716 is D2. Diameter D2 is approximately 14.21 inches (approximately 36.0934 cm). For example, diameter D2 is greater than or equal to approximately 14 inches (approximately 35.56 cm) and less than or equal to approximately 14.5 inches (approximately 36.83 cm). The diameter of the vertically oriented outer surface 1714 is D3, and the diameter of the vertically oriented outer surface 1710 is OD2. Diameter D3 is approximately 14.38 inches (approximately 36.5252 cm). For example, diameter D3 is greater than or equal to approximately 14.2 inches (approximately 36.068 cm) and less than or equal to approximately 14.5 inches (approximately 36.83 cm). Diameter OD2 is approximately 14.7 inches (approximately 37.338 cm). For example, diameter OD2 is greater than or equal to approximately 14 inches (approximately 35.56 cm) and less than or equal to approximately 15 inches (approximately 38.1 cm).

[0111] Diameter D1 is larger than diameter ID2. Furthermore, diameter D2 is larger than diameter D1, diameter D3 is larger than diameter D2, and diameter OD2 is larger than diameter D3.

[0112] 9E is a cross-sectional view of one embodiment of covering 202. Covering 202 includes an upper body portion 1730, a middle body portion 1732, and a lower body portion 1734. Upper body portion 1730 has a vertically oriented outer surface 1710, a horizontally oriented outer surface 1712, another horizontally oriented inner surface 1722, a vertically oriented inner surface 1724, and a horizontally oriented top surface 1704. A curved edge 1706 is formed between vertically oriented outer surface 1710 and top surface 1704. Curved edge 1706 has a radius RC that is approximately 0.06 inches (approximately 0.1524 cm). For example, radius RC is greater than or equal to approximately 0.059 inches (approximately 0.14986 cm) and less than or equal to approximately 0.061 inches (approximately 0.15494 cm). Curved edge 1706 is continuous with (eg, continuous with or adjacent to) top surface 1704 and vertically oriented outer surface 1710 .

[0113] The vertically oriented outer surface 1710 is outside For example, a curve having a radius RD is continuous with the vertically oriented outer surface 1710 and the horizontally oriented outer surface 1712. outside The radius RD is formed between the surface 1712 and the surface 1714. The radius RD is about 0.015 inches (about 0.0381 cm). For example, the radius RD is greater than or equal to about 0.0145 inches (about 0.03683 cm) and less than or equal to about 0.0155 inches (about 0.03937 cm).

[0114] Furthermore, horizontally oriented inner surface 1722 is continuous with vertically oriented inner surface 1724. For example, a curve having a radius R K is formed between vertically oriented inner surface 1724 and horizontally oriented inner surface 1722. Illustratively, radius R K is about 0.015 inches (about 0.0381 cm). By way of example, radius R K is greater than or equal to about 0.0145 inches (about 0.03683 cm) and less than or equal to about 0.0155 inches (about 0.03937 cm).

[0115] Additionally, the top surface 1704 is continuous with the vertically oriented inner surface 1724. For example, a curve having a radius RA is formed between the vertically oriented inner surface 1724 and the top surface 1704. Illustratively, the radius RA is approximately 0.015 inches (approximately 0.0381 cm). As an example, the radius RA is greater than or equal to approximately 0.0145 inches (approximately 0.03683 cm) and less than or equal to approximately 0.0155 inches (approximately 0.03937 cm). The radius RA reduces the likelihood of RF power arcing between the cover ring 202 and the edge ring 228. Arcing occurs when the plasma is forced to exit the plasma chamber. Inside the occurs during the formation of

[0116] The intermediate body portion 1732 has a vertically oriented inner surface 1720, a vertically oriented outer surface 1714, and a horizontally oriented outer surface 1726. 1719 The vertically oriented outer surface 1714 is continuous with the horizontally oriented outer surface 1712 of the upper body portion 1730. For example, a curve having a radius RE is formed between the vertically oriented outer surface 1714 and the horizontally oriented outer surface 1712. In one example, the radius RE is approximately 0.03 inches. Illustratively, the radius RE is greater than or equal to approximately 0.029 inches (approximately 0.07366 cm) and less than or equal to approximately 0.31 inches (approximately 0.7674 cm).

[0117] Additionally, vertically oriented inner surface 1720 is continuous with horizontally oriented inner surface 1722 of upper body portion 1730. For example, a curve having a radius RB is formed between horizontally oriented inner surface 1722 and vertically oriented inner surface 1720. By way of example, radius RB is about 0.01 inch (about 0.0254 cm). Illustratively, radius RB is greater than or equal to about 0.09 inch (about 0.2286 cm) and less than or equal to about 0.011 inch (about 0.02794 cm).

[0118] Horizontally oriented outer surface 1719 is continuous with the vertically oriented outer surface 1714. For example, a curve with a radius RF is continuous with the horizontally oriented outer surface 1714. 1719 and the vertically oriented outer surface 1714. By way of example, the radius RF is about 0.015 inches (about 0.0381 cm). Illustratively, the radius RF is greater than or equal to about 0.0145 inches (about 0.03683 cm) and less than or equal to about 0.0155 inches (about 0.03937 cm).

[0119] The lower body portion 1734 has a vertically oriented inner surface 1736, a bottom surface 1718, and a vertically oriented outer surface 1716 9D ). Vertically oriented inner surface 1736 is continuous with vertically oriented inner surface 1720 of intermediate body portion 1732. For example, vertically oriented inner surfaces 1720 and 1736 are integrated into one surface and have the same diameter D1 ( FIG. 9D ). Vertically oriented inner surface 1736 is continuous with bottom surface 1718. For example, a curve having a radius RJ is formed between vertically oriented inner surface 1736 and bottom surface 1718. By way of example, radius RJ is approximately 0.02 inches (approximately 0.0508 cm). Illustratively, radius RJ is approximately 0.019 inches (approximately 0.04826 cm) or greater and approximately 0.021 inches (approximately 0.05334 cm) or less.

[0120] Vertically oriented outer surface 1716 is continuous with the bottom surface 1718. For example, a curve with a radius RH is continuous with the bottom surface 1718 and the vertically oriented outer surface 1716 In one example, the radius RH is about 0.02 inches (about 0.0508 cm). Illustratively, the radius RH is greater than or equal to about 0.019 inches (about 0.04826 cm) and less than or equal to about 0.021 inches (about 0.05334 cm).

[0121] Vertically oriented outer surface 1716 is a horizontally oriented outer surface of the intermediate body portion 1732 1719 For example, a curve with a radius RG is formed on the vertically oriented outer surface. 1716 and horizontally oriented outer surface 1719 In one example, the radius RG is about 0.01 inches (about 0.0254 cm). Illustratively, the radius RG is greater than or equal to about 0.09 inches (about 0.2286 cm) and less than or equal to about 0.011 inches (about 0.0279 cm).

[0122] A vertical distance dB, such as the distance along the y-axis, is formed between the horizontally oriented inner surface 1722 and the top surface 1704. By way of example, the vertical distance dB is about 0.27 inches (about 0.6858 cm). Illustratively, the vertical distance dB is greater than or equal to about 0.25 inches (about 0.635 cm) and less than or equal to about 0.29 inches (about 0.7366 cm).

[0123] Furthermore, the vertical distance dA is horizontal Orientation outer surface 1712 and horizontal The distance dA is formed between the alignment inner surface 1722. In one example, the distance dA is about 0.011 inches (about 0.02794 cm). Illustratively, the distance dA is not less than about 0.009 inches (about 0.02286 cm) and not more than about 0.013 inches (about 0.03302 cm).

[0124] In addition, the horizontally oriented inner surface 1722 and the horizontally oriented outer surface 1719 The vertical distance between is dD. By way of example, the distance dD is approximately 0.172 inches. By way of illustration, the distance dD is greater than or equal to approximately 0.17 inches and less than or equal to approximately 0.174 inches.

[0125] Also, the vertical distance between the horizontally oriented inner surface 1722 and the horizontally oriented bottom surface 1718 is represented as dC. By way of example, the distance dC is approximately 0.267 inches (approximately 0.67818 cm). Illustratively, the distance dC is greater than or equal to approximately 0.265 inches (approximately 0.6731 cm) and less than or equal to approximately 0.269 inches (approximately 0.68326 cm).

[0126] The bottom surface 1705 of the covering 202 includes a horizontally oriented inner surface 1722, vertically oriented inner surfaces 1720 and 1736, a bottom surface 1718, and a vertically oriented outer surface 1726. 1716 , horizontally oriented outer surface 1719 , vertically oriented outer surface 1714, and horizontally oriented outer surface 1712.

[0127] Further, note that all edges of covering 202 are arcuate, e.g., curved. For example, radii RA, RB, RC, RD, RE, RF, RG, RH, RJ, and RK define arcuate edges.

[0128] 9F is a cross-sectional view of one embodiment of a system including an edge ring 228, a cover ring 202, a base ring 210, and a ground ring 212. A reduced width step 1726 with a turn is formed from the vertically-oriented inner surface 1724 to the vertically-oriented inner surface 1720. The reduced width step 1726 is located horizontally along the x-axis (e.g., in the +x or x-direction). The reduced width step 1726 is located between an upper body portion 1730 and an intermediate body portion 1732. The reduced width 1726 is located in the +x-direction away from the edge ring 228.

[0129] Additionally, another reduced width step 1729 is formed that extends from vertically oriented outer surface 1710 to vertically oriented outer surface 1714. Again, reduced width step 1729 is oriented horizontally (e.g., in the −x direction of the x-axis) but in the opposite direction from reduced width step 1726. Reduced width step 1729 extends in a direction away from edge ring 228.

[0130] The intermediate body portion 1732 has a horizontally oriented inner surface 1722 to a horizontally oriented outer surface 1719 A depth 1762 is formed, which is the distance to the y-axis. As used herein, depth is the depth in the y-axis direction (e.g., the -y direction).

[0131] Additionally, another reduced width step 1728 extends from the vertically oriented outer surface 1714 to the vertically oriented outer surface 1728. 1716 The width-reducing step 1728 is provided in the -x direction.

[0132] Also, the horizontally oriented outer surface of the lower body portion 1734 1719 and bottom surface 1718. Depth 1764 is the depth of lower body portion 1734. Note that depth 1764 is less than depth 1762. Furthermore, the depth of vertically oriented inner surface 1724 is greater than depth 1762.

[0133] An annular width 1746 is formed between the vertically oriented inner surface 1720 and the vertically oriented outer surface 1714. As used herein, annular width is along the x-axis. Additionally, another annular width 1754 is formed between the vertically oriented inner surface 1736 and the vertically oriented outer surface 1714. 1716 Annular width 1754 is less than annular width 1746.

[0134] tracking Possible Distance 1735 is the distance between the edge ring 228 and the ground ring 212. Tracking Possible The distance 1735 is determined by the width L11 of the horizontally oriented inner surface 1722, the total length L12 of the vertically oriented inner surfaces 1720 and 1736, the width L13 of the bottom surface 1718, and the vertically oriented outer surface 1716 length L14, and horizontally oriented outer surface 1719 The total length L12 is the sum of the length of the vertically aligned inner surface 1720 and the length of the vertically aligned inner surface 1736. Possible Distance 1735 is the path that the voltage received from RF power pin 208 dissipates along cover ring 202. Edge ring 228 acts as one capacitor plate of the capacitor, and electrode EL (FIG. 2) acts as another capacitor plate of the capacitor, with the dielectric material of support ring 112 between these two capacitor plates. Distance 1 is the horizontal distance along the x-axis between edge ring 228 and ground ring 212 for the voltage provided by RF power pin 208 to dissipate.

[0135] tracking Possible Distance 1735 or distance 1 defines the annular width of covering 202. PossibleThe voltage dissipation along distance 1735, or distance 1, defines the annular width of covering ring 202. The annular width of covering ring 202 is the difference between an inner diameter ID2 of covering ring 202 and an outer diameter OD2 of covering ring 202. The annular width of covering ring 202 is defined so that a predetermined amount of standoff voltage is achieved at vertically oriented inner surface 1724. For example, assuming 7 to 10 volts dissipate along one-thousandth of an inch (2.54 thousandths of a cm) of covering ring 202 and the standoff voltage at vertically oriented inner surface 1724 is 5000 volts, the annular width of covering ring 202 is equal to the ratio of a multiple (such as two or three times) of 5000 volts to the 7 to 10 volts dissipation per one-thousandth of an inch (2.54 thousandths of a cm) of covering ring 202.

[0136] In some embodiments, depth 1764 is greater than depth 1762. Furthermore, in various embodiments, the depth of vertically oriented inner surface 1724 is less than depth 1762.

[0137] 9G is a cross-sectional view of one embodiment of a system including edge ring 108, cover ring 118, base ring 116, and ground ring 114. Cover ring 118 includes upper body portion 1761, middle body portion 1763, and lower body portion 1765.

[0138] Upper body portion 1761 includes a vertically oriented inner surface 1782, a horizontally oriented top surface 1766, a vertically oriented outer surface 1768, and a horizontally oriented outer surface 1770. Vertically oriented outer surface 1768 is continuous with top surface 1766, and horizontally oriented outer surface 1770 is continuous with vertically oriented outer surface 1768. For example, a curve having a radius is formed between vertically oriented outer surface 1768 and top surface 1766, and a curve having a radius is formed between horizontally oriented outer surface 1770 and vertically oriented outer surface 1768. Furthermore, vertically oriented inner surface 1782 is continuous with top surface 1766. For example, a curve having a radius is formed between vertically oriented inner surface 1782 and top surface 1766.

[0139] Middle body portion 1763 includes a vertically oriented outer surface 1772, a vertically oriented inner surface 1780, and a horizontally oriented inner surface 1781. Vertically oriented outer surface 1772 is continuous with horizontally oriented outer surface 1770 of upper body portion 1761. For example, a curve having a radius is formed between vertically oriented outer surface 1772 and horizontally oriented outer surface 1770.

[0140] Furthermore, vertically-oriented inner surface 1780 is contiguous (e.g., adjacent) with vertically-oriented inner surface 1782. Illustratively, vertically-oriented inner surface 1782 is 1780 is in the same vertical plane as

[0141] The horizontally oriented inner surface 1781 is continuous with the vertically oriented inner surface 1780. For example, a curve having a radius is formed between the horizontally oriented inner surface 1781 and the vertically oriented inner surface 1780.

[0142] Lower body portion 1765 includes a vertically oriented outer surface 1774, a horizontally oriented bottom surface 1776, and a vertically oriented inner surface 1778. Vertically oriented inner surface 1778 is continuous with a horizontally oriented inner surface 1781 of middle body portion 1763. For example, a curve having a radius is formed between vertically oriented inner surface 1778 and horizontally oriented inner surface 1781.

[0143] Additionally, the bottom surface 1776 is continuous with the vertically oriented inner surface 1778. For example, a curve having a radius is formed between the bottom surface 1776 and the vertically oriented inner surface 1778.

[0144] Additionally, bottom surface 1776 is continuous with vertically oriented outer surface 1774. For example, a curve having a radius is formed between bottom surface 1776 and vertically oriented outer surface 1774. Vertically oriented outer surface 1774 is in the same vertical plane as vertically oriented outer surface 1772 of intermediate body portion 1763.

[0145] A reduced width step 1783 is formed between the vertically oriented outer surface 1768 of the upper body portion 1761 and the vertically oriented outer surface 1772 of the intermediate body portion 1763. The reduced width step 1783 is disposed in the −x direction toward the edge ring 108.

[0146] Furthermore, the vertically oriented inner surface 1780 of the intermediate body portion 1763 is surface Another width-reducing step 1784 is formed from the vertically oriented inner surface 1780 in the +x direction of the x-axis, away from the edge ring 108.

[0147] The annular width 1786 is the mid-body portion 1763 Annular width 1786 is formed between vertically oriented inner surface 1780 and vertically oriented outer surface 1772 of lower body portion 1765. Annular width 1786 is aligned along the x-axis. Further, another annular width 1788 is formed between vertically oriented inner surface 1778 and vertically oriented outer surface 1774 of lower body portion 1765. Annular width 1788 is aligned along the x-axis. Annular width 1788 is smaller than annular width 1786.

[0148] Depth 1790 of middle body portion 1763 is defined along the y-axis from horizontally-oriented outer surface 1770 to horizontally-oriented inner surface 1781. Additionally, lower body portion 1765 defines another depth 1792 along the y-axis from horizontally-oriented inner surface 1781 to bottom surface 1776. Depth 1792 is less than depth 1790.

[0149] Note that the bottom surface of cover ring 118 includes surfaces 1781 , 1778 , 1776 , 1774 , 1772 , and 1770 .

[0150] tracking Possible A distance 1794 is formed between the edge ring 108 and the ground ring 114. Tracking Possible Distance 1794 is along the depth L21 of vertically oriented inner surface 1780 along the y-axis, the width L22 of horizontally oriented inner surface 1781 along the x-axis, the depth L23 of vertically oriented inner surface 1778, and the width L24 of bottom surface 1776. Depth L23 is the same as depth 1792. Tracking PossibleDistance 1794 is the path that the voltage received by edge ring 108 through support ring 112 takes to reach ground ring 114. Edge ring 108 acts as one capacitor plate of the capacitor, and electrode EL (FIG. 2) acts as another capacitor plate of the capacitor, with the dielectric material of support ring 112 between these two capacitor plates.

[0151] Distance 2 along the x-axis is formed between edge ring 108 and ground ring 114. Distance 2 is less than distance 1 in FIG. 9F. Because the outer diameter of edge ring 228 in FIG. 9F is smaller than the outer diameter of edge ring 108, upper body portion 1730 of cover ring 202 in FIG. 9F is wider than upper body portion 1761 of cover ring 118. Distance 1 is greater than distance 2 because the width of upper body portion 1730 is greater than the width of upper body portion 1761. The smaller width of edge ring 228 compared to edge ring 108 is compensated for by the greater distance 1, resulting in a tracking error relative to the RF voltage of the RF signal provided by power pin 208 (FIG. 2). Possible Provide a predetermined amount of distance traversed to ground ring 212 via distance 213 (FIG. 2) or 1735 (FIG. 9F). For example, there is a loss of about 7 to about 10 volts per thousandth of an inch of covering ring. To achieve a predetermined standoff voltage of 5000 V on the vertically oriented inner surface of the upper body portion of the covering ring, the annular width of the upper body portion of the covering ring is calculated as (positive real number x 5000) / (volts lost per thousandth of an inch of covering ring), where "positive real number" is a multiple of 2 or 3 or 4, etc.

[0152] In some embodiments, depth 1792 is greater than depth 1790 .

[0153] The embodiments described herein may be practiced with a variety of computer system configurations, including handheld hardware units, microprocessor systems, microprocessor-based or programmable consumer electronics, minicomputers, mainframe computers, etc. The embodiments may also be practiced in distributed computing environments where tasks are performed by remote processing hardware units that are linked through a network.

[0154] In some embodiments, the controllers described herein are part of a system, and such a system may be part of the examples described above. Such systems include semiconductor processing equipment, including one or more processing tools, one or more chambers, one or more processing platforms, and / or specific processing components (e.g., wafer pedestals, gas flow systems, etc.). These systems are integrated with electronics for controlling system operation before, during, and after semiconductor wafer or substrate processing. Such electronics are referred to as a "controller" and may control various components or subcomponents of one or more systems. The controller is programmed to control any of the processes disclosed herein depending on the processing requirements and / or type of system. Such processes include process gas supply, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, RF generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid supply settings, position and motion settings, wafer transfer to and from the tool, and wafer transfer to and from other transfer tools and / or load locks connected or interfaced with the system.

[0155] Broadly, in various embodiments, a controller is defined as an electronic device having various integrated circuits, logic, memory, and / or software that receives instructions, issues instructions, controls operations, enables cleaning operations, enables endpoint measurements, etc. Integrated circuits include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as ASICs, PLDs, and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software). Program instructions are instructions communicated to the controller in the form of various individual settings (or program files) that define parameters, coefficients, variables, etc. for performing a particular process on or for a semiconductor wafer or system. Program instructions, in some embodiments, are part of a recipe defined by a process engineer to implement one or more processing steps in the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or wafer dies.

[0156] The controller, in some embodiments, is part of a computer that is integrated or coupled with the system or otherwise networked to the system, or is coupled to such a computer, or a combination thereof. For example, the controller may be in the "cloud" or all or part of a fab host computer system, thereby enabling remote access of wafer processing. The computer may provide remote access to the system to monitor the current progress of fabrication operations, review the history of past fabrication operations, review trends or performance metrics from multiple fabrication operations, modify parameters of the current process, and / or modify the current Process or new process Set the processing steps that follow do.

[0157] In some examples, a remote computer (e.g., a server) provides a process recipe to the system over a network. Such a network includes a local network or the Internet. The remote computer includes a user interface that enables entry or programming of parameters and / or settings, which are then communicated from the remote computer to the system. In some examples, the controller receives instructions in the form of data. Such data identifies parameters, coefficients, and / or variables for each of the processing steps performed during one or more operations. It should be understood that the parameters, coefficients, and / or variables are specific to the type of process being performed and the type of tool the controller is configured to interface with or control. Thus, as described above, the controller may be distributed, for example, by including one or more individual controllers networked together and cooperating toward a common purpose (such as the processes and controls described herein). One example of a distributed controller for such purposes includes one or more integrated circuits on the chamber that communicate with one or more integrated circuits that are remotely located (e.g., at the platform level or as part of a remote computer) and coupled to control the process in the chamber.

[0158] Without limitation, in various embodiments, exemplary systems to which the methods may be applied include plasma etch chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, bevel edge etch chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etch (ALE) chambers or modules, plasma enhanced chemical vapor deposition (PECVD) chambers or modules, cleaning type chambers or modules, ion implantation chambers or modules, tracking chambers or modules, and any other semiconductor processing systems associated with or used in the fabrication and / or manufacturing of semiconductor wafers.

[0159] Furthermore, in some embodiments, the above-described operations may be performed in multiple types of plasma chambers, for example, plasma chambers including inductively coupled plasma (ICP) reactors, transformer coupled plasma (TCP) reactors, and the like. reactor It should be noted that the present invention may be applied to conductive tools, dielectric tools, plasma chambers including electron cyclotron resonance (ECR) reactors, etc. For example, one or more RF generators are coupled to an inductor in an ICP reactor. Examples of inductor shapes include a solenoid, a dome-shaped coil, a planar coil, etc.

[0160] As described above, depending on the one or more process steps being performed by the tool, the host computer communicates with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, nearby tools, tools located throughout the factory, a main computer, another controller, or tools used in material transport to and from tool locations and / or load ports in the semiconductor fabrication factory.

[0161] With the above embodiments in mind, it should be understood that some of the embodiments employ various computer-implemented operations involving data stored in computer systems. These operations are operations that physically manipulate physical quantities. Any of the operations described herein that form part of the embodiments are useful machine operations.

[0162] Some of the embodiments also relate to hardware units or apparatus for performing these operations. The apparatus is specially constructed for use as a special purpose computer. When defined as a special purpose computer, the computer is operable for its dedicated purpose, while also performing other processes, program execution, or routines that are not part of its dedicated purpose.

[0163] In some embodiments, the operations may be processed by a computer selectively activated or configured by one or more computer programs stored in computer memory, cache, or obtained over a computer network. If data is obtained over a computer network, the data may be processed by other computers on the computer network, e.g., a cloud of computing resources.

[0164] One or more embodiments may also be fabricated as computer-readable code on a non-transitory computer-readable medium. The non-transitory computer-readable medium is any data storage hardware unit (e.g., a memory device, etc.) that stores data, which is then read by a computer system. Examples of non-transitory computer-readable media include hard drives, network-attached storage (NAS), ROM, RAM, compact disc ROM (CD-ROM), CD-recordable (CD-R), CD-rewritable (CD-RW), magnetic tape, and other optical and non-optical data storage hardware units. In some embodiments, the non-transitory computer-readable medium comprises a computer-readable tangible medium distributed over network-coupled computer systems so that the computer-readable code is stored and executed in a distributed manner.

[0165] Although the method operations above have been described in a particular order, it should be understood that in various embodiments, other housekeeping operations are performed between operations, or the method operations are coordinated to occur at slightly different times, or are distributed across a system that allows the method operations to occur at various intervals, or are performed in an order other than that set forth above.

[0166] Furthermore, it should be noted that in one embodiment, one or more features of any of the above-described embodiments may be combined with one or more features of any other embodiment without departing from the scope described in the various embodiments described in this disclosure.

[0167] Although the foregoing embodiments have been described in some detail for purposes of clarity of understanding, it will be apparent that certain changes and modifications may be practiced within the scope of the appended claims. Accordingly, the present embodiments are to be considered as illustrative and not restrictive, and the embodiments should not be limited to the details set forth herein. The present disclosure can also be realized as the following application examples. [Application example 1] 1. An edge ring for use in a plasma processing chamber, the edge ring having an annular body configured to surround a substrate support of the plasma processing chamber; the annular body having a bottom side, a top side, an inner side, and an outer side; a plurality of fastener holes disposed on the annular body along the bottom side, each fastener hole having a threaded inner surface for receiving a fastener used to attach the annular body to a support ring; a step disposed on the interior of the annular body, the step having a lower surface separated from the top upper surface by a sloped surface; a curved edge formed between the top surface and the outer side of the top side; An edge ring. [Application example 2] The edge ring according to Application Example 1, The edge ring is a consumable and replaceable edge ring. [Application example 3] The edge ring according to Application Example 1, the inner side has the inclined surface, a horizontally oriented surface continuous with the inclined surface, and a vertically oriented surface continuous with the horizontally oriented surface; the bottom side is horizontally oriented and continuous with the outer side and the vertically oriented surface; The outer side is a vertically oriented surface, The curved edge is adjacent to the top side and the outside. [Application example 4] The edge ring according to Application Example 1, The substrate support is a chuck, the support ring is an adjustable edge sheath ring, and the bottom side has a first portion configured to be conductively coupled to the chuck via a conductive gel, a second portion configured to be conductively coupled to the adjustable edge sheath ring via a conductive gel, and a third portion adjacent to a base ring. [Application example 5] The edge ring according to Application Example 1, The plurality of fastener holes are equidistantly spaced apart on the bottom side of the edge ring. [Application Example 6] The edge ring according to Application Example 1, an edge ring, wherein one of the plurality of fastener holes is partially surrounded by a top surface of a slot and sides of the slot formed in the bottom side of the edge ring; [Application Example 7] The edge ring according to Application Example 6, an edge ring, wherein a gap between the top surface of the slot and one of the fasteners when the fastener is received in the slot is less than 1 millimeter to reduce the possibility of arcing at the gap. [Application Example 8] The edge ring according to Application Example 1, The edge ring has an outer diameter of about 13.6 inches (about 35.544 cm) or more and about 15 inches (about 38.1 cm) or less, the outer diameter being limited by the outside. [Application Example 9] The edge ring according to Application Example 1, an edge ring, the top side having an outer diameter of greater than 13.6 inches (35.544 cm) and up to 15 inches (38.1 cm) to reduce the possibility of arcing from the top side to the cover ring when a cover ring is placed adjacent to the outside. [Application Example 10] The edge ring according to Application Example 1, An edge ring, wherein when a cover ring is placed adjacent to the outside, the curved edge reduces the possibility of arcing from the curved edge to the cover ring. [Application Example 11] The edge ring according to Application Example 1, An edge ring, wherein all edges of the edge ring are arc-shaped. [Application Example 12] 1. A cover ring for use in a plasma processing chamber, the cover ring having an annular body configured to surround an edge ring and adjacent to a ground ring; the annular body having an upper body portion, an intermediate body portion, and a lower body portion, the intermediate body portion defining a reduced width step from the upper body portion such that the intermediate body portion has a first annular width, and the lower body portion defining a reduced width step from the intermediate body portion such that the lower body portion has a second annular width that is smaller than the first annular width. Equipped with a covering. [Application Example 13] The covering according to Application Example 12, The covering is a consumable and replaceable covering. [Application Example 14] The covering according to Application Example 12, The top body portion, the middle body portion, and the bottom body portion provide a voltage path from the edge ring to the ground ring. [Application Example 15] The covering according to Application Example 12, A cover ring, wherein the reduced width step of the intermediate body portion from the upper body portion is provided in a direction away from the edge ring, and the reduced width step of the lower body portion from the intermediate body portion is provided in a direction toward the edge ring. [Application Example 16] The covering according to Application Example 12, A cover ring, wherein the reduced width step of the intermediate body portion from the upper body portion is provided in a direction toward the edge ring, and the reduced width step of the lower body portion from the intermediate body portion is provided in a direction away from the edge ring. [Application Example 17] The covering according to Application Example 12, The covering, wherein the middle body portion has a first elongated depth and the lower body portion has a second elongated depth. [Application Example 18] The covering according to Application Example 12, the upper body portion has a horizontally oriented top surface, a curved edge continuous with the horizontally oriented top surface, a vertically oriented outer surface continuous with the curved edge, a vertically oriented inner surface continuous with the horizontally oriented top surface, a horizontally oriented inner surface continuous with the vertically oriented inner surface, and a horizontally oriented outer surface continuous with the vertically oriented outer surface; the intermediate body portion has a vertically oriented inner surface that is continuous with the horizontally oriented inner surface of the upper body portion; the intermediate body portion having a vertically oriented outer surface contiguous with the horizontally oriented outer surface of the upper body portion and a horizontally oriented outer surface contiguous with the vertically oriented outer surface of the intermediate body portion; a covering, wherein the lower body portion has a vertically oriented outer surface that is continuous with the horizontally oriented outer surface of the intermediate body portion, a horizontally oriented bottom surface that is continuous with the vertically oriented outer surface of the lower body portion, and a vertically oriented inner surface that is continuous with the horizontally oriented bottom surface of the lower body portion and continuous with the vertically oriented inner surface of the intermediate body portion. [Application Example 19] The covering according to Application Example 18, The upper body portion has a second curved edge between the vertically oriented outer surface of the upper body portion and the horizontally oriented outer surface of the upper body portion, the upper body portion has a third curved edge between the horizontally oriented top surface of the upper body portion and the vertically oriented inner surface of the upper body portion, and the upper body portion has a fourth curved edge between the vertically oriented inner surface of the upper body portion and the horizontally oriented inner surface of the upper body portion. [Application Example 20] The covering according to Application Example 19, The intermediate body portion has a fifth curved edge between the horizontally oriented outer surface of the upper body portion and the vertically oriented outer surface of the intermediate body portion, the intermediate body portion has a sixth curved edge between the horizontally oriented inner surface of the upper body portion and the vertically oriented inner surface of the intermediate body portion, and the intermediate body portion has a seventh curved edge between the vertically oriented outer surface of the intermediate body portion and the horizontally oriented outer surface of the intermediate body portion. [Application Example 21] The covering according to Application Example 20, The lower body portion has an eighth curved edge between the horizontally oriented outer surface of the intermediate body portion and the vertically oriented outer surface of the lower body portion, the lower body portion has a ninth curved edge that is continuous with the vertically oriented outer surface of the lower body portion and the horizontally oriented bottom surface of the lower body portion, and the lower body portion has a tenth curved edge between the vertically oriented inner surface of the lower body portion and the horizontally oriented bottom surface of the lower body portion. [Application Example 22] The covering according to Application Example 12, A cover ring, wherein an inner edge of the cover ring is curved to reduce the possibility of arcing between the inner edge and the edge ring. [Application Example 23] The covering according to Application Example 12, A covering, wherein all edges of said covering are arcuate. [Application Example 24] 1. A system for securing an edge ring of a plasma chamber, comprising: A support ring and the edge ring oriented on the support ring; a gel layer disposed between the bottom surface of the edge ring and the top surface of the support ring; a plurality of screws configured to secure the edge ring to the support ring, each of the plurality of screws being attached to a threaded hole disposed on the bottom surface of the edge ring and passing through the support ring; a plurality of pressure bars connected to the bottom surface of the support ring; a plurality of pneumatic pistons, each of the plurality of pistons being coupled to a corresponding one of the plurality of pressure bars; A system comprising: [Application Example 25] The system according to Application Example 24, The system, wherein the plurality of pneumatic pistons are configured to apply a downward force to the plurality of pressure bars such that the edge ring and the support ring are secured to an insulator ring during processing of a substrate in the plasma chamber. [Application Example 26] The system according to Application Example 24, The system, wherein the plurality of pneumatic pistons are configured to push up on the plurality of pressure rods to remove the edge ring and the support ring from the plasma chamber during maintenance. [Application Example 27] The system according to Application Example 24, an insulator ring positioned below the support ring; a plurality of clasp mechanisms configured to hold the pressure bars, each of the pressure bars having a portion extending into the support ring and a portion extending into the insulator ring, each of the clasp mechanisms configured to pull down a corresponding one of the pressure bars to engage the support ring and the edge ring with the insulator ring during processing operations in the plasma chamber, and configured to push up the support ring and the edge ring against the insulator ring to release the support ring and the edge ring; The system further comprises: [Application Example 28] The system according to Application Example 27, Each of the plurality of clasp mechanisms comprises: An air cylinder; a piston body in the air cylinder; a piston rod attached to the piston body; a mount configured to mount a corresponding one of the pressure bars to the air cylinder; Including, the system. [Application Example 29] The system according to Application Example 28, an air path configured to supply compressed air to the top of the air cylinder to pull down the plurality of pressure bars; an air path configured to supply compressed air to the bottom of the air cylinder to push up the plurality of pressure bars; The system further comprises: [Application Example 30] The system according to Application Example 24, a first piston of the plurality of pistons is part of a first clasp mechanism, a second piston of the plurality of pistons is part of a second clasp mechanism, and a third piston of the plurality of pistons is part of a third clasp mechanism; The system comprises: the second clasp mechanism configured to secure the support ring and the edge ring to the insulator ring at a different location compared to where the first clasp mechanism secures the support ring and the edge ring to the insulator ring; a third clasp mechanism configured to secure the support ring and the edge ring to the insulator ring at a different location compared to the location where the second clasp mechanism secures the support ring and the edge ring to the insulator ring and the location where the first clasp mechanism secures the support ring and the edge ring to the insulator ring; The system further comprises:

Claims

1. 1. A system for securing a support ring, comprising: The support ring; a plurality of pressure bars connected to a bottom surface of the support ring configured to be fixed to an edge ring; A system comprising:

2. 10. The system of claim 1, further comprising: A system comprising a plurality of pneumatic pistons, each of the plurality of pneumatic pistons coupled to a corresponding one of the plurality of pressure bars for vertically moving the support ring.

3. 3. The system of claim 2, The system, wherein the plurality of pneumatic pistons are configured to apply a downward force to the plurality of pressure bars such that the support ring is secured to an insulator ring within a plasma chamber.

4. 4. The system of claim 3, The system, wherein the plurality of pneumatic pistons are configured to push up on the plurality of pressure rods to remove the support ring from the plasma chamber during maintenance.

5. 10. The system of claim 1, further comprising:

1. A system comprising: a first clasp mechanism and a second clasp mechanism, the second clasp mechanism configured to secure the support ring to the insulator ring at a different location compared to a location at which the first clasp mechanism is configured to secure the support ring to the insulator ring.

6. 10. The system of claim 1, further comprising: an insulator ring positioned below the support ring; a plurality of clasp mechanisms including the plurality of pressure bars, each of the plurality of pressure bars having a portion that extends into the support ring and a portion that extends into the insulator ring, each of the clasp mechanisms configured to pull down a corresponding one of the plurality of pressure bars to secure the support ring to the insulator ring and to push up the support ring against the insulator ring to release the support ring; A system comprising:

7. 7. The system of claim 6, Each of the plurality of clasp mechanisms comprises: An air cylinder; a piston body in the air cylinder; a piston rod attached to the piston body; a mount configured to mount a corresponding one of the plurality of pressure bars to the air cylinder; A system comprising:

8. 8. The system of claim 7, further comprising: an air path configured to supply compressed air to the top of the air cylinder to pull down the plurality of pressure bars; an air passage configured to supply compressed air to a bottom of the air cylinder to push up the plurality of pressure bars; A system comprising:

9. 10. The system of claim 1, the plurality of pressure bars include a first pressure bar and a second pressure bar, the first pressure bar coupled to the bottom surface of the support ring at a first location and the second pressure bar coupled to the bottom surface of the support ring at a second location.

10. 10. The system of claim 9, the support ring includes a plurality of slots formed in the bottom surface, the plurality of slots including a first slot at the first location and a second slot at the second location, the first pressure bar received by the first slot at the first location and the second pressure bar received at the second location connecting the plurality of pressure bars to the bottom surface of the support ring.

11. 11. The system of claim 10, the first slot has a first set of threads, the second slot has a second set of threads, the first pressure bar has a distal end with a third set of threads formed thereon, and the second pressure bar has a distal end with a fourth set of threads formed thereon, the third set of threads engaging the first set of threads and the fourth set of threads engaging the second set of threads to connect the plurality of pressure bars to the bottom surface of the support ring.

12. 1. A system for securing an edge ring and a support ring, comprising: The support ring; the edge ring located on top of the support ring and coupled to a top surface of the support ring; a plurality of pressure bars connected to the bottom surface of the support ring; A system comprising:

13. 13. The system of claim 12, further comprising: a plurality of pneumatic pistons, each of the plurality of pneumatic pistons coupled to a corresponding one of the plurality of pressure bars for vertically moving the support ring and the edge ring simultaneously.

14. 14. The system of claim 13, The system, wherein the plurality of pneumatic pistons are configured to apply a downward force to the plurality of pressure bars such that the edge ring and the support ring are secured to an insulator ring within a plasma chamber.

15. 15. The system of claim 14, The system, wherein the plurality of pneumatic pistons are configured to push up on the plurality of pressure rods to remove the edge ring and the support ring from the plasma chamber during maintenance.

16. 13. The system of claim 12, further comprising: a first clasp mechanism and a second clasp mechanism configured to secure the support ring and the edge ring to the insulator ring at a different location compared to a location at which the first clasp mechanism is configured to secure the support ring and the edge ring to the insulator ring.

17. 13. The system of claim 12, further comprising: a plurality of fasteners configured to secure the edge ring to the support ring, each fastener being attached to a plurality of fastener holes disposed on a bottom surface of the edge ring and passing through the support ring.

18. 13. The system of claim 12, further comprising: an insulator ring positioned below the support ring; a plurality of clasp mechanisms including the plurality of pressure bars, each of the plurality of pressure bars having a portion that extends into the support ring and a portion that extends into the insulator ring, each of the plurality of clasp mechanisms configured to pull down a corresponding one of the plurality of pressure bars to secure the support ring and the edge ring to the insulator ring and to push up the support ring and the edge ring against the insulator ring to release the support ring and the edge ring; A system comprising:

19. 20. The system of claim 18, Each of the plurality of clasp mechanisms comprises: An air cylinder; a piston body in the air cylinder; a piston rod attached to the piston body; a mount configured to mount a corresponding one of the plurality of pressure bars to the air cylinder; A system comprising:

20. 20. The system of claim 19, further comprising: an air path configured to supply compressed air to the top of the air cylinder to pull down the plurality of pressure bars; an air passage configured to supply compressed air to a bottom of the air cylinder to push up the plurality of pressure bars; A system comprising:

21. 13. The system of claim 12, the plurality of pressure bars include a first pressure bar and a second pressure bar, the first pressure bar coupled to the bottom surface of the support ring at a first location and the second pressure bar coupled to the bottom surface of the support ring at a second location.

22. 22. The system of claim 21, the support ring includes a plurality of slots formed in the bottom surface, the plurality of slots including a first slot at the first location and a second slot at the second location, the first pressure bar received by the first slot at the first location and the second pressure bar received at the second location connecting the plurality of pressure bars to the bottom surface of the support ring.

23. 23. The system of claim 22, the first slot has a first set of threads, the second slot has a second set of threads, the first pressure bar has a distal end with a third set of threads formed thereon, and the second pressure bar has a distal end with a fourth set of threads formed thereon, the third set of threads engaging the first set of threads and the fourth set of threads engaging the second set of threads to connect the plurality of pressure bars to the bottom surface of the support ring.

24. 13. The system of claim 12, The system, wherein the edge rings are positioned adjacent to and above the support ring so as to be oriented on the support ring.

25. 1. A system for securing a support ring, comprising: a plurality of pressure bars configured to be coupled to a bottom surface of the support ring, the support ring being configured to be secured to an edge ring; a plurality of pneumatic pistons, each coupled to a corresponding one of the plurality of pressure bars for vertically moving the support ring; A system comprising:

26. 26. The system of claim 25, The system, wherein the plurality of pneumatic pistons are configured to apply a downward force to the plurality of pressure bars such that the support ring is secured to an insulator ring within a plasma chamber.

27. 27. The system of claim 26, The system, wherein the plurality of pneumatic pistons are configured to push up on the plurality of pressure rods to remove the support ring from the plasma chamber during maintenance.

28. 26. The system of claim 25, further comprising: a plurality of clasp mechanisms including a plurality of air cylinders and the plurality of pneumatic pistons, each of the plurality of pneumatic pistons a piston body within a corresponding one of the plurality of air cylinders; a piston rod attached to the piston body; A system comprising:

29. 29. The system of claim 28, further comprising: an air path configured to supply compressed air to the tops of the plurality of air cylinders to pull down the plurality of pressure bars; an air path configured to supply compressed air to the bottom of the plurality of air cylinders to push up the plurality of pressure bars; A system comprising:

30. 26. The system of claim 25, further comprising: a plurality of clasp mechanisms including a first clasp mechanism and a second clasp mechanism, the plurality of pneumatic pistons including a first pneumatic piston and a second pneumatic piston, the first clasp mechanism including the first pneumatic piston and the second clasp mechanism including the second pneumatic piston, the second clasp mechanism configured to secure the support ring to the insulator ring at a different location compared to a location where the first clasp mechanism is configured to secure the support ring to the insulator ring.

31. 26. The system of claim 25, the plurality of pressure bars include a first pressure bar and a second pressure bar, the first pressure bar configured to be coupled to the bottom surface of the support ring at a first location and the second pressure bar configured to be coupled to the bottom surface of the support ring at a second location.

32. 26. The system of claim 25, the first pressure bar has a tip end with a first set of threads formed thereon, the second pressure bar has a tip end with a second set of threads formed thereon, the first set of threads configured to engage with a third set of threads formed in a first slot in the bottom surface of the support ring, and the second set of threads configured to engage with a fourth set of threads formed in a second slot in the bottom surface of the support ring to connect the pressure bars to the bottom surface of the support ring.

33. 1. A structure for interfacing with a support ring used to support an edge ring in a plasma chamber, comprising: a plurality of pressure bars configured to couple to a bottom surface of the support ring at a plurality of locations, the support ring being configured to be secured to the edge ring; and a plurality of power pins coupled to the bottom surface of the support ring at a plurality of locations and configured to contact electrodes disposed on the support ring; A structure comprising:

34. 34. The structure of claim 33, The structure, wherein the plurality of pressure bars are configured to move upward to remove the support ring from the plasma chamber and to move downward to secure the support ring to an insulator ring.

35. 34. The structure of claim 33, The plurality of power pins are configured to transmit radio frequency (RF) power to the electrodes embedded within the support ring.

36. 34. The structure of claim 33, further comprising: a plurality of clasp mechanisms coupled to the plurality of pressure bars for controlling movement of the plurality of pressure bars, the movement being controlled to remove the support ring from the plasma chamber and secure the support ring to an insulator ring.

37. 37. The structure of claim 36, One of the plurality of clasp mechanisms comprises: An air cylinder; a piston body located within the air cylinder; a piston rod coupled to the piston body; a mount coupled to the air cylinder; A structure wherein one of the plurality of pressure bars extends into an opening formed in the mount.

38. 38. The structure of claim 37, The piston body is configured to move upward to move the one of the plurality of pressure bars in the upward direction and remove the support ring from the plasma chamber.

39. 38. The structure of claim 37, The piston body is configured to move downward to move the one of the plurality of pressure bars downward to secure the support ring to the insulator ring.

40. 34. The structure of claim 33, a structure in which each of the plurality of pressure bars has threads configured to engage threads in the bottom surface of the support ring to couple the plurality of pressure bars to the bottom surface.

41. 34. The structure of claim 33, A structure wherein one of the plurality of power pins is configured to extend into a power pin feedthrough to protect the one of the plurality of power pins, the power pin feedthrough extending to the support ring through an insulator ring.

42. 34. The structure of claim 33, further comprising: A structure comprising a temperature probe shaft.

43. 34. The structure of claim 33, The structure wherein the plurality of power pins are fabricated from metal for conducting radio frequency power received from a radio frequency generator to the electrodes.

44. A pressure bar configured to connect to a support ring for supporting the edge ring, a top portion configured to extend into a slot formed in a bottom surface of the support ring configured to be secured to the edge ring; an intermediate portion located below the top portion, the intermediate portion configured to extend into a through hole formed in an insulator ring; a bottom portion located below the intermediate portion, the bottom portion configured to be attached to a clasp mechanism for vertically moving the support ring; A pressure bar.

45. 45. The pressure bar of claim 44, The top portion includes a plurality of threads configured to mate with corresponding threads in the slot.

46. 45. The pressure bar of claim 44, A pressure rod, wherein the top, middle, and bottom portions are configured to move upward in accordance with the upward movement of a piston rod of the clasp mechanism, and move upward to push the support ring upward, and the support ring is pushed away from the insulator ring.

47. 45. The pressure bar of claim 44, A pressure bar, wherein the top, middle, and bottom portions are configured to move downward in accordance with downward movement of the piston rod of the clasp mechanism, and move downward to pull the support ring downward, and the support ring is pulled toward the insulator ring.

48. 45. The pressure bar of claim 44, The bottom portion of the pressure bar is configured to be attached to a push connector of the clasp mechanism and moved upward and downward by the clasp mechanism.

Images