Combined optical system for dimensional and thermal measurements and method of operation thereof

Abstract

To provide a combined optical system for determining a surface temperature of an object or material and determining a distance thereto from a predetermined reference point associated with the system.SOLUTION: The combined optical system comprises: an optical radiation source adapted to emit optical probe radiation in a predetermined wavelength range; an optical source control unit adapted to alternately control switching between an operative condition, in which the radiation is emitted, and an inoperative condition, in which the radiation is not emitted; optical detectors adapted to acquire scattered optical radiation and thermally emitted optical radiation from a surface of an object or the like; and a processing unit synchronized with the control unit and arranged for determining a distance to the surface of the object on the basis of the optical probe radiation scattered from the surface of the object or the like and received by the detectors when the optical source is in the operative condition and determining a local temperature of the surface of the object or the like on the basis of the optical radiation thermally emitted from the surface of the object or the like and received by the detectors when the optical source is in the inoperative condition.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates generally to optical measurements, in particular to optical measurements of objects or materials subjected to industrial manufacturing processes. More particularly, the present invention relates to a combined optical system and method for determining the temperature of the surface of an object or material and the distance thereto, according to the preambles of claims 1 and 18, respectively.

[0002] According to a further aspect, the invention relates to a machine for laser processing of workpieces or materials according to the preamble of claim 19. [Background technology]

[0003] In the following description and claims, the term "object" refers to a finished product to be measured or a workpiece to be processed. In the application of machine tools, particularly laser processing machines, the terms "workpiece", and in the preferred embodiment "metal workpiece", are used without distinction to identify any product, such as a sheet or elongated profile, with a closed cross section (e.g., circular, rectangular or hollow square shape) or an open cross section (e.g., flat, or L-, C- or U-shaped cross section, etc.). The terms "material" or "precursor material" in additive manufacturing identify the raw material (generally in powder form) that is to be locally sintered or melted using a laser beam.

[0004] In industrial processes, it is common for processing tools to approach an object or material (without contacting it) in order to treat said object or material at a distance, for example by emitting radiation or a working fluid. It is also known for measuring instruments to approach a workpiece or material being processed during a product manufacturing process, or to approach a finished product in order to detect its geometrical or physical characteristics at the break, during or end of the treatment process.

[0005] As an example of a purely industrial manufacturing process, in laser processing of materials, in particular metal sheets and profiles, laser radiation is used as a heating tool for a wide variety of applications, which depend on the interaction parameters of the laser beam with the workpiece, in particular the energy density per volume of the laser beam incident on the workpiece, and the interaction time interval.

[0006] The differences between the various types of treatments that can be performed on materials are due essentially to the power of the laser beam used and the interaction time between the laser beam and the material being treated. For example, low-density energy (surface 1mm 2 The hardening process is carried out by directing a high energy density (on the order of tens of watts per mm) for a long time (on the order of a few seconds) on the same metallic material, while the hardening process is carried out by directing a high energy density (on the order of femtoseconds or picoseconds) on the order of 1 mm per mm. 2 Photoablation processes are performed by directing a laser beam (of the order of tens of megawatts per unit area) at a workpiece. In the intermediate range of increasing energy density and decreasing processing time, controlling these parameters makes it possible to perform welding, cutting, drilling, etching and marking processes. These processes occur by emitting the laser beam from a processing head operating at a distance from the workpiece to be processed.

[0007] In the layering process, the material may be, for example, in the form of a filament or in the form of a powder emitted from a nozzle, or alternatively in the form of a powder bed, which is then melted by laser radiation and a three-dimensional print is obtained after resolidification of said material.

[0008] In the field of laser processing of materials, a processing tool supported by a machine generates a high-power focused laser beam with a preset transverse power distribution at at least one processing surface of the material, and is configured to control the direction and incidence position of the beam along the material and, if necessary, the direction of the flow of an assist gas, which has the function of mechanically propelling the molten material, the chemical function of supporting combustion, or the technical function of shielding the processing area from the surrounding environment.

[0009] In industrial processes where a processing tool approaches an object or material, the processing result depends on the correct distance between the processing tool and the object or material and the power of the processing laser beam. For example, in laser processing of materials, in particular in controlling the laser processing of metallic materials for laser cutting, drilling or welding of said materials, or in additive manufacturing of predetermined structures starting from powder precursor materials, it is important to keep the processing tool at a controlled distance from the workpiece or material and to control the power of the laser beam focused on the controlled processing surface in an energy range adapted to obtain the desired type of processing.

[0010] The distance of the work tool from the work material can be measured using a measurement probe or sensor, for example a time-of-flight laser scanner, a laser triangulation device, an interferometer.

[0011] The power of the processing laser beam impinging on the surface of a workpiece or material heats the workpiece or material, resulting in the emission of optical radiation in the thermal band (infrared or visible) due to the temperature reached by the molten workpiece or material treatment. The molten state persists for a certain time (typically between a tenth and several seconds) even after the processing laser beam is switched off. Therefore, for example, using a pyrometer (radiation thermometer) or, better, a two-color pyrometer, which can determine the temperature of a solid or melt without knowing its emissivity, it is possible to obtain information about the temperature of the workpiece or material being processed, and indirectly, about the power of the processing laser beam, through the optical radiation thermally emitted from the surface of the workpiece or material.

[0012] Unfortunately, making these measurements, both of which are essential for controlling industrial processes, involves the use of two different devices, the dimensions of which may not be compatible with the space available at or near the processing tool, for example for integration with the processing head of a machine for laser processing of a workpiece or material, which further entails high costs and complexity for a system including the various devices. Summary of the Invention [Problem to be solved by the invention]

[0013] It is an object of the present invention to provide an optical system for determining the temperature and distance of a scattering surface, e.g., the surface of an object or material, relative to a predetermined reference point associated with the system, which can be done with a reduced number of parts and therefore can be easily integrated into industrial manufacturing machines, e.g., processing tools such as machines for laser processing workpieces or materials, without compromising measurement accuracy.

[0014] It is a further object of the present invention to provide such an optical system for substantially simultaneous determination of temperature and distance to the surface of an object or material.

[0015] It is a further object of the present invention to perform thermal measurements without adding complexity to the distance measurement device.

[0016] It is a further object of the present invention to provide an optical system for determining the temperature of and distance from the surface of an object or material, which can be easily installed in existing industrial manufacturing machines.

[0017] It is yet another object of the present invention to provide a combined optical measurement system configured to be installed in a processing head of a machine for laser processing of a workpiece or material aligned with a processing laser beam, and capable of performing coaxial measurements of the distance separating the processing head and the surface of the workpiece or material, and the temperature of the local molten material in the area being processed by the laser beam. [Means for solving the problem]

[0018] According to the invention, these objects are achieved by a combined optical system having the features of claim 1.

[0019] Particular embodiments form the subject matter of dependent claims, the content of which is to be understood as an integral part of this description.

[0020] The invention also relates to a method for determining the temperature of the surface of an object or material and its distance relative to a predetermined reference point associated with the combined optical system, having the features of claim 18.

[0021] A further subject of the invention is a machine for laser processing of workpieces or materials, comprising such a combined optical system as claimed.

[0022] In summary, the invention is based on the construction of a combined optical system in which distance measurements of an object or material (obtained by detecting probe radiation scattered by the surface of the object or material) and measurements of its surface temperature (obtained by detecting optical radiation thermally emitted from the surface of the object or material) are made at alternating times correlated with the respective activation or deactivation of the probe radiation sources. The detection of the probe radiation scattered by the surface of the object or material and the optical radiation thermally emitted from the surface of the object or material is made in dedicated detection devices or, more conveniently, in an integrated form, in a common detection device.

[0023] More specifically, the combined optical system subject matter of the present invention comprises optical radiation source means configured to emit at least one optical probe radiation at a predetermined wavelength or in a predetermined wavelength range. The optical radiation source means may be a single light source, such as a light-emitting diode, laser diode, or superluminescent diode, or a pair of separate light sources configured to emit individual optical radiation beams at different wavelengths or at alternating intervals. However, it is also possible to emit optical radiation beams at different wavelengths or at alternating intervals via a single light source, for example, in the first case, by changing the excitation current or temperature of the light source, or by using a light source in which the beam is split along two different optical paths and switched between them, for example, using a device such as a liquid crystal or mechanical shutter that blocks or allows the beam to pass alternately along one path or the other.

[0024] The means for controlling the optical radiation source means, e.g., electronic control means such as a processor, is configured to selectively control switching of the optical radiation source means from an operational state (emitting at least one optical probe radiation) to a non-operational state (not emitting optical radiation). Conveniently, the control means is configured to alternately control switching of the optical radiation source means from an operational state to a non-operational state according to a predetermined switching frequency. In one embodiment, where the optical radiation source means comprises a light-emitting diode having an active region capable of emitting photons at optical frequencies following radiative recombination of charge carriers trapped therein as a result of a population inversion condition, the control means is configured to selectively control activation and deactivation of an excitation current of the light-emitting diode to alter the thermodynamic equilibrium of the charge carrier population. In industrial process applications where conditions of high switching frequencies (on the order of 1 to 100 kHz) and low forward speeds are met, the two measurements may be considered substantially simultaneous, and the system may be defined as a continuous hybrid measurement system.

[0025] The optical detection means, comprising at least one photodetector or a linear or two-dimensional array of photodetectors or similar optical sensor, is capable of detecting at least one scattered light radiation and one optical radiation thermally emitted from the surface of said object or material (typically in the infrared spectrum at room temperature, but in a wavelength range typically detectable in the near-infrared spectrum, and in the case of molten metals in the visible spectrum).

[0026] The system further comprises electronic processing means, e.g., a processor, configured to determine the distance of the object or material surface from a reference system of the optical system or a reference point permanently associated therewith, based on the optical probe radiation scattered by the object or material surface and received by the detection means, e.g., as a function of the position (as a function of the direction of incidence), intensity, or phase of incidence on a photodetector or a linear or two-dimensional array of photodetectors or similar optical sensor assembly. The electronic processing means is also configured to determine the local temperature of the object or material surface based on the optical radiation thermally emitted from the object or material surface and received by the detection means, e.g., as a function of the emission intensity in a predetermined spectral range or spectral wavelength distribution of the thermally emitted optical radiation. "Local temperature" refers to the surface temperature of the workpiece in the area where the probe radiation is directed, when applied to an industrial process substantially in the area currently being processed.

[0027] The electronic processing means is synchronized with the control means of the light source means to determine the distance of the object or material based on the scattered optical probe radiation received by the detection means when the optical radiation source means is operative, and to determine the local temperature of the surface of the object or material based on the thermally emitted optical radiation received by the detection means when the optical radiation source means is inoperative.

[0028] In a compact embodiment, the optical detection means comprises photodetector means having a spectral sensitivity range that includes a predetermined wavelength (or a predetermined range of wavelengths) of optical probe radiation scattered from the surface of an object or material and at least one wavelength of optical radiation thermally emitted from the surface of said object or material.

[0029] The aforementioned photodetector means may be located separately from the light source means.

[0030] Advantageously, in integrated embodiments, the optical detection means comprises at least one monitoring photodetector device, typically coupled to a radiation source, such as a laser diode or a superluminescent diode. This is typically integrated in an associated package and configured to detect secondary or partial optical radiation emitted by said light source, which represents the primary optical radiation. For example, if the optical radiation source means comprises a light emitting diode having a primary radiation emitting area and a secondary radiation emitting area, the monitoring photodetector device faces the secondary radiation emitting area, typically the back side (opposite the light emitting surface) of the light emitting diode.

[0031] According to this configuration, primary optical probe radiation coaxially scattered from the surface of the object or material is at least partially collected by the primary light-emitting area of ​​the light-emitting diode (the part received within its numerical aperture) and propagates back from there within the active area of ​​the diode to the monitoring photodetector device. The primary optical probe radiation scattered from the surface of the object or material is thus at least partially superimposed on the secondary or partial optical radiation emitted by the diode on the common incident area of ​​the monitoring photodetector device. The monitoring photodetector device is configured to detect an interference fringe pattern between the secondary or partial optical radiation and the primary optical probe radiation, and the processing means is configured to determine the distance of the surface of the object or material relative to the optical radiation source means based on the interference fringe pattern, according to a technique known as "self-mixing interferometry."

[0032] In another aspect of the invention, the optical detection means includes a first photodetector means configured to receive at least a portion of the optical probe radiation scattered by the surface of the object or material, and a second photodetector means configured to receive at least a portion of the optical radiation thermally emitted from the surface of the object or material. The first photodetector means comprises a photodetector array extending along at least one spatial direction, i.e., a linear or two-dimensional photodetector array, and wavelength filtering means coupled to the photodetector means is configured to transmit the optical probe radiation scattered from the surface of the object or material at a predetermined wavelength or a predetermined wavelength range, and to reject the wavelengths of the optical radiation thermally emitted from the surface of the object or material or other wavelengths of spurious ambient radiation. Optionally, the wavelength filtering means may also be positioned before the second photodetector means to select a predetermined portion of the wavelength spectrum of thermal radiation.

[0033] In this case, the light source means and the first photodetector means have different embodiments depending on the technique applied to analyze the scattered radiation.

[0034] Preferred techniques for analyzing scattered radiation to determine distance are triangulation and optical interferometry (coherent light, low coherence in the time, frequency or spatial domain, "self-mixing interferometry") techniques.

[0035] In a triangulation technique, the photodetector array is arranged to receive optical probe radiation scattered by the surface of the object or material according to an observation direction that is at a non-zero angle to the direction of emission of the optical probe radiation, and the processing means is configured to determine the distance of the surface of the object or material relative to the light source means based on the position of incidence of the scattered optical probe radiation along at least one extension direction of the photodetector array.

[0036] Alternatively, the optical radiation source means is coupled to downstream beam shaping means configured to shape the optical probe radiation into a beam having a predetermined transverse power distribution that is variable along the axis of propagation, and the processing means is configured to determine the distance of the object or material surface relative to the light source means based on the transverse power distribution of the scattered optical probe radiation detected by the photodetector array.

[0037] Alternatively, the optical radiation source means is configured to emit first and second coaxial beams of optical probe radiation having different lateral power distributions, and the processing means is configured to determine the distance of the surface of the object or material relative to the light source means based on a differential comparison between the lateral power distribution of the first scattered optical probe radiation beam and the lateral power distribution of the second scattered optical probe radiation beam as detected by the photodetector array.

[0038] The first and second optical probe radiation beams have different, preferably orthogonal, polarizations, or different wavelengths, or are emitted in alternating sections. Conveniently, the optical radiation source means comprises a pair of separate optical radiation sources, so as to be able to emit the first and second optical probe radiation beams at different wavelengths or in alternating sections.

[0039] According to a further alternative in which the triangulation method is omnidirectional, the optical radiation source means is configured to emit optical probe radiation comprising a plurality of collimated or focused beams arranged symmetrically about the axis of propagation, and the processing means is configured to determine the distance of the surface of the object or material relative to the light source means based on a comparison between the mutual positions of incidence of said plurality of beams of optical probe radiation scattered onto the photodetector array.

[0040] In the interferometric technique, the optical radiation source means is configured to emit a first beam of optical probe radiation and a second beam of said optical radiation as a reference. The first optical probe radiation beam is directed towards the surface of the object or material, and the beam reflected or scattered from the surface of the object or material is directed towards the interferometric optical sensor means via an optical measurement path. A second reference optical radiation beam is directed towards the interferometric optical sensor means via a reference optical path of a predetermined optical path length, preferably equivalent within the radiation coherence length to the optical path length of the optical measurement path at nominal operating conditions (the position of the surface of the object or material is at a predetermined nominal position relative to a predetermined reference system). The first and second beams are superimposed at a common incident area of ​​the interferometric optical sensor means forming an interference fringe pattern, and the processing means is configured to determine the distance of the surface of the object or material relative to the light source means based on the interference fringe pattern.

[0041] Conveniently, when determining the temperature, the processing means is configured to normalize the thermally emitted optical radiation received by the photodetector means as a function of the determined distance from the surface of the object or material, so that in the case of irradiation of the object or material with a focused beam (where the irradiated area at the workpiece varies along the axis of propagation and also by compensating for the morphology of the object), an accurate estimate of the temperature can be obtained.

[0042] The inventive combination optical sensor and hybrid or combined measurement method using said sensor can be advantageously used in advanced closed-loop control of industrial manufacturing processes, such as laser processing of workpieces or materials, e.g., cutting, welding, or additive manufacturing, where distance and temperature measurements need to be made. The acquisition of operating temperature can be used to stabilize ongoing thermal processes, and the acquisition of distance can be used to verify or improve the dimensional and positioning accuracy of ongoing processes. The inventive system subject matter overcomes the inconvenience of having separate measuring instruments, e.g., pyrometers and distance sensors, in favor of more compact solutions, potentially integrated with the same light source as the probe radiation, and allows for the detection of thermal radiation emitted by the surface to be measured in an area corresponding to the surface area to which the distance is measured. [Brief explanation of the drawings]

[0043] Additional features and advantages of the invention will be presented in more detail in the following detailed description of one embodiment thereof, given as a non-limiting example, with reference to the accompanying drawings, in which: FIG.

[0044] [Figure 1] 1 is a schematic illustration of an optical probe radiation beam incident on a measurement area of ​​a workpiece or material being processed, showing the relative backscatter of the probe radiation beam and emission of a thermal radiation beam; [Figure 2] FIG. 1 is a block diagram of a combination optical system of the present invention. [Figure 3] 1 shows a diagram representing the time trends of optical probe radiation, scattered optical probe radiation and thermally emitted optical radiation from the surface of an object or material being measured. [Figure 4a] 1 shows an assembly of optical radiation sources, such as laser diodes, according to the prior art, and an optical path diagram of such an assembly; [Figure 4b] 1 shows an assembly of optical radiation sources, such as laser diodes, according to the prior art, and an optical path diagram of such an assembly; [Figure 5]1 shows a block diagram of the combined optical system of the present invention in an operational state for measuring distance. [Figure 6] 1 shows a block diagram of the combined optical system of the present invention in an operational state for measuring temperature. [Figure 7] 1 is a diagram of distance measurement by triangulation using a probe radiation source and an off-axis scatter probe radiation detector according to the prior art; FIG. [Figure 8] 1A-1C are diagrams of distance measurement by coaxial triangulation using optical probe radiation beams with different shapes; [Figure 9] 9 shows a diagram of the coaxial triangulation distance measurement of FIG. 8 applied to the laser cutting process. [Figure 10] FIG. 1 is a diagram of distance measurement by coaxial triangulation using multiple optical probe radiation beams arranged symmetrically about the axis of propagation. [Figure 11a] 1 shows a diagram of distance measurement by triangulation applied to a laser manufacturing process. [Figure 11b] 1 shows a diagram of distance measurement by triangulation applied to a laser manufacturing process. [Figure 12] FIG. 1 is an illustration of distance measurement by low-coherence interferometry applied to a laser manufacturing process. [Figure 13] FIG. 1 is a block diagram of an electronic control system for a machine for laser processing of a workpiece or material. DETAILED DESCRIPTION OF THE INVENTION

[0045] The following description generally relates to the configuration and operation of a combined optical system according to the present invention for determining the temperature of an object or material and its distance relative to a predetermined point on a reference system associated with the combined optical system. More specifically, the combined optical system according to the present invention is configured to determine the temperature and distance of the surface of the object or material. In the applied example, the system according to the present invention is described as being coupled to a machine for laser processing of a workpiece or material, and the reference system associated with the combined optical system is also permanently associated with the reference system of the processing head of the laser processing machine, so that determining the distance of the surface of the object or material relative to the point of the combined optical system where the measurement is performed can be reduced to determining the distance of the surface of the object or material relative to the processing head of the laser processing machine using a simple rototranslation transformation.

[0046] 1 shows a schematic diagram of a situation for measuring distances and temperatures in an area of ​​the surface of an object or material, with particular reference to laser processing of a workpiece or material WP. Reference A indicates the area currently being processed, on which a processing laser beam B used for cutting, welding or sintering impinges according to a predetermined propagation direction Z, resulting in an increase in the temperature of said area relative to the environment. The representation of a filler material or assist gas has been omitted and can be easily imagined by a person skilled in the art as a function of the envisaged processing, as this is not important for the purposes of the present description.

[0047] In a preferred embodiment, optical probe radiation P impinges on region A, coaxially with respect to the processing laser beam B, and is reflected therefrom to emerge as scattered optical probe radiation D. At the same time, the surface of the workpiece WP in region A, which is currently being processed, emits thermal radiation T.

[0048] More generally, from a geometrical point of view, the optical probe radiation may be the envelope of a single beam or multiple beams, e.g., a single collimated beam (which can be approximated as a single optical beam) that is coaxial or inclined with respect to the propagation axis of the processing laser beam, multiple beams that impinge on the surface of the workpiece at different positions or at different inclination angles with respect to the propagation axis of the processing laser beam, one or more shaped beams, e.g., focused beams, or beams with their lateral power distribution controlled according to a predetermined shape (e.g., annular), e.g., a predetermined shape that is variable along the propagation axis.

[0049] Generally, depending on the properties of the workpiece surface or material being processed, backscattering of the probe radiation beam P results in a backpropagated probe radiation beam D that is scattered according to a larger scattering angle than the lateral distribution of the incident beam, and the beam of thermally luminescent radiation T is scattered over an even wider angle.

[0050] FIG. 2 shows a block diagram of the combined optical system of the present invention.

[0051] The optical probe radiation source assembly is indicated at 10 and includes, in this embodiment, a source of optical probe radiation in the form of a light emitting diode 12, e.g., an LED, superluminescent diode or laser, which includes an active semiconductor region that is capable of emitting photons at multiple optical frequencies following radiative recombination of charge carriers trapped therein as a result of excitation or population inversion conditions. The light emitting diode 12 has a primary emission region (e.g., a front face of the active region) for primary optical probe radiation P and a secondary emission region (e.g., a rear face of the active region opposite the front face) for secondary optical radiation P' that is correlated to said primary optical probe radiation.

[0052] Reference numeral 14 denotes a monitoring photodetector device that is typically coupled to the light emitting diode and faces the secondary radiation emitting area of ​​the diode to detect the intensity of the secondary radiation, which is indicative of the actual luminous intensity of the diode 12 .

[0053] An electronic unit for controlling the activation and deactivation of the light-emitting diode 12 is indicated by the reference numeral 16 and is supplied with a drive signal S P is configured to alternately (repeatedly) control the switching of the light emitting diode 12 from an operating state to a non-operating state in accordance with a predetermined frequency via

[0054] The beam splitting / recombining device 18 is inserted along the propagation path of the probe radiation P (which may be in free space or at least partially guided) so as to intersect the probe radiation P coming from the light source 12 without appreciable losses or to extract a reference beam of the probe radiation for distance measurements based on interferometric techniques.

[0055] 1, a workpiece is designated WP. As a result of the incidence of probe radiation P, the workpiece backscatters scattered probe radiation D, and as a result of the incidence of a processing laser beam (not shown), the workpiece scatters thermally emitted optical radiation T. Both the scattered probe radiation D and the thermally emitted radiation T propagate through a beam splitting / recombining device 18 and are directed from there to the light source assembly 10, where a photodetector device 14 is located, and to a means 20 (external to the light source assembly 10) for detecting the scattered probe radiation. In the case of polarized beams (obtained by inserting optical elements, such as a polarizer or a quarter-wave retardation plate, in the propagation path to manipulate the polarization of the beams), the routing of the optical probe radiation beam and the scattered optical probe radiation beam is advantageously obtained by separating the two radiations using a polarization-selective criterion.

[0056] An optical filter 22 may be positioned upstream of the detector means 20, which is configured to transmit wavelengths or ranges of wavelengths of scattered optical probe radiation from the surface of the workpiece WP and to block wavelengths of thermally emitted optical radiation coming from the surface of said workpiece WP.

[0057] An electronic processing unit 30 is connected to the source assembly 10 and the detector means 20 and outputs a signal S indicative of the scattered probe radiation D detected by the detector means 20. D and a signal S indicative of the thermal radiation T detected by the photodetector device 14. T The processing unit 30 is configured to (i) apply a predetermined algorithm or computational model based on an analysis of the characteristics of the scattered radiation (e.g., phase, position, direction, lateral power distribution, etc.) to determine, based on the signals indicative of the scattered optical probe radiation D, the distance of the surface of the workpiece WP relative to a predetermined reference point of the system, e.g., the position of the source of the probe radiation 12 in a predetermined reference system permanently associated with the laser processing machine, and (ii) apply a predetermined algorithm or computational model to determine the local temperature of the surface of the workpiece WP based on the signals indicative of the thermally emitted radiation T.

[0058] The processing unit 30 is further connected to the electronic control unit 16 and operates in synchronization with the activation and deactivation of the light-emitting diodes 12 to determine the distance of the surface of the workpiece WP when the light-emitting diodes are activated and to determine the local temperature of the surface of said workpiece WP when the light-emitting diodes are deactivated.

[0059] The operation of the system, and in particular the operation of the control unit 16, is better explained with reference to the diagram of Figure 3, which shows the time trends of the optical probe radiation emitted by the diode 12, the optical probe radiation scattered at the surface of the workpiece WP, and the optical radiation thermally emitted from the surface of the workpiece WP.

[0060] The first figure shows the drive signal S of the light-emitting diode 12. P and therefore represents the nominal time trend of the optical probe radiation. P oscillates alternately between periods of activation of probe radiation emission (denoted ON) and periods of deactivation of probe radiation emission (denoted OFF). A square wave signal waveform represents a purely periodic control waveform. Other waveforms, for example, sine waves, are also contemplated.

[0061] The second diagram shows a signal S representing the scattered probe radiation D detected by the detection means 20, 14. D and a signal S indicative of the thermal radiation T detected by the photodetector device 14. T The trend is shown at time t T ,t D denote the sampling time of thermal radiation T to determine the temperature and the sampling time of scattered probe radiation D to determine the workpiece distance, respectively.

[0062] The method for determining the local temperature of the surface of the workpiece WP and the distance thereto is based on repeated selective control of switching the optical probe radiation source between an operating state in which the optical probe radiation is emitted and an inoperable state in which the optical probe radiation is not emitted, and on obtaining a signal indicative of the optical probe radiation scattered by the surface of the workpiece WP when the optical probe radiation source is in an operating state, i.e. when the scattered probe radiation is established, and on obtaining a signal indicative of the thermal luminescence radiation from the surface of the workpiece WP when the optical probe radiation source is in an inoperable state, i.e. when the thermal luminescence radiation is the only radiation present (except for laser radiation of the manufacturing process and spurious environmental radiation).

[0063] In practice, when the light emitting diode 12 (optical probe radiation source) is active, i.e., in the interval indicated by ON in Fig. 3, the scattered optical probe radiation is directed to the detector means 20 for distance measurement. The detector means 20 may coincide with the photodetector device 14 of the light source assembly for the optical probe radiation if the "self-mixing interferometry" technique is applied. When the light emitting diode 12 (probe radiation source) is not active, i.e., in the interval indicated by OFF in Fig. 3, the photodetector device 14 of the light source assembly detects thermal radiation over a predetermined spectral range to estimate the temperature.

[0064] In this way, a combination of two measurements is effectively obtained.

[0065] The repetitive switching frequency of the emission of the optical probe radiation is in the range of 1-100 kHz, which is believed by the inventors to be sufficiently high to allow measurements to approximate simultaneous and continuous operation during the laser manufacturing process. Advantageously, this hybrid configuration enables remote and rapid optical measurement of temperature and distance of a hot workpiece via a single optical system. Equally advantageously, the combined optical system, particularly the optical probe radiation source assembly, can be coaxially aligned with the processing laser beam, allowing the temperature of the molten material to be readily determined by a pyrometer approach. In this manner, parameters of laser manufacturing processes, such as cutting, welding, and additive manufacturing, can be efficiently controlled in real time, thereby improving process control.

[0066] Furthermore, because the thermoluminescent radiation received by the photodetector device 14 varies with distance for a non-collimated probe beam, it is possible to normalize the thermoluminescent radiation intensity reading from the distance determination occurring in the previous sampling period, for example, by compensating for variability in the collecting numerical aperture corresponding to variability in the numerical aperture of the optical path of the measurement beam.

[0067] It should be noted that the synchronization of the electronic processing unit 30 with the electronic control unit 16 allows the scattered probe radiation and the thermoluminescent radiation readings to be recognized and separated via demodulation techniques similar to those used in lock-in type amplifiers, or by digital discrimination by the acquisition system if the sampling frequency is much higher than the switching frequency.

[0068] In a compact configuration, a photodetector means may be used which has a wide spectral detection range and is therefore configured to acquire optical radiation over a wide wavelength spectrum, including the wavelength or wavelength range of the probe radiation and the range of thermal emission wavelengths for the ongoing process.

[0069] The functions of the detector means 20 described above may, to give generality to the discussion, also be performed by a photodetector device 14 in an integrated configuration of the system, which photodetector device 14 is responsible for detecting scattered probe radiation D in addition to the thermal luminescent radiation T. This is possible, for example, when a source-light radiation assembly of the type shown in Figure 4a is used.

[0070] In Figure 4a, reference numeral 50 generally designates an assembly of an optical emitter in a TO-can package according to the prior art, including a laser diode 52 surrounded by a protective casing 56 disposed on a heat dissipating support 54 and on a base 58 supporting electrical connections 60 for driving the diode. An enlarged view of the laser diode 52 identifies a primary radiation-emitting area 62 facing a radiation output window 64 and a secondary radiation-emitting area 66 facing the rear side of the laser diode 52 relative to the radiation output window 64. A monitoring photodetector device 68 is positioned behind the laser diode 52, facing the secondary radiation-emitting area 66.

[0071] An optical path diagram of the light source assembly 50 is shown in Figure 4b. The primary optical probe radiation beam P emitted by the primary radiation-emitting region 62 of the laser diode 52 passes through various optical elements to collimate and focus the beam and impinge on the scattering surface of the workpiece WP to be analyzed in the current processing region A, possibly coaxial with the optical propagation system (not shown) of the laser processing beam. At the same time, a secondary optical radiation beam P' representing the primary optical probe radiation is emitted in the opposite direction towards the monitoring photodetector device 68. Considering the reversibility of the optical path, optical radiation D reflected or scattered by the surface of the workpiece WP is at least partially coupled in the opposite direction along the same propagation direction, to the extent that the radiation is within the numerical aperture of the optical path and travels back along the optical path until it traverses the laser diode 52 and impinges on the monitoring photodetector device 68. It interferes with the secondary optical radiation beam P' to form an interference fringe pattern, which makes it possible to apply an interferometric analysis technique known as "self-mixing interferometry." This technique is used in a wide range of applications, from vibration measurements to depth measurements, for example in laser ablation processes.

[0072] 5 and 6 illustrate an arrangement for detecting scattered and thermally emitted optical radiation from the surface of a workpiece WP, with reference to the block diagram of the combined optical system of the present invention shown in FIG.

[0073] In detail, FIG. 5 shows the arrangement in operation for measuring the distance of the workpiece WP, in which the control unit 16 applies a drive signal S to the light emitting diode during the on-time interval. P and the processing unit 30 generates a signal S indicative of the scattered probe radiation D detected by the detection means 20. D 6 shows the configuration in an operating condition for measuring the temperature of the workpiece WP, in which the control unit 16 does not apply the drive signal SP to the light-emitting diode during the off-time interval, and the processing unit 30 receives a signal S indicative of the thermal radiation T detected by the photodetector device 14. T Get.

[0074] 7-11 show several configurations of the probe radiation and combined optical system of the present invention that may be used in applying triangulation techniques to determine the distance of a workpiece WP from a source of probe radiation.

[0075] The principle of triangulation can be used to determine the distance to a workpiece from geometric considerations. For example, in a classic triangulation configuration shown in FIG. 7, with a radiation source 12 and an off-axis scattered radiation detection means 20, where Z denotes the axis along which distance is measured, the position of the incident area of ​​the probe radiation projected in the XY plane depends on the distance to the workpiece if the probe radiation beam has a non-zero tilt angle with respect to the observation direction. Therefore, measurements can be performed by detecting the probe radiation scattered by the workpiece on a linear or two-dimensional photodetector array PD. In both the case of a single probe radiation beam and the case of multiple probe radiation beams, if they are tilted with respect to the observation axis, their apparent position on the photodetector array PD depends linearly on the distance. In these cases, using a single collimated beam as the probe radiation is preferred, but this configuration can introduce anisotropic phenomena if the optical path of the beam is interrupted along the propagation direction, if the reflectivity changes depending on the tilt of the surface to be inspected, or if the measurement beam moves away from the measurement area as the distance changes.

[0076] In the more general case using a probe radiation beam with controlled shaping, the beam has a variable shape along the propagation axis Z (e.g., with a changing diameter of the focused beam), and the distance of the workpiece along the rotation axis Z can be determined by observing the beam shape of the scattered probe radiation projected onto the photodetector array PD, possibly in combination with knowledge of the position of the incident region. In such a case, the distance can be determined if the beam shape of the probe radiation is known, for example after a pre-calibration.

[0077] Referring to FIG. 8, two probe radiation beams with different shapes, e.g., differently collimated beams, can be used simultaneously. The two beams can be aligned to impinge on the same area of ​​the workpiece surface, or preferably coaxially overlapped. One of the two beams (preferably the collimated beam) can be considered a reference beam, such that absolute distance measurements are obtained from a comparison between the shapes of the two incident spots of the beams on the photodetector array PD. This differential measurement provides more reliable results because it does not require absolute calibration. FIG. 8 shows a first probe beam P1 and a second coaxial probe beam P2, where the first beam P1 has a variable lateral power distribution trend along the propagation axis Z, while the second beam P2 has a constant lateral power distribution trend. FIG. 8 also shows a comparison of the lateral dimensions of the two beams at two different propagation distances.

[0078] 9 shows the incidence area of ​​a pair of coaxial probe radiation beams on the surface of a workpiece in the processing area of ​​the workpiece, where a processing laser beam, designated by the letter B, impinges and creates a notch K in the workpiece. Advantageously, the symmetry of the pair of beams makes it possible to correct for the presence of the notch K. A similar approach is advantageously applied in the case of welding or drilling laser beams.

[0079] Various methods are possible for distinguishing between two beams in the differential measurement technique described above. For example, the two beams may have different polarizations and can be distinguished by using two sensors configured to detect separate, orthogonal polarizations using a beam splitter device depending on the polarization. According to another example, the two beams may have different wavelengths and can be distinguished by using two sensors configured to detect different spectral regions using a dichroic mirror or spectral filter. According to yet another example, two pulsed beams may be used, i.e., the two beams are selectively and alternately activated to be read by a single sensor, and the readings are correlated in the time domain with the collimated signal from the light source.

[0080] 10 shows a number of focused probe radiation beams P1-P8, which are arranged symmetrically and tilted relative to a common propagation axis Z, according to a side view in the upper illustration and a cross-sectional view in the lower illustration, respectively. The use of multiple beams arranged symmetrically relative to the propagation axis along which the measurement is made or symmetrically relative to this axis is particularly advantageous, as it allows isotropic distance measurements to be made, independent of the measurement direction. An isotropic beam configuration is suitable for applications in laser processing machines, where the probe radiation can be used coaxially relative to the propagation axis of the processing laser beam, allowing distance measurements to be obtained that are independent of preferred direction and free of blind spots.

[0081] Finally, referring to Figures 11a and 11b, a substantially coaxial triangulation configuration is shown. Elements common to Figure 2 are designated by the same reference numerals. Figure 11a shows a diagram of a triangulation system in which probe radiation is focused on a workpiece, while Figure 11b shows a simplified diagram in which the workpiece is retracted relative to the focusing plane. Detector means 20 is shown in the form of a video camera in front of which is positioned a focusing lens 20a, downstream of a bandpass filter 20b configured to transmit the wavelength or range of wavelengths of the scattered probe radiation. The paths of the probe radiation P and scattered probe radiation D are aligned with the path of the processing laser beam B via dichroic mirror M, and a focusing lens L is positioned to focus the beam on the workpiece WP.

[0082] Figure 11b shows the probe radiation beam P, which, after focusing via lens L, impinges on the workpiece WP at an angle α. If the distance of the workpiece WP from the focusing plane F is non-zero, the tilted beam will impinge on the workpiece WP at a position y1 relative to the axis, which is a function of the distance z of the workpiece along the axis Z, according to the relationship y1 = f(z). The associated scattered probe radiation D captured by the focusing lens L is guided to the detector means 20 via a further focusing lens 20a, and is then guided to the detector means 20 at a distance y1 relative to the axis. 2This correlates to the distance z of the workpiece along the Z axis according to the relationship y2 = f(z). It is therefore possible to determine the distance z by inverting the relationship, i.e. z = f -1 (y2).

[0083] Figure 12 shows the configuration of a combined optical system of the present invention for use in applying an interferometric technique to determine the distance of a workpiece WP from a probe radiation source. Elements common to Figure 2 are designated by the same reference numerals.

[0084] Interferometer configurations utilize interference phenomena occurring between coherent or partially coherent radiation beams to measure distances, or generally differences between optical paths. A typical interferometer configuration comprises two arms, a measurement arm and a reference arm, along which a common optical radiation beam is directed. The optical radiation beam traveling along the optical path of the measurement arm and backscattered by the workpiece WP interposed along the measurement arm and the optical radiation beam traveling along the optical path of the reference arm and reflected by a fixed mirror are recombined at a common entrance region of an interferometer sensor means, where they are superimposed, resulting in an interference phenomenon that generates an interference fringe pattern due to constructive or destructive interference, respectively, as a function of the difference in the optical paths between the two arms. The interferometer sensor means may be a photodetector or photodetector array, for example, a linear or two-dimensional photodetector array, possibly combined with a spectrometer or other optical elements according to the particular interferometry technique, which may be a time-domain, frequency-domain, or spatial-domain interferometry technique. The interferometric sensor means can detect interference patterns as a function of variations (in the spatial, frequency or time domain) in the geometric length or refractive index of the optical path along the measurement arm, while the optical path in the reference arm is typically constant and referenced to the nominal operating condition.

[0085] Figure 12 shows a Michelson interferometer configuration adapted for low-coherence optical interferometry in the frequency domain, where information about the comparison between the length of the optical measurement path and the reference optical path is encoded in wavelength space. Specifically, optical interferometry in the frequency domain is based on the Fourier transform relationship between the spectral density function and the cross-correlation of the measurement and reference beams, which allows for the extraction of a real-space distance difference measurement from the wavelength spectral profile of the two interfering beams. Using a diffraction grating and a focusing lens downstream of the grating, a single spectrum of the overlapping measurement and reference beams can be acquired, and the spectral distribution of the interfering beam can be projected onto a linear sensor device, e.g., a video camera. The spectrum of the two interfering beams exhibits a periodic modulation, and the periodicity (frequency) of this modulation in wavelength space changes as the difference in optical length between the measurement and reference paths changes. A Fourier transform calculation algorithm, e.g., an FFT algorithm, is applied to extract a measurement of the signal intensity peak associated with the real-space difference between the optical paths. In the figure, P denotes the probe radiation traveling along the optical measurement path through the workpiece WP, and P R denotes the probe radiation that is split via a dichroic mirror or similar beam splitter / combiner device BSC and then travels along the reference optical path interposed by a reflecting mirror RM. The probe radiation D scattered by the workpiece WP and the reference probe radiation P R are recombined in a beam splitter / combiner device BSC and from there directed to an assembly of interferometric sensor means generally designated SENS.

[0086] The above-described combined optical system is advantageously associated with a machine for laser processing of a workpiece or material, for example permanently coupled to the processing head of the laser processing machine to determine the distance of the workpiece surface relative to the head and the workpiece temperature during processing, and to perform process control based on these parameters. Advantageously, the optical probe radiation may be aligned with the processing laser beam to perform coaxial measurements in the processing area, allowing the actual separation distance of the workpiece surface from the processing head and the temperature of the molten material portion on the workpiece during processing to be determined.

[0087] FIG. 13 shows a block diagram of the electronic control system of a machine for laser processing of a workpiece or material.

[0088] The system comprises electronic processing and control means, generally shown in the figure as ECU, which may be integrated in a single processing unit on board the machine or may be implemented in a distributed manner, said processing and control means comprising processing modules located in various parts of the machine, for example in the machining head.

[0089] Memory means M associated with the electronic processing and control means store predetermined process models or programs, including, for example, predetermined processing trajectories in the form of instructions for moving the processing head and / or the workpiece, and physical processing parameters indicating the power distribution of the light beam as a function of the processing trajectory, the power intensity of the beam and the activation time of the laser beam.

[0090] The electronic processing and control means ECU is configured to access the memory means M to retrieve the machining trajectory and to control the application of the machining laser beam along said trajectory. Controlling the application of the machining laser beam along the predetermined machining trajectory includes controlling the irradiation of the laser beam with a predetermined power distribution directed at a predetermined machining area with reference to a predetermined pattern or machining program, i.e., in accordance with the machining trajectory information and processing parameters retrieved by the memory means, and in some applications includes controlling the supply of an assist gas flow.

[0091] The above-described combined optical system S of the present invention is mounted on a machine and arranged to detect the distance between the processing head and the workpiece and the change in this distance over time in real time by acquiring scattered probe radiation D, and to detect the surface temperature of the workpiece in the processing area in real time by acquiring thermal radiation radiation T.

[0092] The electronic processing and control means ECU is configured to receive from the combined optical system S of the present invention signals indicative of the distance, i.e. the mutual position over time, between the machining head and the workpiece, and signals related to the local temperature of the surface of the workpiece in the machining area.

[0093] The electronic processing and control means ECU comprises a first control module CM1 for controlling the mechanical parameters of the machining, arranged to generate first command signals CMD1 to a set of known actuator means, comprising actuator means for moving the machining head along the degrees of freedom allowed by the particular embodiment of the machine, actuator means for moving the material to be machined relative to the position of the machining head, which are arranged to cooperate with the actuator means for moving the machining head so as to present with the output of the laser beam of the machining head a programmed machining trajectory on the material to be machined as a function of the determined distance, i.e. as a function of the mutual position between the working head and the workpiece. These actuator means are known in the art and will not be described in detail.

[0094] The electronic processing and control means ECU comprises a second control module CM2 for controlling the physical parameters of the processing and is configured to generate second control signals CMD2 for the means for controlling the generation and transmission of the laser beam (e.g. for controlling the intensity and lateral power distribution of the laser beam as a function of the instantaneous processing conditions, i.e. a function of the local temperature of the surface of the workpiece in the area currently being processed).

[0095] Advantageously, closed-loop control of the position of the processing head and the physical parameters of the processing allows for increased precision in the focusing of the processing laser beam in cutting and welding processes, increased precision in the height of material deposition in additive manufacturing processes, frequency or active duty cycle of the pulsed processing laser beam, pressure of the assist gas, translation speed of the head along the processing (cutting or welding) trajectory, and flow rate of powder material in additive manufacturing processes.

[0096] Additionally, closed loop temperature control can be used, particularly for heat stabilization and for process stabilization.

[0097] It should be noted that the embodiments of the present invention proposed in the foregoing discussion are merely exemplary in nature and are not intended to limit the present invention. Those skilled in the art can easily implement the present invention in different embodiments, but without departing from the principles described herein, and therefore are encompassed by this patent.

[0098] This is especially true with regard to the possibility of using detection means for scattered light probe radiation and thermoluminescent radiation that are different from photodetector devices, such as video cameras or spectrometers.

[0099] Naturally, without prejudice to the principles of the invention, the embodiments and implementation details may be varied considerably from those described and illustrated purely by way of non-limiting example, without departing from the scope of protection of the invention as defined by the appended claims.

Claims

1. 1. A combined optical system, comprising: determining the surface temperature of an object or material and the distance of said object or material from a predetermined reference point associated with said system; optical radiation source means configured to emit at least one optical probe radiation at a predetermined wavelength or in a predetermined wavelength range; - control means for controlling the optical radiation source means, configured to control the switching of the optical radiation source means alternately between an operational state in which it emits the at least one optical probe radiation and a non-operational state in which it does not emit optical probe radiation; optical detection means configured to detect at least one scattered optical radiation and one thermally emitted optical radiation from the surface of said object or material; processing means synchronized with said control means, a) determining the distance of the surface of the object or material from the reference point based on optical probe radiation scattered from the surface of the object or material and received by the optical detection means when the optical radiation source means is in an operational state; and b) processing means configured to determine the local temperature of the surface of the object or material based on optical radiation thermally emitted from the surface of the object or material and received by the optical detection means when the optical radiation source means is in an inoperative state.

2. said optical radiation source means being configured to emit primary optical probe radiation and secondary or partial optical radiation representative of said primary optical probe radiation; 2. The system of claim 1, wherein said optical detection means includes at least one monitoring optical detector device normally coupled to said optical radiation source means for detecting said secondary or partial optical radiation.

3. the primary optical probe radiation scattered from the surface of the object or material is at least partially superimposed on the secondary or partial optical radiation on a common incident area of ​​the monitoring photodetector device; the monitoring photodetector device is configured to detect an interference fringe pattern between the secondary or partial optical radiation and the primary optical probe radiation scattered by the surface of the object or material; 3. The system of claim 2, wherein the processing means is configured to determine the distance of the surface of the object or material from the optical radiation source means based on the interference fringe pattern.

4. the optical radiation source means comprises a light emitting diode having a primary radiation emitting area and a secondary radiation emitting area; the monitoring photodetector device faces the secondary radiation-emitting region; 4. The system of claim 2 or 3, wherein primary optical probe radiation scattered by the surface of the object or material is at least partially collected by the primary radiation emitting region.

5. 5. The system of claim 4, wherein the control means is configured to selectively control activation and deactivation of an excitation current of the light emitting diode, which is configured to alter a thermodynamic balance of a population of charge carriers.

6. 2. The system of claim 1, wherein said optical detection means includes photodetector means having a spectral detection range that includes said predetermined wavelength of optical probe radiation scattered by the surface of said object or material and at least one wavelength of optical radiation thermally emitted from the surface of said object or material.

7. the optical detection means comprising: first optical detector means configured to receive at least a portion of the optical probe radiation scattered by the surface of the object or material; and second photodetector means configured to receive at least a portion of the thermally emitted optical radiation from the surface of said object or material.

8. the first optical detector means comprises an optical detector arrangement extending along at least one spatial direction and arranged to receive the optical probe radiation scattered by the surface of the object or material from an observation direction at a non-zero angle to the emission direction of the optical probe radiation; 8. The system of claim 7, wherein the processing means is configured to determine a distance of the surface of the object or material relative to the optical radiation source means based on a position of incidence of optical probe radiation scattered from the surface of the object or material along the at least one spatial direction of the optical detector arrangement.

9. the first photodetector means comprises a photodetector arrangement extending along at least one spatial direction; the optical radiation source means is coupled to downstream beam shaping means configured to shape the at least one optical probe radiation into a beam having a predetermined transverse power distribution that is variable along a propagation axis; 8. The system of claim 7, wherein the processing means is configured to determine a distance of the surface of the object or material relative to the optical radiation source means based on a lateral power distribution of optical probe radiation scattered by the surface of the object or material and detected by an optical detector arrangement.

10. the first photodetector means comprises a photodetector arrangement extending along at least one spatial direction; the optical radiation source means is configured to emit first and second coaxial optical probe radiation beams having different transverse power distributions; 8. A system according to claim 7, wherein the processing means is configured to determine the distance of the surface of the object or material relative to the optical radiation source means based on a differential comparison between the lateral power distribution of the first optical probe radiation beam detected by the optical detector arrangement and scattered from the surface of the object or material and the lateral power distribution of the second optical probe radiation beam scattered from the surface of the object or material.

11. The system of claim 10 , wherein the first and second optical probe radiation beams have different polarizations.

12. The system of claim 10 , wherein the first and second optical probe radiation beams have different wavelengths.

13. The system of claim 10 , wherein the first and second optical probe radiation beams are emitted in alternating intervals.

14. the first photodetector means includes a photodetector array; the optical radiation source means is configured to emit optical probe radiation comprising a plurality of beams arranged symmetrically about an axis of propagation; 8. The system of claim 7, wherein the processing means is configured to determine the distance of the surface of the object or material relative to the optical radiation source means based on a comparison between mutual positions of incidence of the plurality of beams of optical probe radiation scattered from the surface of the object or material on an optical detector arrangement.

15. the optical radiation source means is configured to emit a first optical probe radiation beam and a second reference beam of optical radiation; the system is configured to direct the first optical probe radiation beam towards a surface of the object or material via a measurement optical path and direct a beam reflected or scattered from the surface of the object or material towards an interferometric optical sensor means; the system including second reference optical radiation beam propagation means configured to direct the second reference beam towards the interferometer optical sensor means via a reference optical path of a predetermined optical length under a nominal operating condition in which the position of a surface of the object or material is at a predetermined nominal position relative to a predetermined reference point associated with the system; the first and second beam propagation means are configured to overlap the first and second beams on a common incidence area of ​​the interferometer optical sensor means; the first photodetector means includes a photodetector arrangement configured to detect an interference fringe pattern between the measurement beam and the reference beam on the common incidence area extending along at least one spatial direction; 8. The system of claim 7, wherein the processing means is configured to determine the distance of the surface of the object or material from the optical radiation source means based on the interference fringe pattern.

16. wavelength filtering means coupled to an input of said first photodetector means; 8. The system of claim 7, wherein the wavelength filtering means is configured to transmit optical probe radiation of the predetermined wavelength or range of wavelengths scattered by the surface of the object or material and to block wavelengths of optical radiation thermally emitted from the surface of the object or material.

17. 7. The system of claim 6, wherein the processing means is also configured to normalize the thermally luminescent light radiation received by the photodetector means as a function of the determined distance of the surface of the object or material.

18. 8. The system of claim 7, wherein the processing means is also configured to normalize the thermally luminescent optical radiation received by the second photodetector means as a function of the determined distance of the surface of the object or material.

19. A method for determining the temperature of a surface of an object or material and its distance from a predetermined reference point associated with a combined optical system according to any one of claims 1 to 18, comprising: - providing optical radiation source means configured to emit at least one optical probe radiation at a predetermined wavelength or in a predetermined range of wavelengths; - controlling the switching of said optical radiation source means alternately between an operational state in which it emits said at least one optical probe radiation and an inoperative state in which it does not emit optical probe radiation according to a predetermined frequency; - detecting at least one scattered and one thermally emitted optical radiation from the surface of said object or material; determining the distance of the surface of said object or material from said reference point based on optical probe radiation scattered by the surface of said object or material detected when the optical radiation source means is in an operational state; - determining the temperature of the surface of said object or material based on thermally emitted optical radiation detected from the surface of said object or material when the optical radiation source means is in an inoperative state.

20. 1. A machine for laser processing of a workpiece or material, comprising: It operates using a processing laser beam emitted by a processing head, guided along a machining trajectory on the workpiece or material that includes a series of machining areas; control means for controlling processing parameters; a combined optical system according to any one of claims 1 to 18 permanently coupled to the processing head for determining the temperature of the surface of the workpiece or material and its distance from the processing head, The control means operates based on a predetermined process design, a determined temperature of the surface of the workpiece or material, and a determined distance of the surface of the workpiece or material relative to a work head.

21. 21. The machine of claim 20, wherein the processing parameters include at least one of an intensity and a lateral power distribution of a processing laser beam, a relative position between the processing head and the workpiece or material, a deposition height of material in an additive manufacturing process, a frequency or duty cycle of activation of a pulsed processing laser beam, a pressure of an assist gas, a translational speed of a processing head along a processing trajectory, and a flow rate of powder material in an additive manufacturing process.

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