Parts Mounting Equipment

Abstract

To improve component mounting device tact.SOLUTION: A component mounting device 10 includes a fixing mechanism for fixing a board B, a head unit 30 that mounts a component E on the board B fixed to a fixing mechanism, an imaging unit 21 that images the board B, and a control unit 110, and the fixing mechanism includes a temporary fixing unit 50 that temporarily fixes the board B, and a main fixing unit 40 that permanently fixes the board B temporarily fixed to the temporary fixing unit 50, and in order to recognize the state of the board B temporarily fixed to the temporary fixing unit 50 during the period from the temporary fixing of the board B to the permanent fixing of the board B, the control unit 110 controls the imaging unit 21 to image a predetermined recognition mark provided on the substrate B temporarily fixed to the temporary fixing unit 50.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a component mounting device having a fixing mechanism for fixing a substrate. [Background technology]

[0002] There are known component mounting methods and component mounting devices (component mounting devices) that can minimize the time spent in the pre-processing stage of a printed circuit board before component mounting. Patent Document 1 discloses a technology that can reduce the pre-mounting processing time by capturing an image of a mark (recognition mark) provided on a board waiting in the loader section with a camera (imaging unit) on the top surface of the board in the loader section while components are being mounted on another board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-069288 Summary of the Invention [Problem to be solved by the invention]

[0004] Before mounting components on the board, the imaging unit captures an image of the recognition mark to recognize the position of the board, etc. Conventionally, the image of the recognition mark was captured after the board was fixed to the component mounting device. In this case, if imaging was not started until the board was fixed, the waiting time of the imaging unit would be long, leading to a decrease in takt time. [Means for solving the problem]

[0005] The component mounting device comprises a fixing mechanism for fixing a substrate, a head unit for mounting components on the substrate fixed to the fixing mechanism, an imaging unit for imaging the substrate, and a control unit, wherein the fixing mechanism has a temporary fixing unit for temporarily fixing the substrate and a final fixing unit for final fixing the substrate temporarily fixed to the temporary fixing unit, and the control unit controls the imaging unit to image a predetermined recognition mark provided on the substrate temporarily fixed to the temporary fixing unit in order to recognize the state of the substrate temporarily fixed to the temporary fixing unit between the time when the substrate is temporarily fixed to the temporary fixing unit and the time when the substrate is final fixed. [Effects of the Invention]

[0006] Since the recognition marks are imaged after the temporary fixation and before the final fixation, the image capturing can be started early to recognize the state of the board, thereby improving the takt time of the component mounting device. [Brief explanation of the drawings]

[0007] [Figure 1] Plan view of the component mounting device [Figure 2] Front view of component mounting device [Figure 3] A side view of the air cylinder clamp to explain the temporary fixing operation. [Figure 4] Schematic side view to explain the mounting preparation operation using an air cylinder clamp [Figure 5] FIG. 1 is a plan view showing a bad mark attached to a multi-piece substrate; [Figure 6] Block diagram showing the electrical configuration of the component mounting device [Figure 7] 1 is a time chart showing a mounting preparation operation of a configuration according to a first embodiment; [Figure 8] 1 is a flowchart showing a mounting preparation operation of a configuration according to the first embodiment; [Figure 9] Schematic side view to explain the mounting preparation operation using the PU interlocking clamp [Figure 10] 10 is a time chart showing a mounting preparation operation of a configuration according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] <Embodiment 1> Specific examples of the component mounting device 10 of the present disclosure will be described. Note that the present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims. As shown in FIG. 1, the first embodiment illustrates a component mounting device 10 that mounts a component E on a substrate B such as a printed circuit board.

[0009] <Overall configuration of the component mounting device> As shown in Figures 1 and 2, the component mounting device 10 is configured to include a base 11 that is approximately rectangular in plan view, a transport device 12 that transports a substrate B, a component mounting unit 20 that mounts components E on the substrate B, a component supply device 13 that supplies components E to the component mounting unit 20, and a push-up device (hereinafter referred to as "PU device") 40 that supports the substrate B from below.

[0010] In the following description, the left-right direction is based on the left-right direction in Fig. 1 (the direction of the long sides of the base 11). The front-rear direction is based on the up-down direction in Fig. 1 (the direction of the short sides of the base 11), and in Fig. 1, the lower side will be described as the front side and the upper side will be described as the rear side. The up-down direction will be described as the direction perpendicular to the plane of the paper in the drawing.

[0011] <Base> As shown in FIG. 1, the base 11 has a generally rectangular shape in plan view that is long in the left-right direction, and on the base 11, a transport device 12, a component mounting unit 20, and the like are arranged, each extending in the left-right direction.

[0012] <Conveyor equipment> As shown in Figure 2, the conveying device 12 has a pair of front and rear conveyor belts 14 that rotate in the left-right direction, and as shown in Figure 1, the board B is transported from the upstream side (left side in the left-right direction) to the mounting position P on the PU device 40 by the conveyor belts 14, and after the mounting work of the component E is carried out at the mounting position P, the board B is transported by the conveyor belts 14 toward the component mounting device 10 downstream (right side in the left-right direction).

[0013] <Parts supply device> 1, the component supply devices 13 are feeder-type devices, and are arranged in four locations, two on each side in the left-right direction on the front-rear direction of the conveyance device 12. A plurality of feeders 16 are attached to these component supply devices 13 and aligned in the left-right direction. Each feeder 16 is equipped with an electric delivery device (not shown) that pulls out a component supply tape containing a plurality of components E from a reel, and supplies the components E one by one from the end on the conveyance device 12 side.

[0014] <Component mounting unit> The component mounting unit 20 picks up components E supplied from the component supply device 13 and mounts them on the substrate B, and as shown in Figure 1, is configured with a pair of Y-axis frames 23 arranged on both the left and right sides of the base 11, an X-axis frame 26 mounted on the pair of Y-axis frames 23, and a head unit 30 movably attached to the X-axis frame 26.

[0015] The pair of Y-axis frames 23 are provided with Y-axis guide rails 24 arranged along the Y-axis frames 23, and a Y-axis servo motor 25. When the Y-axis servo motor 25 is energized, the X-axis frame 26 and the head unit 30 attached to the X-axis frame 26 move back and forth along the Y-axis guide rails 24.

[0016] The X-axis frame 26 extends in the left-right direction, and as shown in Figure 2, the X-axis frame 26 is provided with an X-axis guide rail 27 and an X-axis servo motor 28 arranged along the X-axis frame 26, and when the X-axis servo motor 28 is powered and controlled, the head unit 30 moves in the left-right direction along the X-axis guide rail 27.

[0017] <Head unit> As shown in FIGS. 1 and 2, the head unit 30 has a box-shaped head unit main body 31 and a plurality of heads 32 that perform the mounting operation of the component E.

[0018] The multiple heads 32 are arranged side by side in the left-right direction, protruding downward from the head unit main body 31, and each head 32 has a shaft 33 extending in the vertical direction and a detachable suction nozzle 34 at the lower end, which is the tip of the shaft 33.

[0019] A Z-axis servo motor 35 and an R-axis servo motor 36 are attached to the shaft 33, and are provided inside the head unit main body 31. The shaft 33 can be raised and lowered in the vertical direction by the Z-axis servo motor 35, and can be rotated around its axis by the R-axis servo motor 36.

[0020] 2, the suction nozzle 34 has a generally cylindrical shape extending in the vertical direction. The suction nozzle 34 is held at the lower end of the shaft 33 by having its upper end held by a holder (not shown) provided at the lower end of the shaft 33. Furthermore, negative pressure is supplied to each head 32 from an air supply device 51, so that suction force is generated at the tip of the suction nozzle 34.

[0021] 2, a board camera (an example of an "imaging section") 21 is provided on the side of the head unit main body 31, and the board camera 21 captures images of fiducial marks (an example of "recognition marks" and "position recognition marks") FM and bad marks (an example of "recognition marks" and "good / bad recognition marks") BM on the board B to perform image recognition of the board B. Meanwhile, a pair of component cameras 15 is installed on both sides of the mounting position P on the base 11 in the front-to-rear direction, as shown in FIG. 1, and each component camera 15 captures an image of a component E sucked and held by the head 32 of the head unit 30.

[0022] <Air cylinder clamp (temporary fixing part)> As shown in FIG. 2, the air cylinder clamp 50 has a locking piece 46, a clamp plate 47, a cam 48, and an air cylinder 49. As will be described later, the air cylinder clamp 50 can clamp and temporarily fix the substrate B. The air cylinder clamp 50 is an example of a "temporary fixing portion." The air cylinder 49 is an example of a "clamp driving portion." The clamp plate 47 is an example of a "first clamp portion."

[0023] 3, a pair of side walls 45 are provided on the front and rear sides of the transport device 12 on the base 11. A pair of locking pieces 46 are provided on the upper portions of the pair of side walls 45 so as to protrude on opposite sides.

[0024] A clamp plate 47 is provided between the side wall 45 and the conveyor belt 14. The clamp plate 47 has a generally rectangular shape with its plate surface facing the front-to-rear direction, being short in the vertical direction and long in the horizontal direction, and is attached to the side wall 45 so as to be displaceable in the vertical direction. The clamp plate 47 is located below the portion where the locking piece 46 protrudes from the side wall 45.

[0025] 2, a substantially triangular cam 48 slidably contacts the lower side of the clamp plate 47. The cam 48 is connected to the shaft of an air cylinder 49. When air is supplied from an air supply device 51 to the air cylinder 49 under positive or negative pressure, the cam 48 rotates in accordance with the displacement of the shaft, and the clamp plate 47, pushed by the cam 48, is displaced in the vertical direction.

[0026] 3(a) shows a state in which the shaft is retracted and the clamp plate 47 is displaced downward. The position of the clamp plate 47 shown in FIG. 3(a) is the unclamped position. When the clamp plate 47 is in the unclamped position, the substrate B is supported by the conveyor belt 14.

[0027] Figure 3(b) shows a state in which the shaft of air cylinder 49 has extended and clamp plate 47 has been displaced upward (see Figure 2). The position of clamp plate 47 shown in Figure 3(b) is the clamped position. As clamp plate 47 displaces from the unclamped position to the clamped position, the upper edge of clamp plate 47 abuts against the underside of substrate B, lifting substrate B. When clamp plate 47 displaces to the clamped position, substrate B is sandwiched between clamp plate 47 and locking piece 46 and temporarily fixed.

[0028] <Push-up device (main fixing part)> The PU device 40 is attached below the mounting position P on the base 11, and as shown in FIG. 2, is composed of a push-up plate (hereinafter referred to as "PU plate") 42 that holds a plurality of push-up pins (hereinafter referred to as "PU pins") 41 in an upright position, and a first lifting drive unit 44 that has a lifting shaft 43 that raises and lowers the PU plate 42. The PU pins 41 rise and lower integrally with the PU plate 42. The PU pins 41 and the PU plate 42 together form a "first support unit."

[0029] The first lifting / lowering drive unit 44 has a motor equipped with an encoder, and transmits the amount of vertical displacement of the lifting shaft 43 to a control unit 110 (described later). The PU device 40 is a device that permanently fixes the substrate B, and is an example of a "main fixing unit."

[0030] The PU plate 42 can be displaced between a lowered position shown in Fig. 4(a) and an elevated position shown in Fig. 4(c) by operating the first lifting drive unit 44. Fig. 4(b) shows the PU plate 42 in a state between the lowered position and the elevated position.

[0031] When the PU plate 42 is in the lowered position shown in FIG. 4(a), each PU pin 41 does not abut on the board B, and is spaced downward from the board B by a predetermined distance.

[0032] When the first lifting drive unit 44 is operated to displace the PU plate 42 to the raised position shown in Figure 4(c), the PU pins 41 come into contact with the underside of the substrate B from below, supporting the substrate B from below. Since the upward displacement of the substrate B is restricted by the locking pieces 46, the substrate B is sandwiched from above and below between the locking pieces 46 and the PU pins 41 and is firmly fixed. The air cylinder clamp 50 and PU device 40 described above are collectively an example of a "fixing mechanism."

[0033] The PU plate 42 of the permanent fixing portion has a larger displacement amount and a slower displacement speed than the clamp plate 47 of the temporary fixing portion, so the time required for permanent fixing is longer than the time required for temporary fixing.

[0034] <Substrate> 5 is a plan view of substrate B carried into component mounting device 10. Substrate B is a multi-piece substrate including a plurality of unit substrates B1 to B3 (three in this embodiment). Substrate B is a rectangular plate, and fiducial marks FM are provided at the four corners. Component mounting device 10 can recognize the state of substrate B (positional information such as exact position and posture) from images of each fiducial mark FM captured by substrate camera 21.

[0035] A bad mark BM, which is imaged by the substrate camera 21, may be attached to the unit substrates B1 to B3 included in the substrate B. The bad mark BM is a mark attached to a unit substrate that is determined to be defective (has a defect) in an inspection carried out in a previous process.

[0036] The bad mark BM is either automatically marked by an inspection device in a previous process or manually marked by an operator in the previous process. In FIG. 5, of the three unit substrates B1 to B3, the bad mark BM is marked on unit substrate B2. When the bad mark BM is marked, the bad mark BM is marked on a predetermined position where the bad mark BM is to be marked (the left end of unit substrate B2 in FIG. 5). Therefore, by capturing an image of the position where the bad mark BM is to be marked with substrate camera 21, it is possible to capture an image of the bad mark BM.

[0037] Board camera 21 captures images of the positions where bad marks BM are to be applied on unit boards B1 to B3. When a bad mark BM is recognized only from the position where bad marks BM are to be applied on unit board B2 in the captured image, component E is not mounted on the area of ​​unit board B2, but is mounted on the areas of unit boards B1 and B3. Component mounting device 10 can recognize the state of board B (good / bad information on unit boards) from the captured images of bad marks BM.

[0038] The board camera 21 only needs to recognize the presence or absence of a bad mark BM at the intended application position, and since the bad mark BM is generally larger in size than the fiducial mark FM, the recognition accuracy when capturing an image of the bad mark BM may be lower than when capturing an image of the fiducial mark FM.

[0039] <Electrical configuration of the component mounting device> Next, the electrical configuration of component mounting device 10 will be described with reference to Fig. 6. Component mounting device 10 is entirely controlled by control unit 110, which includes an arithmetic processing unit 111 including a CPU and the like. A motor control unit 112, a storage unit 113, an image processing unit 114, an external input / output unit 115, a component supply device communication unit 116, a timer unit 117, an operation unit 118, and the like are connected to arithmetic processing unit 111.

[0040] The arithmetic processing unit 111 calculates the actual stopping position of the board B, the amount of expansion and contraction of the board B, the rotation angle in the horizontal plane, etc. based on the image captured by the board camera 21. Furthermore, the arithmetic processing unit 111 corrects the target mounting position of the component E by the head unit 30 based on these calculation results.

[0041] In response to instructions from the calculation processing unit 111, the motor control unit 112 controls the Y-axis servo motor 25, the X-axis servo motor 28, the Z-axis servo motor 35, the R-axis servo motor 36, the first lifting and lowering drive unit 44, the conveying device 12, etc. based on the mounting program stored in the memory unit 113, to perform the final fixing of the substrate B and the mounting of the component E.

[0042] The memory unit 113 stores various mounting programs, various data, and the like, such as a continuous mounting sequence for continuously mounting components E on the board B. The various data include a production plan for the board B to be produced, the target mounting positions of the components E, the type of board B, and identification information for the shaft 33 and suction nozzle 34 attached to the head unit 30. The production plan for board B includes information on the type of board B. The types of board B will be described later.

[0043] The image processing unit 114 is adapted to receive image signals output from the board camera 21 and the component camera 15, and generates image data of the board B based on the received image signals.

[0044] The external input / output unit 115 is a so-called interface. The arithmetic processing unit 111 exchanges control signals with the air supply device 51 through the external input / output unit 115. By sending a control signal from the arithmetic processing unit 111 to the air supply device 51, it is possible to control the suction of the component E by the suction nozzle 34 and the temporary fixation of the substrate B by the clamp plate 47 connected to the air cylinder 49.

[0045] As described above, the PU device 40, which performs the final fixing, is driven by the motor of the first lifting drive unit 44. On the other hand, the air cylinder clamp 50, which performs the temporary fixing, is driven by air supplied from the air supply unit 51. Because the PU device 40 and the air cylinder clamp 50 have different drive sources, the control unit 110 can control the final fixing operation and the temporary fixing operation separately and perform them at any timing. For example, temporary fixing can be started after final fixing is completed, or conversely, final fixing can be started after temporary fixing is completed. Furthermore, temporary fixing can be started during the final fixing operation, or final fixing can be started during the temporary fixing operation.

[0046] The component supply device communication unit 116 is connected to the component supply device 13 and controls the component supply device 13 in an integrated manner. The timing unit 117 measures the operating time of the motor built into the first lifting / lowering drive unit 44 and transmits the measurement result to the calculation processing unit 111. The calculation processing unit 111 calculates the displacement amount of the first support unit (PU plate 42 and PU pin 41) based on the operating time of the first lifting / lowering drive unit 44.

[0047] The operation unit 118 includes a display device (not shown), such as a liquid crystal monitor, and input devices (not shown), such as a keyboard and a mouse, and receives input from the operator and outputs to the operator.

[0048] <About the types of boards> A substrate B that has only been temporarily fixed is not fixed as strongly as a substrate B that has been temporarily fixed and then permanently fixed. When imaging the fiducial mark FM, the former substrate B is more difficult to recognize with accuracy than the latter substrate B. A substrate that cannot achieve the recognition accuracy required to recognize the fiducial mark FM after temporary fixation and before permanent fixation is called a specific type of substrate BX. A type of substrate that is not a specific type of substrate BX is called a substrate BY. A substrate BY is a substrate that can achieve the recognition accuracy required to recognize the fiducial mark FM even after temporary fixation and before permanent fixation.

[0049] Board BX is an example of a “specific type of board.” Whether the type of board B is board BX or board BY is included in advance in the production plan information stored in storage unit 113.

[0050] The recognition accuracy of the fiducial mark FM after temporary fixation and before final fixation can be determined based on the board dimensions, amount of board warpage, board thickness, board material, etc. For example, when the board dimensions are large, the bending and expansion / contraction of the board B is greater than when the board dimensions are small, so the recognition accuracy of the fiducial mark FM is lower.

[0051] As described above, the bad marks BM can be recognized with a lower recognition accuracy than the fiducial marks FM. Therefore, regardless of whether the substrate B is a specific type of substrate BX or another type of substrate BY, the bad marks BM can be recognized by the substrate camera 21 after temporary fixation and before final fixation.

[0052] <Loading preparation> Next, the mounting preparation operation will be described. The mounting preparation operation is an operation that is performed after the board B is carried into the mounting position P from the upstream side of the component mounting device 10 and before the mounting of the component E begins. The mounting preparation operation includes fixing the board B with the fixing mechanism (PU device 40 and air cylinder clamp 50), capturing images of the marks (fiducial marks FM and bad marks BM) with the board camera 21, correcting the target mounting position based on the image of the fiducial marks FM (hereinafter also referred to as the correction process), and determining whether or not to mount the component based on the presence or absence of the bad marks BM.

[0053] 4A and 4B are schematic diagrams illustrating the operation of the fixing mechanism during the mounting preparation operation. Fig. 4A shows the state of the fixing mechanism when the substrate B is carried into the mounting position P by the conveyor belt 14 of the transport device 12 and stops. At this time, the clamp plate 47 of the air cylinder clamp 50 is in the unclamped position, and the PU plate 42 is in the lowered position. The substrate B is neither temporarily nor permanently fixed, and is placed on the conveyor belt 14.

[0054] After the substrate B has stopped, a mounting preparation operation is started in response to an instruction from the control unit 110. First, the final fixation of the substrate B by the PU device 40 and the temporary fixation by the air cylinder clamp 50 are started approximately simultaneously. Note that, although the present embodiment describes a case in which the final fixation and the temporary fixation are started approximately simultaneously, either one may be started first.

[0055] 4(b) shows a state in which the clamp plate 47 is in the clamp position and temporary fixation is complete, but the PU plate 42 is still rising and has not yet been fully fixed. After a predetermined time has elapsed since temporary fixation began, the control unit 110 instructs the board camera 21 to begin capturing images of the recognition marks (fiducial marks FM and bad marks BM). The predetermined time is set to be longer than the time from the start of operation of the air cylinder clamp 50 to its completion (completion of temporary fixation).

[0056] The substrate camera 21 captures an image of the recognition mark when only temporary fixation is complete, without waiting for the completion of final fixation. The PU plate 42 continues to rise while the recognition mark is being imaged, and final fixation is completed when the PU plate 42 reaches its upper limit position. Figure 4(c) shows the state after both the image of the recognition mark and the final fixation of substrate B have been completed.

[0057] <Time chart> A time chart of the operation of each part during the mounting preparation operation is shown in Fig. 7. The reading of board information and the determination of whether board B is a specific type of board BX will be explained together with the explanation of the flowchart to be given later.

[0058] At time T10, the loaded substrate B starts to be permanently fixed by the PU device 40 and temporarily fixed by the air cylinder clamp 50. At time T11, the temporary fixing is completed first.

[0059] After the start of temporary fixation, at time T12, when a predetermined time has elapsed, board camera 21 starts capturing images of the recognition marks. The passage of the predetermined time is detected by timer 117. The recognition marks include fiducial marks FM and bad marks BM. The predetermined time is set to be longer than the time required for temporary fixation (times T10 to T11). Therefore, after temporary fixation is completed, board camera 21 starts capturing images of the recognition marks.

[0060] When the image capturing of the recognition marks by the board camera 21 is completed at time T13, the control unit 110 then corrects the target mounting position of the component E based on the image of the fiducial mark FM and determines whether or not the component E can be mounted on the unit boards B1 to B3 based on the image of the bad mark BM. The correction process and the determination of whether or not the component E can be mounted are performed so as to be completed before time T15 when the main fixing is completed.

[0061] In this embodiment, the correction process and the determination of whether or not to allow mounting are started at time T13 when imaging by the board camera 21 is completed, and are completed at time T14, before the completion of main fixing. After that, once main fixing is completed, mounting of the component E by the head 32 begins. If main fixing has already been completed at time T14, mounting of the component E by the head 32 begins once the correction process and the determination of whether or not to allow mounting are completed.

[0062] In the component mounting device 10 of this embodiment, after the substrate B is temporarily fixed, the substrate camera 21 captures an image of the recognition mark before the substrate B is fully fixed. Since the substrate camera 21 can capture an image in parallel during the full-fixing operation, the image capture can be completed earlier than when the recognition mark is captured after the full-fixing is completed, and the state of the substrate B can be recognized based on the captured image. This allows the takt time of the component mounting device 10 to be improved.

[0063] In the component mounting device 10 of this embodiment, after the temporary fixing of the substrate B and before the final fixing, the substrate camera 21 captures an image of the fiducial mark FM provided on the substrate B, acquires position information of the substrate B from the captured image, and corrects the target mounting position of the component E. Since the image of the fiducial mark FM and the correction of the target mounting position can be taken in parallel with the final fixing operation, mounting of the component E at the corrected target mounting position can be started immediately after the completion of the final fixing, thereby improving the takt time of the component mounting device 10.

[0064] In the component mounting device 10 of this embodiment, after the temporary fixing of the board B and before the final fixing, the board camera 21 captures an image of the bad marks BM provided on the board B, and determines whether or not components E can be mounted on the unit boards B1 to B3 from the captured image. Since the bad marks BM are captured and whether or not components E can be mounted can be determined in parallel with the operation of the final fixing, components E can be mounted on the unit boards on which they are to be mounted immediately after the completion of the final fixing. This improves the takt time of the component mounting device 10.

[0065] In the component mounting device 10 of this embodiment, the target mounting position is corrected before the final fixing of the board B is completed. By performing the correction before the final fixing is completed, the component E can be mounted on the board B immediately after the final fixing is completed. This allows the mounting of the component E to start earlier, thereby improving the takt time of the component mounting device 10. <Flowchart> Next, the mounting preparation operation will be explained using the flowchart in Fig. 8 when the type of substrate B is a specific type of substrate BX and when it is another type of substrate BY. The operations of each part explained in the above-mentioned time chart (see Fig. 7) are the operations when substrate B is another type of substrate BY, and correspond to S30 to S70 in Fig. 8. Note that while the above-mentioned time chart describes both the start and completion timing of the operations of each part, the flowchart describes only the completion timing.

[0066] The mounting preparation operation starts when the substrate B is carried into the mounting position P. First, in S10, the arithmetic processing unit 111 reads information about the type of substrate B from the storage unit 113 (S10).

[0067] Next, the arithmetic processing unit 111 determines whether the substrate B is a specific type of substrate BX or another type of substrate BY (S20). If it is another type of substrate BY (S20: NO), as explained in the time chart above, the following steps are sequentially performed: temporarily fixing the substrate BY (S30), capturing an image of the fiducial marks FM (S40), capturing an image of the bad marks BM (S50), performing correction processing and determining whether or not to mount (S60), and finally fixing the substrate BY (S70), and then the mounting preparation operation is completed. In S30 to S70, after temporarily fixing the substrate BY, images of both the fiducial marks FM and the bad marks BM are captured before finally fixing it. After the mounting preparation operation is completed, the head 32 starts mounting the components E.

[0068] When the substrate B corresponds to a specific type of substrate BX (S20: YES), as described above, after temporary fixing and before final fixing, it is difficult to obtain a recognition accuracy that can recognize the fiducial mark FM. Therefore, by changing the order from the flow of S30 to S70 described above, after the completion of final fixing (S100), imaging of the fiducial mark FM is performed (S110), and then correction processing and determination of mountability are performed (S120). Note that the recognition of the bad mark BM (S90) is performed after the completion of temporary fixing (S80).

[0069] By performing the recognition of the fiducial mark FM after final fixing with high recognition accuracy, even for a specific type of substrate, the success rate of recognizing the fiducial mark FM can be increased. In addition, since the imaging of the bad mark BM is performed during the operation of final fixing, the imaging can be completed earlier compared to the case where the fiducial mark FM and the bad mark BM are imaged after waiting for the completion of final fixing, and the mounting of the component E can be started earlier.

[0070] In the component mounting device 10 of the present embodiment, the flow is changed according to the type of the substrate B. In the case of the substrate BY, both the fiducial mark FM and the bad mark BM are imaged after the completion of temporary fixing until final fixing. In the case of the substrate BX, the imaging of the bad mark BM is performed after the completion of temporary fixing until final fixing, and the imaging of the fiducial mark FM that requires high recognition accuracy is performed after final fixing where sufficient recognition accuracy can be obtained.

[0071] Regardless of whether the type of the substrate B is BX or BY, since at least the imaging of the bad mark BM is performed during the operation of final fixing, the mounting of the component E can be started earlier and the tact of the component mounting device 10 can be improved.

[0072] <Embodiment 2> <PU interlocking clamp (temporary fixing part)> A component mounting device 210 of embodiment 2 will be described with reference to FIGS. 9 and 10. The component mounting device 210 of embodiment 2 differs from embodiment 1 in the configuration of the temporary fixing portion that fixes the substrate B. The temporary fixing portion of this embodiment is a push-up (PU) interlocking clamp 150 that rises and falls in conjunction with the rising and falling movement of the PU plate 142. The PU interlocking clamp 150 is an example of a "temporary fixing portion." The clamp plate 147 is an example of a "second clamp portion." The PU pin 141 and the PU plate 142 form a second support portion.

[0073] 9 is a side view for explaining the temporary fixing and final fixing operations by the PU-interlocking clamp 150. The PU-interlocking clamp 150 has a pair of locking pieces 46 and a pair of clamp plates 147.

[0074] Unlike the air cylinder clamp 50 described above, the PU-interlocking clamp 150 does not have an air cylinder 49 or motor that serves as a drive source for the clamp plate 147. As will be described below, the clamp plate 147 is displaced up and down by coming into contact with the PU plate 142 and being lifted from below. The clamp plate 147 is longer in the up and down direction than the clamp plate 47, and the length of the clamp plate 147 in the up and down direction is approximately equal to the distance from the top surface of the PU plate 142 to the upper end of the PU pin 141.

[0075] The clamp plate 147 is movable up and down between the unclamped position shown in Fig. 9(a) and the clamped position shown in Fig. 9(c). When the clamp plate 147 is in the unclamped position, the substrate B is placed on the conveyor belt 14.

[0076] When the second lifting drive unit 144 is operated to raise the PU plate 142 from the lower limit position shown in FIG. 9A, the permanent fixing operation begins. Before the PU plate 142 reaches the upper limit position, the lower edge of the clamp plate 147 abuts against the upper surface of the PU plate 142. When the PU plate 142 is then further raised, the clamp plate 147 is pushed up by the PU plate 142 and rises together with the PU plate 142, thereby starting temporary fixing (see FIG. 9B). As the clamp plate 147 rises, the upper edge of the clamp plate 147 supports and lifts the lower surface of the substrate B from below. In this embodiment, when the clamp plate 147 supports the substrate B from below, it is determined that temporary fixing is complete even if the upper surface of the substrate B does not abut against the locking piece 46. Furthermore, substantially simultaneously with the clamp plate 147 abutting against the lower surface of the substrate B, the upper end of the PU pin 141 also abuts against the lower surface of the substrate B and supports and lifts the substrate B from below.

[0077] 9(c), when the PU plate 142 is displaced to the upper limit position, the upper edge of the clamp plate 147 clamps the substrate B between itself and the locking piece 46. At the same time, the PU pin 141 supports the lower surface of the substrate B from below, completing the permanent fixation of the substrate B.

[0078] <Time chart> The operation of each part during the mounting preparation operation in the configuration of embodiment 2 is shown in the time chart of Figure 10. When board B is carried into component mounting device 210, the mounting preparation operation starts. The time at which this happens is designated as T30. At time T30, the PU device 140 starts full fixing, and the PU plate 142 rises from the lower limit position.

[0079] When the PU plate 142 rises a predetermined distance from the lowest position, at time T31, the upper surface of the PU plate 142 comes into contact with the lower edge of the clamp plate 147, and the clamp plate 147 is lifted. As soon as the clamp plate 147 rises in conjunction with the rise of the PU plate 142 at time T31, the clamp plate 147 comes into contact with and supports the substrate B from below, completing temporary fixation.

[0080] An encoder included in the motor of the second lifting drive unit 144 transmits the displacement amount of the lifting shaft 143 to the control unit 110, whereby the control unit 110 detects that the PU plate 142 has risen a predetermined distance.

[0081] After the temporary fixation is completed at time T31, when the second drive unit 144 detects that the PU plate 142 has risen a predetermined distance, at time T32, the board camera 21 starts capturing an image of the recognition mark (see FIG. 9(b)). After capturing the image of the recognition mark is completed, correction processing and a decision on whether or not to mount are performed are carried out until time T35.

[0082] When final fixing is completed at time T34 and the correction process and determination of whether or not to mount are completed at time T35, mounting of component E by head 32 begins at time T34 or time T35, whichever is later. In the example of Fig. 10, final fixing is already completed at time T34, which is before time T35 when correction process is completed, so mounting of component E begins at time T35 when correction process is completed. If final fixing is not yet completed when correction process is completed, mounting of component E will begin after final fixing is completed.

[0083] <Effects> In the component mounting device 210 according to this embodiment, the PU-interlocking clamp 150, which is the temporary fixing unit, operates in conjunction with the PU device 40, which is the final fixing unit. In this configuration, as shown in FIG. 10, the board B is temporarily fixed at time T31 during the final fixing operation. After the temporary fixing, at time T32, the board camera 21 starts capturing images of the recognition marks. Because the recognition marks are captured in parallel with the final fixing operation without waiting for the final fixing to be completed, mounting of the component E can begin earlier than if the image capture is started after the final fixing is completed. This improves the takt time of the component mounting device 210.

[0084] <Other embodiments> (1) In the above-described first and second embodiments, the mounting target position is corrected based on the position information of the captured fiducial mark FM, but the object to be imaged does not have to be the fiducial mark FM. For example, the correction may be performed based on the position information acquired by capturing an image of an arbitrary circuit pattern formed on the substrate B or a notch formed at the edge of the substrate.

[0085] (2) In the above-described embodiment 1, the main fixation by the PU device 40 is started at approximately the same time as the start of the temporary fixation by the air cylinder clamp 50, but the start of the temporary fixation and the main fixation may be performed in succession, or one may be started first.

[0086] (3) In the above-described first embodiment, as an example of a configuration in which the air cylinder clamp 50 for temporary fixation and the PU device 40 for final fixation operate independently, a case in which the PU device 40 is driven by a motor and the air cylinder clamp 50 is driven by an air cylinder is exemplified. In the first embodiment, the temporary fixation and the final fixation are performed using different drive sources, but the drive sources may be the same as long as they can operate independently.

[0087] (4) In the above embodiment, both fiducial marks FM and bad marks BM are provided on the substrate B, and an example is given of a case in which both marks are imaged by the substrate camera 21. However, it is sufficient that at least one of the fiducial marks FM and bad marks BM is provided on the substrate B. Furthermore, even if both marks are provided on the substrate B, the substrate camera 21 may image only one of the marks. [Explanation of symbols]

[0088] 10. Parts mounting equipment 21 Imaging unit 30 Head Unit 40 Push-up device (an example of the "main fixing part") 50 Air cylinder clamp (an example of a "temporary fixing part") 110 control section B board E parts

Claims

1. a fixing mechanism for fixing the substrate; a head unit that mounts components on the substrate fixed to the fixing mechanism; an imaging unit that images the substrate; a control unit, the fixing mechanism includes a temporary fixing portion that temporarily fixes the substrate, and a final fixing portion that final fixes the substrate that has been temporarily fixed to the temporary fixing portion, The control unit controls the imaging unit to capture an image of a predetermined recognition mark provided on the substrate temporarily fixed to the temporary fixing portion, in order to recognize the state of the substrate temporarily fixed to the temporary fixing portion, from after the substrate is temporarily fixed to the temporary fixing portion until the substrate is actually fixed.

2. 2. The component mounting device according to claim 1, The control unit captures an image of a position recognition mark provided on the board using the imaging unit, obtains position information of the board from the image, and controls the head unit to correct the target mounting position of the component relative to the board.

3. 2. The component mounting device according to claim 1, The control unit captures an image of a pass / fail recognition mark provided on the board using the imaging unit, obtains pass / fail information for the board from the image, and determines whether or not the component can be mounted in a specified area of ​​the board.

4. 3. The component mounting device according to claim 2, the control unit acquires the type of the substrate to be fixed to the fixing mechanism based on a production plan for the substrate; The control unit controls the imaging unit to capture an image of the position recognition mark after the substrate has been fully fixed, only if the type of substrate fixed to the fixing mechanism is a specific type.

5. 3. The component mounting device according to claim 2, The control unit corrects the target mounting position based on an image of the position recognition mark before the main fixing unit main fixes the substrate.

6. The component mounting device according to any one of claims 1 to 5, the main fixing unit is capable of rising and falling relative to the substrate, and includes a first support unit that contacts the substrate from below when rising to support the substrate, and a first lifting drive unit that drives the first support unit to rise and fall, the temporary fixing unit has a first clamp unit that clamps the substrate and a clamp driving unit that drives the first clamp unit, The control unit controls the clamp drive unit and the lift drive unit individually to temporarily fix the substrate using the temporary fixation unit and to permanently fix the substrate using the permanent fixation unit at any timing.

7. The component mounting device according to any one of claims 1 to 5, the main fixing unit is capable of lifting and lowering relative to the substrate and includes a second support unit that contacts and supports the substrate from below when lifted, and a second lifting drive unit that drives the second support unit to lift and lower, the temporary fixing portion has a second clamp portion that clamps the substrate, the second clamping portion comes into contact with the second support portion that is driven upward by the second lifting drive portion, and rises in conjunction with the second support portion to come into contact with the substrate and temporarily fix the substrate; The control unit controls the second lifting drive unit to temporarily fix the substrate by the temporary fixing unit while the final fixing unit is performing the final fixing operation of the substrate.

Images