Curable compositions and uses thereof

Abstract

A curable composition is provided that is thermally curable at temperatures below 100° C. and is both thermally and radiation curable, comprising: (A) at least one (meth)acrylate; (B) at least one diaryliodonium salt; and (C) at least one latent amine catalyst. The curable composition exhibits good adhesive strength to a variety of substrates upon curing.

Description

[Technical Field]

[0001] The present invention relates to curable compositions, cured products and uses thereof. [Background technology]

[0002] At present, UV-curable adhesives have been successfully applied in many fields of industrial assembly, especially in high-tech industries that require rapid assembly, such as the manufacturing of electronic devices, optical equipment, etc. UV-curable adhesives are also widely used in daily necessities fields, such as the manufacturing of glass furniture, toys, jewelry, and other decorative items.

[0003] However, some problems may be encountered in certain application areas using conventional UV-curable adhesives. For example, there are shadow areas between the LCD panel and the substrate, i.e. areas where light cannot be transmitted or transmitted, and ultraviolet / visible light cannot penetrate these areas, so the adhesive does not cure completely, which can lead to problems such as corrosion, fatigue over time, or peeling of unbonded edges.

[0004] Free-radical curing systems primarily consist of a photoradical generator and a (meth)acrylate resin. While this system is characterized by rapid curing after UV irradiation, it generally suffers from issues such as low adhesive strength. Cationic curing systems, on the other hand, consist of a photoacid generator, such as a diaryliodonium salt or triarylsulfonium salt, and a cationic polymerization-capable epoxy resin, oxetane resin, or vinyl ether resin. The photoacid generator generates acid upon exposure to light, which cures the cationic polymerization resin. While cationic curing systems offer rapid curing and high adhesive strength, they also suffer from issues such as poor curing due to moisture or subtle basic contamination on the substrate surface, and corrosion caused by residual strong acid in the system when used with metal or inorganic substrates. Summary of the Invention [Problem to be solved by the invention]

[0005] In view of the above, an object of the present invention is to provide a curable composition that can be thermally cured at a temperature of less than 100° C. and that exhibits good adhesive strength to various substrates upon curing. A further object of the present invention is to provide a curable composition that is thermally and radiation-curable and exhibits good adhesive strength to various substrates upon curing. [Means for solving the problem]

[0006] In this specification, (A) at least one (meth)acrylate; (B) at least one diaryliodonium salt; and (C) at least one latent amine catalyst A curable composition comprising:

[0007] Also disclosed herein are cured products of the curable compositions according to the present invention.

[0008] Also disclosed herein are articles comprising the cured product of the curable composition according to the present invention.

[0009] Also disclosed herein are electronic devices comprising articles according to the present invention.

[0010] Also disclosed herein is the use of curable compositions and articles according to the present invention in the manufacture of electronic devices.

[0011] Other features and aspects of the subject matter are described in more detail below.

[0012] Detailed Description of the Invention Those skilled in the art should understand that the present invention describes only exemplary embodiments and does not limit the broader aspects of the present invention. Each aspect so described may be combined with any other aspect unless expressly indicated to the contrary. In particular, any feature indicated as being preferred or advantageous may be combined with any other feature indicated as being preferred or advantageous.

[0013] Unless otherwise stated, in the context of the present invention, the terms used should be construed in accordance with the following definitions.

[0014] Unless otherwise stated, as used herein, the terms "a," "an," and "the" include both singular and plural referents.

[0015] As used herein, the terms "comprising" and "comprises" are synonymous with "including," "includes," or "containing," and "contains," and are inclusive or open-ended and do not exclude additional, unrecited members, elements, or process steps.

[0016] As used herein, the term "room temperature" refers to a temperature of about 20°C to about 25°C, preferably about 25°C.

[0017] Unless otherwise specified, the recitations of numerical endpoints include all numbers and fractions subsumed within the respective ranges, as well as the recited endpoints.

[0018] All references cited herein are incorporated by reference in their entirety.

[0019] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the meaning commonly understood by one of ordinary skill in the art to which this invention belongs.

[0020] In one aspect, the disclosure generally comprises: (A) at least one (meth)acrylate; (B) at least one diaryliodonium salt; and (C) at least one latent amine catalyst The present invention relates to a curable composition of the present invention.

[0021] (A) (Meth)acrylate According to the present invention, the curable composition comprises (A) at least one (meth)acrylate.

[0022] The component (A) is selected from monofunctional (meth)acrylate monomers, polyfunctional (meth)acrylate monomers, and oligomers thereof.

[0023] Examples of monofunctional (meth)acrylate monomers for use as component (A) in the present invention include, but are not limited to, methyl (meth)acrylate, (meth)acrylic acid, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, n-pentyl (meth)acrylate, n-hexyl (meth)acrylate, cyclohexyl (meth)acrylate, n-heptyl (meth)acrylate, n-octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, 2-methyl-2-propanol (meth)acrylate, 2-methyl-1 ... (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, dodecyl (meth)acrylate, tricyclodecanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, phenyl (meth)acrylate, tolyl (meth)acrylate, benzyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 3-methoxybutyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, stearyl (meth)acrylate, glycidyl (meth)acrylate, 2-phenoxyethyl acrylate, 2-aminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, and combinations thereof.

[0024] Examples of polyfunctional (meth)acrylate monomers for use as component (A) in the present invention include, but are not limited to, ethoxylated trimethylolpropane triacrylate, trimethylolpropane tri(meth)acrylate, dipentaerythritol pentaacrylate, pentaerythritol triacrylate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate, pentaerythritol tetraacrylate, 1,4-butanediol diacrylate, trimethylolpropane tri(meth)acrylate, tri(propylene glycol) diacrylate, neopentyl glycol propoxylate diacrylate, diethylene glycol dimethacrylate, bisphenol A diglycidyl ether di(meth)acrylate, dicyclopentadiene dimethanol di(meth)acrylate, tricyclodecane dimethanol diacrylate, and combinations thereof.

[0025] In some embodiments, urethane (meth)acrylate oligomers can be used as component (A) of the present invention. Urethane (meth)acrylates are well known to those skilled in the art and can be obtained, for example, by reacting a diisocyanate, preferably an aliphatic diisocyanate, with a hydroxy (meth)acrylate, or can be obtained, for example, by reacting a diisocyanate, preferably an aliphatic diisocyanate, with a hydroxy (meth)acrylate and a polyol.

[0026] The component (A) may be used alone or in combination of two or more different compounds.

[0027] Commercially available products of the component (A) include, for example, SR833S manufactured by Sartomer and PEP9000 manufactured by Negami Chemical Industrial Co., Ltd.

[0028] According to the present invention, said component (A) may be present in an amount of 50 to 95% by weight, preferably 60 to 85% by weight, based on the total weight of the composition.

[0029] (B) Diaryliodonium Salts According to the present invention, the curable composition comprises (B) at least one diaryliodonium salt.

[0030] In some embodiments, the diaryliodonium salt can be selected from diphenyliodonium phosphate and diphenyliodonium borate.Examples of diphenyliodonium phosphate are selected from (4-methylphenyl)-[4-(2-methylpropyl)phenyl]iodonium hexafluorophosphate, (4-methylphenyl)-phenyliodonium hexafluorophosphate, bis(4-tert-butylphenyl)iodonium hexafluorophosphate, bis(4-methylphenyl)iodonium hexafluorophosphate, (4-ethylphenyl)-[4-(2-methylpropyl)phenyl]iodonium hexafluorophosphate, bis(t-butylphenyl)iodonium hexafluorophosphate, and bis(3,4-dimethylphenyl)iodonium hexafluorophosphate.Examples of diphenyliodonium borates include (4-isopropylphenyl)(p-tolyl)iodonium tetrakis(perfluorophenyl)borate, (4-methylphenyl)-(2-propan-2-ylphenyl)iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranide, bis(2-methylphenyl)iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranide, (4-methylphenyl)-[4-(2-methylpropyl)phenyl]iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranide, and bis(4-dodecylphenyl)iodonium tetrakis(4-methylphenyl)-[4-(2-methylpropyl)phenyl]iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranide. tetrakis(2,3,4,5,6-pentafluorophenyl)boranide, bis(2-dodecylphenyl)iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranide, (2-methylphenyl)-(2-propan-2-ylphenyl)iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranide, bis(2-tert-butylphenyl)iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranide, 1,4-di(3-phenylpropyl)-2,3-diperfluorophenyl-1,4-diiodobutadiene, butyl(triphenyl)boranide, (4-cyclohexylphenyl)-(4-methylphenyl)iodonium, (4-hexylphenyl)-phenyliodonium tetraphenylboranide, (4-cyclohexylphenyl)-phenyliodonium tetraphenylboranide.

[0031] The component (B) may be used alone or in combination of two or more different compounds.

[0032] The component (B) can be produced by a conventionally known method. It is also available as a commercially available product. Examples of commercially available products of the component (B) include Rhodorsil Photoinitiator 2074 manufactured by RHODIA INC. and Omnicat 250 manufactured by IGM Resins.

[0033] According to the present invention, the component (B) may be present in an amount of more than 0% to less than 3% by weight, preferably 0.001 to 2% by weight, more preferably 0.01 to 2% by weight, based on the total weight of the composition.

[0034] In a particularly preferred embodiment, component (B) may be present in an amount greater than 1 wt %, based on the total weight of the composition, and when the amount of component (B) is greater than 1 wt %, the composition can be heat cured at a temperature of 80° C. or less.

[0035] (C) Latent amine catalyst According to the present invention, the curable composition includes (C) at least one latent amine catalyst. A latent amine catalyst refers to an amine catalyst that slowly releases or diffuses through a barrier at room temperature. The release or diffusion of the amine catalyst can be accelerated, for example, by increasing temperature, radiation, or force.

[0036] Examples of latent amine catalysts include, but are not limited to, amine addition latent catalysts, preferably those obtained by the reaction product of an amine compound with an epoxy compound, an isocyanate compound, and / or a urea compound, core-shell type latent amine catalysts, masterbatch type latent amine catalysts, and combinations thereof, preferably core-shell type latent amine catalysts.

[0037] Epoxy compounds used as one of the raw materials for producing amine addition latent catalysts (latent catalysts based on amine-epoxy addition) include, for example, polyglycidyl ethers obtained by reacting polyhydric phenols such as bisphenol A, bisphenol F, catechol, and resorcinol, or polyhydric alcohols such as glycerin and polyethylene glycol, with epichlorohydrin; glycidyl ether esters obtained by reacting hydroxycarboxylic acids such as p-hydroxybenzoic acid and 3-hydroxynaphthoic acid with epichlorohydrin; polyglycidyl esters obtained by reacting polycarboxylic acids such as phthalic acid and terephthalic acid with epichlorohydrin; and glycidyl amine compounds obtained by reacting 4,4'-diaminodiphenylmethane, m-aminophenol, or the like with epichlorohydrin. Further examples include polyfunctional epoxy compounds such as epoxidized phenol novolac resins, epoxidized cresol novolac resins, and epoxidized polyolefins, as well as monofunctional epoxy compounds such as butyl glycidyl ether, phenyl glycidyl ether, and glycidyl methacrylate. However, the epoxy compounds used as latent catalysts in the present invention are not limited to these.

[0038] Amine compounds used as a separate raw material for producing amine addition latent catalysts include any compound that has one or more active hydrogen atoms capable of addition reaction with epoxy groups and one or more functional groups selected from primary amino groups, secondary amino groups, and tertiary amino groups. Examples of such amine compounds are listed below. Examples include aliphatic amines such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, and 4,4'-diamino-dicyclohexylmethane; aromatic amine compounds such as 4,4'-diaminodiphenylmethane and 2-methylaniline; and nitrogen-containing heterocyclic compounds such as 2-ethyl-4-methylimidazole, 2-ethyl-4-methylimidazoline, 2,4-dimethylimidazoline, piperidine, and piperazine. However, the amine compounds used as latent catalysts in the present invention are not limited to these.

[0039] Examples of such compounds include primary or secondary amines having a tertiary amino group in the molecule, for example, amine compounds such as dimethylaminopropylamine, diethylaminopropylamine, dipropylaminopropylamine, dibutylaminopropylamine, dimethylaminoethylamine, diethylaminoethylamine, and N-methylpiperazine, as well as imidazole compounds such as 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, and 2-phenylimidazole. Furthermore, for example, alcohols, phenols, thiols, carboxylic acids, hydrazides, etc. having a tertiary amino group in the molecule, such as 2-dimethylaminoethanol, 1-methyl-2-dimethylaminoethanol, 1-phenoxymethyl-2-dimethylaminoethanol, 2-diethylaminoethanol, 1-butoxymethyl-2-dimethylaminoethanol, 1-(2-hydroxy-3-phenoxypropyl)-2-methylimidazole, 1-(2-hydroxy-3-phenoxypropyl)-2-ethyl-4-methylimidazole, 1-(2-hydroxy-3-butoxypropyl)-2-methylimidazole, 1-(2-hydroxy-3-butoxypropyl)-2-ethyl-4-methylimidazole, 1-(2-hydroxy-3-phen ... Examples of suitable latent catalysts include N,N-dimethylaminoethanethiol, ...

[0040] Examples of isocyanate compounds that can be used as another raw material for the amine addition latent catalyst include, but are not limited to, monofunctional isocyanate compounds such as n-butyl isocyanate, isopropyl isocyanate, phenyl isocyanate, and benzyl isocyanate, as well as polyfunctional isocyanate compounds such as hexamethylene diisocyanate, toluene diisocyanate, 1,5-naphthalene diisocyanate, diphenylmethane-4,4'-diisocyanate, isophorone diisocyanate, xylylene diisocyanate, paraphenylene diisocyanate, 1,3,6-hexamethylene triisocyanate, and bicycloheptane triisocyanate. Furthermore, compounds having terminal isocyanate groups obtained by reacting these polyfunctional isocyanate compounds with active hydrogen compounds can also be used. Examples of such compounds having an isocyanate group at their terminals include an addition compound having an isocyanate group at their terminals obtained by reacting toluene diisocyanate with trimethylolpropane, and an addition compound having an isocyanate group at their terminals obtained by reacting toluene diisocyanate with pentaerythritol. However, the compounds having an isocyanate group at their terminals used as the amine addition latent catalyst in the present invention are not limited to these.

[0041] Examples of urea compounds used as raw materials for producing amine addition latent catalysts include, but are not limited to, urea, urea phosphate, urea oxalate, urea acetate, diacetylurea, dibenzoylurea, and trimethylurea.

[0042] Commercially available products of the amine addition latent catalyst include Ajicure PN-23 manufactured by Ajinomoto FineTechno Co., Inc., Ajicure PN-40 manufactured by Ajinomoto FineTechno Co., Inc., Ajicure PN-50 manufactured by Ajinomoto FineTechno Co., Inc., Hardener X-3661 S manufactured by ACR Co., Ltd., Hardener X-3670S manufactured by ACR Co., Ltd., EH-5011S and EH5057P manufactured by Adeka, Ancamine (registered trademark) 2014FG and 2337S manufactured by Evonik, FXR-1121 manufactured by T&K Toka Corporation, Fujicure FXE-1000 manufactured by T&K Toka Corporation, and Fujicure FXR-1030 manufactured by T&K Toka Corporation.

[0043] Furthermore, the core-shell type latent amine catalyst can be obtained by further treating the surface of an amine adduct with an acid compound such as a carboxylic acid compound or a sulfonic acid compound, an isocyanate compound, or an epoxy compound to form a shell of a modified product (such as an adduct) on the surface. Furthermore, a masterbatch type latent amine catalyst is a core-shell type latent catalyst mixed with an epoxy resin.

[0044] Commercially available core-shell type latent amine catalysts and masterbatch type latent amine catalysts include, for example, Fujicure FXR 1081 manufactured by T&K Toka Corporation, Novacure HX-3722 manufactured by Asahi Kasei Epoxy Co., Ltd., Novacure HX-3742 manufactured by Asahi Kasei Epoxy Co., Ltd., and Novacure HX-3613 manufactured by Asahi Kasei Epoxy Co., Ltd.

[0045] The latent amine catalysts can be used alone, or two or more of these components can be used in combination.

[0046] According to the present invention, said component (C) may be present in an amount of 3 to 47% by weight, more preferably 7 to 40% by weight, and even more preferably 13 to 35% by weight, based on the total weight of the composition.

[0047] (D) Additives In some embodiments, the curable composition may further comprise (D) at least one additive selected from a curing reaction inhibitor, a pigment, a dye, a fluorescent dye, a heat resistance additive, a flame retardant, a plasticizer, an adhesion promoter, a filler, and combinations thereof.

[0048] Suitable examples of curing reaction inhibitors for use in the present invention include, but are not limited to, the following: acetylenic compounds selected from barbituric acid, 2-methyl-3-butyn-2-ol, 2-phenyl-3-butyn-2-ol, or 1-ethynyl-1-cyclohexanol; eneyne compounds such as 3-methyl-3-penten-1-yne, 3,5-dimethyl-3-hexen-1-yne, and combinations thereof; hydrazine-based compounds; phosphine-based compounds; mercaptan-based compounds; and combinations thereof.

[0049] Suitable commercially available curing reaction inhibitors include PM 182 from Henkel and 3,5-dimethyl-1-hexyn-3-ol from Sigma-Aldrich Company.

[0050] Examples of useful pigments include inorganic, organic, reactive, and non-reactive pigments, and combinations thereof, which may be selected from metal oxide pigments, optionally surface-treated titanium dioxide, zirconium oxide or cerium oxide, zinc oxide, iron oxide (black, yellow, or red), chromium oxide, manganese.

[0051] If necessary, the curable composition may be mixed with fillers such as silica fillers, stabilizers, carbon black, titanium black, silane coupling agents, ion trapping agents, leveling agents, antioxidants, antifoaming agents, thixotropic agents, and other additives without impairing the object of the present invention.

[0052] When the composition of the present invention contains component (D), the amount of component (D) to be incorporated is not particularly limited, but is preferably in the range of 0 to 10% by weight, more preferably 0.1 to 5% by weight, and even more preferably 1 to 3% by weight, based on the total weight of the composition.

[0053] (E) Photoradical polymerization initiator According to the present invention, the curable composition may further comprise (E) at least one photoradical polymerization initiator, which, if present, can initiate the curing process by UV irradiation.

[0054] In some embodiments, both photoinitiation and thermal initiation may be desirable: for example, the curing process can be initiated by UV irradiation, and curing can be completed by applying heat to further cure in a subsequent processing step.

[0055] Useful photoradical polymerization initiators include, but are not limited to, α-cleavage (Type I) photoradical polymerization initiators, hydrogen abstraction photoradical polymerization initiators, and combinations thereof. Examples of α-cleavage (Type I) photoradical polymerization initiators are benzil dimethyl ketal, benzoin ether, hydroxyalkyl phenyl ketone, benzoylcyclohexanol, dialkoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, trimethylbenzoylphosphine oxide, methylthiophenyl morpholinoketone, and morpholinophenylaminoketone, and combinations thereof. Examples of hydrogen abstraction photoradical polymerization initiators are benzophenone, thioxanthone, benzil, camphorquinone, ketocoumarin, and combinations thereof.

[0056] Preferred photoradical polymerization initiators include ketone derivatives, such as 1-hydroxycyclohexylphenyl ketone.

[0057] These photoradical polymerization initiators may be used alone or in combination of two or more.

[0058] Useful commercially available photoradical polymerization initiators are available from BASF under the trade names IRGACURE® 184, IRGACURE® 127, IRGACURE® 819, IRGACURE® 754, and IRGACURE® 500, DAROCUR® 4265.

[0059] Generally, when a photoradical polymerization initiator is present in the composition, these compositions will cure at room temperature at wavelengths ranging from 200 to 650 nm, preferably 300 to 500 nm, in less than 30 seconds, preferably less than 10 seconds, and more preferably less than 5 seconds, followed by the heat cure process described herein. As will be appreciated, the time and wavelength cure profile of each curable composition will vary, and different compositions can be designed to provide a cure profile suitable for a particular industrial manufacturing process.

[0060] Particularly preferably, said component (E), when present, may be in an amount of 0 to 10% by weight, preferably 0.1 to 7% by weight, based on the total weight of the composition.

[0061] composition In a particularly preferred embodiment, the curable composition comprises, based on the total weight of the composition: (A) 50 to 95% by weight, preferably 60 to 85% by weight, of at least one (meth)acrylate; (B) more than 0% by weight and less than 3% by weight, preferably 0.001 to 2% by weight, more preferably 0.01 to 2% by weight, of at least one diaryliodonium salt; (C) 3 to 47 wt. %, more preferably 7 to 40 wt. %, and even more preferably 13 to 35 wt. % of at least one latent amine catalyst; (D) 0 to 10 wt. %, more preferably 0.1 to 5 wt. %, even more preferably 1 to 3 wt. % of at least one additive, and (E) 0 to 10% by weight, preferably 0.1 to 7% by weight, of at least one photoradical polymerization initiator Includes.

[0062] Method for preparing a curable composition The curable composition according to the present invention can be prepared at room temperature by the following steps: (i) mixing component (B), component (E), if present, with component (A) in an apparatus to obtain a homogeneous mixture; (ii) adding component (D), if present, to the mixture obtained in step (i); and (iii) Finally, component (C) is added and the mixture is stirred uniformly to obtain a composition.

[0063] The apparatus for mixing, stirring, dispersing, etc., is not particularly limited. An automatic mortar equipped with a stirrer and a heater, a Henschel mixer, a three-roll mill, a ball mill, a planetary mixer, a bead mill, etc. can be used. Furthermore, these apparatuses may be used in appropriate combination. The method for preparing the curable composition is not particularly limited as long as a composition in which the above components are uniformly mixed can be obtained.

[0064] Curing profile and cured product According to the present invention, the curable composition of the present invention can be thermally cured at a temperature preferably below 100°C, more preferably below 80°C.

[0065] In some embodiments, the curable composition of the present invention can be thermally cured at 40 to 95°C, preferably 40 to 85°C.

[0066] The inventors have surprisingly discovered that diaryliodonium salts, after heating above 100°C, release free radicals capable of initiating the free radical polymerization of (meth)acrylates, but the reaction temperature can be significantly reduced in the presence of a latent amine catalyst during the reaction.

[0067] According to the present invention, the curable composition of the present invention can be heat-curable and radiation-curable when at least one photoradical polymerization initiator is present.

[0068] In a preferred embodiment, the curable compositions of the present invention can be cured by UV irradiation at wavelengths ranging from 200 to 650 nm, preferably 250 to 500 nm, at room temperature for less than 30 seconds, preferably less than 10 seconds, and more preferably less than 5 seconds; then thermally cured at temperatures below 100°C, preferably 60 to 90°C, preferably 62 to 82°C, for 20 minutes to 3 hours. As will be appreciated, the time and temperature cure profile of each adhesive composition will vary, and different compositions can be designed to provide a cure profile suitable for a particular industrial manufacturing process.

[0069] In another aspect of the present invention, there is provided a cured product of the curable composition according to the present invention.

[0070] Articles, electronic devices and their uses In another aspect of the present invention, an article is provided that includes a first substrate, a cured product, and a second substrate bonded to the first substrate via the cured product derived from a curable composition according to the present invention.

[0071] The first substrate and / or the second substrate can be a single material and a single layer, or can include multiple layers of the same or different materials. The layers can be continuous or discontinuous.

[0072] The substrate of the articles described herein can have a variety of properties, including rigidity (e.g., a stiff substrate, i.e., the substrate cannot be bent by an individual using both hands or will break if an individual attempts to bend the substrate using both hands), flexibility (e.g., a flexible substrate, i.e., the substrate can be bent with less than the strength of both hands), porosity, electrical conductivity, lack of electrical conductivity, and combinations thereof.

[0073] The substrate of the article can be in a variety of forms, including, for example, fibers, threads, yarns, woven fabrics, nonwoven fabrics, films (e.g., polymeric films, metallized polymeric films, continuous films, discontinuous films, and combinations thereof), foils (e.g., metal foils), sheets (e.g., metal sheets, polymeric sheets, continuous sheets, discontinuous sheets, and combinations thereof), and combinations thereof.

[0074] Useful substrate materials for use in the present invention include, for example, polymers (e.g., polycarbonate, ABS resin (acrylonitrile butadiene styrene resin)), liquid crystal polymers, polyolefins (e.g., polypropylene, polyethylene, low-density polyethylene, linear low-density polyethylene, high-density polyethylene, polypropylene, and oriented polypropylene, copolymers of polyolefins with other comonomers), polyether terephthalate, ethylene vinyl acetate, ethylene methacrylic acid ionomer, ethylene vinyl alcohol, polyesters such as polyethylene terephthalate, polycarbonate, polyamides such as nylon-6 and nylon-6,6, polyvinyl chloride, polyvinylidene chloride, cellulose, and the like. Examples of suitable materials include cellulose derivatives, polystyrene, and epoxy), polymer composites (e.g., composites of polymers with metals, cellulose, glass, polymers, and combinations thereof), metals (aluminum, copper, zinc, lead, gold, silver, platinum, and magnesium and alloys such as steel (e.g., stainless steel), tin, brass, and magnesium and aluminum alloys), carbon fiber composites, other fiber-based composites, graphene, fillers, glass (e.g., alkali aluminosilicate reinforced glass and borosilicate glass), quartz, boron nitride, gallium nitride, sapphire, silicon, carbides, ceramics, and combinations thereof, preferably liquid crystal polymers, glass, and combinations thereof.

[0075] The curable composition can be applied to a substrate using any suitable application method, including, for example, automated fine line coating, jet coating, slot die coating, roll coating, gravure coating, transfer coating, pattern coating, screen printing, spray coating, extrusion, air knife, trailing blade, brushing, dipping, filament coating with a doctor blade, offset gravure coating, rotogravure coating, and combinations thereof. The curable composition can be applied as a continuous or discontinuous coating, in a single layer or multiple layers, and combinations thereof.

[0076] Optionally, the surface of the substrate to which the curable adhesive composition is applied is treated to enhance adhesion using any suitable method for enhancing adhesion to the substrate surface, including, for example, corona treatment, chemical treatment (e.g., chemical etching), flame treatment, abrasion, and combinations thereof.

[0077] In an additional aspect of the present invention, there is provided an electronic device comprising an article of the present invention.

[0078] Exemplary electronic devices include computers and computer equipment, such as printers, fax machines, scanners, keyboards, and the like; medical sensors; automotive sensors, and the like; wearable electronic devices (e.g., watches and eyeglasses), handheld electronic devices (e.g., phones (e.g., cell phones and mobile smart phones), cameras, tablets, e-readers, monitors (e.g., monitors used in hospitals and monitors used by medical professionals, athletes, and individuals), watches, calculators, mice, touchpads, and joysticks), computers (e.g., desktop and laptop computers), computer monitors, televisions, media players, household appliances (e.g., refrigerators, washers, dryers, ovens, and microwaves), light bulbs (e.g., incandescent lamps, light emitting diodes, and fluorescent lamps), articles containing visible, transparent, or transparent compositions, glass housing structures, protective transparent covers for displays or other optical components.

[0079] In yet another aspect of the present invention, there is provided the use of curable adhesive compositions and articles according to the present invention in the manufacture of electronic devices. [Example]

[0080] The following examples are intended to help those skilled in the art better understand and practice the present invention. The scope of the present invention is not limited by the examples, but is defined by the appended claims. All parts and percentages are by weight unless otherwise specified.

[0081] raw materials: SR 833S is tricyclodecane dimethanol diacrylate available from Sartomer.

[0082] PEP 9000 is a urethane (meth)acrylate available from Negami Chemical Industrial Co., Ltd.

[0083] Irgacure 184 is 1-hydroxycyclohexyl phenyl ketone available from BASF.

[0084] Rhodorsil Photoinitiator 2074 is 4-isopropyl-4'-methyldiphenyliodonium tetrakis(pentafluorophenyl)borate available from RHODIA INC.

[0085] Omnicat 250 is 4-isobutylphenyl-4'-methylphenyliodonium hexafluorophosphate iodonium available from IGM Resins.

[0086] CPI-200K is a triarylsulfonium salt with a phosphate anion available from San-Apro Ltd.

[0087] Cyracure UVI 6976 is a mixed type triarylsulfonium hexafluoroantimonate available from DOW.

[0088] 2-(Acetyloxy)-5-iodobenzoic acid is available from Sigma Aldrich.

[0089] Iodobenzene is available from Sigma Aldrich.

[0090] Fujicure FXR 1081 is a mixture of aliphatic and cycloaliphatic polyamines available from T&K Toka Corporation.

[0091] 2E4MZ-CN is 1-cyanoethyl-2-ethyl-4-methylimidazole available from Shikoku Chemicals.

[0092] PM182 is a barbituric acid available from Henkel.

[0093] Manufacturing method: Example 1 (Ex.1) In a lidded container, 0.08 g of Rhodorsil Photoinitiator 2074 was mixed with 3 g of SR 833S. The mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (FlackTek, Inc.). Next, 0.1 g of PM 182 was added to the container, and the mixture was mixed at 1000 rpm for 5 minutes. Then, 1 g of Fujicure FXR 1081 was added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, air bubbles were removed from the homogeneous mixture using a Thinky ARV-310 mixer, resulting in a curable composition.

[0094] Example 2 (Ex.2) In a lidded container, 0.08 g of Omnicat 250 was mixed with 3 g of SR 833S. The mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (FlackTek, Inc.). Next, 0.1 g of PM 182 was added to the container, and the mixture was mixed at 1000 rpm for 5 minutes. Then, 1 g of Fujicure FXR 1081 was added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, air bubbles were removed from the uniform mixture using a Thinky ARV-310 mixer, resulting in a curable composition.

[0095] Example 3 (Ex.3) In a lidded container, 0.04 g of Rhodorsil Photoinitiator 2074 was mixed with 3 g of SR 833S. The mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (FlackTek, Inc.). Next, 0.1 g of PM 182 was added to the container, and the mixture was mixed at 1000 rpm for 5 minutes. Then, 1 g of Fujicure FXR 1081 was added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, air bubbles were removed from the uniform mixture using a Thinky ARV-310 mixer, resulting in a curable composition.

[0096] Example 4 (Ex.4) In a lidded container, 0.005 g of Rhodorsil Photoinitiator 2074 was mixed with 3 g of SR 833S. The mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (manufactured by FlackTek, Inc.). Next, 0.1 g of PM 182 was added to the container, and the mixture was mixed at 1000 rpm for 5 minutes. Then, 1 g of Fujicure FXR 1081 was added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, air bubbles were removed from the homogeneous mixture using a Thinky ARV-310 mixer, resulting in a curable composition.

[0097] Example 5 (Ex.5) In a lidded container, 0.08 g of Rhodorsil Photoinitiator 2074 was mixed with 3 g of SR 833S. The mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (manufactured by FlackTek, Inc.). Next, 0.1 g of PM 182 was added to the container, and the mixture was mixed at 1000 rpm for 5 minutes. Then, 0.5 g of Fujicure FXR 1081 was added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, air bubbles were removed from the homogeneous mixture using a Thinky ARV-310 mixer, resulting in a curable composition.

[0098] Example 6 (Ex.6) In a lidded container, 0.08 g of Rhodorsil Photoinitiator 2074 was mixed with 3 g of SR 833S. The mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (manufactured by FlackTek, Inc.). Next, 0.1 g of PM 182 was added to the container, and the mixture was mixed at 1000 rpm for 5 minutes. Then, 0.1 g of Fujicure FXR 1081 was added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, air bubbles were removed from the homogeneous mixture using a Thinky ARV-310 mixer, resulting in a curable composition.

[0099] Example 7 (Ex.7) In a lidded container, 1 g of PEP 9000 was mixed with 2 g of SR 833S. The mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (FlackTek, Inc.). 0.08 g of Rhodorsil Photoinitiator 2074 and 0.15 g of Irgacure® 184 were then added, and the mixture was mixed at 1000 rpm for 5 minutes. 0.1 g of PM 182 was then added to the container, and the mixture was mixed at 1000 rpm for another 5 minutes. 1 g of Fujicure FXR 1081 was then added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, a Thinky ARV-310 mixer was used to remove air bubbles from the homogeneous mixture, yielding a curable composition.

[0100] Example 8 In a lidded container, 1 g of PEP 9000 was mixed with 2 g of SR 833S. The mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (FlackTek, Inc.). 0.08 g of Omnicat 250 and 0.15 g of Irgacure® 184 were then added, and the mixture was mixed at 1000 rpm for 5 minutes. 0.1 g of PM 182 was then added to the container, and the mixture was mixed at 1000 rpm for another 5 minutes. 1 g of Fujicure FXR 1081 was then added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, air bubbles were removed from the homogeneous mixture using a Thinky ARV-310 mixer, yielding a curable composition.

[0101] Example 9 In a lidded container, 1 g of PEP 9000 was mixed with 2 g of SR 833S. The mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (FlackTek, Inc.). 0.08 g of Rhodorsil Photoinitiator 2074 and 0.15 g of Irgacure® 184 were then added, and the mixture was mixed at 1000 rpm for 5 minutes. 0.1 g of PM 182 was then added to the container, and the mixture was mixed at 1000 rpm for another 5 minutes. 0.3 g of Fujicure FXR 1081 was then added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, a Thinky ARV-310 mixer was used to remove air bubbles from the homogeneous mixture, yielding a curable composition.

[0102] Example 10 (Ex.10) In a lidded container, 1 g of PEP 9000 was mixed with 2 g of SR 833S. The mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (FlackTek, Inc.). 0.04 g of Rhodorsil Photoinitiator 2074 and 0.15 g of Irgacure® 184 were then added, and the mixture was mixed at 1000 rpm for 5 minutes. 0.1 g of PM 182 was then added to the container, and the mixture was mixed at 1000 rpm for an additional 5 minutes. 1 g of Fujicure FXR 1081 was then added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, a Thinky ARV-310 mixer was used to remove air bubbles from the homogeneous mixture, yielding a curable composition.

[0103] Comparative example 1 (CEx.1) In a container with a lid, 0.08 g of Rhodorsil Photoinitiator 2074 was mixed with 3 g of SR 833S, and the mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (manufactured by FlackTek, Inc.) to obtain a curable composition.

[0104] Comparative example 2 (CEx.2) 3 g of SR 833S was prepared in a container with a lid, and then 1 g of Fujicure FXR 1081 was added thereto. The mixture was stirred at 2000 rpm at room temperature for 10 minutes in a Speedmixer DAC 150.1 FVZ-K (manufactured by FlackTek, Inc.) to obtain a composition.

[0105] Comparative example 3 (CEx.3) In a lidded container, 0.08 g of CPI-200K was mixed with 3 g of SR 833S. The mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (FlackTek, Inc.). Next, 0.1 g of PM 182 was added to the container, and the mixture was mixed at 1000 rpm for 5 minutes. 1 g of Fujicure FXR 1081 was then added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, air bubbles were removed from the homogeneous mixture using a Thinky ARV-310 mixer to obtain the composition.

[0106] Comparative example 4 (CEx.4) In a lidded container, 0.08 g of Cyracure UVI 6976 was mixed with 3 g of SR 833S. The mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (manufactured by FlackTek, Inc.). Next, 0.1 g of PM 182 was added to the container, and the mixture was mixed at 1000 rpm for 5 minutes. 1 g of Fujicure FXR 1081 was then added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, air bubbles were removed from the homogeneous mixture using a Thinky ARV-310 mixer to obtain a composition.

[0107] Comparative example 5 (CEx.5) In a lidded container, 0.08 g of iodobenzene was mixed with 3 g of SR 833S. The mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (FlackTek, Inc.). Next, 0.1 g of PM 182 was added to the container, and the mixture was mixed at 1000 rpm for 5 minutes. 1 g of Fujicure FXR 1081 was then added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, air bubbles were removed from the homogeneous mixture using a Thinky ARV-310 mixer to obtain a composition.

[0108] Comparative example 6 (CEx.6) In a lidded container, 0.08 g of 2-(acetyloxy)-5-iodobenzoic acid was mixed with 3 g of SR 833S. The mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (FlackTek, Inc.). Next, 0.1 g of PM 182 was added to the container, and the mixture was mixed at 1000 rpm for 5 minutes. 1 g of Fujicure FXR 1081 was then added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, air bubbles were removed from the homogeneous mixture using a Thinky ARV-310 mixer, resulting in a curable composition.

[0109] Comparative example 7 (CEx.7) In a lidded container, 0.08 g of Rhodorsil Photoinitiator 2074 was mixed with 3 g of SR 833S. The mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (FlackTek, Inc.). Next, 0.1 g of PM 182 was added to the container, and the mixture was mixed at 1000 rpm for 5 minutes. Then, 0.5 g of 2E4MZ-CN was added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, air bubbles were removed from the uniform mixture using a Thinky ARV-310 mixer, resulting in a curable composition.

[0110] Comparative example 8 (CEx.8) In a lidded container, 1 g of PEP 9000 was mixed with 2 g of SR 833S. The mixture was stirred at room temperature for 10 minutes at 2000 rpm in a Speedmixer DAC 150.1 FVZ-K (manufactured by FlackTek, Inc.). Next, 0.08 g of Rhodorsil Photoinitiator 2074 and 0.01 g of Irgacure® 184 were added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, air bubbles were removed from the homogeneous mixture using a Thinky ARV-310 mixer to obtain a curable composition.

[0111] Comparative example 9 (CEx.9) In a lidded container, 1 g of PEP 9000 was mixed with 2 g of SR 833S. The mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (FlackTek, Inc.). 0.01 g of Irgacure® 184 was then added, and the mixture was mixed at 1000 rpm for 5 minutes. 1 g of Fujicure FXR 1081 was then added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, air bubbles were removed from the homogeneous mixture using a Thinky ARV-310 mixer to obtain a composition.

[0112] Comparative example 10 (CEx.10) In a lidded container, 1 g of PEP 9000 was mixed with 2 g of SR 833S. The mixture was stirred at 2000 rpm for 10 minutes at room temperature in a Speedmixer DAC 150.1 FVZ-K (FlackTek, Inc.). 0.08 g of Cyracure UVI 6976 and 0.15 g of Irgacure® 184 were then added, and the mixture was mixed at 1000 rpm for 5 minutes. 0.1 g of PM 182 was then added to the container, and the mixture was mixed at 1000 rpm for another 5 minutes. 1 g of Fujicure FXR 1081 was then added, and the mixture was mixed at 1000 rpm for 5 minutes. Finally, a Thinky ARV-310 mixer was used to remove air bubbles from the homogeneous mixture, resulting in a composition.

[0113] Test Method: Differential scanning calorimetry (DSC) The curing temperatures of each of the formulations Ex.1 to Ex.6 and CEx.1 to CEx.7 were determined using a dynamic DSC Q2000 instrument. The measurement conditions were as follows: the scanning temperature range was 40 to 250°C (10°C / min). The peak temperatures were recorded in Table 1.

[0114] A DSC peak temperature of less than 100°C is acceptable.

[0115] Die shear strength of the cured product The die shear strength (DSS) of the cured product was measured at room temperature using a DAGE4000 (manufactured by Nordson Corporation). 2 The glass top adherend was then placed on a polyamide substrate. All samples of compositions Ex.1 to Ex.6 and CEx.1 to CEx.7 were cured in an oven at 80°C for 1 hour. All samples of compositions Ex.7 to Ex.10 and CEx.8 to CEx.10 were cured with LED light at 1100mw / cm2 with a wavelength of 365nm. 2 The adhesive was cured under UV irradiation at 400 K for 2 seconds, followed by heat curing in an oven at 80°C for 1 hour. No pressure was used. Each sample was tested eight times under the same conditions, and the average DSS was calculated and recorded using a simplified averaging method to eliminate errors. The test results are shown in Tables 1 and 2.

[0116] In Ex.1 to Ex.6 and CEx.1 to CEx.7, DSS of more than 5Kg is permissible. In Ex.7 to Ex.10, CEx.8 and CEx.10, DSS of more than 5Kg is permissible.

[0117] [Table 1]

[0118] [Table 2]

[0119] As can be seen from Table 1, the curable compositions of the present invention have lower cure temperatures (less than 100°C) than the comparative compositions, and the cured products of the curable compositions of the present invention exhibit good die shear strength (more than 5 kg).

[0120] As can be seen from Table 2, the curable compositions of the present invention were heat curable and radiation curable and exhibited desirable die shear strength (greater than 5 Kg).

[0121] While several preferred embodiments have been described, many modifications and variations may be made thereto in light of the above teachings. It is therefore to be understood that the invention may be practiced otherwise than as specifically described without departing from the scope of the appended claims. Preferred aspects of the present invention include the following. [1] (A) at least one (meth)acrylate; (B) at least one diaryliodonium salt; and (C) at least one latent amine catalyst A curable composition comprising: [2] The curable composition according to [1], wherein the component (A) is selected from monofunctional (meth)acrylate monomers, polyfunctional (meth)acrylate monomers, and oligomers thereof. [3] The monofunctional (meth)acrylate monomer may be methyl (meth)acrylate, (meth)acrylic acid, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, n-pentyl (meth)acrylate, n-hexyl (meth)acrylate, cyclohexyl (meth)acrylate, n-heptyl (meth)acrylate, n-octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, or nonyl (meth)acrylate. [2] The curable composition according to [2], wherein the acrylate is selected from the group consisting of acrylate, decyl (meth)acrylate, dodecyl (meth)acrylate, tricyclodecanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, phenyl (meth)acrylate, tolyl (meth)acrylate, benzyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 3-methoxybutyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, stearyl (meth)acrylate, glycidyl (meth)acrylate, 2-phenoxyethyl acrylate, 2-aminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, and combinations thereof. [4] The curable composition according to [2], wherein the polyfunctional (meth)acrylate monomer is selected from ethoxylated trimethylolpropane triacrylate, trimethylolpropane tri(meth)acrylate, dipentaerythritol pentaacrylate, pentaerythritol triacrylate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate, pentaerythritol tetraacrylate, 1,4-butanediol diacrylate, trimethylolpropane tri(meth)acrylate, tri(propylene glycol) diacrylate, neopentyl glycol propoxylate diacrylate, diethylene glycol dimethacrylate, bisphenol A diglycidyl ether di(meth)acrylate, dicyclopentadiene dimethanol di(meth)acrylate, tricyclodecane dimethanol diacrylate, and combinations thereof. [5] The component (B) is selected from diphenyliodonium phosphate, diphenyliodonium borate, and combinations thereof, and is preferably selected from (4-methylphenyl)-[4-(2-methylpropyl)phenyl]iodonium hexafluorophosphate, (4-methylphenyl)-phenyliodonium hexafluorophosphate, bis(4-tert-butylphenyl)iodonium hexafluorophosphate, bis(4-methylphenyl)iodonium hexafluorophosphate, (4-ethylphenyl)-[4-(2-methylpropyl)phenyl]iodonium hexafluorophosphate, bis(t-butylphenyl)iodonium hexafluorophosphate, bis(3,4-dimethylphenyl)iodonium hexafluorophosphate, (4-isopropylphenyl)(p-tolyl)iodonium tetrakis(perfluorophenyl)borate, (4-methylphenyl)-(2-propan-2-ylphenyl)iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranide, bis(2-methylphenyl)iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranide, (4-methylphenyl)-[4-(2-methylpropyl)phenyl]iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranide, bis(4-dodecylphenyl)iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranide, bis (2-dodecylphenyl)iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranide, (2-methylphenyl)-(2-propan-2-ylphenyl)iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranide, bis(2-tert-butylphenyl)iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranide, 1,4-di(3-phenylpropyl)-2,3-diperfluorophenyl-1,The curable composition according to any one of [1] to [4], wherein the iodonium tetraphenylboronide is selected from 4-diiodobutadiene, butyl(triphenyl)boronide (4-cyclohexylphenyl)-(4-methylphenyl)iodonium, (4-hexylphenyl)-phenyliodonium tetraphenylboronide, (4-cyclohexylphenyl)-phenyliodonium tetraphenylboronide, and combinations thereof. [6] The curable composition according to any one of [1] to [5], wherein the component (C) is selected from an amine-addition latent amine catalyst, preferably obtained by the reaction product of an amine compound with an epoxy compound, an isocyanate compound, and / or a urea compound; a core-shell type latent amine catalyst; a masterbatch type latent amine catalyst; and a combination thereof, preferably a core-shell type latent amine catalyst. [7] The curable composition according to any one of [1] to [6], further comprising (D) at least one additive selected from a curing reaction inhibitor, a pigment, a dye, a fluorescent dye, a heat resistance additive, a flame retardant, a plasticizer, an adhesion promoter, a filler, and a combination thereof. [8] The curable composition according to any one of [1] to [7], wherein the composition is thermosetting at a temperature of preferably less than 100°C, preferably from 40°C to 95°C, more preferably from 40°C to 85°C. [9] The curable composition according to any one of [1] to [8], further comprising (E) at least one photoradical polymerization initiator.

[10] The curable composition according to [7], wherein the photoradical polymerization initiator is an α-cleavage type photoradical polymerization initiator, a hydrogen abstraction type photoradical polymerization initiator, or a combination thereof, and is preferably selected from benzyl dimethyl ketal, benzoin ether, hydroxyalkyl phenyl ketone, benzoylcyclohexanol, dialkoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, trimethylbenzoylphosphine oxide, methylthiophenyl morpholinoketone and morpholinophenyl aminoketone, benzophenone, thioxanthone, benzil, camphorquinone, ketocoumarin; and a combination thereof.

[11] The curable composition according to [9] or

[10] , wherein the composition is heat-curable and radiation-curable.

[12] The curable composition according to any one of [1] to

[11] , wherein the component (A) is present in an amount of 50 to 95% by weight, preferably 60 to 85% by weight, based on the total weight of the composition.

[13] The curable composition according to any one of [1] to

[12] , wherein component (B) is present in an amount of more than 0 wt % and less than 3 wt %, preferably 0.001 to 2 wt %, more preferably 0.01 to 2 wt %, based on the total weight of the composition.

[14] The curable composition according to any one of [1] to

[13] , wherein the component (C) is present in an amount of 3 to 47 wt %, more preferably 7 to 40 wt %, and even more preferably 13 to 35 wt %, based on the total weight of the composition.

[15] The curable composition according to any one of [1] to

[14] , wherein the component (D) is present in an amount of 0 to 10 wt %, more preferably 0.1 to 5 wt %, and even more preferably 1 to 3 wt %, based on the total weight of the composition.

[16] The curable composition according to any one of [1] to

[15] , wherein the component (E) is present in an amount of 0 to 10% by weight, preferably 0.1 to 7% by weight, based on the total weight of the composition.

[17] A cured product of the curable composition according to any one of [1] to

[16] .

[18] a first substrate;

[17] The cured product according to

[17] , and A second substrate bonded to the first substrate via the cured product. Items including.

[19] An electronic device comprising the article according to

[18] .

[20] Use of the curable composition according to any one of [1] to

[16] or the article according to

[18] in the manufacture of an electronic device.

Claims

1. (A) at least one (meth)acrylate; (B) at least one diaryliodonium salt; and (C) at least one latent amine catalyst A curable composition comprising:

2. The curable composition of claim 1 , wherein component (A) is selected from monofunctional (meth)acrylate monomers, polyfunctional (meth)acrylate monomers, and oligomers thereof.

3. The monofunctional (meth)acrylate monomers include methyl (meth)acrylate, (meth)acrylic acid, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, n-pentyl (meth)acrylate, n-hexyl (meth)acrylate, cyclohexyl (meth)acrylate, n-heptyl (meth)acrylate, n-octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and nonyl (meth)acrylate.

3. The curable composition of claim 2, wherein the acrylate is selected from the group consisting of methyl acrylate, decyl (meth)acrylate, dodecyl (meth)acrylate, tricyclodecanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, phenyl (meth)acrylate, tolyl (meth)acrylate, benzyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 3-methoxybutyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, stearyl (meth)acrylate, glycidyl (meth)acrylate, 2-phenoxyethyl acrylate, 2-aminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, and combinations thereof.

4. 3. The curable composition of claim 2, wherein the polyfunctional (meth)acrylate monomer is selected from ethoxylated trimethylolpropane triacrylate, trimethylolpropane tri(meth)acrylate, dipentaerythritol pentaacrylate, pentaerythritol triacrylate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate, pentaerythritol tetraacrylate, 1,4-butanediol diacrylate, trimethylolpropane tri(meth)acrylate, tri(propylene glycol) diacrylate, neopentyl glycol propoxylate diacrylate, diethylene glycol dimethacrylate, bisphenol A diglycidyl ether di(meth)acrylate, dicyclopentadiene dimethanol di(meth)acrylate, tricyclodecane dimethanol diacrylate, and combinations thereof.

5. The curable composition of any one of claims 1 to 4, wherein component (B) is selected from diphenyliodonium phosphate, diphenyliodonium borate, and combinations thereof.

6. The curable composition according to any one of claims 1 to 5, wherein the component (C) is selected from an amine-addition latent amine catalyst; a core-shell type latent amine catalyst; a masterbatch type latent amine catalyst; and combinations thereof.

7. The curable composition according to any one of claims 1 to 6, wherein the composition further comprises (D) at least one additive selected from a curing reaction inhibitor, a pigment, a dye, a fluorescent dye, a heat resistance additive, a flame retardant, a plasticizer, an adhesion promoter, a filler, and combinations thereof.

8. The curable composition of any one of claims 1 to 7, wherein the composition is heat-curable at a temperature of less than 100°C.

9. The curable composition according to any one of claims 1 to 8, wherein the composition further comprises (E) at least one photoradical polymerization initiator.

10. The curable composition according to claim 9, wherein the photoradical polymerization initiator is an α-cleavage type photoradical polymerization initiator, a hydrogen abstraction type photoradical polymerization initiator, or a combination thereof.

11. 11. The curable composition of claim 9 or 10, wherein the composition is heat-curable and radiation-curable.

12. The curable composition of any of claims 1 to 11, wherein component (A) is present in an amount of 50 to 95 wt%, based on the total weight of the composition.

13. The curable composition of any of claims 1 to 12, wherein component (B) is present in an amount greater than 0 wt% and less than 3 wt%, based on the total weight of the composition.

14. The curable composition of any of claims 1 to 13, wherein component (C) is present in an amount of 3 to 47 wt%, based on the total weight of the composition.

15. The curable composition of any of claims 1 to 14, wherein component (D) is present in an amount of 0 to 10 wt%, based on the total weight of the composition.

16. The curable composition of any of claims 1 to 15, wherein component (E) is present in an amount of 0 to 10 wt%, based on the total weight of the composition.

17. A cured product of the curable composition according to any one of claims 1 to 16.

18. a first substrate; The cured product according to claim 17, and A second substrate bonded to the first substrate via the cured product. Items including.

19. 20. An electronic device comprising the article of claim 18.

20. Use of a curable composition according to any one of claims 1 to 16 or an article according to claim 18 in the manufacture of an electronic device.

Images