Light-curing varnish composition

JP7789505B2Active Publication Date: 2025-12-22SAKATA INX
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Patent Information

Application Number
JP2021125524
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-07-30
Publication Date
2025-12-22
Estimated Expiration
2041-07-30

AI Technical Summary

Technical Problem

Existing overprint varnishes have not effectively addressed the combination of gloss, slipperiness, blocking resistance, and leveling properties, especially in carton packaging, and packaging. The present invention aims to provide a photocurable varnish that can address these issues by incorporating specific amide compounds and plasticizers, ensuring appropriate content levels to achieve the desired properties.

Method used

The photocurable varnish composition includes a photopolymerizable compound, a photopolymerization initiator, an amide compound with 32 to 40 carbon atoms or a monoamide with 10 to 16 carbon atoms, and a dialkyl dicarboxylate plasticizer, with specific content percentages to enhance slip properties, blocking resistance, and leveling properties.

Benefits of technology

The composition forms a cured product with improved gloss, slipperiness, and leveling properties, maintaining smoothness and appearance without impairing gloss.

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Abstract

To provide a photocurable varnish composition capable of giving a cured product which has gloss imparted and, moreover, combines slipperiness, blocking resistance, and leveling property.SOLUTION: A photocurable varnish composition contains at least a photopolymerizable compound, a photopolymerization initiator, an amide compound, and a plasticizer. The amide compound is a C32-40 bisamide and / or a C10-16 monoamide. The content of the amide compound is 0.5-4.0 mass% based on the total amount of the photopolymerizable compound. The plasticizer is a dialkyl dicarboxylate. The content of the plasticizer is 3.0-6.5 mass% based on the total amount of the photopolymerizable compound.SELECTED DRAWING: None
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Citation Information

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