Encapsulating resin composition, electronic component device, and method for manufacturing electronic component device

Abstract

A sealing resin composition for use in a wafer level package, the sealing resin composition containing an epoxy resin, a curing agent, and an inorganic filler,and being such that the elasticity modulus at 25°C of a cured product of the sealing resin composition is 18 GPa or less.

Description

[Technical Field]

[0001] The present invention relates to an encapsulating resin composition, an electronic component device, and a method for manufacturing an electronic component device. [Background technology]

[0002] For example, Patent Document 1 discloses an encapsulating epoxy resin molding material containing a silicone compound and the application of the encapsulating epoxy resin molding material to a thin package. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-241307 Summary of the Invention [Problem to be solved by the invention]

[0004] Wafer level packaging (WLP) is a technology for encapsulating a relatively large area with an encapsulating resin composition. As the area encapsulated with the encapsulating resin composition increases, molding warpage tends to become more pronounced. Therefore, there is a demand for an encapsulating resin composition that can suppress the occurrence of molding warpage.

[0005] The embodiments of the present disclosure have been made under the above circumstances. An object of the present disclosure is to provide an encapsulating resin composition for wafer-level packages that suppresses the occurrence of molding warpage, an electronic component device encapsulated with the same, and a method for manufacturing an electronic component device encapsulated with the same. [Means for solving the problem]

[0006] Specific means for solving the above problems include the following aspects.

[0007] <1> An encapsulating resin composition for use in wafer-level packaging, comprising an epoxy resin, a curing agent, and an inorganic filler, wherein the cured product of the encapsulating resin composition has an elastic modulus of 18 GPa or less at a temperature of 25°C. <2> Further containing an amorphous polymer having a glass transition temperature of 70°C or less, <1> The encapsulating resin composition according to claim 1. <3> The content of the inorganic filler is 65% by volume or more and 80% by volume or less with respect to the entire encapsulating resin composition. <1> or <2> The encapsulating resin composition according to claim 1. <4> The cured product of the encapsulating resin composition has a glass transition temperature of 100°C or higher and 160°C or lower, and the cured product of the encapsulating resin composition has a linear expansion coefficient between a temperature of 25°C and the glass transition temperature of 10 x 10 -6 / K or more, <1> ~ <3> 10. The encapsulating resin composition according to claim 1, wherein the encapsulating resin composition is a resin composition for encapsulation. <5> The curing agent comprises an active ester compound. <1> ~ <4> 10. The encapsulating resin composition according to claim 1, wherein the encapsulating resin composition is a resin composition for encapsulation. <6> a support member, an element disposed on the support member, and a sealing member for sealing the element; <1> ~ <5> 10. An electronic component device comprising: a cured product of the encapsulating resin composition according to any one of claims 1 to 9. <7> A step of disposing a plurality of elements on a wafer; <1> ~ <5> 10. A method for manufacturing an electronic component device, comprising: a step of encapsulating the entire device with the encapsulating resin composition according to any one of the preceding items; and a step of dividing the encapsulated elements into individual pieces. [Effects of the Invention]

[0008] According to the present disclosure, there are provided an encapsulating resin composition for wafer-level packaging that suppresses the occurrence of molding warpage in a cured product, an electronic component device encapsulated with the same, and a method for manufacturing an electronic component device encapsulated with the same. DETAILED DESCRIPTION OF THE INVENTION

[0009] In the present disclosure, the term "process" includes not only a process that is independent of other processes, but also a process that cannot be clearly distinguished from other processes as long as the purpose of the process is achieved. In the present disclosure, numerical ranges indicated using "to" include the numerical values ​​before and after "to" as the minimum and maximum values, respectively. In the numerical ranges described in stages in this disclosure, the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another numerical range described in stages. Furthermore, in the numerical ranges described in this disclosure, the upper or lower limit value of that numerical range may be replaced with a value shown in the examples. In the present disclosure, each component may contain multiple substances corresponding to the component. When multiple substances corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple substances present in the composition, unless otherwise specified. In the present disclosure, the composition may contain multiple types of particles corresponding to each component. When multiple types of particles corresponding to each component are present in the composition, the particle size of each component means the value for a mixture of the multiple types of particles present in the composition, unless otherwise specified.

[0010] <Sealing resin composition> The encapsulating resin composition of the present disclosure is an encapsulating resin composition for use in wafer-level packaging, and contains an epoxy resin, a curing agent, and an inorganic filler, and the cured product of the encapsulating resin composition has an elastic modulus of 18 GPa or less at a temperature of 25°C. Wafer level packaging (WLP) is a technology for sealing a relatively large area with an encapsulating resin composition, and the encapsulating resin composition of the present disclosure suppresses molding warpage by having a modulus of elasticity of the cured product of 18 GPa or less at a temperature of 25°C.

[0011] In general, the higher the linear expansion coefficient of the cured product of an encapsulating resin composition, the more likely it is that molding warpage will occur. According to the encapsulating resin composition of the present disclosure, even if the linear expansion coefficient of the cured product is relatively high, molding warpage is suppressed because the elastic modulus of the cured product at a temperature of 25°C is 18 GPa or less.

[0012] From the viewpoint of further suppressing molding warpage, the encapsulating resin composition of the present disclosure has a cured product with a modulus of elasticity of more preferably 16 GPa or less, and even more preferably 14 GPa or less at a temperature of 25° C. The encapsulating resin composition of the present disclosure has a cured product with a modulus of elasticity of, for example, 10 GPa or more at a temperature of 25° C.

[0013] In one embodiment of the encapsulating resin composition of the present disclosure, the glass transition temperature of the cured product is in the range of 100°C to 170°C (preferably in the range of 100°C to 160°C), and the linear expansion coefficient of the cured product between a temperature of 25°C and the glass transition temperature is 10 × 10 -6 / K or more. The linear expansion coefficient is, for example, 20×10 -6 / K or less. In one embodiment of the present invention, the linear expansion coefficient of the cured product between the glass transition temperature and a temperature of 175°C is, for example, 30 x 10 -6 / K or more. The linear expansion coefficient is, for example, 75×10 -6 / K or less. In this disclosure, the glass transition temperature is also referred to as Tg, the linear expansion coefficient between a temperature of 25°C and the glass transition temperature is also referred to as "CLE1" (Coefficient of Linear Expansion 1), and the linear expansion coefficient between the glass transition temperature and a temperature of 175°C is also referred to as "CLE2" (Coefficient of Linear Expansion 2).

[0014] Here, methods for measuring the modulus of elasticity, glass transition temperature, and coefficient of linear expansion of the cured product of the encapsulating resin composition will be described.

[0015] -Elastic modulus and Tg- The encapsulating resin composition is molded into a sheet having a thickness of 0.8 mm under the conditions of a mold temperature of 175°C, a molding pressure of 7 MPa, and a curing time of 90 seconds. A 4 mm x 25 mm plate is cut out from the sheet to serve as a test piece. The test specimen is placed in a solid viscoelasticity measuring device (e.g., TA Instruments, Model RSA-G2) and dynamic viscoelasticity measurements are performed in a three-point bending mode. The measurement conditions are: temperature range: 10°C to 40°C, heating rate: 5°C / min, frequency: 10 Hz, strain: 0.2%, and atmosphere: nitrogen flow. The storage modulus E' (Pa) and loss modulus E'' (Pa) are measured, the loss tangent tan δ (=E'' / E') is calculated, and a tan δ-temperature curve is obtained. The storage modulus E' at a temperature of 25°C is defined as the modulus (GPa) of the cured product of the encapsulating resin composition, and the temperature at the peak top of the tan δ-temperature curve is defined as the Tg (°C) of the cured product of the encapsulating resin composition.

[0016] -Linear expansion coefficient- The encapsulating resin composition is molded into a rectangular column having a length of 20 mm and a side length of 4 mm under the conditions of a mold temperature of 175° C., a molding pressure of 7 MPa, and a curing time of 120 seconds, and this is used as a test piece. The test piece is placed in a thermomechanical analyzer (e.g., Rigaku Corporation, Model No. TMA8310L) and subjected to thermomechanical analysis in compression and heating modes. The measurement conditions are: temperature range: 20°C to 180°C, heating rate: 5°C / min, load: 98 mN, and atmosphere: nitrogen gas flow. Length of test piece at 20℃ L 20 (mm) and the length L of the test piece at a temperature of 25°C 25 (mm), and the length L of the test piece at Tg of the cured product of the encapsulating resin composition Tg (mm) and the length L of the test piece at a temperature of 175°C 175 (mm) and measure. The temperature difference between Tg and 25°C is Δt1 = Tg-25 (K), and the length difference between Tg and 25°C is ΔL1 = L Tg -L 25 (mm) and then calculate CLE1 using the following formula 1. The temperature difference between 175°C and Tg is Δt2 = 175-Tg (K), and the length difference between 175°C and Tg is ΔL2 = L 175 -L Tg (mm) and then calculate CLE2 using the following formula 2. (Formula 1)...CLE1( / K)=(1÷L 20 ) × (ΔL1 ÷ Δt1) (Formula 2)...CLE2( / K)=(1÷L 20 ) × (ΔL2 ÷ Δt2)

[0017] The method for controlling the elastic modulus of the cured product at a temperature of 25°C to 18 GPa or less is not particularly limited, and the elastic modulus can be controlled, for example, by adding an amorphous polymer having a Tg of 70°C or less to the encapsulating resin composition, or by increasing or decreasing the content of an inorganic filler in the encapsulating resin composition.

[0018] (Amorphous polymer with Tg of 70°C or less) In the present disclosure, an amorphous polymer refers to a polymer that falls into any one of (a) to (c) in differential scanning calorimetry (DSC). (a) Polymer with no clear endothermic peak. (b) Polymer showing a stepwise change in heat absorption. (c) Polymers with a full width at half maximum of the endothermic peak exceeding 10°C when measured at a heating rate of 10°C / min. The glass transition temperature of an amorphous polymer is a temperature determined from a DSC curve, and is the "extrapolated glass transition onset temperature" described in "Method for determining glass transition temperature" of JIS K7121:1987 "Method for measuring transition temperature of plastics."

[0019] Specific examples of amorphous polymers having a Tg of 70° C. or less include silicone, various modified silicones, polyimide, and polyamideimide. The amorphous polymer having a Tg of 70°C or less is more preferably one having a Tg of 50°C or less, and even more preferably one having a Tg of 30°C or less.

[0020] An example of an embodiment of an amorphous polymer having a Tg of 70°C or less is polyether-modified silicone. The polyether-modified silicone is not particularly limited as long as it is a compound in which a polyether group is introduced into silicone, which is a polymeric compound having a main skeleton formed by siloxane bonds. The polyether-modified silicone may be a side-chain-modified polyether-modified silicone, a terminal-modified polyether-modified silicone, or a side-chain-and-terminal-modified polyether-modified silicone. Of these, the side-chain-modified polyether-modified silicone is preferred.

[0021] An example of an embodiment of an amorphous polymer having a Tg of 70° C. or less is an epoxy-polyether-modified silicone. The epoxy-polyether-modified silicone is not particularly limited as long as it is a compound in which a polyether group and an epoxy group are introduced into silicone, which is a polymer compound having a main skeleton formed by siloxane bonds. The epoxy-polyether-modified silicone may be a side-chain-modified epoxy-polyether-modified silicone, a terminal-modified epoxy-polyether-modified silicone, or a side-chain-and-terminal-modified epoxy-polyether-modified silicone. The main skeleton of the epoxy-polyether-modified silicone is preferably polydimethylsiloxane. The polyether group is preferably a polyether group formed by polymerizing one or both of ethylene oxide and propylene oxide. The epoxy-polyether-modified silicone is preferably a side-chain-modified epoxy-polyether-modified silicone in which a polyether group (preferably a polyether group formed by polymerizing one or both of ethylene oxide and propylene oxide) and an epoxy group are present in the side chain of a silicone (preferably polydimethylsiloxane). Commercially available epoxy-polyether-modified silicones include "SIM768E" manufactured by Momentive Performance Materials, Inc., and "BY16-760," "BY16-870," and "BY16-876" manufactured by Dow-Toray, Inc.

[0022] An example of an embodiment of an amorphous polymer having a Tg of 70° C. or less is polycaprolactone-modified silicone. The polycaprolactone-modified silicone is not particularly limited as long as it is a compound obtained by reacting caprolactone with silicone, which is a polymer compound having a main skeleton formed by siloxane bonds. The polycaprolactone-modified silicone may be a side-chain-modified polycaprolactone-modified silicone, a one-terminal-modified polycaprolactone-modified silicone, or a both-terminal-modified polycaprolactone-modified silicone, with a both-terminal-modified polycaprolactone-modified silicone being preferred. The main skeleton of the polycaprolactone-modified silicone is preferably polydimethylsiloxane. An example of a commercially available polycaprolactone-modified silicone that is a both-terminal-modified polydimethylsiloxane is "DBL-C32" manufactured by Gelest.

[0023] The viscosity of the amorphous polymer having a Tg of 70° C. or less is not particularly limited. From the viewpoint of controlling the elastic modulus of the cured product of the encapsulating resin composition, the viscosity (25° C.) of the amorphous polymer having a Tg of 70° C. or less is preferably 0.5 Pa·s to 300 Pa·s, more preferably 1 Pa·s to 100 Pa·s, and even more preferably 2 Pa·s to 50 Pa·s. The viscosity of an amorphous polymer having a Tg of 70°C or less is a value measured by a method in accordance with JIS K 7233:1986.

[0024] From the viewpoint of controlling the elastic modulus of the cured product of the encapsulating resin composition, the content of the amorphous polymer having a Tg of 70°C or less is preferably 10 parts by mass to 100 parts by mass, more preferably 15 parts by mass to 80 parts by mass, even more preferably 20 parts by mass to 60 parts by mass, and still more preferably 20 parts by mass to 40 parts by mass, relative to 100 parts by mass of the epoxy resin.

[0025] (epoxy resin) The type of epoxy resin is not particularly limited as long as it has an epoxy group in the molecule.

[0026] Specific examples of epoxy resins include novolac epoxy resins (phenol novolac epoxy resins, orthocresol novolac epoxy resins, etc.) obtained by epoxidizing novolac resins obtained by condensing or co-condensing, under an acidic catalyst, at least one phenolic compound selected from the group consisting of phenolic compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, etc., and naphthol compounds such as α-naphthol, β-naphthol, dihydroxynaphthalene, etc., with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, etc.; triphenylmethane epoxy resins obtained by epoxidizing triphenylmethane phenolic resins obtained by condensing or co-condensing, under an acidic catalyst, the above-mentioned phenolic compound with an aromatic aldehyde compound such as benzaldehyde, salicylaldehyde, etc.; and novolac resins obtained by co-condensing, under an acidic catalyst, the above-mentioned phenolic compound and naphthol compound with an aldehyde compound. diphenylmethane-type epoxy resins, which are diglycidyl ethers of bisphenol A, bisphenol F, etc.; biphenyl-type epoxy resins, which are diglycidyl ethers of alkyl-substituted or unsubstituted biphenols; stilbene-type epoxy resins, which are diglycidyl ethers of stilbene-based phenolic compounds; sulfur-containing epoxy resins, which are diglycidyl ethers of bisphenol S, etc.; epoxy resins, which are glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; glycidyl ester-type epoxy resins, which are glycidyl esters of polycarboxylic acids such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; glycidylamine-type epoxy resins, in which the active hydrogen bonded to the nitrogen atom of aniline, diaminodiphenylmethane, isocyanuric acid, etc. is substituted with a glycidyl group; and dicyclopentadiene-type epoxy resins, which are epoxidized co-condensation resins of dicyclopentadiene and phenolic compounds.Alicyclic epoxy resins such as vinylcyclohexene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, and 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane, which are produced by epoxidizing the olefin bonds in the molecule; paraxylylene-modified epoxy resins, which are glycidyl ethers of paraxylylene-modified phenolic resins; metaxylylene-modified epoxy resins, which are glycidyl ethers of metaxylylene-modified phenolic resins; terpene-modified epoxy resins, which are glycidyl ethers of terpene-modified phenolic resins; and dicyclopentadiene-modified phenolic resins, which are glycidyl ethers of dicyclopentadiene-modified phenolic resins. Examples of suitable epoxy resins include pentadiene-modified epoxy resins, cyclopentadiene-modified epoxy resins, which are glycidyl ethers of cyclopentadiene-modified phenolic resins, polycyclic aromatic ring-modified epoxy resins, which are glycidyl ethers of polycyclic aromatic ring-modified phenolic resins, naphthalene-type epoxy resins, which are glycidyl ethers of naphthalene ring-containing phenolic resins, halogenated phenol novolac-type epoxy resins, hydroquinone-type epoxy resins, trimethylolpropane-type epoxy resins, linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids such as peracetic acid, and aralkyl-type epoxy resins obtained by epoxidizing aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins. Epoxidized acrylic resins are also suitable as epoxy resins. These epoxy resins may be used alone or in combination of two or more.

[0027] The epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin is not particularly limited, but from the viewpoint of a balance of various properties such as moldability, reflow resistance, and electrical reliability, it is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq. The epoxy equivalent of the epoxy resin is a value measured by a method in accordance with JIS K 7236:2009.

[0028] When the epoxy resin is solid, the softening point or melting point of the epoxy resin is not particularly limited, but is preferably 40°C to 180°C from the viewpoint of moldability and reflow resistance, and more preferably 50°C to 130°C from the viewpoint of handleability during preparation of the encapsulating resin composition. The melting point or softening point of the epoxy resin is a value measured by differential scanning calorimetry (DSC) or a method in accordance with JIS K 7234:1986 (ring and ball method).

[0029] The mass proportion of the epoxy resin in the total amount of the encapsulating resin composition is preferably 0.5 mass % to 50 mass %, and more preferably 2 mass % to 30 mass %, from the viewpoints of strength, fluidity, heat resistance, moldability, etc.

[0030] (hardening agent) The encapsulating resin composition of the present disclosure contains a curing agent. The type of curing accelerator is not particularly limited. The curing agent preferably contains an active ester compound. In the present disclosure, the active ester compound refers to a compound that has one or more ester groups in one molecule that react with epoxy groups and has the ability to cure epoxy resins.

[0031] The amount of transmission loss that occurs when radio waves transmitted for communication are converted into heat in a dielectric is expressed as the product of frequency, the square root of the relative permittivity, and the dielectric loss tangent. In other words, since the transmission signal is more likely to be converted into heat in proportion to the frequency, the higher the frequency band, the lower the dielectric properties required for communication component materials to suppress transmission loss. In the field of information and communications, radio waves are becoming increasingly higher in frequency as the number of channels and the amount of information transmitted increase. Currently, the practical application of fifth-generation mobile communication systems is progressing worldwide, and several frequency bands in the range of approximately 30 GHz to 70 GHz have been identified as candidates for use. Because wireless communications will become mainstream in the future at such high frequencies, communication component materials are required to have even lower dielectric loss tangents.

[0032] Conventionally, phenolic curing agents, amine curing agents, etc. have generally been used as curing agents for epoxy resins, but secondary hydroxyl groups are generated in the reaction between an epoxy resin and a phenolic curing agent or an amine curing agent. In contrast, ester groups are generated instead of secondary hydroxyl groups in the reaction between an epoxy resin and an active ester compound. Because ester groups have lower polarity than secondary hydroxyl groups, encapsulating resin compositions containing active ester compounds as curing agents can reduce the dielectric tangent of the cured product compared to encapsulating resin compositions containing only curing agents that generate secondary hydroxyl groups. Furthermore, while polar groups in the cured product increase the water absorption of the cured product, the use of an active ester compound as a curing agent can reduce the concentration of polar groups in the cured product, thereby suppressing the water absorption of the cured product. Furthermore, by suppressing the water absorption of the cured product, in other words by suppressing the content of HO, a polar molecule, the dielectric tangent of the cured product can be further reduced.

[0033] The type of active ester compound is not particularly limited as long as it has one or more ester groups in the molecule that react with an epoxy group. Examples of the active ester compound include phenol ester compounds, thiophenol ester compounds, N-hydroxyamine ester compounds, and esterified products of heterocyclic hydroxy compounds.

[0034] Examples of active ester compounds include ester compounds obtained from at least one of an aliphatic carboxylic acid and an aromatic carboxylic acid and at least one of an aliphatic hydroxy compound and an aromatic hydroxy compound. Ester compounds using an aliphatic compound as a polycondensation component tend to have excellent compatibility with epoxy resins due to the presence of an aliphatic chain. Ester compounds using an aromatic compound as a polycondensation component tend to have excellent heat resistance due to the presence of an aromatic ring.

[0035] Specific examples of activated ester compounds include aromatic esters obtained by the condensation reaction of an aromatic carboxylic acid with a phenolic hydroxyl group. Among these, aromatic esters obtained by the condensation reaction of an aromatic carboxylic acid with a phenolic hydroxyl group using a mixture of raw materials: an aromatic carboxylic acid component in which 2 to 4 hydrogen atoms on the aromatic ring of benzene, naphthalene, biphenyl, diphenylpropane, diphenylmethane, diphenylether, diphenylsulfonic acid, etc. are substituted with carboxyl groups; a monohydric phenol in which one hydrogen atom on the aromatic ring is substituted with a hydroxyl group; and a polyhydric phenol in which 2 to 4 hydrogen atoms on the aromatic ring are substituted with a hydroxyl group. That is, aromatic esters having structural units derived from the aromatic carboxylic acid component, structural units derived from the monohydric phenol, and structural units derived from the polyhydric phenol are preferred.

[0036] Specific examples of the active ester compound include an active ester resin having a structure obtained by reacting a phenolic resin having a molecular structure in which phenolic compounds are linked via alicyclic hydrocarbon groups with an aromatic dicarboxylic acid or its halide and an aromatic monohydroxy compound, as described in JP 2012-246367 A. As the active ester resin, a compound represented by the following structural formula (1) is preferred.

[0037] [ka]

[0038] In structural formula (1), R 1 represents an alkyl group having 1 to 4 carbon atoms; X represents a benzene ring, a naphthalene ring, a benzene ring or a naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms, or a biphenyl group; Y represents a benzene ring, a naphthalene ring, or a benzene ring or a naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms; k is 0 or 1; and n represents the average number of repetitions and is 0.25 to 1.5.

[0039] Specific examples of the compound represented by structural formula (1) include the following exemplary compounds (1-1) to (1-10): In the structural formula, t-Bu is a tert-butyl group.

[0040] [ka]

[0041] [ka]

[0042] Other specific examples of the active ester compound include a compound represented by the following structural formula (2) and a compound represented by the following structural formula (3), which are described in JP 2014-114352 A.

[0043] [ka]

[0044] In structural formula (2), R 1 and R 2 are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms; Z is an ester-forming structural moiety (z1) selected from the group consisting of a benzoyl group, a naphthoyl group, a benzoyl group or a naphthoyl group substituted with an alkyl group having 1 to 4 carbon atoms, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom (z2); and at least one of Z is an ester-forming structural moiety (z1).

[0045] In structural formula (3), R 1 and R 2 are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms; Z is an ester-forming structural moiety (z1) selected from the group consisting of a benzoyl group, a naphthoyl group, a benzoyl group or a naphthoyl group substituted with an alkyl group having 1 to 4 carbon atoms, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom (z2); and at least one of Z is an ester-forming structural moiety (z1).

[0046] Specific examples of the compound represented by structural formula (2) include the following exemplary compounds (2-1) to (2-6).

[0047] [ka]

[0048] Specific examples of the compound represented by structural formula (3) include the following exemplary compounds (3-1) to (3-6).

[0049] [ka]

[0050] Commercially available active ester compounds may be used. Examples of commercially available active ester compounds include active ester compounds containing a dicyclopentadiene-type diphenol structure such as "EXB9451," "EXB9460," "EXB9460S," and "HPC-8000-65T" (manufactured by DIC Corporation); active ester compounds containing an aromatic structure such as "EXB9416-70BK," "EXB-8," and "EXB-9425" (manufactured by DIC Corporation); active ester compounds containing an acetylated phenol novolac such as "DC808" (manufactured by Mitsubishi Chemical Corporation); and active ester compounds containing a benzoylated phenol novolac such as "YLH1026" (manufactured by Mitsubishi Chemical Corporation).

[0051] The active ester compounds may be used alone or in combination of two or more.

[0052] The ester equivalent of the active ester compound is not particularly limited, but from the viewpoint of a balance of various properties such as moldability, reflow resistance, and electrical reliability, it is preferably 150 g / eq to 400 g / eq, more preferably 170 g / eq to 300 g / eq, and even more preferably 200 g / eq to 250 g / eq. The ester equivalent of the active ester compound is a value measured by a method in accordance with JIS K 0070:1992.

[0053] The equivalent ratio of the epoxy resin to the active ester compound (ester group / epoxy group) is preferably 0.9 or more, more preferably 0.95 or more, and even more preferably 0.97 or more, from the viewpoint of keeping the dielectric loss tangent of the cured product low. The equivalent ratio (ester group / epoxy group) of the epoxy resin to the active ester compound is preferably 1.1 or less, more preferably 1.05 or less, and even more preferably 1.03 or less, from the viewpoint of minimizing the amount of unreacted active ester compound.

[0054] The curing agent may contain other curing agents in addition to the active ester compound. In this case, the type of other curing agent is not particularly limited and can be selected depending on the desired properties of the encapsulating resin composition. Examples of other curing agents include phenol curing agents, amine curing agents, acid anhydride curing agents, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, and blocked isocyanate curing agents.

[0055] Specific examples of the phenolic curing agent include polyhydric phenolic compounds such as resorcinol, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenols; novolak-type phenolic resins obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenolic compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, and aminophenol, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene, with an aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde, under an acidic catalyst; and copolymers of the above phenolic compounds with dimethoxyparaxylene, bis(methoxymethyl)biphenyl, and the like. Examples of suitable phenol curing agents include aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins synthesized from alkyl phenols such as paraxylylene-modified phenolic resins and metaxylylene-modified phenolic resins, melamine-modified phenolic resins, terpene-modified phenolic resins, dicyclopentadiene-type phenolic resins and dicyclopentadiene-type naphthol resins synthesized by copolymerization of the above phenolic compounds with dicyclopentadiene, cyclopentadiene-modified phenolic resins, polycyclic aromatic ring-modified phenolic resins, biphenyl-type phenolic resins, triphenylmethane-type phenolic resins obtained by condensation or co-condensation of the above phenolic compounds with aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde under an acidic catalyst, and phenolic resins obtained by copolymerization of two or more of these. These phenolic curing agents may be used alone or in combination of two or more.

[0056] The functional group equivalent of other curing agents (hydroxyl group equivalent in the case of phenolic curing agents) is not particularly limited, but from the viewpoint of the balance of various properties such as moldability, reflow resistance, and electrical reliability, it is preferably 70 g / eq to 1000 g / eq, and more preferably 80 g / eq to 500 g / eq. The functional group equivalent weight of other curing agents (hydroxyl group equivalent weight in the case of phenolic curing agents) is the value measured by a method in accordance with JIS K 0070:1992.

[0057] The softening point or melting point of the curing agent is not particularly limited, but is preferably 40°C to 180°C from the viewpoint of moldability and reflow resistance, and more preferably 50°C to 160°C from the viewpoint of handleability during production of the encapsulating resin composition.

[0058] The melting point or softening point of the curing agent is a value measured in the same manner as the melting point or softening point of the epoxy resin.

[0059] The equivalent ratio between the epoxy resin and all curing agents (active ester compound and other curing agents), i.e., the ratio of the number of functional groups in the curing agent to the number of functional groups in the epoxy resin (number of functional groups in the curing agent / number of functional groups in the epoxy resin), is not particularly limited. From the viewpoint of minimizing unreacted components, it is preferably set in the range of 0.5 to 2.0, more preferably in the range of 0.6 to 1.3. From the viewpoint of moldability and reflow resistance, it is even more preferably set in the range of 0.8 to 1.2.

[0060] The mass proportion of the active ester compound in the total amount of the active ester compound and other curing agents is preferably 80 mass % or more, more preferably 85 mass % or more, and even more preferably 90 mass % or more, from the viewpoint of keeping the dielectric loss tangent of the cured product low.

[0061] The total mass proportion of the epoxy resin and the active ester compound in the total amount of the epoxy resin, the active ester compound, and other curing agents is preferably 80 mass % or more, more preferably 85 mass % or more, and even more preferably 90 mass % or more, from the viewpoint of keeping the dielectric loss tangent of the cured product low.

[0062] (curing accelerator) The encapsulating resin composition of the present disclosure may contain a curing accelerator. The type of curing accelerator is not particularly limited and can be selected depending on the type of epoxy resin or curing agent, the desired properties of the encapsulating resin composition, and the like.

[0063] Examples of the curing accelerator include diazabicycloalkenes such as 1,5-diazabicyclo[4.3.0]nonene-5 (DBN) and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), cyclic amidine compounds such as 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 2-heptadecylimidazole; derivatives of the cyclic amidine compounds; phenol novolac salts of the cyclic amidine compounds or their derivatives; and the addition of maleic anhydride, 1,4-benzoquinone, 2,5- Quinone compounds such as toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, and phenyl-1,4-benzoquinone; compounds with intramolecular polarization formed by adding compounds with π bonds such as diazophenylmethane; tetraphenylborate salt of DBU, tetraphenylborate salt of DBN, tetraphenylborate salt of 2-ethyl-4-methylimidazole, and tetraphenylborate of N-methylmorpholine. cyclic amidinium compounds such as salts; tertiary amine compounds such as pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; derivatives of the above tertiary amine compounds; ammonium salt compounds such as tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, and tetrapropylammonium hydroxide; tertiary phosphines such as triphenylphosphine, diphenyl(p-tolyl)phosphine, tris(alkylphenyl)phosphine, tris(alkoxyphenyl)phosphine, tris(alkylalkoxyphenyl)phosphine, tris(dialkylphenyl)phosphine, tris(trialkylphenyl)phosphine, tris(tetraalkylphenyl)phosphine, tris(dialkoxyphenyl)phosphine, tris(trialkoxyphenyl)phosphine, tris(tetraalkoxyphenyl)phosphine, trialkylphosphine, dialkylarylphosphine, and alkyldiarylphosphine;Phosphine compounds such as complexes of the above-mentioned tertiary phosphines and organoborons; compounds having intramolecular polarization obtained by adding the above-mentioned tertiary phosphines or the above-mentioned phosphine compounds to maleic anhydride, quinone compounds such as 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, and phenyl-1,4-benzoquinone, and compounds having a π bond such as diazophenylmethane; complexes of the above-mentioned tertiary phosphines or the above-mentioned phosphine compounds to 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-iodophenol, 3-iodophenol, 2-iodophenol, 4-bromophenol, Examples of compounds having intramolecular polarization include compounds obtained by reacting halogenated phenol compounds such as 2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo-3,5-dimethylphenol, 4-bromo-2,6-di-tert-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, and 4-bromo-4'-hydroxybiphenyl, followed by a dehydrohalogenation process; tetra-substituted phosphonium compounds such as tetraphenylphosphonium compounds, and tetra-substituted phosphonium and tetra-substituted borates having no phenyl group bonded to the boron atom, such as tetra-p-tolylborate; salts of tetraphenylphosphonium compounds with phenol compounds; and salts of tetraalkylphosphonium compounds with partial hydrolysates of aromatic carboxylic acid anhydrides.

[0064] When the encapsulating resin composition of the present disclosure contains a curing accelerator, the amount thereof is preferably 0.1 to 30 parts by mass, and more preferably 1 to 15 parts by mass, per 100 parts by mass of the resin component (total amount of epoxy resin and curing agent). When the amount of the curing accelerator is 0.1 part by mass or more per 100 parts by mass of the resin component, the composition tends to cure well in a short time. When the amount of the curing accelerator is 30 parts by mass or less per 100 parts by mass of the resin component, the curing speed is not too fast, and a good molded product tends to be obtained.

[0065] (Inorganic filler) The encapsulating resin composition of the present disclosure contains an inorganic filler. The type of inorganic filler is not particularly limited. Specific examples include inorganic materials such as fused silica, crystalline silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, fosterite, steatite, spinel, mullite, titania, talc, clay, and mica. An inorganic filler having a flame-retardant effect may also be used. Examples of the inorganic filler having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as a composite hydroxide of magnesium and zinc, and zinc borate.

[0066] Among inorganic fillers, silica such as fused silica is preferred from the viewpoint of reducing the linear expansion coefficient, and alumina is preferred from the viewpoint of high thermal conductivity. One type of inorganic filler may be used alone, or two or more types may be used in combination. The inorganic filler may be in the form of powder, beads obtained by sphericizing powder, fiber, etc.

[0067] When the inorganic filler is particulate, its average particle size is not particularly limited. For example, the average particle size is preferably 0.2 μm to 100 μm, and more preferably 0.5 μm to 50 μm. When the average particle size is 0.2 μm or more, the increase in viscosity of the encapsulating resin composition tends to be further suppressed. When the average particle size is 100 μm or less, the filling property tends to be further improved. The average particle size of the inorganic filler is determined as the volume average particle size (D50) using a laser scattering diffraction particle size distribution analyzer.

[0068] From the viewpoint of controlling the elastic modulus of the cured product of the encapsulating resin composition, the content of the inorganic filler contained in the encapsulating resin composition of the present disclosure is preferably 60 vol% to 82 vol%, more preferably 62 vol% to 80 vol%, even more preferably 65 vol% to 80 vol%, and still more preferably 65 vol% to 78 vol%, of the total encapsulating resin composition.

[0069] The volume ratio of the inorganic filler in the encapsulating resin composition can be determined by the following method. A thin sample of the encapsulating resin composition or its cured product is imaged using a scanning electron microscope (SEM). An arbitrary area S is identified in the SEM image, and the total area A of the inorganic filler contained in area S is calculated. The total area A of the inorganic filler is divided by area S, and the resulting value is converted into a percentage (%), which is the volume ratio of the inorganic filler to the encapsulating resin composition. The area S is set to be sufficiently large relative to the size of the inorganic filler. For example, the area S is set to be large enough to contain 100 or more inorganic fillers. The area S may be the total area of ​​a plurality of cut surfaces. The inorganic filler may have a bias in its presence ratio in the direction of gravity when the encapsulating resin composition is cured. In such a case, when imaging with an SEM, the entire cured product in the direction of gravity is imaged, and the area S that includes the entire cured product in the direction of gravity is determined.

[0070] [Various additives] In addition to the above-described components, the encapsulating resin composition of the present disclosure may contain various additives such as a coupling agent, an ion exchanger, a release agent, a flame retardant, and a colorant, as exemplified below. The encapsulating resin composition may also contain various additives known in the art, as needed, in addition to the additives exemplified below.

[0071] (coupling agent) The encapsulating resin composition may contain a coupling agent. From the viewpoint of improving the adhesion between the resin component and the inorganic filler, the encapsulating resin composition preferably contains a coupling agent. Examples of the coupling agent include known coupling agents such as silane-based compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, vinylsilane, and disilazane, titanium-based compounds, aluminum chelate compounds, and aluminum / zirconium-based compounds.

[0072] When the resin composition for sealing contains a coupling agent, the amount of the coupling agent is preferably 0.05 to 5 parts by mass, more preferably 0.1 to 2.5 parts by mass, based on 100 parts by mass of the inorganic filler. When the amount of the coupling agent is 0.05 parts by mass or more based on 100 parts by mass of the inorganic filler, the adhesion to the frame tends to be further improved. When the amount of the coupling agent is 5 parts by mass or less based on 100 parts by mass of the inorganic filler, the moldability of the package tends to be further improved.

[0073] (Ion exchanger) The resin composition for sealing may contain an ion exchanger. The resin composition for sealing preferably contains an ion exchanger from the viewpoint of improving the moisture resistance and high-temperature storage characteristics of an electronic component device including the element to be sealed. The ion exchanger is not particularly limited, and a conventionally known one can be used. Specifically, hydrotalcite compounds, and hydrated oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium, and bismuth can be mentioned. The ion exchanger may be used alone or in combination of two or more. Among them, hydrotalcite represented by the following general formula (A) is preferable.

[0074] Mg (1-X) Al X (OH)2(CO3) X / 2 ·mH2O ……(A) (0 < X ≦ 0.5, m is a positive number)

[0075] When the resin composition for sealing contains an ion exchanger, its content is not particularly limited as long as it is an amount sufficient to capture ions such as halogen ions. For example, it is preferably 0.1 to 30 parts by mass, more preferably 1 to 10 parts by mass, based on 100 parts by mass of the resin component (total amount of epoxy resin and curing agent).

[0076] (Release agent) The encapsulating resin composition may contain a mold release agent from the viewpoint of obtaining good releasability from the mold during molding. There are no particular limitations on the mold release agent, and conventionally known ones can be used. Specific examples include carnauba wax, higher fatty acids such as montanic acid and stearic acid, higher fatty acid metal salts, ester waxes such as montanic acid esters, and polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene. One type of mold release agent may be used alone, or two or more types may be used in combination.

[0077] When the encapsulating resin composition contains a release agent, the amount thereof is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass, per 100 parts by mass of the resin component (total amount of epoxy resin and curing agent). When the amount of the release agent is 0.01 part by mass or more per 100 parts by mass of the resin component, sufficient release properties tend to be obtained. When the amount is 10 parts by mass or less, better adhesion tends to be obtained.

[0078] (Flame retardant) The encapsulating resin composition may contain a flame retardant. The flame retardant is not particularly limited, and conventionally known flame retardants can be used. Specific examples include organic or inorganic compounds containing halogen atoms, antimony atoms, nitrogen atoms, or phosphorus atoms, and metal hydroxides. The flame retardants may be used alone or in combination of two or more.

[0079] When the encapsulating resin composition contains a flame retardant, the amount thereof is not particularly limited as long as it is an amount sufficient to obtain the desired flame retardant effect. For example, the amount is preferably 1 to 30 parts by mass, more preferably 2 to 20 parts by mass, per 100 parts by mass of the resin component (total amount of epoxy resin and curing agent).

[0080] (coloring agent) The encapsulating resin composition may contain a colorant. Examples of the colorant include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, red lead, and red iron oxide. The content of the colorant can be appropriately selected depending on the purpose, etc. The colorant may be used alone or in combination of two or more.

[0081] (Method for preparing encapsulating resin composition) The method for preparing the encapsulating resin composition is not particularly limited. A typical method includes thoroughly mixing predetermined amounts of components using a mixer or the like, melt-kneading the mixture using a mixing roll, extruder, or the like, cooling, and pulverizing the mixture. More specifically, a method includes uniformly stirring and mixing predetermined amounts of the components described above, kneading the mixture using a kneader, roll, extruder, or the like that has been preheated to 70°C to 140°C, cooling, and pulverizing the mixture.

[0082] The encapsulating resin composition is preferably solid at room temperature and normal pressure (for example, 25°C, atmospheric pressure). When the encapsulating resin composition is solid, its shape is not particularly limited, and examples thereof include powder, granules, tablets, etc. When the encapsulating resin composition is in tablet form, it is preferable that the dimensions and mass of the tablet-shaped encapsulating resin composition be such that they are suitable for the molding conditions of the package, from the viewpoint of ease of handling.

[0083] <Electronic component equipment> The electronic component device of the present disclosure is manufactured using wafer level packaging (WLP). That is, the electronic component device of the present disclosure is manufactured by mounting a plurality of elements (active elements such as semiconductor chips, transistors, diodes, and thyristors, and passive elements such as capacitors, resistors, and coils) on a wafer, encapsulating the elements together with an encapsulating resin composition, and then dividing the encapsulated elements into individual pieces. The WLP may be a fan-out wafer level package (FOWLP) or a fan-in wafer level package (FIWLP, also known as a wafer-level chip size package (WLCSP)). An example of an embodiment of an electronic component device according to the present disclosure includes a support member, an element disposed on the support member, and a cured product of the encapsulating resin composition according to the present disclosure encapsulating the element.

[0084] <Electronic component device manufacturing method> The method for manufacturing an electronic component device according to the present disclosure includes the steps of arranging a plurality of elements on a wafer, collectively encapsulating the plurality of elements with the encapsulating resin composition according to the present disclosure, and singulating the encapsulated elements into individual pieces. That is, the method for manufacturing an electronic component device according to the present disclosure is a manufacturing method including wafer-level packaging.

[0085] The method for carrying out each of the above steps is not particularly limited and can be carried out by a general method. In addition, the types of wafers and elements used for manufacturing electronic component devices are not particularly limited and wafers and elements generally used for manufacturing electronic component devices can be used.

[0086] The wafer material used in WLP is usually a crystal of a semiconductor material, and is generally a silicon single crystal. The size of the wafer is not particularly limited, but is, for example, 6 to 12 inches in diameter, and preferably 10 to 12 inches in diameter.

[0087] Examples of methods for encapsulating elements using the encapsulating resin composition of the present disclosure include transfer molding, compression molding, and injection molding. [Example]

[0088] The above-described embodiment will be specifically described below using examples, but the scope of the above-described embodiment is not limited to these examples.

[0089] <Preparation of encapsulating resin composition> The encapsulating resin compositions of Examples and Comparative Examples were prepared by mixing the components shown below in the blending ratios (parts by mass) shown in Table 1. This encapsulating resin composition was solid at room temperature and normal pressure.

[0090] Epoxy resin 1: Triphenylmethane type epoxy resin, epoxy equivalent weight 167g / eq (Mitsubishi Chemical Corporation, product name "1032H60") Epoxy resin 2: Biphenyl type epoxy resin, epoxy equivalent weight 192g / eq (Mitsubishi Chemical Corporation, product name "YX-4000") Epoxy resin 3: Biphenyl aralkyl epoxy resin, epoxy equivalent 274g / eq (Nippon Kayaku Co., Ltd., product name "NC-3000")

[0091] Polymer 1: Epoxy-polyether modified silicone, amorphous polymer, Tg≦25℃, liquid (Momentive Performance Materials, product name "SIM768E") Polymer 2: Epoxy-polyether modified silicone, amorphous polymer, Tg≦25℃, liquid (Dow Toray Industries, Inc., product name "BY16-876") Polymer 3: Polycaprolactone-modified dimethyl silicone, amorphous polymer, Tg 55°C (Gelest, product name "DBL-C32") Polymer 4: Silicone resin, amorphous polymer, Tg 80°C (Dow Toray Industries, Inc., product name "AY42-119")

[0092] Active ester compound 1: DIC Corporation, product name "EXB-8" Phenol hardener 1: Biphenyl aralkyl resin, hydroxyl equivalent 275g / eq (Meiwa Kasei Co., Ltd., product name "MEH7851SS")

[0093] Curing accelerator 1: Triphenylphosphine / 1,4-benzoquinone adduct Curing accelerator 2: 2-ethyl-4-methylimidazole Inorganic filler: fused silica (DENKA, product name "FB9454FC", volume average particle size 10 μm) Coupling agent 1: 3-methacryloxypropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., product name "KBM-503") Release agent: Montan acid ester wax (Clariant Japan Co., Ltd., product name "HW-E") Colorant: Carbon black (Mitsubishi Chemical Corporation, product name "MA600")

[0094] Cured test pieces were prepared from the encapsulating resin compositions of each Example and Comparative Example, and the elastic modulus, glass transition temperature, and linear expansion coefficients (CLE1 and CLE2) were measured. The results are shown in Table 1.

[0095] <Performance evaluation of encapsulating resin composition> (molding warpage) A mold and release film were prepared for compression molding a laminate in which a 200 μm-thick cured resin product was laminated on a 12-inch diameter silicon wafer. Using this mold, release film, 12-inch diameter silicon wafer, and encapsulating resin composition, a laminate in which a cured product of the encapsulating resin composition was laminated on a silicon wafer was molded under conditions of a mold temperature of 175°C, a molding pressure of 7 MPa, and a curing time of 300 seconds. The laminate was measured for molding warpage using a shadow moire measuring device (TherMoireAXP, manufactured by Akrometrix), with 2.0 mm or less being within the allowable range.

[0096] (Fluidity: Spiral flow) Using a spiral flow measurement mold conforming to EMMI-1-66, the encapsulating resin composition was molded under conditions of a mold temperature of 180°C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds, and the flow distance (cm) was determined.

[0097] (relative permittivity and dielectric loss tangent) The encapsulating resin composition was loaded into a vacuum hand press and molded under conditions of a mold temperature of 175°C, molding pressure of 6.9 MPa, and curing time of 600 seconds. Post-curing was performed at 180°C for 6 hours to obtain a plate-shaped cured product (12.5 mm long, 25 mm wide, 0.2 mm thick). This plate-shaped cured product was used as a test specimen and its relative permittivity and dielectric loss tangent were measured at a temperature of 25±3°C and approximately 60 GHz using a dielectric constant measurement device (Agilent Technologies, product name "Network Analyzer N5227A").

[0098] [Table 1]

[0099] The encapsulating resin compositions of Examples suppressed molding warpage more than the encapsulating resin compositions of Comparative Examples.

[0100] All publications, patent applications, and technical standards mentioned in this specification are herein incorporated by reference to the same extent as if each individual publication, patent application, or technical standard was specifically and individually indicated to be incorporated by reference. The disclosure of Japanese Application No. 2020-009046, filed on January 23, 2020, is incorporated herein by reference in its entirety.

Claims

1. The composition contains an epoxy resin, a curing agent, an inorganic filler, and an amorphous polymer having a glass transition temperature of 70°C or less, the amorphous polymer comprises at least one selected from the group consisting of epoxy-polyether-modified silicone and polycaprolactone-modified silicone, the elastic modulus of the cured product of the encapsulating resin composition at a temperature of 25°C is 18 GPa or less, the glass transition temperature of the cured product of the encapsulating resin composition is 100°C or higher and 160°C or lower, the linear expansion coefficient of the cured product of the encapsulating resin composition between a temperature of 25°C and the glass transition temperature is 10 x 10 -6 / K or more; An encapsulating resin composition for use in wafer-level packaging.

2. The encapsulating resin composition according to claim 1 , wherein the content of the inorganic filler is 65% by volume or more and 80% by volume or less with respect to the entire encapsulating resin composition.

3. The encapsulating resin composition according to claim 1 or 2, wherein the curing agent comprises an active ester compound.

4. A support member; an element disposed on the support member; a cured product of the encapsulating resin composition according to any one of claims 1 to 3 that encapsulates the element; and An electronic component device comprising:

5. disposing a plurality of devices on a wafer; a step of collectively encapsulating the plurality of elements with the encapsulating resin composition according to any one of claims 1 to 3; a step of singulating each encapsulated element; A method for manufacturing an electronic component device, comprising:

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