Method for manufacturing resin components for electronic device manufacturing processes

Abstract

Provided is a method for producing a resin member for a production process of electronic devices which makes it possible to suppress, for a long period of time, adhesion of an adhering substance on a surface. A method for producing a resin member according to the present invention that is used in a production process of electronic devices comprises a processing step of carrying out abrasive machining of the surface of a raw member so that the surface roughness Ra becomes not more than 100 nm and the contact angle of pure water with respect to the surface becomes not less than 70° to less than 110°.

Description

[Technical Field]

[0001] The present invention relates to a method for producing a resin member for use in an electronic device manufacturing process. [Background technology]

[0002] Resins are used in a variety of applications due to their processability, water repellency, oil repellency, low friction, chemical resistance, corrosion resistance, insulating properties, etc. In particular, in the manufacturing process of electronic devices, wet processes using chemicals and processing fluids, such as cleaning, polishing, and plating, are frequently performed, and therefore resins are preferably used as materials for piping components, bathtubs, etc., from the viewpoint of chemical resistance and corrosion resistance.

[0003] When resin components are used in the manufacturing process of electronic devices, dust may be generated from the surface of the resin component or the attached matter may be detached from the surface of the resin component, which may contaminate the electronic device, thereby reducing the electrical properties of the manufactured electronic device and the yield. Examples of the attached matter that may be generated on the surface of the resin component include contaminants derived from the processing liquid that have adhered to and accumulated on the surface of the resin component. Therefore, it is necessary to suppress the generation of dust from the surface of the resin component and the detachment of the attached matter from the surface of the resin component for a long period of time.

[0004] Conventionally, resin members having a surface roughness Ra (surface smoothness) ranging from submicrons to several tens of nanometers have been used (see, for example, Patent Document 1). However, simply controlling the surface roughness Ra of a resin member is difficult to sufficiently prevent dust generation from the surface of the resin member or detachment of deposits attached to the surface of the resin member over a long period of time, and further improvements have been required. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 293069, 1994 Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present invention is to provide a method for producing a resin member for use in an electronic device manufacturing process, which is capable of preventing adhesion of deposits to the surface for a long period of time. [Means for solving the problem]

[0007] After extensive research, the inventors discovered that by applying abrasive processing to the surface of a resin component to reduce surface roughness and by setting a specific contact angle, it is possible to prevent deposits from adhering to the surface of the resin component for a long period of time, and thus completed the present invention. That is, one embodiment of the present invention provides a method for manufacturing a resin component for use in an electronic device manufacturing process, which is a method for manufacturing a resin component used in a process for manufacturing an electronic device, and includes a processing step in which the surface of the raw component is subjected to abrasive processing to achieve a surface roughness Ra of 100 nm or less and a contact angle of pure water with the surface of 70° or more and less than 110°. [Effects of the Invention]

[0008] According to the present invention, it is possible to obtain a resin member for use in an electronic device manufacturing process that is capable of preventing adhesion of deposits to its surface for a long period of time. DETAILED DESCRIPTION OF THE INVENTION

[0009] An embodiment of the present invention will be described in detail. Note that the following embodiment shows an example of the present invention, and the present invention is not limited to this embodiment. Furthermore, various modifications and improvements can be made to the following embodiment, and such modifications and improvements can also be included in the present invention.

[0010] <Electronic device manufacturing process> The method for producing a resin member for use in an electronic device manufacturing process according to this embodiment is a method for producing a resin member used in a process for manufacturing an electronic device, but the type of electronic device is not particularly limited, and examples include semiconductor devices, hard disks, sensors, photomasks, MEMS (Micro Electro Mechanical Systems), and Micro LEDs (Light Emitting Diodes). Among these, in the processes for manufacturing semiconductor devices and hard disks, even small amounts of contamination can have a significant impact on yield, so it is preferable to use the resin member for use in an electronic device manufacturing process according to this embodiment in these processes.

[0011] The type of electronic device manufacturing process is not particularly limited, and examples include wet processes such as polishing, cleaning, photolithography, plating, anodization, etc. Among these, polishing, cleaning, and photolithography are processes that are sensitive to contamination, and contamination has a significant impact on yield, so it is suitable to use the resin member for an electronic device manufacturing process according to this embodiment in these processes.

[0012] Furthermore, the resin member for electronic device manufacturing processes according to this embodiment is used in a process for manufacturing an electronic device, and is particularly suitable for use in an electronic device manufacturing process in which the surface of the resin member for electronic device manufacturing processes is kept wet when the resin member for electronic device manufacturing processes is used in the electronic device manufacturing process.

[0013] Examples of cases in which the surface of a resin member for an electronic device manufacturing process is kept wet include cases in which the resin member for an electronic device manufacturing process is used in a state in which it is partially or entirely immersed in a liquid such as pure water, a solution, etc., or in a state in which it is used in a state in which it is partially or entirely in contact with a liquid such as pure water, a solution, etc. Among these cases, cases in which the resin member for an electronic device manufacturing process is used in a state in which it is entirely immersed in a liquid such as pure water, a solution, etc., and cases in which it is used in a state in which it is entirely in contact with a liquid such as pure water, a solution, etc. are more preferred.

[0014] <Resin parts> The type of resin used to form the resin component for the electronic device manufacturing process according to this embodiment is not particularly limited, but is preferably a resin with high water repellency, such as fluororesin, polyphenylene sulfide (PPS), or polyether ether ketone (PEEK).

[0015] Examples of fluororesins include fully fluorinated resins such as polytetrafluoroethylene (PTFE), partially fluorinated resins such as polychlorotrifluoroethylene (PCTFE), polyvinylidene fluoride (PVDF), and polyvinyl fluoride (PVF), and fluorinated resin copolymers such as perfluoroalkoxy resin (PFA), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), ethylene-tetrafluoroethylene copolymer (ETFE), and ethylene-chlorotrifluoroethylene copolymer (ECTFE).

[0016] Furthermore, the method for preparing (manufacturing) the raw material (resin component before abrasive processing) of the resin component for the electronic device manufacturing process according to this embodiment is not particularly limited, but examples include mechanical processing such as cutting and grinding, molding processing such as injection molding, film formation processing, and coating processing.

[0017] <Processing process (abrasive processing method)> The abrasive processing method for the raw material in the method for manufacturing a resin component for an electronic device manufacturing process according to this embodiment is not particularly limited, but examples include processing using fixed abrasives such as sandpaper, resin-bonded pellets, metal-bonded pellets, and electroplated grinding wheels, and polishing (CMP) using free abrasives.

[0018] In the final finishing of resin parts, polishing using free abrasive grains is preferably applied, whereas in the processing before the final finishing (pre-processing), processing using fixed abrasive grains may be applied. The method for manufacturing a resin component for an electronic device manufacturing process according to this embodiment can be applied to any surface properties (e.g., surface roughness) of the resin component before abrasive processing, but is particularly preferably applied to resin components having a surface roughness Ra of 100 nm or more before abrasive processing.

[0019] The mechanism by which abrasive processing improves anti-fouling properties is not entirely clear, but it is speculated as follows: Possible causes of contamination of electronic devices from the surfaces of resin components include: (1) the high contact angle of the resin component surfaces makes them highly water-repellent. Therefore, during the wet processes used in electronic device manufacturing, contaminants from the processing fluid adhere to the surface of the resin component and are unable to be washed away by the dispersion medium. This makes the contaminants more likely to remain on the surface of the resin component, which then detaches from the surface of the resin component and becomes a source of contamination; (2) the softness of resin components makes the surface of the resin component prone to scratches during molding, cutting, coating, and other processes. Various types of contaminants that are difficult to remove adhere and remain on the scratched areas, which then detach from the surface of the resin component and become a source of contamination during the electronic device manufacturing process; and (3) the high surface roughness of resin components causes dust to be generated at the protruding portions, which then become a source of contamination.

[0020] It is believed that the high contact angle on the surface of a resin component is due to the highly bonded state of the atoms on the surface of the resin after molding, and that abrasive processing of the surface of the resin component moderately breaks the surface bonds and adjusts the contact angle to a specific value, (2) abrasive processing is effective in removing various contaminants that adhere to the surface of the resin component during molding, cutting, coating, etc., and (3) abrasive processing can smooth the surface of the resin component, thereby suppressing dust generation from the convex parts on the surface of the resin component, thereby improving the antifouling properties. Note that the above mechanism is based on speculation, and whether it is correct or incorrect does not affect the technical scope of the present invention.

[0021] <Abrasive grain> The abrasive grains used in abrasive processing serve to mechanically polish the resin member (raw material) that is the object to be polished. The type of abrasive grain is not particularly limited, but examples include particles made of at least one of oxides of silicon and metal elements, such as alumina, silica, cerium oxide, zirconia, titania, iron oxide, and manganese oxide. Among these, alumina and silica are preferred, with alumina being most preferred. The alumina may be any of α-alumina, δ-alumina, θ-alumina, κ-alumina, and amorphous alumina, with α-alumina being most preferred.

[0022] The volume-based average secondary particle diameter of the abrasive grains (hereinafter sometimes referred to as "D50") is not particularly limited, but is preferably 0.01 μm or more, more preferably 0.03 μm or more, even more preferably 0.05 μm or more, even more preferably 0.1 μm or more, even more preferably 0.3 μm or more, and most preferably 0.5 μm or more. Within this range, a high polishing rate can be achieved. Furthermore, the volume-based average secondary particle diameter of the abrasive grains is preferably 3 μm or less, more preferably 2 μm or less, and even more preferably 1.5 μm or less. Within this range, the surface properties of the resin member are improved. In the present invention, the volume-based average secondary particle diameter refers to the cumulative median value measured using a laser diffraction / scattering particle size distribution analyzer.

[0023] The 10% particle size in the cumulative particle size distribution on a volume basis of the abrasive grains (the particle size at which the cumulative frequency from the small particle size side is 10%, hereinafter sometimes referred to as "D10") is not particularly limited, but is preferably 0.005 μm or more, more preferably 0.01 μm or more, even more preferably 0.02 μm or more, even more preferably 0.05 μm or more, even more preferably 0.2 μm or more, and most preferably 0.4 μm or more. Within this range, a high polishing rate can be achieved. Furthermore, D10 is preferably 2 μm or less, more preferably 1.5 μm or less, even more preferably 1.0 μm or less, and most preferably 0.8 μm or less. Within this range, the surface quality of the resin member will be good.

[0024] The 90% particle size in the cumulative particle size distribution on a volume basis of the abrasive grains (the particle size at which the cumulative frequency from the small particle size side is 90%, hereinafter sometimes referred to as "D90") is not particularly limited, but is preferably 0.02 μm or more, more preferably 0.04 μm or more, even more preferably 0.1 μm or more, even more preferably 0.3 μm or more, even more preferably 0.6 μm or more, particularly preferably 1.0 μm or more, and most preferably 1.3 μm or more. Within this range, a high polishing rate can be achieved. Furthermore, D90 is preferably 8 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. Within this range, the surface quality of the resin member will be good.

[0025] The ratio of D90 to D50 of the abrasive grains (D90 / D50) is not particularly limited, but is preferably 1.1 or more, more preferably 1.2 or more, and even more preferably 1.3 or more. Within this range, a high polishing rate can be achieved. Furthermore, D90 / D50 is preferably 3.0 or less, more preferably 2.5 or less, and even more preferably 2.2 or less. Within this range, the surface quality of the resin member can be improved.

[0026] The ratio of D90 to D10 of the abrasive grains (D90 / D10) is not particularly limited, but is preferably 1.2 or more, more preferably 1.5 or more, and even more preferably 2.0 or more. Within this range, a high polishing rate can be achieved. Furthermore, D90 / D10 is preferably 7.0 or less, more preferably 6.0 or less, and even more preferably 5.0 or less. Within this range, the surface quality of the resin member will be good.

[0027] The ratio of D50 to D10 of the abrasive grains (D50 / D10) is not particularly limited, but is preferably 1.1 or more, more preferably 1.2 or more, and even more preferably 1.3 or more. Within this range, a high polishing rate can be achieved. Furthermore, D50 / D10 is preferably 3.0 or less, more preferably 2.5 or less, and even more preferably 2.2 or less. Within this range, the surface quality of the resin member can be improved.

[0028] The BET specific surface area of ​​the abrasive grains is not particularly limited, but is preferably 5 m 2 / g or more is preferable, and 10m 2 / g or more is more preferable, and 15m 2 / g or more is more preferable. The BET specific surface area of ​​the abrasive grains is 250 m 2 / g or less is preferable, and 100m 2 / g or less is more preferable, and 50m 2 / g or less is more preferable, and 25m 2 / g or less is most preferable. Within this range, a high polishing rate can be achieved while maintaining a good surface shape. The BET specific surface area can be measured using, for example, a FlowSorb II 2300 manufactured by Micromeritics. In measuring the BET specific surface area, nitrogen, argon, krypton, etc. can be used as the gas to be adsorbed by the free abrasive grains.

[0029] The shape of the abrasive grains is not particularly limited, and examples thereof include spherical, elliptical, cocoon-shaped, crushed, angular, etc. Among these, from the viewpoint of improving the processing speed, elliptical, cocoon-shaped, crushed, and angular shapes are preferred. When alumina is used as the abrasive grain, the alpha conversion rate is not particularly limited, but is preferably 30% or more, more preferably 50% or more, even more preferably 70% or more, even more preferably 80% or more, and particularly preferably 90% or more. Within this range, a high polishing rate can be achieved while maintaining a good surface shape. The alpha conversion rate can be determined, for example, from the integrated intensity ratio of the (113) plane diffraction line by X-ray diffraction measurement.

[0030] <Polishing using loose abrasive grains> When polishing a raw material to be polished with a polishing liquid (hereinafter sometimes referred to as a "polishing composition") used in polishing with free abrasive grains, the polishing can be carried out, for example, by the following procedure.

[0031] That is, the surface of the object to be polished can be polished by bringing a surface plate, polishing pad, etc. into contact with the surface to be polished of the object to be polished, applying pressure to the object to be polished as necessary, and sliding one of the surface plate, polishing pad, and object to be polished against the other while supplying a polishing composition between the surface plate, polishing pad, and the surface to be polished of the object to be polished.

[0032] The apparatus used for polishing is not particularly limited, and examples thereof include a stationary polishing apparatus, a hand polisher, a robot equipped with a rotating body, etc. Furthermore, the method of supplying the polishing composition is not particularly limited, and depending on the size and shape (flat shape, curved shape, three-dimensional shape) of the object to be polished and the polishing apparatus, a method such as supplying by flowing, supplying by circulation, supplying in a state in which the composition accumulates on the surface of the platen or polishing pad that contacts the surface to be polished of the object to be polished, supplying by dropping onto the object to be polished, dispersing by spray, or supplying by coating can be appropriately selected.

[0033] The concentration of abrasive grains contained in the polishing composition is not particularly limited, but is preferably 0.1% by mass or more, more preferably 1% by mass or more, and even more preferably 3% by mass or more.Within this range, a high polishing rate can be achieved.In addition, the concentration of abrasive grains contained in the polishing composition is preferably 40% by mass or less, more preferably 20% by mass or less, and even more preferably 15% by mass or less.Within this range, the cost of the polishing composition can be appropriate.

[0034] The polishing composition contains a dispersion medium. The dispersion medium serves as a medium for dispersing or dissolving components other than the dispersion medium in the polishing composition. When water is used as the dispersion medium, industrial water, tap water, distilled water, or purified water or ultrapure water obtained by filtering these may be used. Among these, distilled water, pure water, and ultrapure water are preferred because they contain fewer impurities.

[0035] The pH of the polishing composition is preferably 1.0 or higher, more preferably 2.0 or higher, and even more preferably 3.0 or higher. The pH of the polishing composition is preferably 13.0 or lower, more preferably 10.0 or lower, even more preferably 7.0 or lower, and most preferably 5.0 or lower. When the pH of the polishing composition is within this range, the polishing ability of the polishing composition is improved, and the surface smoothness of the resinous member after polishing is improved. The pH of the polishing composition can be adjusted by appropriately adding a known acid such as nitric acid or sulfuric acid, or a known alkali such as potassium hydroxide.

[0036] The polishing composition may further contain a water-soluble polymer, which improves the smoothness of the surface of the resin member. The polishing composition is preferably any of a slurry of an aqueous solvent, an emulsion which is a mixture of an aqueous solvent and a non-aqueous solvent, and a high-viscosity compound obtained by adding a thickener to an emulsion. The polishing composition may be prepared by diluting a stock solution for dilution manufactured at a concentration higher than that at the time of use with water. By manufacturing the stock solution for dilution at a concentration higher than that at the time of use, the transportation cost and storage space for the polishing composition can be reduced.

[0037] <Polishing pad> When using a polishing pad to polish the surface of the raw material, the material and shape of the polishing pad are not particularly limited, and any polishing pad can be used, such as a polyurethane type, a nonwoven fabric type, a suede type, a wool buff type, a sponge buff type, a pile type, or a belt type. Among these, polyurethane and suede type polishing pads are preferred. The structure of the polishing pad is also not particularly limited, and for example, a single-layer structure or a multi-layer structure of two or more layers, with a layer supporting the polishing surface on the side opposite the polishing surface, can be used.

[0038] There are no particular restrictions on the hardness of the polishing pad, but when polishing a flat object, the A hardness measured by a method conforming to JIS K6253 is preferably 50 or more, more preferably 60 or more, and even more preferably 70 or more. The hardness of the polishing pad is preferably 90 or less, more preferably 85 or less.

[0039] When polishing a three-dimensional object to be polished, the hardness of the polishing pad is preferably 40 or more, more preferably 50 or more, in terms of C hardness measured by a method conforming to Appendix 2 of JIS K7312:1996. The hardness of the polishing pad is preferably 90 or less, more preferably 80 or less. If the hardness of the polishing pad is within this range, the polishing ability of the polishing composition is improved, and the smoothness of the surface of the resin member after polishing is also improved.

[0040] The thickness of the polishing pad is not particularly limited, but is preferably 0.5 mm or more, more preferably 1 mm or more, and even more preferably 2 mm or more. The thickness of the polishing pad is preferably 50 mm or less, more preferably 30 mm or less, and even more preferably 20 mm or less. If the thickness of the polishing pad is within this range, the polishing ability of the polishing composition is improved, and the smoothness of the surface of the resin member after polishing is improved.

[0041] <Other polishing conditions> When pressure is applied to the object to be polished, the pressure is preferably 0.1 kPa or more, more preferably 1 kPa or more, and even more preferably 2 kPa or more. The pressure applied to the object to be polished is preferably 100 kPa or less, more preferably 50 kPa or less, and even more preferably 15 kPa or less. If the pressure is within this range, the polishing ability of the polishing composition is improved, and the surface smoothness of the resin member after polishing is improved.

[0042] The linear speed when sliding one of the polishing pad and the object to be polished against the other is preferably 10 m / min or more, more preferably 20 m / min or more. The linear speed is preferably 1000 m / min or less, more preferably 500 m / min or less. If the linear speed is within this range, the polishing ability of the polishing composition is improved, and the surface smoothness of the resin member after polishing is improved.

[0043] <Properties of resin components used in electronic device manufacturing processes> The surface roughness Ra of the resin member for use in the electronic device manufacturing process is 100 nm or less, preferably 50 nm or less, more preferably 20 nm or less, even more preferably 15 nm or less, and most preferably 10 nm or less. Within this range, adhesion of contaminants to the surface of the resin member can be suppressed for a long period of time. The surface roughness of the resin member can be measured using, for example, a measuring device such as a Laser Microscope VK-X200 manufactured by Keyence Corporation.

[0044] The contact angle of pure water with the surface of the resin member for use in the electronic device manufacturing process is 70° or more, preferably 75° or more, more preferably 80° or more, even more preferably 85° or more, and most preferably 90° or more. The contact angle of pure water with the surface is less than 110°, preferably 108° or less, more preferably 106° or less. When the resin member for use in the electronic device manufacturing process is made of a fluororesin, the contact angle of pure water with the surface is preferably less than 105°.

[0045] Within this range, the hydrophilicity of the surface of the resin member is in an appropriate range, which not only prevents contamination from adhering to the surface of the resin member but also maintains antifouling properties even when exposed to contamination for a long period of time. The contact angle of pure water with the surface can be measured using, for example, a portable contact angle meter PG-X+ manufactured by Matsubo Corporation.

[0046] Furthermore, by polishing using abrasive grain processing or the like, the contact angle of pure water on the surface of the resin member for use in the electronic device manufacturing process is preferably reduced by 3° or more, more preferably by 5° or more, and even more preferably by 7° or more, compared to before polishing. Within this range, the hydrophilicity of the surface of the resin member becomes appropriate, and adhesion of contaminants to the surface of the resin member can be further suppressed.

[0047] [Example] The present invention will be described in more detail below with reference to examples and comparative examples. (Example 1 and Comparative Examples 1 to 3) The resin members for electronic device manufacturing processes of Example 1 and Comparative Examples 1 to 3 are molded articles of perfluoroalkoxy resin (PFA). In Example 1, the surface of the resin member (raw member) was polished using a polishing composition in which alumina was dispersed in water to a concentration of 20 mass %. In Comparative Examples 1 and 3, the surface of the resin member (raw member) was polished with sandpaper. The grit size of the sandpaper was #1000 in Comparative Example 1 and #320 in Comparative Example 3. In Comparative Example 2, the surface of the resin member (raw member) was not polished.

[0048] The contact angle of pure water with respect to the surface before polishing, the contact angle of pure water with respect to the surface after polishing, and the surface roughness Ra of the surface after polishing are as shown in Table 1. Since Comparative Example 2 was not polished, the contact angle of pure water with respect to the surface after polishing is not recorded. The contact angle of pure water was measured using a portable contact angle meter PG-X+ manufactured by Matsubo Corporation, with a water drop volume of 1.5 μL. The surface roughness Ra was measured using a measuring device, Laser Microscope VK-X200 manufactured by Keyence Corporation, with a viewing angle of 284 × 213 μm.

[0049] The specific polishing conditions in Example 1 are as follows. Grinding machine: EJ-380IN manufactured by Engis Japan Co., Ltd. Polishing pad: Fujibo Ehime Co., Ltd. K-1WNX-202U Polishing load: 15kPa Polishing composition supply rate: 30 mL / min

[0050] [Table 1]

[0051] The resin members of Example 1 and Comparative Examples 1 to 3 were evaluated as follows. (Rating 1) The resin components were immersed for 1 hour in a colloidal silica solution (20% by mass) prepared by dispersing colloidal silica with a primary particle size of 100 nm in water, after which the solution was replaced with pure water and dried with dry air. The surfaces of the dried resin components were then observed at 3000x magnification using a Hitachi High-Technologies SU8000 scanning electron microscope to evaluate the level of surface contamination. The results are shown in Table 1.

[0052] In Table 1, the number of colloidal silica aggregates observed within a 40 μm×40 μm field of view is indicated as “A” if it is less than 10, and “B” if it is 10 or more. The sliding angle of the colloidal silica liquid relative to the surface of the dried resin member was also measured. Specifically, the resin member was tilted at a rate of 0.5° / sec using an automatic tilting table manufactured by Mugegawa Seiko Co., Ltd., and the angle at which a 50 μL droplet of colloidal silica liquid slid down was taken as the sliding angle. The results are shown in Table 1.

[0053] (Rating 2) A colloidal silica solution (20% by mass concentration) containing colloidal silica with a primary particle size of 100 nm dispersed in water was sprayed onto the resin component for 30 seconds, then allowed to dry for one day and rinsed with running water. This procedure was repeated six times, after which the surface of the resin component was photographed using a Keyence Corporation Microscope VHX-2000 at a magnification of 32 mm x 32 mm to observe and evaluate the occurrence of dried solids. The results are shown in Table 1.

[0054] In Table 1, when no dried solidified matter was observed on the surface of the resin member in the photographed image, it was marked with "A," and when a dried solidified matter was observed, it was marked with "B." The above procedure was repeated six times, and the sliding angle of the colloidal silica liquid on the surface of the resin member was then measured. Specifically, the resin member was tilted at a rate of 0.5° / sec using an automatic tilting table manufactured by Mugegawa Seiko Co., Ltd., and the angle at which a 50 μL droplet of colloidal silica liquid slid down was taken as the sliding angle. The results are shown in Table 1.

[0055] (Example 2 and Comparative Examples 4 to 6) Except for the fact that the type of resin used was polytetrafluoroethylene (PTFE), tests were carried out in the same manner as in Example 1 and Comparative Examples 1 to 3. The results are shown in Table 1. (Example 3 and Comparative Examples 7 to 9) Except for the fact that the type of resin used was polyether ether ketone (PEEK), tests were conducted in the same manner as in Example 1 and Comparative Examples 1 to 3. However, only the amount of contamination was evaluated in Evaluation 1, and the sliding angle in Evaluation 1 and the amount of contamination and sliding angle in Evaluation 2 were not evaluated. The results are shown in Table 1.

[0056] As can be seen from the results shown in Table 1, Examples 1 to 3, in which the resin parts were processed with abrasive grains to have a surface roughness Ra of 100 nm or less and a contact angle of pure water on the surface of 70° or more and less than 110°, had little contamination in evaluation 1 and had high anti-fouling properties. Furthermore, in Examples 1 and 2, there was little contamination of the resin member even after the six-day continuous soiling test in Evaluation 2. In addition, in Examples 1 and 2, the sliding angle, which is one of the indicators of antifouling properties, showed little change compared to Evaluation 1, indicating that the surface properties of the resin member could be maintained for a long period of time. On the other hand, there was a lot of contamination in the resin members of Comparative Examples 1 to 9. Furthermore, in Comparative Examples 1 to 6, the sliding angle in Evaluation 2 changed significantly compared to Evaluation 1, and it was found that the surface properties of the resin members could not be maintained for a long period of time.

Claims

1. A method for manufacturing a resin component used in a process for manufacturing an electronic device, comprising a processing step of abrasively processing the surface of the raw component to achieve a surface roughness Ra of 100 nm or less and a contact angle of pure water with the surface of 70° or more and less than 110°.

2. 2. The method for producing a resin member for an electronic device manufacturing process according to claim 1, wherein the raw material is made of a fluororesin, and the processing step is a step of abrasively processing the surface of the raw material to have a surface roughness Ra of 100 nm or less and a contact angle of pure water with the surface of 85° or more and less than 105°.

3. 3. The method for producing a resin member for use in an electronic device manufacturing process according to claim 1, wherein the processing step is a step of reducing the contact angle of pure water on the surface by the abrasive processing by 5° or more compared to before processing.

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