Transducer element for an ultrasound probe, module including the transducer element, ultrasound probe including the transducer element, and ultrasound system including the transducer element

Abstract

The transducer element (15) of the ultrasonic probe (2) can be bent into a desired shape while maintaining its performance as a transducer element (15). In one embodiment, a transducer element (15) for an ultrasonic probe (2) is provided. The transducer element (15) is disposed on a base block (22) including a first portion having a first curvature and a second portion having a second curvature with a radius shorter than the first curvature. The transducer element (15) includes an FPC (20) disposed across the first portion and the second portion, and a laminate including a transducer disposed on the FPC (20). The laminate including the transducer includes a layer of piezoelectric elements, and the laminate including the transducer includes relatively shallow grooves that do not completely cut through the layer of piezoelectric elements and relatively deep grooves that completely cut through the layer of piezoelectric elements, the relatively shallow grooves and the relatively deep grooves being alternately arranged at positions corresponding to the first portion, and a plurality of the relatively deep grooves being consecutively arranged at positions corresponding to the second portion.

Description

[Technical Field]

[0001] The present invention relates to an ultrasonic probe, and more particularly to a transducer element including a transducer that converts high frequency power into ultrasonic vibrations. [Background technology]

[0002] When performing an ultrasound examination, an operator can freely place an ultrasound probe on a scanning object, orient it in any direction, and perform imaging, thereby obtaining non-destructive / non-invasive ultrasound images.

[0003] Such ultrasonic probes may include a piezoelectric transducer containing a piezoelectric material such as PZT (lead zirconate titanate: Pb(Zr,Ti)), a base block located on the side of the piezoelectric transducer opposite the ultrasound emission side, a flexible printed circuit (FPC) sandwiched between the base block and the piezoelectric transducer and connected to the electrodes of the piezoelectric transducer, and a reflective layer located between the piezoelectric transducer and the FPC. In certain ultrasonic probes, the piezoelectric transducer layer and the reflective layer are embodied as a laminate formed on the FPC. The combination of the laminate including the transducer and the FPC is sometimes called a transducer element. The transducer element is placed on the base block, and the ultrasonic probe is assembled. During this assembly, the transducer element is conventionally attached to the base block with an adhesive.

[0004] On the other hand, the tip of an ultrasound probe, which directly or indirectly contacts the subject, is required to have various shapes depending on the nature of the subject. For example, in abdominal ultrasound examinations, it is sometimes desirable to observe a wider, deeper internal area with a certain contact area. Fan-shaped ultrasound waves enable such observations. To enable the ultrasound probe to emit fan-shaped ultrasound waves, the tip of the ultrasound probe must be curved. Furthermore, particularly when the subject is a human or animal, contact with the tip of the ultrasound probe must not cause pain or discomfort to the subject, or must minimize such discomfort. Even when the subject is not a living organism, the tip of the ultrasound probe may be designed to have a curved surface to reduce damage to the subject during the examination. For the tip of the ultrasound probe to be curved, the base block must also have a corresponding curved shape.

[0005] The transducer elements arranged on the base block may not be sufficiently flexible, and it is not necessarily easy to bend them along the curved surface of the base block. Even if you try to bend the transducer elements along the surface of the base block, they may bend in undesired positions, creating undesired gaps between the surface of the base block and the FPC. Furthermore, applying strong stress to the transducer elements to arrange them along the surface of the base block may cause the FPC wiring to break.

[0006] Each layer of the laminate included in the transducer element has its own role, so from the perspective of maintaining the performance of the ultrasonic probe, it is not easy to change the material of each layer of the laminate to a highly flexible material. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Special Publication No. 2014-180362 [Patent Document 2] Japanese Patent Application Laid-Open No. 2015-012943 Summary of the Invention [Problem to be solved by the invention]

[0008] Therefore, a new technique is required that enables the transducer element to be bent into a desired shape while maintaining its performance as a transducer element. [Means for solving the problem]

[0009] A first aspect of the present disclosure provides a transducer element for an ultrasound probe. The transducer element is disposed on a base block including a first portion having a first curvature and a second portion having a second curvature with a radius shorter than the first curvature. The transducer element includes a flexible printed circuit (FPC) disposed across the first portion and the second portion, and a laminate including a transducer disposed on the FPC. The laminate including the transducer includes a layer of piezoelectric elements, and the laminate including the transducer includes relatively shallow grooves that do not completely cut through the layer of piezoelectric elements and relatively deep grooves that completely cut through the layer of piezoelectric elements, the relatively shallow grooves and the relatively deep grooves being alternately arranged at positions corresponding to the first portion, and a plurality of the relatively deep grooves being consecutively arranged at positions corresponding to the second portion.

[0010] In a second aspect of the present disclosure, there is provided a module for an ultrasonic probe, the module for an ultrasonic probe including a transducer element having the features of the first aspect of the present disclosure and the base block, the base block including a sound-absorbing material.

[0011] In a third aspect of the present disclosure, there is provided an ultrasonic probe, the ultrasonic probe including a transducer element having the features of the first aspect of the present disclosure and the base block.

[0012] A fourth aspect of the present disclosure provides an ultrasound diagnostic device, comprising: an ultrasound probe having the features of the third aspect of the present disclosure; an image processing unit that generates an ultrasound image based on ultrasound signals collected by the ultrasound probe; and a display device that displays the ultrasound image.

[0013] In a fifth aspect of the present disclosure, there is provided a method for manufacturing a transducer element for an ultrasonic probe. The transducer element is disposed on a base block including a first portion having a first curvature and a second portion having a second curvature with a radius shorter than the first curvature. The manufacturing method includes the steps of forming a laminate including a transducer on a flexible printed circuit board (FPC) to create a transducer element, the laminate including the transducer including a layer of a piezoelectric element; a step of dicing a laminate including the vibrator to form a plurality of grooves, the plurality of grooves including relatively shallow grooves that do not completely cut through the layer of the piezoelectric element and relatively deep grooves that completely cut through the layer of the piezoelectric element, the relatively shallow grooves and the relatively deep grooves being alternately arranged in a first portion of the vibrator element, and the relatively deep grooves being continuously arranged in a second portion of the vibrator element.

[0014] A sixth aspect of the present disclosure provides a method for manufacturing a module for an ultrasonic probe, the method including the steps of preparing the transducer element according to the method having the features of the fifth aspect of the present disclosure, preparing the base block, and positioning and adhering the transducer element on the base block such that the first portion of the transducer element is positioned on the first portion of the base block and the second portion of the transducer element is positioned on the second portion of the base block. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is a block diagram showing an example of a schematic configuration of an ultrasound diagnostic system according to an embodiment of the present invention. [Figure 2] FIG. 2 is a diagram showing the external structure of an ultrasonic probe. [Figure 3] FIG. 2 is a diagram showing the external structure of an ultrasonic probe. [Figure 4] 1 is a cross-sectional view of a probe case cut along a cross section that divides the probe case into two halves, front and back. [Figure 5] FIG. 5 is a diagram showing the structure of a portion including a transducer element and a base block, corresponding to the left portion of FIG. 4. [Figure 6] FIG. 5 is a diagram showing the structure of a portion including a conventional transducer element and a base block, corresponding to the left portion of FIG. 4. [Figure 7] FIG. 5 is a diagram showing the structure of a portion including a conventional transducer element and a base block, corresponding to the left portion of FIG. 4. [Figure 8A] FIG. 1 is a diagram illustrating conventional dicing. [Figure 8B] 1A to 1C are diagrams illustrating dicing performed according to the present invention. [Figure 9A] FIG. 1 is a diagram showing the surface of an FPC. [Figure 9B] FIG. 1 is a diagram showing the back side of the FPC. [Figure 9C] FIG. 1 is a diagram showing the rear surface of an FPC including the boundary between active elements and dummy elements. [Figure 10] 1 is a flowchart showing a process for manufacturing a transducer element and an ultrasound probe. [Figure 11] FIG. 2 is an exploded perspective view showing the internal structure of an ultrasonic probe. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, embodiments of the present invention will be described. However, the claimed invention is not limited to the embodiments described here. In particular, in this disclosure, a medical ultrasound diagnostic system will be described as an example, but the present invention can be applied to ultrasound inspection systems, ultrasound inspection devices, and ultrasound probes for non-destructive testing of buildings, structures, various mechanical devices, etc.

[0017] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. An ultrasonic diagnostic device 1 shown in Fig. 1 includes an ultrasonic probe 2, a transmit / receive beam former 3, an echo data processing unit 4, a display processing unit 5, a display unit 6, an operation unit 7, a control unit 8, and a storage unit 9. The ultrasonic diagnostic device 1 is configured as a computer.

[0018] The ultrasonic probe 2 is configured to have a plurality of ultrasonic transducers arranged in an array (see FIGS. 4 and 5), and transmits ultrasonic waves to the object to be inspected using these ultrasonic transducers, and receives the resulting echo signals.

[0019] The ultrasonic probe 2 transmits and receives ultrasonic waves to and from the object of examination. The transmit / receive beamformer 3 supplies electrical signals to the ultrasonic probe 2 for transmitting ultrasonic waves from the ultrasonic probe 2 under predetermined scanning conditions based on control signals from the control unit 8. The transmit / receive beamformer 3 also performs signal processing such as A / D conversion and phasing addition processing on the echo signals received by the ultrasonic probe 2, and outputs the echo data after signal processing to the echo data processing unit 4.

[0020] The echo data processing unit 4 performs processing to create an ultrasound image on the echo data output from the transmit / receive beamformer 3. For example, the echo data processing unit 4 performs B-mode processing such as logarithmic compression processing and envelope detection processing to create B-mode data.

[0021] The display processing unit 5 scan-converts the data input from the echo data processing unit 4 using a scan converter to create ultrasound image data. For example, the display processing unit 5 scan-converts B-mode data to create B-mode image data, and displays an ultrasound image on the display unit 6 based on the ultrasound image data. The ultrasound image is, for example, a B-mode image based on the B-mode image data.

[0022] The display unit 6 is an LCD (Liquid Crystal Display), an organic EL (Electro-Luminescence) display, etc. The operation unit 7 is a device through which a user inputs instructions and information. For example, although not shown, the operation unit 7 includes a keyboard and a pointing device such as a mouse or trackball.

[0023] The control unit 8 is a processor such as a CPU (Central Processing Unit). The control unit 8 reads out a program stored in the storage unit 9 and controls each unit of the ultrasound diagnostic apparatus 1. For example, the control unit 8 reads out a program stored in the storage unit 9 and causes the transmit / receive beamformer 3, the echo data processing unit 4, and the display processing unit 5 to perform the functions according to the read out program.

[0024] The control unit 8 may execute all of the functions of the transmit / receive beamformer 3, all of the functions of the echo data processing unit 4, and all of the functions of the display processing unit 5 by a program, or may execute only some of the functions by a program. When the control unit 8 executes only some of the functions, the remaining functions may be executed by hardware such as a circuit. Note that the functions of the transmit / receive beamformer 3, the echo data processing unit 4, and the display processing unit 5 may be realized by hardware such as a circuit.

[0025] The storage unit 9 is a semiconductor memory such as an HDD (Hard Disk Drive), an SSD (Solid State Drive), a RAM (Random Access Memory), or a ROM (Read Only Memory).

[0026] The ultrasound diagnostic apparatus 1 may have all of an HDD, SSD, RAM, and ROM as the storage unit 9. The storage unit 9 may also be a portable storage medium such as a CD (Compact Disk) or a DVD (Digital Versatile Disk). The programs executed by the control unit 8 are stored in a non-transitory storage medium such as an HDD or a ROM. The programs may also be stored in a portable non-transitory storage medium such as a CD or a DVD.

[0027] 2 and 3 are diagrams showing the external structure of the ultrasound probe 2. FIG. 2 is a front view of the ultrasound probe 2, and FIG. 3 is a right side view of the ultrasound probe 2. In this embodiment, the ultrasound probe 2 is a convex ultrasound probe, but it may be another type of ultrasound probe equipped with an acoustic window having a convex curved surface, such as an ultrasound probe for a bronchial endoscope or a transesophageal ultrasound probe. A convex ultrasound probe has an acoustic window 10 having a convex curved surface and emits ultrasound waves that diffuse radially. A convex ultrasound probe is used for abdominal ultrasound echography, etc.

[0028] As shown in FIGS. 2 and 3 , the acoustic window 10 is joined to the probe case 24 at the tip of the ultrasonic probe 2. In this example, the cable 26 is joined to the probe case 24 at the rear end of the ultrasonic probe 2. In FIG. 2 , the probe 2 is placed so that the bottom surface 233 (see FIG. 3 ) of the probe 2 is in contact with a support surface for the ultrasonic probe 2, such as a desk or table. Therefore, the surface of the probe 2 facing the user is referred to as the top surface 231, and the opposite surface is referred to as the bottom surface 233. However, in some embodiments, the top surface 231 and the bottom surface 233 of the probe 2 may have exactly the same structure. In this case, when the probe 2 is placed upside down, the top surface 231 of the probe 2 may be referred to as the bottom surface 233, and the bottom surface 233 of the probe 2 may be referred to as the top surface 231. Taking this into consideration, the top surface 231 and bottom surface 233 of the probe 2 shown in Figures 2 and 3 can also be seen as the side surfaces of the probe 2, but to make it easier for readers to understand, these two surfaces will be described as the top surface 231 and bottom surface 233 of the probe 2.

[0029] Fig. 4 is a cross-sectional view of the probe case 24 in some embodiments of the present invention, in which the acoustic window 10 of the ultrasonic probe 2 is disposed, taken along a cross section 13 (see Fig. 3) that bisects the tip of the probe case 24 into the front and rear halves, and Fig. 5 is an enlarged view of a portion of the cross-sectional view. The cross-sectional view of the probe case 24 taken along a cross section 11 (see Fig. 2) that bisects the tip of the probe case 24 into the left and right halves is omitted because there is no significant difference between the conventional ultrasonic probe 2 and the probe case 2.

[0030] As shown in FIG. 4 , the acoustic window 10 in some embodiments of the present invention is arranged to cover a module 28 including a piezoelectric element 164 and an acoustic lens 12. The transducer-containing module 28 includes a transducer element 15 and a base block 22. The surface 50 of the acoustic window 10 has a shape suitable for contact with an imaging target. As shown in FIG. 5 , the transducer element 15 includes a flexible printed circuit board (FPC) 20 and a laminate 16 laminated on the FPC 20. In the example of FIG. 5 , the transducer-containing laminate 16 includes a second acoustic matching layer 161, a ground electrode 162, a first acoustic matching layer 163, a piezoelectric element 164, and a reflecting layer 165. The transducer is composed of at least the piezoelectric element 164. As will be apparent to those skilled in the art, the types and order of layers included in the transducer-containing laminate 16 vary depending on the manufacturer and the type of test target. The types of layers and their order shown in FIG. 4 are just an example, and the present invention can also be applied to laminates and transducer elements other than the specific laminate 16 and the specific transducer element 15 shown here.

[0031] The piezoelectric element 164 converts an electrical signal into vibration to generate an ultrasonic wave, and vibrates upon receiving an echo signal, converting the echo signal into an electrical signal. The piezoelectric element 164 can be made of a known material such as PZT ceramic. A second acoustic matching layer 161 and a first acoustic matching layer 163, each having a multilayer structure, are provided on the piezoelectric element 164 to acoustically match the acoustic impedance of the piezoelectric element 164 with the acoustic impedance of the subject. The second acoustic matching layer 161 can be made of a known material such as cross-linked polystyrene resin (REXOLITE: registered trademark). The first acoustic matching layer 163 can be made of a known material such as graphite. The ground electrode 162 is a grounding electrode.

[0032] An acoustic lens 12 is provided on the upper surface of the second acoustic matching layer 161, which allows ultrasonic waves to be incident on the object to be efficiently focused, and ultrasonic waves are transmitted and received through the acoustic lens 12. In some embodiments of the present invention, protecting the acoustic lens 12 with an acoustic window 10 makes it possible to fabricate the acoustic lens 12 from a material that is soft and easily damaged but has excellent acoustic properties, allowing for the selection of a material suitable for the propagation and refraction of ultrasonic waves. A specific material that can be used for the acoustic lens 12 is silicone rubber, which has an acoustic impedance close to that of water and excellent moldability and releasability.

[0033] The convex surface of the acoustic window 10 that contacts the subject can have a uniform thickness across the azimuth direction. This makes it easier to manufacture the acoustic window 10 to the designed shape and dimensions, reducing the possibility of substandard defective products and improving yield. The acoustic lens 12 has a convex outer surface that corresponds to the concave shape of the back surface of the acoustic window 10, and the convex outer surface of the acoustic lens 12 is acoustically coupled to the back surface of the acoustic window 10. In some embodiments, this acoustic coupling is performed using an adhesive.

[0034] The ultrasonic waves generated by the piezoelectric element 164 travel not only forward but also backward. A reflective layer 165 is provided to reflect the backward-propagating ultrasonic waves, and a base block 22 made of a sound-absorbing material is provided to absorb the backward-propagating ultrasonic waves and suppress excess vibrations. Ultrasonic waves tend to be reflected by objects with high hardness. For this reason, the reflective layer 165 may be formed of a metal such as tungsten, particularly tungsten carbide, which has high hardness. As will be apparent to those skilled in the art, tungsten carbide is an alloy of tungsten and carbon. Tungsten carbide is known as the second hardest material after diamond. In addition to its high hardness, tungsten carbide also has excellent abrasion resistance, corrosion resistance, impact resistance, and durability.

[0035] The FPC 20 serves as a lead wire, transmitting an electrical signal from an electronic component (not shown) to the piezoelectric element 164, and transmitting an electrical signal from the piezoelectric element 164 to the electronic component (not shown). In addition, power from the cable 26 is also transmitted via the FPC 20 to the laminate 16 including the vibrator.

[0036] In some embodiments, acoustic lens 12 is part of transducer-containing module 28, and in some embodiments, acoustic lens 12 is adhesively bonded to ultrasound transducer-containing module 28 ( FIG. 11 ) such that the convex outer surface of acoustic lens 12 is acoustically coupled to the back surface of acoustic window 10. The convex outer surface of acoustic lens 12 and the back surface of acoustic window 10 are also adhesively bonded. The adhesive can be a silicone-based adhesive or an epoxy-based adhesive, as can adhesives used for other components.

[0037] The transducer element 15 according to one embodiment of the present invention, shown in FIG. 5, and a conventional transducer element 15' shown in FIGS. 6-7 are described below. The right ends of the transducer elements 15, 15' are shown as if they were cut off on the base block 22. However, this is done for ease of understanding; in fact, as shown in FIG. 4, the transducer element 15 in FIG. 5 is arranged across the base block 22 in the azimuth direction 235. In a specific embodiment, the arrangement of the transducer elements 15 is symmetrical with respect to the cross section 11. In FIGS. 5-7, the acoustic window 10 and acoustic lens 12 shown in FIG. 4 have been removed to facilitate a more detailed observation of the transducer elements 15, 15'.

[0038] FIG. 5 is an enlarged view of a portion of FIG. 4. As shown in FIGS. 4 and 5, the transducer elements 15 are preferably adhered to the base block 22 in close contact with each other across the azimuth direction 235. However, depending on the shape of the base block 22 on which the transducer elements 15 are arranged, it may not be easy to adhere the transducer elements 15 to the base block 22 in close contact with each other across the azimuth direction 235. In the embodiment of FIGS. 4 and 5, the base block 22 has shoulders 181 at both ends in the azimuth direction 235, and a central portion 182 is located between the shoulders 181 at both ends. Active elements are located in the section indicated by the double arrow 171, and dummy elements are located in the section indicated by the double arrow 172. Elements included in the active elements transmit ultrasonic signals and receive echo signals. On the other hand, elements included in the dummy elements neither transmit ultrasonic signals nor receive echo signals. The dummy elements are located on the shoulders 181. In some embodiments, the radius of curvature R1 of the center portion 182 of the base block 22 is 45 cm to 65 cm. More preferably, the radius of curvature R1 is 50 cm to 60 cm. Even more preferably, the radius of curvature R1 is 54.096±0.05 cm. Furthermore, the radius of curvature R2 of the shoulder portion 181 of the base block 22 is 2.5 cm to 3.5 cm. More preferably, the radius of curvature R2 is 2.0 cm to 3.0 cm. Even more preferably, the radius of curvature R2 is 2.5 cm. By appropriately setting the radii of curvature R1 and R2, the ultrasonic probe 2 can emit ultrasonic waves that diverge in an ideal fan shape, and also improve contact with the object to be examined.

[0039] However, because the transducer element 15 has a highly hard reflective layer 165, it is not easy to bond a conventional transducer element 15' to a base block 22 having such an ideal shape without leaving any gaps. Because the radius of curvature R1 of the center portion 182 of the base block 22 is sufficiently long, it is relatively easy to bend the conventional transducer element 15' to that curvature. However, because the radius of curvature R2 of the shoulder portion 181 of the base block 22 is not sufficiently long, it is not easy to bend the transducer element 15' to that curvature. For this reason, as shown in FIG. 6 , the conventional transducer element 15' cannot be maintained in a state where it is bent to the length of the radius of curvature R2. This can cause the adhesive between the conventional transducer element 15' and the base block 22 to peel off, resulting in a gap 183. In some cases, the gap 183 can be created due to damage to the FPC 20. Furthermore, if the transducer element 15' cannot be bent to the length of the radius of curvature R2, it may not be possible to proceed to the adhesive bonding process.

[0040] As shown in Figure 6, if a gap 183 occurs between the conventional transducer element 15' and the base block 22, the transducer will fail the Time of Flight (TOF) test, which is one of the acoustic inspection items. In this TOF test, a target is placed in a water tank, ultrasonic waves are emitted, and echo signals from the target are received to measure the distance for each channel and determine the measurement error. If the conventional transducer element 15' floats above the base block 22 due to deflection, the distance to the target changes, resulting in a difference from the designed distance and a large error. Furthermore, if the transducer element 15' floats above the base block 22 due to deflection, the base block 22 will not adequately absorb sound, resulting in increased noise. Furthermore, if the transducer element 15' floats above the base block 22 due to deflection, the transducer element 15' itself will vibrate, generating noise.

[0041] On the other hand, when a large force is applied to the conventional transducer element 15′ to conform to the radius of curvature R2 of the base block 22, a location 185 occurs where the elements of the laminate 16 are significantly separated from each other, as shown in FIG. 7 . When the elements of the laminate 16 are significantly separated from each other, a large stress is applied to the FPC 20, which acts as the fulcrum of the reflective layer, due to the principle of leverage. This large stress may destroy the wiring 215 of the FPC 20 (see FIG. 9 ). That is, the location where the elements of the laminate 16 are significantly separated from each other may become the disconnection location 185. In some embodiments, the wiring 215 of the FPC 20 extends in the azimuth direction 235, and the element located in the center portion 182 of the transducer element 15′ is also connected to electronic components (not shown) in the ultrasound probe 2 and power lines from the cable 26 ( FIG. 2 ) via the wiring 215 passing over the shoulder portion 181. Therefore, if a disconnection point 185 occurs, it will result in the element located in the central portion 182 being unable to transmit and receive signals between the electronic components in the ultrasonic probe 2, or being unable to receive power.

[0042] 7, if a portion 185 occurs where adjacent elements of the laminate 16 are significantly separated from each other, the outer shape of the transducer element 15' may deviate significantly from the initially designed outer shape of the transducer element 15' and may no longer fit the shape of the inner surface of the acoustic window 10. If the outer shape of the transducer element 15' no longer fits the shape of the inner surface of the acoustic window 10, it may become impossible to assemble the ultrasonic probe 2.

[0043] In order to avoid the problems described in Figures 6 and 7 and to arrange the transducer elements 15 on the base block 22 in the manner shown in Figure 5, the conventional dicing shown in Figure 8A is changed to the dicing shown in Figure 8B.

[0044] FIG. 8A is a diagram illustrating a conventional dicing process. As shown in the figure, conventionally, relatively shallow grooves 175 and relatively deep grooves 176 are alternately formed along a dicing direction 187, without distinguishing between a section 171 where effective elements are arranged and a section 172 where dummy elements are arranged. Because the section 171 where effective elements are arranged is longer than the section 172 where dummy elements are arranged, most of the section 171 where effective elements are arranged is omitted in the figure. In some embodiments, the relatively shallow grooves 175 are grooves with a depth that reaches the piezoelectric elements 164. More specifically, the relatively shallow grooves 175 are formed by dicing 50 to 98% of the thickness of the piezoelectric elements 164. More preferably, this range is 70 to 95%, and even more preferably 75 to 90% of the thickness of the piezoelectric elements 164. In some embodiments, the relatively deep grooves 176 are grooves with a depth that completely cuts through the reflective layer 165 (i.e., completely cuts through the laminate 16) and reaches the FPC 20. More specifically, the relatively deep grooves 176 are formed by dicing 0 to 60% of the thickness of the FPC 20. More preferably, this range is 15 to 40% of the thickness of the FPC 20, and even more preferably 33 to 35%. Forming the relatively deep grooves 176 deeper has the advantage of making the transducer elements 15 easier to bend, but increases the possibility of damaging the FPC 20 during the dicing and attachment processes of the transducer elements 15. In the section 171 where the effective elements are arranged, a portion sandwiched between two consecutive relatively deep grooves 176 forms one channel. In this specification, a portion in the section 171 where the effective elements are arranged, which is sandwiched between two consecutive relatively deep grooves 176 and has one relatively shallow groove 176 to form one channel, will be referred to as a U-shaped element 167 with a shallow groove.

[0045] FIG. 8B is a diagram illustrating dicing performed according to the present invention. As shown in the figure, in section 171 where active elements are arranged, relatively shallow grooves 175 and relatively deep grooves 176 are formed alternately, as in the conventional method. In some embodiments, the relatively shallow grooves 175 remove the piezoelectric elements 164 to a depth of 0.005 mm to 1 mm, more preferably 0.01 mm to 0.05 mm, and even more preferably 0.02 mm. The relatively deep grooves 176 remove the FPC 20 by 0.1 mm to 0.020 mm, more preferably 0.03 mm to 0.04 mm, and even more preferably 0.035 mm. In some embodiments, the widths of the relatively shallow grooves 175 and the relatively deep grooves 176 can both be 0.01 mm to 0.1 mm, more preferably 0.03 mm to 0.05 mm, and even more preferably 0.04 mm. In another embodiment, the width of the relatively shallow groove 175 and the width of the relatively deep groove 176 are set so that one is narrower than the other. In the section 173 having the shallow-deep repeated grooves, the distance between adjacent relatively deep grooves 176 and the distance between adjacent relatively shallow grooves 175 can both be 0.2 mm to 0.5 mm, more preferably 0.3 mm = 0.4 mm, and even more preferably 0.35 mm. The section 173 having the shallow-deep repeated grooves can extend into the section 172 where the dummy elements are arranged. In other words, the section 174 having the deep continuous grooves can be designed to be shorter than the section 172 where the dummy elements are arranged. In the example of FIG. 8B, two U-shaped elements 167 with shallow grooves are arranged outside the section 171 where the effective elements are arranged. The number of U-shaped elements 167 with shallow grooves arranged in the section 172 where the dummy elements are arranged can be 0 to 5, more preferably 1 to 3, and even more preferably 2. By placing a U-shaped element 167 with shallow grooves in the section 172 where the dummy elements are placed, there is an advantage that the deepest positions of all relatively deep grooves 176 can be visually confirmed even when the presence of the ground electrode 162 prevents the viewing of the deepest positions of the grooves.Furthermore, by arranging U-shaped elements 167 with shallow grooves in section 172 where dummy elements are arranged, it is possible to reduce the possibility that the relatively shallow grooves 175 of U-shaped elements 167 with shallow grooves arranged at both ends of section 171 where effective elements are arranged will be formed deeper than their designed depth. As shown in FIG. 8B , in section 173 with alternating shallow and deep grooves, relatively shallow grooves 175 and relatively deep grooves 176 are formed alternately. In section 174 with deep continuous grooves, relatively deep grooves 176 are formed continuously. In this specification, the portion of section 174 with deep continuous grooves sandwiched between two consecutive relatively deep grooves 176 is referred to as I-shaped element 168. In this example, section 174 with deep continuous grooves is arranged at both ends of transducer element 15. However, as shown in FIG. 5 , wide dummy elements 166 without grooves can also be arranged at both ends or one end of transducer element 15. Placing the large-width dummy elements 166 without grooves at the ends of the transducer elements 15 can provide several advantages. For example, by reducing the number of times the transducer elements 15 need to be diced, the transducer elements 15 can be produced quickly and inexpensively. Furthermore, even if the quality of the laminate 16 is not necessarily high and some layers are discontinued before reaching the end, the element will not be destroyed by dicing. The large-width dummy elements 166 without grooves also improve the robustness of the transducer elements 15. While portions where relatively deep grooves 176 are continuously formed tend to be less robust due to the grooves, the large-width dummy elements 166 without grooves serve to protect the portions where the relatively deep grooves 176 are continuously formed. The width of the large-width dummy elements 166 without grooves can be 0.7 to 5.5 times, more preferably 1.5 to 4.5 times, and even more preferably 2.5 to 3.5 times, the width of the U-shaped elements 167 with shallow grooves. In another embodiment, the section 174 having the deep continuous groove can be positioned in the center of the section 172 in which the dummy elements are placed, and the sections 173 having the shallow and deep repeating grooves can be positioned at both ends of the section 172 in which the dummy elements are placed.In either case, dicing is performed so that the I-shaped elements 168 in the section 174 having the deep continuous groove are positioned on the shoulder 181 of the base block 22. The section 174 having the deep continuous groove may be 50 to 95%, more preferably 70 to 90%, of the section 172 in which the dummy elements are positioned. The relatively shallow groove 175 and the relatively deep groove 176 cut the piezoelectric element 164 across the entire width of the piezoelectric element 164 in the elevation direction.

[0046] In the example of FIG. 8B , the dicing pitch in section 174 having deep continuous grooves is the same as the dicing pitch in section 173 having shallow and deep alternate grooves. In this embodiment, the present invention can be implemented without significantly modifying a conventional dicing control program, and yield is also improved. In another embodiment, the dicing pitch in section 174 having deep continuous grooves is set to be different from the dicing pitch in section 173 having shallow and deep alternate grooves. Specifically, the dicing pitch in section 174 having deep continuous grooves is set to be 50 to 90% of the dicing pitch in section 173 having shallow and deep alternate grooves. As the dicing pitch in section 174 having deep continuous grooves becomes shorter, flexibility increases and the device becomes easier to bend. On the other hand, as the dicing pitch in section 174 having deep continuous grooves becomes shorter, the possibility of the device being broken during dicing increases.

[0047] FIG. 9A is a diagram showing the front surface 201 of the FPC 20, and FIG. 9B is a diagram showing the back surface 203 of the FPC 20. In a preferred embodiment of the present invention, a relatively shallow groove 175 in the section 171 where the active elements are arranged is formed at a position corresponding to the dashed line 211. The dashed line 211 passes through the via 205 provided on the front surface 201 of the FPC 20. As described above, the relatively shallow groove 175 is deep enough to reach the piezoelectric element 164, but does not reach the reflective layer 165. Therefore, the relatively shallow groove 175 does not affect the electrical connection between the conductive reflective layer 165 and the wiring 215 ( FIG. 9B ) provided on the back surface 203 of the FPC 20 via the via 205. A relatively deep groove 176 in the section 171 where the active elements are arranged is formed at a position corresponding to the dashed line 213. Since there is no via 205 at the position corresponding to the dashed line 213 (FIG. 9C), the relatively deep groove 176 does not affect the electrical connection via the via 205 between the reflective layer 165 and the wiring 215 provided on the rear surface 203 of the FPC 20. In the example of FIG. 9B, the wiring 215 extends in the azimuth direction 235 on the rear surface 203 of the FPC 20 to facilitate the reader's understanding, but the FPC 20 may have multiple layers and the wiring 215 may be provided on an intermediate layer.

[0048] The relatively deep groove 176 in the section 174 having the deep continuous groove is formed at a position corresponding to the dashed line 211 and the dashed line 213. There is no point in arranging the via 205 in the section 172 where the dummy elements are arranged. In a preferred embodiment of the present invention, as shown in FIG. 9C , the via 205 is not arranged in the section 172 where the dummy elements are arranged. Because the section 174 having the deep continuous groove is provided only in the section 172 where the dummy elements are arranged, even if the relatively deep groove 176 were to occur, there would be no problem of destroying the electrical connection via the via 205 between the reflective layer 165 and the wiring 215 provided on the back surface 203 of the FPC 20.

[0049] Returning to FIG. 5, the explanation will continue. As shown in the figure, the transducer element 15 is adhered along the surface of the base block 22 so as to avoid the gap 183 in FIG. 6 and the disconnection point 185 in FIG. 7. The base block 22 has a pair of shoulders 181 near both ends. The section 174 having a deep continuous groove is positioned on these pair of shoulders 181, thereby achieving close contact of the transducer element 15 with the shoulders 181. The section 174 having the deep continuous groove is more flexible and bendable than the section 173 having repeated shallow and deep grooves because it has a series of relatively deep grooves 176. In particular, in an embodiment in which the relatively shallow grooves 175 do not cut the reflective layer 165 and the relatively deep grooves 176 cut or remove almost all or all of the reflective layer 165, the flexibility and bendability of the section 174 having the deep continuous groove are dramatically improved. The improved flexibility and bendability allow the transducer element 15 (FPC 20) to be closely fitted to the shape of the shoulder 181, which has a short radius of curvature R2. More specifically, the back surface 203 of the FPC 20 is fixed to the surface of the base block 22 with an adhesive. As described above, the adhesive can be a silicone-based adhesive or an epoxy resin-based adhesive. This adhesion simultaneously avoids the risks of both failing the TOF inspection and the occurrence of disconnections, improving product quality and providing a more stable product. As shown in the figure, the section 173 having the repeated shallow and deep grooves is located in the center portion 182 between a pair of shoulder portions 181. The transducer element 15 extends beyond the shoulder portions 181. The FPC 20 of the transducer element 15 extends toward the rear end of the ultrasonic probe 2 and is connected to electronic components (not shown) via a connector (not shown). The FPC 20 can extend toward the rear end only on the left side, only on the right side, or on both sides of the paper in FIG. 2 .

[0050] Continuing to refer to FIG. 5 , in the specific embodiment shown in the figure, the laminate 16 of the transducer element 15 is also disposed on the side 184 of the base block 22 beyond the shoulder 181. In another specific embodiment, the laminate 16 of the transducer element 15 is not disposed on the side 184 of the base block 22. When the laminate 16 is disposed on the side 184 of the base block 22, the portion of the laminate 16 disposed on the side 184 can serve as a barrier for the active element. For example, even if an external impact is applied to the side 184 during the assembly process of the ultrasonic probe 2, the portion of the laminate 16 disposed on the side 184 absorbs the impact and reduces the impact on the active element 171 to a level that does not cause any problems. It is also possible to dispose the laminate 16 on the side 184 of the base block 22 and to dispose components for shock absorption therein, but this may result in an increase in the number of manufacturing steps and increased costs.

[0051] Next, referring to Figure 10, a process for manufacturing a transducer element and a process for manufacturing an ultrasonic probe will be described. The process begins at 401. At step 403, a laminate 16 is formed on an FPC 20 to create a transducer element 15. As described above, in a specific embodiment, the laminate 16 including the transducer includes a second acoustic matching layer 161, a ground electrode 162, a first acoustic matching layer 163, a piezoelectric element 164, and a reflecting layer 165. Forming the laminate 16 on the FPC 20 can be performed according to a known technique, and therefore a detailed description thereof will be omitted.

[0052] In step 405, the ground electrode 162 is bent. Before the ground electrode 162 is bent in step 405, the ground electrode 162 protrudes in the elevation direction 237 (into the plane of the paper in FIGS. 4-8 ) at least in the section 171 where the active elements are located. In certain embodiments, the ground electrode 162 does not need to protrude in the elevation direction 237 in the section 172 where the dummy elements are located. This minimizes material, reducing weight and cost. However, extending the portion of the ground electrode 162 that protrudes in the elevation direction 237 into the section 172 where the dummy elements are located can improve the likelihood that elements located at both ends of the section 172 where the dummy elements are located will function reliably. This extension of the ground electrode 162 can correspond to the number of shallow-grooved U-shaped elements 167 located in the section 172 where the dummy elements are located. As described above, the types and order of layers included in the laminate 16 including the vibrator vary depending on the manufacturer and the type of test object, and step 405 may not be an essential step.

[0053] In step 407, the laminate 16 is diced to form a plurality of grooves. As described in FIG. 8B , in the section 173 having the shallow-deep alternate grooves, relatively shallow grooves 175 and relatively deep grooves 176 are formed alternately. In the section 174 having the deep continuous grooves, relatively deep grooves 176 are formed continuously. When the ground electrode 162 is bent in step 405, the bent portion of the ground electrode 162 has a sufficient length so that it is not completely cut by the dicing process. The bent portion of the ground electrode 162 that is not completely cut is connected to earth.

[0054] In step 409, a base block 22 is provided. As described above, the base block 22 includes a first portion (central portion 182) having a first curvature R1 and a second portion (shoulder portion 181) with a second curvature R2 having a radius smaller than the first curvature R1. The base block 22 may be constructed of a sound-absorbing material.

[0055] In step 411, the transducer element 15 is placed on and adhered to the base block 22. As described above, the section 174 having the deep continuous groove of the transducer element 15 is positioned on a pair of shoulders 181 of the base block 22, thereby achieving close contact between the transducer element 15 and the base block 22. The base block 22 with the transducer element 15 attached can be made into a module 28 including a transducer.

[0056] In step 413, an ultrasonic probe is manufactured according to a manufacturing process that combines it with other components of the ultrasonic probe 2, and the manufacturing process ends in step 415. In some embodiments, step 413 can be implemented by manufacturing an ultrasonic probe according to a manufacturing process for a conventional ultrasonic probe. A module 28 including a transducer that includes a novel transducer element 15 manufactured according to the present invention can be treated in the same manner as a module 28 including a conventional transducer in subsequent manufacturing processes, thereby reducing manufacturing costs.

[0057] FIG. 11 is an exploded perspective view showing the internal structure of an ultrasonic probe. In this embodiment, a metal inner housing 30 is disposed inside the probe case 24 of the ultrasonic probe 2. The inner housing 30 dissipates heat generated in the module 28, including the transducer, and prevents the heat generated in the module 28, including the transducer, from being transmitted to the subject. The outer surface of the inner housing 30 has a shape that matches the inner surface of the probe case 24. The inner housing 30 can be manufactured by known techniques such as casting, additive manufacturing, CNC machining, forging, and press working. The top portion 301 and the bottom portion 302 of the inner housing 30 are bonded to each other with an adhesive. The inner surface of the probe case 24 is attached to the outer surface of the inner housing 30 with an adhesive. The top portion 241 and the bottom portion 242 of the probe case 24 are also bonded to each other with an adhesive. The front end of the probe case 24 is bonded to the acoustic window 10, and the rear end of the probe case 24 is bonded to the cable 26.

[0058] A chassis 38 is positioned inside the inner housing 30. One or more electronic components (not shown) are disposed inside the chassis 38. The chassis 38 can be fixed to the transducer-containing module 28 with screws so that the components fixed thereto do not easily move or move from their predetermined positions in the ultrasound probe 2. The chassis 38 can also be fixed to other components, such as the inner housing 30, using various known fixing means. In a specific embodiment of the present invention, the electronic components (not shown) are detachably connected to the cable 26 by a connector (not shown) and are also detachably connected to the transducer-containing module 28 by another connector (not shown). This allows power from the cable to be supplied to the electronic components (not shown) and the transducer-containing module 28. Bidirectional signal transmission is also possible via the cable 26.

[0059] In some embodiments of the present invention, an acoustic lens 12 is attached to the back surface of the acoustic window 10 shown in FIG. 11 . The transducer-containing module 28 and the acoustic lens 12 are also coupled so that they are acoustically connected. Next, the transducer-containing module 28 and the chassis 38 are fixed with screws, and the electronic components and cables of the transducer-containing module 28 are connected with connectors. The connector connection may be located below or to the side of the transducer-containing module 28. Then, the top portion 301 and the bottom portion 302 of the inner housing 30 are joined to each other so as to enclose or sandwich the transducer-containing module 28. Next, the top portion 241 and the bottom portion 242 of the probe case 24 are joined to each other so as to enclose or sandwich these components. A portion of the inner surface of the probe case 24 near the tip has a shape corresponding to the first wall portion. The inner surface of the probe case 24 and the first wall portion are joined with an adhesive.

[0060] The adhesive used to assemble the ultrasonic probe 2 is preferably an adhesive with excellent chemical resistance and UV resistance, such as a silicone-based adhesive or an epoxy resin-based adhesive. From the perspective of miniaturization, the thickness of the adhesive is preferably 5 mm or less. Furthermore, from the perspective of adhesive strength, the thickness of the adhesive is preferably 0.3 mm or more. More preferably, the adhesive has a thickness of 1 to 4 mm. The adhesives applied to each part may be the same or different.

[0061] Further aspects of the present invention can be provided by the following embodiments: [Embodiment 1] A transducer element for an ultrasonic probe is provided that is disposed on a base block including a first portion having a first curvature and a second portion having a second curvature with a radius smaller than the first curvature. a flexible printed circuit (FPC) disposed across the first portion and the second portion; a laminate including a vibrator disposed on the FPC; Including, the laminate including the vibrator includes a layer of a piezoelectric element, a laminate including the vibrator includes a relatively shallow groove that does not completely cut through the layer of the piezoelectric element and a relatively deep groove that completely cuts through the layer of the piezoelectric element; the relatively shallow grooves and the relatively deep grooves are alternately arranged at positions corresponding to the first portion; A plurality of the relatively deep grooves are arranged in succession at a position corresponding to the second portion. [Embodiment 2] the FPC includes wiring and vias connected to the wiring; the laminate including the vibrator includes a reflective layer disposed between the piezoelectric element layer and the FPC; the reflective layer contains a metal and is electrically conductive; the reflective layer is connected to the via at a position corresponding to the first portion; There is provided a transducer element as in the preceding embodiment, wherein the relatively deep groove cuts through at least a portion of the reflective layer. [Embodiment 3]

[0013] The transducer element of any preceding embodiment is provided, wherein the metal of the reflective layer comprises tungsten. [Embodiment 4]

[0013] The transducer element according to any one of the preceding embodiments may be provided, wherein the wiring of the FPC extends in an azimuth direction. [Embodiment 5]

[0013] The transducer element of any preceding embodiment, wherein the first portion and the second portion are arranged to be aligned in an azimuth direction. [Embodiment 6] The transducer element of any preceding embodiment is provided, wherein the laminate including the transducer includes an acoustic matching layer disposed on the layer of the piezoelectric element. [Embodiment 7]

[0013] The transducer element of any preceding embodiment is provided, wherein the transducer stack includes a ground electrode layer disposed on the piezoelectric element layer. [Embodiment 8] the relatively shallow groove cuts the piezoelectric element across the entire width of the piezoelectric element in an elevation direction; The transducer element of any preceding embodiment is provided, wherein the relatively deep groove also cuts the piezoelectric element across its entire width in the elevation direction. [Embodiment 9] A module for an ultrasound probe is provided, the module for an ultrasound probe comprising: The transducer element of any preceding embodiment; and The base block; Including, The base block includes a sound absorbing material. [Embodiment 10] the base block includes a pair of shoulders; the first portion is disposed between the pair of shoulder portions; the second portion is disposed on one or both of the pair of shoulder portions; 10. The module of any preceding embodiment, wherein the transducer element extends beyond either or both of the pair of shoulders. [Embodiment 11] The module of any preceding embodiment, wherein the FPC is adhered to the base block without any gaps at least in the portion spanning from one of the pair of shoulder portions to the other of the pair of shoulder portions. [Embodiment 12] The transducer element of any preceding embodiment; and The base block; An ultrasound probe is provided having: [Embodiment 13] an acoustic lens disposed above the transducer element; an acoustic window covering the module and the acoustic lens; a probe case covering at least the lower end of the acoustic window; Including, 10. The ultrasound probe of any preceding embodiment, wherein the module and the acoustic lens are sealed by the acoustic window and the probe case. [Embodiment 14] 10. The ultrasonic probe of any preceding embodiment, wherein the ultrasonic probe is a convex ultrasonic probe. [Embodiment 15] an ultrasound probe according to any preceding embodiment; an image processing unit that generates an ultrasound image based on the ultrasound signals collected by the ultrasound probe; a display device that displays the ultrasound image; An ultrasound diagnostic device comprising: [Embodiment 16] A method is provided for manufacturing a transducer element for an ultrasonic probe disposed on a base block including a first portion having a first curvature and a second portion with a second curvature having a radius that is smaller than the first curvature, the method comprising: A step of forming a laminate including a vibrator on a flexible printed circuit board (FPC) to create a vibrator element, the laminate including the vibrator including a layer of a piezoelectric element; a step of dicing a laminate including the vibrator to form a plurality of grooves, the plurality of grooves including relatively shallow grooves that do not completely cut through the layer of the piezoelectric element and relatively deep grooves that completely cut through the layer of the piezoelectric element, the relatively shallow grooves and the relatively deep grooves being alternately arranged in a first portion of the vibrator element, and the relatively deep grooves being continuously arranged in a second portion of the vibrator element; Includes. [Embodiment 17] A method for manufacturing a module for an ultrasound probe is provided, the method comprising: providing the transducer element according to the method of embodiment 1; providing the base block; placing and adhering the transducer element onto the base block such that the first portion of the transducer element is disposed on the first portion of the base block and the second portion of the transducer element is disposed on the second portion of the base block; Includes. [Embodiment 18] the FPC includes wiring and vias connected to the wiring; the laminate including the vibrator includes a reflective layer disposed between the piezoelectric element layer and the FPC; the reflective layer contains a metal and is electrically conductive; the reflective layer is connected to the via at a position corresponding to the first portion; 10. The method of claim 1, wherein the relatively deep groove cuts through at least a portion of the reflective layer. [Embodiment 19] 10. The method of any preceding embodiment, wherein the metal of the reflective layer comprises tungsten. [Embodiment 20] 10. The method of any preceding embodiment, wherein the traces of the FPC extend in an azimuth direction.

[0062] The invention is not limited to the present embodiment, and various modifications are possible within the scope of the invention. [Explanation of symbols]

[0063] 1: Ultrasound diagnostic equipment 2: Ultrasonic probe 3: Transmit / receive beamformer 4: Echo data processing section 5: Display processing section 6: Display section 7:Operation unit 8: Control unit 9: Storage part 10: Acoustic window 11, 13: Cross section 12: Acoustic lens 15, 15': Transducer element 16: Laminate 161:Second acoustic matching layer 162: Ground electrode 163: 1st acoustic matching layer 164: Piezoelectric element 165: Reflective layer 166: Large width dummy element 167: U-shaped element 168: I-shaped element 171: Section where valid elements are placed 172: Section where dummy elements are placed 173: Section with shallow and deep repeated grooves 174: Section with deep continuous grooves 175: Relatively shallow groove 176: Relatively deep groove 181: Shoulder / second part 182: Central part / first part 183: Gap 184: Side 185: Location of disconnection 187: Dicing direction 20: Flexible PCB / FPC 201: Surface 203: Back side 205: Beer 211, 213: dashed lines 215: Wiring 22: Base Block 231: Top of the probe 233: Bottom of probe 235: Azimuth direction 237: Elevation direction 24: Probe case 241:Top side part 242: Bottom side part 26: Cable 28: Module containing oscillator 30: Inner housing 301:Top side part 302: Bottom side part 38: Chassis 50: Surface

Claims

1. 1. A transducer element for an ultrasonic probe disposed on a base block including a first portion having a first curvature and a second portion having a second curvature having a radius smaller than the first curvature, a flexible printed circuit (FPC) disposed across the first portion and the second portion; a laminate including a vibrator disposed on the FPC; Including, the laminate including the vibrator includes a layer of a piezoelectric element, a laminate including the vibrator includes a relatively shallow groove that does not completely cut through the layer of the piezoelectric element and a relatively deep groove that completely cuts through the layer of the piezoelectric element; the relatively shallow groove and the relatively deep groove are arranged at a position corresponding to the first portion such that the relatively shallow groove is arranged between the relatively deep grooves; a plurality of the relatively deep grooves are arranged consecutively at a position corresponding to the second portion; A transducer element, wherein the distance between two adjacent ones of the relatively deep grooves at a position corresponding to the second portion is shorter than the distance between two adjacent ones of the relatively deep grooves at a position corresponding to the first portion.

2. the FPC includes wiring and vias connected to the wiring; the laminate including the vibrator includes a reflective layer disposed between the piezoelectric element layer and the FPC; the reflective layer contains a metal and is electrically conductive; the reflective layer is connected to the via at a position corresponding to the first portion; The transducer of claim 1 , wherein the relatively deep groove cuts at least a portion of the reflective layer. element.

3. The relatively deep groove completely cuts through the reflective layer, The transducer element of claim 2 , wherein the metal of the reflective layer comprises tungsten.

4. The transducer element according to claim 2 , wherein the wiring of the FPC extends in an azimuth direction.

5. The relatively shallow groove and the relatively deep groove are formed at a position corresponding to the first portion at a first dicing pitch; the relatively deep grooves are formed at a second dicing pitch at positions corresponding to the second portions; the pitch of the second dicing is equal to the pitch of the first dicing, The transducer element according to claim 1 , wherein the first portion and the second portion are arranged to be aligned in an azimuth direction.

6. The transducer element according to claim 1 , wherein the laminate including the transducer includes an acoustic matching layer disposed on the layer of the piezoelectric element.

7. The transducer element of claim 1 , wherein the transducer stack includes a ground electrode layer disposed on the piezoelectric element layer.

8. the relatively shallow groove cuts the piezoelectric element across the entire width of the piezoelectric element in an elevation direction; 2. The transducer element of claim 1, wherein the relatively deep groove also cuts the piezoelectric element across the entire width of the piezoelectric element in the elevation direction.

9. 1. A module for an ultrasound probe, comprising: A transducer element according to any one of claims 1 to 8, The base block; Including, The base block includes a sound absorbing material.

10. the base block includes a pair of shoulders; the first portion is disposed between the pair of shoulders; the second portion is disposed on one or both of the pair of shoulder portions; The module of claim 9 , wherein the transducer element extends beyond either or both of the pair of shoulders.

11. The module according to claim 10 , wherein the FPC is adhered to the base block without any gaps at least in a portion spanning from one of the pair of shoulder portions to the other of the pair of shoulder portions.

12. A transducer element according to any one of claims 1 to 8, The base block; An ultrasound probe having

13. an acoustic lens disposed above the transducer element; an acoustic window covering the module and the acoustic lens; a probe case covering at least the lower end of the acoustic window; Including, The ultrasound probe of claim 12 , wherein the module and the acoustic lens are sealed by the acoustic window and the probe case.

14. The ultrasonic probe according to claim 12, wherein the ultrasonic probe is a convex type ultrasonic probe.

15. The ultrasonic probe according to claim 12; an image processing unit that generates an ultrasound image based on the ultrasound signals collected by the ultrasound probe; a display device that displays the ultrasound image; An ultrasound diagnostic device comprising:

Images