Multilayer electronic components and their mounting substrates

Abstract

To provide a laminate type electronic component.SOLUTION: A laminate type electronic component according to one embodiment of the present invention includes: a main body including a dielectric layer and an internal electrode, and including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; and an external electrode including a connection part disposed on the third and fourth surfaces, an upper band part extending from the connection part to a part of the second surface, and a lower band part extending to a part of the first surface. The external electrode includes a Pd plating layer disposed on an outer surface of the lower band part. The Pd plating layer is disposed extending to a part of the connection part.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a multilayer electronic component and a mounting substrate for the same. [Background technology]

[0002] Multi-layer ceramic capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors that are attached to the printed circuit boards of various electronic products, such as visual devices like liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and serve to charge and discharge electricity.

[0003] In recent years, there has been growing interest in automotive electrical components in the industry, and multilayer ceramic capacitors are also being required to have high reliability and high strength characteristics for use in automobiles or infotainment systems.

[0004] In particular, multilayer ceramic capacitors placed around the engine compartment are exposed to high-temperature environments, which can cause mechanical stress due to expansion and contraction caused by temperature changes in the external electrodes of the multilayer ceramic capacitor and the solder that bonds the external electrodes of the multilayer ceramic capacitor to the substrate, resulting in cracks in the solder itself.

[0005] To prevent this, a method has been proposed in which the multilayer capacitor is mounted on the board using a conductive resin adhesive instead of solder, which requires a change in the structure of the plating layer of the multilayer capacitor. Summary of the Invention [Problem to be solved by the invention]

[0006] One of various objects of the present invention is to provide a multilayer electronic component with excellent reliability.

[0007] One of the various objects of the present invention is to provide a multilayer electronic component with reduced manufacturing costs.

[0008] One of the various objects of the present invention is to provide a multilayer electronic component that can be suitably mounted on a substrate using a conductive resin adhesive.

[0009] However, the scope of the present invention is not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0010] A multilayer electronic component according to one embodiment of the present invention includes a main body including dielectric layers and internal electrodes, the main body having first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces facing in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces facing in the third direction, and external electrodes including connecting portions disposed on the third and fourth surfaces, an upper band portion extending from the connecting portions to a portion of the second surface, and a lower band portion extending to a portion of the first surface, wherein the external electrodes include a Pd plating layer disposed on an outer surface of the lower band portion, and the Pd plating layer is disposed extending to a portion of the connecting portions.

[0011] A mounting substrate for a multilayer electronic component according to another embodiment of the present invention includes: a substrate on which electrode pads are arranged; a main body including a dielectric layer and internal electrodes, the main body having first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces facing in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces facing in the third direction; external electrodes including connecting portions arranged on the third and fourth surfaces, an upper band portion extending from the connecting portions to a portion of the first surface, and a lower band portion extending to a portion of the second surface, the external electrodes including a Pd plating layer arranged on an outer surface of the lower band portion, the Pd plating layer arranged to extend to a portion of the connecting portions; and a conductive resin adhesive bonding the external electrodes and the electrode pads. [Effects of the Invention]

[0012] One of the various effects of the present invention is that corrosion and deposition of the external electrodes is prevented, improving reliability.

[0013] One of the various effects of the present invention is that by optimizing the arrangement of the Pd plating layer, the reliability of the multilayer electronic component is improved while the manufacturing cost is reduced.

[0014] One of the various effects of the present invention is that it can provide a multilayer electronic component that can be suitably mounted on a substrate using a conductive resin adhesive.

[0015] However, the various beneficial advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 2] FIG. 2 is a cross-sectional view taken along II' in FIG. [Figure 3] 1 is an exploded perspective view schematically illustrating a main body according to an embodiment of the present invention. [Figure 4] 1 is a schematic perspective view of a mounting substrate on which a multilayer electronic component according to an embodiment of the present invention is mounted; [Figure 5] FIG. 5 is a cross-sectional view taken along line II-II' of FIG. [Figure 6] FIG. 2 is a cross-sectional view taken along II' in FIG. 1, showing a modified example of one embodiment of the present invention. [Figure 7] FIG. 10 is a schematic perspective view of a multilayer electronic component according to another modified example of an embodiment of the present invention. [Figure 8] FIG. 8 is a cross-sectional view taken along the line III-III' in FIG. 7. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those having average knowledge in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation.

[0018] In order to clearly explain the present invention, parts not relevant to the description are omitted in the drawings, thicknesses are exaggerated to clearly show various layers and regions, and components having the same function within the same concept are denoted by the same reference numerals. Furthermore, throughout the specification, the term "comprises" a certain component does not mean that it excludes other components, but that it may further include other components, unless otherwise specified.

[0019] In the drawings, the first direction may be defined as the thickness direction or stacking direction of the body, the second direction may be defined as the length direction of the body, and the third direction may be defined as the width direction of the body.

[0020] Multilayer electronic components FIG. 1 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention.

[0021] FIG. 2 is a cross-sectional view taken along II' in FIG.

[0022] FIG. 3 is an exploded perspective view schematically illustrating a main body according to an embodiment of the present invention.

[0023] FIG. 4 is a schematic perspective view of a mounting substrate on which a multilayer electronic component according to one embodiment of the present invention is mounted.

[0024] FIG. 5 is a cross-sectional view taken along line II-II' in FIG.

[0025] A multilayer electronic component 100 according to one embodiment of the present invention will now be described with reference to FIGS.

[0026] A multilayer electronic component 100 according to one embodiment of the present invention is a multilayer electronic component including a body 110 including a dielectric layer 111 and internal electrodes 121 and 122, having first and second surfaces 1 and 2 facing in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in the second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing in the third direction, and external electrodes 131 and 132 including connection portions A1 and A2 arranged on the third and fourth surfaces, upper band portions B1a and B2a extending from the connection portions to portions of the second surface, and lower band portions B1b and B2b extending to portions of the first surface, wherein the external electrodes include Pd plating layers 131d and 132d arranged on outer surfaces of the lower band portions, and the Pd plating layers are arranged to extend to portions of the connection portions A1 and A2.

[0027] The body 110 is formed by alternately laminating dielectric layers 111 and internal electrodes 121 and 122 .

[0028] The specific shape of the body 110 is not particularly limited, but as shown, the body 110 may have a hexahedral shape or a shape similar thereto. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process, the body 110 may have a substantially hexahedral shape, although not a hexahedral shape with perfectly straight lines.

[0029] The main body 110 may have first and second surfaces 1, 2 facing each other in a first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces 1, 2 and facing each other in a second direction, and fifth and sixth surfaces 5, 6 connected to the first and second surfaces 1, 2 and also connected to the third and fourth surfaces 3, 4 and facing each other in the third direction.

[0030] The plurality of dielectric layers 111 constituting the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 may be integrated to such an extent that they are difficult to identify without using a scanning electron microscope (SEM).

[0031] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as it can provide sufficient capacitance. For example, a barium titanate-based material, a lead complex perovskite-based material, or a strontium titanate-based material can be used. The barium titanate-based material can include a BaTiO3-based ceramic powder, and examples of the ceramic powder include BaTiO3, BaTiO3 partially solid-dissolved with Ca (calcium), Zr (zirconium), etc. 1-x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x Ca x )(Ti 1-y Zr y )O3, or Ba(Ti 1-y Zr y )O3, etc.

[0032] Furthermore, the material forming the dielectric layer 111 may be a powder of barium titanate (BaTiO3) or the like to which various ceramic additives, organic solvents, binders, dispersants, etc. may be added according to the purpose of the present invention.

[0033] The main body 110 may include a capacitance forming portion in which capacitance is formed, including a first internal electrode 121 and a second internal electrode 122 arranged inside the main body 110 and facing each other across the dielectric layer 111, and protective layers 112 and 113 formed on the upper and lower parts of the capacitance forming portion.

[0034] The capacitance forming portion is a portion that contributes to forming the capacitance of the capacitor, and can be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 sandwiched therebetween.

[0035] The upper protective layer 112 and the lower protective layer 113 may be formed by stacking a single dielectric layer or two or more dielectric layers in the vertical direction on the upper and lower surfaces of the capacitance forming portion, respectively, and basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0036] The upper protective layer 112 and the lower protective layer 113 do not include an internal electrode and may include the same material as the dielectric layer 111 .

[0037] The internal electrodes 121 and 122 may be disposed to face each other with the dielectric layer 111 interposed therebetween.

[0038] The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122 alternately arranged to face each other with a dielectric layer interposed therebetween.

[0039] The first and second internal electrodes 121 and 122 may be exposed to the third and fourth surfaces 3 and 4 of the body 110, respectively.

[0040] 2, the first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. A first external electrode 131 may be disposed on the third surface 3 of the main body and connected to the first internal electrode 121, and a second external electrode 132 may be disposed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0041] That is, the first internal electrode 121 is connected to the first external electrode 131 but not to the second external electrode 132, and the second internal electrode 122 is connected to the second external electrode 132 but not to the first external electrode 131. Therefore, the first internal electrode 121 is formed at a certain distance from the fourth surface 4, and the second internal electrode 122 is formed at a certain distance from the third surface 3.

[0042] The first and second internal electrodes 121 and 122 may be electrically isolated from each other by a dielectric layer 111 disposed therebetween.

[0043] Referring to FIG. 3, the body 110 can be formed by alternately stacking dielectric layers 111 on which first internal electrodes 121 are printed and dielectric layers 111 on which second internal electrodes 122 are printed in the thickness direction (first direction) and then firing the layers.

[0044] There are no particular limitations on the material for forming the internal electrodes 121 and 122, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, on a ceramic green sheet.

[0045] The conductive paste for the internal electrodes may be printed by a screen printing method or a gravure printing method, but the present invention is not limited thereto.

[0046] The external electrodes 131, 132 may include connection portions A1, A2 arranged on the third and fourth surfaces of the main body 110, upper band portions B1a, B2a extending from the connection portions to a portion of the second surface, and lower band portions B1b, B2b extending to a portion of the first surface.

[0047] The external electrodes 131, 132 may include a first external electrode 131 disposed on the third surface and a second external electrode 132 disposed on the fourth surface.

[0048] Referring to Figure 2, when the area of ​​the first external electrode 131 is divided according to its placement position, the first external electrode 131 may include a first connection portion A1 arranged on the third surface 3 of the main body, a first upper band portion B1a extending from the first connection portion A1 to a portion of the second surface 2, and a first lower band portion B1b extending from the first connection portion A1 to a portion of the first surface 1.

[0049] When the area of ​​the second external electrode 132 is divided according to its placement position, the second external electrode 132 can include a second connection portion A2 arranged on the fourth surface 4 of the main body, a second upper band portion B2a extending from the second connection portion A2 to a portion of the second surface 2, and a second lower band portion B2b extending from the second connection portion A2 to a portion of the first surface 1.

[0050] The external electrodes 131, 132 include Pd plating layers 131d, 132d disposed on the outer surfaces of the lower band portions B1b, B2b, and the Pd plating layers 131d, 132d may be disposed extending to a portion of the connecting portions A1, A2. In this case, since the Pd plating layers 131d, 132d are disposed extending only to a portion of the connecting portions A1, A2, no Pd plating layer is disposed on the outer surfaces of the upper band portions B1a, B2a of the external electrodes 131, 132.

[0051] Generally, to mount a multilayer electronic component on a substrate, solder is used to bond the external electrodes of the multilayer electronic component to the electrode pads of the substrate. However, when solder is used, mechanical stress occurs due to expansion and contraction caused by temperature changes in the external electrodes of the multilayer electronic component and the solder bonding the external electrodes to the substrate, which can cause cracks in the solder itself.

[0052] To prevent this, a method has been proposed in which a multilayer capacitor is mounted on a board using a conductive resin adhesive instead of solder. The heat curing temperature of the conductive resin adhesive is lower than the melting point of the solder. Therefore, when a conductive resin adhesive is used instead of solder, thermal stress can be reduced, thereby improving reliability.

[0053] When mounting on a substrate using a conductive resin adhesive, it is preferable to use a Pd plating layer as the outermost plating layer to prevent corrosion and deposition of the external electrodes and improve reliability. However, because Pd is expensive, this increases the manufacturing cost of multilayer electronic components.

[0054] According to the present invention, by disposing the Pd plating layers 131d, 132d only on a portion of the external electrodes, it is possible to prevent corrosion and deposition of the external electrodes and improve reliability while reducing manufacturing costs. That is, by disposing the Pd plating layers 131d, 132d only on the areas that come into contact with the conductive resin adhesives 230, 240, it is possible to reduce manufacturing costs while also ensuring the effects of preventing corrosion and deposition of the external electrodes and improving reliability, similar to when the Pd plating layers are disposed on the entire outer surfaces of the external electrodes.

[0055] The Pd plating layers 131d and 132d have excellent corrosion resistance, which can increase the affinity between the external electrodes 131 and 132 and the conductive resin adhesives 230 and 240, thereby improving the electrical connectivity between the external electrodes 131 and 132 and the conductive resin adhesives 230 and 240.

[0056] On the one hand, the Pd plating layers 131d and 132d of the present invention can mean those made of a metal containing Pd. However, it does not only mean the case where the Pd plating layers 131d and 132d are composed of only Pd, but can include a Pd-Ni alloy or other Pd alloys, and may contain other metal elements other than Pd.

[0057] There is no particular need to limit the method for forming the Pd plating layers 131d and 132d in a form extending from the outer surfaces of the lower band portions B1b and B2b to the connection portions A1 and A2.

[0058] For example, by immersing only a part of the multilayer electronic component in a Pd plating bath for Pd plating, a Pd plating layer can be formed only on a part of the external electrode.

[0059] As another example, after forming an insulating layer in a region of the external electrode excluding the region where the Pd plating layer is to be disposed, a Pd plating layer can be formed by performing Pd plating. At this time, the method for forming the insulating layer is not particularly limited. For example, the insulating layer can be formed by coating an insulating substance. Also, the insulating layer can be removed later, but it does not have to be removed.

[0060] Referring to FIG. 2, when the distance in the first direction from the lowest point to the highest point of the external electrode in the first direction is T, and the distance in the first direction from the lowest point of the external electrode in the first direction to the highest point of the Pd plating layer in the first direction is h, 0.44T < h can be satisfied.

[0061] Here, T means the thickness of the multilayer electronic component, and h can mean the maximum height of the Pd plating layer.

[0062] When h is 0.44T or less, the height h of the Pd plating layer becomes lower than the height hs of the conductive resin adhesives 230 and 240 that must be ensured at a minimum during mounting, and there is a risk that the mechanical bonding force or electrical connectivity with the electrode pads 221 and 222 of the substrate cannot be ensured sufficiently.

[0063] The upper limit of h does not need to be particularly limited. However, since the Pd plating layers 131d and 132d are arranged to extend to a part of the connection portions A1 and A2, no Pd plating layer is arranged on the outer surfaces of the upper band portions B1a and B2a of the external electrodes 131 and 132.

[0064] Meanwhile, the required mechanical bonding strength and / or electrical connectivity between the multilayer electronic component 100 and the substrate 210 may vary depending on the thickness T of the multilayer electronic component, and the required height hs of the conductive adhesive may vary accordingly. Therefore, the height h of the Pd plating layer can be appropriately adjusted depending on the thickness T of the multilayer electronic component.

[0065] In one embodiment, when T is 2375 μm or more and 2625 μm or less, the height of the conductive adhesive to ensure the required mechanical bonding strength and electrical connectivity between the multilayer electronic component and the substrate is about 1100 μm. Therefore, h may be greater than 1100 μm. In this case, the multilayer electronic component may have a size of 3225 (length 3.2 mm, width 2.5 mm).

[0066] In one embodiment, when T is 1520 μm or more and 1680 μm or less, the height of the conductive adhesive to ensure the required mechanical bonding strength and electrical connectivity between the multilayer electronic component and the substrate is about 790 μm. Therefore, h may be greater than 790 μm. In this case, the multilayer electronic component may have a size of 3216 (length 3.2 mm, width 1.6 mm).

[0067] In one embodiment, when T is between 1187.5 μm and 1312.5 μm, the height of the conductive adhesive to ensure the required mechanical bonding strength and electrical connectivity between the multilayer electronic component and the substrate is about 760 μm. Therefore, h may exceed 760 μm. In this case, the multilayer electronic component may have a size of 2012 (length 2.0 mm, width 1.2 mm).

[0068] In one embodiment, when T is 760 μm or more and 840 μm or less, the height of the conductive adhesive to ensure the required mechanical bonding strength and electrical connectivity between the multilayer electronic component and the substrate is about 730 μm. Therefore, h may be greater than 730 μm. In this case, the multilayer electronic component may have a size of 1608 (length 1.6 mm, width 0.8 mm).

[0069] In one embodiment, when T is 475 μm or more and 525 μm or less, the height of the conductive adhesive to ensure the required mechanical bonding strength and electrical connectivity between the multilayer electronic component and the substrate is about 455 μm. Therefore, h may be greater than 455 μm. In this case, the multilayer electronic component may have a size of 1005 (length 3.2 mm, width 1.6 mm).

[0070] In this case, the lowest and highest points in the first direction of the external electrodes 131 and 132, the highest point in the first direction of the Pd plating layer, T, and h may be measured on a cross section cut in the first and second directions at the center of the body in the third direction. That is, they may be values ​​measured by exposing the cross section as shown in FIG. 2. In addition, the center of the body in the third direction may refer to a 1 / 2 point in the third direction of the body. The observation tool for measurement is not particularly limited, and for example, an optical microscope, a scanning electron microscope (SEM), etc. may be used.

[0071] Generally, the size of the external electrodes 131, 132 in the first direction is maximum when measured at the center of the body 110 in the third direction, and may decrease gradually as the distance from the center in the third direction increases. Therefore, it is preferable to measure the size based on a cross section cut in the first and second directions at the center of the body 110 in the third direction. Meanwhile, some measurement errors may occur due to processes such as cutting and polishing for exposing the cross sections in the first and second directions, but it should be noted that values ​​within such error ranges are within the ranges of values ​​presented in the present invention.

[0072] In this case, the external electrodes 131, 132 include electrode layers 131a, 132a arranged on the main body, conductive resin layers 131b, 132b arranged on the electrode layers, and Ni plating layers 131c, 132c arranged on the conductive resin layers, and the Pd plating layers 131d, 132d can be arranged on the outer surfaces of the Ni plating layers 131c, 132c.

[0073] The electrode layers 131a and 132a may be formed using any material that has electrical conductivity, such as a metal, and the specific material may be determined in consideration of electrical properties, structural stability, etc.

[0074] For example, the electrode layers 131a, 132a can include conductive metal and glass.

[0075] The conductive metal used for the electrode layers 131a and 132a is not particularly limited as long as it is a material that can be electrically connected to the internal electrodes to form capacitance, and may include, for example, one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0076] The electrode layers 131a and 132a can be formed by applying a conductive paste prepared by adding glass frit to the conductive metal powder, and then firing the paste.

[0077] In addition, the electrode layers 131a and 132a may be formed using an atomic layer deposition (ALD) method, a molecular layer deposition (MLD) method, a chemical vapor deposition (CVD) method, a sputtering method, or the like.

[0078] Alternatively, the electrode layers 131a and 132a may be formed on the main body 110 by transferring a sheet containing a conductive metal.

[0079] The conductive resin layers 131b and 132b may contain a conductive metal and a base resin.

[0080] The conductive metal contained in the conductive resin layers 131b and 132b serves to electrically connect the conductive resin layers 131b and 132b to the electrode layers 131a and 132a.

[0081] The conductive metal contained in the conductive resin layers 131b and 132b is not particularly limited as long as it is a material that can be electrically connected to the electrode layers 131a and 132a, and may include, for example, one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0082] The conductive metal contained in the conductive resin layers 131b and 132b may contain one or more of spherical powder and flaky powder, i.e., the conductive metal may consist of only flaky powder, only spherical powder, or a mixture of flaky powder and spherical powder.

[0083] Here, the spherical powder may include a shape that is not perfectly spherical, for example, a shape in which the ratio of the length of the major axis to the length of the minor axis (major axis / minor axis) is 1.45 or less.

[0084] The flake-like powder means a powder having a flat and elongated shape, and is not particularly limited, but may have, for example, a ratio of the length of the major axis to the length of the minor axis (major axis / minor axis) of 1.95 or more.

[0085] The lengths of the major and minor axes of the spherical powder and flaky powder can be measured from images obtained by scanning a cross section (LT cross section) in the first and second directions cut at the center of the third direction of the multilayer electronic component with a scanning electron microscope (SEM).

[0086] The base resin contained in the conductive resin layers 131b and 132b serves to ensure bonding and absorb shock.

[0087] The base resin contained in the conductive resin layers 131b and 132b is not particularly limited as long as it has bonding and shock absorbing properties and can be mixed with conductive metal powder to form a paste, and may include, for example, one or more of epoxy resins and acrylic resins.

[0088] The conductive resin layers 131b and 132b may contain a conductive metal, an intermetallic compound, and a base resin.

[0089] The Ni plating layers 131c and 132c can serve to prevent corrosion of the electrode layers 131a and 132a and the conductive resin layers 131b and 132b.

[0090] The Ni plating layers 131c, 132c are easily oxidized, making it difficult to ensure sufficient electrical connectivity with the conductive resin adhesive. However, according to the present invention, the Pd plating layers 131d, 132d are disposed on the outer surfaces of the Ni plating layers 131c, 132c, thereby ensuring sufficient electrical connectivity with the conductive resin adhesive.

[0091] FIG. 6 shows a modified example of the embodiment of the present invention, and is a cross-sectional view taken along II' in FIG.

[0092] According to a modified example of the embodiment of the present invention, the external electrodes 131′, 132′ do not include a conductive resin layer. The external electrodes 131′, 132′ include electrode layers 131a′, 132a′ disposed on the main body and Ni plating layers 131c, 132c disposed on the electrode layers, and the Pd plating layers 131d, 132d may be disposed on the outer surfaces of the Ni plating layers 131c, 132c.

[0093] Fig. 7 is a schematic perspective view of a multilayer electronic component according to another modified example of one embodiment of the present invention, and Fig. 8 is a cross-sectional view taken along line III-III' in Fig. 7.

[0094] 7 and 8, in a multilayer electronic component 200 according to another modified example of an embodiment of the present invention, insulating layers 141 and 142 may be disposed on the outer surfaces of the external electrodes 131 and 132 in areas where the Pd plating layer is not formed.

[0095] This makes it possible to more easily and accurately control the height h of the Pd plating layer, more reliably preventing corrosion and precipitation in areas where the Pd plating layer is not formed, and further improving reliability.

[0096] Mounting board for multilayer electronic components A multilayer electronic component mounting substrate 1000 according to another embodiment of the present invention will now be described in detail.

[0097] A multilayer electronic component mounting substrate 1000 according to another embodiment of the present invention is a form in which the multilayer electronic component 100 according to one embodiment of the present invention is mounted. Therefore, the description will be made with reference to Fig. 4, which is a schematic perspective view of a mounting substrate on which the multilayer electronic component according to one embodiment of the present invention is mounted, and Fig. 5, which is a cross-sectional view taken along line II-II' in Fig. 4, and descriptions that overlap with features of the multilayer electronic component 100 according to one embodiment of the present invention will be omitted.

[0098] 4 and 5, a mounting substrate 1000 for a multilayer electronic component includes a substrate 210 on which electrode pads 221 and 222 are arranged, a dielectric layer 111, and internal electrodes 121 and 122, a main body 110 having first and second surfaces 1 and 2 facing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing each other in a second direction, fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing each other in a third direction, connection portions A1 and A2 arranged on the third and fourth surfaces, and a wiring pattern extending from the connection portions to the second surface. and a laminated electronic component (100) including external electrodes (131, 132) each including upper band portions (B1a, B2a) extending to a portion of the first surface and lower band portions (B1b, B2b) extending to a portion of the first surface, wherein the external electrodes include Pd plating layers (131d, 132d) arranged on the outer surfaces of the lower band portions, the Pd plating layers extending to a portion of the connection portions (A1, A2), and conductive resin adhesives (230, 240) bonding the external electrodes (131, 132) to the electrode pads (221, 222).

[0099] In this case, the electrode pads 221 and 222 may be spaced apart from each other and electrically connected to the first and second external electrodes 131 and 132 of the multilayer electronic component 100, respectively.

[0100] The thermosetting temperature of the conductive resin adhesives 230 and 240 is lower than the melting point of the solder, so when the conductive resin adhesive is used instead of the solder, thermal stress can be reduced, thereby improving reliability.

[0101] The conductive resin adhesives 230 and 240 may include a conductive metal and a base resin. The conductive metal serves to ensure electrical connectivity between the external electrodes 131 and 132 and the electrode pads 221 and 222, and the base resin serves to reduce thermal stress and prevent cracks. The type of base resin is not particularly limited and may be, for example, a thermosetting resin such as an epoxy resin.

[0102] In this case, the highest point of the Pd plating layers 131d, 132d in the first direction can exceed the highest point of the conductive resin adhesive 230, 240 in the first direction. That is, the height hs of the conductive resin adhesive can be lower than the height h of the Pd plating layer. As a result, by disposing the Pd plating layers 131d, 132d only in parts, it is possible to prevent corrosion and deposition of the external electrodes 131, 132 and improve reliability while reducing manufacturing costs. That is, by disposing the Pd plating layers 131d, 132d only in the areas that come into contact with the conductive resin adhesive 230, 240, it is possible to prevent corrosion and deposition of the external electrodes and improve reliability while reducing manufacturing costs, similar to when the Pd plating layer is disposed on the entire outer surface of the external electrodes.

[0103] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited only by the appended claims. Therefore, various substitutions, modifications, and alterations can be made by those skilled in the art without departing from the technical spirit of the present invention as set forth in the claims, and these also fall within the scope of the present invention. [Explanation of symbols]

[0104] 100 Multilayer electronic components 110 Main Unit 111 Dielectric layer 121, 122 Internal electrode 131, 132 External electrode 131a, 132a electrode layer 131b, 132b Conductive resin layer 131c, 132c Ni plating layer 131d, 132d Pd plating layer 141, 142 insulating layer 1000 Mounting Boards 210 Substrate 221, 222 electrode pads 230, 240 Conductive resin adhesive

Claims

1. a body including a dielectric layer and an internal electrode, the body having first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces facing each other in the third direction; an external electrode including connection portions disposed on the third and fourth surfaces, an upper band portion extending from the connection portions to a portion of the second surface, and a lower band portion extending to a portion of the first surface, the external electrode includes a Pd plating layer disposed on the outer surface of the lower band portion, the Pd plating layer extending from the lower band portion to a portion of the connection portion and disposed so as to partially cover the connection portion.

2. In a cross section cut in the first and second directions at the center of the body in the third direction, when the distance in the first direction from the lowest point to the highest point of the external electrode in the first direction is T and the distance in the first direction from the lowest point of the external electrode in the first direction to the highest point of the Pd plating layer in the first direction is h, The multilayer electronic component according to claim 1 , wherein 0.44T<h is satisfied.

3. The T is 2375 μm or more and 2625 μm or less, The multilayer electronic component according to claim 2 , wherein h is greater than 1100 μm.

4. The T is 1520 μm or more and 1680 μm or less, The multilayer electronic component according to claim 2 or 3, wherein h exceeds 790 μm.

5. The T is 1187.5 μm or more and 1312.5 μm or less, The multilayer electronic component according to any one of claims 2 to 4, wherein h exceeds 760 µm.

6. The T is 760 μm or more and 840 μm or less, The multilayer electronic component according to any one of claims 2 to 5, wherein h exceeds 730 µm.

7. The T is 475 μm or more and 525 μm or less, The multilayer electronic component according to any one of claims 2 to 6, wherein h exceeds 455 µm.

8. the external electrode includes an electrode layer disposed on the main body, a conductive resin layer disposed on the electrode layer, and a Ni plating layer disposed on the conductive resin layer, 8. The multilayer electronic component according to claim 1, wherein the Pd plating layer is disposed on an outer surface of the Ni plating layer.

9. the external electrode includes an electrode layer disposed on the main body and a Ni plating layer disposed on the electrode layer; 9. The multilayer electronic component according to claim 1, wherein the Pd plating layer is disposed on an outer surface of the Ni plating layer.

10. 10. The multilayer electronic component according to claim 1, wherein an insulating layer is disposed on the outer surface of the external electrodes in a region where the Pd plating layer is not formed.

11. 11. The multilayer electronic component according to claim 1, wherein the Pd plating layer is not disposed on the outer surface of the upper band portion of the external electrodes.

12. a substrate on which electrode pads are arranged; a multilayer electronic component including: a main body including a dielectric layer and an internal electrode, the main body having first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces facing in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces facing in the third direction; and an external electrode including connection portions disposed on the third and fourth surfaces, an upper band portion extending from the connection portions to a portion of the second surface, and a lower band portion extending to a portion of the first surface, the external electrode including a Pd plating layer disposed on an outer surface of the lower band portion, the Pd plating layer extending from the lower band portion to a portion of the connection portion so as to partially cover the connection portion; a conductive resin adhesive that bonds the external electrodes and the electrode pads together, The Pd plating layer is disposed on the outer surface of the external electrode in a region that comes into contact with the conductive resin adhesive.

13. The multilayer electronic component mounting substrate according to claim 12 , wherein the highest point of the Pd plating layer in the first direction exceeds the highest point of the conductive resin adhesive in the first direction.

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