Alignment device and method for forming external electrodes

Abstract

Provided is an alignment device with which it is possible to accurately hold a plurality of workpieces at a plurality of set hold positions respectively, and to obtain sufficient filling factor.　The alignment device is provided with: a pallet 20 comprising a planar portion 21 and a side wall portion 25 defining a surface 21a of the planar portion 21 as an alignment area 22 to which chips 1 as a plurality of workpieces are supplied, the pallet 20 being provided with vibrations; recess portions 23 as a plurality of hold positions set in the alignment area 22 to hold an alignment state of the plurality of chips 1; a supply opening 26 provided by opening a part of the side wall portion 25 of the pallet 20 and through which the plurality of chips 1 can be supplied from the outside of the side wall portion 25 into the alignment area 22; and a first magnet 40 as a moving / holding portion disposed on at least one of the planar portion 21 and the side wall portion 25 to cause the plurality of chips 1, having been supplied through the supply opening 26 to the alignment area 22, to be respectively moved to the plurality of recess portions 23 and be held in the recess portions 23.

Description

[Technical Field]

[0001] The present invention relates to an alignment device for aligning a plurality of workpieces such as chip components, and a method for forming external electrodes on the workpieces. [Background technology]

[0002] Conventionally, in the case of chip-type electronic components such as semiconductor devices and multilayer ceramic capacitors, an alignment device may be used to align a plurality of loose components during the manufacturing process or after manufacture in a specific direction. For example, Patent Document 1 discloses, as an example of such an alignment device, a transfer jig that uses a plurality of recesses that open upward as holding positions and stores the workpieces one by one in the recesses. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-75519 Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional alignment devices such as the above-mentioned transfer jig, it was difficult to ensure that all of the recesses were filled with workpieces, resulting in a low filling rate for the recesses.Furthermore, it was difficult to securely hold the workpieces in the recesses, resulting in problems such as the workpieces becoming unstable in their position within the recesses or jumping out of the recesses due to vibration.

[0005] Therefore, the main object of the present invention is to provide an alignment device that can accurately hold multiple workpieces at each of multiple set holding positions, thereby achieving a sufficient filling rate. [Means for solving the problem]

[0006] The alignment device of the present invention includes a flat plate portion having a front surface and a back surface, and a side wall portion that rises from the front surface side of the flat plate portion and partitions the inner surface as an alignment area where multiple workpieces are supplied, and is equipped with a pallet to which vibration is applied, a plurality of holding positions that are set in the alignment area and at which each of the multiple workpieces supplied to the alignment area is positioned to maintain the alignment of the multiple workpieces, a supply port that is set by opening a portion of the side wall portion of the pallet and that allows multiple workpieces to be supplied to the alignment area from outside the side wall portion, and a moving holding unit that is positioned relative to the flat plate portion and moves each of the multiple workpieces supplied to the alignment area from the supply port to each of the multiple holding positions and holds them at that holding position. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide an alignment device that can accurately hold a plurality of workpieces at each of a plurality of set holding positions and can obtain a sufficient filling rate. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a plan view schematically showing an alignment device according to a first embodiment and a linear feeder connected to the alignment device. [Figure 2] FIG. 1 is a perspective view showing a tip as a workpiece according to a first embodiment. [Figure 3] FIG. 2 is a perspective view showing a pallet provided in the alignment device according to the first embodiment. [Figure 4] FIG. 2 is a plan view of a pallet provided in the aligning device according to the first embodiment. [Figure 5] 5 is a diagram showing a schematic configuration of an alignment device, including a cross-sectional view corresponding to line VV in FIG. 4. FIG. [Figure 6] FIG. 2 is an enlarged cross-sectional view showing a state in which chips are accommodated in recesses of the pallet according to the first embodiment. [Figure 7] FIG. 7 is a view taken along arrow VII in FIG. 6. [Figure 8]3 is a flowchart showing a method for forming external electrodes according to an embodiment in the order of steps. [Figure 9] 5A to 5I are transition diagrams showing the movement of the chip in accordance with the steps of the method for forming external electrodes according to the embodiment, in the order of (a) to (i). [Figure 10] FIG. 10 is a plan view of an alignment device according to a second embodiment. [Figure 11] FIG. 10 is a cross-sectional view of an alignment device according to a second embodiment. [Figure 12] FIG. 10 is a cross-sectional view of an alignment device according to a third embodiment. [Figure 13] FIG. 10 is a cross-sectional view of an alignment device according to a fourth embodiment. [Figure 14] FIG. 10 is a cross-sectional view of an alignment device according to a fifth embodiment. [Figure 15] FIG. 10 is a plan view showing an alignment device according to a sixth embodiment. [Figure 16] FIG. 13 is a cross-sectional view of an alignment device according to a seventh embodiment. [Figure 17] FIG. 13 is a cross-sectional view of a modified example of the alignment device according to the seventh embodiment. [Figure 18] FIG. 13 is a plan view of an alignment device according to an eighth embodiment. [Figure 19] FIG. 13 is a cross-sectional view of an alignment device according to an eighth embodiment. [Figure 20] FIG. 13 is a plan view of an alignment device according to a modified example of the eighth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the present invention will be described. [Alignment device] 1 is a plan view showing an alignment device 10 according to the first embodiment and a linear feeder 100 connected to the alignment device 10. A plurality of chips 1 are supplied to the alignment device 10 from the linear feeder 100. The chips 1 are an example of workpieces.

[0010] As shown in Figure 2, chip 1 according to the embodiment is a rectangular parallelepiped microelectronic component having a length direction L, a width direction W perpendicular to length direction L, and a thickness direction T perpendicular to length direction L and width direction W. Chip 1 has a first end face 1a and a second end face 2a at both ends in the length direction. Here, one end in the length direction on the side of first end face 1a is referred to as first end face side end 1b, and the other end in the length direction on the side of second end face 2a is referred to as second end face side end 2b. The chip 1 has a pair of main surfaces 1c facing each other in the thickness direction T, and a pair of side surfaces 1d facing each other in the width direction W.

[0011] The chip 1 of the embodiment is a laminate element in a multilayer ceramic capacitor before external electrodes are formed on the end 1b on the first end face side and the end 2b on the second end face side. The laminate element is a multilayer structure in which internal electrode layers and dielectric ceramic layers are alternately stacked. The chip 1 of the embodiment is a laminate element in which the internal electrode layers contain Ni or the like and thus have magnetism.

[0012] The aligning device 10 of the embodiment is a device that aligns a plurality of chips 1 supplied from a linear feeder 100 in a state where the length direction of the chips 1 is aligned in the same direction and arranged in a matrix.

[0013] Fig. 3 is a perspective view of a pallet 20 provided in the alignment device 10. Fig. 4 is a plan view of the pallet 20. Fig. 5 is a diagram schematically showing the configuration of the alignment device 10, including a cross-sectional view corresponding to line VV in Fig. 4. 5, the alignment device 10 includes a pallet 20, a plurality of first magnets 40, and an imaging unit 50. The first magnets 40 are an example of a moving holder.

[0014] The pallet 20 has a pallet body 29 and a base 30 . The pallet body 29 includes a flat plate portion 21 and a side wall portion 25 provided on the periphery of the flat plate portion 21. The flat plate portion 21 is a rectangular plate-like member having a front surface 21a and a back surface 21b. The pallet body 29 is installed with the front surface 21a facing upward and in a substantially horizontal state. The side wall portion 25 rises toward the front surface 21a of the flat plate portion 21 and surrounds the flat plate portion 21. The front surface 21a of the flat plate portion 21 surrounded by the side wall portion 25 is defined as an alignment area 22 to which a plurality of chips 1 are supplied. The flat plate portion 21 and the side wall portion 25 may be separate bodies or may be integral. The side wall portion 25 may be positioned not on the periphery of the flat plate portion 21 but inside the periphery.

[0015] As shown in Figure 4, the pallet 20 of this embodiment has a rectangular shape in a plan view. A supply port 26 is provided in the center of the short side of one side (the lower side in Figure 4) of the pallet 20, allowing multiple chips 1 to be supplied to the alignment area 22. The supply port 26 is provided by cutting out a portion of the circumferential direction of the side wall portion 25 to open it. The end of the linear feeder 100 shown in Figure 1 is located at the supply port 26. The chips 1 are supplied from the linear feeder 100 to the alignment area 22 through the supply port 26. The supply port 26 is an entrance through which multiple chips 1 are supplied from the outside of the side wall portion 25 to the alignment area 22.

[0016] A plurality of holding positions 70 are set in the alignment area 22. The holding positions 70 are positions where the chips 1 are held. In FIG. 4, the holding positions 70 are shown as shapes corresponding to cross sections (WT cross sections) along the width direction W and height direction T assuming that the chips 1 are placed vertically. In the first embodiment, a recess 23 is provided at each of the plurality of holding positions 70.

[0017] As shown in FIG. 4, in the alignment area 22, between the side wall portion 25 and the plurality of recesses 23 arranged on the outermost side, there is provided a surplus portion 24 where no recesses 23 are arranged.

[0018] As shown in Figures 6 and 7, the recess 23 is a depression surrounded by a cylindrical inner wall surface 23a and a bottom surface 23b, and has an opening 23c that opens to the surface 21a. The axial direction of the inner wall surface 23a is approximately perpendicular to the surface 21a. As shown in Figure 4, the multiple recesses 23 in this embodiment are arranged in a matrix of 4 rows and 5 columns, with 20 recesses 23. The intervals between adjacent recesses 23 are approximately equal, and the multiple chips 1 are evenly arranged. Note that the number and arrangement of the recesses 23 are merely examples and are not limited to these.

[0019] The diameter of the recess 23 is slightly larger than the diagonal length between the first end face 1a and the second end face 2a of the chip 1. The depth of the recess 23 is slightly shorter than the length of the chip 1 (the dimension in the longitudinal direction L). One chip 1 can be accommodated in the recess 23 in a vertically inserted position, with the longitudinal direction aligned vertically. The chip 1 enters the recess 23 in a vertically inserted position by passing through the opening 23c from the end 1b on the first end face side or the end 2b on the second end face side along the inner wall surface 23a. As shown in FIG. 7, the chip 1 maintains its vertically inserted position by having its four corners 1e extending in the longitudinal direction approach or contact the inner wall surface 23a. Because the depth of the recess 23 is slightly shorter than the length of the chip 1, the longitudinal ends of the chip 1 protrude from the opening 23c by a certain distance above the surface 21a, as shown in FIG. 6.

[0020] The chip 1 supplied to the alignment area 22 from the supply port 26 moves from the front end 20a, which is the end of the pallet 20 on the supply port 26 side, toward the back end 20b on the opposite side of the supply port 26, and is stored in the recess 23 during the movement.

[0021] The base 30 is a plate-like member having dimensions in a plan view equivalent to those of the pallet body 29. The pallet body 29 is placed on an upper surface 30a of the base 30. The pallet body 29 is preferably fixed to the base 30 in a detachable manner.

[0022] As shown in FIG. 5, the upper surface 30a of the base 30 is provided with a plurality of magnet storage sections 31 corresponding to each of the recesses 23 arranged in each of the plurality of holding positions 70 of the pallet 20. The magnet storage sections 31 are recesses that open to the upper surface 30a and are arranged directly below each of the recesses 23. A first magnet 40 is fitted into and accommodated in each of the plurality of magnet storage sections 31. A plurality of first magnets 40 are arranged on the back surface 21b side of the flat plate portion 21 of the pallet main body 29, corresponding to each of the plurality of recesses 23. The first magnet 40 in the first embodiment is an electromagnet whose magnetic force is turned on and off by turning on and off current supply. It is preferable that current supply to each of the plurality of first magnets 40 be turned on and off individually.

[0023] The linear feeder 100 shown in FIG. 1 is installed so as to extend substantially horizontally toward the alignment device 10. The end of the linear feeder 100 is located at the supply port 26 of the alignment device 10. Multiple chips 1 are fed onto the linear feeder 100, which vibrates under predetermined conditions to continuously transport them toward the alignment device 10. The chips 1 are transported individually or in groups while being pushed by the following chips 1, and are supplied to the alignment device 10 in loose form from the supply port 26. In the alignment device 10, vibrations are applied to the pallet 20 by a vibration source (not shown). The vibrating pallet 20 moves the chips 1 from the front end 20a to the back end 20b. The rectangular parallelepiped chips 1 tend to move horizontally, with the main surface 1c or side surface 1d in contact with the surface 21a.

[0024] Vibrations may not be directly applied to the pallet 20, but vibrations from a linear feeder 100 connected to the pallet 20 may be transmitted to the pallet 20, causing the pallet 20 to vibrate, thereby moving the chips 1 within the pallet 20. In other words, vibrations from the linear feeder 100 connected to the supply port 26 of the pallet 20 may be transmitted to the pallet 20, causing the pallet 20 to be subjected to a vibration common to that of the linear feeder 100. This allows the pallet 20 and the linear feeder 100 to share a vibration source, thereby simplifying the configuration.

[0025] In the first embodiment, as shown in Fig. 5, an imaging unit 50 is disposed above the pallet 20. The imaging unit 50 is a camera capable of capturing an image of the entire alignment area 22. The image captured by the imaging unit 50 is displayed on a monitor 51. By observing the monitor 51, the storage status of the chips 1 in the recesses 23 can be ascertained.

[0026] According to the alignment device 10 of the first embodiment having the above-described configuration, a plurality of chips 1 supplied loose from the linear feeder 100 to the alignment area 22 are moved to each recess 23 by the attractive force of the first magnet 40, which is energized to turn on its magnetic force, and are accommodated one by one in the recess 23 in a vertically inserted position. As described above, the chips 1 are laminate elements of a multilayer ceramic capacitor in which internal electrode layers containing Ni or the like are stacked, and therefore have magnetism. Therefore, the chips 1 can be attracted to the first magnet 40.

[0027] When one chip 1 has been accommodated in each of the recesses 23, the multiple chips 1 are aligned in a 4 row by 5 column pattern corresponding to the recesses 23. The accommodation status of the chips 1 in the recesses 23 can be ascertained by watching the monitor 51, and the power to the first magnet 40 corresponding to the recess 23 in which the chip 1 has been accommodated, i.e., the first magnet 40 directly below that recess 23, can be turned off, and the power to the first magnet 40 corresponding to that recess 23 can be continued until the chip 1 is accommodated.

[0028] According to the alignment device 10 of the first embodiment, each of the plurality of chips 1 supplied from the feeder 100 to the alignment area 22 of the pallet 20 moves from the front end 20a to the rear end 20b due to the vibration of the pallet 20. During the movement, the chips are attracted by the first magnet 40 and accommodated one by one in the recesses 23, and are held within the recesses 23. This allows each of the plurality of chips 1 to be accurately held in each of the recesses 23 provided at each of the plurality of holding positions 70. Because the chips 1 are attracted by the first magnet 40 and held in the recesses 23, they are prevented from flying out of the recesses 23 even when the pallet 20 is vibrating. Therefore, chips 1 are easily filled into all of the plurality of recesses 23, thereby achieving a sufficient filling rate.

[0029] [External electrode formation method] Next, an example of a method for forming external electrodes on each of the end portions 1b on the first end face side and the end portions 2b on the second end face side of multiple chips 1 using the alignment device 10 of the first embodiment will be described with reference to Figures 8 and 9.

[0030] Fig. 8 is a flowchart showing the process steps of the method for forming external electrodes according to the embodiment. Fig. 9 is a transition diagram showing the movement of the chip 1 according to the process steps in the order of (a) to (i). For convenience of explanation, Figs. 9(a) to (i) show one chip 1 as a representative, but in reality, all chips 1 accommodated in multiple recesses 23 are processed collectively in the same manner.

[0031] First, vibration is applied to the pallet 20 of the alignment device 10 (step S101). Next, the linear feeder 100 transports a plurality of chips 1 toward the alignment device 10 and supplies the plurality of chips 1 to the alignment area 22 of the pallet 20 through the supply port 26 (step S102). Each of the plurality of chips 1 is attracted by the first magnet 40 and moves to a plurality of recesses 23. As shown in FIG. 9(a), one end of each chip 1 is inserted vertically into the recess 23 and held therein (step S103). Here, the end that enters the recess 23 and contacts the bottom surface 23b as a result is referred to as the first end surface end 1b, and the end that protrudes from the opening 23c of the recess 23 toward the surface 21a of the flat plate portion 21 and moves away from the surface 21a is referred to as the second end surface end 2b. That is, in step S103, the end 1b on the first end face side of the chip 1 is held in the recess 23, and the end 2b on the second end face side is held in a state spaced apart from the surface 21a of the pallet 20.

[0032] 9(b), the second end face side end portions 2b of the plurality of chips 1 held in the plurality of recesses 23 are collectively held by a second holding sheet 220 (step S104). The second holding sheet 220 includes a base material 221 and an adhesive layer 222 formed on one side of the base material 221. The second end face 2a of each chip 1 is pressed against the adhesive layer 222 of the second holding sheet 220, thereby adhesively holding the second end face side end portions 2b to the second holding sheet 220.

[0033] Next, as shown in FIG. 9(c), the multiple chips 1 held by the second holding sheet 220 are collectively removed from the recesses 23 (step S105). Next, first external electrodes 5A are collectively formed as external electrodes on the exposed first end surface side ends 1b of the multiple chips 1 held by the second holding sheet 220 (step S106). In step S106, as shown in FIG. 9(d), the first end surface side ends 1b of the multiple chips 1 held by the second holding sheet 220 are immersed in a conductive paste 231 held on a plate 230, and then, as shown in FIG. 9(e), the multiple chips 1 are collectively removed from the conductive paste 231 together with the second holding sheet 220. As a result, the conductive paste 231 adheres to the first end surface side ends 1b of the multiple chips 1. The conductive paste 231 is dried to form first external electrodes 5A on the first end surface side ends 1b.

[0034] 9(f), each of the first end face side end portions 1b on which the first external electrodes 5A are formed of the multiple chips 1 held on the second holding sheet 220 is held on the first holding sheet 210 (step S107). The first holding sheet 210 includes a base material 211 and an adhesive layer 212 formed on one side of the base material 211. The first external electrodes 5A of each chip 1 are pressed against the adhesive layer 212 of the first holding sheet 210, thereby adhesively holding each of the first end face side end portions 1b to the first holding sheet 210.

[0035] Next, the end portions 2b on the second end face side of the multiple chips 1 held on the second holding sheet 220 are peeled off and separated from the second holding sheet 220 (step S108). That is, as shown in FIG. 9(g), the second end face 2a of each chip 1 is separated from the second holding sheet 220. For example, if the adhesive strength of the adhesive layer 222 of the second holding sheet 220 is weaker than that of the adhesive layer 212 of the first holding sheet 210, it is easy to peel the second holding sheet 220 off the chips 1 while keeping the chips 1 held on the first holding sheet 210.

[0036] Next, second external electrodes 5B are formed collectively as external electrodes on the second end face-side ends 2b of the multiple chips 1 held by the first holding sheet 210, which are separated from the second holding sheet 220 (step S109). In step S109, as shown in FIG. 9(h), the first holding sheet 210 is inverted to place the second end faces 2a of the chips 1 downward. Next, in the same manner as in FIG. 9(d), the second end face-side ends 2b of the multiple chips 1 are immersed in conductive paste 231 and then pulled out of the conductive paste 231, thereby adhering the conductive paste 231 to the second end face-side ends 2b of the multiple chips 1. By drying the conductive paste 231, second external electrodes 5B are formed on the second end face-side ends 2b, as shown in FIG. 9(i).

[0037] The external electrodes 5A and 5B may have a single layer structure using the conductive paste 231 as described above, or may have a multi-layer structure in which a plating layer is further formed on the surface.

[0038] According to the above-described method for forming external electrodes, the first external electrodes 5A and the second external electrodes 5B are formed collectively on a plurality of chips 1 while the chips 1 are aligned on the alignment device 10 and held by the first holding sheet 210 and the second holding sheet 220. Therefore, the first external electrodes 5A and the second external electrodes 5B can be formed efficiently.

[0039] According to the embodiment described above, the following effects are achieved. The alignment device 10 of the embodiment includes a flat plate portion 21 having a surface 21a and a back surface 21b, a side wall portion 25 that rises from the surface 21a side of the flat plate portion 21 and partitions the inner surface 21a as an alignment area 22 to which multiple workpieces, i.e., chips 1, are supplied, and the pallet 20 includes vibration-applied pallets, a plurality of holding positions 70 that are set in the alignment area 22 and at which each of the multiple chips 1 supplied to the alignment area 22 is positioned and maintains the alignment of the multiple chips 1, a supply port 26 that is provided by opening a portion of the side wall portion 25 of the pallet 20 and enables multiple chips 1 to be supplied to the alignment area 22 from outside the side wall portion 25, and a first magnet 40 that is positioned relative to the flat plate portion 21 and acts as a moving holding portion that moves each of the multiple chips 1 supplied from the supply port 26 to the alignment area 22 to each of the multiple holding positions 70 and holds them at the holding positions 70.

[0040] This allows a plurality of chips 1 to be accurately held and aligned at a plurality of set holding positions 70, thereby achieving a sufficient filling rate.

[0041] Since the side wall 25 of the pallet 20 has a supply port 26, the chips 1 can be supplied into the pallet 20 from the supply port 26 while moving horizontally or in a state close to it. This makes it less likely that an impact will be applied to the chips 1, causing damage to the chips 1.

[0042] In the alignment device 10 according to the embodiment, each of the plurality of holding positions 70 has a recess 23 in which one chip 1 is accommodated.

[0043] The chip 1 accommodated in the recess 23 is restricted from moving in the planar direction of the surface 21a of the pallet 20 and is therefore difficult to move, so that the chip 1 is securely held at the holding position 70 and can be positioned and aligned at the holding position 70 with high precision.

[0044] In the alignment device 10 according to the embodiment, the moving and holding unit is a first magnet 40 that moves the chip 1 to a holding position 70 by magnetic attraction and holds it at that holding position 70.

[0045] This allows a plurality of chips 1 to be accurately held by magnetic force in a plurality of set holding positions 70. The chips 1 are attracted by the first magnets 40 and held in the recesses 23 of the holding positions 70, so that they are prevented from flying out of the recesses 23 even if the pallet 20 vibrates. Therefore, chips 1 are filled and held in all of the plurality of recesses 23, so a sufficient filling rate can be obtained.

[0046] In the aligning device 10 according to the embodiment, a plurality of first magnets 40 are arranged on the rear surface 21b side of the flat plate portion 21 of the pallet 20 in correspondence with the plurality of holding positions 70, respectively.

[0047] Since the first magnets 40 are disposed at all of the holding positions 70, the chips 1 are reliably held at the respective holding positions 70 by the first magnets 40, and a sufficient packing rate can be obtained.

[0048] The alignment device 10 of the embodiment is equipped with a linear feeder 100 that is connected to the supply port 26 of the pallet 20 and transports chips 1 to the alignment area 22 of the pallet 20 by vibrating, and it is preferable that the vibration of the linear feeder 100 is transmitted to the pallet 20 and the same vibration as that of the linear feeder 100 is imparted to the pallet 20. This allows the pallet 20 and the linear feeder 100 to share a vibration source, thereby simplifying the configuration.

[0049] The method for forming external electrodes according to the embodiment is a method for forming external electrodes on each of the first end face side end 1b and the second end face side end 2b of each of the plurality of chips 1 using the alignment device 10, and includes the steps of: step S101 of applying vibration to the pallet 20; step S102 of supplying the plurality of chips 1 from the supply port 26 to the alignment area 22; step S103 of moving each of the plurality of chips 1 supplied to the alignment area 22 to a plurality of holding positions 70 by a first magnet 40, which is a moving holding unit, to hold the first end face side end 1b of each of the chips 1 at the holding position 70 and hold the second end face side end 2b of each of the chips 1 apart from the surface 21a of the flat plate portion 21; and step S104 of collectively holding the second end face side end 2b of each of the plurality of chips 1 held at each of the plurality of holding positions 70 on a second holding sheet 220. The method includes step S105 of collectively separating the multiple chips 1 held on the second holding sheet 220 from the holding position 70; step S106 of collectively forming first external electrodes 5A as external electrodes on the first end face side ends 1b of the multiple chips 1 held on the second holding sheet 220; step S107 of holding the first end face side ends 1b, on which the first external electrodes 5A are formed, of the multiple chips 1 held on the second holding sheet 220, on the first holding sheet 210; step S108 of separating the second end face side ends 2b of the multiple chips 1 held on the second holding sheet 220 from the second holding sheet 220; and step S109 of collectively forming second external electrodes 5B as external electrodes on the second end face side ends 2b of the multiple chips 1 held on the first holding sheet 210 and separated from the second holding sheet 220.

[0050] This makes it possible to efficiently form the first external electrodes 5A and the second external electrodes 5B on the plurality of chips 1, and also to prevent a decrease in yield.

[0051] [Another embodiment of the alignment device] Next, as other embodiments of the alignment device, second to eighth embodiments will be described. In the drawings referred to in the description, the same components as those in the first embodiment or components having similar functions will be assigned the same reference numerals, and the description will be omitted or simplified.

[0052] (Second embodiment) Fig. 10 is a plan view of the alignment device 10 according to the second embodiment. Fig. 11 is a cross-sectional view of the alignment device 10 according to the second embodiment. The alignment device 10 of the second embodiment is provided with a plurality of second magnets 42 and a plurality of air ejection units 44 as movement assist units.

[0053] Among the multiple chips 1 supplied to the alignment area 22, some may pass through the recesses 23 and move to the surrounding surplus portion 24, where they may become trapped. The multiple second magnets 42 and the multiple air ejection portions 44 have the function of assisting the chips 1 that have moved to the surplus portion 24 to move toward the recesses 23, thereby urging the chips 1 to be accommodated in the recesses 23.

[0054] Four second magnets 42 are arranged at each of the front end 20a and the rear end 20b of the pallet 20. These second magnets 42 are arranged above and along the side wall 25. The second magnets 42 are preferably arranged directly on or near the side wall 25. The second magnets 42 are arranged in a line at positions corresponding to the recesses 23 arranged in the width direction of the pallet 20 (the left-right direction in FIG. 10). The second magnets 42 are electromagnets, and the magnetic poles that repel the chips 1 are adjusted so that they face inward, i.e., toward the alignment area 22.

[0055] 10 , when a chip 1 resides in the surplus portion 24a on the front end 20a side of the surplus portion 24, the chip 1 can be moved inside the alignment area 22 as indicated by arrow M1 due to the magnetic repulsive force of the second magnet 42 located near the chip 1. When a chip 1 resides in the surplus portion 24b on the rear end 20b side of the surplus portion 24, the magnetic repulsive force of the second magnet 42 located near the chip 1 can be moved inside the alignment area 22 as indicated by arrow M2. The chip 1 that has been moved inside the alignment area 22 is more likely to be accommodated in the recess 23.

[0056] One air jetting unit 44 is disposed on each of the side portions 20c and 20d on both sides of the pallet 20. Each air jetting unit 44 is disposed above the side wall portion 25. The air jetting unit 44 is preferably disposed directly on or near the side wall portion 25. The air jetting unit 44 is a cylindrical member extending along the side wall portion 25, and compressed air is supplied to its internal space. The air jetting unit 44 has a number of nozzles (not shown) that spray air toward the alignment area 22. The multiple nozzles are disposed in a row from one end to the other end of the extension direction of the air jetting unit 44.

[0057] 10, when a chip 1 remains in the surplus portion 24c on the side 20c of one of the surplus portions 24 (the left side in FIG. 10), the chip 1 can be pushed by the flow of air ejected from the air ejection portion 44 on the side 20c side, and can be moved toward the inside of the alignment area 22 as shown by arrow R1. When a chip 1 remains in the surplus portion 24d on the side 20d of the other of the surplus portions 24 (the right side in FIG. 10), the chip 1 can be pushed by the flow of air ejected from the air ejection portion 44 on the side 20d side, and can be moved toward the inside of the alignment area 22 as shown by arrow R2. The chip 1 that has moved toward the inside of the alignment area 22 is more likely to be accommodated in the recess 23.

[0058] The alignment device 10 of the second embodiment is provided with a movement assisting part that is arranged on or near the side wall part 25 of the pallet 20 and assists in moving the chips 1 supplied to the alignment area 22 to the recesses 23.

[0059] Specific examples of the movement assisting part include a second magnet 42 that moves the chip 1 to the recess 23 by magnetic repulsion, and an air ejection part 44 that moves the chip 1 to the recess 23 by ejecting air.

[0060] This allows the chips 1 remaining in the excess portion 24, which is the peripheral portion of the alignment area 22, to move toward the recessed portion 23, thereby further improving the filling rate.

[0061] The second magnet 42 and the air blowing part 44 may be arranged at any position, and for example, the second magnet 42 and the air blowing part 44 may be arranged in the reverse order to that shown in FIG. Furthermore, a plurality of second magnets 42 may be integrated. Furthermore, the air blowing portion 44 may be divided into a plurality of parts, which may be arranged side by side. Furthermore, the movement assisting unit may consist solely of second magnet 42 that moves chip 1 toward recess 23 by magnetic repulsion, or conversely, it may consist solely of air jetting unit 44 that moves chip 1 toward recess 23 by jetting air. That is, in Figure 10, multiple second magnets 42 may be placed at the positions of air jetting units 44 so that the movement assisting unit is entirely made up of second magnets 42, or conversely, air jetting units 44 may be placed at the positions of second magnets 42 so that the movement assisting unit is entirely made up of air jetting units 44.

[0062] Next, third to fifth embodiments in which the mode of the first magnet 40 that attracts and holds the tip 1 in the recess 23 is changed will be described.

[0063] (Third embodiment) 12 is a cross-sectional view of an alignment device 10 according to a third embodiment. In the third embodiment, there is one first magnet 40, and the first magnet 40 is large enough to cover all of the recesses 23 provided in each of the multiple holding positions 70. The first magnet 40 is housed in one magnet housing portion 32 formed in the upper surface 30a of the base 30. The magnet housing portion 32 is a recess that opens to the upper surface 30a of the base 30. The first magnet 40 is housed by fitting into the magnet housing portion 32.

[0064] In the third embodiment, the first magnet 40 has a size that covers all of the recesses 23 .

[0065] This allows for only one first magnet 40, thereby reducing the number of parts and simplifying the configuration.

[0066] The first magnet 40 may be a single magnet that covers all of the recesses 23, or a plurality of first magnets 40 of an appropriate size (for example, two, four, eight, etc.) may be used to cover all of the recesses 23. In this case, the first magnet 40 has a size that covers a portion of all the recesses 23.

[0067] (Fourth embodiment) 13 is a cross-sectional view of an alignment device 10 according to a fourth embodiment. In the fourth embodiment, a magnet storage unit 32 similar to that of the third embodiment is provided on the base 30. A plurality of first magnets 40 are movably provided within the magnet storage unit 32. The plurality of first magnets 40 are sandwiched between the pallet main body 29 and the base 30, and are capable of sliding and moving in a substantially horizontal direction parallel to the surface 21a. In this case, the number of first magnets 40 is arbitrary, but is set to an appropriate number so that each can move vertically and horizontally within the magnet storage unit 32.

[0068] The first magnet 40 is driven by a driving unit (not shown) that is arranged on the lower surface 30b side of the base 30. The driving unit may be a magnet that attracts the first magnet 40, an appropriate actuator, or any other device that can move the first magnet 40. The multiple first magnets 40 are provided on the rear surface 21b side of the flat plate portion 21 so as to be movable along the rear surface 21b. The movement of the first magnets 40 allows the chip 1 to be guided into the recess 23.

[0069] When the above-mentioned imaging unit 50 and monitor 51 are provided, the storage status of the chip 1 in the recess 23 can be grasped by looking at the monitor 51, and the first magnet 40 can be moved below the recess 23 where the chip 1 is not stored, thereby guiding the first magnet 40 into the recess 23 and storing it there.

[0070] In the fourth embodiment, the first magnet 40 is provided on the rear surface 21b side of the flat plate portion 21 so as to be movable along the rear surface 21b, and guides the chip 1 to the recess 23 by moving.

[0071] This allows the chip 1 to be actively moved into the recess 23, and the chip 1 to be aligned efficiently and quickly.

[0072] (Fifth embodiment) 14 is a cross-sectional view of an alignment device 10 according to a fifth embodiment. In the fifth embodiment, first magnets 40 are arranged on the front surface 21a side of the flat plate portion 21 of the pallet body 29 of the pallet 20, corresponding to each of the plurality of recesses 23. The plurality of first magnets 40 are inserted into the interior of each recess 23 and arranged on the bottom surface 23b.

[0073] In the fifth embodiment, a plurality of first magnets 40 are arranged on the front surface 21a of the flat plate portion 21 in correspondence with the plurality of recesses 23, respectively.

[0074] According to the fifth embodiment, the first magnet 40 is arranged on the surface 21a side on which the chip 1 moves, so that the magnetic force of the first magnet 40 that attracts the chip 1 acts directly on the chip 1, allowing the chip 1 to be more smoothly accommodated within the recess 23.

[0075] (Sixth embodiment) Figure 15 shows a sixth embodiment in which a large number of small holes 90 are distributed over the surface 21a of the flat plate portion 21 of the pallet body 29 in the first embodiment described above. The large number of small holes 90 are arranged on the surface 21a excluding the recesses 23. In this modification, air is ejected from the large number of small holes 90 toward the surface 21a. For example, at least the surface 21a side of the flat plate portion 21 of the pallet body 29 may be formed from a perforated plate 91, and compressed air may be supplied to an enclosed space provided on the back side of the perforated plate 91, thereby ejecting air from the large number of small holes 90 toward the surface 21a.

[0076] The chip 1 supplied from the supply port 26 to the alignment area 22 glides across the surface 21a due to the air ejected from the numerous small holes 90 toward the surface 21a, and is attracted to the first magnet 40 during the movement and held in the recess 23.

[0077] In the sixth embodiment, at least the surface 21a side of the alignment area 22 of the flat plate portion 21 is formed of a porous plate 91 with many small holes 90 dispersed therein, and air is ejected from the many small holes 90 toward the surface 21a side.

[0078] This allows the plurality of chips 1 to move quickly through the alignment area 22, thereby reducing the time required for alignment and improving efficiency.

[0079] Next, a seventh embodiment will be described in which an air suction part 60 is used instead of the first magnet 40 as a moving holding part that attracts and holds the tip 1 in the recess 23.

[0080] Seventh embodiment 16 is a cross-sectional view of an alignment device 10 according to the seventh embodiment. The alignment device 10 of the seventh embodiment includes an air suction unit 60 that sucks air from inside the recesses 23. The air suction unit 60 has an air intake flow path 61 provided in the pallet 20 and an air intake mechanism 65.

[0081] The intake flow path 61 includes a main flow path 62 provided on the upper surface 30a of the base 30, a plurality of intake holes 63 branching off from the main flow path 62 to each recess 23, and an intake port 64 leading from the main flow path 62 to the lower surface 30b of the base 30. The main flow path 62 is configured by a recess formed in the upper surface 30a of the base 30. Each of the plurality of intake holes 63 penetrates from the bottom surface 23b of each recess 23 to the lower surface 30b of the pallet body 29 and is connected to the main flow path 62. The intake port 64 is formed in the center of the base 30 and is connected to the main flow path 62. The suction mechanism 65 is connected to the base 30 and includes an intake pipe 66 that communicates with the intake port 64 , and an air suction source 67 such as a vacuum pump that is connected to the intake pipe 66 .

[0082] According to the air suction unit 60, when the air suction source 67 is activated, air is sucked from within each recess 23 via the intake pipe 66, the intake port 64, the main flow path 62, and the intake hole 63. As a result, the tip 1 is sucked into the recess 23 and accommodated therein.

[0083] In the seventh embodiment, the moving holder is an air suction unit 60 that sucks the air in the recess 23 above the holding position 70, thereby sucking and holding the chip 1 in the recess 23.

[0084] This allows a plurality of chips 1 to be accurately held in each recess 23 of the set plurality of holding positions 70. The air inside the recess 23 is sucked out of the chips 1, causing them to be adsorbed to the bottom surface 23b, preventing them from flying out of the recess 23 even when the pallet 20 is vibrating. Therefore, all of the plurality of recesses 23 are filled with and held by the chips 1, thereby achieving a sufficient filling rate. Furthermore, since the chips 1 are held in the recesses 23 by suction of air, even if the chips 1 are not magnetic, they can be reliably held and aligned in the recesses 23.

[0085] 17, each of the intake holes 63 can be provided with a valve 63a that opens and closes the intake hole 63. When the valve 63a is closed, air inside the recess 23 is no longer sucked in. When the imaging unit 50 and monitor 51 described above are provided, the state of the chips 1 accommodated in the recesses 23 can be ascertained while watching the monitor 51, and the valve 63a corresponding to the recess 23 that does not accommodate a chip 1 can be opened to enable the chip 1 to be sucked in, and when a chip 1 is accommodated, the valve 63a corresponding to that recess 23 can be controlled to close.

[0086] Next, an eighth embodiment will be described in which the surface 21a of the pallet body 29 does not have a plurality of recesses 23 for accommodating chips 1, and the entire surface 21a is flat.

[0087] (Eighth embodiment) FIG. 18 is a plan view of an alignment device 10 according to the eighth embodiment. FIG. 19 is a cross-sectional view of the alignment device 10 according to the eighth embodiment. In the eighth embodiment, the entire surface 21a of the pallet body 29 that constitutes the alignment area 22 is flat. In the alignment area 22, a plurality of holding positions 70 are set as positions for holding and aligning a plurality of chips 1. In this embodiment, similar to the plurality of recesses 23 in the first embodiment, 20 holding positions 70 are evenly arranged in a matrix of 4 rows and 5 columns. The holding positions 70 are rectangular sections that correspond to the planar shape of the chips 1, but are not limited to such a shape.

[0088] 19, first magnets 40 are arranged directly below the plurality of holding positions 70 on the back surface 21b side of the flat plate portion 21. Each of the plurality of first magnets 40 is fitted into and accommodated in a magnet accommodating portion 31 provided on the upper surface 30a of the base 30.

[0089] According to the eighth embodiment, a plurality of chips 1 supplied from the supply port 26 to the alignment area 22 are stopped and held at each holding position 70 by the attractive force of the first magnets 40 while moving toward the rear end 20b, and are aligned. The chips 1 are easily moved in a horizontal position with the main surface 1c or the side surface 1d in contact with the front surface 21a, and are therefore held at the holding positions 70 in that horizontal position.

[0090] In addition, when the chip 1 is held in the horizontal position at the holding position 70, if external electrodes are to be formed at both longitudinal ends of the chip 1 as shown in Figure 9, the external electrodes can be formed, for example, by rolling the chip 1 to change its position to vertical.

[0091] FIG. 20 shows a modified example of the eighth embodiment. When the surface 21a of the alignment area 22 is flat, it is preferable to provide a blocking portion 80 for blocking the chip 1 at each holding position 70, as shown in FIG. 20. The blocking portion 80 is an L-shaped member in a plan view, including a vertical portion 80a along one long side of the rectangular holding position 70 and a horizontal portion 80b along the short side on the rear end 20b side. The height of the blocking portion 80 is set so that the vibrating chip 1 can be blocked. When the chip 1 moves to the holding position 70, it is locked by the blocking portion 80, preventing further movement toward the rear end 20b, and the chip 1 is stopped and held at the holding position 70.

[0092] In the eighth embodiment, it is preferable to provide a damming section 80 that dams up the tip 1 at the holding position 70 after it has been moved to the holding position 70 .

[0093] As a result, even if the surface 21a of the alignment area 22 is flat, the chip 1 can be stopped and held at the holding position 70, and the aligned state can be ensured.

[0094] In the above-described eighth embodiment, the air suction unit 60 of the seventh embodiment may be applied as a moving holding unit that attracts and holds the tip 1, instead of the first magnet 40. Furthermore, the third to eighth embodiments described above may be combined with the second magnet 42 and air ejection part 44 as the movement assisting part shown in the second embodiment.

[0095] Although the embodiments have been described above, the present invention is not limited to these embodiments, and the present invention includes modifications and improvements within the scope of achieving the object of the present invention.

[0096] For example, the first magnet 40 that attracts and holds the chip 1 may be a permanent magnet. In this case, although the magnetic force cannot be turned on and off like an electromagnet, it can be used as long as it has a sufficient function of attracting the chip 1. The second magnet 42 and the air ejection part 44 are shown as movement assisting parts that assist in moving the chip 1 remaining in the excess part 24 of the alignment area 22 toward the holding position 70, but these are just examples and any form that has such a function may be used. In the embodiment, a chip, which is a laminate element in a multilayer ceramic capacitor before external electrodes are formed, is used as an example of a workpiece, but the workpiece is not limited to this, and a finished multilayer ceramic capacitor or other chip-like electronic components such as a semiconductor device can also be used as a workpiece. [Explanation of symbols]

[0097] 1 chip (workpiece) 5A First outer electrode 5B Second external electrode 10 Alignment device 20 palettes 21 Flat plate part 21a surface 21b Back side 22 Queue Area 23 Recess (holding position) 25 Side wall 26 Supply port 40 First Magnet 42 Second magnet (movement assist part) 44 Air jet unit (movement support unit) 60 Air suction section 70 Holding position 90 small hole 91 Perforated plate 210 First retaining sheet 220 Second Retaining Sheet

Claims

1. a pallet to which vibration is applied, the pallet including: a flat plate portion having a front surface and a back surface; and a side wall portion provided upright on the front surface side of the flat plate portion, the side wall portion defining the inner surface as an alignment area to which a plurality of magnetic workpieces are supplied; a plurality of holding positions set in the alignment area, at which the plurality of workpieces supplied to the alignment area are positioned and the aligned state of the plurality of workpieces is maintained; a supply port provided by opening a portion of the side wall of the pallet, which allows a plurality of works to be supplied to the alignment area from outside the side wall; a moving and holding unit that is disposed relative to the flat plate portion and moves each of the plurality of workpieces supplied from the supply port to the alignment area to each of the plurality of holding positions and holds each of the workpieces at the holding positions; the moving and holding unit is a first magnet that moves the workpiece to the holding position by magnetic attraction and holds the workpiece at the holding position; the first magnet is an electromagnet, a plurality of which are arranged corresponding to the plurality of holding positions, and which is individually energized; An alignment device in which an imaging unit is disposed above the pallet to capture an image of the alignment area and grasp the storage status of the workpieces in the holding position.

2. The alignment device according to claim 1 , wherein each of the plurality of holding positions has a recess for accommodating one workpiece.

3. The alignment device according to claim 1 or 2, wherein a plurality of the first magnets are arranged on the back surface side in correspondence with the plurality of holding positions.

4. 3. The aligning device according to claim 1, wherein the first magnet is provided on the rear surface side of the flat plate portion so as to be movable along the rear surface, and guides the workpiece to the holding position by moving.

5. The alignment device according to claim 1 or 2, wherein a plurality of the first magnets are arranged on the front surface side of the flat plate portion in correspondence with the plurality of holding positions.

6. 6. The aligning device according to claim 1, further comprising a blocking portion for blocking the workpieces moved to the holding position at the holding position.

7. The alignment device according to any one of claims 1 to 6, further comprising a movement assisting unit arranged at or near the side wall unit, which assists in moving the work supplied to the alignment area to the holding position.

8. The alignment device according to claim 7 , wherein the movement assisting part is a second magnet that moves the workpiece to the holding position by magnetic repulsion.

9. The alignment device according to claim 7 , wherein the movement assisting unit is an air ejection unit that ejects air to move the workpiece to the holding position.

10. An alignment device according to any one of claims 1 to 9, wherein at least the surface side of the alignment area of ​​the flat plate portion is made of a perforated plate having a large number of small holes dispersed therein, and air is ejected toward the surface side from the large number of small holes.

11. a feeder connected to the supply port and vibrating to transport the work to the alignment area of ​​the pallet; The aligning device according to any one of claims 1 to 10, wherein vibrations of the feeder are transmitted to the pallet, and a common vibration is imparted to the pallet as well as to the feeder.

12. A method for forming external electrodes on each of an end portion on a first end face side and an end portion on a second end face side of each of a plurality of workpieces, using the alignment device according to any one of claims 1 to 11, applying vibration to the pallet; supplying a plurality of works from the supply port to the alignment area; a step of moving each of the plurality of workpieces supplied to the alignment area to a plurality of the holding positions by the moving holding unit, holding the end portions of the workpieces on the first end surface side at the holding positions, and holding the end portions of the workpieces on the second end surface side in a state spaced apart from the surface; a step of collectively holding, on a second holding sheet, each of the end portions of the workpieces held at the respective holding positions on the second end surface side; a step of simultaneously separating the plurality of workpieces held on the second holding sheet from the holding position; forming first external electrodes as the external electrodes collectively on the end portions of the plurality of workpieces held on the second holding sheet on the first end surface side; holding, on a first holding sheet, each end portion of the plurality of workpieces held on the second holding sheet, the end portion on the first end face side on which the first external electrode is formed; A step of separating end portions of the plurality of workpieces held on the second holding sheet on the second end surface side from the second holding sheet; and forming second external electrodes as the external electrodes collectively on the end portions of the plurality of workpieces held by the first holding sheet on the second end face side that is separated from the second holding sheet, In the supplying step, an image of the alignment area is taken by an imaging unit, and a state of the workpieces being accommodated in the holding position is grasped.

Images