Contact unit and inspection jig

Abstract

To enable accurate inspection of electrical properties of an inspection target.SOLUTION: A contact unit 100 provided herein comprises a flexible substrate 110 and a block 140 for pressing at least a portion of the flexible substrate 110 toward an inspection target 50, where at least a portion of the block 140 is conductive.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a contact unit and an inspection jig. [Background technology]

[0002] In recent years, various inspection jigs have been developed for inspecting inspection objects such as semiconductor integrated circuits. For example, the inspection jig described in Patent Document 1 includes a thin film. The thin film is provided with bumps that come into contact with the inspection object. A support block is provided on the side of the thin film opposite the surface on which the bumps are provided. The support block is biased by a spring toward the side where the inspection object is located. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-208777 Summary of the Invention [Problem to be solved by the invention]

[0004] As described in Patent Document 1, at least a portion of a flexible substrate, such as a thin film, may be pressed toward an object to be inspected by a block. The flexible substrate may be provided with a conductive pattern for transmitting high-speed signals. When a high-speed signal is transmitted through the conductive pattern, electromagnetic waves may be generated from the conductive pattern. However, the electromagnetic waves generated from the conductive pattern may penetrate the block and reach another conductive pattern. The electromagnetic waves that reach the other conductive pattern may generate noise in the high-speed signal transmitted through the other conductive pattern. Therefore, high-speed signal interference may occur between different conductive patterns. When high-speed signal interference occurs, it may be impossible to accurately inspect the electrical characteristics of the object to be inspected.

[0005] An example of an object of the present invention is to accurately inspect the electrical characteristics of an object to be inspected. Other objects of the present invention will become apparent from the description of this specification. [Means for solving the problem]

[0006] One aspect of the present invention is A flexible substrate; a block that presses at least a portion of the flexible substrate toward an object to be inspected; Equipped with At least a portion of the block is a contact unit having electrical conductivity.

[0007] Another aspect of the present invention is An inspection jig including the contact unit. [Effects of the Invention]

[0008] According to the above aspects of the present invention, the electrical characteristics of the object to be inspected can be inspected accurately. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a cross-sectional view of the inspection jig according to the embodiment. [Figure 2] FIG. 2 is a plan view of the contact unit according to the embodiment, as viewed from the side where an object to be inspected is located. [Figure 3] FIG. 3 is a diagram of FIG. 2 with the flexible substrate removed. [Figure 4] 10 is a graph showing isolation characteristics in an embodiment in which the entire block is made of metal and in a comparative example in which the entire block is made of resin. [Figure 5] FIG. 10 is a cross-sectional view of an inspection jig according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments and modifications of the present invention will be described with reference to the drawings. In all the drawings, like components are designated by like reference numerals, and descriptions thereof will be omitted as appropriate.

[0011] In this specification, ordinal numbers such as "first," "second," and "third" are used merely to distinguish between similarly named configurations, unless otherwise specified, and do not imply any particular characteristics (e.g., order or importance) of the configurations.

[0012] Fig. 1 is a cross-sectional view of an inspection jig 10 according to an embodiment. Fig. 2 is a plan view of a contact unit 100 according to an embodiment, seen from the side where an inspection target 50 is located. Fig. 3 is a view in which a flexible substrate 110 has been removed from Fig. 2. Fig. 1 is a cross-sectional view taken along line AA' in Fig. 2. For the sake of explanation, Figs. 2 and 3 do not show the main substrate 200 and the pressing member 300 shown in Fig. 1.

[0013] 1 to 3, an arrow indicating the first direction X, the second direction Y, or the third direction Z indicates that the direction from the base end of the arrow to the tip is the positive direction of the direction indicated by the arrow, and that the direction from the tip of the arrow to the base end is the negative direction of the direction indicated by the arrow. In FIG. 1, a white circle with a black dot indicating the second direction Y indicates that the direction from the back of the paper to the front is the positive direction of the second direction Y, and that the direction from the front of the paper to the back is the negative direction of the second direction Y. In FIGS. 2 and 3, a white circle with an X indicating the third direction Z indicates that the direction from the front of the paper to the back is the positive direction of the third direction Z, and that the direction from the back of the paper to the front is the negative direction of the third direction Z.

[0014] The first direction X is a direction parallel to the horizontal direction perpendicular to the vertical direction. The positive direction of the first direction X is parallel to the direction from one of a pair of extension regions 114, which are located on opposite sides of a base region 112 (described later), among the four extension regions 114 described later. The negative direction of the first direction X is parallel to the direction from the other of the pair of extension regions 114 to the first. The second direction Y is parallel to the horizontal direction and perpendicular to the first direction X. The positive direction of the second direction Y is parallel to the direction from one of another pair of extension regions 114, which are located on opposite sides of the base region 112, among the four extension regions 114. The negative direction of the second direction Y is parallel to the direction from the other of the other pair of extension regions 114 to the first. The third direction Z is a direction parallel to the vertical direction. The positive direction of the third direction Z is a direction from below to above in the vertical direction. The negative direction of the third direction Z is a direction from above to below in the vertical direction.

[0015] The inspection jig 10 includes a contact unit 100, a main substrate 200, and a pressing member 300. The contact unit 100 includes a flexible substrate 110, four coaxial connectors 120, a sub-substrate 130, and a block 140. In this embodiment, the contact unit 100 is a replacement contact unit. Specifically, the contact unit 100 is detachable from the main substrate 200. In this embodiment, the inspection jig 10 is a probe card. As shown in FIG. 1, the main substrate 200 is provided with a first through-hole 202 that penetrates the main substrate 200 in the vertical direction (third direction Z). As shown in FIGS. 1 to 3, the sub-substrate 130 is provided with a second through-hole 132 that penetrates the sub-substrate 130 in the vertical direction. As shown in FIGS. 2 and 3, the second through-hole 132 is located in the center of the sub-substrate 130 when viewed in the vertical direction.

[0016] The flexible substrate 110 is, for example, a flexible printed circuit (FPC). In this embodiment, the flexible substrate 110 has a base region 112 and four extension regions 114, as shown in FIG.

[0017] 2, when viewed in the vertical direction, the base region 112 is located in the center of the flexible substrate 110. The four extension regions 114 extend from the base region 112 in directions different from each other. Specifically, the four extension regions 114 extend from the base region 112 in the positive direction of the first direction X, the negative direction of the first direction X, the positive direction of the second direction Y, and the negative direction of the second direction Y. As a result, when viewed in the vertical direction, the flexible substrate 110 has a shape similar to a cross (+ shape).

[0018] As shown in FIG. 1 , the base region 112 is parallel to the horizontal direction. The base region 112 overlaps at least a portion of the first through hole 202 and at least a portion of the second through hole 132 in the vertical direction. The base region 112 is located below the lower end of the first through hole 202. The portion of each extension region 114 extending from the base region 112 to the inner edge of the first through hole 202 has an inclined region (inclined portion) that is inclined obliquely upward in the vertical direction with increasing distance from the base region 112. The portion of each extension region 114 located around the block 140 in the horizontal direction (outer region) is located between the portion of the upper surface of the main substrate 200 that is located around the block 140 in the horizontal direction and the portion of the lower surface of the sub-substrate 130 that is located around the block 140 in the horizontal direction.

[0019] A plurality of contact portions 116 are provided on the lower surface of the base region 112. Each contact portion 116 is, for example, a bump. Each of the plurality of contact portions 116 contacts a corresponding one of the plurality of electrodes 52 provided on the upper surface of the test object 50. In this embodiment, the plurality of contact portions 116 include at least one high-speed signal contact portion 116a, at least one low-speed signal contact portion 116b, at least one power supply contact portion 116c, and at least one ground contact portion 116d. Note that in another example different from this embodiment, the plurality of contact portions 116 may include at least one high-speed signal contact portion 116a and at least one ground contact portion 116d, without including the low-speed signal contact portion 116b and the power supply contact portion 116c. The plurality of contact portions 116 may be other combinations of high-speed signal contact portion 116a, low-speed signal contact portion 116b, power supply contact portion 116c, and ground contact portion 116d.

[0020] In this embodiment, the inspection object 50 is a semiconductor integrated circuit in a wafer state. Therefore, the multiple contact portions 116 are oriented vertically downward. However, depending on the inspection conditions, such as the type of inspection object 50, the multiple contact portions 116 may be oriented in a direction other than vertically downward. For example, when the inspection object 50 is placed vertically upward relative to the inspection jig 10, the inspection jig 10 is turned upside down relative to the inspection jig 10 according to this embodiment so that the multiple contact portions 116 are oriented upward.

[0021] At least one conductive pattern 118a for high-speed signals, at least one conductive pattern 118b for low-speed signals, at least one conductive pattern 118c for power supply, and at least one conductive pattern 118d for ground are provided on the negative side of each extension region 114 in the third direction Z.

[0022] One end of the high-speed signal conductive pattern 118a provided in each extension region 114 is connected to the high-speed signal contact portion 116a. The other end of the high-speed signal conductive pattern 118a provided in each extension region 114 is electrically connected to a high-speed signal leg portion 124a (described later) of the coaxial connector 120 provided in each extension region 114.

[0023] One end of the low-speed signal conductive pattern 118b provided in each extension region 114 is connected to the low-speed signal contact portion 116b. The other end of the low-speed signal conductive pattern 118b provided in each extension region 114 is electrically connected to the main board 200 by pressure contact of the pressing member 300.

[0024] One end of the power supply conductive pattern 118c provided in each extension region 114 is connected to the power supply contact portion 116c. The other end of the power supply conductive pattern 118c provided in each extension region 114 is electrically connected to the main board 200 by pressure contact of the pressing member 300.

[0025] At least a portion of the ground conductive pattern 118d provided in each extension region 114 overlaps in the third direction Z with at least a portion of the coaxial connector 120 provided in each extension region 114. For example, the ground conductive pattern 118d is provided so as to weave between the high-speed signal conductive pattern 118a, the low-speed signal conductive pattern 118b, and the power supply conductive pattern 118c. One end of the ground conductive pattern 118d provided in each extension region 114 is electrically connected to four ground legs 124d (described later) of the coaxial connector 120 provided in the extension region 114. The other end of each ground conductive pattern 118d provided in each extension region 114 is electrically connected to a ground contact 116d. Specifically, a ground (not shown) is provided on the surface of the flexible substrate 110 facing in the positive direction in the third direction Z. The other end of the ground conductive pattern 118d is electrically connected to the ground via a through-hole provided in the flexible substrate 110. The ground contact portion 116d is also electrically connected to the ground via a through-hole provided in the flexible substrate 110. The other end of each ground conductive pattern 118d provided in each extension region 114 may be directly connected to the ground contact portion 116d.

[0026] In the above description, the high-speed signal conductive pattern 118a, the low-speed signal conductive pattern 118b, the power supply conductive pattern 118c, and the ground conductive pattern 118d are all located on the surface of the flexible substrate 110 facing in the negative direction in the third direction Z. However, at least one of the high-speed signal conductive pattern 118a, the low-speed signal conductive pattern 118b, and the power supply conductive pattern 118c may be provided on the surface of the flexible substrate 110 facing in the positive direction in the third direction Z.

[0027] The shape of the flexible substrate 110 is not limited to the shape according to this embodiment. For example, the flexible substrate 110 may have only two of the four extension regions 114 that are located on opposite sides of the base region 112 in the first direction X or the second direction Y.

[0028] 2 and 3, the four coaxial connectors 120 are provided in portions located around the second through hole 132 in the horizontal direction. Specifically, the coaxial connector 120 located on the positive side of the second through hole 132 in the first direction X vertically overlaps with a portion of the extension region 114 extending from the base region 112 in the positive direction of the first direction X, the portion being located on the negative side of the center in the second direction Y in the second direction Y. The coaxial connector 120 located on the negative side of the second through hole 132 in the first direction X vertically overlaps with a portion of the extension region 114 extending from the base region 112 in the negative direction of the first direction X, the portion being located on the positive side of the center in the second direction Y in the second direction Y. The coaxial connector 120 located on the positive side of the second direction Y with respect to the second through hole 132 vertically overlaps a portion of the extension region 114 extending from the base region 112 in the positive direction of the second direction Y that is located on the positive side of the first direction X with respect to the center of the first direction X. The coaxial connector 120 located on the negative side of the second through hole 132 in the second direction Y vertically overlaps a portion of the extension region 114 extending from the base region 112 in the negative direction of the second direction Y that is located on the negative side of the first direction X with respect to the center of the first direction X. Note that the arrangement of the multiple coaxial connectors 120 is not limited to the arrangement according to this embodiment.

[0029] 1 to 3, each of the four coaxial connectors 120 has a main body 122, a high-speed signal leg 124a, and four ground legs 124d. Below, we will explain the coaxial connector 120 located on the positive side of the second through hole 132 in the first direction X. The matters explained below regarding the coaxial connector 120 located on the positive side of the second through hole 132 in the first direction X also apply to the remaining three coaxial connectors 120.

[0030] The main body 122 is provided on the upper surface of the sub-substrate 130 in a portion positioned around the second through-hole 132 in the horizontal direction.

[0031] As shown in FIG. 1, the high-speed signal leg 124a protrudes downward from the lower end of the main body 122. The high-speed signal leg 124a overlaps the center of the main body 122 in the third direction Z. The high-speed signal leg 124a penetrates the sub-substrate 130 in the vertical direction. The lower end of the high-speed signal leg 124a is electrically connected to the other end of the high-speed signal conductive pattern 118a, which is provided in the extension region 114 extending from the base region 112 in the positive direction of the first direction X, opposite to the one end connected to the high-speed signal contact portion 116a. Specifically, the lower end of the high-speed signal leg 124a is joined to the other end of the high-speed signal conductive pattern 118a by soldering.

[0032] Each of the four ground legs 124d protrudes downward from the lower end of the main body 122. As shown in FIGS. 2 and 3, the four ground legs 124d are located in a region surrounding the periphery of the high-speed signal leg 124a. Specifically, the four ground legs 124d are arranged around the high-speed signal leg 124a at 90° intervals as viewed from the third direction Z. Each of the four ground legs 124d penetrates the sub-substrate 130 in the vertical direction. The lower end of each of the four ground legs 124d is electrically connected to a ground conductive pattern 118d provided in an extension region 114 that extends from the base region 112 in the positive direction of the first direction X.

[0033] The sub-substrate 130 is, for example, a rigid substrate such as a glass epoxy substrate. In this embodiment, the sub-substrate 130 has a substantially square shape with the corners of the square cut off when viewed from the third direction Z. However, the shape of the sub-substrate 130 is not limited to the shape according to this embodiment. The sub-substrate 130 is provided to reduce the load that may be applied to the soldered joint between the high-speed signal conductive pattern 118a and the high-speed signal leg 124a.

[0034] The block 140 presses at least a portion of the flexible substrate 110 toward the test object 50. Specifically, as shown in FIGS. 2 and 3 , the block 140 has a pressing surface 142 and four side surfaces 144. The pressing surface 142 presses the base region 112 toward the test object 50.

[0035] 3, when viewed vertically, the pressing surface 142 is located at the center of the block 140. When viewed vertically, the four side surfaces 144 are located around the pressing surface 142. Specifically, the four side surfaces 144 are located on the positive side of the first direction X, the negative side of the first direction X, the positive side of the second direction Y, and the negative side of the second direction Y with respect to the pressing surface 142.

[0036] 1, the pressing surface 142 is parallel to the horizontal direction. The pressing surface 142 overlaps with at least a portion of the second through hole 132 and at least a portion of the first through hole 202 in the vertical direction. The pressing surface 142 is located below the lower end of the first through hole 202. Each side surface 144 is inclined obliquely upward in the vertical direction relative to the horizontal direction as it moves away from the pressing surface 142. As a result, the pressing surface 142 protrudes downward in the vertical direction further than any of the four side surfaces 144.

[0037] As shown in FIG. 1 , an elastic member 146 is provided on the side of the block 140 opposite to the side where the flexible substrate 110 is located. In this embodiment, the elastic member 146 is a coil spring. The elastic member 146 may be an elastic member other than a coil spring. In this embodiment, the lower end of the elastic member 146 fits into a recess provided in the upper surface of the block 140. Furthermore, the upper end of the elastic member 146 fits into a recess provided in the lower surface of the pressing member 300. The elastic member 146 biases the block 140 downward. As a result, the base region 112 is biased toward the test object 50 by the pressing surface 142. Therefore, compared to a state in which the block 140 is not biased downward by the elastic member 146, each of the multiple contact portions 116 can be pressed more strongly against each of the multiple electrodes 52.

[0038] 1, at least a portion of the base region 112 vertically overlaps with at least a portion of the pressing surface 142. The portion of the base region 112 that vertically overlaps with the pressing surface 142 is pushed downward by the pressing surface 142 beyond the lower end of the first through hole 202.

[0039] 1, at least a portion of each extension region 114 overlaps vertically with at least a portion of each side surface 144. The portion of each extension region 114 that overlaps vertically with each side surface 144 is pushed downward by the side surface 144 below the upper surface of the main substrate 200.

[0040] The shape of the block 140 is not limited to the shape according to this embodiment. For example, the block 140 may be a substantially cubic shape with substantially square upper and lower surfaces. In this example, the pressing surface 142 is parallel to the horizontal direction, and the four side surfaces 144 are parallel to the vertical direction. The block 140 may also be a truncated cone shape. In this example, the truncated cone has a lower base and an upper base having an area smaller than that of the lower base. The lower base of the truncated cone faces upward. The upper base of the truncated cone faces downward and serves as the pressing surface 142. The side surfaces of the truncated cone are the side surfaces 144.

[0041] The main substrate 200 is, for example, a glass epoxy substrate. In this embodiment, the flexible substrate 110 is not soldered to the main substrate 200. Therefore, the flexible substrate 110 is detachable from the main substrate 200.

[0042] The pressing member 300 is made of, for example, a resin molded body. The pressing member 300 presses the contact unit 100 toward the main substrate 200 from the upper surface side of the sub-substrate 130. Specifically, the pressing member 300 is fixed to a portion of the main substrate 200 located horizontally around the first through-hole 202 by a fastener such as a screw. Specifically, the fastener passes vertically from the upper surface of the pressing member 300 through the pressing member 300, the sub-substrate 130, and the portion of the extension region 114 located horizontally around the first through-hole 202, and is fixed to a hole provided in the upper surface of the main substrate 200. If the fastener is a screw, the hole provided in the upper surface of the main substrate 200 can be a tapped hole. In this case, the screw can be threaded into the tapped hole.

[0043] Next, block 140 will be described in detail.

[0044] In this embodiment, the entire block 140 is made of metal. That is, the entire block 140 is made of a conductive material. Therefore, the entire block 140 is conductive.

[0045] In this embodiment, at least a portion of the block 140 is electrically grounded. Specifically, at least a portion of the block 140 is electrically connected to at least a portion of the conductive pattern of the flexible substrate 110. In this embodiment, the block 140 is electrically connected to the ground conductive pattern 118d. At least a portion of the surface of the block 140 on which the flexible substrate 110 is located is bonded to at least a portion of the surface of the flexible substrate 110 on which the block 140 is located via a conductive adhesive. Therefore, at least a portion of the surface of the block 140 on which the flexible substrate 110 is located is electrically connected to at least a portion of the surface of the flexible substrate 110 on which the block 140 is located. In this embodiment, the pressing surface 142 is bonded to the upper surface of the base region 112 via a conductive adhesive. In addition, each of the four side surfaces 144 is bonded to the upper surface of each of the four extension regions 114 that vertically overlap the four side surfaces 144 via a conductive adhesive.

[0046] According to the present embodiment, a potential (ground potential) for electrically grounding the block 140 can be applied from the flexible substrate 110. For example, the potential for electrically grounding the block 140 is applied from the ground conductive pattern 118d. Therefore, according to the present embodiment, it is not necessary to provide a member for setting the block 140 at the ground potential separately from the flexible substrate 110. Therefore, compared to a case in which a member for setting the block 140 at the ground potential is provided separately from the flexible substrate 110, the configuration of the contact unit 100 can be simplified.

[0047] According to the present embodiment, the potential of the flexible substrate 110 can be applied to the block 140 via at least a portion of the surface of the flexible substrate 110 on which the block 140 is located and at least a portion of the surface of the block 140 on which the flexible substrate 110 is located. Specifically, the ground potential of the flexible substrate 110 can be applied to the block 140 via a conductive adhesive located between at least a portion of the surface of the flexible substrate 110 on which the block 140 is located and at least a portion of the surface of the block 140 on which the flexible substrate 110 is located. Therefore, compared to a case in which the potential of the flexible substrate 110 is applied to the block 140 via an electrical path that does not go through at least a portion of the surface of the flexible substrate 110 on which the block 140 is located and at least a portion of the surface of the block 140 on which the flexible substrate 110 is located, no member for the electrical path is required, and the configuration of the contact unit 100 can be simplified. In other words, compared to when the ground potential of the flexible substrate 110 is applied to the block 140 via an electrical path that does not involve a conductive adhesive, components for the electrical path are not required, and the configuration of the contact unit 100 can be simplified.

[0048] The region where the conductive adhesive is provided is not limited to the above example. For example, the conductive adhesive does not have to be provided between the upper surface of each extension region 114 and each side surface 144. Even in this case, the ground potential of the flexible substrate 110 can be applied to the block 140 via the conductive adhesive provided between the upper surface of the base region 112 and the pressing surface 142.

[0049] The method for electrically grounding at least a portion of the block 140 is not limited to the above example. For example, the block 140 may be electrically grounded via the elastic member 146. In this example, the elastic member 146 is made of a conductive material such as metal. That is, the elastic member 146 is conductive. The elastic member 146 is also electrically grounded. Furthermore, at least a portion of the elastic member 146 contacts at least a portion of the block 140. For example, the lower end of the elastic member 146 contacts the bottom surface of a recess in the upper surface of the block 140 into which the lower end of the elastic member 146 fits. In this case, electrically grounding the elastic member 146 allows at least a portion of the block 140 surrounding the elastic member 146 to be electrically grounded.

[0050] This embodiment, in which the entire block 140 is made of metal, is compared with a comparative example, in which the entire block 140 is made of resin. In both this embodiment and the comparative example, when a high-speed signal is transmitted through the high-speed signal conductive pattern 118a, electromagnetic waves may be generated from the high-speed signal conductive pattern 118a.

[0051] In the comparative example, electromagnetic waves generated from the high-speed signal conductive pattern 118a provided in one of the extension regions 114 can pass through the block 140 and reach the high-speed signal conductive pattern 118a provided in at least one other extension region 114. These electromagnetic waves can generate noise in the high-speed signal flowing in the high-speed signal conductive pattern 118a provided in the at least one other extension region 114. In this way, in the comparative example, high-speed signal interference can occur between the high-speed signal conductive patterns 118a provided in different extension regions 114.

[0052] In contrast, in the present embodiment, the block 140 can block electromagnetic waves generated from the high-speed signal conductive patterns 118a provided in any of the extension regions 114. Therefore, compared to the comparative example, it is possible to prevent electromagnetic waves generated from the high-speed signal conductive patterns 118a provided in any of the extension regions 114 from reaching the high-speed signal conductive patterns 118a provided in other extension regions 114. Therefore, compared to the comparative example, it is possible to prevent interference of high-speed signals between the high-speed signal conductive patterns 118a provided in different extension regions 114. Therefore, compared to the comparative example, it is possible to accurately inspect the electrical characteristics of the inspection object 50.

[0053] Furthermore, in this embodiment, compared to the comparative example, the inductance component between the ground conductive patterns 118d provided in different extension regions 114 can be reduced. Specifically, in this embodiment and the comparative example, the ground conductive patterns 118d provided in different extension regions 114 are spaced apart from each other. In the comparative example, an inductance component may be generated between the ground conductive patterns 118d provided in different extension regions 114. This inductance component may cause a potential difference between the ground conductive patterns 118d provided in different extension regions 114. In this case, problems such as fluctuations in the level of signals transmitted through the high-speed signal conductive pattern 118a or resonance at a specific frequency of the signals transmitted through the high-speed signal conductive pattern 118a may occur. In contrast, in the embodiment, a block 140, at least a portion of which is electrically grounded, is located between the ground conductive patterns 118d in different extension regions 114. Therefore, in this embodiment, compared to the comparative example, the inductance component between the ground conductive patterns 118d provided in different extension regions 114 can be reduced.

[0054] A comparison between this embodiment and the comparative example reveals that, even when only a portion of the block 140 is conductive, interference of high-speed signals between different high-speed signal conductive patterns 118a can be suppressed compared to the comparative example. That is, when at least a portion of the block 140 is conductive, the electrical characteristics of the inspection target 50 can be inspected more accurately than when the entire block 140 is made of resin. Furthermore, the suppression of high-speed signal interference in this embodiment can be achieved not only with the shape of the flexible substrate 110 according to this embodiment, but also with shapes different from the shape of the flexible substrate 110 according to this embodiment. That is, by using a block 140 at least a portion of which is conductive, interference of high-speed signals between different portions of the flexible substrate 110 can be suppressed compared to the comparative example.

[0055] From the viewpoint of blocking electromagnetic waves generated from the high-speed signal conductive pattern 118a using a conductive material, the conductive material constituting the block 140 may be located relatively close to the high-speed signal conductive pattern 118a. That is, at least a portion of the surface of the block 140 on which the flexible substrate 110 is located may be conductive. For example, at least a portion of the pressing surface 142 and each of the four side surfaces 144 may be conductive. In this example, the entire block 140 does not need to be made of a conductive material. For example, a conductive film such as a metal film may cover at least a portion of the pressing surface 142 and each of the four side surfaces 144. In this case, the block 140 can more easily block electromagnetic waves generated from the high-speed signal conductive pattern 118a compared to when only a portion of the block 140 away from the surface on which the flexible substrate 110 is located is conductive.

[0056] In this embodiment, at least a portion of the block 140 is made of metal. Therefore, the resistance of the block 140 can be lowered and the hardness of the block 140 can be increased compared to when the block 140 is made of a conductive material other than metal. The lower the resistance of the block 140, the smaller the voltage drop inside the block 140 when the block 140 is electrically grounded. Furthermore, the higher the hardness of the block 140, the stronger the force with which the block 140 can be pressed against the flexible substrate 110. However, the conductive material constituting the block 140 is not limited to metal. The block 140 may be made of, for example, conductive resin, conductive rubber, or the like.

[0057] When at least a portion of the block 140 is made of a conductive material such as metal, a recess may be provided in a portion of the block 140. The weight of the block 140 with the recess can be made lighter than the weight of the block 140 without the recess. The recess may be provided, for example, in a portion of the top surface of the block 140 that is located around the elastic member 146 in the horizontal direction. Alternatively, the spring constant of the elastic member 146 when at least a portion of the block 140 is made of a conductive material such as metal may be greater than the spring constant of the elastic member 146 when at least a portion of the block 140 is made of resin.

[0058] Fig. 4 is a graph showing the isolation characteristics of an embodiment in which the entire block 140 is made of metal and a comparative example in which the entire block 140 is made of resin. The horizontal axis of the graph shown in Fig. 4 represents frequency (unit: GHz). The vertical axis of the graph shown in Fig. 4 represents amplitude (unit: dB).

[0059] In the comparative example, an amplitude peak occurs near 5.4 GHz. In contrast, in the embodiment, no peak corresponding to the peak occurring in the comparative example is observed. From the results shown in Figure 4, it can be said that when the entire block 140 is made of metal, the isolation characteristics near 5.4 GHz can be improved compared to when the entire block 140 is made of resin.

[0060] 5 is a cross-sectional view of an inspection jig 10A according to a modified example. The inspection jig 10A according to the modified example is the same as the inspection jig 10 according to the embodiment, except for the following points.

[0061] The inspection jig 10A according to the modified example includes a contact unit 100A, a main board 200, and a pressing member 300A. The contact unit 100A according to the modified example includes a flexible board 110, a plurality of coaxial connectors 120A, a plurality of coaxial cables 126A, and a block 140. Furthermore, the contact unit 100A according to the modified example does not include the sub-board 130 according to the embodiment.

[0062] In this modified example, a portion (outer region) of pressing member 300A located horizontally around a portion that vertically overlaps first through-hole 202 protrudes downward further than the portion of pressing member 300A that vertically overlaps first through-hole 202. The portion of each extension region 114 located horizontally around first through-hole 202 is located between a portion of the upper surface of main substrate 200 that is located horizontally around first through-hole 202 and the lower end of the portion of pressing member 300A that is located horizontally around the portion that vertically overlaps first through-hole 202.

[0063] In this modification, the multiple coaxial connectors 120A are positioned around the pressing member 300A in the horizontal direction. For example, four coaxial connectors 120A are positioned on the positive side of the pressing member 300A in the first direction X, the negative side of the first direction X, the positive side of the second direction Y, and the negative side of the second direction Y.

[0064] The following describes the coaxial connector 120A located on the positive side of the pressing member 300A in the first direction X. The matters described below regarding the coaxial connector 120A located on the positive side of the pressing member 300A in the first direction X also apply to the remaining coaxial connectors 120A.

[0065] One end of a coaxial cable 126A is connected to the lower end of the coaxial connector 120A. The coaxial cable 126A extends from the lower end of the coaxial connector 120A toward the side where the pressing member 300A is located. The other end of the coaxial cable 126A, opposite the end connected to the lower end of the coaxial connector 120A, is electrically connected to a high-speed signal conductive pattern 118a provided in an extension region 114 extending from the base region 112 in the positive direction of the first direction X, via a conductive pattern provided in a portion of the main substrate 200 located on the positive side of the first through-hole 202 in the first direction X.

[0066] The method for electrically connecting the coaxial connector 120A and the high-speed signal conductive pattern 118a is not limited to the method according to this modification. For example, the coaxial connector 120A may be electrically connected to the high-speed signal conductive pattern 118a via a conductive pattern on the main board 200, without using the coaxial cable 126A.

[0067] In this modification, at least a portion of the block 140 is conductive. Therefore, compared to the comparative example, the electrical characteristics of the inspection object 50 can be inspected more accurately.

[0068] Although the embodiments and modifications of the present invention have been described above with reference to the drawings, these are merely examples of the present invention, and various configurations other than those described above can also be adopted.

[0069] According to the present specification, the following aspects are provided. (Aspect 1) Aspect 1 is A flexible substrate; a block that presses at least a portion of the flexible substrate toward an object to be inspected; Equipped with At least a portion of the block is a contact unit having electrical conductivity. According to the first aspect, electromagnetic waves that may be generated from the flexible substrate when a high-speed signal is transmitted through the flexible substrate can be blocked by the blocking device. Therefore, interference between high-speed signals between different parts of the flexible substrate can be suppressed. Therefore, the electrical characteristics of the test object can be accurately tested. (Aspect 2) Aspect 2 is 2. The contact unit according to claim 1, wherein at least a portion of the block is electrically grounded. According to the second aspect, a block having at least a portion electrically grounded is located between conductive ground patterns provided in different portions of the flexible substrate, thereby reducing the inductance component between the conductive ground patterns provided in different portions of the flexible substrate compared to when the block is not electrically grounded. (Aspect 3) Aspect 3 is In the contact unit according to aspect 1 or 2, at least a portion of the block is electrically connected to at least a portion of the conductive pattern of the flexible substrate. According to the third aspect, a potential (ground potential) for electrically grounding the block can be applied from the flexible substrate. Therefore, there is no need to provide a member for applying a potential for electrically grounding the block separately from the flexible substrate. This simplifies the configuration of the contact unit compared to when a member for applying a potential for electrically grounding the block is provided separately from the flexible substrate. (Aspect 4) Aspect 4 is This is a contact unit described in any one of aspects 1 to 3, wherein at least a portion of the surface of the block on which the flexible substrate is located is electrically connected to at least a portion of the surface of the flexible substrate on which the block is located. According to the fourth aspect, the potential of the flexible substrate can be applied to the block via at least a portion of the surface of the flexible substrate on the side where the block is located and at least a portion of the surface of the block on the side where the flexible substrate is located. Therefore, compared to when the potential of the flexible substrate is applied to the block via an electrical path that does not go through at least a portion of the surface of the flexible substrate on the side where the block is located and at least a portion of the surface of the block on the side where the flexible substrate is located, no member for the electrical path is required, and the configuration of the contact unit can be simplified. (Aspect 5) Aspect 5 is In the contact unit according to any one of aspects 1 to 4, at least a portion of the surface of the block on which the flexible substrate is located is conductive. According to aspect 5, the block can more easily block electromagnetic waves generated from the flexible substrate, compared to when only the portion of the block away from the surface on which the flexible substrate is located is conductive. (Aspect 6) Aspect 6 is In the contact unit according to any one of aspects 1 to 5, at least a portion of the block is made of metal. According to the sixth aspect, the resistance of the block can be lowered and the hardness of the block can be increased, compared to when the block is made of a conductive material other than metal. (Aspect 7) Aspect 7 is An inspection jig including the contact unit according to any one of the first to sixth aspects. According to the seventh aspect, similarly to the first aspect, the electrical characteristics of the object to be inspected can be inspected accurately. [Explanation of symbols]

[0070] 10 Inspection jig 10A Inspection jig 50 Inspection object 52 electrodes 100 contact units 100A contact unit 110 Flexible PCB 112 Base Area 114 Stretching area 116 Contact point 116a High-speed signal contact section 116b Low speed signal contact section 116c Power supply contact section 116d Ground contact 118a High-speed signal conductive pattern 118b Conductive pattern for low-speed signals 118c Power supply conductive pattern 118d Ground conductive pattern 120 coaxial connector 120A Coaxial Connector 122 Main body 124a High speed signal leg 124d Ground legs 126A coaxial cable 130 Sub-board 132 Second through hole 140 blocks 142 Pressing surface 144 Side 146 Elastic Members 200 Main board 202 First through hole 300 Holding member 300A holding member X 1st direction Y Second direction Z 3rd direction

Claims

1. a flexible substrate having a conductive pattern electrically connected to the object to be inspected; a block that presses at least a portion of the flexible substrate toward the test object; Equipped with the block has a conductive pressing surface that presses an area of ​​the flexible substrate facing the test object toward the test object, and a conductive pushing surface that is located around the pressing surface and pushes out other areas of the flexible substrate that are located around the area of ​​the flexible substrate toward the side where the test object is located; a contact unit, wherein at least a portion of the pressing surface of the block and at least a portion of the pushing surface of the block are electrically connected to at least a portion of the conductive pattern of the flexible substrate.

2. The contact unit according to claim 1 , wherein at least a portion of the block is electrically grounded.

3. 3. The contact unit according to claim 1, wherein at least a portion of the surface of the block on which the flexible substrate is located is electrically connected to at least a portion of the surface of the flexible substrate on which the block is located.

4. 4. The contact unit according to claim 1, wherein at least a portion of the surface of said block on which said flexible substrate is located is conductive.

5. 5. The contact unit according to claim 1, wherein at least a portion of the block is made of metal.

6. An inspection tool comprising the contact unit according to any one of claims 1 to 5.

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