Manufacturing method for busbar assembly and flat plate laminate structure for busbar assembly

Abstract

To provide a method for producing a bus bar assembly capable of producing simultaneously a plurality of plane type bus bar assemblies with a frame with excellent yield.SOLUTION: A bus bar flat plate that has m bus bar rows and bus bar side gripping pieces paralleled in an X direction, and has n bus bar forming regions and bus bar side connecting pieces where the bus bar rows are along a Y direction, and a flat plate for frame having m frame body rows and frame side gripping pieces paralleled in the X direction and having n frame forming regions and the frame body side connecting pieces along the Y direction at the same pitch as the bus bar forming region are fixed in a polymerization state, and the bus bar side connecting piece and the frame side connecting piece are displaced relative to each other so that they do not polymerize in a plane view, and a boundary between the bus bar forming region and the bus bar side connecting piece is cut from a surface facing the frame body flat plate to the opposite surface, and the boundary of the frame forming region and the frame side connecting piece is cut from the surface facing the bus bar flat plate to the opposite surface.SELECTED DRAWING: Figure 13

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a busbar assembly in which a plurality of busbars are electrically insulated and mechanically connected, and to a flat plate laminate structure for the busbar assembly. [Background technology]

[0002] 2. Description of the Related Art Busbar assemblies having a plurality of busbars that are electrically insulated from one another but mechanically connected to one another have been proposed and are used in various fields.

[0003] For example, a stacked busbar assembly has been proposed in which one flat busbar and another flat busbar are stacked one on top of the other in a parallel state (see Patent Documents 1 and 2 below).

[0004] In the laminated bus bar assembly, the opposing flat surfaces of one flat bus bar and the opposing flat surfaces of another flat bus bar are arranged to face each other across an insulating layer, which makes it difficult to ensure sufficient reliability in terms of insulation. In particular, if the thickness of the insulating layer between the one flat bus bar and the other flat bus bar is reduced in order to reduce the size in the vertical direction, there is a risk of leakage current flowing between the two bus bars.

[0005] In order to solve the problems with the laminated busbar assembly, the applicant of the present application has filed an application for and received a patent for a planar busbar assembly in which first and second busbars made of conductive metal flat plates are arranged side by side in the same plane (see Patent Documents 3 and 4 below).

[0006] FIG. 17 shows a vertical cross-sectional view of a semiconductor module 600 in which semiconductor elements 110 such as LEDs are mounted on the flat bus bar assembly 500.

[0007] As shown in Figure 17, the planar-side busbar assembly 500 is formed of a conductive flat-plate member and includes a plurality of first and second busbars 510(1), 510(2) arranged in the same plane with gaps 519 between opposing side surfaces; a busbar-side insulating layer 520 including gap-filling portions 529 filled in the gaps 519 and upper-surface-side laminated portions 521 extending integrally from the gap-filling portions 529 so as to cover the upper surface on one side in the plate thickness direction of the busbar connected body formed by the gap-filling portions 529; and a frame body 530 including a frame body main body 531 having the same external shape as the busbar connected body in a planar view and provided with a central hole 523 penetrating vertically, and a frame body-side insulating layer 540 covering the outer peripheral surface of the frame body main body 531.

[0008] In the planar bus bar assembly 500, one of the first and second bus bars 510(1), 510(2) acts as an anode, and the other acts as a cathode.

[0009] The upper surface side laminated portion 521 is provided with first and second upper surface side openings 522(1) and 522(2) that expose at least a portion of the upper surfaces of the first and second bus bars 510(1) and 510(2), respectively.

[0010] The portion of the upper surface of the first bus bar 510(1) that is exposed through the first upper surface opening 522(1) forms the upper surface connection portion of the first bus bar 510(1), and the portion of the upper surface of the second bus bar 510(2) that is exposed through the second upper surface opening 522(2) forms the upper surface connection portion of the second bus bar 510(2).

[0011] One of the pair of electrode layers 111, 112 of the semiconductor element 110 is attached in an electrically connected state to the upper surface side connection portion of one of the first and second bus bars 510(1), 510(2), and the other electrode layer of the semiconductor element 110 is electrically connected to the other upper surface side connection portion of the first and second bus bars 510(1), 510(2) via an electrical connection member such as a wire 120.

[0012] That is, the semiconductor element 110 has an element body 115, and an upper electrode layer 111 and a lower electrode layer 112 respectively disposed on one side and the other side of the element body 115 in the thickness direction, and the lower electrode layer 112 is mechanically and electrically connected to the upper surface side connection portion of one of the first and second bus bars 510(1), 510(2) (the first bus bar 510(1) in FIG. 17) via, for example, a plating layer (not shown), and the upper electrode layer 111 is electrically connected to the upper surface side connection portion of the other of the first and second bus bars 510(1), 510(2) (the second bus bar 510(2) in FIG. 17) via a wire 120.

[0013] In the illustrated embodiment, the busbar-side insulating layer 520 further includes a lower-surface-side laminated portion 523 that covers the lower surface of the busbar connecting body on the other side in the plate thickness direction, and a side-surface-side laminated portion 525 that covers the side surface of the busbar connecting body, and the lower-surface-side laminated portion 523 is provided with first and second lower-surface-side openings 524(1), 524(2) that expose at least a portion of the lower surface of each of the first and second busbars 510(1), 510(2).

[0014] The portion of the underside of the first bus bar 510(1) that is exposed through the first underside opening 524(1) forms the underside connection portion of the first bus bar 510(1), and the portion of the underside of the second bus bar 510(2) that is exposed through the second underside opening 524(2) forms the underside connection portion of the second bus bar 510(2).

[0015] The frame body 530 is a member for preventing the leakage and detachment of the sealing resin body 130 that protects the semiconductor element 110 and the wire 120, and is fixed to the periphery of the upper surface of the busbar connector with the first and second upper surface openings 522(1), 522(2) positioned within the central hole 535 in a plan view.

[0016] That is, the sealing resin body 130 is formed by pouring insulating resin onto the upper surface of the bus bar connector so as to surround the semiconductor element 110 and the wire 120 and then hardening it, and the frame body 530 prevents the insulating resin from flowing out before hardening and also prevents the sealing resin body 130 from detaching from the bus bar assembly 500 after hardening.

[0017] The above-mentioned Patent Document 4 describes a manufacturing method (hereinafter referred to as a conventional manufacturing method) that can efficiently manufacture the frame-attached planar busbar assembly 500. A conventional manufacturing method will be described below.

[0018] The conventional manufacturing method includes a step of preparing a bus bar flat plate 550 made of a conductive metal. FIG. 18 shows a plan view of the bus bar plate 550. As shown in FIG.

[0019] As shown in FIG. 18, the bus bar plate 550 has a bus bar row 555 extending along a first direction (Y direction in FIG. 18 below) of the XY plane on which the bus bar plate 550 is located.

[0020] The busbar row 555 has an outer shape in a plan view corresponding to the busbar connecting body, and has a plurality of (five in the illustrated form) busbar forming areas 560 arranged in series along a first direction of the XY plane, and a plurality of (six in the illustrated form) busbar side connecting pieces 570 that integrally connect the plurality of busbar forming areas 560.

[0021] The conventional manufacturing method includes a slit forming step. The slit forming process is configured to form slits 569 that penetrate busbar forming region 560 in the plate thickness direction and have the same width as gap 519, thereby dividing busbar forming region 560 into a plurality of busbar forming portions 565(1), 565(2) that correspond to the plurality of busbars 510(1), 510(2). FIG. 18 shows the state after the slit forming step.

[0022] As shown in Figure 18, the slit 569 formed in one busbar forming region 560 in the slit forming process has one longitudinal end extending into a busbar side connecting piece 570 connected to one side (e.g., the downward side in Figure 18) of the one busbar forming region in the first direction (the Y direction in the illustrated form), and the other longitudinal end extending into a busbar side connecting piece 570 connected to the other side (e.g., the upward side in Figure 18) of the one busbar forming region 560 in the first direction.

[0023] The conventional manufacturing method further includes a busbar side insulating layer forming process in which an insulating resin paint is applied to the inside of the slit 569 and the outer peripheral surface of the busbar forming area 560 and hardened to provide the busbar side insulating layer 520. FIG. 19 shows a plan view of the bus bar forming plate 550 after the bus bar side insulating layer forming step.

[0024] The conventional manufacturing method further includes a laser light irradiation step of irradiating the upper surface laminated portion 521 of the busbar side insulating layer 520 with laser light to form the first and second upper surface openings 522(1), 522(2), and irradiating the lower surface laminated portion 523 with laser light to form the first and second lower surface openings 524(1), 524(2). 20(a) and 20(b) show a plan view and a bottom view, respectively, of the bus bar plate 550 after the laser light irradiation step.

[0025] The conventional manufacturing method includes a frame forming process for forming the frame 530 in addition to the processing of the bus bar flat plate 550 .

[0026] More specifically, the frame forming process includes a step of preparing a frame plate 650 made of conductive metal. FIG. 21 shows a plan view of the frame plate 650. As shown in FIG.

[0027] As shown in FIG. 21, the frame body flat plate 650 has a frame body row 655 extending in the same direction as the bus bar row 555 (the Y direction on the XY plane).

[0028] The frame body row 655 has a plurality (five in the illustrated form) of frame body forming regions 660 having a planar external shape corresponding to the busbar forming region 560 and having a through hole 665 corresponding to the central hole 35 formed therein, and a plurality (six in the illustrated form) of frame body side connecting pieces 670 that integrally connect the plurality of frame body forming regions 660.

[0029] The frame forming process further includes a frame-side insulating layer forming step of applying an insulating resin paint to the outer peripheral surface of the frame forming region 660 and hardening it to provide the frame-side insulating layer 540 . FIG. 22 shows a plan view of the frame body flat plate 650 after the frame body side insulating layer forming step.

[0030] The conventional manufacturing method further includes a flat plate fixing process in which the lower surface of the frame body forming region 660 after the frame body forming process is fixed in an overlapping state to the upper surface of the busbar forming region 560 after the busbar side insulating layer forming process. FIG. 23 shows a plan view of the bus bar forming plate 550 and the frame forming plate 650 after the plate fixing step.

[0031] The conventional manufacturing method further includes a cutting step after the flat plate fixing step, in which the fixed busbar forming region 560 and the fixed frame body forming region 660 are cut from the bus bar forming plate 550 and the frame body forming plate 650.

[0032] The conventional manufacturing method having such a configuration is useful in that it allows a plurality of the frame-equipped planar bus bar assemblies 500 to be manufactured at the same time, but there is room for improvement.

[0033] In the conventional manufacturing method, as shown in FIG. 23, when the busbar forming plate 550 and the frame body forming plate 650 are fixed together so that the busbar forming region 560 and the frame body forming region 660 overlap, the busbar connecting piece 570 and the frame body connecting piece 670 also overlap each other.

[0034] In this case, a boundary D1 between the frame body forming region 660 and the frame body side connecting piece 670 and a boundary D2 between the bus bar forming region 560 and the bus bar side connecting piece 570 are positioned at the same position in a plan view.

[0035] Therefore, in the cutting step in the conventional manufacturing method, the cutting process for separating the frame body forming region 660 from the frame body flat plate 650 and the cutting process for separating the bus bar forming region 560 from the bus bar flat plate 550 are performed as a single cutting process at the same position in a plan view.

[0036] 24(a) and (b) show enlarged cross-sectional views taken along line XXIV-XXIV in FIG. 23. 24(a) and (b) show the state before and after cutting, respectively. In addition, reference numeral 180 in Figures 24(a) and (b) denotes a cutting member such as a diamond blade, and reference numeral 190 denotes a holding member that fixes the bus bar flat plate 550 and the frame body flat plate 650 and is provided with a guide for the cutting member 180.

[0037] As shown in Figure 24(b), if a boundary D1 between the frame-forming region 660 and the frame-side connecting piece 670 and a boundary D2 between the busbar-forming region 560 and the busbar-side connecting piece 570, which are located at the same position in a plan view, are cut in a single cutting process, a burr 680 generated on one of the busbar forming plates 550 and the frame forming plate 650 located upstream in the cutting direction (the frame forming plate 650 in Figures 24(a) and 24(b)) may damage the insulating layer of the other plate located directly below (the busbar forming plate 550 in Figures 24(a) and 24(b)). In some cases, this may come into contact with the plate located downstream in the cutting direction (the busbar forming plate 550 in Figures 24(a) and 24(b)). If this happens, the resulting product will be unusable and will be defective. [Prior art documents] [Patent documents]

[0038] [Patent Document 1] Patent No. 4432913 [Patent Document 2] Patent No. 6487769 [Patent Document 3] Patent No. 6637002 [Patent Document 4] Patent No. 6637003 Summary of the Invention [Problem to be solved by the invention]

[0039] The present invention has been made in view of the above-mentioned conventional techniques, and has as its object to provide a method for manufacturing busbar assemblies that can simultaneously manufacture a plurality of planar busbar assemblies with frame bodies and with a high yield. [Means for solving the problem]

[0040] In order to achieve the above object, the present invention provides a busbar-side insulating layer including a plurality of busbars formed of conductive flat plate-like members and arranged in the same plane with gaps between opposing side surfaces, gap filling portions filled in the gaps, and an upper surface side laminate portion covering an upper surface on one side in a plate thickness direction of a busbar connected body formed by the gap filling portions, and a frame body having a frame body main body having the same external shape as the busbar connected body in a plan view and provided with a central hole penetrating in the vertical direction, and a frame body side insulating layer covering an outer peripheral surface of the frame body, a busbar assembly including a frame body secured to a peripheral edge of the upper surface of the busbar connected body via the upper surface laminated portion, with the one or more upper surface openings being located within the central hole in a plan view, the busbar assembly comprising the steps of: preparing a busbar plate made of a conductive metal, the busbar plate including a busbar forming region having an outer shape in a plan view corresponding to the busbar connected body; and forming one or more slits in the busbar forming region that penetrate the busbar plate in a plate thickness direction and have the same width as the gap. a slit forming step of dividing the busbar forming region into a plurality of busbar forming portions corresponding to the plurality of busbars; a busbar side insulating layer forming step of applying an insulating resin paint at least to the inside of the slits and to an upper surface of the busbar forming region and curing the paint to form the busbar side insulating layer; a laser light irradiation step of irradiating a laser light to an upper surface laminated portion of the busbar side insulating layer to form the one or more upper surface openings; and a frame forming process which is performed before, after, or in parallel with the processes from the busbar plate preparing step to the laser light irradiation step. a frame forming process including a step of preparing a frame plate made of a conductive metal including a frame forming region having an outer shape in a plan view corresponding to the busbar forming region and having a through hole formed therein corresponding to the central hole; a frame side insulating layer forming step of applying an insulating resin paint to an outer peripheral surface of the frame forming region and hardening the paint to provide the frame side insulating layer; a plate fixing step of fixing, before or after the laser light irradiation step, a lower surface of the frame forming region after the frame forming process to an upper surface of the busbar forming region after the busbar side insulating layer forming step in an overlapping state; andand a cutting step of cutting the busbar forming regions and the frame body forming regions in a fixed state from the busbar forming plate and the frame body flat plate, wherein the busbar forming plate has a busbar row formed by the plurality of busbar forming regions and a plurality of busbar side connecting pieces integrally connecting the plurality of busbar forming regions, which are arranged in series along a first direction of an XY plane in which the busbar forming plate is located, and the slit formed in one busbar forming region has one longitudinal end side extending into the busbar side connecting piece connected to one side of the one busbar forming region in the first direction and the other longitudinal end side extending into the busbar side connecting piece connected to the other side of the one busbar forming region in the first direction, and the frame body flat plate has a frame body row formed by the plurality of frame body forming regions and a plurality of frame body side connecting pieces integrally connecting the plurality of frame body forming regions, which are arranged in series in the first direction at the same pitch as the plurality of busbar forming regions in the busbar row, and the busbar-side connecting pieces are disposed at a center in the width direction of the busbar row, and the frame-side connecting pieces are disposed on both sides of the center in the width direction of the frame row, a busbar assembly manufacturing method including: a busbar-side cutting process for cutting the boundary between the busbar forming region and the busbar-side connecting piece from the side of the surface facing the frame body flat plate toward the side of the surface opposite the frame body flat plate; and a frame body-side cutting process for cutting the boundary between the frame body forming region and the frame body-side connecting piece from the side of the surface facing the busbar flat plate toward the side of the surface opposite the busbar flat plate.

[0041] Preferably, the busbar plate has a plurality of busbar rows arranged in parallel in a second direction perpendicular to the first direction within an XY plane in which the busbar plate is located, and busbar-side gripping pieces that hold the plurality of busbar rows together, and the frame plate has a plurality of frame body rows arranged in parallel in the second direction at the same pitch as the plurality of busbar rows and in the same number, and frame body-side gripping pieces that hold the plurality of frame body rows together.

[0042] The present invention also provides a method for manufacturing a busbar assembly, the method comprising: providing a plurality of bus bars formed of conductive flat plate members and arranged in the same plane with gaps between opposing side surfaces; a bus bar side insulating layer including gap filling portions filled in the gaps and an upper surface side laminate portion covering an upper surface on one side in the plate thickness direction of a bus bar connected body formed by the gap filling portions; and a frame body having a frame body main body having the same external shape in a plan view as the bus bar connected body and provided with a central hole penetrating in the vertical direction, and a frame body side insulating layer covering an outer peripheral surface of the frame body main body, wherein the upper surface side laminate portion has a frame body covering an outer peripheral surface of the frame body, and the frame has one or more upper surface openings that expose at least a portion of the upper surface of the busbar connector, and the frame is formed with a flat plate laminate structure for busbar assemblies in which a plurality of busbar assemblies are connected in the same plane, the busbar assemblies being fixed to the periphery of the upper surface of the busbar connector via the upper surface laminate portion with the one or more upper surface openings positioned within the central hole in a plan view, the flat plate for busbar assemblies being made of a conductive metal and having an outer shape in a plan view that corresponds to the busbar connector, and having a plurality of busbar forming regions and front surfaces that are arranged in series along a first direction in an XY plane in which the flat plate for busbar assemblies is located a busbar row formed by a plurality of busbar-side connecting pieces that integrally connect the plurality of busbar forming regions, each of the plurality of busbar forming regions having a busbar forming plate partitioned into a plurality of busbar forming portions corresponding to the plurality of busbars by one or more slits that penetrate the plate thickness direction and have the same width as the gaps, a portion that is filled in the slits to form the gap filling portion, and a portion that is provided on the upper surface of the busbar forming region to form the upper surface side laminated portion, and the one or more upper surface side openings are provided in the portion that forms the upper surface side laminated portion a frame body flat plate made of a conductive metal having a busbar-side insulating coating film formed on an outer circumferential surface of the frame body forming region, a plurality of frame body forming regions having an outer shape in a plan view corresponding to the busbar forming region and arranged in series in a first direction at the same pitch as the plurality of busbar forming regions in the busbar row, and a frame body row formed by a plurality of frame body-side connecting pieces integrally connecting the plurality of frame body forming regions, wherein each of the plurality of frame body forming regions has a through hole that forms the central hole; and a frame body flat plate made of a conductive metal having an outer circumferential surface of the frame body forming region and forming the frame body-side insulating layer,the slit formed in one busbar forming region has one longitudinal end extending into a busbar side connecting piece connected to one side of the one busbar forming region in the first direction and the other longitudinal end extending into a busbar side connecting piece connected to the other side of the one busbar forming region in the first direction, and the busbar forming plate and the frame body flat plate are fixed together so that the busbar forming region provided with the busbar side insulating coating film overlaps the frame body forming region provided with the frame body side insulating coating film, the busbar-side connecting pieces are disposed at a center in the width direction of the busbar row, and the frame-side connecting pieces are disposed on both sides of the center in the width direction of the frame row, The busbar side connecting piece and the frame body side connecting piece are displaced relative to each other so as not to overlap in a planar view when the frame body flat plate and the busbar flat plate are fixed in place, thereby providing a flat plate stack structure for a busbar assembly.

[0043] Preferably, the busbar plate has a plurality of busbar rows arranged in parallel in a second direction perpendicular to the first direction in an XY plane on which the busbar plate is located, and busbar-side gripping pieces that hold the plurality of busbar rows together, and the frame plate has a plurality of frame body rows arranged in parallel in the second direction at the same pitch as the plurality of busbar rows, and frame body-side gripping pieces that hold the plurality of frame body rows together.

[0044] Preferably, the busbar-side insulating coating further has a portion that is provided on the underside of the busbar forming area and forms a lower surface-side laminate portion that covers the underside of the busbar connecting body on the other side in the plate thickness direction, and a portion that is provided on the side of the busbar forming area and forms a side surface-side laminate portion that covers the side surface of the busbar connecting body, and the portion that forms the lower surface-side laminate portion is provided with one or more lower surface-side openings that expose at least a portion of the underside of each of the plurality of busbars. [Effects of the Invention]

[0045] According to the method for manufacturing a busbar assembly of the present invention, a plurality of planar busbar assemblies with frames can be manufactured simultaneously with a high yield. [Brief explanation of the drawings]

[0046] [Figure 1] FIG. 1(a) is a plan view of a semiconductor module in which semiconductor elements such as LEDs are mounted on a busbar assembly manufactured by a manufacturing method according to embodiment 1 of the present invention, and FIG. 1(b) is a cross-sectional view taken along line I(b)-I(b) in FIG. 1(a). [Figure 2] FIG. 2 is a plan view of the bus bar plate used in the manufacturing method according to the first embodiment, showing the state after the slit forming step in the manufacturing method. [Figure 3] FIG. 3 is a plan view of the busbar forming plate after the busbar-side insulating layer forming step in the manufacturing method according to the first embodiment. [Figure 4] FIG. 4 is a plan view of the bus bar forming plate after the laser light irradiation step in the manufacturing method according to the first embodiment. [Figure 5] FIG. 5 is a bottom view of the bus bar forming plate after the laser light irradiation step in the manufacturing method according to the first embodiment. [Figure 6] FIG. 6 is a plan view of a frame plate used in the manufacturing method according to the first embodiment. [Figure 7] FIG. 7 is a plan view of the frame-forming plate after the frame-side insulating layer forming step in the manufacturing method according to the first embodiment. [Figure 8] FIG. 8 is a plan view of the bus bar forming plate and the frame forming plate after the plate fixing step in the manufacturing method according to the first embodiment. [Figure 9] FIG. 9 is an enlarged view of part IX in FIG. [Figure 10] Fig. 10(a) is a cross-sectional view taken along line X(a)-X(a) in Fig. 9, showing a state in which frame-side cutting processing is being performed in the cutting step in the manufacturing method according to embodiment 1. Fig. 10(b) is a cross-sectional view taken along line X(b)-X(b) in Fig. 9, showing a state in which busbar-side cutting processing is being performed in the cutting step. [Figure 11]FIG. 11 is a plan view of a bus bar plate used in a manufacturing method according to the second embodiment of the present invention, showing the state after the slit forming step in the manufacturing method. [Figure 12] FIG. 12 is a plan view of a frame plate used in the manufacturing method according to the second embodiment. [Figure 13] FIG. 13 is a plan view of the bus bar forming plate and the frame forming plate after the plate fixing step in the manufacturing method according to the second embodiment. [Figure 14] FIG. 14 is an enlarged view of a portion XIV in FIG. [Figure 15] Fig. 15(a) is a cross-sectional view taken along line XV(a)-XV(a) in Fig. 14, showing a state in which frame-side cutting processing is being performed in the cutting step in the manufacturing method according to the second embodiment. Fig. 15(b) is a cross-sectional view taken along line X(b)-X(b) in Fig. 14, showing a state in which busbar-side cutting processing is being performed in the cutting step. [Figure 16] FIG. 16 is a plan view of the bus bar forming plate and the frame forming plate used in the manufacturing method according to the modified example of the second embodiment after the plate fixing step. [Figure 17] FIG. 17 is a vertical cross-sectional view of a semiconductor module in which semiconductor elements such as LEDs are mounted on a flat bus bar assembly. [Figure 18] FIG. 18 is a plan view of a bus bar plate used in a conventional manufacturing method, showing the state after the slit forming step in the manufacturing method. [Figure 19] FIG. 19 is a plan view of the busbar forming plate after the busbar-side insulating layer forming step in the conventional manufacturing method. [Figure 20] 20(a) and 20(b) are a plan view and a bottom view, respectively, of the bus bar forming plate after the laser light irradiation step in the conventional manufacturing method. [Figure 21] FIG. 21 is a plan view of a frame plate used in a conventional manufacturing method. [Figure 22]FIG. 22 is a plan view of the frame-forming plate after the frame-side insulating layer forming step in the conventional manufacturing method. [Figure 23] FIG. 23 is a plan view of the bus bar forming plate and the frame forming plate after the plate fixing step in the conventional manufacturing method. [Figure 24] 24(a) and (b) are enlarged cross-sectional views taken along line XXIV-XXIV in FIG. 23, showing the state before and after cutting, respectively. DETAILED DESCRIPTION OF THE INVENTION

[0047] Embodiment 1 Hereinafter, an embodiment of a method for manufacturing a busbar assembly according to the present invention will be described with reference to the accompanying drawings. 1(a) and (b) show a plan view and a cross-sectional view along line I(b)-I(b) in FIG. 1(a), respectively, of a semiconductor module 101 in which a semiconductor element 110 such as an LED is mounted on a busbar assembly 1 manufactured by the manufacturing method of this embodiment.

[0048] As shown in Figures 1(a) and 1(b), the busbar assembly 1 is formed of a conductive flat plate-like member and includes a plurality of busbars 10 arranged in parallel in the same plane with gaps 19 between opposing side surfaces 15, a busbar-side insulating layer 20 including gap-filling portions 29 filled in the gaps 19 and an upper-surface-side laminated portion 21 covering the upper surface of a busbar connected body formed by connecting the plurality of busbars 10 via the gap-filling portions 29, and a frame body 30 including a frame body main body 31 having the same external shape as the busbar connected body in a planar view and provided with a central hole 35 penetrating vertically, and a frame body-side insulating layer 40 covering the outer peripheral surface of the frame body main body 31.

[0049] The bus bar 10 is made of a conductive metal such as Cu. The bus bar assembly 1 according to this embodiment has two bus bars, namely, first and second bus bars 10(1) and 10(2), as the plurality of bus bars 10. Of course, the plurality of bus bars 10 may include three or more bus bars.

[0050] Each of the first and second bus bars 10(1), 10(2) has an upper surface 11 and a lower surface 12 facing one side and the other side in the thickness direction, respectively, and a side surface 15 connecting the upper surface 11 and the lower surface 13, and the side surfaces 15 of adjacent bus bars 10 face each other via the gap 19.

[0051] The busbar side insulating layer 20 is formed by an insulating resin coating film having heat resistance and insulating properties, such as polyamideimide, polyimide, polyamide, or epoxy, and is preferably formed using Insulead (registered trademark).

[0052] The upper surface side laminated portion 21 is provided with one or more upper surface side openings 22(1), 22(2) that expose at least a portion of the upper surface of each of the first and second bus bars 10(1), 10(2).

[0053] As shown in Figures 1(a) and (b), in this embodiment, the upper surface laminated portion 21 is provided with a plurality of upper surface openings (first and second upper surface openings 22(1), 22(2)) that expose a portion of each of the upper surfaces 11 of the plurality of bus bars 10 (the first and second bus bars 10(1), 10(2)).

[0054] Alternatively, it is possible to provide a single upper surface opening in the upper surface laminated portion 21 that integrally exposes a portion of the upper surfaces 11 of the plurality of bus bars 10 (the first and second bus bars 10(1), 10(2)).

[0055] The portions of the upper surfaces 11 of the first and second bus bars 10(1), 10(2) that are exposed through the upper surface openings (in this embodiment, the first and second upper surface openings 22(1), 22(2)) form upper surface connection portions 12.

[0056] One of the pair of electrode layers of the semiconductor element 110 is attached in an electrically connected state to the upper surface connection portion 12 of one of the first and second bus bars 10(1), 10(2) (for example, the first bus bar 10(1)), and the other of the pair of electrode layers of the semiconductor element 110 is electrically connected to the upper surface connection portion 12 of the other of the first and second bus bars 10(1), 10(2) (for example, the second bus bar 10(2)) via an electrical connection member 120 such as a wire.

[0057] That is, the semiconductor element 110 has an upper electrode layer 111 and a lower electrode layer 112 on the upper surface on one side in the thickness direction and on the lower surface on the other side in the thickness direction, respectively, and has an element body 115 between the upper electrode layer 111 and the lower electrode layer 112.

[0058] In the semiconductor module 101, the lower electrode layer 112 of the semiconductor element 110 is fixed in an electrically connected state to the upper surface connection portion 12 of the first bus bar 10(1), and the upper electrode layer 111 is electrically connected to the upper surface connection portion 12 of the second bus bar 10(2) via a wire 120.

[0059] One of the first and second bus bars 10(1), 10(2) acts as a first electrode that is one of an anode and a cathode (for example, an anode), and the other of the first and second bus bars 10(1), 10(2) acts as a second electrode that is the other of an anode and a cathode (for example, a cathode).

[0060] At least a part of the lower surface 13 of each of the first and second bus bars 10(1) and 10(2) is exposed to form a lower surface side connection portion 14.

[0061] In this embodiment, as shown in FIG. 1(b), the busbar-side insulating layer 20 has a lower-surface-side laminated portion 23 that covers the lower surface of the busbar connected body, and the lower-surface-side laminated portion 23 is provided with first and second lower-surface-side openings 24(1) and 24(2) that expose portions of the lower surfaces 13 of the first and second busbars 10(1) and 10(2), respectively.

[0062] Alternatively, it is possible to provide a single lower surface opening in the lower surface laminated portion 23 that integrally exposes a portion of the lower surfaces 13 of the plurality of bus bars 10 (the first and second bus bars 10(1), 10(2)).

[0063] The portions of the undersides 13 of the first and second bus bars 10(1), 10(2) that are exposed through the underside openings (in this embodiment, the first and second underside openings 24(1), 24(2)) form the underside connection portions 14. The lower surface side connection portions 14 act as external connection terminals for electrically connecting the corresponding bus bars 10(1), 10(2) to the outside.

[0064] In this embodiment, the busbar-side insulating layer 20 integrally includes, in addition to the gap-filling portion 29, the upper surface-side laminated portion 21, and the lower surface-side laminated portion 23, a side surface-side laminated portion 25 that covers the side surfaces of the busbar connected body.

[0065] The frame 30 holds a sealing resin body 130 that protects the semiconductor element 110 and the wires 120 mounted on the upper surface side connection portion 12 .

[0066] In detail, the frame body 30 is fixed to the periphery of the upper surface of the busbar connector via the upper surface laminated portion 21 in a state where the one or more upper surface openings (in this embodiment, the first and second upper surface openings 22(1), 22(2)) are positioned within the central hole 35 in a plan view.

[0067] The frame body 31 is formed of a conductive metal member (preferably the same member as the bus bar 10).

[0068] The frame-side insulating layer 40 is formed of an insulating resin coating having heat resistance and insulating properties, such as polyamideimide, polyimide, polyamide, or epoxy, and is preferably formed using Insulead (registered trademark).

[0069] The sealing resin layer 130 is made of a transparent insulating resin material such as polyimide, polyamide, or epoxy.

[0070] More specifically, the insulating resin material that forms the sealing resin layer 130 is poured into the housing space defined by the frame 30 so as to surround the semiconductor element 110 and the wires 120 . The frame 30 prevents the insulating resin material from flowing out before hardening, and prevents the sealing resin layer 130 from detaching from the bus bar assembly 1 after hardening.

[0071] A method for manufacturing the busbar assembly 1 according to this embodiment will now be described.

[0072] The manufacturing method includes a step of preparing a bus bar plate 200A made of a conductive metal. FIG. 2 shows a plan view of the bus bar plate 200A. FIG. 2 shows the state after the slit forming step described below.

[0073] The busbar flat plate 200A has a plurality of busbar assembly forming regions 210 having an outer shape in a plan view corresponding to the busbar connected body formed by connecting a plurality of busbars 10 (in this embodiment, the first and second busbars 10(1), 10(2)) by the busbar side insulating layer 20.

[0074] The busbar assembly forming region 210 has a length in a first direction (Y direction in this embodiment) of the XY plane in which the busbar flat plate 200A is located that is the same as the length along a direction parallel to the gap 19 of the busbar assembly 1, and a second direction (X direction length in this embodiment) that is perpendicular to the first direction in the XY plane that is the same as the length along the width direction of the gap 19 of the busbar assembly 1.

[0075] As shown in FIG. 2, in this embodiment, the busbar plate 200A has m (m is an integer of 2 or more, m=3 in the illustrated embodiment) busbar rows 205A (first to third busbar rows 205A(1) to (3) in this embodiment) arranged in parallel in the X direction of the XY plane, and a busbar-side gripping piece 207 that integrally holds the m busbar rows 205A.

[0076] Each of the busbar rows 205A(1) to (3) has n (n is an integer of 2 or more, n=5 in the illustrated embodiment) busbar forming regions 210 arranged in series along the Y direction of the XY plane, and a plurality (n+1) of busbar side connecting pieces 230A that integrally connect the n busbar forming regions 210.

[0077] That is, in this embodiment, the busbar forming plate 200A has m×n (3×5=15 in the illustrated embodiment) busbar forming regions 210 arranged in a rectangular shape.

[0078] In this embodiment, the busbar side gripping piece 207 has first and second busbar side gripping pieces 207(1), 207(2) arranged on one and the other longitudinal sides of the busbar row 205A (in this embodiment, the first to third busbar rows 205A(1) to (3)). Of the multiple busbar side connecting pieces 230A, the busbar side connecting piece 230A(1) located at the outermost position on one longitudinal side of the busbar row 205A is connected to the first busbar side gripping piece 207(1), and the busbar side connecting piece 230A(2) located at the outermost position on the other longitudinal side of the busbar row 205A is connected to the second busbar gripping piece 207(2).

[0079] As shown in FIG. 2, alignment holes 208 are formed in the first and second bus bar side gripping pieces 207(1), 207(2).

[0080] The manufacturing method further includes a slit forming step of forming one or more slits 219 in the busbar forming region 210, which pierce the busbar forming region 210 in the plate thickness direction and have the same width as the gap 19, thereby dividing the busbar forming region 210 into a plurality of busbar forming portions 220 corresponding to the plurality of busbars 10.

[0081] As described above, in this embodiment, the busbar assembly 1 has the first and second busbars 10(1), 10(2) as the multiple busbars 10. Therefore, as shown in FIG. 2, the slit forming step is configured to form one slit 219 in the busbar forming region 210 to divide the busbar forming region 210 into first and second busbar forming portions 220(1), 220(2).

[0082] The slit 219 formed in one busbar forming region 210 has one longitudinal end extending into a busbar side connecting piece 230A connected to one side of the busbar forming region 210 in the Y direction, and the other longitudinal end extending into a busbar side connecting piece 230A connected to the other side of the busbar forming region 210 in the Y direction.

[0083] That is, the longitudinal length of the slit 219 is made greater than the length of the busbar forming area 210 along the longitudinal direction of the busbar row 205A, and after the slit forming step, the first and second busbar forming portions 220(1), 220(2) are maintained in a connected state to each other via a pair of busbar side connecting pieces 230A located on both sides of the busbar assembly forming area 210 in the longitudinal direction of the busbar row 205A. By providing such a configuration, the slit 219 (the gap 19) can be formed with high precision.

[0084] The manufacturing method further includes a busbar side insulating layer forming step of applying and curing an insulating resin paint at least in the slits 219 and on the upper surface of the busbar forming region 210 to provide the busbar side insulating layer 20. FIG. 3 shows a plan view of the busbar forming plate 200A after the busbar-side insulating layer forming step.

[0085] The application of the insulating resin paint in the bus bar side insulating layer forming step can be carried out by, for example, electrodeposition coating, electrostatic powder coating, or spray coating.

[0086] As described above, in the busbar assembly 1, the busbar side insulating layer 20 has the gap filling portion 29 and the upper surface side laminated portion 21, as well as the lower surface side laminated portion 23 and the side surface laminated portion 25.

[0087] Therefore, the busbar side insulating layer forming process is configured to apply insulating resin paint to the lower and side surfaces of the busbar forming area 210 in addition to the inside of the slit 219 and the upper surface of the busbar forming area 210.

[0088] The manufacturing method further includes a laser light irradiation step of irradiating the upper surface side laminated portion 21 of the busbar side insulating layer 20 with laser light to form the one or more upper surface side openings 22 (in this embodiment, the first and second upper surface side openings 22(1), 22(2)). FIG. 4 shows a plan view of the bus bar forming plate 200A after the laser light irradiation step.

[0089] As described above, in the bus bar assembly 1, the lower laminated portion 23 is provided with the first and second lower openings 24(1), 24(2).

[0090] Therefore, the laser light irradiation process is configured to irradiate the upper surface laminated portion 21 with laser light to form the first and second upper surface openings 22(1), 22(2), as well as the lower surface laminated portion 23 with laser light to form the first and second lower surface openings 24(1), 24(2). FIG. 5 shows a bottom view of the busbar plate 200A after the lower surface laminated portion 23 is irradiated with laser light to form the first and second lower surface openings 24(1), 24(2).

[0091] The manufacturing method includes a frame forming process that is performed before, after, or in parallel with the processes from the process of preparing the bus bar plate 200A to the laser light irradiation process.

[0092] The frame body forming process includes a step of preparing a frame body flat plate 300A made of a conductive metal, which includes a frame body forming region 310 having a planar outer shape corresponding to the bus bar forming region 210 and in which a through hole 315 corresponding to the central hole 35 is formed. FIG. 6 shows a plan view of the frame plate 300A.

[0093] As shown in Figure 6, the frame body flat plate 300A has n frame body rows 305A (in this embodiment, first to fifth frame body rows 305A(1) to (5)) and a frame body side gripping piece 307 that holds the n frame body rows 305A together. The n frame body rows 305A are arranged in parallel in the Y direction of the XY plane on which the frame body flat plate 300A is located, at the same pitch as the n (n=5 in this embodiment) busbar forming areas 210 in the busbar row 205A.

[0094] Each of the n frame body rows 305A has m frame body forming regions 310 arranged in series along the X direction of the XY plane on which the frame body flat plate 300A is located, at the same pitch as the m (in this embodiment, m=3) bus bar rows 205A (in this embodiment, the first to third bus bar rows 205A(1) to (3)), and a plurality of (m+1) frame body side connecting pieces 330A that integrally connect the m frame body forming regions 310.

[0095] That is, the multiple (15 in this embodiment) busbar forming regions 210 in the busbar forming plate 200A and the multiple (15 in this embodiment) frame forming regions 310 in the frame body forming plate 300A are positioned at the same position in the XY plane (i.e., in a planar view), while the multiple busbar side connecting pieces 230A and the multiple frame body side connecting pieces 330A are displaced in position in the XY plane.

[0096] The frame body side connecting piece 307 has first and second frame body side gripping pieces 307(1), 307(2) positioned in the same position as the first and second bus bar side gripping pieces 207(1), 207(2) in a plan view.

[0097] In detail, as shown in FIG. 6, the frame body flat plate 300A is provided with a first intermediate piece 309(1) extending in the Y direction while connecting one end sides of the longitudinal direction (X direction) of the n frame body rows 305A (in this embodiment, the first to fifth frame body rows 305A(1) to (5)) together, and a second intermediate piece 309(2) extending in the Y direction while connecting the other end sides of the longitudinal direction (X direction) of the n frame body rows 305A together.

[0098] Furthermore, the first frame body side gripping piece 307(1) is positioned at the same position as the first bus bar side gripping piece 207(1) in a planar view with one end of the longitudinal direction (Y direction) of the first and second intermediate pieces 309(1), 309(2) connected to each other, and the second frame body side gripping piece 307(2) is positioned at the same position as the second bus bar side gripping piece 207(2) in a planar view with the other end of the longitudinal direction (Y direction) of the first and second intermediate pieces 309(2) connected to each other.

[0099] As shown in FIG. 6, the first and second frame-side gripping pieces 307(1), 307(2) are formed with alignment holes 308 that are positioned in the same positions as the alignment holes 208 of the first and second busbar-side gripping pieces 207(1), 207(2) in a plan view.

[0100] The frame forming process further includes a frame-side insulating layer forming step of applying an insulating resin paint to the outer peripheral surface of the frame forming region 310 and hardening it to provide the frame-side insulating layer 40 . FIG. 7 shows a plan view of the frame body flat plate 300A after the frame body side insulating layer forming step.

[0101] The application of the insulating resin paint in the frame-side insulating layer forming step can be carried out by, for example, electrodeposition coating, electrostatic powder coating, or spray coating.

[0102] The manufacturing method further includes a flat plate fixing process in which the lower surface of the frame body forming region 310 after the frame body forming process is fixed in an overlapping state to the upper surface of the busbar forming region 210 after the busbar side insulating layer forming process. Figure 8 shows a plan view of the busbar flat plate 200A and the frame body flat plate 300A after the flat plate fixing process (i.e., a plan view of the flat plate laminate structure for a busbar assembly in which the frame body flat plate 300A is fixed to the busbar flat plate 200A).

[0103] The bus bar forming plate 200A and the frame forming plate 300A can be fixed together using an insulating adhesive, for example, after the alignment holes 208, 308 are used to align the two plates 200A, 300A. Alternatively, instead of or in addition to the adhesive, it is also possible to utilize the hardening action of the insulating resin coating film that forms the busbar side insulating layer 20 or the insulating resin coating film that forms the frame body side insulating layer 40.

[0104] That is, when one of the insulating resin coating film forming the busbar side insulating layer 20 and the insulating resin coating film forming the frame body side insulating layer 40 is in a semi-cured state, the two flat plates 200A, 300A are pressed together in a polymerized state, and the semi-cured insulating resin coating film is cured, thereby fixing the two flat plates 200A, 300A together.

[0105] The laser light irradiation step is performed after the bus bar side insulating layer 20 is completely cured, but the order of the laser light irradiation step and the flat plate fixing step can be arbitrary.

[0106] That is, when the laser light irradiation process is performed before the flat plate fixing process, the laser light irradiation process is performed on the busbar flat plate 200A in a state in which the busbar side insulating layer 20 has been completely cured, and then the busbar flat plate 200A and the frame flat plate 300A can be fixed with an insulating adhesive.

[0107] Alternatively, the busbar forming plate 200A in which the busbar-side insulating layer 20 is fully cured may be subjected to the laser light irradiation step, while the busbar forming plate 200A after the laser light irradiation step and the frame body forming plate 300A in which the frame body-side insulating layer 40 is semi-cured may be pressure-bonded to each other, thereby fixing the two plates 200A and 300A together. At this time, in addition to the curing action of the frame body-side insulating layer 40, an insulating adhesive may also be used.

[0108] When the laser light irradiation process is performed after the flat plate fixing process, the busbar flat plate 200A in which the busbar side insulating layer 20 is fully cured and the frame body flat plate 300A in which the frame body side insulating layer 40 is fully cured can be fixed together using an insulating adhesive before the laser light irradiation process.

[0109] Alternatively, instead of or in addition to an insulating adhesive, the two flat plates 200A, 300A can be pressure-bonded together when at least one of the busbar-side insulating layer 20 and the frame-side insulating layer 40 is in a semi-cured state, and the curing action of the semi-cured insulating layer can be utilized to fix the two flat plates 200A, 300A together. In this case, an insulating adhesive can also be used in addition to the curing action of the semi-cured insulating layer.

[0110] After the two flat plates 200A, 300A are fixed together and the bus bar side insulating layer 20 is completely cured, the laser light irradiation step is carried out.

[0111] The manufacturing method further includes a cutting step of cutting the busbar forming region 210 and the frame body forming region 310 in a fixed state from the busbar forming plate 200A and the frame body forming plate 300A after the flat plate fixing step.

[0112] The cutting process can be carried out by various cutting methods, such as a method using a rotating or non-rotating dicing blade.

[0113] FIG. 9 shows an enlarged view of part IX in FIG. As shown in Figures 8 and 9, the cutting process includes a frame body side cutting process in which the boundary C1 between the frame body forming region 310 and the frame body side connecting piece 330A is cut to separate the frame body forming region 310 from the frame body flat plate 300A, and a busbar side cutting process in which the boundary C2 between the busbar forming region 210 and the busbar side connecting piece 230A is cut to separate the busbar forming region 210 from the busbar flat plate 200A.

[0114] FIG. 10(a) is a cross-sectional view taken along the line X(a)-X(a) in FIG. 9, showing the state in which the frame-side cutting process is being performed. FIG. 10(b) is a cross-sectional view taken along line X(b)-X(b) in FIG. 9, showing a state in which the bus bar side cutting process is being performed. In addition, reference numeral 180 in Figures 10(a) and (b) denotes a cutting member such as a diamond blade, and reference numeral 190 denotes a holding member that fixes the busbar flat plate 200A and the frame body flat plate 300A and is provided with a guide for the cutting member 180.

[0115] As shown in Figure 10(a), the frame body side cutting process is configured to cut the boundary C1 between the frame body forming region 310 and the frame body side connecting piece 330A from the lower surface on the other side of the thickness direction of the frame body flat plate 300A to the upper surface on one side of the thickness direction (i.e., from the side facing the bus bar flat plate 200A to the side opposite the bus bar flat plate 200A).

[0116] As shown in Figure 10(b), the busbar side cutting process is configured to cut the boundary C2 between the busbar forming region 210 and the busbar connecting piece 230A from the upper surface on one side of the busbar flat plate 200A in the plate thickness direction to the lower surface on the other side of the plate thickness direction (i.e., from the side facing the frame body flat plate 300A to the side opposite the frame body flat plate 300A).

[0117] According to this configuration, even if burrs 185 are generated by the frame-side cutting process, these burrs 185 do not affect the bus bar substrate 200A. Similarly, even if burrs 187 are generated by the bus bar side cutting process, these burrs 187 will not affect the frame body substrate 300A.

[0118] Therefore, according to the manufacturing method of this embodiment, a plurality of planar busbar assemblies 1 with frames can be manufactured simultaneously with a high yield.

[0119] Embodiment 2 Hereinafter, another embodiment of the method for manufacturing a busbar assembly according to the present invention will be described with reference to the accompanying drawings.

[0120] 11 and 12 are plan views showing a busbar forming plate 200B and a frame forming plate 300B used in the manufacturing method according to this embodiment, respectively. In the drawings, the same members as those in the first embodiment are given the same reference numerals, and the description thereof will be omitted as appropriate.

[0121] The manufacturing method of this embodiment differs from the manufacturing method of embodiment 1 only in that the busbar flat plate 200A and the frame body flat plate 300A are changed to busbar flat plate 200B and frame body flat plate 300B.

[0122] As shown in FIG. 11, the busbar plate 200B has a busbar row 205B including a plurality of (five in the illustrated embodiment) busbar forming regions 210 arranged in series along a first direction (Y direction in this embodiment) of the XY plane in which the busbar plate 200B is located, and a plurality of (5+1=6 in the illustrated embodiment) busbar side connecting pieces 230B that integrally connect the plurality of busbar forming regions 210.

[0123] As shown in Figure 12, the frame body flat plate 300B has a frame body row 305B which includes a plurality of frame body forming regions 310 arranged in series along the same direction (i.e., the first direction of the XY plane (the Y direction in this embodiment)) with the same pitch and in the same number as the plurality of busbar forming regions 210 in the busbar row 205B, and a plurality (5 + 1 = 6 in the illustrated embodiment) of frame body side connecting pieces 330B which integrally connect the plurality of frame body forming regions 310.

[0124] That is, in the first embodiment, as shown in Figures 2 and 6, the longitudinal direction of the busbar row 205A (i.e., the arrangement direction of the multiple busbar forming regions 210 in the busbar row 205A) and the longitudinal direction of the frame body row 305A (i.e., the arrangement direction of the multiple frame body forming regions 310 in the frame body row 305A) are perpendicular to each other.

[0125] In contrast, in this embodiment, the longitudinal direction of the busbar row 205B (i.e., the arrangement direction of the multiple busbar forming regions 210 in the busbar row 205B) and the longitudinal direction of the frame body row 305B (i.e., the arrangement direction of the multiple frame body forming regions 310 in the frame body row 305B) are the same direction (in this embodiment, the Y direction of the XY plane).

[0126] Figure 13 shows a plan view of the busbar flat plate 200B and the frame body flat plate 300B after the flat plate fixing process (i.e., a plan view of the flat plate laminate structure for a busbar assembly in which the frame body flat plate 300B is fixed to the busbar flat plate 200B). As shown in Figures 11 to 13, in this embodiment, the busbar side connecting piece 230B and the frame body side connecting piece 330B are displaced so that they do not overlap with each other in a planar view when the frame body flat plate 300B and the busbar flat plate 200B are fixed together.

[0127] In this embodiment, the busbar side connecting piece 230B is positioned at the center in the width direction (X direction in this embodiment) of the busbar row 205B, and the frame body side connecting piece 330B is positioned on both sides of the center in the width direction (X direction in this embodiment) of the frame body row 305B.

[0128] FIG. 14 shows an enlarged view of the portion XIV in FIG. As shown in Figures 13 and 14, in this embodiment, the boundary C2 between the busbar forming region 210 and the busbar connecting piece 230B and the boundary C1 between the frame body forming region 310 and the frame body side connecting piece 330B are at the same position in the longitudinal direction of the busbar row 205B and the frame body row 305B, but are displaced in the width direction of the busbar row 205B and the frame body row 305B.

[0129] FIG. 15(a) is a cross-sectional view taken along the line XV(a)-XV(a) in FIG. 14, showing the state in which the frame-side cutting process is being performed. FIG. 15(b) is a cross-sectional view taken along line X(b)-X(b) in FIG. 14, showing a state in which the bus bar side cutting process is being performed.

[0130] As shown in Figure 15(a), as in embodiment 1, in this embodiment too, the frame body side cutting process is configured to cut the boundary C1 between the frame body forming region 310 and the frame body side connecting piece 330B from the lower surface on the other side of the thickness direction of the frame body flat plate 300B toward the upper surface on one side of the thickness direction (i.e., from the side facing the bus bar flat plate 200B toward the side opposite the bus bar flat plate 200B).

[0131] As shown in Figure 15(b), in the same way as in the first embodiment, in the present embodiment, the busbar side cutting process is configured to cut the boundary C2 between the busbar forming region 210 and the busbar connecting piece 230B from the upper surface on one side of the busbar flat plate 200B in the thickness direction to the lower surface on the other side of the thickness direction (i.e., from the side facing the frame body flat plate 300B to the side opposite the frame body flat plate 300B).

[0132] The manufacturing method according to this embodiment having such a configuration can also achieve the same effects as those in the first embodiment.

[0133] In this embodiment, the busbar plate 200B has a single busbar row 205B, and the frame body plate 300B has a single frame body row 305B, but it is also possible to modify the embodiment to use a busbar plate 200C having a plurality of busbar rows 205B and a frame body plate 300C having the same number of frame body rows 305B as the plurality of busbar rows 205B.

[0134] FIG. 16 is a plan view showing the bus bar plate and the frame plate used in the manufacturing method according to the modified example of the present embodiment after the plate fixing step. In the drawings, the same members as those in the first and second embodiments are given the same reference numerals, and the description thereof will be omitted.

[0135] As shown in FIG. 16, in the modified example, the busbar plate 200C has a plurality of busbar rows 205B (first to third busbar rows 205B(1) to 205B(3) in the illustrated embodiment) arranged in parallel in a second direction (i.e., the X direction) perpendicular to the first direction in the XY plane in which the busbar plate 200C is located.

[0136] The frame body flat plate 300C has a plurality of bus bar rows 305B (first to third bus bar rows 305B(1) to 305B(3) in the illustrated embodiment) arranged in parallel in a second direction (i.e., the X direction) perpendicular to the first direction within the XY plane in which the frame body flat plate 300C is located. [Explanation of symbols]

[0137] 1 Busbar assembly 10(1)~(2) First and second bus bars 11 Top side 12 Top connection part 13 Bottom side 14 Bottom connection part 15 Side 19 Gap 20 Busbar side insulation layer 21 Upper surface layer 22(1)~(2) First and second upper openings 23 Bottom laminated section 24(1)~(2) First and second lower openings 25 Side laminated section 29 Gap filling part 30 Frame 31 Frame body 35 Central hole 40 Frame side insulation layer 200A, 200B busbar flat plate 205A(1)~(3), 205B(1)~(3) busbar array 207 Busbar side gripping piece 208 Alignment hole 210 Busbar assembly forming area 219 Slit 220(1)~(2) First and second busbar forming portions 230A, 230B Busbar side connecting piece 300A, 300B flat plate for frame 305A(1)~(5), 305B(1)~(3) Frame row 307 Frame side gripping piece 308 Alignment hole 310 Frame forming area 330A, 330B Frame side connecting piece C1 Boundary between the frame forming area and the frame side connecting piece C2 Boundary between busbar forming area and busbar side connecting piece

Claims

1. a busbar assembly including: a plurality of busbars formed of conductive flat plate-like members and arranged in the same plane with gaps between opposing side surfaces; a busbar-side insulating layer including gap filling portions filled in the gaps and a top surface laminate portion covering an upper surface on one side in a plate thickness direction of a busbar connected body formed by the gap filling portions; and a frame having a frame main body having the same external shape as the busbar connected body in a plan view and a central hole passing through it in the vertical direction, and a frame-side insulating layer covering an outer peripheral surface of the frame main body, wherein the top surface laminate portion is provided with one or more top surface openings exposing at least a portion of the upper surface of each of the plurality of busbars, and the frame is fixed to a periphery of the upper surface of the busbar connected body via the top surface laminate portion with the one or more top surface openings positioned within the central hole in a plan view, preparing a busbar plate made of a conductive metal, the busbar plate including a busbar forming region having an outer shape in a plan view corresponding to the busbar connected body; a slit forming step of forming one or more slits in the busbar forming region, the slits penetrating the busbar forming region in a plate thickness direction and having the same width as the gap, to divide the busbar forming region into a plurality of busbar forming portions corresponding to the plurality of busbars; a busbar-side insulating layer forming step of applying and curing an insulating resin paint at least in the slits and on an upper surface of the busbar forming region to provide the busbar-side insulating layer; a laser light irradiation step of irradiating a laser beam to an upper surface side laminated portion of the busbar side insulating layer to form the one or more upper surface side openings; a frame-forming process carried out before or after, or in parallel with, processes from the process of preparing a busbar plate to the process of applying laser light, the frame-forming process including: a process of preparing a frame-forming plate made of a conductive metal, the frame-forming plate including a frame-forming region having an outer shape in a plan view corresponding to the busbar-forming region and having a through-hole corresponding to the central hole; and a frame-side insulating layer forming process of applying an insulating resin paint to an outer peripheral surface of the frame-forming region and curing the paint to provide the frame-side insulating layer; a flat plate fixing step of fixing, in an overlapping state, a lower surface of the frame body forming region after the frame body forming treatment to an upper surface of the busbar forming region after the busbar-side insulating layer forming step, before or after the laser light irradiation step; a cutting step of cutting the fixed busbar forming region and the fixed frame body forming region from the busbar forming plate and the frame body forming plate after the flat plate fixing step, the busbar formation plate has a busbar row formed by a plurality of the busbar forming areas arranged in series along a first direction in an X-Y plane on which the busbar formation plate is located and a plurality of busbar side connecting pieces integrally connecting the plurality of busbar forming areas, the slit formed in one busbar forming region has one longitudinal end extending into a busbar side connecting piece connected to one side of the one busbar forming region in the first direction, and the other longitudinal end extending into a busbar side connecting piece connected to the other side of the one busbar forming region in the first direction, the frame body flat plate has a plurality of frame body forming regions arranged in series in a first direction at the same pitch as the plurality of busbar forming regions in the busbar row, and a frame body row formed by a plurality of frame body side connecting pieces that integrally connect the plurality of frame body forming regions, the busbar-side connecting pieces are disposed at a center in the width direction of the busbar row, and the frame-side connecting pieces are disposed on both sides of the center in the width direction of the frame row, and the busbar-side connecting pieces and the frame-side connecting pieces are displaced relative to each other so as not to overlap in a plan view when the frame-forming flat plate and the busbar-forming flat plate are fixed together, the cutting step includes a busbar-side cutting process for cutting the boundary between the busbar forming region and the busbar-side connecting piece from the side of the surface facing the frame body flat plate toward the side of the surface opposite the frame body flat plate, and a frame body-side cutting process for cutting the boundary between the frame body forming region and the frame body-side connecting piece from the side of the surface facing the busbar flat plate toward the side of the surface opposite the busbar flat plate.

2. the busbar support plate includes a plurality of busbar rows arranged in parallel in a second direction perpendicular to a first direction in an X-Y plane on which the busbar support plate is located, and busbar-side gripping pieces that integrally hold the plurality of busbar rows; 2. The method for manufacturing a busbar assembly according to claim 1, wherein the frame body flat plate has a plurality of frame body rows arranged in parallel in the second direction at the same pitch as the plurality of busbar rows and in the same number, and a frame body side gripping piece that holds the plurality of frame body rows together.

3. a busbar-side insulating layer including a top-side laminated portion covering an upper surface of one side in a plate thickness direction of a busbar connected body formed of a conductive flat plate member and having gaps between opposing side surfaces; a gap filling portion filling the gaps and a top-side laminated portion covering an upper surface of one side in a plate thickness direction of a busbar connected body formed by the gap filling portion; and a frame having a frame main body having the same external shape as the busbar connected body in a plan view and having a central hole penetrating vertically, and a frame-side insulating layer covering an outer peripheral surface of the frame main body, wherein the top-side laminated portion has one or more top-side openings exposing at least a portion of the upper surface of each of the plurality of busbars, and the frame has a plurality of busbar assemblies connected in the same plane, the busbar assemblies being fixed to the periphery of the upper surface of the busbar connected body via the top-side laminated portion with the one or more top-side openings positioned within the central hole in a plan view, a busbar plate made of a conductive metal, having an outer shape in a plan view corresponding to the busbar connector, the busbar plate having a plurality of busbar forming regions arranged in series along a first direction of an X-Y plane in which the busbar plate is located, and a busbar row formed by a plurality of busbar side connecting pieces integrally connecting the plurality of busbar forming regions, each of the plurality of busbar forming regions being partitioned into a plurality of busbar forming sites corresponding to the plurality of busbars by one or more slits that penetrate the plate in a thickness direction and have the same width as the gap; a busbar-side insulating coating film having a portion that fills the slit to form the gap filling portion and a portion that is provided on the upper surface of the busbar forming region to form the upper surface side laminated portion, the portion that forms the upper surface side laminated portion having the one or more upper surface side openings; a frame body flat plate made of a conductive metal, the frame body flat plate having an outer shape in a plan view corresponding to the busbar forming region, the frame body flat plate having a frame body row formed by a plurality of frame body forming regions arranged in series in a first direction at the same pitch as the plurality of busbar forming regions in the busbar row, and a plurality of frame body side connecting pieces integrally connecting the plurality of frame body forming regions, the frame body flat plate having a through hole that forms the central hole in each of the plurality of frame body forming regions; a frame-side insulating coating film provided on the outer peripheral surface of the frame-forming region to form the frame-side insulating layer, the slit formed in one busbar forming region has one longitudinal end extending into a busbar side connecting piece connected to one side of the one busbar forming region in the first direction, and the other longitudinal end extending into a busbar side connecting piece connected to the other side of the one busbar forming region in the first direction, the busbar forming plate and the frame forming plate are fixed together so that the frame forming region provided with the frame body side insulating coating film overlaps the busbar forming region provided with the busbar side insulating coating film, a flat plate stacking structure for a busbar assembly, characterized in that the busbar side connecting pieces are arranged at the center in the width direction of the busbar row, and the frame body side connecting pieces are arranged on both sides of the center in the width direction of the frame body row, and the busbar side connecting pieces and the frame body side connecting pieces are displaced relative to each other so as not to overlap in a planar view when the frame body flat plate and the busbar flat plate are fixed together.

4. the busbar support plate includes a plurality of busbar rows arranged in parallel in a second direction perpendicular to a first direction in an X-Y plane on which the busbar support plate is located, and busbar-side gripping pieces that integrally hold the plurality of busbar rows; 4. The flat plate stack structure for a bus bar assembly according to claim 3, wherein the frame body flat plate has a plurality of frame body rows arranged in parallel in the second direction at the same pitch as the plurality of bus bar rows, and a frame body side gripping piece that holds the plurality of frame body rows together.

5. the busbar-side insulating coating film further includes a portion that forms a lower-surface-side laminated portion that is provided on the lower surface of the busbar forming region and covers the lower surface of the busbar connected body on the other side in the plate thickness direction, and a portion that forms a side-surface-side laminated portion that is provided on the side surface of the busbar forming region and covers the side surface of the busbar connected body, 5. The flat plate laminate structure for a busbar assembly according to claim 3, wherein the portion forming the lower surface laminate portion has one or more lower surface openings that expose at least a portion of the lower surface of each of the plurality of busbars.

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