Electronic Components

Abstract

To provide an electronic component capable of preventing unexpected adhesion of a mold resin to an outer surface of the product.SOLUTION: An electronic component includes: a case including an accommodation part having an opening; a ceramic element arranged in the accommodation part; a metal terminal having an electrode connecting part connecting to the ceramic element, a mounting part exposed from the accommodation part, and a terminal arm part connecting the electrode connecting part with the mounting part; a case cover having a closing plate part for closing the opening, and a cover edge part protruding in a depth direction of the accommodation part from a peripheral edge of the closing plate part and at least partially facing an accommodation part side wall which is a side wall of the accommodation part; and a mold resin filling the accommodation part.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electronic component used as a capacitor or the like. [Background technology]

[0002] Conventionally, capacitors and the like have been proposed that are configured by connecting metal terminals to a single-plate dielectric disk, and electronic components have also been proposed in which the periphery of such a dielectric disk is molded with an exterior material, making it suitable for surface mounting.

[0003] However, conventional surface-mount electronic components have the problem of a complicated assembly process, since they require a process of fixing a dielectric disk and metal terminals in a cavity for resin molding and then molding with an exterior material.Furthermore, since the molding die must be changed when the size of the dielectric disk changes, it is difficult to flexibly respond to changes in the size of the dielectric disk. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 6-196348 Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides an electronic component that can flexibly accommodate changes in the size of the internal ceramic element, and can prevent molding resin from unexpectedly adhering to the outer surface of the product, etc. [Means for solving the problem]

[0006] One embodiment of an electronic component that solves the above problem is a case having a housing portion with an opening; a ceramic element disposed in the housing; a metal terminal having an electrode connection portion connected to the ceramic element, a mounting portion exposed from the housing portion, and a terminal arm portion connecting the electrode connection portion and the mounting portion; a case cover including a closing plate portion that closes the opening, and a cover edge portion that protrudes from a peripheral edge of the closing plate portion in a depth direction of the storage portion and at least a portion of which faces a storage portion side wall that is a side wall of the storage portion in the depth direction; and a molding resin filled in the housing portion.

[0007] Because such electronic components house a ceramic element in a housing portion of a case with an opening, there is no need for a process of placing the ceramic element or the like in a cavity for resin molding and then molding it with an exterior material, making it possible to flexibly accommodate size changes and achieving good productivity. Furthermore, by filling the housing portion with molding resin, the ceramic element or the like inside can be easily protected, and the gap between the edge of the cover and the side wall of the housing portion retains excess molding resin, preventing the problem of uncured molding resin leaking out of the housing portion and unexpectedly adhering to the exterior surface of the product, etc.

[0008] Furthermore, for example, the cover edge portion may face an outer side surface of the storage portion side wall that faces away from the storage portion.

[0009] With such electronic components, the amount of molding resin filled can be easily controlled, and the problem of molding resin unexpectedly adhering to the outer surface of the product can be more effectively prevented.

[0010] Furthermore, for example, a gap groove portion may be formed on one of the surfaces facing each other on the cover edge portion and the storage section side wall, which partially widens the width of the gap formed between the cover edge portion and the storage section side wall.

[0011] In such electronic components, a larger amount of molding resin can be held in the gaps, which more effectively prevents the problem of molding resin unexpectedly adhering to the outer surface of the product.

[0012] Furthermore, for example, a gap protrusion may be formed on one of the surfaces facing each other on the cover edge portion and the storage section side wall, which partially narrows the width of the gap formed between the cover edge portion and the storage section side wall.

[0013] In such electronic components, the gap protrusions can precisely determine the shape of the gap, which more effectively prevents the problem of mold resin unexpectedly adhering to the product's exterior surface, etc. Also, the case cover and case are firmly fixed in the narrow gap area, while more mold resin is retained in the wider gap area.

[0014] Also, for example, a convex portion may be formed on one of the surfaces of the cover edge portion and the storage portion side wall that face each other, and a concave portion into which the convex portion fits may be formed on the other.

[0015] In such electronic components, the relative positions of the case and case cover can be precisely controlled by fitting the recessed and protruding portions together, which allows for precise control of the shape of the gap that holds the molded resin, effectively preventing the molded resin from leaking out, and also improves the fixing strength between the case cover and the case.

[0016] Furthermore, for example, the mounting portion may be exposed from the accommodation portion through the opening, The mounting portion may have a gap passing portion disposed in the gap between the cover edge portion and the housing portion side wall, and a mounting bottom portion facing the mounting surface side.

[0017] By exposing the mounting portion through the opening in the housing portion, the shape of the case can be simplified and the problem of uncured molding resin leaking out from areas other than the opening can be prevented. In addition, because the gap passing portion of the mounting portion is connected to the case or case cover by the molding resin, the durability of such electronic components against external forces can be improved.

[0018] Furthermore, for example, the storage section side wall may be provided so as to surround the periphery of the bottom plate section of the case, The cover edge portion may be provided so as to surround the peripheral edge of the closing plate portion.

[0019] The side walls of the container and the edge of the cover are provided so as to surround the periphery of the bottom plate and the closing plate, thereby more effectively preventing leakage of uncured molding resin from the container. However, the side walls of the container and the edge of the cover may be partially discontinued.

[0020] Furthermore, for example, an inner surface of the cover edge portion may face an outer surface of the storage portion side wall, A first groove may be formed in a first outer surface which is one of the outer surfaces of the cover edge portion, A first protrusion corresponding to a shape of the first groove may be formed on a second outer surface of the cover edge portion that faces in a different direction from the first outer surface.

[0021] With such electronic components, multiple electronic components can be easily integrated by fitting the first protrusions into the first grooves. This makes it possible, for example, to use a mounter with a single suction arm to transport multiple electronic components together to the mounting position, enabling efficient mounting.

[0022] Furthermore, for example, the housing portion may further include an insulating member disposed between the electrode portion and the terminal arm portion.

[0023] Such an electronic component can suitably ensure insulation between the electrode portion and the metal terminal in a narrow housing portion. [Brief explanation of the drawings]

[0024] [Figure 1] FIG. 1 is a schematic perspective view of an electronic component according to a first embodiment, viewed obliquely from above. [Figure 2] FIG. 2 is a cross-sectional view of the electronic component shown in FIG. [Figure 3] FIG. 3 is a schematic perspective view of the electronic component shown in FIG. 1, viewed obliquely from below. [Figure 4] 4 is a plan view showing the electronic component shown in FIG. 1 excluding the case cover and mold resin. [Figure 5] 5 is a bottom view of the case cover of the electronic component shown in FIG. [Figure 6] FIG. 6 is a bottom view of the electronic component according to the second embodiment. [Figure 7] FIG. 7 is a schematic perspective view of the electronic component shown in FIG. 6, excluding the case cover and the mold resin, as viewed obliquely from above. [Figure 8] 8 is a schematic perspective view of the case cover of the electronic component shown in FIG. 6, viewed obliquely from below. [Figure 9] FIG. 9 is a schematic perspective view of a case cover according to a first modified example, seen obliquely from below. [Figure 10] FIG. 10 is a schematic perspective view of a case cover according to a second modified example, seen obliquely from below. [Figure 11] FIG. 11 is a schematic perspective view of a case cover according to a third modified example, viewed obliquely from below. [Figure 12] FIG. 12 is a schematic perspective view of a case cover according to a fourth modified example, seen obliquely from below. [Figure 13] FIG. 13 is a schematic perspective view of a case cover and an insulating member in an electronic component according to a third embodiment, viewed obliquely from below. [Figure 14] FIG. 14 is a cross-sectional view of the electronic component shown in FIG. [Figure 15] FIG. 15 is a schematic perspective view of the electronic component according to the fourth embodiment, viewed obliquely from above. [Figure 16] FIG. 16 is a bottom view of the electronic component shown in FIG. [Figure 17] FIG. 17 is a schematic perspective view of a state in which a plurality of electronic components shown in FIG. 15 are connected together, as viewed obliquely from above. [Figure 18] FIG. 18 is a schematic perspective view of a state in which a plurality of electronic components shown in FIG. 15 are connected together, as viewed obliquely from below. DETAILED DESCRIPTION OF THE INVENTION

[0025] Each embodiment will be described below with reference to the drawings.

[0026] First embodiment FIG. 1 is a schematic perspective view of electronic component 10 according to the first embodiment, viewed obliquely from above; FIG. 2 is a cross-sectional view of electronic component 10; FIG. 3 is a perspective view of electronic component 10 viewed obliquely from below; and FIG. 4 is a top view of electronic component 10, excluding case cover 60 and molded resin. As shown in FIGS. 1 to 4, electronic component 10 includes case 20 having housing 21 (see FIGS. 2 and 4) therein, and case cover 60 that closes opening 21a (see FIG. 2) of housing 21. As shown in FIGS. 2 and 4, electronic component 10 also includes ceramic element 30 disposed in housing 21 within case 20, first metal terminal 40 connected to first electrode 33 of ceramic element 30, and second metal terminal 50 connected to second electrode 34 of ceramic element 30.

[0027] 1, electronic component 10 has a substantially rectangular flat plate shape, but is not limited to this and may have a polygonal flat plate shape other than a rectangle, or may have a disk shape. As shown in the cross-sectional view of FIG. 2, the side of electronic component 10 opposite to the side on which closing plate portion 63 of case cover 60 is arranged is the mounting surface side that faces the substrate or the like to be mounted when electronic component 10 is mounted.

[0028] As shown in FIG. 2, in describing the electronic component 10, the normal direction of the bottom plate portion 22 of the case 20 is defined as the Z-axis direction, the direction perpendicular to the Z-axis direction and connecting the first mounting portion 42 and the second mounting portion 52 at the shortest distance is defined as the Y-axis direction, and the direction perpendicular to the Z-axis direction and the Y-axis direction is defined as the X-axis direction.

[0029] 2 and 4, the case 20 has a recessed housing portion 21, and houses the ceramic element 30 and the like inside the housing portion 21. When viewed from the opening 21a side of the housing portion 21, the housing portion 21 has a rectangular shape that is slightly smaller than the outer shape of the case 20. The housing portion 21 includes a substantially rectangular parallelepiped space formed inside the case 20. The opening 21a of the housing portion 21 is formed in the case 20 so as to open in a direction facing upward of the electronic component 10 (the side opposite the mounting surface).

[0030] 2 and 4, the case 20 has a substantially rectangular, flat bottom plate portion 22 that constitutes the bottom plate of the case 20, and storage portion side walls 24 that are side walls of the storage portion 21. The storage portion side walls 24 protrude upward from the periphery of the bottom plate portion 22 in the depth direction D1 (parallel to the Z-axis direction) of the storage portion 21. As shown in FIG. 4, the storage portion side walls 24 are provided so as to surround the periphery of the bottom plate portion 22 of the case 20, and have a frame-like shape.

[0031] As shown in Fig. 4, the upper end of the accommodating section side wall 24 forms an opening edge 24c that surrounds the opening 21a in the case 20. Two stepped portions that are lower in height than the other portions are formed in the opening edge 24c, and the stepped portions allow the opening 21a to extend to part of the side surface of the case 20. The stepped portions of the case 20 form a first gap 27 and a second gap 28 through which the first metal terminal 40 or the second metal terminal 50 is inserted when the case cover 60 is attached to the case 20 as shown in Fig. 4.

[0032] 5 is a plan view of case cover 60 as viewed from below (the storage section 21 side). As shown in FIG. 5 and FIG. 2, which is a cross-sectional view of electronic component 10, case cover 60 has a substantially rectangular flat plate-like closing plate portion 63 that closes at least a portion of opening 21a of storage section 21, and a cover edge portion 66 that protrudes from the periphery of closing plate portion 63 in depth direction D1 of storage section 21. As shown in FIG. 5, cover edge portion 66 is provided so as to surround the periphery of closing plate portion 63.

[0033] As shown in FIG. 2, the closing plate portion 63 is disposed on the opening 21a side of the case 20, which is opposite the mounting surface side. At least a portion of the cover edge portion 66 faces the storage section side wall 24, which is the side wall of the storage section 21. The case cover 60 has the closing plate portion 63 in the form of a rectangular flat plate. As shown in FIG. 2, the cover edge portion 66 faces the side wall outer surface 24a of the storage section side wall 24, which faces away from the storage section 21. However, the cover edge portion 66 is not limited to being faced only to the side wall outer surface 24a, and may be faced to the side wall inner surface 24b of the storage section side wall 24, which faces the storage section 21.

[0034] 2 and 3, the lower end of the cover edge portion 66 extends to approximately the same plane as the lower end of the case 20 (the lower surface of the bottom plate portion 22). However, the lower end of the cover edge portion 66 and the lower surface of the case 20 may be at different heights.

[0035] As indicated by the dotted hatching in Fig. 2, the housing portion 21 is filled with a mold resin 80. The mold resin filled in the housing portion 21 is not particularly limited, but examples thereof include, but are not limited to, epoxy resin and silicone resin. Note that in Figs. 3 and 4, the mold resin 80 is not shown in order to explain the shapes of other components.

[0036] 2 and 3, a side gap 69 is formed between the edge inner surface 66a and the side wall outer surface 24a, which are surfaces that face each other on the cover edge 66 and the accommodating section side wall 24. As shown in FIG. 2, the side gap 69 formed between the cover edge 66 and the accommodating section side wall 24 functions as a resin pool for uncured molding resin 80 that overflows from the accommodating section 21 during the manufacturing stage. In this way, in electronic component 10, side gap 69 retains excess molding resin 80, preventing the problem of uncured molding resin 80 leaking out of the accommodating section 21 and unexpectedly adhering to the outer surface of the product, etc.

[0037] 3 and 5, at least one of the surfaces (edge ​​inner surface 66a in the embodiment) of cover edge 66 and storage section side wall 24 that face each other has gap groove 66b formed therein to partially widen side gap 69 formed between cover edge 66 and storage section side wall 24. By forming such gap groove 66b, the volume of molding resin 80 that can be held in side gap 69 increases, making it possible to effectively prevent uncured molding resin 80 from unexpectedly leaking out.

[0038] In electronic component 10, gap groove 66b is formed in edge inner surface 66a of cover edge 66, which is one of the surfaces of cover edge 66 and accommodation section side wall 24 that face each other. However, the gap groove that widens side gap 69 is not limited to this. For example, the gap groove that widens side gap 69 may be formed in side wall outer surface 24a on the accommodation section side wall 24 side, or may be formed in both edge inner surface 66a and side wall outer surface 24a. Also, as shown in FIG. 3, electronic component 10 has gap groove 66b formed in two locations on edge inner surface 66a. However, the number of gap groove 66b may be one, three, or more.

[0039] 2, which is a cross-sectional view of electronic component 10, in case 20, the upper surface of bottom plate portion 22 forms the bottom surface of accommodation portion 21, and the lower surface of bottom plate portion 22 faces away from opening 21a and forms the lower surface of case 20. The lower surface of bottom plate portion 22 of case 20 is approximately parallel to the lower surfaces of first mounting portion 42 of first metal terminal 40 and second mounting portion 52 of second metal terminal 50, and is positioned slightly higher than the lower surfaces of first mounting portion 42 of first metal terminal 40 and second mounting portion 52 of second metal terminal 50. However, the lower surface of bottom plate portion 22 may be positioned on the same plane as the lower surfaces of first mounting portion 42 and second mounting portion 52 of first metal terminal 40, and the positional relationship in the Z-axis direction between the lower surface of bottom plate portion 22 and the lower surfaces of first and second mounting portions 42, 52 is not particularly limited.

[0040] As shown in FIG. 2, the ceramic element 30 is disposed in the housing 21 of the case 20. The ceramic element 30 has a first main surface 31a and a second main surface 31b facing each other and has a generally disc-shaped outer shape. However, the ceramic element 30 may have a shape other than a disc shape, such as an elliptical disk or a rectangular flat plate. The first main surface 31a and the second main surface 31b are a pair of surfaces (flat surfaces) with the largest areas of the ceramic element 30. Also, as shown in FIG. 2, in the ceramic element 30 for the electronic component 10, the first main surface 31a faces the opening 21a (upward) and the second main surface 31b faces the opposite side of the opening 21a (downward, toward the bottom surface 21c). However, in other embodiments in which the opening 21a of the case 20 faces in a different direction from that of the electronic component 10 according to the present embodiment, the orientation of each main surface may differ from that shown in the first embodiment.

[0041] As shown in FIG. 2, the ceramic element 30 has a first electrode portion 33 formed on the first principal surface 31a, a second electrode portion 34 formed on the second principal surface 31b, and a dielectric portion 35 sandwiched between the first electrode portion 33 and the second electrode portion 34. The material of the dielectric portion 35 is not particularly limited and may be a dielectric material such as calcium titanate, strontium titanate, barium titanate, or a mixture thereof. Note that the ceramic element 30 is not limited to a capacitor in which the dielectric portion 35 is sandwiched between the first electrode portion 33 and the second electrode portion 34. For example, the ceramic element may be a varistor or thermistor in which a semiconductor ceramic is sandwiched between the first electrode portion 33 and the second electrode portion.

[0042] The materials for the first electrode portion 33 and the second electrode portion 34 are not particularly limited, and typically copper, copper alloys, nickel, nickel alloys, etc. are used, but silver, silver-palladium alloys, etc. can also be used. The thickness of the first electrode portion 33 and the second electrode portion 34 is not particularly limited, but is typically about 10 to 50 μm. The surfaces of the first and second electrode portions 33, 34 may be coated with at least one metal coating selected from Ni, Cu, Sn, etc.

[0043] 2, the storage depth W2, which is the distance from the opening 21a of the storage portion 21 in the case 20 to the bottom surface 21c, is greater than the element thickness W1, which is the distance from the first main surface 31a to the second main surface 31b of the ceramic element 30. This allows the entire ceramic element 30 to be stored in the storage portion 21 without any part of the ceramic element 30 being exposed through the opening 21a of the storage portion 21. Furthermore, for such electronic component 10, the shape of the case cover 60 can be simplified. Furthermore, the storage portion 21 can be filled with a mold resin 80, which covers the entire ceramic element 30.

[0044] 2 and 4, electronic component 10 has a pair of metal terminals, a first metal terminal 40 and a second metal terminal 50. Each of metal terminals 40, 50 has an electrode connection portion (first electrode connection portion 44, second electrode connection portion 54) that connects to ceramic element 30, a mounting portion (first mounting portion 42, second mounting portion 52) that is exposed from housing portion 21, and a terminal arm portion (first terminal arm portion 46, second terminal arm portion 56) that connects the electrode connection portion and the mounting portion.

[0045] The first metal terminal 40 and the second metal terminal 50 are spaced apart and electrically insulated from each other in the electronic component 10. The first metal terminal 40 and the second metal terminal 50 are formed, for example, by machining a conductive metal plate material, but the method for forming the metal terminals 40, 50 is not particularly limited.

[0046] 2 and 4, the first metal terminal 40 has a first electrode connection portion 44 that connects to the first electrode portion 33 of the ceramic element 30, a first mounting portion 42 that is exposed from the accommodation portion 21 through the opening 21a (including the first gap 27 that is part of the opening 21a), and a first terminal arm portion 46 that connects the first electrode connection portion 44 and the first mounting portion 42. Of the first metal terminal 40, the first electrode connection portion 44 and the first terminal arm portion 46 (including the portion that is disposed in the first gap 27) are disposed in the accommodation portion 21 and the opening 21a, while the first mounting portion 42 is exposed from the accommodation portion 21 and the opening 21a.

[0047] As shown in FIG. 2 , the first mounting portion 42 has a generally L-shape. The first mounting portion 42 has a gap-passing portion 42b disposed in the side gap 69 and a mounting bottom portion 42a facing the mounting surface and located closer to an end portion 42c of the first metal terminal 40 opposite the first electrode connection portion 44 side than the gap-passing portion 42b. The gap-passing portion 42b bends vertically from the first terminal arm portion 46, extends downward along the sidewall outer surface 24a, and then bends substantially vertically from a position slightly below the lower surface of the bottom plate portion 22. The tip of the first mounting portion 42 extends in a direction substantially parallel to the lower surface of the bottom plate portion 22, away from the case 20. However, the shape of the first mounting portion 42 is not limited to the shape shown in FIG. 2 , and the tip of the first mounting portion 42 may face the lower surface of the bottom plate portion 22.

[0048] 2 and 4, the portions of the first metal terminal 40 corresponding to the first electrode connection portion 44 and the first terminal arm portion 46 have a generally rectangular flat plate shape. Of the flat plate-shaped portions corresponding to the first electrode connection portion 44 and the first terminal arm portion 46, the portion facing the first main surface 31a of the ceramic element 30 is the first electrode connection portion 44. The first terminal arm portion 46 extends from the first electrode connection portion 44 to the first gap 27 along an extension plane of the first main surface 31a.

[0049] As shown in FIG. 2, the second metal terminal 50 has a second electrode connecting portion 54 that connects to the second electrode portion 34 of the ceramic element 30, a second mounting portion 52 that is exposed from the accommodating portion 21 through the opening 21a (a second gap 28 that is part of the opening 21a), and a second terminal arm portion 56 that connects the second electrode connecting portion 54 and the second mounting portion 52. Of the second metal terminal 50, the second electrode connecting portion 54 and the second terminal arm portion 56 (including the portion that is disposed in the second gap 28) are disposed in the accommodating portion 21 and the opening 21a, while the second mounting portion 52 is exposed from the accommodating portion 21 and the opening 21a.

[0050] As shown in FIG. 2, the second mounting portion 52 has a substantially L-shape and is disposed substantially symmetrically with respect to the first mounting portion 42. The second mounting portion 52 has a gap passing portion 52b disposed in the side gap 69 and a mounting bottom portion 52a facing the mounting surface and located closer to an end portion 52c of the second metal terminal 50 on the opposite side from the second electrode connection portion 54 side than the gap passing portion 52b. The gap passing portion 52b bends vertically from the first terminal arm portion 56, extends downward along the sidewall outer surface 24a, and then bends substantially vertically from a position slightly below the lower surface of the bottom plate portion 22. Like the first mounting portion 42, the shape of the second mounting portion 52 is not limited to the shape shown in FIG. 2.

[0051] 2 and 4, the portion of the second metal terminal 50 corresponding to the second electrode connection portion 54 is flat, but the portion corresponding to the second terminal arm portion 56 includes two bent portions. The second electrode connection portion 54 faces the second main surface 31b of the ceramic element 30. The second electrode connection portion 54 also faces the bottom plate portion 22 that forms the bottom surface of the housing portion 21. Therefore, the second electrode connection portion 54 is disposed so as to be sandwiched from above and below between the bottom plate portion 22 of the housing portion 21 and the second main surface 31b of the ceramic element 30.

[0052] As shown in FIG. 2, the second terminal arm 56 of the second metal terminal 50 has the following three portions. The first portion 56b of the second terminal arm 56 extends from the second electrode connection portion 54 to the accommodation portion sidewall 24 along an extension of the second main surface 31b. The second portion of the second terminal arm 56 is a rising portion 56a that bends approximately perpendicularly from the first portion 56b along the extension of the second main surface 31b and extends from the bottom plate portion 22 toward the opening 21a. As shown in FIGS. 4 and 5, the third portion 56c of the second terminal arm 56 bends approximately perpendicularly from the rising portion 56a and is disposed in the second gap 28. The tip of the third portion 56c is connected to the second mounting portion 52.

[0053] The material of the first metal terminal 40 and the second metal terminal 50 is not particularly limited as long as it is a metallic material having electrical conductivity, and may be, for example, iron, nickel, copper, silver, or an alloy containing any of these. Furthermore, the surfaces of the first metal terminal 40 and the second metal terminal 50 may be coated with a metal coating of Ni, Sn, Cu, or the like.

[0054] The electronic component 10 can effectively protect components disposed in the accommodation portion 21, such as the ceramic element 30, by sealing the accommodation portion 21 with the case cover 60. A frame-shaped opening edge portion 24c surrounding the opening 21a shown in FIG. 4 is connected to a cover lower surface 63a of the closing plate portion 63 shown in FIG. 2, and the closing plate portion 63 of the case cover 60 closes the opening 21a of the accommodation portion 21. However, as shown in FIG. 2, a first gap 27 through which the first metal terminal 40 is inserted and a second gap 28 through which the second metal terminal 50 is inserted are formed between the case cover 60 and the case 20. In addition, a side gap 69 is formed between the cover edge portion 66 of the case cover 60 and the accommodation portion side wall 24 of the case 20.

[0055] The area enclosed by the edge inner surface 66a of the case cover 60 shown in Fig. 5 is slightly larger than the area enclosed by the side wall outer surface 24a of the case 20 shown in Fig. 4. This allows a side gap 69 of an appropriate width to be formed when the case cover 60 is assembled to the case 20, as shown in Fig. 2. For example, by setting the side gap 69 to an average of about 0.3 to 0.7 mm in the circumferential direction, it is possible to prevent the uncured molding resin from leaking out and to suppress misalignment of the case 20 relative to the case cover 60. Note that when the gap groove 66b as shown in Fig. 3 is formed, the width of the side gap 69 other than the gap groove 66b may be substantially zero.

[0056] The case 20 and the case cover 60 can be manufactured by, for example, injection molding using resin, etc. However, the material of the case 20 and the case cover 60 is not limited to resin.

[0057] 1 to 5 can be manufactured by, for example, the following process. First, the ceramic element 30, the first metal terminal 40, and the second metal terminal 50 are prepared, and the first metal terminal 40 and the second metal terminal 50 are connected to the ceramic element 30. The connection between the ceramic element 30 and the first metal terminal 40 and the second metal terminal 50 can be performed using solder, a conductive adhesive, or the like.

[0058] Next, the intermediate product in which first metal terminal 40, second metal terminal 50, and ceramic element 30 are integrated is placed in housing portion 21 of case 20, and uncured molding resin is then poured into housing portion 21 through opening 21a. Case cover 60 is attached to case 20 while the molding resin is still uncured, and the molding resin then cures, thereby firmly fixing case cover 60 and case 20 together via the molding resin. In this manner, electronic component 10 as shown in FIGS. 1 to 5 can be manufactured.

[0059] The step of connecting the first metal terminal 40 and the second metal terminal 50 to the ceramic element 30 may be performed in a state where the mounting bottoms 42a, 52a of the first metal terminal 40 and the second metal terminal 50 are not bent.

[0060] In this way, electronic component 10 shown in Figures 1 to 5 accommodates ceramic element 30 in accommodation section 21 within case 20, eliminating the need for a process of placing ceramic element 30 or the like in a cavity for resin molding and molding it with an exterior material, resulting in good productivity.

[0061] Because electronic component 10 can accommodate ceramic element 30 and the like within case 20, it can flexibly accommodate changes in the size of ceramic element 30 as long as it fits within case 20. Furthermore, because first mounting portion 42 and second mounting portion 52 are parallel to first main surface 31a and second main surface 31b of ceramic element 30, electronic component 10 is advantageous in terms of reducing its height and is suitable for surface mounting.

[0062] Furthermore, electronic component 10 can easily protect the ceramic element 30 and other components inside by filling housing 21 with mold resin 80. Furthermore, electronic component 10 has side gaps 69 between cover edge 66 and housing sidewall 24 that retain excess mold resin 80, preventing the problem of uncured mold resin leaking from housing 21 and unexpectedly adhering to the exterior surface of the product. Note that, from the perspective of preventing mold resin leakage, it is preferable for cover edge 66 and housing sidewall 24 to continuously surround the periphery of closure plate 63 or bottom plate 22, although partial discontinuities may be formed.

[0063] Second embodiment FIG. 6 is a bottom view of electronic component 210 according to the second embodiment, FIG. 7 is a perspective view showing a portion of electronic component 210 excluding case cover 260 and molded resin, and FIG. 8 is a perspective view of case cover 260 of electronic component 210, viewed obliquely from below. Electronic component 210 according to the second embodiment is similar to electronic component 10 according to the first embodiment, except that the shape of side wall outer surface 224a of housing section side wall 224 of case 220 and the shape of edge inner surface 266a of cover edge portion 266 of case cover 260 are different. In describing electronic component 210, differences from electronic component 10 will be mainly described, and common features with electronic component 10 will be assigned the same reference numerals as electronic component 10 and will not be described again.

[0064] 6, in electronic component 210, as in electronic component 10, edge inner surface 266a of cover edge 266 and side wall outer surface 224a of accommodation section side wall 224 face each other. In addition, a side gap 269 is formed between edge inner surface 266a and side wall outer surface 224a to prevent excess molding resin 80 (see FIG. 2) from flowing out to the outer surface of the product.

[0065] As shown in Fig. 7, a convex portion 224d is formed on the side wall outer surface 224a, which is one of the edge portion inner surface 266a and the side wall outer surface 224a that face each other. Also, as shown in Fig. 8, a concave portion 266b into which the convex portion 224d fits is formed on the edge portion inner surface 266a, which is the other of the edge portion inner surface 266a and the side wall outer surface 224a that face each other.

[0066] 6, the protrusion 224d protrudes from the sidewall outer surface 224a toward the edge inner surface 266a. The value of the protrusion height h1 of the protrusion 224d is greater than the value of the depth D2 of the recess 266b formed in the edge inner surface 266a, and the width of the gap at the portion where the protrusion 224d enters the recess 266b is smaller than the width of the other portions of the side gap 269.

[0067] 6 to 8, recess 266b and protrusion 224d fit together, allowing the relative positions of case 220 and case cover 260 to be controlled with precision, thereby enabling the shape of side gap 269 that holds molded resin 80 to be controlled with precision and effectively preventing molded resin 80 from leaking out. This also improves the fixing strength between case cover 260 and case 220.

[0068] 6, in electronic component 210, the width of side gap 269 other than the portion where convex portion 224d is fitted into concave portion 266b can be increased more uniformly than in a case where convex portion 224d is not formed. Therefore, in electronic component 210, the volume of side gap 269 that holds molded resin 80 can be increased evenly, improving the effectiveness of preventing molded resin 80 from leaking out. Furthermore, electronic component 210 has similar effects to electronic component 10 in terms of the points in common with electronic component 10.

[0069] First Modification Fig. 9 is an external view of case cover 560 according to the first modification, viewed from diagonally below. Case cover 560 can be used in electronic component 10 according to the first embodiment, in place of case cover 60 shown in Fig. 5. Case cover 560 shown in Fig. 9 has a total of four gap grooves 566b, one for each of the four flat surfaces that make up edge inner surface 566a of cover edge 566.

[0070] By forming gap grooves 566b on each surface of edge inner surface 566a as in case cover 560, it is possible to effectively prevent the problem of uncured molding resin leaking out from a position far from gap grooves 566b in the gap between edge inner surface 566a and sidewall outer surface 24a (see FIG. 3). However, the number of gap grooves 566b formed on edge inner surface 566a can be changed depending on the viscosity of the molding resin, variations in the filling rate, and the like, and is not limited to those shown in the embodiment and modified examples.

[0071] An electronic component using case cover 560 according to the first modification in place of case cover 60 shown in FIG. 5 also achieves the same effects as electronic component 10 according to the first embodiment with respect to the common parts.

[0072] Second Modification Fig. 10 is an external view of case cover 660 according to the second modification, viewed from diagonally below. Case cover 660 can be used in electronic component 210 according to the second embodiment, in place of case cover 260 shown in Fig. 8. In case cover 660 shown in Fig. 10, no protrusions or grooves are formed on the flat surfaces that form edge inner surface 666a of cover edge 666.

[0073] When the case cover 660 shown in Fig. 10 is applied to the case 220 shown in Fig. 7 etc., the side wall outer surface 224a shown in Fig. 7 faces the edge portion inner surface 666a shown in Fig. 10. In this case, the protrusion 224d formed on the side wall outer surface 224a functions as a gap protrusion that partially narrows the width of the side gap formed between the cover edge portion 666 and the storage portion side wall 224.

[0074] Thus, even in an electronic component using case cover 660 according to the second modification in place of case cover 260 shown in FIG. 8, protrusions 224d functioning as gap protrusions improve the assembly accuracy of case cover 660 to case 220. Furthermore, case cover 660 and case 220 are firmly fixed together in the portions with narrow side gaps, while more molded resin is held in the portions with wide side gaps. Furthermore, an electronic component using case cover 660 according to the second modification in place of case cover 60 shown in FIG. 8 also achieves the same effects as electronic component 210 according to the second embodiment in terms of the common parts.

[0075] Third Modification Fig. 11 is an external view of case cover 760 according to a third modified example, viewed from diagonally below. Case cover 760 can be used in electronic component 10 according to the first embodiment, in place of case cover 60 shown in Fig. 5. In case cover 760 shown in Fig. 11, a total of four gap grooves 766b are formed at the connection positions of four flat surfaces that make up edge inner surface 766a of cover edge 766, i.e., at the four corners of frame-shaped edge inner surface 766a.

[0076] By forming gap grooves 766b at the four corners of the edge inner surface 766a, where the flat surfaces of the edge inner surface 766a are connected, as in case cover 760, gap grooves 766b are arranged at approximately equal intervals in the gap between, for example, edge inner surface 766a and sidewall outer surface 24a (see FIG. 3). This allows excess molding resin to flow favorably into gap grooves 766b, effectively preventing the problem of uncured molding resin leaking onto the outer surface of the product. Furthermore, an electronic component using case cover 760 according to the third modification in place of case cover 60 shown in FIG. 5 also achieves the same effects as electronic component 10 according to the first embodiment with regard to the common parts.

[0077] Fourth Modification Fig. 12 is an external view of a case cover 860 according to a fourth modified example, viewed from diagonally below. Case cover 860 can be used in electronic component 10 according to the first embodiment, in place of case cover 60 shown in Fig. 5. In case cover 860 shown in Fig. 12, two gap grooves 866b are formed on each of two opposing surfaces of the four flat surfaces that make up edge inner surface 866a of cover edge 866, for a total of four gap grooves 866b.

[0078] In an electronic component using case cover 860, gap grooves 866b are not evenly positioned in the gap between edge inner surface 866a and sidewall outer surface 24a (see FIG. 3). However, the positions from which excess molding resin is likely to leak may be unevenly distributed depending on the shapes of ceramic element 30 and metal terminals 40, 50 disposed inside the case, the position where uncured molding resin is applied, and other factors. By unevenly disposing gap grooves 866b in positions from which molding resin is likely to leak, case cover 860 can effectively prevent the problem of uncured molding resin leaking onto the outer surface of the product. Furthermore, an electronic component using case cover 860 according to the fifth modification instead of case cover 60 shown in FIG. 5 also achieves the same effects as electronic component 10 according to the first embodiment with regard to the common parts.

[0079] Third embodiment Fig. 13 is an external view of case cover 360 used in electronic component 310 according to the third embodiment, as viewed from diagonally below, and Fig. 14 is a cross-sectional view of electronic component 310. Electronic component 310 according to the third embodiment differs from electronic component 210 according to the second embodiment in that it has insulating member 370 that is integrated with case cover 360, but is otherwise similar to electronic component 210 according to the second embodiment. In describing electronic component 310, differences from electronic component 210 according to the second embodiment will be mainly described, and commonalities with electronic component 210 will not be described.

[0080] 13, the insulating member 370 is provided on the cover lower surface 63a, which is the surface of the closure plate 63 facing the accommodation section 21. As shown in Fig. 14, the insulating member 370 protrudes downward (toward the bottom surface 21c) from the cover lower surface 63a of the case cover 60 and is disposed within the accommodation section 21. The insulating member 370 is disposed in the accommodation section 21 between the first electrode portion 33 of the ceramic element 30 and the second terminal arm portion 56 of the second metal terminal 50.

[0081] 14, the insulating member 370 is preferably disposed in the housing portion 21 of the case 20 so as to intersect with the extended surface 31aa of the first main surface 31a of the ceramic element 30. Furthermore, it is also preferable that the insulating member 370 blocks an imaginary line (which coincides with the extended surface 31aa in FIG. 14) that connects the first electrode portion 33 and the second terminal arm portion 56 (particularly the rising portion 56a) at the shortest distance along the extended surface 31aa of the first main surface 31a. Such an arrangement effectively improves the insulation between the first electrode portion 33 and the second terminal arm portion 56 that is electrically connected to the second electrode portion 34.

[0082] 14 , the second metal terminal 50 electrically connected to the second electrode portion 34 is exposed from the accommodation portion 21 through the opening 21a (including the second gap 28). Therefore, in the electronic component 310, the rising portion 56a or the third portion 56c of the second terminal arm 56 is disposed near the first electrode portion 33 facing the opening 21a in the ceramic element 30. However, in the electronic component 310, the insulating member 370 is disposed between the first electrode portion 33 and the second terminal arm 56 (particularly the rising portion 56a), so that the insulation distance between the first electrode portion 33 and the second terminal arm 56 can be appropriately ensured even in the narrow accommodation portion 21.

[0083] Similar to the cover edge portion 266 shown in Fig. 8, two recesses 266b are formed on an edge portion inner surface 266a of a cover edge portion 266 of a case cover 360 of an electronic component 310. In the electronic component 310, when the case cover 360 is assembled to the case 220, similar to the electronic component 210 shown in Fig. 6, the recesses 266b formed on the edge portion inner surface 266a are fitted into the protrusions 224d formed on the side wall outer surface 224a.

[0084] 14, a side gap 269 is formed between the edge inner surface 266a and the sidewall outer surface 224a, and the side gap 269 holds excess molding resin 80. In addition, the electronic component 310 according to the third embodiment also has the same effects as the electronic component 210 according to the second embodiment in terms of the common parts.

[0085] Fourth embodiment Fig. 15 is a schematic perspective view of electronic component 410 according to the fourth embodiment, viewed obliquely from above, and Fig. 16 is a bottom view of electronic component 410. Electronic component 410 according to the fourth embodiment differs from electronic component 210 according to the second embodiment in that first groove 468a and second groove 468c or first protrusion 468b and second protrusion 468d are formed on four outer surfaces (first to fourth outer surfaces 467a to 467d) of cover edge portion 466 of case cover 460. However, electronic component 410 is similar to electronic component 210 in other respects. In the description of electronic component 210, differences from electronic component 210 will be mainly described, and commonalities with electronic component 210 will not be described.

[0086] 15 and 16, a first groove portion 468a is formed in a first outer surface 467a, which is one of the outer surfaces of the cover edge portion 266. In addition, a first protrusion portion 468b corresponding to the shape of the first groove portion 468a is formed in a second outer surface 467b of the cover edge portion 266, which faces in a different direction from the first outer surface 467a (the opposite direction in this embodiment).

[0087] 18, multiple electronic components 410 can be connected to one another without using adhesive or the like by fitting the first protrusion 468b of one electronic component 410 into the first groove 468a of another electronic component 410. In FIG. 18, three electronic components 410 are connected in the Y-axis direction using the first protrusion 468b and the first groove 468a, but the number of connected electronic components 410 may be two, four or more.

[0088] 15 and 16, a second groove portion 468c is formed in a third outer surface 467c, which is one of the outer surfaces of the cover edge portion 266. Furthermore, a second protrusion portion 468d corresponding to the shape of the second groove portion 468c is formed in a fourth outer surface 467d of the cover edge portion 266, which faces in a different direction from the third outer surface 467c (the opposite direction in this embodiment).

[0089] 17, multiple electronic components 410 can be connected to one another without using adhesive or the like by fitting the second protrusion 468d of one electronic component 410 into the second groove 468c of another electronic component 410. The number of electronic components 410 connected in the X-axis direction using the second protrusion 468d and the second groove 468c is not limited to three as shown in FIG. 17, and any number of electronic components 410 can be connected. Furthermore, multiple electronic components 410 can be connected in two dimensions (X-axis direction and Y-axis direction) using both the first protrusion 468b and the first groove 468a and the second protrusion 468d and the second groove 468c.

[0090] In addition, the electronic component 410 according to the fourth embodiment has the same effects as the electronic component 210 according to the second embodiment in terms of the common parts.

[0091] While electronic components 10, 210, 310, 410, etc. have been described above using embodiments and modifications, it goes without saying that the shape and structure of each part are not limited to these embodiments and modifications and can be changed to other shapes and structures that have similar functions. For example, in electronic components 10, 210, 310, 410, the mounting surface is on the side of bottom plate 22 of case 20, but instead, the tips of metal terminals 30, 40 may be exposed on the side of closing plate 63 of case cover 60, 260, 360, 460, so that the mounting surface is on the side of closing plate 63 of case cover 60, 260, 360, 460. [Explanation of symbols]

[0092] 10, 210, 310, 410...Electronic components 20, 220…case 21...Storage section 21a...Aperture 21c…Bottom surface 22...Bottom plate part 24, 224...Side wall of storage area 24a, 224a...Outer surface of side wall 24b…Inner surface of side wall 24c…Opening edge 27...First gap 28...Second gap 30...Ceramic element 31a...first principal surface 31aa…extension surface 33...First electrode part 31b…Second main surface 34…Second electrode part 35...Dielectric part 40...First metal terminal 44...First electrode connection part 42...First mounting section 42b...gap passage part 42c...opposite end 42a...Bottom mounting part 46...1st terminal arm 50…Second metal terminal 54...Second electrode connection part 52...Second mounting section 52b...gap passage part 52c...opposite end 52a...Bottom mounting part 56…Second terminal arm 56a...Rising part 56b...First part 56c...Third part 60, 260, 360, 460, 560, 660, 760, 860…Case Cover 63... Closing plate 63a...Underside of cover 66, 266, 466, 566, 666, 766, 866...Cover edge 66a, 266a, 566a, 666a, 766a, 866a...Inner surface of edge 66b, 566b, 766b, 866b...Gap groove 266b...recess 69, 269...Side gap 467a~467d...1st~4th outer surface 468a...First groove 468b...first protrusion 468c...Second groove 468d…Second protrusion 370...Insulating member 80...Mold resin D1: Depth direction h1...height D2…Depth 224d...Convex part

Claims

1. a case having a housing portion with an opening; a ceramic element disposed in the housing; a metal terminal having an electrode connection portion connected to the ceramic element, a mounting portion exposed from the housing portion, and a terminal arm portion connecting the electrode connection portion and the mounting portion; a case cover including a closing plate portion that closes the opening, and a cover edge portion that protrudes from the periphery of the closing plate portion in the depth direction of the storage portion and at least a portion of which faces a storage portion side wall that is a side wall of the storage portion; a molding resin filled in the housing portion, An electronic component in which a gap groove portion that partially widens the width of the gap formed between the cover edge portion and the accommodating portion side wall is formed on at least one of the surfaces that face each other on the cover edge portion and the accommodating portion side wall.

2. a case having a housing portion with an opening; a ceramic element disposed in the housing; a metal terminal having an electrode connection portion connected to the ceramic element, a mounting portion exposed from the housing portion, and a terminal arm portion connecting the electrode connection portion and the mounting portion; a case cover including a closing plate portion that closes the opening, and a cover edge portion that protrudes from the periphery of the closing plate portion in the depth direction of the storage portion and at least a portion of which faces a storage portion side wall that is a side wall of the storage portion; a molding resin filled in the housing portion, An electronic component in which a gap protrusion that partially narrows the width of the gap formed between the cover edge portion and the accommodating portion side wall is formed on at least one of the surfaces that face each other on the cover edge portion and the accommodating portion side wall.

3. a case having a housing portion with an opening; a ceramic element disposed in the housing; a metal terminal having an electrode connection portion connected to the ceramic element, a mounting portion exposed from the housing portion, and a terminal arm portion connecting the electrode connection portion and the mounting portion; a case cover including a closing plate portion that closes the opening, and a cover edge portion that protrudes from the periphery of the closing plate portion in the depth direction of the storage portion and at least a portion of which faces a storage portion side wall that is a side wall of the storage portion; a molding resin filled in the housing portion, An electronic component in which a convex portion is formed on one of the surfaces of the cover edge portion and the accommodating portion side wall that face each other, and a concave portion into which the convex portion fits is formed on the other surface.

4. a case having a housing portion with an opening; a ceramic element disposed in the housing; a metal terminal having an electrode connection portion connected to the ceramic element, a mounting portion exposed from the housing portion, and a terminal arm portion connecting the electrode connection portion and the mounting portion; a case cover including a closing plate portion that closes the opening, and a cover edge portion that protrudes from the periphery of the closing plate portion in the depth direction of the storage portion and at least a portion of which faces a storage portion side wall that is a side wall of the storage portion; a molding resin filled in the housing portion, the mounting portion is exposed from the accommodation portion through the opening, The mounting portion is an electronic component having a gap passing portion disposed in the gap between the cover edge portion and the accommodating portion side wall, and a mounting bottom portion facing the mounting surface side.

5. a case having a housing portion with an opening; a ceramic element disposed in the housing; a metal terminal having an electrode connection portion connected to the ceramic element, a mounting portion exposed from the housing portion, and a terminal arm portion connecting the electrode connection portion and the mounting portion; a case cover including a closing plate portion that closes the opening, and a cover edge portion that protrudes from the periphery of the closing plate portion in the depth direction of the storage portion and at least a portion of which faces a storage portion side wall that is a side wall of the storage portion; a molding resin filled in the housing portion, The electronic component further includes an insulating member disposed in the housing between the electrode portion of the ceramic element and the terminal arm portion.

6. The electronic component according to claim 1 , wherein the cover edge portion faces an outer surface of the housing portion side wall that faces away from the housing portion.

7. The housing side wall is provided to surround the periphery of the bottom plate portion of the case, 7. The electronic component according to claim 1, wherein the cover edge portion is provided so as to surround the periphery of the closing plate portion.

8. an inner surface of the cover edge portion faces an outer surface of the storage portion side wall that faces away from the storage portion, a first groove portion is formed in a first outer surface which is one of the outer surfaces of the cover edge portion; 8. An electronic component according to claim 1, wherein a first protrusion portion corresponding to the shape of the first groove portion is formed on a second outer surface of the cover edge portion that faces in a direction different from the first outer surface.

Images