Posture changing device and substrate processing apparatus equipped with same

Abstract

To normally perform posture change regardless of a direction of a processing surface of a substrate.SOLUTION: A control unit 1 operates a drive mechanism to cause an inversion chuck 43 to hold a plurality of substrates W in a vertical posture. Thereafter, when posture of the plurality of substrates W is changed from a vertical posture to a horizontal posture, the control unit operates a rotation mechanism so that a processing surface of the plurality of substrates W faces upward. Therefore, regardless of a direction of the processing surface of the substrate W, it is possible to normally perform posture change so that the processing surfaces of the plurality of substrates W face upward.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present invention relates to a posture changing device for performing predetermined processing on substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal displays and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks, and to a substrate processing apparatus equipped with the same. [Background technology]

[0002] Conventionally, this type of apparatus includes a batch module, a single-wafer module, and a posture conversion module (see, for example, Patent Document 1). A batch module processes multiple substrates at once. A single-wafer module processes substrates one by one. Generally, drying processing using a single-wafer module requires a smaller processing atmosphere space that affects the substrates, and has higher particle performance, compared to drying processing using a batch module. Therefore, it is easier to improve drying performance in a single-wafer module than in a batch module. Therefore, for example, after etching processing and rinsing processing are performed in a batch module, drying processing is performed in a single-wafer module.

[0003] In the batch-type module, multiple substrates are processed in a vertical position. On the other hand, in the single-wafer-processing module, substrates are processed in a horizontal position. Therefore, the substrates in a vertical position that have finished processing in the batch-type module are converted to a horizontal position by a position conversion module before being transferred to the single-wafer-processing module.

[0004] Specifically, the posture conversion module includes a chuck having side support portions that contact and support both side surfaces of the substrate and a lower end support portion that contacts and supports the lower end of an end surface perpendicular to both sides of the substrate, and a rotation mechanism that rotates the chuck 90 degrees to one side about a horizontal axis. The rotation mechanism rotates the chuck 90 degrees about the horizontal axis so that, in a plan view, the lower end support portion is positioned on the side opposite to the direction in which the robot that transfers substrates one by one to the single-wafer processing module is located. After the chuck has been rotated by the rotation mechanism, the robot can receive the substrate from the side of the chuck where the lower end support portion is not located. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Special Publication No. 2016-502275 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the conventional example having such a configuration has the following problems. In other words, in conventional devices, the chuck can only rotate 90 degrees in one direction around the horizontal axis. With this configuration, for example, when the processing surfaces of multiple substrates are facing the robot in a vertical position, they cannot be converted to a horizontal position with the processing surfaces facing up. In other words, there is a problem in that the position of multiple substrates can only be changed when the processing surfaces of the multiple substrates are facing away from the robot in a vertical position.

[0007] In batch-type modules, in order to improve throughput, multiple substrates that make up one lot are sometimes combined with multiple substrates that make up another lot, and processing is performed on a batch lot basis. In such cases, there are two types of processing, depending on the combination of processing surfaces, i.e., in which direction the processing surfaces of the lots face to form the batch lot: face-to-face (also called face-to-back) and back-to-back (also called face-to-back). Conventional orientation conversion modules can only rotate in one direction, so they cannot properly convert the orientation of lots with the opposite processing surfaces so that the processing surfaces face upward.

[0008] The present invention has been made in consideration of the above circumstances, and aims to provide a posture changing device that can perform posture changes normally regardless of the orientation of the processing surface of the substrate, and a substrate processing apparatus equipped with the same. [Means for solving the problem]

[0009] In order to achieve the above object, the present invention has the following configuration. That is, the invention of claim 1 provides a posture changing device for changing the posture of a plurality of substrates, the posture changing device comprising: an inversion chuck for holding a plurality of substrates; an opening / closing drive mechanism for driving the inversion chuck in a radial direction of the substrates between an open position for transferring the plurality of substrates between the inversion chuck and the inversion chuck and a holding position for holding the plurality of substrates by the inversion chuck; a rotation drive mechanism for driving the inversion chuck around a horizontal axis to change the posture of the plurality of substrates from a vertical posture to a horizontal posture; and a rotary drive mechanism for operating the opening / closing drive mechanism to hold the plurality of substrates in the inversion chuck in a vertical posture, and then, when changing the posture of the plurality of substrates from a vertical posture to a horizontal posture, lead The rotation drive mechanism is operated in accordance with the orientation of the processing surfaces of the plurality of substrates in the upright position, and the rotation angle of the inversion chuck around the horizontal axis is changed, water and a control unit that causes the processing surfaces of the plurality of substrates in a flat position to face upward.

[0010] [Operation and Effect] According to the invention described in claim 1, the control unit operates the opening and closing drive mechanism to hold multiple substrates in a vertical position on the inversion chuck. Thereafter, when the position of the multiple substrates is changed from the vertical position to the horizontal position, the control unit: lead The rotation drive mechanism is operated in accordance with the orientation of the processing surfaces of the multiple substrates in the upright position, and the rotation angle of the inversion chuck about the horizontal axis is changed, thereby operating the rotation drive mechanism so that the processing surfaces of the multiple substrates in the horizontal position face upward. Therefore, regardless of the orientation of the processing surfaces of the substrates, the orientation of the multiple substrates can be properly changed so that the processing surfaces face upward.

[0011] In the present invention, the processing surface of the substrate refers to the surface that is processed after the substrate is placed in a horizontal position in the position changing device. The processing surface is the surface that faces upward when the substrate is placed in a horizontal position.

[0012] In addition, in the present invention, it is preferable that the control unit operates the rotation drive mechanism to rotate in either one direction or the other direction opposite thereto, depending on the orientation of the processing surfaces of the plurality of substrates (Claim 2).

[0013] The processing surfaces of the vertically oriented substrates are oriented in either one direction or the other direction, and the control unit can rotate the substrates by a predetermined angle in the other direction opposite the one direction or in the one direction opposite the other direction, depending on the orientation of the processing surfaces, so that the processing surfaces of the substrates are oriented upward.

[0014] In the present invention, it is preferable that the control unit operates the rotation drive mechanism so as to rotate the substrates in only one direction, depending on the orientation of the processing surfaces of the substrates (claim 3).

[0015] The processing surfaces of the multiple substrates in a vertical position are oriented in either one direction or the other. Therefore, the control unit can orient the processing surfaces of the multiple substrates upward by operating the rotation drive mechanism to rotate only in either one direction or the other. Since the substrates are rotated only in one direction, the control unit can easily control the rotation.

[0016] In the present invention, it is preferable that the reversal chuck holds only both side surfaces of the plurality of substrates in a direction perpendicular to the direction in which the plurality of substrates are transferred (claim 4).

[0017] When converting the orientation of multiple substrates from a vertical orientation to a horizontal orientation, the inversion chuck does not interfere with the transfer regardless of the direction of rotation, thereby facilitating the subsequent transfer operation.

[0018] In the present invention, it is preferable that the control unit operates the rotation drive mechanism based on a recipe that defines how the plurality of substrates are to be processed (claim 5).

[0019] The control unit operates the rotation drive mechanism based on the recipe, and therefore can operate the rotation drive mechanism appropriately for each of the plurality of substrates.

[0020] In addition, in the present invention, it is preferable that the control unit operates the rotation drive mechanism in accordance with the combination of processing surfaces, i.e., the direction in which the processing surfaces should face in a batch lot consisting of a combination of a certain number of substrates and another number of substrates in the recipe (Claim 6).

[0021] The control unit operates the rotation drive mechanism according to the combination of processing surfaces in the recipe, and therefore, since the control unit knows the orientation of the processing surfaces of the multiple substrates, it can operate the rotation drive mechanism appropriately for each of the multiple substrates.

[0022] The invention of claim 7 provides a substrate processing apparatus for processing substrates, comprising: a batch processing section for processing a plurality of substrates collectively in a vertical position; a single wafer processing section for processing a single substrate in a horizontal position; a position changing section for changing the position of the plurality of substrates that have been processed in the batch processing section from the vertical position to the horizontal position; a first transport section for transporting the plurality of substrates that have been processed in the batch processing section to the position changing section; and a second transport section for transporting the plurality of substrates that have been horizontally positioned in the position changing section to the single wafer processing section, wherein the position changing section has an inversion chuck for holding the plurality of substrates; an opening / closing drive mechanism that drives the inversion chuck in a radial direction of the substrates between an open position for transferring the plurality of substrates between the batch processing unit and the inversion chuck and a holding position for holding the plurality of substrates by the inversion chuck; and a rotation drive mechanism that drives the inversion chuck about a horizontal axis to change the attitude of the plurality of substrates from a vertical attitude to a horizontal attitude, wherein after the plurality of substrates have been processed in the batch processing unit and before the plurality of substrates are transported to the single wafer processing unit, the opening / closing drive mechanism is operated to hold the plurality of substrates in a vertical attitude by the inversion chuck, and then when changing the attitude of the plurality of substrates from a vertical attitude to a horizontal attitude, lead The rotation drive mechanism is operated in accordance with the orientation of the processing surfaces of the plurality of substrates in the upright position, and the rotation angle of the inversion chuck around the horizontal axis is changed, water The apparatus is characterized by comprising a control unit that operates the rotation drive mechanism so that the processing surfaces of the plurality of substrates in a flat position face upward.

[0023] [Operation and Effect] According to the invention described in claim 7, after processing a plurality of substrates in the batch processing section, the control section operates the opening and closing drive mechanism to hold the plurality of substrates in a vertical position on the inversion chuck before transporting the plurality of substrates to the single wafer processing section. Then, when converting the position of the plurality of substrates from a vertical position to a horizontal position, the control section: leadThe rotation drive mechanism is operated in accordance with the orientation of the processing surfaces of the multiple substrates in the upright position, and the rotation angle of the inversion chuck about the horizontal axis is changed, thereby operating the rotation drive mechanism so that the processing surfaces of the multiple substrates in the horizontal position face upward. Therefore, regardless of the orientation of the processing surfaces of the substrates, the orientation of the multiple substrates can be properly changed so that the processing surfaces face upward. [Effects of the Invention]

[0024] According to the posture changing device of the present invention, the control unit operates the opening and closing drive mechanism to hold the plurality of substrates in the vertical posture on the inversion chuck. Thereafter, when changing the posture of the plurality of substrates from the vertical posture to the horizontal posture, the control unit lead The rotation drive mechanism is operated in accordance with the orientation of the processing surfaces of the multiple substrates in the upright position, and the rotation angle of the inversion chuck about the horizontal axis is changed, thereby operating the rotation drive mechanism so that the processing surfaces of the multiple substrates in the horizontal position face upward. Therefore, regardless of the orientation of the processing surfaces of the substrates, the orientation of the multiple substrates can be properly changed so that the processing surfaces face upward. [Brief explanation of the drawings]

[0025] [Figure 1] 1 is a plan view showing an overall configuration of a substrate processing apparatus according to an embodiment; [Figure 2] FIG. 2 is a cross-sectional view taken along the line AA in FIG. [Figure 3] 10(a) and 10(b) are schematic diagrams for explaining how to combine processing surfaces that make up a batch lot. [Figure 4] 10(a) and 10(b) are schematic diagrams for explaining how to combine processing surfaces that make up a batch lot. [Figure 5] FIG. 10 is a plan view showing the configuration of a 25-plate chuck and a reversing chuck. [Figure 6] FIG. 10 is a front view showing a state in which the reversing chuck is in an open position. [Figure 7] FIG. 10 is a front view showing a state in which the reversal chuck is in a holding position. [Figure 8] FIG. 10 is a front view showing the configuration of the posture changing tank, showing a state in which the substrate is held in a vertical posture. [Figure 9] FIG. 10 is a front view showing the configuration of the posture changing tank, showing a state in which the substrate is held in a horizontal posture. [Figure 10] FIG. 2 is a block diagram showing a control system. [Figure 11] 10(a) to 10(d) are schematic diagrams showing an example of posture change in a batch lot with surface alignment. [Figure 12] 10(a) to 10(d) are schematic diagrams showing an example of posture change in a batch lot with surface alignment. [Figure 13] 10(a) to 10(d) are schematic diagrams showing other examples of posture transformation. [Figure 14] FIG. 10 is a block diagram showing a modified example of the control system. DETAILED DESCRIPTION OF THE INVENTION

[0026] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0027] Fig. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment, and Fig. 2 is a cross-sectional view taken along the line AA in Fig. 1.

[0028] Fig. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment, and Fig. 2 is a cross-sectional view taken along the line AA in Fig. 1.

[0029] <1. Overall structure>

[0030] The substrate processing apparatus 1 processes substrates W. For example, the substrate processing apparatus 1 performs chemical processing, cleaning processing, drying processing, etc. on the substrates W. The substrate processing apparatus 1 employs a processing method (a so-called hybrid method) that combines the batch and single-wafer processing methods. The batch method processes multiple substrates W in a vertical position all at once. The single-wafer method processes a single substrate W in a horizontal position.

[0031] The substrate processing apparatus 1 includes a batch processing apparatus 3 and a single wafer processing apparatus 5. In this embodiment, the single wafer processing apparatus 5 is disposed adjacent to the batch processing apparatus 3. The batch processing apparatus 3 and the single wafer processing apparatus 5 are disposed at a distance from each other. The batch processing apparatus 3 and the single wafer processing apparatus 5 are connected by a bridge section 7.

[0032] <2. Batch processing equipment>

[0033] The batch processing apparatus 3 collectively processes a plurality of substrates W. The batch processing apparatus 3 includes a carry-in block 9, a stocker block 11, a transfer block 13, a posture changing block 15, and a processing block 17.

[0034] For convenience, in this specification, the direction in which the loading block 9, stocker block 11, transfer block 13, and processing block 17 are aligned is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, the direction from the stocker block 11 toward the loading block 9 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For reference, in each figure, front, back, right, left, top, and bottom are indicated as appropriate.

[0035] <3. Carry-in block>

[0036] The carry-in block 9 includes a loading section 19. The loading section 19 is arranged in the front X of the batch processing apparatus 3. The carrier C stores a plurality of (e.g., 25) substrates W in a horizontal position, stacked at regular intervals in the vertical direction Z. The carrier C has a plurality of grooves (not shown) formed therein, separating the surfaces of the substrates W and accommodating each substrate W. An example of the carrier C is a front-opening unify pod (FOUP). A FOUP is a sealed container. The carrier C may be an open container and may be of any type. The loading section 19 includes, for example, two mounting tables 21 on which the carriers C are placed. The two mounting tables 21 are arranged, for example, along the width direction Y. The loading section 19 is also called a load port.

[0037] <4. Stocker Block>

[0038] The stocker block 11 is disposed adjacent to the rear X of the carry-in block 9. The stocker block 11 includes a transporting and storing unit ACB. The transporting and storing unit ACB includes a transport mechanism 23 and shelves 25.

[0039] The transport mechanism 23 transports the carriers C. The transport storage unit ACB has a plurality of shelves 25. Some of the shelves 25 are simply where the carriers C are placed temporarily, and others are where the carriers C are placed for transfer to and from the first transport mechanism HTR. The transport storage unit ACB takes in the carriers C storing unprocessed substrates W from the input unit 19 and places them on the shelves 25. The transport storage unit ACB transports and places the carriers C on the delivery shelf 25 in accordance with a schedule that defines the processing order. The transport storage unit ACB transports and places the emptied carriers C that have been placed on the delivery shelf 25 on the shelf 25. The transport storage unit ACB unloads the empty carriers C placed on the shelf 25 onto the delivery table 21 in accordance with the availability of the table 21. The empty carriers C are transported to the single-wafer processing unit 5. In the empty carrier C transported to the single wafer processing section 5, for example, a substrate W that was stored in this carrier C before processing and has now been processed is stored in the single wafer processing section 5.

[0040] <5. Transfer block>

[0041] The transfer block 13 is disposed adjacent to the rear X of the stocker block 11. The transfer block 13 includes a transfer mechanism CTC. The transfer mechanism CTC includes a first transport mechanism HTR, a conversion mechanism HVC, a pusher PH, and a second transport mechanism WTR.

[0042] A first transport mechanism HTR is disposed on the right side Y of the rear X of the transport storage unit ACB. The first transport mechanism HTR transports multiple substrates W in a batch. In other words, the first transport mechanism HTR is equipped with multiple hands (not shown). Each hand supports one substrate W. The first transport mechanism HTR can also transport only one substrate W. The first transport mechanism HTR picks up multiple substrates W (e.g., 25 substrates) in a batch from a carrier C placed on a delivery shelf 25 in the transport storage unit ACB, and transports them in a horizontal position to the conversion mechanism HVC. At this time, the conversion mechanism HVC converts the position of the substrates W from a horizontal position to a vertical position.

[0043] To the left Y of the first transport mechanism HTR, a conversion mechanism HVC and a pusher PH are arranged in this order. The conversion mechanism HVC delivers multiple substrates W to the pusher PH. After receiving the multiple substrates W from the conversion mechanism HVC, the pusher PH moves in the width direction Y to the second transport mechanism WTR. At this time, the conversion mechanism HVC and the pusher PH assemble or disassemble a batch lot. The pusher PH delivers multiple substrates W to the second transport mechanism WTR.

[0044] The transfer mechanism CTC combines, for example, multiple substrates W constituting one lot removed from one carrier C with multiple substrates W constituting another lot removed from another carrier C into one batch lot. This is the assembly of the batch lot. A batch lot consists of twice the number of substrates W as one lot. In a batch lot, each substrate W from one lot is arranged adjacent to each substrate W from another lot. In other words, each substrate W from one lot is arranged odd-numbered, and each substrate W from the other lot is arranged even-numbered. Typically, the spacing between multiple substrates W removed from a carrier C is the same as that of the carrier C. This is called full pitch. In a batch lot, for example, the spacing between multiple substrates W is half the full pitch. This is called half pitch. As described above, a batch lot is combined with another lot. There are two types of combination methods: front-to-face (also called face-to-face) and front-to-back (also called face-to-back). The way the lots are combined is determined by the operation of the pusher PH. In the following description, a plurality of substrates W will be referred to as a lot, but when a description specific to a batch lot is required, a plurality of substrates W will be referred to as a batch lot.

[0045] Here, reference is made to Figures 3 and 4. Figures 3(a), (b) and 4(a), (b) are schematic diagrams for explaining how to combine processing surfaces that make up a batch lot. In Figures 3(a), (b) and 4(a), (b), each lot is made up of three substrates W to make the invention easier to understand.

[0046] The transfer mechanism CTC described above assembles the batch lot as shown in FIGS. 3(a), (b) and 4(a), (b).

[0047] (1) Face to Face As shown in FIG. 3(a), a batch lot BL1 of the surface-matching FTF shown in FIG. 3(b) is assembled by combining one lot LT1 with another lot LT2. Specifically, immediately after the lot LT1 is converted to a vertical position by the conversion mechanism HVC, the processing surface of each substrate W in the lot LT1 faces the left Y. For example, the lot LT1 is rotated 180 degrees around the vertical axis by the pusher PH. As a result, the processing surface of the lot LT1 faces the right Y. The processing surface of each substrate W in the lot LT2 faces the opposite side to the processing surface of the lot LT1, that is, the left Y. The processing surface of each substrate W in the lot LT1 is marked with a white triangle. The processing surface of each substrate W in the lot LT2 is marked with a black triangle. Here, the processing surface refers to the surface that is processed after the orientation is converted to a horizontal position in the orientation conversion block 15. The processing surface is the surface that faces upward when the substrate W is placed. The processing surface is also called the main surface, front surface, or back surface.

[0048] The order in which the lots LT1 and LT2 are carried into the transfer mechanism CTC may be reversed, so that the odd-numbered lots in the batch lot BL1 in FIG.

[0049] (2) Face to Back As shown in Fig. 4(a), by combining one lot LT1 with another lot LT2, a batch lot BL2 of the front-to-back surface facing FTB shown in Fig. 4(b) is assembled. In detail, the processing surfaces of the substrates W of the lots LT1 and LT2 face, for example, to the left Y. When assembling a batch lot with this front-to-back surface facing FTB, only linear movement of half a pitch in the width direction Y is performed, and no rotational movement is performed by the pusher PH.

[0050] The second transport mechanism WTR is disposed to the left Y of the transfer mechanism CTC. The second transport mechanism WTR is configured to be movable between the transfer block 13 and the processing block 17. The second transport mechanism WTR is configured to be movable in the front-rear direction X. The second transport mechanism WTR is equipped with a pair of hands 27 that transports a lot. The pair of hands 27 has, for example, a rotation axis facing the width direction Y. The pair of hands 27 swings around this rotation axis. The pair of hands 27 clamps the side end surfaces of the substrates W that constitute a lot, located in the front-rear direction X. The second transport mechanism WTR transfers the substrates W that constitute a lot between itself and the transfer mechanism CTC. The second transport mechanism WTR transfers the unprocessed substrates W that constitute a lot to the processing block 17. The second transport mechanism WTR transfers the substrates W that have been processed in the processing block 17 between itself and the attitude conversion block 15.

[0051] Here, the processing block 17 will be explained before the posture transformation block 15.

[0052] <6. Processing Block>

[0053] 1 and 2. The processing block 17 includes, for example, a batch processing unit BPU. For example, the batch processing unit BPU includes six processing units. Specifically, the batch processing unit BPU includes a first batch processing unit BPU1, a second batch processing unit BPU2, a third batch processing unit BPU3, a fourth batch processing unit BPU4, a fifth batch processing unit BPU5, and a sixth batch processing unit BPU6. The number of batch processing units BPU is not limited to six. In other words, the number of batch processing units BPU may be less than six, or may be seven or more.

[0054] The first batch processing unit BPU1 to the sixth batch processing unit BPU6 are arranged in a row in the front-rear direction X. Each of the first batch processing unit BPU1 to the sixth batch processing unit BPU6 includes a processing bath BB and a lifter LF. The processing bath BB stores a processing liquid. The processing liquid is pure water or a chemical liquid. The chemical liquid is, for example, an organic solvent or an etching liquid. The organic solvent is, for example, IPA (isopropyl alcohol). The etching liquid is, for example, a phosphoric acid solution.

[0055] The lifter LF moves up and down between a processing position inside the processing bath BB and a transfer position above the liquid level in the processing bath BB. The lifter LF transfers a plurality of substrates W to and from the second transport mechanism WTR at the transfer position. The first batch processing unit BPU1 to the sixth batch processing unit BPU6 are associated with each other in pairs, for example. Specifically, the first batch processing unit BPU1 and the second batch processing unit BPU2 form one pair, the third batch processing unit BPU3 and the fourth batch processing unit BPU4 form one pair, and the fifth batch processing unit BPU5 and the second batch processing unit BPU6 form one pair. Each pair is assigned the role of, for example, chemical processing and cleaning processing. The first batch processing unit BPU1 to the sixth batch processing unit BPU6 can process, for example, up to 50 substrates W at a time. In other words, the first batch processing unit BPU1 to the sixth batch processing unit BPU6 can simultaneously process, for example, a maximum of one batch lot.

[0056] Each processing tank BB is supplied with processing liquid from below. The processing liquid is discharged over the upper edge of each processing tank BB. Each processing tank BB immerses multiple substrates W placed on a lifter LF in the processing liquid. Each lifter LF abuts and holds the lower edge of the substrate W. Each lifter LF transfers multiple substrates W between it and the second transport mechanism WTR.

[0057] <7. Posture change block>

[0058] 2, the posture changing block 15 includes a 25-piece chuck TFC, a standby tank 31, and a posture changing tank 33. In the drawings referring to the standby tank 31 and the posture changing tank 33, the liquid surface is not shown so that each component can be easily seen.

[0059] The standby tank 31 includes a processing tank BB0 and a lifter LF0. The processing tank BB0 has the same configuration as the processing tank BB included in the first batch processing unit BPU1 to the sixth batch processing unit BPU6 described above. The lifter LF0 moves up and down between a standby position inside the processing tank BB0 and a transfer position above the liquid level in the processing tank BB0. The standby tank BB0 stores a processing liquid. The processing liquid is, for example, pure water. At the standby position, the substrate W placed on the lifter LF0 is entirely submerged in the processing liquid.

[0060] Here, reference is made to Fig. 5. Fig. 5 is a plan view showing the configuration of the 25-plate chuck and the reversing chuck.

[0061] The 25-substrate chuck TFC moves horizontally as a whole only in the width direction Y. The 25-substrate chuck TFC does not move up and down in the vertical direction Z. The 25-substrate chuck TFC does not move horizontally in the front-to-rear direction X. However, the 25-substrate chuck TFC opens and closes the hand 35 between the holding position PC and the passing position PT. At the holding position PC, the 25-substrate chuck TFC holds multiple substrates W. At the passing position PT, the 25-substrate chuck TFC does not hold multiple substrates W. In other words, the passing position PT allows the lifter LF0 holding multiple substrates W to move between the transfer position and the standby position. The 25-substrate chuck TFC moves, for example, to three positions in the width direction Y: a first transfer position P1, a second transfer position P2, and a third transfer position P3.

[0062] The 25-substrate chuck TFC has locking portions 37. The locking portions 37 are provided inside the hand 35. The locking portions 37 are formed in the width direction Y at intervals of the full pitch described above. The first transfer position P1 and the second transfer position P2 differ in position in the width direction Y by a distance corresponding to the half pitch. The third transfer position P3 is a position where multiple substrates W are transferred to the posture change tank 33. The 25-substrate chuck TFC receives only one lot from the lifter LF0 at the first transfer position P1. Specifically, of the two lots that make up the batch, it receives only the multiple odd-numbered substrates W that make up one lot. The 25-substrate chuck TFC receives only the other lot from the lifter LF0 at the second transfer position P2. Specifically, of the two lots that make up the batch, it receives only the multiple even-numbered substrates W that make up the other lot.

[0063] For example, a plurality of odd-numbered substrates W correspond to lot LT2 in the example of Figure 3 described above. A plurality of even-numbered substrates W correspond to lot LT1 in the example of Figure 3 described above. For example, a plurality of odd-numbered substrates W correspond to lot LT1 in the example of Figure 4 described above. A plurality of even-numbered substrates W correspond to lot LT2 in the example of Figure 4 described above.

[0064] Here, further reference will be made to Figures 6 to 9. Figure 6 is a front view in a state where the inversion chuck is in the release position. Figure 7 is a front view in a state where the inversion chuck is in the holding position. Figure 8 is a front view showing the configuration of the attitude changing tank, in a state where the substrate is held in a vertical position. Figure 9 is a front view showing the configuration of the attitude changing tank, in a state where the substrate is held in a horizontal position.

[0065] As shown in FIGS. 8 and 9, the posture changing tank 33 includes a dipping tank DB and a posture changing section 41.

[0066] First, the main parts will be described. The posture changing tank 33 uses the inversion chucks 43 to change the postures of multiple substrates W collectively in the immersion tank DB. Specifically, the inversion chucks 43 change the postures of multiple substrates W from a vertical posture to a horizontal posture. The inversion chucks 43 change the postures of, for example, half of the substrates W that make up a batch lot. The inversion chucks 43 change the postures of, for example, 25 substrates W. The inversion chucks 43 are arranged opposite each other in the radial direction of the substrates W and clamp the peripheral edges of the substrates W. The immersion tank DB stores a processing liquid. The processing liquid is, for example, pure water.

[0067] 6 and 7, the inversion chuck 43 includes a pair of chuck members 45. The length of the chuck members 45 in the vertical direction Z when receiving or holding a vertically oriented substrate W is shorter than the radius of the substrate W. As shown in Fig. 5, the length of the chuck members 45 in the width direction Y when receiving or holding a vertically oriented substrate W is slightly longer than the length of the substrates W in the alignment direction in the lot.

[0068] 6 and 7, each chuck member 45 has a groove 47 on the opposing surface. When viewed from the width direction Y in a vertical position for receiving and holding a vertically oriented substrate W, the groove 47 has an arc-like shape. The arc-like shape of the groove 47 follows the outer edge of the substrate W.

[0069] The pair of chuck members 45 move in the front-rear direction X over a first distance WD1 and a second distance WD2. The pair of chuck members 45 can change the distance between the opposing grooves 47. The first distance WD1 is a distance for transferring substrates between the 25-plate chuck TFC and the bridging portion 7. The second distance WD2 is narrower in the front-rear direction X than the first distance WD1 and is a distance for clamping multiple substrates W.

[0070] The inverting chuck 43 holds only both side surfaces of the substrate W in a direction perpendicular to the direction in which the substrate W is transferred. Therefore, when the orientation of multiple substrates W is changed from a vertical orientation to a horizontal orientation, the inverting chuck 43 does not interfere with the transfer regardless of the direction in which the substrates are rotated. This allows the subsequent transfer operation to be carried out smoothly.

[0071] The posture changing tank 33 includes a lifting mechanism 61 , a driving mechanism 63 , and a rotation mechanism 65 .

[0072] The lifting mechanism 61 lifts and lowers the reversing chuck 43. The driving mechanism 63 opens and closes the reversing chuck 43. The rotating mechanism 65 rotates the reversing chuck 43.

[0073] The lifting mechanism 61 is disposed outside the immersion tank DB. In a plan view, the lifting mechanism 61 is disposed along the outer surfaces of two of the four side walls of the immersion tank DB that are located in the front-rear direction X. As shown in FIG. 8 , the lifting mechanism 61 raises and lowers the inverting chuck 43 among a receiving height HP1, a clamping height HP2, a locking height HP3, and an immersion height HP4. The receiving height HP1 is the height at which a vertically oriented substrate W is received by the inverting chuck 43. The clamping height HP2 is the height at which a vertically oriented substrate W is clamped by the inverting chuck 43. The locking height HP3 is the height at which a vertically oriented substrate W clamped by the inverting chuck 43 is locked. The immersion height HP4 is the height at which a vertically oriented substrate W locked by the inverting chuck 43 is immersed in the processing liquid in the immersion tank DB.

[0074] The lifting mechanism 61 includes a base member 61a and a lifting motor 61b. The base member 61a is fixed to the bottom of the posture change tank 33. The lifting motor 61b raises and lowers the upper part of the base member 61a in the vertical direction Z. The lifting motor 61b may be configured with an actuator such as a multi-stage air cylinder.

[0075] The drive mechanism 63 is mounted on the upper part of the lifting mechanism 61. The drive mechanism 63 includes an air cylinder 63a, a moving piece 63b, and a suspension arm 63c. The air cylinder 63a has an actuating axis facing the front-rear direction X. The suspension arm 63c has an inverted L shape. A horizontal portion of the suspension arm 63c is attached to the upper part of the base member 61a. The suspension arm 63c is attached so as to be horizontally movable in the front-rear direction X. The drive mechanism 63 moves the suspension arm 63c in the front-rear direction X by operating the air cylinder 63a. The drive mechanism 63 drives the reversing chuck 43 by operating the air cylinder 63a. Specifically, the drive mechanism 63 moves the chuck member 45 between the first distance WD1 and the second distance WD2.

[0076] For example, the air cylinder 63a has an operating shaft that contracts when not in operation. For example, the air cylinder 63a has an operating shaft that extends when in operation. In other words, when the air cylinder 63a is not in operation, the chuck 43 has a first distance WD1. When the air cylinder 63a is in operation, the chuck 43 has a second distance WD2.

[0077] The rotation mechanism 65 includes a rotation shaft 65a and a motor 65b.

[0078] One end of the rotating shaft 65a is connected to the outer surface of the chuck member 45. The motor 65b is built into the lower part of the suspension arm 63c. The motor 65b is arranged facing the front-rear direction X. The rotating shaft 65a is attached to the suspension arm 63c via a sealing member (not shown). Therefore, the pure water stored in the immersion tank DB does not enter the suspension arm 63c. The motor 65b rotates the rotating shaft 65a around the axis AX1. When the motor 65b is driven, the reversing chuck 43 is driven to rotate around the axis AX1. The reversing chuck 43 can be rotated clockwise and counterclockwise around the axis AX1 when viewed from the front X by the motor 65b. The rotation control of the reversing chuck 43 by the motor 65b will be described in detail below.

[0079] The attitude changing unit 41 configured as described above can change the attitude of the substrate W in the same way as the transfer mechanism CTC. However, the attitude changing unit 41 rotates the orientation of the surface of the substrate W around the axis AX1 oriented horizontally. The transfer mechanism CTC changes the attitude by combining the conversion mechanism HVC and the pusher PH. Therefore, the attitude changing unit 41 can be made smaller than the transfer mechanism CTC.

[0080] Now, let us return to Figures 1 and 2.

[0081] <8. Bridging Section>

[0082] The bridge unit 7 connects the batch processing apparatus 3 and the single wafer processing apparatus 5. The bridge unit 7 is in communication only with the batch processing apparatus 3 and the single wafer processing apparatus 5. The bridge unit 7 is equipped with a bridge robot BR. The bridge robot BR is configured to be movable only in the width direction Y. The bridge robot BR does not move up and down in the vertical direction Z. The bridge robot BR is equipped with a hand 71. The hand 71 is configured to be rotatable within a horizontal plane including the front-to-rear direction X and the width direction Y. The hand 71 is configured to be extendable and retractable in the horizontal direction. The bridge robot BR moves the hand 71 forward and backward to receive a single horizontally oriented substrate from the orientation conversion block 15. The bridge robot BR delivers the single horizontally oriented substrate to the single wafer processing apparatus 5.

[0083] <9. Single-Wafer Processing Equipment>

[0084] The single wafer processing apparatus 5 includes an unloading block 81, an indexer block 83, and a processing block 85.

[0085] <10. Carry-out block>

[0086] The unloading block 81 includes an unloading section 87. The unloading section 87 is arranged in the front X of the single wafer processing apparatus 5. A carrier C is placed on the unloading section 87. The unloading block 81 includes, for example, four unloading sections 87. The four unloading sections 87 are arranged along the width direction Y. The unloading sections 87 are also called load ports.

[0087] <11. Indexer Block>

[0088] The indexer block 83 is equipped with an indexer robot IR. The indexer robot IR is equipped with, for example, an articulated arm 89 and a hand 91. The indexer robot IR does not move in the width direction Y or the front-rear direction X. The indexer robot IR bends the articulated arm 89 to move the hand 91. The indexer robot IR raises and lowers the hand 91 in the vertical direction Z. The indexer robot IR can access each of the cassettes C placed on the four unloading units 87. The indexer robot IR transports one substrate W with the hand 91. The indexer robot IR transports one substrate W from the processing block 85 to the unloading unit 87.

[0089] <12. Processing Block>

[0090] The processing block 85 includes four towers TW1 to TW4 and a center robot CR.

[0091] The tower TW1 is disposed behind the indexer block 83 in the X direction. The tower TW1 is disposed adjacent to the indexer block 83. The tower TW1 includes processing chambers-MPCs stacked in the vertical direction Z. The tower TW1 includes, for example, three processing chambers-MPCs. The processing chambers-MPCs process substrates W one by one. The processing chambers-MPCs in the vertical direction Z perform, for example, a drying process on the substrates W.

[0092] Tower TW2 is disposed behind tower TW1 at X. Tower TW2 is disposed adjacent to tower TW1. Tower TW2 has the same configuration as tower TW1. That is, tower TW2 has three processing chambers-MPC stacked in the vertical direction Z.

[0093] Tower TW3 is disposed to the left Y of tower TW2. Tower TW3 is disposed to the left Y of tower TW2, with the center robot CR in between. Tower TW3 has the same configuration as towers TW1 and TW2. In other words, tower TW3 has three processing chambers MPC stacked in the vertical direction Z.

[0094] Tower TW4 differs in part in configuration from towers TW1 to TW4. That is, tower TW4 is provided with processing chambers-MPC at the bottom and top in the vertical direction Z. Tower TW4 is provided with a transfer section 93 in the center in the vertical direction Z. A single substrate W is placed on the transfer section 93. The transfer section 93 is provided with lifting pins 93a. The lifting pins 93a are raised and lowered when receiving a substrate W from the bridge robot BR. A single substrate W is placed on the transfer section 93 from the bridge robot BR. The placed substrate W is received by the center robot CR at the transfer section 93.

[0095] The center robot CR is configured to be movable in the front-rear direction X. The center robot CR is equipped with a hand 95. The hand 95 moves up and down in the vertical direction Z. The hand 95 is configured to be rotatable within a plane including the front-rear direction X and the width direction Y. The hand 95 is moved so as to be able to access the processing chambers-MPC and the delivery part 93 of the towers TW1 to TW4. In other words, the center robot CR can freely move the hand 95 in the vertical direction Z, the front-rear direction X, and the width direction Y. The center robot CR delivers the processed substrate W to the indexer robot 83.

[0096] <13. Control System>

[0097] Here, reference is made to Fig. 10. Fig. 10 is a block diagram showing the control system.

[0098] The substrate processing apparatus 1 includes a control unit 101. The control unit 101 includes a CPU and a memory. The control unit 101 is configured with electronic circuits. The control unit 101 operates the above-mentioned components according to a pre-stored program. The control unit 101 is connected to an operation unit 103. The operation unit 103 is attached, for example, to the front X of the batch processing apparatus 3 as shown in FIG. 1. The operation unit 103 is configured, for example, with a keyboard, a pointing device, and a display unit or a touch-type display panel. The operation unit 103 is operated by an operator of the substrate processing apparatus 1. The operator operates the operation unit 103 to, for example, specify a desired recipe for each lot. The operator operates the operation unit 103 to, for example, specify a desired combination of processing surfaces for a batch lot. As described above, there are two types of combination of processing surfaces: front surface matching (also called face to face) and front and back surface matching (also called face to back).

[0099] The control unit 101 is connected to a recipe storage unit 105. The recipe storage unit 105 is configured with a memory. The recipe storage unit 105 stores recipes that define how to process each lot. The recipes can also be edited by an operator via the operation unit 103. The method of combining processing surfaces for the batch lot described above is associated with the recipe, for example. In other words, when a recipe is specified for each lot by the operation unit 103, front surface matching or front / rear surface matching is specified for the batch lot that combines lots.

[0100] In a configuration in which the substrate processing apparatus 1 is connected to a network within a factory, the combination of processing surfaces for a batch lot may be specified in advance by a host computer (not shown). The host computer (not shown) can comprehensively manage not only the substrate processing apparatus 1 but also all the equipment within the factory and clean room. In addition, a recipe for each lot may be specified in advance by the host computer.

[0101] The control unit 101 operates the rotation mechanism 65 in the posture conversion block 15 in accordance with the recipe of the batch lot, i.e., the combination of processing surfaces for the batch lot. Details of this will be described later.

[0102] <14. Operation explanation>

[0103] An example of processing performed by the substrate processing apparatus 1 will be described with reference to FIGS.

[0104] First, the overall flow of processing will be roughly described.

[0105] <15. Batch Processing>

[0106] A carrier C containing a plurality of unprocessed substrates W is placed in the loading unit 19. At this time, for example, an operator can operate the operation unit 103 to specify a recipe for the lot of the carrier C as needed. Here, it is assumed that a recipe has already been specified for the carrier C, and that a method for combining processing surfaces for the batch lot has also been specified. That is, a recipe is associated with the carrier C that constitutes the lot, and a method for combining processing surfaces for the batch lot is associated with the recipe. In other words, the method for assembling the batch lot is associated with the recipe. The recipe and the method for combining processing surfaces for the batch lot are referenced by the control unit 101. The control unit 101 refers to the recipe storage unit 105 and operates each unit based on the corresponding recipe. In particular, the control unit 101 operates the attitude conversion unit 41 of the attitude conversion block 15 based on the method for combining the batch lots associated with the recipe. As will be described in detail later, the control unit 101 operates the rotation mechanism 65 of the attitude conversion block 15 depending on the orientation of the processing surfaces of the substrates W that constitute the lot.

[0107] The transport mechanism 23 loads the carrier C into the stocker block 11. Two sets of substrates W are assembled into a batch lot by the first transport mechanism HTR and the transfer mechanism CTC. The substrates W constituting the batch lot are transported by the second transport mechanism WTR to the processing block 17. In the processing block 17, for example, a phosphoric acid etching process is performed in the second batch processing unit BPU2. The substrates W constituting the batch lot are then subjected to a pure water cleaning process in the first batch processing unit BPU1. The substrates W constituting the batch lot are then transported by the second transport mechanism WTR to the orientation conversion block 15. In the orientation conversion block 15, only one of the batch lots is transported to the orientation conversion bath 33. In the orientation conversion bath 33, the vertically oriented substrates W of only one of the batch lots are converted to a horizontal orientation in the liquid. The substrates W constituting one of the batch lots are then transported one by one to the single-wafer processing apparatus 5. Thereafter, the other lot of the batch is similarly changed in position and then transported to the single-wafer processing apparatus 5.

[0108] <16. Single-Wafer Processing>

[0109] The substrate W, which has been converted to a horizontal position, is transported to the single-wafer processing apparatus 5 by the bridge robot BR. Specifically, the substrate W is placed on the transfer section 93. The substrate W placed on the transfer section 93 is received by the center robot CR. The center robot CR loads the substrate W, for example, into a processing chamber MPC of the tower TW1. In the processing chamber MPC, for example, a drying process is performed on the substrate W. Specifically, for example, pure water is supplied to the substrate W while the substrate W is being rotated. Then, IPA is supplied to the substrate W to replace the pure water in the substrate W with IPA. The substrate W is then rotated at high speed to dry it. Furthermore, if necessary, a drying process using carbon dioxide as a supercritical fluid is preferably performed in another processing chamber MPC. The substrate W is subjected to a finish drying process by the drying process using the supercritical fluid. This completely dries the substrate W while preventing the collapse of the pattern formed on the substrate W.

[0110] The substrate W for which the drying process has been completed is carried out to the unloading section 87 by the center robot CR and the indexer robot IR. The indexer robot IR stores the substrate W in a carrier C placed in the unloading section 87. Subsequent substrates W that constitute the same lot to be processed are stored in the same carrier C.

[0111] <17. Posture conversion processing>

[0112] The above is a rough outline of the processing flow by the substrate processing apparatus 1. Next, the posture change will be described.

[0113] After batch processing, the plurality of substrates W constituting the batch lot are transferred by the second transport mechanism WTR to the lifter LF0 in the standby tank 31. The lifter LF0 moves the plurality of substrates W constituting the batch lot to a standby position inside the standby tank 31. Since the plurality of substrates W constituting the batch lot wait in this state, drying can be prevented. In other words, patterns formed on the substrates W after batch processing can be prevented from collapsing.

[0114] The 25-substrate chuck TFC is positioned, for example, at the second transfer position P2. The 25-substrate chuck TFC releases the hand 35. That is, the 25-substrate chuck TFC has the hand 35 at the passing position PT (see FIG. 5). The lifter LF0 is raised to the transfer position above the liquid level in the standby tank BB0. At this time, since the hand 35 of the 25-substrate chuck TFC is at the passing position PT, the multiple substrates W can pass between the 25-substrate chucks TFC and rise. At the same time, the posture changing unit 41 in the posture changing tank 33 raises the inverted chuck 43 to the receiving height HP1 (see FIG. 8).

[0115] The 25-substrate chuck TFC closes the hand 35. That is, the hand 35 of the 25-substrate chuck TFC is set to the holding position PC (see FIG. 5). In this state, the lifter LF0 is lowered to the standby position. As a result, of the multiple substrates W of the batch lot placed on the lifter LF0, only the multiple even-numbered substrates W that constitute one lot are placed on the 25-substrate chuck TFC. Of the multiple substrates W of the batch lot placed on the lifter LF0, the multiple odd-numbered substrates W that constitute another lot are lowered together with the lifter LF0 into the standby tank BB0. As a result, the hand 35 of the 25-substrate chuck TFC is set to the first transfer position PT1, and the odd-numbered substrates W can be placed on standby in a state where they are prevented from drying until they are moved to the posture conversion tank 33. This also prevents pattern collapse due to drying of the multiple substrates W that constitute another lot.

[0116] 5, the five-substrate chuck TFC advances the hand 35 to the right Y to the third transfer position P3. At this time, as shown in FIG. 8, the inverting chuck 43 is positioned at the receiving height HP1, so that no interference with the substrate W occurs.

[0117] The inverting chuck 43 is spaced at a first distance WD1 (see FIG. 6). In this state, the inverting chuck 43 is lowered toward the plurality of substrates W placed on the 25-substrate chuck TFC. Specifically, as shown in FIG. 8, the inverting chuck 43 is lowered to a clamping height HP2. The plurality of substrates W are accommodated in the inverting chuck 43.

[0118] The inverting chuck 43 is set to a second width WD2 (see FIG. 7). This clamps the substrate W accommodated in the inverting chuck 43. Furthermore, as shown in FIG. 8, the inverting chuck 43 is raised to a locking height HP3. This causes the lower edge portion of the end face of the substrate W clamped by the inverting chuck 43, which is lower than the sides, to abut and lock. Note that with the inverting chuck 43 temporarily raised to the receiving height HP1, the 25-substrate chuck TFC is moved to a second transfer position P2. This makes the 25-substrate chuck TFC ready to receive the multiple substrates W that make up another lot placed on the lifter LF0.

[0119] As shown in Fig. 8, the inversion chuck 43 is lowered to an immersion height HP4. As a result, the plurality of substrates W held by the inversion chuck 43 are immersed in the processing liquid in the immersion tank DB. The plurality of substrates W are entirely submerged in the processing liquid in the immersion tank DB. In the attitude changing block 15, the plurality of substrates W that make up one lot are exposed from the liquid only for a short period of time, from when they are raised from the standby tank BB0 until they are immersed in the immersion tank DB.

[0120] For example, the inversion chuck 43 is rotated 90°. More specifically, in this example, it is rotated 90° counterclockwise. The direction of rotation can be determined depending on the direction in which the processing surface (front surface) of the substrate W is positioned. In other words, the direction of rotation can be determined so that the processing surface of the substrate W faces upward. As a result, the multiple substrates W are converted into a horizontal position.

[0121] The inverting chuck 43 is raised. Specifically, the inverting chuck 43 is raised so that only the substrate W clamped in the uppermost groove 47 of the inverting chuck 43 is exposed from the liquid in the immersion tank DB. The height of the inverting chuck 43 is set to a height that allows the hand 71 of the bridge robot BR to enter a position slightly below the underside of the substrate W exposed from the liquid.

[0122] The hand 71 of the bridge robot BR is advanced into the posture changing section 41. The hand 71 advances to a position slightly below and spaced apart from the lower surface of the substrate W.

[0123] The inverting chuck 43 is moved downward. By the movement of the inverting chuck 43, the substrate W is transferred to the hand 71.

[0124] The bridge robot BR moves the hand 71 to the right Y and removes the uppermost substrate W from the inverting chuck 43 .

[0125] The bridge robot BR rotates the hand 71 to position the substrate W to the right Y. Specifically, the hand 71 rotates to move the substrate W toward the delivery section 93. Then, one substrate W is delivered to the delivery section 93.

[0126] By the operation of the posture changing block 15 described above, one substrate W is transported from the batch processing apparatus 3 to the single wafer processing apparatus 5 in a horizontal posture.

[0127] <18. Detailed operation of posture conversion processing>

[0128] Here, the detailed operation of the above-mentioned posture conversion process will be explained. Hereinafter, reference will be made to Fig. 11 and Fig. 12. Fig. 11(a) to (d) and Fig. 12(a) to (d) are schematic diagrams showing an example of posture conversion in a face-to-face batch lot. Here, the batch lot BL1 described with reference to Fig. 3 will be used as an example. Batch lot BL1 is a combination of lots LT1 and LT2 in a face-to-face FTF.

[0129] 11(a) and 11(b), the 25-substrate chuck TFC receives, for example, a plurality of substrates W constituting lot LT1 from the batch lot BL1 held by the lifter LF0. Each substrate W constituting lot LT1 has its processing surface facing, for example, to the right Y. Next, as shown in FIG. 11(c), the inverting chuck 45 receives each substrate W constituting lot LT1 from the 25-substrate chuck TFC.

[0130] Next, the control unit 101 operates the rotation mechanism 65 based on the combination of lots associated with the recipe at this time. In this case, since the batch lot BL1 is a surface-matching FTF, the control unit 101 can know in which direction the processing surface of each substrate W constituting the lot LT1 faces when held by the inversion chuck 43. The control unit 101 operates the rotation mechanism 65 so that the processing surface faces upward.

[0131] 11(d), the control unit 101 rotates the rotation mechanism 65 counterclockwise by a predetermined angle when viewed from the rear X. The predetermined angle is, for example, 90 degrees. That is, the control unit 101 rotates the rotation mechanism 65 by 90 degrees in one direction.

[0132] The control unit 101 performs posture change on the remaining lot LT2 of the batch lot BL1. Specifically, as shown in Figures 12(a) and 12(b), the 25-substrate chuck TFC receives the multiple substrates W that make up lot LT2 held by the lifter LF0. Next, as shown in Figure 12(c), the inverting chuck 45 receives each substrate W that makes up lot LT2 from the 25-substrate chuck TFC. The processing surface of lot LT2 faces leftward Y.

[0133] Next, the control unit 101 operates the rotation mechanism 65 so that the processing surface of the lot LT2 faces upward. Specifically, as shown in FIG. 12(d), the control unit 101 rotates the rotation mechanism 65 clockwise by a predetermined angle when viewed from the rear X. The predetermined angle is, for example, 90 degrees. In other words, the control unit 101 rotates the rotation mechanism 65 by 90 degrees in the other direction, which is opposite to the one direction.

[0134] The correspondence between the present invention and each of the components in the above-described embodiment is as follows:

[0135] The batch processing apparatus 3 corresponds to the "batch processing section" in the present invention. The single wafer processing apparatus 5 corresponds to the "single wafer processing section" in the present invention. The posture change tank 33 corresponds to the "posture change section" in the present invention. The 25-piece chuck TFC corresponds to the "first transport section" in the present invention. The bridge robot BR corresponds to the "second transport section" in the present invention. The drive mechanism 63 corresponds to the "opening / closing drive mechanism" in the present invention. The rotation mechanism 65 corresponds to the "rotation drive mechanism" in the present invention. The first distance WD1 corresponds to the "open position" in the present invention. The second distance WD2 corresponds to the "holding position" in the present invention.

[0136] According to this embodiment, the control unit 101 operates the drive mechanism 63 to hold multiple substrates W in a vertical position on the inversion chuck 43. Thereafter, when converting the position of the multiple substrates W from a vertical position to a horizontal position, the control unit 101 operates the rotation mechanism 65 so that the processing surfaces of the multiple substrates W face upward. Therefore, regardless of the orientation of the processing surfaces of the substrates W, the position can be normally converted so that the processing surfaces of the multiple substrates W face upward.

[0137] Furthermore, the processing surfaces of the multiple substrates W in the vertical position are oriented in one direction or the other. Therefore, the control unit 101 can orient the processing surfaces of the multiple substrates W upward by operating the rotation mechanism 65 to rotate the substrates 90 degrees in one direction or the other direction depending on the orientation of the processing surfaces.

[0138] 4, that is, when the target of attitude change is batch lot BL2 having a front-to-back surface facing FTB with its processing surface facing leftward Y, the control unit 101 first operates the rotation mechanism 65 to rotate the substrates W of lot LT1 by 90 degrees in one direction so that the processing surfaces of the substrates W face upward. Next, the control unit 101 operates the rotation mechanism 65 to rotate the substrates W of lot LT2 by 90 degrees in one direction so that the processing surfaces of the substrates W face upward. Furthermore, when the processing surfaces of the substrates W of batch lot BL2 face rightward Y, the control unit 101 operates the rotation mechanism 65 to rotate the substrates W by 90 degrees in the other direction so that the processing surfaces of the substrates W face upward.

[0139] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0140] (1) In the above-described embodiment, the control unit 101 operates the rotation mechanism 65 in opposite directions for lots BL1 and BL2 when changing the posture of batch lot BL1. However, the present invention is not limited to this type of rotation control. For example, the rotation mechanism 65 may be operated as follows.

[0141] Here, reference is made to Fig. 13. Fig. 13(a) to (d) are schematic diagrams showing other examples of posture transformation.

[0142] In the example described above, the control unit 101 operates the rotation mechanism 65 in one direction or the opposite direction depending on the orientation of the processing surfaces of the lots LT1 and LT2. However, the control unit 101 may also operate the rotation mechanism 65 as follows.

[0143] The control unit 101 also operates the rotation mechanism 65 for lot LT2 to rotate it in only one direction. That is, the control unit 101 operates the rotation mechanism 65 for lot LT1 to rotate it in one direction by a first angle. The first angle is, for example, 90 degrees. The control unit 101 also operates the rotation mechanism 65 for lot LT2 to rotate it in one direction by a second angle so that the processing surfaces of the substrates W face upward. The second angle is larger than the first angle. The second angle is, for example, 270 degrees. That is, the control unit 101 rotates the rotation mechanism 65 in only the same direction so that the processing surfaces of the substrates W face upward, regardless of whether the lot is LT1 or LT2.

[0144] In this way, the control unit 101 can operate the rotation drive mechanism 65 to rotate it 90 degrees or 270 degrees in one direction, so that the processing surfaces of the plurality of substrates W face upward. This simplifies the control of the drive mechanism 65 by the control unit 101.

[0145] (2) In the above-described embodiment, the substrate processing apparatus 1 includes one control unit 101, which controls each unit in an integrated manner. However, the present invention is not limited to this control method. Reference is now made to FIG. 14, which is a block diagram showing a modified example of the control system.

[0146] That is, the substrate processing apparatus 1A is equipped with a control unit 101 that controls the entire apparatus, a sub-control unit 101A that controls the batch processing apparatus 3, a sub-control unit 101B that controls the posture conversion block 15, and a sub-control unit 101C that controls the single-wafer processing apparatus 5.

[0147] With this configuration, the control unit 101 transmits information about recipes for each lot to the sub-control units 101A, 101B, and 101C. The control unit 101 also transmits information about how to combine processing surfaces for a batch lot. The sub-control unit 101A controls the rotational and linear movements of the pusher PH in the posture conversion block 13, for example, in accordance with the recipes for the lots that make up the batch lot received from the control unit 101. The sub-control unit 101B controls the rotational direction and angle of the rotation mechanism 65, for example, in accordance with the recipes for the lots that make up the batch lot received from the control unit 101. The sub-control unit 101C controls each of the towers TW1 to TW3, for example, in accordance with the recipes for the lots that make up the batch lot received from the control unit 101.

[0148] With this configuration, the load on the control unit 1010 can be distributed by the sub-control units 101A, 101B, and 101C, and therefore the load on the control unit 101 can be reduced.

[0149] (3) In the above-described embodiment, the reversing chuck 43 includes a pair of chuck members 45. However, the reversing chuck 43 of the present invention is not limited to this configuration.

[0150] (4) In the above-described embodiment, the posture changing tank 33 changes the postures of multiple substrates W in pure water. However, the present invention does not require posture changing in liquid. That is, the posture changing tank 33 may change the postures of multiple substrates W in an atmosphere such as air or nitrogen gas. In this case, since there is less resistance during rotation, the posture changing speed can be increased, and throughput can be improved.

[0151] (5) In the above-described embodiment, the substrate processing apparatus 1 is configured such that the batch processing apparatus 3 and the single wafer processing apparatus 5 are connected by the bridge section 7. However, the present invention can also be applied to a single substrate processing apparatus 1 that includes the batch processing apparatus 3 and the single wafer processing apparatus 5 in the same housing. [Explanation of symbols]

[0152] 1... Substrate processing equipment W: Substrate 3... Batch processing equipment 5... Single wafer processing equipment 7 … Bridging Section 7 9... Loading block 11... Stocker block 13...Transfer block 15... Posture change block 17 ... Processing block 19 … Input section C...Career BPU: Batch processing unit BB: Treatment tank LF... Lifter TFC... 25-piece zipper 31 … Standby tank 33... Posture change tank BB0: Treatment tank LF0 ... Lifter DB … Immersion tank 41 ... Posture conversion unit 43... Reversing chuck WD1...first interval WD2: Second interval 45 ... Chuck member 47 ... Groove 61 ... Lifting mechanism 61a ... Base member 61b ... Lifting motor 63 ... Drive mechanism 63a ... Air cylinder 63b … Moving piece 63c ... arm pull-ups 65... Rotation mechanism 65a … Rotating axis 65b ... Motor AX1 … Axis core HP1 … Acceptance height HP2: Clamping height BR... Bridge Robot 81 ... Carry-out block 83 ... Indexer block 85 ... Processing block 87 ... Unloading section IR... Indexer robot TW1~TW4 ... Tower CR... Center robot 93 … Delivery department 101 ... Control unit 103...Operation unit 105... Recipe memory section

Claims

1. In a posture changing device for changing the posture of a plurality of substrates, an inversion chuck for holding a plurality of substrates; an opening / closing drive mechanism that drives the inversion chuck in a radial direction of the substrates between an open position for transferring the plurality of substrates between the inversion chuck and the opening / closing drive mechanism and a holding position for holding the plurality of substrates by the inversion chuck; a rotation drive mechanism that drives the inversion chuck around a horizontal axis to convert the orientation of the plurality of substrates from a vertical orientation to a horizontal orientation; a control unit that operates the opening / closing drive mechanism to hold the plurality of substrates in a vertical position on the inversion chuck, and then, when converting the position of the plurality of substrates from the vertical position to a horizontal position, operates the rotation drive mechanism in accordance with the orientation of the processing surfaces of the plurality of substrates in the vertical position, and displaces the rotation angle of the inversion chuck about a horizontal axis, so that the processing surfaces of the plurality of substrates in the horizontal position face upward; A posture change device comprising:

2. The attitude change device according to claim 1, The control unit is characterized in that it operates the rotation drive mechanism to rotate the substrates in either one direction or the opposite direction depending on the orientation of the processing surfaces of the substrates.

3. The attitude change device according to claim 1, The position changing device is characterized in that the control unit operates the rotation drive mechanism to rotate the substrates in only one direction depending on the orientation of the processing surfaces of the substrates.

4. The attitude change device according to claim 1, The posture changing device is characterized in that the inversion chuck holds only both side surfaces of the plurality of substrates in a direction perpendicular to a direction in which the plurality of substrates are transferred.

5. 5. The posture change device according to claim 1, The attitude changing device is characterized in that the control unit operates the rotation drive mechanism based on a recipe that defines how the plurality of substrates are to be processed.

6. The attitude change device according to claim 5, The control unit is an attitude change device characterized in that it operates the rotation drive mechanism according to the combination of processing surfaces, that is, the direction in which the processing surfaces should face in a batch lot consisting of a combination of a certain number of substrates and another number of substrates in the recipe.

7. In a substrate processing apparatus for processing a substrate, a batch processing unit that processes a plurality of substrates in a vertical position at once; a single-substrate processing unit that processes a single substrate in a horizontal position; a posture changing unit that changes the posture of the plurality of substrates that have been processed in the batch processing unit from a vertical posture to a horizontal posture; a first transfer unit that transfers the plurality of substrates that have been processed in the batch processing unit to the attitude changing unit; a second transport unit that transports the plurality of substrates that have been placed in a horizontal position by the position conversion unit to the single-wafer processing unit; Equipped with The posture conversion unit is an inversion chuck for holding the plurality of substrates; an opening / closing drive mechanism that drives the inversion chuck in a radial direction of the substrates between an open position for transferring the plurality of substrates between the inversion chuck and the opening / closing drive mechanism and a holding position for holding the plurality of substrates by the inversion chuck; a rotation drive mechanism that drives the inversion chuck around a horizontal axis to convert the orientation of the plurality of substrates from a vertical orientation to a horizontal orientation; Equipped with a control unit that operates the opening / closing drive mechanism to hold the substrates in a vertical position on the inversion chuck after processing the substrates in the batch processing unit and before transporting the substrates to the single-wafer processing unit, and then, when converting the position of the substrates from a vertical position to a horizontal position, operates the rotation drive mechanism in accordance with the orientation of the processing surfaces of the substrates in the vertical position, and displaces the rotation angle of the inversion chuck about the horizontal axis, so that the processing surfaces of the substrates in the horizontal position face upward.

Images