Holding jig, storage cassette, manufacturing method of holding jig, and manufacturing method of chip

Abstract

To enable a workpiece to be carried out of a holding table easily, without lowering the productivity of chips which are manufactured by dividing the workpiece.SOLUTION: A holding jig is constructed such that an attracting force occurring from the holding table of a laser processing device acts upon a workpiece which is placed on the upper surface of a holding plate. Since this holding jig is a structure independent from the holding table, it can be carried out of the holding table while the workpiece is placed on the upper surface of the holding plate. For this reason, as long as the workpiece is held in place using this holding jig, the workpiece does not need to be integrated with an annular frame via an adhesive tape in order to facilitate handling, as when carried out of the holding table, a plurality of chips which are manufactured by dividing the workpiece. As a result, it is easy to carry the workpiece out of the holding table without lowering the productivity of chips which are manufactured by dividing the workpiece.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a holding jig used to hold a workpiece on a holding table of a laser processing machine, a storage cassette for storing this holding jig, and a method for manufacturing this holding jig. [Background technology]

[0002] Chips for devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) are essential components in various electronic devices such as mobile phones and personal computers. These chips are manufactured by dividing a workpiece such as a wafer having many devices formed on its surface along the boundaries (planned division lines) of areas containing individual devices.

[0003] The workpiece is divided, for example, by irradiating a laser beam of a wavelength absorbed by the workpiece along the intended division lines while held on a holding table of a laser processing device so that laser ablation occurs. Prior to division, the workpiece is often integrated with an annular frame via adhesive tape to facilitate handling (e.g., removal from the holding table) of the multiple chips produced by dividing the workpiece.

[0004] In order to divide a workpiece by irradiating it with a laser beam, it is necessary to irradiate the workpiece along the intended division line so that the laser beam extends beyond the outer edge of the workpiece. Therefore, if the workpiece is integrated with an annular frame via adhesive tape, the laser beam will be directly irradiated onto a portion of the adhesive tape that is slightly outside the outer edge of the workpiece.

[0005] In this case, the adhesive tape may be welded to the surface (holding surface) of the holding table as the heat is absorbed by the holding table and the adhesive tape is cooled. If the adhesive tape is welded to the holding table, it may become difficult to remove the workpiece from the holding table.

[0006] In view of this, it has been proposed to provide a guard member on the outside of the workpiece that is integrated with the annular frame via adhesive tape prior to dividing the workpiece using a laser beam (see, for example, Patent Document 1). This prevents the adhesive tape from welding to the holding table, making it easier to remove the workpiece from the holding table. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-188755 Summary of the Invention [Problem to be solved by the invention]

[0008] However, providing a guard member in this manner reduces the productivity of chips produced by dividing the workpiece. In view of this, an object of the present invention is to facilitate the removal of the workpiece from the holding table without reducing the productivity of chips produced by dividing the workpiece. [Means for solving the problem]

[0009] According to one aspect of the present invention, there is provided a holding jig used to hold a workpiece on a holding table of a laser processing apparatus that performs laser processing by irradiating a laser beam onto a workpiece having devices formed in each of a plurality of regions defined by planned division lines set in a grid pattern, the holding jig comprising: a holding plate having grid-like grooves formed on an upper surface thereof and having through holes formed in each of the plurality of regions defined by the grooves; and a frame having recesses formed on an upper surface thereof into which the holding plate is fitted and having communication passages formed therein that connect the through holes formed in the holding plate fitted in the recesses to the outside; and the workpiece is placed on the upper surface of the holding plate so that the planned division lines overlap the grooves, and the workpiece is held on the holding table by applying a suction force generated from the holding table via the through holes formed in the holding plate fitted in the recesses and the communication passages formed in the frame. A structure independent of the holding table. A holding jig is provided.

[0010] Furthermore, it is preferable that the holding jig of the present invention further comprises a porous plate, and the suction force generated from the holding table acts on the workpiece through the porous plate arranged between the lower surface of the holding plate fitted into the recess and the bottom surface of the recess.

[0011] The support plate is preferably made of an inorganic material.

[0012] Furthermore, it is preferable that the communication passage formed in the frame body is provided with a check valve that prevents fluid from flowing from the outside of the frame body to the through hole formed in the retaining plate fitted in the recess.

[0013] According to another aspect of the present invention, there is provided a storage cassette for storing the above-mentioned holding jig, comprising: a main body having a top plate, a pair of side walls, and a bottom plate; a storage shelf connected to the inner surfaces of each of the pair of side walls and for storing the holding jig; and a suction source for generating suction force, wherein the storage shelf has a suction path formed therein that connects the suction source to the communication path formed in the frame body of the holding jig stored in the storage shelf.

[0014] According to yet another aspect of the present invention, there is provided a method for manufacturing a holding jig used to hold a workpiece on a holding table of a laser processing apparatus that performs laser processing by irradiating a laser beam onto the workpiece, the workpiece having devices formed in each of a plurality of regions defined by planned division lines set in a grid pattern, the method comprising: a groove forming step of forming grooves in a grid pattern on an upper surface of a holding plate; a through hole forming step of forming through holes in each of the plurality of regions defined by the grooves of the holding plate; a preparation step of preparing a frame having recesses formed on an upper surface thereof and having communication passages formed therein that connect the internal spaces of the recesses to the outside; and a fitting step of fitting the holding plate into the recesses so that the through holes communicate with the outside via the communication passages. The holding jig is a structure independent from the holding table. A method for manufacturing a holding jig is provided. Alternatively, according to yet another aspect of the present invention, there is provided a method for manufacturing chips, comprising: using the above-mentioned holding jig to hold the workpiece on the holding table; and irradiating the workpiece with the laser beam along the intended division line to divide the workpiece. [Effects of the Invention]

[0015] The holding jig of the present invention is configured to apply a suction force generated from the holding table of the laser processing machine to a workpiece placed on the upper surface of the holding plate. Furthermore, since this holding jig is a structure independent of the holding table, it can be carried out from the holding table with the workpiece placed on the upper surface of the holding plate.

[0016] Therefore, when a workpiece is held using the holding jig of the present invention, it is not necessary to integrate the workpiece with the annular frame via adhesive tape in order to facilitate handling (e.g., carrying out from the holding table) of the multiple chips produced by dividing the workpiece, i.e., in this case, adhesive tape and annular frame are not required.

[0017] As a result, by using the holding jig of the present invention, it becomes easy to remove the workpiece from the holding table without reducing the productivity of the chips produced by dividing the workpiece. [Brief explanation of the drawings]

[0018] [Figure 1]FIG. 1(A) is a perspective view that schematically shows an example of a holding jig, and FIG. 1(B) is a cross-sectional view that schematically shows an example of the holding jig. [Figure 2] FIG. 2 is an exploded perspective view schematically showing an example of a holding jig. [Figure 3] FIG. 3 is an exploded cross-sectional view schematically showing an example of a holding jig. [Figure 4] FIG. 4 is a flowchart schematically illustrating an example of a method for manufacturing a holding jig. [Figure 5] FIG. 5 is a perspective view schematically showing an example of a holding jig on which a workpiece is placed. [Figure 6] Figure 6(A) is a perspective view schematically showing the front side of an example of a storage cassette that stores a holding jig, and Figure 6(B) is a perspective view schematically showing the rear side of an example of a storage cassette that stores a holding jig. [Figure 7] Figure 7(A) is a perspective view showing a storage shelf provided in the storage space of a storage cassette, and Figure 7(B) is a perspective view showing a storage shelf that stores a holding jig with a workpiece placed on it. [Figure 8] FIG. 8(A) is a perspective view that schematically shows an example of a laser processing device, and FIG. 8(B) is a perspective view that schematically shows how a laser beam is irradiated onto a workpiece in the laser processing device. [Figure 9] FIG. 9 is a perspective view schematically showing another example of the holding jig. DETAILED DESCRIPTION OF THE INVENTION

[0019] Embodiments of the present invention will be described with reference to the accompanying drawings. Fig. 1(A) is a perspective view schematically showing an example of a holding jig, and Fig. 1(B) is a cross-sectional view schematically showing an example of the holding jig. Fig. 2 is an exploded perspective view schematically showing an example of the holding jig. Fig. 3 is an exploded cross-sectional view schematically showing an example of the holding jig.

[0020] 1(A), 1(B), 2, and 3 has a frame 4 made of, for example, ceramics, with a cylindrical recess 4a formed on the upper surface side. Specifically, the frame 4 has a disk-shaped bottom plate 4b and an annular side wall 4c erected from the outer edge of the bottom plate 4b, and a space with an open top (the internal space of the recess 4a) is enclosed by the bottom plate 4b and the side wall 4c.

[0021] Furthermore, a cylindrical recess 4d is formed on the upper surface of the bottom plate 4b. A communication passage 4e is formed in the center of the bottom plate 4b, opening at the bottom surface of the recess 4d and penetrating the bottom plate 4b. This communication passage 4e connects the internal space of the recess 4a to the outside. Furthermore, this communication passage 4e is provided with a check valve 6 that blocks the flow of fluid from below to above the bottom plate 4b.

[0022] Furthermore, a disk-shaped porous plate 8 made of, for example, ceramics and a disk-shaped holding plate 10 made of, for example, an inorganic material such as silicon (Si) are provided in the recess 4a of the frame 4. This porous plate 8 has a diameter roughly the same as the inner diameter of the recess 4a, and is fitted into the recess 4a of the frame 4 so that its lower surface contacts the annular region on the upper surface of the bottom plate 4b that surrounds the recess 4d.

[0023] The holding plate 10 has a diameter approximately equal to the inner diameter of the recess 4a, and is fitted into the recess 4a of the frame 4 so that its lower surface is in contact with the upper surface of the porous plate 8. The sum of the thicknesses of the porous plate 8 and the holding plate 10 is approximately equal to the depth of the recess 4a of the frame 4 (the height of the side wall 4c). In other words, the upper surface of the holding plate 10 and the side wall 4c of the frame 4 are positioned on approximately the same plane.

[0024] Furthermore, a grid-like groove 10a is formed on the upper surface of the holding plate 10. The grooves 10a are formed to correspond to planned dividing lines set on the workpiece, which will be described later. Furthermore, through holes 10b are formed in each of the multiple regions defined by the grooves 10a of the holding plate 10.

[0025] When the porous plate 8 and the holding plate 10 are fitted into the recess 4a of the frame 4, the through-hole 10b of the holding plate 10 communicates with the outside via the recess 4d and the communication passage 4e formed in the porous plate 8 and the frame 4. However, as described above, since the communication passage 4e is provided with the check valve 6, the flow of fluid from the through-hole 10b of the holding plate 10 to the outside via the porous plate 8 etc. is not obstructed, but the flow of fluid in the reverse direction is obstructed.

[0026] The holding plate 10 needs to have grooves 10a and through holes 10b formed therein so as to correspond to planned dividing lines set on the workpiece, which will be described later. Therefore, the holding jig 2 may be distributed on the market in a state including a disk-shaped holding plate without grooves 10a and through holes 10b formed therein, and the other components described above.

[0027] The holding jig 2 in this state is manufactured by the customer by forming the grooves 10a and through holes 10b as desired. Figure 4 is a flowchart schematically showing an example of a method for manufacturing a holding jig in which the customer manufactures the holding jig 2 by forming the grooves 10a and through holes 10b in the holding plate 10.

[0028] In this method, first, grooves 10a are formed in a grid pattern on the upper surface of the holding plate 10 (groove forming step: S1). This groove forming step (S1) is performed using, for example, a known cutting device. Next, through holes 10b are formed in each of the multiple regions defined by the grooves 10a of the holding plate 10 (through hole forming step: S2). This through hole forming step (S2) is performed using, for example, a known laser processing device. Next, the frame 4 and the porous plate 8 are prepared (preparation step: S3).

[0029] Next, the holding plate 10 is fitted into the recess 4a formed on the upper surface of the frame 4 so that the through-holes 10b communicate with the outside via the recess 4d and communication passage 4e formed in the porous plate 8 and the frame 4 (fitting step: S4). This fitting step (S4) is performed, for example, manually. By the above steps, it is possible to manufacture the holding jig 2 including the holding plate 10 in which the grooves 10a and the through-holes 10b are formed so as to correspond to the planned dividing lines set in the workpiece, which will be described later.

[0030] Fig. 5 is a perspective view schematically showing the holding jig 2 with a workpiece placed thereon. The workpiece 11 shown in Fig. 5 is a wafer made of a semiconductor material such as silicon (Si), silicon carbide (SiC), or gallium nitride (GaN). The workpiece 11 is divided into a plurality of regions by grid-like dividing lines 13, and a device 15 such as an IC or LSI is formed on the surface 11a of each region.

[0031] Furthermore, a notch 11b indicating a specific crystal orientation of the semiconductor material constituting the workpiece 11 is formed on the side of the workpiece 11. There are no limitations on the material, shape, structure, size, etc. of the workpiece 11. For example, the workpiece 11 may be a substrate made of a material such as ceramic, resin, or metal. Similarly, there are no limitations on the type, number, shape, structure, size, arrangement, etc. of the devices.

[0032] The workpiece 11 is placed on the upper surface of the holding plate 10 so that the planned dividing lines 13 overlap the grooves 10a and the center of the workpiece 11 overlaps the center of the holding plate 10. In the holding jig 2, the diameter of the holding plate 10 is designed to be slightly longer than the diameter of the workpiece 11. Specifically, the holding plate 10 is designed to have a shape such that, when the workpiece 11 is placed on its upper surface, the end portions of the grooves 10a are exposed but the through holes 10b are not exposed.

[0033] Fig. 6(A) is a perspective view schematically showing the front side of an example of a storage cassette that stores the holding jig 2, and Fig. 6(B) is a perspective view schematically showing the rear side of an example of a storage cassette that stores the holding jig 2. The storage cassette 12 shown in Fig. 6(A) and Fig. 6(B) has a rectangular parallelepiped top plate 12a.

[0034] A handle 12b is provided on the upper surface of the top plate 12a to be grasped by an operator when transporting the storage cassette 12. A rectangular parallelepiped rear wall 12c is provided below the rear end of the top plate 12a, and rectangular parallelepiped side walls 12d and 12e are provided below each of its two sides. A rectangular parallelepiped bottom plate 12f having the same size as the top plate 12a is provided below the rear wall 12c and the side walls 12d and 12e.

[0035] In the storage cassette 12, a space (storage space) with an open front surface is enclosed by a top plate 12a, a rear wall 12c, side walls 12d and 12e, and a bottom plate 12f for storing the holding jig 2. In this storage space, a plurality of storage shelves 14 are provided, each positioned at a different height and connected to the inner surfaces of the side walls 12d and 12e.

[0036] In addition, in the storage cassette 12, the holding jig 2 is stored in one of a plurality of storage shelves 14. Fig. 7(A) is a perspective view that schematically shows the storage shelf 14 provided in the storage space of the storage cassette 12, and Fig. 7(B) is a perspective view that schematically shows the storage shelf 14 that stores the holding jig 2 with the workpiece 11 placed thereon.

[0037] The storage shelf 14 has a rear support portion 14a, side support portions 14b and 14c extending forward from both ends of the rear support portion 14a, and a central support portion 14d extending forward from the center of the rear support portion 14a. The rear support portion 14a is connected to the rear wall 12c. The side support portions 14b and 14c are connected to the side walls 12d and 12e, respectively.

[0038] Furthermore, a suction path 14e that opens on the upper surface of the central support portion 14d is formed inside the storage shelf 14. The suction path 14e communicates with a fan (suction source) 16 provided on the rear side of the rear wall 12c (see FIG. 6(B)).

[0039] Furthermore, this suction path 14e communicates with a communication path 4e formed in the bottom plate 4b of the frame body 4 of the holding jig 2 stored in the storage shelf 14. In other words, the holding jig 2 is stored in the storage shelf 14 in a state where the communication path 4e opening on the lower surface of the bottom plate 4b overlaps with an opening formed on the upper surface of the central support part 14d of the storage shelf 14.

[0040] Then, when the holding jig 2 with the workpiece 11 placed on it is stored on the storage shelf 14 and the fan 16 is operated, a suction force acts on the workpiece 11 through the suction path 14e formed inside the storage shelf 14, the connecting path 4e formed in the bottom plate 4b of the frame body 4 of the holding jig 2, the recess 4d formed on the upper surface side of the bottom plate 4b, and the through hole 10b formed in the porous plate 8 and the holding plate 10.

[0041] That is, negative pressure is created in the through holes 10b of the holding plate 10, etc. As a result, the workpiece 11 is held on the upper surface of the holding plate 10. Furthermore, a pressing force acts from the workpiece 11 toward the storage shelf 14 on the holding jig 2 located between the workpiece 11 and the storage shelf 14. As a result, the holding jig 2 is held on the upper surface of the storage shelf 14.

[0042] The holding jig 2 may be stored in the storage shelf 14 in a state in which the workpiece 11 is held on the upper surface of the holding plate 10. In other words, the holding jig 2 may be stored in the storage shelf 14 in a state in which the through-hole 10b of the holding plate 10, on whose upper surface the workpiece 11 is placed, is under negative pressure by using a holding table of a laser processing apparatus described later or another suction mechanism.

[0043] Even in such a case, it is preferable to operate the fan 16 in the storage cassette 12 to maintain negative pressure in the through holes 10b of the holding plate 10, etc., and to hold the holding jig 2 on the upper surface of the storage shelf 14.

[0044] FIG. 8(A) is a perspective view showing a schematic example of a laser processing device that irradiates a workpiece 11 with a laser beam to perform laser processing, and FIG. 8(B) is a perspective view showing a schematic example of the manner in which a laser beam is irradiated onto a workpiece 11 in this laser processing device.

[0045] The laser processing device 18 shown in Figures 8(A) and 8(B) has a circular holding surface that is approximately parallel to a horizontal plane, and a holding table 20 that can hold a holding jig 2 on which a workpiece 11 is placed.

[0046] The upper surface of a disc-shaped porous plate 22 made of, for example, ceramic is exposed on the holding surface. Furthermore, the porous plate 22 is in communication with a suction source (not shown) such as a vacuum pump via a flow path or the like provided inside the holding table 20.

[0047] When the holding jig 2 with the workpiece 11 placed thereon is placed on the holding surface of the holding table 20 and the suction source is operated, a suction force acts on the workpiece 11 through the flow path provided inside the holding table 20, the connecting passage 4e formed in the bottom plate 4b of the frame body 4 of the holding jig 2, the recess 4d formed on the upper surface of the bottom plate 4b, and the through hole 10b formed in the porous plate 8 and the holding plate 10.

[0048] That is, the through holes 10b of the holding plate 10 are under negative pressure. As a result, the workpiece 11 is held on the upper surface of the holding plate 10. Furthermore, a pressing force acts from the workpiece 11 toward the holding table 20 on the holding jig 2 located between the workpiece 11 and the holding table 20. As a result, the holding jig 2 is held on the holding surface of the holding table 20.

[0049] Furthermore, the holding table 20 is connected to a horizontal movement mechanism (not shown) that includes a forward / backward movement mechanism and a left / right movement mechanism. This horizontal movement mechanism has, for example, a ball screw and a motor. When the horizontal movement mechanism operates, the holding table 20 moves in the horizontal direction.

[0050] The holding table 20 is also connected to a rotation mechanism (not shown). This rotation mechanism includes, for example, a spindle and a motor. When the rotation mechanism operates, the holding table 20 rotates around a rotation axis that is a straight line passing through the center of the holding surface along the vertical direction.

[0051] A head 26 of the laser irradiation unit 24 is provided above the holding table 20. The head 26 is provided at the tip of a connecting portion 28 that extends in a direction perpendicular to the vertical direction. The head 26 houses an optical system such as a condenser lens and a mirror, and the connecting portion 28 houses an optical system such as a mirror and / or a lens.

[0052] The base end of the connecting portion 28 is connected to a vertical movement mechanism (not shown). This vertical movement mechanism includes, for example, a ball screw and a motor. When the vertical movement mechanism operates, the head 26 and the connecting portion 28 move vertically.

[0053] The laser irradiation unit 24 also has a laser oscillator (not shown) that generates a laser beam LB with a wavelength (e.g., 355 nm) that is absorbed by the workpiece 11. This laser oscillator has, for example, Nd:YAG or the like as a laser medium. When the laser beam LB is generated by the laser oscillator, the laser beam LB is irradiated onto the holding surface side of the holding table 20 via an optical system housed in the connecting portion 28 and the head 26.

[0054] Furthermore, an imaging unit 30 capable of capturing an image of the holding surface side of the holding table 20 is provided on the side of the connecting portion 28. This imaging unit 30 has, for example, a light source such as an LED (Light Emitting Diode), an objective lens, and an imaging element such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0055] When dividing the workpiece 11 along the planned division lines 13 in this laser processing device 18, first, the holding table 20 holds the workpiece 11 using the holding jig 2. Specifically, a suction source communicating with the porous plate 22 is operated so that a suction force acts on the workpiece 11 via the through holes 10b of the holding plate 10 of the holding jig 2, etc.

[0056] Next, while the holding table 20 is moved in the horizontal direction (front-back or left-right), the head 26 of the laser irradiation unit 24 irradiates a laser beam LB onto a linear area included in the planned dividing line 13 of the workpiece 11. Note that the irradiation of this laser beam LB continues, for example, from slightly outside one end of this linear area in the horizontal direction to slightly outside the other end.

[0057] As a result, laser ablation occurs in this linear region, dividing the workpiece 11. The workpiece 11 is placed on the upper surface of the holding plate 10 so that the planned division line 13 overlaps with the groove 10a formed on the upper surface of the holding plate 10 of the holding jig 2. Therefore, the laser beam LB irradiated onto the workpiece 11 is attenuated in the groove 10a, preventing damage to the holding plate 10 due to the irradiation of the laser beam LB onto the workpiece 11.

[0058] Furthermore, by appropriately operating the horizontal movement mechanism and rotation mechanism connected to the holding table 20 and the laser irradiation unit 24, the laser beam LB is irradiated onto all of the remaining linear areas included in the planned dividing lines 13 of the workpiece 11. As a result, the workpiece 11 is divided along the planned dividing lines 13.

[0059] Then, once the workpiece 11 has been divided along the planned division lines 13, the operation of the suction source communicating with the porous plate 22 is stopped. Note that, since the check valve 6 is provided in the communication passage 4e formed in the bottom plate 4b of the frame 4 of the holding jig 2, the pressure in the through holes 10b of the holding plate 10, etc., is maintained at a negative pressure even after the operation of the suction source is stopped. In other words, the state in which the workpiece 11 is held by the holding jig 2 is maintained.

[0060] The holding jig 2 described above is configured to apply a suction force generated from a holding table 20 of a laser processing device 18 to the workpiece 11 placed on the upper surface of the holding plate 10. Since the holding jig 2 is a structure independent of the holding table 20, it can be carried out from the holding table 20 with the workpiece 11 placed on the upper surface of the holding plate 10.

[0061] Therefore, when the workpiece 11 is held using the holding jig 2, it is not necessary to integrate the workpiece 11 with the annular frame via adhesive tape in order to facilitate handling (e.g., carrying out from the holding table 20) of the multiple chips produced by dividing the workpiece 11. In other words, in this case, the adhesive tape and the annular frame are not required.

[0062] As a result, by using the holding jig 2, it becomes easy to remove the workpiece 11 from the holding table 20 without reducing the productivity of the chips produced by dividing the workpiece 11.

[0063] The above-described content is one aspect of the present invention, and the present invention is not limited to the above-described content. For example, the holding jig of the present invention may be provided with a vent valve for returning the pressure of the through-holes formed in the holding plate from negative pressure to atmospheric pressure. In this case, it becomes easy to separate the workpiece 11 from the holding jig as desired.

[0064] Furthermore, the porous plate is not an essential component of the holding jig of the present invention. Similarly, it is not essential for the holding jig of the present invention to form a recess on the upper surface side of the bottom plate of the frame. In other words, the holding jig of the present invention only needs to be structured so that an external suction force can be applied to the through-holes formed in the holding plate via the communication passages formed in the bottom plate of the frame, and there are no limitations on its specific structure.

[0065] The holding jig of the present invention may also be provided with a structure for facilitating the alignment of the workpiece 11. Fig. 9 is a perspective view schematically showing an example of such a holding jig. The holding jig 32 shown in Fig. 9 has the same structure as the holding jig 2, except that a plurality of protrusions 36 are provided on the upper surface of the side wall 34a of the frame 34, and a mark 38 is displayed on this upper surface to indicate the position where the notch 11b of the workpiece 11 should be positioned.

[0066] The multiple protrusions 36 may be structures that are integrated with the side wall 34a of the frame body 34, or may be structures that are fixed to the side wall 34a of the frame body 34 via an adhesive or the like. The marks 38 are formed, for example, by laser marking or coloring the upper surface of the frame body 34. Alternatively, the marks 38 may be replaced with convex or concave portions that are formed on the upper surface of the frame body 34.

[0067] The holding jig 32 is provided with a plurality of protrusions 36, which makes it easy to place the workpiece 11 on the upper surface of the holding plate 10. Furthermore, the holding jig 32 is provided with marks 38, which makes it easy to place the notch 11b of the workpiece 11 in an appropriate position, that is, to align the planned dividing line 13 of the workpiece 11 with the groove 10a formed on the upper surface of the holding plate 10.

[0068] In addition, the holding jig of the present invention may be used when laser processing is performed to remove only a portion of the area along the planned dividing line 13 of the workpiece 11 (for example, the area along the planned dividing line 13 excluding the area near the outer edge of the workpiece 11).

[0069] When performing such laser processing on a workpiece that is integrated with an annular frame via adhesive tape, the portion of the adhesive tape that overlaps the workpiece may be welded to the holding surface of the holding table 20 of the laser processing device 18. If the adhesive tape is welded to the holding table 20, it may become difficult to remove the workpiece from the holding table 20.

[0070] On the other hand, when the holding jig of the present invention is used, the adhesive tape and the annular frame are not required, as described above, and therefore, by using the holding jig of the present invention, it becomes easy to carry the workpiece out of the holding table 20.

[0071] In addition, the structures and methods according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0072] 2: Holding jig 4: Frame (4a: recess, 4b: bottom plate, 4c: side wall, 4d: recess, 4e: communication path) 6: Check valve 8: Porous plate 10: Holding plate (10a: groove, 10b: through hole) 11: Workpiece (11a: Surface, 11b: Notch) 12: Storage cassette (12a: Top plate, 12b: Handle, 12c: Rear wall) (12d, 12e: side wall, 12f: bottom wall) 13: Planned division line 14: Storage shelf (14a: rear support portion, 14b, 14c: side support portions) (14d: Central support part, 14e: Suction path) 15: Device 16: Fan (suction source) 18: Laser processing equipment 20: Holding table 22: Porous plate 24: Laser irradiation unit 26: Head 28:Connection part 30: Imaging unit 32: Holding jig 34: Frame (34a: Side wall) 36:Protrusion 38: Mark

Claims

1. A holding jig used to hold a workpiece on a holding table of a laser processing apparatus that performs laser processing by irradiating a laser beam onto a workpiece having devices formed in each of a plurality of areas partitioned by planned division lines set in a grid pattern, a retaining plate having a grid-like groove formed on an upper surface thereof, and a through hole formed in each of a plurality of regions defined by the grooves; a frame body having a recess formed on its upper surface into which the holding plate is fitted, and a communication passage formed therein that connects the through hole formed in the holding plate fitted into the recess to the outside, the workpiece is placed on the upper surface of the holding plate so that the planned dividing line overlaps the groove, and a suction force generated from the holding table is applied to the workpiece via the through-hole formed in the holding plate fitted into the recess and the communication path formed in the frame, thereby holding the workpiece on the holding table; A holding jig characterized by being a structure independent from the holding table.

2. Further comprising a porous plate; A holding jig as described in claim 1, characterized in that the suction force generated from the holding table acts on the workpiece through the porous plate arranged between the lower surface of the holding plate fitted into the recess and the bottom surface of the recess.

3. 3. The holding jig according to claim 1, wherein the holding plate is made of an inorganic material.

4. A holding jig as described in any one of claims 1 to 3, characterized in that the communicating passage formed in the frame body is provided with a check valve that inhibits the flow of fluid from the outside of the frame body to the through hole formed in the holding plate fitted in the recess.

5. A storage cassette for storing the holding jig according to any one of claims 1 to 4, a main body having a top plate, a pair of side walls, and a bottom plate; a storage shelf connected to each inner surface of the pair of side walls and configured to store the holding jig; a suction source that generates a suction force; a storage cassette characterized in that a suction path is formed in the storage shelf, which connects the suction source to the communication path formed in the frame of the holding jig stored in the storage shelf.

6. A method for manufacturing a holding jig used to hold a workpiece on a holding table of a laser processing apparatus that performs laser processing by irradiating a laser beam onto a workpiece having devices formed in each of a plurality of areas partitioned by planned division lines set in a grid pattern, the method comprising: a groove forming step of forming grooves in a grid pattern on the upper surface of the holding plate; a through-hole forming step of forming a through-hole in each of a plurality of regions defined by the grooves of the holding plate; a preparation step of preparing a frame body having a recess formed on an upper surface side and a communication passage formed to connect an internal space of the recess to the outside; a fitting step of fitting the holding plate into the recess so that the through hole communicates with the outside via the communication passage, The method for manufacturing a holding jig is characterized in that the holding jig is a structure independent from the holding table.

7. The holding table holds the workpiece using a holding jig according to any one of claims 1 to 4; dividing the workpiece by irradiating the laser beam onto the workpiece along the planned dividing line; A method for manufacturing a chip, comprising:

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