Power Conversion Device

Abstract

To provide a power conversion device that matches an amount of power without changing a type of a cooling device.SOLUTION: A power conversion device 40 comprises a power conversion unit 43. The power conversion unit 43 includes a cooling device 14a, a cooling device 14c, a power semiconductor module 18a, and a power semiconductor module 18d. Each of the cooling devices 14a and 14c includes a heat receiving block 15, a heat pipe 17, and a cooling fin 16. The cooling device 14c is formed in the same shape as that of the cooling device 14a. In the cooling device 14a, the power semiconductor module 18d is attached to a surface 30a. In the cooling device 14c, the power semiconductor module 18a is attached to a surface 30c. The cooling device 14a and the cooling device 14c are disposed so that a surface 31a and a surface 31c face each other. Another cooling device having the same shape as the cooling device 14 can be disposed between the cooling device 14a and the cooling device 14c.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present disclosure relates to a power conversion device. [Background technology]

[0002] Patent Document 1 discloses a power conversion device. The power conversion device described in Patent Document 1 includes six transistor modules and a heat pipe cooler. Three of the transistor modules are attached to the front surface of the heat pipe cooler. The remaining three of the transistor modules are attached to the back surface of the heat pipe cooler. The power conversion device is capable of handling large amounts of power. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 07-131978 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the power conversion device described in Patent Document 1, when the amount of power used is smaller than the corresponding amount of power, the size of the heat pipe cooler is too large for the heat generated. Also, in the power conversion device described in Patent Document 1, when the amount of power used is larger than the corresponding amount of power, the size of the heat pipe cooler is too small for the heat generated. This means that the shape of the heat pipe cooler needs to be changed according to the amount of power used, which causes a problem of increasing the variety of heat pipe coolers.

[0005] The present disclosure has been made to solve the above-mentioned problems, and an object of the present disclosure is to provide a power conversion device that can reduce the number of types of coolers. [Means for solving the problem]

[0006] A power conversion device according to the present disclosure includes a power conversion unit, the power conversion unit including a first cooler, a second cooler, and a third cooler; The cooling system includes a first power semiconductor module and a second power semiconductor module. The first cooler includes a first heat receiving block, a first heat pipe installed on the first heat receiving block, and a first cooling fin that radiates heat received by the first heat receiving block through the first heat pipe. The second cooler includes a second heat receiving block, a second heat pipe installed on the second heat receiving block, and a second cooling fin that radiates heat received by the second heat receiving block through the second heat pipe. The first heat receiving block has a first surface and a second surface on the back side of the first surface. The second heat receiving block has a third surface and a fourth surface on the back side of the third surface. The second cooler has the same shape as the first cooler, and the first cooler and the second cooler are arranged so that the second surface and the third surface face each other. The first power semiconductor module is attached to the first surface, and the second power semiconductor module is attached to the fourth surface. The third cooler includes a third heat receiving block, a third heat pipe installed on the third heat receiving block, and a third cooling fin that dissipates heat received by the third heat receiving block through the third heat pipe. The third heat receiving block includes a front heat receiving surface and a back heat receiving surface on the back side of the front heat receiving surface. The third cooler has the same shape as the first cooler and the second cooler, and includes: Between the first cooler and the second cooler The heat receiving surface is disposed so that the front heat receiving surface is in indirect contact with the second surface, and the rear heat receiving surface is in indirect contact with the third surface.

[0007] Further, a power conversion device according to the present disclosure includes a first cooler, a first power semiconductor module, and Another cooler having the same shape as the first cooler; The first cooler includes a first heat receiving block, a first heat pipe installed on the first heat receiving block, and a first cooling fin that dissipates heat received by the first heat receiving block through the first heat pipe. The first heat receiving block includes a first surface and a second surface on the rear side of the first surface. Notes and others Cooler in the same direction as the first cooler The first power semiconductor module can be attached to both the first surface and the second surface, and is attached to either the first surface or the second surface. The other cooler is arranged so as to be in contact with the side of the first surface or the second surface on which the first power semiconductor module is not attached. [Effects of the Invention]

[0008] The power conversion device according to the present disclosure includes two coolers of the same shape and two power semiconductor modules. The coolers include a heat receiving block having a first surface and a second surface. The power semiconductor modules are attached to the first surfaces of the two coolers, respectively. The two coolers are arranged so that their second surfaces face each other. Another cooler having the same shape as the cooler can be arranged between the two coolers. This allows for a reduction in the variety of cooler types. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a configuration diagram showing an example of a building to which a power conversion device according to a first embodiment is applied. [Figure 2] 1 is a circuit diagram showing an example of a low-speed power conversion device according to a first embodiment. [Figure 3] 1 is a front view showing an example of a low-speed power conversion device according to a first embodiment. [Figure 4] 1 is a side view showing an example of a low-speed power conversion device according to a first embodiment. [Figure 5] 1 is a circuit diagram showing an example of a high-speed model power conversion device according to a first embodiment. [Figure 6] 1 is a front view showing an example of a power conversion unit of a high-speed model power conversion device according to the first embodiment. [Figure 7] 1 is a side view showing an example of a power conversion unit of a high-speed model power conversion device according to the first embodiment. [Figure 8] 3 is a bottom view showing an example of a power conversion unit of a high-speed model power conversion device according to the first embodiment. FIG. [Figure 9] 3 is a side view showing an example of a power conversion bus bar of a high-speed model power conversion device according to the first embodiment. FIG. [Figure 10] 1 is a configuration diagram showing an example of a high-speed model power conversion device according to a first embodiment. [Figure 11] 3 is a side view showing an example of a bus bar of a high-speed model power converter according to the first embodiment. FIG. [Figure 12]1 is a front view showing an example of a power conversion unit of an ultra-high speed model power conversion device according to the first embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] The embodiments of the present disclosure will be described with reference to the accompanying drawings. In each drawing, the same or corresponding parts are designated by the same reference numerals. Duplicate descriptions of these parts will be appropriately simplified or omitted.

[0011] Embodiment 1 FIG. 1 is a configuration diagram showing an example of a building to which a power conversion device 9 according to the first embodiment is applied.

[0012] The power converter 9 is applied to a low-speed elevator system. The elevator system includes a car 1, a hoist 2, a main rope 3, a counterweight 4, a control panel 8, and a power converter 9. A hoistway 5 runs through each floor of the building. A machine room 6 is provided above the hoistway 5. Landings are located opposite the hoistway 5 and are provided on each floor of the building.

[0013] The car 1 is hung on one side of the main rope 3. The main rope 3 is wound around a hoisting machine 2. The hoisting machine 2 moves the main rope 3 in the longitudinal direction, causing the car 1 to rise and fall inside the hoistway 5. The counterweight 4 is hung on the other side of the main rope 3. The counterweight 4 rises and falls in the direction opposite to that of the car 1.

[0014] The elevator apparatus further includes an AC power supply 10. The hoisting machine 2 and a control panel 8 are installed in the machine room 6. The control panel 8 is electrically connected to the AC power supply 10. The control panel 8 is electrically connected to the hoisting machine 2. The control panel 8 is electrically connected to the equipment of the car 1. The control panel 8 is provided to control the elevator apparatus as a whole. The hoisting machine 2 is controlled by the control panel 8.

[0015] The power converter 9 is installed in the control panel 8. The control panel 8 is electrically connected to the power converter 9. The power converter 9 is electrically connected to an AC power source 10. The hoisting machine 2 includes a motor 7. The power converter 9 is electrically connected to the motor 7.

[0016] The car 1 may be applied to an elevator device without a machine room 6. In that case, the hoisting machine 2 and the control panel 8 are provided in the lower or upper part of the hoistway 5.

[0017] Next, the circuit configuration of the low-speed power conversion device 9 according to the first embodiment will be described with reference to FIG. FIG. 2 is a circuit diagram showing an example of the low-speed power conversion device 9 according to the first embodiment.

[0018] The power conversion device 9 includes a diode module 11, a smoothing capacitor 12, and a power semiconductor module 13. The power semiconductor module 13 forms an inverter. The input side of the diode module 11 is connected to the output side of an AC power supply 10. The AC power supply 10 outputs three-phase (R, S, T) AC power. The output side of the diode module 11 is connected to the smoothing capacitor 12.

[0019] Furthermore, the smoothing capacitor 12 is connected to the input side of the power semiconductor module 13. The output side of the power semiconductor module 13 is connected to the input side of the motor 7. The power semiconductor module 13 includes a plurality of transistors.

[0020] In power semiconductor module 13, a transistor constituting an upper arm and a transistor constituting a lower arm are connected in series. Power semiconductor module 13 includes three transistors each constituting an upper arm and a lower arm connected in series. Power semiconductor module 13 may use MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) as the transistors.

[0021] The diode module 11 converts three-phase (R, S, T) AC power into DC power. The power semiconductor module 13 converts the DC power into three-phase (U, V, W) AC power.

[0022] Next, the configuration of the low-speed power conversion device 9 according to the first embodiment will be described. Fig. 3 is a front view showing an example of the power conversion device 9 of a low speed model according to the first embodiment. Fig. 4 is a side view showing an example of the power conversion device 9 of a low speed model according to the first embodiment.

[0023] The power conversion device 9 includes a cooler 14. The cooler 14 includes a heat receiving block 15, cooling fins 16, and a heat pipe 17. The cooler 14 may include a plurality of cooling fins 16. The cooler 14 may include a plurality of heat pipes 17. The heat receiving block 15 has a rectangular parallelepiped shape. The heat receiving block 15 has an upper surface 50. One end of the heat pipe 17 is attached to the heat receiving block 15. One end of the heat pipe 17 may be attached to the upper surface 50. The heat pipe 17 extends from the upper surface 50 in a direction perpendicular to the upper surface 50. The heat pipe 17 may extend upward from the heat receiving block 15. The cooling fins 16 are attached to the upper surface 50 of the heat receiving block 15. The cooling fins 16 may be attached on the heat receiving block 15. The cooling fins 16 are thermally connected to the heat pipes 17.

[0024] The heat receiving block 15 has a surface 30 and a surface 31. The surface 31 is the surface behind the surface 30. The power semiconductor module 13 can be attached to both the surface 30 and the surface 31. The power semiconductor module 13 is attached to the surface 30 or the surface 31. For example, the power semiconductor module 13 is attached to the surface 30. The power semiconductor module 13 may also be attached to the surface 31.

[0025] The heat receiving block 15 has a surface 51 and a surface 52. The surface 51 is the surface between the surface 30 and the surface 31. The surface 52 is the surface behind the surface 51. The surface 51 is one of the left and right sides when viewed from the surface 30 side when the top surface 50 is facing up. The surface 52 is the other of the left and right sides when viewed from the surface 30 side when the top surface 50 is facing up. For example, the surface 51 is the right side when viewed from the surface 30 side when the top surface 50 is facing up. For example, the surface 52 is the left side when viewed from the surface 30 side when the top surface 50 is facing up.

[0026] Heat generated in the power semiconductor module 13 is transferred to the heat receiving block 15. The heat received by the heat receiving block 15 is transferred to the cooling fins 16 through the heat pipes 17. The cooling fins 16 dissipate the heat received by the heat receiving block 15.

[0027] The multiple transistors that make up power semiconductor module 13 may be housed in one package. In this case, one package contains three sets of series-connected transistors that make up the upper and lower arms.

[0028] The power semiconductor module 13 includes a P terminal 32 and an N terminal 33. The P terminal 32 and the N terminal 33 are input terminals. The P terminal 32 and the N terminal 33 are installed on the surface opposite to the surface that comes into contact with the heat receiving block 15. The P terminal 32 and the N terminal 33 are connected to the smoothing capacitor 12 by electric wires or the like.

[0029] Furthermore, the power semiconductor module 13 includes a U terminal 34, a V terminal 35, and a W terminal 36. The U terminal 34, the V terminal 35, and the W terminal 36 are output terminals. The U terminal 34, the V terminal 35, and the W terminal 36 are connected to cables that are wired to the motor 7.

[0030] The power conversion device 9 is installed on the control panel 8 with the surface 30 facing forward. The power conversion device 9 is installed on the control panel 8 with the surface 31 facing backward. The power conversion device 9 is installed so that the surface 31 faces the installation surface of the control panel 8.

[0031] The power conversion device 9 may also include another cooler having the same shape as the cooler 14. The other cooler having the same shape as the cooler 14 is arranged on the side of the surface 30 or the surface 31 on which the power semiconductor module 13 is not installed. For example, if the power semiconductor module 13 is installed on the surface 31 but not on the surface 30, the other cooler having the same shape as the cooler 14 is arranged on the surface 30 side.

[0032] Another cooler having the same shape as the cooler 14 may be arranged on the surface 31 side in the same orientation as the cooler 14. Another cooler having the same shape as the cooler 14 may be arranged on the surface 30 side in the same orientation as the cooler 14. Another cooler having the same shape as the cooler 14 may be arranged stacked so as to be in contact with the cooler 14. Furthermore, a plurality of other coolers having the same shape as the cooler 14 may be installed. Furthermore, the surface of the cooler 14 on the surface 30 side may be joined to the surface of another cooler having the same shape as the cooler 14. Furthermore, the surface of the cooler 14 on the surface 31 side may be joined to the surface of another cooler having the same shape as the cooler 14.

[0033] Next, the circuit configuration of the high-speed power conversion device 40 according to the first embodiment will be described with reference to FIG. FIG. 5 is a circuit diagram showing an example of a high-speed model power conversion device 40 according to the first embodiment.

[0034] The power converter 40 is applied to a high-speed elevator device. The configuration of the elevator device is the same as that shown in Fig. 1, but the power converter 9 is replaced by the power converter 40.

[0035] The power conversion device 40 includes a smoothing capacitor 12, a plurality of power semiconductor modules 18, and a plurality of bus bars 19. For example, six power semiconductor modules 18 are included. In the following description, when it is necessary to individually identify the six power semiconductor modules 18, the power semiconductor modules 18 will be denoted by reference numerals 18a to 18f as shown in FIG. 5.

[0036] The bus bars 19 are formed of plate-shaped conductive wiring members. For example, six bus bars 19 are provided. In the following description, when it is necessary to individually identify the six bus bars 19, the bus bars 19 are denoted by reference numerals 19a to 19f as shown in FIG. 5.

[0037] The power semiconductor module 18 includes a plurality of transistors. The power semiconductor module 18 may include two transistors. The power semiconductor module 18 includes a transistor that configures an upper arm and a transistor that configures a lower arm. The transistor that configures the upper arm and the transistor that configures the lower arm are connected in series. The power semiconductor module 18 may use MOSFETs as transistors. The power semiconductor modules 18a to 18c convert AC power (R, S, T) into DC power. The power semiconductor modules 18d to 18f convert DC power into AC power (U, V, W).

[0038] The circuit of the power conversion device 40 includes a converter 41 and an inverter 42. The converter 41 is made up of power semiconductor modules 18a to 18c. The inverter 42 is made up of power semiconductor modules 18d to 18f. Each of the power semiconductor modules 18a to 18c also has a converter function. Each of the power semiconductor modules 18d to 18f also has an inverter function.

[0039] The bus bars 19a to 19c are connected to the output side of the AC power supply 10. The AC power supply 10 outputs three-phase (R, S, T) AC power. The input side of the converter 41 is connected to the bus bars 19a to 19c. The input side of the power semiconductor module 18a is connected to the bus bar 19a. The input side of the power semiconductor module 18b is connected to the bus bar 19b. The input side of the power semiconductor module 18c is connected to the bus bar 19c.

[0040] The output side of converter 41 is connected to smoothing capacitor 12. The output side of power semiconductor module 18a is connected to smoothing capacitor 12. The output side of power semiconductor module 18b is connected to smoothing capacitor 12. The output side of power semiconductor module 18c is connected to smoothing capacitor 12.

[0041] Furthermore, smoothing capacitor 12 is connected to the input side of inverter 42. The output side of inverter 42 is connected to bus bars 19d to 19f. The output side of power semiconductor module 18d is connected to bus bar 19d. The output side of power semiconductor module 18e is connected to bus bar 19e. The output side of power semiconductor module 18f is connected to bus bar 19f. Bus bars 19d to 19f are connected to the input side of motor 7.

[0042] When the elevator is powered, three-phase (R, S, T) AC power from AC power supply 10 is converted into DC power by power semiconductor modules 18a to 18c (converter 41). The DC power converted by converter 41 is then converted into three-phase (U, V, W) AC power by power semiconductor modules 18d to 18f (inverter 42). Motor 7 is driven by the AC power converted by inverter 42.

[0043] During regeneration of the elevator, the kinetic energy of the motor 7 is converted into DC power by the power semiconductor modules 18d to 18f (inverter 42). The DC power converted by the inverter 42 is converted into three-phase (R, S, T) AC power by the power semiconductor modules 18a to 18c (converter 41). The AC power converted by the converter 41 is recovered by the AC power supply 10.

[0044] Next, the power conversion unit 43 included in the high-speed power conversion device 40 according to the first embodiment will be described. Fig. 6 is a front view showing an example of a power conversion unit 43 of a high-speed model power conversion apparatus 40 according to the first embodiment. Fig. 7 is a side view showing an example of a power conversion unit 43 of a high-speed model power conversion apparatus 40 according to the first embodiment. Fig. 8 is a bottom view showing an example of a power conversion unit 43 of a high-speed model power conversion apparatus 40 according to the first embodiment. Fig. 9 is a side view showing an example of a bus bar 19 of a high-speed model power conversion apparatus 40 according to the first embodiment.

[0045] The power conversion device 40 includes a power conversion unit 43. The power conversion unit 43 includes a plurality of coolers 14, a plurality of power semiconductor modules 18, a plurality of bus bars 19, and a plurality of insulating materials 20.

[0046] The power conversion unit 43 may include three coolers 14. When it is necessary to identify the three coolers 14 individually below, the coolers 14 are denoted by reference numerals 14a to 14c as shown in FIGS. 6 to 8. The components of the cooler 14a are identified by adding the letter a after the reference numeral. Similarly, the components of the cooler 14b are identified by adding the letter b after the reference numeral. Similarly, the components of the cooler 14c are identified by adding the letter c after the reference numeral.

[0047] The power conversion unit 43 may include two bus bars 19. When it is necessary to identify the two bus bars 19 below, the bus bars 19 are denoted by reference numerals 19a and 19d, as shown in FIGS. 6 to 8. The components of the bus bar 19a are identified by adding the letter a after the reference numeral. Similarly, the components of the bus bar 19d are identified by adding the letter d after the reference numeral.

[0048] The power conversion unit 43 may include two power semiconductor modules 18. In this case, the power conversion unit 43 includes one power semiconductor module 18 selected from the power semiconductor modules 18a to 18c that constitute the converter 41. The power conversion unit 43 also includes one power semiconductor module 18 selected from the power semiconductor modules 18d to 18f that constitute the inverter 42. For example, the power conversion unit 43 includes the power semiconductor module 18a and the power semiconductor module 18d.

[0049] The plurality of transistors constituting power semiconductor module 18 may be housed in a single package. In this case, a set of series-connected transistors constituting an upper arm and a lower arm is housed in a single package. For example, in power semiconductor module 18a, a set of series-connected transistors constituting an upper arm and a lower arm may be housed in a single package.

[0050] The three coolers 14 are arranged so as to overlap when viewed from the side of surface 30 or the side of surface 31. The three coolers 14 are arranged side by side in the horizontal direction. The coolers 14 have the same configuration and shape as those used in the power conversion device 9 of the low-speed model.

[0051] Cooler 14a has power semiconductor module 18d attached to surface 30a. Cooler 14c has power semiconductor module 18a attached to surface 30c. Cooler 14a and cooler 14c are arranged so that surfaces 31a and 31c face each other. Cooler 14c has the same shape as cooler 14a. Cooler 14b has the same shape as cooler 14a. Surfaces 51c and 52a are arranged facing the same direction.

[0052] The power conversion unit 43 may include two coolers 14. In this case, the power conversion unit 43 includes two coolers, 14a and 14c. Another cooler having the same shape as the cooler 14 can be disposed between the cooler 14a and the cooler 14c.

[0053] Cooler 14b is disposed between cooler 14a and cooler 14c. Cooler 14b may be disposed so that surface 30b faces surface 31c. Cooler 14b may be disposed so that surface 31b faces surface 31c. No power semiconductor module 18 is mounted on cooler 14b.

[0054] Of the multiple coolers 14, the one disposed in the center is provided to improve the heat dissipation of the power conversion device 40. The coolers 14 not equipped with power semiconductor modules 18 are provided to improve the heat dissipation of the coolers 14 equipped with power semiconductor modules 18. When the power conversion unit 43 includes three coolers 14, the cooler 14b is provided to improve the heat dissipation of the coolers 14a and 14c equipped with power semiconductor modules 18. A plurality of coolers 14b may be provided between the coolers 14a and 14c as needed.

[0055] The cooler 14b dissipates heat generated in the power semiconductor module 18d attached to the cooler 14a. The cooler 14b dissipates heat generated in the power semiconductor module 18a attached to the cooler 14c.

[0056] The power semiconductor module 18 includes a P terminal 32 and an N terminal 33. The P terminal 32 and the N terminal 33 are arranged on the surface opposite to the surface attached to the heat receiving block 15. When viewed from the surface 51c side and the surface 52a side, the P terminal 32 and the N terminal 33 are installed on the front side of the power semiconductor module 18. The P terminal 32 and the N terminal 33 are connected to the smoothing capacitor 12 by electric wires or the like.

[0057] The power semiconductor module 18 also includes a terminal 44. The terminal 44 is arranged on the surface opposite to the surface attached to the heat receiving block 15. When viewed from the surface 51c side and the surface 52a side, the terminal 44 is arranged further back than the P terminal 32 and the N terminal 33 of the power semiconductor module 18.

[0058] The bus bar 19 can be arranged between the multiple coolers 14 while being protected by insulating material 20. The bus bar 19 is formed with terminal holes 21 and fixing holes 22. The fixing holes 22 are formed at one end of the bus bar 19. The bus bar 19 is fixed to the power semiconductor module 18 via the fixing holes 22. The terminal holes 21 are formed at the other end of the bus bar 19. An input terminal or an output terminal of the bus bar 19 is connected to the terminal holes 21.

[0059] The busbar 19a extends along the surface 31c. The busbar 19a is positioned such that the fixing holes 22a overlap the terminals 44 of the power semiconductor module 18a. One end of the busbar 19a is fixed to the power semiconductor module 18a. One end of the busbar 19a is fixed to the power semiconductor module 18a via the fixing holes 22a. The other end of the busbar 19a is positioned in front of the cooler 14c when viewed from the surface 51c side. The other end of the busbar 19a protrudes in the direction in which the surface 51c faces. The portion of the busbar 19a extending along the surface 31c faces the surface 31c. The portion of the busbar 19a extending along the surface 31c is positioned between the coolers 14c and 14b. The busbar 19a extends from one end fixed to the power semiconductor module 18a, through the surface 52c side, and to the other end on the surface 31c side.

[0060] The busbar 19d extends along the surface 31a. The busbar 19d is positioned such that the fixing holes 22d overlap the terminals 44 of the power semiconductor module 18d. One end of the busbar 19d is fixed to the power semiconductor module 18d. One end of the busbar 19d is fixed to the power semiconductor module 18d through the fixing holes 22d. The other end of the busbar 19d is positioned in front of the cooler 14a when viewed from the surface 52a side. The other end of the busbar 19d protrudes in the direction in which the surface 52a faces. The portion of the busbar 19d extending along the surface 31c faces the surface 31a. The portion of the busbar 19d extending along the surface 31a is positioned between the coolers 14a and 14b. The busbar 19d extends from one end fixed to the power semiconductor module 18a, through the surface 51a side, and to the other end on the surface 31a side.

[0061] The plurality of insulating materials 20 are formed in a plate shape. The plurality of insulating materials 20 protect the bus bars 19. The insulating materials 20 may be made of a material with excellent thermal conductivity, such as fine ceramics. Four insulating materials 20 may be provided. In the following description, when it is necessary to individually identify the plurality of coolers 14, the insulating materials 20 will be denoted by reference numerals 20a to 20d as shown in Figs. 6 to 8.

[0062] The insulating material 20 is disposed between the bus bar 19 and the cooler 14. The insulating material 20a is disposed between the surface 31a and the bus bar 19d. The insulating material 20b is disposed opposite the bus bar 19d on the cooler 14c side of the bus bar 19d. The insulating material 20b is disposed between the cooler 14b and the bus bar 19d. The insulating material 20d is disposed between the surface 31c and the bus bar 19a. The insulating material 20c is disposed opposite the bus bar 19a on the cooler 14a side of the bus bar 19a. The insulating material 20c is disposed between the cooler 14b and the bus bar 19a.

[0063] The power conversion unit 43 is installed on the control panel 8 with the surfaces 51c and 52a facing forward. The power conversion unit 43 is installed on the control panel 8 with the surfaces 52c and 51a facing backward. The power conversion unit 43 is installed on the control panel 8 with the other end of the bus bar 19 facing forward. The power conversion unit 43 is installed so that the surfaces 52c and 51a face the installation surface of the control panel 8.

[0064] Next, a description will be given of the configuration of the high-speed model power conversion device 40 according to the first embodiment. Fig. 10 is a configuration diagram of the high-speed model power conversion device 40 according to the first embodiment.

[0065] The power conversion device 40 includes a plurality of power conversion units 43. The power conversion device 40 converts three-phase power using the plurality of power conversion units 43. The plurality of power conversion units 43 may be installed on the control panel 8 aligned horizontally.

[0066] The power conversion device 40 may include three power conversion units 43. When it is necessary to individually identify the three power conversion units 43 below, the power conversion units 43 will be denoted by reference numerals 43a to 43c as shown in FIG.

[0067] All three power conversion units 43 have the same configuration and shape as the power conversion units 43 described with reference to FIGS. 6 to 8. In this case, the power conversion device 40 includes a total of nine coolers 14. When it is necessary to identify the nine coolers 14 individually below, the coolers 14 will be denoted by reference numerals 14a to 14i as shown in FIG. 10. The coolers 14a to 14i all have the same configuration and shape as those used in the low-speed power conversion device 9. The power conversion device 40 also includes a total of six bus bars 19. When it is necessary to identify the six bus bars 19 individually below, the bus bars 19 will be denoted by reference numerals 19a to 19f as shown in FIG. 10.

[0068] The power conversion unit 43a includes a cooler 14a, a cooler 14b, a cooler 14c, a power semiconductor module 18a, a power semiconductor module 18d, a bus bar 19a, a bus bar 19d, and an insulating material 20. The power semiconductor module 18a is attached to the cooler 14c. The power semiconductor module 18d is attached to the cooler 14a. The bus bar 19a is fixed to the power semiconductor module 18a. The bus bar 19d is fixed to the power semiconductor module 18d. The insulating material 20 is disposed between the cooler 14a and the bus bar 19.

[0069] The power conversion unit 43b includes a cooler 14d, a cooler 14e, a cooler 14f, a power semiconductor module 18b, a power semiconductor module 18e, a bus bar 19b, a bus bar 19e, and an insulating material 20. The power semiconductor module 18b is attached to the cooler 14f. The power semiconductor module 18e is attached to the cooler 14d. The bus bar 19b is fixed to the power semiconductor module 18b. The bus bar 19e is fixed to the power semiconductor module 18e. The insulating material 20 is arranged between the cooler 14d and the bus bar 19.

[0070] The power conversion unit 43c includes a cooler 14g, a cooler 14h, a cooler 14i, a power semiconductor module 18c, a power semiconductor module 18f, a bus bar 19c, a bus bar 19f, and an insulating material 20. The power semiconductor module 18c is attached to the cooler 14i. The power semiconductor module 18f is attached to the cooler 14g. The bus bar 19c is fixed to the power semiconductor module 18c. The bus bar 19f is fixed to the power semiconductor module 18f. The insulating material 20 is arranged between the cooler 14g and the bus bar 19.

[0071] The P terminals 32 and N terminals 33 of the power semiconductor modules 18a to 18c are output terminals. The P terminals 32 and N terminals 33 of the power semiconductor modules 18d to 18f are input terminals. The P terminals 32 and N terminals 33 of the power semiconductor modules 18a to 18f are each connected to the smoothing capacitor 12 via an electric wire or the like.

[0072] The terminals 44 of the power semiconductor modules 18a to 18c are input side terminals. The terminals 44 of the power semiconductor modules 18a to 18c are connected to the bus bars 19a to 19c, respectively. The terminals 44 of the power semiconductor modules 18a to 18c are connected to cables wired to the AC power supply 10 via the bus bars 19a to 19c, respectively. The terminals 44 of the power semiconductor modules 18d to 18f are output side terminals. The terminals 44 of the power semiconductor modules 18d to 18f are connected to the bus bars 19d to 19f, respectively. The terminals 44 of the power semiconductor modules 18d to 18f are connected to cables wired to the motor 7 via the bus bars 19d to 19f, respectively.

[0073] An input terminal is connected to terminal hole 21a of bus bar 19a. An input terminal is connected to terminal hole 21b of bus bar 19b. An input terminal is connected to terminal hole 21c of bus bar 19c. An output terminal is connected to terminal hole 21d of bus bar 19d. An output terminal is connected to terminal hole 21e of bus bar 19e. An output terminal is connected to terminal hole 21f of bus bar 19f. Bus bars 19a to 19c are connected to cables wired to AC power supply 10. Bus bars 19d to 19f are connected to cables wired to motor 7. This achieves the configuration of the electrical conversion circuit of FIG. 5.

[0074] Next, a description will be given of the shape of busbar 45. Fig. 11 is a side view showing an example of busbar 45 of high-speed power converter 40 according to the first embodiment.

[0075] When the power conversion device 40 is configured by arranging a plurality of power conversion units 43, the wiring lengths between the AC power source 10 and the power semiconductor modules 18a to 18c, and between the motor 7 and the power semiconductor modules 18d to 18f are different. Therefore, it is necessary to consider the current division ratio so that current does not concentrate in some of the power semiconductor modules 18.

[0076] Power conversion device 40 may include bus bar 45 instead of bus bar 19. Bus bar 45 has the same shape as bus bar 19, but with cutouts 23 formed therein. Bus bar 45 has fixing holes 47 formed therein, similar to fixing holes 22 of bus bar 19. Bus bar 45 has terminal holes 46 formed therein, similar to terminal holes 21 of bus bar 19.

[0077] For example, two notches 23 may be formed. In this case, one notch 23 may be formed on the upper side. The other notch 23 may be formed on the lower side. At least one notch 23 is formed. A plurality of notches 23 may be formed. When a plurality of notches 23 are formed, the shapes of the plurality of notches 23, such as depth and width, may be different from one another. At least one of the notches 23 is formed on a straight line connecting the terminal hole 46 and the fixing hole 47 on the developed plane of the bus bar 45. The notch 23 is formed to lengthen the electrical path and adjust the current division ratio of the power conversion device 40.

[0078] When a current flows through busbar 19, the current travels through a path connecting terminal hole 21 and fixing hole 22. In this case, the shortest path for the current is a straight line connecting terminal hole 21 and fixing hole 22 on the flat surface of busbar 19. Similarly, when a current flows through busbar 45, the current travels through a path connecting terminal hole 46 and fixing hole 47. In this case, the shortest path for the current is longer than the straight line connecting terminal hole 46 and fixing hole 47 on the flat surface of busbar 45. Due to the formation of notch 23, busbar 45 has a longer electrical path for the current than busbar 19.

[0079] Therefore, the electrical path from the terminal of the cable wired to the AC power supply 10 or the motor 7 to the terminal 44 of the power semiconductor module 18 is shorter when bus bar 19 is used than when bus bar 45 is used. Also, the electrical path from the terminal of the cable wired to the AC power supply 10 or the motor 7 to the terminal 44 of the power semiconductor module 18 is longer when bus bar 45 is used than when bus bar 19 is used.

[0080] The power conversion device 40 connects a bus bar 19 to a long-length wire among the wires connecting the AC power source 10 to each of the terminals of a plurality of cables wired from the AC power source 10. The power conversion device 40 connects a bus bar 19 to a long-length wire among the wires connecting the motor 7 to each of the terminals of a plurality of cables wired from the AC power source 10. The power conversion device 40 connects a bus bar 45 to a short-length wire among the wires connecting the AC power source 10 to each of the terminals of a plurality of cables wired from the AC power source 10. The power conversion device 40 connects a bus bar 45 to a short-length wire among the wires connecting the motor 7 to each of the terminals of a plurality of cables wired from the motor 7. The bus bar 45 may be used instead of the bus bar 19 for at least one of the plurality of bus bars. This improves the current division ratio.

[0081] Next, a description will be given of power conversion unit 49 included in power conversion device 48 of an ultra-high speed model according to Embodiment 1. Fig. 12 is a front view showing an example of power conversion unit 49 of power conversion device 48 of an ultra-high speed model according to Embodiment 1.

[0082] The power converter 48 is applied to an ultra-high-speed elevator device. The configuration of the elevator device is the same as that shown in Fig. 1, but the power converter 9 is replaced by the power converter 48.

[0083] The power conversion device 48 includes a power conversion unit 49. The configuration of the power conversion unit 49 is the same as that of the power conversion unit 43. The coolers 14 used in the power conversion unit 49 have the same configuration and shape as those used in the power conversion device 9 of the low-speed model.

[0084] The power conversion unit 49 includes a cooler 14a, a cooler 14b, a cooler 14c, a power semiconductor module 18a, a power semiconductor module 18d, a bus bar 19a, and a bus bar 19d. The power semiconductor module 18a is attached to the cooler 14c. The power semiconductor module 18d is attached to the cooler 14a. The bus bar 19a is fixed to the power semiconductor module 18a. The bus bar 19d is fixed to the power semiconductor module 18d.

[0085] The power conversion unit 49 may include a plurality of coolers 14b. The power conversion unit 49 may include two coolers 14b. The plurality of coolers 14b are arranged in the same direction as the coolers 14a or 14c. The plurality of coolers 14b may be arranged stacked so that the coolers 14b are in contact with each other. The surfaces of the plurality of coolers 14b may be joined together.

[0086] Similarly to the power conversion device 40, the power conversion device 48 may include a plurality of power conversion units 49.

[0087] According to the first embodiment described above, the power conversion unit 43 may include two coolers 14. The cooler 14a has the power semiconductor module 18d attached to the surface 30a. The cooler 14c has the power semiconductor module 18a attached to the surface 30c. The coolers 14a and 14c are arranged so that the surfaces 31a and 31c face each other. The cooler 14c has the same shape as the cooler 14a. The cooler 14b has the same shape as the cooler 14a. Another cooler having the same shape as the cooler 14 can be arranged between the cooler 14a and the cooler 14c. This allows coolers of the same shape to be arranged according to the heat generated by the power semiconductor module 18. Therefore, there is no need to change the shape of the cooler according to the amount of power. This reduces the number of types of coolers

[0088] Furthermore, in the power conversion unit 43, the cooler 14b is disposed between the cooler 14a and the cooler 14c. Two or more coolers 14b may be provided as necessary. This allows the number of coolers 14 to be adjusted according to the heat generated by the power semiconductor modules 18. Furthermore, the cooler 14b can improve the heat dissipation performance of the coolers 14a and 14c on which the power semiconductor modules 18 are mounted.

[0089] Furthermore, the cooler 14b can dissipate both the heat generated by the power semiconductor module 18d attached to the cooler 14a and the heat generated by the power semiconductor module 18a attached to the cooler 14c. This allows the number of coolers to be minimized. This allows for efficient heat dissipation while saving space.

[0090] Furthermore, the power conversion device 9 includes a cooler 14. The power conversion device 40 includes a cooler 14. The power conversion device 48 includes a cooler 14. Therefore, the same cooler can be used regardless of the model, such as a low-speed model, a high-speed model, or an ultra-high-speed model. Therefore, there is no need to change the shape of the cooler depending on the amount of power. Therefore, the number of types of coolers can be reduced.

[0091] The power conversion unit 43 may also include two bus bars 19. The bus bar 19 has a terminal hole 21 and a fixing hole 22 formed therein. The fixing hole 22 is formed at one end of the bus bar 19. The bus bar 19 is fixed to the power semiconductor module 18 via the fixing hole 22. The terminal hole 21 is formed at the other end of the bus bar 19. An input terminal or an output terminal is connected to the terminal hole 21 of the bus bar 19. The other end of the bus bar 19a is positioned in front of the cooler 14c when viewed from the surface 51c side. The power conversion unit 43 is installed on the control panel 8 with the other end of the bus bar 19 at the front. This allows the work of connecting a cable from the AC power source 10 or the motor 7 to the power conversion device 40 to be performed on the front side of the control panel 8. This simplifies the wiring work.

[0092] The busbars 19 extend along the surface 31. One end of the busbars 19 is fixed to the power semiconductor modules 18 through the fixing holes 22. The other end of the busbar 19a is located in front of the cooler 14c when viewed from the surface 51c side. The other end of the busbar 19d is located in front of the cooler 14a when viewed from the surface 52a side. The portion of the busbar 19 extending along the surface 31 is located between the two coolers 14. The busbar 19a extends from one end fixed to the power semiconductor module 18a through the surface 52c side to the other end on the surface 31c side. The busbar 19d extends from one end fixed to the power semiconductor module 18a through the surface 51a side to the other end on the surface 31a side. This allows the cooler 14 and the power semiconductor modules 18 to be arranged together. This saves space. Furthermore, the layout flexibility within the control panel 8 is improved.

[0093] Furthermore, insulating material 20 is disposed between bus bar 19 and cooler 14. Insulating material 20a is disposed between surface 31a and bus bar 19d. Insulating material 20b is disposed opposite insulating material 20a on the cooler 14c side of bus bar 19d. Insulating material 20b is disposed between cooler 14b and bus bar 19d. Insulating material 20d is disposed between surface 31c and bus bar 19a. Insulating material 20c is disposed opposite insulating material 20d on the cooler 14a side of bus bar 19a. Insulating material 20c is disposed between cooler 14b and bus bar 19a. This insulates bus bar 19 from cooler 14, and protects bus bar 19.

[0094] The power conversion device 40 also includes a plurality of power conversion units 43. Each power conversion unit 43 includes two power semiconductor modules 18. An input terminal of bus bar 19a is connected to terminal hole 21a. An input terminal of bus bar 19b is connected to terminal hole 21b. An input terminal of bus bar 19c is connected to terminal hole 21c. An output terminal of bus bar 19d is connected to terminal hole 21d. An output terminal of bus bar 19e is connected to terminal hole 21e. An output terminal of bus bar 19f is connected to terminal hole 21f. Bus bars 19a to 19c are connected to a cable that is wired to AC power supply 10. Bus bars 19d to 19f are connected to a cable that is wired to motor 7. P terminal 32 and N terminal 33 of power semiconductor module 18 are connected to smoothing capacitor 12. This achieves the configuration of an electrical conversion circuit. Thus, three-phase power can be converted.

[0095] Furthermore, the power conversion device 40 may include a bus bar 45 instead of the bus bar 19. At least one of the multiple bus bars may be a bus bar 45 having a notch 23 formed therein for adjusting the current division ratio. This makes it possible to easily adjust the current division ratio between the multiple power conversion units 43. It also makes it possible to prevent current from concentrating in some of the power semiconductor modules 18 and causing them to fail.

[0096] The power converter 9 also includes a cooler 14 and a power semiconductor module 13. The power semiconductor module 13 can be attached to both the surface 30 and the surface 31. The power semiconductor module 13 is attached to the surface 30 or the surface 31. The power converter 9 may also include another cooler having the same shape as the cooler 14. The other cooler having the same shape as the cooler 14 is arranged on the surface of the surface 30 or the surface 31 on which the power semiconductor module 13 is not installed. For example, if the power semiconductor module 13 is installed on the surface 31 but not on the surface 30, the other cooler having the same shape as the cooler 14 is arranged on the surface 30 side. A plurality of other coolers having the same shape as the cooler 14 may be installed. This allows the number of coolers to be adjusted according to the heat generated by the power semiconductor module 13. Therefore, it is not necessary to change the shape of the cooler according to the amount of power. Therefore, the variety of coolers can be reduced.

[0097] The power conversion device 9 is installed on the control panel 8 with the surface 30 facing forward. The power conversion device 9 is installed on the control panel 8 with the surface 31 facing backward. The power semiconductor module 13 is attached to the surface 30. This allows the work of connecting the cables from the AC power source 10 or the motor 7 to the power conversion device 9 to be done on the front side of the control panel 8. This simplifies the wiring work.

[0098] Various aspects of the present disclosure are summarized below as appendices.

[0099] (Appendix 1) Equipped with a power conversion unit, The power conversion unit includes: A first cooler; A second cooler; a first power semiconductor module; a second power semiconductor module; and Equipped with The first cooler is A first heat receiving block; a first heat pipe installed in the first heat receiving block; a first cooling fin that dissipates heat received by the first heat receiving block through the first heat pipe; Equipped with The second cooler is A second heat receiving block; a second heat pipe installed in the second heat receiving block; a second cooling fin that dissipates the heat received by the second heat receiving block through the second heat pipe; Equipped with the first heat receiving block has a first surface and a second surface on the back side of the first surface, the second heat receiving block has a third surface and a fourth surface on the back side of the third surface, the second cooler has the same shape as the first cooler, the first cooler and the second cooler are arranged so that the second surface and the third surface face each other, the first power semiconductor module is attached to the first surface; the second power semiconductor module is attached to the fourth surface; A power conversion device in which another cooler having the same shape as the first cooler can be disposed between the first cooler and the second cooler. (Appendix 2) The power conversion unit includes: Further comprising a third cooler; The third cooler is A third heat receiving block; a third heat pipe installed in the third heat receiving block; a third cooling fin that dissipates the heat received by the third heat receiving block through the third heat pipe; Equipped with the third cooler has the same shape as the first cooler, 2. The power conversion device according to claim 1, wherein the third cooler is disposed between the first cooler and the second cooler. (Appendix 3) 3. The power conversion device according to claim 2, wherein a plurality of the third coolers are arranged between the first cooler and the second cooler. (Appendix 4) The power conversion unit includes: a first bus bar formed of a plate-shaped conductive wiring member; a second bus bar formed of a plate-shaped conductive wiring member; Further provided with the first heat receiving block has a fifth surface between the first surface and the second surface, the second heat receiving block has a sixth surface between the third surface and the fourth surface, the fifth surface and the sixth surface face in the same direction; one end of the first bus bar is fixed to the first power semiconductor module; the first bus bar extends along the second surface, and the other end thereof, as viewed from the fifth surface side of the first cooler, is disposed in front of the fifth surface, one end of the second bus bar is fixed to the second power semiconductor module; the second bus bar extends along the third surface and has another end located in front of the sixth surface as viewed from the sixth surface side of the second cooler. (Appendix 5) The power conversion unit includes: a plate-shaped first insulating material; A plate-shaped second insulating material; a plate-shaped third insulating material; a plate-shaped fourth insulating material; Further provided with the first insulating material is disposed between the first bus bar and the second surface; the second insulating material is disposed opposite the first bus bar on the second cooler side of the first bus bar, the third insulating material is disposed between the second bus bar and the third surface; 5. The power conversion device according to claim 4, wherein the fourth insulating material is disposed opposite the second bus bar on a side of the second bus bar that faces the first cooler. (Appendix 6) 6. The power conversion device according to claim 4 or 5, comprising a plurality of the power conversion units. (Appendix 7) a first fixing hole for fixing the first bus bar to the first power semiconductor module is formed at the one end of the first bus bar; a first terminal hole to which an input terminal or an output terminal is connected is formed at the other end of the first bus bar; 7. The power conversion device according to claim 6, wherein at least one of the plurality of first bus bars has a notch formed therein for adjusting a current division ratio. (Appendix 8) a second fixing hole for fixing the second bus bar to the second power semiconductor module is formed at the one end of the second bus bar; a second terminal hole to which an input terminal or an output terminal is connected is formed at the other end of the second bus bar; The power conversion device according to claim 6 or 7, wherein at least one of the second bus bars has a notch formed therein for adjusting a current division ratio. (Appendix 9) A first cooler; a first power semiconductor module; Equipped with The first cooler is A first heat receiving block; a first heat pipe installed in the first heat receiving block; a first cooling fin that dissipates heat received by the first heat receiving block through the first heat pipe; Equipped with the first heat receiving block has a first surface and a second surface on the back side of the first surface, another cooler having the same shape as the first cooler can be disposed on the first surface side and the second surface side of the first cooler, The first power semiconductor module is mountable on both the first surface and the second surface, and is mounted on either the first surface or the second surface of the power conversion device. [Explanation of symbols]

[0100] 1 basket 2 Hoisting machine 3 Main Rope 4 Counterweight 5 Elevator shaft 6 Machine room 7 motors 8 Control Panel 9 Power conversion equipment 10 AC power supply 11 Diode Module 12 Smoothing capacitor 13 Power Semiconductor Modules 13 14 Cooler 15 Heat receiving block 16 Cooling fins 17 Heat pipe 18 Power Semiconductor Module 19 Busbar 20 Insulation material 21 Terminal hole 22 fixing hole 23 Cutout 30 sides 31 sides 32P terminal 33 N terminal 34 U terminal 35V terminal 36W terminal 40 Power conversion device 41 Converter 42 Inverter 43 Power Conversion Unit 44 terminals 45 Busbar 46 terminal holes 47 Fixing hole 48 Power conversion equipment 49 Power Conversion Unit 50 Top 51 sides 52 sides

Claims

1. Equipped with a power conversion unit, The power conversion unit includes: A first cooler; A second cooler; a third cooler; a first power semiconductor module; a second power semiconductor module; and Equipped with The first cooler is A first heat receiving block; a first heat pipe installed in the first heat receiving block; a first cooling fin that dissipates heat received by the first heat receiving block through the first heat pipe; Equipped with The second cooler is A second heat receiving block; a second heat pipe installed in the second heat receiving block; a second cooling fin that dissipates the heat received by the second heat receiving block through the second heat pipe; Equipped with the first heat receiving block has a first surface and a second surface on the back side of the first surface, the second heat receiving block has a third surface and a fourth surface on the back side of the third surface, the second cooler has the same shape as the first cooler, the first cooler and the second cooler are arranged so that the second surface and the third surface face each other, the first power semiconductor module is attached to the first surface; the second power semiconductor module is attached to the fourth surface; The third cooler is A third heat receiving block; a third heat pipe installed in the third heat receiving block; a third cooling fin that dissipates the heat received by the third heat receiving block through the third heat pipe; Equipped with the third heat receiving block has a front heat receiving surface and a rear heat receiving surface on the rear side of the front heat receiving surface, the third cooler has the same shape as the first cooler and the second cooler, The third cooler is a power conversion device arranged between the first cooler and the second cooler so that the front heat receiving surface is in indirect contact with the second surface and the back heat receiving surface is in indirect contact with the third surface.

2. a plurality of the third coolers are arranged in the same direction between the first cooler and the second cooler, The power conversion device according to claim 1 , wherein the plurality of tertiary coolers are arranged so that adjacent tertiary coolers are in contact with each other.

3. The power conversion unit includes: a first bus bar formed of a plate-shaped conductive wiring member; a second bus bar formed of a plate-shaped conductive wiring member; Further provided with the first heat receiving block has a fifth surface between the first surface and the second surface, the second heat receiving block has a sixth surface between the third surface and the fourth surface, the fifth surface and the sixth surface face in the same direction; one end of the first bus bar is fixed to the first power semiconductor module; the first bus bar extends along the second surface, and the other end thereof, as viewed from the fifth surface side of the first cooler, is disposed in front of the fifth surface, one end of the second bus bar is fixed to the second power semiconductor module; 3. The power conversion device according to claim 1, wherein the second bus bar extends along the third surface, and the other end of the second bus bar is positioned in front of the sixth surface as viewed from the sixth surface side of the second cooler.

4. The power conversion unit includes: a plate-shaped first insulating material; A plate-shaped second insulating material; a plate-shaped third insulating material; a plate-shaped fourth insulating material; Further provided with the first insulating material is disposed between the first bus bar and the second surface; the second insulating material is disposed opposite the first bus bar on the second cooler side of the first bus bar, the third insulating material is disposed between the second bus bar and the third surface; The power conversion device according to claim 3 , wherein the fourth insulating material is disposed opposite the second bus bar on the first cooler side of the second bus bar.

5. The power conversion device according to claim 3 , comprising a plurality of the power conversion units.

6. a first fixing hole for fixing the first bus bar to the first power semiconductor module is formed at the one end of the first bus bar; a first terminal hole to which an input terminal or an output terminal is connected is formed at the other end of the first bus bar; The power conversion device according to claim 5 , wherein at least one of the plurality of first bus bars has a notch formed therein for adjusting a current division ratio.

7. a second fixing hole for fixing the second bus bar to the second power semiconductor module is formed at the one end of the second bus bar; a second terminal hole to which an input terminal or an output terminal is connected is formed at the other end of the second bus bar; The power conversion device according to claim 5 , wherein at least one of the second bus bars has a notch formed therein for adjusting a current division ratio.

8. A first cooler; a first power semiconductor module; Another cooler having the same shape as the first cooler; Equipped with The first cooler is A first heat receiving block; a first heat pipe installed in the first heat receiving block; a first cooling fin that dissipates heat received by the first heat receiving block through the first heat pipe; Equipped with the first heat receiving block has a first surface and a second surface on the back side of the first surface, the first cooler is capable of disposing the other coolers on the first surface side and the second surface side in the same orientation as the first cooler, the first power semiconductor module is attachable to both the first surface and the second surface, and is attached to the first surface or the second surface; The other cooler is arranged to be in contact with one of the first surface and the second surface on which the first power semiconductor module is not attached.

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