Multilayer electronic device with capacitor having precisely controlled capacitive area - Patents.com

Abstract

To provide a multilayer electronic device and a method of forming the same.SOLUTION: A multilayer electronic device includes a plurality of dielectric layers stacked in a Z-direction that is perpendicular to an X-Y plane. The device further includes a first conductive layer 502 overlying one of the dielectric layers, and a second conductive layer 504 overlying another of the dielectric layers and separated from the first conductive layer in the Z-direction. The second conductive layer overlaps the first conductive layer in the X-Y plane at an overlapping area to form a capacitor. The first conductive layer has a pair of parallel edges 506, 508 at a boundary 510 of the overlapping area, and an offset edge 512, 516 within the overlapping area that is parallel with the pair of parallel edges. An offset distance between the offset edge and at least one of the pair of parallel edges is less than about 500 micrometers (500 microns).SELECTED DRAWING: Figure 5A

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of the filing date of U.S. Provisional Patent Application No. 62 / 782,496, having a filing date of December 20, 2018, which is incorporated herein by reference in its entirety. [Background technology]

[0002] Multilayer electronic devices often include capacitors. For example, multilayer filters often include one or more capacitors designed to provide very specific capacitance values. However, precise control over the capacitance of such capacitors can be difficult to achieve because it involves precisely controlling the capacitive area of ​​the capacitor.

[0003] Precise control over capacitance is particularly important in high-frequency filters. Filtering high-frequency signals, such as high-frequency radio signal communications, has become increasingly common in recent years. Demand for increased data transmission speeds for wireless connectivity has increased the demand for high-frequency components, including those configured to operate at high frequencies, including 5G spectrum frequencies. High-frequency applications often require capacitors exhibiting very low capacitance values. To achieve such capacitors, very small capacitive areas must be precisely controlled, which can further increase the difficulty of forming such precise capacitors. Therefore, there is a need in the art for multilayer filters including capacitors with precisely controlled capacitive areas. Summary of the Invention [Means for solving the problem]

[0004] According to one embodiment of the present disclosure, a multilayer electronic device may include a plurality of dielectric layers stacked in a Z direction perpendicular to an XY plane. The multilayer electronic device may include a first conductive layer overlying one of the plurality of dielectric layers. The multilayer electronic device may include a second conductive layer overlying another of the plurality of dielectric layers and spaced apart from the first conductive layer in the Z direction. The second conductive layer may overly the first conductive layer in the XY plane in an overlapping area to form a capacitor. The first conductive layer may have a pair of parallel edges at a boundary of the overlapping area. The first conductive layer may have an offset edge within the overlapping area that is parallel to the pair of parallel edges. The offset edge is offset from at least one of the pair of parallel edges by an offset distance of less than about five hundred micrometers (500 microns).

[0005] According to another embodiment of the present disclosure, a method for forming a frequency multilayer electronic device may include providing a plurality of dielectric layers and forming a first conductive layer overlying one of the plurality of dielectric layers. The first conductive layer may have a pair of parallel edges and an offset edge parallel to the pair of parallel edges. The offset edge is offset from at least one of the pair of parallel edges by an offset distance of less than about five hundred micrometers (500 microns). The method may include forming a second conductive layer overlying another of the plurality of dielectric layers. The method may include stacking the plurality of dielectric layers in a Z direction perpendicular to the XY plane such that the first conductive layer overlies the second conductive layer in the XY plane in the overlapping area. The pair of parallel edges of the first conductive layer may intersect a boundary of the overlapping area. The offset edge of the first conductive layer may be located within the overlapping area.

[0006] According to another embodiment of the present disclosure, a method for designing a capacitor for a multilayer electronic device can include calculating a target overlap area and selecting dimensions of the overlap area based on the target overlap area. The method can include sizing an offset distance between the offset edge and at least one of a pair of parallel edges of the conductive layers to adjust the size of the overlap area and reduce a difference between the size of the overlap area and the size of the target overlap area. The pair of parallel edges of the conductive layers can be located at a boundary of the overlap area. The offset edge can be located within the overlap area.

[0007] A full and enabling disclosure of the present disclosure, including the best mode thereof, to one of ordinary skill in the art, is set forth more particularly in the remainder of the specification, including reference to the accompanying figures, in which: [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a simplified schematic diagram of a bandpass filter according to an aspect of the present disclosure. [Figure 2] FIG. 1 is a simplified schematic diagram of another bandpass filter according to aspects of the present disclosure. [Figure 3A] FIG. 1 is a perspective view of an exemplary bandpass filter according to aspects of the present disclosure. [Figure 3B] FIG. 1 is a perspective view of an exemplary bandpass filter according to aspects of the present disclosure. [Figure 3C] FIG. 3C is a side view of the filter of FIGS. 3A and 3B. [Figure 4A] 3C is a series of successive plan views of the filter of FIGS. 3A and 3B, with additional layers shown in each successive view. [Figure 4B] 3C is a series of successive plan views of the filter of FIGS. 3A and 3B, with additional layers shown in each successive view. [Figure 4C] 3C is a series of successive plan views of the filter of FIGS. 3A and 3B, with additional layers shown in each successive view. [Figure 4D] 3C is a series of successive plan views of the filter of FIGS. 3A and 3B, with additional layers shown in each successive view. [Figure 4E] 3C is a series of successive plan views of the filter of FIGS. 3A and 3B, with additional layers shown in each successive view. [Figure 5A] FIG. 4C is a plan view of a first capacitor of the multilayer filter of FIGS. 3A-4E according to an embodiment of the present disclosure. [Figure 5B] FIG. 5 is a plan view of a second capacitor of the multilayer filter of FIGS. 3A-4E according to an embodiment of the present disclosure. [Figure 5C] FIG. 5B is a plan view of a third capacitor of the multilayer filter of FIGS. 3A-4E according to an embodiment of the present disclosure. [Figure 5D] FIG. 5B is a plan view of a fourth capacitor of the multilayer filter of FIGS. 3A-4E according to an embodiment of the present disclosure. [Figure 5E] FIG. 7B is a plan view of another embodiment of a capacitor that may correspond to the second capacitor of the multi-layer filter of FIGS. 6A-7D, according to aspects of the present disclosure. [Figure 6A] FIG. 10 is a perspective view of another embodiment of a multi-layer filter according to aspects of the present disclosure. [Figure 6B] FIG. 10 is a perspective view of another embodiment of a multi-layer filter according to aspects of the present disclosure. [Figure 6C] FIG. 6C is a side view of the filter of FIGS. 6A and 6B. [Figure 7A] 6C is a series of successive plan views of the filter of FIGS. 6A and 6B, with additional layers shown in each successive view. [Figure 7B] 6C is a series of successive plan views of the filter of FIGS. 6A and 6B, with additional layers shown in each successive view. [Figure 7C] 6C is a series of successive plan views of the filter of FIGS. 6A and 6B, with additional layers shown in each successive view. [Figure 7D] 6C is a series of successive plan views of the filter of FIGS. 6A and 6B, with additional layers shown in each successive view. [Figure 8A] FIG. 10 is a perspective view of another embodiment of a multi-layer filter according to aspects of the present disclosure. [Figure 8B] FIG. 8B is a side view of the filter of FIG. 8A. [Figure 9A]8C is a series of successive plan views of the filter of FIGS. 8A and 8B, with additional layers shown in each successive view. [Figure 9B] 8C is a series of successive plan views of the filter of FIGS. 8A and 8B, with additional layers shown in each successive view. [Figure 9C] 8C is a series of successive plan views of the filter of FIGS. 8A and 8B, with additional layers shown in each successive view. [Figure 9D] 8C is a series of successive plan views of the filter of FIGS. 8A and 8B, with additional layers shown in each successive view. [Figure 10A] FIG. 10 is a perspective view of another embodiment of a multi-layer filter according to aspects of the present disclosure. [Figure 10B] FIG. 10B is a side view of the filter of FIG. 10A. [Figure 11A] 10C is a series of successive plan views of the filter of FIGS. 10A and 10B, with additional layers shown in each successive view. [Figure 11B] 10C is a series of successive plan views of the filter of FIGS. 10A and 10B, with additional layers shown in each successive view. [Figure 11C] 10C is a series of successive plan views of the filter of FIGS. 10A and 10B, with additional layers shown in each successive view. [Figure 11D] 10C is a series of successive plan views of the filter of FIGS. 10A and 10B, with additional layers shown in each successive view. [Figure 12] 1 is a plot of test data including measured insertion loss and return loss values ​​of constructed filters according to aspects of the present disclosure. [Figure 13] 10 is a plot of test data including measured insertion loss and return loss values ​​for constructed filters, according to aspects of the present disclosure. [Figure 14] 10 is a plot of test data including measured insertion loss and return loss values ​​for constructed filters, according to aspects of the present disclosure. [Figure 15]1 is a plot of simulation data including insertion loss and return loss values ​​from a computer analysis of a filter, according to an aspect of the present disclosure. [Figure 16] 1 is a plot of simulation data including insertion loss and return loss values ​​from a computer analysis of a filter, according to an aspect of the present disclosure. [Figure 17] 1 is a plot of simulation data including insertion loss and return loss values ​​from a computer analysis of a filter, according to an aspect of the present disclosure. [Figure 18] FIG. 1 is a perspective view of a test assembly including a filter, according to an aspect of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0009] Repeat use of reference characters in the present specification and drawings is intended to represent same or analogous features or elements of the present disclosure. Those skilled in the art should understand that this discussion is merely a description of exemplary embodiments and is not intended to limit the broader aspects of the present disclosure, which are embodied in the exemplary structures.

[0010] Generally, the present disclosure is directed to a multilayer electronic device including a capacitor with a precisely controlled capacitive area. The multilayer electronic device can include multiple dielectric layers stacked in a Z direction perpendicular to an XY plane. The multilayer electronic device can include a first conductive layer overlying one of the multiple dielectric layers. A second conductive layer can overly another of the multiple dielectric layers and be spaced apart from the first conductive layer in the Z direction. The second conductive layer can overly the first conductive layer in the XY plane in the overlapping area to form a capacitor.

[0011] The first conductive layer is located within the overlap area, thereby slightly adjusting the size of the overlap area. The first conductive layer may include a protrusion or recess that provides a gap between the first conductive layer and the second conductive layer. More specifically, the first conductive layer may have a pair of parallel edges at the boundary of the overlapping area. The first conductive layer may have an offset edge located within the overlapping area and parallel to the pair of parallel edges at the boundary of the overlapping area. An offset distance may be defined between the offset edge and at least one of the pair of parallel edges. The offset distance may be less than about 500 micrometers (500 microns).

[0012] The multilayer filter can include one or more dielectric materials. In some embodiments, the one or more dielectric materials can have a low dielectric constant. The dielectric constant can be less than about 100, in some embodiments less than about 75, in some embodiments less than about 50, in some embodiments less than about 25, in some embodiments less than about 15, and in some embodiments less than about 5. For example, in some embodiments, the dielectric constant can range from about 1.5 to about 100, in some embodiments from about 1.5 to about 75, and in some embodiments from about 2 to about 8. The dielectric constant can be determined according to IPC TM-650 2.5.5.3 at an operating temperature of 25°C and a frequency of 1 MHz. The dissipation factor can range from about 0.001 to about 0.04, in some embodiments from about 0.0015 to about 0.0025.

[0013] In some embodiments, the one or more dielectric materials can include organic dielectric materials. Exemplary organic dielectrics include polyphenyl ether (PPE)-based materials such as Polyclad's LD621 and Park / Nelco Corporation's N6000 series, liquid crystal polymers (LCPs) such as Rogers Corporation or W.L. Gore & Associates, Inc.'s LCPs, hydrocarbon composites such as Rogers Corporation's 400 series, and epoxy-based laminates such as Park / Nelco Corp.'s N4000 series. For example, examples include epoxy-based N4000-13, bromine-free materials laminated to LCPs, organic layers with high-K materials, unfilled high-K organic layers, Rogers 4350, Rogers 4003 materials, and other thermoplastic materials such as polyphenylene sulfide resins, polyethylene terephthalate resins, polybutylene terephthalate resins, polyethylene sulfide resins, polyether ketone resins, polytetrafluoroethylene resins, and graft resins, or similar low-dielectric-constant, low-loss organic materials.

[0014] In some embodiments, the dielectric material can be a ceramic-filled epoxy. For example, the dielectric material can include an organic compound such as a polymer (e.g., an epoxy) and can contain particles of a ceramic dielectric material such as barium titanate, calcium titanate, zinc oxide, alumina with low-fire glass, or other suitable ceramic or glass-bonding material.

[0015] However, other materials may be utilized, including N6000, epoxy-based N4000-13, bromine-free materials laminated to LCP, organic layers with high-K materials, unfilled high-K organic layers, Rogers 4350 (from Rogers Corporation), Rogers 4003 materials, and other thermoplastic materials such as hydrocarbons, Teflon, FR4, epoxies, polyamides, polyimides, and other thermoplastic materials such as acrylates, polyphenylene sulfide resins, polyethylene terephthalate resins, polybutylene terephthalate resins, polyethylene sulfide resins, polyether ketone resins, polytetrafluoroethylene resins, BT resin compounds (e.g., Speedboard C), thermosetting resins (e.g., Hitachi MCL-LX-67F), and graft resins, or similar low dielectric constant, low loss organic materials.

[0016] Additionally, in some embodiments, the following may be used: Non-organic dielectric materials can be used, including ceramic, semiconducting, or insulating materials such as sodium, zinc oxide, alumina with low-fire glass, or other suitable ceramic or glass-bonding materials. Alternatively, the dielectric material can be an organic compound such as epoxy (with or without a ceramic blend, with or without fiberglass), which is common as a circuit board material, or other plastics commonly used as dielectrics. In these cases, the conductor is typically copper foil chemically etched to provide a pattern. In still further embodiments, the dielectric material can include a material with a relatively high dielectric constant (K), such as one of NPO(COG), X7R, X5R, X7S, Z5U, Y5V, and strontium titanate. In such examples, the dielectric material can have a dielectric constant greater than 100, e.g., in the range of about 100 to about 4000, and in some embodiments, in the range of about 1000 to about 3000.

[0017] One or more conductive layers can be formed directly on the dielectric layer. Alternatively, a coating or intermediate layer can be disposed between the conductive layer and the respective dielectric layer. As used herein, "formed on" can refer to a conductive layer formed directly on a dielectric layer, or a conductive layer that overlies a dielectric layer with an intermediate or coating layer between them.

[0018] The conductive layer can include a wide variety of conductive materials, for example, the conductive layer can include copper, nickel, gold, silver, or other metals or alloys. In some embodiments, the multilayer electronic device can include a signal path having an input and an output. The signal path can include one or more conductive layers overlying one or more of the dielectric layers and connected to one or more vias.

[0019] Vias can be formed in one or more of the dielectric layers. For example, vias can electrically connect a conductive layer on one dielectric layer to a conductive layer on another dielectric layer. Vias can include a wide variety of conductive materials, such as copper, nickel, gold, silver, or other metals or alloys. Vias can be formed by drilling (e.g., mechanically drilling, laser drilling) through-holes and plating the through-holes with a conductive material, for example, using electroless plating or a copper seed. The vias can be filled with a conductive material, forming a solid pillar of conductive material. Alternatively, the interior surface of the through-hole can be plated so that the vias are hollow.

[0020] In some embodiments, the multilayer electronic device can include an inductor. The inductor can include a conductive layer formed on one of the plurality of dielectric layers. The inductor can be electrically connected to a signal path at a first location and electrically connected to at least one of the signal path or ground at a second location. For example, the inductor can form a portion of the signal path or can be connected between the signal path and ground.

[0021] In some embodiments, at least one of the dielectric layers may have a thickness of less than about 180 micrometers (180 microns), in some embodiments less than about 120 micrometers (120 microns), in some embodiments less than about 100 micrometers (100 microns), in some embodiments less than about 80 micrometers (80 microns), in some embodiments less than about 60 micrometers (60 microns), in some embodiments less than about 50 micrometers (50 microns), in some embodiments less than about 40 micrometers (40 microns), in some embodiments less than about 30 micrometers (30 microns), and in some embodiments less than about 20 micrometers (20 microns).

[0022] One or more vias can be formed in the dielectric layer. The vias can electrically connect different conductive layers. The vias can have a length of less than about 180 micrometers (180 microns), in some embodiments less than about 100 micrometers (100 microns), and in some embodiments less than about 80 micrometers (80 microns).

[0023] The vias can have a wide variety of suitable widths. For example, in some embodiments, the width of the vias can range from about 20 micrometers (20 microns) to about 200 micrometers (200 microns), in some embodiments, from about 40 micrometers (40 microns) to about 180 micrometers (180 microns), in some embodiments, from about 60 micrometers (60 microns) to about 140 micrometers (40 microns), and in some embodiments, from about 80 micrometers (80 microns) to about 120 micrometers (120 microns).

[0024] In some embodiments, the multilayer electronic device can be configured as a filter. The filter can be configured to operate at high frequencies. The multilayer filter can have a characteristic frequency (e.g., a low-pass frequency, a high-pass frequency, an upper band-pass frequency, or a lower band-pass frequency) greater than 6 GHz. In some embodiments, the filter can have a characteristic frequency greater than about 6 GHz, greater than about 10 GHz, greater than about 15 GHz, greater than about 20 GHz, greater than about 25 GHz, greater than about 30 GHz, greater than about 35 GHz, greater than about 40 GHz, greater than about 45 GHz, greater than about 50 GHz, greater than about 60 GHz, greater than about 70 GHz, and greater than about 80 GHz.

[0025] The filter may exhibit superior performance characteristics, such as low insertion loss for frequencies within the passband frequency range of the filter. For example, the average insertion loss for frequencies within the passband frequency range may be greater than -15 dB, in some embodiments greater than -10 dB, in some embodiments greater than -5 dB, and in some embodiments greater than -2.5 dB or greater.

[0026] Additionally, the filter may exhibit excellent frequency rejection outside the passband frequency range, and in some embodiments, the insertion loss for frequencies outside the passband frequency range may be less than about −15 dB, in some embodiments, less than about −25 dB, in some embodiments, less than about −35 dB, and in some embodiments, less than about −40 dB.

[0027] In addition, the filter may exhibit a steep roll-off from the passband frequency range to frequencies outside the passband. For example, for frequencies just outside the passband frequency range, the insertion loss may decrease at a rate of about 0.1 dB / MHz, in some embodiments greater than about 0.2 dB / MHz, in some embodiments as much as about 0.3 dB / MHz, and in some embodiments greater than about 0.4 dB / MHz.

[0028] The filter may also exhibit consistent performance characteristics (e.g., insertion loss, return loss, etc.) over a wide temperature range. In some embodiments, the insertion loss of the filter may vary by less than 5 dB over a large temperature range. For example, the filter may exhibit a first insertion loss at a first frequency at about 25° C. The filter may exhibit a second insertion loss at approximately the first frequency at a second temperature. The temperature difference between the first temperature and the second temperature can be about 70° C. or greater, in some embodiments about 60° C. or greater, in some embodiments about 50° C. or greater, in some embodiments about 30° C. or greater, and in some embodiments about 20° C. or greater. As an example, the first temperature can be 25° C. and the second temperature can be 85° C. As another example, the first temperature can be 25° C. and the second temperature can be −55° C. The difference between the second insertion loss and the first insertion loss can be about 5 dB or less, in some embodiments about 2 dB or less, in some embodiments about 1 dB or less, in some embodiments about 0.75 dB or less, in some embodiments about 0.5 dB or less, and in some embodiments about 0.2 dB or less.

[0029] However, it should be understood that in other embodiments, the multilayer electronic device can be any suitable type of device, including a capacitor, for example, the multilayer electronic device can be a multilayer capacitor, a multilayer capacitor array, a multilayer transformer (e.g., a balun), etc.

[0030] In some embodiments, the device can have a total length ranging from about 0.5 mm to about 30 mm, in some embodiments, from about 1 mm to about 15 mm, and in some embodiments, from about 2 mm to about 8 mm.

[0031] In some embodiments, the device can have a total length ranging from about 0.2 mm to about 20 mm, in some embodiments from about 0.5 mm to about 15 mm, in some embodiments from about 1 mm to about 10 mm, and in some embodiments, from about 2 mm to about 8 mm.

[0032] The devices can generally be low-profile or thin. For example, in some embodiments, the devices can have an overall thickness ranging from about 100 micrometers (100 microns) to about 2 mm, in some embodiments, from about 150 micrometers (50 microns) to about 1 mm, and in some embodiments, from about 200 micrometers (200 microns) to about 300 micrometers (300 microns).

[0033] Regardless of the particular configuration used, the inventors have discovered that precise control over the capacitance of a capacitor can be achieved through selective control over the shape of the conductive layers of the capacitor. More particularly, precise control can be achieved over the size of the overlap area formed between the conductive layers. The first conductive layer can include protrusions or recesses located within the overlap area, thereby slightly adjusting the size of the overlap area.

[0034] The first conductive layer can have a pair of parallel edges at the boundary of the overlap area. The first conductive layer can have an offset edge located within the overlap area and parallel to the pair of parallel edges at the boundary of the overlap area. An offset distance can be defined between the offset edge and at least one of the pair of parallel edges. The offset distance can be less than about 500 micrometers (500 microns), in some embodiments less than about 400 microns, in some embodiments less than about 300 micrometers (300 microns), in some embodiments less than about 200 micrometers (200 microns), in some embodiments less than about 100 micrometers (100 microns), in some embodiments less than about 75 microns, and in some embodiments less than about 50 micrometers (50 microns).

[0035] The conductive layer can be formed using a variety of suitable techniques. Subtractive, semi-additive, or fully additive processes can be used in conjunction with panel or pattern electroplating of conductive material, followed by printing and etching steps to define the patterned conductive layer. Photolithography, plating (e.g., The conductive layer can be formed using electrolytic plating, sputtering, vacuum deposition, printing, or other techniques. For example, a thin layer of conductive material (e.g., a foil) can be adhered (e.g., laminated) to the surface of the dielectric layer. The thin layer of conductive material can be selectively etched using a mask and photolithography to produce a desired pattern of conductive material on the surface of the dielectric material.

[0036] Finite resolution or feature size is achievable regardless of the particular process used. A "minimum line width" may be defined as the smallest accurately manufacturable feature size of the process or processes used. In some embodiments, the minimum line width may be about 100 micrometers (100 microns) or less, in some embodiments, about 75 microns or less, and in some embodiments, about 50 microns or less. A "minimum area unit" may be defined as the square of the minimum line width. A minimum area unit is about 0.01 mm 2 or less, in some embodiments, about 0.0052 mm 2 or less, and in some embodiments, about 0.0026 mm 2 It can be as follows:

[0037] In some embodiments, the capacitor can be less sensitive to small relative misalignments between the dielectric layers on which the conductive layers are formed. Thus, the capacitor can be described as "self-aligned." For example, the first conductive layer can have smaller dimensions than the second conductive layer. The first conductive layer can be located within the periphery of the second conductive layer in the XY plane. In another example, the first conductive layer can be elongated in a first direction and overlie the second conductive layer such that edges of the second capacitor bound the overlap area in the first direction. Edges of the first conductive layer can bound the overlap area in a second direction orthogonal to the first direction.

[0038] The protrusions or recesses described herein can allow for precise selection or adjustment of the size of the overlap area formed between two conductive layers. More specifically, the protrusions or recesses can allow the size of the overlap area to be increased or decreased by as little as one minimum area unit. Such precision can allow for greater control over the overlap area than simply increasing the width of one of the conductive layers by a minimum line width.

[0039] The protrusion or recess can be at least partially disposed within the overlap area such that the overlap area remains insensitive to slight relative shifts between the conductive layers. For example, the protrusion or recess can be associated with a width discontinuity edge. The width discontinuity edge can be located at least one minimum line width from the edge of the overlap area such that slight shifts do not cause the protrusion or recess to intersect the boundary of the overlap area.

[0040] The protrusions or recesses can be reduced in size. As a result, the protrusions or recesses can increase or decrease the overlap area by a small amount. For example, the protrusions or recesses can be reduced in size by approximately 0.2 mm. 2 less than, in some embodiments, about 0.15 mm 2 less than, in some embodiments, about 0.1 mm 2less than, in some embodiments, about 0.05 mm 2 less than, in some embodiments, about 0.01 mm 2 less than, in some embodiments, about 0.005 mm 2 less than, in some embodiments, about 0.0026 mm 2 less than, and in some embodiments, about 0.001 mm 2 The protrusions or recesses may have an area ranging from 1 to 20 minimum area units, in some embodiments from 1 to 10 minimum area units, in some embodiments from 1 to 5 minimum area units, and in some embodiments from 1 to 3 minimum area units.

[0041] The protrusions or depressions are less than about 400 micrometers (400 microns), some In embodiments, they may have a length or width that is less than about 300 micrometers (300 microns), in some embodiments, less than about 200 micrometers (200 microns), in some embodiments, less than about 100 micrometers (100 microns), in some embodiments, less than about 75 micrometers (75 microns), and in some embodiments, less than about 50 micrometers (50 microns). Protruding or recessed features may have a length or width that is less than about 10 minimum line widths, in some embodiments, less than about 8 minimum line widths, in some embodiments, less than about 4 minimum line widths, in some embodiments, less than about 3 minimum line widths, and in some embodiments, less than about 1 minimum line width.

[0042] The capacitors may have a small overlapping area (e.g., capacitive area). For example, in some embodiments, the capacitive area of ​​the capacitors is about 0.5 square millimeters (mm 2 ), in some embodiments less than about 0.3 mm 2 less than, in some embodiments, about 0.2 mm 2 less than, in some embodiments, about 0.1 mm 2 less than, in some embodiments, about 0.05 mm 2 less than, and in some embodiments, about 0.02 mm2 It can be less than.

[0043] The filter can include a first layer of a first dielectric material between the electrodes of the capacitor. The first dielectric material can be separate from a second dielectric material in another layer of the filter. For example, the first dielectric material between the electrodes can include a ceramic-filled epoxy. The first dielectric material can have a dielectric constant ranging from about 5 to about 9, and in some embodiments, from about 6 to about 8. The second dielectric material can include an organic dielectric material, for example, as described above. The second dielectric material can have a dielectric constant ranging from about 1 to about 5, and in some embodiments, from about 2 to about 4.

[0044] The area of ​​the protrusions or recesses can occupy a small portion of the overlap area of ​​the capacitor. For example, in some embodiments, an overlapping area-to-feature-area ratio can be defined as the ratio of the area of ​​the overlapping area to the area of ​​the protrusions or recesses within the overlapping area. The overlapping area-to-feature-area ratio can be greater than about 1, in some embodiments greater than about 2, in some embodiments greater than about 5, in some embodiments greater than about 7, in some embodiments greater than about 10, in some embodiments greater than about 15, and in some embodiments greater than about 30.

[0045] The first conductive layer of the capacitor may be spaced apart from the second conductive layer of the capacitor by less than about 100 micrometers (100 microns), in some embodiments less than about 80 micrometers (80 microns), in some embodiments less than about 60 micrometers (60 microns), in some embodiments less than about 40 micrometers (40 microns), and in some embodiments, by about 20 micrometers (20 microns) or less. I. Multi-layer filter 1 is a simplified schematic diagram of a multi-layer filter 100 according to an embodiment of the present disclosure. The filter 100 may include one or more inductors 102, 104, 106 and one or more capacitors 108, 110, 112. An input voltage (V i ) can be input to the filter 100, and the output voltage (represented by V in FIG. 1 o ) can be output by filter 100. Bandpass filter 100 can significantly reduce low and high frequencies while allowing frequencies within the passband frequency range to pass through filter 100 substantially unaffected. It should be understood that the simple filter 100 described above is merely a simple example of a bandpass filter, and that aspects of the present disclosure can be applied to more complex bandpass filters. Additionally, aspects of the present disclosure can be applied to more complex bandpass filters, including, for example, lowpass or highpass filters. The present invention may be applied to other types of filters, including

[0046] 2 is a schematic diagram of an exemplary embodiment of a bandpass filter 200 according to aspects of the present disclosure. A signal path 201 may be defined between an input 202 and an output 204 of the filter 200. An input voltage (V in FIG. 1 ) is applied between the input 202 and ground 206 of the filter 200. i ) can be input to the filter 200. The output voltage (represented by V in FIG. 1) is connected between the output 204 and ground 206. o ) can be output by the filter 200.

[0047] The filter 200 may include a first inductor 208 and a first capacitor 210 electrically connected in parallel to each other. The first inductor 208 and the first capacitor 210 may be electrically connected between the signal path 201 and ground 206. The filter 200 may include a second inductor 212 and a second capacitor 214 electrically connected in parallel to each other. The second inductor 212 and the second capacitor 214 may be connected in series with the signal path 201 (e.g., may form a portion of the signal path 201). The filter 200 may include a third inductor 210 and a third capacitor 214 electrically connected in parallel to each other. The third inductor 210 and the third capacitor 214 may be electrically connected between the signal path 201 and ground 206. The third inductor 210 and the third capacitor 214 may be connected in series with the signal path 201 (e.g., may form a portion of the signal path 201). The filter 200 may include a fourth inductor 220 and a fourth capacitor 222 electrically connected in parallel with each other. The fourth inductor 220 and the fourth capacitor 222 may be electrically connected between the signal path 201 and ground 206.

[0048] The inductance values ​​of inductors 208, 212, 216, and 220 and the capacitance values ​​of capacitors 210, 214, 218, and 222 can be selected to produce a desired bandpass frequency range for bandpass filter 200. Bandpass filter 200 can significantly reduce frequencies outside the passband frequency range while allowing frequencies within the passband frequency range to pass through filter 200 substantially unaffected.

[0049] 3A and 3B are perspective views of an exemplary bandpass filter 300 according to an embodiment of the present disclosure. FIG. 3C is a side view of the filter 300 of FIGS. 3A and 3B. Referring to FIGS. 3A-3C, the bandpass filter 300 can include multiple dielectric layers (transparent for clarity). Referring to FIG. 3C, a first dielectric layer 304, a second dielectric layer 306, and a third dielectric layer 308 can be stacked to form a unitary structure. The filter 300 can be mounted to a mounting surface 302, such as a printed circuit board. Conductive layers 303, 305, 307, and 309 can be formed on the dielectric layers 304, 306, and 308. The conductive layer 303 can be formed on the bottom surface of the first dielectric layer 304. The conductive layers 305 and 307 can be formed on the top and bottom surfaces, respectively, of the second dielectric layer 306. The ground may include a ground plane 312 exposed and / or terminated along the bottom surface (bottom surface of conductive layer 303) of filter 300. The mounting surface may include one or more terminals 310 for connecting with ground plane 312.

[0050] 4A-4E are a series of successive plan views of filter 300, with additional layers shown in each successive view. More specifically, FIG. 4A shows mounting surface 302 and first conductive layer 303. FIG. 4B shows ground plane 312 formed on the bottom surface of first dielectric layer 304. FIG. 4C further shows conductive layer 305 formed on the top surface of first dielectric layer 304. FIG. 4D further shows conductive layer 307 formed on second dielectric layer 306. FIG. 4E shows third conductive layer 307 formed on top of second dielectric layer 306. 3 shows a conductive layer 309 formed on the dielectric layer 308. The dielectric layers 304, 306, 308 are transparent to show the relative rearrangement of the various patterned conductive layers 303, 305, 307, 309.

[0051] The bandpass filter 300 may include a signal path 316 having an input 318 and an output 320. The signal path 316 may electrically connect the input 318 and the output 320. More specifically, the signal path 316 may include multiple dielectric layers and / or vias formed in and on the multiple dielectric layers 304, 306, 308 and electrically connected between the input 318 and the output 320. The signal path 316 may include one or more vias 322 electrically connecting the input 318 to an intermediate conductive layer 324 disposed between the first layer 304 and the second layer 306. The signal path 316 may include one or more vias 326 electrically connecting the intermediate layer 324 to a conductive layer 328 formed on the second dielectric layer 306.

[0052] A first capacitor can be formed between a portion 336 of the signal path 316 formed on the upper surface of the second layer 360 and a conductive layer 330 formed on the lower surface of the second layer 306 of dielectric material. The second layer 306 can have a different dielectric constant than one or more of the other layers 304, 308. For example, the dielectric material of the second layer 306 can have a dielectric constant ranging from about 5 to about 8, per IPC TM-650 2.5.5.3, at an operating temperature of 25° C. and a frequency of 1 MHz. One or more of the other layers 304, 308 can have a dielectric constant ranging from about 1 to about 4, per IPC TM-650 2.5.5.3, at an operating temperature of 25° C. and a frequency of 1 MHz.

[0053] The conductive layer 330 may be electrically connected to the ground plane 312. The first capacitor of the filter 300 may correspond to the first capacitor 210 of the circuit diagram 200 of FIG. 2. The conductive layer 330 may be capacitively coupled to a portion 336 of the signal path 316. The conductive layer 330 may be spaced apart from the portion 336 of the signal path 316 in the Z direction. The conductive layer 330 may be electrically connected to the ground plane 312 by one or more vias 334.

[0054] The first capacitor may be less sensitive to relative misalignment of the electrodes of the first capacitor. This may be described as “self-alignment.” As best seen in FIG. 4D , the portion 336 of the signal path 316 may generally have smaller dimensions (e.g., in the X and Y directions) than the conductive layer 330 of the first capacitor. In addition, the portion 336 of the signal path 316 may define connections in the XY plane with other elements and portions of the signal path 316. Such connections may be sized so that slight misalignments in the X or Y directions do not change the capacitive area of ​​the first capacitor. More specifically, the size of the effective overlap area (e.g., in the XY plane) between the conductive layer 330 and the portion 336 of the signal path 316 may be less sensitive to slight misalignments in the X or Y directions of the second and third layers 304, 306.

[0055] For example, portion 336 of signal path 316 may include tab 337 (e.g., extending in the X direction) having a width (e.g., in the Y direction) equal to the width (e.g., in the Y direction) of connector portion 338 on the opposite side of portion 336. Similarly, connection portion 340, which may have the same width, may extend from the opposite side of portion 336 (e.g., in the Y direction). As a result, the relative offset in the Y direction may not change the overlap area between conductive layer 330 and portion 336 of signal path 316.

[0056] The filter 300 is electrically connected to a signal path 316 and a ground plane 312. 3B , the filter 300 may include a first inductor 342. The first inductor 342 of the filter 300 may correspond to the first inductor 208 of the circuit diagram 200 of FIG. 2. The first inductor 342 may be connected to a portion 336 of the signal path 316, forming a first capacitor, by a connector portion 338. The first inductor 342 may be electrically connected to the ground plane 312 by one or more vias 344 (best seen in FIG. 3B ).

[0057] The signal path 316 of the filter 300 may include a second inductor 346, which may correspond to the second inductor 212 of the circuit diagram 200 of FIG. 2. The second inductor 346 may be formed on the third layer 308 (best seen in FIG. 3C ). The second inductor 346 may be electrically connected to the signal path 316 at each of a first location 349 and a second location 351. In other words, the second inductor 346 may form a portion of the signal path 316 between the input 318 and the output 320.

[0058] One or more vias 348 may connect the second inductor 346 at a first location 349 with a portion 354 of the signal path 316 on the second layer 306 (best seen in FIGS. 3B, 4D, and 4E). One or more vias 348 may connect the first inductive element 346 at a second location 351 with each of the portions 369 of the signal path 316 on the top surface of the second layer 306 and with a conductive layer 352 on the bottom surface of the second layer 306 (forming a second capacitor with the portion 354 of the signal path 316, described below). As best seen in FIGS. 3A and 4E, the inductor 346 may have four corners. Thus, the first inductor 346 may form a “loop” that is more than a semicircle.

[0059] A second capacitor may be formed between the conductive layer 352 and a portion 354 of the signal path 316. The second capacitor may correspond to the second capacitor 214 of the circuit diagram 200 of FIG. 2. The second capacitor may be a self-aligned capacitor. The second capacitor may include, for example, one or more protrusions 552, described below with reference to FIG. 5B.

[0060] 2. The third inductor 356 of the filter 300 may correspond to the third inductor 216 of the circuit diagram 200 of FIG. 2. The third inductor 356 may be connected to a portion 369 of the signal path 316 connected to the second inductor 346 by one or more vias 360 at a first location 357. The third inductor 356 may be connected to a portion 361 of the signal path 316 connected to the output 320 by one or more vias 360 at a second location 359. The portion 361 of the signal path 316 may be electrically connected to the output 320 by one or more vias 366 and / or intermediate layers 368. In other words, the third inductor 356 may form a portion of the signal path 316 between the second inductor 346 and the output 320.

[0061] A third capacitor may be formed in parallel with the third inductor 356. The third capacitor may correspond to the third capacitor 214 of the circuit diagram 200 of FIG. 2. The third capacitor of the filter 300 may include a conductive layer 367 capacitively coupled to a portion 369 of the signal path 316. The third capacitor may include, for example, a protrusion 572, described below with reference to FIG. 5C.

[0062] The fourth inductor 370 may be electrically connected to the signal path 316 at a first location 371 and to the ground plane 312 at a second location 373 by vias 374. The vias 374 may be connected by an intermediate layer 376. 2. The fourth inductor 370 of the filter 300 may correspond to the fourth inductor 220 of the circuit diagram 200 of FIG. 2. The fourth inductor 370 of the filter 300 may be connected to the signal path 316 at a portion 361 of the signal path 316 that is electrically connected to the output 320. The fourth inductor 370 may have three corners 372 and may form a generally quadrant-shaped loop.

[0063] The fourth capacitor may include a conductive layer 380 capacitively coupled to a portion 361 of the signal path 316 connected to the output 320. The conductive layer 380 of the fourth capacitor may be electrically connected to the ground plane 312 by a via 382. The fourth capacitor may correspond to the fourth capacitor 222 of the circuit diagram 200 of Figure 2. The fourth capacitor may be self-aligned and may include, for example, a protrusion 583, as described below with reference to Figure 5D. II. Exemplary Capacitors 5A-5D are plan views of the first through fourth capacitors of the multilayer filter 300, respectively. Referring to FIG. 5A, the first capacitor may include a first conductive layer 502 (e.g., portion 336 of signal path 316) and a second conductive layer 504 (e.g., conductive layer 330) spaced apart in the Z direction. The first conductive layer 502 and the second conductive layer 504 may overlap in the XY plane in an overlapping area. The overlapping area may be less susceptible to relative misalignment between the first and second conductive layers 502, 504. Thus, the first capacitor may be described as "self-aligned." More specifically, the first conductive layer 502 may include a tab 337 and a connector portion 338 extending in the X direction from portion 336 and having equal widths 500 at a boundary 501 of the overlapping area. Similarly, the first conductive layer 502 may include connections 340 that extend in the Y direction and have equal widths 503. As a result, the size of the overlap may not change due to relative offsets in the X and Y directions.

[0064] The first conductive layer 502 may have a pair of parallel edges 506, 508 at a boundary 510 of the overlap area. The parallel edges 506, 508 may be parallel to each other and spaced apart in the X direction by a width 503 of the connection portion 340.

[0065] The first conductive layer 502 may have an offset edge 512 in the overlap area and parallel to the pair of parallel edges 506, 508. The offset edge 512 may extend in the Y direction. An offset distance 514 may be defined between the offset edge 512 and the first edge 506 of the pair of parallel edges 506, 508. The offset distance 514 may be defined between the edge 506 of the parallel edges 506, 508 that is closest to the offset edge 512. The offset distance 514 may be less than approximately 500 micrometers (500 microns).

[0066] The first conductive layer 502 can include additional offset edges 516. The additional offset edges 516 can have respective additional offset distances 518 defined relative to the closer of the pair of parallel edges 506, 508. One or more of the additional offset distances 516 can be less than approximately five hundred micrometers (500 microns).

[0067] The first conductive layer 502 can have a first width 520 between the pair of parallel edges 506, 508 in a direction perpendicular to the parallel edges 506, 508 (e.g., the X direction). The first conductive layer 502 can have a second width 522 at the offset edge 512 in a direction perpendicular to the offset edges (e.g., the X direction). The second width 522 can be greater than the first width 520. The second width 522 can be equal to the first width 520 plus the offset distance 514.

[0068] The width discontinuity edge 524 can extend between the offset edge 512 and the first edge 506 (e.g., the closer edge) of the pair of parallel edges 506, 508. The width discontinuity edge 524 can be perpendicular to the parallel edges 506, 508 and / or the offset edge 512. A further width discontinuity edge 526 can be associated with the further offset edge 516.

[0069] The offset edges 512, 516 can form one or more protrusions 528 (represented by cross-hatching in FIG. 5A ). The protrusions 528 can be defined as portions of the first conductive layer 502 located outside the intersection of the parallel edges 506, 508 and the edge of the connector portion 338 defined by the connector portion width 500 at the overlap area boundary 501. The protrusions 528 can increase the size of the overlap area, thereby increasing the resulting capacitance of the first capacitor. The sizes of the various protrusions 528 can be selected to fine-tune the size of the overlap area, and thereby the precise capacitance of the first capacitor.

[0070] More specifically, to preserve the self-alignment characteristics of the first capacitor, the widths 550 of the tabs 337 and connector portions 338 near the boundary 501 of the conductive layer 330 should remain equal. Similarly, the widths 503 of the connections 340 should remain equal. However, the techniques used to pattern and form the conductive layers have finite resolution. A minimum linewidth (represented by the grid points and arrows 508 in the conductive layer) can be defined as the smallest feature size that can be accurately patterned. A "minimum area unit" is the square of the minimum linewidth 508 (e.g., approximately 0.0026 mm 2 ), which is represented in Figure 5A as one square unit in the grid. Very small adjustments to the size of the overlap area can be made using the inclusion of one or more offset edges 512, 516 to define protrusions 528 in the overlap area.

[0071] 5B, the second capacitor of the multi-layer filter 300 can define an overlap area between the conductive layer 352 and the portion 354 of the signal path 316. The first conductive layer 530 (portion 354 of the signal path 316) can be elongated in the Y direction and overlap the second conductive layer 532 (conductive layer 352) in the XY plane in the overlap area. The overlap area can be less susceptible to small misalignments between the conductive layers 530, 532.

[0072] The first conductive layer 530 can have a pair of parallel edges 534, 536 at a boundary 538 of the overlap area. The parallel edges 534, 536 can be parallel to each other and spaced apart in the X direction by a first width 540 of the first conductive layer 530.

[0073] The first conductive layer 530 can have an offset edge 542 in the overlap area that is parallel to the pair of parallel edges 543, 536. The offset edge 542 can extend in the Y direction. An offset distance 543 can be defined between the offset edge 542 and the first edge 534 of the pair of parallel edges 506, 508. An offset distance 514 can be defined between the edge 534 of the parallel edges 534, 536 that is closest to the offset edge 542. The offset distance 542 can be less than approximately 500 micrometers (500 microns).

[0074] The first conductive layer 530 may include an additional offset edge 544 that is offset from the parallel edge 534 by an additional offset distance 546. The additional offset distance 546 may be less than approximately 500 micrometers (500 microns).

[0075] The first conductive layer 530 has a thickness of 1000 Å in a direction perpendicular to the parallel edges 534, 536 (e.g., the X direction). The first conductive layer 530 may have a first width 540 between the pair of parallel edges 534, 536. The first conductive layer 530 may have a second width 548 at the offset edge 542 in a direction perpendicular to the offset edge 542 (e.g., the X direction). The second width 548 may be greater than the first width 540. The second width 548 may be equal to the first width 540 plus the offset distance 543.

[0076] The width discontinuity edge 548 can extend between the offset edge 542 and the first edge 534 (e.g., the closer edge) of the pair of parallel edges 534, 536. The width discontinuity edge 548 can be perpendicular to the parallel edges 534, 536 and / or the offset edge 542. An additional width discontinuity edge 550 can be associated with the additional offset edge 544. A protrusion 552 (represented by cross-hatching in FIG. 5B ) can be formed by offset edges 542, 544. The protrusion 552 can be defined as a portion of the first conductive layer that is located outside the parallel edges 543, 536 of the first conductive layer 530. The protrusion 552 can increase the size of the overlap area, thereby increasing the resulting capacitance of the second capacitor. Various protrusion 552 sizes can be selected to fine-tune the size of the overlap area, and thereby the precise capacitance of the second capacitor.

[0077] 5C, the third capacitor of the multilayer filter 300 may include an overlap area formed between the first conductive layer 556 (conductive layer 367) and the second conductive layer 558 (portion 359 of the signal path 316). The third capacitor may be “self-aligned” such that the overlap area is insensitive to relative misalignment between the first conductive layer 556 and the second conductive layer 558.

[0078] The first conductive layer 556 may include an offset edge 560 located within the overlap area parallel to a pair of parallel edges 562, 564 defined at a boundary 566 of the overlap area in a manner similar to that described above with reference to Figures 5A and 5B. An offset distance 568 may be defined between the offset edge 560 and at least one of the pair of parallel edges 562, 564 in a manner similar to that described above with reference to Figures 5A and 5B. Additionally, an edge 570 of the width discontinuity may be located parallel to the parallel edges 562, 564. The offset edge 560 may have a length 571 in a direction parallel to the offset edge 560 (e.g., the Y direction).

[0079] The first conductive layer 556 may include protrusions 572 (represented by cross-hatching in FIG. 5C ) located outside the pair of parallel edges 562, 564 and within the overlapping area. In this example, the protrusions 572 are approximately equal to the square of the minimum line width 508 (e.g., approximately 0.0026 mm 2 ) can have an area equal to the single smallest area unit, which can be defined as

[0080] 5D, the third capacitor of the multilayer filter 300 may include an overlap area formed between the first conductive layer 574 (portion 361 of the signal path 316) and the second conductive layer 575 (conductive layer 380). The third capacitor may be “self-aligned” such that the overlap area is insensitive to relative misalignment between the first conductive layer 574 and the second conductive layer 575.

[0081] The first conductive layer 574 can include an offset edge 576 located within the overlap area that is parallel to a pair of parallel edges 577, 578 defined at a boundary 579 of the overlap area in a manner similar to that described above with reference to Figures 5A and 5B. The offset distance 580 can be determined by the offset edge distance 580 in a manner similar to that described above with reference to Figures 5A and 5B. An offset edge 576 can be defined between the offset edge 576 and at least one of the pair of parallel edges 577, 578. Additionally, an edge 582 of the width discontinuity can lie parallel to the parallel edges 577, 578. The offset edge 576 can have a length 581 in a direction parallel to the offset edge 576 (e.g., the Y direction).

[0082] The first conductive layer 574 may include protrusions 583 (represented by cross-hatching in FIG. 5D) located outside the pair of parallel edges 577, 578 and within the overlapping area.

[0083] 5E, another capacitor 584 is shown that may correspond to second capacitor 618 of another multilayer filter 600 described below with reference to FIGS. 6A-7D. Capacitor 584 may include an overlap area formed between first conductive layer 585 and second conductive layer 586. Capacitor 584 may be “self-aligned” such that the overlap area is insensitive to relative misalignment between first conductive layer 585 and second conductive layer 586.

[0084] The first conductive layer 585 may include an offset edge 587 located within the overlap area parallel to a pair of parallel edges 588, 589 defined at a boundary 590 of the overlap area in a manner similar to that described above with reference to Figures 5A and 5B. An offset distance 591 may be defined between the offset edge 587 and at least one of the pair of parallel edges 588, 589 in a manner similar to that described above with reference to Figures 5A and 5B. Additionally, an edge 593 of the width discontinuity may be located parallel to the parallel edges 588, 589. The offset edge 587 may have a length 592 in a direction parallel to the offset edge 589 (e.g., the Y direction).

[0085] The first conductive layer 585 can define a recess 594. The recess 594 can be located, at least in part, between the parallel edges 588, 589. The offset edge 587 can be located between the parallel edges 588, 589. In other words, the offset distance 591 can be negative (compared to the previous embodiment). The recess 594 can reduce the size of the overlap area, thereby reducing the capacitance of the capacitor. Because the width 595 of the first conductive layer 585 is the same at each boundary 590 of the overlap area, the capacitor 584 can still be "self-aligned." III. Further Exemplary Embodiments FIG. 6A illustrates a perspective view of another embodiment of a multi-layer filter 600 according to aspects of the present disclosure. FIG. 6B illustrates another perspective view of the multi-layer filter 600 of FIG. 6A. The filter 600 may be generally configured in a manner similar to the filter 300 described above with reference to FIGS. 3-5D. The filter 600 may include an input 602, an output 604, and a signal path 606 connecting the input 602 and the output 604. The filter 600 may also include a ground plane 608 electrically connected to one or more ground electrodes 610.

[0086] The filter 600 may include a first inductor 612 electrically connected to the ground plane 608. The first inductor 612 may correspond to the first inductor 208 of the circuit diagram 200 described above with reference to FIG. 2. The filter 600 may include a first capacitor 614 electrically coupled to the ground plane 608. The first capacitor 614 may correspond to the first capacitor 210 of the circuit diagram 200 described above with reference to FIG. 2.

[0087] The filter 600 may include a second inductor 616 and a second capacitor 618 connected in parallel with each other. 2. The first inductor 616 and the second capacitor 618 may correspond to the second inductor 212 and the second capacitor 214, respectively, of the circuit diagram 200 described above with reference to FIG. 2. The second inductor 616 and the second capacitor 618 may form a portion of the signal path 606 between the input 602 and the output 604. The filter 600 may include a third inductor 620 and a third capacitor 622 connected in parallel to each other and may form a portion of the signal path 606 between the input 602 and the output 604. The third inductor 620 and the third capacitor 622 may correspond to the third inductor 216 and the third capacitor 218, respectively, of the circuit diagram 200 described above with reference to FIG. 2. Finally, the filter 600 may include a fourth inductor 624 and a fourth capacitor 626 connected in parallel to each other and connected between the signal path 606 and the ground plane 608. The fourth inductor 624 and the fourth capacitor 626 may correspond to the fourth inductor 220 and the fourth capacitor 222, respectively, of the circuit diagram 200 described above with reference to FIG.

[0088] The inductors 612, 616, 620, 624 and capacitors 614, 618, 622, 626 may be connected by vias 627 in a manner similar to that described above with reference to Figures 3-5D. Each of the inductors 612, 616, 620, 624 may connect to the signal path 606 at a respective first location and connect to the signal path 606 or the ground plane 608 at a respective second location. Each of the inductors 612, 616, 620, 624 may have a respective effective length (e.g., in the XY plane) between the first location and the second location. Additionally, each of the inductors 612, 616, 620, 624 may have a respective width along the respective effective length.

[0089] FIG. 6C is a side view of the filter 600 of FIGS. 6A and 6B. The bandpass filter 600 may include multiple dielectric layers (which are transparent in FIGS. 6A and 6B for clarity). Referring to FIG. 6C, a first layer 632, a second layer 636, and a third layer 640 may be stacked to form a monolithic structure. Conductive layers 630, 634, 638, and 642 may be formed on the dielectric layers 632, 636, and 640. The conductive layer 630 may be formed on a bottom surface of the first dielectric layer 632. The conductive layers 634 and 638 may be formed on the top and bottom surfaces, respectively, of the second dielectric layer 636. The conductive layer 642 may be formed on a top surface of the third dielectric layer 640.

[0090] FIGS. 7A-7D are a series of successive plan views of filter 600 of FIGS. 6A-6C, with additional layers shown in each successive view. More specifically, FIG. 7A shows a mounting surface 628, such as a printed circuit board. First conductive layer 630 can include ground planes 608, which can be formed on the bottom and top surfaces of first layer 632. FIG. 7B further shows second conductive layer 634 formed on first dielectric layer 632. Second conductive layer 634 can include first capacitor 614, second capacitor 618, third capacitor 622, and fourth capacitor 626. FIG. 7C further shows third conductive layer 638 formed on second dielectric layer 632. Third conductive layer 638 can include a portion of signal path 606 and first inductor 612. FIG. 7D shows fourth conductive layer 642 formed on fourth dielectric layer 640. The fourth conductive layer 642 can comprise the second inductor 616, the third inductor 622, and the fourth inductor 624. The dielectric layers 632, 636, 640 are transparent to show the relative rearrangement of the various patterned conductive layers 630, 634, 638, 642.

[0091] 8A shows a perspective view of another embodiment of a multi-layer filter 800 according to aspects of the present disclosure. Filter 800 may be generally constructed in a manner similar to filter 300 described above with reference to FIGS. 3-5D. Filter 800 includes an input 802, an output 804, and an input 802 and an output 804. The filter 800 may also include a ground plane 808 electrically connected to one or more ground electrodes 810.

[0092] The filter 800 may include a first inductor 812 electrically connected to the ground plane 808. The first inductor 812 may correspond to the first inductor 208 of the circuit diagram 200 described above with reference to FIG. 2. The filter 800 may include a first capacitor 814 electrically connected to the ground plane 808. The first capacitor 814 may correspond to the first inductor-capacitor 210 of the circuit diagram 200 described above with reference to FIG. 2. The filter 800 may include a second inductor 816 and a second capacitor 818 connected in parallel with each other. The second inductor 816 and the second capacitor 818 may correspond to the second inductor 212 and the second capacitor 214, respectively, of the circuit diagram 200 described above with reference to FIG. 2. The second inductor 816 and the second capacitor 818 may form a portion of the signal path 806 between the input 802 and the output 804. The filter 800 may include a third inductor 820 and a third capacitor 822 connected in parallel to each other and may form a portion of the signal path 806 between the input 802 and the output 804. The third inductor 820 and the third capacitor 822 may correspond to the third inductor 216 and the third capacitor 218, respectively, of the circuit diagram 200 described above with reference to FIG. 2. Finally, the filter 800 may include a fourth inductor 824 and a fourth capacitor 826 connected in parallel to each other and connected between the signal path 806 and the ground plane 808. The fourth inductor 824 and the fourth capacitor 826 may correspond to the fourth inductor 220 and the fourth capacitor 222, respectively, of the circuit diagram 200 described above with reference to FIG. 2.

[0093] The inductors 812, 816, 820, 824 and capacitors 814, 818, 822, 826 may be connected by vias 827 in a manner similar to that described above with reference to Figures 3-5D. Each of the inductors 812, 818, 820, 824 may connect to the signal path 806 at a respective first location and connect to the signal path 806 or the ground plane 808 at a respective second location. Each of the inductors 812, 818, 820, 824 may have a respective effective length (e.g., in the XY plane) between the first location and the second location. Additionally, each of the inductors 812, 818, 820, 824 may have a respective width along its respective effective length.

[0094] FIG. 8B is a side view of the filter 800 of FIG. 8A. The bandpass filter 800 may include multiple dielectric layers (which are transparent in FIG. 8A for clarity). Referring to FIG. 8B, a first layer 832, a second layer 836, and a third layer 840 may be stacked to form a monolithic structure. Conductive layers 830, 834, 838, and 842 may be formed on the dielectric layers 832, 836, and 840. The conductive layer 830 may be formed on a bottom surface of the first dielectric layer 832. The conductive layers 834 and 838 may be formed on the top and bottom surfaces of the second dielectric layer 836, respectively. The conductive layer 842 may be formed on a top surface of the third dielectric layer 840.

[0095] 9A-9D are a series of successive plan views of filter 600 of FIGS. 8A and 8B, with additional dielectric layers shown in each successive view. More specifically, FIG. 9A shows a mounting surface 828, such as a printed circuit board. First conductive layer 830 may include ground planes 808, which may be formed on the bottom and top surfaces of first layer 832. FIG. 9B further shows second conductive layer 834 formed on first dielectric layer 832. Second conductive layer 834 may include first capacitor 814, second capacitor 818, third capacitor 822, and third capacitor 834. 9C further shows a third conductive layer 838 formed on the second dielectric layer 836. The third conductive layer 838 can include a portion of the signal path 806 and the first inductor 812. FIG. 9D shows a fourth conductive layer 842 formed on the fourth dielectric layer 840. The fourth conductive layer 842 can include the second inductor 816, the third inductor 822, and the fourth inductor 824. The dielectric layers 832, 836, 840 are transparent to show the relative rearrangement of the various patterned conductive layers 830, 834, 838, 842.

[0096] FIG. 10A illustrates a perspective view of another embodiment of a multi-layer filter 1000 according to aspects of the present disclosure. FIG. 10B illustrates another perspective view of the multi-layer filter 1000 of FIG. 10A. The filter 1000 may be generally configured in a manner similar to the filter 300 described above with reference to FIGS. 3-5D. The filter 1000 may include an input 1002, an output 1004, and a signal path 1006 connecting the input 1002 and the output 1004. The filter 1000 may also include a ground plane 1008 electrically connected to one or more ground electrodes 1010.

[0097] The filter 1000 may include a first inductor 1012 electrically connected to the ground plane 1008. The first inductor 1012 may correspond to the first inductor 208 of the circuit diagram 200 described above with reference to FIG. 2. The filter 1000 may include a first capacitor 1014 electrically coupled to the ground plane 1008. The first capacitor 1014 may correspond to the first inductor-capacitor 210 of the circuit diagram 200 described above with reference to FIG. 2. The filter 1000 may include a second inductor 1016 and a second capacitor 1018 connected in parallel with each other. The second inductor 1016 and the second capacitor 1018 may correspond to the second inductor 212 and the second capacitor 214, respectively, of the circuit diagram 200 described above with reference to FIG. 2. The second inductor 1016 and the second capacitor 1018 may form a portion of the signal path 1006 between the input 1002 and the output 1004. The filter 1000 may include a third inductor 1020 and a third capacitor 1022 connected in parallel to each other and may form a portion of the signal path 1006 between the input 1002 and the output 1004. The third inductor 1020 and the third capacitor 1022 may correspond to the third inductor 216 and the third capacitor 218, respectively, of the circuit diagram 200 described above with reference to FIG. 2. Finally, the filter 1000 may include a fourth inductor 1024 and a fourth capacitor 1026 connected in parallel to each other and connected between the signal path 1006 and the ground plane 1008. The fourth inductor 1024 and the fourth capacitor 1026 may correspond to the fourth inductor 220 and the fourth capacitor 222, respectively, of the circuit diagram 200 described above with reference to FIG. 2.

[0098] The inductors 1012, 1016, 1020, 1024 and capacitors 1014, 1018, 1022, 1026 may be connected by vias 1027 in a manner similar to that described above with reference to Figures 3-5D. Each of the inductors 1012, 10110, 1020, 1024 may connect to the signal path 1006 at a respective first location and connect to the signal path 1006 or the ground plane 1008 at a respective second location. Each of the inductors 1012, 10110, 1020, 1024 may have a respective effective length (e.g., in the XY plane) between the first location and the second location. Additionally, each of the inductors 1012, 10110, 1020, 1024 may have a respective width along its respective effective length.

[0099] Figure 10B is a side view of the filter 1000 of Figures 10A and 10B. The filter 1000 may include multiple dielectric layers (transparent in FIG. 10A for clarity). Referring to FIG. 10B, a first layer 1032, a second layer 1036, and a third layer 1040 may be stacked to form a unitary structure. Conductive layers 1030, 1034, 1038, and 1042 may be formed on the dielectric layers 1032, 1036, and 1040. The conductive layer 1030 may be formed on a bottom surface of the first dielectric layer 1032. The conductive layers 1034 and 1038 may be formed on the top and bottom surfaces, respectively, of the second dielectric layer 1036. The conductive layer 1042 may be formed on a top surface of the third dielectric layer 1040.

[0100] FIGS. 11A-11D are a series of successive plan views of the filter 600 of FIGS. 10A and 10B, with additional dielectric layers shown in each successive view. More specifically, FIG. 11A shows a mounting surface 1028, such as a printed circuit board. A first conductive layer 1030 can include ground planes 1008, which can be formed on the bottom and top surfaces of the first layer 1030. FIG. 11B further shows a second conductive layer 1034 formed on the first dielectric layer 1032. The second conductive layer 1034 can include the first capacitor 1014, the second capacitor 1018, the third capacitor 1022, and the fourth capacitor 1026. FIG. 11C further shows a third conductive layer 1038 formed on the second dielectric layer 1036. The third conductive layer 1038 can include a portion of the signal path 1006 and the first inductor 1012. 11D shows a fourth conductive layer 1042 formed on the fourth dielectric layer 1040. The fourth conductive layer 1042 can comprise a second inductor 1016, a third inductor 1022, and a fourth inductor 1024. The dielectric layers 1032, 1036, 1040 are transparent to show the relative rearrangement of the various patterned conductive layers 1030, 1034, 1038, 1042.

[0101] IV.Applications Various embodiments of the filters described herein may find application in any suitable type of electrical component. The filters may find particular application in devices that receive, transmit, or otherwise use high-frequency radio signals. Exemplary applications include smartphones, signal repeaters (e.g., small cells), relay stations, and radar. [Example]

[0102] Computer modeling was used to simulate a multi-layer high frequency filter according to an aspect of the present disclosure. Additionally, a filter was constructed and tested. It should be understood that the following dimensions are provided by way of example only and do not limit the scope of the present disclosure.

[0103] The capacitors of the multilayer filter 300 described above with reference to FIGS. 3A-4E may be dimensioned to have the following areas and ratios:

[0104] [Table 1]

[0105] The capacitors of the multilayer filter 600 described above with reference to FIGS. 6A-7E may be dimensioned to have the following areas and ratios:

[0106] [Table 2]

[0107] The capacitors of the multi-layer filter 800 described above with reference to FIGS. 8A-9E may be dimensioned to have the following areas and ratios:

[0108] [Table 3]

[0109] The capacitors of the multilayer filter 1000 described above with reference to FIGS. 10A-11E may be dimensioned to have the following areas and ratios:

[0110] [Table 4]

[0111] The thickness of the dielectric layer can typically be less than about 180 micrometers ("microns"). For example, in some embodiments, the first layer 304, 632, 832, 1032 can be about sixty micrometers (60 microns) thick. The second layer 304, 636, 836, 1036 can be about twenty micrometers (20 microns) thick. Thus, in these examples, the layers of the first through fourth capacitors are spaced apart from one another in the Z direction by twenty micrometers (20 microns). The third layer 308, 640, 840, 1040 can be about sixty micrometers (60 microns) thick.

[0112] The overall length of filters 300, 600, 800, and 1000 was 4.3 mm, the overall width was about 4 mm, and the overall thickness was 230 micrometers (230 microns). 12-17 present test results and simulation data for various filters. Referring to FIG. 12, a multi-layer filter according to an embodiment of the present disclosure was constructed and tested. The measured insertion loss (S 21 ) value and the measured return loss (S 11 ) values ​​are plotted from 0 GHz to 45 GHz. The simulated insertion loss (S 21 ) values ​​and simulated return loss (S 11 ) values ​​are plotted from 0 GHz to 35 GHz. The measured passband is from approximately 13.2 GHz to approximately 15.8 GHz.

[0113] Referring to Figure 13, a multi-layer filter according to an embodiment of the present disclosure was constructed and tested. The measured insertion loss (S 21 ) value and the measured return loss (S 11 ) values ​​are plotted from 0 GHz to 45 GHz. The simulated insertion loss (S 21 ) values ​​and simulated return loss (S 11 ) values ​​are plotted from 0 GHz to 35 GHz. The passband is from approximately 16.1 GHz to approximately 18.2 GHz.

[0114] Referring to Figure 14, the multi-layer filter 300 described above with reference to Figures 3A-4E was both simulated and constructed and physically tested. The measured insertion loss (S 21 ) value and the measured return loss (S 11 ) values ​​are plotted from 0 GHz to 45 GHz. The simulated insertion loss (S 21 ) values ​​and simulated return loss (S 11 ) values ​​are plotted from 0 GHz to 35 GHz. The passband is from approximately 17.0 GHz to approximately 21.2 GHz.

[0115] Referring to Figure 15, the multi-layer filter 600 described above with reference to Figures 6A-7D was simulated. The simulated insertion loss (S 21 ) values ​​and simulated return loss (S 11 ) values ​​are plotted from 0 GHz to 50 GHz. The passband is from approximately 24.6 GHz to approximately 27.8 GHz.

[0116] Referring to Figure 16, the multi-layer filter 800 described above with reference to Figures 8A-9D was simulated. The simulated insertion loss (S 21 ) values ​​and simulated return loss (S 11 ) values ​​are plotted from 0 GHz to 55 GHz. The passband is from approximately 34.6 GHz to approximately 37.4 GHz.

[0117] Referring to Figure 17, the multilayer filter 1000 described above with reference to Figures 10A-11D was simulated. The simulated insertion loss (S 21 ) values ​​and simulated return loss (S 11 ) values ​​are plotted from 0 GHz to 70 GHz. The passband is from approximately 42.9 GHz to approximately 46.6 GHz. Test Method 18 , in accordance with an embodiment of the present disclosure, a test assembly 1800 can be used to test performance characteristics such as insertion loss and return loss of a multi-layer filter 1802. The filter 1802 can be mounted on a test board 1804. An input line 1806 and an output line 1808 are each connected to the test board 1804. The test board 1804 can include a microstrip line 1810 that electrically connects the input line 1806 with the input of the filter 1802 and the output line 1808 with the output of the filter 1802. An input signal was applied to the input line using a source signal generator (e.g., a 1806 Keithley 2400 series source measurement unit (SMU), e.g., a Keithley 2410-C SMU), and the resulting output of the filter 1802 was measured at the output line 18108 (e.g., using the source signal generator). This was repeated for various configurations of the filter.

[0118] Those skilled in the art can make these and other modifications and variations of the present disclosure without departing from the spirit and scope of the present disclosure. In addition, it should be understood that aspects of the various embodiments may be interchanged both in whole and in part. Furthermore, those skilled in the art will appreciate that the foregoing description is for illustrative purposes only and is not intended to limit the present disclosure, which is further described in the appended claims.

Claims

1. A multilayer electronic device A plurality of dielectric layers stacked in a Z direction perpendicular to the XY plane; a first conductive layer overlying one of the plurality of dielectric layers; a second conductive layer overlying another of the plurality of dielectric layers and spaced apart from the first conductive layer in the Z direction; Including, the second conductive layer overlaps the first conductive layer in the XY plane in an overlapping area to form a capacitor; the first conductive layer has a pair of parallel edges at the boundary of the overlapping area; The first conductive layer has offset edges in the overlap area that are parallel to the pair of parallel edges. and an edge of the width discontinuity extends between the offset edge and at least one of the pair of parallel edges, the offset edge and the edge of the width discontinuity define a feature within the overlap area, the feature having a characteristic area in the XY plane; the feature comprises a protrusion extending from the offset edge to a further offset edge, the further offset edge being offset from at least one of the pair of parallel edges by a further offset distance; the further offset edge is offset from at least one of the pair of parallel edges by an offset distance of less than five hundred micrometers (500 microns); and the capacitor has an overlap area to feature area ratio greater than 2; the further offset distance is adjustable using one or more square units defined by the smallest line width that can be accurately patterned; Multilayer electronic devices.

2. 10. The multilayer electronic device of claim 1, wherein an edge of the width discontinuity is located at least thirty micrometers (30 microns) from the boundary of the overlap area.

3. 2. The multi-layer electronic device of claim 1, wherein the features are protrusions extending outwardly of the pair of parallel edges and inwardly of the overlapping area.

4. The multi-layer electronic device of claim 1 , wherein the feature is a recess inside the overlap area.

5. 10. The multilayer electronic device of claim 1, wherein the features are 0.2 mm ２ A multilayer electronic device that is less than

6. 10. The multi-layer electronic device of claim 1, wherein the offset edges have a length in a direction parallel to the pair of parallel edges that is less than five hundred micrometers (500 microns).

7. 10. The multilayer electronic device of claim 1, wherein the capacitor is 0.5 mm thick. ２ A multilayer electronic device having an overlap area of ​​less than 100 nm.

8. 10. The multi-layer electronic device of claim 1, wherein the first conductive layer and the second conductive layer are spaced apart in the Z direction by less than 100 micrometers (100 microns).

9. 10. The multilayer electronic device of claim 1, a dielectric material disposed between the first conductive layer and the second conductive layer, the dielectric material meeting IPC TM-650 2.5 at an operating temperature of 25° C. and a frequency of 1 MHz; a dielectric material having a dielectric constant ranging from 5 to 8 in accordance with .5.3; At an operating temperature of 25°C and a frequency of 1 MHz, IPC TM-650 2.5 5.3, an additional dielectric material having a dielectric constant ranging from 1 to 4; The multilayer electronic device further comprises:

10. 10. The multilayer electronic device of claim 1 , wherein the multilayer electronic device is configured as a filter, the filter having a characteristic frequency greater than 6 GHz, the characteristic frequency comprising at least one of a low-pass frequency, a high-pass frequency, or an upper limit of a band-pass frequency.

11. 10. The multilayer electronic device of claim 1, further comprising a ground plane and a via electrically connecting at least one of the first conductive layer or the second conductive layer to the ground plane.

12. The multilayer electronic device of claim 1 further comprising an organic dielectric material.

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