Method for manufacturing a printed circuit board

Abstract

To provide a manufacturing method of wiring circuit board having excellent conveyability.SOLUTION: A manufacturing method of wiring circuit board includes a first process to a third process. In the first process, an aggregate sheet 1 and a support sheet 2 are stacked in a thickness direction. The aggregate sheet 1 includes a plurality of wiring circuit boards 11 and a support part 12 for supporting the plurality of wiring circuit boards 11. The support part 12 supports the aggregate sheet 1. In the second process, the plurality of wiring circuit boards 11 are separated from the support part 12 by cutting. In the third process, the aggregate sheet 1 with the plurality of wiring circuit boards 11 separated from the support part 12 is supported with a support sheet 2 and conveyed.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a printed circuit board. [Background technology]

[0002] In an assembly sheet including a plurality of wired circuit boards and a support portion that supports the plurality of wired circuit boards, a method is known in which the plurality of wired circuit boards are separated from the support portion by cutting (see, for example, Patent Document 1 below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-27880 Summary of the Invention [Problem to be solved by the invention]

[0004] In the method described in Patent Document 1, after cutting, the separated wired circuit boards are transported one by one, which is troublesome and has the drawback of low transportability.

[0005] The present invention provides a method for producing a wired circuit board that is excellent in transportability. [Means for solving the problem]

[0006] The present invention (1) includes a method for manufacturing a wired circuit board, comprising: a first step of stacking an assembly sheet having a plurality of wired circuit boards and support portions supporting the plurality of wired circuit boards, and a support sheet for supporting the assembly sheet in a thickness direction; a second step of separating the plurality of wired circuit boards from the support portions by cutting after the first step; and a third step of transporting the assembly sheet having the plurality of wired circuit boards separated from the support portions while supporting it with the support sheet after the second step.

[0007] According to this manufacturing method, the plurality of wired circuit boards separated from the support portions are transported while being supported by the support sheet, and therefore the transportability of the plurality of wired circuit boards is excellent.

[0008] The present invention (2) includes the method for manufacturing a wired circuit board according to (1), wherein the support sheet has an opening penetrating through the thickness direction, the assembly sheet has a joint connecting a plurality of the wired circuit boards to the support part, the assembly sheet and the support sheet are overlapped in the first step so that the opening includes the joint when viewed in the thickness direction, and the joint is cut in the second step.

[0009] According to this manufacturing method, the joint is cut in the second step, so that the wired circuit board can be reliably and easily separated from the support portion.

[0010] Furthermore, in the first step, the assembly sheet and the support sheet are overlapped so that the opening includes the joint when viewed in the thickness direction, which prevents the cutting tool from coming into contact with the support sheet in the second step and further prevents damage to the support sheet, thereby preventing the generation of foreign matter (dust) caused by the above-mentioned contact.

[0011] Furthermore, damage to the support sheet is suppressed, so that the support sheet can be reused after the third step.

[0012] The present invention (3) includes the method for producing a wired circuit board according to (1) or (2), in which the support sheet is a resin sheet.

[0013] According to this manufacturing method, the support sheet is a resin sheet, so that the support sheet is easy to handle and the transportability of a plurality of wired circuit boards using the support sheet is even better.

[0014] The present invention (4) includes the method for manufacturing a wired circuit board according to any one of (1) to (3), wherein the wired circuit board and the support part each include a metal support layer, an insulating layer, and a wiring layer, in that order toward one side in the thickness direction.

[0015] The present invention (5) includes the method for producing a wired circuit board according to any one of (1) to (4), wherein the thickness of the assembly sheet is 500 μm or less.

[0016] The present invention (6) includes the method for manufacturing a wired circuit board according to any one of (2) to (5), wherein the openings are arranged at intervals, and the total opening ratio of the openings in the support sheet is 20% or more.

[0017] According to this manufacturing method, the total opening ratio of the plurality of openings is 20% or more, so that in the second step, deformation of the assembly sheet at the portions facing the openings can be suppressed.

[0018] The present invention (7) includes the method for producing a wired circuit board according to any one of (2) to (6), wherein the thickness of the support sheet is 150 μm or less.

[0019] According to this manufacturing method, in the second step, deformation of the portion of the assembly sheet facing the opening can be suppressed.

[0020] The present invention (8) includes the method for manufacturing a wired circuit board according to (6) or (7), wherein in the first step, the assembly sheet and the support sheet are arranged between a first die having a punch and a second die spaced apart from the first die in the thickness direction and having a hole, with the assembly sheet facing the first die and the support sheet facing the second die, and in the second step, the joint is punched out by inserting the punch into the hole.

[0021] In the first step, by arranging the assembly sheet and the support sheet between the first die and the second die so that the assembly sheet faces the first die having the punch and the support sheet faces the second die having the hole, the positional accuracy during punching can be improved in the second step.

[0022] On the other hand, in the second step, when the punch is inserted into the hole, the portion of the assembly sheet near the outside of the punch that faces the opening moves toward the opening, and this movement of the portion of the assembly sheet may cause deformation of the assembly sheet.

[0023] However, according to this manufacturing method, since the structure (6) or (7) is provided, the above-mentioned deformation can be effectively suppressed. [Effects of the Invention]

[0024] The present invention provides a method for producing a wired circuit board that is excellent in transportability. [Brief explanation of the drawings]

[0025] [Figure 1] 1A-1D are process diagrams illustrating one embodiment of a method for manufacturing a wired circuit board according to the present invention. FIG. 1A shows a process diagram for preparing an assembly sheet and a first and second molds. FIG. 1B shows a first process diagram. FIG. 1B is a cross-sectional view taken along line XX in FIG. 2A. FIG. 1C shows a second process diagram. FIG. 1C is a cross-sectional view taken along line YY in FIG. 2B. FIG. 1D shows a third process diagram. [Figure 2] 2A-2B are plan views of one embodiment, where Fig. 2A shows the first step and Fig. 2B shows the second step. [Figure 3] 3A and 3B are plan views of the members prepared in the first step shown in Fig. 1A and Fig. 2A. Fig. 3A is a support sheet. Fig. 3B is an assembly sheet. [Figure 4] 10 is a laminated sheet in the second step of the second modified example. DETAILED DESCRIPTION OF THE INVENTION

[0026] 1. One embodiment An embodiment of the method for producing a wired circuit board of the present invention will be described with reference to FIGS. 1A to 3B.

[0027] The method for manufacturing a wired circuit board includes a first step, a second step, and a third step, in that order. That is, in this manufacturing method, the first step, the second step, and the third step are carried out in that order.

[0028] 1.1 First step As shown in FIGS. 1B and 2A, in the first step, an assembly sheet 1 and a support sheet 2 are stacked.

[0029] 1.1.1 Assembly Sheet 1 As shown in Figures 1A and 1B, the assembly sheet 1 has a thickness. The "sheet" in the assembly sheet 1 is synonymous with film. There is no clear distinction between a sheet and a film. The assembly sheet 1 extends in a planar direction. The planar direction is perpendicular to the thickness direction. As shown in Figure 2A, in this embodiment, the assembly sheet 1 has a rectangular outer shape when viewed in the thickness direction. The assembly sheet 1 includes a plurality of wiring circuit boards 11, a support portion 12, and a joint 13. The assembly sheet 1 also has a groove 14.

[0030] 1.1.1.1 Multiple wiring circuit boards 11 The multiple wired circuit boards 11 are arranged inside the peripheral edge of the assembly sheet 1. The multiple wired circuit boards 11 are spaced apart from one another in the planar direction. In this embodiment, the multiple wired circuit boards 11 are aligned in a first direction and a second direction. The first direction and the second direction are included in the planar direction. The first direction and the second direction are perpendicular to each other. The first direction and the second direction are aligned along the four sides of the rectangle of the assembly sheet 1.

[0031] As shown in FIG. 1A, each of the plurality of wired circuit boards 11 has a metal support layer 111A, an insulating layer 112A, a wiring layer 113A, and a cover insulating layer 114A arranged toward one side in the thickness direction.

[0032] The metal support layer 111A is disposed at the other end of the wired circuit board 11 in the thickness direction. The metal support layer 111A extends in the planar direction. Examples of materials for the metal support layer 111A include iron, stainless steel, copper, and copper alloys. The thickness of the metal support layer 111A is, for example, 1 μm or more, preferably 10 μm or more, and for example, 1000 μm or less, preferably 500 μm or less.

[0033] The insulating layer 112A is disposed on one surface of the metal support layer 111A in the thickness direction. The insulating layer 112A extends in the planar direction. In this embodiment, the insulating layer 112A is a base insulating layer. Examples of materials for the insulating layer 112A include insulating resins. Examples of insulating resins include polyimide. The thickness of the insulating layer 112A is, for example, 1 μm or more, preferably 5 μm or more, and, for example, 100 μm or less, preferably 50 μm or less.

[0034] The wiring layer 113A is disposed on one surface of the insulating layer 112A in the thickness direction. The wiring layer 113A extends in the planar direction. The wiring layer 113A has a pattern including wiring and terminals. Examples of materials for the wiring layer 113A include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. The thickness of the wiring layer 113A is, for example, 1 μm or more, preferably 3 μm or more, and, for example, 50 μm or less, preferably 30 μm or less.

[0035] The cover insulating layer 114A is disposed at one end of the wired circuit board 11 in the thickness direction. The cover insulating layer 114A is disposed on one surface of the insulating layer 112A in the thickness direction. The cover insulating layer 114A also covers the wiring of the wiring layer 113A. The cover insulating layer 114A extends in the surface direction. Examples of materials for the cover insulating layer 114A include insulating resins. Examples of insulating resins include polyimide. The thickness of the cover insulating layer 114A is, for example, 1 μm or more, preferably 5 μm or more, and, for example, 100 μm or less, preferably 50 μm or less.

[0036] The thickness of the wired circuit board 11 is, for example, 10 μm or more, or preferably 25 μm or more, and is, for example, 1000 μm or less, or preferably 500 μm or less, and is the total thickness of the metal support layer 111A, the insulating layer 112A, the wiring layer 113A, and the cover insulating layer 114A.

[0037] 1.1.1.2 Support part 12 2A, the support portions 12 are disposed at the peripheral edges of the assembly sheet 1 and between adjacent wired circuit boards 11 in the planar direction. In this embodiment, the support portions 12 have a generally lattice shape when viewed in the thickness direction.

[0038] The support part 12 includes at least one layer (preferably multiple layers) selected from the group consisting of a metal support layer 111B, an insulating layer 112B, a wiring layer 113B, and a cover insulating layer 114B. The metal support layer 111B, the insulating layer 112B, the wiring layer 113B, and the cover insulating layer 114B are the same layers as the metal support layer 111A, the insulating layer 112A, the wiring layer 113A, and the cover insulating layer 114A, respectively. The support part 12 preferably has the same layer configuration as the wired circuit board 11. That is, the support part 12 preferably includes the metal support layer 111B, the insulating layer 112B, the wiring layer 113B, and the cover insulating layer 114B. As shown in FIG. 1A, in the support part 12, the metal support layer 111B, the insulating layer 112B, the wiring layer 113B, and the cover insulating layer 114B are arranged toward one side in the thickness direction.

[0039] The metal support layer 111B of the support part 12 is the same layer as the metal support layer 111A of the wired circuit board 11. The insulating layer 112B of the support part 12 is the same layer as the insulating layer 112A of the wired circuit board 11. The wiring layer 113B of the support part 12 is the same layer as the wiring layer 113A of the wired circuit board 11. Note that the wiring layer 113B may be configured not to transmit signal and / or ground current. The cover insulating layer 114B of the support part 12 is the same layer as the cover insulating layer 114A of the wired circuit board 11.

[0040] Supporting portion 12 has the same thickness as wiring circuit board 11. Assembly sheet 1 has the same thickness as wiring circuit board 11 and supporting portion 12. Specifically, the thickness of assembly sheet 1 is, for example, 10 μm or more, preferably 25 μm or more, and for example, 1000 μm or less, preferably 500 μm or less.

[0041] 1.1.1.3 Joint 13 As shown in FIG. 2A , joints 13 connect multiple wired circuit boards 11 and support parts 12. The joints 13 cross grooves 14, which will be described next. Multiple joints 13 are provided for each wired circuit board 11. In this embodiment, the joints 13 are continuous with four corners 115 of the wired circuit board 11.

[0042] The joint 13 includes at least one layer (preferably multiple layers) selected from the group consisting of a metal support layer 111C, an insulating layer 112C, a wiring layer 113C, and a cover insulating layer 114C (not shown in FIG. 1A). The metal support layer 111C, the insulating layer 112C, the wiring layer 113C, and the cover insulating layer 114C are the same layers as the above-described metal support layer 111A, the insulating layer 112A, the wiring layer 113A, and the cover insulating layer 114A, respectively. Preferably, the joint 13 includes only the metal support layer 111C.

[0043] 1.1.1.4 Groove 14 The grooves 14 are arranged around each of the plurality of wired circuit boards 11. In this embodiment, the grooves 14 have a generally rectangular frame shape when viewed in the thickness direction. The grooves 14 penetrate the assembly sheet 1 in the thickness direction. The grooves 14 separate the wired circuit boards 11 and the support portions 12 in the planar direction. Furthermore, the grooves 14 are divided into multiple pieces by the joints 13 when viewed in the thickness direction. In this embodiment, the grooves 14 are multiple slits.

[0044] 1.1.2 Support sheet 2 The support sheet 2 has a thickness. The support sheet 2 extends in the planar direction. In this embodiment, as shown in Fig. 3A, the support sheet 2 has a rectangular outer shape when viewed in the thickness direction.

[0045] 1.1.2.1 Material of Support Sheet 2 Examples of the support sheet 2 include a resin sheet, a metal sheet, and a ceramic sheet, and a resin sheet is used from the viewpoint of transportability of the wired circuit board 11. Examples of resins for the resin sheet include polyester film and polyolefin film, and preferably a polyester film from the viewpoint of improving strength. Examples of polyester films include polyethylene terephthalate film (PET film), polyethylene naphthalate film, and polybutylene terephthalate film, and preferably a PET film from the viewpoint of reducing costs.

[0046] 1.1.2.2 Dimensions of support sheet 2 The support sheet 2 has a thickness T (see FIG. 1A) of, for example, 250 μm or less, preferably 150 μm or less, more preferably 75 μm or less, and for example, 10 μm or more, preferably 20 μm or more.

[0047] If the thickness T of the support sheet 2 is equal to or less than the above upper limit, deformation of the portion 16 (described below) of the assembly sheet 1 facing the opening 21 can be suppressed in the second step described below.

[0048] 1.1.2.3 Openings 21 In this embodiment, the support sheet 2 preferably has openings 21. The openings 21 penetrate the support sheet 2 in the thickness direction. A plurality of openings 21 are arranged at intervals. As shown in FIGS. 1B and 2A, in this embodiment, the openings 21 are arranged so as to face the joints 13 when the assembly sheet 1 and the support sheet 2 are overlapped in the thickness direction. The plurality of openings 21 are arranged so as to include (encompass) the plurality of joints 13 when the assembly sheet 1 and the support sheet 2 are overlapped in the thickness direction. The dimensions of the openings 21 are larger than the dimensions of the joints 13. In this embodiment, the openings 21 have a circular shape when viewed in the thickness direction.

[0049] The total opening ratio of the plurality of openings 21 is, for example, 10% or more, or preferably 20% or more, and for example, 50% or less, or preferably 40% or less.

[0050] If the total opening ratio of the openings 21 is equal to or greater than the above-mentioned lower limit, deformation of the portions 16 of the assembly sheet 1 facing the openings 21 can be suppressed in the second step described below. If the total opening ratio of the openings 21 is equal to or less than the above-mentioned upper limit, falling off of the wired circuit board 11 from the openings 21 can be suppressed in the third step, thereby improving transportability of the wired circuit board 11.

[0051] The total opening ratio of the plurality of openings 21 is the percentage of the total area of ​​the plurality of openings 21 in the area of ​​the support sheet 2 when viewed in the thickness direction and the total area of ​​the plurality of openings 21.

[0052] The ratio of the area of ​​the joint 13 to the area of ​​the opening 21 when overlapped in the thickness direction is, for example, 0.01 or more, preferably 0.015 or more, and is, for example, 0.3 or less.

[0053] In the first step, the assembly sheet 1 and the support sheet 2 are stacked in the thickness direction. Specifically, in the first step, the above-described assembly sheet 1 and the support sheet 2 are stacked in the thickness direction to produce a laminated sheet 10. In this embodiment, the laminated sheet 10 includes the support sheet 2 and the assembly sheet 1, in that order, toward one side in the thickness direction. That is, in the laminated sheet 10, the support sheet 2 and the assembly sheet 1 are arranged in that order toward one side in the thickness direction. The assembly sheet 1 is arranged on one side of the support sheet 2 in the thickness direction. The assembly sheet 1 contacts one side of the support sheet 2 in the thickness direction.

[0054] The assembly sheet 1 and the support sheet 2 are overlapped so that the opening 21 includes the joint 13 when viewed in the thickness direction. At this time, the portion 16 of the assembly sheet 1 facing the opening 21 is exposed from the support sheet 2.

[0055] One opening 21 corresponds to one corner 115 .

[0056] In the first step, the laminated sheet 10 is then placed between the first mold 3 and the second mold 4 .

[0057] The first die 3 has a first flat plate 31 and a punch 32. The first flat plate 31 has a thickness. The first flat plate 31 extends in the planar direction. The punch 32 extends along the thickness direction of the first flat plate 31. The punch 32 is movable toward and away from the other side in the thickness direction (toward the second die 4) relative to the first flat plate 31. When the punch 32 moves forward and backward, the punch 32 is guided by the third flat plate 31. A blade is provided at the tip end (downstream end in the advancing direction) of the punch 32. A plurality of punches 32 are provided corresponding to the plurality of joints 13. The first die 3 is, for example, a metal mold.

[0058] The second die 4 is spaced apart from the first die 3 on the other side in the thickness direction. The second die 4 has a second flat plate 41 and a hole 42. The second flat plate 41 has a thickness. The second flat plate 41 extends in the surface direction. The second flat plate 41 is parallel to the first flat plate 31. The hole 42 penetrates the second flat plate 41 in the thickness direction. A plurality of holes 42 are provided corresponding to the plurality of punches 32. The hole 42 has a shape and dimensions that allow the joint 13 to be punched (cut) when the punch 32 is inserted into the hole 42. The second die 4 is, for example, a metal mold.

[0059] In this embodiment, the laminated sheet 10 (assembly sheet 1 and support sheet 2) is placed between the first mold 3 and the second mold 4 so that the assembly sheet 1 faces the first mold 3 and the support sheet 2 faces the second mold 4.

[0060] At this time, if necessary, a stripper plate 5 may be disposed between the first flat plate 31 and the laminate sheet 10 (assembly sheet 1). The stripper plate 5 has a second opening 51. When viewed in the thickness direction, the second opening 51 overlaps with the opening 21 of the support sheet 2, the punch 32, and the hole 42. After cutting, the stripper plate 5 allows the punch 32 to be peeled off from the assembly sheet 1 when removing the punch 32 from the hole 42. The stripper plate 5 is, for example, a metal plate.

[0061] Then, the laminated sheet 10 and the stripper plate 5 are sandwiched between the first die 3 and the second die 4 in the thickness direction.

[0062] 1.2 Second process As shown in FIGS. 1C and 2B , in the second step, the multiple wired circuit boards 11 are separated from the support portions 12 by cutting. Specifically, in the second step, the joints 13 are cut. To cut the joints 13, a punch 32 is inserted into the holes 42. Specifically, the punch 32 advances from the first flat plate 31 toward the holes 42, pushing through the joints 13. This removes the joints 13 from the assembly sheet 1. This releases the support for the wired circuit boards 11 by the support portions 12. This separates the multiple wired circuit boards 11 from the support portions 12.

[0063] Thereafter, although not shown, the punch 32 is pulled out from the hole 42 .

[0064] 1.3 Third step As shown in FIG. 1D , in the third step, the assembly sheet 1 including the plurality of wired circuit boards 11 separated from the support portion 12 is transported while being supported by the support sheet 2. In transporting the assembly sheet 1, the laminated sheet 10 including the assembly sheet 1 and the support sheet 2 is detached from the first mold 3 and the second mold 4, and the laminated sheet 10 is subjected to a subsequent step. The subsequent step includes an inspection step and a mounting step. In the inspection step, the presence or absence of deformation of the portion 16 is observed. When the subsequent step is performed, each of the plurality of wired circuit boards 11 is lifted from the support sheet 2. At this time, the support of the wired circuit boards 11 by the support sheet 2 is released.

[0065] Separately, the support sheet 2 is reused.

[0066] 2. Effects of one embodiment According to this manufacturing method, as shown in FIG. 1D, the plurality of wired circuit boards 11 separated from the support portion 12 are transported while being supported by the support sheet 2, and therefore the transportability of the plurality of wired circuit boards 11 is excellent.

[0067] According to this manufacturing method, as shown in FIGS. 1C and 2B, the joints 13 are cut in the second step, so that the wired circuit board 11 can be separated from the support portion 12 reliably and easily.

[0068] Furthermore, in the first step, the assembly sheet 1 and the support sheet 2 are overlapped so that the opening 21 of the support sheet 2 includes the joint 13 when viewed in the thickness direction. Therefore, in the second step, the punch 32 can be prevented from coming into contact with the support sheet 2, and further, damage to the support sheet 2 can be prevented. Therefore, the generation of foreign matter (dust generation) due to the above-mentioned contact can be prevented.

[0069] Furthermore, damage to the support sheet 2 is suppressed, so that the support sheet 2 can be reused after the third step.

[0070] According to this manufacturing method, if the support sheet 2 is a resin sheet, the support sheet 2 is easy to handle, and the transportability of the plurality of wired circuit boards 11 using the support sheet 2 is further improved.

[0071] If the total opening ratio of the multiple openings 21 is less than 20%, the distance D between the inner circumferential surface of the support sheet 2 that separates the openings 21 and the hole 42 becomes short, as shown in Fig. 1C. In this case, when the joint 13 is cut, as the portion 16 moves toward the hole 42, a large stress is applied to the portion 16 corresponding to the inner circumferential surface, causing the portion 16 to deform toward the hole 42. As shown by the imaginary line in Fig. 1D, even when the punch 32 is removed from the hole 42, the deformation described above may remain in the portion 16.

[0072] However, according to this manufacturing method, if the total opening rate of the multiple openings 21 is 20% or more, the distance D between the inner surface of the support sheet 2 and the hole 42 can be increased, the stress on the portion 16 can be reduced in the second step, and deformation of the portion 16 in the assembly sheet facing the opening 21 can be suppressed.

[0073] Furthermore, if the thickness T of the support sheet 2 exceeds 150 μm, as shown in Fig. 1C, the amount of movement of the portion 16 toward the hole 42 increases when the joint 13 is cut. As a result, a large stress is applied to the portion 16 corresponding to the inner peripheral surface, causing the portion 16 to deform toward the hole 42. As shown by the imaginary line in Fig. 1D, the above-mentioned deformation may remain in the portion 16 even after the punch 32 is removed from the hole 42.

[0074] However, according to this manufacturing method, if the thickness T of the support sheet 2 is 150 μm or less, the amount of movement of the portion 16 toward the hole 42 in the second step can be reduced, the stress on the portion 16 can be reduced, and deformation of the portion 16 facing the opening 21 in the assembly sheet 1 can be suppressed.

[0075] According to this manufacturing method, in the first step, as shown in Fig. 1B, the assembly sheet 1 and the support sheet 2 are arranged between the first die 3 and the second die 4 so that the assembly sheet 1 faces the first die 3 having the punch 32 and the support sheet 2 faces the second die 4 having the hole. This then makes it possible to improve the positional accuracy during punching in the second step, as shown in Fig. 1C.

[0076] Furthermore, in the second step, when the punch 32 is inserted into the hole 42, the portion 16 of the assembly sheet 1 that is near the outside of the punch 32 and faces the opening 21 moves toward the opening 21, as described above. Then, as shown in FIG. 1D , the movement of the portion 16 of the assembly sheet described above may cause deformation of the assembly sheet.

[0077] However, according to this manufacturing method, as described above, deformation of portion 16 can be effectively suppressed if the total opening ratio of multiple openings 21 is 20% or more and / or the thickness T of support sheet 2 is 150 μm or less.

[0078] 3. Variations In the following modifications, the same components and steps as those in the above-described embodiment are denoted by the same reference numerals, and detailed descriptions thereof will be omitted. Furthermore, the modifications can achieve the same effects as those in the above-described embodiment, unless otherwise specified. Furthermore, the embodiment and its modifications can be combined as appropriate.

[0079] 3.1 First Modification In the first modified example, although not shown, the support sheet 2 does not have the openings 21.

[0080] Comparing the first modified example and the embodiment, the embodiment is preferable. In the embodiment, the punch 32 can be prevented from contacting the support sheet 2, and furthermore, damage to the support sheet 2 can be prevented. Therefore, the generation of foreign matter (dust generation) caused by the above-mentioned contact can be prevented. Furthermore, because damage to the support sheet 2 is prevented, the support sheet 2 can be reused.

[0081] 3.2 Second Modification As shown in Fig. 4, one opening 22 may correspond to two corners 115. The two corners 115 include a corner 115A of one wired circuit board 11A and a corner 115B of another wired circuit board 11B adjacent to the one wired circuit board 11A. The opening 22 has an elongated hole shape when viewed in the thickness direction. The assembly sheet 1 and the support sheet 2 are overlapped so that the opening 22 includes the two corners 115A and 115B when viewed in the thickness direction.

[0082] 3.3 Third variant In one embodiment, the first mold 3 is disposed above the fourth mold. However, although not shown, in a third modified example, the first mold 3 is disposed below the fourth mold. [Example]

[0083] The present invention will be described in more detail below with reference to examples. It should be noted that the present invention is in no way limited to these examples. The specific numerical values ​​of the blending ratios (content ratios), physical property values, parameters, etc. used in the following description can be replaced with the upper limit (a numerical value defined as "equal to or less than") or lower limit (a numerical value defined as "equal to or more than") of the corresponding blending ratios (content ratios), physical property values, parameters, etc. described in the "Description of the Invention" above.

[0084] Example 1 [1st step] An assembly sheet 1 and a support sheet 2 were each produced. The thickness of the assembly sheet 1 was 60 μm. The thickness of the metal support layers 111A, 111B, and 111C was 30 μm and made of a copper alloy. The thickness of the insulating layers 112A, 112B, and 112C was 10 μm and made of polyimide. The thickness of the wiring layers 113A, 113B, and 113C was 10 μm and made of copper. The thickness of the cover insulating layers 114A, 114B, and 114C was 10 μm and made of polyimide.

[0085] The thickness T of the support sheet 2 was 25 μm. The support sheet 2 was a PET film. The openings 21 had a circular shape when viewed in the thickness direction. The total opening ratio of the multiple openings 21 in the support sheet 2 was 13%.

[0086] 1A and 2A, an assembly sheet 1 and a support sheet 2 are overlapped in the thickness direction to produce a laminated sheet 10. The assembly sheet 1 and the support sheet 2 are overlapped so that the opening 21 includes the joint 13 when viewed in the thickness direction. In this way, the laminated sheet 10 is produced.

[0087] The laminate sheet 10 was placed between the first mold 3 and the second mold 4 so that the assembly sheet 1 faced the first mold 3 and the support sheet 2 faced the second mold 4. Subsequently, at the same time, the stripper plate 5 was placed between the first flat plate 31 and the laminate sheet 10.

[0088] As shown in FIG. 1B, the laminated sheet 10 and the stripper plate 5 were then sandwiched between the first die 3 and the second die 4 in the thickness direction.

[0089] [Second process] As shown in FIGS. 1C and 2B, punch 32 was inserted into hole 42 to cut joint 13 and separate multiple wired circuit boards 11 from support portion 12.

[0090] [3rd step] As shown in FIG. 1D, assembly sheet 1 having a plurality of wired circuit boards 11 separated from supporting portion 12 was transported while being supported by supporting sheet 2.

[0091] Examples 2 to 10 Steps 1 to 3 were carried out in the same manner as in Example 1. However, the thickness T of the support sheet 2 prepared in step 1, the diameter of the openings, and the total opening rate were changed as shown in Table 1.

[0092] [evaluation] Deformity assessment The amount of deformation in the thickness direction of the portion 16 was measured. The deformation of the portion 16 was evaluated based on the amount of deformation as follows. The results are shown in Table 1.

[0093] ⊚: The deformation amount was less than 30 μm. ○: The deformation amount was 30 μm or more and less than 60 μm. △: The deformation amount was 60 μm or more. [Table 1] [Explanation of symbols]

[0094] 1 Assembly sheet 2 Support Sheet 3 Type 1 4 Type 2 11, 11A, 11B Wiring circuit board 12 Support part 13 Joint 21,22 Opening 32 Punch 42 holes 111A,111B,111C Metal support layer 112A, 112B, 112C insulating layer 113A,113B,113C wiring layer

Claims

1. a first step of stacking an assembly sheet including a plurality of wired circuit boards and support portions that support the plurality of wired circuit boards, and a support sheet for supporting the assembly sheet, in a thickness direction; a second step of separating the plurality of wired circuit boards from the support portion by cutting after the first step; a third step of conveying the assembly sheet including the plurality of wired circuit boards separated from the support portion while supporting the assembly sheet with the support sheet after the second step; A method for manufacturing a wired circuit board, comprising:

2. the support sheet has an opening penetrating through the thickness direction, the assembly sheet includes joints that connect the plurality of wired circuit boards to the support portion, In the first step, the assembly sheet and the support sheet are stacked together so that the opening includes the joint when viewed in the thickness direction; The method for manufacturing a wired circuit board according to claim 1 , wherein the second step includes cutting the joint.

3. 3. The method for manufacturing a wired circuit board according to claim 1, wherein the support sheet is a resin sheet.

4. 3. The method for manufacturing a wired circuit board according to claim 1, wherein the wired circuit board and the support portion each include a metal support layer, an insulating layer, and a wiring layer in that order toward one side in a thickness direction.

5. 3. The method for producing a wired circuit board according to claim 1, wherein the assembly sheet has a thickness of 500 [mu]m or less.

6. The openings are arranged at intervals, The method for producing a wired circuit board according to claim 2 , wherein a total opening ratio of the plurality of openings in the support sheet is 20% or more.

7. The method for producing a wired circuit board according to claim 2, wherein the support sheet has a thickness of 150 μm or less.

8. In the first step, the assembly sheet and the support sheet are arranged between a first die having a punch and a second die spaced apart from the first die in the thickness direction and having a hole, such that the assembly sheet faces the first die and the support sheet faces the second die; 8. The method for manufacturing a wired circuit board according to claim 6, wherein in the second step, the joint is punched out by inserting the punch into the hole.

Images