Component mounting device, component mounting method, and management device

Abstract

To provide a component mounting device capable of achieving both high mount quality and high mount efficiency, a component mounting method, and a management device.SOLUTION: The component mounting method for mounting multiple components on a board includes the steps of: acquiring position information regarding each mounting position of multiple components and component information regarding each of the multiple components (ST1); determining a mounting operation for mounting each of the multiple components based on the acquired position information and component information (ST5); and mounting the components on the board via the determined mounting operation (ST7).SELECTED DRAWING: Figure 15

Description

[Technical Field]

[0001] The present invention relates to a component mounting apparatus and method for mounting components on a board, and a management apparatus. [Background technology]

[0002] A component mounting device has a component mounting unit that picks up and holds components from a component supply device such as a tape feeder, and mounts the held components at mounting positions on a board. The component mounting unit is configured with a mounting head that vertically raises and lowers a nozzle that holds the components, and a mounting head movement mechanism that moves the mounting head horizontally. Some component mounting devices are known that perform an arch motion operation to move components held by the component mounting unit in parallel in the horizontal and vertical directions during component mounting, thereby reducing mounting time (for example, see Patent Document 1).

[0003] In the component mounting device (component mounter) described in Patent Document 1, a mounting order that prevents interference, such as mounting components in order from low to high, is determined in advance so that components that descend diagonally due to arch motion do not interfere with adjacent components already mounted on the board, and by mounting components in the determined order, component interference caused by arch motion is avoided, maintaining mounting quality and improving mounting efficiency. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-245537 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in conventional technologies including Patent Document 1, the mounting order is determined in advance taking into consideration interference of components caused by arch motion operation. However, there are cases where interference with adjacent components cannot be avoided simply by changing the mounting order due to factors such as the mounting position, and there is therefore room for further improvement in order to achieve both high mounting quality and high mounting efficiency.

[0006] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a component mounting apparatus, a component mounting method, and a management apparatus that can achieve both high mounting quality and high mounting efficiency. [Means for solving the problem]

[0007] The component mounting device of the present invention is a component mounting device for mounting a plurality of components onto a board, and comprises a component mounting unit that holds components and mounts them at mounting positions on the board, a control unit that controls the operation of the component mounting unit, and an input unit that accepts selection or modification of a mounting operation for mounting each of the plurality of components onto the board, wherein the input unit accepts selection of a mounting operation that includes or does not include an arch motion operation that moves a component held by the component mounting unit in parallel in horizontal and vertical directions, or modification of an execution time of the arch motion operation or a target height of the component at the end of the arch motion operation, and selects a first component of the plurality of components to be mounted on the board. and an interference determination unit that determines whether at least a portion of a second component to be placed adjacent to the first component overlaps with a predetermined range when the second component is moved by the arch motion operation, and when the interference determination unit determines that the second component overlaps with the predetermined range, the input unit accepts selection or modification of a placement operation for placing the second component, and the control unit places the second component on the board based on the selected or modified placement operation, and the predetermined range is calculated from the position of an upper surface and a component height of the first component, and a descent angle when the second component descends by the arch motion operation. of above surface The range is.

[0008] A component mounting method of the present invention is a component mounting method for mounting a plurality of components onto a board, comprising: accepting a selection or modification of a mounting operation for mounting each of a plurality of components onto a board; mounting the components onto the board by the selected or modified mounting operation; the selection of the mounting operation includes a selection of a mounting operation that includes or does not include an arch motion operation that moves the component in parallel in horizontal and vertical directions when mounting the component at a mounting position; and the modification of the mounting operation includes a modification of an execution time of the arch motion operation when mounting the component at the mounting position or a target height of the component at the end of the arch motion operation; determining whether at least a portion of a second component to be placed adjacent to a first component overlaps a predetermined range around a first component among the plurality of components to be placed on the board when the second component is moved by the arch motion operation, and if it is determined that the second component overlaps the predetermined range, accepting selection or modification of a placement operation for placing the second component, and placing the second component on the board based on the selected or modified placement operation, the predetermined range being calculated from the position of an upper surface and a component height of the first component, and a descent angle when the second component descends by the arch motion operation; of above surface The range is.

[0011] The management device of the present invention is a management device for managing a production line including a component mounting device that mounts a plurality of components on a board, and includes a communication unit that communicates with the component mounting device, an input unit that accepts selection or modification of a mounting operation for mounting the plurality of components at each mounting position of the components, and a mounting information modification unit that modifies mounting information related to the mounting operation so that the components are mounted on the board by the selected or modified mounting operation, wherein the communication unit transmits the modified mounting information to the component mounting device, and the input unit selects whether the mounting operation includes or does not include an arch motion motion that moves the component in parallel in horizontal and vertical directions when mounting the component at the mounting position, or modifies the arch motion in the mounting operation. and an interference determination unit that receives a modification of an execution time of a mounting operation or a target height of a component at the end of the arch-motion operation, and determines whether a second component to be mounted adjacent to a first component will overlap a predetermined range around the first component among the plurality of components to be mounted on the board when the second component is moved by the arch-motion operation, and when the interference determination unit determines that the second component will overlap the predetermined range, the input unit receives a selection or modification of a mounting operation for mounting the second component, and the predetermined range is calculated from the position of the top surface and height of the first component, and a descent angle when the second component descends by the arch-motion operation. of above surface The range is. [Effects of the Invention]

[0013] According to the present invention, it is possible to achieve both high mounting quality and high mounting efficiency. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a diagram illustrating the configuration of a component mounting system according to an embodiment of the present invention. [Figure 2] FIG. 1 is a diagram illustrating the configuration of a component mounting device according to an embodiment of the present invention. [Figure 3] FIG. 1 is a functional explanatory diagram of a component mounting device according to an embodiment of the present invention; [Figure 4] FIG. 1 is a block diagram showing the configuration of a component mounting system according to an embodiment of the present invention. [Figure 5] FIG. 10 is a diagram showing an example of position information used in the component mounting system according to the embodiment of the present invention. [Figure 6] FIG. 1 is a diagram showing an example of a board on which components are mounted by a component mounting device according to an embodiment of the present invention. [Figure 7] 1A, 1B, and 1C are explanatory diagrams illustrating an example of component mounting by a first operation in a component mounting device according to an embodiment of the present invention; [Figure 8] (a) (b) (c) (d) is a process explanatory diagram of an example of component mounting by a second operation in a component mounting device according to an embodiment of the present invention. [Figure 9] FIG. 1A is a diagram showing an example of arch motion stage information in a component mounting system according to an embodiment of the present invention; FIG. 1B is a diagram explaining arch motion stages; [Figure 10] FIG. 1 is a diagram illustrating an example of interference with an adjacent component when a component is placed on a board using a placement operation including an arch motion in a component placement device according to an embodiment of the present invention. [Figure 11] 1A and 1B are diagrams illustrating a determination of whether or not there is interference with an adjacent component when a component is placed on a board using a placement operation including an arch motion in a component placement device according to an embodiment of the present invention. [Figure 12] FIG. 10 is a diagram showing an example of a mounting information correction screen displayed in the component mounting system according to the embodiment of the present invention. [Figure 13] FIG. 1A is a diagram showing an example of first operation determination information used in a component mounting system according to an embodiment of the present invention; FIG. 1B is a diagram showing an example of arch motion time determination information; FIG. 1C is a diagram showing an example of arch motion stage determination information; and FIG. 1D is a diagram showing an example of precision proximity target height determination information. [Figure 14] 1 is a flow diagram of a component mounting method according to a first embodiment of the present invention; [Figure 15] 1 is a flow diagram of a component mounting method according to a second embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0015] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanatory purposes and can be modified as appropriate depending on the specifications of the component mounting system, component mounting device, and management device. Corresponding elements in all drawings will be denoted by the same reference numerals, and redundant description will be omitted. In FIG. 2 and in some sections described below, the X direction (left-right direction in FIG. 2 ) of the board transport direction and the Y direction (up-down direction in FIG. 2 ) orthogonal to the board transport direction are shown as two axial directions that are orthogonal to each other in a horizontal plane. In FIG. 3 and in some sections described below, the Z direction (up-down direction in FIG. 3 ) is shown as a height direction that is orthogonal to the horizontal plane. The Z direction is the up-down direction or the orthogonal direction when the component mounting device is installed on a horizontal plane.

[0016] First, the configuration of component mounting system 1 will be described with reference to Figure 1. Component mounting system 1 has the function of mounting components onto a board to produce a mounted board. Component mounting system 1 is configured by connecting multiple component mounting devices M1 to M3. Component mounting devices M1 to M3 are connected to management device 3 via communication network 2. Management device 3 provides overall management of the production of mounted boards by component mounting system 1, and supports the component mounting work of component mounting devices M1 to M3 to mount components onto the board. Note that the number of component mounting devices M1 to M3 provided in component mounting system 1 is not limited to three, and may be one, two, four or more.

[0017] Next, the configuration of component mounting devices M1 to M3 will be described with reference to Figures 2 and 3. Component mounting devices M1 to M3 have the same configuration, and only component mounting device M1 will be described here. In component mounting device M1, a board transport mechanism 5 is installed in the X direction at the center of base 4. Board transport mechanism 5 transports board 6, which is the target for component mounting and has been carried in from the upstream side, in the X direction, and positions and holds it at a mounting operation position by a mounting head, which will be described below. In addition, board transport mechanism 5 carries board 6 downstream after component mounting operation has been completed.

[0018] 2, component supply units 7 are installed on both sides (front and back) of the board transport mechanism 5. Tape feeders 8 are attached to the component supply units 7 on both sides in parallel in the X direction. The tape feeders 8 feed a carrier tape, on which pockets for storing components are formed, by pitch feeding in a direction (tape feed direction) from the outside of the component supply unit 7 toward the board transport mechanism 5, thereby supplying components to a component removal position where the mounting head picks up the components.

[0019] A Y-axis table 9 equipped with a linear drive mechanism is disposed on both ends in the X direction on the upper surface of the base 4. A beam 10 similarly equipped with a linear mechanism is connected to the Y-axis table 9 so as to be movable in the Y direction. A mounting head 11 is attached to the beam 10 so as to be movable in the X direction. The mounting head 11 is a multiple head equipped with multiple (four in this case) holding heads 12.

[0020] 3, a suction nozzle 13 that suctions and holds a component D on a suction surface 13a is attached to the lower end of each holding head 12. Each holding head 12 is equipped with a nozzle lifting mechanism 14 that raises and lowers the suction nozzle 13 up and down (vertical direction), and a nozzle rotation mechanism (not shown) that rotates the suction nozzle 13 by θ around a vertical axis (Z axis). The holding head 12 rotates the suction nozzle 13 by a predetermined rotation angle using the nozzle rotation mechanism, and lowers it to a predetermined mounting height in the Z direction using the nozzle lifting mechanism 14 (arrow a), and mounts the component D held by the suction nozzle 13 on the upper surface 6a of the board 6.

[0021] 2 and 3, the Y-axis table 9 and beam 10 constitute a mounting head moving mechanism 15 that moves the mounting head 11 horizontally (in the X and Y directions). The mounting head 11, which is equipped with the mounting head moving mechanism 15 and the nozzle lifting mechanism 14, constitutes a component mounting unit 16 that performs a component mounting operation of picking up components D from the component supply unit 7 and mounting them in their mounting positions on the board 6. In other words, the component mounting unit 16 has the function of moving the components D it holds in both horizontal and vertical directions. During the component mounting operation, the component mounting unit 16 repeatedly performs a series of turns to pick up predetermined components D from the component supply unit 7 using each suction nozzle 13 provided on the mounting head 11, and mount the components D held by each suction nozzle 13 at a predetermined rotation angle in their mounting positions on the board 6.

[0022] The number of holding heads 12 provided in the mounting head 11 is not limited to four. The mounting head 11 may also be a rotary head with multiple suction nozzles 13 arranged concentrically. The method by which the mounting head 11 holds the component D is not limited to vacuum suction using the suction nozzles 13, and may include a method of gripping the component D with a chuck.

[0023] Here, the detailed configuration of the substrate transport mechanism 5 will be described with reference to Figure 3. In the substrate transport mechanism 5, a pair of transport conveyors 18 are installed inside a pair of plate-like members 17 extending in the X direction. The transport conveyors 18 support both ends of the substrate 6 from below and transport the substrate 6 in the X direction using a transport belt driven by a motor (not shown). Presser plates 19 (see also Figure 2) that protrude above the transport conveyors 18 are installed on the upper ends of the pair of plate-like members 17. The distance between the lower surface of the presser plates 19 and the upper surface of the transport conveyors 18 is wider than the thickness of the substrate 6 transported by the transport conveyor 18.

[0024] Below the substrate 6 being transported to the mounting position, a lower support member 21 (see also FIG. 2) that moves up and down (arrow b) by means of a cylinder 20 is installed. The substrate transport mechanism 5 positions the substrate 6 at the mounting position, raises the lower support member 21 to lift the substrate 6 from the transport conveyor 18, and holds the substrate 6 at the mounting position by pressing down both edges of the substrate 6 from above with the lower surfaces of pressure plates 19 (the state shown in FIG. 3). When transporting the substrate 6, the substrate transport mechanism 5 lowers the lower support member 21 to a position where it does not interfere with the underside of the substrate 6.

[0025] 2 and 3, beam 10 is equipped with a board recognition camera 22 that is located on the underside of beam 10 and moves integrally with mounting head 11. As mounting head 11 moves, board recognition camera 22 moves above board 6 positioned at the mounting operation position of board transport mechanism 5, and captures an image of a board mark (not shown) provided on board 6 to recognize the position of board 6.

[0026] A component recognition camera 23 is installed between the component supply unit 7 and the board transport mechanism 5. When the mounting head 11, which has taken out a component D from the component supply unit 7, is positioned above the component recognition camera 23, the component recognition camera 23 captures an image of the component D held by the suction nozzle 13 from below. When the mounting head 11 mounts the component D on the board 6, correction is made taking into account the recognition result of the board 6 by the board recognition camera 22 and the recognition result of the component D by the component recognition camera 23.

[0027] 2, a touch panel 24 operated by the operator is installed in front of the component mounting device M1 at the position where the operator works. The touch panel 24 displays various information on its display, and the operator inputs data and operates the component mounting device M1 using buttons and other devices displayed on the display.

[0028] Next, the configuration of component mounting system 1 will be described with reference to Figure 4. Component mounting system 1 includes component mounting devices M1 to M3 and a management device 3. Component mounting devices M1 to M3 have similar configurations, and only component mounting device M1 will be described here. Component mounting device M1 includes a mounting control device 30, which is connected to a board transport mechanism 5, a cylinder 20 that raises and lowers a support member 21, a tape feeder 8 attached to a component supply unit 7, a nozzle lifting mechanism 14 and a mounting head moving mechanism 15 that constitute a component mounting unit 16, a board recognition camera 22, a component recognition camera 23, and a touch panel 24.

[0029] The placement control device 30 includes a transport control unit 31, a placement control unit 32, an information acquisition unit 33, an interference determination unit 34, an input processing unit 35, an operation determination unit 36, a placement communication unit 37, and a placement storage unit 38. The placement storage unit 38 is a storage device that stores position information 39, component information 40, board information 41, determination information 42, placement operation information 43, placement information 44, etc. The placement communication unit 37 is a communication interface that transmits and receives data to and from other component placement devices M2 and M3 and the management device 3 via the communication network 2.

[0030] 4, the management device 3 includes a management processing unit 50, a management storage unit 51, a display unit 52, an input unit 53, and a management communication unit 54. The display unit 52 is a display device such as a liquid crystal panel, and displays various data, operation screens, etc. The input unit 53 is an input device such as a keyboard, touch panel, or mouse, and is used to input operation commands and data. The management communication unit 54 is a communication interface, and transmits and receives data to and from the component mounting devices M1 to M3 via the communication network 2.

[0031] The transport control unit 31 controls the board transport mechanism 5 and the cylinder 20 based on various information stored in the placement memory unit 38, causing the board 6 to be transported and positioned and held at the placement work position. The placement control unit 32 controls the tape feeder 8, the component placement unit 16, the board recognition camera 22, and the component recognition camera 23 based on various information stored in the placement memory unit 38, and performs a component placement work in which the components D supplied by the tape feeder 8 are placed at the placement positions on the board 6 held at the placement work position. In other words, the placement control unit 32 is a control unit that controls the operation of the component placement unit 16.

[0032] In FIG. 4, position information 39 includes information about the mounting position where component D is to be mounted on board 6. Component information 40 includes, for each component name that identifies the type of component D to be mounted on board 6, the size (length, width, component height) and electrical characteristics of component D. Board information 41 stores, for each type of board 6, the maximum predicted amount of warpage at the mounting position when the board 6 held at the mounting position warps up or down (the height position of the top surface 6a of the board 6 relative to the height of the top surface 6a of the board 6 in the absence of warpage). For example, the predicted amount of warpage of the board 6 is stored as a function with the X and Y coordinates of the mounting position as variables. The predicted amount of warpage of the board 6 tends to be smaller near both edges of the board 6 that are held down by the pressure plate 19, and larger near the center of the board 6, which is further away from the edges.

[0033] An example of the position information 39 will now be described with reference to Figs. 5 and 6. Fig. 6 shows a portion of the board 6 on which a component D has been placed based on the position information 39 shown in Fig. 5. In Fig. 5, the position information 39 includes information such as a placement position number 60, placement position coordinates 61, a component name 62, an AM operation 63, an AM execution time 64, a placement operation number 65, a target height 66, and an approach direction 67. The placement position number 60 is information that identifies the placement position P of the component D on the board 6. Fig. 5 shows information on placement positions P with placement position numbers 60 of "P01" to "P10." Hereinafter, the placement position P with the placement position number 60 of "P01" will be simply referred to as "placement position P01" (see also Fig. 6).

[0034] 5, mounting position coordinates 61 are information including the mounting coordinates (XY coordinates) and mounting direction (θ direction) of mounting position P of component D. Component name 62 is information specifying the type of component D to be mounted at mounting position P of that mounting position number 60. In FIG. 5, component D with component name 62 "E" is specified for mounting positions P01, P03 to P05, and P07 to P10, component D with component name 62 "F" for mounting position P02, and component D with component name 62 "G" for mounting position P06. Hereinafter, component D with component name 62 "E" will be simply referred to as "component E" (see also FIG. 6).

[0035] The AM operation 63 specifies whether component D is to be placed by a placement operation including an arch motion operation that moves component D held by component placement unit 16 in the horizontal direction (XY direction) and the vertical direction (Z direction) in parallel (Y), or whether component D is to be placed by a placement operation that does not include an arch motion operation (N). That is, component D is placed at placement position P for which AM operation 63 is "Y" by a first operation that includes an arch motion operation, which will be described later, and component D is placed at placement position P for which AM operation 63 is "N" by a second operation that does not include an arch motion operation, which will be described later.

[0036] The first and second operations will now be described with reference to Figures 7 and 8. Figures 7(a) to 7(c) show a process in which, in a first operation, component D2 held by suction nozzle 13 provided in component mounting unit 16 is mounted at mounting position P2 adjacent to component D1 already mounted at mounting position P1 on board 6. In Figure 7(a), component mounting unit 16 moves held component D2 in the horizontal direction at high speed (arrow c1) through a high-speed movement section up to a predetermined proximity position Q above mounting position P2.

[0037] In FIG. 7(b), the component mounting unit 16 moves the component D2 it holds in an arch motion through a precision approach section from the approach position Q to a pre-landing position R directly above the mounting position P2, where the height of the bottom surface of the component D2 is at a precision approach target height h0 above the upper surface 6a of the board 6 (arrow c2). That is, the mounting control unit 32 simultaneously operates the mounting head movement mechanism 15 and the nozzle lifting mechanism 14 of the component mounting unit 16 to move the component D2 held by the suction nozzle 13 in parallel in the horizontal and vertical directions (diagonally downwards) to lower the component D2 to the precision approach target height h0. The movement speed in the precision approach section is, for example, equal to the movement speed in the high-speed movement section. Alternatively, the movement speed in the precision approach section may be set slower than the movement speed in the high-speed movement section. In this case, placement accuracy can be improved.

[0038] 7(c), the component mounting unit 16 vertically lowers the component D2 it is holding through the landing zone from the pre-landing position R until the bottom surface of the component D2 lands at the mounting position P2 (arrow c3). After that, the vacuum suction is stopped to separate the component D2 from the suction nozzle 13, and the component mounting unit 16 raises the suction nozzle 13 upward, thereby mounting the component D2 on the board 6. In the first operation, the mounting time can be shortened by moving the component D2 through the precision approach zone using an arch motion.

[0039] 8(a) to 8(d) show a process of placing component D2 held by suction nozzle 13 of component mounting unit 16 in mounting position P2 adjacent to component D1 already placed in mounting position P1 on board 6 in a second operation. In FIG. 8(a), component D2 held by component mounting unit 16 is moved horizontally at high speed (arrow d1) to approach position Q in the high-speed movement section, which is the same as the first operation. The second operation differs from the first operation in that component mounting unit 16 moves held component D2 to pre-landing position R in the precision approach section without performing an arch motion.

[0040] That is, in the precision approach section, the component mounting unit 16 moves the component D2 it holds horizontally to directly above the mounting position P2 (arrow d2 in FIG. 8(b)). Next, the component mounting unit 16 vertically lowers the component D2 it holds to the pre-landing position R (arrow d3 in FIG. 8(c)). In FIG. 8(d), the component mounting unit 16 vertically lowers the component D2 it holds between the landing sections to land it on the board 6 (arrow d4), which is the same as the first operation. The second operation has the advantage that the distance traveled by the component D2 in the precision approach section is longer than in the first operation, and therefore the mounting time is longer than in the first operation. However, it has the advantage of being able to avoid interference with an adjacent component D1 already mounted on the board 6.

[0041] In Figure 5, AM execution time 64 is the length of execution time of the arch motion operation in the mounting operation of part D, which will be described later. Mounting operation number 65 is a number that identifies a plurality of pre-set mounting operations (arch motion stages) that have different execution times for the arch motion operation, which will be described later. Hereinafter, the "execution time of the arch motion operation" will be simply referred to as the "arch motion time."

[0042] The target height 66 is the target height (precise approach target height h0) of the component D2 at the end of the arch motion in the placement operation of the component D2, which will be described later. The approach direction 67 is the range of directions in which the component D2 held by the component placement unit 16 can approach the placement position P2 in the first operation, including the arch motion, without interfering with the adjacent component D1 (see also FIG. 12). The approach direction 67 of "0-360" indicates that the range in which the component D2 can approach the placement position P2 in the first operation is from 0° to 360°. In other words, the approach direction 67 of "0-360" indicates that the component D2 can be placed on the board 6 by approaching the placement position P2 from any direction in the first operation without interfering with the adjacent component D1.

[0043] An example of an arch motion stage will now be described with reference to FIG. 9. FIG. 9(a) shows an example of arch motion stage information stored in the placement operation information 43. The arch motion stage information includes information such as a placement operation number 68, an AM execution time 69, and a target height 70. The placement operation number 68 is a number that identifies the arch motion stage. The AM execution time 69 is the length of the arch motion time in the placement operation of component D. The target height 70 is the target height (precise proximity target height h0) of component D at the end of the arch motion in the placement operation. The position information 39 and the placement operation information 43 are associated with each other by the numbers specified in the placement operation number 65 and the placement operation number 68.

[0044] In this example, the arch motion stage information includes six arch motion stages, with the wearing action number 68 ranging from "1" to "6" and the arch motion time ranging from "50 ms" to "0 ms." That is, wearing actions with arch motion times that vary in increments of 10 ms are set. Hereinafter, the wearing action with the wearing action number 68 of "1" included in the wearing action information 43 will be simply referred to as "wearing action 1," etc.

[0045] 9(b) is a diagram illustrating mounting operations 1 to 6. The vertical axis indicates the height h of the bottom surface of component D held by component mounting unit 16 relative to the top surface 6a of unwarped board 6 held at the mounting position. The horizontal axis indicates the horizontal position (XY direction) of component D transferred to mounting position P by mounting operations 1 to 6.

[0046] In all of placement operations 1 to 6, the component mounting unit 16 moves the component D horizontally at high speed at a high-speed movement height in the high-speed movement section up to the approach position Q. In placement operation 1, the component mounting unit 16 moves the component D diagonally downward using an arch motion from the approach position Q to the pre-landing position R in the precision approach section from the approach position Q to the pre-landing position R. The arch motion time for placement operation 1 is 50 ms. The target height 70 of the component D at the end of the arch motion is the precision approach target height h0-1.

[0047] 9(b), the component mounting unit 16 sequentially moves horizontally, then diagonally descends in an arch motion, and then vertically descends so that the arch motion time reaches the set time in the precision proximity section in mounting operations 2 to 5. The target height 70 of component D at the end of the arch motion is precision proximity target height h0-2 to h0-5, respectively.

[0048] In placement operation 6, the component mounting unit 16 moves the component D horizontally and then vertically lowers it in the precision proximity section. The arch motion time of placement operation 6 is 0 ms. That is, placement operation 6 is a second operation that does not include an arch motion, and the target height 70 is the precision proximity target height h0-6, which is the same as the high-speed movement height. In all of placement operations 1 to 6, the component mounting unit 16 vertically lowers the component D to placement position P between the pre-landing position R and the landing section.

[0049] 5, in the position information 39, as initial values, "Y" is specified as the AM operation 63 at all mounting positions P, "50 ms" is specified as the AM execution time 64, and "1" (mounting operation 1) is specified as the mounting operation number 65. Furthermore, in the position information 39, "h0-1" is specified as the target height 66, and "0-360" is specified as the approach direction 67.

[0050] It should be noted that the position information 39 does not need to include all of the AM action 63, AM execution time 64, wearing action number 65, target height 66, and approach direction 67, but may include at least one of them. Furthermore, the AM action 63, AM execution time 64, wearing action number 65, target height 66, and approach direction 67 may be stored in the wearing memory unit 38 as information (files) separate from the position information 39, and may be associated with the position information 39 by the wearing position number 60.

[0051] 10, a phenomenon will be described in which component D2, which is being moved by arch motion, interferes with (comes into contact with) adjacent component D1 that has already been placed when component D2 held by suction nozzle 13 is being placed at placement position P2 on board 6. Placement position P2 of component D2 and placement position P1 of adjacent component D1 are set based on the component sizes (length, width, and component height) so that they do not interfere with each other during the component placement operation, even in the first operation including arch motion. However, component D2 may interfere with adjacent component D1 during placement due to factors such as variations in the shapes of board 6 and components, warping of board 6, and misalignment of component placement positions.

[0052] In the example of Figure 10, the top surface 6a of the board 6 held in the mounting position is warped upward from the height position indicated by the two-dot chain line when no warp is present, and the adjacent component D1 mounted on the board 6 is misaligned toward the mounting position P2 of the component D2. Therefore, when component D2 is being mounted on the board 6, the component D2, which is moving in an arch motion (arrow e), comes into contact with the adjacent component D1 that has already been mounted (circle f). If the component D2 comes into contact with the adjacent component D1 during movement, it may be displaced from the mounting position P2 or may be dropped off without being mounted on the board 6.

[0053] 4, the interference determination unit 34 determines whether or not component D2 held by the component mounting unit 16 will interfere with (contact with) an adjacent component D1 that is mounted adjacently when the component D2 is mounted at mounting position P2 on the board 6 by a first operation including an arch motion operation. The information acquisition unit 33 acquires information necessary for the interference determination unit 34 to determine whether or not interference will occur. Specifically, the information acquisition unit 33 acquires position information 39, component information 40, and board information 41 from the mounting storage unit 38.

[0054] 11, the interference determination unit 34 will explain the determination of whether component D2 held by the suction nozzle 13 of the component mounting unit 16 will interfere with adjacent component D1 when mounted at mounting position P2 on the board 6 in the first operation. In FIG. 11(a), component D2 descends in an arch motion to a pre-landing position R at a precision proximity target height h0-1 above mounting position P2. FIG. 11 also shows a schematic diagram of a method for determining whether component D2, descending obliquely at a descent angle φ by arch motion, will interfere with adjacent component D1 when the adjacent component D1 is low (component height H1) and high (component height H2). Note that the width and length of the adjacent component D1 are the same whether the component is high or low.

[0055] The interference determination unit 34 calculates the interference warning range A1 (interference warning range A2) of the adjacent part D1, which is calculated from the position of the upper surface of the adjacent part D1, the part height H1 (part height H2), and the descent angle φ. Specifically, the interference determination unit 34 calculates the interference warning range A1 (interference warning range A2) as the area inside the distance (H1 / tanφ, H2 / tanφ) obtained by multiplying the part height H1 (part height H2) from the edge of the upper surface of the adjacent part D1 by the reciprocal of the tangent (tanφ) of the descent angle φ.

[0056] Furthermore, the interference determination unit 34 widens the interference warning range A1 (interference warning range A2) by taking into account size variations between adjacent components D1 and D2, misalignment of mounting positions, and the predicted amount of warping of the board 6 at mounting position P1 contained in the board information 41 (or calculated from information contained in the board information 41). For example, near the center of the board 6 where the predicted amount of warping of the board 6 is large, a larger margin is added to the interference warning range A1 (interference warning range A2). Note that FIG. 11(b) shows the interference warning range A1 (interference warning range A2) before taking into account the predicted amount of warping of the board 6, etc.

[0057] 11(b), the interference determination unit 34 then determines whether or not part of the component D2 mounted at the mounting position P2 overlaps with the interference warning range A1 (interference warning range A2). If part of the component D2 overlaps with the interference warning range A1 (interference warning range A2), it determines that the component D2 descending by the arch motion will interfere with (contact with) the adjacent component D1, and if part D2 does not overlap, it determines that the component D2 will not interfere with the adjacent component D1.

[0058] In this example, if the height of adjacent part D1 is low (part height H1), part D2 will not interfere with adjacent part D1, but if the height is high (part height H2), it is determined that there will be interference. The interference determination unit 34 updates the AM operation 63 in the position information 39 of part D2 that is determined to interfere with adjacent part D1 to "N" and stores this as placement information 44 in the placement storage unit 38.

[0059] In this way, interference determination unit 34 determines whether at least a portion of second component D2 (component D2) to be placed adjacent to first component D1 (adjacent component D1) of multiple components D to be placed on board 6 overlaps with a predetermined range (interference warning range A1, A2) around the first component D1 (adjacent component D1). The predetermined range (interference warning range A1, A2) is set based on the height of first component D1 (component height H1, H2) and the warpage (predicted amount of warpage) of board 6 expected at placement position P1 of first component D1.

[0060] 4, when the interference determination unit 34 determines that the second part D2 (part D2) overlaps with the predetermined range (interference warning ranges A1, A2), the input processing unit 35 causes the touch panel 24 to display a wearing information correction screen that enables the worker to correct the wearing information 44. An example of the wearing information correction screen 71 displayed on the touch panel 24 will be described with reference to FIG. 12. FIG. 12 shows the wearing information correction screen 71 that is displayed on the touch panel 24 after the interference determination unit 34 determines, based on the position information 39 shown in FIG. 5, that part G (second part) to be mounted at mounting position P06 will interfere with part F (first part) to be mounted at mounting position P02.

[0061] 12, the wearing information correction screen 71 includes a "position information" display frame 72, a "plane" display frame 73, a "wearing operation" display frame 74, a "back" button 75, and a "confirm" button 76. The "position information" display frame 72 displays the following information included in the position information 39: the wearing position number 60, the wearing position coordinates 61, the part name 62, the wearing operation number 65, and the approach direction 67. The "position information" display frame 72 also displays a check box field ("AM off") for turning the arch motion operation on and off. When the worker operates the touch panel 24 to slide the scroll bar up or down, the information displayed in the "position information" display frame 72 scrolls.

[0062] At placement positions P01 to P05, P07 where the check box in the "AM off" column is not selected (white square in the figure), a component is placed by the first operation (placement operation 1 in this case) which includes an arch motion operation. At placement position P06 where the check box is selected (black square in the figure), a component is placed by the second operation (placement operation 6) which does not include an arch motion operation. In other words, for placement positions P01 to P05, P07 where the check box is not selected, the AM operation 63 is "Y", and for placement position P06 where the check box is selected, the AM operation 63 is "N". For a component that is determined by the interference determination unit 34 to overlap the interference warning area of ​​an adjacent component, the check box in the "AM off" column is automatically selected.

[0063] 12, the "Plane" display frame 73 schematically displays the mounting position P06 and the planar outline of the component G selected (here, hatched with diagonal lines) in the "Position Information" display frame 72. Furthermore, the "Plane" display frame 73 schematically displays the mounting position P02 and the planar outline of the adjacent component F adjacent to the component G, an interference warning range 73a of the adjacent component F, and an approach direction display 73b indicating the approach direction 67 of the component G. A portion of the component G (second component) overlaps with the interference warning range 73a (predetermined range) of the adjacent component F (first component).

[0064] The approach direction display 73b schematically shows an approach direction 67, which is the range of directions in which component G can approach placement position P06 by the first operation including the arch motion operation. In this example, the approach direction 67 for placement position P06 is in the range of 15° to 240° (15-240). In other words, when component G approaches placement position P06 from the range of 15° to 240°, it does not interfere with (contact with) the adjacent component F, and therefore placement is possible by the first operation. The approach direction 67 is calculated by the interference determination unit 34 from the positional relationship between placement position P02 of adjacent component F (first component) and placement position P06 of component G (second component), the sizes of adjacent components F and G, etc.

[0065] 12, the "Placement Operation" display frame 74 schematically displays the placement position P06 and outer shape of the side surface of component G selected in the "Position Information" display frame 72, the placement position P02 and outer shape of the side surface of adjacent component F, and the predicted trajectories when the components are placed by placement operations 1 to 6. Of the predicted trajectories of placement operations 1 to 6, placement operation 6 (second operation) set in the placement operation column of the "Position Information" display frame 72 is displayed in solid line.

[0066] The worker can change the placement action number 65 specified in the "Placement Action" field in the "Position Information" display frame 72 while referring to the outer shape of the adjacent component F (first component) displayed in the "Placement Action" display frame 74 and the predicted trajectories of placement actions 1 to 6. For example, by changing to placement action 4, the time required to place component G (second component) can be shortened while preventing interference with the adjacent component F by taking into account warpage and misplacement of the board 6. Note that the information that can be changed in the "Placement Action" display frame 74 is not limited to the placement action number 65. For example, the AM execution time 64 and target height 66 may be changeable on the placement information correction screen 71.

[0067] 12, when the worker operates the "Back" button 75, the change is canceled and the screen returns to the screen before the change. When the worker operates the "Confirm" button 76, the input processing unit 35 corrects (changes) the wearing information 44 based on the information set in the "Position information" display frame 72 and stores the corrected information in the wearing storage unit 38.

[0068] In this way, touch panel 24 is an input unit that accepts selection or modification of placement operations 1 to 6 for placing the second component when interference determination unit 34 determines that the second component (component G) overlaps with a predetermined range (interference warning range 73a) around the first component (component F). That is, touch panel 24 (input unit) accepts selection or modification of placement operations 1 to 6 for placing each of the multiple components D on board 6.

[0069] Specifically, the touch panel 24 accepts the selection of placement operations 1 to 5 (first operations) that include the arch-motion operation or placement operation 6 (second operation) that does not include the arch-motion operation, or the modification of the execution time of the arch-motion operation (arch-motion time Ta) or the target height of the component at the end of the arch-motion operation (precise proximity target height h0). Based on the accepted information, the input processing unit 35 modifies the placement information 44 and stores it in the placement storage unit 38.

[0070] The placement control unit 32 (control unit) then places the second component (component G) on the board 6 based on the selected or modified placement operation (placement information 44). That is, when the placement control unit 32 brings component G close to placement position P06 from within the range of approach direction 67 (15° to 240°), the placement control unit 32 places the component using the first operation (placement operation 1). When the placement control unit 32 brings component G close to placement position P06 from outside the range of approach direction 67 (240° to 15°), the placement control unit 32 places the component using the second operation (placement operation 6) or placement operations 2 to 5 set by placement operation number 65. This makes it possible to achieve both high mounting quality and high mounting efficiency.

[0071] 4, the operation determination unit 36 ​​determines whether or not to mount each of the multiple components D on the board 6 by a first operation including an arch motion operation. That is, the operation determination unit 36 ​​determines whether or not the component D2 will interfere with an adjacent component D1 during the arch motion when mounting the component D2 by the first operation. The information acquisition unit 33 acquires information necessary for the operation determination unit 36 ​​to determine whether or not to perform the first operation. Specifically, the information acquisition unit 33 acquires, from the mounting storage unit 38, position information 39 regarding the mounting position P, component information 40 regarding each of the multiple components D, board information 41, and first operation judgment information included in judgment information 42.

[0072] 13(a), an example of the first operation judgment information included in the judgment information 42 will be described. The first operation judgment information is defined based on the distance ΔX in the X direction (see FIG. 11(b)) and the distance ΔY in the Y direction between adjacent components D1 and D2 to be placed on the board 6. Here, the first operation judgment information for the X direction is shown. Note that the Y direction is similar to the X direction, and a detailed description will be omitted. The first operation judgment information defines that component D should be placed using a first operation including an arch motion when the distance ΔX in the X direction between adjacent components D1 and D2 is in a range wider than ΔX5 (ΔX5<ΔX), and using a second operation without an arch motion when the distance ΔX is narrower than ΔX5 (0≦ΔX≦ΔX5).

[0073] Operation determination unit 36 ​​calculates the spacing ΔX in the X direction between adjacent components D1 and D2 to be placed on board 6, based on the placement position P1 of adjacent component D1 and the placement position P2 of component D2 included in position information 39, and the sizes (width, length) of adjacent components D1 and D2 included in component information 40. Next, if the calculated spacing ΔX in the X direction is wider than a predetermined spacing ΔX5 (ΔX5<ΔX), operation determination unit 36 ​​determines a first operation (placement operation 6) including an arch motion operation as the placement operation.

[0074] The predetermined interval ΔX5 is set based on the height of the adjacent component D1 (component heights H1, H2) and the warpage (anticipated warpage amount) of the board 6 expected at the mounting position P1 of the adjacent component D1. The operation determination unit 36 ​​updates the AM operation 63 of the position information 39 based on the determination result, and stores it in the mounting memory unit 38 as mounting information 44.

[0075] 4, in another embodiment, the operation determination unit 36 ​​determines the arch motion time (the execution time of the arch motion operation) in the mounting operation of component D2. The information acquisition unit 33 acquires information necessary for the operation determination unit 36 ​​to determine the arch motion time. Specifically, the information acquisition unit 33 acquires arch motion time determination information included in position information 39, component information 40, board information 41, and determination information 42 from the mounting storage unit 38.

[0076] 13(b), the arch motion time determination information included in the judgment information 42 will be described. The arch motion time determination information is defined based on the distance ΔX in the X direction and the distance ΔY in the Y direction between adjacent components D1 and D2 mounted on the board 6. Here, the relationship between the distance ΔX in the X direction and the arch motion time Ta is shown. Note that the relationship in the Y direction is the same as in the X direction, so a detailed description will be omitted.

[0077] In this example, the arch motion time Ta is defined as a linear decrease from 50 ms when the X-direction spacing ΔX is ΔX5 to 0 ms when the X-direction spacing ΔX is ΔX1, which is narrower than ΔX5. The arch motion time Ta is defined as 50 ms when the X-direction spacing ΔX is wider than the predetermined spacing ΔX5 (ΔX5<ΔX), and as 0 ms when it is narrower than the predetermined spacing ΔX1 (0≦ΔX≦ΔX1). The predetermined spacings ΔX1 and ΔX5 are set based on the height of adjacent component D1 (component heights H1 and H2) and the expected warpage (expected amount of warpage) of the board 6 at the mounting position P1 of adjacent component D1.

[0078] Operation determination unit 36 ​​calculates the distance ΔX in the X direction between adjacent components D1 and D2 to be placed on board 6 from the placement positions P1, P2 and sizes (width, length) of adjacent components D1 and D2, and determines arch motion time Ta (execution time of arch motion operation) based on the arch motion time determination information included in judgment information 42. Operation determination unit 36 ​​also updates AM execution time 64 of position information 39 based on the determined arch motion time Ta, and stores it in placement storage unit 38 as placement information 44.

[0079] 4, as another embodiment, the operation determination unit 36 ​​selects component placement operations 1 to 6 from a plurality of placement operations (arch motion stages) with different preset arch motion times Ta (execution time of the arch motion operation). In this case, the information acquisition unit 33 acquires arch motion stage determination information included in position information 39, component information 40, board information 41, and judgment information 42 from the placement storage unit 38.

[0080] 13(c), the arch-motion stage determination information included in the judgment information 42 will be described. The arch-motion stage determination information is defined based on the distance ΔX in the X direction and the distance ΔY in the Y direction between adjacent components D1 and D2 to be placed on the board 6. Here, the relationship between the distance ΔX in the X direction and the arch-motion stages (placement operations 1 to 6) is shown. Note that the Y direction is similar to the X direction, and a detailed description thereof will be omitted.

[0081] In this example, the arch motion stages are specified in stages according to the interval ΔX in the X direction. That is, when the interval ΔX in the X direction is in the range of 0≦ΔX≦ΔX1, placement operation 6 (second operation) with an arch motion time Ta of 0 ms is specified. Furthermore, when the interval ΔX in the X direction is in the range of ΔX1<ΔX≦ΔX2, placement operation 5 with an arch motion time Ta of 10 ms is specified. Six stages of placement operations 1 to 6 are specified. The intervals ΔX1 to ΔX5 are set based on the height of adjacent component D1 (component heights H1 and H2) and the expected warpage (expected amount of warpage) of board 6 at placement position P1 of adjacent component D1.

[0082] The operation determination unit 36 ​​calculates the distance ΔX in the X direction between adjacent components D1 and D2 to be placed on the board 6 from the placement positions P1, P2 and sizes (width, length) of adjacent components D1 and D2, and determines the arch motion stage (placement operations 1 to 6) based on the arch motion stage determination information included in the judgment information 42. The operation determination unit 36 ​​updates the placement operation number 65 of the position information 39 based on the determined arch motion stage, and stores it in the placement storage unit 38 as placement information 44.

[0083] 4, in another embodiment, the operation determination unit 36 ​​determines a precision approach target height h0 of the pre-landing position R in the mounting operation of the component D2. That is, the operation determination unit 36 ​​determines the target height (precise approach target height h0) of the component D at the end of the arch motion when the component D2 held by the component mounting unit 16 is lowered obliquely by the arch motion. In this case, the information acquisition unit 33 acquires precision approach target height determination information included in the position information 39, component information 40, board information 41, and determination information 42 from the mounting storage unit 38.

[0084] 13(d), the precision proximity target height determination information included in the judgment information 42 will be described. The precision proximity target height determination information is defined based on the distance ΔX in the X direction and the distance ΔY in the Y direction between adjacent components D1 and D2 to be mounted on the board 6. Here, the relationship between the distance ΔX in the X direction and the precision proximity target height h0 is shown. Note that the same applies to the Y direction, and a detailed description will be omitted.

[0085] In this example, the precision proximity target height h0 is defined as a linear decrease from h0-6 when the X-axis spacing ΔX is ΔX1 to h0-1 when the X-axis spacing ΔX is ΔX5, which is greater than ΔX1. The precision proximity target height h0 is defined as h0-6 when the X-axis spacing ΔX is narrower than the predetermined spacing ΔX1 (0≦ΔX≦ΔX1), and as h0-1 when the X-axis spacing ΔX is wider than the predetermined spacing ΔX5 (ΔX5<ΔX). The predetermined spacings ΔX1 and ΔX5 are set based on the height of the adjacent component D1 (component heights H1 and H2) and the expected warpage (expected warpage amount) of the board 6 at the mounting position P1 of the adjacent component D1.

[0086] The operation determination unit 36 ​​calculates the distance ΔX in the X direction between adjacent components D1 and D2 to be placed on the board 6 from the placement positions P1, P2 and sizes (width, length) of adjacent components D1 and D2, and determines the precision approach target height h0 (the target height of the components at the end of the arch motion operation) based on the precision approach target height determination information included in the judgment information 42. The placement control unit 32 updates the target height 66 of the position information 39 based on the determined precision approach target height h0, and stores it in the placement memory unit 38 as placement information 44.

[0087] In this way, the operation determination unit 36 ​​determines the placement operation for placing each of the multiple components D on the board 6 based on the position information 39 and the component information 40. Specifically, the operation determination unit 36 ​​determines whether the placement operation is a placement operation including an arch motion operation (first operation, or placement operations 1 to 5) or a placement operation not including an arch motion operation (second operation, or placement operation 6), or determines the execution time of the arch motion operation in the placement operation (arch motion time Ta) or the target height of the component at the end of the arch motion operation (precise proximity target height h0).

[0088] Furthermore, the operation determination unit 36 ​​determines the mounting operation based on the size (width, length, height) of the component D included in the component information 40, the mounting position P included in the position information 39, and the predicted warpage of the board 6 (amount of board warpage). Then, the mounting control unit 32 (control unit) mounts each of the multiple components D on the board 6 based on the determined mounting operation. This makes it possible to achieve both high mounting quality and high mounting efficiency.

[0089] As described above, component mounting devices M1 to M3 of this embodiment include component mounting unit 16 that holds components D and mounts them at mounting positions P on board 6, mounting control unit 32 that controls the operation of component mounting unit 16, and input unit (touch panel 24) that accepts selection or modification of mounting operations for mounting each of the multiple components D on board 6. This makes it possible to achieve both high mounting quality and high mounting efficiency.

[0090] Furthermore, component mounting devices M1 to M3 of other embodiments include a component mounting unit 16 that holds a component D and mounts it at a mounting position P on a board 6, a mounting control unit 32 that controls the operation of the component mounting unit 16, an information acquisition unit 33 that acquires position information 39 regarding the mounting position P and component information 40 regarding each of the multiple components D, and an operation determination unit 36 ​​that determines a mounting operation for mounting each of the multiple components D on the board 6 based on the position information 39 and the component information 40. This makes it possible to achieve both high mounting quality and high mounting efficiency.

[0091] 4, a description will be given of management device 3 that manages a production line including component mounting devices M1 to M3 that mount multiple components D on board 6. Here, of the functions of management device 3, a description will be given of a function that creates (changes) mounting information 51a related to the mounting operation in which component mounting devices M1 to M3 mount components D on board 6. In addition to mounting information 51a, management memory unit 51 stores information similar to position information 39, component information 40, board information 41, and determination information 42 stored in mounting memory unit 38.

[0092] The management and communication unit 54 (communication unit) communicates with the component mounting devices M1 to M3. The input unit 53 accepts selection or modification of a mounting operation for mounting a component at each mounting position P of a plurality of components D. Specifically, the display unit 52 displays a mounting information modification screen 71. The input unit 53 then accepts selection of a mounting operation that includes an arch motion (first operation or mounting operations 1 to 5) or does not include an arch motion (second operation or mounting operation 6) when mounting the component D at the mounting position P, or modification of the execution time of the arch motion in the mounting operation (arch motion time Ta) or the target height of the component at the end of the arch motion (precise proximity target height h0).

[0093] The placement information change unit 50a included in the management processing unit 50 changes (or creates) placement information 51a relating to the placement operation so that the component D is placed on the board 6 by the placement operation selected or modified by the input unit 53. Thereafter, the management communication unit 54 transmits the changed placement information 51a to the component placement devices M1 to M3. The component placement devices M1 to M3 place the component D based on the transmitted placement information 51a.

[0094] 4, information acquisition unit 50b included in management processing unit 50 acquires, from component mounting devices M1 to M3 and a file server (not shown), position information 39 regarding mounting positions P at which each of multiple components D is to be mounted on board 6, component information 40 regarding each of the multiple components D, board information 41, and judgment information 42. Mounting operation determination unit 50c included in management processing unit 50 determines a mounting operation for mounting each of the multiple components D on board 6 based on position information 39 and component information 40.

[0095] Specifically, the mounting operation determination unit 50c determines whether the mounting operation includes an arch motion operation when mounting the component D at the mounting position P, or whether the mounting operation does not include the arch motion operation (first operation, or mounting operations 1 to 5), or the execution time (arch motion time Ta) of the arch motion operation when mounting the component D at the mounting position P, or the target height of the component at the end of the arch motion operation (precise proximity target height h0).

[0096] 4, the placement information change unit 50a changes (or creates) placement information 51a relating to the placement operation so that the component D is placed on the board 6 by the placement operation determined by the placement operation determination unit 50c. Thereafter, the management communication unit 54 transmits the changed placement information 51a to the component placement devices M1 to M3. The component placement devices M1 to M3 place the component D based on the transmitted placement information 51a.

[0097] As described above, management device 3 includes management communication unit 54, input unit 53 that accepts selection or modification of a mounting operation for mounting components D at each mounting position P of the plurality of components D, and mounting information modification unit 50a that modifies mounting information 51a related to the mounting operation so that components D are mounted on board 6 by the selected or modified mounting operation. Management communication unit 54 then transmits modified mounting information 51a to component mounting devices M1 to M3. This makes it possible to achieve both high mounting quality and high mounting efficiency.

[0098] Another embodiment of the management device 3 includes a management communication unit 54, an information acquisition unit 50b that acquires position information 39 regarding the mounting position P at which each of the multiple components D is to be mounted on the board 6 and component information 40 regarding each of the multiple components D, a mounting operation determination unit 50c that determines a mounting operation for mounting each of the multiple components D on the board 6 based on the position information 39 and the component information 40, and a mounting information modification unit 50a that modifies mounting information 51a regarding the mounting operation so that the components D are mounted on the board 6 by the determined mounting operation. Then, the management communication unit 54 transmits the modified mounting information 51a to the component mounting devices M1 to M3. This makes it possible to achieve both high mounting quality and high mounting efficiency.

[0099] Next, a component mounting method for mounting multiple components D on board 6 in component mounting system 1 will be described with reference to Figs. 11 and 12, following the flow of Fig. 14. First, information acquisition unit 33 of component mounting devices M1-M3 acquires position information 39 regarding mounting position P, component information 40 regarding each of the multiple components D, board information 41, and judgment information 42 from mounting storage unit 38 or a file server or the like connected to communication network 2 (ST1: information acquisition step). Next, interference determination unit 34 determines for each component D whether component D2 (second component) to be mounted adjacent to adjacent component D1 (first component) overlaps (interferes with) interference warning ranges A1, A2 (predetermined ranges) around adjacent component D1 (ST2: interference determination step).

[0100] If there is a component D2 interfering with the adjacent component D1 (YES in ST3), a placement information correction screen 71 (see FIG. 12) is displayed on the touch panel 24, and the touch panel 24 (input unit) accepts the worker's selection or correction of the placement operation for placing each of the multiple components D on the board 6 (ST4: placement information correction receiving step). The selection of the placement operation includes selecting placement operations 1 to 5 (first operations) that include an arch motion when placing component D2 at placement position P2, or placement operation 6 (second operation) that does not include an arch motion. The correction of the placement operation also includes correcting the execution time (arch motion time Ta) of the arch motion when placing component D2 at placement position P2 or the target height of component D2 at the end of the arch motion (precise proximity target height h0).

[0101] 14, input processing unit 35 then modifies mounting information 44 based on the information received in the mounting information modification receiving step (ST4) (ST5: mounting information modification step). Next, mounting communication unit 37 transmits the modified mounting information 44 to the other component mounting devices M1 to M3 (ST6: mounting information transmission step). Note that if there is no component D2 interfering with adjacent component D1 (No in ST3), the unmodified mounting information 44 is transmitted in the mounting information transmission step (ST6). Next, component mounting devices M1 to M3 mount component D on board 6 using the selected or modified mounting operation (mounting information 44) (ST7: component mounting step). This makes it possible to achieve both high mounting quality and high mounting efficiency.

[0102] Although the above describes an example in which the component mounting devices M1 to M3 change the mounting information 44, in the component mounting method of this embodiment (first embodiment), the management device 3 may change the mounting information 51a. In this case, in the management device 3, the information acquisition unit 50b acquires various information (ST1), the management processing unit 50 determines interference with the component D2 (ST2), the input unit 53 accepts selection or modification of the mounting operation (ST4), the mounting information change unit 50a modifies the mounting information 51a (ST5), and the management communication unit 54 transmits the mounting information 51a to the component mounting devices M1 to M3 (ST6).

[0103] Next, a second embodiment of a component mounting method for mounting multiple components D on a board 6 will be described with reference to the flow chart in Figure 15. In the second embodiment of the component mounting method, component mounting devices M1 to M3 automatically determine the mounting operation, which differs from the first embodiment in that the operator selects or modifies the mounting operation. Hereinafter, the same steps as in the first embodiment will be assigned the same reference numerals, and detailed explanations will be omitted. First, in an information acquisition step (ST1), position information 39 regarding the mounting position P of each of the multiple components D, component information 40 regarding each of the multiple components D, board information 41, and judgment information 42 are acquired.

[0104] Next, based on the acquired position information 39 and component information 40, operation determination unit 36 ​​determines a mounting operation for mounting each of the multiple components D on board 6 (ST11: mounting operation determination step). Specifically, based on judgment information 42 (see FIG. 13), operation determination unit 36 ​​determines whether the component D is to be mounted at mounting position P using mounting operations 1 to 5 (first operations) including an arch motion operation, or mounting operation 6 (second operation) not including an arch motion operation, or determines the execution time (arch motion time Ta) of the arch motion when mounting component D at mounting position P, or the target height of the component at the end of the arch motion (precise proximity target height h0).

[0105] 15, a mounting information correction step (ST5) is then executed, and the mounting information 44 is changed based on the mounting operation determined in the mounting operation determination step (ST11). Next, a mounting information transmission step (ST6) and a component mounting step (ST7) are executed. This allows for both high mounting quality and high mounting efficiency.

[0106] Although the above describes an example in which the component mounting devices M1 to M3 change the mounting information 44, in the component mounting method of this embodiment (second embodiment), the management device 3 may change the mounting information 51a. In this case, the mounting operation determination unit 50c of the management device 3 determines the mounting operation (ST11). [Industrial Applicability]

[0107] The component mounting apparatus, component mounting method, and management apparatus of the present invention have the effect of achieving both high mounting quality and high mounting efficiency, and are useful in the field of mounting components onto boards. [Explanation of symbols]

[0108] 1. Component placement system 6 PCB 16 Parts mounting section 24 Touch panel (input section) 73a, A1, A2 Interference warning range (predetermined range) D~G parts D1 First part (part) D2 Second part (part) h0 Precision proximity target height (target height of part at end of arch motion) H1, H2 Component height (height of first component) M1~M3 component placement device P, P1~P2, P01~P10 mounting position Ta Arch motion time (arch motion execution time)

Claims

1. A component mounting device that mounts a plurality of components on a board, a component mounting section that holds a component and mounts it on a mounting position on a board; a control unit for controlling the operation of the component mounting unit; an input unit that accepts selection or modification of a mounting operation for mounting each of the plurality of components on the board; the input unit accepts a selection of a mounting operation that includes or does not include an arch motion operation that moves the component held by the component mounting unit in parallel in the horizontal and vertical directions, or a correction of an execution time of the arch motion operation or a target height of the component at the end of the arch motion operation; an interference determination unit that determines whether or not at least a portion of a second component, which is mounted adjacent to a first component, overlaps with a predetermined range around the first component among the plurality of components mounted on the board when the second component is moved by the arch motion; When the interference determination unit determines that the second component overlaps the predetermined range, the input unit accepts selection or modification of a mounting operation for mounting the second component; the control unit places the second component on the board based on the selected or modified placement operation; a component mounting device in which the predetermined range is the range of the upper surface of the board surrounding the first component in a planar view, calculated from the position and height of the upper surface of the first component, and the descent angle when the second component descends by the arch motion operation.

2. The component mounting device according to claim 1 , wherein the input unit receives a selection or correction of a direction in which the component held by the component mounting unit approaches the mounting position.

3. 3. The component mounting device according to claim 1, wherein the predetermined range around the first component mounted on the board is set in consideration of expected warpage of the board.

4. A component mounting method for mounting a plurality of components on a substrate, comprising: Accepting a selection or modification of a placement operation for placing each of the plurality of components on the board; placing the component on the substrate using the selected or modified placement operation; the selection of the mounting operation includes selecting a mounting operation that includes or does not include an arch motion operation that moves the component in both horizontal and vertical directions when mounting the component at the mounting position; the correction of the mounting operation includes correction of an execution time of the arch motion operation when mounting the component at the mounting position or a target height of the component at the end of the arch motion operation; determining whether or not at least a portion of a second component to be placed adjacent to a first component will overlap a predetermined range around the first component among the plurality of components to be placed on the board when the second component is moved by the arch motion operation, and accepting selection or modification of a placement operation for placing the second component when it is determined that the second component overlaps the predetermined range; placing the second component on the substrate based on the selected or modified placement operation; a component mounting method in which the predetermined range is the range of the upper surface of the board surrounding the first component in a planar view, calculated from the position and height of the upper surface of the first component and the descent angle when the second component descends by the arch motion operation.

5. A management device for managing a production line including a component mounting device that mounts a plurality of components on a board, a communication unit that communicates with the component mounting device; an input unit that accepts selection or modification of a mounting operation for mounting the components at the respective mounting positions of the plurality of components; a placement information change unit that changes placement information related to the placement operation so that the components are placed on the board by the selected or modified placement operation; The communication unit transmits the changed mounting information to the component mounting device, the input unit accepts a selection of a mounting operation that includes or does not include an arch motion operation that moves the component in parallel in horizontal and vertical directions when mounting the component at the mounting position, or a correction of an execution time of the arch motion operation in the mounting operation or a target height of the component at the end of the arch motion operation; an interference determination unit that determines whether or not at least a portion of a second component, which is mounted adjacent to a first component, overlaps with a predetermined range around the first component among the plurality of components mounted on the board when the second component is moved by the arch motion; When the interference determination unit determines that the second component overlaps the predetermined range, the input unit accepts selection or modification of a mounting operation for mounting the second component; The specified range is the range of the top surface of the substrate surrounding the first component in a planar view, calculated from the position of the top surface of the first component, the component height, and the descent angle when the second component descends by the arch motion operation.

Images