Wire temperature measuring method and device, storage medium, and computer device

Abstract

This application discloses a wire temperature measurement method and apparatus, a storage medium, and a computer device. The method includes the steps of: acquiring an infrared thermal image of a wire to be measured in real time; determining an effective temperature measurement area from the infrared thermal image and characteristic information of the wire; creating a wire geometric model of the wire to be measured; projecting a predetermined light beam onto the wire geometric model to trace the ray propagation path of the predetermined light beam; calculating an effective emissivity based on the traced ray propagation path; and correcting the measured temperature of the effective temperature measurement area based on the effective emissivity to obtain a corrected temperature measurement result. The infrared thermal image is acquired and analyzed using an image processing method to dynamically capture the effective temperature measurement area, calculate and analyze the effective emissivity between the wire, and correct the measured temperature of the wire, thereby improving the accuracy and stability of wire temperature measurement.

Description

[Technical Field]

[0001] The present application relates to the technical field of high-speed wire production, and in particular to a method and apparatus for measuring the temperature of a wire, a storage medium, and a computer device.

[0002] This application claims priority to a Chinese patent application bearing application number 202310905741.3 and entitled "Method and apparatus for measuring temperature of wire, storage medium, and computer device," filed with the China Patent Office on July 21, 2023, the entire contents of which are incorporated herein by reference. [Background technology]

[0003] Stelmor controlled cooling is often used to achieve intelligent temperature control of wire. The Stelmor controlled cooling process is arranged as follows: the wire exiting the finishing mill unit immediately enters the water cooling section, which consists of multiple water tanks, for forced water cooling. It then passes through pinch rollers to the laying head, where it is formed into a coil. It is then laid in a loose roll on the continuously operating Stelmor conveyor, which is equipped with a fan for blowing air cooling. Finally, the wire enters the take-up drum, where it is wound and collected. The water cooling section controls the temperature of the rolled strip to prevent grain growth and prepare for subsequent phase transformation. The air cooling section controls the phase transformation of the rolled strip at a constant cooling rate to achieve the desired microstructure. The mechanical properties and microstructure of the wire depend primarily on the phase transformation process during the air cooling process. Therefore, precise control of the cooling rate during the phase transformation process is crucial. However, factors such as the harsh production environment on-site, the geometric characteristics of the wire itself, changes in the position of the temperature measurement target due to the wire vibrating left and right on the roller, and effective radiation generated by overlapping wires make existing temperature measurement methods difficult and reduce the accuracy of temperature measurement.

[0004] Currently, there are two main methods for measuring wire temperature in Stelmor air-cooling lines. One is to predict wire temperature changes using modeling and simulation of the wire air-cooling process. The other is non-contact temperature measurement, which directly measures the wire temperature. In the first method, the parameters of the model are set based on the wire temperature measured at the production site, so the accuracy of the model is limited by the accuracy of the measured temperature. In the second method, most companies currently use fixed spot thermometers as equipment to measure wire temperature, with a few using scanning spot thermometers. Due to the influence of the mesh structure caused by overlapping wires, the size of the object to be measured must be larger than the spot size of the spot thermometer, as a prerequisite for temperature measurement using a spot thermometer. However, the diameter of the wire is approximately 5.5 to 20 mm, making it difficult to accurately measure the wire temperature. Therefore, to reliably measure the wire temperature, it is common to select an area a certain distance from the end of the wire. This area is considered the effective temperature measurement area because it is not affected by holes caused by overlapping wires. With fixed spot thermometers, the position of the object to be measured is fixed, and the wire moves sideways as it moves forward on the rollers, making it difficult to align the thermometer with the object. Scanning spot thermometers scan the effective temperature measurement area up and down and perform peak filtering to obtain temperature information on the wire and capture the target measurement area, but temperature information may be missed due to the scanning cycle. Furthermore, scanning spot thermometers cannot solve the problem of instability and inaccuracy in temperature measurement results caused by effective radiation between wires. Summary of the Invention [Problem to be solved by the invention]

[0005] In view of the above, the present application provides a wire temperature measurement method and apparatus, a storage medium, and a computer device, which acquire an infrared thermal image and analyze the infrared thermal image using an image processing method to dynamically capture the effective temperature measurement area, calculate and analyze the effective emissivity between the wire, and further correct the measured temperature of the wire, thereby improving the accuracy and stability of wire temperature measurement. [Means for solving the problem]

[0006] According to one aspect of the present application, A step of acquiring an infrared thermal image of a wire rod whose temperature is to be measured in real time; determining an effective temperature measurement area based on the infrared thermal image and characteristic information of the wire material to be measured for temperature; creating a wire geometric model of the wire to be measured for temperature, projecting a predetermined ray of light onto the wire geometric model, tracing a ray propagation path of the predetermined ray of light, and calculating an effective emissivity based on the tracing result of the ray propagation path; and correcting the temperature measurement value of the effective temperature measurement area based on the effective emissivity to obtain a corrected temperature measurement result.

[0007] Optionally, the step of projecting a predetermined ray onto the wire geometric model, tracing a ray propagation path of the predetermined ray, and calculating an effective emissivity based on a result of tracing the ray propagation path includes: generating a plurality of traced rays and projecting each of the traced rays onto a target projection point of a wire geometric model including a plurality of target projection points; a step of tracing a ray propagation path of any of the rays to be traced in the line geometric model after the rays to be traced are projected, and determining whether the rays to be traced are absorbed by the line geometric model according to the ray propagation path; Calculating the local effective emissivity of the target projection point from the number of absorbed tracked rays and the total number of tracked rays, and obtaining the effective emissivity of the wire geometric model from the local effective emissivities of the multiple target projection points.

[0008] Optionally, before the step of projecting each of the traced rays onto a target projection point of a line geometric model, the method further comprises: determining the angle of incidence of each traced ray and the intrinsic emissivity of the wire; In this case, the step of projecting each of the rays to be traced onto a target projection point of a line geometric model includes: The method includes a step of projecting, for any of the rays to be tracked, the ray to be tracked onto a target projection point of a line geometric model according to a corresponding projection angle, so that the ray to be tracked performs ray propagation according to the target projection point.

[0009] Optionally, the step of determining whether the traced ray is absorbed by a wire geometric model according to the ray propagation path comprises: generating a random number when the tracking target ray is projected onto a target projection point of a wire geometric model, and if the random number exceeds the intrinsic emissivity of the wire whose temperature is to be measured, the tracking target ray is reflected; If the random number is less than the characteristic emissivity of the wire whose temperature is to be measured, the traced ray is absorbed.

[0010] Optionally, the step of correcting the temperature measurement value of the effective temperature measurement area based on the effective emissivity to obtain a corrected temperature measurement result includes: filtering the temperature measurements from the effective temperature measurement area to obtain a plurality of filtered peak temperatures; determining a peak effective emissivity within a plurality of change periods according to the change period of the effective emissivity; calculating a peak temperature interference deviation value based on the difference between the peak effective emissivity and the intrinsic emissivity; correcting the peak temperature by the peak temperature interference deviation value; and obtaining a corrected temperature measurement result.

[0011] Optionally, the step of determining an effective temperature measurement area from the infrared thermal image and characteristic information of the wire rod to be temperature measured includes: spatially transforming the infrared thermal image according to the capture angle of the infrared thermal image to obtain the physical position of each pixel in the infrared thermal image; The method includes a step of determining a wire area from the physical position and characteristic information of the wire to be temperature-measured, and determining an effective temperature measurement area based on the wire area and a predetermined separation distance.

[0012] Optionally, the step of creating a wire geometric model of the wire whose temperature is to be measured comprises: a step of acquiring wire geometric parameters of a wire to be temperature-measured, the wire geometric parameters being spatial coordinate parameters of the wire to be temperature-measured on the X-axis, Y-axis, and Z-axis of a preset spatial coordinate system; and creating a wire geometric model of the wire whose temperature is to be measured in a preset spatial coordinate system based on the spatial coordinate parameters.

[0013] According to another aspect of the present application, an infrared thermal image acquisition module that acquires infrared thermal images of the wire rod whose temperature is to be measured in real time; an effective measurement area determination module that determines an effective temperature measurement area based on the infrared thermal image and characteristic information of the wire material being the temperature measurement target; an effective emissivity calculation module that creates a wire geometric model of the wire to be measured for temperature, projects a predetermined ray of light onto the wire geometric model, traces a ray propagation path of the predetermined ray of light, and calculates an effective emissivity based on the tracing result of the ray propagation path; and a temperature correction module that corrects the temperature measurement value of the effective temperature measurement area based on the effective emissivity to obtain a corrected temperature measurement result.

[0014] Optionally, the effective emissivity calculation module further comprises: generating a plurality of traced rays and projecting each of the traced rays onto a target projection point of a wire geometric model including a plurality of target projection points; In the line geometric model, for any of the light rays to be traced, a ray propagation path after the light rays to be traced are projected is traced, and according to the ray propagation path, it is determined whether the light rays to be traced have been absorbed by the line geometric model; The local effective emissivity of the target projection point is calculated from the number of absorbed traced rays and the total number of traced rays, and the effective emissivity of the wire geometric model is obtained from the local effective emissivities of the multiple target projection points.

[0015] Optionally, the effective emissivity calculation module further comprises: determining the angle of incidence of each traced ray and the intrinsic emissivity of the wire; For any of the rays to be tracked, project the ray to a target projection point of a wire geometric model according to a corresponding projection angle, so that the ray to be tracked performs ray propagation according to the target projection point.

[0016] Optionally, the effective emissivity calculation module further comprises: When the tracking target ray is projected onto a target projection point of a wire geometric model, a random number is generated, and if the random number exceeds the characteristic emissivity of the wire whose temperature is to be measured, the tracking target ray is reflected; If the random number is less than the inherent emissivity of the wire whose temperature is to be measured, the traced ray is absorbed.

[0017] Optionally, the temperature compensation module further comprises: filtering the temperature measurements from the effective temperature measurement area to obtain a plurality of filtered peak temperatures; The peak effective emissivity within a plurality of change periods is determined according to the change period of the effective emissivity, a peak temperature interference deviation value is calculated based on the difference between the peak effective emissivity and the intrinsic emissivity, and the peak temperature is corrected by the peak temperature interference deviation value to obtain a corrected temperature measurement result.

[0018] Optionally, the effective measurement area determination module further comprises: spatially transforming the infrared thermal image according to the photographing angle of the infrared thermal image to obtain the physical position of each pixel in the infrared thermal image; The wire area is determined from the physical position and characteristic information of the wire to be temperature-measured, and an effective temperature measurement area is determined based on the wire area and a preset separation distance.

[0019] Optionally, the geometric model creation module further comprises: Acquiring wire geometric parameters of a wire that is a temperature measurement target, the wire geometric parameters being spatial coordinate parameters on the X-axis, Y-axis, and Z-axis of a predetermined spatial coordinate system of the wire that is a temperature measurement target; and creating a wire geometric model of the wire whose temperature is to be measured in a preset spatial coordinate system based on the spatial coordinate parameters.

[0020] According to yet another aspect of the present application, there is provided a storage medium having a computer program stored therein, the program implementing the above-described wire temperature measurement method when executed by a processor.

[0021] According to a further aspect of the present application, there is provided a computer device including a storage medium, a processor, and a computer program stored in the storage medium and operable by the processor, wherein the processor, when executing the program, realizes the above-mentioned wire temperature measurement method. [Effects of the Invention]

[0022] According to the above technical solutions, the wire temperature measurement method and apparatus, storage medium, and computer device of the present application acquire an infrared thermal image of the wire to be measured in real time, determine an effective temperature measurement area from the infrared thermal image and characteristic information of the wire to be measured, create a wire geometric model of the wire to be measured, project a predetermined light beam onto the wire geometric model to trace the ray propagation path of the predetermined light beam, calculate an effective emissivity based on the ray propagation path tracing result, and correct the measured temperature of the effective temperature measurement area based on the effective emissivity to obtain a corrected temperature measurement result. The infrared thermal image is acquired and analyzed using an image processing method to dynamically capture the effective temperature measurement area, calculate and analyze the effective emissivity between the wire, and then correct the measured temperature of the wire, thereby improving the accuracy and stability of wire temperature measurement.

[0023] The above description is only a summary of the technical solution of the present application. In order to more clearly understand the technical solution of the present application, the following provides specific embodiments of the present application, which can be implemented according to the content of the specification, and to make the above and other objectives, features and advantages of the present application more clearly understandable. [Brief explanation of the drawings]

[0024] The drawings described in this specification are intended to provide a further understanding of the present application and constitute a part of the present application, and the schematic examples and descriptions thereof are intended to explain the present application and are not intended to unduly limit the present application. [Figure 1] 1 shows a schematic flow diagram of a method for measuring the temperature of a wire according to an embodiment of the present application. [Figure 2] 1 shows a schematic diagram of a temperature measurement system according to an embodiment of the present application; [Figure 3] 1 shows a schematic diagram of a wire according to an embodiment of the present application. [Figure 4] 1 shows a schematic flow diagram of another method for measuring the temperature of a wire according to an embodiment of the present application. [Figure 5] 1 illustrates a wire geometric model according to an embodiment of the present application. [Figure 6] 1 shows a schematic flow diagram of a further method for measuring the temperature of a wire according to an embodiment of the present application; [Figure 7] 1 shows a schematic structural diagram of a wire temperature measuring device according to an embodiment of the present application. [Figure 8] 1 shows a structural schematic diagram of another wire temperature measuring device according to an embodiment of the present application; DETAILED DESCRIPTION OF THE INVENTION

[0025] The present application will be described in detail below with reference to the accompanying drawings, together with examples. Note that the examples and features of the examples in the present application may be combined with each other as long as they are not inconsistent.

[0026] In this embodiment, a method for measuring the temperature of a wire is provided, and as shown in FIG. 1, the method includes the following steps 101 to 104.

[0027] Step 101: An infrared thermal image of the wire rod to be measured for temperature is acquired in real time.

[0028] Stelmor controlled cooling is an intelligent temperature control method that eliminates or reduces post-heat treatment in downstream processes such as quenching, annealing, and hardening / tempering, thereby saving energy and the environment and improving the cost competitiveness of rolling mills. By utilizing roller conveyors, cooling fans under the conveyor, and insulating covers above the conveyor, various products can be produced using just one cooling line.

[0029] In this embodiment, the temperature of the wire is measured during air cooling in the Stelmor controlled cooling process. Specifically, to capture infrared thermal images of the wire being measured in real time, a temperature measurement system is constructed to measure the temperature of the wire, and the thermal imager of the temperature measurement system captures infrared thermal images of the entire wire, ensuring the completeness of the temperature measurement information. The thermal imager's installation requirements are as follows: To ensure temperature measurement accuracy, the temperature measurement direction at all temperature measurement points must form an angle of less than 45° with the normal direction of the wire surface, so that the entire wire is covered. Furthermore, the thermal imager's spatial resolution must be less than one-third of the wire being measured. Furthermore, the thermal imager requires calibration for accurate use. The temperature measurement system is shown in Figure 2, and the wire is shown in Figure 3.

[0030] Step 102: Determine an effective temperature measurement area based on the infrared thermal image and the characteristic information of the wire material that is the temperature measurement target.

[0031] Next, the effective temperature measurement area is determined from the infrared thermal image and the characteristic information of the wire to be measured. During actual wire production, the effective temperature measurement area moves in the roller conveyance direction and laterally perpendicular to the roller, so neither fixed spot thermometers nor scanning spot thermometers can completely capture the temperature information of the effective temperature measurement area in real time. By determining the target area according to the difference between the temperature characteristics of the wire and the surrounding environment and then extracting the temperature measurement area according to the target area, the effective temperature measurement area of ​​the wire can be dynamically captured while the wire is moving, thereby improving the accuracy of temperature measurement.

[0032] Step 103: Create a wire geometric model of the wire whose temperature is to be measured, project a predetermined ray onto the wire geometric model, trace the ray propagation path of the predetermined ray, and calculate the effective emissivity based on the tracing result of the ray propagation path.

[0033] Next, a wire geometric model of the wire whose temperature is to be measured is created. For example, the measurement object geometric model is created based on the geometric shape of the measurement object (wire whose temperature is to be measured), the optical properties of the material, the surface properties, and the isothermal conditions of the cavity. Because it is difficult to experimentally measure the effective emissivity, a model calculation method such as the Monte Carlo method (MCM) is usually used to calculate the effective emissivity of the wire whose temperature is to be measured. The Monte Carlo method can calculate the effective emissivity at any point on the inner surface of the cavity based on the geometric model of the cavity. To this end, a predetermined ray is projected onto the wire geometric model, the ray propagation path of the predetermined ray is traced, and the effective emissivity is calculated based on the results of the light propagation path tracing.

[0034] Step 104: Correct the temperature measurement value of the effective temperature measurement area based on the effective emissivity to obtain a corrected temperature measurement result.

[0035] Next, the temperature measurement value of the effective temperature measurement area is corrected based on the effective emissivity to obtain the corrected temperature measurement result. Due to the overlapping state of actual wires, the energy at a certain point on a wire includes not only the energy radiated by the wire itself but also the energy reflected from other wires, i.e., it is affected by effective radiation. However, in actual temperature measurements, the intrinsic emissivity of the wire where the thermal imager is placed only takes into account the energy radiated by the wire itself, resulting in inaccurate temperature measurement results. Creating a calculation model of effective emissivity to process temperature measurement results from a thermal imager improves the stability and accuracy of temperature measurements.

[0036] By utilizing the technical solution of this embodiment, an infrared thermal image of the wire to be measured is acquired in real time, and an effective temperature measurement area is determined based on the infrared thermal image and characteristic information of the wire to be measured. A wire geometric model of the wire to be measured is created, a predetermined ray is projected onto the wire geometric model, and the ray propagation path of the predetermined ray is traced. Based on the traced ray propagation path, the effective emissivity is calculated. The measured temperature of the effective temperature measurement area is corrected based on the effective emissivity, and a corrected temperature measurement result is obtained. An infrared thermal image is acquired and analyzed using an image processing method, whereby the effective temperature measurement area is dynamically captured, the effective emissivity between the wire is calculated and analyzed, and the measured temperature of the wire is corrected, thereby improving the accuracy and stability of the temperature measurement.

[0037] Furthermore, as a refinement and extension of the specific embodiment of the above example, another wire temperature measurement method is provided to fully describe the specific implementation process of this example. As shown in Figure 4, the method includes the following steps 301 to 308:

[0038] Step 301: An infrared thermal image of the wire to be temperature-measured is acquired in real time, and an effective temperature measurement area is determined based on the infrared thermal image and characteristic information of the wire to be temperature-measured.

[0039] In the above-mentioned embodiment of the present application, an infrared thermal image of the wire to be measured for temperature is acquired in real time, and an effective temperature measurement area is determined from the infrared thermal image and characteristic information of the wire to be measured for temperature, and the effective temperature measurement area is dynamically captured, thereby improving the accuracy of temperature measurement.

[0040] Step 302: Create a wire geometric model of the wire to be measured for temperature, create multiple tracking rays, determine the projection angle of each tracking ray and the intrinsic emissivity of the wire, and for any of the tracking rays, project the tracking ray onto a target projection point of the wire geometric model according to the corresponding projection angle, so that the tracking ray propagates according to the target projection point.

[0041] Optionally, in step 302, creating a wire geometric model of the wire to be temperature measured includes the following steps 302-1 and 302-2.

[0042] Step 302-1: Obtain wire geometric parameters of the wire to be measured for temperature, where the wire geometric parameters are spatial coordinate parameters of the wire to be measured for temperature on the X-axis, Y-axis and Z-axis of a preset spatial coordinate system.

[0043] Step 302-2: Based on the spatial coordinate parameters, a wire geometric model of the wire whose temperature is to be measured is created in a preset spatial coordinate system. Step 303: Trace the ray propagation path after any traced ray of a line geometric model is cast, where the line geometric model includes a plurality of target cast points.

[0044] Step 304: When the ray to be tracked is projected onto the target projection point of the wire geometric model, a random number is generated, and if the random number is greater than the inherent emissivity of the wire to be temperature measured, the ray to be tracked is reflected.

[0045] Step 305: If the random number is less than the specific emissivity of the wire whose temperature is to be measured, the traced ray is absorbed.

[0046] Step 306: Calculate the local effective emissivity of the target projection point based on the number of absorbed traced rays and the total number of traced rays, and obtain the effective emissivity of the wire geometric model based on the local effective emissivities of the multiple target projection points.

[0047] Next, before calculating the effective emissivity of the wire, a geometric model of the wire must be created. A three-dimensional spatial wire surface model (wire geometric model) is created based on the actual parameters of the production site and the wire (including wire diameter, wire diameter, roller speed, rolling speed, etc.). Next, as shown in Figure 5, the effective emissivity of the wire is calculated using the Monte Carlo method and the created wire geometric model. Specifically, multiple target rays are created and each is projected onto a target projection point on the wire geometric model. For each target ray, the wire geometric model tracks the ray propagation path after the target ray is projected. If the random number is greater than the intrinsic emissivity of the wire whose temperature is being measured, the target ray is reflected. If the random number is less than the intrinsic emissivity of the wire whose temperature is being measured, the target ray is absorbed. The local effective emissivity of the target projection point is calculated from the number of absorbed target rays and the total number of target rays. The effective emissivity of the wire geometric model is then obtained from the local effective emissivities of the multiple target projection points.

[0048] Step 307: Filter the temperature measurements in the effective temperature measurement area to obtain a plurality of filtered peak temperatures.

[0049] Step 308: Determine a peak effective emissivity within a plurality of change periods according to the change period of the effective emissivity, calculate a peak temperature interference deviation value based on the difference between the peak effective emissivity and the intrinsic emissivity, and correct the peak temperature by the peak temperature interference deviation value to obtain a corrected temperature measurement result.

[0050] Next, the temperature measurements in the effective temperature measurement area are filtered to obtain multiple filtered peak temperatures. The peak effective emissivity within the multiple change periods is determined according to the effective emissivity change period. The peak temperature interference deviation is calculated based on the difference between the peak effective emissivity and the intrinsic emissivity. The peak temperature is then corrected using the peak temperature interference deviation to obtain the corrected temperature measurement result. Specifically, a wide change range in effective emissivity can result in increased fluctuations in the wire temperature measurement. Considering that the wire's mesh structure results in alternating high and low temperature values, a peak filtering method is adopted to improve the stability and reliability of temperature measurement. Because the effective emissivity changes periodically, the space and time for temperature filtering can be selected based on the effective emissivity. Because the effective emissivity is periodic, the peak effective emissivity also has periodicity. Considering that the peak temperature within each period is unique, a reasonable filtering space is selected to peak filter the temperature information. The filtering space selection takes into account the effective emissivity period, the width of the effective temperature measurement area, and the control requirements for the transverse temperature (perpendicular to the conveying direction). The filtering time must be selected to capture peak temperatures even under non-uniform overlap conditions while maintaining consistent effective temperature information. Therefore, the peak temperature in the effective temperature measurement area can be corrected by the peak effective emissivity. In actual overlap conditions, the effective temperature measurement area at the end of the wire reaches a thickness of 50 to 200 mm. This area is significantly affected by effective radiation, and the temperature values ​​acquired by the thermal imager are based on the intrinsic emissivity of the wire. To obtain more accurate temperature measurement results, the temperature measurements in this area must be corrected. Due to the uniqueness of the peak effective emissivity within the same cycle and the correspondence between the peak effective emissivity and the peak temperature, the peak temperature obtained by peak filtering in the effective temperature measurement area can be corrected by the difference between the peak effective emissivity and the intrinsic emissivity of the wire within the same cycle, thereby achieving stable and accurate temperature measurement results.

[0051] Furthermore, based on accurate temperature measurement, the transverse temperature distribution curve of the wire can be obtained based on the temperature field measurement, which can be used to guide the airflow configuration of the "optiflex" equipment and improve the uniformity of the wire cooling. In addition, by arranging multiple measurement points, the temperature curve of the wire throughout the cooling process can be obtained, which can be used to understand and control the cooling speed of the wire, thereby achieving the predetermined product quality and performance.

[0052] By utilizing the technical solution of this embodiment, a temperature measurement system is installed based on the actual parameters of the production site, and then an image processing method is used to analyze and process the infrared thermal image of the wire collected by the thermal imager, thereby dynamically capturing the effective temperature measurement area of ​​the wire during the wire's movement; and based on the calculation result of the effective emissivity calculation model, a reasonable filtering space and time are selected to perform peak filtering on the temperature measurement information of the wire, correct the peak temperature, and finally obtain the temperature value of the wire, thus improving the accuracy and stability of the temperature measurement.

[0053] Furthermore, as a refinement and extension of the specific embodiment of the above example, in order to fully describe the specific implementation process of this example, another wire temperature measurement method is provided. As shown in Figure 6, the method includes the following steps 401 to 406:

[0054] Step 401: Obtain an infrared thermal image of the wire to be measured in real time, and spatially transform the infrared thermal image according to the shooting angle of the infrared thermal image to obtain the physical position of each pixel in the infrared thermal image.

[0055] Step 402: Determine a wire area from the physical position and characteristic information of the wire to be temperature measured, and determine an effective temperature measurement area based on the wire area and a preset separation distance.

[0056] In this embodiment, infrared thermal images of the wire to be measured are captured in real time and then spatially transformed according to the imaging angle of the infrared thermal image. Specifically, the temperature measurement system is calibrated, geometric parameters for mounting the thermal imager are determined, and the image is spatially transformed according to the principle of geometric transformation to establish the positional relationship between the pixels in the thermal image and the actual physical space, thereby obtaining the physical location of each pixel in the infrared thermal image. Next, using image processing knowledge, the pixels on the thermal image are traversed and the wire area is determined based on the physical location and characteristic information of the wire to be measured. Based on the wire area and a preset separation distance, an effective temperature measurement area is determined. This dynamic capture of the effective temperature measurement area during the wire temperature measurement process improves the accuracy of temperature measurement.

[0057] Step 403: Obtain wire geometric parameters of the wire to be measured for temperature, and create a wire geometric model of the wire to be measured for temperature in a preset spatial coordinate system based on the spatial coordinate parameters, where the wire geometric parameters are spatial coordinate parameters of the wire to be measured for temperature on the X-axis, Y-axis, and Z-axis of the preset spatial coordinate system.

[0058] Next, the wire geometric parameters of the wire whose temperature is to be measured are obtained. The wire geometric parameters are spatial coordinate parameters on the X-axis, Y-axis, and Z-axis of a preset spatial coordinate system of the wire whose temperature is to be measured. Based on the spatial coordinate parameters, a wire geometric model of the wire whose temperature is to be measured is created in the preset spatial coordinate system (see Figure 5). Once the wire geometric model is created, the effective emissivity can be calculated using the wire geometric model, and the measured temperature can then be corrected using the effective emissivity.

[0059] Step 404: Generate a plurality of target rays to be tracked, and project the target rays to target projection points of a line geometric model, respectively; in the line geometric model, for each of the target rays to be tracked, trace a ray propagation path after the target ray is projected; and determine whether the target ray to be tracked is absorbed by the line geometric model according to the ray propagation path, wherein the line geometric model includes a plurality of target projection points.

[0060] Step 405: Calculate the local effective emissivity of the target projection point based on the number of absorbed traced rays and the total number of traced rays, and obtain the effective emissivity of the wire geometric model based on the local effective emissivities of the multiple target projection points.

[0061] Next, a plurality of tracking target rays are generated, and the tracking target rays are respectively projected onto target projection points of the wire geometric model. In the wire geometric model, for any of the tracking target rays, the ray propagation path after the tracking target ray is projected is traced. According to the ray propagation path, it is determined whether the tracked target ray is absorbed by the wire geometric model. The local effective emissivity of the target projection point is calculated from the number of absorbed tracking target rays and the total number of tracking target rays. The effective emissivity of the wire geometric model is obtained from the local effective emissivities of the plurality of target projection points.

[0062] Step 406: Correct the temperature measurement value of the effective temperature measurement area based on the effective emissivity to obtain a corrected temperature measurement result.

[0063] Next, the temperature measurement value of the effective temperature measurement area is corrected based on the effective emissivity to obtain the corrected temperature measurement result.

[0064] In a specific example, the temperature of a random, complete wire with a wire diameter of 16 mm was measured in a production site using the example of the present application and a scanning temperature measurement device, respectively. The temperature fluctuation measured by the example of the present application was 13°C, while the temperature fluctuation measured by the scanning spot thermometer was as high as 27°C. Furthermore, the standard deviations of both were calculated, and were 7.64°C and 2.80°C, respectively, for the scanning spot thermometer and the method of the example of the present application. Therefore, the example of the present application significantly improves the stability of temperature measurement. Temperature correction improves the accuracy of the wire temperature measurement by 15 to 20°C. The temperature of a random, complete wire with a wire diameter of 16 mm was measured using the method in the embodiment of the present application, and the temperature measurement data was subjected to temperature processing using the processing method of the present application to obtain a temperature distribution curve of the cross section of the wire. From this distribution curve, it was determined that the temperature of the overlapping areas on both sides of the wire was higher than the temperature of the central area of ​​the wire. Therefore, by rationally adjusting the Optiflex device under the roller and adjusting the air volume in each part, the wire could be cooled uniformly.

[0065] By using the technical solution of this embodiment, an infrared thermal image of the wire to be measured for temperature is acquired in real time, the infrared thermal image is spatially transformed according to the shooting angle of the infrared thermal image to determine the wire area, and an effective temperature measurement area is determined based on the wire area and a preset separation distance. The wire geometric parameters of the wire to be measured for temperature are acquired, and a wire geometric model of the wire to be measured for temperature is created in a preset spatial coordinate system based on the spatial coordinate parameters. A plurality of target rays are generated and projected onto target projection points of the wire geometric model. In the wire geometric model, the ray propagation path of each of the target rays after projection is traced. Whether the target ray is absorbed by the wire geometric model is determined according to the ray propagation path. The local effective emissivity of the target projection point is calculated from the number of absorbed target rays and the total number of tracked rays. The effective emissivity of the wire geometric model is obtained from the local effective emissivities of the plurality of target projection points. The temperature measurement value of the effective temperature measurement area is corrected based on the effective emissivity to obtain a corrected temperature measurement result, thereby improving the accuracy of wire temperature measurement.

[0066] Furthermore, as a specific implementation of the method of Fig. 1, an embodiment of the present application provides a wire temperature measuring device. As shown in Fig. 7, the device includes: an infrared thermal image acquisition module 501 that acquires an infrared thermal image of the wire rod whose temperature is to be measured in real time; an effective measurement area determination module 502 that determines an effective temperature measurement area based on the infrared thermal image and characteristic information of the wire material being the temperature measurement target; an effective emissivity calculation module 503 that creates a wire geometric model of the wire to be measured for temperature, projects a predetermined ray of light onto the wire geometric model, traces a ray propagation path of the predetermined ray of light, and calculates an effective emissivity based on the tracing result of the ray propagation path; and a temperature correction module 504 that corrects the temperature measurement value of the effective temperature measurement area based on the effective emissivity to obtain a corrected temperature measurement result.

[0067] Optionally, the effective emissivity calculation module 503 further comprises: generating a plurality of traced rays and projecting each of the traced rays onto a target projection point of a wire geometric model including a plurality of target projection points; In the line geometric model, for any of the light rays to be traced, a ray propagation path after the light rays to be traced are projected is traced, and according to the ray propagation path, it is determined whether the light rays to be traced have been absorbed by the line geometric model; The local effective emissivity of the target projection point is calculated from the number of absorbed traced rays and the total number of traced rays, and the effective emissivity of the wire geometric model is obtained from the local effective emissivities of the multiple target projection points.

[0068] Optionally, the effective emissivity calculation module 503 further comprises: determining the angle of incidence of each traced ray and the intrinsic emissivity of the wire; For any of the rays to be tracked, project the ray to a target projection point of a wire geometric model according to a corresponding projection angle, so that the ray to be tracked performs ray propagation according to the target projection point.

[0069] Optionally, the effective emissivity calculation module 503 further comprises: When the tracking target ray is projected onto a target projection point of a wire geometric model, a random number is generated, and if the random number exceeds the characteristic emissivity of the wire whose temperature is to be measured, the tracking target ray is reflected; If the random number is less than the inherent emissivity of the wire whose temperature is to be measured, the traced ray is absorbed.

[0070] Optionally, the temperature compensation module 504 further comprises: filtering the temperature measurements from the effective temperature measurement area to obtain a plurality of filtered peak temperatures; The peak effective emissivity within a plurality of change periods is determined according to the change period of the effective emissivity, a peak temperature interference deviation value is calculated based on the difference between the peak effective emissivity and the intrinsic emissivity, and the peak temperature is corrected by the peak temperature interference deviation value to obtain a corrected temperature measurement result.

[0071] Optionally, the effective measurement area determination module 502 further comprises: spatially transforming the infrared thermal image according to the photographing angle of the infrared thermal image to obtain the physical position of each pixel in the infrared thermal image; The wire area is determined from the physical position and characteristic information of the wire to be temperature-measured, and an effective temperature measurement area is determined based on the wire area and a preset separation distance.

[0072] Furthermore, an embodiment of the present application provides another wire temperature measuring device, as shown in FIG. 8, an infrared thermal image acquisition module 601 that acquires an infrared thermal image of the wire rod whose temperature is to be measured in real time; an effective measurement area determination module 602 that determines an effective temperature measurement area based on the infrared thermal image and characteristic information of the wire material being the temperature measurement target; an effective emissivity calculation module 603 that creates a wire geometric model of the wire to be measured for temperature, projects a predetermined ray of light onto the wire geometric model, traces a ray propagation path of the predetermined ray of light, and calculates an effective emissivity based on the tracing result of the ray propagation path; a temperature correction module 604 for correcting the temperature measurement value of the effective temperature measurement area based on the effective emissivity to obtain a corrected temperature measurement result; and a geometric model creation module 605 that acquires wire geometric parameters of the wire whose temperature is to be measured and creates a wire geometric model of the wire whose temperature is to be measured in a preset spatial coordinate system based on the spatial coordinate parameters, wherein the wire geometric parameters are spatial coordinate parameters on the X-axis, Y-axis, and Z-axis of the preset spatial coordinate system of the wire whose temperature is to be measured.

[0073] Optionally, the effective emissivity calculation module 603 further comprises: generating a plurality of traced rays and projecting each of the traced rays onto a target projection point of a wire geometric model including a plurality of target projection points; In the line geometric model, for any of the light rays to be traced, a ray propagation path after the light rays to be traced are projected is traced, and according to the ray propagation path, it is determined whether the light rays to be traced have been absorbed by the line geometric model; The local effective emissivity of the target projection point is calculated from the number of absorbed traced rays and the total number of traced rays, and the effective emissivity of the wire geometric model is obtained from the local effective emissivities of the multiple target projection points.

[0074] Optionally, the effective emissivity calculation module 603 further comprises: determining the angle of incidence of each traced ray and the intrinsic emissivity of the wire; For any of the rays to be tracked, project the ray to a target projection point of a wire geometric model according to a corresponding projection angle, so that the ray to be tracked performs ray propagation according to the target projection point. Optionally, the effective emissivity calculation module 603 further comprises: When the tracking target ray is projected onto a target projection point of a wire geometric model, a random number is generated, and if the random number exceeds the characteristic emissivity of the wire whose temperature is to be measured, the tracking target ray is reflected; If the random number is less than the inherent emissivity of the wire whose temperature is to be measured, the traced ray is absorbed.

[0075] Optionally, the temperature compensation module 604 further comprises: filtering the temperature measurements from the effective temperature measurement area to obtain a plurality of filtered peak temperatures; The peak effective emissivity within a plurality of change periods is determined according to the change period of the effective emissivity, a peak temperature interference deviation value is calculated based on the difference between the peak effective emissivity and the intrinsic emissivity, and the peak temperature is corrected by the peak temperature interference deviation value to obtain a corrected temperature measurement result.

[0076] Optionally, the effective measurement area determination module 602 further comprises: spatially transforming the infrared thermal image according to the photographing angle of the infrared thermal image to obtain the physical position of each pixel in the infrared thermal image; The wire area is determined from the physical position and characteristic information of the wire to be temperature-measured, and an effective temperature measurement area is determined based on the wire area and a preset separation distance.

[0077] For other corresponding descriptions of each functional unit of the wire temperature measuring device according to the embodiment of the present application, please refer to the corresponding descriptions in the methods of Figures 1, 4 and 6, and they will not be described in detail here.

[0078] Based on the methods shown in Figures 1, 4 and 6 above, an embodiment of the present application also provides a storage medium having a computer program stored therein, which, when executed by a processor, realizes the wire temperature measurement method shown in Figures 1, 4 and 6 above.

[0079] Based on this understanding, the technical solutions of the present application can be embodied in the form of a software product, and the software product can be stored in a non-volatile storage medium (such as a CD-ROM, a U-disk, or a mobile hard disk) containing instructions for causing a computer device (such as a personal computer, a server, or a network device) to perform the methods described in each implementation scenario of the present application.

[0080] To achieve the above object based on the above method shown in Figures 1, 4, and 6, and the embodiment of the virtual device shown in Figures 7 and 8, the embodiment of the present application also specifically provides a computer device, which may be a personal computer, a server, a network device, etc. The computer device includes a storage medium for storing a computer program, and a processor that executes the computer program to realize the above wire temperature measurement method shown in Figures 1, 4, and 6.

[0081] Optionally, the computing device may include a user interface, a network interface, a camera, a radio frequency (RF) circuit, a sensor, an audio circuit, a Wi-Fi module, etc. The user interface includes a display, an input unit such as a keyboard, etc. The optional user interface may also include a USB interface, a card reader interface, etc. The optional network interface includes a standard wired interface, a wireless interface (such as a Bluetooth interface, a Wi-Fi interface, etc.), etc.

[0082] Those skilled in the art will understand that the structure of the computer device according to this embodiment is not intended to limit the computer device, and that the computer device may include more or fewer components, may combine certain components, or may have different component arrangements.

[0083] The storage medium may also include an operating system and a network communication module. The operating system is a program that manages and stores the hardware and software resources of a computer device and supports the operation of information processing programs and other software and / or programs. The network communication module is used to implement communication between components in the storage medium and with other hardware and software in the physical device.

[0084] From the above description of the embodiments, those skilled in the art can clearly understand that the present application can be implemented by software and a required general hardware platform, or by hardware. This application discloses a wire temperature measurement method and apparatus, a storage medium, and a computer device, which include the steps of: acquiring an infrared thermal image of a wire to be measured in real time; determining an effective temperature measurement area from the infrared thermal image and characteristic information of the wire to be measured; creating a wire geometric model of the wire to be measured; projecting a predetermined ray of light onto the wire geometric model to trace the ray propagation path of the predetermined ray of light; and calculating an effective emissivity based on the ray propagation path tracing result; and correcting the temperature measurement value of the effective temperature measurement area based on the effective emissivity to obtain a corrected temperature measurement result. The infrared thermal image is acquired and analyzed using an image processing method to dynamically capture the effective temperature measurement area, calculate and analyze the effective emissivity between the wire, and correct the measured temperature of the wire, thereby improving the accuracy and stability of the temperature measurement.

[0085] Those skilled in the art can understand that the drawings are merely schematic diagrams of preferred implementation scenarios, and the modules or flows in the drawings are not necessarily required for implementing the present application. Those skilled in the art can understand that the modules of the devices in the implementation scenarios may be distributed within the devices in the implementation scenarios according to the description of the implementation scenarios, or may be arranged in one or more devices different from the implementation scenarios with corresponding changes. The modules in the above implementation scenarios can be combined into one module or further divided into multiple sub-modules.

[0086] The above symbols in the present application are for the purpose of explanation only and do not represent the superiority or inferiority of the implementation scenes. The above disclosure is only some specific implementation scenes of the present application, but the present application is not limited thereto, and any modifications that a person skilled in the art can conceive are included in the protection scope of the present application. [Explanation of symbols]

[0087] 21 Thermal Imager 22 angle of view 23 Support Frame 24 First Baffle 25 Laura 26 Wire rod 27 Second Baffle

Claims

1. A method for measuring the temperature of a wire, comprising: A step of acquiring an infrared thermal image of a wire rod whose temperature is to be measured in real time; determining an effective temperature measurement area based on the infrared thermal image and characteristic information of the wire material to be measured for temperature; creating a wire geometric model of the wire to be measured for temperature, projecting a predetermined ray of light onto the wire geometric model, tracing a ray propagation path of the predetermined ray of light, and calculating an effective emissivity based on the tracing result of the ray propagation path; and correcting the temperature measurement value of the effective temperature measurement area based on the effective emissivity to obtain a corrected temperature measurement result.

2. The step of correcting the temperature measurement value of the effective temperature measurement area based on the effective emissivity and obtaining a corrected temperature measurement result includes: filtering the temperature measurements from the effective temperature measurement area to obtain a plurality of filtered peak temperatures; 2. The method of claim 1, comprising the steps of: determining a peak effective emissivity within a plurality of change periods according to the change period of the effective emissivity; calculating a peak temperature interference deviation value based on a difference between the peak effective emissivity and the intrinsic emissivity; and correcting the peak temperature by the peak temperature interference deviation value to obtain a corrected temperature measurement result.

3. The step of determining an effective temperature measurement area from the infrared thermal image and characteristic information of the wire material to be measured for temperature includes: spatially transforming the infrared thermal image according to the capture angle of the infrared thermal image to obtain the physical position of each pixel in the infrared thermal image; determining a wire area from the physical position and characteristic information of the wire to be temperature-measured, and determining an effective temperature measurement area based on the wire area and a preset separation distance.

4. The step of creating a wire geometric model of the wire to be measured for temperature includes: a step of acquiring wire geometric parameters of a wire to be temperature-measured, the wire geometric parameters being spatial coordinate parameters of the wire to be temperature-measured on the X-axis, Y-axis, and Z-axis of a preset spatial coordinate system; and creating a wire geometric model of the wire whose temperature is to be measured in a preset spatial coordinate system based on the spatial coordinate parameters.

5. A wire temperature measuring device, an infrared thermal image acquisition module that acquires infrared thermal images of the wire rod whose temperature is to be measured in real time; an effective measurement area determination module that determines an effective temperature measurement area based on the infrared thermal image and characteristic information of the wire material being the temperature measurement target; a geometric model creation module for creating a wire geometric model of a wire whose temperature is to be measured; an effective emissivity calculation module that projects a predetermined ray onto the wire geometric model, traces a ray propagation path of the predetermined ray, and calculates an effective emissivity based on the tracing result of the ray propagation path; and a temperature correction module that corrects the temperature measurement value of the effective temperature measurement area based on the effective emissivity to obtain a corrected temperature measurement result.

6. A storage medium on which a computer program is stored, A storage medium that, when executed by a processor, realizes the wire temperature measurement method according to any one of claims 1 to 4.

7. A computer device including a storage medium, a processor, and a computer program stored on the storage medium and operable on the processor, A computer device, wherein the processor, when executing the computer program, realizes the wire temperature measuring method according to any one of claims 1 to 4.

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